D e c reasing silicon allowance for sili-cides places new requirements onthe quality of the silicon/silicideinterface for minimal roughness.Porous low-k materials are inherentlynon-homogeneous in structure, unlikeSiO2. Singh explained that tantalum-based barrier materials for coppermay introduce stress-related reliabilityconcerns, and pinholes and non-uni-formity-related defects in barrier lay-ers become a greater issue below40 nm in thickness.

Table 1 illustrates the expected extension of current patterned waferinspection methods and the timelinefor bringing new technologies intoR&D phases, yield ramp-up and volume production. In the interest of minimizing thermal budget,processes must be created to reduce the activation energy and use in-situ m e a s u rements to maximizep e rf o rmance, throughput and yield( fig u re 1), expecially for large diameter wafers. ❈

Reproduced with permission from SEMICONDUC -TOR INTERNATIONAL, November 1998.Copyright 1998 Cahners Business Information.SEMICONDUCTOR INTERNATIONAL is a trade-mark of Cahners Business Information. All rightsreserved.

Best of YMS

Autumn 1999 Yield Management Solutions 41

S E C T I O N S

Yield ManagementSeminar Series

A valuable venue for innovative ideas

KLA-Tencor’s Yield Management Solutions Seminars (YMS2) focuson value-added, integrated solutions for yield management andprocess control. Key topics include CMP, lithography, in-line moni-toring and yield strategies, with an emphasis on copper.

To reserve your space at the upcoming YMS2, contact Judy Dale byemail at: judy.dale@kla-tencor.com.

Date: Wednesday, October 20thTime: 9:00 a.m. to 6:00 p.m.Location: Hyatt Regency Austin on Town Lake

For future YMS2, please complete and return the enclosed businessreply card.

Call for future papersPapers should focus on using KLA-Tencor tools and solutions toenhance yield through increased productivity and performance.Topics of interest include defect inspection, lithography, CMP, filmmeasurement and yield management strategies.

If you are interested in presenting a paper at one of our upcomingyield management seminars, please submit a one page abstract to:Judy Dale by fax at (408) 875-4144 or email at: judy.dale@kla-tencor.com.

YMS2 at a GlanceDATE LOCATION ABSTRACT DEADLINE

December 2 Makuhari, Japan September 1, 1999 February 16 Seoul, Korea November 1, 1999 April 5 Munich, Germany January 7, 2000