Making the most out of SiCAlexander Streibel, Application Engineer

WBG Power ConferenceDecember 5th, Munich 2017

2 | Danfoss Silicon Power WBG Power Conference, Munich 2017

Content1 Introduction to Danfoss Silicon Power

2

3

Danfoss Technologies

DSP Activities on SiC Packaging

4 Conclusion and Questions

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1990: Kiel

2000: Schleswig

2012: Flensburg

Power Module SpecialistFor more than 25 years

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• ~450 employees

• 4000m2 of clean room area in Flensburg.

• 5000m² of clean room in Utica, USA.In operation beginning of 2018

• >25mio cars equipped with powermodules from DSP

• More than 3GW of solar power withDSP high power 3-level P3L-modules

• >23GW wind turbines installed withDanfoss Silicon Power technology

Flensburg factory – 4000m²

Utica factory, state of New York – 5000m²

Flensburg

Danfoss Silicon Power A Success Story

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Danfoss Silicon PowerPower Modules and Stacks

38%SHARE OF SALES

Automotive (EPS, EV/HEV)

#6 World Wide #3 in Europe

#1 World Wide in MOSFET Power ModulesSource: IHS 2016, DSP analysis

38%SHARE OF SALES

Renewables (Wind, Solar)

24%SHARE OF SALES

Industry (incl. Motor Drives)

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Danfoss Silicon Power is chip independent

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Content1 Introduction to Danfoss Silicon Power

2

3

Danfoss Technologies

DSP Activities on SiC Packaging

4 Conclusion and Questions

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What are the SiC challenges?Electrical: DC stray inductance paralleling of multiple chips parasitic turn-on (high dv/dt) gate oxide reliability

Mechanical: elevated temperatures power cycling capability terminals and connectors

Thermal: lowest Rth lowest pressure drop parallel cooling

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Danfoss Technology for Lifetime Technology induced lifetime increase

technology improvements

Al – wiresoldered die

Al – wiresintered die

Cu – wire on bond buffersintered die

solder degradation and wire lift off

wire lift off

Danfoss DBB®

technology

relia

bilit

y

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DBB® Technology Drives Paradigm Chance: From Current Derating to Full SiC Utilization

Driver for rating

bonding and joining

cooling efficiency

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ShowerPower® Cooling SystemDesign for most efficient coolingShowerPower®3D (SP3D®) principle:

channels in Cu-baseplate guide coolant liquid lowest Rth, at the same time reduced pressure drop homogeneous heat distribution on substrate

0,0000,0200,0400,0600,0800,1000,1200,1400,1600,1800,200

0,00 1,00 2,00 3,00 4,00 5,00 6,00

Rth

[K

/W

]

Flow rate per module [l/min]

Note: 300 mm² IGBT Area, Coolant: 50/50 water glycoleHalf-bridge design optimized for parallel cooling

ShowerPower Design (Gen 2)

ShowerPower 3D (Gen 3, 2017)

200 W/cm²

325 W/cm²

ShowerPower®3D FEM simulation

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Highly advanced packaging technologies from Danfoss are optimal for SiC technology

Danfoss Bond Buffer® Transfer mouldingShowerPower®

• Unmatched reliability • Power density and

cycle capability• Elevated

temperatures• Sintered top- and

bottom side

• More efficient than standard cooling

• Increased thermal transfer

• Minimized lateral temperature gradient

• Low pressure drop

• High reliability & robustness

• Best possible approach for wide-bandgap and other high temperature devices

COST – POWER DENSITY – RELIABILITY – LIFE TIME – EFFICIENCY

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Content1 Introduction to Danfoss Silicon Power

2

3

Danfoss Technologies

DSP Activities on SiC Packaging

4 Conclusion and Questions

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SiC Packaging for Battery Energy Storage Systems: Flexibility for System Integration

Robust 3-level T-Type NPC 1200V phase lag

Customized pin-out available for your application’s need

Bond wire design to decouple control circuit from load current

Integration of individual gate resistors for each chip to allow switching speed adjustment

Advanced substrate material forhighest thermal performance (AlN)

62 mm

45 mm

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1700V 250A Halfbridge for Rail Traction

12 x Rohm Gen2 planar type SiCMOSFETs per logical switch paired with SBD

AlN substrate for lowest Rth

EMI improvements made operation at 25 kHz possible

5 times lower Switch-Off losses

Enabling high efficient inverter

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ThermoFreq (2017 – 2020)

Partners:

Laserwelding

DBB®

Cu-Tape

Sinterlayer

Low-inductiveconductor

Cu-conductor and heat spreader

Isolation Foil

Source: Fraunhofer ILTSi/SiC-Chip

Baseplate

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KomroL – KOOPERATION (2017 – 2019)

Partners:

Targets:

Design a molded power module (Half-Bridge)with internal monolithic RC-Snubbers todecrease the internal commutation loop down to ~5nH

Power rating of each power module is ~175A @ 920 Vdc

Bi-directional DC/DC converter for automotive traction application

Source: Fraunhofer IISB

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Content1 Introduction to Danfoss Silicon Power

2

3

Danfoss Technologies

DSP Activities on SiC Packaging

4 Conclusion and Questions

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Conclusion

SiC enables

highest compactness and efficiency

maximum current and power density

SiC requires

customized cost-effective low-inductive packages

advanced bonding and joining technologies for ∆T=130K ++

dedicated cooling technologies

#One choice in SiC power modulesEngineering Tomorrow – Making the most out of SiC