maps development at iphc for hep and x-ray applications

MAPS development at IPHC for HEP and X-ray applications

Maciej [email protected]

➙ IPHC & PICSEL group

➙MAPS for high energy physics

➙MAPS for low energy X-ray applications

➙Summary and Future

KEK, 30 Nov. 2017

mailto:[email protected]

M.Kachel - MAPS development at IPHC for HEP and X-ray applications 2

Institut Pluridisciplinaire Hubert Curien

IN2P3INC

INEE INSB

• 300 employees(≳100 researchers)• Pluri-disciplinary: subatomic physics, chemistry, ethology

PICSEL group Complementary expertise

• Physicists: 3 permanent, 1 post-doc

• Micro-electronics designers: 11 permanents, 3 PhD students

• 5 test engineers• Since 1999: 120 publications, 14

PhD defended• ~50 sensors designed (MIMOSA

series)

M.Kachel - MAPS development at IPHC for HEP and X-ray applications

Partners• Academics:

CERN, USA (Berkeley, Brookhaven), DESY (Hambourg), IHEP in China, …• CMOS foundries:

AMS, TSMC, STM , Tower-Jazz, ESPROS, X-FAB, …

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IPHC-PICSEL group: MAPS Detection of high energy particles with MAPS sensors

• Pioneers in using Monolithic Active Pixel Sensors since 1998- Single particle detection ➙ position at µm level

• Very low signal (≲200 e-)• Pixel noise ≃ 10 to 20 e-• Pixel size 10 - 100 µm• Low occupancy ≃ 1%

Readout in 2 ways:• Analog - external ADC• Digital – on-chip discrimination / ADC

Detection surface:• Individual sensors: 1 to 4 cm2

• Module with several sensors: .. tens of cm2

• Full detector: few 100 cm2

P- substrate

N-WELLnn

P - WELLn n

collecting diodeNMOS NMOS

P - WELL

epitaxial layer ~20 µm


IPHC-PICSEL strategy

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EUDET 2006/2010Beam Telescope

Spin-off: Interdisciplinary applications, biomedical, space …

ILC >2025Internatinal Linear Collider

CBM 2018Compressed Baryonic Matter

EUDET (R&D for ILC, EU project)

STAR (Heavy Ion physics)

CBM (Heavy Ion physics)

ILC (Particle physics)

HadronPhysics2 (generic R&D, EU project)

AIDA (generic R&D, EU project)

FIRST (Hadron therapy)

ALICE/LHC (Heavy Ion physics)

EIC (Hadronic physics)

Belle II (Particle physics)

CLIC (Particle physics)

…

ALICE 2019A Large Ion Collider at LHC

STAR 2014Solenoid Tracker At RHIC


IPHC-PICSEL: STAR experiment

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MIMOSA28 (ULTIMATE)

- ~ 1M pixels- Thinned to 50 µm- 10 chips per ladder- Power dissipation

~350 mW /cm2

400 MIMOSA-28 sensors 360 106 pixels Air flow cooling Top ≲ 35∘C 𝜎𝜎s.p.≃ 4 µmmat. budget = 0.39 % X0 / layer Read-out time ~ 190 µs

Operated 2014-2016


PLUME Pixel Ladder with Ultra low Material Embedding

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Mimosa 26 sensors

• Thickness 2 mm• 8 Mpixels, • Readout time 115 µs,• Material budget 0.4 % of X0• Weight - 10 g• Power - 9 Watts (air cooled)


PLUME – BEAST @ KEK


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SALAT - Single Arm Large Area Telescope

Motivation -> Big surface and thin reference planes

4.2 cm

4.6 cm

4 x Chips thinned down to 50 μm glued on a 50 μm thick mylar layer• 3.6 M-pixels over 15.3 cm2

• < 200 µs integration time• Gap between the pixels ~ 100 µm

Build with AIDA european project


Molecular imaging with 𝛃𝛃+ emitters in moving rats MAPSSIC project:

• Constraint on size and power dissipation• 16 x 128 pixels – pitch 30 x 50 µm• Pixel based on Alpide architecture (ALICE)• Power consumption ~ 160 µW• Expected flux - few counts / s – slow readout• IMNC, IPHC, CPPM, CERMEP, NeuroPSi

Currently integrating prototype sensor …

probe in the brain : - section ~500x500 µm2

- sensitive volume (18 um) immune to 𝛾𝛾


From previous project PIXSIC

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Current main project of PICSEL groupMIMOSIS - sensor for CBM experiment


MIMOSIS - sensor for CBM experimentCurrent main project of PICSEL group

*D. Kim, et al. “Front end optimization for the monolithic active pixel sensor of the ALICE Inner Tracking System upgrade” JINST, Volume 845, 11 February 2017, Pages 583-587

MIMOSIS pixel details: schematic

Vdiode

AMP

THR

Memory 1

Memory 2

MEM_SEL MEM_SEL

MEM

_RST

MEM

_FLUSH

MASKPIXEL_OUT

Sensingdiode

- Pixel design based on Alpide*

- Modifications in sensing part and the memory part

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Présentateur

Commentaires de présentation

Difference with Alpide – no trigger

13

Current main project of PICSEL group

MIMOSIS pixel details: layout

Single pixel


diode

MIMOSIS - sensor for CBM experimentCurrent main project of PICSEL group

14

But there is more than 1 pixel…

Full sensor Overview• Matrix of pixels – 504 x 1024• Pixel pitch – 26.88 x 30.24 µm2

• Configurable by I2C• Integration time 5 µs• Readout: 8 x e-link @ 320 Mbit/s

• Small prototype produced• First full scale submission

- Q3 2018


Monolithic Active Pixel Sensors for low energy X-ray applications

Motivation – MAPS for Imaging Devices

Monolithic Sensor(ex: MAPS)

Hybrid Pixel SensorCCD

Sensitive Volume

Detector

Readout &Processing Cell

Pixel detector

Small pixel pitch Wide energy range Low noise (cooling) No single particle

image Limited counting rate

Single particle counting High counting rate Noise impacted by

detector connection High cost

Bonding detector

Single particle counting Small pixel pitch Low noise Low cost Moderate counting rate


Présentateur

Commentaires de présentation

particles= photon, proton, electron, alpha.. Single particle counting – provides more information – augmented imaging – filterout energy improve resolution – filter-out the noise !! Especially

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Depletion studies of MAPS Principle

Undepleted MAPS Fully depleted MAPS

p-- epitaxial layer

nwell

deep pwell

pwell

p+ n+ n+

nwell

n+ p+ p+ p+ p+

p substrate

collecting diode (~1 V)NMOS

transistorPMOS

transistor

Depletion RegionX-ray

photon

nwell

deep pwell

pwell

p+ n+ n+

nwell

n+ p+ p+ p+ p+

NMOStransistor

PMOS transistor

X-ray photon

collecting diode (~15 V)

high res p-- substrateor epitaxial layer

• Charge collection by drift and diffusion• Diode at ~ 1.0 V

• Charge collection by drift• Diode at higher voltage ~ 15-20 V

Motivation for having depleted sensors:• Larger depleted volume -> Increased signal • Drift -> Faster charge collection

-> Larger pixels possible (small clusters)


Depletion studies of MAPS

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Pipper sensor (FSI)

Epitaxial layer 18 um Czochralski substrate

Collecting diode

bias

read

Vdiode

Column OUTPUT

• Prorotype - 32x128 pixels• Pixel size 22x22 µm2

• Analog outputs• AC coupled collecting diode• Produced on two substrates:

• Epitaxial layer 18µm• High resistivity substrate

Laboratory measurements with 55Fe in function of diode bias (1-20V)

Energy resolution obtained ~ 300eV


Depletion studies of MAPS (II)

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METAL layers + oxide ~10µmMETAL layers + oxide ~10µm

Goal: « costless » BSI sensor

[J. HEYMES]

Depleted zone

p+ layer

col. diode

• Thinning 50 µm• Ion implant.• Annealing

Preliminary studies on CZ wafer with 55Fe

col. diode

Post processing done in Jan 2017


Counting low energy X-rays - Mimosa 22SX

Vclamp

Cc

Rf

power

_powerCollecting diode

Vdiode

Column OUTPUT

Requirements:• X-Ray Energy Range [few 100 eV – 5 keV] with 100% QE

• Counting Dynamic [1-107] ph/pix/s

• High occupancy

• High Spatial Resolution (pixel pitch ~ 20 µm)

First prototype specs Tower Jazz 180 nm CIS

128 x 256 pixels with 22µm pixel pitch

Collecting diode AC coupled to the amplifier

Discriminator with 2 thresholds -> energy window

Binary outputs

16 mm² of active area

Mimosa 22SX

Strategy for counting:• Small pixels – amplification only• Rolling shutter readout• Column Discriminator• Serialization and readout

Counting outside of the pixels


Mimosa 22SX – energy window


NIR laser emulates a space-correlated continuous energy spectrum• Short laser pulses (100ns) sent at the beginning of every recorded

frame• Unfocused laser spot –> center ~6000 eV, outer ring ~ 500 eV

NIR laser

Equivalent Stable number of pulses detected throughout range of thresholds=> suggest constant detection efficiency from 800 to 6000 eV

Reconstructed laser spot profile

M22SX – results with X-rays

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Piece of a flex PCB - aluminum strips Image obtained with Mimosa 22SX

1. Front Side Illumination vs Back Side Illumination:• Higher diode voltage => deeper depletion• Higher number of counts BSI => full depletion of 40µm probable• Quantitative interpretation needs to account for charge sharing

⇒Need low X-ray energy tests to verify that full depletionis achieved and entrance window is operational

2. X-ray Image (single photon counting)

• Obtained with 55Fe – very low flux• Thickness of the aluminum strips calculated => 15 µm for the thin (150µm), and ≥ 50µm for the thick strips


M22SX results – Soleil – 1.5keV

Post process M22SX Vdiode = 40V

We can see 1.5 keV photons!

23M.Kachel - MAPS development at IPHC for HEP and X-ray applications

A spin-off application for M22SX

Dose Monitoring at CYRCé Cyclotron at IPHC:• 24 MeV protons • Milimeter beam size

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First tests with Mimosa 22SX• Linear behaviour in the measured fluence range• At least 1000 protons/pix/s possible

Motivation:Monitor dose for small beam size (problematic with current detector)


Depleted MAPS – good for HEP!

Tests performed with irradiated Pipper2 chip at the University of Frankfurt


1013 neq/cm²T=-60°C

5x1014 neq/cm²T=-60°C

1V3V

10V 20V

1V3V

10V20V

1013 neq/cm2 performance restored after cooling 1015 neq/cm2 degraded, but we still see the energy peak

Summary – future Plans

PICSEL group capabilities:• Design of sensors for HEP experiments / low X-ray applications• Readout systems• Sensor integration into modules / detectors

Future plans :• Sensor following MIMOSIS architecture (towards ILC)

- Integration time < 1µs- Power pulsing- …

• Large(r) scale depleted imager with analog readout- Active area ~1cm2

- Applications : X-ray spectroscopy, Hadron therapy, …- SOI technology would be an ideal candidate (depletion wise..)


Thank you for your attention

Short-term fellowship at KEK

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Plan for the Short-term fellowship at KEK

Hands-on the SOI technologyDesing of the analog part of MIMOSIS pixel usedfor CBM experiment• Schematic + layout + simulations• How much we benefit from the SOI vs TJ 0.18µm :

- Pixel size- Power- Speed

Future collaboration

31M.Kachel - MAPS development at IPHC for HEP and X-ray applications

maps development at iphc for hep and x-ray applications

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