maran ma yuan fang ramneet singh hp thermal bubble jet printer
TRANSCRIPT
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M A R A N M AY UA N FA N G
R A M N E E T S I N G H
HP Thermal Bubble Jet Printer
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Outline
• History of Printer Technologies• HP Bubble Jet Printer• HP Print Head Fabrication• Print Head Packaging & Circuitry• Performance Analysis• Conclusions
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History
• 1878 – Lord Rayleigh – droplet breakup• 1960 – Continuous ink-jet - stream
broken into droplets via pressure wave pattern
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History (cont’d)• 1979 – Canon develops drop-on-demand
thermal bubble-jet• 1984 – HP produces first commercial
bubble-jet called ThinkJet
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• HP’s print head is disposable – doesn’t sacrifice quality
• Better quality due to frequent replacement
• Allows for up to 4800x1200 dpi @ 24 ppm
• Allows the use of pigmented ink for increased precision and superior fade performance
HP’s Bubble-jet Advantage
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Video clip on HP Cartridge
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Print Head Functional Requirements
Store ink for each nozzleHeat ink drop via heater resistorRelease ink at desired quantity &
position
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HP Print Head Fabrication
Reusable substrate: silicon or glass, with photoresist islands
Orifice plate: nickel, via electroforming
Photoresist island
Reusable substrate
Orifice plate
• Integrated fabrication process, facilitates critical alignment of:– Ink reservoir– Heater resistor– Orifice plate
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HP Print Head Fabrication (cont’d)
First insulating barrier: prevent shorting of resistor/conductor with orifice plate
Heater resistors: narrow region of conductorR = Rs (L/A)
Heater resistors – plan view
C-shaped heater resistor
Lead-in conductor
Insulating barrier layer
Heater resistor
Lead-in conductor
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HP Print Head Fabrication (cont’d) Second insulating
barrier: prevent corrosion of resistor/conductor by ink
Seed layer: sputtered metal, etched to C shape
Ink reservoir wall: nickel, via electroplating
Substrate removal: peeling to unplug orifices
Seed pad
Wall
hole
Second
insulating layerInsulating layer
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HP Print Head Fabrication (cont’d)
Layer Suitable Material Deposition Process Thickness [um]
Substrate Oxidized Silicon/ Glass 200-300
Orifice Plate Nickel Electroforming 20-75
Insulating Layer 1Silicon Dioxide/Silicon Nitride/Silicon Oxynitride
PECVD/LPCVD
1-3
Resistor & Conductor
Polysilicon/Tantalum Silicide/Gold
Sputtering/PECVD/LPCVD
0.05-0.5
Insulating Layer 2 Silicon Nitride &Silicon Carbide
LPCVD 0.5-2
Seed Layer Nickel/Titanium/Chromium
Sputtering0.5-2
Barrier Nickel Electroplating 10-75
Table 1. HP Bubble Jet print head fabrication procedure summary [8]
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HP Print Head Fabrication (cont’d)
Lead-in conductor
C-shaped heater resistor
C-shaped reservoir wall
Orifice (nozzle)
Hole
Ink reservoirWall
Second
insulating barrier layerFirst Insulating barrier layer
Heater resistor
Lead-in conductor
Orifice plate
Seed pad
Print head structure – plan view: ink flow channels along A
MEMS fabricated print head structure prior to assembly with cartridge
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Print Head Packaging & CircuitryPackaging
Electrical contact with lead-in conductor
Dome of C-shaped ink reservoir wall
Ink supply chamber
Ink supply chamber wall
Electrical lead for circuit interfacing
Lead-in conductor
Print head soldered to ink supply chamber wall Electrical contact bonded to exposed conductors
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Print Head Packaging & Circuitry (cont’d)
Circuitry
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Print Head Packaging & Circuitry (cont’d)
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TIJ vs Piezoelectric dots
Piezoelectric vs TIJ vs Laser print on plain paper
Performance Analysis
Piezoelectric printers are susceptible to nozzle-clogging
TIJ use pigmented ink and pressure nozzle ejection
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Epson PM750 1440 dpi, 65microns
HP 2000C 600 dpi, 45microns
Colour Printing
dpi is not the best measure of performanceRapid ejection of small dots is the key to
quality printing (dps)HP’s TIJ has a higher throughputSmaller drop fluid chamber – more nozzles and
higher firing frequency
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Piezoelectric versus TIJ drops-per-second comparison
Colour Printing (cont’d)
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Conclusions
The Bubble jet print head is fabricated using MEMS technology
Fabrication processes include: PECVD, LPCVD, photolithography, etching and sputtering
Integrated design of the print head can increase reliability and reduce cost
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References[1] “Progress and Trends in Ink-jet Printing Technology”, Journal of Imaging Science and
Technology, volume 42, Number 1, Janurary/Feburary 1998[2] Vince Cabill, “Introduction to Digital Printing Technology”:
http://www.techexchange.com/thelibrary/tchnlgy.pdf [March 7 2005][3] “HP Business Inkjet 2800 Printer Series, Technical Specifications”, Hewlett-Packard
Development Company [August 2005][4] “Piezoelectric Process”, PDS Consulting:
http://www.pdsconsulting.co.uk/Images/Process/Piezelectric%20Process.jpg [May 8, 2006].
[5] David B. Wallace, Donald J. Hayes and Christopher J. Fredrickson, "Ink-Jet Based Fluid Microdispensing for High Throughput Drug Discovery," March 2008, http://www.microfab.com/about/papers/chibook/chi_book.htm
[6] Inkjet Workshop, “Tutorials – Definitions,” March 2008, http://www.inkjetworkshop.com/definitions.html
[7] Stephen D. Senturia, Microsystem Design. New York: Springer, 2001.[8] Eldurkar V. Bhaskar and Marzio A. Leban, “Integrated Thermal Ink Jet Printhead and
Method of Manufacture” US Patent 4847630, July 11, 1989[9] C. S. Chan and Robert R. Hay, “Barrier Layer and Orifice Plate for Thermal Ink Jet
Printhead Assembly” US Patent 4694308, September 15, 1987[10] Richard A. Murray, “Printer Ink Cartridge with Drive Logic Integrated Circuit” US
Patent 5646660, July 8, 1997
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Questions?