march 25, 2003 isqed- international symposium on quality electronic design interoperability beyond...

March 25, 2003ISQED- International Symposium on Quality Electronic Design

Interoperability Beyond Design

Sharing Knowledge between Design and Manufacturing

Don Cottrell

VP Emerging Technologies

Si2 Corporation

Thomas J. Grebinski

SEMI Data Path Task Force Chair

SEMI Universal Data Model Working Group Chair


Data-centric IC Designs

• The IC design community is becoming more data centric.– Overcoming the issues of interoperational

efficiencies.• Common data structures for the entire IC design

data flow.

– Open data structure standards• OpenAccess and Si2• Open-source applications program interface.• Open-source reference data base for all IC

design data.• Free license for anyone to use and

redistribute..

• The realization of common expectations– within an increasingly complex, more intimately

connected and data-intensive design data flow.


Open-source Reference Data Base and API

• OpenAccess Coalition and Si2– Click-thru internal use license

• Free access to API specification• Free access to reference database binaries

– Signed internal use and distribution license

• Free access to reference database source• Royalty-free redistribution rights (binaries

only)• Rights to distribute modifications to the

reference database (binaries only) that do not alter the API


OpenAcess Design Data Base and API

Reference DatabaseCores/Cells

GatesTransistors

Physical LayoutOASIS (planned)/GDSII

Standard API.

Commercial EDA ToolsCommercial EDA Tools University ResearchUniversity Research

Th

e r

ealiza

tion

of

com

mon

exp

ecta

tion

s

Internal Proprietary ToolsExternal Design PartnersInternal Proprietary ToolsExternal Design Partners


Wide range of Functionality

• Design Database– Chips / Blocks / Cells– RTL to Silicon– Digital / Analog– Automated / Custom– Logical / Physical– Batch / Interactive

• Library Database– Design organization– Design management– Access control

• Technology Database

– Foundry Rules– Design Constraints

• Translators– GDS2– OASIS (planned)– LEF– DEF– Verilog (planned)– SPEF (planned)– SPICE (planned)


Opaque View Beyond IC Design

• The data view beyond IC design is opaque after GDSII and OASIS.– Design intent is not conserved beyond GDSII and

OASIS.• GDSII and OASIS are a geometric encapsulation of

the design.• SEMI P10 and text files fed downstream are another

encapsulation (interpretation) of the design intent.• The basic design data structure has changed

substantially and thus, the design and mask engineering view up and downstream is not immediately accessible and also not clear (unambiguous).

• Different data structures between design and mask manufacturing centers.– Obscures the up and downstream view further.– Need to convert to standard record structures for

mask manufacturing.


Mask T

ech

nic

al P

lan

nin

g D

ata

Base

Con

vers

ion

to

sta

nd

ard

re

cord

typ

es

Con

vers

ion

to

sta

nd

ard

re

cord

typ

es

IC Design Data Encapsulation for Mask Manufacturing

Ph

ysic

al Layou

t

Cells,

Core

s,

Gate

s,

Tra

nsis

tors

Geom

etr

ic

Sh

ap

es

SEM

I P

10

Text

Files

OA

SIS

GD

SII

Desig

n D

ata

Base

Inte

rnet

File T

ran

sfe

rs

OA

SIS

/GD

SII


Mask Data Preparation and Storage

OA

SIS

/GD

SII

Mask L

ayou

t D

ata

Mask T

ech

nic

al p

lan

nin

g D

ata

Base

MIC

, M

EB

ES

, Tosh

iba

Hit

ach

i, J

EO

L,

KLA

, etc

.

Data

Fin

ish

ing

Data

Fra

ctu

re

Siz

ing,

Bia

sing,

Siz

ing,

Bia

sing,

Mask L

ayou

t

Fra

me g

enera

tion,

bar

codin

g,

test

str

uct

ure

sFra

me g

enera

tion,

bar

codin

g,

test

str

uct

ure

s

Data Preparation

Layer

Extr

acti

on

s,

Scalin

g,

Sh

rin

kin

gLayer

Extr

acti

on

s,

Scalin

g,

Sh

rin

kin

g

Tonalit

y,

Mir

rori

ng

Tonalit

y,

Mir

rori

ng


Machine-specific Data Flow

Mask Critical Dimensions

Mask Inspection

Pattern Generation

OA

SIS

/GD

SII

Mask L

ayou

t D

ata

Mask T

ech

nic

al p

lan

nin

g D

ata

Base

MIC

, M

EB

ES

, Tosh

iba

Hit

ach

i, J

EO

L,

KLA

, etc

.Job Queue Data base


Data Flow and Transformation in a Mask Writer

Wri

ter

Job

Qu

eu

e D

ata

Base

CFR

AC

Extr

acti

on

Ren

deri

ng

CFR

AC

Extr

acti

on

Ren

deri

ng

Mask P

att

ern

Gen

era

tion

FR

AC

Viewers- Integrity Test


Changes in Structure and Hierarchy of Design and Manufacturing Data

Desig

n D

ata

Base

Enca

psu

lati

on F

ilter

Enca

psu

lati

on F

ilter

Reco

rd T

ypes

Filt

er

Reco

rd T

ypes

Filt

er

Data

pre

para

tion F

ilter

Data

pre

para

tion F

ilter

Tech

nic

al P

lan

nin

g D

ata

Base

Tech

nic

al P

lan

nin

g D

ata

Base

Tech

nic

al P

lan

nin

g D

ata

Base


The Fracturing of Fractured Mask Layout Data

Wri

ter

Job

Qu

eu

e D

ata

Base

CFR

AC

Extr

acti

on

Ren

deri

ng

FR

AC

CFR

AC

, Extr

act

ion a

nd R

enderi

ng F

ilter

CFR

AC

, Extr

act

ion a

nd R

enderi

ng F

ilter

FR

AC

Tech

nic

al P

lan

nin

g D

ata

Base

Mask P

att

ern

Gen

era

tion


Design and Manufacturing Interoperability

• IC and mask design intent are lost downstream

– Numerous filters and translations of data drop design and manufacturing hierarchy.

• There is no real time direct data link to what is written on a mask.

• Which gives the IC designer an opaque view of how the design is spatially transformed onto a mask.

– Such a view is a compelling need when non-parasitic biasing and proximity corrections push a design outside acceptable IC design rules.

– Such constraints will increase as the spatial density budget for circuit elements increases.

– Such losses extends “time to market” and increase design and manufacturing costs.

– It will become increasingly important to design at a higher level of abstraction with a real-time view of what is actually writable on a mask or wafer.

– It will also become increasingly important to ensure that any movement of data is as efficient, portable and extensible as possible.


Finer Data Granularity Expected at the Mask Pattern Generation Level

• Design and manufacturing data granularity continues to increase.

– 100 to 300 Gb files with the expectation that the cost of ownership to write or manufacture a mask does not increase.

– Job Queue and sorting data rates are reaching several hundreds of Mb/second with needed storage capacity in the Terabytes region.

– These types of demands run orthogonal to the necessary reduction of COO and a shorter time to market.

• Greater access to design data– Interconnectivity data will help improve mask layout and

engineering data processing time.• Massive parallel processing

– Sorting is fundamental for efficient massive parallel processing

– Access efficiency features, such cell reference tables and bounding boxes, accelerates transformations, such as sorting


The SEMI and OpenAccess Universal Data Model (UDM)

Standard API.

IC Design and Mask Technical Planning Data Base

Physical Design Layout

Cells, Cores, Gates, Transistors

Geometric shapes Mask layout

Write-, inspection- and CD measurement-ready data files

IC Design

DRCSimulationVerificationSynthesisEncapsulation

IC Design

DRCSimulationVerificationSynthesisEncapsulation

Mask Manufacturing

CD measurementPattern generationInspectionEncapsulation/SimulationData preparation/AssemblyFracturing/Verification

Mask Manufacturing

CD measurementPattern generationInspectionEncapsulation/SimulationData preparation/AssemblyFracturing/Verification

Hie

rarc

hic

al D

ata

Base


The SEMI and OpenAcess UDM

• One standard data base and applications program interface (API).– For design and mask manufacturing.– Access to all design and mask manufacturing

data through one common data language.

• Standard semantics for all model objects, attributes and relationships– No ambiguity between or within design and

manufacturing tasks.

• Hierarchy preserved through to mask pattern generation, CD measurements and inspection.– Unified design to manufacturing data flow and

effort.


The SEMI and OpenAcess UDM

• Full access to design and manufacturing intent up and down the design and manufacturing flow.

• Opens the door to more efficient massive parallel processing at the mask pattern generation level.

– Thread safe and data preparation• multiple threads within an application can operate on data in

parallel without the risk of one thread contaminating the data on another.

• request objects that are within a specified spatial area (e.g. a stripe)

– Query by Region for pattern generation and inspection

• multiple stripes in parallel; multiple executions.• Direct access to mask layout and DRC extraction data by

region of interest during mask inspection and CD measurement operations.

• Unlimited scalability– The model is limited only by the ability to store and

manage the data within the data base.


Extending the reach of the UDM

.

Universal Data Model

Hie

rarc

hic

al D

ata

Base

Device manufacturing

Process characterizationParasitics development CMP Etch CVD, PECVD, Implant PSM, Lithography, etc.Mask Quality Assessment

Device manufacturing

Process characterizationParasitics development CMP Etch CVD, PECVD, Implant PSM, Lithography, etc.Mask Quality Assessment

IC Design

Mask Manufacturing

IC Design

Mask Manufacturing

Wafer process data

Process Parasitics

Standard API


UDM Status

• The technology exists today for full implementation– The reference data base and API are already

available and being used today.– Mask and wafer implementations underway

through SEMI, OpenAccess Coalition and Si2.

• It is a community resource– Change-order team in place.– Applicable to design, mask and wafer data

flows.– Applicable to high-speed and volume data

rendering and measurement applications.

• Free-use license– Free-use after release from the OpenAccess

coalition.


Organizations Involved

• SEMI Data Path Task Force– Tom Grebinski ([email protected])

• Task Force Chair– Applicable site

• www.semi.org• www.si2.org/eda-mask

• SEMI UDM Working Group– Tom Grebinski and Don Cottrell – Working Group Co-chairs

• OpenAccess Coalition and Si2– Scott Peterson, LSI Logic (OAC Chairman)– Steve Schulz- President and CEO, Si2

([email protected])– Applicable sites

• www.openeda.org• www.si2.org /openaccess


Companies Participating

• Cadence Design• Mentor Graphics• Synopsys• Micronic Laser

Systems• JEOL• KLA-Tencor• Applied Materials• Dai Nippon Printing• Toppan Printing• Photronics• Dupont Photomasks• STMicroelectronics• TSMC USA• Toshiba (NuFlare)• Hitachi• Hewlett-Packard

• International Sematech

• IBM• Infineon• Texas Instruments• Motorola• Philips Semiconductor• JEOL• Alcatel• Intel• AMD• SELETE/JEITA• National

Semiconductor• LSI Logic


Moving Forward

• Critical Path Items– New members to SEMI Data Path Task

Force and Working Groups– New members to the OpenAcess Coalition

• Implementation of the mask and wafer extensions to the OpenAccess Data base and API.

• Extending and then bridging the responsibilities between design, mask and wafer manufacturing.

– Data-intensive flow integration with OpenAccess and the UDM.

• Pattern generation• Data Preparation• Mask inspection and CD measurement

– Formalize relationship between SEMI, SI2 and OpenAccess Coalition


Successful Track Record

• Si2 and the OpenAccess Coalition– Open-Source Reference Data Base and API– Source and Binary code made available for the

model and API.• Unprecedented effort and availability

– Released to the public January 1, 2003

• SEMI Data Path Task Force– The development of a replacement for GDSII

called OASISTM.



• OASISTM

– 64-bit Open Artwork System Interchange Standard.

• vs. 16-32 bit

– direct access to cell pointers• GDSII has only sequential access to cell data.

– 10-50 times more compact– Makes use of modality– Can mimic data organization of virtually any

writing or inspection pattern file. – Flexible property mechanism which can be

used to tag figures, arrays, and cells with as much textual and numeric information as needed by downstream processors.



• The creation of the Universal Data Model (UDM)

– Embrace of the technology worldwide and across several industry platforms.

• A recognition of the importance of the link between design and manufacturing by the industry and the media.

– Adoption of the OpenAccess reference data model and API as the basis for the ongoing development of the UDM.


Adoption of the Technology

• The compelling need– Data granularity of an IC design and the

manufacturing of an IC continues to increase.• Closer integration of the data flow; greater opportunity

to lose design intent at a number of levels.– Greater inability with the tracking and credible use of

design and manufacturing data.

• Greater need for speed with fewer errors.– Massive parallel processes into the tera-pixels per second.

• Greater need for deign intent at the mask data preparation, pattern generation and inspection levels.

• Greater need for manufacturing intent in the design space; cross talk is there ad getting louder.

– Proximity corrections at the manufacturing level render DRC at the design level less effective. The need for a view by design at the mask production level.

• There is no choice

march 25, 2003 isqed- international symposium on quality electronic design interoperability beyond...

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