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March 4 - 7, 2018
Hilton Phoenix / Mesa Hotel
Mesa, Arizona
© 2018 BiTS Workshop – Image: pilgrims49 / iStock
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Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Improved contact solutions for
WLCSP RF applications
Yoinjun Shi
Twinsolution & GTransi
BiTS Workshop
March 4 - 7, 2018
Conference Ready
mm/dd/2014
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Contents
• Background
• 5G Vision
• Filter Introduction
• 1st Generation Socket Structure Introduction
• Production Data Verification
• Contact Evaluation
• 2nd Generation Introduction
• Summary
Improved contact solutions for WLCSP RF applications 2
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Background
Improved contact solutions for WLCSP RF applications 3
• Short spring pin
• Elastomer
• S-Contactor
• Membrane Pin
• In order to get a lower
inductance, we need the
contactor as short as possible.
• Different technology using
different material as the spring,
but with a lower compress
height.
• A longer compress travel is
needed for RF testing.
RF Test Contactor Type
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
5G Vision
4 Improved contact solutions for WLCSP RF applications
Total Capacity= B X ƞ X N
Bandwidth
spectrum effectiveness
No of stations
5G NR Standard
Catergeory Frequency Range
Consideration TDD Band(3.3GHz -4.6GHz)
(Time Division Duplexing)
Researching 24.25-27.5
31.8-33.4
37-43.5
45.4-50.2
50.4-52.6
66-76
81-86
North America 27.5-28.35
37-38.6
38.6-40
64-71
To boldly go where
no man has gone
before.
Quote from Star Trek:
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
An Typical Diagram of Mobile Phone
http://eecatalog.com/bindra/wp-content/uploads/2012/03/RF-Microwave-Tracker-March-3-Fujitsu-MB86L11A_block-diagram.jpg
5 Improved contact solutions for WLCSP RF applications
• 5 Mode/ 13 Band
• 2G – GSM:850/900/1800/1900
• 3G (WCDMA /TD) – WCDMA:2100MHz/1900MHz/850MHz
– TD-SCDMA:1880-1920MHz/2010-2025MHz
– CDMA2000:1920-1935MHz/2110-2125MHz
• 4G – TDD-LTE:1900MHz/2300MHz/2600MHz
– FDD-LTE:1800MHz/2600MHz
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
1st Generation Socket Structure
6 Improved contact solutions for WLCSP RF applications
Device Contactor
Upper
Guide plate
PCB Board
Microstrip
Line
Patent Pending
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Helius Pin Socket Vs. Traditional Socket
7 Improved contact solutions for WLCSP RF applications
Helius Pin Socket
Material: BeCu/Gold plating
Crown Diameter: Ø0.14mm
Plunger Diameter: Ø0.29mm
Flange Diameter: Ø0.33mm
Flange to Crown: 0.97mm
Material: BeCu /Gold Plating
Length: 0.45mm
Plunger Diameter: Ø0.14mm
Tip Radius: Full Radius
1.72mm
Traditional Socket
Guide
plate
Pin
PCB Board
Support Plate
Back Stiffener
Guide
plate
Socket
Body
Retainer
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Study of S-Parameter
8 Improved contact solutions for WLCSP RF applications
-0.7 dB
-0.6 dB
-0.5 dB
-0.4 dB
-0.3 dB
-0.2 dB
-0.1 dB
0.0 dB
0.0 G 5.0 G 10.0 G 15.0 G 20.0 G 25.0 G 30.0 G 35.0 G 40.0 G
1.72mm Spring Pin Helius Pin
Insertion Loss
-120.0 dB
-100.0 dB
-80.0 dB
-60.0 dB
-40.0 dB
-20.0 dB
0.0 dB
0.0 G 5.0 G 10.0 G 15.0 G 20.0 G 25.0 G 30.0 G 35.0 G 40.0 G
1.72 mm Spring Pin Helius Pin
Return Loss
1. Both using GSG Structure
2. Data by simulation
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Production Test Data
9 Improved contact solutions for WLCSP RF applications
1.72mm Pin Vs Helius Pin
-80
-70
-60
-50
-40
-30
-20
-10
0
1.5
0E+
09
1.5
4E+
09
1.5
7E+
09
1.6
1E+
09
1.6
4E+
09
1.6
8E+
09
1.7
2E+
09
1.7
5E+
09
1.7
9E+
09
1.8
2E+
09
1.8
6E+
09
1.9
0E+
09
1.9
3E+
09
1.9
7E+
09
2.0
0E+
09
2.0
4E+
09
2.0
8E+
09
2.1
1E+
09
2.1
5E+
09
2.1
8E+
09
2.2
2E+
09
2.2
6E+
09
2.2
9E+
09
2.3
3E+
09
2.3
6E+
09
2.4
0E+
09
2.4
4E+
09
2.4
7E+
09
B1 RX Test Data B1 RX Test Data
-7.00E+01
-6.00E+01
-5.00E+01
-4.00E+01
-3.00E+01
-2.00E+01
-1.00E+01
0.00E+00
1.5
0E+
09
1.5
4E+
09
1.5
8E+
09
1.6
2E+
09
1.6
6E+
09
1.7
1E+
09
1.7
5E+
09
1.7
9E+
09
1.8
3E+
09
1.8
7E+
09
1.9
1E+
09
1.9
5E+
09
1.9
9E+
09
2.0
3E+
09
2.0
7E+
09
2.1
2E+
09
2.1
6E+
09
2.2
0E+
09
2.2
4E+
09
2.2
8E+
09
2.3
2E+
09
2.3
6E+
09
2.4
0E+
09
2.4
4E+
09
2.4
8E+
09
B1 TX Test Data B1 TX Test Data
By using same device
different socket structure
to measure.
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Further Discussion
10 Improved contact solutions for WLCSP RF applications
Soldering on Evaluation Board
Socket Performance
1. Out-band suppression
2. Gain loss
By using same device one solder
on the PCB board, the other
measure by Helius pin. In order to study the impact of contactors to
the device, we create a pi type low pass filter,
and insert the pin into the filter to compare.
2
1
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Further Discussion
11 Improved contact solutions for WLCSP RF applications
1.72mm Pin Helius Pin
Self
Inductance 0.31nH 0.11nH
Mutual
Inductance 0.124nH 0.042nH
-25.0 dB
-20.0 dB
-15.0 dB
-10.0 dB
-5.0 dB
0.0 dB
0.0 G 2.5 G 5.0 G
Original_Filter Helius Pin 1.72mm Pin
1. The lower grounding
inductance, the lower
Out-band suppression
2. High contact resistance
significantly related to gain
loss.
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Contact Tip Study
12 Improved contact solutions for WLCSP RF applications
Radius
Crown
By using same device
repeat 10 times to
compare the crown
and radius tip design.
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Contact Current Density Analysis
13 Improved contact solutions for WLCSP RF applications
1. Crown has a better
current path compare
with radius point, the
four constriction point,
utilize the space
optimized.
2. Radius contact has 3
times current density
when we look at the
constriction area.
Insulation Base
1 μm gold pad
Pad
Str
uctu
re
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
n Spot Constriction Discussion
14 Improved contact solutions for WLCSP RF applications
R: Constriction Resistance
n: 4
L: Distance between different
constriction point
a: Constriction radius
𝑅 𝑛, 𝑙, 𝑎 =ϼ
2𝛱𝑛𝑎𝑎𝑟𝑐𝑡𝑎𝑛
𝑙2 − 𝑎2
𝑎
100a 1.34a
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Contactor Performance Test
15 Improved contact solutions for WLCSP RF applications
1pcs Loop test (TX)
10pcs X 3Cycles contact test (TX)
10pcs X 3Cycles contact test (RX)
1pcs Loop test (RX)
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
2nd Generation Proto Type
16 Improved contact solutions for WLCSP RF applications
Grounding or logic pin
Signal Pin Micro Strip
PCB Board
Bottom Guide Plate
Top Guide Plate Test Board
Normal Trace
Second generation structure, using the backside
trace of PCB board for logic signal path, RF
signal still go with the top layer trace.
Patent Pending
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
S-Parameter Simulation and Measurement
17 Improved contact solutions for WLCSP RF applications
-2.5 dB
-2.0 dB
-1.5 dB
-1.0 dB
-0.5 dB
0.0 dB
0.0 G 5.0 G 10.0 G 15.0 G 20.0 G 25.0 G 30.0 G 35.0 G 40.0 G
Simulation Measument
-100.0 dB
-90.0 dB
-80.0 dB
-70.0 dB
-60.0 dB
-50.0 dB
-40.0 dB
-30.0 dB
-20.0 dB
-10.0 dB
0.0 dB
0.0 G 5.0 G 10.0 G 15.0 G 20.0 G 25.0 G 30.0 G 35.0 G 40.0 G
Simulation Measurement
Alphabet Soup - High Frequency (HF), 5G, and millimeter-wave BiTS 2018 Session 1A Presentation 1
March 4-7, 2018 Burn-in & Test Strategies Workshop www.bitsworkshop.org
Summary & Discussion
18 Improved contact solutions for WLCSP RF applications
• Introduce a new design concept for integrated with PCB
board in order to reduce contactor inductance, and signal
to signal isolation
• Discuss the pin contact performance and inductance
impact to filter application.
• Introduce 2nd generation of the design in order to improve
the socket pin count to around 100 pieces.