marking | cutting | welding | micro machining | additive
TRANSCRIPT
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 1 CM-F00003 – Rev 4
Marking | Cutting | Welding | Micro Machining | Additive Manufacturing
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 2 CM-F00003 – Rev 4
G4
130W and 200W EP-Z ns pulsed Fiber Lasers
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 3 CM-F00003 – Rev 4
BEAM QUALITY
S Type
(M2<1.3)
Z Type
(M2<1.6)
L Type
(M2<1.6-2.0)
H Type
(M2<2.5-3.5)
M Type
(M2<4.0-6.0)
Pulse Energy
Peak power
<0.7 mJ
>7 kW
<1.5 mJ
>10 kW
<0.8 mJ
>12 kW
<1.25 mJ
>20 kW
<5 mJ
>40 kW
PU
LS
ET
UN
E
(pu
lse d
ura
tio
n)
RM 2 waveforms
(25-250ns)
- 20W / 30W / 50W / 70W - - -
HS 24+ waveforms
(10-250ns)
20W / 50W - 20W 40W / 70W -
EP 40+ waveforms
(3-2000ns) 20W
20W / 50W / 70W /
100W / 130W / 200W - - 130W / 200W
Key Attributes Fine features <25um
25um – 60um Multi purpose 35um – 80um Wider lines
>60m
High pulse energy & peak
power
Apps Scribing / Fine marking
Marking / Engraving /
Cutting
Plastic / metal marking
Wide marks / Deep
engrave
Cleaning / polishing /
welding
The redENERGY G4 Product Range
All redENERGY G4 Fiber Lasers are OEM devices for incorporation
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 4 CM-F00003 – Rev 4
BEAM QUALITY
S Type (M2<1.3)
Z Type
(M2<1.6) L Type
(M2<1.6-2.0)
H Type
(M2<2.5-3.5)
M Type
(M2<4.0-6.0)
Pulse Energy
Peak power
<0.7 mJ
>7 kW
<1.5 mJ
>10 kW
<0.8 mJ
>12 kW
<1.25 mJ
>20 kW
<5 mJ
>40 kW
PU
LS
ET
UN
E
(pu
lse d
ura
tio
n)
RM 2 waveforms
(25-250ns)
- 20W / 30W / 50W / 70W - - -
HS 24+ waveforms
(10-250ns)
20W / 50W - 20W 40W / 70W -
EP 40+ waveforms
(3-2000ns) 20W
20W / 50W / 70W /
100W / 130W / 200W - - 130W / 200W
Key Attributes Fine features <25um
25um – 60um Multi purpose 35um – 80um Wider lines
>60m
High pulse energy & peak
power
Apps Scribing / Fine marking
Marking / Engraving /
Cutting
Plastic / metal marking
Wide marks / Deep
engrave
Cleaning / polishing /
welding
The redENERGY G4 Product Range
Expanding on our
range of Z-type lasers
for higher power and
productivity
All redENERGY G4 Fiber Lasers are OEM devices for incorporation
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 5 CM-F00003 – Rev 4
PRODUCTIVITY
FLEXIBILITY
QUALITY
All the benefits of redENERGY G4
Flexible yet robust beam delivery
• Range of cable lengths
• IP54 rated cable
Versatile control
• Analogue, RS232 and Ethernet connectivity
Industry leading reliability
• 3 year warranty
CE Marked
Monolithic design
• No need to clean optical surfaces
No routine maintenance required
• No optical realignment or pump replacement
Highly efficient
• Up to 30% wall-plug efficiency
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 6 CM-F00003 – Rev 4
Features of the 130W and 200W EP-Z
Beam Quality
• M2 < 1.6 (typ. 1.3)
Pulse Energy
• Up to 1.5mJ
Peak Power
• In excess of 10kW
Visible pilot laser
Wavelength
• 1060nm across the range
Pulse Duration
• 10ns – 2000ns
Pulse Repetition Frequency
• From single shot to 4MHz
Collimated output
• With nominally 10 mm diameter
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 7 CM-F00003 – Rev 4
Features of the 130W and 200W EP-Z
Compact form-factor
• Will fit in a 3U 19” rack
36 VDC operation
• Optional PSU available
Air-cooled
• No need for cooling water
Field reparable
• Electronics
• Fan assembly
• Output optic
Industry 4.0 ready
• Condition monitoring capability
Industry standard output interface
• 35 mm OD cylindrical connector
Broad operating temperature
• 10 - 40 ºC
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 8 CM-F00003 – Rev 4
Form & Fit – Laser Enclosure
423 mm 417 mm
133 mm
Laser I/O and Ethernet
control/monitoring ports (standard for all redENERGY G4 Lasers)
Laser Power
connector (36 VDC)
“IBeam1”
Delivery Optic
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 9 CM-F00003 – Rev 4
Form & Fit – Beam Delivery Optic
29/06/2016
388 mm
94 mm
57 mm “IBeam1”
Delivery Optic
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 10 CM-F00003 – Rev 4
Applications
Cutting thin foil copper
Cutting
• High quality cutting of thin foils • Good beam quality (M2<1.6 ) provides small spots and high irradiances
• Superb edge quality achieved though longer pulses (up to 2000 ns)
• Ideal for metal foils used in battery production
• Copper and aluminium foil (typically <30 μm in thickness)
• Coated metal foil (typically 60 – 120 μm in total thickness)
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 11 CM-F00003 – Rev 4
Applications
Cutting
Cutting Copper
• High quality cutting of thin foils • Good beam quality (M2<1.6 ) provides small spots and high irradiances
• Superb edge quality achieved though longer pulses (up to 2000 ns)
• Ideal for metal foils used in battery production
• Copper and aluminium foil (typically <30 μm in thickness)
• Coated metal foil (typically 60 – 120 μm in total thickness)
• Faster cutting of sheet metal • Up to 3 mm in thickness for some metals
• Higher average power (up to 200W) increases productivity
• Higher pulse energy (1.5 mJ) provides up to 40% increase in cutting speed
• Compared to legacy G4 at this beam quality (1mJ max.)
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 12 CM-F00003 – Rev 4
Applications
Cutting Silver
Cutting
• High quality cutting of thin foils • Good beam quality (M2<1.6 ) provides small spots and high irradiances
• Superb edge quality achieved though longer pulses (up to 2000 ns)
• Ideal for metal foils used in battery production
• Copper and aluminium foil (typically <30 μm in thickness)
• Coated metal foil (typically 60 – 120 μm in total thickness)
• Faster cutting of sheet metal • Up to 3 mm in thickness for some metals
• Higher average power (up to 200W) increases productivity
• Higher pulse energy (1.5 mJ) provides up to 40% increase in cutting speed
• Compared to legacy G4 at this beam quality (1mJ max.)
• Reliable cutting of reflective metals • Including copper, silver and gold
• Oscillation cutting provides reduced HAZ and increased quality
• Rugged optical isolation provides benefits over CW and QCW lasers
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 13 CM-F00003 – Rev 4
Micro-joining
Battery Welding
Applications
• High quality micro-welding • Can produce lap, butt and fillet welds
• Strong welds with high peel strength
• Extremely low levels of thermal distortion
• High levels of consistency
• Ideal for battery tab welding
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 14 CM-F00003 – Rev 4
Micro-joining
Micro-joining Dissimilar Metals
Applications
• High quality micro-welding • Can produce lap, butt and fillet welds
• Strong welds with high peel strength
• Extremely low levels of thermal distortion
• High levels of consistency
• Ideal for battery tab welding
• Dissimilar metal joining • Can make joins which cannot be achieved with other lasers
• Able to join even the most ‘difficult’ combinations
• Including Stainless Steel, Brass, Copper and Aluminium
• Innovative and patented process techniques
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 15 CM-F00003 – Rev 4
Applications
Micro-joining
Thick Welding on Mild Steel
• High quality micro-welding • Can produce lap, butt and filet welds
• Strong welds with high peel strength
• Extremely low levels of thermal distortion
• High levels of consistency
• Ideal for battery tab welding
• Dissimilar metal joining • Can make joins which cannot be achieved with other lasers
• Able to join even the most ‘difficult’ combinations
• Including Stainless Steel, Brass, Copper and Aluminium
• Innovative and patented process techniques
• Joining foil and sheet metals • Typical weld times of 0.3 – 1.5 seconds per spot
• Up to 1 mm in thickness
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 16 CM-F00003 – Rev 4
Applications
High Speed QR code Marking on Tin
Marking
• Higher productivity • Up to 4MHz pulse repetition frequency
• Suitable for fast galvo and polygon scanners
• Up to 400 m/s linear line scanning speed
• Replacing ultrafast lasers in some applications
• Very short turn on and off times compared to other lasers
• Ideal for fast QR / data matrix marking
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 17 CM-F00003 – Rev 4
Applications
Dot Code Marking on Stainless Steel
Marking
• Higher productivity • Up to 4MHz pulse repetition frequency
• Suitable for fast galvo and polygon scanners
• Up to 400 m/s linear line scanning speed
• Replacing ultrafast lasers in some applications
• Very short turn on and off times compared to other lasers
• Ideal for fast QR / data matrix marking
• Flexible processing • Long and short ns pulses with high peak power (>10kW)
• Same laser can be used for pre or post mark cleaning
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 18 CM-F00003 – Rev 4
Applications
Marking
• Higher productivity • Up to 4MHz pulse repetition frequency
• Suitable for fast galvo and polygon scanners
• Up to 400 m/s linear line scanning speed
• Replacing ultrafast lasers in some applications
• Very short turn on and off times compared to other lasers
• Ideal for fast QR / data matrix marking
• Flexible processing • Long and short ns pulses with high peak power (>10kW)
• Same laser can be used for pre or post mark cleaning
• High quality marking • Stable power, pulse duration and pulse energy
• Multiple first pulse equalisation techniques
• “On the fly” pulse frequency and waveform control
• 45 waveforms enabling pulse durations 10 – 2000 ns
• Ideal for Vehicle Registration Number (VIN) and raised marking VIN marking on Mild Steel
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 19 CM-F00003 – Rev 4
Drilling & Micromachining
Applications
• Faster processing of thin foils • Create 200,000 holes per second
• Holes <30μm diameter or larger with conventional optics
• High quality drilling • Low levels of dross
• High aspect ratio
• High density of holes
Drilling Copper Foil
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 20 CM-F00003 – Rev 4
Applications
Drilling & Micromachining
• Faster processing of thin foils • Create 200,000 holes per second
• Holes <30μm diameter or larger with conventional optics
• High quality drilling • Low levels of dross
• High aspect ratio
• High density of holes
• Consistent and repeatable results • High temporal and spatial resolution
• Enabling quality high speed processing
• Flexibility to create • High peak power maintained at high pulse frequency
• Increased scope for process optimisation
Drilling 0.6mm Stainless Steel
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 21 CM-F00003 – Rev 4
Deep Engraving Mild Steel
Engraving and Polishing
Applications
• High speed deep engraving • Fine features and low taper angles
• Greater control on the depth of engraving
• Polishing with Ra down to 1 um
• Increased processing speed • Enabling both fine detail and large area coverage
• Controllable level of ablation
• Non-contact process • No wearing parts
• Minimal fixturing requirements
Not to be distributed without prior consent of SPI Lasers UK Ltd.
Slide: 22 CM-F00003 – Rev 4 29/06/2016