bullProvides a means to align a pattern on a chip to the pattern

on a mask and then to expose this pattern

UV-light

Mask quartz + Cr pattern

Photoresist

substrate

MASK ALIGNER INTRODUCTION

Pump service

corridor

Lamp power

supply

The aligner

Lamp house

microscope

Microscope Translation-control Mask holder

Alignment stage

Manometer box

Mirror house Sample

holder

Mercury lamp bull g - line 436 nm

bull h-line 405 nm

bull i - line 365 nm

S-1800 series are g-line photoresit

Mercury lamp

bull Life time 600 h

bullNitrogen cooling is very important

bullLamp must be cool before restarting hellip or you risk

damaging the lamp Therefore wait ~30 minutes after

previous use But it is better to leave the lamp on for several

hours than turn off and on and off and on hellip

bullThe first exposure after turning on the lamp should be done

with no wafer

1048766If the bulb explodes it will fill the lithography area with

toxic mercury vapor This can cause severe neurological

damage EVACUATE THE LAB FOR AT LEAST 30 MIN

The mask aligner will also be seriously damaged

1048766

Mercury lamp power supply

bull It can be operated at constant power or

constant Intensity

bull Constant intensity better reproducibility bull CI1 refers to 365 nm

bull CI2 refers to 405 nm

In constant intensity mode the controller monitors the

lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the

intensity selected bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEW Before NOW

Turn onoff the whole

machine and Nitrogen in

service corridor

ONLY H2 and air switches

on the aligner controller unit

No vacuum no possibility

of different exposures modes

Vacuum is available

Possibility to choose

Height adjustment in contact NEVER height adjustment in

contact

The Lever separation was

not used

The lever separation must be

used

Exposures in constant power

mode

Exposures in constant

intensity mode

Air pressure and

nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel

limits

X 3mm

Y 3mm

3

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

Pump service

corridor

Lamp power

supply

The aligner

Lamp house

microscope

Microscope Translation-control Mask holder

Alignment stage

Manometer box

Mirror house Sample

holder

Mercury lamp bull g - line 436 nm

bull h-line 405 nm

bull i - line 365 nm

S-1800 series are g-line photoresit

Mercury lamp

bull Life time 600 h

bullNitrogen cooling is very important

bullLamp must be cool before restarting hellip or you risk

damaging the lamp Therefore wait ~30 minutes after

previous use But it is better to leave the lamp on for several

hours than turn off and on and off and on hellip

bullThe first exposure after turning on the lamp should be done

with no wafer

1048766If the bulb explodes it will fill the lithography area with

toxic mercury vapor This can cause severe neurological

damage EVACUATE THE LAB FOR AT LEAST 30 MIN

The mask aligner will also be seriously damaged

1048766

Mercury lamp power supply

bull It can be operated at constant power or

constant Intensity

bull Constant intensity better reproducibility bull CI1 refers to 365 nm

bull CI2 refers to 405 nm

In constant intensity mode the controller monitors the

lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the

intensity selected bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEW Before NOW

Turn onoff the whole

machine and Nitrogen in

service corridor

ONLY H2 and air switches

on the aligner controller unit

No vacuum no possibility

of different exposures modes

Vacuum is available

Possibility to choose

Height adjustment in contact NEVER height adjustment in

contact

The Lever separation was

not used

The lever separation must be

used

Exposures in constant power

mode

Exposures in constant

intensity mode

Air pressure and

nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel

limits

X 3mm

Y 3mm

3

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

Lamp house

microscope

Microscope Translation-control Mask holder

Alignment stage

Manometer box

Mirror house Sample

holder

Mercury lamp bull g - line 436 nm

bull h-line 405 nm

bull i - line 365 nm

S-1800 series are g-line photoresit

Mercury lamp

bull Life time 600 h

bullNitrogen cooling is very important

bullLamp must be cool before restarting hellip or you risk

damaging the lamp Therefore wait ~30 minutes after

previous use But it is better to leave the lamp on for several

hours than turn off and on and off and on hellip

bullThe first exposure after turning on the lamp should be done

with no wafer

1048766If the bulb explodes it will fill the lithography area with

toxic mercury vapor This can cause severe neurological

damage EVACUATE THE LAB FOR AT LEAST 30 MIN

The mask aligner will also be seriously damaged

1048766

Mercury lamp power supply

bull It can be operated at constant power or

constant Intensity

bull Constant intensity better reproducibility bull CI1 refers to 365 nm

bull CI2 refers to 405 nm

In constant intensity mode the controller monitors the

lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the

intensity selected bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEW Before NOW

Turn onoff the whole

machine and Nitrogen in

service corridor

ONLY H2 and air switches

on the aligner controller unit

No vacuum no possibility

of different exposures modes

Vacuum is available

Possibility to choose

Height adjustment in contact NEVER height adjustment in

contact

The Lever separation was

not used

The lever separation must be

used

Exposures in constant power

mode

Exposures in constant

intensity mode

Air pressure and

nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel

limits

X 3mm

Y 3mm

3

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

Mercury lamp bull g - line 436 nm

bull h-line 405 nm

bull i - line 365 nm

S-1800 series are g-line photoresit

Mercury lamp

bull Life time 600 h

bullNitrogen cooling is very important

bullLamp must be cool before restarting hellip or you risk

damaging the lamp Therefore wait ~30 minutes after

previous use But it is better to leave the lamp on for several

hours than turn off and on and off and on hellip

bullThe first exposure after turning on the lamp should be done

with no wafer

1048766If the bulb explodes it will fill the lithography area with

toxic mercury vapor This can cause severe neurological

damage EVACUATE THE LAB FOR AT LEAST 30 MIN

The mask aligner will also be seriously damaged

1048766

Mercury lamp power supply

bull It can be operated at constant power or

constant Intensity

bull Constant intensity better reproducibility bull CI1 refers to 365 nm

bull CI2 refers to 405 nm

In constant intensity mode the controller monitors the

lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the

intensity selected bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEW Before NOW

Turn onoff the whole

machine and Nitrogen in

service corridor

ONLY H2 and air switches

on the aligner controller unit

No vacuum no possibility

of different exposures modes

Vacuum is available

Possibility to choose

Height adjustment in contact NEVER height adjustment in

contact

The Lever separation was

not used

The lever separation must be

used

Exposures in constant power

mode

Exposures in constant

intensity mode

Air pressure and

nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel

limits

X 3mm

Y 3mm

3

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

Mercury lamp

bull Life time 600 h

bullNitrogen cooling is very important

bullLamp must be cool before restarting hellip or you risk

damaging the lamp Therefore wait ~30 minutes after

previous use But it is better to leave the lamp on for several

hours than turn off and on and off and on hellip

bullThe first exposure after turning on the lamp should be done

with no wafer

1048766If the bulb explodes it will fill the lithography area with

toxic mercury vapor This can cause severe neurological

damage EVACUATE THE LAB FOR AT LEAST 30 MIN

The mask aligner will also be seriously damaged

1048766

Mercury lamp power supply

bull It can be operated at constant power or

constant Intensity

bull Constant intensity better reproducibility bull CI1 refers to 365 nm

bull CI2 refers to 405 nm

In constant intensity mode the controller monitors the

lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the

intensity selected bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEW Before NOW

Turn onoff the whole

machine and Nitrogen in

service corridor

ONLY H2 and air switches

on the aligner controller unit

No vacuum no possibility

of different exposures modes

Vacuum is available

Possibility to choose

Height adjustment in contact NEVER height adjustment in

contact

The Lever separation was

not used

The lever separation must be

used

Exposures in constant power

mode

Exposures in constant

intensity mode

Air pressure and

nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel

limits

X 3mm

Y 3mm

3

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

Mercury lamp power supply

bull It can be operated at constant power or

constant Intensity

bull Constant intensity better reproducibility bull CI1 refers to 365 nm

bull CI2 refers to 405 nm

In constant intensity mode the controller monitors the

lamp intensity measure on the feedback sensor and

varies the power supplied to the lamp to keep the

intensity selected bullWe work with CI2 because is the power meter we have

I= 25mWcm2

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEW Before NOW

Turn onoff the whole

machine and Nitrogen in

service corridor

ONLY H2 and air switches

on the aligner controller unit

No vacuum no possibility

of different exposures modes

Vacuum is available

Possibility to choose

Height adjustment in contact NEVER height adjustment in

contact

The Lever separation was

not used

The lever separation must be

used

Exposures in constant power

mode

Exposures in constant

intensity mode

Air pressure and

nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel

limits

X 3mm

Y 3mm

3

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

1 Lamp

2 Elipsoidal mirror

3 Cold mirror

4 Flyrsquos eyes lens

5 Condenser lens (32mm)

6 Frame for filters

7 Diffraction reducing lens plates (69 mm)

8 Turning mirror

9 Front lens

UV-400 optics

WHATrsquoS NEW Before NOW

Turn onoff the whole

machine and Nitrogen in

service corridor

ONLY H2 and air switches

on the aligner controller unit

No vacuum no possibility

of different exposures modes

Vacuum is available

Possibility to choose

Height adjustment in contact NEVER height adjustment in

contact

The Lever separation was

not used

The lever separation must be

used

Exposures in constant power

mode

Exposures in constant

intensity mode

Air pressure and

nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel

limits

X 3mm

Y 3mm

3

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

WHATrsquoS NEW Before NOW

Turn onoff the whole

machine and Nitrogen in

service corridor

ONLY H2 and air switches

on the aligner controller unit

No vacuum no possibility

of different exposures modes

Vacuum is available

Possibility to choose

Height adjustment in contact NEVER height adjustment in

contact

The Lever separation was

not used

The lever separation must be

used

Exposures in constant power

mode

Exposures in constant

intensity mode

Air pressure and

nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel

limits

X 3mm

Y 3mm

3

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

Air pressure and

nitrogen switches

ONOFF

ON all the time

ONLY MOVE THE THIN ENDS

Travel

limits

X 3mm

Y 3mm

3

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

ONLY MOVE THE THIN ENDS

Travel

limits

X 3mm

Y 3mm

3

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

CONTACT

ARM

CONTACT-

SEPARATION

LEVER

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

Exposure modes

Mode How does it work Resolution comments

Vacuum Contact

(HP)

vacuum is drawn between the mask and

the wafer prior exposure

~08 microm pitch

RISK OF BREAKING

THE MASK

Standard (ST)

Hard contact mode

During exposure the vacuum holding

the substrate to the chuck is switched off

and positive nitrogen pressure is used to

press the substrate against the mask

~15 microm pitch

RISK OF BREAKING

THE MASK

Soft Contact mode The substrate is held to the mask just by

mechanical pressure of chuck

throughout the exposure The vacuum

holding the substrate to the chuck

remains on

~2 microm pitch SAFE

Proximity contact Exposures are made with a small gap

between the mask and substrate The

gap is determined by the height

adjustment

Depends

on separation SAFE It has to be

adjusted manually

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE

1 Fiber optic light pipe

2 Single field splitfield

shutter

3 Rotation for focus

4 Objective separation for

splitfield operation

5 Iris diaphram

6 Objectives

SPLITFIELD= left shutter fully

clockwise right shutter fully

anticlockwise

Left objective=left shutter half

way right shutter fully

anticlockwise

Right objective=left shutter fully

clockwise right shutter half way

MICROSCOPE