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TS9
EMBER® EM35X NCP BREAKOUT BOARD TECHNICALSPECIFICATION
The Silicon Labs’ Ember EM35x Network Co-Processor (NCP) Breakout Board contains the hardware peripherals for the development and deployment of a low-data-rate, low-power ZigBee application on a host micro interfacing via EZSP protocol to the EM300 series NCPs. The NCP Breakout Board supports SPI and UART EZSP interfaces for development flexibility. Modules separately contain the EM35x NCP and the HOST microcontroller to allow for higher degrees of freedom during application development. The modules are connected to the NCP Breakout Board though robust connectors. The EM35x NCP Breakout Board hardware stimuli include a temperature sensor, two buttons, a piezo buzzer, two LEDs, and a 1.6" x 1.8" through-hole prototyping area. The EM35x NCP Breakout Board also contains a USB transceiver with USB connector, a RS-232 transceiver with DB-9 connector, Data Emulation Interface (DEI), Packet Trace Port programming interface, and regulated power planes. The EM35x NCP Breakout Board also includes an optional host interface to 2 Mbit external DataFlash in support of the ZigBee OTA upgrade cluster for over-the-air (OTA) application bootloader purposes. You can obtain the EM35x NCP Breakout Board voltage supply from one of four sources: Debug Adapter (ISA3) (through the Packet Trace Port), external VDC supply, USB port, or AAA battery pack. The various voltage supplies offer a degree of flexibility when testing different network topologies. This document provides the technical specification for the EM35x NCP Breakout Board. It describes the board-level interfaces as well as the key performance parameters. In addition, it provides the necessary information for developer to validate their application designs using the EM35x NCP Breakout Board. New in This Revision Document renumbering. Contents 1 EM35x NCP Breakout Board Features ............................................................................................................ 3
2 Components ................................................................................................................................................... 5
2.1 Power supply and distribution ................................................................................................................... 5
2.1.1 External DC Power Supply (J1 and J32 or J3.2 and J32) ................................................................... 7
2.1.2 Battery Connector (J8) ...................................................................................................................... 7
2.1.3 Packet Trace Port (J8) ...................................................................................................................... 7
2.1.4 USB Host (J5) ................................................................................................................................... 7
2.2 NCP Current Measurements .................................................................................................................... 7
2.3 Host Current Measurements..................................................................................................................... 7
2.4 Deep Sleep Testing of the EM35x Module ................................................................................................ 7
2.5 ZigBee Application Peripherals ................................................................................................................. 8
2.5.1 Temperature Sensor (U4) .................................................................................................................. 8
2.5.2 Buttons (EM1, EM2) .......................................................................................................................... 9
Rev 0.6 Copyright © 2013 by Silicon Laboratories TS9
TS9 2.5.3 Buzzer (SPK1) .................................................................................................................................. 9
2.5.4 LEDs (DS6 and DS7) ........................................................................................................................ 9
2.5.5 External DataFlash (U7) .................................................................................................................... 9
2.6 EZSP and Serial Mode Configuration Switch (SW1) ................................................................................10
2.7 Data Emulation Interface (J43) ................................................................................................................15
2.8 EM35x Module Interface Connector (J21-J24) .........................................................................................15
2.9 Host Module interface connector (J37-J38)..............................................................................................18
2.10 Prototyping Area ..................................................................................................................................20
3 EM35x NCP Breakout Board Schematic .........................................................................................................21
2 Rev. 0.6
TS9 1 EM35x NCP Breakout Board Features The EM35x NCP Breakout Board offers:
• Configurable hardware support for application development Temperature sensor (connects to host GPIO) Two buttons (connect to host GPIO) Piezo buzzer (connect to host GPIO) Two LEDs (connect to host GPIO)
• RS-232 transceiver with DB-9 connector for serial communication (with hardware (HW) handshake support)
• USB transceiver with USB connector (Type B) • 2 MB external DataFlash for ZigBee OTA Profile support • Control Interface for the EM35x Radio Communications Module (RCM)
RCM RESET and Bootload buttons Voltage Supply connection (V_NCP_EN)
• Control Interface for the Host Module RCM RESET and Bootload buttons Voltage Supply connection (V_HOST_EN)
• 1.6" x 1.8", 0.1" pitch prototyping area • 26-pin, 0.1" pitch, dual-row logic-analyzer shrouded connector • 10-pin, 0.05" pitch, dual-row Packet Trace Port connector • 12-pin, 0.1” pitch, dual-row, data emulation interface (DEI) with configuration header • 14-pin, 0.05” pitch, single-row along with a 19-pin 0.05” pitch, single-row, board-to-board connector for the
module • 16-pin, 0.1” pitch, single-row along with a 20-pin 0.1” pitch, single-row, board-to-board connector for the
host module • Selection pins for DC power source selection (either external DC power supply, USB, Debug Adapter
(ISA3), or AAA battery pack). LEDs indicate which power supply has been selected. • 2-pin module VDC pin for connection of an ammeter for EM5x module current measurements • 2-pin module VDC pin for connection of an ammeter for host module current measurements • 2-pin jumpers for each of the HW application peripherals, buzzer, buttons, piezo, temperature sensor, and
LEDs • 2-pin jumpers for connection to TTL UART for either the EM35x UART (SC1) or host UART2. The
selection jumpers route signals (RXD, TXD, nRTS, and nCTS) allow access to the TTL levels.
Rev. 0.6 3
TS9 Table 1 lists the DC electrical characteristics of the EM35x NCP Breakout Board.
Table 1. DC Electrical Characteristics Parameter Min. Typ. Max. Unit VDD supply External DC Supply (J1 / J32) 4 20 V USB Host 4.5 5 V Debug Adapter 3.1 3.3V 3.5 V Battery 2.1 3.6 External DC supply (J3.2) 3.1 3.3 3.5 V Current draw (peripherals) Piezo buzzer 10 mA Buttons (enabled) 6 mA Temperature sensor (enabled) 5 mA Current draw (miscellaneous) RS-232 transceiver 4 mA USB transceiver 15 mA LDO distribution 10 mA Operating temperature 0 + 55 C
4 Rev. 0.6
TS9 2 Components Figure 1 illustrates the components on layer 1 (top side).
Figure 1. Assembly Print for Layer 1
2.1 Power Supply and Distribution The EM35x NCP Breakout Board can be powered from one of five sources:
• 4 V to 20 V External DC Power supply (Positive connected J1 and Ground connected to J32) • Battery pack connector (J8) • USB Host (J5, via Wall wart or PC connection) • Debug Adapter (ISA3) (through Packet Trace Port, J31) • 2.1 to 3.6 V External DC Power supply (Positive connected to J3.2 and Ground connected to J32)
EM35x Radio Module
Connectors (X1: J21-J22)
Packet Trace Port (J31)
Data Emulation Interface (J28)
Data Emulation Interface Selection
Header (J27)
NCP Bootloader (EM3) and Reset
(EM4) Buttons
Host Bootloader (EM6) and Reset
(EM5) Buttons
Prototype Area
DB-9 Connector – RS-232 (J30)
TTL Access Jumpers (J25-J28)
USB Connector (J5)
Power Source LEDs
Power Source Selection Jumpers ZigBee Application
Peripherals
DataFlash & Interface Connectors
Host Module Power Isolation Jumper (J34)
NCP Module Power Isolation Jumper (J34)
Reset and Bootload Enable Jumpers
(J14, J16, J35, J40)
SPI/UART Mode Config Switch (SW1)
Host Module Connectors
(X2: J37-J38)
Rev. 0.6 5
TS9 The EM35x NCP Breakout Board contains power source selection jumpers (J2 and J3) which allows only one DC source to power the board. This eliminates the possibility of overcurrent resulting from power supply contention. Table 2 illustrates the connection scheme and LED indication for each power source.
Table 2. Power Supply connections Power Source Selection Scheme (J2 and J3) LED Indicator
High Voltage External supply (4 V to 20 V) Connect VDD to J1 and GND to J32.
VPS
VBAT
VISA
VUSB
USB Host Connect USB cable to J5.
VPS
VBAT
VISA
VUSB
Debug Adapterr (ISA3) Connect Debug Adapter (ISA3) to J31.
VPS
VBAT
VISA
VUSB
Battery pack Connect AAA battery pack (supplied by Silicon Labs) to J8.
VPS
VBAT
VISA
VUSB
Low Voltage External DC supply (3.1 to 3.5) Connect directly to J3.2 with Ground connected to J32.
VPS
VBAT
VISA
VUSB
J3
VBATT
VREG
1
3J2
VISA
J3
VBATT
VREG
1
3J2
VISA
J3
VBATT
VREG
1
3J2
VISA
J3
VBATT
VREG
1
3J2
VISA
J3
VBATT
VREG
1
3J2
VISA
6 Rev. 0.6
TS9 2.1.1 External DC Power Supply (J1 and J32 or J3.2 and J32)
The EM35x NCP Breakout Board allows two easy to use connections to an external power supply.
• The first connection (Low Voltage) allows for a 3.1 to 3.5 V DC external supply to be connected to J3.2 (positive) and J32 (Ground). The power supply should be able to source up to 250 mA at the set voltage. When using a power supply in this mode, there should be no jumpers on J2 or J3 as shown in Table 2.
• The second connection (High Voltage) allows for a 4 V to 20 V DC external supply to be connected to J1 (positive) and J32 (Ground). The power supply should be able to source up to 300 mA at the set voltage. When using a power supply in this mode, there should be a jumper connecting J3.3 and J3.2 as shown in Table 2.
2.1.2 Battery Connector (J8) The 2-pin, keyed battery connector (Hirose, P/N: DF13-2P-1.25H(50)) allows for connection to a DC power supply or battery pack. The EM35x NCP Breakout Board is shipped with a 2-AAA battery pack with appropriate mating connector for easy attachment. Batteries are sold separately. When using a battery pack, a jumper must be connected between J3.1 and J3.2 as shown in Table 2.
2.1.3 Packet Trace Port (J8) The EM35x NCP Breakout Board can also be powered from a Debug Adapter (ISA3). To enable this power supply, simply connect the Debug Adapter (ISA3) to the Packet Trace Port (J8) and connect the power selection jumper between J2 and J3.2 as shown in Table 2. In addition, the Debug Adapter (ISA3) selection toggle switch must be put in the INT. The Debug Adapter (ISA3) provides a target voltage of 3.3V and sources as much as 250 mA. See document TS7, Debug Adapter (ISA3) Technical Specification, for more details on the Debug Adapter (ISA3).
Note: If the Debug Adapter (ISA3) is connected directly to the Packet Trace Port on the Module, the jumpers at J4 and J34 must be connected as well as the jumper across J2 and J3.2.
2.1.4 USB Host (J5) The EM35x NCP Breakout Board can also be powered by a USB Host (PC or Silicon Labs-supplied USB power supply). To operate in this mode, a USB Host must be connected to J5 and the power selection jumper must be connected between J3.1 and J3.2 as shown in Table 2.
2.2 NCP Current Measurements To allow for NCP current measurements, the EM35x NCP Breakout Board isolates the NCP module VDD power supply from the regulated power domain on the Breakout Board. The only connection point between the NCP module power supply and the Breakout Board supply is through the V_NCP_EN header (J4). Remove J4 and place an ammeter across this jumper to measure the NCP current draw.
2.3 Host Current Measurements To allow for Host current measurements, the EM35x NCP Breakout Board isolates the Host module VDD power supply from the regulated power domain on the Breakout Board. The only connection point between the Host module power supply and the Breakout Board supply is through the V_HOST_EN header (J34). Remove J34 and place an ammeter across this jumper to measure the Host current draw.
2.4 Deep Sleep Testing of the EM35x Module To perform accurate deep sleep measurements of the EM35x NCP, configure the EM35x NCP Breakout Board as follows:
• Remove J4 and place ammeter across this jumper.
Rev. 0.6 7
TS9 • Remove J6 so the V_NCP LED DS4 is not driven. If supplying voltage through J8 battery connector, also
remove J7 so the V_BATT LED DS5 is not driven. • Remove J33 jumpers to isolate DataFlash IC from circuit. • Issue "shutdown" in nodetest. • Once command is issued and node is asleep, remove J25-J28 (TTL jumpers). • Make sure the Packet Trace Port cable, DEI cable, and RS-232 cable are all detached from the Breakout
Board. This connection scheme offers the highest degree of power supply flexibility. Wake the EM35x NCP from deep sleep by pressing the NCP reset button.
Note: The use of virtual UART port 4900 is not recommended when interfacing to nodetest for deep sleep testing, since this does not allow for proper configuration of the EM35x for deep sleep measurements. Therefore, please use either pass-through UART port 4901, USB, or RS-232 to interface to the nodetest application.
2.5 ZigBee Application Peripherals As previously mentioned, the EM35x NCP Breakout Board offers six host peripherals to assist in ZigBee application development including:
• Temperature sensor • Two (2) “normally open” buttons • 4 kHz piezo buzzer • Two (2) LEDs • External DataFlash
Each peripheral connects to a host GPIO through a two-pin peripheral header. Because each peripheral header on the EM35x NCP Breakout Board ships with a jumper in place, the peripherals default to “HW Enabled.” If application development does not require the peripheral, simply remove the jumper.
Note: Each peripheral consumes power. Be sure to factor this into the current consumption equations when testing the module in deep sleep mode or if using the battery pack to power the Breakout Board.
2.5.1 Temperature Sensor (U4) The temperature sensor is an off-the-shelf component from National Semiconductor (MFG P/N: LM20BIM7). The temperature sensor requires an enable signal to be asserted (active high) prior to generating an analog voltage proportional to the ambient temperature of the EM35x NCP Breakout Board. Therefore, two host GPIO signals, HGPIO7 and HGPIO8, are routed to pin 2 of peripheral headers J13 and J15, respectively.
• HGPIO7 enables the temperature sensor when asserted (active high), when a jumper is installed at J13. • HGPIO8 contains the analog temperature information from the sensor, when it is enabled and a jumper is
installed at J15. The temperature sensor output is scaled to between 0 and 1.2 V through a resistive voltage divider. If you want to connect a temperature sensor from a different manufacturer, scale the output in a similar manner. The EM35x NCP Breakout Board is shipped with a jumper installed at J13 and J15. If the jumpers are removed, a different compatible device can be attached to pin 2 of both J13 and J15. For more information on the temperature sensor, refer to its data sheet (http://www.ti.com/product/LM20).
8 Rev. 0.6
TS9 2.5.2 Buttons (EM1, EM2)
Two programmable, normally-open buttons are provided for software debugging and application development. When either button is pressed, the connected net is driven low. A single-pole RC filter minimizes the effects of switching noise. These buttons map to the backchannel button commands as follows:
• EM2: controlled by the button 0 command • EM1: controlled by the button 1 command
For information about the button command, see document UG110, the EM35x Development Kit User Guide.
Two host GPIO signals, HGPIO3 and HGPIO2, are routed from the EM35x Module to pin 2 of peripheral headers J9 and J10, respectively. In the default configuration of the EM35x NCP Breakout Board, jumpers are positioned across J9 and J10 to enable buttons EM1 and EM2, respectively. If the jumpers are removed, different compatible devices can be attached to pin 2 of breakout headers J9 and J10 instead of the buttons.
2.5.3 Buzzer (SPK1) A programmable buzzer is provided for software debugging and application development. A host GPIO signal, HGPIO4, is routed to pin 2 of peripheral header J17. In the default configuration of the EM35x NCP Breakout Board, a jumper is positioned across J17 to enable use of the buzzer. The buzzer installed on the EM35x NCP Breakout Board is from CUI (MFG P/N: CEP-1160). For more information on the buzzer, refer to its datasheet (http://www.cui.com/Product/Resource/PDFRedirect/110/CEP-1160.pdf).
2.5.4 LEDs (DS6 and DS7) The EM35x NCP Breakout Board contains two LEDs for software debugging and application development. Each LED is buffered (non-inverting) to allow for connection to any host GPIO. Two host GPIOs, HGPIO0 and HGPIO1, are routed to pin 2 of headers J12 and J11 respectively. To turn on DS7 (RED) from the host module, install a jumper at J12, configure HGPIO0 as an output and drive it low. To turn on DS6 (GREEN), install a jumper at J11, configure HGPIO1 as an output and drive it low.
2.5.5 External DataFlash (U7) The external DataFlash is an off-the-shelf component from Atmel (MFG P/N: AT45DB021D-SSH-B). The DataFlash is used in cases where ZigBee OTA Profile application bootloader is required for the host. The DataFlash is connected to the host module through jumper block J33. The EM35x NCP Breakout Board is shipped with jumpers installed in a disconnected state at J33. If all six jumpers are installed properly at J33, the external DataFlash connects to the host for application bootloading. Figure 2 illustrates the J33 jumper configuration for the DataFlash interface.
12
J33
DF_3V
DF_nCS
DF_SCKDF_SO
DF_SI
3V
HGPIO12
HGPIO13HGPIO15
HGPIO14
DF_nSD HGPIO11
Figure 2. Jumper for DataFlash connections
For more information on the DataFlash, refer to its datasheet (http://www.atmel.com/Images/doc3638.pdf).
Rev. 0.6 9
TS9 2.6 EZSP and Serial Mode Configuration Switch (SW1) To enhance the software development experience, the EM35x NCP Breakout Board allows for EZSP interfaces between the EM35x NCP and a host via both SPI and UART (either to the host module or an external host). A configuration switch (SW1) is used to set up EZSP mode and serial communication paths. Access to either the EM35x SC1 UART or host UART1 is available directly from the EM35x NCP Breakout Board or by telnetting into port 4901 of a Debug Adapter (ISA3) connected to an Ethernet network. On the EM35x NCP Breakout Board, it is available as RS-232, USB and TTL-compliant signal levels. To minimize current consumption and allow for the different configuration options, the EM35x NCP Breakout Board individually routes the TTL UART signals RXD, TXD nCTS, and nRTS to pin 2 of headers J25, J26, J27, and J28 respectively. To route the UART signals to the USB transceiver, move SW1 Serial to TTL and TTL Path to USB. To route the UART signals to the RS-232 transceiver, move SW1 Serial to TTL and TTL Path to 232. To access TTL signals, move SW1 Serial to TTL, remove the jumpers on J25, J26, J27 and J28 and connect to pin 2 of these jumpers. To route the UART signals to DEI, move SW1 Serial to DEI and place jumpers on the DEI jumper connector (J42) as summarized below and shown in Figure 3.
• TXD: J27.1 to J27.2 • RXD: J27.5 to J27.6 • nRTS: J27.7 to J27.8 • nCTS: J27.9 to J27.10
Each SW1 configuration is shown in Table 3. TTL Access Jumper configuration is shown in Table 4.
Table 3. EZSP and Serial Configuration Switch UART Path Selection Scheme (J22, J25, J24, and J26)
EZSP SPI Mode, Host UART2 to DEI Connect Debug Adapter (ISA3) DEI cable to J31.
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
10 Rev. 0.6
TS9 UART Path Selection Scheme (J22, J25, J24, and J26)
EZSP SPI Mode, Host UART2 to RS-232
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
EZSP SPI Mode, Host UART2 to USB
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
EZSP SPI Mode, Host UART2 to TTL
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
Rev. 0.6 11
TS9 UART Path Selection Scheme (J22, J25, J24, and J26)
EZSP UART Mode to Host Module, Host UART2 to DEI Connect Debug Adapter (ISA3) DEI cable to J31.
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
EZSP UART Mode to Host Module, Host UART2 to RS-232
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
EZSP UART Mode to Host Module, Host UART2 to USB
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
12 Rev. 0.6
TS9 UART Path Selection Scheme (J22, J25, J24, and J26)
EZSP UART Mode to Host Module, Host UART2 to TTL
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
EZSP UART Mode to External Host, NCP UART to DEI Connect DEI cable to J31.
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
EZSP UART Mode to External Host, NCP UART to RS-232
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
Rev. 0.6 13
TS9 UART Path Selection Scheme (J22, J25, J24, and J26)
EZSP UART Mode to External Host, NCP UART to USB
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
EZSP UART Mode to External Host, NCP UART to TTL
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
EZSP MODE:UART HOST:
SERIAL:TTL PATH:
SPIMOD
DEIUSB
UARTEXTTTL232
SW1
Note: To connect to the UART through a Debug Adapter (ISA3), the Debug Adapter (ISA3) must be connected to an Ethernet connection. It can be accessed by issuing “Serial 1” within the Console view of the Ember Desktop or by telnetting to Port 4901.
14 Rev. 0.6
TS9
1
TXD
2
J42
HGPIO3
RXD
nRTSnCTS
HGPIO2
HOST_nRESET
SW_SPI_ENSW_UART_MOD_EN
HOST_BTL
Figure 3. Jumper Settings Required for EM35x SC1 UART Access by Debug Adapter (ISA3)
Table 4. TTL Access Jumpers Configuration Selection Scheme (J25, J26, J27, and J28)
UART via USB or Serial
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
UART via TTL Access
RXD
1 2
TXDnCTSnRTS
J25
J26
J27
J28
2.7 Data Emulation Interface (J43) The 12-pin, dual-row, data emulation interface contains 4 host GPIO signals, 4 host or EM35x NCP UART signals, and 2 DEI control pins, as well as voltage (VBRD) and ground (GND) connections. When connected to the Debug Adapter (ISA3), the connector provides additional debug features to software developers. One feature involves the port 4901 UART connection through Debug Adapter (ISA3). To enable the UART connection to either the host or the EM35x NCP UART signals, configure SW1 for DEI mode as shown in Table 3 and install four jumpers on J42 as shown in Figure 3 for nCTS, nRTS, RXD, and TXD. Another feature involves manipulation of BUTTON0 and BUTTON1 GPIO signals. To enable GPIO manipulation of BUTTON0 and BUTTON1, install jumpers on J42 at HGPIO2 and HGPIO3, respectively.
2.8 EM35x Module Interface Connector (J21-J24) Two single-row, 0.05” pitch, connectors make up the EM35x module interface to the EM35x NCP Breakout Board. In addition, two single-row, guide connectors assist with connecting the EM35x module to the EM35x NCP Breakout Board. The board-to-board connector scheme allows access to all EM35x GPIO as well as nRESET and the JCLK signals. The connector is illustrated in Figure 4, while the dimensions are shown in Figure 5.
Rev. 0.6 15
TS9
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
33
32
31
30
29
28
27
26
25
24
23
22
21
20
EM35x_PC5
EM35x_PC6
EM35x_PC7
EM35x_PA7
EM35x_PB3
EM35x_nRESET
EM35x_PB4
HOST_MOSI
HOST_MISO
HOST_SCK
HOST_nSS
GND
EM35x_PA4
EM35x_PA5
EM35x_PA6
EM35x_PB1
EM35x_PB2
GND
GND
GND
VDD_3V_EM35X
GND
EM35x_PB5
nWAKE
EM35x_PB7
EM35x_PC0
EM35x_PC1
nSIMRST
EM35x_PC4
EM35x_PC3
EM35x_PC2
EM35x_JCLK
GND
J21
J22
3534
3736
J23
J24
NC NC
NC NC
Figure 4. Board-to-Board Connector for the EM35x Module
Figure 5. Board-to-Board Connector Dimensions for the EM35x Module
Table 5 describes the pinout and signal names at J21-J24. The EM35x UART1 signals (PB1, PB2, PB3, PB4) are exposed on the EM35x NCP Breakout Board at the 26-pin, dual row, 0.1” pitch GPIO connector (J41) for application development.
16 Rev. 0.6
TS9
Note: Custom EM35x modules (not shipped with development kits) containing external DataFlash should NOT be connected to the EM35x NCP Breakout Board, as the EM35x SPI1 is used for the EZSP SPI interface.
For more information on the alternate functions of the GPIO connector, refer to document 120-035X-000, the EM351/7 Data Sheet.
Table 5. Pinout and Signal Names of the NCP Interface Connector Pin # Signal name Direction2 Connector Description
1 GND Power J21 Ground Connection 2 PC5 I/O J21 EM35x GPIO 3 PC6 I/O J21 EM35x GPIO 4 PC7 I/O J21 EM35x GPIO 5 PA7 I/O J21 EM35x GPIO 6 PB3 I/O J21 EM35x GPIO 7 nRESET I/O J21 Active low chip reset (internal pull-up on EM35x) 8 PB4 I/O J21 EM35x GPIO 9 PA0 I/O J21 EM35x GPIO
10 PA1 I/O J21 EM35x GPIO 11 PA2 I/O J21 EM35x GPIO 12 PA3 I/O J21 EM35x GPIO 13 GND Power J21 Ground connection 14 PA4 I/O J21 EM35x GPIO 15 PA5 I/O J21 EM35x GPIO 16 PA6 I/O J21 EM35x GPIO 17 PB1 I/O J21 EM35x GPIO 18 PB2 I/O J21 EM35x GPIO 19 GND Power J21 Ground connection 20 GND Power J22 Ground connection 21 JCLK Input J22 JTAG interface, serial clock 22 PC2 I/O J22 EM35x GPIO 23 PC3 I/O J22 EM35x GPIO 24 PC4 I/O J22 EM35x GPIO 25 PB0 I/O J22 EM35x GPIO 26 PC1 I/O J22 EM35x GPIO 27 PC0 I/O J22 EM35x GPIO 28 PB7 I/O J22 EM35x GPIO 29 PB6 I/O J22 EM35x GPIO 30 PB5 I/O J22 EM35x GPIO 31 GND Power J22 Ground connection 32 VDD Power J22 2.1 to 3.6V Module Power Domain 33 GND Power J22 Ground connection 34 NC N/A J23 Not connected; guide pin 35 NC N/A J23 Not connected; guide pin
Rev. 0.6 17
TS9 Pin # Signal name Direction2 Connector Description
36 NC N/A J24 Not connected; guide pin 37 NC N/A J24 Not connected; guide pin
2 with respect to the RCM
2.9 Host Module interface connector (J37-J38) Two single-row, 0.1” pitch, connectors make up the host module interface to the EM35x NCP Breakout Board. The board-to-board connector scheme allows access to 16 host GPIO. The connector is illustrated in Figure 6, while the dimensions are shown in Figure 7.
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
1
2
3
4
5
6
7
8
9
10
11
12
13
14
EZSP_UART2_nRTS
EZSP_UART2_nCTS
EZSP_UART2_RXD
EZSP_UART2_TXD
HGPIO7
HGPIO6
HGPIO5
HGPIO4
HGPIO15
HGPIO14
HGPIO13
HGPIO12
HGPIO3
HGPIO2
HOST_BTL
NCP_nRESET
nWAKE
N/C
VDD_3V_HOST
HGPIO10
HGPIO11
HGPIO0
HGPIO1
HOST_nRESET
HGPIO8
HGPIO9
SER_UART1_nCTS
SER_UART1_nRTS
SER_UART1_TXD
SER_UART1_RXD
HOST_nSS
HOST_SCK
HOST_MISO
J38
J37
15 HOST_MOSI
16 nHOST_INT
36GND
Figure 6. Board-to-Board Connector for the Host Module
18 Rev. 0.6
TS9
Figure 7. Board-to-Board Connector Dimensions for the Host Module
Table 6 describes the pinout and signal names at both J37 and J38. 16 host GPIOs are exposed on the EM35x NCP Breakout Board at the 26-pin, dual row, 0.1” pitch GPIO connector (J41) for application development. For more information on the alternate functions of the GPIO connector, refer to the data sheet for the host microprocessor included on the host module.
Table 6. Pinout and Signal Names of the Host Interface Connector Pin # Signal name Direction2 Connector Description
1 HGPIO10 I/O J37 Spare Host GPIO 2 HGPIO11 I/O J37 DataFlash Shutdown (DF_nSD) 3 HGPIO0 I/O J37 Application LED (LED0) 4 HGPIO1 I/O J37 Application LED (LED1) 5 HOST_nRESET I/O J37 Active low host reset
6 HGPIO8 I/O J37 Temperature Sensor ADC (TEMP_SENSOR)
7 HGPIO9 I/O J37 Spare Host GPIO 8 SER_UART1_nCTS I/O J37 Host UART1 Clear to Send 9 SER_UART1_nRTS I/O J37 Host UART1 Ready to Send 10 SER_UART1_TXD I/O J37 Host UART1 Transmit Data 11 SER_UART1_RXD I/O J37 Host UART1 Receive Data 12 HOST_nSS I/O J37 EZSP SPI Slave Select 13 HOST_SCK I/O J37 EZSP SPI Clock 14 HOST_MISO I/O J37 EZSP Master In-Slave Out 15 HOST_MOSI I/O J37 EZSP Master Out-Slave In 16 nHOST_INT I/O J37 EZSP Host Interrupt 17 VDD_3V_HOST Power J38 3.3V Connection 18 EZSP_UART2_nRTS I/O J38 EZSP UART Ready to Send 19 EZSP_UART2_nCTS I/O J38 EZSP UART Clear to Send
Rev. 0.6 19
TS9 Pin # Signal name Direction2 Connector Description
20 EZSP_UART2_RXD I/O J38 EZSP UART Receive Data 21 EZSP_UART2_TXD I/O J38 EZSP UART Transmit Data
22 HGPIO7 I/O J38 Temperature Sensor Enable (TEMP_ENABLE)
23 HGPIO6 I/O J38 Spare Host GPIO 24 HGPIO5 I/O J38 Spare Host GPIO 25 HGPIO4 I/O J38 Application Speaker (PIEZO) 26 HGPIO15 I/O J38 DataFlash SPI Serial Out (DF_SO) 27 HGPIO14 I/O J38 DataFlash SPI Serial In (DF_SI) 28 HGPIO13 I/O J38 DataFlash SPI Clock (DF_SCK) 29 HGPIO12 I/O J38 DataFlash SPI Chip Select (DF_nSS) 30 HGPIO3 I/O J38 Application Button (BUTTON1) 31 HGPIO2 I/O J38 Application Button (BUTTON0) 32 HOST_BTL I/O J38 Host Bootloader 33 NCP_nRESET I/O J38 Active low NCP reset 34 nWAKE I/O J38 EZSP SPI Wake 35 NC N/A J38 Not connected 36 GND Power J38 Ground connection
2 with respect to the host
2.10 Prototyping Area The 1.6" x 1.8" (0.1” pitch) prototyping area on the EM35x NCP Breakout Board offers software developers an extra degree of flexibility. As shown in Figure 4, it allows access to VBRD, GND, and 16 host GPIOs. Therefore, you can solder any sensor or input device to the prototyping area and connect it to the host GPIO for development and debugging. As shown in Figure 8, the leftmost column is connected to GND and the rightmost column to VBRD. The top row is connected to the host GPIOs. Included in the top row are additional GND and JCLK connections. The remainder of the array is available for application development.
20 Rev. 0.6
TS9
VB
RD
GN
D
HG
PIO
15H
GP
IO14
HG
PIO
13H
GP
IO12
HG
PIO
11H
GP
IO10
HG
PIO
0
HG
PIO
9H
GP
IO8
HG
PIO
7H
GP
IO6
HG
PIO
5H
GP
IO4
HG
PIO
3H
GP
IO2
HG
PIO
1
Figure 8. EM35x NCP Breakout Board prototyping area
3 EM35x NCP Breakout Board Schematic The EM35x NCP Breakout Board schematic is included at the end of this document.
Rev. 0.6 21
COVER SHEETEM35X NCP BREAKOUT BOARD
A0SCH0681
81
REV
2 134
4 3 2 1
TITLE
SIZE B
DWG
A
B B
A
SHEET: ofDATE:
The information in this document is subject to change without notice. The statements, configurations, technical data and recommendations in thisdocument are believed to be accurate and reliable, but are presented without express or implied warranty. The information in this document isthe proprietary and confidential property of Ember Corporation and is priviliged. No part of the drawing or information may be duplicated or otherwiseused without the express permission of Ember Corporation
PAGE
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19-09-2010_22:13
Sheet Details
EM35X NCP Breakout Board
2 POWER MANAGEMENT, MANUFACTURING
3 APPLICATIONS CIRCUITS, BREADBOARD
1 COVER SHEET
4 EM35X RCM CONNECTORS, USER INTERFACES
5 HOST MODULE CONNECTOR, INTERFACES
6 SPI/UART MUX/DEMUX CIRCUIT
7 SPI/UART BLOCK DIAGRAM
8 REVISION NOTES
A0
POWER MANAGEMENT, MANUFACTURINGEM35X NCP BREAKOUT BOARD
SCH0681
82
REV
2 134
4 3 2 1
TITLE
SIZE B
DWG
A
B B
A
SHEET: ofDATE:
The information in this document is subject to change without notice. The statements, configurations, technical data and recommendations in thisdocument are believed to be accurate and reliable, but are presented without express or implied warranty. The information in this document isthe proprietary and confidential property of Ember Corporation and is priviliged. No part of the drawing or information may be duplicated or otherwiseused without the express permission of Ember Corporation
PAGE
Silicon Labs, 25 Thomson Place, Boston, MA 02210 TEL: 617-951-0200, FAX: 617-951-0999www.silabs.com
19-09-2010_22:20
510R5
HEADER-2J29
12
BAT54CD1
2
1
3
L4P
DF13-2P-1.25H(50)J8
21
FID1
47PFC4
HEADER-1J2
1
NUP2301MW6T1GU2
1 3
25
Datasheet
D3
3
21
GSOT15C-GS08Datasheet
47PFC5
PCB1710-0681-000
C310uF
FID2
REDDS1
BAT54CD2
2NC
1
3
L4P
SHORTING
JUMPER
REDDS3
SHORTING
JUMPER
10NFC2
330NFC1
FID3
220NFC7
SHORTING
JUMPER
HEADER-2
J7
12
SHORTING
JUMPER
1.0KR3
SHORTING
JUMPER
BLM18PG600SN1DFB1
2.2KR2
SHORTING
JUMPER
HEADER-3J3
32
1
SHORTING
JUMPER
0_OhmR1LT1763CS8-3.3#PBF
U1
5
8
6
7
43
21
OUTSENSE
GND-1BYP
GND-3
GND-2
IN
NSHDN
Datasheet
SHORTING
JUMPER
GSOT12C-GS08D4
3
21NC
Datasheet
130-0681-000SN1
SHORTING
JUMPER
REDDS2
10NFC6
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
REDDS5
TEST_POINTJ1
1
SHORTING
JUMPER
510R6
SHORTING
JUMPER
GREENDS8
SHORTING
JUMPER
510
R4
HEADER-2
J6
12
SHORTING
JUMPER
TEST_POINTJ32
1
USB-B-RAJ5
4321
S2
S1SHIELD1
SHIELD2
VBUSD-D+
GND
SHORTING
JUMPER
HEADER-2J4
1 2
VIN_USB
VIN_BATT
VIN_USB
VIN_USB
VDD_3V
VDD_ISAVIN_USB
VDD_3VVIN_BATT VDD_ISAVDD_3V_EM35X
VDD_3V_BB
VDD_3V_EM35XVIN_BATT
VIN_PWR_SUPPLY
VIN_PWR_SUPPLY
VIN_PWR_SUPPLY
VIN_PWR_SUPPLY
VIN_BATT
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
VIN_USB
SHORTING
JUMPER
SHORTING
JUMPER
VDD_3V_HOST
GREENDS4
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
SHORTING
JUMPER
1uFC30
SHORTING
JUMPER
HEADER-2J34
1 2
J36
HEADER-2
12
VDD_3V_HOST
R39510
BYPASS
VOUT_SENSEVREGIN
BATTERY_IN
VBUS
USB_DP
USB_DM
The shorting jumper at J4 can be replaced with a
J27J28
J25J26
J2 and J3.2J4J6
J9J10J11J12J13
J15
J17J16
There are five possible power sources for the Breakout board.1. External 3V Supply (Connect directly to J3.2)
2. USB Bus Powered (Connect shorting jumper between J3 pins 2.3)3. Ember battery pack with 2 AAA (Connect shorting jumper between J3 pins 1.2)
4. Debug Adapter (Connect shorting jumper between J2 and J3.2)
2. External Regulated supply from 4V to 20V (Connect shorting jumper between J3 pins 2.3)
J14
Headers J2 and J3 allow the user to select the power source.USB / VIN_PWR_JACK Down Conversion
ESD Suppression (Power Supply)
USB CONNECTION (TYPE B) 5V
Kit Provide Battery Pack for 2 AAAs, voltage range 1.5V to 3.1V
20V MAX IN,3V/500mA OUT
Power Indicator LEDs
Breakout Board and Module Power Selector
X 35
FiducialsPCB Information
* Remove J6, J36 when performing a Deep Sleep Test
POWER SUPPLY, DC, 4V to 20V* Place J1 close to J31
J29 is placed close to J41
Test Equipment GND Connection
J42.1 and J42.2J42.3 and J42.4
Shorting Jumpers
Place shorting jumpers across the following connector pins;
J33.2J33.4J33.6J33.8J33.10
current meter to measure Host module current drawThe shorting jumper at J34 can be replaced with a
current meter to measure EM35x module current draw
J39.1
J34J35
J7
J36
J42.7 and J42.8J42.5 and J42.6
J42.11 and J42.12J42.9 and J42.10
J42.13 and J42.14
J40
a Deep Sleep Test with Battery* Remove J67 when performing
BATTERY INTERFACE
EM35x IC will not operate properly at voltages below 1.8V
J33.12
APPLICATIONS CIRCUITS, BREADBOARDEM35X NCP BREAKOUT BOARD
SCH0681
83
A0REV
2 134
4 3 2 1
TITLE
SIZE B
DWG
A
B B
A
SHEET: ofDATE:
The information in this document is subject to change without notice. The statements, configurations, technical data and recommendations in thisdocument are believed to be accurate and reliable, but are presented without express or implied warranty. The information in this document isthe proprietary and confidential property of Ember Corporation and is priviliged. No part of the drawing or information may be duplicated or otherwiseused without the express permission of Ember Corporation
PAGE
Silicon Labs, 25 Thomson Place, Boston, MA 02210 TEL: 617-951-0200, FAX: 617-951-0999www.silabs.com
19-09-2010_22:13
J11HEADER-2
12
BAT54AWT-TPD5
2
1
3
X3
15x16_PIN_BREADBOARD_AREA
HEADER-2J16
12
HEADER-2J15
12
B3S-1000EM4
42
310_OhmR13
HEADER-2J17
12
100nFC10
100KR8
510
R11
SN74LVC2G07DBVRU3
25
6
43
1 IN1
IN2 OUT2
OUT1
VC
CG
ND
DatasheetSN74LVC2G07DBVR
100nFC9
LM20BIM7/NOPBU4
5
4 3
2
1NCNC
GND1
VOV+
GND2
DatasheetLM20BIM7/NOPB
1.0KR17
DNIJ20
16151413121110987654321
B3S-1000EM3
42
31
100KR7
CEP-1160SPK1
21 V+
V-
Datasheet
1.0KR9
HEADER-2J12
12
1.0KR12
1.0KR14
B3S-1000EM1
42
31
HEADER-2J10
12
DNIC13
100KR16
S-HEADER-26J41
262422
252321
2018161412
1917151311
108642
97531
HEADER-2J13
12
GREEN
DS6
100KR15
DNIJ19
16151413121110987654321
HEADER-2J14
12
HEADER-2J9
12
100nFC12
B3S-1000EM2
42
31
DNIJ18
16151413121110987654321
REDDS7
100nFC8
100nFC11
510R10
VDD_3V_BB
VDD_3V_BB
VDD_3V_BB
VDD_3V_BB
J40HEADER-2
12
R341.0K
J35HEADER-2
12
R311.0K
EM5B3S-1000
42
31
EM6B3S-1000
42
31
0_OhmR32
DNIR33
PIEZO
TEMP_ENABLE
LED0
LED1
BUTTON1 EM1
DS6LED_1
DS7LED_0
BUTTON0 EM2
EM3
TEMP_SENSOR
EM4
VO
TEMP_SENSE
EM35X_PB4EM35X_PB3EM35X_PB1 EM35X_PB2
EM35X_nRESET
EM35X_PA5
nSIMRST
HOST_nRESET
HOST_BTL
EM35X_nRESET_SRC
MUX_nRESET
HGPIO0
HGPIO0
HGPIO0
HGPIO1
HGPIO1
HGPIO1
HGPIO2
HGPIO2
HGPIO2
HGPIO3
HGPIO3HGPIO3
HGPIO4
HGPIO4HGPIO4
HGPIO5HGPIO5HGPIO6HGPIO6
HGPIO7
HGPIO7HGPIO7
HGPIO8
HGPIO8HGPIO8
HGPIO9
HGPIO9HGPIO10
HGPIO10
HGPIO11
HGPIO11
HGPIO12
HGPIO12
HGPIO13
HGPIO13
HGPIO14
HGPIO14
HGPIO15
HGPIO15
EM35X_nRESET_BUTTON
EM6
EM5
HOST_MOSI HOST_MISOHOST_SCK HOST_nSS
nWAKE
Buttons
Host Application LEDs
Host Temperature Sensor
Host Application Buttons
Host Piezo Speaker
Peripheral Scratch Pad (0.1" pitch)
EM35x RESET Button (Active Low)EM35x Reset Selection
EM35x Bootloader Button (Active Low)
26-Pin, Dual Row Test Connector
Host RESET Button (Active Low)
Host Bootloader Button (Active Low)
VALUE
U5
33 262017424
911102122
3
7
6
31
8
32
2
30
16
282723
18
292513125
14
15
191 VCCIO
VCC
USBDM
USBDP
NC-6NC
NC-5NC
NC-1NC
NC-4NC
NC-3NC
RESET#
NC-2NC
OSC1NC
OSC2NC
3V3OUT
TXD
RXD
RTS#
CTS#
DTR#
DSR#
DCD#
RI#
CBUS0CBUS1CBUS2CBUS3CBUS4
AG
ND
GN
D-1
GN
D-3
GN
D-4
TE
ST
GN
D-2
DatasheetFT232RQ_R
EM35X RCM CONNECTORS, USER INTERFACES
A0EM35X NCP BREAKOUT BOARD
SCH0681
84
REV
2 134
4 3 2 1
TITLE
SIZE B
DWG
A
B B
A
SHEET: ofDATE:
The information in this document is subject to change without notice. The statements, configurations, technical data and recommendations in thisdocument are believed to be accurate and reliable, but are presented without express or implied warranty. The information in this document isthe proprietary and confidential property of Ember Corporation and is priviliged. No part of the drawing or information may be duplicated or otherwiseused without the express permission of Ember Corporation
PAGE
Silicon Labs, 25 Thomson Place, Boston, MA 02210 TEL: 617-951-0200, FAX: 617-951-0999www.silabs.com
19-09-2010_22:13
RCM_INTERFACEX1
37 363534
3332313029282726252423222120
19181716151413121110987654321
NCNC
NC
NC
DatasheetHEADER-19J21
DatasheetHEADER-14
J22
FT232RQ_RU5
35 38373634G
ND
-5
GN
D-7
GN
D-8
GN
D-9
GN
D-6
DNIJ23
DNIJ24
DNIR29 0_OhmR26
DNIR30
100nFC21
TP7
J25HEADER-2
12
TP8
100nFC19
C16100nF
100KR18
J26HEADER-2
12
FTSH-105-01-F-DV-KJ31
10987654321
Datasheet
C154.7UF
T491A475K020AT
TP4
100nFC22
J27HEADER-2
12
100KR19
TP3
TP2
J30
5
4NC
3
2
1NC
9NC
8
7
6NC1
2
3
4
5
6
7
8
9
RECEPTACLE_DB9
10NFC18
TP1
100nFC20
100nFC14
TP5
C17100nF
J28HEADER-2
12
TP6
Datasheet
LTC1386CS#PBFU6
6
2
147
13815
912
10
5
11
4
31
16V
CCC1+
C1-
C2+
TR1_IN
C2-
TR2_IN
RX1_OUTRX2_OUT
GNDRX2_INRX1_IN
TR2_OUTTR1_OUT
V+
V-
VDD_3V_BB
VDD_3V_BBVDD_3V_BB
VIN_USB VCC30
VCC30
VCC30VIN_USB
VDD_3V_EM35X
R36DNI
TP9
R37DNI
DNIDS10
DNIDS11
VDD_3V_BB
SW1
765
8
321
4
DatasheetADE0404
R2310K
R2410K
R2510K
R2210K
VDD_3V_BB
0_OhmR27
J44
87654321 1
2345678
DNI
USB_DP
DB9_TXDDB9_nRTS
DB9_RXDDB9_nCTS
CBUS0
CBUS0
RS232_nCTS
RS232_nRTS
FTDI_NRTS
RS232_TXD
CBUS3
CBUS3
CBUS4
CBUS4
NDSR
NDSR
CBUS1
CBUS1NRI
NRI
CBUS2
CBUS2
NDCD
NDCD
EM35X_PB4
EM35X_PB3
EM35X_PB1EM35X_PB2
EM35X_nRESET
EM35X_nRESET
EM35X_PA4
EM35X_PA4
EM35X_PA5
EM35X_PA5
EM35X_PB5
EM35X_PB5
EM35X_PB7
EM35X_PB7
EM35X_PC0
EM35X_PC0
EM35X_PC1
EM35X_PC1nSIMRST
EM35X_PC4
EM35X_PC4
EM35X_PC3
EM35X_PC3
EM35X_PC2
EM35X_PC2
EM35X_JCLK
EM35X_JCLK
NDTR
NDTR
TTL_RXD
TTL_TXD
TTL_nCTS
SERIAL_TXD
SERIAL_RXD
SERIAL_nCTS
SERIAL_nRTSTTL_nRTS
SW_UART_MOD_ENSW_SPI_EN HW_SPI_EN
HW_UART_MOD_EN
USB_EN
SPI_EN
DEI_EN
FTDI_RXD
FTDI_TXD
RS232_RXD
FTDI_NCTS
EM35X_PA6
EM35X_PA6
EM35X_PA7
EM35X_PA7
EM35X_PC5
EM35X_PC5
EM35X_PC6
EM35X_PC6
EM35X_PC7
EM35X_PC7
UART_MOD_EN
HOST_MOSIHOST_MISOHOST_SCKHOST_nSS
nWAKE
USB_DM
EM3XX RCM Interface Header
5 via grid for U5 PCB Footprint
Configuration Mode Enable Switches
Software/Hardware Enable
FROM DEI/TTL MUX <--- ---> TO USB/232 MUX
(Target Power)(JTDO/SWO)(nJRST)(JTDI)
(JTCK/SWCLK)(JTMS/SWDIO)(nRESET)(Packet Trace Frame)(Packet Trace Data)
EM35x Packet Trace Port TTL to RS-232 Transceiver
USB / UART IC FTDi GPIO Test PointsUSB IC Decoupling
TTL Signal Access
Access to unused EM35x GPIO
EM35x GPIO Header
X2
3635 NC
343332313029282726252423222120191817
16151413121110987654321
HOST_INTERFACE
DatasheetSOCKET-16J37 Datasheet
SOCKET-20J38
NDS355NQ1
1
2
3
R28100K
R35DNI
J33
11 12108642
97531
Header-12
VDD_3V_HOST
0_Ohm
R20
U7
87654
321
SISCKnRESETnCS nWP
VCCGND
SO
DatasheetAT45DB021D-SSH-B
VDD_3V_DF
0_Ohm
R21
VDD_3V_BBJ43S-HEADER-12
1211108642
97531
J42
2018161412108642
191715131197531
Header-20
VDD_3V_DF
10NFC23
VDD_3V_HOST VDD_3V_DF
VDD_3V_DF
HOST MODULE CONNECTORS, INTERFACESEM35X NCP BREAKOUT BOARD
A0
5 8
SCH0681 REV
2 134
4 3 2 1
TITLE
SIZE B
DWG
A
B B
A
SHEET: ofDATE:
The information in this document is subject to change without notice. The statements, configurations, technical data and recommendations in thisdocument are believed to be accurate and reliable, but are presented without express or implied warranty. The information in this document isthe proprietary and confidential property of Ember Corporation and is priviliged. No part of the drawing or information may be duplicated or otherwiseused without the express permission of Ember Corporation
PAGE
Silicon Labs, 25 Thomson Place, Boston, MA 02210 TEL: 617-951-0200, FAX: 617-951-0999www.silabs.com
19-09-2010_22:13
DEI_nCTS_JMPDEI_nRTS_JMPDEI_RXD_JMP
DEI_TXD_JMP
SW_UART_MOD_ENSW_SPI_EN
HOST_nRESET
HOST_nRESET
DEI_HOST_BTL
DEI_HOST_BTL
DEI_SW_UART_MOD_EN
DEI_SW_UART_MOD_EN
DEI_SW_SPI_EN
DEI_SW_SPI_EN
DEI_HOST_nRESET
DEI_HOST_nRESET
DEI_BUTTON0
DEI_BUTTON0
DEI_nCTS
DEI_nCTS
DEI_nRTS
DEI_nRTS
DEI_RXD
DEI_RXD
DEI_BUTTON1
DEI_BUTTON1
DEI_TXD
DEI_TXD
DF_nCS
DF_nCS
DF_SCKDF_SCKDF_SO
DF_SO
DF_SI
DF_SI
DF_nWP
DF_nRESET
HOST_BTL
HOST_BTL
HGPIO0HGPIO1
HGPIO2
HGPIO2
HGPIO3
HGPIO3
HGPIO4HGPIO5HGPIO6HGPIO7
HGPIO8HGPIO9
HGPIO10
HGPIO11
HGPIO11
HGPIO12
HGPIO12
HGPIO13
HGPIO13
HGPIO14
HGPIO14
HGPIO15
HGPIO15
EZSP_UART2_RXDEZSP_UART2_nCTSEZSP_UART2_nRTS
nHOST_INTNCP_nRESETHOST_MOSI
HOST_MISOHOST_SCKHOST_nSS
nWAKE
EZSP_UART2_TXD
SER_UART1_RXDSER_UART1_TXD
SER_UART1_nCTSSER_UART1_nRTS
NDS355N
DF_nSD
DF_nSD
DataFlash (SPI Interface with Host)
Radio Modules which are expected to operate at voltages below 2.7V will require a DC to DC up-converter supply source for the AT45DB021DVoltage range of the AT45DB021D is 2.7V to 3.6V
Input data on SI is always latched on the rising edge of SCKOutput data on SO is always clocked out on the falling edge of SCK
Host DEI
Should be placed near J43
Host Module Interface Headers
Host DEI Jumpers
Host Module Application Peripheral GPIO Mapping
HOST NET NAME GPIO FUNCTION
Application LED (LED0)HGPIO0
HGPIO1 Application LED (LED1)
Application Button (BUTTON0)HGPIO2
HGPIO3 Application Button (BUTTON1)
Application Speaker (PIEZO)HGPIO4
HGPIO5 Spare GPIO
Spare GPIOHGPIO6
HGPIO7 Temperature Sensor Enable (TEMP_ENABLE)
Temperature Sensor ADC (TEMP_SENSOR)HGPIO8
HGPIO9 Spare GPIO
Spare GPIOHGPIO10
HGPIO11 DataFlash Shutdown (DF_nSD)
DataFlash SPI Chip Select (DF_nCS)HGPIO12
HGPIO13 DataFlash SPI Clock (DF_SCK)
DataFlash SPI Serial In (DF_SI)HGPIO14
HGPIO15 DataFlash SPI Serial Out (DF_SO)
J37p35 - NC, available for later use
J39
1HEADER-2
2
C24100nF
C25100nF
C27100nF
C26100nF
SPI/UART MUX/DEMUX CIRCUITEM35X NCP BREAKOUT BOARD
A0
6 8
SCH0681 REV
2 134
4 3 2 1
TITLE
SIZE B
DWG
A
B B
A
SHEET: ofDATE:
The information in this document is subject to change without notice. The statements, configurations, technical data and recommendations in thisdocument are believed to be accurate and reliable, but are presented without express or implied warranty. The information in this document isthe proprietary and confidential property of Ember Corporation and is priviliged. No part of the drawing or information may be duplicated or otherwiseused without the express permission of Ember Corporation
PAGE
Silicon Labs, 25 Thomson Place, Boston, MA 02210 TEL: 617-951-0200, FAX: 617-951-0999www.silabs.com
19-09-2010_22:13
U8
4
15
816
14
76 9
1011
35
12
1312
X0X1
Y0Y1
Z0Z1
ABCnEN
VEE
X VC
CG
ND
Y
Z
DatasheetCD74HC4053M
U11
4
15
816
14
76 9
1011
35
12
1312
X0X1
Y0Y1
Z0Z1
ABCnEN
VEE
X VC
CG
ND
Y
Z
DatasheetCD74HC4053M
U9
4
15
816
14
76 9
1011
35
12
1312
X0X1
Y0Y1
Z0Z1
ABCnEN
VEE
X VC
CG
ND
Y
Z
DatasheetCD74HC4053M
U10
4
15
816
14
76 9
1011
35
12
1312
X0X1
Y0Y1
Z0Z1
ABCnEN
VEE
X VC
CG
ND
Y
Z
DatasheetCD74HC4053M
U12
4
15
816
14
76 9
1011
35
12
1312
X0X1
Y0Y1
Z0Z1
ABCnEN
VEE
X VC
CG
ND
Y
Z
DatasheetCD74HC4053M
U13
4
15
816
14
76 9
1011
35
12
1312
X0X1
Y0Y1
Z0Z1
ABCnEN
VEE
X VC
CG
ND
Y
Z
DatasheetCD74HC4053M
VDD_3V_BB
VDD_3V_BB
VDD_3V_BB
VDD_3V_BB
VDD_3V_BB
VDD_3V_BB
U14
5
43
2
1 1A
1B
GND 1Y
VCC
Datasheet74LX1G32STR
VDD_3V_BB
C28100nF
C29100nF
RS232_nCTS
RS232_nRTS
FTDI_nRTS
RS232_TXD
EM35X_PB4EM35X_PB3EM35X_PB1
EM35X_PB2
NDTR
TTL_RXD
TTL_TXD
TTL_nCTS
SERIAL_TXD
SERIAL_RXD
SERIAL_nCTS SERIAL_nRTS
TTL_nRTS
DEI_nCTS_JMP DEI_nRTS_JMP
DEI_RXD_JMP
DEI_TXD_JMP
USB_ENUSB_EN
SPI_EN
SPI_EN
SPI_EN
DEI_ENDEI_ENDEI_EN
DEI_EN
EM35X_PB2_UART
AorB
AorB
AorBAorBAorB
FTDI_RXD
FTDI_TXD
TXD
RS232_RXD
nCTS nRTS
FTDI_nCTS
MUX_nRESET
EZSP_UART2_RXD EZSP_UART2_nCTSEZSP_UART2_nRTS
nHOST_INT
NCP_nRESETNDTR_MUX
UART_MOD_EN
RXD
EZSP_UART2_TXD
SER_UART1_RXD
SER_UART1_TXD SER_UART1_nCTS SER_UART1_nRTS
SPI/UART Multiplexer/Demultiplexer Circuit
SPI_EN (A) or UART_MOD_EN (B)
SPI/UART BLOCK DIAGRAMEM35X NCP BREAKOUT BOARD
A0
7 8
SCH0681 REV
2 134
4 3 2 1
TITLE
SIZE B
DWG
A
B B
A
SHEET: ofDATE:
The information in this document is subject to change without notice. The statements, configurations, technical data and recommendations in thisdocument are believed to be accurate and reliable, but are presented without express or implied warranty. The information in this document isthe proprietary and confidential property of Ember Corporation and is priviliged. No part of the drawing or information may be duplicated or otherwiseused without the express permission of Ember Corporation
PAGE
Silicon Labs, 25 Thomson Place, Boston, MA 02210 TEL: 617-951-0200, FAX: 617-951-0999www.silabs.com
19-09-2010_22:13
EM
35X
HO
ST
SP
IU
AR
T EM35X_PB1 (TXD)EM35X_PB2 (RXD)EM35X_PB3 (nCTS)EM35X_PB4 (nRTS)
UA
RT
SP
I
EM35X_PB0 (nSIMRST)EM35X_PA3 (nSSEL)
EM35X_PA1 (MISO)EM35X_PA0 (MOSI)
nWAKEnHOST_INT
EM35X_PB6 (nWAKE)EM35X_PB2 (nHOST_INT)
SPI_EN (A) ||
NCP_nRESET
nSS
MISOMOSI
EM35X_PA2 (SCLK)
SCK
EZSP_UART2_nCTSEZSP_UART2_nRTSEZSP_UART2_TXDEZSP_UART2_RXD
SER_UART1_nRTSSER_UART1_nCTSSER_UART1_RXDSER_UART1_TXD
SPI_EN (A) ||UART_MOD_EN (B)
nRTSnCTSRXDTXD
DEI_RXDDEI_nCTSDEI_nRTS
DEI_TXD
TTL_nRTSTTL_nCTSTTL_RXDTTL_TXD
SERIAL_nRTSSERIAL_nCTSSERIAL_RXDSERIAL_TXD FTDI_nCTS
FTDI_nRTSFTDI_TXDFTDI_RXD
RS232_nRTSRS232_nCTSRS232_RXDRS232_TXD
UART_MOD_EN (B)
0
1
0
1 0
1
0
1
DEI_EN
USB_ENTTL signal accessby pulling 4 jumpersJ25, J26,J27,J28
EM35X NCP BREAKOUT BOARD
8 8
SCH0681 A0
REVISION NOTES
12
2
B
A
B
A
1
Silicon Labs, 25 Thomson Place, Boston, MA 02210 TEL: 617-951-0200, FAX: 617-951-0999www.silabs.com
REV
TITLE
SIZE A
DWG
SHEET: ofDATE:
The information in this document is subject to change without notice. The statements, configurations, technical data and recommendations in thisdocument are believed to be accurate and reliable, but are presented without express or implied warranty. The information in this document isthe proprietary and confidential property of Ember Corporation and is priviliged. No part of the drawing or information may be duplicated or otherwiseused without the express permission of Ember Corporation
PAGE
19-09-2010_22:13
SCHEMATIC NOTES:
-- Version P0 --*Released: 2010-06-11*Initial version released, Version P0 (initial draft)
*Released: 2010-06-11
6) Corrected D5 decal error (was SOT23 instead of SOT323).
PCB LAYOUT NOTES:
*Initial version released, Version P0 (initial draft)
-- Version P0 --
8) Test point coverage for nets without probe access.
*Released: 2010-09-20*Production version release
-- Version A0 --
*Production version release
-- Version A0 --*Released: 2010-09-20
*Changes from P0 to A0: *Changes from P0 to A0:1) Swapped UART1 nets with UART2 nets based on changes for UART1 STM32 BTL.2) Renamed UART1 nets to SER_UART1_TXD, etc.3) Renamed UART2 nets to EZSP_UART1_TXD, etc.4) Updated sheet 7 chart for UART changes.5) Added SJ34-35 for J7 and J33.12.6) Removed SW_DEI_EN and DEI_SW_DEI_EN (DS9, R28, R35, R38).7) Updated J43p11 from DEI_SW_DEI_EN to DEI_HOST_BTL.8) Updated J42p19/20 from DEI_EN to HOST_BTL.9) Symbol clean-up for using PART_NUMBER rather than Manufacturer P/N.10) Replaced 570_0603_100 with _101, and _400 with _401.11) Added Q1 shutdown transistor circuit for DataFlash.12) Changed title block text from EZSP to NCP to reflect product name.13) Corrected 500_4053_001 symbol due to error with Ember P/N (-000 instead of -001).14) Added 1uF cap to input of regulator U1.15) Changed C3 from 554-106A-016 (ESR 7 ohm) to 554-106A-020 (ESR 1 ohm).
5) Added bump-on outlines in SSB and ASB.4) Corrected board outline dimensioning error.
1) Schematic changes reflected in layout.
3) Added pin1 marking for U7 SST.2) Corrected J41p15 SST error (was HGPIO1 instead of HGPIO14).
7) Updated LED0603 decal with Cathode C marking.
TS9
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Patent Notice Silicon Labs invests in research and development to help our customers differentiate in the market with innovative low-power, small size, analog-intensive mixed-signal solutions. Silicon Labs' extensive patent portfolio is a testament to our unique approach and world-class engineering team.
The information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the functioning of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.
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22 Rev. 0.6