mc13150 technical data sheet - nxp semiconductors · mc13150 motorola analog ic device data 3 ac...

SEMICONDUCTORTECHNICAL DATA

NARROWBAND FM COILLESSDETECTOR IF SUBSYSTEM

FOR CELLULAR AND ANALOG APPLICATIONS

FTA SUFFIXPLASTIC PACKAGE

CASE 977(LQFP–24)

24 1

Order this document by MC13150/D

FTB SUFFIXPLASTIC PACKAGE

CASE 873(LQFP–32)

32

1

1MOTOROLA ANALOG IC DEVICE DATA

The MC13150 is a narrowband FM IF subsystem targeted at cellular andother analog applications. Excellent high frequency performance isachieved, with low cost, through use of Motorola’s MOSAIC 1.5 RF bipolarprocess. The MC13150 has an onboard Colpitts VCO for Crystal controlledsecond LO in dual conversion receivers. The mixer is a double balancedconfiguration with excellent third order intercept. It is useful to beyond200 MHz. The IF amplifier is split to accommodate two low cost cascadedfilters. RSSI output is derived by summing the output of both IF sections. Thequadrature detector is a unique design eliminating the conventional tunablequadrature coil.

Applications for the MC13150 include cellular, CT–1 900 MHz cordlesstelephone, data links and other radio systems utilizing narrowband FMmodulation.

• Linear Coilless Detector

• Adjustable Demodulator Bandwidth

• 2.5 to 6.0 Vdc Operation

• Low Drain Current: < 2.0 mA

• Typical Sensitivity of 2.0 µV for 12 dB SINAD

• IIP3, Input Third Order Intercept Point of 0 dBm

• RSSI Range of Greater Than 100 dB

• Internal 1.4 kΩ Terminations for 455 kHz Filters

• Split IF for Improved Filtering and Extended RSSI Range

ORDERING INFORMATION

DeviceOperating

Temperature Range Package

MC13150FTATA = –40 ° to +85°C

LQFP–24

MC13150FTBTA = –40 ° to +85°C

LQFP–32

AFTFilt

PIN CONNECTIONS

Mixer

LimiterLimiter

Mixer

IF

IF

RSSIb

DETout

VEE2

DETGain

AFTout

RSSIb

DETout

VEE (N/C)

VEE2

DETGain

VEE (N/C)

AFTFilt

AFTout

MixOut

VCC1

VCC (N/C)

IFin

IFd1

VCC (N/C)

IFd2

IFout

Mixout

VCC1

IFin

IFd1

IFd2

IFout

1

2

3

4

5

6

18

17

16

15

14

13

7 8 9 10 11 12

24 23 22 21 20 19

1

2

3

4

5

6

7

8

24

23

22

21

20

19

18

17

VC

C2

LIM

in

LIM

d1

LIM

d2

BWAd

j

F Adj

Mix

in

V EE1

LOe

LOb

Enab

le

RSS

I

Mix

in

V EE1

LOe

LOb

Enab

le

RSS

I

V CC

(N/C

)

V CC

(N/C

)

VC

C2

LIM

in

LIM

d1

LIM

d2

BWAd

j

F Adj

V CC

(N/C

)

V CC

(N/C

)

Det

ecto

r

Det

ecto

r

9 10 13 14 15 1611 12

32 31 28 27 26 2530 29

LQFP–24 LQFP–32

Motorola, Inc. 1997 Rev 2

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Freescale Semiconductor, Inc.

For More Information On This Product, Go to: www.freescale.com

nc

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ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005

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MC13150

2 MOTOROLA ANALOG IC DEVICE DATA

MAXIMUM RATINGS

Rating Pin Symbol Value Unit

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Power Supply Voltage ÁÁÁÁÁÁ

2, 9ÁÁÁÁÁÁÁÁÁÁ

VCC(max)ÁÁÁÁÁÁÁÁÁÁ

6.5 ÁÁÁÁÁÁÁÁ

Vdc


Junction Temperature ÁÁÁÁÁÁ

–ÁÁÁÁÁÁÁÁÁÁ

TJmaxÁÁÁÁÁÁÁÁÁÁ

+150 ÁÁÁÁÁÁÁÁ

°CÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Storage Temperature Range ÁÁÁÁÁÁ


TstgÁÁÁÁÁÁÁÁÁÁ

–65 to +150ÁÁÁÁÁÁÁÁ

°C

NOTE: 1. Devices should not be operated at or outside these values. The ”Recommended OperatingLimits” provide for actual device operation.

2. ESD data available upon request.

RECOMMENDED OPERATING CONDITIONS

Rating Pin Symbol Value UnitÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Power Supply Voltage TA = 25°C–40°C ≤ TA ≤ 85°C

(See Figure 22)

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

2, 921, 31

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

VCCVEE


2.5 to 6.00


Vdc

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Input FrequencyÁÁÁÁÁÁÁÁÁÁÁÁ

32ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

fin

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

10 to 500ÁÁÁÁÁÁÁÁÁÁÁÁ

MHzÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Ambient Temperature RangeÁÁÁÁÁÁÁÁÁÁÁÁ

–ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

TA


–40 to +85ÁÁÁÁÁÁÁÁÁÁÁÁ

°CÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Input Signal LevelÁÁÁÁÁÁÁÁÁÁÁÁ

32ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Vin


0ÁÁÁÁÁÁÁÁÁÁÁÁ

dBm

DC ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC1 = VCC2 = 3.0 Vdc, No Input Signal.)

Characteristics Condition Pin Symbol Min Typ Max Unit

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Total Drain Current(See Figure 2)

ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

VS = 3.0 VdcÁÁÁÁÁÁÁÁÁÁÁÁ

2 + 9ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

ITOTAL ÁÁÁÁÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁÁÁÁÁÁÁ

1.7 ÁÁÁÁÁÁÁÁÁÁÁÁ

3.0 ÁÁÁÁÁÁÁÁÁÁÁÁ

mA


Supply Current, Power Down(See Figure 3)

ÁÁÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁÁÁ

2 + 9ÁÁÁÁÁÁÁÁÁÁÁÁ



40 ÁÁÁÁÁÁÁÁ


nA

AC ELECTRICAL CHARACTERISTICS (TA = 25°C, VS = 3.0 Vdc, fRF = 50 MHz, fLO = 50.455 MHz,LO Level = –10 dBm, see Figure 1 Test Circuit*, unless otherwise specified.)

Characteristics Condition Pin Symbol Min Typ Max UnitÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

12 dB SINAD Sensitivity(See Figure 15)


fmod = 1.0 kHz;fdev = ±5.0 kHz


32ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

–ÁÁÁÁÁÁÁÁÁ


–100ÁÁÁÁÁÁÁÁÁÁÁÁ


dBm


RSSI Dynamic Range(See Figure 7)


– ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

25 ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁÁÁÁ




dB


Input 1.0 dB Compression PointInput 3rd Order Intercept Point(See Figure 18)


––


––ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

1.0 dB C. Pt.IIP3

ÁÁÁÁÁÁÁÁÁ

––ÁÁÁÁÁÁÁÁÁ

–11–1.0ÁÁÁÁÁÁÁÁÁÁÁÁ

––ÁÁÁÁÁÁÁÁÁ

dBm


Coilless Detector BandwidthAdjust (See Figure 11)


Measured with No IF FiltersÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

∆BW adj ÁÁÁÁÁÁÁÁÁ




kHz/µA

MIXER


Conversion Voltage Gain(See Figure 5)


Pin = –30 dBm;PLO = –10 dBm

ÁÁÁÁÁÁÁÁÁÁ

32 ÁÁÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

10ÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

dB


Mixer Input ImpedanceÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Single–EndedÁÁÁÁÁÁÁÁÁÁ

32ÁÁÁÁÁÁÁÁÁÁ

–ÁÁÁÁÁÁ

–ÁÁÁÁÁÁ

200ÁÁÁÁÁÁÁÁ

–ÁÁÁÁÁÁ

ΩÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Mixer Output ImpedanceÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ


1ÁÁÁÁÁÁÁÁÁÁ

–ÁÁÁÁÁÁ

–ÁÁÁÁÁÁ

1.5ÁÁÁÁÁÁÁÁ

–ÁÁÁÁÁÁ

kΩ

LOCAL OSCILLATORÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

LO Emitter Current(See Figure 26)


–ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

29ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ


30ÁÁÁÁÁÁÁÁÁ


100ÁÁÁÁÁÁÁÁÁ

µA

IF & LIMITING AMPLIFIERS SECTION


IF and Limiter RSSI Slope ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Figure 7 ÁÁÁÁÁÁÁÁÁÁ


– ÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

0.4ÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

µA/dB


IF Gain ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

Figure 8 ÁÁÁÁÁÁÁÁÁÁ

4, 8 ÁÁÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

42ÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

dB


IF Input & Output Impedance ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁÁÁÁÁ

4, 8 ÁÁÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

1.5ÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

kΩ


Limiter Input Impedance ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ



– ÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

1.5ÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

kΩ


Limiter Gain ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ



– ÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

96ÁÁÁÁÁÁÁÁ

– ÁÁÁÁÁÁ

dB

* Figure 1 Test Circuit uses positive (VCC) Ground.

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MC13150


AC ELECTRICAL CHARACTERISTICS (continued) (TA = 25°C, VS = 3.0 Vdc, fRF = 50 MHz, fLO = 50.455 MHz,LO Level = –10 dBm, see Figure 1 Test Circuit*, unless otherwise specified.)

Characteristics UnitMaxTypMinSymbolPinCondition

DETECTOR

Frequency Adjust Current Figure 9,fIF = 455 kHz

16 – 41 49 56 µA

Frequency Adjust Voltage Figure 10,fIF = 455 kHz

16 – 600 650 700 mVdc

Bandwidth Adjust Voltage Figure 12,I15 = 1.0 µA

15 – – 570 – mVdc

Detector DC Output Voltage(See Figure 25)

– 23 – – 1.36 – Vdc

Recovered Audio Voltage fdev = ±3.0 kHz 23 – 85 122 175 mVrms

* Figure 1 Test Circuit uses positive (VCC) Ground.

Figure 1. Test Circuit

MixerIn

1:4Z Xformer

10 µ 220 n

VEE1LO Input

100 n

49.9

Enable

RSSI

RSSIBuffer

DetectorOutput

RL100 k

RS100 k

VEE2

100 p

220 n 10 µ

100 k V18–V17 = 0;fIF = 455 kHz

I16I15220 n

49.9

LimiterIn

IF AmpOut

1.5 k

220 n

49.9

IFIn

MixerOut

1.5 k

32

VEE1

Mixer

VCC1 LocalOscillator RSSI

Buffer

IF

VCC2

VEE2

Limiter

(6)

Det

ecto

r

+

+

220 n

220 n

220 n

220 n

220 n

220 n

31 30 29 28 27 26 25

9 10 11 12 13 14 15 16

1

2

3

4

5

6

7

8

24

23

22

21

20

19

18

17

220 n220 n

100 n

This device contains 292 active transistors.

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MC13150


MC13150 CIRCUIT DESCRIPTION

GeneralThe MC13150 is a very low power single conversion

narrowband FM receiver incorporating a split IF. This deviceis designated for use as the backend in analog narrowbandFM systems such as cellular, 900 MHz cordless phones andnarrowband data links with data rates up to 9.6 k baud. Itcontains a mixer, oscillator, extended range received signalstrength indicator (RSSI), RSSI buffer, IF amplifier, limiting IF,a unique coilless quadrature detector and a device enablefunction (see Package Pin Outs/Block Diagram).

Low Current OperationThe MC13150 is designed for battery and portable

applications. Supply current is typically 1.7 mAdc at 3.0 Vdc.Figure 2 shows the supply current versus supply voltage.

EnableThe enable function is provided for battery powered

operation. The enabled pin is pulled down to enable theregulators. Figure 3 shows the supply current versus enablevoltage, Venable (relative to VCC) needed to enable thedevice. Note that the device is fully enabled at VCC – 1.3 Vdc.Figure 4 shows the relationship of enable current, Ienable toenable voltage, Venable.

MixerThe mixer is a double–balanced four quadrant multiplier

and is designed to work up to 500 MHz. It has a single endedinput. Figure 5 shows the mixer gain and saturated outputresponse as a function of input signal drive and for –10 dBmLO drive level. This is measured in the application circuitshown in Figure 15 in which a single LC matching network isused. Since the single–ended input impedance of the mixer is200 Ω, an alternate solution uses a 1:4 impedancetransformer to match the mixer to 50 Ω input impedance. Thelinear voltage gain of the mixer alone is approximately 4.0 dB(plus an additional 6.0 dB for the transformer). Figure 6shows the mixer gain versus the LO input level for variousmixer input levels at 50 MHz RF input.

The buffered output of the mixer is internally loaded,resulting in an output impedance of 1.5 kΩ.

Local OscillatorThe on–chip transistor operates with crystal and LC

resonant elements up to 220 MHz. Series resonant, overtonecrystals are used to achieve excellent local oscillator stability.3rd overtone crystals are used through about 65 to 70 MHz.Operation from 70 MHz up to 200 MHz is feasible using theon–chip transistor with a 5th or 7th overtone crystal. Toenhance operation using an overtone crystal, the internaltransistor’s bias is increased by adding an external resistorfrom Pin 29 (in 32 pin QFP package) to VEE to keep theoscillator on continuously or it may be taken to the enable pinto shut it off when the receiver is disabled. –10 dBm of localoscillator drive is needed to adequately drive the mixer(Figure 6). The oscillator configurations specified above aredescribed in the application section.

RSSIThe received signal strength indicator (RSSI) output is a

current proportional to the log of the received signalamplitude. The RSSI current output is derived by summingthe currents from the IF and limiting amplifier stages. Anexternal resistor at Pin 25 (in 32 pin QFP package) sets thevoltage range or swing of the RSSI output voltage. Linearityof the RSSI is optimized by using external ceramic bandpassfilters which have an insertion loss of 4.0 dB. The RSSI circuitis designed to provide 100+ dB of dynamic range withtemperature compensation (see Figures 7 and 23 whichshow the RSSI response of the applications circuit).

RSSI BufferThe RSSI buffer has limitations in what loads it can drive.

It can pull loads well towards the positive and negativesupplies, but has problems pulling the load away from thesupplies. The load should be biased at half supply toovercome this limitation.

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MC13150


LO DRIVE (dBm)

VENABLE, ENABLE VOLTAGE (Vdc)

Figure 2. Supply Currentversus Supply Voltage

VENABLE, SUPPLY VOLTAGE (Vdc)

Figure 3. Supply Currentversus Enable Voltage

Figure 4. Enable Currentversus Enable Voltage

Figure 5. Mixer IF Output Level versusRF Input Level

Figure 6. Mixer IF Output Level versusLocal Oscillator Input Level

Figure 7. RSSI Output Currentversus Input Signal Level

2.0

1.6

1.2

0.8

0.4

01.5 2.5 3.5 4.5 5.5 6.5 7.5

TA = 25°C

MIX

ER IF

OU

TPU

T LE

VEL

(dBm

)

MIX

ER IF

OU

TPU

T LE

VEL

(dBm

)

VENABLE, ENABLE VOLTAGE (Vdc)

10–2

0.5

10–3

10–4

10–5

10–6

10–7

10–8

10–9

10–100.7 0.9 1.1 1.3 1.5

VCC = 3.0 VdcTA = 25°CVENABLE MeasuredRelative to VCC

70

60

50

40

30

20

10

0

–100 0.4 0.8 1.2 1.6 2.0

RF INPUT LEVEL (dBm)

SIGNAL INPUT LEVEL (dBm)

VCC = 3.0 VdcTA = 25°C

20

10

0

–10

–20

–30

–50–50 –40 –30 –20 –10 0

–40

VEE = –3.0 VdcTA = 25°C

fRF = 50 MHz; fLO = 50.455 MHzLO Input Level = –10 dBm(100 mVrms)(Rin = 50 Ω; Rout = 1.4 kΩ

20

0

–20

–40

–80

–60

–60 –50 –40 –30 –20 –10 0

VEE = –3.0 VdcTA = 25°C

fRF = 50 MHz; fLO = 50.455 MHzRin = 50 Ω; Rout = 1.4 kΩ

RF In = 0 dBm

–20 dBm

–40 dBm

50

40

30

20

0

10

–120 –100 –80 –60 –40 –20 0

VCC = 3.0 Vdcf = 50 MHzfLO = 50.455 MHz455 kHzCeramic FilterSee Figure 15

I SU

PPLY

, SU

PPLY

CU

RR

ENT

(mA)

I SU

PPLY

, SU

PPLY

CU

RR

ENT

(A)

IA

)µ

ENAB

LE, E

NAB

LE C

UR

REN

T (

RSS

I OU

TPU

T C

UR

REN

T (

A)µ

10 20

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MC13150


IF AmplifierThe first IF amplifier section is composed of three

differential stages. This section has internal dc feedback andexternal input decoupling for improved symmetry andstability. The total gain of the IF amplifier block isapproximately 42 dB at 455 kHz. Figure 8 shows the gain ofthe IF amplifier as a function of the IF frequency.

The fixed internal input impedance is 1.5 kΩ; it is designedfor applications where a 455 kHz ceramic filter is used and noexternal output matching is necessary since the filter requiresa 1.5 kΩ source and load impedance.

Overall RSSI linearity is dependent on having totalmidband attenuation of 10 dB (4.0 dB insertion loss plus 6.0dB impedance matching loss) for the filter. The output of theIF amplifier is buffered and the impedance is 1.5 kΩ.

LimiterThe limiter section is similar to the IF amplifier section

except that six stages are used. The fixed internal inputimpedance is 1.5 kΩ. The total gain of the limiting amplifiersection is approximately 96 dB. This IF limiting amplifiersection internally drives the quadrature detector section.

Fadj CURRENT (µA)

Figure 8. IF Amplifier Gainversus IF Frequency

f, FREQUENCY (MHz)

Figure 9. F adj Currentversus IF Frequency

Figure 10. F adj Voltageversus F adj Current

Figure 11. BW adj Currentversus IF Frequency

50

45

35

30

25

200.01 0.1 1.0 10

f, IF FREQUENCY (kHz)

120

0

100

80

60

40

20

0200 400 600 800 1000

VCC = 3.0 VdcSlope at 455 kHz = 9.26 kHz/µA

800

750

700

650

6000 20 40 60 80 100

f, IF FREQUENCY (kHz)


3.5

3.0

2.5

2.0

1.5

1.0

0400 420 440 460 480 500

0.5

40

Vin = 100 µVRin = 50 ΩRout = 1.4 kΩBW (3.0 dB) = 2.4 MHzTA = 25°C

IF A

MP

GAI

N (d

B)

VCC = 3.0 VdcBW 26 kHz/µA

FA

)µ

adjC

UR

REN

T (

F adj

VOLT

AGE

(mVd

c)

BWA)

µad

jCU

RR

ENT

(

AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

ale

Se

mic

on

du

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...


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ON

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. 200

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MC13150


Coilless DetectorThe quadrature detector is similar to a PLL. There is an

internal oscillator running at the IF frequency and twodetector outputs. One is used to deliver the audio signal andthe other one is filtered and used to tune the oscillator.

The oscillator frequency is set by an external resistor atthe Fadj pin. Figure 9 shows the control current required for aparticular frequency; Figure 10 shows the pin voltage at thatcurrent. From this the value of RF is chosen. For example,455 kHz would require a current of around 50 µA. The pinvoltage (Pin 16 in the 32 pin QFP package) is around 655mVgiving a resistor of 13.1 kΩ. Choosing 12 kΩ as the neareststandard value gives a current of approximately 55 µA. The5.0 µA difference can be taken up by the tuning resistor, RT.

The best nominal frequency for the AFTout pin (Pin 17)would be half supply. A supply voltage of 3.0 Vdc suggests aresistor value of (1.5 – 0.655)V/5.0 µA = 169 kΩ. Choosing150 kΩ would give a tuning current of 3/150 k = 20 µA. FromFigure 9 this would give a tuning range of roughly 10 kHz/µAor ± 100 kHz which should be adequate.

The bandwidth can be adjusted with the help of Figure 11.For example, 1.0 µA would give a bandwidth of ± 13 kHz. The

voltage across the bandwidth resistor, RB from Figure 12 isVCC – 2.44 Vdc = 0.56 Vdc for VCC = 3.0 Vdc, soRB = 0.56V/1.0 µA = 560 kΩ. Actually the locking range willbe ±13 kHz while the audio bandwidth will be approximately±8.4 kHz due to an internal filter capacitor. This is verified inFigure 13. For some applications it may be desirable that theaudio bandwidth is increased; this is done by reducing RB.Reducing RB widens the detector bandwidth and improvesthe distortion at high input levels at the expense of 12 dBSINAD sensitivity. The low frequency 3.0dB point is set by thetuning circuit such that the product

RTCT = 0.68/f3dB.

So, for example, 150 k and 1.0 µF give a 3.0 dB point of4.5 Hz. The recovered audio is set by RL to give roughly50mV per kHz deviation per 100 k of resistance. The dc levelcan be shifted by RS from the nominal 0.68 V by the followingequation:

Detector DC Output = ((RL + RS)/RS) 0.68 Vdc

Thus, RS = RL sets the output at 2 x 0.68 = 1.36 V;RL = 2RS sets the output at 3 x 0.68 = 2.0 V.

Figure 12. BW adj Currentversus BW adj Voltage

BWadj VOLTAGE (Vdc)

Figure 13. Demodulator Outputversus Frequency

2.3 2.5 2.7

f, FREQUENCY (kHz)

0.1 1.0 10 100

DEM

OD

ULA

TOR

OU

TPU

T (d

B)

10–3

10–4

10–5

10–6

10–7


10

0

–10

–20

–30

–50

–40

VCC = 3.0 VdcTA = 25°CfRF = 50 MHzfLO = 50.455 MHzLO Level = –10 dBmNo IF Bandpass Filtersfdev = ±4.0 kHz

RB = 560 k

RB = 1.0 M

BWad

jCU

RR

ENT

(A)

AR

CH

IVE

INF

OR

MA

TIO

N

AR

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IVE

INF

OR

MA

TIO

N

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MC13150


APPLICATIONS INFORMATION

Evaluation PC BoardThe evaluation PCB is very versatile and is intended to be

used across the entire useful frequency range of this device.The center section of the board provides an area forattaching all SMT components to the circuit side and radialleaded components to the component ground side (seeFigures 29 and 30). Additionally, the peripheral areasurrounding the RF core provides pads to add supportingand interface circuitry as a particular application dictates.There is an area dedicated for a LNA preamp. Thisevaluation board will be discussed and referenced in thissection.

Component SelectionThe evaluation PC board is designed to accommodate

specific components, while also being versatile enough touse components from various manufacturers and coil types.The applications circuit schematic (Figure 15) specifiesparticular components that were used to achieve the resultsshown in the typical curves but equivalent componentsshould give similar results. Component placement views are

shown in Figures 27 and 28 for the application circuit inFigure 15 and for the 83.616 MHz crystal oscillator circuit inFigure 16.

Input Matching ComponentsThe input matching circuit shown in the application circuit

schematic (Figure 15) is a series L, shunt C single L sectionwhich is used to match the mixer input to 50 Ω. Analternative input network may use 1:4 surface mounttransformers or BALUNs. The 12 dB SINAD sensitivityusing the 1:4 impedance transformer is typically –100 dBmfor fmod = 1.0 kHz and fdev = ±5.0 kHz at fin = 50 MHz andfLO = 50.455 MHz (see Figure 14).

It is desirable to use a SAW filter before the mixer toprovide additional selectivity and adjacent channel rejectionand improved sensitivity. SAW filters sourced from Toko(Part # SWS083GBWA) and Murata (Part # SAF83.16MA51X)are excellent choices to easily interface with the MC13150mixer. They are packaged in a 12 pin low profile surfacemount ceramic package. The center frequency is 83.161 MHzand the 3.0 dB bandwidth is 30 kHz.

Figure 14. S+N+D, N+D, N, 30% AMRversus Input Signal Level

INPUT SIGNAL (dBm)

–120

S+N

+D, N

+D, N

, 30%

AM

R (d

B)

20

–60

VCC = 3.0 Vdcfmod = 1.0 kHzfdev = ±5.0 kHzfin = 50 MHz

–50

–40

–30

–20

–10

0

10

–100 –80 –60 –40

fLO = 50.455 MHzLO Level = –10 dBmSee Figure 15

S+N+D

N+D

30% AMR

N

AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

ale

Se

mic

on

du

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...


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MC13150


Figure 15. Application Circuit

NOTES: 1. Alternate solution is 1:4 impedance transformer (sources include Mini Circuits, Coilcraft and Toko).2. 455 kHz ceramic filters (source Murata CFU455 series which are selected for various bandwidths).3. For external LO source, a 51 Ω pull–up resistor is used to bias the base of the on–board transistor as shown in Figure 15.

Designer may provide local oscillator with 3rd, 5th, or 7th overtone crystal oscillator circuit. The PC board is laid out toaccommodate external components needed for a Butler emitter coupled crystal oscillator (see Figure 16).

4. Enable IC by switching the pin to VEE.5. The resistor is chosen to set the range of RSSI voltage output swing.6. Details regarding the external components to setup the coilless detector are provided in the application section.

32 31 30 29 28 27 26 25

9 10 11 12 13 14 15 16

1

2

3

4

5

6

7

8

24

23

22

21

20

19

18

17

(3)LO Input

(4)Enable(5)RSSI

RSSIBuffer

DetectorOutput

RL150 k

RS150 k

1.0 n

100 n

100 n

1.0 µCT

+

560 kRB

150 kRT

12 kRF

(6)Coilless Detector

Circuit

10 µ

VCC

100 n

100 n455 kHzIF Ceramic

Filter

1.0 n

1.0 n100 n

(2)455 kHz

IF CeramicFilter

100 n

RF/IFInput

11 p

(1)180 nH

100 n 51

82 k

VEE1

Mixer

VCC1

LocalOscillator

RSSIBuffer

IF

VCC2

VEE2

Limiter

(6)

Det

ecto

r

AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

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mic

on

du

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...


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. 200

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MC13150


Local Oscillators

HF & VHF ApplicationsIn the application schematic, an external sourced local

oscillator is utilized in which the base is biased via a 51 Ωresistor to VCC. However, the on–chip grounded collectortransistor may be used for HF and VHF local oscillators withhigher order overtone crystals. Figure 16 shows a 5thovertone oscillator at 83.616 MHz. The circuit uses a Butlerovertone oscillator configuration. The amplifier is an emitterfollower. The crystal is driven from the emitter and is coupledto the high impedance base through a capacitive tapnetwork. Operation at the desired overtone frequency isensured by the parallel resonant circuit formed by thevariable inductor and the tap capacitors and parasiticcapacitances of the on–chip transistor and PC board. Thevariable inductor specified in the schematic could bereplaced with a high tolerance, high Q ceramic or air woundsurface mount component if the other components have tightenough tolerances. A variable inductor provides anadjustment for gain and frequency of the resonant tankensuring lock up and start–up of the crystal oscillator. Theovertone crystal is chosen with ESR of typically 80 Ω and120 Ω maximum; if the resistive loss in the crystal is too highthe performance of oscillator may be impacted by lower gainmargins.

A series LC network to ac ground (which is VCC) iscomprised of the inductance of the base lead of the on–chiptransistor and PC board traces and tap capacitors. Parasiticoscillations often occur in the 200 to 800 MHz range. A smallresistor is placed in series with the base (Pin 28) to cancel thenegative resistance associated with this undesired mode ofoscillation. Since the base input impedance is so large, asmall resistor in the range of 27 to 68 Ω has very little effecton the desired Butler mode of oscillation.

The crystal parallel capacitance, Co, provides a feedbackpath that is low enough in reactance at frequencies of 5thovertones or higher to cause trouble. Co has little effect nearresonance because of the low impedance of the crystalmotional arm (Rm–Lm–Cm). As the tunable inductor, whichforms the resonant tank with the tap capacitors, is tuned offthe crystal resonant frequency, it may be difficult to tell if theoscillation is under crystal control. Frequency jumps mayoccur as the inductor is tuned. In order to eliminate thisbehavior an inductor, Lo, is placed in parallel with the crystal.Lo is chosen to resonant with the crystal parallel capacitance,Co, at the desired operation frequency. The inductor providesa feedback path at frequencies well below resonance;however, the parallel tank network of the tap capacitors andtunable inductor prevent oscillation at these frequencies.

Figure 16. MC13150FTB Overtone OscillatorfRF = 83.16 MHz; fLO = 83.616 MHz

5th Overtone Crystal Oscillator

MC13150

Mixer

VEE

28

33

(4)0.135 µH

39 p

27 k10 n

1.0 µH

VCC

(3)5th OTXTAL

+

29

31

1.0 µ

39 p

AR

CH

IVE

INF

OR

MA

TIO

N

AR

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IVE

INF

OR

MA

TIO

N

Fre

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on

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...


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. 200

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MC13150


Receiver Design ConsiderationsThe curves of signal levels at various portions of the

application receiver with respect to RF input level are shownin Figure 17. This information helps determine the networktopology and gain blocks required ahead of the MC13150 toachieve the desired sensitivity and dynamic range of thereceiver system. The PCB is laid out to accommodate a lownoise preamp followed by the 83.16 MHz SAW filter. In the

application circuit (Figure 15), the input 1.0 dB compressionpoint is –10 dBm and the input third order intercept (IP3)performance of the system is approximately 0 dBm (seeFigure 18).

Typical Performance Over TemperatureFigures 19–26 show the device performance over

temperature.

Figure 17. Signal Levels versusRF Input Signal Level

RF INPUT SIGNAL LEVEL (dBm)

–80

POW

ER (d

Bm)

10

–70

–50

–40

–30

–20

–10

0

–70 –60 –50 –40

fRF = 50 MHzfLO = 50.455 MHz; LO Level = –10 dBmSee Figure 15

IF Output

–60

Mixer Output

LimiterInput

IF Input

MixerInput

RF Inputat TransformerInput

–30 –20 –10 0

AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

ale

Se

mic

on

du

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...


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MC13150


Figure 18. 1.0 dB Compression Point and InputThird Order Intercept Point versus Input Power

RF INPUT POWER (dBm)

MIX

ER IF

OU

TPU

T LE

VEL

(dBm

)

20

–40

–20

0

–60

–80 –60 –40 –20 0 20

VCC = 3.0 VdcfRF1 = 50 MHzfRF2 = 50.01 MHzfLO = 50.455 MHzPLO = –10 dBmSee Figure 15

1.0 dB CompressionPoint = –11 dBm

IP3 = –0.5 dBm

TYPICAL PERFORMANCE OVER TEMPERATURE

SIGNAL INPUT LEVEL (dBm)

Figure 19. Supply Current, I VEE1versus Signal Input Level

Figure 20. Supply Current, I VEE2versus Ambient Temperature

5.0

0

TA, AMBIENT TEMPERATURE (°C)

0.35

0.3

0.25

0.2

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

–120 –105 –90 –75 –60 –45 –30 –15 0

VCC = 3.0 Vdcfc = 50 MHzfdev = ±4.0 kHz

TA = 85°C

TA = 25°C TA = –40°C

–40 –20 0 20 40 60 80

VCC = 3.0 Vdc

I VEE

1, S

UPP

LY C

UR

REN

T (m

A)

I VEE

2, S

UPP

LY C

UR

REN

T (m

A)

AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

ale

Se

mic

on

du

cto

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...


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. 200

5

MC13150


TYPICAL PERFORMANCE OVER TEMPERATURE



Figure 21. Total Supply Currentversus Ambient Temperature


Figure 22. Minimum Supply Voltageversus Ambient Temperature

Figure 23. RSSI Current versusAmbient Temperature and Signal Level

Figure 24. Recovered Audio versusAmbient Temperature

Figure 25. Demod DC Output Voltageversus Ambient Temperature

Figure 26. LO Current versusAmbient Temperature

1.8

1.75

1.7

1.65

1.6

1.4


3.0

2.5

2.0

1.5

1.0

60

50

40

30

20

10

0



0.7

0.65

0.6

0.55

0.5

0.4

0.45

1.7

1.6

1.5

1.4

0.9

1.3

–40 –20 0 20 40 60 80

100

90

80

70

50

60

TOTA

L SU

PPLY

CU

RR

ENT

(mA)

MIN

IMU

M S

UPP

LY V

OLT

AGE

(Vdc

)

DEM

OD

DC

OU

TPU

T VO

LTAG

E (V

dc)

1.55

1.5

1.45

–40 –20 0 20 40 60 80 –40 –20 0 20 40 60 80

–40 –20 0 20 40 60 80 100 –40 –20 0 20 40 60 80 100

1.2

1.1

1.0

–40 –20 0 20 40 60 80

VCC = 3.0 Vdc

VCC = 3.0 VdcfRF = 50 MHz

Vin =

0 dBm–20 dBm

–40 dBm

–60 dBm

–80 dBm

–100 dBm

–120 dBm

VCC = 3.0 VdcRF In = –50 dBmfc = 50 MHzfLO = 50.455 MHzfdev = ±4.0 kHz



REC

OVE

RED

AU

DIO

(Vpp

)LO

CU

RR

ENT

(A)µ

RSS

I CU

RR

ENT

(A)µ

AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

ale

Se

mic

on

du

cto

r, I



nc

...


AR

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ON

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. 200

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MC13150


Figure 27. Component Placement View – Circuit Side

GND VCC

1 n

150 k

100 n

27 k

1 n

100 n

1 n

150 k

1 n

100 n

10 n33

39 p

180 n

11 p 1 n

82 k

150 k

100 n

560 k

12 k

39 p

1µ

100 n

10µ

+

50Sem

i–Rigid C

oaxΩ

MC13150FTB

AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

ale

Se

mic

on

du

cto

r, I



nc

...


AR

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D B

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CA

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ON

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. 200

5

MC13150


Figure 28. Component Placement View – Ground Side

455 kHzCeramic

Filter

455 kHzCeramic

Filter

RF1 IN RF2 IN

LO IN

LOTuning

Xtal

ENABLE

RSSI

AFT_adj

GND

BW_adj F_adj DET_out

VCC

455 kHzCeramic

Filter

1 µH

83.616 MHz

135 nH

SMA

455 kHzCeramic

Filter

3.8″AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

ale

Se

mic

on

du

cto

r, I



nc

...


AR

CH

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D B

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CA

LE

SE

MIC

ON

DU

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R, I

NC

. 200

5

MC13150


Figure 29. PCB Circuit Side View

3.8″

MC13150 Rev 0 3/95

GND VCC

AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

ale

Se

mic

on

du

cto

r, I



nc

...


AR

CH

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D B

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CA

LE

SE

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ON

DU

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R, I

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. 200

5

MC13150


Figure 30. PCB Ground Side View

455 kHzCeramic

Filter

455 kHzCeramic

Filter

RF1 IN RF2 IN

LO IN

LOTuning

Xtal

ENABLE

RSSI

AFT_adj

GND

BW_adj F_adj DET_out

VCC

3.8″AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

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Se

mic

on

du

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...


AR

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D B

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CA

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ON

DU

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R, I

NC

. 200

5

MC13150


FTA SUFFIXPLASTIC PACKAGE

CASE 977–01(LQFP–24)ISSUE O

OUTLINE DIMENSIONS

DIM MIN MAX MIN MAXINCHESMILLIMETERS

A 4.000 BSC 0.157 BSCA1 2.000 BSC 0.079 BSCB 4.000 BSC 0.157 BSCB1 2.000 BSC 0.079 BSCC 1.400 1.600 0.055 0.063D 0.170 0.270 0.007 0.011E 1.350 1.450 0.053 0.057F 0.170 0.230 0.007 0.009G 0.500 BSC 0.020 BSCH 0.050 0.150 0.002 0.006J 0.090 0.200 0.004 0.008K 0.500 0.700 0.020 0.028M 12 REF 12 REFN 0.090 0.160 0.004 0.006P 0.250 BSC 0.010 BSCQ 1 5 1 5 R 0.150 0.250 0.006 0.010S 6.000 BSC 0.236 BSCS1 3.000 BSC 0.118 BSCV 6.000 BSC 0.236 BSCV1 3.000 BSC 0.118 BSCW 0.200 REF 0.008 REFX 1.000 REF 0.039 REF

NOTES:1 DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.2 CONTROLLING DIMENSION: MILLIMETER.3 DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEADWHERE THE LEAD EXITS THE PLASTIC BODY ATTHE BOTTOM OF THE PARTING LINE.

4 DATUMS –T–, –U–, AND –Z– TO BE DETERMINEDAT DATUM PLANE –AB–.

5 DIMENSIONS S AND V TO BE DETERMINED ATDATUM PLANE –AC–.

6 DIMENSIONS A AND B DO NOT INCLUDE MOLDPROTRUSION. ALLOWABLE PROTRUSION IS0.250 (0.010) PER SIDE. DIMENSIONS A AND B DOINCLUDE MOLD MISMATCH AND AREDETERMINED AT DATUM PLANE –AB–.

7 DIMENSION D DOES NOT INCLUDE DAMBARPROTRUSION. DAMBAR PROTRUSION SHALLNOT CAUSE THE D DIMENSION TO EXCEED0.350 (0.014).

8 MINIMUM SOLDER PLATE THICKNESS SHALL BE0.0076 (0.0003).

9 EXACT SHAPE OF EACH CORNER IS OPTIONAL.

DETAIL AD

DETAIL Y

4X

4X

1

6

7

13

19

12

18

24

S

S1

A

A1

–U–

T–U0.200 (0.008) ZAB9

B

B1

–T–

V

V1

–Z–

T–U0.200 (0.008) ZAB

–AC–

–AB–

0.080 (0.003) AC

R

DETAIL AD DETAIL Y

AE AE

K

X

W

G

TOP & BOTTOM

SECTION AE–AE

M

Q

C E

H0.250 (0.010)

GAUGEPLANE

ÉÉÉÉÉÉÉÉÉ

ÇÇÇÇÇÇÇÇÇ

F

D

NJ–T–, –U–, –Z–

P

ST–US0.080 (0.003) Z SAC

AR

CH

IVE

INF

OR

MA

TIO

N

AR

CH

IVE

INF

OR

MA

TIO

N

Fre

esc

ale

Se

mic

on

du

cto

r, I



nc

...


AR

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D B

Y F

RE

ES

CA

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ON

DU

CTO

R, I

NC

. 200

5

MC13150


FTB SUFFIXPLASTIC PACKAGE

CASE 873–01(LQFP–32)ISSUE A

OUTLINE DIMENSIONS

0.2740.2740.0550.0100.0510.010

— 0.0050.013

6°0.005

5°0.0060.3480.006

5°0.348

MIN MINMAX MAXMILLIMETERS INCHES

DIM7.107.101.60

0.3731.50

—

0.200.1970.57

8°0.135

10°0.259.150.2511°9.15

6.956.951.40

0.2731.30

0.273

— 0.1190.33

6°0.119

5°0.158.850.155°

8.85

0.031 BSC

0.220 REF

0.016 BSC

0.80 BSC

5.6 REF

0.40 BSC

ABCDEFGHJKLMNPQRSTUVX

0.2800.2800.0630.0150.059

—

0.0080.0080.022

8°0.005

10°0.0100.3600.01011°

0.360

NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2. CONTROLLING DIMENSION: MILLIMETER.3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS

COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THEPLASTIC BODY AT THE BOTTOM OF THE PARTING LINE.

4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT DATUMPLANE -H-.

5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE-C-.

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE.DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH ANDARE DETERMINED AT DATUM PLANE -H-.

7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION.ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003)TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUMMATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ONTHE LOWER RADIUS OR THE FOOT.

-H-DATUMPLANE

X

K

DETAIL C

U

T

R

Q

P

DETAIL A

-A-,-B-,-D-

B

B

J

BASE METAL

D

N

SECTION B-BVIEW ROTATED 90° CLOCKWISE

F

-H- DATUMPLANE

H

32

25

24 17

16

9

81

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-B-

L

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L

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DETAIL A

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C E

DETAIL CM

MG

1.0 REF 0.039 REF

C0.20 (0.008) A–B DS SM

0.01 (0.004)

H0.20 (0.008) A–B DS SM

C0.20 (0.008) A–B D

A–B0.05 (0.002)

S SM0.

20 (0

.008

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A–B

D0.

05 (0

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)A–

B

MS

S

0.20

(0.0

08)

HA–

BD

MS

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Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motoroladata sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights ofothers. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or otherapplications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injuryor death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorolaand its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney feesarising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges thatMotorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an EqualOpportunity/Affirmative Action Employer.

Mfax is a trademark of Motorola, Inc.How to reach us:USA/EUROPE/Locations Not Listed : Motorola Literature Distribution; JAPAN : Nippon Motorola Ltd.: SPD, Strategic Planning Office, 4–32–1,P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140 or 1–800–441–2447 Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. 81–3–5487–8488

Customer Focus Center: 1–800–521–6274

Mfax : [email protected] – TOUCHTONE 1–602–244–6609 ASIA/PACIFIC : Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,Motorola Fax Back System – US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

– http://sps.motorola.com/mfax/HOME PAGE: http://motorola.com/sps/

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