mcl presentation rusnano forum 2009

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All rights reserved, Confidential, Micro Components Ltd. (MCL) MCL MCL Micro Components Ltd Micro Components Ltd . Rusnano Forum October 2009, Dr. Uri Mirsky, CEO www.mcltek.com 1 Micro Components Ltd. (MCL) Micro Components Ltd. (MCL) Rusnano Forum 10/2009 Rusnano Forum 10/2009 MCL ALOX ALOX

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Page 1: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com 1

Micro Components Ltd. (MCL)Micro Components Ltd. (MCL)

Rusnano Forum 10/2009Rusnano Forum 10/2009

MCL

ALOXALOX™™

Page 2: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com 2

Electronic PackagingElectronic Packaging

Page 3: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com 3

LED Supply ChainLED Supply Chain

Light EngineLuminair/Lighting fixture

- MCL

Page 4: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com 4

The Problem - Thermal ManagementThe Problem - Thermal Management

Note the high portion (56%) of temp. related failuresNote the high portion (56%) of temp. related failures

Note how critical is thermal performance on Note how critical is thermal performance on The LED overall performanceThe LED overall performance

Page 5: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com 6

The Packaging & Substrates World The Packaging & Substrates World

Laminate substrates

Ceramic HTCC/LTCCsubstrates

Cost

Performance

ALOXTM

substrates

Highest Cost/Performance

value

ALOX™ : A Disruptive Nano Packaging TechnologyALOX™ : A Disruptive Nano Packaging Technology

Page 6: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com 8

ALOXALOXTMTM - Nanotechnology - Nanotechnology

Internal Aluminum Layer – Ground / Power

Aluminum via

Al2O3 modified Copper Metalization

Solder mask

CORE

Typical 0.1- 0.3 mmBlind Via/

Thermal via

Multilayer Interconnect SubstrateMultilayer Interconnect Substrate

Nano Porous Composite

Page 7: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com10The Heart of the Technology -The Heart of the Technology -

ALOX™ Anodizing process: ALOX™ Anodizing process: (Nano Pores SEM Photography)

ALOX™ genuine Nano-TechnologyALOX™ genuine Nano-Technology

Need control of Pores

Critical for ALOX properties and performance

Page 8: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com11

Selective Oxidation of Aluminum SubstrateSelective Oxidation of Aluminum Substrate

4. Anodize unprotected aluminum (conversion to non-conducting aluminum oxide)

5. Strip Resist

1. Aluminum Layer

2. Mask

3. Pattern the Mask

-

ALOX™via Formation Concept ALOX™via Formation Concept

Page 9: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com12

ALOX™ Thermal Advantage ALOX™ Thermal Advantage

MCL unique ALOX structure provide for: Direct metal thermal path from die to heat sink

Path is in form of large thermal

via composed of aluminum and

copper

In contrast with standard

approaches typically

incorporating thermal blocking

materials in the structure

(polymers) or using ceramic

materials of inferior thermal

conductivity compared with Al

Al

ALOX

Cu/Ni/Au

Solder Mask

LED site Bond pad

Isolated lineALOX isolation

AluminumThermal

Path

Page 10: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com13

ALOXALOXTMTM LED PKG LED PKG

- Integrated Reflector

- Embedded Heat Slug (Al)

- Discrete / COB type Metal PKG

- Integrated Reflector

- Embedded Heat Slug (Al)

- Discrete / COB type Metal PKG

FeaturesFeatures FeaturesFeatures

Thermal Resistance

- Lead Frame : 8~12K/W (@3W)

- Ceramic PKG : 4K/W (@10W)

Thermal Resistance

- Lead Frame : 8~12K/W (@3W)

- Ceramic PKG : 4K/W (@10W)

Low Thermal Resistance High Thermal Reliability

* ALOXTM PKG* ALOXTM PKG

* Conventional PKG* Conventional PKG

Thermal Resistance

- < 5K/W(@3W)

- < 4K/W(@10W)

Thermal Resistance

- < 5K/W(@3W)

- < 4K/W(@10W)

Page 11: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com15

BLU Coupon Lighting BLU Coupon Lighting

Page 12: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com17

ALOX™ Substrate SolutionALOX™ Substrate Solution

Excellent Thermal Performance ALOX substrate conductivity 5X better than

standard solutions Allows for significant better power utilization

and higher reliability of high power devices

Low Cost

Large Panel Production No via drill process Simple - Fewer number of process steps

Page 13: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com18

Technology

ALOX™ Enhanced CSP:Thermal, Higher

density & Performance

BGA / FC & W/BHigh Pin Count

Thermal

Our Focus application area: Power LEDs, LED Arrays

Power Modules , Boards RF modules, CPUs

ALOX™: Wide Application PlatformALOX™: Wide Application Platform

Page 14: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com19

HB LED ForecastHB LED Forecast

HB-LED Substrates market (est.): $600 mil. (2009) >$1.5 b (2012)

Page 15: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com20 High Brightness (HB) LED MarketHigh Brightness (HB) LED Market

MCL strategy is to focus first on the High Brightness (HB)

LED Business

Page 16: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com21

Corporate SummaryCorporate Summary

Business: Microelectronics Packaging Technology

Products: Special Packaging Solutions; IP Technology Licenses

Major Applications: HB LEDs, High Power Electronics; Portables

Primary Market: High Power and HB LEDs devices and modules

Technology : ALOX™ ; Innovative Substrate Fabrication Technology

Patents: 24 patents; 8 patents families; 7 Granted US and

International,

Key Attributes: High Thermal Performance; High Density and Better

Form factor; Low Cost

Page 17: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com22

Major Achievements and StatusMajor Achievements and Status

Technology validation by Samsung

1st High volume manufacturing facility established in Penang, Malaysia

Ongoing Projects with Major Corporations

Financing - Equity Investment from Samsung ventures (SVIC)

Page 18: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com23

High Volume ManufacturingHigh Volume Manufacturing

Manufacturing License

granted to High Volume

Manufacturing plant in

Penang, a leading LED

hub be operative June

2008

Initial annual production

output rate of 28,000,000

square Inch of AMS

products

Page 19: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com24

Technology RecognitionTechnology Recognition

MCL is engages in various

projects, directly or through

its licensee company with

several leading LED

manufactures, including:

Lumileds, Avago, Samsung,

Phillips, Nichia and others

Page 20: Mcl Presentation  Rusnano Forum 2009

All rights reserved, Confidential, Micro Components Ltd. (MCL)

MCLMCL Micro Components LtdMicro Components Ltd..

Rusnano Forum October 2009, Dr. Uri Mirsky, CEO

www.mcltek.com25

Thank YouThank You

Micro Components Ltd

www.mcltek.com

Dr. Uri Mirsky, CEOTel:        972-4-644 2666Fax:       972-4-644 2665mobile:  [email protected]

Direct Contact:

DisclaimerThis document may contain some forward looking statements which involve known and unknown risks, delays, uncertainties and other factors not

under the Company's control which may cause actual results, performance or achievements of the Company to be materially different from the results, performance or expectations implied by these forward-looking statements. The Company gives no warranty and accepts no responsibility for the

accuracy or the completeness of the material, and reserves the right at any time to make changes, as it deems appropriate.This document is MCL confidential