mcl presentation rusnano forum 2009
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Светодиды, упаковкаTRANSCRIPT
All rights reserved, Confidential, Micro Components Ltd. (MCL)
MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com 1
Micro Components Ltd. (MCL)Micro Components Ltd. (MCL)
Rusnano Forum 10/2009Rusnano Forum 10/2009
MCL
ALOXALOX™™
All rights reserved, Confidential, Micro Components Ltd. (MCL)
MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com 2
Electronic PackagingElectronic Packaging
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com 3
LED Supply ChainLED Supply Chain
Light EngineLuminair/Lighting fixture
- MCL
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com 4
The Problem - Thermal ManagementThe Problem - Thermal Management
Note the high portion (56%) of temp. related failuresNote the high portion (56%) of temp. related failures
Note how critical is thermal performance on Note how critical is thermal performance on The LED overall performanceThe LED overall performance
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com 6
The Packaging & Substrates World The Packaging & Substrates World
Laminate substrates
Ceramic HTCC/LTCCsubstrates
Cost
Performance
ALOXTM
substrates
Highest Cost/Performance
value
ALOX™ : A Disruptive Nano Packaging TechnologyALOX™ : A Disruptive Nano Packaging Technology
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com 8
ALOXALOXTMTM - Nanotechnology - Nanotechnology
Internal Aluminum Layer – Ground / Power
Aluminum via
Al2O3 modified Copper Metalization
Solder mask
CORE
Typical 0.1- 0.3 mmBlind Via/
Thermal via
Multilayer Interconnect SubstrateMultilayer Interconnect Substrate
Nano Porous Composite
All rights reserved, Confidential, Micro Components Ltd. (MCL)
MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com10The Heart of the Technology -The Heart of the Technology -
ALOX™ Anodizing process: ALOX™ Anodizing process: (Nano Pores SEM Photography)
ALOX™ genuine Nano-TechnologyALOX™ genuine Nano-Technology
Need control of Pores
Critical for ALOX properties and performance
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com11
Selective Oxidation of Aluminum SubstrateSelective Oxidation of Aluminum Substrate
4. Anodize unprotected aluminum (conversion to non-conducting aluminum oxide)
5. Strip Resist
1. Aluminum Layer
2. Mask
3. Pattern the Mask
-
ALOX™via Formation Concept ALOX™via Formation Concept
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com12
ALOX™ Thermal Advantage ALOX™ Thermal Advantage
MCL unique ALOX structure provide for: Direct metal thermal path from die to heat sink
Path is in form of large thermal
via composed of aluminum and
copper
In contrast with standard
approaches typically
incorporating thermal blocking
materials in the structure
(polymers) or using ceramic
materials of inferior thermal
conductivity compared with Al
Al
ALOX
Cu/Ni/Au
Solder Mask
LED site Bond pad
Isolated lineALOX isolation
AluminumThermal
Path
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com13
ALOXALOXTMTM LED PKG LED PKG
- Integrated Reflector
- Embedded Heat Slug (Al)
- Discrete / COB type Metal PKG
- Integrated Reflector
- Embedded Heat Slug (Al)
- Discrete / COB type Metal PKG
FeaturesFeatures FeaturesFeatures
Thermal Resistance
- Lead Frame : 8~12K/W (@3W)
- Ceramic PKG : 4K/W (@10W)
Thermal Resistance
- Lead Frame : 8~12K/W (@3W)
- Ceramic PKG : 4K/W (@10W)
Low Thermal Resistance High Thermal Reliability
* ALOXTM PKG* ALOXTM PKG
* Conventional PKG* Conventional PKG
Thermal Resistance
- < 5K/W(@3W)
- < 4K/W(@10W)
Thermal Resistance
- < 5K/W(@3W)
- < 4K/W(@10W)
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com15
BLU Coupon Lighting BLU Coupon Lighting
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com17
ALOX™ Substrate SolutionALOX™ Substrate Solution
Excellent Thermal Performance ALOX substrate conductivity 5X better than
standard solutions Allows for significant better power utilization
and higher reliability of high power devices
Low Cost
Large Panel Production No via drill process Simple - Fewer number of process steps
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com18
Technology
ALOX™ Enhanced CSP:Thermal, Higher
density & Performance
BGA / FC & W/BHigh Pin Count
Thermal
Our Focus application area: Power LEDs, LED Arrays
Power Modules , Boards RF modules, CPUs
ALOX™: Wide Application PlatformALOX™: Wide Application Platform
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com19
HB LED ForecastHB LED Forecast
HB-LED Substrates market (est.): $600 mil. (2009) >$1.5 b (2012)
All rights reserved, Confidential, Micro Components Ltd. (MCL)
MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com20 High Brightness (HB) LED MarketHigh Brightness (HB) LED Market
MCL strategy is to focus first on the High Brightness (HB)
LED Business
All rights reserved, Confidential, Micro Components Ltd. (MCL)
MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com21
Corporate SummaryCorporate Summary
Business: Microelectronics Packaging Technology
Products: Special Packaging Solutions; IP Technology Licenses
Major Applications: HB LEDs, High Power Electronics; Portables
Primary Market: High Power and HB LEDs devices and modules
Technology : ALOX™ ; Innovative Substrate Fabrication Technology
Patents: 24 patents; 8 patents families; 7 Granted US and
International,
Key Attributes: High Thermal Performance; High Density and Better
Form factor; Low Cost
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com22
Major Achievements and StatusMajor Achievements and Status
Technology validation by Samsung
1st High volume manufacturing facility established in Penang, Malaysia
Ongoing Projects with Major Corporations
Financing - Equity Investment from Samsung ventures (SVIC)
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com23
High Volume ManufacturingHigh Volume Manufacturing
Manufacturing License
granted to High Volume
Manufacturing plant in
Penang, a leading LED
hub be operative June
2008
Initial annual production
output rate of 28,000,000
square Inch of AMS
products
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MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com24
Technology RecognitionTechnology Recognition
MCL is engages in various
projects, directly or through
its licensee company with
several leading LED
manufactures, including:
Lumileds, Avago, Samsung,
Phillips, Nichia and others
All rights reserved, Confidential, Micro Components Ltd. (MCL)
MCLMCL Micro Components LtdMicro Components Ltd..
Rusnano Forum October 2009, Dr. Uri Mirsky, CEO
www.mcltek.com25
Thank YouThank You
Micro Components Ltd
www.mcltek.com
Dr. Uri Mirsky, CEOTel: 972-4-644 2666Fax: 972-4-644 2665mobile: [email protected]
Direct Contact:
DisclaimerThis document may contain some forward looking statements which involve known and unknown risks, delays, uncertainties and other factors not
under the Company's control which may cause actual results, performance or achievements of the Company to be materially different from the results, performance or expectations implied by these forward-looking statements. The Company gives no warranty and accepts no responsibility for the
accuracy or the completeness of the material, and reserves the right at any time to make changes, as it deems appropriate.This document is MCL confidential