mcp47cxbxx data sheet - microchip technology...mcp47cxbxx ds20006089b-page 2 2018-2019 microchip...
TRANSCRIPT
MCP47CXBXX81012-Bit Digital-to-Analog Converters 1 LSb INL
SingleDual Voltage Outputs with I2C Interface
Features
bull Memory Options
- Volatile Memory MCP47CVBXX
- Nonvolatile Memory MCP47CMBXX
bull Operating Voltage Range
- 27V to 55V ndash Full specifications
- 18V to 27V ndash Reduced device specifications
bull Output Voltage Resolutions
- 8-bit MCP47CXB0X (256 steps)
- 10-bit MCP47CXB1X (1024 steps)
- 12-bit MCP47CXB2X (4096 steps)
bull Nonvolatile Memory (MTP) Size 32 Locations
bull 1 LSb Integral Nonlinearity (INL) Specification
bull DAC Voltage Reference Source Options
- Device VDD
- External VREF pin (buffered or unbuffered)
- Internal band gap (1214V typical)
bull Output Gain Options
- 1x (Unity)
- 2x (available when not using internal VDD as voltage source)
bull Power-onBrown-out Reset (PORBOR) Protection
bull Power-Down Modes
- Disconnects output buffer (high-impedance)
- Selection of VOUT pull-down resistors (100 k or 1 k)
bull I2C Interface
- Slave address options register-defined address with two physical address select pins (package dependent)
- Standard (100 kbps) Fast (400 kbps) and High-Speed (up to 34 Mbps) modes
bull Package Types
- Dual 16-lead 3 x 3 QFN 10-lead MSOP10-lead 3 x 3 DFN
- Single 16-lead 3 x 3 QFN 10-lead MSOP10-lead 3 x 3 DFN
bull Extended Temperature Range -40degC to +125degC
Package Types
MCP47CXBX1 (Single)
VREF
A0
VOUT
SCL
LATHVC
1
VSS
SDAVDD
MCP47CXBX2 (Dual)
NC
A1
2
3
4
5
10
9
8
7
6
VREF
A0
VOUT
SCL
LATHVC
1
VSS
SD
A
VD
DN
C
A12
3
4
5 6 7 8
12
11
10
9
16
15
14
13
17 EP(1)
NC
NC
NC
NC
NC
NC
QFN-16 (3x3)
VREF
A0
VOUT0
SCL
LATHVC(2)
1
VSS
SDAVDD
VOUT1
A1
2
3
4
5
10
9
8
7
6
VREF0
A0
VOUT0
SCL
LAT0HVC
1
VSS
SD
A
VD
DV
OU
T1
A12
3
4
5 6 7 8
12
11
10
9
16
15
14
13
17 EP(1)
NC
NC
LA
T1
NC
NC
VREF1
MSOP-10 DFN-10 (3x3)
QFN-16 (3x3)
MSOP-10 DFN-10 (3x3)
Note 1 Exposed pad (substrate paddle)2 This pinrsquos signal can be connected to DAC0
andor DAC1
2018-2019 Microchip Technology Inc DS20006089B-page 1
MCP47CXBXX
General Description
The MCP47CXBXX devices are single and dualchannel 8-bit 10-bit and 12-bit buffered voltage outputDigital-to-Analog Converters (DAC) with volatile orMTP memory and an I2C serial interface
The MTP memory can be written by the user up to32 times for each specific register It requires a high-voltage level on the HVC pin typically 75V in order tosuccessfully program the desired memory locationThe nonvolatile memory includes power-up outputvalues device Configuration registers and generalpurpose memory
The VREF pin the device VDD or the internal band gapvoltage can be selected as the DACrsquos referencevoltage When VDD is selected VDD is internallyconnected to the DAC reference circuit
When the VREF pin is used with an external voltagereference the user can select between a gain of 1 or 2and can have the reference buffer enabled or disabledWhen the gain is 2 the VREF pin voltage should belimited to a maximum of VDD2
These devices have a two-wire I2C compatible serialinterface for Standard (100 kHz) Fast (400 kHz) orHigh-Speed (17 MHz and 34 MHz) modes
Applications
bull Set Point or Offset Trimming
bull Sensor Calibration
bull Low-Power Portable Instrumentation
bull PC Peripherals
bull Data Acquisition Systems
MCP47CMBX1 Block Diagram (Single-Channel Output)
VDD
VSS
Memory
SDA
SCL
VREF1VREF0
A0
A1
VOUT0
10
0k
1k
VDD PD1PD0
VREF1VREF0
OP AMP
ADDR6ADDR0
PD1PD0 and VREF1VREF0
DAC0VREFPOWER-DOWNGAINSTATUS
DAC0VREFPOWER-DOWNGAINI2C ADDRESSWiperLocktrade
VOLATILE (4x16)
NONVOLATILE (13x16)
Band Gap1214V
VDD
VIHH
LAT0
VBG
LATHVC
VREF0
Power-upBrown-out Control
I2C Serial Interface Moduleand Control Logic
(WiperLocktrade Technology)
Res
isto
rL
add
er
GAIN
DS20006089B-page 2 2018-2019 Microchip Technology Inc
MCP47CXBXX
MCP47CMBX2 Block Diagram (Dual Channel Output)
VDD
VSS
Memory
VREF0(2)
SDA
SCL
VREF1VREF0
Note 1 On dual output devices except those in a QFN16 package the LAT0 pin is internally connected to LAT1 input of DAC1
2 On dual output devices except those in a QFN16 package the VREF0 pin is internally connected to VREF1 input of DAC1
A0
A1
Res
isto
rL
add
er
VOUT0
10
0k
1k
VDD
LAT0HVC
PD1PD0
VREF1VREF0
OP AMP
ADDR6ADDR0
PD1PD0 andVREF1VREF0
DAC0 and DAC1VREFPOWER-DOWNGAINSTATUS
DAC0 and DAC1VREFPOWER-DOWNGAINI2C ADDRESSWiperLocktrade
VOLATILE (5x16)
NONVOLATILE (14x16)
Band Gap1214V
VDD
GAIN
VREF1(2)
VREF1VREF0
Re
sist
or
Lad
der
VOUT1
100
k
1k
VDD
LAT1(1)
PD1PD0
VREF1VREF0
OP AMP
PD1PD0 and VREF1VREF0
VDD
GAIN
VIHH
LAT0
LAT0(1)
VBG
VBG
Power-upBrown-out Control
I2C Serial Interface Moduleand Control Logic
(WiperLocktrade Technology)
2018-2019 Microchip Technology Inc DS20006089B-page 3
MCP47CXBXX
Family Device Features
Device Package Type
o
f C
ha
nn
els
Re
so
luti
on
(b
its)
DAC Output PORBOR Setting(1)
o
f V
RE
F I
np
uts
o
f L
AT
In
pu
ts(3
)
o
f A
dd
ress
Pin
s
Me
mo
ry(2
)
GP
MT
P L
oca
tio
ns
MCP47CVB01 MSOP QFN DFN 1 8 7Fh 1 1 2 RAM mdash
MCP47CVB11 MSOP QFN DFN 1 10 1FFh 1 1 2 RAM mdash
MCP47CVB21 MSOP QFN DFN 1 12 7FFh 1 1 2 RAM mdash
MCP47CVB02QFN 2 8 7Fh 2 2 2 RAM mdash
MSOP DFN 2 8 7Fh 1 1 2 RAM mdash
MCP47CVB12QFN 2 10 1FFh 2 2 2 RAM mdash
MSOP DFN 2 10 1FFh 1 1 2 RAM mdash
MCP47CVB22QFN 2 12 7FFh 2 2 2 RAM mdash
MSOP DFN 2 12 7FFh 1 1 2 RAM mdash
MCP47CMB01 MSOP QFN DFN 1 8 7Fh 1 1 2 MTP 8
MCP47CMB11 MSOP QFN DFN 1 10 1FFh 1 1 2 MTP 8
MCP47CMB21 MSOP QFN DFN 1 12 7FFh 1 1 2 MTP 8
MCP47CMB02QFN 2 8 7Fh 2 2 2 MTP 8
MSOP DFN 2 8 7Fh 1 1 2 MTP 8
MCP47CMB12QFN 2 10 1FFh 2 2 2 MTP 8
MSOP DFN 2 10 1FFh 1 1 2 MTP 8
MCP47CMB22QFN 2 12 7FFh 2 2 2 MTP 8
MSOP DFN 2 12 7FFh 1 1 2 MTP 8
Note 1 The factory default value
2 Each nonvolatile memory location can be written 32 times For subsequent writes to the MTP the device will ignore the commands and the memory will not be modified
3 If the product is a dual device and the package has only one LAT pin it is associated with both DAC0 and DAC1
DS20006089B-page 4 2018-2019 Microchip Technology Inc
MCP47CXBXX
10 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(dagger)
Voltage on VDD with respect to VSS -06V to +65V
Voltage on all pins with respect to VSS -06V to VDD + 03V
Input clamp current IIK (VI lt 0 VI gt VDD VI gt VPP on HV pins) plusmn20 mA
Output clamp current IOK (VO lt 0 or VO gt VDD)plusmn20 mA
Maximum current out of VSS pin (Single) 50 mA(Dual)100 mA
Maximum current into VDD pin (Single) 50 mA(Dual)100 mA
Maximum current sourced by the VOUT pin 20 mA
Maximum current sunk by the VOUT pin20 mA
Maximum current sourcesunk by the VREF(0) pin (in Band Gap mode) 20 mA
Maximum current sunk by the VREFx pin (when VREF is in Unbuffered mode) 175 microA
Maximum current sourced by the VREFx pin 20 microA
Maximum current sunk by the VREF pin 125 microA
Maximum input current sourcesunk by SDA SCL pins 2 mA
Maximum output current sunk by SDA output pin 25 mA
Total power dissipation(1) 400 mW
ESD protection on all pins plusmn6 kV (HBM)plusmn400V (MM)plusmn2 kV (CDM)
Latch-up (per JEDEC JESD78A) at +125degC plusmn100 mA
Storage temperature -65degC to +150degC
Ambient temperature with power applied -55degC to +125degC
Soldering temperature of leads (10 seconds) +300degC
Maximum Junction Temperature (TJ) +150degC
Note 1 Power dissipation is calculated as follows PDIS = VDD x IDD ndash IOH + (VDD ndash VOH) x IOH + (VOL x IOL)
dagger Notice Stresses above those listed under ldquoMaximum Ratingsrdquo may cause permanent damage to the device This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied Exposure to maximum rating conditions for extended periods may affect device reliability
2018-2019 Microchip Technology Inc DS20006089B-page 5
MCP47CXBXX
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended) All parameters apply across the specified operating ranges unless notedVDD = +27V to 55V VREF = +1000V to VDD VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
Supply Voltage VDD 27 mdash 55 V
18 mdash 27 V DAC operation (reduced analog specifications) and serial interface
VDD Voltage (rising) to Ensure Device Power-on Reset
VPOR mdash mdash 175 V RAM retention voltage (VRAM) lt VPORVDD voltages greater than the VPOR limit ensure that the device is out of Reset
VDD Voltage (falling) to Ensure Device Brown-out Reset
VBOR VRAM mdash 161 V RAM retention voltage (VRAM) lt VBOR
VDD Rise Rate to Ensure Power-on Reset
VDDRR Note 3 Vms
Power-on Reset to Output-Driven Delay(2)
TPOR2OD mdash mdash 130 micros VDD rising VDD gt VPOR single output
mdash mdash 145 micros VDD rising VDD gt VPOR dual output
Note 2 This parameter is ensured by characterization
Note 3 PORBOR voltage trip point is not slope-dependent Hysteresis implemented with time delay
DS20006089B-page 6 2018-2019 Microchip Technology Inc
MCP47CXBXX
DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended) All parameters apply across the specified operating ranges unless notedVDD = +27V to 55V VREF = +1000V to VDD VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
Supply Current IDD mdash mdash 230 microA Single 100 kHz(2) Serial interface active VRxBVRxA = 10(4) VOUT is unloaded VREF = VDD = 55VVolatile DAC register = Mid-Scale
mdash mdash 310 400 kHz
mdash mdash 460 17 MHz(2)
mdash mdash 620 34 MHz(2)
mdash mdash 330 Dual 100 kHz(2)
mdash mdash 410 400 kHz
mdash mdash 560 17 MHz(2)
mdash mdash 720 34 MHz(2)
mdash mdash 160 Single Serial interface inactive VRxBVRxA = 10VOUT is unloaded VREF = VDD = 55VVolatile DAC register = Mid-Scale
mdash mdash 280 Dual
LATHVC Pin Write Current(2)
IDD(MTP_WR) mdash mdash 640 mA mdash Serial interface inactive (MTP write active)VRxBVRxA = 10 (valid for all modes)VDD = 55V LATHVC = VIHH write all lsquo1rsquos to nonvolatile DAC0VOUT pins are unloaded
Power-Down Current
IDDP mdash 065 380 microA mdash PDxBPDxA = 01(5) VRxBVRxA = 10VOUT not connected
Note 2 This parameter is ensured by characterization
Note 4 Supply current is independent of current through the resistor ladder in mode VRxBVRxA = 10
Note 5 The PDxBPDxA = 01 10 and 11 configurations should have the same current
2018-2019 Microchip Technology Inc DS20006089B-page 7
MCP47CXBXX
DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended) All parameters apply across the specified operating ranges unless notedVDD = +27V to 55V VREF = +1000V to VDD VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
Resistor Ladder Resistance(6)
RL 639 71 781 k VRxBVRxA = 10VREF = VDD
Resolution ( of resistors and of taps) (see C1 ldquoResolutionrdquo)
N 256 Taps 8-bit No missing codes
1024 Taps 10-bit No missing codes
4096 Taps 12-bit No missing codes
Nominal VOUT Match(10) |VOUT ndash VOUTMEAN|VOUTMEAN
mdash 0016 0300 18V VDD 55V(2)
VOUT Tempco(2) (see C19 ldquoVOUT Temperature Coefficientrdquo)
VOUTT mdash 3 mdash ppmdegC Code = Mid-Scale VRxBVRxA = 00 10 and 11
VREF Pin Input Voltage Range(1)
VREF VSS mdash VDD V 18V VDD 55V
Note 1 This parameter is ensured by design
Note 2 This parameter is ensured by characterization
Note 6 Resistance is defined as the resistance between the VREF pin (mode VRxBVRxA = 10) to the VSS pinFor dual channel devices (MCP47CXBX2) this is the effective resistance of each resistor ladder Theresistance measurement is one of the two resistor ladders measured in parallel
Note 10 Variation of one output voltage to mean output voltage for dual devices only
DS20006089B-page 8 2018-2019 Microchip Technology Inc
MCP47CXBXX
DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended) All parameters apply across the specified operating ranges unless notedVDD = +27V to 55V VREF = +1000V to VDD VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
Zero-Scale Error(Code = 000h)(see C5 ldquoZero-Scale Error (EZS)rdquo)
EZS mdash mdash 0375 LSb 8-bit VRxBVRxA = 10 G = 0VREF = VDD no load
mdash mdash 15 LSb 10-bit VRxBVRxA = 10 G = 0VREF = VDD no load
mdash mdash 6 LSb 12-bit VRxBVRxA = 10 G = 0VREF = VDD no load
See Section 20 ldquoTypical Performance Curvesrdquo(2)
LSb VRxBVRxA = 10 G = 1 VREF = 05 X VDD no load
See Section 20 ldquoTypical Performance Curvesrdquo(2)
LSb VRxBVRxA = 01 G = 0 G = 1VDD = 18V-55V no load
Offset Error (see C7 ldquoOffset Error (EOS)rdquo)
EOS -6 plusmn04 +6 mV VRxBVRxA = 10 Gx = 0 no load8-bit Code = 4 10-bit Code = 16 12-bit Code = 64
Offset Voltage Temperature Coefficient(29)
VOSTC mdash plusmn5 mdash microVdegC
Full-Scale Error (see C4 ldquoFull-Scale Error (EFS)rdquo)
EFS mdash mdash 25 LSb 8-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
mdash mdash 9 LSb 10-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
mdash mdash 35 LSb 12-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
See Section 20 ldquoTypical Performance Curvesrdquo(2)
LSb VRxBVRxA = 10 G = 1 VREF = 05 X VDD no load
See Section 20 ldquoTypical Performance Curvesrdquo(2)
LSb VRxBVRxA = 01 G = 0 G = 1VDD = 18V-55V no load
Gain Error (see C9 ldquoGain Error (EG)rdquo)(7)
EG -1 plusmn01 +1 of FSR
8-bitVRxBVRxA = 10 G = 0 Code = 252 VREF = VDD no load
-1 plusmn01 +1 of FSR
10-bitVRxBVRxA = 10 G = 0 Code = 1008 VREF = VDD no load
-1 plusmn01 +1 of FSR
12-bitVRxBVRxA = 10 G = 0 Code = 4032 VREF = VDD no load
Gain Error Drift(29) (see C10 ldquoGain Error Drift (EGD)rdquo)
GdegC mdash -6 mdash ppmdegC
Note 2 This parameter is ensured by characterization
Note 7 This gain error does not include the offset error
Note 9 Code range dependent on resolution 8-bit codes 4 to 252 10-bit codes 16 to 1008 12-bit codes 64 to4032
2018-2019 Microchip Technology Inc DS20006089B-page 9
MCP47CXBXX
DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended) All parameters apply across the specified operating ranges unless notedVDD = +27V to 55V VREF = +1000V to VDD VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
Total Unadjusted Error(29) (see C6 ldquoTotal Unadjusted Error (ET)rdquo)
ET -25 mdash 075 LSb 8-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
-9 mdash 3 LSb 10-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
-35 mdash 12 LSb 12-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
See Section 20 ldquoTypical Performance Curvesrdquo(2)
LSb VRxBVRxA = 10 G = 1 VREF = 05 X VDD no load
See Section 20 ldquoTypical Performance Curvesrdquo(2)
LSb VRxBVRxA = 01 G = 0 G = 1VDD = 18V-55V no load
Integral Nonlinearity (see C11 ldquoIntegral Nonlinearity (INL)rdquo)(9)
INL -01 mdash +01 LSb 8-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
-025 mdash +025 LSb 10-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
-1 mdash +1 LSb 12-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
See Section 20 ldquoTypical Performance Curvesrdquo(2)
LSb VRxBVRxA = 10 G = 1 VREF = 05 X VDD no load
See Section 20 ldquoTypical Performance Curvesrdquo(2)
LSb VRxBVRxA = 01 G = 0 G = 1VDD = 18V-55V no load
Differential Nonlinearity (see C12 ldquoDifferential Nonlinearity (DNL)rdquo)(9)
DNL -01 mdash +01 LSb 8-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
-025 mdash +025 LSb 10-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
-10 mdash +10 LSb 12-bit VRxBVRxA = 10 G = 0 VREF = VDD no load
See Section 20 ldquoTypical Performance Curvesrdquo(2)
LSb VRxBVRxA = 10 G = 1 VREF = 05 X VDD no load
See Section 20 ldquoTypical Performance Curvesrdquo(2)
LSb VRxBVRxA = 01 G = 0 G = 1VDD = 18V-55V no load
Note 2 This parameter is ensured by characterization
Note 9 Code range dependent on resolution 8-bit codes 4 to 252 10-bit codes 16 to 1008 12-bit codes 64 to4032
DS20006089B-page 10 2018-2019 Microchip Technology Inc
MCP47CXBXX
DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended) All parameters apply across the specified operating ranges unless notedVDD = +27V to 55V VREF = +1000V to VDD VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
-3 dB Bandwidth (see C16 ldquo-3 dB Bandwidthrdquo)
BW mdash 60 mdash kHz VREF = 300V plusmn 2V VRxBVRxA = 10 Gx = 0mdash 35 mdash VREF = 350V plusmn 15V VRxBVRxA = 10
Gx = 1Output Amplifier (Op Amp)
Phase Margin(1) PM mdash 58 mdash degC RL = infin
Slew Rate SR mdash 015 mdash Vmicros RL = 2 k
Load Regulation mdash mdash 130 mdash microVmA 1 mA I mA VDD = 55VDAC code = Mid-Scalemdash 320 mdash microVmA -6 mA I-1 mA
Short-Circuit Current ISC_OA 6 10 14 mA Short to VSS DAC code = Full Scale
6 10 14 mA Short to VDD DAC code = Zero Scale
Settling Time(8) tSETTLING mdash 16 mdash micros RL = 2 k
Internal Band Gap
Band Gap Voltage VBG 1180 1214 1260 V 18V VDD 55V
Short-Circuit Current ISC_BG 6 10 14 mA Short to VSS
6 10 14 mA Short to VDD
Band Gap Voltage Temperature Coefficient
VBGTC mdash 16 mdash ppmdegC 18V VDD 55V
Band Gap mode VREF Pin Load Regulation
IBG mdash 30 mdash microVmA 1 mA I6 mA VDD = 55V
mdash 390 mdash microVmA -6 mA I-1 mA
Note 1 This parameter is ensured by design
Note 8 Within 12 LSb of the final value when code changes from 14 to 34 of FSR (Example 400h to C00h in 12-bit device)
2018-2019 Microchip Technology Inc DS20006089B-page 11
MCP47CXBXX
DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended) All parameters apply across the specified operating ranges unless notedVDD = +27V to 55V VREF = +1000V to VDD VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
External Reference (VREF)
Input Range(1) VREF VSS mdash VDD V VRxBVRxA = 10 (Unbuffered mode)
Input Capacitance CREF mdash 29 mdash pF VRxBVRxA = 10(Unbuffered mode)
Input Impedance RL See Resistor Ladder Resistance(6)
k 27V VDD 55VVRxBVRxA = 10 VREF VDD
Current through VREF(1) IVREF mdash mdash 17215 microA Mathematically from RVREF(min)
spec (at 55V)
Total Harmonic Distortion(1)
THD mdash -76 mdash dB VREF = 2048V plusmn 01V VRxBVRxA = 10 Gx = 0 Frequency = 1 kHz
Dynamic Performance
Major Code Transition Glitch (see C14 ldquoMajor Code Transition Glitchrdquo)
mdash mdash 10 mdash nV-s 1 LSb change around major carry (7FFh to 800h)
Digital Feedthrough (see C15 ldquoDigital Feedthroughrdquo)
mdash mdash lt2 mdash nV-s
Note 1 This parameter is ensured by design
Note 6 Resistance is defined as the resistance between the VREF pin (mode VRxBVRxA = 10) to the VSS pinFor dual channel devices (MCP47CXBX2) this is the effective resistance of each resistor ladder Theresistance measurement is one of the two resistor ladders measured in parallel
DS20006089B-page 12 2018-2019 Microchip Technology Inc
MCP47CXBXX
DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended) All parameters apply across the specified operating ranges unless notedVDD = +27V to 55V VREF = +1000V to VDD VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
Digital InputsOutputs (LAT0HVC LAT1 A0 A1)
Schmitt Trigger High Input Threshold
VIH 045 VDD mdash mdash V 18V VDD 55V (allows 27V digital VDD with 55V analog VDD or 18V digital VDD with 30V analog VDD)
Schmitt Trigger Low Input Threshold
VIL mdash mdash 02 VDD V
Hysteresis of Schmitt Trigger Inputs
VHYS mdash 01 VDD mdash V
Input Leakage Current IIL -1 mdash 1 microA VIN = VDD and VIN = VSS
Pin Capacitance CIN COUT mdash 10 mdash pF
Digital Interface (SDA SCL)
Output Low Voltage VOL mdash mdash 04 V VDD 20V IOL = 3 mA
mdash mdash 02 VDD V VDD lt 20V IOL = 1 mA
Input High Voltage (SDA and SCL pins)
VIH 07 VDD mdash mdash V 18V VDD 55V
Input Low Voltage (SDA and SCL pins)
VIL mdash mdash 03 VDD V 18V VDD 55V
Input Leakage IL -1 mdash 1 microA SCL = SDA = VSS or SCL = SDA = VDD
Pin Capacitance CPIN mdash 10 mdash pF
RAM Value
Value Range N 0h mdash FFh Hex 8-bit
mdash 3FFh 10-bit
mdash FFFh 12-bit
DAC Register PORBOR Value
N See Table 4-2 Hex 8-bit
10-bit
12-bit
PDCON Initial Factory Setting
mdash See Table 4-2 Hex
Power Requirements
Power Supply Sensitivity (C17 ldquoPower Supply Sensitivity (PSS)rdquo)
PSS mdash 00010 00035 8-bit Code = Mid-Scale
mdash 10-bit
mdash 12-bit
2018-2019 Microchip Technology Inc DS20006089B-page 13
MCP47CXBXX
DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended) All parameters apply across the specified operating ranges unless notedVDD = +27V to 55V VREF = +1000V to VDD VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
Multi-Time Programming Memory (MTP)
MTP Programming Voltage(1)
VPG_MTP 20 mdash 55 V HVC = VIHH -20degC TA +125degC
LATHVC Pin Voltage for MTP Programming (high-voltage commands)
VIHH 725 75 775V V The LATHVC pin will be at one of the three input levels (VIL VIH or VIHH)(111)
the LATHVC pin must supply the required MTP programming current (up to 64 mA)
Writes Cycles mdash mdash mdash 32(12) Cycles Note 1
Data Retention DRMTP 10 mdash mdash Years At +85degC(1)
MTP Range N 0h mdash FFh Hex 8-bit
0h mdash 3FFh Hex 10-bit
0h mdash FFFh Hex 12-bit
0000h 7FFFh Hex All general purpose memory
Initial Factory Setting N See Table 4-2 mdash
MTP Programming Write Cycle Time(1)
tWC(MTP) mdash mdash 250 micros VDD = +20V to 55V -20degC TA +125degC
Note 1 This parameter is ensured by design
Note 11 High-voltage on the LATHVC pin must be limited to the command + programming time After the programming cycle the LATHVC pin voltage must be returned to 55V or lower
Note 12 After 32 MTP write cycles writes are inhibited and the 32nd write value is retained (not corrupted)
DS20006089B-page 14 2018-2019 Microchip Technology Inc
MCP47CXBXX
DC Notes
1 This parameter is ensured by design
2 This parameter is ensured by characterization
3 PORBOR voltage trip point is not slope-dependent Hysteresis implemented with time delay
4 Supply current is independent of current through the resistor ladder in mode VRxBVRxA = 10
5 The PDxBPDxA = 01 10 and 11 configurations should have the same current
6 Resistance is defined as the resistance between the VREF pin (mode VRxBVRxA = 10) to the VSS pin For dual channel devices (MCP47CXBX2) this is the effective resistance of each resistor ladder The resistance measurement is one of the two resistor ladders measured in parallel
7 This gain error does not include the offset error
8 Within 12 LSb of the final value when code changes from 14 to 34 of FSR (Example 400h to C00h in 12-bit device)
9 Code range dependent on resolution 8-bit codes 4 to 252 10-bit codes 16 to 1008 12-bit codes 64 to 4032
10 Variation of one output voltage to mean output voltage for dual devices only
11 High-voltage on the LATHVC pin must be limited to the command + programming time After the programming cycle the LATHVC pin voltage must be returned to 55V or lower
12 After 32 MTP write cycles writes are inhibited and the 32nd write value is retained (not corrupted)
2018-2019 Microchip Technology Inc DS20006089B-page 15
MCP47CXBXX
11 Timing Waveforms and Requirements
111 WIPER SETTLING TIME
FIGURE 1-1 VOUT Settling Time Waveforms
112 LATCH PIN (LAT) TIMING
FIGURE 1-2 LAT Pin Waveforms
VOUT
plusmn 05 LSb
Old Value
New Value
TABLE 1-1 WIPER SETTLING TIMING
Timing Characteristics
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended)
All parameters apply across the specified operating ranges unless notedVDD = +27V to 55V VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
VOUT Settling Time (see C13 ldquoSettling Timerdquo)
tS mdash 16 mdash micros 12-bit Code = 400h C00h C00h 400h(2)
Note 2 Within 12 LSb of final value when code changes from 14 to 34 of FSR
LATx
SCL
tLAT
Wx
TABLE 1-2 LAT PIN TIMING
Timing Characteristics
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended)
All parameters apply across the specified operating ranges unless noted VDD = +27V to 55V VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
LATx pin pulse width tLAT 20 mdash mdash ns
DS20006089B-page 16 2018-2019 Microchip Technology Inc
MCP47CXBXX
12 I2C Mode Timing Waveforms and Requirements
FIGURE 1-3 Power-on and Brown-out Reset Waveforms
FIGURE 1-4 I2C Power-Down Command Timing
VDD
tBORD
VOUT
VBOR
VOUT at High-Z
SPI Interface is Operational
VPOR
tPOR2SIA = tPOR2OD
SDA
SCL
ACK Stop Start ACK
VOUT
tPDD tPDE
TABLE 1-3 RESET TIMING
Timing Characteristics
Standard Operating Conditions (unless otherwise specified)Operating Temperature -40degC TA +125degC (Extended)
All parameters apply across the specified operating ranges unless noted VDD = +27V to 55V VSS = 0V RL = 2 k from VOUT to GND CL = 100 pF Typical specifications represent values for VDD = 55V TA = +25degC
Parameters Sym Min Typ Max Units Conditions
Power-on Reset Delay(1) tPOR2SIA mdash mdash 130 micros Single Monitor ACK bit response to ensure the device responds to commandmdash mdash 145 Dual
Brown-out Reset Delay tBORD mdash 30 mdash micros VDD transitions from VDD(MIN) gt VPOR VOUT driven to VOUT disabled
Power-Down Output Enable Time Delay
TPDE mdash 15 mdash micros PDxBPDxA = 11 10 or 01 00 started from the rising edge of the SCL at the end of the 8th clock cycle Volatile DAC register = FFFh VOUT = 10 mV VOUT not connected
Power-Down Output Disable Time Delay
TPDD mdash 0025 mdash micros PDxBPDxA = 00 11 10 or 01 started from the rising edge of the SCL at the end of the 8th clock cycle VOUT = VOUT ndash 10 mVVOUT not connected
Note 1 Not tested This parameter is ensured by characterization
2018-2019 Microchip Technology Inc DS20006089B-page 17
MCP47CXBXX
FIGURE 1-5 I2C Bus StartStop Bits and HVC Timing Waveforms
SCL
SDA
StartCondition
StopCondition
VIH
111
VIL
VIH VIHH
VIHHVC94
Note 1 The HVC pin must be at VIHH until the MTP write cycle is complete
9091 93
92
DS20006089B-page 18 2018-2019 Microchip Technology Inc
MCP47CXBXX
TABLE 1-4 I2C BUS STARTSTOP BITS AND LAT REQUIREMENTS
I2C AC CharacteristicsStandard Operating Conditions (unless otherwise specified)Operating Temperature -40C TA +125C (Extended) The operating voltage range is described in DC Characteristics
Param No
Sym Characteristic Min Max Units Conditions
mdash FSCL SCL Pin Frequency Standard mode 0 100 kHz Cb = 400 pF 18V-55V(1)
Fast mode 0 400 kHz Cb = 400 pF 27V-55V
High Speed 17 0 17 MHz Cb = 400 pF 45V-55V(1)
High Speed 34 0 34 MHz Cb = 100 pF 45V-55V(1)
90 TSUSTA Start Condition Setup Time(only relevant for Repeated Start condition)
100 kHz mode 4700 mdash ns Note 1
400 kHz mode 600 mdash ns
17 MHz mode 160 mdash ns Note 1
34 MHz mode 160 mdash ns
91 THDSTA Start ConditionHold Time(after this period the first clock pulse is generated)
100 kHz mode 4000 mdash ns Note 1
400 kHz mode 600 mdash ns
17 MHz mode 160 mdash ns Note 1
34 MHz mode 160 mdash ns
92 TSUSTO Stop ConditionSetup Time
100 kHz mode 4000 mdash ns Note 1
400 kHz mode 600 mdash ns
17 MHz mode 160 mdash ns Note 1
34 MHz mode 160 mdash ns
93 THDSTO Stop ConditionHold Time
100 kHz mode 4000 mdash ns Note 1
400 kHz mode 600 mdash ns
17 MHz mode 160 mdash ns Note 1
34 MHz mode 160 mdash ns
94 THVCSU HVC High to Start Condition(setup time)
0 mdash micros Not tested specification ensured by Master
Note 1 Not tested This parameter is ensured by characterization
2018-2019 Microchip Technology Inc DS20006089B-page 19
MCP47CXBXX
FIGURE 1-6 I2C Bus Data Timing Waveforms
TABLE 1-5 I2C BUS REQUIREMENTS (SLAVE MODE)
I2C AC CharacteristicsStandard Operating Conditions (unless otherwise specified)Operating Temperature -40C TA +125C (Extended) The operating voltage range is described in DC Characteristics
Param No
Sym Characteristic Min Max Units Conditions
100 THIGH Clock High Time 100 kHz mode 4000 mdash ns 18V-55V(1)
400 kHz mode 600 mdash ns 27V-55V
17 MHz mode 120 mdash ns 45V-55V(1)
34 MHz mode 60 mdash ns 45V-55V(1)
101 TLOW Clock Low Time 100 kHz mode 4700 mdash ns 18V-55V(1)
400 kHz mode 1300 mdash ns 27V-55V
17 MHz mode 320 mdash ns 45V-55V(1)
34 MHz mode 160 mdash ns 45V-55V(1)
102A(10) TRSCL SCL Rise Time 100 kHz mode mdash 1000 ns Cb is specified to be from 10 to 400 pF (100 pF maximum for 34 MHz mode)
400 kHz mode 20 + 01Cb(4) 300 ns
17 MHz mode 20 80 ns
17 MHz mode 20 160 ns After a Repeated Start condition or an Acknowledge bit
34 MHz mode 10 40 ns
34 MHz mode 10 80 ns After a Repeated Start condition or an Acknowledge bit
102B(10) TRSDA SDA Rise Time 100 kHz mode mdash 1000 ns Cb is specified to be from 10 to 400 pF (100 pF maximum for 34 MHz mode)
400 kHz mode 20 + 01Cb 300 ns
17 MHz mode 20 160 ns
34 MHz mode 10 80 ns
103A(10) TFSCL SCL Fall Time 100 kHz mode mdash 300 ns Cb is specified to be from 10 to 400 pF (100 pF maximum for 34 MHz mode)(4)
400 kHz mode 20 + 01Cb 300 ns
17 MHz mode 20 80 ns
34 MHz mode 10 40 ns
Note 1 Not tested This parameter is ensured by characterization
Note 4 Use Cb in pF for the calculations
Note 10 Not tested This parameter is ensured by design
9091 92
100101
103
106107
109 109 110
102
SCL
SDA In
SDA Out
DS20006089B-page 20 2018-2019 Microchip Technology Inc
MCP47CXBXX
TABLE 1-5 I2C BUS REQUIREMENTS (SLAVE MODE) (CONTINUED)
I2C AC CharacteristicsStandard Operating Conditions (unless otherwise specified)Operating Temperature -40C TA +125C (Extended) The operating voltage range is described in DC Characteristics
Param No
Sym Characteristic Min Max Units Conditions
103B(10) TFSDA SDA Fall Time 100 kHz mode mdash 300 ns Cb is specified to be from 10 to 400 pF (100 pF maximum for 34 MHz mode)(4)
400 kHz mode 20 + 01Cb 300 ns
17 MHz mode 20 160 ns
34 MHz mode 10 80 ns
106 THDDAT Data Input Hold Time
100 kHz mode 0 mdash ns 18V-55V(15)
400 kHz mode 0 mdash ns 27V-55V(5)
17 MHz mode 0 mdash ns 45V-55V(15)
34 MHz mode 0 mdash ns 45V-55V(15)
107 TSUDAT Data Input Setup Time
100 kHz mode 250 mdash ns Notes 1 6
400 kHz mode 100 mdash ns Note 6
17 MHz mode 10 mdash ns Notes 1 6
34 MHz mode 10 mdash ns Notes 1 6
109 TAA Output Valid from Clock
100 kHz mode mdash 3450 ns Notes 1 5 7 9
400 kHz mode mdash 900 ns Notes 5 7 9
17 MHz mode mdash 310 ns Cb = 400 pF(19)
34 MHz mode mdash 150 ns Cb = 100 pF(19)
110 TBUF Bus Free Time 100 kHz mode 4700 mdash ns Time the bus must be free before a new transmission can start(1)
400 kHz mode 1300 mdash ns
17 MHz mode NA mdash ns
34 MHz mode NA mdash ns
111 TSP Input Filter Spike Suppression (SDA and SCL)
100 kHz mode mdash 50 ns NXP Spec states NA(1)
400 kHz mode mdash 50 ns NXP Spec states NA
17 MHz mode mdash 10 ns NXP Spec states NA(1)
34 MHz mode mdash 10 ns NXP Spec states NA(1)
Note 1 Not tested This parameter is ensured by characterization
Note 4 Use Cb in pF for the calculations
Note 5 A Master transmitter must provide a delay to ensure that the difference between SDA and SCL fall times doesnot unintentionally create a Start or Stop condition
Note 6 A Fast mode (400 kHz) I2C bus device can be used in a Standard mode (100 kHz) I2C bus system but therequirement tSUDAT 250 ns must then be met This will automatically be the case if the device does notstretch the Low period of the SCL signal If such a device does stretch the Low period of the SCL signal itmust output the next data bit to the SDA line TR max+ tSUDAT = 1000 + 250 = 1250 ns (according to theStandard mode I2C bus specification) before the SCL line is released
Note 7 As a transmitter the device must provide this internal minimum delay time to bridge the undefined region(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions
Note 8 Ensured by the TAA 34 MHz specification test
Note 9 The specification is not part of the I2C specification TAA = THDDAT + TFSDA (or TRSDA)
Note 10 Not tested This parameter is ensured by design
2018-2019 Microchip Technology Inc DS20006089B-page 21
MCP47CXBXX
Timing Notes
1 Not tested This parameter is ensured by characterization
2 Within 12 LSb of final value when code changes from 14 to 34 of FSR
3 The transition of the LAT signal between 10 ns before the rising edge (Spec 94) and 250 ns after the rising edge (Spec 95) of the SCL signal is indeterminate whether the change in VOUT is delayed or not
4 Use Cb in pF for the calculations
5 A Master transmitter must provide a delay to ensure that the difference between SDA and SCL fall times does not unintentionally create a Start or Stop condition
6 A Fast mode (400 kHz) I2C bus device can be used in a Standard mode (100 kHz) I2C bus system but the requirement tSUDAT 250 ns must then be met This will automatically be the case if the device does not stretch the Low period of the SCL signal If such a device does stretch the Low period of the SCL signal it must output the next data bit to the SDA line TR max+ tSUDAT = 1000 + 250 = 1250 ns (according to the Standard mode I2C bus specification) before the SCL line is released
7 As a transmitter the device must provide this internal minimum delay time to bridge the undefined region (minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions
8 Ensured by the TAA 34 MHz specification test
9 The specification is not part of the I2C specification TAA = THDDAT + TFSDA (or TRSDA)
10 Not tested This parameter is ensured by design
DS20006089B-page 22 2018-2019 Microchip Technology Inc
MCP47CXBXX
TEMPERATURE SPECIFICATIONS
Electrical Specifications Unless otherwise indicated VDD = +27V to +55V VSS = GND
Parameters Sym Min Typical Max Units Conditions
Temperature Ranges
Specified Temperature Range TA -40 mdash +125 degC
Operating Temperature Range TA -40 mdash +125 degC
Storage Temperature Range TA -65 mdash +150 degC
Thermal Package Resistances
Thermal Resistance 10L-MSOP JA mdash 206 mdash degCW
Thermal Resistance 10L-DFN (3x3) JA mdash 91 mdash degCW
Thermal Resistance 16L-QFN (3x3) JA mdash 58 mdash degCW
2018-2019 Microchip Technology Inc DS20006089B-page 23
MCP47CXBXX
NOTES
DS20006089B-page 24 2018-2019 Microchip Technology Inc
MCP47CXBXX
20 TYPICAL PERFORMANCE CURVES
21 Electrical DataNote Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-1 Average Device Supply Current vs FSCL Frequency Voltage and Temperature ndash Active Interface VRxBVRxA = 00 (VDD Mode)
FIGURE 2-2 Average Device Supply Current vs FSCL Frequency Voltage and Temperature ndash Active Interface VRxBVRxA = 01 (Band Gap Mode)
FIGURE 2-3 Average Device Supply Current vs FSCL Frequency Voltage and Temperature ndash Active Interface VRxBVRxA = 11 (VREF Buffered Mode)
FIGURE 2-4 Average Device Supply Current ndash Inactive Interface (SCL = VIH or VIL) vs Voltage and Temperature VRxBVRxA = 00 (VDD Mode)
FIGURE 2-5 Average Device Supply Current ndash Inactive Interface (SCL = VIH or VIL) vs Voltage and Temperature VRxBVRxA = 01 (Band Gap Mode)
FIGURE 2-6 Average Device Supply Current ndash Inactive Interface (SCL = VIH or VIL) vs Voltage and Temperature VRxBVRxA = 11 (VREF Buffered Mode)
Note The graphs and tables provided following this note are a statistical summary based on a limited number ofsamples and are provided for informational purposes only The performance characteristics listed hereinare not tested or guaranteed In some graphs or tables the data presented may be outside the specifiedoperating range (eg outside specified power supply range) and therefore outside the warranted range
2018-2019 Microchip Technology Inc DS20006089B-page 25
MCP47CXBXX
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-7 Average Device Supply Current vs FSCL Frequency Voltage and Temperature ndash Active Interface VRxBVRxA = 10 (VREF Unbuffered Mode)
FIGURE 2-8 Average Device Supply Active Current (IDDA) (at 55V and FSCL = 34 MHz) vs Temperature and DAC Reference Voltage Mode
FIGURE 2-9 Average Device Supply Current ndash Inactive Interface (SCL = VIH or VIL) vs Voltage and Temperature VRxBVRxA = 10 (VREF Unbuffered Mode)
DS20006089B-page 26 2018-2019 Microchip Technology Inc
MCP47CXBXX
22 Linearity Data
221 TOTAL UNADJUSTED ERROR (TUE) ndash MCP47CXB2X (12-BIT) VREF = VDD (VRXBVRXA = 10) GAIN = 1x CODE 64-4032
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-10 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V
FIGURE 2-11 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V
FIGURE 2-12 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V
FIGURE 2-13 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V
FIGURE 2-14 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V
FIGURE 2-15 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V
2018-2019 Microchip Technology Inc DS20006089B-page 27
MCP47CXBXX
222 INTEGRAL NONLINEARITY (INL) ndash MCP47CXB2X (12-BIT) VREF = VDD (VRXBVRXA = 10) GAIN = 1x CODE 64-4032
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-16 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V
FIGURE 2-17 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V
FIGURE 2-18 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V
FIGURE 2-19 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V
FIGURE 2-20 INL Error vs DAC Code and Temperature (Code 100-4000) (Dual Channel ndash MCP47CXB22) VDD = 27V
FIGURE 2-21 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V
DS20006089B-page 28 2018-2019 Microchip Technology Inc
MCP47CXBXX
223 DIFFERENTIAL NONLINEARITY (DNL) ndash MCP47CXB2X (12-BIT) VREF = VDD (VRXBVRXA = 10) GAIN = 1x CODE 64-4032
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-22 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V
FIGURE 2-23 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V
FIGURE 2-24 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V
FIGURE 2-25 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V
FIGURE 2-26 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V
FIGURE 2-27 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V
2018-2019 Microchip Technology Inc DS20006089B-page 29
MCP47CXBXX
224 TOTAL UNADJUSTED ERROR (TUE) ndash MCP47CXB2X (12-BIT) EXTERNAL VREF = 05 VDD (VRXBVRXA = 10) UNBUFFERED CODE 64-4032
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-28 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VREF = 05 x VDD = 275V Gain = 2x
FIGURE 2-29 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VREF = 05 x VDD = 135V Gain = 2x
FIGURE 2-30 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VREF = 05 x VDD = 275V Gain = 2x
FIGURE 2-31 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VREF = 05 x VDD = 135V Gain = 2x
DS20006089B-page 30 2018-2019 Microchip Technology Inc
MCP47CXBXX
225 INTEGRAL NONLINEARITY (INL) ndash MCP47CXB2X (12-BIT) EXTERNAL VREF = 05 VDD (VRXBVRXA = 10) UNBUFFERED CODE 64-4032
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-32 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VREF = 05 x VDD = 275V Gain = 2x
FIGURE 2-33 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VREF = 05 x VDD = 135V Gain = 2x
FIGURE 2-34 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VREF = 05 x VDD = 275V Gain = 2x
FIGURE 2-35 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VREF = 05 x VDD = 135V Gain = 2x
2018-2019 Microchip Technology Inc DS20006089B-page 31
MCP47CXBXX
226 DIFFERENTIAL NONLINEARITY ERROR (DNL) ndash MCP47CXB2X (12-BIT) EXTERNAL VREF = 05 VDD (VRXBVRXA = 10) UNBUFFERED CODE 64-4032
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-36 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V VREF = 05 x VDD = 275V
FIGURE 2-37 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V VREF = 05 x VDD = 135V
FIGURE 2-38 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V VREF = 05 x VDD = 275V
FIGURE 2-39 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V VREF = 05 x VDD = 135V
DS20006089B-page 32 2018-2019 Microchip Technology Inc
MCP47CXBXX
227 TOTAL UNADJUSTED ERROR (TUE) ndash MCP47CXB2X (12-BIT) VREF = INTERNAL BAND GAP (VRXBVRXA = 01) CODE 64-4032
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-40 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 1x
FIGURE 2-41 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 2x
FIGURE 2-42 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 1x
FIGURE 2-43 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 1x
FIGURE 2-44 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 2x
FIGURE 2-45 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 1x
2018-2019 Microchip Technology Inc DS20006089B-page 33
MCP47CXBXX
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-46 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 2x
FIGURE 2-47 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V Gain = 1x
FIGURE 2-48 Total Unadjusted Error (VOUT) vs DAC Code 25degC Gain = 1x
FIGURE 2-49 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 2x
FIGURE 2-50 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V Gain = 1x
FIGURE 2-51 Total Unadjusted Error (VOUT) vs DAC Code 25degC Gain = 2x
DS20006089B-page 34 2018-2019 Microchip Technology Inc
MCP47CXBXX
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-52 Total Unadjusted Error (VOUT) vs DAC Code +25degC Gain = 1x and 2x
2018-2019 Microchip Technology Inc DS20006089B-page 35
MCP47CXBXX
228 INTEGRAL NONLINEARITY ERROR (INL) ndash MCP47CXB2X (12-BIT) VREF = INTERNAL BAND GAP (VRXBVRXA = 01) CODE 64-4032
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-53 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 1x
FIGURE 2-54 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 2x
FIGURE 2-55 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 1x
FIGURE 2-56 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 1x
FIGURE 2-57 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 2x
FIGURE 2-58 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 1x
DS20006089B-page 36 2018-2019 Microchip Technology Inc
MCP47CXBXX
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-59 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 2x
FIGURE 2-60 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V Gain = 1x
FIGURE 2-61 INL Error vs DAC Code +25degC Gain = 1x
FIGURE 2-62 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 2x
FIGURE 2-63 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V Gain = 1x
FIGURE 2-64 INL Error vs DAC Code +25degC Gain = 2x
2018-2019 Microchip Technology Inc DS20006089B-page 37
MCP47CXBXX
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-65 INL Error vs DAC Code +25degC Gain = 1x and 2x
DS20006089B-page 38 2018-2019 Microchip Technology Inc
MCP47CXBXX
229 DIFFERENTIAL NONLINEARITY ERROR (DNL) ndash MCP47CXB2X (12-BIT) VREF = INTERNAL BAND GAP (VRXBVRXA = 01) CODE 64-4032
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-66 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 1x
FIGURE 2-67 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 2x
FIGURE 2-68 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 1x
FIGURE 2-69 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 1x
FIGURE 2-70 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 2x
FIGURE 2-71 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 1x
2018-2019 Microchip Technology Inc DS20006089B-page 39
MCP47CXBXX
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-72 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 2x
FIGURE 2-73 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V Gain = 1x
FIGURE 2-74 DNL Error vs DAC Code +25degC Gain = 1x
FIGURE 2-75 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 2x
FIGURE 2-76 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V Gain = 1x
FIGURE 2-77 DNL Error vs DAC Code +25degC Gain = 2x
DS20006089B-page 40 2018-2019 Microchip Technology Inc
MCP47CXBXX
Note Unless otherwise indicated TA = +25degC VDD = 55V
FIGURE 2-78 DNL Error vs DAC Code +25degC Gain = 1x and 2x
2018-2019 Microchip Technology Inc DS20006089B-page 41
MCP47CXBXX
NOTES
DS20006089B-page 42 2018-2019 Microchip Technology Inc
MCP47CXBXX
30 PIN DESCRIPTIONS
Overviews of the pin functions are provided inSection 31 ldquoPositive Power Supply Input (VDD)rdquothrough Section 39 ldquoNo Connect (NC)rdquo
The descriptions of the pins for the single DAC outputdevice are listed in Table 3-1 and descriptions for thedual DAC output device are listed in Table 3-2
TABLE 3-1 MCP47CXBX1 (SINGLE DAC) PIN FUNCTION TABLE
Pin
Symbol IOBuffer Type
DescriptionMSOP10L
DFN10L
QFN16L
1 1 16 VDD mdash P Supply Voltage Pin
2 2 1 A0 I ST I2C Slave Address Bit 0 Pin
3 3 2 VREF A Analog Voltage Reference InputOutput Pin
4 4 3 VOUT A Analog Buffered Analog Voltage Output Pin
5 5 456781415
NC mdash mdash Not Internally Connected
6 6 9 LATHVC I ST DAC Wiper Register LatchHigh-Voltage Command Pin
The Latch pin allows the value in the Volatile DAC registers (Wiper and Configuration bits) to be transferred to the DAC output (VOUT)
High-voltage commands allow the user MTP Configuration bits to be written
7 7 10 VSS mdash P Ground Reference Pin for all circuitries on the device
8 8 11 A1 I ST I2C Slave Address Bit 1 Pin
9 9 12 SCL I ST I2C Serial Clock Pin
10 10 13 SDA IO ST I2C Serial Data Pin
mdash mdash 17 EP mdash P Exposed Thermal Pad Pin must be connected to VSS
Note 1 A = Analog I = Input ST = Schmitt Trigger O = Output IO = InputOutput P = Power
2018-2019 Microchip Technology Inc DS20006089B-page 43
MCP47CXBXX
TABLE 3-2 MCP47CXBX2 (DUAL DAC) PIN FUNCTION TABLE
Pin
Symbol IOBuffer Type
DescriptionMSOP10L
DFN10L
QFN16L
1 1 16 VDD mdash P Supply Voltage Pin
2 2 1 A0 I ST I2C Slave Address Bit 0 Pin
3 3 mdash VREF A Analog Voltage Reference InputOutput Pin
mdash mdash 2 VREF0 A Analog Voltage Reference InputOutput Pin for DAC0
mdash mdash 4 VREF1 A Analog Voltage Reference InputOutput Pin for DAC1
4 4 3 VOUT0 A Analog Buffered Analog Voltage Output 0 Pin
5 5 5 VOUT1 A Analog Buffered Analog Voltage Output 1 Pin
mdash mdash 671415
NC mdash mdash Not Internally Connected
6 6 mdash LATHVC I ST DAC Wiper Register LatchHigh-Voltage Command Pin
The Latch pin allows the value in the Volatile DAC registers (Wiper and Configuration bits) to be transferred to the DAC output (VOUT)
High-voltage commands allow the user MTP Configuration bits to be written
mdash mdash 9 LAT0HVC I ST DAC0 Wiper Register LatchHigh-Voltage Command Pin
The Latch pin allows the value in the Volatile DAC0 registers (Wiper and Configuration bits) to be transferred to the DAC0 output (VOUT0)
High-voltage commands allow the user MTP Configuration bits to be written
mdash mdash 8 LAT1 I ST DAC1 Wiper Register Latch Pin
The Latch pin allows the value in the Volatile DAC1 registers (Wiper and Configuration bits) to be transferred to the DAC1 output (VOUT1)
7 7 10 VSS mdash P Ground Reference Pin for all circuitries on the device
8 8 11 A1 I ST I2C Slave Address Bit 1 Pin
9 9 12 SCL I ST I2C Serial Clock Pin
10 10 13 SDA IO ST I2C Serial Data Pin
Note 1 A = Analog I = Input ST = Schmitt Trigger O = Output IO = InputOutput P = Power
DS20006089B-page 44 2018-2019 Microchip Technology Inc
MCP47CXBXX
31 Positive Power Supply Input (VDD)
VDD is the positive supply voltage input pin The inputsupply voltage is relative to VSS
The power supply at the VDD pin should be as clean aspossible for good DAC performance It is recom-mended to use an appropriate bypass capacitor ofabout 01 microF (ceramic) to ground as close as possibleto the pin An additional 10 microF capacitor (tantalum) inparallel is also recommended to further attenuate noisepresent in application boards
32 Ground (VSS)
The VSS pin is the device ground reference
The user must connect the VSS pin to a ground planethrough a low-impedance connection If an analogground path is available in the application PCB (PrintedCircuit Board) it is highly recommended that the VSS
pin be tied to the analog ground path or isolated withinan analog ground plane of the circuit board
33 Voltage Reference Pin (VREF)
The VREF pin is either an input or an output When theDACrsquos voltage reference is configured as the VREF pinthe pin is an input When the DACrsquos voltage reference isconfigured as the internal band gap the pin is an output
When the DACrsquos voltage reference is configured as theVREF pin there are two options for this voltage inputVREF pin voltage is buffered or unbuffered Thebuffered option is offered in cases where the externalreference voltage does not have sufficient currentcapability to not drop its voltage when connected to theinternal resistor ladder circuit
When the DACrsquos voltage reference is configured as thedevice VDD the VREF pin is disconnected from theinternal circuit
When the DACrsquos voltage reference is configured as theinternal band gap the VREF pinrsquos drive capability isminimal so the output signal should be buffered
See Section 52 ldquoVoltage Reference Selectionrdquo andRegister 4-2 for more details on the Configuration bits
34 Analog Output Voltage Pins (VOUT0 VOUT1)
VOUT0 and VOUT1 are the DAC analog voltage outputpins Each DAC output has an output amplifier The DACoutput range is dependent on the selection of the voltagereference source (and potential output gain selection)These are
bull Device VDD ndash The Full-Scale Range (FSR) of the DAC output is from VSS to approximately VDD
bull VREF pin ndash The Full-Scale Range of the DAC output is from VSS to G x VRL where G is the gain selection option (1x or 2x)
bull Internal Band Gap ndash The Full-Scale Range of the DAC output is from VSS to G X VBG where G is the gain selection option (1x or 2x)
In Normal mode the DC impedance of the output pin isabout 1 In Power-Down mode the output pin isinternally connected to a known pull-down resistor of1 k 100 k or open The power-down selection bitssettings are shown in Register 4-3 (Table 5-5)
35 LatchHigh-Voltage Command Pin (LATHVC)
The DAC output value update event can be controlledand synchronized using the LAT pin for one or bothchannels on single or different devices
The LAT pin controls the effect of the Volatile Wiperregisters VRxBVRxA and PDxBPDxA and the Gx bitson the DAC output If the LAT pin is held at VIH thevalues sent to the Volatile Wiper registers and Configu-ration bits have no effect on the DAC outputs After theVolatile Wiper registers and Configuration bits havebeen loaded with the desired data once the voltage onthe pin transitions to VIL the values in the Volatile Wiperregisters and Configuration bits are transferred to theDAC outputs Pulsing LAT low during writes to theregisters could lead to unpredictable DAC output voltagevalues until the next pulse is issued and should beavoided The pin is level-sensitive so writing to theVolatile Wiper registers and Configuration bits while it isbeing held at VIL will trigger an immediate change in theoutputs
For dual output devices in MSOP and DFN packagesthe LAT pin controls both channels at the same timeThe HVC pin allows the devicersquos MTP memory to beprogrammed for the MCP47CMBXX devices Theprogramming voltage supply should provide 75V andat least 64 mA
Note The HVC pin should have voltagesgreater than 55V present only during theMTP programming operation Usingvoltages greater than 55V for anextended time on the pin may causedevice reliability issues
2018-2019 Microchip Technology Inc DS20006089B-page 45
MCP47CXBXX
36 I2C ndash Serial Clock Pin (SCL)
The SCL pin is the serial clock pin of the I2C interfaceThe MCP47CXBXX I2C interface only acts as a Slaveand the SCL pin accepts only external serial clocksThe input data from the Master device are shifted intothe SDA pin on the rising edges of the SCL clock andoutput from the device occurs at the falling edges of theSCL clock The SCL pin is an open-drain N-channeldriver Therefore it needs an external pull-up resistorfrom the VDD line to the SCL pin Refer to Section 60ldquoI2C Serial Interface Modulerdquo for more details on theI2C serial interface communication
37 I2C ndash Serial Data Pin (SDA)
The SDA pin is the serial data pin of the I2C interfaceThe SDA pin is used to write or read the DAC registersand Configuration bits The SDA pin is an open-drainN-channel driver Therefore it needs an externalpull-up resistor from the VDD line to the SDA pin Exceptfor Start and Stop conditions the data on the SDA pinmust be stable during the high period of the clock Thehigh or low state of the SDA pin can only change whenthe clock signal on the SCL pin is low See Section 60ldquoI2C Serial Interface Modulerdquo
38 I2C Slave Address Pins (A0A1)
The state of these pins will determine the devicersquos I2CSlave Address bit 0 value (overriding the ADD0 bit andthe ADD1 bit in Register 4-5)
39 No Connect (NC)
The NC pin is not internally connected to the device
DS20006089B-page 46 2018-2019 Microchip Technology Inc
MCP47CXBXX
40 GENERAL DESCRIPTION
The MCP47CXBX1 (MCP47CXB01 MCP47CXB11and MCP47CXB21) devices are single-channel voltageoutput devices
MCP47CXBX2 (MCP47CXB02 MCP47CXB12 andMCP47CXB22) are dual channel voltage output devices
These devices are offered with 8-bit (MCP47CXB0X)10-bit (MCP47CXB1X) and 12-bit (MCP47CXB2X)resolutions
The family offers two memory options theMCP47CVBXX devices have volatile memory whilethe MCP47CMBXX have 32-times programmablenonvolatile memory (MTP)
All devices include an I2C serial interface and a writelatch (LAT) pin to control the update of the analog out-put voltage value from the value written in the VolatileDAC Output register
The devices use a resistor ladder architecture Theresistor ladder DAC is driven from a software-selectable voltage reference source The source canbe either the devicersquos internal VDD an external VREFpin voltage (buffered or unbuffered) or an internalband gap voltage source
The DAC output is buffered with a low-power andprecision output amplifier This output amplifier pro-vides a rail-to-rail output with low offset voltage andlow noise The gain (1x or 2x) of the output buffer issoftware configurable
The devices operate from a single supply voltage Thisvoltage is specified from 27V to 55V for full specifiedoperation and from 18V to 55V for digital operationThe device operates between 18V and 27V butsome device parameters are not specified
The MCP47CMBXX devices also have user-programmable nonvolatile configuration memory(MTP) This allows the devicersquos desired POR values tobe saved or the I2C address to be changed Thedevice also has general purpose MTP memorylocations for storing system-specific information(calibration data serial numbers system ID informa-tion) A high-voltage requirement for programming onthe HVC pin ensures that these device settings are notaccidentally modified during normal system operationTherefore it is recommended that the MTP memoryshould only be programmed at the userrsquos factory
The main functional blocks are
bull Power-on ResetBrown-out Reset (PORBOR)
bull Device Memory
bull Resistor Ladder
bull Output BufferVOUT Operation
bull I2C Serial Interface Module
41 Power-on ResetBrown-out Reset (PORBOR)
The internal Power-on Reset (POR)Brown-out Reset(BOR) circuit monitors the power supply voltage (VDD)during operation This circuit ensures correct devicestart-up at system power-up and power-down events
The devicersquos RAM Retention Voltage (VRAM) is lowerthan the PORBOR Voltage Trip Point (VPORVBOR)The maximum VPORVBOR voltage is less than 18V
The POR and BOR trip points are at the same voltageand the condition is determined by whether the VDDvoltage is rising or falling (see Figure 4-1) What occursis different depending on whether the Reset is a PORor BOR Reset
POR occurs as the voltage rises (typically from 0V)while BOR occurs as the voltage falls (typically fromVDD(MIN) or higher)
When VPORVBOR lt VDD lt 27V the electrical perfor-mance may not meet the data sheet specifications Inthis region the device is capable of reading and writingto its volatile memory if the proper serial command isexecuted
411 POWER-ON RESET
The Power-on Reset is the case where the devicersquosVDD has power applied to it from the VSS voltage levelAs the device powers up the VOUT pin floats to anunknown value When the devicersquos VDD is above thetransistor threshold voltage of the device the outputstarts to be pulled low
After the VDD is above the PORBOR trip point(VBORVPOR) the resistor networkrsquos wiper is loadedwith the POR value The POR value is either mid-scale(MCP47CVBXX) or the userrsquos MTP programmed value(MCP47CMBXX)
Note In order to have the MCP47CMBXXdevices load the values from nonvolatilememory locations at POR they have to beprogrammed at least once by the userotherwise the loaded values will be thedefault ones After MTP programming aPOR event is required to load the writtenvalues from the nonvolatile memory
2018-2019 Microchip Technology Inc DS20006089B-page 47
MCP47CXBXX
Volatile memory determines the Analog Output (VOUT)pin voltage After the device is powered up the usercan update the device memory
When the rising VDD voltage crosses the VPOR trippoint the following occur
bull The default DAC POR value is latched into the Volatile DAC register
bull The default DAC POR Configuration bit values are latched into the Volatile Configuration bits
bull POR status bit is set (lsquo1rsquo)bull The Reset Delay Timer (tPORD) starts when the
Reset Delay Timer (tPORD) times out the I2C serial interface is operational During this delay time the I2C interface will not accept commands
bull The Device Memory Address Pointer is forced to 00h
The Analog Output (VOUT) state is determined by thestate of the Volatile Configuration bits and the DACregister This is called a Power-on Reset (event)
Figure 4-1 illustrates the conditions for power-up andpower-down events under typical conditions
FIGURE 4-1 Power-on Reset Operation
VPOR
TPORD2OD
VDD(MIN)
BOR Reset Volatile DAC Register = 000hVolatile VRxBVRxA = 00
VRAM
Volatile Gx = 0 Volatile PDxBPDxA = 11
VBOR
POR starts Reset Delay TimerWhen timer times out the I2C interfacecan operate (if VDD VDD(MIN))
VDD(MIN)
TPOR2OD
VBOR VPOR
VRAM
Case 1 VDD Ramp
Case 2 VDD Step
Volatile MemoryRetains Data Value
POR ResetForce Active
Device in Unknown Devicein PORState
Normal OperationState
Below MinOperatingVoltage
Device inPower-Down State
Device inUnknownState
Default device configurationlatched into Volatile Configurationbits and DAC registerPOR status bit is set (lsquo1rsquo)
Volatile Memorybecomes Corrupted
Volatile Memorybecomes Corrupted
Device inPower-Down State
Device inUnknownState
Normal Operation Below MinOperatingVoltage
Device in UnknownState
Device inKnown State
Volatile MemoryRetains Data Value
POR Event
DS20006089B-page 48 2018-2019 Microchip Technology Inc
MCP47CXBXX
412 BROWN-OUT RESET
A Brown-out Reset occurs when a device had powerapplied to it and that power (voltage) drops below thespecified range
When the falling VDD voltage crosses the VPOR trippoint (BOR event) the following occurs
bull Serial interface is disabled
bull MTP writes are disabled
bull Device is forced into a power-down state (PDxBPDxA = 11) Analog circuitry is turned off
bull Volatile DAC register is forced to 000h
Volatile Configuration bits VRxBVRxA and Gx areforced to lsquo0rsquo
If the VDD voltage decreases below the VRAM voltageall volatile memory may become corrupted
As the voltage recovers above the VPORVBOR voltagesee Section 411 ldquoPower-on Resetrdquo for further details
Serial commands not completed due to a brown-outcondition may cause the memory location to becomecorrupted
Figure 4-1 illustrates the conditions for power-up andpower-down events under typical conditions
42 Device Memory
User memory includes the following types
bull Volatile Register Memory (RAM)bull Nonvolatile Register Memory (MTP)
MTP memory is present just for the MCP47CMBXXdevices and has three groupings
bull NV DAC Output Values (loaded on POR event)
bull Device Configuration Memory
bull General Purpose NV Memory
Each memory location is up to 16 bits wide Thememory-mapped register space is shown in Table 4-1
The I2C interface depends on how this memory is readand written Refer to Section 60 ldquoI2C Serial InterfaceModulerdquo and Section 70 ldquoDevice Commandsrdquo formore details on reading and writing the devicersquosmemory
421 VOLATILE REGISTER MEMORY (RAM)
The MCP47CXBXX devices have volatile memory todirectly control the operation of the DACs There areup to five volatile memory locations
bull DAC0 and DAC1 Output Value registers
bull VREF Select register
bull Power-Down Configuration register
bull Gain and Status register
The volatile memory starts functioning when thedevice VDD is at (or above) the RAM retention voltage(VRAM) The volatile memory will be loaded with thedefault device values when the VDD rises across theVPORVBOR voltage trip point
After the device is powered-up the user can update thedevice memory Table 4-2 shows the volatile memorylocations and their interaction due to a POR event
2018-2019 Microchip Technology Inc DS20006089B-page 49
MCP47CXBXX
TABLE 4-1 MCP47CXBXX MEMORY MAP (16-BIT)A
dd
res
s
Function
Sin
gle
Du
al
Ad
dre
ss
Function
Sin
gle
(1)
Du
al(1
)
00h Volatile DAC Wiper Register 0 Y Y 10h Nonvolatile DAC Wiper Register 0 Y Y
01h Volatile DAC Wiper Register 1 mdash Y 11h Nonvolatile DAC Wiper Register 1 mdash Y
02h Reserved mdash mdash 12h Reserved mdash mdash
03h Reserved mdash mdash 13h Reserved mdash mdash
04h Reserved mdash mdash 14h Reserved mdash mdash
05h Reserved mdash mdash 15h Reserved mdash mdash
06h Reserved mdash mdash 16h Reserved mdash mdash
07h Reserved mdash mdash 17h Reserved mdash mdash
08h Volatile VREF Register Y Y 18h Nonvolatile VREF Register Y Y
09h Volatile Power-Down Register Y Y 19h Nonvolatile Power-Down Register Y Y
0Ah Volatile Gain and Status Register Y Y 1Ah NV Gain and I2C 7-Bit Slave Address Y Y
0Bh Reserved mdash mdash 1Bh NV WiperLocktrade Technology Register Y Y
0Ch General Purpose MTP (1) 1Ch General Purpose MTP (1)
0Dh General Purpose MTP (1) 1Dh General Purpose MTP (1)
0Eh General Purpose MTP (1) 1Eh General Purpose MTP (1)
0Fh General Purpose MTP (1) 1Fh General Purpose MTP (1)
Legend
Volatile Memory Addresses
MTP Memory Addresses
Memory Locations Not Implemented on this Device Family
Note 1 On nonvolatile memory devices only (MCP47CMBXX)
DS20006089B-page 50 2018-2019 Microchip Technology Inc
MCP47CXBXX
422 NONVOLATILE REGISTER MEMORY (MTP)
This memory option is available only for theMCP47CMBXX devices
MTP memory starts functioning below the devicersquosVPORVBOR trip point and once the VPOR eventoccurs the Volatile Memory registers are loaded withthe corresponding MTP register memory values
Memory addresses 0Ch through 1Fh are nonvolatilememory locations These registers contain the DACPORBOR wiper values the DAC PORBOR Configura-tion bits the I2C Slave address and eight generalpurpose memory addresses for storing user-defineddata as calibration constants or identification numbersThe Nonvolatile DAC Wiper registers and Configurationbits contain the userrsquos DAC Output and configurationvalues for the POR event
The Nonvolatile DAC Wiper registers contain the userrsquosDAC output and configuration values for the PORevent These nonvolatile values will overwrite thefactory default values If these MTP addresses areunprogrammed the factory default values define theoutput state
The Nonvolatile DAC registers enable the stand-aloneoperation of the device (without microcontroller control)after being programmed to the desired values
To program nonvolatile memory locations a high-voltage source on the LATHVC pin is required EachregisterMTP location can be programmed 32 timesAfter 32 writes a new write operation will not bepossible and the last successful value written willremain associated with the memory location
The device starts writing the MTP memory cells at thecompletion of the serial interface command at the risingedge of the last data bit The high voltage shouldremain present on the LATHVC pin until the write cycleis complete otherwise the write is unsuccessful andthe location is compromised (cannot be used again andthe number of available writes decreases by one)
To recover from an aborted MTP write operation thefollowing procedure must be used
bull Write again any valid value to the same address
bull Force a POR condition
bull Write again the desired value to the MTP location
It is recommended to keep high voltage on only duringthe MTP write command and programming cycleotherwise the reliability of the device could be affected
423 PORBOR OPERATION WITH WIPERLOCK TECHNOLOGY ENABLED
Regardless of the WiperLock technology state a PORevent will load the Volatile DACx Wiper register valuewith the Nonvolatile DACx Wiper register value Referto Section 41 ldquoPower-on ResetBrown-out Reset(PORBOR)rdquo for further information
424 UNIMPLEMENTED LOCATIONS
4241 Unimplemented Register Bits
When issuing read commands to a valid memory loca-tion with unimplemented bits the unimplemented bitswill be read as lsquo0rsquo
4242 Unimplemented (RESERVED) Locations
There are a number of unimplemented memorylocations that are reserved for future use Normal(voltage) commands (read or write) to any unimple-mented memory address will result in a commanderror condition (I2C NACK)
High-voltage commands to any unimplementedConfiguration bit(s) will also result in a command errorcondition
2018-2019 Microchip Technology Inc DS20006089B-page 51
MCP47CXBXX
TABLE 4-2 FACTORY DEFAULT PORBOR VALUES (MTP MEMORY UNPROGRAMMED)A
dd
ress
Function
PORBOR Value
Ad
dre
ss
Function
PORBOR Value
8-B
it
10-B
it
12-B
it
8-B
it
10-B
it
12-B
it
00h Volatile DAC0 Register 7Fh 1FFh 7FFh 10h Nonvolatile DAC0 Wiper Register(1)
7Fh 1FFh 7FFh
01h Volatile DAC1 Register 7Fh 1FFh 7FFh 11h Nonvolatile DAC1 Wiper Register(1)
7Fh 1FFh 7FFh
02h Reserved(3) mdash mdash mdash 12h Reserved(3) mdash mdash mdash
03h Reserved(3) mdash mdash mdash 13h Reserved(3) mdash mdash mdash
04h Reserved(3) mdash mdash mdash 14h Reserved(3) mdash mdash mdash
05h Reserved(3) mdash mdash mdash 15h Reserved(3) mdash mdash mdash
06h Reserved(3) mdash mdash mdash 16h Reserved(3) mdash mdash mdash
07h Reserved(3) mdash mdash mdash 17h Reserved(3) mdash mdash mdash
08h Volatile VREF Register 0000h 0000h 0000h 18h Nonvolatile VREF Register(1) 0000h 0000h 0000h
09h Volatile Power-Down Register
0000h 0000h 0000h 19h Nonvolatile Power-Down Register(1)
0000h 0000h 0000h
0Ah Volatile Gain and Status Register(4)
0080h 0080h 0080h 1Ah NV Gain and I2C 7-Bit Slave Address(12)
0060h 0060h 0060h
0Bh Reserved(3) 0000h 0000h 0000h 1Bh NV WiperLocktrade Technology Register(1)
0000h 0000h 0000h
0Ch General Purpose MTP(1) 0000h 0000h 0000h 1Ch General Purpose MTP(1) 0000h 0000h 0000h
0Dh General Purpose MTP(1) 0000h 0000h 0000h 1Dh General Purpose MTP(1) 0000h 0000h 0000h
0Eh General Purpose MTP(1) 0000h 0000h 0000h 1Eh General Purpose MTP(1) 0000h 0000h 0000h
0Fh General Purpose MTP(1) 0000h 0000h 0000h 1Fh General Purpose MTP(1) 0000h 0000h 0000h
Legend
Volatile Memory Address Range
Nonvolatile Memory Address Range
Not Implemented
Note 1 On nonvolatile devices only (MCP47CMBXX)2 Default I2C 7-bit Slave address is lsquo110 0000rsquo (lsquo110 00xxrsquo when A1A0 bits are determined from the A1 and A0 pins) 3 Reading a reserved memory location will result in the I2C command to Not ACK the command byte The device data
bits will output all lsquo1rsquos A Start condition will reset the I2C interface 4 The lsquo1rsquo bit is the POR status bit which is set after the POR event and cleared after address 0Ah is read
DS20006089B-page 52 2018-2019 Microchip Technology Inc
MCP47CXBXX
12-b
10-b
8-b
425 DEVICE REGISTERS
Register 4-1 shows the format of the DAC Output Valueregisters for the volatile memory locations Theseregisters will be either 8 bits 10 bits or 12 bits wide Thevalues are right justified
REGISTER 4-1 DAC0 (00h10h) AND DAC1 (01h11h) OUTPUT VALUE REGISTERS (VOLATILENONVOLATILE)
U-0 U-0 U-0 U-0 RW-n RW-n RW-n RW-n RW-n RW-n RW-n RW-n RW-n RW-n RW-n RW-n
it mdash mdash mdash mdash D11 D10 D09 D08 D07 D06 D05 D04 D03 D02 D01 D00
it mdash mdash mdash mdash mdash mdash D09 D08 D07 D06 D05 D04 D03 D02 D01 D00
it mdash mdash mdash mdash mdash mdash mdash mdash D07 D06 D05 D04 D03 D02 D01 D00
bit 15 bit 0
Legend
R = Readable bit W = Writable bit U = Unimplemented bit read as lsquo0rsquo -n = Value at POR lsquo1rsquo = Bit is set lsquo0rsquo = Bit is cleared x = Bit is unknown
= 12-bit device = 10-bit device = 8-bit device
12-bit 10-bit 8-bit
bit 15-12 bit 15-10 bit 15-8 Unimplemented Read as lsquo0rsquo
bit 11-0 mdash mdash D11D00 DAC Output Value bits ndash 12-bit devices
FFFh = Full-scale output value7FFh = Mid-scale output value000h = Zero scale output value
mdash bit 9-0 mdash D09D00 DAC Output Value bits ndash 10-bit devices
3FFh = Full-scale output value1FFh = Mid-scale output value000h = Zero scale output value
mdash mdash bit 7-0 D07D00 DAC Output Value bits ndash 8-bit devices
FFh = Full-scale output value7Fh = Mid-scale output value00h = Zero scale output value
2018-2019 Microchip Technology Inc DS20006089B-page 53
MCP47CXBXX
Sing
Du
Register 4-2 shows the format of the Voltage Refer-ence Control register Each DAC has two bits to controlthe source of the voltage reference of the DAC Thisregister is for the volatile memory locations The widthof this register is two times the number of DACs for thedevice
REGISTER 4-2 VOLTAGE REFERENCE (VREF) CONTROL REGISTERS (08h18h)(VOLATILENONVOLATILE)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 RW-n RW-n RW-n RW-n
le mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash(1) mdash(1) VR0B VR0A
al mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash VR1B VR1A VR0B VR0A
bit 15 bit 0
Legend
R = Readable bit W = Writable bit U = Unimplemented bit read as lsquo0rsquo -n = Value at POR lsquo1rsquo = Bit is set lsquo0rsquo = Bit is cleared x = Bit is unknown
= Single channel device = Dual channel device
Single Dual
bit 15-2 bit 15-4 Unimplemented Read as lsquo0rsquo
bit 1-0 bit 3-0 VRxBVRxA DAC Voltage Reference Control bits
11 = VREF pin (buffered) VREF buffer enabled10 = VREF pin (unbuffered) VREF buffer disabled01 = Internal band gap (1214V typical) VREF buffer enabled VREF voltage driven when
powered down(2)
00 = VDD (unbuffered) VREF buffer disabled use this state with power-down bits for lowest current
Note 1 Unimplemented bit read as lsquo0rsquo
2 When the internal band gap is selected the band gap voltage source will continue to output the voltage on the VREF pin in any of the Power-Down modes To reduce the power consumption to its lowest level (band gap disabled) after selecting the desired Power-Down mode the voltage reference should be changed to VDD or the VREF pin unbuffered (lsquo00rsquo or lsquo10rsquo) which turns off the Internal band gap circuitry After wake-up the user needs to reselect the internal band gap (lsquo01rsquo) for the voltage reference source
DS20006089B-page 54 2018-2019 Microchip Technology Inc
MCP47CXBXX
Sing
Du
Register 4-3 shows the format of the Power-DownControl register Each DAC has two bits to control thepower-down state of the DAC This register is for thevolatile memory locations and the nonvolatile memorylocations The width of this register is two times thenumber of DACs for the device
REGISTER 4-3 POWER-DOWN CONTROL REGISTERS (09h19h)(VOLATILENONVOLATILE)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 RW-n RW-n RW-n RW-n
le mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash(1) mdash(1) PD0B PD0A
al mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash PD1B PD1A PD0B PD0A
bit 15 bit 0
Legend
R = Readable bit W = Writable bit U = Unimplemented bit read as lsquo0rsquo -n = Value at POR lsquo1rsquo = Bit is set lsquo0rsquo = Bit is cleared x = Bit is unknown
= Single channel device = Dual channel device
Single Dual
bit 15-2 bit 15-4 Unimplemented Read as lsquo0rsquo
bit 1-0 bit 3-0 PDxBPDxA DAC Power-Down Control bits(2)
11 = Powered down ndash VOUT is open circuit10 = Powered down ndash VOUT is loaded with a 100 k resistor to ground01 = Powered down ndash VOUT is loaded with a 1 k resistor to ground00 = Normal operation (not powered down)
Note 1 Unimplemented bit read as lsquo0rsquo
2 See Table 5-5 for more details
2018-2019 Microchip Technology Inc DS20006089B-page 55
MCP47CXBXX
Sing
Du
Register 4-4 shows the format of the Gain Control andSystem Status register Each DAC has one bit tocontrol the gain of the DAC and two Status bits
REGISTER 4-4 GAIN CONTROL AND SYSTEM STATUS REGISTER (0Ah)(VOLATILE)
U-0 U-0 U-0 U-0 U-0 U-0 RW-n RW-n RC-1 R U-0 U-0 U-0 U-0 U-0 U-0
le mdash mdash mdash mdash mdash mdash mdash(1) G0 POR MTPMA mdash mdash mdash mdash mdash mdash
al mdash mdash mdash mdash mdash mdash G1 G0 POR MTPMA mdash mdash mdash mdash mdash mdash
bit 15 bit 0
Legend
R = Readable bit W = Writable bit C = Clearable bit U = Unimplemented bit read as lsquo0rsquo -n = Value at POR lsquo1rsquo = Bit is set lsquo0rsquo = Bit is cleared x = Bit is unknown
= Single channel device = Dual channel device
Single Dual
bit 15-9 bit 15-10 Unimplemented Read as lsquo0rsquo
mdash bit 9 G1 DAC1 Output Driver Gain Control bit
1 = 2x gain not applicable when VDD is used as VRL(2)
0 = 1x gain
bit 8 bit 8 G0 DAC0 Output Driver Gain Control bit
1 = 2x gain not applicable when VDD is used as VRL(2)
0 = 1x gain
bit 7 bit 7 POR Power-on Reset (Brown-out Reset) Status bit
This bit indicates if a POR or BOR event has occurred since the last read command of this register Reading this register clears the state of the POR Status bit
1 = A POR (BOR) event occurred since the last read of this register reading this register clearsthis bit
0 = A POR (BOR) event has not occurred since the last read of this register
bit 6 bit 6 MTPMA MTP Memory Access Status bit(3)
This bit indicates if the MTP memory access is occurring
1 = An MTP memory access is currently occurring (during the POR MTP read cycle or an MTPwrite cycle is occurring) only serial commands addressing the volatile memory are allowed
0 = An MTP memory access is NOT currently occurring
bit 5-0 bit 5-0 Unimplemented Read as lsquo0rsquo
Note 1 Unimplemented bit read as lsquo0rsquo
2 The DACrsquos Gain bit is ignored and the gain is forced to 1x (Gx = 0) when the DAC voltage reference is selected as VDD (VRxBVRxA = 00)
3 For devices configured as volatile memory this bit is read as lsquo0rsquo
DS20006089B-page 56 2018-2019 Microchip Technology Inc
MCP47CXBXX
Sing
Du
Register 4-5 shows the format of the Nonvolatile GainControl and Slave Address register Each DAC hasone bit to control the gain of the DAC I2C devices alsohave seven bits that are the I2C Slave address
REGISTER 4-5 GAIN CONTROL AND SLAVE ADDRESS REGISTER (1Ah)(NONVOLATILE)
U-0 U-0 U-0 U-0 U-0 U-0 RW-n RW-n U-0 RW-n RW-n RW-n RW-n RW-n RW-n RW-n
le mdash mdash mdash mdash mdash mdash G1 G0 mdash ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0
al mdash mdash mdash mdash mdash mdash G1 G0 mdash ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 ADD0
bit 15 bit 0
Legend
R = Readable bit W = Writable bit C = Clearable bit U = Unimplemented bit read as lsquo0rsquo -n = Value at POR lsquo1rsquo = Bit is set lsquo0rsquo = Bit is cleared x = Bit is unknown
= Single-channel device = Dual-channel device
Single Dual
bit 15-10 bit 15-10 Unimplemented Read as lsquo0rsquo
bit 9-8 bit 9-8 Gx DAC Output Driver Gain Control bits(1)
1 = 2x gain0 = 1x gain
bit 7 bit 7 Unimplemented Read as lsquo0rsquo
bit 6-0 bit 6-0 ADD6ADD0 I2C 7-Bit Slave Address bits(2)
Note 1 When the DAC voltage reference is selected as VDD (VRxBVRxA = 00) the DACrsquos Gain bit is ignored and the gain is forced to 1x (Gx = 0)
2 For I2C devices that have the A1 and A0 pins the 7-bit Slave address is ADD6ADD2 + A1A0 For devices without the A1 and A0 pins the 7-bit Slave address is ADD6ADD0
2018-2019 Microchip Technology Inc DS20006089B-page 57
MCP47CXBXX
Singl
Dua
Register 4-6 shows the format of the DAC WiperLockTechnology Status register The width of this register istwo times the number of DACs for the device
WiperLock technology bits only control access tovolatile memory Nonvolatile memory write access iscontrolled by the requirement of high voltage on theHVC pin which is recommended to not be availableduring normal device operation
REGISTER 4-6 WiperLocktrade TECHNOLOGY CONTROL REGISTER (1Bh) (NONVOLATILE)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0 RW-n RW-n RW-n RW-n
e mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash(1) mdash(1) WL0B WL0A
l mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash mdash WL1B WL1A WL0B WL0A
bit 15 bit 0
Legend
R = Readable bit W = Writable bit C = Clearable bit U = Unimplemented bit read as lsquo0rsquo -n = Value at POR lsquo1rsquo = Bit is set lsquo0rsquo = Bit is cleared x = Bit is unknown
= Single channel device = Dual channel device
Single Dual
bit 15-2 bit 15-4 Unimplemented Read as lsquo0rsquo
bit 1-0 bit 3-1 WLxBWLxA WiperLocktrade Technology Status bits(2)
11 = Volatile DAC Wiper register and Volatile DAC Configuration bits are locked10 = Volatile DAC Wiper register is locked and Volatile DAC Configuration bits are unlocked01 = Volatile DAC Wiper register is unlocked and Volatile DAC Configuration bits are locked00 = Volatile DAC Wiper register and Volatile DAC Configuration bits are unlocked
Note 1 Unimplemented bit read as lsquo0rsquo
2 The Volatile PDxBPDxA bits are NOT locked due to the requirement of being able to exit Power-Down mode
DS20006089B-page 58 2018-2019 Microchip Technology Inc
MCP47CXBXX
50 DAC CIRCUITRY
The Digital-to-Analog Converter circuitry converts adigital value into its analog representation Thisdescription describes the functional operation of thedevice
The DAC circuit uses a resistor ladder implementationDevices have up to two DACs Figure 5-1 shows thefunctional block diagram for the MCP47CXBXX DACcircuitry
The functional blocks of the DAC include
bull Resistor Ladder
bull Voltage Reference Selection
bull Output BufferVOUT Operation
bull Latch Pin (LAT)
bull Power-Down Operation
FIGURE 5-1 MCP47CXBXX DAC Module Block Diagram
RS(2)
VREF
DACOutput
RS(1)
RS(2n ndash 1)
RS(2n ndash 2)
RS(2n ndash 3)
RS(2n)
VDD
VRL
VOUT
PD1PD0
VDD
PD1PD0
VDD
VW
Band Gap(1214V typical)
VREF1VREF0and PD1PD0
Selection
Internal Band GapVoltageReferenceSelection
ResistorLadder
Output BufferVOUT Operation
Power-DownOperation
Power-DownOperation
Power-DownOperation
A (RL)
B
VREF1VREF0
Where
Resistors in Resistor Ladder = 256 (MCP47CXB0X)
1024 (MCP47CXB1X)
4096 (MCP47CXB2X)
VWDAC Register Value
Resistor in Resistor Ladder---------------------------------------------------------------------- VRL=
VDD
(~71 k)RRL
1kΩ
100
kΩ
Gain(1x or 2x)
PD1PD0 andVREF1VREF0
2018-2019 Microchip Technology Inc DS20006089B-page 59
MCP47CXBXX
51 Resistor Ladder
The resistor ladder is a digital potentiometer with theA Terminal connected to the selected reference voltageand the B Terminal internally grounded (see Figure 5-2)The Volatile DAC register controls the wiper positionThe Wiper Voltage (VW) is proportional to the DACregister value divided by the number of ResistorElements (RS) in the ladder (256 1024 or 4096) relatedto the VRL voltage
The output of the resistor network will drive the input ofan output buffer
The resistor network is made up of three parts
bull Resistor Ladder (string of RS elements) bull Wiper Switchesbull DAC Register Decode
The resistor ladder has a typical impedance (RRL) ofapproximately 71 k This Resistor Ladder Resistance(RRL) may vary from device to device up to plusmn10Since this is a voltage divider configuration the actualRRL resistance does not affect the output given a fixedvoltage at VRL
Equation 5-1 shows the calculation for the stepresistance
If the unbuffered VREF pin is used as the VRL voltagesource the external voltage source should have a lowoutput impedance
When the DAC is powered down the resistor ladder isdisconnected from the selected reference voltage
FIGURE 5-2 Resistor Ladder Model Block Diagram
EQUATION 5-1 RS CALCULATION
Note The maximum wiper position is 2n ndash 1while the number of resistors in theresistor ladder is 2n This means thatwhen the DAC register is at full scalethere is one Resistor Element (RS)between the wiper and the VRL voltage
VW
Analog MUX
Note 1 The analog Switch Resistance (RW) does not affect performance due to the voltage divider configuration
RS(2)
DACRegister
RS(1)
RS(2n ndash 1)
RS(2n ndash 2)
RS(2n ndash 3)
RS(2n)
VRL
RRL
RW(1)
RW(1)
RW(1)
RW(1)
RW(1)
RW(1)
2n ndash 1
2n ndash 2
1
0
2
2n ndash 3
RS
RRL256
--------------=
RS
RRL1024
------------------=
8-Bit Device
10-Bit Device
RS
RRL4096
------------------= 12-Bit Device
DS20006089B-page 60 2018-2019 Microchip Technology Inc
MCP47CXBXX
52 Voltage Reference Selection
The resistor ladder has up to four sources for the refer-ence voltage The selection of the voltage referencesource is specified with the Volatile VREF1VREF0Configuration bits (see Register 4-2) The selectedvoltage source is connected to the VRL node (seeFigure 5-3 and Figure 5-4)
The four voltage source options for the Resistor Ladderare
1 VDD pin voltage
2 Internal Band Gap Voltage Reference (VBG)
3 VREF pin voltage ndash unbuffered
4 VREF pin voltage ndash internally buffered
On a PORBOR event the default configuration state orthe value written in the Nonvolatile register is latched intothe Volatile VREF1VREF0 Configuration bits
If the VREF pin is used with an external voltage sourcethen the user must select between Buffered orUnbuffered mode
FIGURE 5-3 Resistor Ladder Reference Voltage Selection Block Diagram
FIGURE 5-4 Reference Voltage Selection Implementation Block Diagram
521 USING VDD AS VREF
When the user selects the VDD as reference the VREFpin voltage is not connected to the resistor ladder TheVDD voltage is internally connected to the resistorladder
522 USING AN EXTERNAL VREF SOURCE IN UNBUFFERED MODE
In this case the VREF pin voltage may vary from VSS toVDD The voltage source should have a low outputimpedance If the voltage source has a high outputimpedance then the voltage on the VREF pin could belower than expected The resistor ladder has a typicalimpedance of 71 k and a typical capacitance of 29 pF
If a single VREF pin is supplying multiple DACs theVREF pin source must have adequate current capabilityto support the number of DACs It must be assumedthat the Resistor Ladder Resistance (RRL) of each DACis at the minimum specified resistance and theseresistances are in parallel
If the VREF pin is tied to the VDD voltage selectingthe VDD Reference mode (VREF1VREF0 = 00) isrecommended
VRL
VDD
Buffer
Re
fere
nce
VREF1VREF0
Se
lect
ion
VREF
Band Gap
Note 1 The Band Gap Voltage (VBG) is 1214V typical The band gap output goes through the buffer with a 2x gain to create the VRL voltage See Table 5-1 for additional information on the band gap circuit
VDD
VRL
Band Gap(1)
(1214V typical)
VDD
VDD
VREF
PD1PD0 andVREF1VREF0
PD1PD0 andVREF1VREF0
PD1PD0 andVREF1VREF0
2018-2019 Microchip Technology Inc DS20006089B-page 61
MCP47CXBXX
523 USING AN EXTERNAL VREF SOURCE IN BUFFERED MODE
The VREF pin voltage may be from 0V to VDD The inputbuffer (amplifier) provides low offset voltage low noiseand a very high input impedance with only minorlimitations on the input range and frequency response
Any variation or noises on the reference source candirectly affect the DAC output The reference voltageneeds to be as clean as possible for accurate DACperformance
524 USING THE INTERNAL BAND GAP AS VOLTAGE REFERENCE
The internal band gap is designed to drive the resistorladder buffer
If the internal band gap is selected then the band gapvoltage source will drive the external VREF pins TheVREF0 pin can source up to 1 mA of current withoutaffecting the DAC output specifications The VREF1 pinmust be left unloaded in this mode The voltage refer-ence source can be independently selected on deviceswith two DAC channels but restrictions apply
bull The VDD mode can be used without issues on any channel
bull When the internal band gap is selected as the voltage source all the VREF pins are connected to its output The use of the Unbuffered mode is only possible on VREF0 because itrsquos the only one that can be loaded
bull When using the Internal Band Gap mode on Channel 0 Channel 1 must be put in Buffered External VREF mode or VDD Reference mode and the VREF1 pin must be left unloaded
The resistance of the Resistor Ladder (RRL) is targetedto be 71 k (10) which means a minimumresistance of 639 k
The band gap selection can be used across the VDDvoltages while maximizing the VOUT voltage rangesFor VDD voltages below the Gain VBG voltage theoutput for the upper codes will be clipped to the VDDvoltage Table 5-1 shows the maximum DAC registercode given device VDD and Gain bit setting
53 Output BufferVOUT Operation
The output driver buffers the Wiper Voltage (VW) of theresistor ladder
The DAC output is buffered with a low-power precisionoutput amplifier with selectable gain This amplifier pro-vides a rail-to-rail output with low offset voltage and lownoise The amplifierrsquos output can drive the resistive andhigh-capacitive loads without oscillation The amplifierprovides a maximum load current which is enough formost programmable voltage reference applicationsRefer to Section 10 ldquoElectrical Characteristicsrdquo forthe specifications of the output amplifier
Figure 5-5 shows a block diagram of the output drivercircuit
FIGURE 5-5 Output Driver Block Diagram
Power-down logic also controls the output bufferoperation (see Section 55 ldquoPower-Down Operationrdquofor additional information on power-down) In any of thethree Power-Down modes the output amplifier ispowered down and its output becomes a high-impedanceto the VOUT pin
531 PROGRAMMABLE GAIN
The amplifierrsquos gain is controlled by the Gain (G)Configuration bit (see Register 4-4) and the VRLreference selection (see Register 4-2)
The Gain options are
a) Gain of 1 with either the VDD or VREF pin usedas the reference voltage
b) Gain of 2 only when the VREF pin or the internalband gap is used as the reference voltage TheVREF pin voltage should be limited to VDD2When the Reference Voltage Selection (VRL) isthe devicersquos VDD voltage the Gx bit is ignoredand a gain of 1 is used
TABLE 5-1 VOUT USING BAND GAP
VD
D
DA
C G
ain Max DAC Code(1)
Comment12-Bit 10-Bit 8-Bit
551 FFFh 3FFh FFh VOUT(max) = 1214V(3)
2 FFFh 3FFh FFh VOUT(max) = 2428V(3)
271 FFFh 3FFh FFh VOUT(max) = 1214V(3)
2 FFFh 3FFh FFh VOUT(max) = 2428V
181 FFFh 3FFh FFh VOUT(max) = 1214V
2(2) BBCh 2EFh BBh 18V
Note 1 Without the VOUT pin voltage being clipped2 Recommended to use the Gain = 1 setting3 When VBG = 1214V typical
Note The load resistance must be kept higherthan 2 k to maintain stability of theanalog output and have it meet electricalspecifications
VWVOUT
PD1PD0
VDD
PD1PD0
1kΩ
100
kΩ
Gain(1x or 2x)
DS20006089B-page 62 2018-2019 Microchip Technology Inc
MCP47CXBXX
Table 5-2 shows the gain bit operation
The volatile G bit value can be modified by
bull POR Event
bull BOR Event
bull I2C Write Commands
bull I2C General Call Reset Command
532 OUTPUT VOLTAGE
The Volatile DAC register values along with thedevicersquos Configuration bits control the analog VOUTvoltage The Volatile DAC registerrsquos value is unsignedbinary The formula for the output voltage is provided inEquation 5-2 Examples of Volatile DAC register valuesand the corresponding theoretical VOUT voltage for theMCP47CXBXX devices are shown in Table 5-6
EQUATION 5-2 CALCULATING OUTPUT VOLTAGE (VOUT)
When Gain = 2 (VRL = VREF) if VREF gt VDD2 the VOUTvoltage is limited to VDD So if VREF = VDD the VOUTvoltage does not change for Volatile DAC registervalues mid-scale and greater since the output amplifieris at full-scale output
The following events update the DAC register valueand therefore the analog Voltage Output (VOUT)
bull Power-on Resetbull Brown-out Resetbull I2C write command (to Volatile registers) on the
rising edge of the last write command bitbull I2C General Call Reset command the output is
updated with default POR data or MTP valuesbull I2C general call wake-up command the output is
updated with default POR data or MTP values
Next the VOUT voltage starts driving to the new valueafter the event has occurred
533 STEP VOLTAGE (VS)
The step voltage depends on the device resolution andthe calculated output voltage range One LSb isdefined as the ideal voltage difference between twosuccessive codes The step voltage can easily be cal-culated by using Equation 5-3 (the DAC register valueis equal to lsquo1rsquo) Theoretical step voltages are shown inTable 5-3 for several VREF voltages
EQUATION 5-3 VS CALCULATION
TABLE 5-3 THEORETICAL STEP VOLTAGE (VS)(1)
TABLE 5-2 OUTPUT DRIVER GAIN
Gain Bit Gain Comment
0 1
1 2 Limits VREF pin voltages relative to device VDD voltage
Where
Resistors in R-Ladder = 4096 (MCP47CXB2X)
1024 (MCP47CXB1X)
256 (MCP47CXB0X)
VOUT
VRL DAC Register Value Resistor in Resistor Ladder---------------------------------------------------------------------- Gain=
Where
Resistors in R-Ladder = 4096 (12-bit)
1024 (10-bit)
256 (8-bit)
VS
VRL
Resistor in Resistor Ladder---------------------------------------------------------------------- Gain=
StepVoltage
VREF
50 27 18 15 10
VS
122 mV 659 uV 439 uV 366 uV 244 uV 12-bit
488 mV 264 mV 176 mV 146 mV 977 uV 10-bit
195 mV 105 mV 703 mV 586 mV 391 mV 8-bit
Note 1 When Gain = 1x VFS = VRL and VZS = 0V
2018-2019 Microchip Technology Inc DS20006089B-page 63
MCP47CXBXX
534 OUTPUT SLEW RATE
Figure 5-6 shows an example of the slew rate of the VOUTpin The slew rate can be affected by the characteristicsof the circuit connected to the VOUT pin
FIGURE 5-6 VOUT Pin Slew Rate
5341 Small Capacitive Load
With a small capacitive load the output bufferrsquos currentis not affected by the Capacitive Load (CL) But still theVOUT pinrsquos voltage is not a step transition from one out-put value (DAC register value) to the next output valueThe change of the VOUT voltage is limited by the outputbufferrsquos characteristics so the VOUT pin voltage willhave a slope from the old voltage to the new voltageThis slope is fixed for the output buffer and is referredto as the Buffer Slew Rate (SRBUF)
5342 Large Capacitive Load
With a larger capacitive load the slew rate isdetermined by two factors
bull The output bufferrsquos Short-Circuit Current (ISC)
bull The VOUT pinrsquos external load
IOUT cannot exceed the output bufferrsquos Short-CircuitCurrent (ISC) which fixes the output Buffer Slew Rate(SRBUF) The voltage on the Capacitive Load (CL) VCLchanges at a rate proportional to IOUT which fixes aCapacitive Load Slew Rate (SRCL)
The VCL voltage slew rate is limited to the slower of theoutput bufferrsquos internally Set Slew Rate (SRBUF) andthe Capacitive Load Slew Rate (SRCL)
535 DRIVING RESISTIVE AND CAPACITIVE LOADS
The VOUT pin can drive up to 100 pF of capacitive loadin parallel with a 5 k resistive load (to meet electricalspecifications) VOUT drops slowly as the load resis-tance decreases after about 35 k It is recommendedto use a load with RL greater than 2 k
Refer to Section 20 ldquoTypical Performance Curvesrdquo fora detailed VOUT vs Resistive Load characterizationgraph
Driving large capacitive loads can cause stabilityproblems for voltage feedback output amplifiers As theload capacitance increases the feedback looprsquos phasemargin decreases and the closed-loop bandwidth isreduced This produces gain peaking in the frequencyresponse with overshoot and ringing in the stepresponse That is since the VOUT pinrsquos voltage doesnot quickly follow the bufferrsquos input voltage (due to thelarge capacitive load) the output buffer will overshootthe desired target voltage Once the driver detects thisovershoot it compensates by forcing it to a voltagebelow the target This causes voltage ringing on theVOUT pin
So when driving large capacitive loads with the outputbuffer a small Series Resistor (RISO) at the output (seeFigure 5-7) improves the output bufferrsquos stability(feedback looprsquos phase margin) by making the outputload resistive at higher frequencies The bandwidth willbe generally lower than the bandwidth with nocapacitive load
FIGURE 5-7 Circuit to Stabilize Output Buffer for Large Capacitive Loads (CL)
The RISO resistor value for your circuit needs to beselected The resulting frequency response peakingand step response overshoot for this RISO resistorvalue should be verified on the bench Modify theRISOrsquos resistance value until the output characteristicsmeet your requirements
A method to evaluate the systemrsquos performance is toinject a step voltage on the VREF pin and observe theVOUT pinrsquos characteristics
Time
DACx = A
VO
UT
VOUT(A)
VOUT(B)
DACx = B
Slew RateVOUT B VOUT A ndash
T--------------------------------------------------=
Note Additional insight into circuit design fordriving capacitive loads can be found inAN884 ldquoDriving Capacitive Loads WithOp Ampsrdquo (DS00884)
Gain
VOUT RISO
RL CL
VCL
VW
DS20006089B-page 64 2018-2019 Microchip Technology Inc
MCP47CXBXX
54 Latch Pin (LAT)
The Latch pin controls when the Volatile DAC registervalue is transferred to the DAC wiper This is useful forapplications that need to synchronize the wiper(s)updates to an external event such as zero-crossing orupdates to the other wipers on the device The LAT pinis asynchronous to the serial interface operation
When the LAT pin is high transfers from the VolatileDAC register to the DAC wiper are inhibited The VolatileDAC register value(s) can continue to be updated
When the LAT pin is low the Volatile DAC registervalue is transferred to the DAC wiper
Figure 5-8 shows the interaction of the LAT pin and theloading of the DAC Wiper x (from the Volatile DACRegister x) The transfers are level-driven If the LATpin is held low the corresponding DAC wiper isupdated as soon as the Volatile DAC register value isupdated
FIGURE 5-8 LAT and DAC Interaction
The LAT pin allows the DAC wiper to be updated to anexternal event and to have multiple DACchannelsdevices update at a common event
Since the DAC Wiper x is updated from the VolatileDAC Register x all DACs that are associated with agiven LAT pin can be updated synchronously
If the application does not require synchronization thenthis signal should be tied low
Figure 5-9 shows two cases of using the LAT pin tocontrol when the Wiper register is updated relative tothe value of a sine wave signal
FIGURE 5-9 Example Use of LAT Pin Operation
Note This allows both the Volatile DAC0 andDAC1 registers to be updated while theLAT pin is high and to have outputssynchronously updated as the LAT pin isdriven low
Write CommandRegister Address
DAC Wiper x
16 Clocks
LATSYNC
Transfer
Serial Shift Reg
Data(internal signal)
LAT SYNCTransfer
DataComment
1 1 0 No Transfer
1 0 0 No Transfer
0 1 1 Vol DAC Register x DAC Wiper x
0 0 0 No Transfer
Vol DAC Register x
Case 1 Zero-Crossing of Sine Wave to Update the Volatile DAC0 Register (using LAT pin)
Case 2 Fixed-Point Crossing of Sine Wave to Update the Volatile DAC0 Register (using LAT pin)
Indicates where LAT pin pulses are active (Volatile DAC0 register updated)
2018-2019 Microchip Technology Inc DS20006089B-page 65
MCP47CXBXX
55 Power-Down Operation
To allow the application to conserve power when DACoperation is not required three Power-Down modesare available On devices with multiple DACs eachDACrsquos Power-Down mode is individually controllable
All Power-Down modes do the following
bull Turn off most of the DAC modulersquos internal circuitsbull Op amp output becomes high-impedance to the
VOUT pinbull Retain the value of the Volatile DAC register and
Configuration bits
Depending on the selected Power-Down mode thefollowing will occur
bull VOUT pin is switched to one of the two resistive pull-downs- 100 k (typical) - 1 k (typical)
bull Op amp is powered down and the VOUT pin becomes high-impedance
The Power-Down Configuration bits (PD1PD0) controlthe power-down operation (Table 5-4)
TABLE 5-4 POWER-DOWN BITS AND OUTPUT RESISTIVE LOAD
There is a delay (TPDD) between the PD1PD0 bitschanging from lsquo00rsquo to either lsquo01rsquo lsquo10rsquo or lsquo11rsquo and theop amp no longer driving the VOUT output and thepull-down resistorsrsquo sinking current
In any of the Power-Down modes where the VOUT pinis not externally connected (sinking or sourcing cur-rent) as the number of DACs increases the devicersquospower-down current will also increase
Table 5-5 shows the current sources for the DAC basedon the selected source of the DACrsquos reference voltageand if the device is in normal operating mode or one ofthe Power-Down modes
The power-down bits are modified by using a writecommand to the Volatile Power-Down register or a PORevent which transfers the Nonvolatile Power-Downregister to the Volatile Power-Down register
Section 70 ldquoDevice Commandsrdquo describes the I2Ccommands for writing the power-down bits Thecommands that can update the volatile PD1PD0 bits are
bull Writebull General Call Resetbull General Call Wake-up
551 EXITING POWER-DOWN
The following events change the PD1PD0 bits to lsquo00rsquoand therefore exit the Power-Down mode These are
bull Any I2C Write Command where the PD1PD0 bits are lsquo00rsquo
bull I2C General Call Wake-up Command
bull I2C General Call Reset Command
When the device exits Power-Down mode thefollowing occurs
bull Disabled internal circuits are turned on
bull Resistor ladder is connected to the selected Reference Voltage (VRL)
bull Selected pull-down resistor is disconnected
bull The VOUT output is driven to the voltage represented by the Volatile DAC registerrsquos value and Configuration bits
The DAC Wiper register and DAC wiper value may bedifferent due to the DAC Wiper register being modifiedwhile the LAT pin was driven to (and remaining at) VIH
The VOUT output signal requires time as these circuitsare powered up and the output voltage is driven to thespecified value as determined by the Volatile DACregister and Configuration bits
PD1 PD0 Function
0 0 Normal operation
0 1 1 k resistor to ground
1 0 100 k resistor to ground
1 1 Open circuit
TABLE 5-5 DAC CURRENT SOURCES
Device VDD Current Source
PDxBxA = 00 VREFxBxA =
PDxBxA 00 VREFxBxA =
00 01 10 11 00 01 10 11Output Op Amp Y Y Y Y N N N N
Resistor Ladder Y Y N(1) Y N N N(1) N
VREF Selection Buffer N Y N Y N N N N
Band Gap N Y N N N(2) Y(2) N(2) N(2)
Note 1 The current is sourced from the VREF pin not the device VDD
2 If DAC0 and DAC1 are in one of the Power-Down modes MTP write operations are not recommended
Note 1 The I2C serial interface circuit is notaffected by the Power-Down mode Thiscircuit remains active in order to receiveany command that might come from theI2C Master device
2 A General Call Reset will do the PORevent sequence except that the MTPshadow memory values will be transferedto the Volatile Memory registers
Note Since the op amp and resistor ladder werepowered off (0V) the op amprsquos InputVoltage (VW) can be considered as 0VThere is a delay (TPDE) between thePD1PD0 bits updating to lsquo00rsquo and theop amp driving the VOUT output Theop amprsquos settling time (from 0V) needs tobe taken into account to ensure the VOUTvoltage reflects the selected value
DS20006089B-page 66 2018-2019 Microchip Technology Inc
MCP47CXBXX
TABLE 5-6 DAC INPUT CODE VS CALCULATED ANALOG OUTPUT (VOUT) (VDD = 50V)
DeviceVolatile DAC
Register ValueVRL
(1)LSb Gain
Selection (2)
VOUT(3)
Equation microV Equation VM
CP
47C
VB
2X (
12
-bit)
1111 1111 1111 50V 50V4096 12207 1x VRL (40954096) 1 4998779
25V 25V4096 6104 1x VRL (40954096) 1 2499390
2x(2) VRL (40954096) 2) 4998779
0111 1111 1111 50V 50V4096 12207 1x VRL (20474096) 1) 2498779
25V 25V4096 6104 1x VRL (20474096) 1) 1249390
2x(2) VRL (20474096) 2) 2498779
0011 1111 1111 50V 50V4096 12207 1x VRL (10234096) 1) 1248779
25V 25V4096 6104 1x VRL (10234096) 1) 0624390
2x(2) VRL (10234096) 2) 1248779
0000 0000 0000 50V 50V4096 12207 1x VRL (04096) 1) 0
25V 25V4096 6104 1x VRL (04096) 1) 0
2x(2) VRL (04096) 2) 0
MC
P47
CV
B1X
(1
0-b
it)
11 1111 1111 50V 50V1024 48828 1x VRL (10231024) 1 4995117
25V 25V1024 24414 1x VRL (10231024) 1 2497559
2x(2) VRL (10231024) 2 4995117
01 1111 1111 50V 50V1024 48828 1x VRL (5111024) 1 2495117
25V 25V1024 24414 1x VRL (5111024) 1 1247559
2x(2) VRL (5111024) 2 2495117
00 1111 1111 50V 50V1024 48828 1x VRL (2551024) 1 1245117
25V 25V1024 24414 1x VRL (2551024) 1 0622559
2x(2) VRL (2551024) 2 1245117
00 0000 0000 50V 50V1024 48828 1x VRL (01024) 1 0
25V 25V1024 24414 1x VRL (01024) 1 0
2x(2) VRL (01024) 1 0
MC
P4
7CV
B0X
(8
-bit)
1111 1111 50V 50V256 195313 1x VRL (255256) 1 4980469
25V 25V256 97656 1x VRL (255256) 1 2490234
2x(2) VRL (255256) 2 4980469
0111 1111 50V 50V256 195313 1x VRL (127256) 1 2480469
25V 25V256 97656 1x VRL (127256) 1 1240234
2x(2) VRL (127256) 2 2480469
0011 1111 50V 50V256 195313 1x VRL (63256) 1 1230469
25V 25V256 97656 1x VRL (63256) 1 0615234
2x(2) VRL (63256) 2 1230469
0000 0000 50V 50V256 195313 1x VRL (0256) 1 0
25V 25V256 97656 1x VRL (0256) 1 0
2x(2) VRL (0256) 2 0
Note 1 VRL is the resistor ladderrsquos reference voltage It is independent of the VREF1VREF0 selection 2 Gain selection of 2x (Gx = 1) requires the voltage reference source to come from the VREF pin
(VREF1VREF0 = 10 or 11) and requires VREF pin voltage (or VRL) le VDD2 or from the internal band gap (VREF1VREF0 = 01)
3 These theoretical calculations do not take into account the offset gain and nonlinearity errors
2018-2019 Microchip Technology Inc DS20006089B-page 67
MCP47CXBXX
NOTES
DS20006089B-page 68 2018-2019 Microchip Technology Inc
MCP47CXBXX
60 I2C SERIAL INTERFACE MODULE
The MCP47CXBXXrsquos I2C serial interface modulesupports the I2C serial protocol specification This I2Cinterface is a two-wire interface (clock and data)Figure 6-1 shows a typical I2C interface connection
The I2C specification only defines the field typeslengths timings etc of a frame The frame contentdefines the behavior of the device The frame content(commands) for the MCP47CXBXX is defined inSection 70 ldquoDevice Commandsrdquo
An overview of the I2C protocol is available inAppendix B ldquoI2C Serial Interfacerdquo
FIGURE 6-1 Typical I2C Interface
61 Overview
This section discusses some of the specific character-istics of the MCP47CXBXX devicesrsquo I2C serial interfacemodule This is to assist in the development of yourapplication
The following sections discuss some of thesedevice-specific characteristics
bull Interface Pins (SCL and SDA)
bull Communication Data Rates
bull PORBOR
bull Device Memory Address
bull General Call Commands
bull Device I2C Slave Addressing
bull Slope Control
611 INTERFACE PINS (SCL AND SDA)
The MCP47CXBXX I2C module SCL pin does notgenerate the serial clock since the device operates inSlave mode Also the MCP47CXBXX will not stretchthe clock signal (SCL) since memory read accessoccurs fast enough
The MCP47CXBXX I2C module implements slopecontrol on the SDA pin output driver
62 Communication Data Rates
The I2C interface specifies different communication bitrates These are referred to as Standard Fast or High-Speed modes The MCP47CXBXX supports thesethree modes The clock rates (bit rate) of these modesare
bull Standard mode Up to 100 kHz (kbits)
bull Fast mode Up to 400 kHz (kbits)
bull High-Speed mode (HS mode) Up to 34 MHz (Mbits)
A description on how to enter High-Speed mode isdescribed in Section 68 ldquoSlope Controlrdquo
63 PORBOR
On a PORBOR event the I2C serial interface modulestate machine is reset which includes forcing thedevicersquos Memory Address Pointer to 00h
64 Device Memory Address
The memory address is the 5-bit value that specifiesthe location in the devicersquos memory that the specifiedcommand will operate on
On a PORBOR event the devicersquos Memory AddressPointer is forced to 00h
The MCP47CXBXX retains the last received ldquoDeviceMemory Addressrdquo That is the MCP47CXBXX does notldquocorruptrdquo the ldquodevice memory addressrdquo after RepeatedStart or Stop conditions
65 General Call Commands
The general call commands utilize the I2C specificationreserved general call command address and commandcodes The MCP47CXBXX also implements anonstandard general call command
The general call commands are
bull General Call Reset bull General Call Wake-up (MCP47CXBXX defined)
The general call wake-up command will cause all theMCP47CXBXX devices to exit their power-down state
66 Multi-Master Systems
The MCP47CXBXX is not a Master device (generatesthe interface clock) but it can be used in Multi-Masterapplications
SCLSCL
MCP47CVBXX
SDASDA
HostController
Typical I2C Interface Connections
Other Devices
(Master)(Slave)
2018-2019 Microchip Technology Inc DS20006089B-page 69
MCP47CXBXX
67 Device I2C Slave Addressing
The address byte is the first byte received following theStart (or Repeated Start) condition from the Master device(see Figure 6-2) For nonvolatile devices the seven bits ofthe I2C Slave address are user-programmable Thedefault address is lsquo110 0000rsquo If the address pins arepresent on the specific package the lower two bits ofthe address are determined by the state of the A1 andA0 pins
For volatile devices (MCP47CVBXX) the I2C Slaveaddress bits A6A0 are fixed (lsquo110 0000rsquo) The userstill has Slave address programmability with the A1A0address pins (if available on the package)
FIGURE 6-2 Slave Address Bits in the I2C Control Byte
Table 6-1 shows the four standard orderable I2C Slaveaddresses and their respective device order codes
671 CUSTOM I2C SLAVE ADDRESS OPTIONS
Custom I2C Slave address options can be requestedUsers can request the custom I2C Slave address viathe Nonstandard Customer Authorization Request(NSCAR) process
68 Slope Control
The slope control on the SDA output is differentbetween the FastStandard Speed and the High-SpeedClock modes of the interface
69 Pulse Gobbler
The pulse gobbler on the SCL pin is automaticallyadjusted to suppress spikes lt10 ns during HS mode
Note Address bits A6A0 are MTP and canbe programmed during the userrsquosmanufacturing flow
Start BitReadWrite Bit
Address Byte
RW ACK
Acknowledge Bit
Slave Address
A6 A5 A4 A3
Slave Address (7 bits)
A2 A1 A0
1 1 0 0 0 0 0DefaultFactoryAddress(Note 1)
Note 1 Address bits (A6A0) can be programmed by the user (MCP47CMBXX devices) Bits A1 and A0 are determined by either the MTP bits or the A0 and A1 pin values if present on the package
TABLE 6-1 I2C ADDRESSORDER CODE
Default7-Bit I2C Address
Device Order Code(1)
Memory Tape and ReelVOL NV
lsquo1100000rsquoMCP47CXBXX-EXX Y Y N
MCP47CXBXXT-EXX Y Y Y
Note 1 Nonvolatile devicesrsquo I2C Slave address can be reprogrammed by the end user
Note Non-Recurring Engineering (NRE) chargesand minimum ordering requirements forcustom orders Please contact Microchipsales for additional information
A custom device will be assigned customdevice marking
DS20006089B-page 70 2018-2019 Microchip Technology Inc
MCP47CXBXX
610 Entering High-Speed (HS) Mode
The I2C specification requires that a High-Speed modedevice be lsquoactivatedrsquo to operate in High-Speed(34 Mbits) mode This is done by the Master sendinga special address byte following the Start bit This byteis referred to as the High-Speed Master Mode Code(HSMMC)
The device can now communicate at up to 34 Mbitson SDA and SCL lines The device will switch out of theHS mode on the next Stop condition
The Master code is sent as follows
1 Start condition (S)
2 High-Speed Master Mode Code (lsquo0000 1xxxrsquo)the lsquoxxxrsquo bits are unique to the High-Speed (HS)Master mode
3 No Acknowledge (A)
After switching to High-Speed mode the next trans-ferred byte is the I2C control byte which specifies thedevice to communicate with and any number of databytes plus Acknowledgments The Master device canthen either issue a Repeated Start bit to address adifferent device (at High-Speed mode) or a Stop bit toreturn to the bus FastStandard Speed mode After theStop bit any other Master device (in a Multi-Mastersystem) can arbitrate for the I2C bus
The MCP47CXBXX device does not Acknowledge theHS select byte However upon receiving thiscommand the device switches to HS mode
See Figure 6-3 for an illustration of the HS modecommand sequence
For more information on the HS mode or other I2Cmodes refer to the ldquoNXP I2C Specificationrdquo
FIGURE 6-3 HS Mode Sequence
S Alsquo0000 1xxxrsquobrsquo Sr ASlave Address AAData
P
S = Start bitSr = Repeated Start bitA = Acknowledge bitA = Not Acknowledge bit
RW = ReadWrite bit
RW
P = Stop bit (Stop condition terminates HS mode)
FS Mode HS Mode
HS Mode Continues
FS Mode
ASlave Address RWHS Select Byte Control Byte CommandData Byte(s)
Control Byte
Sr
2018-2019 Microchip Technology Inc DS20006089B-page 71
MCP47CXBXX
NOTES
DS20006089B-page 72 2018-2019 Microchip Technology Inc
MCP47CXBXX
70 DEVICE COMMANDS
The I2C protocol does not specify how commands areformatted so this section specifies the MCP47CXBXXdevicersquos I2C command formats and operation
The commands can be grouped into the followingcategories
bull Write Commands (C1C0 = 00) bull Read Commands (C1C0 = 11) bull General Call Commands
The supported commands are shown in Table 7-1These commands allow both single data or continuousdata operation Continuous data operation means thatthe I2C Master does not generate a Stop bit but repeatsthe required dataclocks This allows faster updatessince the overhead of the I2C control byte is removedTable 7-1 also shows the required number of bit clocksfor each commandrsquos different mode of operation
71 Write Commands
Write commands are used to transfer data to thedesired memory location (from the Host controller) Themodes are Single or Continuous The Continuousmode format allows the fastest data update rate for thedevicersquos memory locations
See Section 75 ldquoWrite Commandrdquo for a full descriptionof the write commands
72 Read Commands
Read commands are used to transfer data from thedesired memory location to the Host controller Theread command format writes two bytes (Control byte(RW bit) = 0) and the read command byte (desiredmemory address and the read command) Then aRestart condition is followed by a second control bytebut this control byte indicates an I2C read operation(RW bit = 1) The Master will then supply 16 clocks sothe specified address data are transfered SeeSection 76 ldquoRead Commandrdquo for full a description ofthe read commands
Note The 8-bit data devices use the sameformat as 10-bit and 12-bit devices Thisallows code migration compatibility at thecost of nine extra clock cycles per databyte transferred
TABLE 7-1 DEVICE COMMANDS ndash NUMBER OF CLOCKS
Command
of Bit Clocks(1)
Data Update Rate (8-bit10-bit12-bit)
(Data WordsSecond) CommentsOperation
CodeMode
C1 C0 100 kHz 400 kHz 34 MHz (3)
Write Command(4) 0 0 Single 38 2632 10526 89474
0 0 Continuous 27n + 11 3559 14235 120996 For ten data words
Read Command 1 1 Random 48 2083 8333 70833
1 1 Continuous 18n + 11 4762 19048 161905 For ten data words
1 1 Last Address 29 3448 13793 117241
General Call Reset Command
mdash mdash Single 20 5000 20000 170000 Note 2
General Call Wake-up Command
mdash mdash Single 20 5000 20000 170000 Note 2
Note 1 ldquonrdquo indicates the number of times the command operation is to be repeated2 Determined by general call command byte after the I2C general call address 3 There is a minimal overhead to enter into 34 MHz mode4 This command can be at either normal or high voltage A high-voltage command requires the HVC pin to be at
VIHH for the entire command until the completion of the MTP cycle
2018-2019 Microchip Technology Inc DS20006089B-page 73
MCP47CXBXX
73 General Call Commands
The general call commands utilize the I2C specificationreserved general call command address and commandcodes The General Call Reset command format isspecified by the ldquoNXP I2C Specificationrdquo The generalcall wake-up command is a Microchip-defined format
I2C devices Acknowledge the general call addresscommand (0x00 in the first byte) The meaning of thegeneral call address is always specified in the secondbyte The I2C specification does not allow lsquo00000000rsquo(00h) in the second byte Also the lsquo00000100rsquo andlsquo00000110rsquo functionality is defined by the ldquoNXP I2CSpecificationrdquo Lastly a data byte with a lsquo1rsquo in the LSbindicates a ldquoHardware General Callrdquo
Please refer to the ldquoNXP I2C Specificationrdquo for moredetails on the general call specifications
The MCP47CXBXX devices support the following I2Cgeneral calls
bull General Call Reset
bull General Call Wake-up
See Section 771 ldquoGeneral Call Resetrdquo for a fulldescription of the General Call Reset command andthe general call wake-up command
74 Aborting a Transmission
A Restart or Stop condition in an expected data bitposition will abort the current command sequence andif the command is a write that data word will not be writ-ten to the MCP47CXBXX Also the I2C state machinewill be reset
75 Write Command
The write command can be issued to both the volatileand nonvolatile memory locations Write commandscan also be structured as either single or continuousThe continuous format allows the fastest data updaterate for the devicersquos memory locations
The format of the command is shown in Figure 7-1 TheMCP47CXBXX generates the AA bits The format ofthe command is shown in Figure 7-1 (single) andFigure 7-3 (continuous) for example ACKNACKbehavior (see Figure 7-2)
A write command to a volatile memory locationchanges that location after a properly formatted writecommand and the rising edge of the D00 bit (last databit) clock has been detected
A write command to a nonvolatile memory location willonly start a write cycle after a properly formatted writecommand has been received and the Stop conditionhas occurred
751 SINGLE WRITE TO VOLATILE MEMORY
For volatile memory locations data are written to theMCP47CXBXX after every data word transfer (16 bits)during the rising edge of the last data bit If a Stop orRestart condition is generated during a data transfer(before the last data bit is received) the data will not bewritten to the MCP47CXBXX After the A bit the Mastercan initiate the next sequence with a Stop or Restartcondition (See Figure 7-1 for the write sequence)
752 SINGLE WRITE TO NONVOLATILE MEMORY (HVC PIN = VIL OR VIH)
In normal user mode the MTP memory addresscannot be written Writing to the MTP address spacewhile the HVC pin is not at VIHH will not have anyeffect the command is Acknowledged but the memoryis not modified
Note 1 Writes to volatile memory locations willbe dependent on the state of theirrespective WiperLock Technology bits
2 During device communication if thedevice addresscommand combination isinvalid or an unimplemented deviceaddress is specified then the MCP47CX-BXX will NACK that byte To reset the I2Cstate machine the I2C communicationmust detect a Start bit
3 Writes to volatile memory locations willbe dependent on the state of theirrespective WiperLock Technology bits
Note Writes to a Volatile DAC register will nottransfer to the output register until the LAT(HVC) pin is transitioned to the VILvoltage
DS20006089B-page 74 2018-2019 Microchip Technology Inc
MCP47CXBXX
753 SINGLE WRITE TO NONVOLATILE MEMORY (HVC PIN = VIHH)
The sequence to write to a single nonvolatile memorylocation is the same as a single write to volatile memorywith the exception that the MTP Write Cycle (twc) isstarted after a properly formatted command includingthe Stop bit is received After the Stop condition occursthe serial interface may immediately be re-enabled byinitiating a Start condition
The HVC pin must be at VIHH until the completion of theMTP Write Cycle (twc)
During an MTP write cycle access to the volatile mem-ory is allowed when using the appropriate commandsequence Commands that address nonvolatile memoryare ignored until the MTP Write Cycle (twc) completesThis allows the Host controller to operate on the VolatileDAC registers
Once a write command to a nonvolatile memorylocation has been received no other commands shouldbe received before the Stop condition occurs
Writes to a NV memory location while an MTP writecycle is occurring will force an error condition (A) AStart bit is required to reset the command statemachine
Figure 7-1 shows the waveform for a single write
FIGURE 7-1 Write Random Address Command
Note Writes to MTP memory require the HVCpin at 75V This is not the normal operat-ing conditions of the device it is designedfor factory programming of configurationparameters
Note If a Stop condition does not occur then theNV Write does not occur and all followingcommand(s) will have an error condition(A) A Start bit is required to reset the com-mand state machine
Memory Address
I2C ACK bit(1)
Note 1 The Acknowledge bit is generated by the MCP47CXBXX
2 At the rising edge of the SCL signal for the last bit (D00) of the write command the device updates the value of the specified device register For DAC Output registers the output voltage depends on the state of the LAT pin
3 This command sequence does not need to terminate (using the Stop bit) and the write command can be repeated (see continuous write format Section 754 ldquoContinuous Writes to Volatile Memoryrdquo)
SA6
SSA5
SA4
SA3
SA2
SA1
SA0
0
0
AAD4
AD3
AD2
AD1
AD0
0 0 x A
ADn
D15
D14
D13
D12
D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
A PA
A
P
S xSAn
0 0
I2C Start Bit
I2C Slave Address
I2C Write Bit Write Command
Reserved should be Set to lsquo0rsquo
I2C Stop Bit(3)
Dnn Register Data (to be written)(2)
Control Byte Write Command
Data to Write MSB Data to Write LSB
Legend
2018-2019 Microchip Technology Inc DS20006089B-page 75
MCP47CXBXX
754 CONTINUOUS WRITES TO VOLATILE MEMORY
A Continuous Write mode of operation is possible whenwriting to the devicersquos Volatile Memory registers (seeTable 7-2) This Continuous Write mode allows writeswithout a Stop or Restart condition or repeated trans-missions of the I2C control byte Figure 7-3 shows thesequence for three continuous writes The writes do notneed to be to the same volatile memory address Thesequence ends with the Master sending a Stop orRestart condition
755 CONTINUOUS WRITES TO NONVOLATILE MEMORY
If a continuous write is attempted on nonvolatilememory the missing Stop condition will cause thecommand to be an error condition (A) on all followingbytes A Start bit is required to reset the command statemachine
FIGURE 7-2 I2C ACKNACK Behavior (Write Command Example)
TABLE 7-2 VOLATILE MEMORY ADDRESSES
Address Single Channel Dual Channel
00h Yes Yes
01h No Yes
08h Yes Yes
09h Yes Yes
0Ah Yes Yes
Note All bytes are ignored and not transferredto memory
Write 1 Word Command
S Slave Address
RW
AC
K
Command
AC
K
Data Byte
AC
K
Data Byte
AC
K
P
Master S
SA
6S
A5
SA
4S
A3
SA
2S
A1
SA
0
0 AA
AD
4A
D3
AD
2A
D1
AD
0C
1C
0 x AA
D15
D14
D13
D12
D11
D10
D09
D08 AA
D07
D06
D05
D04
D03
D02
D01
D00 AA P
Example 1 (No Command Error)
Master S 1 1 0 0 0 0 0 0 1 0 0 0 0 1 0 0 x 1 d d d d d d d d 1 d d d d d d d d 1 P
MCP47CXBXX 0 0 0 0
I2C Bus S 1 1 0 0 0 0 0 0 0 0 0 0 0 1 0 0 x 0 d d d d d d d d 0 d d d d d d d d 0 P
Example 2 (Command Error)
Master S 1 1 0 0 0 0 0 0 1 0 1 1 1 1 0 0 x 1 d d d d d d d d 1 d d d d d d d d 1 P
MCP47CXBXX 0 1 1 1
I2C Bus S 1 1 0 0 0 0 0 0 0 0 1 1 1 1 0 0 x 0 d d d d d d d d 1 d d d d d d d d 1 P
Note Once a command error has occurred (Example 2) the MCP47CVBXX will NACK until a Start condition occurs
DS20006089B-page 76 2018-2019 Microchip Technology Inc
MCP47CXBXX
FIGURE 7-3 Continuous Write Commands (Volatile Memory Only)
Note 1 The Acknowledge bit is generated by the MCP47CXBXX
2 At the falling edge of the SCL pin for the write command ACK bit the MCP47CXBXX device updates the value of the specified device register
3 This command sequence does not need to terminate (using the Stop bit) and the write command can be repeated (see continuous write format Section 754 ldquoContinuous Writes to Volatile Memoryrdquo)
4 Only functions when writing to Volatile registers (AD4AD0 = 00h through 0Ah)
D15
D14
D13
D12
D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
A A
Data to Write MSB Data to Write LSB
D15
D14
D13
D12
D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
A A
Data to Write MSB Data to Write LSB
D15
D14
D13
D12
D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
A A
Data to Write MSB Data to Write LSB
AD4
AD3
AD2
AD1
AD0
0 0 x A
Write Command
P
AD4
AD3
AD2
AD1
AD0
0 0 x A
Write Command
SA6
SSA5
SA4
SA3
SA2
SA1
SA0
0 AAD4
AD3
AD2
AD1
AD0
0 0 x A
Control Byte Write Command
Memory Address
I2C ACK Bit (1)
0
ADn
A
P
S x
SAn
0 0
I2C Start Bit
I2C Slave Address
I2C Write Bit Write Command
Reserved should be Set to lsquo0rsquo
I2C Stop Bit(3)
Dnn Register Data (to be written)(2)
Legend
2018-2019 Microchip Technology Inc DS20006089B-page 77
MCP47CXBXX
76 Read Command
Read commands are used to transfer data from thespecified memory location to the Host controller
The read command can be issued to both the volatileand nonvolatile memory locations During an MTPmemory write cycle the read command can only readthe volatile memory locations By reading the StatusRegister (0Ah) the Host controller can determinewhen the Write Cycle (twc) has been completed (viathe state of the MTPMA bit)
The read command formats include
bull Single Read
- Single Memory Address
- Last Memory Address Accessed
bull Continuous Reads
The MCP47CXBXX retains the last received devicememory address This means the MCP47CXBXX doesnot corrupt the device memory address after RepeatedStart or Stop conditions
761 SINGLE READ
The read command format writes two bytes the controlbyte and the read command byte (desired memoryaddress and the read command) and then has aRestart condition Then a second control byte istransmitted but this control byte indicates an I2C readoperation (RW bit = 1)
7611 Single Memory Address
Figure 7-4 shows the sequence for reading a specifiedmemory address
7612 Last Memory Address Accessed
This is useful for checking the status of the MTPMA bitor when writes to other I2C devices on the bus mustoccur between these memory reads The Master mustsend a Stop or Restart condition after the data word issent from the Slave Figure 7-5 shows the waveformsfor a single read of the last memory location accessed
762 CONTINUOUS READS
Continuous reads allow the devicersquos memory to beread quickly and are valid for all memory locations
Figure 7-7 shows the sequence for three continuousreads
For continuous reads instead of transmitting a Stop orRestart condition after the data transfer the Mastercontinually reads the data byte The sequence endswith the Master Not Acknowledging and then sending aStop or Restart
763 IGNORING AN I2C TRANSMISSION AND ldquoFALLING OFFrdquo THE BUS
The MCP47CXBXX expects to receive complete validI2C commands and will assume any command notdefined as a valid command is due to a bus corruptionthus entering a passive high condition on the SDAsignal All signals will be ignored until the next validStart condition and control byte are received
Note 1 During device communication if thedevice addresscommand combination isinvalid or an unimplemented address isspecified the MCP47CXBXX will NACKthat byte To reset the I2C state machinethe I2C communication must detect aStart bit
2 If the LAT pin is high (VIH) reads of theVolatile DAC register return the currentoutput value not the internal registervalue
3 The read commands operate the sameregardless of the state of the High-VoltageCommand (HVC) signal
DS20006089B-page 78 2018-2019 Microchip Technology Inc
MCP47CXBXX
FIGURE 7-4 Read Command ndash Single Memory Address
Note 1 The Master device is responsible for the AA signal If an A signal occurs the MCP47CXBXX will abort this transfer and release the bus
2 This Acknowledge bit is generated by the Master device
3 This command sequence does not need to terminate (using the Stop bit) and the read command can be repeated (see Section 762 ldquoContinuous Readsrdquo)
4 The Master device will Not Acknowledge and the MCP47CXBXX will release the bus so the Master device can generate a Stop or Repeated Start condition
5 The MCP47CXBXX retains the last received ldquodevice memory addressrdquo
6 The non-data bits of the Read Data Word will be output as lsquo0rsquosfor 12-bit devices bits D15D12 are lsquo0rsquosfor 10-bit devices bits D15D10 are lsquo0rsquosfor 8-bit devices bits D15D08 are lsquo0rsquos
Memory Address(5)
I2C ACK Bit(1)
SA6
SSA5
SA4
SA3
SA2
SA1
SA0
0
0
AAD4
AD3
AD2
AD1
AD0
1 1 x A
ADn
A
A
PS
x
SAn
1 1
I2C Start Bit
I2C Slave Address
I2C Write Bit
Read Command
Reserved Set to lsquo0rsquo
I2C Stop Bit(3)
Dnn
Data (read from memory)
Control Byte Read Command
Legend
Sr
0 0 0 0 D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
A PA
Data Read MSB Data Read LSB
SA6
SA5
SA4
SA3
SA2
SA1
SA0
1
Control Byte
A I2C ACK Bit(2)
I2C NACK Bit(4)A
1 I2C Read Bit
Sr I2C Start Bit Repeated
2018-2019 Microchip Technology Inc DS20006089B-page 79
MCP47CXBXX
FIGURE 7-5 Read Command ndash Last Memory Address Accessed
Note 1 The Master device is responsible for the AA signal If an A signal occurs the MCP47CXBXX will abort this transfer and release the bus
2 This Acknowledge bit is generated by the Master device
3 This command sequence does not need to terminate (using the Stop bit) and the read command can be repeated (see Section 762 ldquoContinuous Readsrdquo)
4 The Master device will Not Acknowledge and the MCP47CXBXX will release the bus so the Master device can generate a Stop or Repeated Start condition
5 The MCP47CXBXX retains the last received ldquoDevice Memory Addressrdquo
6 The non-data bits of the Read Data Word will be output as lsquo0rsquosfor 12-bit devices bits D15D12 are lsquo0rsquosfor 10-bit devices bits D15D10 are lsquo0rsquosfor 8-bit devices bits D15D08 are lsquo0rsquos
7 If the last device address written (via the read or write command) is invalid for a read then the read last memory address command will NACK due to the invalid device memory address
I2C ACK Bit(1)
SA6
SSA5
SA4
SA3
SA2
SA1
SA0
1 A
A
P
S
SAn
I2C Start Bit
I2C Slave Address I2C Stop Bit(3)Dnn Data (read from memory)
Control Byte
Legend
0 0 0 0 D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
A PA
Data Read MSB Data Read LSB
A I2C ACK Bit(2)
I2C NACK Bit(4)A1 I2C Read Bit
DS20006089B-page 80 2018-2019 Microchip Technology Inc
MCP47CXBXX
FIGURE 7-6 I2C ACKNACK Behavior (Read Command Example)
Read 1 Word Command
S Slave Address
RW
AC
K Command
AC
K
Master SS
A6
SA
5S
A4
SA
3S
A2
SA
1S
A0 0 1
AD
4A
D3
AD
2A
D1
AD
0C
1C
0x
1
Sr
Slave Address RW
AC
K
Data Byte AC
K
Data Byte AC
K
P
Master (Continued) Sr
SA
6S
A5
SA
4S
A3
SA
2S
A1
SA
0
1 1
D1
5D
14
D1
3D
12
D11
D1
0D
09
D0
8 1
D0
7D
06
D0
5D
04
D0
3D
02
D0
1D
00 1 P
Example 1 (No Command Error)
Master S 1 1 0 0 0 0 0 0 1 0 0 0 0 1 1 1 x 1
MCP47CXBXX 0 0
I2C Bus S 1 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 x 0
Master (Continued) S 0 0 0 0 1 0 0 1 1 1 1 P
MCP47CXBXX (Continued) 0 d d d d d d d d 0 d d d d d d d d 0
I2C Bus (Continued) S 0 0 0 0 0 0 0 1 0 d d d d d d d d 0 d d d d d d d d 0 P
Example 2 (Command Error)
Master S 1 1 0 0 0 0 0 0 1 0 1 1 1 1 0 0 x 1
MCP47CXBXX 0 1
I2C Bus S 1 1 0 0 0 0 0 0 0 0 1 1 1 1 0 0 x 1
Master (Continued) S 1 1 0 0 0 0 0 1 1 1 1 P
MCP47CXBXX (Continued) 0 0 1
I2C Bus (Continued) S 1 1 0 0 0 0 0 1 0 0 1 P
Note 1 Once a command error has occurred (Example 2) the MCP47CXBXX will NACK until a Start condition occurs
2 For command error case (Example 2) the data read is from the register of the last valid address loaded into the device
2018-2019 Microchip Technology Inc DS20006089B-page 81
MCP47CXBXX
FIGURE 7-7 Continuous Read Command of Specified Address
Note 1 The Master device is responsible for the AA signal If an A signal occurs the MCP47CXBXX will abort this transfer and release the bus
2 This Acknowledge bit is generated by the Master device
3 This command sequence does not need to terminate (using the Stop bit) and the read command can be repeated (see Section 762 ldquoContinuous Readsrdquo)
4 The Master device will Not Acknowledge and the MCP47CXBXX will release the bus so the Master device can generate a Stop or Repeated Start condition
5 The MCP47CXBXX retains the last received ldquoDevice Memory Addressrdquo
6 The non-data bits of the Read Data Word will be output as lsquo0rsquosfor 12-bit devices bits D15D12 are lsquo0rsquosfor 10-bit devices bits D15D10 are lsquo0rsquosfor 8-bit devices bits D15D08 are lsquo0rsquos
Memory Address(5)
I2C ACK Bit(1)
SA6
SSA5
SA4
SA3
SA2
SA1
SA0
0
0
AAD4
AD3
AD2
AD1
AD0
1 1 x A
ADn
A
A
PS
x
SAn
1 1
I2C Start Bit
I2C Slave Address
I2C Write Bit
Read Command
Reserved Set to lsquo0rsquo
I2C Stop Bit(3)
Dnn Data (read from memory)
Control Byte Read Command
Legend
Sr
0 0 0 0 D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
A PA
Data Read MSB Data Read LSB
SA6
SA5
SA4
SA3
SA2
SA1
SA0
1
Control Byte
A I2C ACK Bit(2)
I2C NACK Bit(4)A
1 I2C Read Bit
Sr I2C Start Bit Repeated
0 0 0 0 D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
A A
Data Read MSB Data Read LSB
0 0 0 0 D11
D10
D09
D08
D07
D06
D05
D04
D03
D02
D01
D00
A A
Data Read MSB Data Read LSB
DS20006089B-page 82 2018-2019 Microchip Technology Inc
MCP47CXBXX
77 General Call Commands
The MCP47CXBXX Acknowledges the general calladdress command (00h in the first byte) General callcommands can be used to communicate to all deviceson the I2C bus (at the same time) that understand thegeneral call command The meaning of the general calladdress is always specified in the second byte (seeFigure 7-8)
If the second byte has a lsquo1rsquo in the LSb the specificationintends this to indicate a ldquoHardware General Callrdquo TheMCP47CXBXX will ignore this byte and all followingbytes (and A) until a Stop bit (P) is encountered
The MCP47CXBXX devices support the following I2Cgeneral call commands
bull General Call Reset (06h)
bull General Call Wake-up (0Ah)
The General Call Reset command format is specifiedby the I2C Specification The general call wake-upcommand is a Microchip-defined format The generalcall wake-up command will have all devices wake-up(that is exit the Power-Down mode)
The other two I2C specification command codes (04hand 00h) are not supported and therefore thosecommands are Not Acknowledged
If these 7-bit commands conflict with other I2C deviceson the bus the user will need two I2C buses to ensurethat the devices are on the correct bus for their desiredapplication functionality
FIGURE 7-8 General Call Formats
Note Refer to the ldquoNXP SpecificationrdquoUM10204 Rev 03 19 June 2007 docu-ment for more details on the general callspecifications The I2C specification doesnot allow lsquo00000000rsquo (00h) in the secondbyte
S 0 A 0 x x 0 A
General Call Address 7-Bit Command
0 00 0 0 0 0 x P000
I2C ACK Bit(1)A PS x xI2C Start Bit GC Command I2C Stop Bit(23)
Legend
x
Note 1 The Acknowledge bit is generated by the MCP47CXBXX
2 This command sequence does not need to terminate (using the Stop bit) and the general call com-mand can be repeated or another general call command can be sent Only the first command will be accepted by the MCP47CXBXX
2018-2019 Microchip Technology Inc DS20006089B-page 83
MCP47CXBXX
771 GENERAL CALL RESET
The I2C General Call Reset command forces a resetevent This is similar to the Power-On Reset exceptthat the reset delay timer is not started This commandallows multiple devices to be reset synchronously
The device performs General Call Reset if the secondbyte is lsquo00000110rsquo (06h) At the acknowledgment ofthis byte the device will perform the following tasks
bull Internal reset similar to a POR The contents of the MTP are loaded into the DAC registers
bull Analog output (VOUT) is available after the POR sequence has been completed
772 GENERAL CALL WAKE-UP
The I2C General Call Wake-Up command forces thedevice to exit from its Power-Down state (forces thePDxBPDxA bits to lsquo00rsquo) This command allows multipleMCP47CXBXX devices to wake up synchronously
The device performs General Call Wake-Up if thesecond byte (after the General Call Address) islsquo00001010rsquo (0Ah) At the acknowledgment of this bytethe device will perform the following task
bull The devicersquos volatile power-down bits (PDxBPDxA) are forced to lsquo00rsquo
FIGURE 7-9 General Call Reset Command
FIGURE 7-10 General Call Wake-up Command
Note 1 The Acknowledge bit is generated by the MCP47CXBXX
2 At the falling edge of the SCL pin for the General Call Reset command ACK bit theMCP47CXBXX device is reset
3 This command sequence does not need to terminate (using the Stop bit) and the General Call Reset command can be repeated or the general call wake-up command can be sent Only the first command will be accepted by the MCP47CXBXX
S 0 A 0 1 1 0 A
General Call Address 7-Bit Command
0 00 0 0 0 0 0 P000
I2C ACK Bit(1) A PS 1 1I2C Start Bit Reset Command I2C Stop Bit(23)
Legend
0
Note 1 The Acknowledge bit is generated by the MCP47CXBXX
2 At the rising edge of the last data bit for the general call wake-up command the volatile Power-Down bits (PDxBPDxA) are forced to lsquo00rsquo
3 This command sequence does not need to terminate (using the Stop bit) and the general call wake-up command can be repeated or the General Call Reset command can be sent
S 0 A 0 0 1 0 A
General Call Address 7-Bit Command
0 00 0 0 0 0 1 P000
I2C ACK Bit(1)A PS 0 1I2C Start Bit Reset Command I2C Stop Bit(3)
Legend
1
DS20006089B-page 84 2018-2019 Microchip Technology Inc
MCP47CXBXX
80 TYPICAL APPLICATIONS
The MCP47CXBXX devices are general purposesingledual channel voltage output DACs for variousapplications where a precision operation with lowpower is needed
Applications generally suited for the devices are
bull Set Point or Offset Trimming
bull Sensor Calibration
bull Portable Instrumentation (Battery-Powered)
bull Motor Control
81 Connecting to the I2C Bus Using Pull-up Resistors
The SCL and SDA pins of the MCP47CXBXX devicesare open-drain configurations These pins require apull-up resistor as shown in Figure 8-2
The pull-up resistor values (R1 and R2) for SCL andSDA pins depend on the operating speed (standardfast and high speed) and loading capacitance of the I2Cbus line A higher value of the pull-up resistor consumesless power but increases the signal transition time(higher RC time constant) on the bus line therefore itcan limit the bus operating speed The lower resistorvalue on the other hand consumes higher power butallows higher operating speed If the bus line has highercapacitance due to long metal traces or multiple deviceconnections to the bus line a smaller pull-up resistor isneeded to compensate for the long RC time constantThe pull-up resistor is typically chosen between 1 kand 10 kranges for Standard and Fast modes andless than 1 kfor High-Speed mode
811 DEVICE CONNECTION TEST
The user can test the presence of the device on the I2Cbus line using a simple I2C command This test can beachieved by checking an Acknowledge response fromthe device after sending a read or write commandFigure 8-1 shows an example with a read commandThe steps are
1 Set the RW bit ldquoHighrdquo in the devicersquos address byte
2 Check the ACK bit of the address byte If the device Acknowledges (ACK = 0) thecommand then the device is connectedotherwise it is not connected
3 Send Stop bit
FIGURE 8-1 I2C Bus Connection Test
1 2 3 4 5 6 7 8 9SCL
SDA A2 A1 A0 1StartBit
Address Byte
Address Bits
RW
StopBit
Device
AC
K
Response
A3A4A5A6
2018-2019 Microchip Technology Inc DS20006089B-page 85
MCP47CXBXX
82 Power Supply Considerations
The power source should be as clean as possible Thepower supply to the device is also used for the DACvoltage reference internally if the internal VDD isselected as the resistor ladderrsquos reference voltage(VRxBVRxA = 00)
Any noise induced on the VDD line can affect the DACperformance Typical applications will require a bypasscapacitor in order to filter out high-frequency noise onthe VDD line The noise can be induced onto the powersupplyrsquos traces or as a result of changes on the DAC out-put The bypass capacitor helps to minimize the effect ofthese noise sources on signal integrity Figure 8-2shows an example of using two bypass capacitors (a10 microF tantalum capacitor and a 01 microF ceramic capaci-tor) in parallel on the VDD line These capacitors shouldbe placed as close to the VDD pin as possible (within4 mm) If the application circuit has separate digital andanalog power supplies the VDD and VSS pins of thedevice should reside on the analog plane
FIGURE 8-2 Example Circuit
5
Analog
VDD
1
2
3
8
6
VDD SDA
SCL
VSS
VOUT0
7
R1 R2
To MCU
R1 and R2 are I2C pull-up resistors
R1 and R2
5 k-10 k for fSCL = 100 kHz to 400 kHz
~700 for fSCL = 34 MHz
C1 01 microF capacitor = Ceramic
C2 10 microF capacitor = Tantalum
C3 ~ 01 microF = Optional to reduce noise in VOUT pin
C4 01 microF capacitor = Ceramic
C5 10 microF capacitor = Tantalum
C6 01 microF capacitor = Ceramic
C2C1
MCP47CVBX2
Optional
(a) Circuit when VDD is selected as reference
Note VDD is connected to the reference circuit internally
(b) Circuit when external reference is used
Output
VREF
4 5
LATHVC
VOUT1
C4C3
Analog
VDD
1
2
3
8
6
VDD SDA
SCL
VSS
VOUT0
7To MCU
C2C1
MCP47CVBX2
Optional
Output
VREF
4
LATHVC
VOUT1
C5
Optional
VREF
C6
R1 R2
C4C3
DS20006089B-page 86 2018-2019 Microchip Technology Inc
MCP47CXBXX
83 Application Examples
The MCP47CXBXX devices are rail-to-rail outputDACs designed to operate with a VDD range of 27V to55V The internal output amplifier is robust enough todrive common small signal loads directly thuseliminating the cost and size of the external buffers formost applications The user can use the gain of 1 or 2of the output op amp by setting the Configurationregister bits The internal VDD or an external referencecan be used There are various user options and easy-to-use features that make the devices suitable forvarious modern DAC applications
Application examples include
bull Decreasing Output Step-Size
bull Building a ldquoWindowrdquo DAC
bull Bipolar Operation
bull Selectable Gain and Offset Bipolar Voltage Output
bull Designing a Double Precision DAC
bull Building Programmable Current Source
bull Serial Interface Communication Times
bull Software I2C Interface Reset Sequence
bull Power Supply Considerations
bull Layout Considerations
831 DC SET POINT OR CALIBRATION
A common application for the devices is a digitallycontrolled set point andor calibration of variableparameters such as sensor offset or slope Forexample the MCP47CVB2X provides 4096 outputsteps If the voltage reference is 4096V (where Gx = 0)the LSb size is 1 mV If a smaller output step-size isdesired a lower external voltage reference is needed
8311 Decreasing Output Step-Size
If the application is calibrating the bias voltage of adiode or transistor a bias voltage range of 08V may bedesired with about 200 microV resolution per step Twocommon methods to achieve small step-size are to usea lower VREF pin voltage or a voltage divider on theDACrsquos output
Using an external Voltage Reference (VREF) is anoption if the external reference is available with thedesired output voltage range However when using alow-voltage reference voltage occasionally the noisefloor causes an SNR error that is intolerable Using avoltage divider method is another option and providessome advantages when external voltage referenceneeds to be very low or when the desired outputvoltage is not available In this case a larger valuereference voltage is used while two resistors scale theoutput range down to the precise desired level
Figure 8-3 illustrates this concept A bypass capacitoron the output of the voltage divider plays a criticalfunction in attenuating the output noise of the DAC andthe induced noise from the environment
FIGURE 8-3 Example Circuit of Set Point or Threshold Calibration
EQUATION 8-1 VOUT AND VTRIP CALCULATIONS
R1
VCC+
VCC-
VOUT
I2C2-Wire
VREF
Optional
MCP47CVBXX
VDD
VOR2 C1
RSENSE
Comp
VDD
VTRIP
Vtrip VOUT
R2R1 R2+--------------------
=
VOUT = VREF bull G bull DAC Register Value
2N
2018-2019 Microchip Technology Inc DS20006089B-page 87
MCP47CXBXX
8312 Building a ldquoWindowrdquo DAC
When calibrating a set point or threshold of a sensortypically only a small portion of the DAC output range isutilized If the LSb size is adequate enough to meet theapplicationrsquos accuracy needs the unused range issacrificed without consequences If greater accuracy isneeded then the output range will need to be reducedto increase the resolution around the desired threshold
If the threshold is not near VREF 2 bull VREF or VSS thencreating a ldquowindowrdquo around the threshold has severaladvantages One simple method to create this ldquowindowrdquois to use a voltage divider network with a pull-up andpull-down resistor Figure 8-4 and Figure 8-6 illustratethis concept
FIGURE 8-4 Single-Supply ldquoWindowrdquo DAC
EQUATION 8-2 VOUT AND VTRIP CALCULATIONS
84 Bipolar Operation
Bipolar operation is achievable by utilizing an externaloperational amplifier This configuration is desirabledue to the wide variety and availability of op amps Thisallows a general purpose DAC with its cost andavailability advantages to meet almost any desiredoutput voltage range power and noise performance
Figure 8-5 illustrates a simple bipolar voltage sourceconfiguration R1 and R2 allow the gain to be selectedwhile R3 and R4 shift the DACs output to a selectedoffset Note that R4 can be tied to VDD instead of VSS ifa higher offset is desired
FIGURE 8-5 Digitally Controlled Bipolar Voltage Source Example Circuit
EQUATION 8-3 VOUT VOA+ AND VO CALCULATIONS
R1
VCC+
VCC-
VO
I2C2-Wire
VREF
Optional
MCP47CVBXX
VDD
VOUTR2 C1
R3
VCC+
VCC-
RSENSE
CompVTRIP
R23
R2R3
R2 R3+-------------------=
V23
VCC+R2 VCC-R3 +
R2 R3+------------------------------------------------------=
VTRIP
VOUTR23 V23R1+
R1 R23+---------------------------------------------------=
TheveninEquivalent
R1
R23
V23
VOUT VTRIP
VOUT = VREF bull G bull DAC Register Value
2N
R3
VCC+
VCC-
VO
I2C2-Wire
VREF
Optional
MCP47CVBXX
VDD
R2
VOUT
VIN
R1
R4 C1
VOA+
VOA+ = VOUT bull R4
R3 + R4
VOUT = VREF bull G bull DAC Register Value
2N
VO = VOA+ bull (1 + ) ndash VDD bull ( ) R2
R1
R2
R1
DS20006089B-page 88 2018-2019 Microchip Technology Inc
MCP47CXBXX
85 Selectable Gain and Offset Bipolar Voltage Output
In some applications precision digital control of theoutput range is desirable Figure 8-6 illustrates how touse the DAC devices to achieve this in a bipolar orsingle-supply application
This circuit is typically used for linearizing a sensorwhose slope and offset varies
The equation to design a bipolar ldquowindowrdquo DAC wouldbe utilized if R3 R4 and R5 are populated
851 BIPOLAR DAC EXAMPLE
An output step-size of 1 mV with an output range ofplusmn205V is desired for a particular application
The equation can be simplified to
EQUATION 8-4
EQUATION 8-5
FIGURE 8-6 Bipolar Voltage Source with Selectable Gain and Offset
EQUATION 8-6 VOUT VOA+ AND VO CALCULATIONS
EQUATION 8-7 BIPOLAR ldquoWINDOWrdquo DAC USING R4 AND R5
Step 1 Calculate the range +205V ndash (-205V) = 41V
Step 2 Calculate the resolution needed
41V1 mV = 4100
Since 212 = 4096 12-bit resolution is desired
Step 3 The amplifier gain (R2R1) multiplied byfull-scale VOUT (4096V) must be equal tothe desired minimum output to achieve bipo-lar operation Since any gain can be realizedby choosing resistor values (R1 + R2) theVREF value must be selected first If a VREFof 4096V is used solve for the amplifierrsquosgain by setting the DAC to 0 knowing thatthe output needs to be -205V
Step 4 Next solve for R3 and R4 by setting theDAC to 4096 knowing that the outputneeds to be +205V
R2ndash
R1---------
205ndash4096V-----------------=
If R1 = 20 k and R2 = 10 k the gain will be 05
R2
R1------
12---=
R4
R3 R4+ ------------------------
205V 05 4096V +15 4096V
-------------------------------------------------------23---= =
If R4 = 20 k then R3 = 10 k
R3
VCC+
VCC-
VOUT
I2C2-Wire
VREF
Optional
MCP47CVBXX
VDD
R2
VO
VIN
R1
R4C1
R5
Optional
VOA+
VCC+
VCC-
C1 = 01 microF
Offset Adjust Gain Adjust
VOUT = VREF bull G bull DAC Register Value
2N
VOA+ = VOUT bull R4 + VCC- bull R5
R3 + R4
VO = VOA+ bull (1 + ) ndash VIN bull ( ) R2
R1
R2
R1
TheveninEquivalent V45
VCC+R4 VCC-R5+
R4 R5+---------------------------------------------=
VIN+
VOUTR45 V45R3+
R3 R45+---------------------------------------------=
R45
R4R5
R4 R5+-------------------=
VO VIN+ 1R2
R1------+
VA
R2
R1------ ndash=
Offset Adjust Gain Adjust
2018-2019 Microchip Technology Inc DS20006089B-page 89
MCP47CXBXX
86 Designing a Double Precision DAC
Figure 8-7 shows an example design of a single-supplyvoltage output capable of up to 24-bit resolution Thisrequires two 12-bit DACs This design is simply avoltage divider with a buffered output
As an example if a similar application to the onedeveloped in Section 851 ldquoBipolar DAC Examplerdquorequired a resolution of 1 microV instead of 1 mV and arange of 0V to 41V then 12-bit resolution would not beadequate
FIGURE 8-7 Simple Double Precision DAC Using MCP47CVBX2
EQUATION 8-8 VOUT CALCULATION
87 Building Programmable Current Source
Figure 8-8 shows an example of building aprogrammable current source using a voltage followerThe current sensor resistor is used to convert the DACvoltage output into a digitally-selectable current source
The smaller RSENSE is the less power is dissipatedacross it However this also reduces the resolution thatthe current can be controlled at
FIGURE 8-8 Digitally-Controlled Current Source
88 Serial Interface Communication Times
Table 7-1 shows the timefrequency of the supportedoperations of the I2C serial interface for the differentserial interface operational frequencies This alongwith the VOUT output performance (such as slew rate)would be used to determine your applicationrsquos VolatileDAC register update rate
Step 1 Calculate the resolution needed
41V1 microV = 41 x 106 Since 222 = 42 x 106 a 22-bit resolution isdesired Since DNL = plusmn10 LSb this designcan be attempted with the 12-bit DAC
Step 2 Since DAC1rsquos VOUT1 has a resolution of1 mV its output only needs to be ldquopulledrdquo11000 to meet the 1 microV target DividingVOUT0 by 1000 would allow the applicationto compensate for DAC1rsquos DNL error
Step 3 If R2 is 100 then R1 needs to be 100 k
Step 4 The resulting transfer function is shown inEquation 8-8
R1
VCC+
VCC-
VOUT
I2C2-Wire
VREF
Optional
MCP47CVBX2
VDD
I2C2-Wire
VREF
Optional
MCP47CVBX2
VDD
R2
01 microF
VOUT0
VOUT1
(DAC0)
(DAC1)
VOUT =
Gx = Selected Op Amp Gain
VOUT0 R2 + VOUT1 R1
R1 + R2
VOUT0 = (VREF Gx DAC0 Register Value)4096 VOUT1 = (VREF Gx DAC1 Register Value)4096
Where
RSENSE
Ib
Load
IL
VCC+
VCC-
VOUT
IL
VOUT
Rsense---------------
1+-------------=
Ib
IL
----=
Common Emitter Current GainWhere
VDD
I2C2-Wire
VREF
Optional
MCP47CVBXX
VDD
(or VREF)
DS20006089B-page 90 2018-2019 Microchip Technology Inc
MCP47CXBXX
89 Software I2C Interface Reset Sequence
At times it may become necessary to perform aSoftware Reset sequence to ensure the MCP47CXBXXdevice is in a correct and known I2C interface state Thistechnique only resets the I2C state machine
This is useful if the MCP47CXBXX device powers up inan incorrect state (due to excessive bus noise etc) orif the Master device is reset during communicationFigure 8-9 shows the communication sequence tosoftware reset the device
FIGURE 8-9 Software Reset Sequence Format
The first Start bit will cause the device to reset from astate in which it is expecting to receive data from theMaster device In this mode the device is monitoringthe data bus in Receive mode and can detect if theStart bit forces an internal Reset
The nine bits of lsquo1rsquo are used to force a reset of thosedevices that could not be reset by the previous Start bitThis occurs only if the MCP47CXBXX is driving an A biton the I2C bus or is in Output mode (from a readcommand) and is driving a data bit of lsquo0rsquo onto the I2Cbus In both of these cases the previous Start bit couldnot be generated due to the MCP47CXBXX holding thebus low By sending out nine lsquo1rsquo bits it is ensured that thedevice will see an A bit (the Master device does not drivethe I2C bus low to Acknowledge the data sent by theMCP47CXBXX) which also forces the MCP47CXBXX toreset
The second Start bit is sent to address the rarepossibility of an erroneous write This could occur if theMaster device was reset while sending a write com-mand to the MCP47CXBXX and then as the Masterdevice returns to normal operation and issues a Startcondition while the MCP47CXBXX is issuing anAcknowledge In this case if the second Start bit is notsent (and the Stop bit was sent) the MCP47CXBXXcould initiate a write cycle
The Stop bit terminates the current I2C bus activity TheMCP47CXBXX waits to detect the next Start condition
This sequence does not affect any other I2C deviceswhich may be on the bus as they should disregard thisas an invalid command
810 Design Considerations
In the design of a system with the MCP47CXBXXdevices the following considerations should be takeninto account
bull Power Supply Considerations
bull Layout Considerations
8101 POWER SUPPLY CONSIDERATIONS
The typical application requires a bypass capacitor inorder to filter high-frequency noise which can beinduced onto the power supplyrsquos traces The bypasscapacitor helps to minimize the effect of these noisesources on signal integrity Figure 8-10 illustrates anappropriate bypass strategy
In this example the recommended bypass capacitorvalue is 01 microF This capacitor should be placed as close(within 4 mm) to the device power pin (VDD) as possible
The power source supplying these devices should beas clean as possible If the application circuit hasseparate digital and analog power supplies VDD andVSS should reside on the analog plane
FIGURE 8-10 Typical Microcontroller Connections
Note This technique is documented in AN1028ldquoRecommended Usage of Microchip I2CSerial EEPROM Devicesrdquo (DS01028)
Note The potential for this erroneous writeONLY occurs if the Master device is resetwhile sending a write command to theMCP47CVBXX
S lsquo1rsquo lsquo1rsquo lsquo1rsquo lsquo1rsquo lsquo1rsquo lsquo1rsquo lsquo1rsquo lsquo1rsquo S P
Start
Nine Bits of lsquo1rsquo
Start BitStop BitBit
VDD
VDD
VSS VSS
MC
P4
7CX
BX
X
01 microFP
ICreg
Mic
roc
on
tro
lle
r
01 microF
SCL
VOUT
VREF SDA
2018-2019 Microchip Technology Inc DS20006089B-page 91
MCP47CXBXX
8102 LAYOUT CONSIDERATIONS
Several layout considerations may be applicable toyour application These may include
bull Noise
bull PCB Area Requirements
81021 Noise
Inductively coupled AC transients and digital switchingnoise can degrade the input and output signal integritypotentially masking the MCP47CXBXX devicersquos perfor-mance Careful board layout minimizes these effectsand increases the Signal-to-Noise Ratio (SNR) Multi-layer boards utilizing a low-inductance ground planeisolated inputs isolated outputs and proper decouplingare critical to achieving the performance that the silicon iscapable of providing Particularly harsh environmentsmay require shielding of critical signals
Separate digital and analog ground planes arerecommended In this case the VSS pin and the groundpins of the VDD capacitors should be terminated to theanalog ground plane
81022 PCB Area Requirements
In some applications PCB area is a criteria for deviceselection Table 8-1 shows the typical packagedimensions and area for the different package options
Note Breadboards and wire-wrapped boardsare not recommended
TABLE 8-1 PACKAGE FOOTPRINT(1)
Package Package Footprint
Pin
s
Type Code
Dimensions (mm) Area (mm2)
Length Width
10 MSOP UN 300 490 1470
10 DFN MF 300 300 900
16 QFN MG 300 300 900
Note 1 Does not include recommended land pattern dimensions Dimensions are typical values
DS20006089B-page 92 2018-2019 Microchip Technology Inc
MCP47CXBXX
90 DEVELOPMENT SUPPORT
Development support can be classified into two groups
bull Development Tools
bull Technical Documentation
91 Development Tools
Several development tools are available to assist in yourdesign and evaluation of the MCP47CXBXX devicesThe currently available tools are shown in Table 9-1
Figure 9-1 shows how the ADM00309 bond-out PCBcan be populated to easily evaluate the MCP47CXBXXdevices Device evaluation can use the PICkittrade SerialAnalyzer to control the DAC Output registers and stateof the Configuration Control and Status registers
The ADM00309 boards may be purchased directlyfrom the Microchip web site at wwwmicrochipcom
92 Technical Documentation
Several additional technical documents are available toassist you in your design and development Thesetechnical documents include Application NotesTechnical Briefs and Design Guides Table 9-2 listssome of these documents
TABLE 9-1 DEVELOPMENT TOOLS(1)
Board Name Part Comment
MSOP-8 and MSOP-10 Evaluation Board ADM00309 The MSOP-8 and MSOP-10 Evaluation Board is a bond-out board that allows the system designer to quickly evaluate the operation of Microchip Technologyrsquos devices in any of the following packagesbull MSOP (810-pin)bull DIP (10 pin)
Note 1 Supports the PICkittrade Serial Analyzer See the Userrsquos Guide for additional information and requirements
TABLE 9-2 TECHNICAL DOCUMENTATION
Application Note Number
Title Literature
AN1326 Using the MCP4728 12-Bit DAC for LDMOS Amplifier Bias Control Applications DS01326
mdash Signal Chain Design Guide DS21825
mdash Analog Solutions for Automotive Applications Design Guide DS01005
2018-2019 Microchip Technology Inc DS20006089B-page 93
MCP47CXBXX
FIGURE 9-1 MCP47CXBXX Evaluation Board Circuit Using ADM00309
0
47k
Two Wire Jumpers to Connect thePICkittrade Serial Interface (I2C) to Device Pins
1 x 6 Male Header with 90deg Right Angle
MCP47CVBXX in MSOP-10 PackageInstalled in U1 Footprint
Connected toDigital Ground Connected to
Digital Power (VL) Plane
VDD SDA
SCL
(DGND) Plane
NCVOUT1 LATHVC
VSS
10 microF 47k
VOUT0
VREF
47Cx
Bxx
0
A1
A0
DS20006089B-page 94 2018-2019 Microchip Technology Inc
MCP47CXBXX
100 PACKAGING INFORMATION
101 Package Marking Information
Legend XXX Customer-specific informationY Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week lsquo01rsquo)NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package
Note In the event the full Microchip part number cannot be marked on one line it willbe carried over to the next line thus limiting the number of availablecharacters for customer-specific information
3e
3e
Part Number Code
MCP47CVB01-EMF BAJU
MCP47CVB11-EMF BAJX
MCP47CVB21-EMF BAJZ
MCP47CVB02-EMF BAJV
MCP47CVB12-EMF BAJY
MCP47CVB22-EMF BAKA
MCP47CMB01-EMF BAJV
MCP47CMB11-EMF BAJQ
MCP47CMB21-EMF BAJS
MCP47CMB02-EMF BAJP
MCP47CMB12-EMF BAJR
MCP47CMB22-EMF BAJT
XXXXXX
10-Lead MSOP
YWWNNN47CV01
Example
935256
XXXX
10-Lead DFN (3x3 mm)
PIN 1
YYWWNNN
BAJU
Example
PIN 1
1935256
2018-2019 Microchip Technology Inc DS20006089B-page 95
MCP47CXBXX
Part Number Code
MCP47CVB02-EMG AAD
MCP47CVB12-EMG AAE
MCP47CVB22-EMG AAF
MCP47CMB02-EMG AAA
MCP47CMB12-EMG AAB
MCP47CMB22-EMG AAC
XXX
16-Lead QFN (3x3 mm)
PIN 1
XYYWWNNN
Note For MCP47CVB02 MCP47CVB12 MCP47CVB22 MCP47CMB02 MCP47CMB12 and MCP47CMB22) devices
AAD
Example
PIN 1
1935256
DS20006089B-page 96 2018-2019 Microchip Technology Inc
MCP47CXBXX
Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging
UN
2018-2019 Microchip Technology Inc DS20006089B-page 97
MCP47CXBXX
Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging
UN
DS20006089B-page 98 2018-2019 Microchip Technology Inc
MCP47CXBXX
10-Lead Plastic Micro Small Outline Package (UN) [MSOP]
Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging
2018-2019 Microchip Technology Inc DS20006089B-page 99
MCP47CXBXX
Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging
DS20006089B-page 100 2018-2019 Microchip Technology Inc
MCP47CXBXX
Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging
2018-2019 Microchip Technology Inc DS20006089B-page 101
MCP47CXBXX
Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging
DS20006089B-page 102 2018-2019 Microchip Technology Inc
MCP47CXBXX
Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging
2018-2019 Microchip Technology Inc DS20006089B-page 103
MCP47CXBXX
Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging
DS20006089B-page 104 2018-2019 Microchip Technology Inc
MCP47CXBXX
Note For the most current package drawings please see the Microchip Packaging Specification located at httpwwwmicrochipcompackaging
2018-2019 Microchip Technology Inc DS20006089B-page 105
MCP47CXBXX
NOTES
DS20006089B-page 106 2018-2019 Microchip Technology Inc
MCP47CXBXX
APPENDIX A REVISION HISTORY
Revision B (June 2019)
bull Corrected the Internal Band Gap voltage throughout the document
bull Updated the Block Diagrams
bull Updated DC Characteristics table
bull Added Section 112 Latch Pin (LAT) Timing
bull Updated Figure 1-3 Figure 1-4 and Figure 4-1
bull Updated Table 1-3 Table 1-5 Table 3-2 and Table 4-1
bull Updated Section 35 ldquoLatchHigh-Voltage Command Pin (LATHVC)rdquo
bull Updated Section 422 ldquoNonvolatile Register Memory (MTP)rdquo
bull Updated Section 523 ldquoUsing an External VREF Source in Buffered Moderdquo
bull Updated Section 532 ldquoOutput Voltagerdquo
bull Various typographical edits
Revision A (September 2018)
bull Original release of this document
2018-2019 Microchip Technology Inc DS20006089B-page 107
MCP47CXBXX
NOTES
DS20006089B-page 108 2018-2019 Microchip Technology Inc
MCP47CXBXX
APPENDIX B I2C SERIAL INTERFACE
This I2C is a two-wire interface that allows multipledevices to be connected to the two-wire bus Figure B-1shows a typical I2C interface connection
FIGURE B-1 Typical I2C Interface
B1 Overview
A device that sends data onto the bus is defined as atransmitter and a device receiving data is defined as areceiver The bus has to be controlled by a Masterdevice which generates the Serial Clock (SCL) con-trols the bus access and generates the Start and Stopconditions Devices that do not generate a serial clockwork as Slave devices Both Master and Slave canoperate as transmitter or receiver but the Masterdevice determines which mode is activated Communi-cation is initiated by the Master (microcontroller) whichsends the Start bit followed by the Slave address byteThe first byte transmitted is always the Slave addressbyte which contains the device code the address bitsand the RW bit
The I2C interface specifies different communication bitrates These are referred to as Standard Fast or High-Speed modes and the MCP47CXBXX supports thesethree modes The clock rates (bit rate) of these modesare
bull Standard mode Up to 100 kHz (kbits)
bull Fast mode Up to 400 kHz (kbits)
bull High-Speed mode (HS mode) Up to 34 MHz (Mbits)
The I2C protocol supports two addressing modes
bull 7-Bit Slave Addressing
bull 10-Bit Slave Addressing (allows more devices on the I2C bus)
Only 7-Bit Slave Addressing will be discussed in thissection
The I2C serial protocol allows multiple Master deviceson the I2C bus This is referred to as ldquoMulti-Masterrdquo Forthis all Master devices must support Multi-Masteroperation In this configuration all Master devices mon-itor their communication If they detect that they wish totransmit a bit that is a logic high but is detected as alogic low (some other Master device driving) they ldquogetoffrdquo the bus That is they stop their communication andcontinue to listen to determine if the communication isdirected towards them
The I2C serial protocol only defines the field types fieldlengths timings etc of a frame The frame contentdefines the behavior of the device For details on theframe content (commandsdata) refer to Section 70Device Commands
The I2C serial protocol defines some commands calledldquoGeneral Call Addressingrdquo which allow the Masterdevice to communicate to all Slave devices on the I2Cbus
SCL SCL
Slave
SDA SDA
Master
Typical I2C Interface Connections
Other Devices
Note Refer to the ldquoNXP SpecificationUM10204rdquo Rev 06 4 April 2014document for more details on theI2C specifications
2018-2019 Microchip Technology Inc DS20006089B-page 109
MCP47CXBXX
B2 Signal Descriptions
The I2C interface uses two pins (signals) These are
bull SDA (Serial Data)bull SCL (Serial Clock)
B21 SERIAL DATA (SDA)
The Serial Data (SDA) signal is the data signal of thedevice The value on this pin is latched on the risingedge of the SCL signal when the signal is an input
With the exception of the Start (Restart) and Stop con-ditions the high or low state of the SDA pin can onlychange when the clock signal on the SCL pin is lowDuring the high period of the clock the SDA pinrsquos value(high or low) must be stable Changes in the SDA pinrsquosvalue while the SCL pin is high will be interpreted as aStart or a Stop condition
B22 SERIAL CLOCK (SCL)
The Serial Clock (SCL) signal is the clock signal of thedevice The rising edge of the SCL signal latches thevalue on the SDA pin
Depending on the Clock Rate mode the interface willdisplay different characteristics
B3 I2C Operation
B31 I2C BIT STATES AND SEQUENCE
Figure B-8 shows the I2C transfer sequence whileFigure B-7 shows the bit definitions The serial clock isgenerated by the Master The following definitions areused for the bit states
bull Start Bit (S)bull Data Bitbull Acknowledge (A) Bit (driven low)
No Acknowledge (A) bit (not driven low)bull Repeated Start Bit (Sr)bull Stop Bit (P)
B311 Start Bit
The Start bit (see Figure B-2) indicates the beginning ofa data transfer sequence The Start bit is defined as theSDA signal falling when the SCL signal is ldquohighrdquo
FIGURE B-2 Start Bit
B312 Data Bit
The SDA signal may change state while the SCL signalis low While the SCL signal is high the SDA signalMUST be stable (see Figure B-3)
FIGURE B-3 Data Bit
B313 Acknowledge (A) Bit
The A bit (see Figure B-4) is typically a response fromthe receiving device to the transmitting deviceDepending on the context of the transfer sequence theA bit may indicate different things Typically the Slavedevice will supply an A response after the Start bit andeight ldquodatardquo bits have been received An A bit has theSDA signal low while the A bit has the SDA signal high
FIGURE B-4 Acknowledge Waveform
Table B-1 shows some of the conditions where theSlave device issues the A or Not A (A)
If an error condition occurs (such as an A instead of A)then a Start bit must be issued to reset the commandstate machine
SDA
SCL
S
1st Bit 2nd Bit
TABLE B-1 MCP47CXBXX AA RESPONSES
EventAcknowledge Bit Response
Comment
General Call A
Slave Address Valid
A
Slave Address Not Valid
A
Bus Collision NA I2C module resets or is a ldquoDonrsquot Carerdquo if the collision occurs on the Masterrsquos ldquoStart bitrdquo
SDA
SCL
Data Bit
1st Bit 2nd Bit
A
8
D0
9
SDA
SCL
DS20006089B-page 110 2018-2019 Microchip Technology Inc
MCP47CXBXX
B314 Repeated Start Bit
The Repeated Start bit (see Figure B-5) indicates thecurrent Master device wishes to continue communicat-ing with the current Slave device without releasing theI2C bus The Repeated Start condition is the same asthe Start condition except that the Repeated Start bitfollows a Start bit (with the Data bits + A bit) and not aStop bit
The Start bit is the beginning of a data transfersequence and is defined as the SDA signal falling whenthe SCL signal is ldquohighrdquo
FIGURE B-5 Repeated Start Condition Waveform
B315 Stop Bit
The Stop bit (see Figure B-6) Indicates the end of theI2C data transfer sequence The Stop bit is defined asthe SDA signal rising when the SCL signal is ldquohighrdquo
A Stop bit should reset the I2C interface of the Slavedevice
FIGURE B-6 Stop Condition Receive or Transmit Mode
B32 CLOCK STRETCHING
ldquoClock Stretchingrdquo is something the receiving devicecan do to allow additional time to ldquorespondrdquo to theldquodatardquo that has been received
B33 ABORTING A TRANSMISSION
If any part of the I2C transmission does not meet thecommand format it is aborted This can be intentionallyaccomplished with a Start or Stop condition This is doneso that noisy transmissions (usually an extra Start or Stopcondition) are aborted before they corrupt the device
FIGURE B-7 Typical 8-Bit I2C Waveform Format
FIGURE B-8 I2C Data States and Bit Sequence
Note 1 A bus collision during the Repeated Startcondition occurs if
bull SDA is sampled low when SCL goes from low-to-high
bull SCL goes low before SDA is asserted low This may indicate that another Master is attempting to transmit a data lsquo1rsquo
SDA
SCL
Sr = Repeated Start
1st Bit
SCL
SDA AA
P
1st Bit
SDA
SCL
S 2nd Bit 3rd Bit 4th Bit 5th Bit 6th Bit 7th Bit 8th Bit PAA
SCL
SDA
StartCondition
StopCondition
Data Allowedto Change
Data orA Valid
2018-2019 Microchip Technology Inc DS20006089B-page 111
MCP47CXBXX
B34 SLOPE CONTROL
As the device transitions from High-Speed (HS) mode toFats (FS) mode the slope control parameter will changefrom the HS specification to the FS specification
For FS and HS modes the device has a spikesuppression and a Schmitt Trigger at SDA and SCLinputs
B35 DEVICE ADDRESSING
The I2C Slave address control byte is the first bytereceived following the Start condition from the Masterdevice This byte has seven bits to specify the Slaveaddress and the readwrite control bit
Figure B-9 shows the I2C Slave address byte formatwhich contains the seven address bits and aReadWrite (RW) bit
FIGURE B-9 I2C Slave Address Control Byte
B36 HS MODE
The I2C specification requires that a High-Speed modedevice must be lsquoactivatedrsquo to operate in High-Speed(34 Mbits) mode This is done by the Master sending
a special address byte following the Start bit This byteis referred to as the High-Speed Master Mode Code(HSMMC)
The device can now communicate at up to 34 Mbitson SDA and SCL lines The device will switch out of theHS mode on the next Stop condition
The Master code is sent as follows
1 Start condition (S)
2 High-Speed Master Mode Code (lsquo0000 1xxxrsquo)the lsquoxxxrsquo bits are unique to the HS mode Master
3 No Acknowledge (A)
After switching to HS mode the next transferred byte isthe I2C control byte which specifies the device to com-municate with and any number of data bytes plusAcknowledgments The Master device can then eitherissue a Repeated Start bit to address a different device(at high speed) or a Stop bit to return to faststandardbus speed After the Stop bit any other Master device(in a Multi-Master system) can arbitrate for the I2C bus
See Figure B-10 for an illustration of an HS modecommand sequence
For more information on the HS mode or other I2Cmodes refer to the ldquoNXP I2C Specificationrdquo
B361 Slope Control
The slope control on the SDA output is differentbetween the FastStandard Speed and the High-SpeedClock modes of the interface
B362 Pulse Gobbler
The pulse gobbler on the SCL pin is automaticallyadjusted to suppress spikes lt10 ns during HS mode
FIGURE B-10 HS Mode Sequence
Start BitReadWrite Bit
Address Byte
RW ACK
Acknowledge Bit
7-Bit Slave Address
A6 A5 A4 A3 A2 A1 A0
S A0000 1xxxrsquob Sr ASlave Address AAData
P
S = Start bit
Sr = Repeated Start bit
A = Acknowledge bit
A = Not Acknowledge bit
RW = ReadWrite bit
RW
P = Stop bit (Stop condition terminates HS mode)
FS Mode HS Mode
HS Mode Continues
FS Mode
Sr ASlave Address RWHS Select Byte Control Byte CommandData Byte(s)
Control Byte
DS20006089B-page 112 2018-2019 Microchip Technology Inc
MCP47CXBXX
B37 GENERAL CALL
The general call is a method the Master device can useto communicate with all other Slave devices In a Multi-Master application the other Master devices areoperating in Slave mode The general call address hastwo documented formats These are shown inFigure B-11
The I2C specification documents three 7-bit commandbytes
The I2C specification does not allow lsquo00000000rsquo (00h)in the second byte Also the lsquo00000100rsquo andlsquo00000110rsquo functionalities are defined by the specifica-tion Lastly a data byte with a lsquo1rsquo in the LSb indicates aldquoHardware General Callrdquo
For details on the operation of the MCP47CXBXXdevicersquos general call commands see Section 73ldquoGeneral Call Commandsrdquo
FIGURE B-11 General Call Formats
Note Only one general call command per issueof the general call control byte Anyadditional general call commands areignored and Not Acknowledged
00 0 0S 0 0 0 0 xx x x xA x x 0 A P
General Call Address
Second Byte
7-Bit Command
Reserved 7-Bit Commands (by I2C Specification ndash ldquoNXP Specification UM10204rdquo Rev 06 4 April 2014)lsquo0000 011rsquobrsquo ndash Reset and Write Programmable Part of Slave Address by Hardwarelsquo0000 010rsquobrsquo ndash Write Programmable Part of Slave Address by Hardware
The Following is a ldquoHardware General Callrdquo Format
00 0 0S 0 0 0 0 xx x x xA x x 1 A
General Call Address
Second Byte
Master Address
xx x x x x x x A P
n Occurrences of (Data + A)
This Indicates a ldquoHardware General Callrdquo
2018-2019 Microchip Technology Inc DS20006089B-page 113
MCP47CXBXX
NOTES
DS20006089B-page 114 2018-2019 Microchip Technology Inc
MCP47CXBXX
APPENDIX C TERMINOLOGY
C1 Resolution
The resolution is the number of DAC output states thatdivide the Full-Scale Range (FSR) For the 12-bit DACthe resolution is 212 meaning the DAC code rangesfrom 0 to 4095
C2 Least Significant Bit (LSb)
This is the voltage difference between two successivecodes For a given output voltage range it is divided bythe resolution of the device (Equation C-1) The rangemay be VDD (or VREF) to VSS (ideal) the DAC registercodes across the linear range of the output driver(Measured 1) or full scale to zero scale (Measured 2)
EQUATION C-1 LSb VOLTAGE CALCULATION
C3 Monotonic Operation
The monotonic operation means that the devicersquosOutput Voltage (VOUT) increases with every one codestep (LSb) increment (from VSS to the DACrsquos referencevoltage (VDD or VREF))
FIGURE C-1 VW (VOUT)
Note When there are 2N resistors in the resistorladder and 2N tap points the full-scaleDAC register code is the resistor element(1 LSb) from the source reference voltage(VDD or VREF)
2N = 4096 (MCP47CVB2X)= 1024 (MCP47CVB1X)= 256 (MCP47CVB0X)
Ideal
Measured 1
Measured 2
VLSb IDEAL VDD
2N
----------- or VREF
2N
-------------=
VLSb Measured VOUT(4032) VOUT(64)ndash
4032 64ndash ---------------------------------------------------------------=
VLSb
VOUT(FS) VOUT(ZS)ndash
2N
1ndash-----------------------------------------------------------=
40h
3Fh
3Eh
03h
02h
01h
00h
Wip
er
Cod
eVoltage (VW ~= VOUT)
VW ( Tap)
VS0
VS1
VS3
VS63
VS64
VW = VSn + VZS( Tap 0) n = 0
n =
2018-2019 Microchip Technology Inc DS20006089B-page 115
MCP47CXBXX
C4 Full-Scale Error (EFS)
The Full-Scale Error EFS (see Figure C-3) is the erroron the VOUT pin relative to the expected VOUT voltage(theoretical) for the maximum device DAC registercode (code FFFh for 12-bit code 3FFh for 10-bit andcode FFh for 8-bit) see Equation C-2 The error isdependent on the resistive load on the VOUT pin (andwhere that load is tied to such as VSS or VDD) Forloads (to VSS) greater than specified the full-scaleerror will be greater
The error in bits is determined by the theoretical voltagestep-size to give an error in LSb
EQUATION C-2 FULL-SCALE ERROR
C5 Zero-Scale Error (EZS)
The Zero-Scale Error EZS (see Figure C-2) is the differ-ence between the ideal and measured VOUT voltage withthe DAC register code equal to 000h (Equation C-3) Theerror is dependent on the resistive load on the VOUT pin(and where that load is tied to such as VSS or VDD) Forloads (to VDD) greater than specified the zero-scaleerror is greater
The error in bits is determined by the theoretical voltagestep-size to give an error in LSb
EQUATION C-3 ZERO-SCALE ERROR
C6 Total Unadjusted Error (ET)
The Total Unadjusted Error (ET) is the differencebetween the ideal and measured VOUT voltage Typi-cally calibration of the output voltage is implementedto improve the systemrsquos performance
The error in bits is determined by the theortical voltagestep-size to give an error in LSb
Equation C-4 shows the total unadjusted errorcalculation
EQUATION C-4 TOTAL UNADJUSTED ERROR CALCULATION
WhereEFS is expressed in LSb
VOUT(FS) is the VOUT voltage when the DAC register code is at full scale
VIDEAL(FS) is the ideal output voltage when theDAC register code is at full scale
VLSb(IDEAL) is the theoretical voltage step-size
EFS
VOUT(FS) VIDEAL(FS)ndash
VLSb IDEAL ----------------------------------------------------------------=
WhereEFS is expressed in LSb
VOUT(ZS) is the VOUT voltage when the DAC register code is at zero scale
VLSb(IDEAL) is the theoretical voltage step-size
EZS
VOUT(ZS)
VLSb(IDEAL)----------------------------=
Where
ET is expressed in LSb
VOUT_Actual(code) = The measured DAC output voltage at the specified code
VOUT_Ideal(code) = The calculated DAC output voltage at the specified code (code VLSb(Ideal))
VLSb(Ideal) = VREF Steps 12-bit = VREF4096 10-bit = VREF1024 8-bit = VREF256
ET
VOUT_Actual(code) VOUT_Ideal(code)ndash VLSb Ideal
--------------------------------------------------------------------------------------------------=
DS20006089B-page 116 2018-2019 Microchip Technology Inc
MCP47CXBXX
C7 Offset Error (EOS)
The Offset Error (EOS) is the delta voltage of the VOUTvoltage from the ideal output voltage at the specifiedcode This code is specified where the output amplifieris in the linear operating range for the MCP47CXBXXwe specify code 100 (decimal) Offset error does notinclude gain error which is illustrated in Figure C-2
This error is expressed in mV Offset error can benegative or positive The error can be calibrated bysoftware in application circuits
FIGURE C-2 Offset Error (Zero Gain Error)
C8 Offset Error Drift (EOSD)
The Offset Error Drift (EOSD) is the variation in offseterror due to a change in ambient temperature The off-set error drift is typically expressed in ppmdegC or microVdegC
C9 Gain Error (EG)
Gain Error (EG) is a calculation based on the idealslope using the voltage boundaries for the linear rangeof the output driver (eg code 100 and code 4000) seeFigure C-3) The gain error calculation nullifies thedevicersquos offset error
The gain error indicates how well the slope of the actualtransfer function matches the slope of the ideal transferfunction The gain error is usually expressed as a percentof Full-Scale Range ( of FSR) or in LSb FSR is theideal full-scale voltage of the DAC (see Equation C-5)
FIGURE C-3 Gain Error and Full-Scale Error Example
EQUATION C-5 GAIN ERROR EXAMPLE
C10 Gain Error Drift (EGD)
The Gain Error Drift (EGD) is the variation in gain errordue to a change in ambient temperature The gain errordrift is typically expressed in ppmdegC (of Full-ScaleRange)
Ideal Transfer
Actual
DAC Input Code0
Zero-ScaleError (EZS)
Offset
Function
64 4032
VO
UT
Error (EOS)
TransferFunction
VO
UT
Ideal Transfer
Actual
DAC Input Code0
Full-ScaleError (EFS)
Gain Error (EG)
Function
64 4032 4095
VREF
TransferFunction
( code = 4032)
Ideal TransferFunction Shifted byOffset Error(crosses at start ofdefined linear range)
Where
EG is expressed in of Full-Scale Range (FSR)
VOUT(4032) = The measured DAC output voltage at the specified code
VOUT_Ideal(4032) = The calculated DAC output voltage at the specified code(4032 VLSb(Ideal))
VOS = Measured offset voltage
VFull-Scale Range = Expected full-scale output value (such as the VREF voltage)
EG
VOUT(4032) VOSndash VOUT_Ideal(4032)ndash VFull-Scale Range
---------------------------------------------------------------------------------------------------- 100=
2018-2019 Microchip Technology Inc DS20006089B-page 117
MCP47CXBXX
C11 Integral Nonlinearity (INL)
The Integral Nonlinearity (INL) error is the maximumdeviation of an actual transfer function from an idealtransfer function (straight line) passing through thedefined end-points of the DAC transfer function (afterOffset and Gain Errors have been removed)
For the MCP47CXBXX INL is calculated using thedefined end points DAC code 64 and code 4032 INLcan be expressed as a percentage of Full-Scale Range(FSR) or in LSb INL is also called relative accuracyEquation C-6 shows how to calculate the INL error inLSb and Figure C-4 shows an example of INL accuracy
Positive INL means a VOUT voltage higher than theideal one Negative INL means a VOUT voltage lowerthan the ideal one
EQUATION C-6 INL ERROR
FIGURE C-4 INL Accuracy
C12 Differential Nonlinearity (DNL)
The Differential Nonlinearity (DNL) error (seeFigure C-5) is the measure of step-size between codesin an actual transfer function The ideal step-sizebetween codes is 1 LSb A DNL error of zero wouldimply that every code is exactly 1 LSb wide If the DNLerror is less than 1 LSb the DAC ensures monotonicoutput and no missing codes Equation C-7 shows howto calculate the DNL error between any two adjacentcodes in LSb
EQUATION C-7 DNL ERROR
FIGURE C-5 DNL Accuracy
Where
INL is expressed in LSb
VCalc_Ideal = Code VLSb(Measured) + VOS
VOUT(Code = n) = The measured DAC output voltage with a given DAC register code
VLSb(Measured) = For Measured (VOUT(4032) ndash VOUT(64))3968
VOS = Measured offset voltage
EINL
VOUT VCalc_Idealndash VLSb Measured
--------------------------------------------------=
010001000
AnalogOutput(LSb)
DAC Input Code011 111100 101
1
2
3
4
5
6
0
7
110
Ideal Transfer Function
Actual Transfer Function
INL = lt -1 LSb
INL = 05 LSb
INL = -1 LSb
Where
DNL is expressed in LSb
VOUT(Code = n) = The measured DAC output voltage with a given DAC register code
VLSb(Measured) = For Measured (VOUT(4032) ndash VOUT(64))3968
EDNL
VOUT(code = n+1) VOUT(code = n)ndash VLSb Measured
------------------------------------------------------------------------------------ 1ndash=
010001000
AnalogOutput(LSb)
DAC Input Code
011 111100 101
1
2
3
4
5
6
0
7
DNL = 2 LSb
DNL = 05 LSb
110
Ideal Transfer Function
Actual Transfer Function
DS20006089B-page 118 2018-2019 Microchip Technology Inc
MCP47CXBXX
C13 Settling Time
The settling time is the time delay required for the VOUTvoltage to settle into its new output value This time ismeasured from the start of code transition to when theVOUT voltage is within the specified accuracy
For the MCP47CXBXX the settling time is a measureof the time delay until the VOUT voltage reaches within05 LSb of its final value when the Volatile DAC registerchanges from 14 to 34 of the Full-Scale Range (12-bitdevice 400h to C00h)
C14 Major Code Transition Glitch
Major code transition glitch is the impulse energyinjected into the DAC analog output when the code inthe DAC register changes the state It is normally spec-ified as the area of the glitch in nV-Sec and is measuredwhen the digital code is changed by 1 LSb at the majorcarry transition (Example 011111 to 100000 or 100000 to 011111)
C15 Digital Feedthrough
The digital feedthrough is the glitch that appears at theanalog output caused by coupling from the digital inputpins of the device The area of the glitch is expressedin nV-Sec and is measured with a full-scale change(Example all lsquo0rsquos to all lsquo1rsquos and vice versa) on the digitalinput pins The digital feedthrough is measured whenthe DAC is not being written to the output register
C16 -3 dB Bandwidth
This is the frequency of the signal at the VREF pin thatcauses the voltage at the VOUT pin to fall to -3 dB froma static value on the VREF pin The output decreasesdue to the RC characteristics of the resistor ladder andthe characteristics of the output buffer
C17 Power Supply Sensitivity (PSS)
PSS indicates how the output of the DAC is affected bychanges in the supply voltage PSS is the ratio of thechange in VOUT to a change in VDD for mid-scale outputof the DAC The VOUT is measured while the VDD isvaried from 55V to 27V as a step (VREF voltage heldconstant) and expressed in which is the change of the DAC output voltage with respect to the change of the VDD voltage
EQUATION C-8 PSS CALCULATION
C18 Power Supply Rejection Ratio (PSRR)
PSRR indicates how the output of the DAC is affectedby changes in the supply voltage PSRR is the ratio ofthe change in VOUT to a change in VDD for full-scaleoutput of the DAC The VOUT is measured while theVDD is varied plusmn10 (VREF voltage held constant) andexpressed in dB or microVV
C19 VOUT Temperature Coefficient
The VOUT temperature coefficient quantifies the error inthe resistor ladderrsquos resistance ratio (DAC registercode value) and output buffer due to temperature drift
C20 Absolute Temperature Coefficient
The absolute temperature coefficient quantifies theerror in the end-to-end output voltage (nominal outputvoltage VOUT) due to temperature drift For a DAC thiserror is typically not an issue due to the ratiometricaspect of the output
C21 Noise Spectral Density
The noise spectral density is a measurement of thedevicersquos internally generated random noise and ischaracterized as a spectral density (voltage per radicHz)It is measured by loading the DAC to the mid-scalevalue and measuring the noise at the VOUT pin It ismeasured in nVradicHz
Where
PSS is expressed in
VOUT(55V) = The measured DAC output voltage with VDD = 55V
VOUT(27V) = The measured DAC output voltage with VDD = 27V
PSSVOUT(55V) VOUT(27V)ndash VOUT(55V)
55V 27Vndash 55V ----------------------------------------------------------------------------------------------------------=
2018-2019 Microchip Technology Inc DS20006089B-page 119
MCP47CXBXX
NOTES
DS20006089B-page 120 2018-2019 Microchip Technology Inc
MCP47CXBXX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information eg on pricing or delivery refer to the factory or the listed sales office
Device MCP47CXBXX 1 LSb INL Voltage Output Digital-to-Analog Converters with I2C Interface81012-Bit Resolution SingleDual Outputsand VolatileMTP Memory
Tape and Reel T = Tape and Reel
Temperature Range
E = -40degC to +125degC (Extended)
Package MF = Plastic Dual Flat No Lead Package (DFN) 3x3x09 mm 10-Lead
MG = Plastic Quad Flat No Lead Package (QFN) 3x3x09 mm 16-Lead
UN = Plastic Micro Small Outline Package (MSOP) 10-Lead
Examples
a) MCP47CVB01-EMF 1 LSb INL Voltage OutputDigital-to-Analog Converter 8-Bit Resolution Extended Temperature 10LD DFN with Volatile Memory
b) MCP47CVB01T-EMF 1 LSb INL Voltage Output Digital-to-Analog Converter 8-Bit Resolution Tape and Reel Extended Temperature 10LD DFN with Volatile Memory
a) MCP47CVB12-EMG 1 LSb INL Voltage Output Digital-to-Analog Converter 10-Bit Resolution Extended Temperature 16LD QFN with Volatile Memory
b) MCP47CVB12T-EMG 1 LSb INL Voltage Output Digital-to-Analog Converter 10-Bit Resolution Tape and Reel Extended Temperature 16LD QFN with Volatile Memory
a) MCP47CMB21-EUN 1 LSb INL Voltage Output Digital-to-Analog Converter 12-Bit Resolution Extended Temperature 10LD MSOP with Nonvolatile Memory
b) MCP47CMB21T-EUN 1 LSb INL Voltage Output Digital-to-Analog Converter 12-Bit Resolution Tape and Reel Extended Temperature 10LD MSOP with Nonvolatile Memory
PART NO X
TemperatureRange
Device
XX
Package
X(1)
Tape andReel
Note 1 Tape and Reel identifier only appears in the catalog part number description This identifier is used for ordering purposes and is not printed on the device package Check with your Microchip Sales Office for package availability with the Tape and Reel option
-
2018-2019 Microchip Technology Inc DS20006089B-page 121
MCP47CXBXX
NOTES
DS20006089B-page 122 2018-2019 Microchip Technology Inc
Note the following details of the code protection feature on Microchip devices
bull Microchip products meet the specification contained in their particular Microchip Data Sheet
bull Microchip believes that its family of products is one of the most secure families of its kind on the market today when used in the intended manner and under normal conditions
bull There are dishonest and possibly illegal methods used to breach the code protection feature All of these methods to our knowledge require using the Microchip products in a manner outside the operating specifications contained in Microchiprsquos Data Sheets Most likely the person doing so is engaged in theft of intellectual property
bull Microchip is willing to work with the customer who is concerned about the integrity of their code
bull Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code Code protection does not mean that we are guaranteeing the product as ldquounbreakablerdquo
Code protection is constantly evolving We at Microchip are committed to continuously improving the code protection features of ourproducts Attempts to break Microchiprsquos code protection feature may be a violation of the Digital Millennium Copyright Act If such actsallow unauthorized access to your software or other copyrighted work you may have a right to sue for relief under that Act
Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates It is your responsibility toensure that your application meets with your specificationsMICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED WRITTEN OR ORAL STATUTORY OROTHERWISE RELATED TO THE INFORMATIONINCLUDING BUT NOT LIMITED TO ITS CONDITIONQUALITY PERFORMANCE MERCHANTABILITY ORFITNESS FOR PURPOSE Microchip disclaims all liabilityarising from this information and its use Use of Microchipdevices in life support andor safety applications is entirely atthe buyerrsquos risk and the buyer agrees to defend indemnify andhold harmless Microchip from any and all damages claimssuits or expenses resulting from such use No licenses areconveyed implicitly or otherwise under any Microchipintellectual property rights unless otherwise stated
2018-2019 Microchip Technology Inc
For information regarding Microchiprsquos Quality Management Systems please visit wwwmicrochipcomquality
TrademarksThe Microchip name and logo the Microchip logo Adaptec AnyRate AVR AVR logo AVR Freaks BesTime BitCloud chipKIT chipKIT logo CryptoMemory CryptoRF dsPIC FlashFlex flexPWR HELDO IGLOO JukeBlox KeeLoq Kleer LANCheck LinkMD maXStylus maXTouch MediaLB megaAVR Microsemi Microsemi logo MOST MOST logo MPLAB OptoLyzer PackeTime PIC picoPower PICSTART PIC32 logo PolarFire Prochip Designer QTouch SAM-BA SenGenuity SpyNIC SST SST Logo SuperFlash Symmetricom SyncServer Tachyon TempTrackr TimeSource tinyAVR UNIO Vectron and XMEGA are registered trademarks of Microchip Technology Incorporated in the USA and other countries
APT ClockWorks The Embedded Control Solutions Company EtherSynch FlashTec Hyper Speed Control HyperLight Load IntelliMOS Libero motorBench mTouch Powermite 3 Precision Edge ProASIC ProASIC Plus ProASIC Plus logo Quiet-Wire SmartFusion SyncWorld Temux TimeCesium TimeHub TimePictra TimeProvider Vite WinPath and ZL are registered trademarks of Microchip Technology Incorporated in the USA
Adjacent Key Suppression AKS Analog-for-the-Digital Age Any Capacitor AnyIn AnyOut BlueSky BodyCom CodeGuard CryptoAuthentication CryptoAutomotive CryptoCompanion CryptoController dsPICDEM dsPICDEMnet Dynamic Average Matching DAM ECAN EtherGREEN In-Circuit Serial Programming ICSP INICnet Inter-Chip Connectivity JitterBlocker KleerNet KleerNet logo memBrain Mindi MiWi MPASM MPF MPLAB Certified logo MPLIB MPLINK MultiTRAK NetDetach Omniscient Code Generation PICDEM PICDEMnet PICkit PICtail PowerSmart PureSilicon QMatrix REAL ICE Ripple Blocker SAM-ICE Serial Quad IO SMART-IS SQI SuperSwitcher SuperSwitcher II Total Endurance TSHARC USBCheck VariSense ViewSpan WiperLock Wireless DNA and ZENA are trademarks of Microchip Technology Incorporated in the USA and other countries
SQTP is a service mark of Microchip Technology Incorporated in the USAThe Adaptec logo Frequency on Demand Silicon Storage Technology and Symmcom are registered trademarks of Microchip Technology Inc in other countriesGestIC is a registered trademark of Microchip Technology Germany II GmbH amp Co KG a subsidiary of Microchip Technology Inc in other countries All other trademarks mentioned herein are property of their respective companies
copy 2018-2019 Microchip Technology Incorporated All Rights Reserved
ISBN 978-1-5224-4636-1
DS20006089B-page 123
DS20006089B-page 124 2018-2019 Microchip Technology Inc
AMERICASCorporate Office2355 West Chandler BlvdChandler AZ 85224-6199Tel 480-792-7200 Fax 480-792-7277Technical Support httpwwwmicrochipcomsupportWeb Address wwwmicrochipcom
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Worldwide Sales and Service
051419
- Features
- General Description
- Applications
- MCP47CMBX1 Block Diagram (Single-Channel Output)
- MCP47CMBX2 Block Diagram (Dual Channel Output)
- Family Device Features
- 10 Electrical Characteristics
-
- Absolute Maximum Ratings(dagger)
-
- DC Characteristics
- DC Characteristics (Continued)
- DC Characteristics (Continued)
- DC Characteristics (Continued)
- DC Characteristics (Continued)
- DC Characteristics (Continued)
- DC Characteristics (Continued)
- DC Characteristics (Continued)
- DC Characteristics (Continued)
-
- DC Notes
- 11 Timing Waveforms and Requirements
-
- 111 Wiper Settling Time
-
- FIGURE 1-1 VOUT Settling Time Waveforms
- TABLE 1-1 Wiper Settling Timing
-
- 112 Latch Pin (LAT) Timing
-
- FIGURE 1-2 LAT Pin Waveforms
- TABLE 1-2 LAT Pin Timing
-
- 12 I2C Mode Timing Waveforms and Requirements
-
- FIGURE 1-3 Power-on and Brown-out Reset Waveforms
- FIGURE 1-4 I2C Power-Down Command Timing
- TABLE 1-3 Reset Timing
- FIGURE 1-5 I2C Bus StartStop Bits and HVC Timing Waveforms
- TABLE 1-4 I2C Bus StartStop Bits and LAT Requirements
- FIGURE 1-6 I2C Bus Data Timing Waveforms
- TABLE 1-5 I2C Bus Requirements (Slave Mode)
- TABLE 1-5 I2C Bus Requirements (Slave Mode) (Continued)
-
- Timing Notes
-
- Temperature Specifications
- 20 Typical Performance Curves
-
- 21 Electrical Data
-
- FIGURE 2-1 Average Device Supply Current vs FSCL Frequency Voltage and Temperature ndash Active Interface VRxBVRxA = 00 (VDD Mode)
- FIGURE 2-2 Average Device Supply Current vs FSCL Frequency Voltage and Temperature ndash Active Interface VRxBVRxA = 01 (Band Gap Mode)
- FIGURE 2-3 Average Device Supply Current vs FSCL Frequency Voltage and Temperature ndash Active Interface VRxBVRxA = 11 (VREF Buffered Mode)
- FIGURE 2-4 Average Device Supply Current ndash Inactive Interface (SCL = VIH or VIL) vs Voltage and Temperature VRxBVRxA = 00 (VDD Mode)
- FIGURE 2-5 Average Device Supply Current ndash Inactive Interface (SCL = VIH or VIL) vs Voltage and Temperature VRxBVRxA = 01 (Band Gap Mode)
- FIGURE 2-6 Average Device Supply Current ndash Inactive Interface (SCL = VIH or VIL) vs Voltage and Temperature VRxBVRxA = 11 (VREF Buffered Mode)
- FIGURE 2-7 Average Device Supply Current vs FSCL Frequency Voltage and Temperature ndash Active Interface VRxBVRxA = 10 (VREF Unbuffered Mode)
- FIGURE 2-8 Average Device Supply Active Current (IDDA) (at 55V and FSCL = 34 MHz) vs Temperature and DAC Reference Voltage Mode
- FIGURE 2-9 Average Device Supply Current ndash Inactive Interface (SCL = VIH or VIL) vs Voltage and Temperature VRxBVRxA = 10 (VREF Unbuffered Mode)
-
- 22 Linearity Data
-
- 221 Total Unadjusted Error (TUE) ndash MCP47CXB2X (12-Bit) VREF = VDD (VRXBVRXA = 10) Gain = 1X Code 64-4032
-
- FIGURE 2-10 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V
- FIGURE 2-11 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V
- FIGURE 2-12 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V
- FIGURE 2-13 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V
- FIGURE 2-14 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V
- FIGURE 2-15 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V
-
- 222 Integral Nonlinearity (INL) ndash MCP47CXB2X (12-Bit) VREF = VDD (VRXBVRXA = 10) Gain = 1X Code 64-4032
-
- FIGURE 2-16 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V
- FIGURE 2-17 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V
- FIGURE 2-18 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V
- FIGURE 2-19 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V
- FIGURE 2-20 INL Error vs DAC Code and Temperature (Code 100-4000) (Dual Channel ndash MCP47CXB22) VDD = 27V
- FIGURE 2-21 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V
-
- 223 Differential Nonlinearity (DNL) ndash MCP47CXB2X (12-Bit) VREF = VDD (VRXBVRXA = 10) Gain = 1X Code 64-4032
-
- FIGURE 2-22 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V
- FIGURE 2-23 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V
- FIGURE 2-24 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V
- FIGURE 2-25 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V
- FIGURE 2-26 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V
- FIGURE 2-27 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V
-
- 224 Total Unadjusted Error (TUE) ndash MCP47CXB2X (12-Bit) External VREF = 05 VDD (VRXBVRXA = 10) Unbuffered Code 64-4032
-
- FIGURE 2-28 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VREF = 05 x VDD = 275V Gain = 2x
- FIGURE 2-29 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VREF = 05 x VDD = 135V Gain = 2x
- FIGURE 2-30 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VREF = 05 x VDD = 275V Gain = 2x
- FIGURE 2-31 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VREF = 05 x VDD = 135V Gain = 2x
-
- 225 Integral Nonlinearity (INL) ndash MCP47CXB2X (12-Bit) External VREF = 05 VDD (VRXBVRXA = 10) Unbuffered Code 64-4032
-
- FIGURE 2-32 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VREF = 05 x VDD = 275V Gain = 2x
- FIGURE 2-33 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VREF = 05 x VDD = 135V Gain = 2x
- FIGURE 2-34 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VREF = 05 x VDD = 275V Gain = 2x
- FIGURE 2-35 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VREF = 05 x VDD = 135V Gain = 2x
-
- 226 Differential Nonlinearity Error (DNL) ndash MCP47CXB2X (12-Bit) External VREF = 05 VDD (VRXBVRXA = 10) Unbuffered Code 64-4032
-
- FIGURE 2-36 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V VREF = 05 x VDD = 275V
- FIGURE 2-37 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V VREF = 05 x VDD = 135V
- FIGURE 2-38 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V VREF = 05 x VDD = 275V
- FIGURE 2-39 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V VREF = 05 x VDD = 135V
-
- 227 Total Unadjusted Error (TUE) ndash MCP47CXB2X (12-Bit) VREF = Internal Band Gap (VRXBVRXA = 01) Code 64-4032
-
- FIGURE 2-40 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 1x
- FIGURE 2-41 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 2x
- FIGURE 2-42 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 1x
- FIGURE 2-43 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 1x
- FIGURE 2-44 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 2x
- FIGURE 2-45 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 1x
- FIGURE 2-46 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 2x
- FIGURE 2-47 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V Gain = 1x
- FIGURE 2-48 Total Unadjusted Error (VOUT) vs DAC Code 25degC Gain = 1x
- FIGURE 2-49 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 2x
- FIGURE 2-50 Total Unadjusted Error (VOUT) vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V Gain = 1x
- FIGURE 2-51 Total Unadjusted Error (VOUT) vs DAC Code 25degC Gain = 2x
- FIGURE 2-52 Total Unadjusted Error (VOUT) vs DAC Code +25degC Gain = 1x and 2x
-
- 228 Integral Nonlinearity Error (INL) ndash MCP47CXB2X (12-Bit) VREF = Internal Band Gap (VRXBVRXA = 01) CODE 64-4032
-
- FIGURE 2-53 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 1x
- FIGURE 2-54 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 2x
- FIGURE 2-55 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 1x
- FIGURE 2-56 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 1x
- FIGURE 2-57 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 2x
- FIGURE 2-58 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 1x
- FIGURE 2-59 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 2x
- FIGURE 2-60 INL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V Gain = 1x
- FIGURE 2-61 INL Error vs DAC Code +25degC Gain = 1x
- FIGURE 2-62 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 2x
- FIGURE 2-63 INL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V Gain = 1x
- FIGURE 2-64 INL Error vs DAC Code +25degC Gain = 2x
- FIGURE 2-65 INL Error vs DAC Code +25degC Gain = 1x and 2x
-
- 229 Differential Nonlinearity Error (DNL) ndash MCP47CXB2X (12-Bit) VREF = Internal Band Gap (VRXBVRXA = 01) Code 64-4032
-
- FIGURE 2-66 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 1x
- FIGURE 2-67 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 55V Gain = 2x
- FIGURE 2-68 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 1x
- FIGURE 2-69 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 1x
- FIGURE 2-70 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 55V Gain = 2x
- FIGURE 2-71 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 1x
- FIGURE 2-72 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 27V Gain = 2x
- FIGURE 2-73 DNL Error vs DAC Code and Temperature (Single Channel ndash MCP47CXB21) VDD = 18V Gain = 1x
- FIGURE 2-74 DNL Error vs DAC Code +25degC Gain = 1x
- FIGURE 2-75 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 27V Gain = 2x
- FIGURE 2-76 DNL Error vs DAC Code and Temperature (Dual Channel ndash MCP47CXB22) VDD = 18V Gain = 1x
- FIGURE 2-77 DNL Error vs DAC Code +25degC Gain = 2x
- FIGURE 2-78 DNL Error vs DAC Code +25degC Gain = 1x and 2x
-
- 30 Pin Descriptions
-
- TABLE 3-1 MCP47CXBX1 (Single DAC) Pin Function Table
- TABLE 3-2 MCP47CXBX2 (Dual DAC) Pin Function Table
- 31 Positive Power Supply Input (VDD)
- 32 Ground (VSS)
- 33 Voltage Reference Pin (VREF)
- 34 Analog Output Voltage Pins (VOUT0 VOUT1)
- 35 LatchHigh-Voltage Command Pin (LATHVC)
- 36 I2C ndash Serial Clock Pin (SCL)
- 37 I2C ndash Serial Data Pin (SDA)
- 38 I2C Slave Address Pins (A0A1)
- 39 No Connect (NC)
-
- 40 General Description
-
- 41 Power-on ResetBrown-out Reset (PORBOR)
-
- 411 Power-on Reset
-
- FIGURE 4-1 Power-on Reset Operation
-
- 412 Brown-out Reset
-
- 42 Device Memory
-
- 421 Volatile Register Memory (RAM)
-
- TABLE 4-1 MCP47CXBXX Memory Map (16-Bit)
-
- 422 Nonvolatile Register Memory (MTP)
- 423 PORBOR Operation with WiperLock Technology Enabled
- 424 Unimplemented Locations
-
- TABLE 4-2 Factory Default PORBOR Values (MTP Memory Unprogrammed)
-
- 425 Device Registers
-
- Register 4-1 DAC0 (00h10h) and DAC1 (01h11h) Output Value Registers (VolatileNonvolatile)
- Register 4-2 Voltage Reference (VREF) Control Registers (08h18h) (VolatileNonvolatile)
- Register 4-3 Power-Down Control Registers (09h19h) (VolatileNonvolatile)
- Register 4-4 Gain Control and System Status Register (0Ah) (Volatile)
- Register 4-5 Gain Control and Slave Address Register (1AH) (Nonvolatile)
- Register 4-6 WiperLocktrade Technology Control Register (1Bh) (Nonvolatile)
-
- 50 DAC Circuitry
-
- FIGURE 5-1 MCP47CXBXX DAC Module Block Diagram
- 51 Resistor Ladder
-
- FIGURE 5-2 Resistor Ladder Model Block Diagram
- EQUATION 5-1 RS Calculation
-
- 52 Voltage Reference Selection
-
- FIGURE 5-3 Resistor Ladder Reference Voltage Selection Block Diagram
- FIGURE 5-4 Reference Voltage Selection Implementation Block Diagram
- 521 Using VDD as VREF
- 522 Using an External VREF Source in Unbuffered Mode
- 523 Using an External VREF Source in Buffered Mode
- 524 Using the Internal Band Gap as Voltage Reference
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- TABLE 5-1 VOUT Using Band Gap
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- 53 Output BufferVOUT Operation
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- FIGURE 5-5 Output Driver Block Diagram
- 531 Programmable Gain
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- TABLE 5-2 Output Driver Gain
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- 532 Output Voltage
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- EQUATION 5-2 Calculating Output Voltage (VOUT)
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- 533 Step Voltage (VS)
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- EQUATION 5-3 VS Calculation
- TABLE 5-3 Theoretical Step Voltage (VS)(1)
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