The # 1 cost component of the MCPCB is the dielectric substrate between the copper traces and the metal heatsink / core.

Cost Drivers For MCPCBsDielectric Substrate

An insulating medium which occupies the region between two conductors. In this case, the copper circuits and the metal core heat sink.

Definition

The most effective way to reduce cost of dielectric is to introduce competition: Laird Bergquist Dupont Uniplus Iteq Insulectro Plus future innovators

Cost Drivers For MCPCBs (cont.)

Introducing competition