MECetchBOND 1

MEC COMPANY LTD.

MECetchBOND CZMECetchBOND CZ

Copper Surface Treatment System for Advanced PWBs

MECetchBOND 2

MEC COMPANY LTD.

The Trends of Increased Functionality and Reduced Size of Portable Wireless Products and Routing Densities for PWB

Printed Wiring BoardPrinted Wiring Board

MECetchBOND 3

MEC COMPANY LTD.

Customers Using MECetchBONDCustomers Using MECetchBOND

Japan

Asia

Europe

USA

95 Users (142 Lines)

45 Users(73 Lines)

41 Users(51 Lines)

8 Users(10 Lines)In 2004

MECetchBOND 4

MEC COMPANY LTD.

Application of MECetchBONDApplication of MECetchBOND

BGADIE-PAD

SI

Cu/Via-fill Resin Cu/Prepreg or RCC

Cu/Build-up Resin

Cu/Solder Mask

BGA Solder Mask/Cu

Die-pad/Encapsulating Resin

MECetchBOND 5

MEC COMPANY LTD.

• Excellent adhesion to resins• Fully conveyorized process• Easy to control• Proven process• Reasonable cost• Environmental friendly

Benefits of MECetchBONDBenefits of MECetchBOND

MECetchBOND 6

MEC COMPANY LTD.

Copper Surface TopographyCopper Surface Topography

Buff Scrubbing ×5,000

Jet Scrubbing ×5,000

MECetchBOND CZ-8100 ×5,000

Black Oxide ×10,000

H2SO4-H2O2 ×5,000This chemistry is essentially a micro-etching process that roughens

the copper surface, resulting in a unique topography.

MECetchBOND 7

MEC COMPANY LTD.

MECetchBOND Process FlowMECetchBOND Process Flow

Rinse

Rinse

Acid Rinse

Dry

Can create steeper peaks and valleys

Anchor Effect

MECetchBOND CZ-8100Standard 35℃（25～40℃）

Spray pressure 0.15～0.2MPa

Etching amount 0.5～3μm

20～30℃, 10sec Spray pressure 0.03～0.06MPa

Rinse

MAC-5330 / 3～5%HCl Pre-treatment for MECetchBOND

20～30℃, 10～30sec Spray pressure 0.1～0.2MPa

MECetchBOND 8

MEC COMPANY LTD.

Advantages of MECetchBONDAdvantages of MECetchBOND

MECetchBOND CZ-8100

-Can Enhance Mechanical Bonding (Anchor Effect)

-Can Give Higher Adhesion

-Simple Control

-Fully conveyorized process

MECetchBOND 9

MEC COMPANY LTD.

Physical Properties & ControlPhysical Properties & Control

【Usage】

Make-up: Use CZ-8100M as it is. Replenish: Use CZ-8100R as it is.

【Control】1. Replenish the dragged-out amount. 2. Cu Concentration (15-30 g/L) 3. Concentration/Dilution (-10- +10%)

Appearance

Specific Gravity (20℃)

pH

Blue transparent

1.13±0.011.11±0.01

3.4±0.53.1±0.5

Replenisher CZ-8100R

Colorless – Slight yellow transparent

Make-up Soln. CZ-8100M

MECetchBOND CZ-8100

MECetchBOND 10

MEC COMPANY LTD.

CZCZ--8100 Treated Topography8100 Treated Topography

CCL

Plated Copper

0.5µm etching 1 µm etching 2 µm etchingSEM ×5,000

Can decide some roughening variation for some application

MECetchBOND 11

MEC COMPANY LTD.

Operation Temp. vs. Etching RateOperation Temp. vs. Etching Rate

0

0 .5

1

1 .5

2

2 .5

3

3 .5

4

20 25 30 35 40 45

Operat ion Temp.（℃）

Etc

hin

g R

ate

（μ

m/

min

）

MEC Test Machine Data

Standard Operation Conditions at 35℃

MECetchBOND 12

MEC COMPANY LTD.

0

0.5

1

1 .5

2

2 .5

3

3 .5

4

10 15 20 25 30 35

Copper Cocentrat ion（g/L)

Etc

hin

g R

ate

（μ

m/m

in）

MEC Test Machine Data

Control Range 15 – 30g/L

Copper Conc. vs. Etching RateCopper Conc. vs. Etching Rate

MECetchBOND 13

MEC COMPANY LTD.

Etching MechanismEtching Mechanism

Cu + Cu(Ⅱ)An 2Cu(Ⅰ)An/2

2Cu(Ⅰ) An/2 + n/4O2 + nAH

2Cu(Ⅱ) An + n/2H2O

Air

A : Weak Complexer n : Coordination number

Copper reacts with a Cu(Ⅱ) complex in the solution to form a Cu(Ⅰ) complex. The formed Cu(Ⅰ) complex in the solution reacts with oxygen to generate a Cu(Ⅱ) complex. Such reactions accelerate dissolving of copper.

MECetchBOND 14

MEC COMPANY LTD.

Topography Forming MechanismTopography Forming Mechanism

How can such a unique topography be obtained ?

Copper grains

MECetchBOND CZ attacks boundaries faster than crystals.

Well roughened topography is left.

MECetchBOND 15

MEC COMPANY LTD.

Etching Amount for ApplicationsEtching Amount for Applications

For pretreatment of Solder Mask PrintingEtching amount：0.5～2.0μm

For pretreatment of Micro-via Formation

Etching amount：1.5～3.0μm

For pretreatment of Dry Film LaminationEtching amount：0.5～1.0μm

For pretreatment of Prepreg Lamination

Etching amount：1.5～3.0μm

MECetchBOND 16

MEC COMPANY LTD.

Adhesion (Solder Mask)Adhesion (Solder Mask)

MECetchBOND CZ-8100 (1.5 μm)

Conventional Microetchant (2μm ) Buff Scrubbing

No Peel off of Solder Mask with MECetchBOND Process

Solder Mask Printing → Cross-cut → 3.5%HCl dipping(R.T., 10min) → Rinse&Dry → Tape on the cross-cuts → Peel

SEM×3,500

Tape Side

- Tape Peel Test-

MECetchBOND 17

MEC COMPANY LTD.

Adhesion (Dry Film)Adhesion (Dry Film)

MECetchBOND CZ-8100 (1 μm)

Conventional Microetchant (2μm ) Buff Scrubbing

No Peel off of Dry Film with MECetchBOND Process

Dry Film Lamination → Cross-cut → 3.5%HCl dipping(R.T., 1min) → Rinse&Dry → Tape on the cross-cuts → Peel

SEM×3,500

Tape Side

- Tape Peel Test-

MECetchBOND 18

MEC COMPANY LTD.

Adhesion (Dry Film)Adhesion (Dry Film)

Dense Patterns Column Pattern Diameter / Space＝20μm/20μm

Sparse Patterns Column Pattern Diameter/ Space ＝20μm/60μm

0102030405060708090

100

200mj 140mj ８０mj

Light Intensity

Perc

ent Colu

mn R

em

ainin

g

（%)

H2SO4-H2O2

Buffing CZ-8100

0102030405060708090

100

200mj 140mj ８０mj

Light Intensity

Pe

rce

nt

Co

lum

n R

em

ain

in（

%)

H2SO4-H2O2BuffingCZ-8100

Column patterns with 10μm-30μm diameter are formed latticedly. Evaluation Conditions : sparse space / dense space

MECetchBOND 19

MEC COMPANY LTD.

Resolution (Dry Film)Resolution (Dry Film)

Procedures- Measure the targeted width and the actual width.- A condition of light intensity is ;

80mj/cm2,140mj/cm2 and 200mj/cm2.

27

28

29

30

31

32

33

34

35

200mj 140mj ８０mj

Light Intensity

Pat

tern

Wid

th （

Tar

get

３０

μm

）

H2SO4 - H2O2

Buffing

CZ-8100

Line/Space=30/30μm

MECetchBOND 20

MEC COMPANY LTD.

Summary of MECetchBONDSummary of MECetchBOND

• Adhesion between copper surface and resin has become more and more important.

• MECetchBOND CZ can enhance mechanical bonding.

• MECetchBOND system can give excellent adhesion and high reliability.

• MECetchBOND system is what you need for various applications!