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MEMS AT LETI: NEW TRENDS

Ph. RobertHead of Section – MEMS & Packaging

July 2014


Outline

MEMS Activities overview

New trends:- Issues related to consumer, wearable and IoT markets

- Solutions under development

Conclusion


Microsystems Section

TECHNOLOGICAL PLATFORM• MEMS 8”(1000 m²) + FE 8”(3000 m²) Cleanrooms

• Specific MEMS equip. : DRIE, HF-vapor, bonder…

• 5 shifts working: 7days/week – 24h/days

LCMC Lab.

Sensors

Components

LCRF Lab.

RF Components

LCMA Lab.

Actuators

Components

LCFC Lab.

Characterization

& Reliability

LPI Lab.

Packaging &

Interposer

| 3

Overall MEMS activities > 200 personsOverall MEMS activities > 200 persons


From MEMS design to system integration

| 4

Characterizations Characterizations

Prototyping

3D assembly3D assembly

MEMS TechnologyMEMS Technology

Electronic design Electronic design

Leti covers the wholechain of development

WLP & TFP PackagingWLP & TFP Packaging

MEMS DesignMEMS Design


MEMS devices background

| 5

Pressure sensorPressure sensor

3-axis force sensorCapacitive pressure sensor Piezoresistive pressure sensor

Magnetic sensorMagnetic sensor

3-axis CompassAbove-IC GMR sensor TMR sensor and resonator

Inertial SensorInertial Sensor

3-axis Accelerometer 3-axis Gyroscope Geophone

Acoustic sensorAcoustic sensor

MicrophonecMUT


MEMS devices background

| 6

Gas sensorGas sensor

HumidityNEMS-based + µGC gas sensor µ-TOF Mass-spec for NRBC

Energy harvestingEnergy harvesting

Piezoelectric AlN harvester Electret-based harvester Breakthrough concept

1cm²x1mm

1mW @ 60rpm (1Hz)200µW/cm³ @ 200 Hz 1cm³ / 10µW @ 20 Hz

MEMS ActuatorMEMS Actuator

PZT-based Variable LensMicro-valves

10 diopters

@ 10V

PZT ultrasonic transducers (Digital-loudspeaker, pMUT)

RF-MEMSRF-MEMS

BAW filterMicro-switch

35V / 40GHz

High-Q resonator (Si and HBAR)

Q=24000 @ 4.2 GHzQ=58000 @ 97MHz


| 7

Technology background

MEMS / CMOSCo-integrationMEMS / CMOSCo-integration

Above-IC co-integration

NEMS with 0.35µm CMOS

driver

RF switch on top of CMOS circuit

GMR sensor on top of CMOS circuit

Pre-CMOS co-integration

Nano-scaletechnologieNano-scaletechnologie

M&NEMS platformNEMS resonator MEMS with nano-gap

Electrostatic gap:3µm high / 80nm width

Passive componentsintegrationPassive componentsintegration

500nF/mm²

3D Integrated Capacitors(ALD medium k material – h=50µm)

Magnetic core HF inductors (<100 MHz)

Magnetic shield RF inductors (2 -10 GHz)

CoFe/NiMn exchange

coupled material

10x[NiFe1µm / SiO2100nm]

Electro-Magnetic Transformer

Breakdown 7,5 KV R ≈ 4Ω, L ≈ 82nH


| 8


Hermetic packagingHermetic packaging

Thin-Film packagingVacuum Wafer-level packaging & Getter

Vacuum WLP with TSV

3D Technology3D Technology

TSV last (Cu-liner)TSV-Mid (Cu-filled)TSV-First (Poly-Si filled)

AR20 AR10 AR3-5

3D Integration3D IntegrationThinning (20µm) & multi-die stacking (µ-bump or µ-insert)

3 thinned dies

Back to face interconnectCu pillars(pitch 40µm)

Silicon Interposer

Smart Interposer

80µm thick interposer with embedded 3D capa



| 9

CharacterizationExpertiseCharacterizationExpertise

Packaging

reliability

Residual Gas Analysis

Physics of

contactElectrical contact

failure mechanisms

« 3D »

reliability

electromigrationmechanisms,..

MEMS device & Passive

component reliabilityThermal behavior, long term

stability, resonance freq.,…

Material ExpertiseMaterial Expertise

Piezoelectric material(actionneur, RF, high k)

Magnetic material GMR, TMR, high permeability mat. (RF inductor) and

high permitivity and permeablity mat. (for antenna)

PZT Sol-gel deposition AlN sputtering deposition

F/AF permanent magnet

BAW filterCoFe/NiMn stack

PZT stack


Outline




Conclusion


Issues on Consumer/wearable/IoT market

| 11

Issu

es

Issu

es

Strong cost pressure

Miniaturization

Growing use of Combo sensors

MEMS components

� Well established� Accelerometer

� Gyroscope

� Magnetometer

� Microphone

� Sensor being adopted� Pressure

� Humidity

� Emerging MEMS� Autofocus

� Gas sensor

� Energy harvesting


Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor

� Energy harvesting From IHS / 2014

Average Selling Price erosion by

sensor function 2011-2017


| 12

Issu

es

Issu

es


Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor



Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor


Component size is still decreasing

- From Yole Development / 2013 -

Typical package footprint for mobile devices sensors



| 13

Issu

es

Issu

es


Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor



Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor


Combo sensors will represent the majority of the market from 2016

- From Yole Development / 2013 -

Combo vs. Discrete inertial sensor for consumer

2011-2018 market



| 14

Issu

es

Issu

es


Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor



Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor



9-axis MEMS IMU (Bosch BMX055 – 5 dies)

Microphone (Knowles SPA2629LR5H-B)

Pressure sensor (ST LPS25H)

Humidity sensor (Sensirion SHTC1)

No manufacturing standard1 Product = 1 Process

No manufacturing standard1 Product = 1 Process


Issu

es

Issu

es


Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor



Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor


LETI’s Solution

LET

I S

olu

tio

nLE

TI

So

luti

on

Goal : “Generic”, efficient and reliable MEMS platform

� Unique Platform with the capability to address 11+ axis

� Innovative and high performances concept

� Differentiation: 20+ patents

M&NEMSPlatform

M&NEMSPlatform


MEMS size inertial mass

+Nano-size piezoresistive gauge

� Miniaturized sensors

� Generic platform

� Not sensitive to parasitics

� Well known and robustpiezoresisitive detection

� Strongly differentiated approach (20+ patents)

3-axis Gyroscope

3-axis Magneto

3-axis Accelero

X

ZY

Pressure sensor

High-SNR Microphone

2 New Innovative Sensors under development

M&NEMS "Generic" Platform


� 9-axis M&NEMS platform is currently being transferred

to Tronics involving a Tier 1 pilot customer

� Tronics’ goals

� 6DOF on a 4mm² die by 2014-2015

� 9DOF on a 5 mm² die by 2015-2016

2,5mm

1,6

mm

6-axis M&NEMS sensor 6-axis M&NEMS

sensor on 4mm²

| 17

M&NEMS "Generic" Platform


Issu

es

Issu

es


Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor



Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor


LETI’s Solution

LET

I S

olu

tio

nLE

TI

So

luti

on

� Goal : High optical quality& Low actuation voltage

Liquid Lens+

Piezoelectric actuation

Liquid Lens+

Piezoelectric actuation

� Startup creation


WAVELENS PZT-based Variable Lens

PZT actuator

Optical oil

� Optical aperture: from

1.6mm to 3mm(up to 20MP camera)

� Response time < 3ms

� Optical power variation :

10 diopters at 10V

� Consumption < 100µW

Camera phone

2D barcode

surveillance cameras

camera pills

4.5x4.5x0.4mm / aperture ∅2,2mm


WAVELENS PZT-based Variable Lens

PZT actuator

Optical oil

� Optical aperture: from

2.2mm to 3mm

� Response time < 3ms

� Optical power variation :

10 diopters (m-1) at 10V

� Consumption < 100µW

Camera phone

2D barcode

surveillance cameras

camera pills

4.5x4.5x0.4mm


Issu

es

Issu

es


Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor



Miniaturization


MEMS components


� Gyroscope

� Magnetometer

� Microphone


� Humidity


� Gas sensor


LETI’s Solution

LET

I S

olu

tio

nLE

TI

So

luti

on

� Goal : High sensitivity and high selectivity gas detection

NEMS Resonators+

Gas Chromatography Column

NEMS Resonators+

Gas Chromatography Column

� Startup creation

� LETI / Caltech join development


APIXNEMS-based Gas Sensor

NEMS-based gas

chromatography

systems

Hydrocarbons : industry, process monitoring,

natural gas

LoD ≈ 100’s ppb

VOCs: environment, hygiene & safety, air quality

µGC

� 10 to 100x smaller

� Air gas carrier

� Sensitivity up to sub ppm

Industry

Environment

Security

Medical


Outline




Conclusion


: the leading R&D institute on microsystems

Generic MEMS Platform | Philippe Robert | 24

� 330 patents portfolio in the MEMS field

� 35 % under license or on co-ownership

� 35 new patents/year

� 25 on-going industrial collaborations

� 10 long-term strategic partnership

� 18 industrial transfers

� 5 startups creation

� 30 years experience on MEMS

� 200 people involve on MEMS (sensor, actuator, RF, packaging, process, characterization)

� All 8” MEMS/NEMS technologies in-house


a strong partner for innovation

development research from

technologies to applications,

in a dynamic

and global

environment

mems at leti: new trends - semi.org robert - mems... · mems at leti: new trends ph. robert head of...

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