mems在射頻無線通訊上的應用 -...
TRANSCRIPT
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6
MEMS
/
(RF-MEMS)
(RF-MEMS) IC
(Resonator)(Oscillator)(Filter)(Mixer)(Switch)(Antenna)
Q
IC
(Integration) IC
IC MEMS
1
IC
(Interdisciplinary Fields)
RF-MEMS
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7
Q (High-Q Passives) 1 (Discrete Components)
(Wireless Transceivers) Q
()
(RF) (IF) (Frequency Selection) (Frequency Generation)(Timing Reference) Q (Discrete)(Ceramic Filters)(SAW Filters)(Quartz Crystals)FBAR (Film Bulk Acoustic Resonator Filters)(Interface Circuits)(Packaging)(Assembling)
Superheterodyne [1] 2 (a)( Q )
I
Q
IQOsc.
QuartzXstal
IFAmp
SAWIF FilterMixer
SAWRF Filter
90
QuartzXstal
VCO
ChannelSelect PLL
LNACeramicRF Filter
Antenna
Tunable Off-ChipLC Tank
Off-ChipComponent
I
Q
IQOsc.
QuartzXstal
IFAmp
SAWIF FilterMixer
SAWRF Filter
90
QuartzXstal
VCO
ChannelSelect PLL
LNACeramicRF Filter
Antenna
Tunable Off-ChipLC Tank
Off-ChipComponent
(a)
Off-ChipComponent
Rx Out Q
FrequencySynthesizer
LNA
Antenna
AGC
LPF
LPF
Rx Out I
MixerSAW
RF Filter
LowpassFilter
LowpassFilter
2
Amp
2
0 90
0 90
0 90
Amp
MixerLNASAW
RF FilterSwitch Amp AGC Amp
QuartzXstal
Off-ChipComponent
Rx Out Q
FrequencySynthesizer
LNA
Antenna
AGC
LPF
LPF
Rx Out I
MixerSAW
RF Filter
LowpassFilter
LowpassFilter
2
Amp
2
0 90
0 90
0 90
Amp
MixerLNASAW
RF FilterSwitch Amp AGC Amp
QuartzXstal
(b)
(N+1)/N
Duplexer
RF BPF
RF BPF
RF BPF
Duplexer
Duplexer
LNA RF BPFFrom TX
LNA
LNA
LNA
LNA
LNA
From TX
From TX
RF BPF
0
090
90
I
QI
Q
RF BPF
GSM 900
PCS 1900
DCS 1800
AntennaCDMA
WCDMA
CDMA-2000 Tank
RXRF Channel Select PLL
RXRF LOXstalOsc
AGC
AGC
A/D I
A/D Q
(N+1)/N
Duplexer
RF BPF
RF BPF
RF BPF
Duplexer
Duplexer
LNA RF BPFFrom TX
LNA
LNA
LNA
LNA
LNA
From TX
From TX
RF BPF
0
090
90
I
QI
Q
RF BPF
GSM 900
PCS 1900
DCS 1800
AntennaCDMA
WCDMA
CDMA-2000 TankTank
RXRF Channel Select PLL
RXRF LOXstalOsc
AGC
AGC
A/D I
A/D Q
(c)
2
(a)(Superheterodyne Architecture)
(b)(Direct-Conversion Architecture)
(c)(Multi-Mode Multi-Band
Wireless Systems)
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8
Q
(Off-Chip Components) (Direct-Conversion Receiver Architectures) [2](IF Filters) 2 (b) (Integrated Inductor Technologies) [3](Bias)(Matching Networks)(Off-Chip Inductors)
(Robustness)(Power Efficiency)
(Multi-Mode/Standard Reconfigurable Handsets) 2(c)(RF Front-End Filters)
3GPP (the 3rd Generation Partnership Project) WiMAX 50 ()(> 50)
I
Q
IQOsc.
Mech.Res.
IFAmp
90
Antenna
Switchable Mech.
Mech.Mixer-Filter
Res. Oscillator
On-ChipMech. Circuit
Multi-Band ProgrammableChannel-Select Filter Bank
SeriesSwitch
I
Q
IQOsc.
Mech.Res.
IFAmp
90
Antenna
Switchable Mech.
Mech.Mixer-Filter
Res. Oscillator
On-ChipMech. Circuit
On-ChipMech. Circuit
Multi-Band ProgrammableChannel-Select Filter Bank
SeriesSwitch
3
Q
(Miniaturization)(Integration)
TI DMD (Digital Micromirror Device) Analog Devices Inc. (ADI)Avago FBAR
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9
(Ultra-Low Power)(High Selectivity) (Bandpass Filters) (Reference Oscillators)(Mixer-Filters)(MEMS Switches)
(Miniaturized)(Integrated)(Low Power)(Robustness)
(Bulky)(Discrete) Q (Direct-Conversion)[2] IF (Wideband IF)[4]
Q Superheterodyne [1]
[5]
3 [5]
(1) (RF Channel
Selection) 3
Q (Filter Banks)()
(ADC) (Baseband Components) Q
Q (Q 10,000)
(2)(All-Mechanical Signal Processing) 3 Q
(Mixing) (Antenna Switching)(Phase-Shifting)(Charge Pumping)(Frequency Generation) (A/D Conversion)
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10
(3)(Low
Power Micro-Mechanical Frequency Synthesizer (Local Oscillator)) 3 (Local Oscillator) Q
(Phase-Locked Loops)
(Power Saving)
(Selectivity or Q)
Q 3 Q
Q (Quartz Crystals)(Surface Acoustic Wave Devices) Q 1,000
( )
CMOS MEMS ()(kHz GHz)(Frequency Selection)(Frequency Generation)
CAD-Layout ()
(Multi-Mode Multi-Standard)
1 Q
(Comb Drive Actuator)[6] 1 Q 80,000()
LF (30kHz - 300kHz)MF(300kHz - 3MHz)
(Clamped-Clamped Beam)[7] 1 (Vertical Vibration)
10MHzQ 8,000 Squeeze Film Damping Q 100
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11
1 Q
1.
[6]
Frequency (Hz)
Tran
smis
sion
(dB
)
fo=18.8kHzQ=51,000
Frequency (Hz)
Tran
smis
sion
(dB
)
fo=18.8kHzQ=51,000
Q~53,000 @ 18.8kHz () Q~100 @ 18.8kHz () Q Flexural (LF-MF) Rx ~1M-5M
2.
[7]
Tran
smis
sion
(dB
)
Frequency (MHz)
Tran
smis
sion
(dB
)
Frequency (MHz)
Q~8,000 @ 10MHz () Q~50 @ 10MHz () Q~300 @ 70MHz (anchor loss) Q Flexural (HF-VHF) Rx ~500-5,000
3.
[8]
fo=101 .3M HzQ=11,500
fo=101 .3M HzQ=11,500
Q~11,500@ 10-200MHz () Q~2,000 @ 90MHz () Q Flexural (VHF) Rx ~500-5,000
4.
[9]
-90-80
-70
-60
-50
-40
-30
-20
61.08 61.13 61.18 61.23 61.28 61.33
Tran
smis
sion
(dB
)
Frequency (MHz)
Q= 48,000Rx = 1.5 k
-90
-80
-70
-60
-50
-40
-30
-20
61.08 61.13 61.18 61.23 61.28 61.33
Tran
smis
sion
(dB
)
Frequency (MHz)
Q= 48,000Rx = 1.5 k
Q~48,000@ 61MHz () Q~10,000 @ 61MHz () Q Extensional (VHF) Rx ~500-5,000
5. C
onto
ur
[11]
-102
-96
-90
-84
1507.4 1507.8 1508.2Frequency
Pow
er (d
Bm
)
fo=1.51GHzQ=11,555
-102
-96
-90
-84
1507.4 1507.8 1508.2Frequency
Pow
er (d
Bm
)
Frequency
Pow
er (d
Bm
)
fo=1.51GHzQ=11,555
Q~11,555 @ 1.5GHz () Q~10,100 @ 1.5GHz () Q Q Extensional (VHF-UHF) Rx ~500-50,000
6.
[12]
Q~2,300 @ 1.47GHz () Q>2,000 @ 1.47GHz () 1GHzQ Extensional (VHF-UHF) Rx ~500-50,000
7. C
onto
ur
[13]
1 463 .4 146 3.6 1 463 .8 1464 1 464 .2-9 8-9 6
-9 4
-9 2
-9 0
-8 8
fo=1.464GHz
Q=15,248
Pow
er [d
Bm
]
Frequency [MHz]1 463 .4 146 3.6 1 463 .8 1464 1 464 .2-9 8
-9 6
-9 4
-9 2
-9 0
-8 8
fo=1.464GHz
Q=15,248
Pow
er [d
Bm
]
Frequency [MHz]
Q~15,248 @ 1.46GHz () Q~10,165 @ 1.46GHz () 1GHzQ Extensional (VHF-UHF) Rx ~500-50,000
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HF (3MHz - 30MHz)Anchor Loss
(Anchor)(Substrate) Q VHF (30MHz-300MHz) Anchor Loss VHF Q (Nodal Support)(Free-Free Beam)[8] 1
Anchor VHF Q 10,000
(Flexural Mode) k (Equivalent Stiffness)
mkfo 2= m
UHF (300MHz - 3GHz)
Extensional Mode 1
(Wine-Glass Mode)[9]61MHz Q 200,000 Q (Polysilicon) Q Contour-Mode
100MHz- 1.8GHz 1GHz Anchor Anchor Loss Q 1,600 [10]()[11]
Q Q 10,000 Squeeze Film Damping
UHF ()(Transduction Area)(Motional Current)(50) (Ring Resonators) 1
Contour-Mode [13]
(Quarter Wavelength)
1.464-GHz Q 15,000 MEMS CMOS
2
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13
(Spurious Modes)
(Mechanical Coupling) 2 ( N )
N N [14] Q 125k() 15k(
) 2 (Flexural-Mode)[15] 480
2 [16] 11.73k 2.56kQ 100,000
Q Q
N
(Transmitter)
2
1.
[1
4]
Rx=125k@ 15.4MHz (1 Res.) Rx=43k@ 15.2MHz (3 Res.) Rx=22k@ 15.4MHz (10 Res.) Rx=15k@ 15.4MHz (20 Res.) Flexural (HF) Q~3,800-6,800
2.
[1
5]
0
50
100
150
200
250
300
69.50 70.00 70.50 71.00 71.50
Frequency [MHz]
Out
put [
uA]
Rx = 480Rx = 480
1Res.3Res.
5Res.
7Res.
0
50
100
150
200
250
300
69.50 70.00 70.50 71.00 71.50
Frequency [MHz]
Out
put [
uA]
Rx = 480Rx = 480
1Res.3Res.
5Res.
7Res.
Rx=2.82k@ 71.7MHz (1 Res.) Rx=2.3k@ 70.1MHz (3 Res.) Rx=1k@ 69.7MHz (5 Res.) Rx=0.48k@ 69.6MHz (7 Res.) Flexural (VHF) Q~9,100-17,500
3.
[1
6]
-110-100
-90
-80-70-60-50
-40-30
61.73 61.78 61.83 61.88 61.93
Tran
smis
sion
(dB
)
Frequency (MHz)
1Res.3Res.5Res.
9Res.
-110-100
-90
-80-70-60-50
-40-30
61.73 61.78 61.83 61.88 61.93
Tran
smis
sion
(dB
)
Frequency (MHz)
1Res.3Res.5Res.
9Res.
Rx=11.73k@ 61.8MHz (1 Res.) Rx=6.34k@ 61.8MHz (3 Res.) Rx=4.04k@ 61.8MHz (5 Res.) Rx=2.56k@ 61.8MHz (9 Res.) Extensional (VHF) Q~118,900-161,000
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Q
(Insertion Loss)(Phase Noise)
3
[17]
[7] Q
3 9-MHz [18]
( Loss Pole)
(Transfer Function)
3 [19][20]
(Single-Ended System) Feedthrough Feedthrough
Feedthrough (Differential)
[21] 3 (Resonator Array)(Fully-Differential)
(Parasitics) Feedthrough
3 [22]
(Programmable Channels and Bandwidths)() (Low Impedance)(Low Insertion Loss)(Forth-Order)(Differential-Mode Input) (Common-Mode Output)(Eighth-Order)(Filter Transfer Function)
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15
3
1.
[
17]
340kHz 403Hz 0.09% 64dB < 0.6dB
2.
[
7]
7.81MHz 18kHz 0.23% 35dB < 2dB
3.
[18
]
-70
-60
-50
-40
-30
-20
-10
0
8.69 8.74 8.79 8.84 8.89
Tran
smis
sion
(dB
)
Frequency (MHz)
-70
-60
-50
-40
-30
-20
-10
0
8.69 8.74 8.79 8.84 8.89
Tran
smis
sion
(dB
)
Frequency (MHz)
9MHz 20kHz 0.2% 51dB < 2.8dB
4.
[19]
-21
-18
-15
-12
-9
-6
-3
0
67.70 67.88 68.05 68.23 68.40
Frequency [MHz]
Tran
smis
sion
[dB
]Tr
ansm
issi
on (d
B)
Frequency (MHz)
-21
-18
-15
-12
-9
-6
-3
0
67.70 67.88 68.05 68.23 68.40
Frequency [MHz]
Tran
smis
sion
[dB
]Tr
ansm
issi
on (d
B)
Frequency (MHz)
68.1MHz 190kHz 0.28% > 10dB < 2.7dB
5. C
onto
ur
[20]
-25
-20
-15
-10
-5
0
155.2 155.4 155.6 155.8 156.0 156.2 156.4
Tran
smis
sion
(dB
)
Frequency (MHz)
-25
-20
-15
-10
-5
0
155.2 155.4 155.6 155.8 156.0 156.2 156.4
Tran
smis
sion
(dB
)
Frequency (MHz)
155.9MHz 201kHz 0.13% 20dB 2.5dB
6.
[21]
-75-70-65-60-55-50-45-40-35-30-25-20-15-10-50
162.6 162.8 163.0 163.2 163.4 163.6
Tran
smis
sion
(dB
)
Frequency (MHz)
Terminated
Un-Term.
-75-70-65-60-55-50-45-40-35-30-25-20-15-10-50
162.6 162.8 163.0 163.2 163.4 163.6
Tran
smis
sion
(dB
)
Frequency (MHz)
-75-70-65-60-55-50-45-40-35-30-25-20-15-10-50
162.6 162.8 163.0 163.2 163.4 163.6
Tran
smis
sion
(dB
)
Frequency (MHz)
Terminated
Un-Term.
163.1MHz 98.5kHz 0.06% > 20dB 2.43dB
7.
[22]
-80
-70
-60
-50
-40
-30
-20
-10
0
161.8 162.8 163.8 164.8
Un-terminatedTerminated
Tran
smis
sion
(dB
)
Frequency (MHz)
Terminated
Un-Term.
-80
-70
-60
-50
-40
-30
-20
-10
0
161.8 162.8 163.8 164.8
Un-terminatedTerminated
Tran
smis
sion
(dB
)
Frequency (MHz)
Terminated
Un-Term.
163.3MHz 253.7kHz 0.16% > 20dB < 2.73dB
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16
3()
8.
[
14]
TIAvo-
vo+
RoRi
CBRx CxLx
CoCo1 Co2
Rx CxLx
CoCo1 Co2
15.4MHz Q=2,432 @10MHz L{ fm =1kHz}=-112dBc L{ fm =10kHz}=-136dBc
9.
[
16]
M3M4
M1 M2
MRf
Vbias2
Vbias1
M11 M12 M13 M14
Vcm
M17M18
M16M15Output
Input
M5
Wine-Glass Disk Array-Composite
Resonator
Wine-Glass Disk Array-Composite
Resonatorio
vi
VP
VSS = -1.65 V
M3M4
M1 M2
MRf
Vbias2
Vbias1
M11 M12 M13 M14
Vcm
M17M18
M16M15Output
Input
M5
Wine-Glass Disk Array-Composite
Resonator
Wine-Glass Disk Array-Composite
Resonatorio
vi
VP
VSS = -1.65 V
62MHz Q=118,900 @13MHz L{ fm =1kHz}=-140dBc L{ fm =10kHz}=-150dBc
[22] 128
(Medium-Scale Integrated Micromechanical Circuits)
4CMOS-MEMS [23]
(Timing Reference)
Q (Frequency Stability)(Phase Noise)
Q 3 [14][16]
[16] Q 118,900 TSMC 0.35-m
(Transresistance-Sustaining Amplifier)
GSM
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17
CMOS-MEMS
Foundry- MEMS CMOS-MEMSCMOS-MEMS Dr. Gary K. Fedder ( Carnegie Mellon University ECE )Fedder Foundry CMOS
Release CMOS MEMS CMOS 4 [23]
Universitat Autnoma de Barcelona (UAB) 1GHz [24] CMOS Foundry CMOS-MEMS
MEMS
Q () CMOS Foundry RF MEMS
Prof. Clark T.-C. Nguyen ()
[1] P. Orsatti, et al., A 20-mA-receive , IEEE J.
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Dec. 1999.
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Solid-State Circuits, vol. 30, pp. 1399-1410,
December 1995.
[3] C. P. Yue, et al., On-Chip Spiral , IEEE J.
Solid-State Circuits, vol. 33, no. 5, May 1998, pp.
743-752.
[4] J. C. Rudell, et al., A 1.9-GHz , IEEE J.
Solid-State Circuits, vol. 32, no. 12, pp. 2071-2088,
Dec. 1997.
[5] C. T.-C. Nguyen, Vibrating RF , Proceedings,
2004 IEEE Custom Integrated Circuits Conf.,
Orlando, Florida, Oct. 3-6, 2004, pp. 257-264.
[6] W. C. Tang, et al., Laterally driven , Sensors
and Actuators, 20, 25-32, 1989.
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Circuits, vol. 35, no. 4, pp. 512-526, April 2000.
-
18
[8] K. Wang, et al., VHF free-free , IEEE/ASME J.
Microelectromech. Syst., vol. 9, no. 3, pp. 347-360,
Sept. 2000.
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Solid-State Circuits, vol. 39, no. 12, pp. 2477-2491,
Dec. 2004.
[10] J. Wang, et al., 1.156-GHz , IEEE Trans.
Ultrason., Ferroelect., Freq. Contr., vol. 51, no. 12,
pp. 1607-1628, Dec. 2004.
[11] J. Wang, et al., 1.51-GHz , Proceedings,
MEMS04, The Netherlands, Jan. 25-29, 2004 , pp.
641-644.
[12] Y. Xie, et al., UHF Micromechanical ,
Technical Digest, IEDM03, Washington, DC, Dec.
8-10, 2003, pp. 953-956.
[13] S.-S. Li, et al., Micromechanical hollow-
disk , Technical Digest, MEMS04,
Maastricht, The Netherlands, 2004, pp. 821-824.
[14] S. Lee, et al., Mechanically , Proceedings,
IEEE Int. Ultrasonics, Ferroelectrics, and
Frequency Control 50th Anniv. Joint Conf.,
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[23] C.-C. Lo, Thesis, Carnegie Mellon University,
2008.
[24] J. Teva, et al., From VHF to UHF , Tech.
Digest, MEMS08, Tucson, Arizona, Jan. 13-17,
2008, pp. 82-85.
: :RF Micro Devices : :
CMOS-MEMS