metatex200
DESCRIPTION
IPA-free Alkaline Texturing State-of-the-art Surface Etching for Monocrystalline Si-WafersTRANSCRIPT
Smart Solutions to Drive the Future.
MetaTEX200IPA-free Alkaline Texturing
State-of-the-art Surface Etching for Monocrystalline Si-Wafers
Traditional TexturingIncreasing demands to process stability and surface definition arelimiting the application of IPA as thecommon texturing agent in massproduction of solar cells. Low boilingpoint and high volatility of IPA effectdifficult process adjustments, shortbath lifetimes and high chemicalconsumption.
Advanced TexturingMetaTEX is a new texturing additive,opens the door for a robust new IPA-free texturing process, offeringsubstantial cost advantages compared to traditional etching
systems, completely refrains fromusing flammable, volatile solventsand enables a stable, wet-chemicaltexturing process for silicon wafers.
With the application of this alkalinetexturing process the etching solution lifetime is tripled for themodified SILEX etching system from SINGULUS STANGL SOLAR in combination with
_ Shortening of the etching duration at the same time
_ Simplified chemical disposal_ Wide process window
MetaTEX200 IPA-free Alkaline Texturing
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State-of-the-art Surface Etching for Monocrystalline Si-Wafers
Benefits and Features
_ Environmental-friendly IPA-free composition
_ No solvent evaporation/emission
_ Safe and easy handling of chemical, process and waste water
_ Wide process window
_ No analytical bath control required
_ Improved etch and reflectance process stability
_ Excellent bath lifetime
_ Reduced process time
_ Small, uniform and adjustable pyramide size
_ Perfect surface compatibility with subsequent passivation and deposition processes
_ Compatible with “as-cut” and etched wafers
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SILEX Etch Equipment and Advanced Alkaline Texturing
with MetaTEX200
Application IPA-free alkaline texturing for mono Si-wafers
Chemicals KOH/organic additive/DIW
Additive Concentration 1.5~2 wt % MetaTEX200
Features PreClean SINGULUS STANGL SOLAR BKM* * best known method
Etch removal 6-8 μm* * per side
Process time 15-20 minBath life time 30-40 runs* * 30 runs as cut, 40 runs SD etched
Pyramid size 2~5 μmReflectance < 12 % at 600 nm * < 12,5 % 400-1100 nm
Wafer p-type , n-type mono waferas cut (wire and diamond)saw damage etched
Environmental Data BOD = 36 mg/l IPA-Process 130 mg/l
COD = 556 mg/l IPA-Process 8700 mg/l
Affiliated Companies
ChinaSINGULUS MANUFACTURING GUANGZHOU LTD.Tel. [email protected]
FranceSINGULUS TECHNOLOGIES FRANCE S.A.R.L.Tel. +33 3 893111-29 [email protected]
GermanySINGULUS STANGL SOLAR GMBHTel. +49 8141 [email protected]
Great BritainSINGULUS TECHNOLOGIES UK LTD.Tel. +44 1793 [email protected]
ItalySINGULUS TECHNOLOGIES ITALIA S.R.L.Tel. +39 071 [email protected]
Latin AmericaSINGULUS TECHNOLOGIES LATIN AMERICA LTDA.Tel. +55 1121 [email protected]
NetherlandsSINGULUS TECHNOLOGIES AGBranch Office SINGULUS MASTERINGTel. +31 40 [email protected]
HeadquartersSINGULUS TECHNOLOGIES AGHanauer Landstrasse 103D - 63796 Kahl, GermanyTel. +49 6188 440-0Fax +49 6188 [email protected]
SingaporeSINGULUS TECHNOLOGIES ASIA PACIFIC PTE LTD.Tel. +65 674 [email protected]
SpainSINGULUS TECHNOLOGIES IBERICA S.L.Tel. +34 936 [email protected]
TaiwanSINGULUS TECHNOLOGIES TAIWAN LTD.Tel. +886 2 [email protected]
United States and CanadaSINGULUS TECHNOLOGIES INC. Tel. +1 860 [email protected]
5/2012-M
etaC
om Printed in Germany - Technical alterations reserved