method of component recognition data creation 016

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IM-SMT-VSNDIC-0002-000

Method of creating the component recognition data

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1. Component data .......................................................................................................... 5

1.1 Component data configuration ..................................................................................... 5

1.2 The basics of the component data definitions............................................................ 12

1.3 Simple settings for component data........................................................................... 14

1.4 Precautions concerning the component data definitions ........................................... 17

1.4.1 ReflectLL. ............................................................................................................ 17

1.4.2 Component sizes (chip component).................................................................... 18

2. Details of the component data setting .................................................................... 18

2.1 2-pin components....................................................................................................... 19

2.2 Mini-mold trasnsistors / SOTs .................................................................................... 21

2.2.1 Mini-mold transistor / SOTs Special –(1) ............................................................. 26

2.2.2 Mini-mold transistor / SOTs Special –(4) ............................................................. 28

2.3 P-Tr ............................................................................................................................ 29

2.4 SOPs.......................................................................................................................... 35

2.4.1 Special recognition in the SOP Recognition mode.............................................. 37

2.5 SOJs........................................................................................................................... 44

2.5.1 Special recognition in the SOJ Recognition mode .............................................. 47

2.6 QFPs .......................................................................................................................... 48

2.6.1 Special recognition in the QFP Recognition mode.............................................. 50

2.7 PLCCs........................................................................................................................ 53

2.7.1 Special recognition in the PLCC Recognition mode ........................................... 56

2.8 Off Lead...................................................................................................................... 60

2.9 Connector components .............................................................................................. 67

2.9.1 Single-direction connectors ................................................................................. 67

2.9.2 4-direction connectors ......................................................................................... 69

2.9.3 Special recognition of connectors........................................................................ 74

2.9.4 Odd-shape connectors ........................................................................................ 88

2.10 Ball components....................................................................................................... 89

2.10.1 Simple BGA Recognition mode......................................................................... 90

2.10.2 BGA Recognition mode ..................................................................................... 92

2.10.3 Special recognition of BGAs.............................................................................. 94

2.10.4 Flip-chip recognition ........................................................................................ 100

2.10.5 Flip-chip recognition: Special 1........................................................................ 102

2.10.6 Flip-chip recognition : Special 2 and 3 ............................................................ 107

2.11 Chip components ....................................................................................................111

2.11.1 Standard chips ................................................................................................. 112

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2.11.2 MELF chips..................................................................................................... 114

2.11.3 Bare chip.......................................................................................................... 115

2.11.5 Special chips.................................................................................................... 117

2.11.6 Small Chip ....................................................................................................... 118

2.11.6 Special recognition of chip components .......................................................... 119

(standard chips, MELF chips, special chips)................................................................. 119

2.11.7 Special Recognition of chip components (Cylindrical chips) ........................... 124

2.12 Special components ............................................................................................... 124

2.12.1 Special shapes ................................................................................................ 124

2.12.2 Odd-shape chips ............................................................................................. 128

2.12.3 Mark types ....................................................................................................... 129

2.12.4 Special Quad ................................................................................................... 155

2.12.5 Center of Gravity detection.............................................................................. 162

3. Fiducial Mark Recognition...................................................................................... 165

3.1 Center of Gravity detection (Recognition type: Normal) .......................................... 165

3.2 Template matching (Recognition type: pattern) ....................................................... 167

3.3 Corner detection....................................................................................................... 168

3.4 Top Edge detection .................................................................................................. 169

3.5 CirEdge detection..................................................................................................... 170

3.6 Contour rectangle detection / contour triangle detection ......................................... 170

3.7 Edge circle detection................................................................................................ 171

3.8 Edge rectangle / triangle detection .......................................................................... 171

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Appendix ............................................................................................................................. 173

Appendix 1. Noise processing .......................................................................................... 173

Appendix 2. Detection level differences used to detect leads (threshold value) ........ 174

Appendix 3. Creating simple data in the special recognition modes ........................... 175

Appendix 4. Lead position check ..................................................................................... 176

Appendix 5. Reading and interpreting the recognition results display........................ 177

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1. Component data

In vision recognition, data pertaining to the shape of the component, the image input condition and other elements are required in order to perform component recognition. This is hereafter referred to as “component data”. The section below shows the configuration of the component data.

1.1 Component data configuration

Component data consists of the following two parts:

- Shape parameter - Vision parameter The vision parameters are the parameters that are required in order for component recognition to actually be carried out, such as the lighting level and threshold value. <Examples of recognition parameters>

Items to be set Set value Notes

Alignment Module Back �

Alignment Module Fore �

Specifies the device that can be used for recognition.

Light Main �

Light Coax �

Light Side �

Selects the type of illumination to be used.

Lighting Level Sets the brightness of the illumination to one

of nine levels from 0/8 through 8/8.

Comp. Threshold Sets the threshold value for recognition.

Comp. Tolerance Sets the tolerance check value as a percentage.

Search Area(mm) Sets a range for carrying out a component search.

Datum Angle (degree) Selects from “Normal”,”90 degrees”, “180 degrees” or “270 degrees”.

Multi MACS � Specifies whether to use Multi MACS or not.

Table 1

Caution: The parameter “Datum Angle” is used when the actual angle of the component supplied from the feeder is different from the angle specified by the component definition. Though “Normal” is usually selected for this parameter, in the aforementioned case, “90 degrees”, “180 degrees” or “270 degrees” is specified depends which angle the component is recognized. This allows components to be recognized using the standard component data, without correcting the existing data. (This is a system that automatically rotates the component data for recognition based on this specification in the image recognition system.

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Figure 1

The shape parameter is used to define the shape of the component, and defines it with a coordinate system like shown in Figure 2.

Figure 2

The upper direction of the image is defined as the N direction, the lower direction as the S direction, the direction to the right of the image as the E direction and the direction to the left of the image as the W direction. It is possible to define up to two groups of lead information for each direction. The Lead Group consists of leads that have the same lead width, lead pitch, and lead length. In the case shown in Figure 2, as all of the leads in one direction have the same lead width, lead pitch and lead length, they can be defined as one Lead Group. On the other hand, in the case shown in Figure 3, as the lead width of the leads are different, they cannot be defined as a single Lead Group, but are divided into two Lead Groups for definition purposes.

Normal

90 degrees

180 degrees

270 degrees

Center of the component

W

N

E

S

Y

X

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Figure 3

Thus, the leads are defined as two different groups when the leads cannot be defined as a single group due to the factor that individual lead width, lead pitch or lead length are different or the lead pitches are not constant. (The Lead Groups can be defined up to 2 groups for each direction.)

Each Lead Group can be defined based on the position and width of the reference lead, lead length, lead pitch and number of the leads. For a component shown in Figure 4, the leads in one direction can be define based on the following factors: - the position of the reference lead - the lead length - the lead width - the lead pitch - the number of the leads In order to define the leads of the component as a whole, Lead Groups need to be defined for each direction.

Figure 4

Group 1 Group 2

N

N direction reference lead position

E direction reference lead position

W direction reference lead position

S direction reference lead position

X

Y

Lead width

Reflect Lead Length

Lead pitch

Lead width

Lead pitch

Component center

Reflect Lead Length

N direction

E direction

S direction

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For example, the row of the leads in N direction shown in Figure 5 can be defined by the coordinates of the tip position (� part in the figure) of the leftmost lead as a reference lead position X and reference lead position Y, while the lead length will be defined as “length”, the lead width as “width”, the lead pitch as “pitch” and the number of the lead as “n”.

Figure 5

It is also possible to define the row of the leads in S, E and W direction in the same way. When defining these directions, the points used as the reference are as follows:

- The S direction: the leftmost lead - The E direction: the uppermost lead - The W direction: the uppermost lead (In Figure 5, the lead with � mark is the reference lead, and its tip is the reference lead position.) As shown in Figure 6, when the leads in a single direction have different width and pitches, they are divided into two groups and then defined. For example, the row of leads in the N direction shown in Figure 6 can be defines as follows:

Figure 6

<< Group 1: Left-side group in N direction >>

Reference lead position X1 Reference lead position Y1 Lead length: length 1

Reflect Lead Length

Lead width Lead pitch

N direction reference lead position

N

E W

S

Group 1

Group 1

Group 2

Group 1

Group 2

Group 2

Group 2

Group 1

Component center

N direction

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Lead width: width 1 Lead pitch: pitch 1 Number of the leads: n1

<< Group 2: Right-side group in N direction >>

Reference lead position X2 Reference lead position Y2 Lead length: length 2 Lead width: width 2 Lead pitch: pitch 2 Number of the leads: n2

As shown in Figure 6, the groups are specified as Group1 and Group 2, from left to right in the N/S direction, and from top to bottom in the W/E direction.

The definitions are made in the same way for the S, E and W directions.

This is how to define the component shape. Detailed setting items for the component data are as follows:

<< Details of the component data>>

Items to be set Set value

Explanation

Alignment Group Sets the component category.

Alignment Type Sets the component type.

Comp. Threshold Sets the threshold value or the level difference.

Comp. Tolerance Specifies the shape tolerance as a percentage.

Search Area (mm) Sets the range of the detection.

Body Size X (mm) Sets the size of the outer edge.

Body Size Y (mm) Sets the size of the outer edge.

Body Size Z (mm) Sets the size of the outer edge.

Cntr. Offset X (mm) Sets the offset amount in the X direction from the center position.

Cntr. Offset Y (mm) Sets the offset amount in the Y direction from the center position.

Cntr. Offset R (mm) Sets the offset amount of the angle of rotation.

Ruler Width

Algorithm Selects the recognition algorithm when using a special algorithm.

Base Alignment Selects the basic component type when using a special algorithm.

Vision Option Sets option parameter 1.

Vision Option 2 Sets option parameter 2.


Common Data


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Explanation

Lead Group N Sets the number of Lead Group (1 or 2)

Ruler Offset N Sets the offset amount for the detection line in the N direction.

Items to be set (Group 1)

Set value


Set value

Explanation

Lead Number: 1N

Lead Number: 2N

Sets the number of leads.

Reflect LL.: 1N (mm)

Reflect LL.: 2N (mm)

Sets the lead length of the upper lead(s) on the image.

Lead Width: 1N (mm)

Lead Width: 2N (mm)

Sets the width of the lead for the upper lead(s).

Lead Pitch: 1N (mm)

Lead Pitch: 2N (mm)

Sets the pitch for the upper lead(s).

Find Pos X: 1N (mm)

Find Pos X: 2N (mm)

Sets the reference position for the upper lead(s).

N direction

Find Pos Y: 1N (mm)

Find Pos Y: 2N (mm)


Explanation

Lead Group S Sets the number of Lead Group (1 or 2)

Ruler Offset S Sets the offset amount for the detection line in the S direction.


Set value


Set value

Explanation

Lead Number: 1S

Lead Number: 2S


Reflect LL.: 1S (mm)

Reflect LL.: 2S (mm)

Sets the lead length of the lower lead(s) on the image.

Lead Width: 1S (mm)

Lead Width: 2S (mm)

Sets the width of the lead for the lower lead(s).

Lead Pitch: 1S (mm)

Lead Pitch: 2S (mm)

Sets the pitch for the lower lead(s).

Find Pos X: 1S (mm)

Find Pos X: 2S (mm)

Sets the reference position for the lower lead(s).

S direction

Find Pos Y: 1S (mm)

Find Pos Y: 2S (mm)


Explanation

Lead Group E Sets the number of Lead Group (1 or 2)

E direction

Ruler Offset E Sets the offset amount for the detection line in the E direction.

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Set value


Set value

Explanation

Lead Number: 1E

Lead Number: 2E


Reflect LL.: 1E (mm)


Sets the lead length of the lead(s) on the right on the image.

Lead Width: 1E (mm)

Lead Width: 2E (mm)

Sets the width of the lead for the lead(s) on the right.

Lead Pitch: 1E (mm)

Lead Pitch: 2E (mm)

Sets the pitch for the lead(s) on the right.

Find Pos X: 1E (mm)

Find Pos X : 2E (mm)

Sets the reference position for the lead(s) on the right.

Find Pos Y: 1E (mm)

Find Pos Y: 2E (mm)


Explanation

Lead Group W Sets the number of Lead Group (1 or 2)

Ruler Offset W Sets the offset amount for the detection line in the W direction.


Set value


Set value

Explanation

Lead Number: 1W

Lead Number: 2W


Reflect LL.: 1W (mm)

Reflect LL.: 2W (mm)

Sets the lead length for the lead(s) on the left on the image.

Lead Width: 1W (mm)

Lead Width: 2W (mm)

Sets the width of the lead for the lead(s) on the left.

Lead Pitch: 1W (mm)

Lead Pitch: 2W (mm)

Sets the pitch for the lead(s) on the left.

Find Pos X: 1W (mm)

Find Pos X : 2W (mm)

Sets the reference position for the lead(s) on the left.

W direction

Find Pos Y: 1W (mm)

Find Pos Y: 2W (mm)

Table 2

Caution: In Table 2, the reference lead positions are expressed as the Find Pos.

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1.2 The basics of the component data definitions This section describes how to create component data in details. The component definition for the component that has two Lead Groups (See Figure 7) is taken as an example here.

Figure 7

Note: In Figure 7, the reference lead positions are displayed as the Find Pos.

In the N direction, the five leads on the left side and the three leads on the right side have different Lead width. In a case like this, as the component cannot be defined by a single Lead Group, it is defined by the two Lead Groups.

The tip position of the Pn1 lead is set as the reference for the first Lead Group, and from Pn1 to Pn5 leads are defines as follows:

Reference lead position X N1 : - 5.08mm Reference lead position Y N1 : 6.00mm ReflectLL N1 : 1.00mm Lead width N1 : 0.40mm Lead pitch N1 : 1.27mm Lead Number N1 : 5

The tip position of the Pn6 lead is set as the reference for the second Lead Group, and from Pn6 to Pn8 are defined as follows:

Length N1 N

E W

S

Length E1

Pitch N2

Width N2

Pitch N1 Width N1

Find Pos X N1 Find Pos X N2

Find Pos Y N2 Pitch E1

Width E1

The center of the component

Find Pos Y N1

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<Group 2: right-side group in N direction>

Reference lead position X N2 : 3.00mm Reference lead position Y N2 : 6.00mm ReflectLL N2 : 1.00mm Lead width N2 : 0.60mm Lead pitch N2 : 1.27mm Lead number N2 : 3

Defining the Lead Groups in this way makes it possible to define the components that have different lead width, lead pitches and lead length.

For the E direction, in the same way, pe1 is defined as the reference for the first Lead Group and pe4 is defined as the reference for the second Lead Group.

< 1stLead Group >

Reference lead position X E1 : 7.50mm Reference lead position Y E1 : 3.81mm ReflectLL E1 : 1.00mm Lead width E1 : 0.40mm Lead pitch E1 : 1.27mm Lead Number E1 : 3

<2nd Lead Group >

Reference lead position X E2 : 7.50mm Reference lead position Y E2 : -1.27mm ReflectLL E2 : 1.00mm Lead width E2 : 0.60mm Lead pitch E2 : 1.27mm Lead Number E2 : 3

It is possible to define the leads by a single Lead Group in the S and W direction.

<S direction Lead Group >

Reference lead position X S1 : - 5.08mm Reference lead position Y S1 : - 6.00mm ReflectLL S1 : 1.00mm Lead width S1 : 0.40mm Lead pitch S1 : 1.27mm Lead Number S1 : 9

<W direction Lead Group >

Reference lead position X W2 : - 7.50mm Reference lead position Y W2 : 3.81mm ReflectLL W2 : 1.00mm Lead width W2 : 0.40mm Lead pitch W2 : 1.27mm Lead Number W2 : 7

Basically, the component data can be created in this way. However, there is a method to create the data more simply by inputting only the minimum data on the machine. The following section describes the process.

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1.3 . Simple settings for component data

As the left/right and upper/lower leads of the QFP components are symmetrical, the components can be expressed in one group. Also, the outer shape is determined based on the lead tips. Therefore, the center of the QFP component is equal to the center of the outer shape. The lead length, the lead pitch, the lead width are the same in each direction and only the number of the leads in N/S and E/W direction may be different. For these reasons, it is possible to define the component shape as long as the following information is available.

- Body size X (xsize) - Body size Y (ysize) - Body size Z (zsize) - Lead Number N (hnum) - Lead Number E (vnum) - Lead pitch (pitch) - LeadWidth (width) - ReflectLL. (length)

Figure 8

The following is the explanation of the above mentioned simple setting for QFP component. In the QFP mode, the component data (shape parameters) is created automatically in the machine by just setting the data indicated in Table 3.

Items to be set Set Value

Body Size X (mm) Xsize

Body Size Y (mm) ysize

Lead Number N hnum

Lead Number E vnum

Lead pitch (mm) pitch

Lead width (mm) width

Reflecting lead length (mm) length

Table 3

Number of the leads N

Body Size X

Number of the leads E

Reflect lead length

Body Size Y


Lead Pitch Lead Width

S direction

N direction

E direction W direction

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<Automatic settings>

The setting is calculated as follows (See Figure 9 ): hposx = (hnum - 1) * pitch / 2 hposy = ysize / 2 vposx = xsize / 2 vposy = (vnum - 1) * pitch / 2

Figure 9

<< The result of the automatic setting for GFP recognition >>


Alignment Group IC

Alignment Type QFP

Comp. Threshold -

Comp. Tolerance -

Search Area (mm) -

Body Size X (mm) xsize

Body Size Y (mm) ysize

Body Size Z (mm) zsize

Cntr. Offset X (mm) 0

Cntr. Offset Y (mm) 0

Cntr. Offset R (mm) 0

Ruler Width 3

Algorithm 0

Base Alignment 0

Vision Option 0

Vision Option 2 0

Body Size X (xsize)

Body Size Y (ysize)


S

E

W

N

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Vision Option 3 0

Vision Option 4 0

Table 4

<<N direction data>>


Lead group N 1

Ruler Offset N 3

Items to be set Set value Items to be set Set value

Lead Number 1N hnum Lead Number 2N 0

Reflect LL 1N (mm) length Reflect LL 2N (mm) 0

Lead Width 1N (mm) width Lead Width 2N (mm) 0

Lead Pitch 1N (mm) pitch Lead Pitch 2N (mm) 0

Find Pos X 1N (mm) -hposx Find Pos X 2N (mm) 0

Find Pos Y 1N (mm) hposy Find Pos Y 2N (mm) 0

<<S direction data>>


Lead group S 1

Ruler Offset S 3


Lead Number 1S hnum Lead Number 2S 0

Reflect LL 1S (mm) length Reflect LL 2S (mm) 0

Lead Width 1S (mm) width Lead Width 2S (mm) 0

Lead Pitch 1S (mm) pitch Lead Pitch 2S (mm) 0

Find Pos X 1S (mm) - hposx Find Pos X 2S (mm) 0

Find Pos Y 1S (mm) - hposy Find Pos Y 2S (mm) 0

<<E direction data>>


Lead group E 1

Ruler Offset E 3


Lead Number 1E vnum Lead Number 2E 0

Reflect LL 1E (mm) length Reflect LL 2E (mm) 0

Lead Width 1E (mm) width Lead Width 2E (mm) 0

Lead Pitch 1E (mm) pitch Lead Pitch 2E (mm) 0

Find Pos X 1E (mm) - vposx Find Pos X 2E (mm) 0

Find Pos Y 1E (mm) vposy Find Pos Y 2E (mm) 0

<<W direction data>>


Lead group W 1

Ruler Offset W 3

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Lead Number 1W vnum Lead Number 2W 0

Reflect LL 1W (mm) length Reflect LL 2W (mm) 0

Lead Width 1W (mm) width Lead Width 2W (mm) 0

Lead Pitch 1W (mm) pitch Lead Pitch 2W (mm) 0

Find Pos X 1W (mm) vposx Find Pos X 2W (mm) 0

Find Pos Y 1W (mm) vposy Find Pos Y 2W (mm) 0

Table 5

Caution: In Table 5, the reference lead positions are displayed as the Find Pos.

In this way, the component data can normally be created just by specifying the minimum necessary data.

1.4 Precautions concerning the component data definitions

This section describes points to notice on component data setting.

1.4.1. ReflectLL.

Caution is required in recognizing to the lead length. When the component is read as an image, the lead may appear different in the image from the actual image. The bent parts of the gull-wing shaped leads look black in the image and are hard to be recognized. In this case, it is necessary to specify the data using the shape that is visible on the image, rather than the actual component shape. As can be expected from the item name “ReflectLL.” on the data definition screen, the length of the portion that is visible in the image is supposed to be set on the screen.

Figure 10

Actual lead length

Reflecting lead length

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1.4.2. Component sizes (chip component)

When the chip component (capacitors) and other components whose tip is rounded, the component size on the image may be different from the actual component size. In this case, the size on the image should be set.

Figure 11

2. Details of the component data setting

As already mentioned, it is possible to create the data for the standard components with the minimum necessary data. In the component recognition mode, the components are divided into the groups shown below and the data is created for each mode.

<IC components>

1) 2-pin components 2) Mini-mold transistors / SOTs 3) Power transistors 4) SOP Recognition mode 5) QFP Recognition mode 6) SOJ Recognition mode 7) PLCC Recognition mode 8) Off Lead

<Connector components>

1) Single-direction Connector recognition mode

Actual component size

Set component size

The figure seen from the side of the component

This part looks dark

The image of the component seen from the bottom surface

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2) 4-direction Connector recognition mode 3) Odd-shape Connector recognition mode

<Ball components>

1) Simple BGA Recognition mode 2) BGA Recognition mode 3) Flip-chip Recognition mode

<Chip components>

1) Standard Chip Recognition mode 2) MELF Chip Recognition mode 3) Bare Chip Recognition mode 4) Circular Chip Recognition mode 5) Special Chip Recognition mode 6) Small Chip Recognition mode

<Special components>

1) Special Shape Recognition mode 2) Odd-shape Chip Recognition mode 3) Mark Recognition mode 4) Sp Quad Recognition mode 5) Center of Gravity Detection mode

The following section describes the items to be set and other information pertaining to the individual recognition modes.

2.1. 2-pin components

<Items to be set for 2-pin components>

Items to be set Set value Explanation

AlignmentGroup IC Sets the component category.

Alignment Type 2Ends Sets the component type.

Comp. Threshold Sets the detection level difference for lead

detection. (See “Appendix 2. Detection level differences used to detect leads (threshold value))”


Search Area (mm) Sets the range for detection.

Body Size X (mm) Sets the outer edge size.

Body Size Y (mm) Sets the outer edge size.

Body Size Z (mm) Sets the outer edge size.

Ruler Offset Sets the offset amount for the detection line.

Ruler Width

Reflct LL Sets the lead length on the image.

Lead Width (mm) Sets the lead width.

Table 6

This mode is used for recognition of components that have two leads, and for diodes, aluminum capacitors and other components.

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As shown in Figure 12, the components whose “Body size X” and the “Lead width” are different can be defined. The upper/lower and left/right leads need to be symmetrical. Chip recognition is used as the recognition method.

Figure 12

<Recognition check items>

Items Yes/No Notes

Body Size May exist Only “Body Size Y” is checked.

Lead pitch No

Lead width Yes

Lead length No

Lead position Yes

Checks the lead tip position using [Body Size Y x tolerance] as the check range.

* Please refer to “Appendix 4. Lead position check” for the details of “Lead position check” function.

Table 7

Table 8 is the example of actual settings and the recognition results. Please refer to “Appendix 5. Reading and interpreting the recognition results display” for how to interpret the information on recognition result.


Alignment Group IC

Alignment Type 2Ends

Comp. Threshold 50

Comp. Tolerance 30

Search Area (mm) 2.5

Body Size X (mm) 0.6

Body Size Y (mm) 7.6

Lead width

Lead length

Body size Y

Body size X

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Body Size Z (mm) 6.0

Ruler Offset 5

Ruler Width 1

Reflct LL 2.0

Lead Width (mm) 0.6

Table 8

In the recognition result shown in Figure 13, “sizeh” is displayed as the average value between the upper and lower lead width. Special recognition is available for recognizing the 2-pin components. Please refer to “2.11.6. Special recognition of chip components (standard chips, MELF chips, special chips)” for the details.

Figure 13

2.2. Mini-mold trasnsistors / SOTs

<Items to be set for mini-mold transistors and SOTs>


Alignment Group IC Sets the component category.

Alignment Type Mini-Tr/SOT Sets the component type.

Comp. Threshold Sets the detection level difference for lead detection.

(See “Appendix 2. Detection level differences used to

detect leads (threshold value)”)


Search Area (mm) Sets the range for detection.

Body Size X (mm) Sets the outer edge size.

Body Size Y (mm) Sets the outer edge size.

Body Size Z (mm) Sets the outer edge size.


Ruler Width

Lead Number N Sets the number of the leads in the N direction.

Lead Number S Sets the number of the leads in the S direction.

Reflct LL Sets the lead length on the image.


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Lead Pitch N mm) Sets the lead pitch in the N direction.

(Set to 0 when there is one lead.)

Lead Pitch S(mm) Sets the lead pitch in the S direction.

(Set to 0 when there is one lead.)

Table 9

This is the recognition mode for components such as mini-mold transistors and SOTs with leads in the N and S directions. It is possible to define the number of the leads and the lead pitch separately for N and S directions. Though there is no need for the upper and lower directions to be symmetrical, the left and right directions must be symmetrical. The lead width and lead length are the same in the N and the S directions. Consequently, all of the leads need to be the same shape. When these conditions are not satisfied, please use the special mode for recognition. When only the upper and lower lead width and lead length of the components are different, the components can also be recognized by Power Transistor mode. (Please refer to P.29 “2.3. P-Tr” for the details.)

Figure 14

<Recognition check items>

Items Yes/No Notes

Body Size May Exist Only the outer edge dimension Y is checked. (Note 1)

Lead pitch Yes The pitch in the direction with one lead is not checked.

Lead width No

Lead length No

Lead position Yes Checks the lead tip position by using [Body Size Y x tolerance] as the check range. (Note 2)

Extra leads May Exist Checks whether there are extra leads aside from the defined leads. (Note 3).

Table 10

Note: 1. This function performs a check only when the check function is validated in the application software. (Some versions are not equipped with this function.) 2. See “Appendix 4. Lead position check” for the details of the “Lead position check”

function. 3. The function checks if there is an identical shape lead outside the detected lead, and if

Lead width

Body Size Y

Body Size X

Pitch S

Lead length

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there is, it is determined to be an error. (Some versions are not equipped with this function.)

Table 11 is the example of actual definitions and the recognition results.

<< Items to be set for Mini-mold trasnsistors / SOTs >>


Alignment Group IC

Alignment Type Mini-Tr/SOT

Comp. Threshold 45

Comp. Tolerance 20





Ruler Offset 4

Ruler Width 1

Lead Number N 1

Lead Number S 2

Reflct LL 0.3

Lead Width (mm) 0.3

Lead Pitch N (mm) 0

Lead Pitch S (mm) 1.75

Table 11

Figure 15

If the LED that has four leads and the lead width of one of the lead is different from the others is recognized by standard mini-transistor /SOT recognition data, the correct result cannot be obtained due to the different lead width.


Alignment Group IC

Alignment Type Mini-Tr/SOT

Comp. Threshold 50

Comp. Tolerance 30





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Ruler Offset 3

Ruler Width 1

Lead Number N 2

Lead Number S 2

Reflct LL 0.5

Lead Width (mm) 0.4

Lead Pitch N (mm) 2.0


Table 12

<Recognition result with standard data>

Figure 16

In order to avoid this, the data corresponds to the component shape should be created. Special mode is used in order to define the leads in the N direction as two Lead Groups.

<Items to be set for mini-mold transistors and SOTs>


Alignment Group Special

Alignment Type Special

Comp. Threshold 50

Comp. Tolerance 30





Cntr. Offset X (mm) 0.0

Cntr. Offset Y (mm) 0.0

Cntr. Offset R (mm) 0.0

Common Data

Ruler Width 1

25/178



Algorithm

Base Alignment Mini-Tr /SOT

Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Vision Option 4 0


Lead Group N 2 Common

Ruler Offset N 3

Lead Number : 1N 1

Reflect LL.: 1N (mm) 0.5

Lead Width: 1N (mm) 0.6

Lead Pitch: 1N (mm) 0.0

Find Pos X: 1N (mm) - 0.9

Group 1

Find Pos Y: 1N (mm) 1.6

Lead Number : 2N 1




Find Pos X: 2N (mm) 1.0

N Direction

Group 2


Lead Group S 1 Common

Ruler Offset S 3

Lead Number : 1S 2

Reflect LL.: 1S (mm) 0.5

Lead Width: 1S(mm) 0.4

Lead Pitch: 1S (mm) 2.0

Find Pos X: 1S (mm) -1.0

S Direction

Group 1

Find Pos Y: 1S (mm) -1.6 Table 13

<Recognition result with special data>

Figure 17

26/178


This makes it possible to obtain the results that are not offset.

2.2.1 Mini-mold transistor / SOTs Special –(1)

Though the “Special” mode is provided for recognizing the trimmer capacitors, variable resistors and other components, the “Power Transistor” mode (See “2.3. P-Tr” ) or the “Special Quad.” mode (See “2.12.4. Special Quad”) are recommendable to be used for these components. (*Please note that the operation is not covered under YAHAMA guaranty.) <Items to be set for mini-mold transistor and SOTs (Special 1)>


Alignment Group Special Sets the component category.

Alignment Type Special Sets the component type.

Comp. Threshold

Sets the detection level difference for lead detection. (See “Appendix 2. Detection level differences used to detect leads (threshold value)”)

Comp. Tolerance Specifies the tolerance of the lead pitch as a percentage.

Search Area (mm)

Sets the range of the detection.

Body Size X (mm)

Sets the size of the outer edge.

Body Size Y (mm)


Body Size Z (mm)


Cntr. Offset X (mm)

Sets the offset amount in the X direction from the center position.

Cntr. Offset Y (mm)

Sets the offset amount in the Y direction from the center position.

Cntr. Offset R (mm)

Sets the offset amount of the angle of rotation.

Ruler Width

Algorithm Special 1 Selects the recognition algorithm when using a special algorithm.

Base Alignment Mini-Tr /SOT

Selects the basic component type when using a special algorithm.

Vision Option 1 0 Sets option parameter 1.



Common Data



Explanation

Lead Group N 1 Sets the number of Lead Group in the N direction. (1)

Common

Ruler Offset N Sets the offset amount for

the detection line in the N direction.

Lead Number: 1N Sets the number of leads in

the N direction.

N Direction

Group 1

Reflect LL.: 1N (mm) Sets the lead length on the

image in the N direction.

27/178


Lead Width: 1N (mm) Sets the width of the lead in

the N direction.

Lead Pitch: 1N (mm) Sets the pitch in the N

direction.

Find Pos X: 1N (mm) Sets the reference position

X of the lead in the N direction.

Find Pos Y: 1N (mm) Sets the reference position

Y of the lead in the N direction.

Lead Group S 1 Sets the number of Lead Group in the S direction. (1)

Common

Ruler Offset S Sets the offset amount for

the detection line in the S direction.

Lead Number : 1S Sets the number of leads in

the S direction.

Reflect LL.: 1S (mm) Sets the lead length on the

image in the S direction.

Lead Width: 1S (mm) Sets the width of the lead in

the S direction.

Lead Pitch: 1S (mm) Sets the pitch in the S

direction.

Find Pos X: 1S (mm) Sets the reference position

X of the lead in the S direction.

S Direction

Group 1

Find Pos Y: 1S (mm) Sets the reference position

Y of the lead in the S direction.

Table 14

Note: The parameters other than those shown in Table 14 are not used, and should be set to 0.

[Recognition check items ]

Items Yes / No Notes

Body Size May exist Only the outer edge dimension Y is checked. Note 1


Lead width No

Reflect LL No

Find Pos Yes Checks the lead tip position in the check range of [outer edge dimension Y x tolerance]. Note 2

Table 15

Note: 1. This function performs a check only when the check function is validated in the application software. (Some versions may not be equipped with this function.) 2. See “Appendix 4. Lead position check” for the details of the “Lead position check”

function.

28/178


2.2.2. Mini-mold transistor / SOTs Special –(4)

Check Upside-Down (Dispersion)

The top surface and the bottom surface of the components is identified by checking the variation of the brightness (dispersion) of the determination range. It is applicable for the components with the characters printed on the molded area of the pickup surface.

Option 1

Threshold of 3-sigma Sets the threshold of the value of the brightness variation (3sigma) in the determination range. The value becomes larger as the brightness variation becomes large.

Option 2

Threshold of Average Sets the lower limit of the average brightness (Ave) in the determination area. It is available only when “Dispersion” is specified as “NG condition”. It is used when over-determination occurs due to the variant set for determination.

Option 3 Judgement Flag (Some old version software may not be equipped with this function.)

Table 16

Specify the determination range in the Lead Group 1 in W direction. (If it is necessary to offset to the E direction, set to East.)

Figure 18

Bit position

Determination range Offset Enable: (0: Disable, 1: Enable)

NG condition: (0:Dispersion, 1: Non Dispersion)

- Dispersion: When the variance of the brightness in the determination range is larger than threshold, it is determined to be an error.

- Non Dispersion: When the variance of the brightness in the determination range is smaller than threshold, it is determined to be an error.

- Number of the Lead Group W: 1 - Number of the leads W1: 0 - Lead pitch W1: 0 - Lead width W1: Size of the determination range Y - Reflect LL W1: Size of the determination range X - Find Pos X W1: Determination range offset X - Find Pos Y W1: Determination range offset Y

Dispersion: Small

Dispersion: Large

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2.3. P-Tr

<Items to be set for P-Tr>



Alignment Type P-TR Sets the component type.

Comp. Threshold Sets the detection level difference for lead detection. (See “Appendix 2. Detection level differences used to detect leads (threshold value)”)











Ruler Width

Lead Number : N Sets the number of leads in the N direction.

Reflect LL.: N (mm) Sets the lead length on the image.

Lead Width: N (mm) Sets the width of the lead.

Lead Pitch: N (mm) Sets the pitch in the N direction. (Set to 0 when

there is only one lead.)

Lead Number : S Sets the number of leads in the S direction.

Reflect LL.: S (mm) Sets the lead length on the image.

Lead Width: S (mm) Sets the width of the lead.

Lead Pitch: S (mm) Sets the pitch in the S direction. (Set to 0 when

there is only one lead.)

Table 17

This is the recognition mode for power transistors with leads in the N and S directions. It can be used not only for power transistors, but also for recognition of any components whose upper and lower lead width and lead lengths are different. The number of the lead, lead pitch, lead width and lead length can be defined separately for the N and S directions. Though the upper and lower directions do not need to be symmetrical, the left and right directions must be symmetrical.

30/178


Figure 19



Body Size May exist Only the outer edge dimension Y is checked. (Note 1)


Lead width No

Reflect LL No

Find Pos Yes Checks the lead tip position using [outer edge dimension Y x tolerance] as check range. (Note 2)

Table 18

Note: 1. This function performs a check only when the check function is validated in the

application software. (Some versions are not equipped with this function.) 2. See “Appendix 4. Lead position check” for the details of the “Lead position check”

function.

Table 19 shows the example of actual settings and the recognition results.

<Items to be set for Power Transistor>


Alignment Group IC

Alignment Type P-Tr

Comp. Threshold 40

Comp. Tolerance 30








Lead Width N

Lead Length N

Body Size Y

Lead Length S

Lead Width S

Body Size X

Pitch S

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Ruler Offset N 15

Ruler Offset S 5

Ruler Width 3

Lead Number : N 1

Reflect LL.: N (mm) 1.5

Lead Width: N (mm) 5.0

Lead Pitch: N (mm) 0.0

Lead Number : S 2

Reflect LL.: S (mm) 1.0

Lead Width: S (mm) 0.65

Lead Pitch: S (mm) 4.6

Table 19

<Component and defined shape>

Figure 20

<Recognition Result>

As shown in Figure 21, the Ruler Offset in the N direction is set so that sections where the leads are not chamfered are detected.

Figure 21

32/178


The following is the example in which power transistor recognition was used to recognize the trimmer capacitor.

<Items to be set for Power Transistor>


Alignment Group IC

Alignment Type P-Tr

Comp. Threshold 50

Comp. Tolerance 30








Ruler Offset N 2

Ruler Offset S 2

Ruler Width 3

Lead Number: N 2




Lead Number: S 2




Table 20

< Recognition Result (P-Tr) >

Figure 22

33/178


<Component and defined shapes>

When the outer shape of the component glows, and the recognition by Power Transistor recognition mode is not stable (See Figure 23), the Special Quad. mode may offer more stable recognition as shown in Figure 24. (Please refer to “2.12.4. Special Quad”.)

Figure 23

<Recognition Result (Sp. Quad)>

Figure 24

The Special Quad. mode offers more stable recognition for trimmer capacitors (See Figure 25), as well. (Please refer to “2.12.4. Special Quad”.)

Figure 25

34/178


The following shows an example in which the Power Transistor recognition mode is used to recognize a variable resistor.


Alignment Group IC

Alignment Type P-Tr

Comp. Threshold 40

Comp. Tolerance 30








Ruler Offset N 5

Ruler Offset S 5

Ruler Width 3

Lead Number: N 1




Lead Number: S 2




Table 21

<Component and defined shape>

Figure 26

35/178


<Recognition Result (P-Tr)>

Figure 27

As with trimmer capacitors, when the outer shape of the component glows, and the recognition by Power Transistor recognition mode is not stable, the Special Quad. mode may offer more stable recognition. (Please refer to”2.12.4. Special Quad”.)

Figure 28

2.4. SOPs

<Items to be set for SOPs>



Alignment Type SOP Sets the component type.

Comp. Threshold Sets the detection level difference for lead detection. (See “Appendix 2. Detection level differences used to detect leads (threshold value)”.)



36/178







Ruler Width

Lead Number Sets the number of leads on one side.

Lead Pitch (mm) Sets the pitch.

Lead Width (mm) Sets the width of the lead.

Reflect LL. (mm) Sets the lead length on the image.

Table 22

This is the recognition mode used for standard SOP components.

Figure 29



Body Size May exist Only the “Body Size X” is checked. (Note 1)

Lead pitch Yes

Lead width May exist Checks only when the lead width is more than 1.0mm. (Note 2)

Reflect LL No

Find Pos May exist Checks the lead tip position using [outer edge dimension Y x tolerance] as check range. (Note 3)

Table 23

Note: 1. This function performs a check only when the check function is validated in the

Application software. (Some versions may not be equipped with this function.) 2. “Lead width” check function may not be available for the old versions. 3. See “Appendix 4. Lead position check” for the details of the “Lead position check” function.

The following is the example of actual setting and the recognition result.

Body Size Y

Body Size X

Lead length

Lead width

Lead pitch

37/178


< Items to be set for SOP>


Alignment Group IC

Alignment Type SOP

Comp. Threshold 50

Comp. Tolerance 30





Ruler Offset 3

Ruler Width 3

Lead Number 8

Lead Pitch (mm) 1.27

Lead Width (mm) 0.45

Reflect LL. (mm) 0.5

Table 24

<Recognition result>

Figure 30

2.4-1 Special recognition in the SOP Recognition mode

There are some special recognition algorithms for SOP Recognition mode.

<< Items to be set for SOP special mode >>


Alignment Group Special Sets the component category. Common Data Alignment Type Special Sets the component type.

38/178



Comp. Threshold

Sets the detection level difference for lead detection. (See “Appendix 2. Detection level differences used to detect leads (threshold value)”.)

Comp. Tolerance Specifies the tolerance of lead pitch as a percentage.








Ruler Width

Algorithm Special n Selects the recognition algorithm when using a special algorithm.

Base Alignment SOP Selects the basic component type when using a special algorithm.

Vision Option 1 (0) Sets option parameter 1.





Explanation

Lead Group E 1 Sets the number of Lead Group in the E direction. (1)

Common

Ruler Offset E Sets the offset amount for the

detection line in the E direction.

Lead Number: 1E Sets the number of leads in the

E direction.


Sets the lead length on the image in the E direction.

Lead Width: 1E (mm)

Sets the width of the lead in the E direction.

Lead Pitch: 1E (mm)

Sets the pitch in the E direction.

Find Pos X: 1E (mm)

Sets the reference position X of the lead in the E direction.

E Direction

Group

1

Find Pos Y: 1E (mm)

Sets the reference position Y of the lead in the E direction.

Lead Group W 1 Sets the number of Lead Group in the W direction. (1)

Common

Ruler Offset W Sets the offset amount for the

detection line in the W direction.

Lead Number: 1W

Sets the number of leads in the W direction.

W Direction

Group

1 Reflect LL.: 1W (mm)

Sets the lead length on the image in the W direction.

39/178



Explanation

Lead Width: 1W (mm)

Sets the width of the lead in the W direction.

Lead Pitch: 1W (mm)

Sets the pitch in the W direction.

Find Pos X: 1W (mm)

Sets the reference position X of the lead in the W direction.

Find Pos Y: 1W (mm)

Sets the reference position Y of the lead in the W direction.

Table 25


1) Special 1: This is the same recognition method as SOJ recognition. (SOJ recognition should be used in order to run this mode.) This mode improves the recognition rate by checking the positional relations between the leads and extracting the combination best fits the component definition when detecting the end leads.

2) Special 2: Not supported



5) Special 5: SOP upside-down judgment (LeadPitch) This compares the lead pitches at the tip and root of the lead in order to check the reversed component. In order to set the inner detection line, the lead length is set to a length slightly longer than the normal value. (This should be set so that the detection line extends to the lead section.) This recognition method is available only when using a single camera. When using a multi-camera, it is impossible to perform recognition of the leads aligned in the E/W direction. If this method is being used, the leads should be aligned in N/S direction before carrying out the recognition.

Figure 31

Root detection line

Tip detection line

40/178


Table 26 shows the recognition results obtained with a single camera.

<Items to be set for SOPs>




Comp. Threshold 50

Comp. Tolerance 30








Ruler Width 3

Algorithm Special 5

Base Alignment SOP

Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Common Data

Vision Option 4 0


Lead Group E 1 Common

Ruler Offset E 4

Lead Number: 1E 8

Reflect LL.: 1E (mm) 1.0

Lead Width: 1E (mm) 0.45

Lead Pitch: 1E (mm) 1.27

Find Pos X: 1E (mm) 3.2

E Direction

Group 1

Find Pos Y: 1E (mm) 4.445

Lead Group W 1 Common

Ruler Offset W 4

Lead Number: 1W 8

Reflect LL.: 1W (mm) 1.0

Lead Width: 1W (mm) 0.45

Lead Pitch: 1W (mm) 1.27

Find Pos X: 1W (mm) -3.2

W Direction

Group 1

Find Pos Y: 1W (mm) 4.445

Table 26

41/178


<When the component is correctly positioned >

Figure 32

<When a reversed component is detected>

Figure 33

6) Special 6: Check the bending of the whole leads of SOP components This mode checks to see if all of the leads of an SOP are bent between the tips and the roots of the leads. The recognition mode is the same as that of Special 1.

Option 1: Bending angle tolerance value

42/178


(This specifies to use “degrees” as a unit, and when the value is 0, the check is performed as “ 5 degrees” has been specified.) An error occurs if the sum of the bending angles detected on the left and right sides is larger than the value specified with Option 1. If the leads on the left and right are bent in different directions as shown in Figure 34, an error occurs. If the leads are bent in the same direction, as shown in Figure 35, no error occurs.

Figure 34

Figure 35

Set the detection line at the tip of the leads and at the root of the leads, and obtain the center of these two lines. The tilt of the whole leads is detected based on these values. Detect the tilt of the lead on both left and right side, then add these results. The tip line is set to the inside of the Ruler Offset by the amount of the distance from the lead tip to the Ruler Offset. The root line is set to the inside of the Ruler Offset by the amount of the distance from the lead tip to the point equal to the value where the detection line offset is subtracted from the lead length. For this reason, the length including the lead root portions is set as Reflect LL unlike the usual case of setting. Figure 36 shows the example of the bent lead check. An error has occurred due to the bent leads. The lead length is set longer than the normal value in order to set the inside detection line.

<Items to be set for SOP Special mode>


Common Alignment Group Special

Bent angle of the lead

43/178




Comp. Threshold

Comp. Tolerance

Search Area (mm)

Body Size X (mm)

Body Size Y (mm)

Body Size Z (mm)

Cntr. Offset X (mm)

Cntr. Offset Y (mm)

Cntr. Offset R (mm)

Ruler Width

Algorithm Special 6

Base Alignment SOP

Vision Option 1 5

Vision Option 2 0

Vision Option 3 0

Data

Vision Option 4 0



Ruler Offset E 3

Lead Number: 1E 17

Reflect LL.: 1E (mm) 1.2 Lead Width: 1E (mm) 0.4 Lead Pitch: 1E (mm) 1.0 Find Pos X: 1E (mm) 5.1

E Direction

Group 1



Ruler Offset W 3

Lead Number: 1W 17

Reflect LL.: 1W (mm) 1.2 Lead Width: 1W (mm) 0.4 Lead Pitch: 1W (mm) 1.0 Find Pos X: 1W (mm) -5.1

W Direction

Group 1


Table 27

Figure 36

44/178


7. Special 7: Direction check by Lead width The direction is determined by using the thick leads in the lead row.

Figure 37

2.5. SOJs

<Items to be set for SOJ>



Alignment Type SOJ Sets the component type.








Ruler Width 3

Lead Number Sets the number of leads on one side.




Table 28

SOJs and SOPs are similar in terms of shape. However, unlike SOPs, the lead tips of SOJs cannot be stably recognized in some cases (because the shape of the leads are not planer). In order to improve the recognition rate, the positional relations between the leads are checked and the combination best fits the component definition is extracted when the end leads are detected.

Also, in some cases, all of the illumination sources (Main light, Coaxal light and Side light) need to be turned on in order to light up the leads stably. In this case, “Yes” should be selected from the “All Lighting On” recognition parameter. As shown in Figure 40, the leads will be clearly recognized when all the illumination sources are turned on.

Option 1: The position of the wide lead in the N/W direction. (e.g.:4)

Option 2: The position of the wide lead in the S/E direction (e.g.:2)

45/178


Figure 38

< Main light and Coaxal light are turned on>

Figure 39

< All the illumination sources are turned on: Main light , Coaxal light and Side light >

Figure 40

Lead length

Lead width

Pitch Body Size Y

Body Size X

46/178


If the recognition is still not stable, Lead root recognition mode should be used. In this mode, the root of the lead is recognized not the tip. When this recognition mode is selected, either “Inside Recognition” or “Inside + LeadAutoSearch” should be selected for ”Recognition Way” in the recognition parameters. As shown in Figure 39, the lead tips look split and the roots where the leads are attached are visible, which affect the recognition of SOJs. In this case, Lead rood recognition mode provides the stable recognition by detecting the inner leads.

Moreover, with the “Lead Auto Search”, the LeadPitch and LeadWidth parameters are used when the row of leads is detected, and leads that match these definition data are picked out during lead detection.

[Recognition check items]


Body Size No



Reflect LL No

Find Pos No

Table 29

Note: 1. “Lead width check” function may not be available for some old softwares.

The following is the actual example of the recognition of the normal lead tip detection and root detection.

<<Items to be set for SOJs>>


Alignment Group IC

Alignment Type SOJ

Comp. Threshold 50

Comp. Tolerance 30





Ruler Offset 6

Ruler Width 3

Lead Number 14



Lead Pitch (mm) 1.27

Table 30

When performing inside recognition, it may not be able to detect the component without inputting the correct Lead length. Please check the display of the defined shape to make sure it matches to the actual component.

47/178


< Lead tip detection> <Lead root detection>

Figure 41

As shown in Figure 41, in inside recognition mode, the inner portion of the detection leads (indicated by the number 4 through 7 in the figures) are detected.

2.5.1. Special recognition in the SOJ Recognition mode

There is no special recognition in SOJ recognition mode at this point in time.

[How to set the “Find Pos” when the Rood Detection mode is used]

In the Root Detection mode, the root position of the lead is internally set as the reference lead position (Find Pos). (See Figure 42). As these are set internally in the software, the users basically do not need to consider. However, please keep it in mind when using the Special Recognition mode.

Figure 42

Find Pos X E1 Find Pos X W1

Find Pos Y E1 Find Pos Y W1

48/178


2.6. QFPs

Setting the data in Table 31 is required to create the component data of QFP components.

<Items to be set for QFPs>



Alignment Type QFP Sets the component type.








Ruler Width

Lead Number N Sets the number of leads in the cross direction.

Lead Number E Sets the number of leads in the lengthwise

direction.

Lead Pitch (mm) Sets the lead pitch.



Bumper Mask (mm)

When the QFP has bumpers, it sets so that the range from the intersection point of the detection lines and the set value are not to be detected. ( Normally, 0 is set for QFPs.)

Table 31

49/178


This mode is used for recognition of standard QFPs.

Figure 43



Body Size No



Reflect LL No

Find Pos No Table 32

Note: 1. This function may not be available for some old softwares.

<Items to be set for QFPs>


Alignment Group IC

Alignment Type QFP

Comp. Threshold 50

Comp. Tolerance 30





Ruler Offset 2

Ruler Width 3

Lead Number N 25

Lead Number E 25

Lead Pitch (mm) 0.5



Bumper Mask (mm) 0

Table 33

Body Size Y

Body Size X

Pitch

Lead width

Lead length

50/178


Figure 44

2.6.1. Special recognition in the QFP Recognition mode

There are some special algorithms available for QFP recognition mode.

1) Special 1: Side Lead Fitting

This mode improves the recognition rate by checking the positional relations between the leads, and extracting the combination best fits the component definition when detecting the end leads.

Option 3: Recognition Flag

2) Special 2: NS Base Search

In this mode, SOJ recognition is performed by first using the leads in the N/S direction, then based on the data, the recognition of W/E direction is performed.

Option 3: Recognition Flag (same as Special 1)

3) Special 3: WE Base Search

In this mode, SOJ recognition is performed by first using the leads in the W/E direction, then based on the data, the recognition of N/S direction is performed.

4) Special 4: Check Lead Length In this mode, a function that checks the lead length is added to the normal QFP recognition. It checks whether the distance between the straight line running across the

� Bit position

Excessive Lead Check (0:Non, 1:Exist) (It checks whether the extra leads exist outside of the pitch 1.)

51/178


lead tips and tips of each lead is less than the specified distance. Option 1: Bumper mask offset X:(The offset in the X direction: Pixel) Option 2: Bumper mask offset Y: (The offset in the Y direction: Pixel) Option 3: Allowable length error (set as a value in units of 1/100 mm).

Values that may be set are those between 0 and 255 (0.01 ~ 2.55 mm). It does not perform a check when the value is 0. (When setting the value larger than 128, please input the value that subtract

256 from the set value.)

Figure 45

Note: Please refer to “Appendix 3. Creating simple data in the special recognition modes” for the method how to create components data in Special mode

<< Items to be set for QFP Special recognition >>




Comp. Threshold








Common

Data


Line running across the tips.

Checks the distance between the line running across the tips of the leads and the lead tip.

52/178



Cntr. Offset R (mm) Sets the offset amount of the angle of

rotation.

Ruler Width

Algorithm Special n Selects the recognition algorithm when using a special algorithm.

Base Alignment QFP Selects the basic component type when using a special algorithm.






Explanation

Lead Group N 1 Specifies the number for the Lead Group in the N direction. (1)

Common

Ruler Offset N Sets the offset amount of the

detection line in the N direction.

Lead Number: 1N Sets the number of lead in the

N direction.




the N direction.


direction.

Find Pos X: 1N (mm) Sets the reference position X

in the N direction.

N

Direction

Group 1

Find Pos Y: 1N (mm) Sets the reference position Y

in the N direction.

Lead Group S 1 Specifies the number for the Lead Group in the S direction. (1)

Common

Ruler Offset S Sets the offset amount of the

detection line in the S direction.

Lead Number: 1S Sets the number of lead in the

S direction.




the S direction.


direction.

Find Pos X: 1S (mm) Sets the reference position X

in the S direction.

S Direction

Group 1

Find Pos Y: 1S (mm) Sets the reference position Y

in the S direction.

53/178


Lead Group E 1 Specifies the number for the Lead Group in the E direction. (1)

Common

Ruler Offset E Sets the offset amount of the


Lead Number: 1E Sets the number of lead in the

E direction.

Reflect LL.: 1E (mm) Sets the lead length on the

image in the E direction.

Lead Width: 1E (mm) Sets the width of the lead in

the E direction.

Lead Pitch: 1E (mm) Sets the pitch in the E

direction.

Find Pos X: 1E (mm) Sets the reference position X

in the E direction.

E Direction

Group 1

Find Pos Y: 1E (mm) Sets the reference position Y

in the E direction.

Lead Group W 1 Specifies the number for the Lead Group in the W direction. (1)

Common

Ruler Offset W Sets the offset amount of the


Lead Number: 1W Sets the number of leads in

the W direction.

Reflect LL.: 1W (mm) Sets the lead length on the

image in the W direction.

Lead Width: 1W (mm) Sets the width of the lead in

the W direction.

Lead Pitch: 1W (mm) Sets the pitch in the W

direction.

Find Pos X: 1W (mm) Sets the reference position X

in the W direction.

W Direction

Group 1

Find Pos Y: 1W (mm) Sets the reference position Y

in the W direction. Table 34


2.7. PLCCs

<Items to be set for PLCCs>



Alignment Type PLCC Sets the component type.





54/178






Ruler Width

Lead Number N Sets the number of leads in the cross direction.

Lead Number E Sets the number of leads in the lengthwise

direction.




Table 35

In the normal mode, the recognition method is the same as QFP recognition.

Figure 46

QFPs and PLCCs are similar in terms of shape. However, unlike QFPs, the lead tips of PLCCs may not be stably recognized (because the shape of the leads are not planar).

Also, in some cases, all of the illumination sources (Main light, Coaxal light and Side light) need to be turned on in order to light up the leads stably. In this case, “Yes” should be selected from the “All Lighting On” recognition parameter.

If the recognition is still not stable, Lead root recognition mode should be used. In this mode, the root of the lead is recognized not the tip.

In order to improve the recognition rate, the positional relations between the leads are checked and the combination best fits the component definition is extracted when the end leads are detected

When this recognition mode is selected, either “Inside Recognition” or “Inside + LeadAutoSearch” should be selected for ”Recognition Way” in the recognition parameters. In the “LeadAutoSearch” mode, Lead detection is performed by using the lead pitch/ lead width parameter and extracting the data best fits the definition data when detecting the lead row.

Lead length

Lead width

Pitch Body Size Y

Body Size X

55/178




Body Size No



Reflect LL No

Find Pos No Table 36

Note: “Lead width” check function may not be available for the old softwares.

The following is the actual example of the recognition of the normal lead tip detection and root detection.


Alignment Group IC

Alignment Type PLCC

Comp. Threshold 50

Comp. Tolerance 15





Ruler Offset 5

Ruler Width 3

Lead Number N 11

Lead Number E 11



Lead Pitch (mm) 1.27 Table 37

When performing root recognition, it may not be able to be detected without inputting the correct Lead length. Please check the display of the defined shape to make sure it matches to the actual component.

<Lead tip detection> <Lead root detection>

Figure 47

56/178


2.7.1 Special recognition in the PLCC Recognition mode

There are several special recognition algorithms available for PLCC recognition mode.

1) Special 1: Side Lead Fitting

This mode improves the recognition rate by checking the positional relations between the leads and extracting the combination best fits the component definition when detecting the end leads.

Option 1: Lead detection flag

As mentioned above, it is possible to perform Lead root detection by setting the option.

[ How to set the detection position when the Root detection mode is used ]

In the Root Detection mode, the root position of the lead is set as the reference lead position (Find Pos). (See Figure 48.)

Figure 48

� Bit position

Lead Search (0:Tip, 1:Root)

Find Pos X E1

Find Pos X N1

Find Pos Y E1 Find Pos Y N1

Find Pos X W1

Find Pos Y W1

Find Pos Y S1

Find Pos X S1

57/178



Option 4: Corner detection filter:

2) Special 2: NS Base Search

In this mode, SOJ recognition is performed by first using the leads in the N/S direction, then based on the data, the recognition of W/E direction is performed.

Option 1: Lead detection flag (same as Special 1)


3) Special 3: WE Base Search

In this mode, SOJ recognition is performed by first using the leads in the W/E direction, then based on the data, the recognition of N/S direction is performed.

Option 1: Lead detection flag (same as Special 1)


4) Special 4: Check Direction It compares the average brightness of the specified circular region and the other circular region located 180 degrees opposed (diagonal) from the specified circular region in order to identify the direction.

Option 1: Lead Detection Flag (same as Special 1)

Option 2: Direction of mark: (0:N, 1:S, 2:W, 3:E)

Option 3: Recognition flag (same as Special 1)

Option 4: Corner detection filter (same as Special1)

� Bit position

Excessive Lead Check (0:Non, 1:Exist) (It checks whether the extra leads exist outside of pitch 1)

� Bit position

Lead Search Filter: (0:None, 1:Once, 2: Twice) (Noise elimination filter is used when detecting the corner.)

Right Angle Fitting: 0:None, 1:Exist

(It checks the perpendicularity of the candidate adjacent sides when extracting the corner.)

58/178


Set the direction determination data to the second Lead Group of the direction set in Option 2. - Number of the leads

* “Angle correction” mode needs to be custom ordered.

- Lead pitch: Min. Brightness Difference (If the value is 0, 50 is set) If the difference of the average brightness of the detected circle is less than

the value specified here, it is determined to be an error.

- Lead width: The diameter of the detecting circle (mm)

- Reflect LL: 0

- Find Pos X: The center position X of the detecting circle

- Find Pos Y: The center position Y of the detecting circle

<< Items to be set for PLCC Special recognition>>




Comp. Threshold










Ruler Width

Algorithm Special 1-4 Selects the recognition algorithm when using a special algorithm.

Base Alignment PLCC Selects the basic component type when using a special algorithm.




Common

Data


� Bit position

Check Direction ( 0: 2 angle,1: 4 angle)

Check Type (0:Black, 1:White)

Judgment method ( 0: Error, 1: Angle correction)

59/178



Explanation

Lead Group N 1 Specifies the number for the Lead Group in the N direction.

Common



Lead Number: 1N Sets the number of leads in

the N direction.




the N direction.


direction.


in the N direction.

N

Direction

Group 1


in the N direction.

Lead Group S 1 Specifies the number for the Lead Group in the S direction.

Common



Lead Number: 1S Sets the number of leads in

the S direction.




the S direction.


direction.


in the S direction.

S Direction

Group 1

Find Pos Y: 1S (mm) Sets the reference position Y

in the S direction.

Lead Group E 1 Specifies the number for the Lead Group in the E direction.

Common



Lead Number: 1E Sets the number of lead in the

E direction.


image in the E direction.

Lead Width: 1E (mm) Sets the width of the leads in

the E direction.

Lead Pitch: 1E (mm) Sets the pitch in the E

direction.


in the E direction.

E Direction

Group 1


in the E direction.

60/178


Lead Group W 1 Specifies the number for the Lead Group in the W direction.

Common



Lead Number: 1W Sets the number of lead in the

W direction.


image in the W direction.

Lead Width: 1W (mm) Sets the width of the lead in

the W direction.

Lead Pitch: 1W (mm) Sets the pitch in the W

direction.


in the W direction.

W Direction

Group 1

Find Pos Y: 1W (mm) Sets the reference position Y

in the W direction.

Table 38



2.8. Off Lead

<<Items to be set for Off Lead recognition>>



Alignment Type Off Lead Sets the component type.












61/178





Ruler Width

Lead Number N Sets the number of leads in the N direction.

(Includes the missing part)

Lead Pitch N (mm) Sets the lead pitch in the N direction.

Lead Width N (mm) Sets the lead width in the N direction.

Reflect LL. N (mm) Sets the lead length on the image in the N

direction.

Off Lead Start N Sets the start position of lead gaps in the N

direction.

Off Lead End N Sets the end position of lead gaps in the N

direction.

Lead Number S Sets the number of leads in the S direction.


Lead Pitch S (mm) Sets the lead pitch in the S direction.

Lead Width S (mm) Sets the lead width in the S direction.

Reflect LL. S (mm) Sets the lead length on the image in the S

direction.

Off Lead Start S Sets the start position of lead gaps in the S

direction.

Off Lead End S Sets the end position of lead gaps in the S

direction.

Lead Number E Sets the number of leads in the E direction.


Lead Pitch E (mm) Sets the lead pitch in the E direction.

Lead Width E (mm) Sets the lead width in the E direction.

Reflect LL. E (mm) Sets the lead length on the image in the E

direction.

Off Lead Start E Sets the start position of lead gaps in the E

direction.

Off Lead End E Sets the end position of lead gaps in the E

direction.

Lead Number W Sets the number of leads in the W direction.


Lead Pitch W (mm) Sets the lead pitch in the W direction.

Lead Width W (mm) Sets the lead width in the W direction.

Reflect LL. W (mm) Sets the lead length on the image in the W

direction.

Off Lead Start W Sets the start position of lead gaps in the W

direction.

Off Lead End W Sets the end position of lead gaps in the W

direction.

Table 39

62/178


Figure 49

As shown in Figure 49, this recognition mode is used when there is a gap in the row of leads. It is possible to define the components that have leads not only in two directions, but also in one direction, three direction and four directions. The numbers of the leads that start and end the gap are specified as the gap start/end parameters.

In the example of Figure 49, the values would be as follows:

Lead Number: 9 Off Lead start: 5 Off Lead end: 5 When performing recognition of the components that have leads in two directions (E-W), the recognition method is the same as that of SOJs. The others are the same as connector component recognition.



Body Size No



Reflect LL No

Find Pos No

Table 40

Note: “Lead width” check may not be available for some old software versions.

Lead length

Lead width

Lead Pitch

Body Size Y

Body Size Y

63/178


The following is the actual example of the recognition.

<<Items to be set for Off Lead recognition >>


Alignment Group IC

Alignment Type Off Lead

Comp. Threshold 50

Comp. Tolerance 30








Ruler Offset N 0

Ruler Offset S 0

Ruler Offset E 5

Ruler Offset W 5

Ruler Width 3

Lead Number E 13

Lead Pitch E (mm) 1.27

Lead Width E (mm) 0.43

Reflect LL. E (mm) 1.0

Off Lead Start E 6

Off Lead End E 8

Lead Number W 13

Lead Pitch W (mm) 1.27

Lead Width W (mm) 0.43

Reflect LL. W (mm) 1.0

Off Lead Start W 6

Off Lead End W 8

Table 41

64/178


Figure 50

This mode is applicable not only for the components with the missing leads as above mentioned, but also the tips that have leads for heat radiation as shown below. (It ignores the leads for heat radiation.) <<Items to be set for Off Lead recognition >>


Alignment Group IC


Comp. Threshold 50

Comp. Tolerance 30








Ruler Offset N 0

Ruler Offset S 0

Ruler Offset E 3

Ruler Offset W 3

Ruler Width 3

Lead Number E 21




65/178



Off Lead Start E 8

Off Lead End E 14

Lead Number W 21




Off Lead Start W 8

Off Lead End W 14

Table 42

Figure 51

This is applicable not only for SOPs but also QFPs.

<<Items to be set for Off Lead recognition >>


Alignment Group IC


Comp. Threshold 50

Comp. Tolerance 30








Ruler Offset N 3

Ruler Offset S 3

Ruler Offset E 3

Ruler Offset W 3

Ruler Width 3

66/178



Lead Number N 10


Lead Width N (mm) 0.35

Reflect LL. N (mm) 0.5

Off Lead Start N 4

Off Lead End N 7

Lead Number S 10


Lead Width S (mm) 0.35

Reflect LL. S (mm) 0.5

Off Lead Start S 4

Off Lead End S 7

Lead Number E 10




Off Lead Start E 5

Off Lead End E 6

Lead Number W 10




Off Lead Start W 5

Off Lead End W 6

Table 43

Figure 52

67/178


2.9. Connector components

The followings are the recognition modes used for the recognition of connector components.

1) Single-direction Connector Recognition mode 2) 4-direction Connector Recognition mode 3) Odd-shape Connector Recognition mode

2.9.1. Single-direction connectors

<< Items to be set for single-direction connectors>>


Alignment Group Connector Sets the component category.

Alignment Type Con-E Sets the component type.











Ruler Width

Lead Number E Sets the number of leads.




Table 44

68/178


This mode is used for the connector components that have leads only in one direction.

Figure 53



Body Size No



Reflect LL No

Find Pos No

Table 45

Note: “Lead width” check function may not be available for some old software versions.

The following is the actual example of the setting and the recognition result.

<< Items to be set for single-direction connectors>>


Alignment Group Connector

Alignment Type Con- E

Comp. Threshold 50

Comp. Tolerance 30







Lead length

Lead width

Lead pitch Body Size Y

Body Size X

69/178




Ruler Offset E 5

Ruler Width 3

Lead Number E 14

Lead Pitch (mm) 1.0

Lead Width (mm) 0.3


Table 46

Figure 54

2.9.2. 4-direction connectors

<< Items to be set for 4-direction connectors>>



Alignment Type Con-NSEW Sets the component type.

Comp. Threshold




70/178













Ruler Width

Lead Number N Sets the number of leads in the N

direction.

Lead Pitch N (mm) Sets the lead pitch in the N direction.

Lead Width N (mm) Sets the lead width in the N direction.

Reflect LL. N (mm) Sets the lead length on the image in the

N direction.

Lead Number S Sets the number of leads in the S direction.

Lead Pitch S (mm) Sets the lead pitch in the S direction.

Lead Width S (mm) Sets the lead width in the S direction.

Reflect LL. S (mm) Sets the lead length on the image in the S direction.

Lead Number E Sets the number of leads in the E direction.

Lead Pitch E (mm) Sets the lead pitch in the E direction.

Lead Width E (mm) Sets the lead width in the E direction.

Reflect LL. E (mm) Sets the lead length on the image in the E direction.

Lead Number W Sets the number of leads in the W direction.

Lead Pitch W (mm) Sets the lead pitch in the W direction.

Lead Width W (mm) Sets the lead width in the W direction.

Reflect LL. W (mm) Sets the lead length on the image in the W direction.

Table 47

This mode can be used for recognition of not only four directions but also one direction, two directions and three directions. The data should be set for only the necessary direction(s), and data for directions that are not necessary should be set to 0.

Leads in the N/S direction must be symmetrical on the left and right sides, and leads in the W/E direction must be symmetrical on the upper and lower sides. This is because the reference lead position is determined from the center of the outer edge, based on the Lead Number and the Lead Pitch.

71/178


Figure 55



Body Size No



Reflect LL No

Find Pos No

Table 48

Note: “Lead width” check function may not be available for the old software versions.

Lead length

Lead width

Lead pitch

Body Size X

Body Size Y

72/178






Alignment Type Con-NSEW

Comp. Threshold 50

Comp. Tolerance 30








Ruler Offset N 0

Ruler Offset S 0

Ruler Offset E 5

Ruler Offset W 5

Ruler Width 3

Lead Number E 25




Lead Number W 25



Reflect LL. W (mm) 0.8 Table 49

Figure 56

73/178


The following is the actual example of the setting and the recognition result. As the tilt is not stable just by recognizing the E direction, the fixed leads are also targeted for recognition.





Comp. Threshold 50

Comp. Tolerance 30








Ruler Offset N 3

Ruler Offset S 3

Ruler Offset E 3

Ruler Offset W 0

Ruler Width 3

Lead Number N 2


Lead Width N (mm) 0.2

Reflect LL. N (mm) 0.5

Lead Number S 2


Lead Width S (mm) 0.2

Reflect LL. S (mm) 0.5

Lead Number E 6




Table 50

74/178


Figure 57

2.9.3. Special recognition of connectors

There are several algorithms available in the Connector Recognition mode.

(1) Special 1: Side Lead Fitting

This mode is effective when there are items other than leads that show up as white, which makes it difficult to detect the leads easily. This mode improves the recognition rate by checking the positional relations between the leads and extracting the combination best fits the component definition when detecting the end leads.

Option 1: Lead detection flag.

Option 2: Filter settings

� Bit position

Detection of check of distance between 2 pins at lead search end: ( 0:Yes, 1:No)

Lead search direction: ( 0: Inclined 1: Horizontal / vertical)

� Bit position

Number of times that filter is applied when lead search is conducted. (0-3) The lead search should be performed by using the filter with its maximum value in order to respond to the components whose lead is curved, and the curved surface is the ground plane to the board. ( 0: No filtering, 1: 3 x 3 maximum filter, 2: 5 x 5 maximum filter, 3: 7 x 7 maximum filter)

75/178


Option 3: Recognition flag

Option 4: Allowable length error (set as a value in units of 1/10 mm). Values to be set are those between 0 and 255 (0.1 ~ 25.5 mm).

It does not perform check when the value is 0. (When setting the value larger than 128, please input the value that 256 is

subtracted from the set value.)


<<Items to be set for Special 1 connectors>>




Comp. Threshold 50

Comp. Tolerance 30








Ruler Width 3

Algorithm Special 1

Base Alignment Special

Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Common

Data

Vision Option 4 0


Ruler Offset E 5

Lead Number: 1E 10





E Direction

Group 1


Table 51

� Bit position

Excessive Lead Check (0:Non, 1:Exist) (It checks whether the extra leads exist outside of pitch 1)

76/178


Figure 58

As described above, sometimes “Special 1” mode does not provide stable recognition. When the leads for securing the connector are located close to the targeted leads, detection error may occur as shown in Figure 59.

Figure 59

In this case, stable recognition can be performed by including leads used to secure connectors as the target in the recognition process as shown in Figure 60.

77/178


Figure 60

<<Items to be set for Special 1 connectors>>




Comp. Threshold 50

Comp. Tolerance 30








Ruler Width 3

Algorithm Special 1


Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Common

Data

Vision Option 4 0


Ruler Offset E 5

Lead Number: 1E 30



E Direction

Group 1


78/178






Ruler Offset W 5

Lead Number: 1W 2





W Direction

Group 1


Table 52

(2) Special 2: Long Connector recognition

This mode is used for positioning by using only the specified number of leads on both side of the connector.

Option 1: Detecting Numbers of side lead (Five in the example of Figure 61.) (If 0 is specified, all the leads are used.)

Figure 61

(3) Special 3: Not supported

(4) Special 4: Size check (Normal) The size of the connector is checked by the ordinary connector recognition function.

(5) Special 5: Size check (Side Fitting) The size of the connector is checked by the “Special 1” connector recognition function.


<<Items to be set for the special connector>>




Comp. Threshold

Sets the threshold value or the level difference. (See “Appendix 2. Detection level differences used to detect leads (threshold value)”)


Common Data


Only the leads in these sections are used for recognition.(In this example, recognition is performed by using only the five leads on each side.)

79/178






Cntr. Offset X (mm)

Sets the offset amount in the X direction from the center position.

Cntr. Offset Y (mm)

Sets the offset amount in the Y direction from the center position.

Cntr. Offset R (mm)

Sets the offset amount of the angle of rotation.

Ruler Offset Sets the width of the lead detection line.

Ruler Width

Algorithm Special 1-6

Selects the recognition algorithm when using a special algorithm.

Base Alignment Special Selects the basic component type when using a special algorithm.





Items to be set

Set value

Explanation

Lead Group N Sets the number of the Lead

Group (0-2) in the N direction. Common



Lead Number: 1N Sets the number of leads of

Group 1 in the N direction.


image of Group 1 in the N direction.

Lead Width: 1N (mm) Sets the width of the leads of


Lead Pitch: 1N (mm) Sets the lead pitch of Group 1

in the N direction.


for the lead of Group 1 in the N direction.

Group 1



Lead Number: 2N Sets the number of leads of



image of Group 2 in the N direction.

Lead Width: 2N (mm) Sets the width of the leads of


Lead Pitch: 2N (mm) Sets the lead pitch of Group 2

in the N direction.

N

Direction

Group 2



80/178


Items to be set

Set value

Explanation



Lead Group S Sets the number of the Lead

Group (0-2) in the S direction. Common



Lead Number: 1S Sets the number of leads of

Group 1 in the S direction.


image of Group 1 in the S direction.

Lead Width: 1S (mm) Sets the width of the leads of


Lead Pitch: 1S (mm) Sets the lead pitch of Group 1

in the S direction.


for the lead of Group 1 in the S direction.

Group 1

Find Pos Y: 1S(mm) Sets the reference position Y


Lead Number: 2S Sets the number of leads of


Reflect LL.: 2S(mm) Sets the lead length on the

image of Group 2 in the S direction.

Lead Width: 2Smm) Sets the width of the leads of


Lead Pitch: 2S (mm) Sets the lead pitch of Group 2

in the S direction.



S direction

Group 2

Find Pos Y: 2S(mm) Sets the reference position Y


Lead Group E Sets the number of the Lead

Group (0-2) in the E direction. Common



Lead Number: 1E Sets the number of leads of

Group 1 in the E direction.


image of Group 1 in the E direction.

Lead Width: 1E (mm) Sets the width of the leads of


Lead Pitch: 1E (mm) Sets the lead pitch of Group 1

in the E direction.

E direction

Group 1


for the lead of Group 1 in the E direction.

81/178


Items to be set

Set value

Explanation

Find Pos Y: 1E(mm) Sets the reference position Y


Lead Number: 2E Sets the number of leads of


Reflect LL.: 2E(mm) Sets the lead length on the

image of Group 2 in the E direction.

Lead Width: 2Emm) Sets the width of the leads of


Lead Pitch: 2E(mm) Sets the lead pitch of Group 2

in the E direction.



Group 2

Find Pos Y: 2E(mm) Sets the reference position Y


Lead Group W Sets the number of the Lead

Group (0-2) in the E direction. Common



Lead Number: 1W Sets the number of leads of

Group 1 in the W direction.


image of Group 1 in the W direction.

Lead Width: 1W (mm) Sets the width of the leads of


Lead Pitch: 1W (mm) Sets the lead pitch of Group 1

in the W direction.


for the lead of Group 1 in the W direction.

Group 1

Find Pos Y: 1W(mm) Sets the reference position Y


Lead Number: 2W Sets the number of leads of


Reflect LL.: 2W(mm) Sets the lead length on the

image of Group 2 in the W direction.

Lead Width: 2Wmm) Sets the width of the leads of


Lead Pitch: 2W(mm) Sets the lead pitch of Group 2

in the W direction.

Find Pos X: 2W(mm) Sets the reference position X


W direction

Group 2

Find Pos Y: 2Wmm) Sets the reference position Y


Table 53

82/178


<< Recognition of connectors in a zigzag layout that are symmetrical on the upper and lower sides>>


Alignment Group Connector component

Alignment Type Connector NSEW

Comp. Threshold 50

Comp. Tolerance 30








Ruler Offset N 0

Ruler Offset S 0

Ruler Offset E 3

Ruler Offset W 3

Ruler Width 3

Lead Number E 13



Reflect LL. E(mm) 0.7

Lead Number W 14




Table 54

Figure 62

83/178


Recognition of connectors in a zigzag layout that are asymmetrical on the upper and lower side << Items to be set for Special 1 connectors >>




Comp. Threshold 50

Comp. Tolerance 30








Ruler Width 3

Algorithm Special 1


Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Common Data

Vision Option 4 0

Items to be set Set Value


Ruler Offset E 3

Lead Number: 1E 8





E Direction

Group 1



Ruler Offset W 3

Lead Number: 1W 8





W Direction

Group 1


Table 55

These are recognized as Special 1 connectors. They are defined by offsetting the Find Pos Y in the E and W directions by half of the pitch.

84/178


Figure 63




Comp. Threshold 50

Comp. Tolerance 30








Ruler Width 3

Algorithm Special 1


Vision Option 0

Vision Option 2 0

Vision Option 3 0

Common Data

Vision Option 4 0



Ruler Offset E 3

Lead Number: 1E 25





E Direction

Group 1



Ruler Offset W 3

Lead Number: 1W 25

W Direction

Group 1


85/178







Table 56

Recognition of connectors with fixed leads in a zigzag layout. Fixed leads are ignored when definitions are made.

Figure 64

When performing recognition on the connectors that have leads both on outside and inside of the component, only the leads on outside of the component are used for recognition.




Comp. Threshold 50

Comp. Tolerance 30








Ruler Offset N 0

Ruler Offset S 0

Ruler Offset E 5

Ruler Offset W 5

Ruler Width 3

Lead Number E 60

86/178






Lead Number W 60




Table 57

Figure 65

The following is the actual example of the setting and recognition results of the components on which some of the leads on the right and left sides are missing.

<<Items to be set for Special 1 connector>>




Comp. Threshold 50

Comp. Tolerance 30








Ruler Width 3

Common Data

Algorithm Special 1

87/178




Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Vision Option 4 0


Ruler Offset N 3

Lead Number: 1N 1





N direction

Group 1



Ruler Offset S 3

Lead Number: 1S 1


Lead Width: 1S (mm) 0.9


Find Pos X: 1S (mm) 0.0

S direction

Group 1

Find Pos Y: 1S(mm) -6.8


Ruler Offset E 3

Lead Number: 1E 2





Group 1

Find Pos Y: 1E(mm) 3.0

Lead Number: 2E 1

Reflect LL.: 2E(mm) 0.8

Lead Width: 2Emm) 0.6

Lead Pitch: 2E(mm) 0.0


E direction

Group 2

Find Pos Y: 2E(mm) -3.0


Ruler Offset W 3

Lead Number: 1W 2





Group 1

Find Pos Y: 1W(mm) 3.0

Lead Number: 2W 8

Reflect LL.: 2W(mm) 0.5

Lead Width: 2Wmm) 0.2

Lead Pitch: 2W(mm) 2.0

Find Pos X: 2W(mm) -4.0

W direction

Group 2

Find Pos Y: 2Wmm) -3.0

Table 58

88/178


Figure 66

2.9.4. Odd-shape connectors



Alignment Type Odd. Con Sets the component type.

Comp. Threshold











Ruler Width

Lead Number E Sets the number of leads. (The gaps are included.)




Off Lead Start E Sets the start position of the leads gap.

Off Lead End E Sets the end position of the leads gap. Table 59

89/178


This mode is used for recognition of connectors that have leads only in one direction, and there are some missing leads as shown in Figure 67. The number of the start and end of the missing leads are specified for Off Lead start /Off Lead end parameters. In case of Figure 67, the values would be as follows:

Number of the leads: 9 Off Lead start: 4 Off Lead end: 6

Figure 67

If a connector has missing leads in two or more directions, it is recognized with the Off Lead mode used for IC components.



Body Size No



Reflect LL No

Find Pos No

Table 60

Note: “Lead width” check function may not be available for some old software versions.

2.10. Ball components

There are several modes that can be used for recognition of the ball components.

1) Simple BGA Recognition mode

2) BGA Recognition mode

3) Flip-chip Recognition mode

Lead length

Lead width

Lead pitch

Body Size Y

Body Size X

90/178


2.10.1. Simple BGA Recognition mode

<<Items to be set for Simple BGAs>>


Alignment Group Ball Sets the component category.

Alignment Type Simple BGA Sets the component type.

Comp. Tolerance Specifies the tolerance of the ball pitch as a percentage.





Ball number N Sets the number of BGA ball rows in the horizontal direction.

Ball number E Sets the number of BGA ball rows in the vertical direction.

BGA diameter (mm) Sets the diameter of the solder balls.

BGA Pitch (mm) Sets the pitch of the solder balls.

Ball Amount Sets the total number of the solder balls. Table 61

This mode is used for recognition of BGAs and CSPs whose solder balls with the same diameter are placed at the same pitch in a regular pattern over the entire grid. If there are places on the grid where there are no balls, or the pitches are different in the horizontal and vertical directions, the after-mentioned BGA mode is used.

Figure 68



Body Size No

Ball pitch Yes

Table 62

Body Size Y

Body Size X

Ball diameter Ball pitch

91/178



<<Items to be set for Simple BGAs>>


Alignment Group Ball

Alignment Type Simple BGA

Comp. Tolerance 30





Ball number N 6

Ball number E 8

BGA diameter (mm) 0.4

BGA Pitch (mm) 0.8

Ball Amount 48 Table 63

Figure 69

92/178


2.10.2 BGA Recognition mode

<< Items to be set for BGAs>>



Alignment Type BGA Sets the component type.






Ball number N Sets the number of BGA ball rows in the horizontal direction.

Ball number E Sets the number of BGA ball rows in the vertical direction.

BGA diameter (mm) Sets the diameter of the solder balls.

BGA Pitch N (mm) Sets the pitch of the solder balls.

BGA Pitch E (mm) Sets the pitch of the solder balls.

Ball Amount Sets the total number of the solder balls.

Binary Level

Sets the parameter for correcting the binarization level. When performing recognition of the components that have the white area other than the balls to be detected, set the ratio of the white portion as a percentage of the overall ball area in order to correct the binarization level. Table 64

This mode is used when there are places without solder balls on the grid, or the pitches are different in the horizontal and vertical directions. It is also applicable for BGAs and CSPs in a zigzag pattern. In this mode, recognition is performed by using the information that specifies whether there are balls on the grid or not.

Figure 70

Ball diameter Ball pitch N

Ball pitch E Body Size Y

Body Size X

93/178




Body Size No

Ball pitch Yes Table 65

The following is the actual example of the setting and the recognition result. Recognition is preformed by using the ball recognition file like shown in Figure 71.

<< Items to be ser for BGA>>


Alignment Group Ball

Alignment Type BGA

Comp. Tolerance 30





Ball number N 29

Ball number E 29

BGA diameter (mm) 0.3

BGA Pitch N (mm) 0.5

BGA Pitch E (mm) 0.5

Ball Amount 216

Binary Level 0 Table 66

<< Ball definition file setting state>>

Figure 71 Figure 72

94/178


2.10.3. Special recognition of BGAs

There are some special recognition algorithms are available in the BGA/CSP recognition mode.

<<Items to be set for Special BGAs>>


Explanation



Comp. Threshold









Ruler Width

Algorithm Special 1-10

Selects the recognition algorithm when using a special algorithm.

Base Alignment BGA Selects the basic component type when using a special algorithm.




Common Data



Explanation

Lead Group N 1 Activates the setting of Lead Group 1N (1). Common

Ruler Offset N

Lead Number: 1N Sets the number of rows in

the horizontal direction.

Reflect LL.: 1N (mm) Sets the total number of

balls.

Lead Width: 1N (mm) Sets the diameter of the

balls.

Lead Pitch: 1N (mm) Sets the ball pitch in the

horizontal direction.


of the ball in the horizontal direction.

N Direction

Group 1


of the ball in the horizontal direction.

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Explanation

Lead Group E 1 Activates the setting of Lead Group 1E (1). Common

Ruler Offset E

Lead Number: 1E Sets the number of rows in

the vertical direction.


Lead Width: 1E (mm) Sets the diameter of the

balls.

Lead Pitch: 1E (mm) Sets the ball pitch in the

vertical direction.


of the ball in the vertical direction.

E Direction

Group 1


of the ball in the vertical direction.

Table 67


(1) Special 1: Polarity judgment function

This function is used in the Simple BGA Recognition mode to judge polarity based on whether the specified ball exists or not.

Option 1: Column number of the ball for polarity judgment in the horizontal direction.

Option 2: Row number of the ball for polarity judgment in the vertical direction.

Option 3: Polarity Ball: (0:None, 1:Exist)

(2) Special 2: The Standard BGA Recognition mode runs in this mode.

Option 1: Lower 8 bits of the index number for the ball position information

Option 4: Upper 8 bits of the index number for the ball position information

Option 2: Binarization correction parameter


(3) Special 3: Simple recognition of ceramic BGAs This is used for recognition of the BGAs whose base is made of white ceramic. The ball position definition information is not used.

Option 2: Ball Exist Threshold Level The following is the actual example of the recognition.

� Bit position

Excessive Ball check: (0: None, 1:Exist)

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<< Items to be set for Special BGA>>




Comp. Threshold 0

Comp. Tolerance 30








Ruler Width 3

Algorithm Special 3

Base Alignment BGA

Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Common Data

Vision Option 4 0



Ruler Offset N 0

Lead Number: 1N 40




Find Pos X: 1N (mm) -24.77

N Direction

Group 1



Ruler Offset E 0

Lead Number: 1E 10

Reflect LL.: 1E (mm) 0




E Direction

Group 1


Table 68

Set the total number of balls.

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Figure 73

(4) Special 4: Recognition of ceramic BGAs (Using the ball position information)

This is used for recognition of the BGAs whose base is made of white ceramic. The ball position definition information is used.



Option 2: Threshold value for judging whether the balls exist or not

The following is the actual example of recognition.

<< Items to be set for Special BGA>>




Comp. Threshold 0

Comp. Tolerance 30








Ruler Width 3

Algorithm Special 4

Base Alignment BGA

Vision Option xx

Vision Option 2 0

Vision Option 3 0

Common Data

Vision Option 4 xx

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Ruler Offset N 0

Lead Number: 1N 25





N

Direction Group 1



Ruler Offset E 0

Lead Number: 1E 25

Reflect LL.: 1E (mm) 0




E Direction

Group 1

Find Pos Y: 1E (mm) -15.24

Table 69

Figure 74

5. Special 5: Not supported

6. Special 6: Not supported

7. Special 7: CGA recognition




Set the total number of balls.

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Option 3: Recognition flag (Same as Special 2)

8. Special 8: Standard BGA recognition by using the multi-stage threshold value






(10) Special 10: BGA recognition with direction judgment by using marks. (* This needs to be custom-ordered.)




Option 3: Recognition Flag (Same as Special 2)

Number of Lead Group S: 1

Number of the leads S1: Check Direction Flag

Lead width S1: Direction Mark Diameter

Reflect LL. S1: Min. Brightness Difference

Find Pos. X S1: Direction Mark Center X Find Pos. Y S1: Direction Mark Center Y


� Bit position

Sets up the 8 steps of the Threshold steps.(If 0,16,1:8,2:16,3:24..7:56)

Sets up the detection stage as +-n (If 0, +-1, 1:+-1,2:+-2,3:+-3,…)

Excessive ball check (0:None, 1:Exist)

� Bit position

Check Type: (0: Black, 1: White)

Check Direction: (0: 2 direction, 1: 4 direction)

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2.10.4 Flip-chip recognition

<<Items to be set for Flip-ships>>



Alignment Type Flip Chip Sets the component type.

Comp. Threshold Sets the binarization level. (If 0, the binarization level is set automatically.)

Comp. Tolerance Specifies the tolerance as a percentage.





Bump Number N Sets the number of BGA ball rows in the N direction.

Diameter N (mm) Sets the diameter of the solder balls in the N direction.

StartPos X N (mm) Sets the bump center position X of the starting position in the N direction.

StartPos Y N (mm) Sets the bump center position Y of the starting position in the N direction.

End Pos X N (mm) Sets the bump center position X of the ending position in the N direction.

End Pos Y N (mm) Sets the bump center position Y of the ending position in the N direction.

Bump Number S Sets the number of BGA ball rows in the S direction.

Diameter S (mm) Sets the diameter of the solder balls in the S direction.

StartPos X S (mm) Sets the bump center position X of the starting position in the S direction.

StartPos Y S (mm) Sets the bump center position Y of the starting position in the S direction.

End Pos X S (mm) Sets the bump center position X of the ending position in the S direction.

End Pos Y S (mm) Sets the bump center position Y of the ending position in the S direction.

Bump Number E Sets the number of BGA ball rows in the E direction.

Diameter E (mm) Sets the diameter of the solder balls in the E direction.

StartPos X E (mm) Sets the bump center position X of the starting position in the E direction.

StartPos Y E (mm) Sets the bump center position Y of the starting position in the E direction.

End Pos X E (mm) Sets the bump center position X of the ending position in the E direction.

End Pos Y E (mm) Sets the bump center position Y of the ending position in the E direction.

Bump Number W Sets the number of BGA ball rows in the W direction.

Diameter W (mm) Sets the diameter of the solder balls in the W direction.

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StartPos X W (mm) Sets the bump center position X of the starting position in the W direction.

StartPos Y W (mm) Sets the bump center position Y of the starting position in the W direction.

End Pos X W (mm) Sets the bump center position X of the ending position in the W direction.

End Pos Y W (mm) Sets the bump center position Y of the ending position in the W direction.

Table 70

This is the recognition mode used for flip-chips such as shown in Figure 75. Only the balls on the outer periphery are recognized. The centers of the balls on each side where recognition is to start and end are specified. It is possible to specify the same ball for both the horizontal and vertical directions.(In Figure 75, the starting points in the N and W directions share the same point, and the ending points in the N direction and the ending point in the E direction share the same point.)

Figure 75



Body Size No

Ball pitch No

Number of balls Yes

Table 71

Diameter N

Diameter W Diameter E

Diameter S

Pitch N

Pitch E

Pitch S

Pitch W Body Size Y

Body Size X

Start Pos N/W

Start Pos S

End Pos N Start Pos E

End Pos E

End Pos S End Pos W

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2.10.5. Flip-chip recognition: Special 1

<< Items to be set for Flip-chip Special 1>>













Ruler Width 0


Base Alignment Flip Chip Selects the basic component type when using a special algorithm.

Vision Option 1 Note *2 Sets option parameter 1.

Vision Option 2 0

Vision Option 3 0

Common Data

Vision Option 4 Note *1

Specifies the noise cut for inside and outside of the component, the order of execution and the object type.

Items to be set

Set value

Explanation

Lead Group N Sets the number of the Lead Group (1 or 2). Common

Ruler Offset N 0

Lead Number: 1N Sets the number of balls of Group 1 in the N direction.


Lead Width: 1N (mm) Note*4 Sets the diameter of the balls of Group 1 in the N direction.

Lead Pitch: 1N (mm) Sets the ball pitch of Group 1 in the N direction.

Find Pos X: 1N (mm) Note*5

Sets the reference position X for the ball of Group 1 in the N direction.

Group 1

Find Pos Y: 1N (mm) Note*5

Sets the reference position Y for the ball of Group 1 in the N direction.

Lead Number: 2N Sets the number of balls of Group 2 in the N direction.

N direction

Group 2 Reflect LL.: 2N (mm) 0.0

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Items to be set

Set value

Explanation

Lead Width: 2N (mm) Note *4 Sets the diameter of the balls of Group 2 in the N direction.

Lead Pitch: 2N (mm) Sets the ball pitch of Group 2 in the N direction.

Find Pos X: 2N (mm) Note *5

Sets the reference position X for the ball of Group 2 in the N direction.

Find Pos Y: 2N (mm) Note *5

Sets the reference position Y for the ball of Group 2 in the N direction.

Lead Group S Sets the number of the Lead Group (0-2) in the S direction. Common

Ruler Offset S 0

Lead Number: 1S Sets the number of balls of Group 1 in the S direction.


Lead Width: 1S (mm) Note *4 Sets the diameter of the balls of Group 1 in the S direction.

Lead Pitch: 1S (mm) Sets the ball pitch of Group 1 in the S direction.

Find Pos X: 1S (mm) Note *5

Sets the reference position X for the ball of Group 1 in the S direction.

Group 1

Find Pos Y: 1S(mm) Note *5

Sets the reference position Y for the ball of Group 1 in the S direction.

Lead Number: 2S Sets the number of balls of Group 2 in the S direction.

Reflect LL.: 2S(mm) 0.0

Lead Width: 2Smm) Note *4 Sets the diameter of the balls of Group 2 in the S direction.

Lead Pitch: 2S (mm) Sets the ball pitch of Group 2 in the S direction.

Find Pos X: 2S (mm) Note *5

Sets the reference position X for the ball of Group 2 in the S direction.

S direction

Group 2

Find Pos Y: 2S(mm) Note *5

Sets the reference position Y for the ball of Group 2 in the S direction.

Lead Group E Sets the number of the Lead Group (0-2) in the E direction. Common

Ruler Offset E 0

Lead Number: 1E Sets the number of balls of Group 1 in the E direction.


Lead Width: 1E (mm) Note *4 Sets the diameter of the balls of Group 1 in the E direction.

Lead Pitch: 1E (mm) Sets the ball pitch of Group 1 in the E direction.

E direction

Group 1

Find Pos X: 1E (mm) Note *5

Sets the reference position X for the ball of Group 1 in the E direction.

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Items to be set

Set value

Explanation

Find Pos Y: 1E(mm) Note *5

Sets the reference position Y for the ball of Group 1 in the E direction.

Lead Number: 2E Sets the number of balls of Group 2 in the E direction.


Lead Width: 2Emm) Note *4 Sets the diameter of the balls of Group 2 in the E direction.

Lead Pitch: 2E(mm) Sets the ball pitch of Group 2 in the E direction.

Find Pos X: 2E (mm) Note *5

Sets the reference position X for the ball of Group 2 in the E direction.

Group 2

Find Pos Y: 2E(mm) Note *5

Sets the reference position Y for the ball of Group 2 in the E direction.

Lead Group W Sets the number of the Lead Group (0-2) in the E direction. Common

Ruler Offset W 0

Lead Number: 1W Sets the number of balls of Group 1 in the W direction.


Lead Width: 1W (mm) Note *4 Sets the diameter of the balls of Group 1 in the W direction.

Lead Pitch: 1W (mm) Sets the ball pitch of Group 1 in the W direction.

Find Pos X: 1W (mm) Note *5

Sets the reference position X for the ball of Group 1 in the W direction.

Group 1

Find Pos Y: 1W(mm) Note *5

Sets the reference position Y for the ball of Group 1 in the W direction.

Lead Number: 2W Sets the number of balls of Group 2 in the W direction.


Lead Width: 2Wmm) Note *4

Sets the width of the diameter of the balls of Group 2 in the W direction.

Lead Pitch: 2W(mm) Sets the ball pitch of Group 2 in the W direction.

Find Pos X: 2W(mm) Note *5

Sets the reference position X for the ball of Group 2 in the W direction.

W direction

Group 2

Find Pos Y: 2Wmm) Note *5

Sets the reference position Y for the ball of Group 2 in the W direction.

Table 72

Note *1: . This option parameter consists of one byte of data, and each bit has different meaning (Please refer to “2.12.3-3. Mark 2, Note *3” for the details.)

Note *2: This option parameter consists of one byte of data, and each bit has different meaning.

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Trace retry 0: No 1: Yes

Note *4: The ball diameter is set for the LeadWidth.

Note *5: The center of gravity position of the leads targeted for detection is set as the offset position from the component center.

Figure 76

The following is the actual example.




Comp. Threshold 0

Comp. Tolerance 30







Common Data


� Bit position

Pitch check :(0: Not run 1: Run)

)) Binarization method when threshold value is 0: (0: Automatic binarization, 1: P-tile binarization)

Lead position check: ( 0: Not run, 1: Run) *See ”Appendix 4. Lead position check” (Checks to see whether the lead is within the range by using the pitch x tolerance. If a check is performed, the pitch must be entered even if the Lead Number is 1.)

Method for setting parameter for distance between leads /corners (0: New, 1: Previous)

Lead Pitch N1

Find Pos Y N1

Find Pos Y S1

Find Pos X S1

Find Pos Y E1

Find Pos X E1

Find Pos X N1

Find Pos Y W1

Find Pos X W1

Lead Pitch E1

Lead Pitch W1

Lead Pitch S1

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Ruler Width 1

Algorithm Special 1

Base Alignment Flip chip

Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Vision Option 4 0



Ruler Offset N 0

Lead Number: 1N 10





N direction

Group 1



Ruler Offset S 0

Lead Number: 1S 10





S direction

Group

1



Ruler Offset E 0

Lead Number: 1E 10





E direction

Group 1



Ruler Offset W 0

Lead Number: 1W 3





Group

1


Lead Number: 2W 1


Lead Width: 2Wmm) 0.7

Lead Pitch: 2W(mm) 0.0

Find Pos X: 2W(mm) -4.5

W direction

Group

2

Find Pos Y: 2Wmm) -4.5

Table 73

Figure 77 is the shape defined by the component definition. It is defined to recognize only the pads that are arranged in a regular pattern. Also, the pads on each corner are doubly defined by each side. Figure 78 is the recognition

107/178


result obtained by the data.

Figure 77

Figure 78

2.10.6 Flip-chip recognition : Special 2 and 3

These recognition modes are used for chips that have the balls placed in a random pattern. A file containing definitions for each ball position is use for recognition. With Special 2, the contour tracing based on binarization is used for recognition. With Special 3, recognition is performed by matching the individual balls.

<< Flip-chip Special 2 &3 >>


Alignment Group Special Sets the component category. Common Data Alignment Type Special Sets the component type.

108/178












Ruler Width 0

Algorithm Special 2/3 Selects the recognition algorithm when using a special algorithm.

Base Alignment Flip chip Selects the basic component type when using a special algorithm.

Vision Option 1 0 An index of the ball position definition file.

Vision Option 2 0 Ball matching level (%) (This is effective only for Special 3 algorithm.)

Vision Option 3 0

Vision Option 4 *Note 1

Specifies the noise cut for inside and outside of the component, the order of execution and the object type. (This is effective only for Special 2 algorithm.)

Table 74

Note *1: . This option parameter consists of one byte of data, and each bit has different meaning (Please refer to “2.12.3-3. Mark 2, Note *3” for the details.)

As shown in Figure 79, the definitions for the individual ball positions are stored in a ball position definition file (text file) (Lines beginning with // are comments.)

109/178


Figure 79

The following is the definition coordinate.

Figure 80

Pos 0 ~ 7 are the balls referred to as reference balls, and are used for rough position

110/178


detection. Consequently, they should be defined as close to the outer edge as possible within the various quadrants. (The user do not need to concern about making these positions precisely.) It is possible to perform recognition by using Pos1 ~ 4, or Pos5 ~ 8.

<< Commands for bump position definition >>

Command Items to be set

#SIZE Sets the size of the component.

#DIAMETER Sets the default ball diameter.

#POS Sets the ball position.

#POS 0 – #POS 7 Sets the reference ball position. Table 75


<<Flip chip Special 2 and 3>>

Figure 81




Comp. Threshold 0

Comp. Tolerance 30

Search Area (mm) 0.5 Body Size X (mm) 3.5 Body Size Y (mm) 3.5 Body Size Z (mm) 0.5 Cntr. Offset X (mm) 0.0 Cntr. Offset Y (mm) 0.0 Cntr. Offset R (mm) 0.0 Ruler Width 0

Algorithm Special 2

Base Alignment Flip chip

Vision Option 1 126

Vision Option 2 0

Vision Option 3 0

Common Data

Vision Option 4 0

File specified by this number.

111/178


Figure 82 shows the definition shape.

Figure 82

Figure 83 shows the recognition result obtained by the data.

Figure 83

2.11 Chip components

There are a number of modes for chip recognition.

1) Standard Chip Recognition mode 2) MELF Chip Recognition mode 3) Bare Chip Recognition mode 4) Cylindrical Chip Recognition mode 5) Special Chip Recognition mode 6) Small Chip Recognition mode

112/178


2.11.1. Standard chips

<<Items to be set for standard chips>>


Alignment Group Chip Sets the component category.

Alignment Type Std. Chip Sets the component type.

Comp. Threshold

Sets the detection level difference for lead detection. Note1. (See “Appendix 2. Detection level differences used to detect leads (threshold value)”.)







Table 76

Note1: If the Comp Threshold is set to 0, a threshold value is set automatically. At the same time, a check (“Symmetry”) is performed to see if the brightness at the center of the component has changed.

In “Symmetry” check, the brightness is checked on the 2 straight lines that pass through the center point of the chip as shown in Figure 84. On the horizontal line, it checks if the brightness change is small. On the vertical line, it checks if the brightness change at the upper and lower ends of the chip are symmetrical.

Figure 84

The detection lines are drawn in “#” shape. If the lines need to be drawn in “‡” shape, MELF

chip should be selected.

Figure 85

Body Size Y

Body Size X

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Body Size May exist Only Body Size Y is checked

Lead pitch No

Lead width Yes

Lead position

No

Find Pos Yes Checks whether the center of the detected lead tip is in the range of Body Size Y x tolerance.

Nozzle check *Note 1

Yes “Lead Brightness” check. *Note 2 “Symmetry” check (Only when the threshold is set to 0.) *Note 3

Table 77

Note 1: “Nozzle check” is the function for detecting the components that have not been picked up. When there is a component that has not been picked up and if the nozzle is contaminated with solder, please make sure that the solder adhered to the nozzle is not falsely recognized as a component.

Note 2: The “Lead Brightness” function checks if the brightness of the electrode section of the chip is smaller than the specified value. If it is smaller, it is detected to be an error.

Note 3: “Symmetry check” (Described above).


<<Recognition result of R1005>> <<Recognition result of C1005>>

Figure 86

As can be seen from the figures, in the recognition of the resistor (R1005), the component size is approximately equivalent to the size of actual component. However in the recognition of the capacitor (C1005), the size of the detected component is slightly smaller than the actual size. This is because the ends of the capacitor are rounded, which makes the component look smaller on the image. In cases like this, the user should specify the size on the image. (Please refer to “1.4.Precautions concerning the component data definitions”.)

114/178


2.11.2 MELF chips

<<Items to be set for MELF chips>>



Alignment Type MELF chip Sets the component type.

Comp. Threshold









Table 78

The detection line is drawn in “‡” shape.

Figure 87




Lead pitch No

Lead width Yes

Lead length No

Lead position Yes Checks whether the center of the detected lead tip is in the range of Body Size Y x tolerance.

Table 79

115/178



<Color resistor> <Diode>

Figure 88

2.11.3 Bare chip

<<Items to be set for Bare chips>>



Alignment Type Bare chip Sets the component type.

Comp. Threshold








Table 80

Figure 89

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Body Size May exist Only Body Size Y is checked.

Lead pitch No

Lead width Yes

Lead length No


Table 81


Figure 90

2.11.4. Cylindrical chip

<<Items to be set for Cylindrical chips>>



Alignment Type Cylinder Sets the component type.

Comp. Threshold Sets the binarization level.



Body Diameter Sets the size of the outer edge.


Ruler Offset

Table 82

This mode is used for the recognition of the cylindrical components. No component angle is required.

117/178




Body Size Yes

Lead pitch No

Lead width No

Lead length No

Lead position No Table 83


Figure 91

2.11.5. Special chips

<<Items to be set for Special chips>>



Alignment Type Sp.Chip Sets the component type.

Comp. Threshold










Ruler Offset Sets the offset amount of the detection line.

Common Data

Lead Length Sets the lead width.

Table 84

118/178


Not only the size of the outer edge, but also the lead width can be set. This mode is used when the size of the outer edge and the lead width are different. In addition to the outer edge sizes, the amount of offset from the center position can be set. This makes it possible to offset the center of mounting position.

Figure 92




Lead pitch No

Lead width Yes

Lead length No


Table 85

2.11.6. Small Chip

<<Items to be set for Small chips>>


Alignment Group Chip Sets the component category

Alignment Type Small Chip

Sets the component type

Comp. Threshold Sets the detection level difference for lead detection

(See “Appendix 2. Detection level differences used to detect leads (threshold value)”.)

Comp. Tolerance Sets the shape tolerance as a percentage

Search Area (mm) Sets the range for detection

Body Size X (mm) Sets the outer edge size

Body Size Y (mm) Sets the outer edge size

Body Size Z (mm) Sets the outer edge size

Ruler Offset Sets the offset amount for the detection line

Reflct LL Sets the length of the electrode. (If 0.2mm is set, it is

the same setting as Standard chip.)

Align size X (mm) Sets the size X recognized on the image.

Align size Y (mm) Sets the size Y recognized on the image.

Table 86

This mode is used for the components smaller than 1005. These components look smaller on the image compare to the actual size, which affects the recognition. When recognizing these small components, the difference between the recognized size and the actual component size become large, and the effect on recognition becomes large accordingly. This mode is used to deal with the symptom.

119/178


“Align size X,Y” are used to check the component size. The size of the outer edge is set to “Body Size” and the component size on the image is set to “Align size”.

Figure 93



Body Size Yes

Lead pitch No

Lead width Yes

Lead length

Lead position No

Nozzle check Yes “Lead Brightness” check. Note *1 “Symmetry” check (Only when the threshold is set to 0.)

Table 87

Note *1: The “Lead Brightness” function checks if the brightness of the electrode section of the chip is smaller than the specified value. If it is smaller, it is detected to be an error.

2.11.6. Special recognition of chip components (standard chips, MELF chips, special chips)

There are a number of special recognition algorithms available for the Standard Chip, MELF Chip, and Special Chip Recognition modes.

(1) Special 1: Chamfer Lead

Option 1: This is used to specify the direction of the component whose leads are partly missing. (Sets the numbers as shown in Figure 94.)

Figure 94

For instance, when performing recognition on the component placed vertically like shown in Figure 95, 1 is specified.

Vertically placed Horizontally placed

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Figure 95

(2) Special 2: Check Lead Brightness


Option 2: Comp. Intensity (0-255)

Option 3: Check method

0: Lead Brightness This checks to see if the brightness of the electrode section of the chip is smaller (darker) than the specified value. If it is smaller, it is determined to be an error.

1: Lead Brightness + Symmetry (This mode is used if the chip is a standard chip and the threshold value is 0.) Please refer to “2.11.1. Standard chips” for “Symmetry”.

2: Lead Brightness + Difference In “Difference” mode, when the upper and lower (or left and right) brightness ratio exceeds a certain value (less than 0.7 or more than 1.5), it is determined to be an error.

Option 4: Trapezoid Tolerance (0-255)% Even though the lead width on one side is out of the tolerance range, if the

lead width on the other side is within the tolerance and the degree of trapezoid (the ratio between the widest and narrowest lead width) is within the trapezoidal tolerance, it is determined to be satisfactory.

(3) Special 3: Check Direction

The direction of the component is determined by the brightness of the specified circular region. (*This needs to be custom-ordered.)


Option 2: Min. Brightness Difference (If 0, 50 will be set) If the difference in the average brightness of the detection circle checked for

direction determination is smaller than the value, it is determined to be an error.

� Bit position

� Bit position

Check Type (0:Black, 1: White)

Check Direction (0:2 angle, 1: 4 angle)

Check Many Adsorption (0: None, 1: Exist)

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The detection circle used to differentiate the direction is set as the first Lead Group in the East direction if the leads are placed vertically, and in the North direction if they are placed horizontally.

- Number of Lead Group: 1 - Number of leads: 0 - Lead length: 0 - Lead width: Diameter of detection circle (mm) - Lead pitch: 0 - Lead reference position X: Detection circle center position X - Lead reference position Y: Detection circle center position Y

Based on the results obtained from the “Direction check”, add +90°, +180° or +270° to the tilt of the component and set the value to the fields of “Lead Width” and “Lead reference position X, Y”.

(4) Special 4: Nozzle check (check the center of the chip)

Option 2: Threshold used for check (0 ~ 255)

Option 3: Diameter of the detected region 1 - 255 (unit: 0.1 mm -> allowable setting range: 0.1 mm - 25.5. mm)

Option 4: NG Condition (0: Less than threshold, 1: More than threshold)

Figure 96

(5) Special 5: Retry Lead Center Search

When detecting the edge in the lead width direction, the recognition is performed several times while changing the detection line position slightly each time, and the value closest to the component data is adopted as the result.


(6) Special 6: Check Upside-Down

This checks the difference between the brightness of the outer periphery of the component and the center of the component in order to identify the top surface and bottom surface of the component.

Option 1: Min. Brightness Difference If the difference between the brightness of the outer periphery of the component

� Bit position

Angle Correction: (0:None, 1: Exist)

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and the center of the component is larger than the Min. Brightness Difference (brightness of the outer periphery – brightness of the center > Min. Brightness Difference), the result is satisfactory.

Option 2: Brightness threshold of center area If the brightness of the component center is smaller than the Brightness

threshold of center area, the result is satisfactory. (0 is not checked)


(8) Special 8: Chip Array

Option 1: (0: Convex electrode type, 1: Concave electrode type (Not supported), 2: Flat electrode type (C array))


(10) Special 10: Check Upside-Down of Diode

This checks the variation of the brightness (dispersion) of the determination area in order to identify the top surface and the bottom surface of the component. It is applicable for the components with the characters printed on the molded area of the pickup surface such as 2-terminal diodes.

Option 1: Threshold of 3-sigma

This sets the threshold of the brightness variance (3 sigma) in the determination area. The variance becomes larger as the variation of the brightness becomes larger.

Option 2: Threshold of Average

This sets the lower limit of the average threshold (Ave) of the determination area. It is available only when “Dispersion” is selected from the “NG condition” item, and is used to avoid the over-determination when judged by the variance.

Option 3: Judgment Flag (Some old versions of software may not be equipped with this function.)

Dispersion: When the brightness variance is larger than the threshold in the determination area, it is determined to be an error.

Non Dispersion: When the brightness variance is smaller than the threshold in the determination area, it is determined to be an error.

The determination area is set to the “Lead Group 1” in the W direction. (When it is required to offset to the East direction, set to E direction.)

- Number of the Lead Group W: 1 - Number of the leads W1: 0 - Lead Pitch W1: 0 - Lead Width W1: Determination area size Y - Reflct LL W1: Determination area size X - Find Pos X W1: Check Area Offset X - Find Pos Y W1: Check Area Offset Y

� Bit position

Check-Area Offset Enable:(0: Disable, 1: Enable)

NG condition: (0: Dispersion, 1: Non Dispersion)

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Figure 97

Special 11: Not supported

Special 12: Size Fitting (Bare chip )recognition

This is used for recognition of chip components. It detects the object whose size is close to the defined component size by changing the threshold. It can also be used for direction discrimination.

<Example of the setting for direction discrimination>

- Lead Group N: 2 - Number of the leads N2: Number of the brightness measurement area (circle) - Lead Pitch N2: Pitch of the measurement area - Lead Width N2: The diameter of the brightness measurement area (circle) - Find Pos X: The coordinate of start point X in the brightness measurement area - Find Pos Y: The coordinate of start point Y in the brightness measurement area

Option 1: Setting Flag

Option 2: The “Min. Brightness Difference” in the brightness measurement area

(When the value “0” is specified, the value “50” is adopted as default.)



Special 15: Check Many Adsorption

This detects whether more than one component is picked up by checking around the detected chip component. The thickness of the actual component needs to be input accurately as the distance to be checked varies depends on the component thickness.

Determination area size Y Determination area size X

Check Area Offset X Check Area Offset Y

� Bit position

Check Type: (0:Black, 1: White)

Check Direction: (0: (0°, 180°), 1: (0°, 90°, 180°, 270°)

Picked up properly

Not properly picked up

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2.11.7. Special Recognition of chip components (Cylindrical chips)

There are several special recognition algorithms available in the Cylindrical Chip Recognition mode. (1) Special 1: Average brightness check in a object

If the outer periphery is brighter than the specified value, the result is satisfactory.

Option 1: The minimum value of difference between the brightness of outer periphery and inner part

Option 2: The minimum brightness of inner part Option 3: Cut Inner Noise Option 4: Cut Outer Noise

(2) Special 2: Average brightness check in a object If the outer periphery is darker than the specified value, the result is satisfactory.

Option 1: The maximum value of difference between the brightness of outer periphery and inner part

Option 2: The maximum brightness of inner part Option 3: Cut Inner Noise Option 4: Cut Outer Noise

(3) Special 3: Center of gravity and shape constant check

This checks the shape constant.

Option 3: Cut Inner Noise Option 4: Cut Outer Noise

The shape constant of a circle is obtained by dividing the square of the circumference by the surface area, which becomes the constant of the certain value as shown below:

Peripheral length2 /Surface area = (2 π r)2 / π r 2= 4 π

This value is calculated for the detected target, and is checked to see if it is within the tolerance. (The surface area is also checked to see if it is within the tolerance.)

2.12. Special components

There are several mode available for recognition of special components.

1) Special Recognition mode 2) Odd. Chip Recognition mode 3) As Mark Recognition mode 4) Sp. Quad Recognition mode 5) Gravity mode

2.12.1. Special shapes

This recognition mode serves as the base for accommodating components with special shapes. All of the component data shown in Table 88 can be set. Basically, this works as connector recognition, but it supports various types of recognition depending on the base Alignment Type and algorithm(s) that are set. For detailed information, please refer to the individual type of special recognition.

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<< Items to be set for special shapes >>




Comp. Threshold Sets the difference of the detection level for the lead detection.









Ruler Width

Algorithm Selects the recognition algorithm when using a special algorithm.

Base Alignment Selects the basic component type when using a special algorithm.




Common Data



Explanation

Lead Group N Sets the number of the Lead Group (1 or 2).

Common

Ruler Offset N Sets the offset amount of the detection line in the N direction.

Lead Number: 1N Sets the number of leads of Group 1 in the N direction.

Reflect LL.: 1N (mm) Sets the lead length on the image of Group 1 in the N direction.

Lead Width: 1N (mm) Sets the width of the leads of Group 1 in the N direction.

Lead Pitch: 1N (mm) Sets the lead pitch of Group 1 in the N direction.

Find Pos X: 1N (mm) Sets the reference position X for the lead of Group 1 in the N direction.

Group 1

Find Pos Y: 1N (mm) Sets the reference position Y for the lead of Group 1 in the N direction.


N direction

Group 2

Reflect LL.: 2N (mm) Sets the lead length on the image of Group 2 in the N direction.

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Explanation

Lead Width: 2N (mm) Sets the width of the leads of Group 2 in the N direction.


Find Pos X: 2N (mm) Sets the reference position X for the lead of Group 2 in the N direction.

Find Pos Y: 2N (mm) Sets the reference position Y for the lead of Group 2 in the N direction.

Lead Group S Sets the number of the Lead Group (1 or 2).

Common

Ruler Offset S Sets the offset amount of the detection line in the S direction.

Lead Number: 1S Sets the number of leads of Group 1 in the S direction.

Reflect LL.: 1S (mm) Sets the lead length on the image of Group 1 in the S direction.

Lead Width: 1S (mm) Sets the width of the leads of Group 1 in the S direction.

Lead Pitch: 1S (mm) Sets the lead pitch of Group 1 in the S direction.

Find Pos X: 1S (mm) Sets the reference position X for the lead of Group 1 in the S direction.

Group 1

Find Pos Y: 1S(mm) Sets the reference position Y for the lead of Group 1 in the S direction.


Reflect LL.: 2S(mm) Sets the lead length on the image of Group 2 in the S direction.

Lead Width: 2Smm) Sets the width of the leads of Group 2 in the S direction.


Find Pos X: 2S (mm) Sets the reference position X for the lead of Group 2 in the S direction.

S direction

Group 2

Find Pos Y: 2S(mm) Sets the reference position Y for the lead of Group 2 in the S direction.

Lead Group E Sets the number of the Lead Group (1 or 2).

Common

Ruler Offset E Sets the offset amount of the detection line in the E direction.

Lead Number: 1E Sets the number of leads of Group 1 in the E direction.

E direction

Group 1

Reflect LL.: 1E (mm) Sets the lead length on the image of Group 1 in the E direction.

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Explanation

Lead Width: 1E (mm) Sets the width of the leads of Group 1 in the E direction.

Lead Pitch: 1E (mm) Sets the lead pitch of Group 1 in the E direction.

Find Pos X: 1E (mm) Sets the reference position X for the lead of Group 1 in the E direction.

Find Pos Y: 1E(mm) Sets the reference position Y for the lead of Group 1 in the E direction.


Reflect LL.: 2E(mm) Sets the lead length on the image of Group 2 in the E direction.

Lead Width: 2Emm) Sets the width of the leads of Group 2 in the E direction.


Find Pos X: 2E (mm) Sets the reference position X for the lead of Group 2 in the E direction.

Group 2

Find Pos Y: 2E(mm) Sets the reference position Y for the lead of Group 2 in the E direction.

Lead Group W Sets the number of the Lead Group (1or 2).

Common

Ruler Offset W Sets the offset amount of the detection line in the E direction.

Lead Number: 1W Sets the number of leads of Group 1 in the W direction.

Reflect LL.: 1W (mm) Sets the lead length on the image of Group 1 in the W direction.

Lead Width: 1W (mm) Sets the width of the leads of Group 1 in the W direction.

Lead Pitch: 1W (mm) Sets the lead pitch of Group 1 in the W direction.

Find Pos X: 1W (mm) Sets the reference position X for the lead of Group 1 in the W direction.

Group 1

Find Pos Y: 1W(mm) Sets the reference position Y for the lead of Group 1 in the W direction.


Reflect LL.: 2W(mm) Sets the lead length on the image of Group 2 in the W direction.

Lead Width: 2Wmm) Sets the width of the leads of Group 2 in the W direction.

W direction

Group 2

Lead Pitch: 2W(mm) Sets the lead pitch of Group 2 in the W direction.

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Explanation

Find Pos X: 2W(mm) Sets the reference position X for the lead of Group 2 in the W direction.

Find Pos Y: 2Wmm) Sets the reference position Y for the lead of Group 2 in the W direction.

Table 88

2.12.2. Odd-shape chips

<<Items to be set for odd-shape chips>>



Alignment Type Odd. Chip

Sets the component type.

Comp. Threshold

Sets the difference of the detection level for the lead detection. (See “Appendix 2. Detection level differences used to detect leads (threshold value)”.)

Comp. Tolerance Specifies the tolerance of the shape as a percentage.





Ruler Offset Sets the offset amount of the detection line.

Table 89

It is possible to recognize the lead regardless of whether it is black or white. (Recognition is performed by using both black and white leads, and whichever produces a satisfactory result is adopted.)

Figure 98



Body Size May exist Only Body Size Y is checked.

Lead pitch No

Lead width Yes

Lead length No

Lead position No Checks if the center of the lead tip position of the detected lead is in the range of Body Size Y x tolerance.

Table 90

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2.12.3. Mark types

There are a number of algorithms available for recognition of mark types. The target object is binarized, then the component is detected from the detected target object. It is possible to use the fixed threshold and the automatic threshold for binarization.

1) Special components: Mark type (mark 1)

This is used for recognition of objects that consist of a single part as shown in Figure 99.

Figure 99

2) Algorithm: Special 1 (mark line)

3) Algorithm: Special 2 (mark 2)

This is used for recognition of objects that consist of two parts as shown in Figure 100.

Figure 100

4) Algorithm: Special 3 (mark 4)

This is used for recognition of objects that consist of four parts as shown in Figure 101.

Figure 101

5) Algorithm: Special 4 (mark, general-purpose)

This is used for recognition of objects that consist of multiple parts, as shown in Figure 102.

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Figure 102

2.12.3-1. Mark 1

This is used for recognition of objects that consist of a single part as shown in Figure 103.

Figure 103

The target object is binarized, then the component is detected from the detected target object. This mode can be used for recognition of the irregular shaped components. It is possible to use the fixed threshold and the automatic threshold for binarization. The component center is determined to be the center of gravity position, and the inclination is determined to be the inclination of the axis. The correct inclination of components that are close to the circular or square shape cannot be obtained as they have no main axis. White objects are normally recognized, but it is also possible to detect black objects on a white background.

<< Items to be recognized for Mark 1 marks >>



Alignment Type Mark Sets the component type.

Comp. Threshold Sets the binarization level. (If 0 is specified, the threshold is set automatically.)






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Surface Type

Selects from reflecting component or non-reflecting component. If the component looks white, select “Reflecting component”, if not, select “Non reflecting component”.

Cut Outer Noise Select from 0 through 7.

Cut Inner Noise Select from 0 through 7.

Noise Cut Order “Inner” / “Outer”

Table 91

The functions for cutting noise both inside and outside the component are used when the noise is detected as shown in Figure 104, which eliminate the effects from the noise. Please refer to ”Appendix 1. Noise processing” for the details of the noise elimination process.

Figure 104

Figure 105

Also, if the component is divided into two parts and the boundary between the parts is not clearly seen due to the lighting level, component lot, or another factor as shown in Figure 106 (the figure on the left), the noise cut function can be used in order to perform stable recognition. In the example in Figure 106, the “Cut Inner Noise” function is used in order to perform the stable recognition by combining the two separate objects together.

“Cut Outer Noise”

“Cut Inner Noise”

Body Size Y

Body Size X

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Figure 106

In the actual example shown in Figure 107, the “Cut Outside Noise” function prevents the lead part and body part from separating each other in order to perform stable recognition.

Figure 107

2.12.3-2. Mark Line

This is used to recognize rectangles consisting of a single part, as shown in Figure 108. Components are detected from among objects that have been binarized and detected. Either fixed or automatic threshold values can be used for the binarization. The component center and inclination are determined by setting the detection line. White objects are normally recognized, but it is also possible to detect black objects on a white field.

Figure 108




Common Data


This part cannot be seen clearly.

Combined

“Cut Inner Noise” function

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Ruler Width 3 Not used.

Algorithm Special 1

Base Alignment As Mark

Vision Option 1 0

*4

Designates the detection direction 0: Auto, 1: left side/upper side only, 2: right side/lower side only, 3: both sides (With Auto detection, the direction in which the component extends beyond the search frame is not detected.)

Vision Option 2 0

Vision Option 3 0

Vision Option 4 0 *1

Specifies the priority to perform “Cut Inner Noise “/”Cut Outer Noise” function and the object type.


Explanation

Lead Group E 0 or 1

When “0” is specified, the offset of the detection line is automatically set to 1/4 of the detection size.

Common

Ruler Offset E --

Lead Number: 1E 0




Find Pos X: 1E (mm) *2

When the number of Lead Groups is 1, this sets the detection line at the position that is offset from the contour of the circumscribed rectangle by the amount of this value.

E Direction

Group 1

Find Pos Y: 1E (mm) *3

When the number of Lead Groups is 1, this sets the detection line to the position that is offset from the center line by the amount of this value.

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Explanation

Lead Group W 0 or 1

When “0” is specified, the offset of the detection line is automatically set to 1/4 of the detection size.

Common

Ruler Offset W --

Lead Number: 1W 0




Find Pos X: 1W (mm) *2

When the number of Lead Groups is 1, this sets the detection line at the position that is offset from the contour of the circumscribed rectangle by the amount of this value.

W Direction

Group 1

Find Pos Y: 1W (mm) *3

When the number of Lead Groups is 1, this sets the detection line to the position that is offset from the center line by the amount of this value.

Table 92


Note: *1. This option parameter consists of one byte of data, and each bit has different meaning.

(Please refer to P.142, Note*3 for the details.) *2. Set the Offset 1 in Figure 109. *3. Set the Offset 2 in Figure 109.

Figure 109

Note: *4. It is possible to specify execution of the position detection on the detection lines from L5

through L8 by using the value in the field of Vision Option 1. If the value is set to 0, position detection is normally performed in both the left and right (or upper and lower) directions, but if the contour extends beyond the search frame for the detection direction

Offset 1 Offset 1

Offset 2

Offset 2

Offset 2

Offset 2

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of the component, detection is not performed in that direction. In the example in Figure 110, as the search range does not encompass the right side of the component, recognition is performed only on the left side. In this case, the search range serves as the reference for the offset on the right side. Also, the center position of P7 and P8 that have been determined at this point are averaged, and the result is offset by the amount of the component size to determine the component center.

If the value is set to 1, detection is performed only on the left (upper) side, regardless of whether the contour is entirely within the search range or not. (This is the same as the example in Figure 110, except for the point that the component extends beyond the search range.)

Figure 110

Note: *4. If the value is set to 2, detection is performed only on the right (lower) side, regardless of

whether the contour is entirely within the search range or not. In this case as well, the center position of the obtained edge positions are averaged, and the result is offset by the amount of the component size to determine the component center. For instance, in the example in Figure 111, P5 and P6 positions that have been determined are averaged, and the resulting position is offset by the component size and determined to be the component center. It is also possible to perform recognition on the components vertically placed. In this case, the direction would be set to N-S, not to E-W.

Figure 111

Offset 1 Offset 1

Offset 2

Offset 2

Offset by the component size Search range

Offset 2

Offset 2

Offset by the component size

Offset 1 Offset 1

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Table 93 is the actual example of the recognition.




Comp. Threshold 0

Comp. Tolerance 30








Ruler Width 3

Algorithm Special


Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Common Data

Vision Option 4 0



Ruler Offset E 0

Lead Number: 1E 0





E Direction

Group 1



Ruler Offset W 0

Lead Number: 1W 0




Find Pos X: 1W (mm) 2.0

W Direction

Group 1


Table 93

The position of the left and right detection lines in the E/W direction are set to 4.00mm from the contour position for E direction, 2.0mm inward for the W direction. For the “Find Pos” of the left and right detection lines, the “Find Pos” in the E/W direction is set to 4.0 mm inward from the contour position in the E direction, and 2.0 mm in the W direction. The upper and lower lines are set at positions offset 1.5 mm each from the center line.

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Figure 112

2.12.3-3. Mark 2

This algorithm is used for recognition of the components whose shape consists of two parts as shown in Figure 113.

Figure 113

The target object is binarized, then the component is detected from the detected target object. It is possible to perform recognition on the irregular shaped component. For binarization, both the fixed threshold and the automatic threshold can be used. The average center-of-gravity of the two objects is determined to be the center of the component, and the inclination is determined as the inclination of the straight line which connects the center-of-gravity of the two objects. White objects are normally recognized, but it is also possible to detect black objects on a white background.



Body Size Yes

Lead pitch No

Lead width No

Lead length No

Lead position No

Table 94

<< Mark 2 : Items to be set for components that have two parts >>

(Special components: Special shape, algorithm: Special 2, base Alignment Type: Mark type)


Alignment Group Special Common Data Alignment Type Special

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Algorithm Special 2


Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Vision Option 4 0 *3



Explanation


Ruler Offset N --

Lead Number: 1N 1

Reflect LL.: 1N (mm) *1

Lead Width: 1N (mm) *1

Sets the size (surface area) of the upper side.


Find Pos X: 1N (mm) *2

N direction

Group 1

Find Pos Y: 1N (mm) *2

Sets the center of gravity position of the upper side.


Ruler Offset S --

Lead Number: 1S 1

Reflect LL.: 1S (mm) *1

Lead Width: 1S (mm) *1

Sets the size (surface area) of the lower side.


Find Pos X: 1S (mm) *2

S direction

Group 1

Find Pos Y: 1S(mm) *2

Sets the center of gravity position of the lower side.

Table 95

Note: The parameters other than those shown in Table 95 are not used.

Note *1: The size (surface area) of the object being detected is set to the “Reflect LL.” and “Lead Width.” Field. The diameter of the circle is specified by using the lead width as follows:

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If the shape is a rectangle: The lead length x the lead width. If the shape is a circle, The lead length = 0 (See Figure 114.)

Note *2: The center of gravity of the object being detected is set at a position offset from the component center. (See Figure 114. In the example, the “Find Pos X” is 0.)

Figure 114

Note *3. This option parameter consists of one byte of data, and each bit has different meaning.

If the values of Noise Cut for the outside and inside of the component are specified as n1/n2, the value obtained from the formula below is set:

If the object is white, n2 x 8 + n1 If the object is black, 64 + n2 * 8 + n1

For example, if the noise cut outside the component is executed twice and the noise cut inside the component three times, the values obtained from the following formula are set:

If the object is white, 3x8 + 2 = 26 If the object is black, 64 + 3x8 + 2 = 90

Also, if the noise cut is executed first on the outside and then on the inside of the component, the value subtract 128 from this value is set. In the above example, If the object is white, 26 – 128 = -102 If the object is black, 90 – 128 = -38

The functions for cutting noise on both inside and outside of the component are used when

Body Size Y

Find Pos Y

Find Pos Y

Lead Width

Lead Width= 0

Lead Length

Lead Width

� Bit Position

The value of “Cut Outer Noise”: (0-7): n1

The value of “Cut Outer Noise”: (0-7): n2

Surface Type: (0: White, 1: Black)

Noise cut order: (0: Inner�Outer, 1: Outer � Inner)

Find Pos X N1 = 0

Find Pos X S1 = 0

Body Size X

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the noise is detected as shown in Figure 115, which eliminate the effects from the noise. Please refer to “Appendix 1. Noise processing” for the details on the noise elimination process.

Figure 115

In the actual example shown in Figure 116, the “Cut Outer Noise” function is used to eliminate the effects caused by the projection on the lead section in order to stabilize the shape.

Figure 116

Also, if the component is divided into two parts and the boundary between the parts is not clearly seen due to the lighting level, component lot, or another factor as shown in Figure 117, the noise cut function can be used in order to perform stable recognition. The “Cut Outer Noise” function separate the two objects connected together in order to perform stable recognition.

“Cut Inner Noise”

“Cut Outer Noise”

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Figure 117

In the example of actual recognition shown in Figure 118, the lead section and the body section are separated by using the “Cut Outer Noise” function.

Figure 118

It is possible to perform recognition on horizontally placed components. In this case, the data should be set to the E-W direction not to the N-S direction.

2.12.3-4. Mark 4

This algorithm is used to recognize components whose shape consists of four parts, as shown in Figure 119.

Figure 119

This part cannot be seen clearly.

“Cut Outer Noise” function is used

Separate the two objects.

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The target object is binarized, then the component is detected from the detected target object. This mode can be used for recognition of the irregular shaped components. It is possible to use the fixed threshold and the automatic threshold for binarization. White objects are normally recognized, but it is also possible to detect black objects on a white background.



Body Size Yes

Lead pitch No

Lead width No

Lead length No

Lead position No

Table 96

<< Mark 4: Items to be set for components consists of four parts >>

(Special components: Special shape, algorithm: Special 2, base Alignment Type: Mark type)














Algorithm Special 3


Vision Option 1

Vision Option 2

Vision Option 3

Common Data

Vision Option 4 *1


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Explanation


Ruler Offset N 0

Lead Number: 1N 1

Reflect LL.: 1N (mm) *2 Sets the length of the lead on the upper left side.

Lead Width: 1N (mm) *2 Sets the width of the lead on the upper left side.


Find Pos X: 1N (mm) *3 Sets the Find Pos X of the lead on the upper left side.

Group 1

Find Pos Y: 1N (mm) *3 Sets the Find Pos Y of the lead on the upper left side.

Lead Number: 2N 1

Reflect LL.: 2N (mm) *2 Sets the length of the lead on the upper right side.

Lead Width: 2N (mm) *2 Sets the width of the lead on the upper right side.

Lead Pitch: 2N (mm)

Find Pos X: 2N (mm) *3 Sets the Find Pos X of the lead on the upper right side.

N direction

Group 2

Find Pos Y: 2N (mm) *3 Sets the Find Pos Y of the lead on the upper right side.


Ruler Offset S 0

Lead Number: 1S 1

Reflect LL.: 1S (mm) *2 Sets the length of the lead on the upper left side.

Lead Width: 1S (mm) *2 Sets the width of the lead on the upper left side.


Find Pos X: 1S (mm) *3 Sets the Find Pos X of the lead on the upper left side.

Group 1

Find Pos Y: 1S(mm) *3 Sets the Find Pos Y of the lead on the upper left side.

Lead Number: 2S 1

Reflect LL.: 2S (mm) *2 Sets the length of the lead on the upper right side.

Lead Width: 2S (mm) *2 Sets the width of the lead on the upper right side.


Find Pos X: 2S (mm) *3 Sets the Find Pos X of the lead on the upper right side.

S direction

Group 2

Find Pos Y: 2S(mm) *3 Sets the Find Pos Y of the lead on the upper right side.

Table 97

Note: The parameters other than those shown in Table 97 are not used and the value ” 0” should be set.

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Note 1 This option parameter consists of one byte of data, and each bit has different meaning. (Please refer to “2.12.3-3. Mark 2”, Note 3 for the details.)

Note *2: The size (surface area) of the object being detected is set to the “Reflect LL.” and “Lead Width.” field. The surface area of the lead is obtained from the following formula:

The lead length x the lead width.

Note *3: The inner center position in the Y direction of the detected object lead is set at the position offset from the component center.

Figure 120

The following is the actual example of the recognition and its component data. Though the shape of the lead is not rectangular, it is possible to perform recognition of the component.

Find Pos X 2S

Lead Width 1N Lead Width 2N

Lead Length 1N Lead Length 2N

Lead Width 1S Lead Width 2S

Lead Length 2S Lead Length

Find Pos Y 2S Find Pos Y 1S

Find Pos X 1NFind Pos X 2N

Find Pos Y 2N

Find Pos X 1S

Find Pos Y 1N

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Figure 121




Comp. Threshold 0

Comp. Tolerance 30








Ruler Width 1

Algorithm Special 3


Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Common Data

Vision Option 4 0



Ruler Offset N 0

Lead Number: 1N 1





Group 1


Lead Number: 2N 1


N direction

Group 2


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Ruler Offset S 0

Lead Number: 1S 1





Group 1


Lead Number: 2S 1





S direction

Group 2


Table 98

2.12.3-5. Mark – General purpose

This recognition mode is used for various components consisting of multiple parts, as shown in Figure 122.

Figure 122

The target object is binarized, then the component is detected from the detected target object. This mode can be used for recognition of the irregular shaped components. It is possible to use the fixed threshold and the automatic threshold for binarization. The tilt of the component is determined from the inclination of the straight lines which connect the centers of each side. White objects are normally recognized, but it is also possible to detect black objects on a white background.



Body Size Yes

Lead pitch No

Lead width No

Lead length No

Lead position No

Table 99

<< Mark-General purpose : Items to be set for components consists of multiple parts >>

(Special components: Special shape, Algorithm: Special 4, Base Alignment Type: Mark type)

147/178
















Base Alignment As Mark Selects the basic component type when using a special algorithm.

Vision Option 1 *2 Sets option parameter 1.

Vision Option 2 *3 Sets option parameter 2.


Common Data

Vision Option 4 *1


(continued)

Note *1: This option parameter consists of one byte of data, and each bit has different meaning. (Please refer to “2.12.3-3. Mark 2”, Note *3 for the details.)

Note *2: This option parameter consists of one byte of data, and each bit has different meaning.

� Bit position

Pitch check: (0: Not executed, 1: Executed)

Lead position check 0: Not executed 1: Executed. (This checks to see if the lead is within the range specified by the pitch x tolerance. If a check is carried out, the pitch is input, even if there is only one lead.)* Please refer to Appendix 4.

Method of setting the parameter for the distance between the lead and corner: (0: New 1: Previous)

Trace retry: (0:No, 1: Yes)

The binarization method when the threshold is 0: Automatic binarizaiton, 1: P-tile binarization

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Note*3: This option parameter consists of one byte of data, and each bit has different meaning.

<< Mark-General purpose : Items to be set for components consists of multiple parts >> (continued)


Explanation

Lead Group N Sets the number of Lead Group. (1 or 2)

Common

Ruler Offset N 0 Sets the offset amount of the detection line in the N direction.



Sets the lead length on the image of Group 1 in the N direction.

Lead Width: 1N (mm) *4 Sets the width of the leads of Group 1 in the N direction.



Sets the reference position X for the lead of Group 1 in the N direction.

Group 1


Sets the reference position Y for the lead of Group 1 in the N direction.



Sets the lead length on the image of Group 2 in the N direction.

Lead Width: 2N (mm) *4 Sets the width of the leads of Group 2 in the N direction.



Sets the reference position X for the lead of Group 2 in the N direction.

N direction

Group 2


Sets the reference position Y for the lead of Group 2 in the N direction.

Lead Group S Sets the number of the Lead Group (1 or 2).

Common

Ruler Offset S 0 Sets the offset amount of the detection line in the S direction.

S direction

Group


� Bit position

Center Detection Algorithm: 0: Center of circumscribed rectangle 1: Center of rectangle composed of component inclination lines passing through the center of gravity of each of the sides

2: Center of all leads

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Explanation


Sets the lead length on the image of Group 1 in the S direction.

Lead Width: 1S (mm) *4 Sets the width of the leads of Group 1 in the S direction.



Sets the reference position X for the lead of Group 1 in the S direction.

1


Sets the reference position Y for the lead of Group 1 in the S direction.



Sets the lead length on the image of Group 2 in the S direction.

Lead Width: 2S (mm) *4 Sets the width of the leads of Group 2 in the S direction.



Sets the reference position X for the lead of Group 2 in the S direction.

Group 2


Sets the reference position Y for the lead of Group 2 in the S direction.

Lead Group E Sets the number of the Lead Group (1 or 2).

Common

Ruler Offset E 0 Sets the offset amount of the detection line in the E direction.


Reflect LL.: 1E (mm) *4

Sets the lead length on the image of Group 1 in the E direction.

Lead Width: 1E (mm) *4 Sets the width of the leads of Group 1 in the E direction.



Sets the reference position X for the lead of Group 1 in the E direction.

Group 1

Find Pos Y: 1E(mm) *5

Sets the reference position Y for the lead of Group 1 in the E direction.


E direction

Group 2

Reflect LL.: 2E(mm) *4

Sets the lead length on the image of Group 2 in the E direction.

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Explanation

Lead Width: 2Emm) *4 Sets the width of the leads of Group 2 in the E direction.

Lead Pitch: 2E(mm) Sets the lead pitch of Group 2 in the E direction.


Sets the reference position X for the lead of Group 2 in the E direction.

Find Pos Y: 2E(mm) *5

Sets the reference position Y for the lead of Group 2 in the E direction.

Lead Group W Sets the number of the Lead Group (1or 2).

Common

Ruler Offset W 0 Sets the offset amount of the detection line in the E direction.


Reflect LL.: 1W (mm) *4

Sets the lead length on the image of Group 1 in the W direction.

Lead Width: 1W (mm) *4 Sets the width of the leads of Group 1 in the W direction.

Lead Pitch: 1W (mm) Sets the lead pitch of Group 1 in the W direction.

Find Pos X: 1W (mm) *5

Sets the reference position X for the lead of Group 1 in the W direction.

Group 1

Find Pos Y: 1W(mm) *5

Sets the reference position Y for the lead of Group 1 in the W direction.


Reflect LL.: 2W(mm) *4

Sets the lead length on the image of Group 2 in the W direction.

Lead Width: 2Wmm) *4 Sets the width of the leads of Group 2 in the W direction.

Lead Pitch: 2W(mm) Sets the lead pitch of Group 2 in the W direction.

Find Pos X: 2W(mm) *5

Sets the reference position X for the lead of Group 2 in the W direction.

W direction

Group 2

Find Pos Y: 2Wmm) *5

Sets the reference position Y for the lead of Group 2 in the W direction.

Table 100

Note *4: The size (surface area) of the object being detected is set to the “Reflect LL.” and “Lead Width.” field. The diameter of the circle is specified by using the lead width as follows: If the shape is a rectangle: The lead length x the lead width. If the shape is a circle, The lead length = 0

Note *5: The center of gravity of the object being detected is set at the position offset from the component center.

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Figure 123

Figure 124 is the actual component and the definition data display. It is possible to perform recognition of the component though it is not rectangular. Table 101 shows the data of the component.

Figure 124




Comp. Threshold 0

Comp. Tolerance 30




Common Data


Lead Pitch N1

Lead Pitch E1

Find Pos Y N1

Find Pos Y S1

Find Pos X N1

Find Pos Y W1

Find Pos Y E1

Find Pos X E1 Find Pos X W1

Lead Pitch W1

Lead Pitch S1

Find Pos X S1

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Ruler Width 1

Algorithm Special 4


Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Vision Option 4 0



Ruler Offset N 0

Lead Number: 1N 1





N direction

Group 1



Ruler Offset S 0

Lead Number: 1S 3





Group 1


Lead Number: 2S 2





S direction

Group 2



Ruler Offset E 0

Lead Number: 1E 3





Group 1


Lead Number: 2E 2


Lead Width: 2Emm) 0.8

Lead Pitch: 2E(mm) 0.0


E direction

Group 2


Lead Group W 2 W direction

Common Ruler Offset W 0

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Lead Number: 1W 3





Group 1


Table 101

Figure 125 is the recognition result of the component data.

Figure 125

There are several algorithms available in the Mark Type recognition mode.

(1) Special 6: Check direction (*This needs to be custom-ordered)

The method for positioning is the same as that of Mark 1. (There is only one object.) The direction is determined by the brightness of the specified circular region.

Option 1: Recognition flag, the method to detect the inclination

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Option 2: Min. Brightness Difference (If the value is 0, 50 is set) If the difference of the average brightness of the detected circle is less than the

value specified here, it is determined to be an error.

Option 4: “Cut Inner /Outer Noise”, the priority to perform “Cut Inner /Outer Noise” function and the object type are specified.

The detection conditions for direction check are set to 1N Lead Group.

- Lead Group 1N: 1 *The detecting conditions for direction check are set to 1N Lead Group

- Lead Number 1N: 0

- Reflect LL 1N: 0

- Lead width 1N: Diameter of detection circle (mm)

- Lead pitch 1N: 0

- Find Pos. X 1N: Detection circle center position X

- Find Pos. Y 1N : Detection circle center position Y

Based on the results obtained from the “Direction check”, add +90°, +180° or +270° to the tilt of the component and set the values.

(2) Special 8: 2 Objects (Angle of Terminal)

Perform the same recognition method as that of Mark 2. The average center-of-gravity of the two objects is determined to be the center of the component, and the inclination is determined as the inclination of the straight lines which configure the objects. When the straight lines configure the shape of the lead, the angle may be obtained more correctly compare to the recognition by Mark 2.

� Bit position


Check Direction: (0: (0°, 180°), 1: (0°, 90°, 180°, 270°)

Least-square method is always used when performing inclination detection. (For all the sides)

Performs inclination detection with reference to the side in N direction. (when the inclination is not obtained correctly.)

Performs inclination detection with reference to the side in S direction. (when the inclination is not obtained correctly.)

Performs inclination detection with reference to the side in W direction. (when the inclination is not obtained correctly.)

Performs inclination detection with reference to the side in E direction. (when the inclination is not obtained correctly.)

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2.12.4. Special Quad

This is the recognition mode used for rectangular components. Squares can also be recognized with this mode.

<< Items to be set for recognition of Sp Quads >>



Alignment Type Sp. Quad Sets the component type.







Surface Type

Selects from reflect and non-reflect. Selects reflect when the component appears to be white and selects non-reflect when it does not.

Cut Outer Noise Select from 0 through 7.

Cut Inner Noise Select from 0 through 7.

Noise Cut Order Selects from “Inner” or ”Outer”.

Lead Number N When not performing line detection in the N direction, this sets the value other than 0.

Lead Number S When not performing line detection in the S direction, this sets the value other than 0.

Lead Number E

When not performing line detection in the E direction, this sets the value other than 0.

Common Data

Lead Number W

When not performing line detection in the W direction, this sets the value other than 0.

Table 102



Body Size Yes

Lead pitch No

Lead width No

Lead length No

Lead position No

Table 103

The following is the actual definition data of the component (semi-fixed resistor) and the recognition result.

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Alignment Type Sp. Quad

Comp. Threshold 0

Comp. Tolerance 30





Surface Type Reflect

Cut Outer Noise 0

Cut Inner Noise 0

Noise Cut Order --

Lead Number N 1

Lead Number S 1

Lead Number E 0

Lead Number W 0

Table 104

Figure 126

As the component has leads in the N/S direction, the value “1” is set to “Lead Number N/S” in order to avoid line detection in the N/S direction. As a result, recognition is carried out only in the right/left (E/W) direction.

The following shows the recognition results of the actual component (trimmer capacitor). Recognition was performed only in the left/right (W/E) direction for these components.

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Figure 127

The following is the example of the recognition of Sp Quad. All the four sides were used for the recognition.



Alignment Type Sp. Quad

Comp. Threshold 0

Comp. Tolerance 30





Surface Type Reflect

Cut Outer Noise 0

Cut Inner Noise 3

Noise Cut Order --

Lead Number N 0

Lead Number S 0

Lead Number E 0

Lead Number W 0

Table 105 Figure 128

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In the example of recognition shown in Figure 128, the function that cuts noise inside the component (See “Appendix 1. Noise processing”.) was used to reduce the effects of the dark portion at the top. (A numeric value is set for the component inside noise cut function.)

2.12.4-1. Special recognition of special quad

There are a number of special recognition algorithms available in the Sp Quad Recognition mode.

(1) Normal: No restriction on the range of value. (Special components, Special shape, Sp Quad, Normal)

(2) Special 1: Not supported (Lead Width, Lead Pitch check exist)

(3) Special 2: Not supported (hole position check)

(4) Special 3: Check Direction --- The direction is judged based on the brightness of the specified range (circle). (* This needs to be custom ordered.)


Option 2: Min. Brightness Difference (If the value is 0, 50 is set) If the difference of the average brightness of the detected circle is less than the

value specified here, it is determined to be an error.

The detection circle is set in the Lead Groups specified by the bit 7,5 and 4 in Option 1 in order to determine the direction. - Lead Group: 1 (When set to Lead Group 2, specify 2) - Lead Number: 0 - Reflect LL: 0 - Lead width: Diameter of detection circle (mm) - Lead pitch: 0 - Find Pos. X: Detection circle center position X - Find Pos. Y: Detection circle center position Y

Based on the results of each direction, add +90°, +180° or +270° to the tilt of the component and set the values.

� Bit position

Center Detection Algorithm: (0: Center of Gravity, 1: Apex of Rectangle)

� Bit position


Direction defined in check data: 0: North, 1:South, 2:West, 3: East

0: (0°, 90°), 1: (0°, 90°, 180°, 270°)

Lead group defined in check data: 0: 1

st Lead Group is used

1: 2nd Lead group is used

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Table 106 is the example of the direction determination. Figure 129 is the result of the recognition with the data in Table 106. The figure on the left in Figure 129 is the recognition result obtained from the definition. The figure on the right is the recognition result of the 180 degrees rotated component.




Comp. Threshold 0

Comp. Tolerance 30


Body Size X (mm) 5






Ruler Width 1

Algorithm Special 3

Base Alignment Sp Quad

Vision Option 1 0

Vision Option 2 30

Vision Option 3 0

Common Data

Vision Option 4 0


Ruler Offset N 0

Lead Number: 1N 0





N direction

Group 1


Table 106

Figure 129

The circular shapes on the figures in Figure 129 indicate the direction check range, and

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indicate whether the range was brighter or darker comparing to the rotated check range. In the example, the value “30” is set to “Vision Option 2”, so the difference in brightness between the check ranges has to be at least 30.

(5) Special 8: Shield recognition

The inclination of the dominant line which forms the contour of the component is determined to be the inclination of the component. This is used for the components whose outline of the contour is mainly consisted of the horizontal or vertical straight lines and the entire contour are connected to each other.

Option 4: “Cut Inner /Outer Noise”, the priority to perform “Cut Inner /Outer Noise” function and the object type are specified. Please refer to ”2.12.3-3. Mark 2 Note*3” for details.

Figure 130

(6) Special 10: Check Upside-Down

It identifies whether the surface is the topside or the bottom side by checking the variation of the brightness of the specified determination range.

Option 1: Threshold of 3-sigma It sets the threshold of the brightness variation (3-sigma) within the

determination range. Dispersion value becomes larger as the brightness variation becomes larger.

Option 2: Threshold of Average It sets the lower limit of the Average brightness value (Ave). It is available

only when “Dispersion” is selected from the “NG condition” and used to avoid the over determination when performing recognition by the dispersion value.

Option 3: Judgment Flag (This function may not be available for some old software versions.)

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Set the Lead Group for one side out of four sides. (Ex. N direction)

- Lead Group N: 1 - Lead Number N1: 0 - Lead pitch N1: 0 - Lead width N1: The size of the determination range X (In W/E direction,

Determination range Y) - Reflect LL N1: The size of the determination range Y(In W/E direction,

Determination range X) - Find Pos X N1: Determination range offset X - Find Pos Y N1: Determination range offset Y

(7) Special 11: 4 Corner Fitting

This is used for positioning the generally rectangular components by using the straight lines close to the four corners.

- Lead Group N: 1 (Set 0 for other directions) - Reflect LL N1: Set the distance from the end surface of the rectangular part to

the straight lines where its accuracy is ensured. - Lead width N1: Set the length of the straight line where its accuracy is ensured. - Find Pos X N1: Set Dimension X of the square part. - Find Pos Y N1: Set Dimension Y of the square part.

Option 4: “Cut Inner /Outer Noise”, the priority to perform “Cut Inner /Outer Noise” function and the object type are specified. Please refer to ”2.12.3-3. Mark 2, Note*3” for details.

Figure 131

� Bit position

Check-area Offset Enable: (0:Disable, 1: Enable)

NG Condition: (0: Dispersion, 1: Non Dispersion)

Dispersion: If the brightness dispersion value is larger than threshold, it is determined to be an error.

Non Dispersion: If the brightness dispersion value is smaller than threshold, it is determined to be an error.

Lead Width Reflect LL

Find Pos Y

Body Size Y

Find Pos X

Body Size X

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2.12.5. Center of Gravity detection

In this mode, the component contour is determined, and then recognition is performed on the component by using the center of gravity position and the tilt of the axis of the contour. This method is used to recognize irregular shaped components. However, the tilt of the square and circular components is not defined, as they have no axes.

<< Items to be set for Center of Gravity detection >>



Alignment Type Gravity Sets the component type.

Comp. Threshold Sets the binarization level.








Cntr. Offset R (mm) Sets the offset amount of the angle of rotation. Table 107



Surface Area Yes Checks the surface area of the targeted item

Body Size No

Lead pitch No

Lead width No

Lead length No

Lead position No

Table 108

The following is the example of the recognition of Center of Gravity detection.



Alignment Type Gravity

Comp. Threshold 0

Comp. Tolerance 30








Table 109

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Figure 132

2.12.5-1. Special recognition of the Center of Gravity detection

(1) Special 1: Not supported (Check of the average brightness within the objects) (2) Special 2: Not supported (Check of the average brightness within the objects) (3) Special 3: Check Direction: The direction is determined based on the brightness of the

specified circular region. (*This needs to be custom-ordered.)


Option 2: Min. Brightness Difference (If the value is 0, 50 is set)

If the difference of the average brightness of the detected circle is smaller than the value specified here, it is determined to be an error.

Option 3: Cut Inner Noise

Option4: Cut Outer Noise

The detection circle is set for the Lead Group 1 in the N direction in order to determine the direction.

- Lead Group: 1 - Lead Number: 0 - Reflect LL: 0 - Lead width: Diameter of detection circle (mm) - Lead pitch: 0 - Find Pos. X: Detection circle center position X - Find Pos. Y: Detection circle center position Y

� Bit position

Check Type: (0:Black, 1 White)

0: (0°, 90°), 1: (0°, 90°, 180°, 270°)

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Based on the result, add +90°, +180° or +270° to the tilt of the component and set the value.

Table 110 is the example of the direction determination. Figure 133 is the result of the recognition with the data in Table 110. The figure on the left in Figure 133 is the recognition result obtained from the definition. The figure on the right in Figure 133 is the recognition result of the 180 degrees rotated component.




Comp. Threshold 0

Comp. Tolerance 30


Body Size X (mm) 5

Body Size Y (mm) 9





Ruler Width 1

Algorithm Special 4

Base Alignment

Vision Option 1 0

Vision Option 2 0

Vision Option 3 0

Common Data

Vision Option 4 0


Ruler Offset N 0

Lead Number: 1N 0





N direction

Group 1


Table 110

Figure 133

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The circular shapes on the figures in Figure 133 indicate the direction check range, and indicate whether the range was brighter or darker comparing to the rotated check range.

In the example, the value “0” is set to “Vision Option2”, so the difference in brightness between the check range has to be at least 50.

3. Fiducial Mark Recognition

There are several methods that can be used for fiducial mark recognition. These can be selected from those noted in Table 111 based on the values specified for the recognition type and shape type.

Circle Square/ Rectangle

Triangle Sp.Shape Corner TopEdge CirEdge*

Normal Center of gravity

detection

Center of gravity

detection

Center of gravity

detection

Center of gravity

detection

Corner detection

Tip detection

Contour circle

detection

Special 1 Contour circle

detection

Contour square

Contour triangle

Center of gravity

detection

Corner detection

Tip detection

Contour circle

detection

Special 2 Edge circle

detection

Edge square

Edge triangle

Center of gravity

detection

Corner detection

Tip detection

Edge circle

detection

PTRN Outline

Matching 1

Matching 1

Matching 1

Matching 1

Matching 1

Matching 1

Matching 1

PTRN GrayLev

Matching 2

Matching 2

Matching 2

Matching 2

Matching 2

Matching 2

Matching 2

PTRN* Whole

Matching 3

Matching 3

Matching 3

Matching 3

Matching 3

Matching 3

Matching 3

Table 111

Note*: “Cir Edge” and “PTRN Whole” may not be available for some machine series and software versions.

3.1. Center of Gravity detection (Recognition type: Normal)

The mark contour is determined, and then the center of the mark is determined from the center of gravity position of the contour. If there is a projection or a dent, it affects the detection position. However, the “hole” inside the contour does not affect the recognition result.

Figure 134

The contour is detected.

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The recognition results are detected at the sub-pixel level. The following shapes can be selected as the mark shape:

- Circle - Square/ Oblong - True triangle - Special shape

The surface area and shape constant are checked for each of these shapes. (Shape constant of the “Special shape” and “Oblong” are not checked. Only the surface area is checked for the shapes.)

This recognition method is suitable for objects with brightness contrast.

<< Items to be set for center of gravity detection >>

Shape Type Selects from circle/square/triangle/special shape.

Surface type Selects reflecting/non-reflecting

Algorithm Type Normal

Mark Threshold Sets the binarization level. (If this is set to 0, the binarization level is set automatically.)

Tolerance Sets the shape tolerance.

Search Area Sets the detection range.

Cut Inner Noise Selects from 0 through 9.

Cut Outer Noise Selects from 0 through 9.

Table 112

Figure 135

<< For circle / (square /rectangle)/ true triangle >>

Mark OutSize

Sets the Body Size. (As shown in Figure 135, set the diameter for circle, the length of the side for square and triangle, and for oblong, set the length of the bottom line for X, height for Y.)

Table 113

The value obtained from the formula ( The perimeter 2 / The surface area) is set as a constant value, like those shown below. This is referred to as “shape constant”.

Circle: Perimeter2 divided by surface area = 4π Square: Perimeter 2 divided by surface area = 16

True triangle: Perimeter 2 divided by surface area = 36 / √ 3

[ What is “Shape constant”? ]

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<<For special shape>

Mark Outsize X (mm) Sets the Body Size X.

Mark Outsize Y (mm) Sets the Body Size Y.

Area (mm2) Sets the area.

Outline Sets the perimeter

Table 114

3.2. Template matching (Recognition type: pattern)

In this method, a mark that has been registered in advance is used to detect the mark that is the closest to the registered mark from among those on the image that has been captured.

A template is created from the specified field.

Figure 136

Matching is performed on the captured image by using the registered template.

Figure 137

The position that matches most closely to the registered mark is detected. The recognition results are detected at the sub-pixel level.

In “PTRN Outline” mode, recognition is performed by registering the contour part of the fiducial mark as a template.

In “PTRN Graylev” mode, the straight line on each vertical and horizontal direction are set in order to speed up the detection, and the rough position is determined by using the brightness

Template registration

Matching

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distribution on the straight lines, then the detailed matching is performed by using those positions as the center.

As speeding up process is not adopted for “PTRN Whole” mode, it takes time for processing compare to other modes. However, there is the least possibility for the detection error and it provides the high detection accuracy.

The matching degree is calculated by normalized correlation. Therefore the overall fluctuation in brightness does not affect the degree.

The matching degree decreases when unevenness of lighting or reflection fluctuates.

Also it does not correspond to the size variation and rotation (as it may decrease the matching degree), it is not applicable for the objects that change size or rotate.

<< Items to be set for Matching detection >>

Shape Type --

Surface type --

Algorithm Type Selects from “PTRN Outline” ,”PTRN GrayLev” or “PTRN Whole”

Mark Threshold --

Tolerance Specifies the allowable matching level. When the matching level is more than (1.0 – tolerance /100), it is determined to be satisfactory.


Cut Inner Noise --

Cut Outer Noise

--

Pattern Size X Template size X

Pattern Size Y Template size Y

Offset X Offset amount X from the center of the template

Offset Y Offset amount Y from the center of the template

Table 115

3.3 Corner detection

With this recognition method, the linear elements are detected from the contour of the object with the largest surface area, and from those elements, those that are thought to be corners are detected and recognized.

Caution: In this mode, recognition should be performed only when there is only one corner in the detection range. If there are more than one corner in the detection range, it is impossible to determine which coordinate of the corner to be detected.

Figure 138

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<< Items to be set for Corner detection >>

Shape Type Corner

Surface type Selects from Reflecting / Non reflecting


Mark Threshold Sets the binarization level. (When 0 is specified, binarization level is set automatically.

Tolerance --




Mark Outsize

Specifies the length of the segment targeted for processing (the dimension line in Figure 138). Only items with a segment equal to or longer than the value specified here is targeted for processing. If this is set to 0, all segments are targeted for processing.

Table 116

3.4. Top Edge detection

With this recognition method, the linear elements are detected from the contour of the object with the largest surface area, and from those elements, those that are thought to be tips are detected and recognized.

Caution: In this mode, recognition should be performed only when there is only one tip in the detection range. If there are more than one tip in the detection range, it is impossible to determine which coordinate of the tip to be detected.

Figure 139

<< Items to be set for Top Edge detection >>

Shape Type Tip detection

Surface type Selects from Reflect / Non reflect



Tolerance Sets the tolerance of the tip width (specified by the Mark Outsize)




Mark Outsize Sets the width of the tip portion. (The dimension line in Figure 139.)

Table 117

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3.5. CirEdge detection

With this recognition method, the circular elements are detected from the contour of the object with the largest surface area, and from those elements, those that are thought to be circles are detected and recognized. As presumed circles are recognized, it is possible to perform recognition in case a part of the contour is missing. However, depends on the software version, when the missing part of the object is large, it may not be able to be recognized as the surface area and shape constant are checked before the contour of the circle is presumed. (Please refer to “3.1.Center of Gravity detection (Recognition type: Normal)”.) “Edge circle detection” should be used for these objects. This mode may also cause the inaccuracy as the shapes are presumed.

Figure 140

<< Items to be set for CirEdge detection >>

Shape Type Circle end detection




Tolerance This is used when checking the surface area and perimeter (of the outer edge of the line detection results). It is also used to check shape constants.




Mark Outsize Sets the Body Size (diameter) of the mark. (The dimension line in Figure 140.)

Table 118

3.6. Contour rectangle detection / contour triangle detection

With this recognition method, the linear elements are detected from the contour of the object with the largest surface area, and from those elements, those that are thought to be rectangles / triangles are detected and recognized. As presumed circles are recognized, it is possible to perform recognition in case a part of the contour is missing. However, when the missing part of the object is large, it may not be able to be recognized as the surface area and shape constant are checked before the contour of the circle is presumed. (Please refer to “3.1.Center of Gravity detection (Recognition type: Normal)”.) “Edge rectangle / triangle detection” should be used for these objects. This mode may also cause the inaccuracy as the shapes are presumed.

Figure 141

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<< Items to be set for Contour rectangle detection / contour triangle detection >>

Shape Type (Square/Oblong) / Triangle

Surface type Selects from Reflecting / Non reflecting

Algorithm Type Special 1


Tolerance This is used when checking the surface area and the perimeter of the detected rectangle or triangle. It is also used to check the shape constants.




Mark Outsize X (mm) Sets the Body Size of the mark (side length).

Mark Outsize Y (mm) Sets the Body Size of the mark (side length). Table 119

3.7. Edge circle detection

Circular elements are detected from the edge detection results, and from those elements, those that are thought to be circles are detected and recognized. This approach is different from the contour detection on the point that all of the edge positions in the detection range are targeted for detection. Therefore, this recognition method is effective for the objects which are difficult to be detected when performing the center of gravity detection and the contour detection due to the effects such as uneven reflection. There is a possibility that recognition will still be possible even in situations when a large portion of the pattern is missing. In terms of accuracy, errors are more likely to occur.

Figure 142

<< Items to be set for Edge circle detection >>

Shape Type Circle



Mark Threshold Specifies the threshold value for edge detection.

Tolerance This is used when checking the surface area and perimeter.




Mark Outsize X (mm) Sets the Body Size of the mark.

Mark Outsize Y (mm) Sets the Body Size of the mark.

Table 120

3.8 Edge rectangle / triangle detection

Linear elements are detected from the edge detection results, and from those elements,

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those components that are thought to be rectangles or triangles are detected and recognized. This approach is different from contour detection on the point that all of the edge positions in the detection range are targeted for detection. Therefore, this recognition method is effective for the objects which are difficult to be detected when performing the center of gravity detection and the contour detection due to the effects such as uneven reflection. There is a possibility that recognition will still be possible even in situations when a large portion of the pattern is missing. In terms of accuracy, errors are more likely to occur.

Figure 143

<< Items to be set for Contour rectangle detection / contour triangle detection >>

Shape Type Selects from (Square/Oblong) / Triangle



Mark Threshold Sets the threshold for edge detection.

Tolerance This is used when checking the surface area and the perimeter (of the outer edge of the line detection results).




Mark Outsize X (mm) Sets the Body Size of the mark (side length).

Mark Outsize Y (mm) Sets the Body Size of the mark (side length).

Table 121

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Appendix

Appendix 1. Noise processing

1) “Cut Inner Noise” Noise is eliminated by performing compression processing after expansion processing has been carried out (See Figure 144).

2) “Cut Outer Noise”

Noise is eliminated by executing expansion processing after compression processing has been carried out (See Figure 144).

Noises of inside and outside of the component can be eliminated by using both “Cut Inner Noise” and “Cut Outer Noise“ functions. The processing results vary depending on the order in which the noise elimination functions are executed. The execution sequence of the functions should be selected according to need.

Figure 144

<Expansion processing>

The bottom figure in the middle in Figure 144 shows the result after expanding the image on the left by 1 pixel. As shown in this example, if the gray area is expanded by 1 pixel, a section consists of two or less pixels in the component is embedded. Multiple pixels can be specified for expansion, so the section containing the multiple pixels (noise) is embedded. Performing compression processing following the expansion processing produces an image without the noise. (See the bottom figure on the right in Figure 144).

Deleted

Compressed Expand

Deleted

Deleted Deleted

Expand

Compressed

Connected Connected

Noise elimination outside the component

Noise elimination inside the component

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<Compression processing>

The top figure in the middle in Figure 144 shows the result after compressing the image on the left by 1 pixel. As shown in this example, if the gray area is compressed by 1 pixel, a section consists of two or less pixels in the component is deleted. As multiple pixels can be specified for compression, the section containing the multiple pixels (noise) is deleted. Performing expansion processing following the compression processing produces an image without the noise (See the top figure on the right in Figure 144).

Appendix 2. Detection level differences used to detect leads (threshold value)

This parameter is used when leads are being detected. For lead detection, scanning is performed within the search range in order to separate the leads from the background. During the scanning process, if there are any pixels that are brighter than the value specified as the difference in detection level from the background density, those pixels are recognized as leads. Consequently, setting a lower value for this parameter makes it possible to detected dark leads. If the value is too low, however, the results are more easily affected by the noise. Moreover, setting a larger value is more effective in terms of noise, but there is a greater possibility of error in detecting the leads themselves.

The recognition conditions should be set in such a way that the illumination produces a strong contrast between the background and the leads. In the figure below, the illumination has been set to maximize the difference in levels between the lead section and the background section. If the lighting is too dark, the brightness of the lead itself decreases, and there will be no contrast. Conversely, if the lighting is too bright, the brightness of the background increases, eliminating contrast between the background and the lead.

Figure 145

Brightness

Brightness

Brightness

With dark lighting

With appropriate lighting

With bright lighting

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For example, if the brightness is distributed as shown in Figure 146 along the line being scanned, the leads can be detected correctly with the difference in detection levels (threshold A), but with detection level difference B, reaction to the noise can be seen. With detection level difference C, the leads cannot be detected at all.

Figure 146

Consequently, the largest possible value should be set as the detection level difference in order not to detect the noise within a range in which there is no error in lead detection. Normally, a value that is approximately half of the difference between the maximum luminance and the background luminance is thought to be appropriate. In a search for the appropriate value, the center value of the range where recognition is performed successfully is obtained as the set value, while changing the combination of the illumination level and the detection level difference. However, as searches for the appropriate value are conducted only on one component, disparities between components are not taken into consideration.

Appendix 3. Creating simple data in the special recognition modes

Some recognition modes provide modes called “special recognition modes”. These are used to recognize components that cannot be recognized with the standard settings. In this case, a special mode is also used for the component data settings. All of the setting items can be entered in this mode, in other words, it is necessary to set all of the required setting items manually. In order to minimize the manual work, the data can be created using the standard procedure described below and then the recognition mode changed in order to eliminate delays in creating the data.

For example, when the SOP data is created in a normal manner by using the Special 1 algorithm for SOP recognition, the following changes are made:

Alignment Group : Special component (� IC component) Alignment Type : Special shape (� SOP)

Then the following are set in order to eliminate delays in creating the data:

Algorithm : Special 1 Base Alignment Type : SOP

The data for the lead length, Lead Width, Lead Pitch and reference lead position (Find Pos) can be created automatically by entering the data as usual. After that, the data set automatically is retained just as it is, and the correction is required to be made only for the necessary items.

Detection level difference C

Detection level difference A

Detection level difference B

Background intensity

Brightness distribution on the scan line

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Appendix 4. Lead position check

Using the position where the lead tips should exist (the black dots at the lead tips in Figure 147) as the center, it checks whether the center of the actually detected lead tip is in the allowable range or not.

In other words, this checks the offset between the actual lead tip position and the ideal position that was determined from the component data, the component center that was determined, and the tilt. If the check range is 1.0 mm, this checks to see if the detected lead is within a range of +-1.0 mm.

Figure 147

Allowable range

Allowable range

Allowable range where the lead tip should be as its center

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Appendix 5. Reading and interpreting the recognition results display

The recognition results are displayed on the vision monitor or in the vision image monitor window. The displayed contents vary depending on the recognition mode. This section describes the typical results.

<For lead components>

Figure 148

Component detection center coordinate (critical area)

The total number of detected leads

Tilt of detected component. (degree)

Coordinate for the center of the side. (pixels)

Number of the leads per side.

Average pitch per side.(mm)

Average lead widthper side. (mm)

The lead whose

ｔip is detected

Lead detection lines Lines connecting the center position on the sides

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<< For chip components >>

Figure 149

<< For ball components >>

Figure 150

Vertical/ horizontal component size (mm)

Lead detection lines

Cross mark indicating the component center.

Average ball pitch in the horizontal direction.(mm)

Average ball pitch in the vertical direction. (mm)

Number of rows of balls in the horizontal direction.

Number of columns of balls in the vertical direction.

Average ball diameter. (mm)

Display showing layout of detected balls.

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