mft wg5: ladder disk and global assembly stéphane bouvier & sébastian herlant mft wg7:...
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MFT WG5: ladder disk and global assembly
Stéphane BOUVIER & Sébastian HERLANT
MFT WG7: Mechanics and Thermal studies
Jean-Michel BUHOUR & Emili SCHIBLER
ALICE ITS, MFT and O2 Asian Workshop 20151
Assembly, mechanics and
cooling of the MFT
2ALICE ITS, MFT and O2 Asian Workshop
2015
MFT ladder and disk assembly and ongoing
thermal studies
Sensor+FPC Hybrid Integrated Circuit (HIC) with 1 to 5 sensors each.
Carbon plastic CFRP stiffener/protector.
3 Alice Muon meeting - Chia - 26th May 2015
MFT ladder
ALICE ITS, MFT and O2 Asian Workshop 20154
Cold plateFoam
Disk support
Cooling pipes
Manyfold
Water cooling
5
Simplified ladder modelWater velocity in pipes 1 m/sPower distribution 85%(dig)+ 15%(ana)Influence of the water pipe diameter
Cooling Studies (I)
X
Z40 mW/cm2
50 mW/cm2
7
Pipe diameter
Ø1=> Ø2 : Tmax -1.5 / -2°C
Composite material
- Tmax > 50°C !!
- Non cooled sensor impossible with ‘standard’ composite
High thermal conductivity composite required (K13D2U) for ‘straight pipes’ configuration
Non cooled sensors
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Analog part
Digital part
ALICE ITS, MFT and O2 Asian Workshop 2015
WG5 weekly meeting - 12th Mayl 2015
Stiffener in carbone fiber material = cold plate
467MP
Heater
Dummy sensors
FPC
Glue467MP
467MP
Constantan
Dummy ladder for thermal test
constantan wire, 100 µm diameter, 62.4 W/m
Heater, 28 , W 13 x 140 mm, 170 µm thickness
Thermal dissipation of a sensor
Digital part :1 mm width,85 % of the power dissipation2 lenghts of constantan wiresAnalog part :14 mm width, 15 % of the power dissipation
ALICE ITS, MFT and O2 Asian Workshop 2015
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Thermal tests, general diagram
Thermal cameraTc recorder
Power unit
Pomp and chiller
HIC
Cold plate
Water pipe
ThermoCouple
10ALICE ITS, MFT and O2 Asian Workshop
2015
Ladder Assembly
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Micrometric tools toPlace sensors (ITS)
ALICE ITS, MFT and O2 Asian Workshop 2015
Vacuum table(ITS)• To keep sensor in position• To optimize laser soldering
Worktable MFTTo align
sensors/Flex circuit/laser soldering mask
Sensors Laser Soldering: MFT worktable principle
12ALICE ITS, MFT and O2 Asian Workshop
2015
Procedure:• Sensors alignment • Add Flex and Soldering grid.• Check alignment of pads sensors and holes• Install balls (200µm) on the special tool• Put the balls on the soldering grid• Install the vacuum box/ make vacuum• Soldering the balls
Sensors Laser Soldering: Operations
13ALICE ITS, MFT and O2 Asian Workshop
2015
Features for laser soldering operation: Quality of the FPC
Perfect Ni/Au finishing in the hole. Accurate position of the hole. High cleanness (Washing Workshop).
Good precision for alignment and stacking of Sensors/Flex/Soldering grid/balls. Clean worktable and sensors
BallFPC hole
Soldering grid hole
Sensors Laser Soldering: Requirements
14ALICE ITS, MFT and O2 Asian Workshop
2015
TerminalTo monitor laser solderingResults:
• Worktable to be redesign to improve mechanical tolerance• A new production of FPC with better quality
Sensors Laser Soldering: First results
First HIC (5 chips with just connections soldered)
15ALICE ITS, MFT and O2 Asian Workshop
2015
FPC :
*Several prototypes in copper for mechanical purposes and first soldering,
*Final version with traces in aluminum Very expensive, try to reduce the surface
Flexible Printed Circuit design
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2015
*Allowed temperature for FPC integrity: up to 140 °C
*Technical choice: Gluing components with conductive glue : H20E
*Produced by Epoxy Technology
*Provided by FTPolymer in France
*Can be cured at 80°C for a minimum of 3 hours
*Commonly used for HEP.
*Specific SMD components : Pd/Ag plating for gluing curing.
*Under discussion with a company for trial
SMD & Connector soldering/gluing
17ALICE ITS, MFT and O2 Asian Workshop
2015
Tools for MFT Ladder
*Laser soldering worktable
*FPC ears cutting system
*Worktable gluing support
*Tools to handle and store the ladders
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First MFT ladder (5 sensors) by November 2015.
Production 2016-2019 at CERN.
504 MFT ladders (2 to 5 sensors). This includes half MFT as spare and 20% of spares ladders.
2 technicians and 1 physicist
10 months
Ladder production
ALICE ITS, MFT and O2 Asian Workshop 2015
19ALICE ITS, MFT and O2 Asian Workshop
2015
Disk Assembly
20ALICE ITS, MFT and O2 Asian Workshop
2015
Design of the prototype done and fabricated for disk 0
Disk assembly tool prototype
Disk support
Ladder positioning reference
FPC tail cutting tool
Dummy cold plate
Disk support positioning referenceDisk support reference plane
ALICE ITS, MFT and O2 Asian Workshop 201521
First assembly of FPCs on a disk :• Position of one FPC defined by 2 pins and the connector => risk of overconstrain
Tests done, assembling work, => design validated (pins, screw, lenght of FPC)
Disk Prototype + ladders
22ALICE ITS, MFT and O2 Asian Workshop
2015
On going gluing tests
HICGlue
Cold plate
Kapton adhesive
HICGlue
Cold plate
Ladder removable mechanically
Removability in whole or in part of the ladder insured by pulling the kapton adhesive
Case 2 : Glue only
Case 1 : kapton adhesive + glue
1-a
HIC
Glue
Cold plate
Kapton adhesive
1-b
Others cases...
Interface Ladder-Disk
Glue Type
Eccobond 45(ITS)
Epoxy
Adhesive tape 467MP
(used in STAR)
Transfert adhesive
LEDPAD SFH52-sided
adhesive, acrylic film
APTEK 2724 A/B(used in STAR)
Silicone
Dow CorningSE 4445
(used in ATLAS)Silicone
Several glue tested
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Disk assembly process, design and specific tooling by April 2016.
Production 2017-2019.
30 half-disks.
One week per half-disk assembly, one week for the survey and one week for qualification.
Global assembly 4 months on surface and 6 months in the cavern (october 2019).
Half-disk production
24ALICE ITS, MFT and O2 Asian Workshop
2015
Thank you