Micro-Electro-Mechanical Systems (MEMS)

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Mr.Deepak Basandari Made By:Mr.Deepak Basandari Made By: Rupesh KumarRupesh Kumar B.Tech MechanicalB.Tech Mechanical

Table of contents1) Acknowledgement2) Abstract of work undertaken3) Introduction to the problem4) Fabricating MEMS and Nanotechnology a) Deposition Processes b) Lithography c) Etching5) MEMS and Nanotechnology Applications 6) Accelerometer7) Usefulness of accelerometers8) Current Challenges9) Reference sites

Acknowledgement As I began to reflect on magnitude of this project. i was

overwhelmed by guidance and support extended by my teacher, friends and others. i would acknowledge of H.O.D sir whose constant encouragements made me believe in myself .i would express my senior incharge CA department, who has always there in hour of need.

Last but not the least, our heart goes out to our families and our friends, who cognizance, knowledge and support make to do this presentable

RUPESH KUMAR 10802946

Abstract of work undertaken

Micro-Electro-Mechanical Systems (MEMS) is the integration of mechanical elements, sensors, actuators, and electronics on a common silicon substrate through microfabrication technology. While the electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes), the micromechanical components are fabricated using compatible "micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices.

Introduction to the problem Imagine a machine so small that it is imperceptible to the human eye. 

Imagine working machines no bigger than a grain of pollen.  Imagine thousands of these machines batch fabricated on a single piece of silicon, for just a few pennies each.  Imagine a world where gravity and inertia are no longer important, but atomic forces and surface science dominate. Imagine a silicon chip with thousands of microscopic mirrors working in unison, enabling the all optical network and removing the bottlenecks from the global telecommunications infrastructure. You are now entering the microdomain, a world occupied by an explosive technology known as MEMS.  A world of challenge and opportunity, where  traditional engineering concepts are turned upside down, and the realm of the "possible" is totally redefined. 

Fabricating MEMS and Nanotechnology MEMS technology is based on a number of tools and

methodologies, which are used to form small structures with dimensions in the micrometer scale (one millionth of a meter). Significant parts of the technology has been adopted from integrated circuit (IC) technology. For instance, almost all devices are build on wafers of silicon, like ICs. The structures are realized in thin films of materials, like ICs. They are patterned using photolithographic methods, like ICs. There are however several processes that are not derived from IC technology, and as the technology continues to grow the gap with IC technology also grows.

There are three basic building blocks in MEMS technology, which are the ability to deposit thin films of material on a substrate, to apply a patterned mask on top of the films by photolithograpic imaging, and to etch the films selectively to the mask. A MEMS process is usually a structured sequence of these operations to form actual devices. Please follow the links to read more about deposition, lithography and etching.

Deposition Processes MEMS Thin Film Deposition Processes

One of the basic building blocks in MEMS processing is the ability to deposit thin films of material. In this text we assume a thin film to have a thickness anywhere between a few nanometer to about 100 micrometer.

MEMS deposition technology can be classified in two groups:1. Depositions that happen because of a chemical reaction:

a) Chemical Vapor Deposition (CVD) b) Electrodeposition c) Epitaxy d) Thermal oxidation

These processes exploit the creation of solid materials directly from chemical reactions in gas and/or liquid compositions or with the substrate material. The solid material is usually not the only product formed by the reaction. Byproducts can include gases, liquids and even other solids.

2) Depositions that happen because of a physical reaction: a) Physical Vapor Deposition (PVD) b) Casting

Lithography Various steps involved in Lithography:1) Pattern Transfer Lithography in the MEMS context is typically the transfer of a pattern to a photosensitive

material by selective exposure to a radiation source such as light. A photosensitive material is a material that experiences a change in its physical properties when exposed to a radiation source. If we selectively expose a photosensitive material to radiation (e.g. by masking some of the radiation) the pattern of the radiation on the material is transferred to the material exposed, as the properties of the exposed and unexposed regions differs.

2) Alignment In order to make useful devices the patterns for different lithography steps that belong to a

single structure must be aligned to one another. The first pattern transferred to a wafer usually includes a set of alignment marks, which are high precision features that are used as the reference when positioning subsequent patterns, to the first pattern.

3) Exposure The exposure parameters required in order to achieve accurate pattern transfer from the

mask to the photosensitive layer depend primarily on the wavelength of the radiation source and the dose required to achieve the desired properties change of the photoresist. Different photoresists exhibit different sensitivities to different wavelengths. The dose required per unit volume of photoresist for good pattern transfer is somewhat constant; however, the physics of the exposure process may affect the dose actually received. For example a highly reflective layer under the photoresist may result in the material experiencing a higher dose than if the underlying layer is absorptive, as the photoresist is exposed both by the incident radiation as well as the reflected radiation. The dose will also vary with resist thickness.

Etching Processes

In order to form a functional MEMS structure on a substrate, it is necessary to etch the thin films previously deposited and/or the substrate itself. In general, there are two classes of etching processes:

1) Wet etching where the material is dissolved when immersed in a chemical solution.

2) Dry etching where the material is sputtered or dissolved using reactive ions or a vapor phase etchant.

MEMS and Nanotechnology Applications

There are numerous possible applications for MEMS and Nanotechnology. As a breakthrough technology, allowing unparalleled synergy between previously unrelated fields such as biology and microelectronics, many new MEMS and Nanotechnology applications will emerge, expanding beyond that which is currently identified or known. Here are a few applications of current interest:

1) Biotechnology MEMS and Nanotechnology is enabling new discoveries in science and engineering such as the

Polymerase Chain Reaction (PCR) microsystems for DNA amplification and identification, micromachined Scanning Tunneling Microscopes (STMs), biochips for detection of hazardous chemical and biological agents, and microsystems for high-throughput drug screening and selection.

2) Communications High frequency circuits will benefit considerably from the advent of the RF-MEMS technology. Electrical

components such as inductors and tunable capacitors can be improved significantly compared to their integrated counterparts if they are made using MEMS and Nanotechnology. With the integration of such components, the performance of communication circuits will improve, while the total circuit area, power consumption and cost will be reduced. In addition, the mechanical switch, as developed by several research groups, is a key component with huge potential in various microwave circuits. The demonstrated samples of mechanical switches have quality factors much higher than anything previously available.

3) Accelerometers MEMS accelerometers are quickly replacing conventional accelerometers for crash air-bag deployment

systems in automobiles. The conventional approach uses several bulky accelerometers made of discrete components mounted in the front of the car with separate electronics near the air-bag; this approach costs over $50 per automobile. MEMS and Nanotechnology has made it possible to integrate the accelerometer and electronics onto a single silicon chip at a cost between $5 to $10. These MEMS accelerometers are much smaller, more functional, lighter, more reliable, and are produced for a fraction of the cost of the conventional macroscale accelerometer elements.

Accelerometer An accelerometer is an

electromechanical device that will measure acceleration forces. These forces may be static, like the constant force of gravity pulling at your feet, or they could be dynamic - caused by moving or vibrating the accelerometer.

Usefulness of accelerometers By measuring the amount of static acceleration due to gravity, you can find out

the angle the device is tilted at with respect to the earth. By sensing the amount of dynamic acceleration, you can analyze the way the device is moving.At first, measuring tilt and acceleration doesn't seem all that exciting. However, engineers have come up with many ways to make really useful products using them.

An accelerometer can help your project understand its surroundings better. Is it driving uphill? Is it going to fall over when it takes another step? Is it flying horizontally or is it dive bombing your professor? A good programmer can write code to answer all of these questions using the data provided by an accelerometer. An accelerometer can help analyze problems in a car engine using vibration testing, or you could even use one to make a musical instrument.

In the computing world, IBM and Apple have recently started using accelerometers in their laptops to protect hard drives from damage. If you accidentally drop the laptop, the accelerometer detects the sudden freefall, and switches the hard drive off so the heads don't crash on the platters. In a similar fashion, high g accelerometers are the industry standard way of detecting car crashes and deploying airbags at just the right time.

Current Challenges MEMS and Nanotechnology is currently used in low- or medium-volume applications.

Some of the obstacles preventing its wider adoption are:

1) Limited Options Most companies who wish to explore the potential of MEMS and Nanotechnology have very limited options

for prototyping or manufacturing devices, and have no capability or expertise in microfabrication technology. Few companies will build their own fabrication facilities because of the high cost. A mechanism giving smaller organizations responsive and affordable access to MEMS and Nano fabrication is essential.

2) Packaging The packaging of MEMS devices and systems needs to improve considerably from its current primitive

state. MEMS packaging is more challenging than IC packaging due to the diversity of MEMS devices and the requirement that many of these devices be in contact with their environment. Currently almost all MEMS and Nano development efforts must develop a new and specialized package for each new device. Most companies find that packaging is the single most expensive and time consuming task in their overall product development program. As for the components themselves, numerical modeling and simulation tools for MEMS packaging are virtually non-existent. Approaches which allow designers to select from a catalog of existing standardized packages for a new MEMS device without compromising performance would be beneficial.

3) Fabrication Knowledge Required Currently the designer of a MEMS device requires a high level of fabrication knowledge in order to create a

successful design. Often the development of even the most mundane MEMS device requires a dedicated research effort to find a suitable process sequence for fabricating it. MEMS device design needs to be separated from the complexities of the process sequence.

Reference sites

1) Memx.org

2) Google.com

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