Microelectronic Interconnections and Assembly

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3. High Technology - Vol. 54

Microelectronic I nterconnections and Assembly

edited by

George Harman National Institute of Standards and Technology, Semiconductor Electronics Division, Gaithersburg, Maryland, U.S.A.

and

Pavel Mach Department of Electrotechnology, Czech Technical University in Prague, Prague, Czech Republic

Springer Science+Business Media, BV.

Proceedings of the NATO Advanced Research Workshop on Microelectronic Interconnections and Assembly Prague, Czech Republic 18-21 May, 1996

A C,I .P. Catalogue record for this book is available from the Library of Congress.

ISBN 978-94-010-6159-9 ISBN 978-94-011-5135-1 (eBook) DOI 10.1007/978-94-011-5135-1

Printed on acid-free paper

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Softcover reprint of the hardcover 1 st edition 1998

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TABLE OF CONTENTS

Preface ............................................................. ix

Session 1. Packaging and Interconnection Trends - Present and Future

1.1 The Packaging and Interconnection Trends in the Nordic Microelectronics Industry ........................................ . Seren Nerlyng

1.2 IC Packaging for Miniaturised Consumer Electronics ................... 9 Co van Veen

1.3 The Move towards Further Miniaturisation ........................... 13 MG. Sage

1.4 Plastic Packaging is Highly Reliable ................................ 21 Nihal Sinnadurai

1.5 Thermal Simulation and Characterization of Single Chip Packages ........ 33 Orla Slattery, Ciaran Cahill, John Barrett, Martin 0 'Flaherty and Kenneth Rodgers

1.6 Current Trends and Future Issues in Solderability ..................... 45 Gary J. Ewell

Session 2. Solder and Flip Chip Interconnections and Assembly

2.1 The At-Temperature Mechanical Properties of Lead-Tin-Based Alloys ..... 53 W. Kinzy Jones, Y. Q. Liu, Marc A. Zampino and Gerardo L. Gonzalez

2.2 Flip Chip Technology: Is It Time for Mass Production? ................. 59 Carlo Cognetti

2.3 Flip-Chip - The Ultimate Solution Comparing Flip-Chip and Chip Scale Packaging (Abstract only) .................................. 77 Bill Brox and Katarina Boustedt

2.4 Solder and Solderless Flip Chip Assembly on a MCM-D in a BGA Package (Abstract only) ......................................... 79 Peter Bodo, Hans Hentzell, Jan Strandberg, Joacim Haglund and Sima Valizadeh

VI

2.5 Solder Bumping for Flip Chip Interconnections ....................... 81 P. Annala, J Kaitila, J Salonen and 1. Suni

2.6 Reliability of Solder Joint Interconnections in Thermally Matched Assemblies .................................................... 87 E. Suhir

2.7 Mechanical Stress in Microelectronic Interconnects .................... 97 Peter J. Gielisse, Meirong Tu, Dongming Y. White and Yang Xu Famu-Fsu

Session 3. Single Chip Interconnection and Qualification: Wire Bonding and TAB

3.1 Low Cost Interconnection Technology for Fast Prototyping of Multichip Modules ............................................. 109 Zsolt Illyefalvi- Vitez, Janos Pinkola, Laszlo Gal and Endre Toth

3.2 Opto-Electronic Multi-Chip Modules (OE-MCMs): Current R&D and Applications to Microelectronic Interconnections ..................... 119 Sayan D. Mukherjee

3.3 On Thin Film MCM-D Interconnects .............................. 141 J. Roggen, E. Beyne, C. Truzzi, E. Ringoot and P. Pieters

Session 4. Multichip Module Interconnections and Assembly I

4.l VLSIInterconnection by Bumpless Tab ............................ 145 Gerard Dehaine, Patrick Courant and Karel Kurzweil

4.2 Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001 ... 157 George G. Harman

4.3 Bonding of Al Wires to Copper Contacts on PCBs and Alumina Substrates - A Comparative Study ................................ 167 MichalCiez

4.4 Microwelding of Leads to the the Film Structures Working at Elevated Temperatures ................................................. 179 T. Pisarkiewicz, T. Habdank-Wojewodzki and M Ciez

Session 5. Discussion with the Dean and Vice Chancellor of the Czech Technical University and People from the Czech and the Slovak ISHM Chapters

5.1 New Trends in the Integration and Education in Microsystems

VII

Technology (Abstract only) ..................................... 185 Juraj Banslgl

Session 6. Multichip Module Interconnections and Assembly II

6.1 MCM Implementation of a 2.5 Gb/s A TM Switch .................... 187 Pierre Plaza and Jose Luis Conesa

6.2 Processing and Performance of High Dielectric Permeability Thin Anodised Films in Multilayer Structures for MCM(D) High Speed Digital Applications ............................................ 193 Radosvet G. Arnaudov, Nikola St. Yordanov and Phillip Iv. Phillipov

6.3 Optical Interconnection Elements Investigation in Chalcogenide Glass Layers for Integrated Optics ................................ 213 A. Kikinesshy, M Marjan, V. Vlasov, I. Mojzes and G. Ripka

Session 7. Thick Film Interconnections and Metallurgical Interactions I

7.1 Material Composition Changes during High Temperature Annealing and Electrochemical Migration Reliability .......................... 217 Gabor Harsanyi, Liana Pernes and W Kinzy Jones

7.2 Nonlinearity between Interconnection and Resistive Layer .............. 225 Pavel Mach

Session 8. Thick Film Interconnections and Metallurgical Interactions II

8.1 Education in Hybrid Microelectronics at the Technical University ofBmo ...................................................... 233 Ivan Szendiuch

8.2 Thick Film Interconnections for Sensor Applications .................. 237 Darko Be/avic, Sreeko Macek, Stojan Soba, Marko Pavlin, Marko Hrovat and Dubravka Rocak

Vlll

8.3 PTF (Polymer Thick Film) Interconnections in Tenn of Long Time Reliability .................................................... 249 Jan Urbaneik

8.4 The Usage of Polymer Inks in Interconnection Technology ............. 257 Frantisek Kolesar and Milos Somora

8.5 Production of Metallic Patterns with the Help of Highresolution Inorganic Resists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. 263 Alexander V. Stronski

Subject Index ...................................................... 295

NATO ARW 951423 Preface

MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP

18-21 May 1996, Prague, Czech Republic

Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic)

Summary of the Technical Program

Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas.

In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.

Wire bonding currently dominates chip to package interconnections, with about 95% of devices so interconnected. However, there was general agreement that some form of flip chip interconnection (currently used on -1% of semiconductor devices) will rapidly increase its market share in the future, and this was reflected in the number of papers on the subject. Tape Automated Bonding (TAB) was also discussed, but its market share is not expected to grow Significantly, being used primarily for special applications. However, such a statement might be challenged by some TAB advocates. The solder metallurgy as well as the production technology of flip chip interconnections were described in several papers. Solderability, reliability, and fatigue of the joints were modeled, and mechanical stresses resulting from temperature cycling were reported.

Multichip Module and thick-film hybrid substrate interconnections were reported in several papers. These included thick and thin film metals, as well as low temperature polymer inks. Several papers described diffusion and other metallurgical interactions in thick film interfaces.

The program was very diverse, covering materials, manufacturing, and reliability issues of chip and substrate interconnections, so that a single, simple conclusion is not possible. However, all attendees left with a broad understanding of the possible interconnection choices and technologies to implement (manufacture) them, as well as with the knowledge of who could help in such activities in the future. In addition to the technical program, a fruitful discussion with the Dean of the Faculty of Electrical Engineering and the Vice Chancellor of the Technical University was included as part of the conference (in Session 5).

ix

x

THE TECHNICAL PROGRAM Session 1

Session 2

Session 3

Session 4

Session 5

Session 6

Session 7

Session 8

Packaging and interconnection Trends -- Present and Future Session Chairs: Karel Kurzweil, Bull SA (France), and Soeren Noerlyng, Micronsult (Denmark).

Solder and Flip Chip Interconnections and Assembly Session Chair: Pavel Mach, Czech Technical Univ. (Czech Republic), and W. Kinzy Jones, Florida IntI. Univ. (USA).

Single Chip Interconnection and Qualification: Wire Bonding and TAB Session Chair: Carlo Cognetti, SGS Thompson (Italy).

Multichip Module Interconnections and Assembly I Session Chair: George Harman, NIST (USA).

Discussion with the Dean and Vice Chancellor of the Czech Technical Univ., and People from the Czech and the Slovak ISHM Chapters The Lead-off Talk was: New Trends in the Integration and Education in Microsystems Technology: Prof. Juraj Bansky, Technical University Kosice (Slovak Republic).

Multichip Module Interconnections and Assembly /I Session Chair: Zsolt lIIyefalvi-Vitez, Technical Univ. Budapest (Hungary)

Thick Film Interconnections and Metallurgical Interactions I Session Chair: Milos Somora (Slovak Republic).

Thick Film Interconnections and Metallurgical Interactions /I Gabor Harsanyi, Technical Univ. of Budapest (Hungary).

In all, 32 papers were presented from the following 19 countries: Belgium, Bulgaria, Czech Republic, Denmark, Finland, France, Hungary, Ireland, Italy, the Netherlands, Norway, Poland, Slovak Republic, Slovenia, Spain, Sweden, United Kingdom, Ukraine, and the USA. It was felt that the diverse national representation served to produce a balanced program that should be useful to the entire electronics packaging community.

Organizing Committee:

Dr. W. Kinzy Jones, Florida International University, USA Dr. Karel Kurzweil, Bull SA, France Dr. Soren Norlyng, Microsult, Denmark Dr. Sidney Stein, Electro-Science Laboratories, USA

Publication:

Title: Microelectronic Interconnections and Microassembly Publishers: Kluwer Academic Publishers, Dordrecht, Netherlands.

Xl

Session 1 Packaging and Interconnection Trends - Present and Future Session Chairs: Karel Kurzweil, Bull S. A., France, and Soeren Noeriyng, Micronsuit, Denmark

1.1 The Packaging & Interconnection Trends in the Nordic Microelectronics Industry Soeren Noriyng, Micronsult, Denmark

1.2 [Paper Not Given)

1.3 I C Packaging for Miniaturized Consumer Electronics Co van Veen, Philips CFT, The Netherlands

1.4 The Move towards Further Miniaturization Maurice Sage, BP A, United Kingdom

1.5 Plastic Packaged Devices survive where Hermetic Packaged Devices Fail in Severe Climates Nihal Sinnadurai, TWI, United Kingdom

1.6 Thermal Simulation and Characterization of Single Chip Packages Orla Slattery, Ciaran Cahill, John Barrett, Martin O'Flaherty and Kenneth Rodgers National Microelectronics, Ireland

1.7 Current Trends and Future Issues in Solderability Gary J. Ewell, The Aerospace Corporation

Session 2 Solder and Flip Chip Interconnections and Assembly Session Chair: Pavel Mach, Czech Technical University, Czech Republic and Kinzy Jones, Florida International University, USA

2.1 The At-Temperature Mechanical Properties of Lead-Tin-Based Alloys w. Kinzy Jones, Florida International University, USA

2.2 Flip Chip Technology: Is It Time for Mass Production? Carlo Cognetti, SGS Thomson Microelectronics, Italy

2.3 [No Paper - Use Abstract) Flip-Chip - The Ultimate Solution Comparing Flip-Chip and Chip Scale Packaging Bill Brox and Katarina Boustedt, IVF, Sweden

2.4 [No Paper - Use Abstract) Solder and Solderiess Flip Chip Assembly on an MCM-D in a BGA Package Peter Bodo, Industrial Microelectronics Center, Sweden

XII

2.5 Solder Bumping for Flip Chip Interconnections P. Annala, J: Kaitila, J. Salonen and I. Suni, V1T Electronics, Finland

2.6 Reliability of Solder Joint Interconnections in Thermally Matched Assemblies Ephraim Suhir,AT&T Bell Labs., USA

2.7 Mechanical Stress in Microelectronic Interconnects Peter Gielisse, Meirong Tu, Dongming Y. White, and Yong Xu, Florida State University, USA

Session 3 Single Chip Interconnection and Qualification: Wire Bonding and TAD Session Chair: Carlo Cognetti, SGS Thompson, Italy

3.1 Low Cost Interconnection Technology for Fast Prototyping of Multi chip Modules Zsolt Illyefalvi-Vitez, Janos Pinkola, Laszlo Gal and Endre Toth Technical University of Budapest, Hungary

3.2 Opto-Electronic Multi-Chip Modules (OE-MCMs): Current R&D and Applications to Microelectronic Interconnections Sayan Mukherjee, Department of Physical Electronics, Norway

3.3 On Thin Film MCM-D Interconnects J. Roggen, E. Beyne, C. Truzzi, E. Ringoot and P. Pieters Interuniversity Micro-Electronics Centre, Belgium

Session 4 Multichip Module Interconnections and Assembly I Session Chair: George Harman, National Institute of Standards & Technoloy, USA

4.1 VLSI Interconnection by Bumpless Tab Gerard Dehaine, Patrick Courant and Karel Kurzweil, Bull, S.A., France

4.2 Critical Issues in Wire-bonded Chip Interconnections to the Year 2000 George G. Harman, National Institute of Standards and Technology, USA

4.3 Bonding of Al Wires to Copper Contacts on PCBs and Alumina Substrates - A Comparative Study Michal Ciez, Center for Hybrid Microelectronics and Resistors, Poland

4.4 MicroWelding of Leads to the Film Structures Working at Elevated Temperatures T. Pisarkiewicz, T. Habdank -Wojewodzki and M. Ciez, University of Mining and

Metallurgy, Poland

Session 5 Discussion with the Dean and Vice ChanceUor of the Czech Technical University and People from the Czech and the Slovak IS8M Chapters

5.1 [No Paper - Use Abstract] New Trends in the Integration and Education in Microsystems Technology Juraj Bansky, Technical University Kosice, Slovak Republic

Session 6 Multichip Module Interconnections and Assembly Session Chair: Zsolt Illyefalvi-Vitez, Technical University of Budapest, Hungary

6.1 MCM Implementation of a 2.5 Gbls ATM Switch Pierre Plaza and Jose Luis Conesa, I&D Telefonica, Spain

6.2 Processing and Performance of High Dielectric Permeability Thin Anodised Films in Multilayer Structures for MCM(D) High Speed Digital Applications

Radosvet G. Arnaudov, Nikola St. Yordanov and Philip Phillipov, Technical University of Sofia, Bulgaria

6.3 Optical Interconnection Elements Investigation in Chalcogenide Glass Layers for Integrated Optics A. Kikinesh, M. Marjan, V. Vlasov, I. Mojzes and G. Ripka, Technical University of Budapest, Hungary

Session 7 Thick Film Interconnections and MetaUurgical Interactions I Session Chair: Milos Somora, Slovak Republic

Xlll

7.1 Material Composition Changes During High Temperature Annealing and Electrochemical Migration Reliabilityl Gabor Harsanyi, Technical University of Budapest, Hungary Liana Pernes and W. Kinzy Jones, Florida International University, USA

7.2 Nonlinearity between Interconnection and Resistive Layer Pavel Mach, Czech Technical University, Czech Republic

Session 8 Thick Film Interconnections and Metallurgical Interactions II Gabor Harsanyi, Technical University of Budapest, Hungary

8.1 Education in Hybrid Microelectronics at the Technical University ofBrno Ivan Szendiuch, Czech Technical University, Czech Republic

XIV

8.2 Thick Film Interconnections for Sensor Applications Darko Belavic, Srecko Macek, Stojan Soba, Marko Pavlin, Marko Hrovat and Dubravka Rocak HIPOT Hybrid, Slovenia

8.3 PTF (Polymer Thick Film) Interconnections in Term of Long Time Reliability Jan Urbancik, Technical University of Kosice, Slovakia

8.4 The Usage of Polymer Inks in Interconnection Technology F. Kolesar and M. Somora, Cassovia Kosice, Slovak Republic

8.5 Production of Metallic Patterns with the Help of HighResolution Inorganic Resists Alexander Stronski, National Academy of Sciences, Ukraine