microstar rg

MicroStar BGA PackagingReference Guide

Printed on Recycled PaperPrinted on Recycled Paper

Literature Number: SSYZ015BThird Edition – September 2000

MicroStar BGA is a trademark of Texas Instruments Incorporated.

IMPORTANT NOTICE

Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgment, including thosepertaining to warranty, patent infringement, and limitation of liability.

TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.

Customers are responsible for their applications using TI components.

In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.

TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.

Copyright 2000, Texas Instruments Incorporated

iiiMicroStar BGA Packaging Reference Guide

Introduction

The parallel pursuit of cost reduction and miniaturizationin recent years has given rise to an increasing emphasison very small integrated circuit (IC) package solutions.This is particularly evident in consumer-based end

equipment using digital signal processor (DSP) solutionssuch as wireless telephones, laptop computers, andhard-disk drives. Despite the formal definition, packageswith an area similar in size to the IC they encapsulate areloosely referred to as chip scale packages (CSPs).Figure 1 illustrates this trend.

Figure 1. Packaging Trends

Pac

kage

siz

e

QFP0.5 mm pitch

BGA (ball grid array)1.27 mm ball pitch Fine pitch requirement

QFP0.4 mm pitch

Bare chip(flip chip)

• Infra. issue (KGD)

• Soldering difficulties

• PWB/ASSY cost up

CSP (chip scale pkg.) solution

Fine pitch BGA(0.5, 0.8, 1.0 mm ball pitch)

QFP-0.5

QFP-0.4

CSP

BGA

Bare chip (bump)

Pin count

Package trend (customer requirement)

Chip scale packages are in many ways an ideal solutionto the cost reduction and miniaturization requirements.They offer enormous area reductions in comparison toquad flat packages (QFPs) and have increasing potentialto do so without adding to system-level cost. In the bestcase, CSPs compete today on a cost-per-terminal basiswith QFPs. For example, various CSPs from TexasInstruments (TI) are now available at cost parity with thinQFPs.

Texas Instruments produces a polyimide film-basedfamily of CSPs called MicroStar BGA. Like most otherCSPs, MicroStar BGAs use solder alloy balls as theinterconnect between the package substrate and theboard on which the package is soldered. The MicroStarBGA family comes in a range of solder ball pitch (0.5 mm,0.8 mm, and 1.0 mm). Currently, TI’s most popularpackages are 64- and 144-ball packages. Figure 2shows the structure of TI’s MicroStar BGA package.

Figure 2. Structure of TI’s MicroStar BGA

Cu pattern(30 µm line/40 µm space)

Flex substrate(polyimide)

(Single electrical layer)

0.5 mm DIA./0.8 mm ball pitchSn/Pb: near eutectic

Via(0.375 mm DIA.)

Wire bond

Conforms to JEDEC Outlines: MO-192 and MO-205-AEncapsulant

Chip(11 mils)

0.8 mmpitch

PWB

Diepaste

MicroStar BGA is a trademarks of Texas Instruments.

ivMicroStar BGA Packaging Reference Guide

Texas Instruments addressed several key issues inpackage assembly in order to produce a CSP that is notonly physically and mechanically stable butcost-effective for a wide variety of applications. Figure 3demonstrates how MicroStar BGAs resolve reliabilityand cost issues. An overall view of the flow used toproduce TI MicroStar BGA packages is shown inFigure 4. The process for solder ball attachment isshown in Figure 5.

Figure 3. MicroStar BGA Package AssemblyIssues

Substrate – Ceramic

selection – Glass-epoxy

– Polyimide†

Interconnection – Bump (flip chip)

– Wire bond†

Solder ball form – Solder jet

– Stud bump

– Paste print

– Pick and place†

Encapsulation – Potting

– Transfer mold†

Transducer

Moltensolder

Orifice

Printing maskSolderpaste

Vacuum

Solder wire

Capillary

†These are the processes used by TI.

Figure 4. MicroStar BGA Package Assembly Flow

Same as QFP assembly

Die attach Wire bond Encap

Non-Ag paste Short loop X’fer mode

Ball attach IR reflow Flux wash

0.30 mm DIA. Ultrasonic clean

Laser symboland singulation Test

Tray

BGA unique process

Figure 5. Solder Ball Attachment

Solder ball attach Pick and place

Squeegee

Printing mask

Solderpaste

Vacuum

Substrate Solder ball

Ball pads (via) Solder paste print Solder ball attach(12 mil DIA.)

Solder ball shear tests

SS Fail Ave. Reading125 0 668 g125 0 734 g

144GGU, 0.8-mm pitch, 0.5 mm DIA. ball TI spec. is 400 g min

The MicroStar BGA package has been fully qualified innumerous applications and is being used extensively inmobile phones, laptops, modems, handheld devices,and office environment equipment. Your local TI fieldsales office can give you more information on usingreliable and cost-effective MicroStar BGA packaging in

your application.

This guide is designed to give you technical backgroundon MicroStar BGA packages as well as how they can beused to build advanced board layouts. Any additionalhelp desired with your specific design is also availablethrough your local TI field sales office.

vMicroStar BGA Packaging Reference Guide

Contents

1 PCB Design Considerations 1–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Solder Land Areas 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Conductor Width/Spacing 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . High-Density Routing Techniques 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Via Density 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Conventional PCB Design 1–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Advanced Design Methods 1–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Reliability 2–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Daisy-Chained Units 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reliability Data 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reliability Calculations 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package Characteristics 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Thermal Modeling 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Electrical Modeling 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 Surface-Mounting MicroStar BGA Packages 3–1. . . . . . . . . . . . . . . . . . . . . . . . . . Design for Manufacturability (DFM) 3–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Solder Paste 3–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Solder Ball Collapse 3–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reflow 3–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Inspection 3–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4 Packing and Shipping 4–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trays 4–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tape-and-Reel Packing Method 4–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tape Format 4–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Device Insertion 4–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Packaging Method 4–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5 Sockets 5–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The Design Challenge 5–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contacting the Ball 5–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Establishing Contact Force 5–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Conclusions and Future Work 5–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6 Lead-Free Solutions 6–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Moisture Sensitivity 6–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Board Land Finishes and Solder Paste 6–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . Summary 6–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7 References 7–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Appendix A Frequently Asked Questions A–1. . . . . . . . . . . . . . . . . . . . . . . . . . . Package Questions A–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Assembly Questions A–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Appendix B Package Data Sheets B–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80GJK (Pitch = 0.5 mm; Size = 6 x 6 mm) B–2. . . . . . . . . . . . . . . . . . . . . 167GJJ (Pitch = 0.5 mm; Size = 8 x 8 mm) B–3. . . . . . . . . . . . . . . . . . . . . 151GHZ (Pitch = 0.5 mm; Size = 10 x 10 mm) B–4. . . . . . . . . . . . . . . . . . . 100GGM (Pitch = 0.8 mm; Size = 10 x 10 mm) B–5. . . . . . . . . . . . . . . . . . . 64GGV (Pitch = 0.8 mm; Size = 8 x 8 mm) B–6. . . . . . . . . . . . . . . . . . . . . 80GGM (Pitch = 0.8 mm; Size = 10 x 10 mm) B–7. . . . . . . . . . . . . . . . . . . 100GGF (Pitch = 0.5 mm; Size = 10 x 10 mm) B–8. . . . . . . . . . . . . . . . . . . 100GGT (Pitch = 0.8 mm; Size = 11 x 11 mm) B–9. . . . . . . . . . . . . . . . . . . 144GGU (Pitch = 0.8 mm; Size = 12 x 12 mm) B–10. . . . . . . . . . . . . . . . . 179GHH (Pitch = 0.8 mm; Size = 12 x 12 mm) B–11. . . . . . . . . . . . . . . . . . 176GGW (Pitch = 0.8 mm; Size = 15 x 15 mm) B–12. . . . . . . . . . . . . . . . . 208GGW (Pitch = 0.8 mm; Size = 15 x 15 mm) B–13. . . . . . . . . . . . . . . . .

viMicroStar BGA Packaging Reference Guide

Contents (continued)240GGW (Pitch = 0.8 mm; Size = 15 x 15 mm) B–14. . . . . . . . . . . . . . . . . 196GHC (Pitch = 1.0 mm; Size = 15 x 15 mm) B–15. . . . . . . . . . . . . . . . . 257GHK (Pitch = 0.8 mm; Size = 16 x 16 mm) B–16. . . . . . . . . . . . . . . . . 257GJG (Pitch = 0.8 mm; Size = 16 x 16 mm) B–17. . . . . . . . . . . . . . . . .

viiMicroStar BGA Packaging Reference Guide

List of FiguresFigure Page

1 Packaging Trends iii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Structure of TI’s MicroStar BGA iii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 MicroStar BGA Package Assembly Issues iv. . . . . . . . . . . . . . . . . . . . . . . . . . .

4 MicroStar BGA Package Assembly Flow iv. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5 Solder Ball Attachment iv. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6 Package Via to Board Land Area Configuration 1–2. . . . . . . . . . . . . . . . . . . . .

7 Effects of Via-to-Land Ratios 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8 Optimum Land Configurations 1–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9 PCB Design Considerations (Conventional) 1–3. . . . . . . . . . . . . . . . . . . . . . . .

10 Microvia Structure 1–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11 “Dog Bone Via” Structure 1–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

12 Buried Vias 1–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

13 Daisy-Chained Pinout List 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

14 General Net List 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

15 PCB Layout for Daisy-Chained Unit 2–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

16 Daisy-Chain Test Configuration 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

17 Board-Level Reliability Test Boards 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

18 Board-Level Reliability Test Data 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

19 Thermal Modeling Process 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

20 Electrical Modeling Process 2–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

21 Solder Ball Collapse 3–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

22 Ideal Reflow Profile 3–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

23 Shipping Tray Detail 4–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

24 Packing Method for Trays 4–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

25 Single Sprocket Tape Dimensions 4–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

26 Reel Dimensions 4–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

27 Tape-and-Reel Packing 4–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

28 Approaches for Contacting the Solder Ball 5–2. . . . . . . . . . . . . . . . . . . . . . . . .

29 Pinch Contact for Solder Balls 5–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

30 Contact Area on Solder Ball 5–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

31 Witness Marks on Solder Ball 5–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

32 Effect of Burn-in on Probe Marks 5–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

33 Assembly Testing of Eutectic vs. Pb-free Solder Balls 6–3. . . . . . . . . . . . . . .

34 Standard Reflow Profile for Pb/Sn Alloy Solder 6–3. . . . . . . . . . . . . . . . . . . . .

35 Proposed Reflow Profile for Non-Pb Alloy Solders 6–4. . . . . . . . . . . . . . . . . .

36 Typical SAM Pictures After Moisture Sensitivity Testing 6–5. . . . . . . . . . . . . .

37 Broad-Level Reliability Study(Solder Paste: Sn/Pb Eutectic) 6–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

viiiMicroStar BGA Packaging Reference Guide

List of Figures (continued)Figure Page

38 Broad-Level Reliability Study(Solder Paste: Pb-free-1) 6–6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

39 Broad-Level Reliability Study(Solder Paste: Pb-free-2) 6–7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

40 Key Push Test Apparatus 6–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

41 Typical Key Push Test Results 6–8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

42 Key Push Test Performance 6–9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

43 TI’s Strategic Package Line-Up B–1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

List of TablesTable Page

1 Package-Level Reliability Tests 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Package-Level Reliability Test Results 2–3. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 Board-Level Reliability Summary 2–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4 Summary of Significant BLR Improvements 2–5. . . . . . . . . . . . . . . . . . . . . . . .

5 Effects of Pad Size and Board Thickness on Fatigue Life 2–5. . . . . . . . . . . .

6 Number of Units per Shipping Tray 4–2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

7 Tape Dimensions 4–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

8 Reel Dimensions 4–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

9 Component Relialibility Testing and BLR for Pb-free Solder Balls 6–2. . . . . .

10 Moisture Sensitivity test results 6–4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

11 Solder paste compositions 6–5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1–1MicroStar BGA Packaging Reference Guide

1PCB Design Considerations

PCB Design Considerations


Solder Land Areas

Design of both the MicroStar BGA itself and the printedcircuit board (PCB) are important in achieving goodmanufacturability and optimum reliability. In particular,the diameters of the package vias and the board landsare critical. While the actual sizes of these dimensionsare important, their ratio is more critical. Figure 6illustrates the package via-to-PCB configuration andFigure 7 illustrates why this ratio is critical.

Figure 6. Package Via to Board Land AreaConfiguration

MicroStar BGA package

Land on PCB Package ball via

PCB

A

B(Not to scale)

A = Via diameter on packageB = Land diameter on PCB

Ratio A/B should equal 1.0 for optimum reliability.

Figure 7. Effects of Via-to-Land Ratios

Package

PCB

Package

Package

PCB

PCB

In the top view of Figure 7, the package via is larger thanthe PCB via, and the solder ball is prone to crackprematurely at the PCB interface. In the middle view, thePCB via is larger than the package via, which leads tocracks at the package surface. In the bottom view, wherethe ratio is almost 1:1, the stresses are equalized andneither site is more susceptible to cracking than theother.

Solder lands on the PCB are generally simple roundpads. Solder lands are either solder-mask-defined ornon-solder-mask-defined.

Figure 8. Optimum Land Configurations

YX

Solder-Mask-Defined Land

µ

µ

µ

X Y

Non-Solder-Mask-Defined Land

µ

µ

µ

Solder-mask-defined (SMD) land. With this method, thecopper pad is made larger than the desired land area,and the opening size is defined by the opening in thesolder mask material. The advantages normallyassociated with this technique include more closelycontrolled size and better copper adhesion to thelaminate. Better size control is the result of photoimagingthe stencils for masks. The chief disadvantage of thismethod is that the larger copper spot can make routingmore difficult.

Non-solder-mask-defined (NSMD) land. Here, the landarea is etched inside the solder mask area. While thesize control is dependent on copper etching and is not asaccurate as the solder mask method, the overall patternregistration is dependent on the copper artwork, which isquite accurate. The tradeoff is between accurate dotplacement and accurate dot size.

See Figure 8 for an example of optimum land diametersand configurations for a common MicroStar BGA pitch.

Conductor Width/Spacing

Many of today’s circuit board layouts are based on atmost a 100-µm conductor line width and 200-µmspacing. To route between 0.8-mm-pitch balls, given aclearance of roughly 380 µm between ball lands, onlyone signal can be routed between ball pads. The 380-µmball spacing is worst case and is calculated by assumingthe diameter of the solder ball land is 410 µm.

Figure 9 presents some design considerations based oncommonly used PCB design rules. Conventionally, thepads are connected by wide copper traces to otherdevices or to plated through holes (PTH). As a rule, themounting pads must be isolated from the PTH. Placingthe PTH interstitially to the land pads often achieves this.



Figure 9. PCB Design Considerations (Conventional)

0.8 mmpitch

1.0 mmpitch

0.350 mmDIA. pad

0.12

5 m

m li

ne 0.50 mm DIA.solder mask

opening

0.254 mmDIA. hole

NSMD pads NSMD pads

0.400 mmDIA. pad

0.12

5 m

m li

ne 0.55 mm DIA.solder mask

opening

0.254 mmDIA. hole

0.375 mm DIA.solder mask

opening

SMD pads

0.480 mmDIA. pad 0.550 mm

DIA. pad

0.12

5 m

m li

ne

0.450 mm DIA.solder mask

opening

SMD pads

(Not to scale)

0.10

0 m

m li

ne

High-Density Routing TechniquesA challenge when designing with CSP packages is thatas available space contracts, the space available forsignal fanout also decreases. By using a fewhigh-density routing techniques, the PCB designer canminimize many of these design and manufacturingchallenges. This section focuses on TI designators GGU(144-pin) and GGW (176-pin) packages. Both packageshave 0.8-mm pitch, but each is distinctly different in arraystyle. The GGW ball array has wide channels in the fourcorners, providing the inner balls with space for routingand VCC connectivity. Mechanical drawings of theseMicroStar BGA packages can be found in Appendix B.The GGU package has a solid four-row arrayconfiguration which can cause difficulties when routinginner rows on two-layer boards.

Via DensityVia density, as mentioned earlier, can be a limiting factorwhen designing high-density boards. Via density isdefined as the number of vias in a particular board area.Using smaller vias increases the routability of the boardby requiring less board space and increasing via density.The invention of the microvia, shown in Figure 10, hassolved many of the problems associated with via density.

Figure 10. Microvia Structure

Microvias are often created using a laser to penetrate thefirst few layers of dielectric. The laser can penetrate a4-mil-thick dielectric layer, creating the 4-µm microviashown in Figure 10. The layout designer can now routeto the first internal board layer. Two layers (each 4 milsthick) can be laser-drilled, creating a 200-µm microviadiameter. In this case, routing to the first two internallayers is possible.

The number of board layers increases as board chipdensity and functional pin count increase. As anexample, the TMS320VC549GGU digital signalprocessor (DSP) is in a 144-GGU package and uses32 balls for power and ground. Routing of roughly



112 signals can be accomplished on three layers. Thepower and ground planes increase the board to fivelayers. The sixth layer can be used on the bottom side toplace discrete components. Furthermore, by increasingthe board layer stack-up to eight layers, high-densityapplications are possible with only 10 to 15 mils betweenthe chips.

Conventional PCB DesignThe relatively large via density on the package periphery,mentioned earlier, is caused by limited options whenrouting the signal from the ball. To reduce or eliminate thevia density problem on the periphery of the package,designers can build the PCB vertically from the BGA padthrough the internal layers of the board, as shown inFigure 11. By working vertically and mechanical drilling250-µm vias between the pads on the board and theinternal layers, designers can create a“pick-and-choose” method. They can pick the layer andchoose the route. A “dog bone” method is used toconnect the through-hole via and the pad.

This method requires a very small mechanical drill tocreate the necessary number of 144 or 176 vias for onepackage. Although this method is the least expensive, adisadvantage is that the vias go through the board,creating a matrix of vias on the bottom side of the board.

Figure 11. “Dog Bone Via” StructureCross-sectional view Top side view

Layer 1Layer 2Layer 3Layer 4Layer 5Layer 6

Advanced Design Methods

Another option is to use a combination of blind and buriedvias. Blind vias connect either the top or bottom side ofthe board to inner layers. Buried vias usually connectonly the inner layers. Figure 12 illustrates this methodusing 4-mil laser-drilled microvias in the center of thepads and burying the dog bone on layer 2.

Since the buried via does not extend through theunderside of the board, the designer can use another setof laser-drilled blind microvias, if needed, to connect thebypass capacitors and other discrete components to thebottom side.

More information on these advanced techniques isavailable by contacting your local TI field sales office.

Figure 12. Buried Vias

Solder wicks intoblind via filling void

Micro blind viasLayer 1Layer 2

Layer 3

Layer 4

Layer 5Layer 6

10-mil through-holeburied via

4-mil laser-drilled microvia may berequired to connect discretes onbottom side of board


2Reliability

Reliability


Daisy-Chained Units

Daisy-chained units are used to gain experience in thehandling and mounting of CSPs, for board-reliabilitytesting, to check PCB electrical layouts, and to confirmthe accuracy of the mounting equipment. To facilitatethis, Texas Instruments offers daisy-chained units in allproduction MicroStar BGA packages.

Each daisy-chained pinout differs slightly depending onpackage layout. An example is shown in Figure 13.Daisy-chained packages are wired to provide acontinuous path through the package for easy testing.TI issues a net list for each package, which correlateseach ball position with a corresponding wire pad number.The daisy-chained net list is a special case of the generalnet list shown in Figure 14. Package net lists anddaisy-chained net lists for all production packages areincluded in Appendix B.

A PCB layout for a 144-GGU daisy-chained package isshown in Figure 15. When a daisy-chained package isassembled on the PCB, a complete circuit is formed,which allows continuity testing. The circuit includes thesolder balls, the metal pattern on the die, the bond wires,and the PCB traces. The entire package or only aquadrant can be interconnected and tested. A diagramof the test configuration is shown in Figure 16.

Figure 13. Daisy-Chained Pinout List

100GGT Top View

Indexmark

1110

987654321

A B C D E F G H J K L

A1 – B2 L1 – K2 L11 – K10 A11 – B10B1 – C2 L2 – K3 K11 – J10 A10 – B9C1 – D2 L3 – K4 J11 – H10 A9 – B8D1 – E2 L4 – K5 G9 – G10 B7 – A7F3 – F2 J6 – K6 F9 – F10 C7 – C6E1 – F1 L5 – L6 G11 – F11 B6 – A6G1 – G2 L7 – L8 E11 – D11 B5 – A5G3 – H1 K7 – J7 E10 – E9 C5 – D4H2 – H3 K8 – J8 D10 – C11 A4 – B4H4 – J1 L9 – H8 D9 – D8 C4 – A3J2 – J3 K9 – J9 C10 – B11 B3 – C3K1 – J4 L10 – H9 C9 – C8 A2 – D3

NC – E3, J5, H11, A8

Reliability Data

Reliability is one of the first questions designers askabout any new packaging technology. They want to knowhow well the package will survive handling and assemblyoperation, and how long it will last on the board. Theelements of package reliability and system reliability,while related, focus on different material properties andcharacteristics and are tested by different methods.

Figure 14. General Net List

100GGT Top View

11

10

98

76

54

3

2

1

A B C D E F G H J K L

Indexmark

PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL#

1 – A1 26 – L1 51 – L11 76 – A112 – B2 27 – K2 52 – K10 77 – B103 – B1 28 – L2 53 – K11 78 – A104 – C2 29 – K3 54 – J10 79 – B95 – C1 30 – L3 55 – J11 80 – A96 – D2 31 – K4 56 – H10 81 – B87 – E3 32 – J5 57 – H11 82 – A88 – D1 33 – L4 58 – G9 83 – B79 – E2 34 – K5 59 – G10 84 – A710 – F3 35 – J6 60 – F9 85 – C711 – F2 36 – K6 61 – F10 86 – C612 – E1 37 – L5 62 – G11 87 – B613 – F1 38 – L6 63 – F11 88 – A614 – G1 39 – L7 64 – E11 89 – B515 – G2 40 – L8 65 – D11 90 – A516 – G3 41 – K7 66 – E10 91 – C517 – H1 42 – J7 67 – E9 92 – D418 – H2 43 – K8 68 – D10 93 – A419 – H3 44 – J8 69 – C11 94 – B420 – H4 45 – L9 70 – D9 95 – C421 – J1 46 – H8 71 – D8 96 – A322 – J2 47 – K9 72 – C10 97 – B323 – J3 48 – J9 73 – B11 98 – C324 – K1 49 – L10 74 – C9 99 – A225 – J4 50 – H9 75 – C8 100 – D3

Figure 15. PCB Layout for Daisy-Chained Unit

Reliability


Figure 16. Daisy-Chain Test Configuration

Wire bonds

Solderballs

PCB

Copper traces

MicroStar BGA

Test pads

Tester

Package reliability focuses on materials of construction,thermal flows, material adherence/delamination issues,resistance to high temperatures, moisture resistanceand ball/stitch bond reliability. Thorough engineering ofthe package is performed to prevent delaminationcaused by the interaction of the substrate material andthe mold compound.

TI subjects each MicroStar BGA to rigorous qualificationtesting before the package is released to production.These tests are summarized in Table 1. All samples usedin these tests are preconditioned according to JointElectronic Device Committee (JEDEC) A113 at variouslevels. Typical data is presented in Table 2. MicroStarBGA packages have proven robust and reliable.

Board-level reliability (BLR) issues generally focus onthe complex interaction of various materials under theinfluence of heat generated by the operation of electronicdevices. Not only is there a complex thermal situationcaused by multiple heat sources, but there are cyclicalstrains due to expansion mismatches, warping andtransient conditions, non-linear material properties, andsolder fatigue behavior influenced by geometry,metallurgy, stress relaxation phenomenon, and cycleconditions. In addition to material issues, board andpackage design can influence reliability. Thermalmanagement from a system level is critical for optimum

reliability, and thermal cycling tests are generally used topredict behavior and reliability. Many of these are usedin conjunction with solder fatigue life models using amodified Coffin-Manson strain range-fatigue life plots.

Table 1. Package-Level Reliability Tests †

Test Environments Conditions Read Points

HAST 85RH/85°C 600 hrs.

1000 hrs.

Autoclave 121°C, 15 psig 96 hrs.

240 hrs.

Temp. Cycle –55/125°C–65/150°C‡

500 cycles

750 cycles

1000 cycles

Thermal Shock –65/150°C‡–55/125°C

200 cycles

500 cycles

750 cycles

1000 cycles

HTOL 125°C, Op. voltage 500 hrs.

600 hrs.

1000 hrs.

HTOL‡ 140°C, Op. voltage 500 hrs.

HTOL‡ 155°C, Op. voltage 240 hrs.

Bake‡ 150°C

170°C

600 hrs.

1000 hrs.

420 hrs.

HAST‡ 130°C 96 hrs.

† All samples used in these tests are preconditioned according to JointElectronic Device Committee (JEDEC) A113 at various levels.

‡ Optional tests. One or more of them may be added to meet customerrequirements.

Table 2. Package-Level Reliability Test Results

Package Types

Leads 64 80 144 196

Body (mm) 8 x 8 10 x 10 12 x 12 15 x 15

Device MSP ASP DSP DSP

Die (mm) 5.3 x 5.8 7.5 x 7.5 9.3 x 9.5

Level 4 2 2a 4 3

Test Environment Failures/Sample Size

Autoclave (240 hrs.) 0/70 0/78 0/77 0/77 0/77

T/C, –55/125°C (1000 cycles) 0/116 0/78 0/77 0/77 0/76

T/S, –65/150°C (500 cycles)

(750 cycles)

(1000 cycles) 0/116

0/78

0/77

0/77 0/77

HAST,85°C/85%RH

(1000 hrs.)

(1250 hrs.) 0/115 0/77

0/78

150°C Storage (600 hrs.)

(1000 hrs.)

0/43

0/78

0/77 0/77 0/77

HTOL (1000 hrs.) 0/116

Reliability


In addition to device/package testing, board-levelreliability testing has been extensively performed on theMicroStar BGA packages. Various types ofdaisy-chained packages were assembled to specialboards shown in Figure 17. Electrical measurements

Figure 17. Board-Level Reliability Test Boards

TI-Houston test board

TI-HIJI test board

Board Material FR-4

Structure: Two externalmetal layersTraces: 1oz cu design rule100 µm (4 mils) width,100 µm (4 mils) spacePaste: Eutectic(SENJU 63-330F-21-10.5)Paste thickness: 0.15 µmBoard thickness: 31 mils

Reflow profile: 225°Cmax, time above 200°C is50 sec, time above 150°Cis 240 secScreen opening: matchland pad diameterPrecondition: Level 3

were made in the initial state and then at intervals aftertemperature cycles were run. The overall test conditionsare shown in Figure 18. A summary of a wide range ofboard-level reliability is shown in Table 3. This dataincludes testing by TI and by end manufacturers.

Table 4 summarizes conclusions from the testing. Twoimportant conclusions are that the PCB pad size needsto match the via size, and that solder paste is needed forattachment to give optimal reliability.

Reliability CalculationsAnother important aspect of predicting how a packagewill perform in any given application is reliabilitymodeling. Thermal, electrical, and thermomechanicalmodeling, verified by experimental results, provideinsight into system behavior, shorten package

Figure 18. Board-Level Reliability Test Data

5 minRamp time: 2 min–5 minDwell time: 11 min–13 min

Test condition: Open short @25°C, 10% resistancechange or 200 ΩSample size: Greater or equal to 32Temperature cycle range: –40°C to 125°CSampling rate: Every 100 cycles, up to first failure; every50 cycles thereafter up to 1000 cycles; every 100 cyclesbetween 1000 to 1500 cycles; every 250 cycles between1500 to 2500 cycles; Test stopping point min (2500 cycles,50% failures)

Table 3. Board-Level Reliability Summary

Failures/Sample Size

Conditions (With Solder Paste) Requirements Extended Range

TI Mfg Site Body Pitch Die Temp. 500 800 1000 1100 1200 1300 1500

Package Test Site (mm) (mm) (mm) Cycle ( °C) (Cycles) (Cycles)

GGU

144 balls

TI HIJI

TI HIJI

12 x 12 0.8 8.8 x 8.8 –40/125 0/85 0/85 0/85 4/85 5/77 5/72 15/39

GGU

144 balls

TI Philippines

TI HIJI

12 x 12 0.8 8.8 x 8.8 –40/125 0/36 0/36 0/36 0/36 0/36 0/36 1/35

GGF

100 balls

TI HIJI

TI HIJI

10 x 10 0.5 6.6 x 6.6 –25/125 0/32 0/32 0/32 0/32 0/32 0/16 6/16

GHC

196 balls

TI TIPI

TI Hou

15 x 15 1.0 8.8 x 8.8 –40/125 0/62 0/62 0/62 0/62 0/62 0/62 4/62

GGU

144 balls

TI Philippines

Customer A

12 x 12 0.8 8.8 x 8.8 –40/100 0/180 0/180 0/180 0/180 – – –

GGW

176 balls

TI HIJI

Customer B

15 x 15 0.8 6.6 x 6.6 –25/125 0/35 0/35 0/35 0/35 0/35 0/35 1/35

GGM

80 balls

TI HIJI

Customer C

10 x 10 0.8 5.0 x 5.0 –40/125 0/12 0/12 0/12 – – – 0/10

Reliability


Table 4. Summary of Significant BLRImprovements

Condition Improved BLR ⇒

Die size Larger ⇒ Smaller

Die edge Over balls ⇒ Within ball matrix

Ball count Smaller ⇒ Larger

Ball size Smaller ⇒ Larger

PCB pad size Over/undersized ⇒ Matches package via(for NSMD ~90% of via)

Solder paste None orinsufficient

⇒ Thickness 0.15 nom.(type matches reflow)

development time, predict system lifetimes, and providean important analytical tool. In applications such asBGAs, where the interconnections are made throughsolder balls, the useful life of the package is, in mostcases, dependent on the useful life of the solder itself.This is an area that has been studied extensively, andvery accurate models for predicting both solder behaviorand interpreting accelerated life testing exist.

The current methodology employed at TexasInstruments includes both extensive model refinementand constant experimental verification. For a givenpackage, a detailed 2D Finite Element Model (FEM) isconstructed. This model will be used to carry out 2D plainstrain elastoplastic analysis to predict areas of highstress. These models also account for the thermalvariation of material properties, such as Modulus ofElasticity, Coefficient of Thermal Expansion, andPoisson’s Ratio as a function of temperature. Theseallow the FEM to calculate the thermomechanical plasticstrains in the solder joints for a given thermal loading.

The combination of Finite Element Analysis (FEA),accurate thermal property information, and advancedstatistical methods allows prediction of the number ofcycles to failure for various probability levels. Using theassumption that cyclic fatigue lifetime follows a Weibulldistribution, various probability levels can be calculated.For these calculations, the Weibull shape parameterused is β = 4, which is based on experimental datacalibration. It is also consistent with availableexperimental data found in the literature for leadlesspackages. This then results in the following equation:

Nf(x%) = Nf(50%)[ln(1–0.01x)/ln(0.5)]1/β

Using this equation, and using the plastic strain εp incombination with the S-N curves, the data below is anexample of the accuracy possible with this method:

Sample Finite Element Simulation and LifePrediction:144 GGU @ T/C: –40/125°C

Model→ εp = 0.353% on the outmost joint→ Nf(50%)= 4434 cycles

→ Nf(1%) = 1539 cycles

BLR Testing→ –40/125°C (10 min/10 min) → Nf(1%) = 1657 cycles

Modeling is most useful in exploring changes inmaterials, designs and process parameters without theneed to build experimental units. For example, modelingwas used to study the effects of changes in boardthickness and pad size. Table 5 shows the simulatedeffects of pad size and board thickness on the fatigue lifeof a 144-GGU package.

Table 5. Effects of Pad Size and Board Thickness on Fatigue Life

Example1: Effects of pad size on fatigue life

• Package: 144 GGU• Die: 8.8 x 8.8 x 0.279 mm

Pad Dia.(mils)

PadStandoff

(mm)

SolderCenter Dia.

(mm)Plastic

Strain (%)

Nf (1%)(cycles to

failure) Difference• Die: 8.8 x 8.8 x 0.279 mm• Board: FR-4 board 52 mils thick 12 0.3847 0.4908 0.4400 998 0.88x

13 0.3689 0.4951 0.4127 1134 1

14 0.3523 0.5005 0.3908 1263 1.11x

15 0.3350 0.5060 0.3741 1377 1.21x

Example 2: Effects of board thickness on fatiguelife

• Package: 144 GGU

BoardThickness

(mils)Plastic

Strain (%)

Nf (1%)(cycles to

failure) Differenceg• Die: 8.8 x 8.8 x 0.279 mm• Board: FR-4

50 0.4095 1152 1• Board: FR-4• Pad Size: 13 mils 31 0.393 1249 1.08x

Reliability


Package CharacteristicsTexas Instruments has extensive packagecharacterization capabilities, including an electricalmeasurements lab with TDR/LRC (Time DomainReflectometer/inductance resistance capacitance) andnetwork analysis capabilities, a thermal measurementslab with JEDEC standard test conditions up to1000 watts, and extensive electrical, thermal, andmechanical modeling capability. Modeling wasimplemented at TI starting in 1984. Stress analysis isdone with the Ansys Analysis tool, which provides fulllinear, nonlinear, 2D and 3D capabilities for solderreliability, package warpage, and stress analysis studies.An internally developed tool (PACED) is used forelectrical modeling that gives 2.5D and full 3D capabilityfor LRC models, transmission lines, lossy dielectrics,and SPICE deck outputs. The thermal modeling tool wasalso internally developed (ThermCAL) and it providesfull 3D automatic mesh generation for most packages.

Figure 19. Thermal Modeling ProcessHeat-Transfer Paths

(TQFP shown for illustration purposes)

Model’s three heat-transfer mechanisms:– Conduction– Convection– Radiation

Method:– Define solid– Mesh solid– Solve large number of simultaneous equations relating

each defined mesh point to each other

Sources of error:– Convection coefficients– Material properties– Solid definition inaccuracies

Chip

PadPackage

PWB

Conduction Convection Radiation

Complex geometries, transient analysis, and anisotropicmaterials can be modeled with it. With these capabilities,a full range of modeling from device level through systemlevel can be provided. Package modeling is used topredict package performance at the design stage, toprovide a package development tool, to aid qualificationby similarity, and is used as a failure analysis tool.

Thermal Modeling

Figure 19 outlines the thermal modeling process. Datafor each package is included in Appendix B.

Electrical Modeling

Figure 20 outlines the electrical modeling process. Datafor each package is included in Appendix B.

Figure 20. Electrical Modeling Process

Vol

tage

(V

)

1

2

3

4

5

00 2.00E-09 4.00E-09

Time (sec)

Input pin 1Output pin1

Crosstalk pin 1

Calculates inductances,capacitances, resistances,transmission line characteristics ofpackage geometries

Uses as loads for circuit simulation

Process– Select solution algroithms for

problem domain– Identify package structures to be

modeled– Generate spice deck of package

parameters– Simulate impact on driver output

waveforms– Calculate ground/power bounce

DiePin 1Pin 2

PACED and ThermCAL are trademarks of Texas Instruments Incorporated.


3Surface-Mounting

MicroStar BGA Packages

Surface-Mounting MicroStar BGA Packages


Surface-mount technology (SMT) has evolved over thepast decade from an art into a science with thedevelopment of design guidelines and rules. While theseguidelines are specific enough to incorporate manyshared conclusions, they are general enough to allowflexibility in board layouts, solder pastes, stencils,fixturing, and reflow profiles. From experience, mostassembly operations have found MicroStar BGApackages to be robust, manufacturing-friendly packagesthat fit easily within existing processes and profiles. Inaddition, they do not require special handling. However,as ball pitch becomes smaller, layout methodology andplacement accuracy become more critical. Below is areview of the more important aspects ofsurface-mounted CSPs. The suggestions provided mayaid in efficient, cost-effective production.

Design for Manufacturability (DFM)

A well-designed board that follows the basicsurface-mount technology considerations greatlyimproves the cost, cycle time, and quality of the endproduct. Board design should comprehend theSMT-automated equipment used for assembly, includingminimum and maximum dimensional limits andplacement accuracy. Many board shapes can beaccommodated, but the front of the board should have astraight and square edge to help machine sensors detectit. While odd-shaped or small boards can be assembled,they require panelization or special tooling to processin-line. The more irregular the board—non-rectangularwith no cutouts—the more expensive the assembly cost.

Fiducials (the optical alignment targets that align themodule to the automated equipment) should allowvision-assisted equipment to accommodate the shrinkand stretch of the raw board during processing. Theyalso define the coordinate system for all automatedequipment, such as printing and pick-and-place. Thefollowing guidelines may be helpful:

• Automated equipment requires a minimum of twoand preferably three fiducials.

• A wide range of fiducial shapes and sizes can beused. Among the most useful is a circle 1.6 mm indiameter with an annulus of 3.175/3.71 mm. Theouter ring is optional, but no other feature may bewithin 0.76 mm of the fiducial.

• The most useful placement for the fiducials is anL configuration, which is orthogonal to optimize thestretch/shrink algorithms. When possible, thelower left fiducial should be the design origin(coordinate 0,0).

• All components should be within 101.6 mm of afiducial to guarantee placement accuracy. For largeboards or panels, a fourth fiducial should be added.

If the edges of the boards are to be used for conveyertransfer, a cleared zone of at least 3.17 mm should beallowed. Normally, the longest edges of the board areused for this purpose, and the actual width is dependenton equipment capability. While no component lands orfiducials can be in this area, breakaway tabs may be.

Interpackage spacing is a key aspect of DFM, and thequestion of how close you can safely put components toeach other is a critical one. The following componentlayout considerations are recommendations based on TIexperience:

• There should be a minimum of 0.508 mm betweenland areas of adjacent components to reduce the riskof shorting.

• The recommended minimum spacing between SMDdiscrete component bodies is equal to the height ofthe tallest component. This allows for a 45° solderingangle in case manual work is needed.

• Polarization symbols need to be provided fordiscrete SMDs (diodes, capacitors, etc.) next to thepositive pin.

• Pin-1 indicators or features are needed to determinethe keying of SMD components.

• Space between lands (under components) on thebackside discrete components should be a minimumof 0.33 mm. No open vias may be in this space.

• The direction of backside discretes for wave soldershould be perpendicular to the direction through thewave.

• Do not put SMT components on the bottom side thatexceed 200 grams per square inch of contact areawith the board.

• If space permits, symbolize all referencedesignators within the land pattern of the respectivecomponents.

• It is preferable to have all components oriented inwell-ordered columns and rows.

• Group similar components together wheneverpossible.

• Room for testing needs to be allowed.

Solder Paste

TI recommends the use of paste when mountingMicroStar BGAs. The use of paste offers the followingadvantages:

• It acts as a flux to aid wetting of the solder ball to thePCB land.

• The adhesive properties of the paste will hold thecomponent in place during reflow.



• It helps compensate for minor variations in theplanarity of the solder balls.

• Paste contributes to the final volume of solder in thejoint, and thus allows this volume to be varied to givean optimum joint.

Paste selection is normally driven by overall systemassembly requirements. In general, the “no clean”compositions are preferred due to the difficulty incleaning under the mounted component. Most assemblyoperations have found that no changes in existing pastesare required by the addition of MicroStar BGA, but dueto the large variety of board designs and tolerances, it isnot possible to say this will be true for any specificapplication.

Nearly as critical as paste selection is stencil design. Aproactive approach to stencil design can pay largedividends in assembly yields and lower costs. In general,MicroStar BGA packages are special cases of BGApackages, and the general design guidelines for BGApackage assembly applies to them as well. There aresome excellent papers on BGA assembly, so only a briefoverview of issues especially important to MicroStarBGA packages will be presented here.

The typical stencil hole diameter should be the same sizeas the land area, and 125- to 150-µm-thick stencils havebeen found to give the best results. Good release and aconsistent amount of solder paste and shapes arecritical, especially as ball pitches decrease. The use ofmetal squeegee blades, or at the very least, highdurometer polyblades, is important in achieving this.Paste viscosity and consistency during screening aresome variables that require close control.

Solder Ball Collapse

In order to produce the optimum solder joint, it isimportant to understand the amount of collapse of thesolder balls, and the overall shape of the joint. These area function of:

• The diameter of the package solder ball via.

• The volume and type of paste screened onto thePCB.

• The diameter of the PCB land.

• The board assembly reflow conditions.

• The weight of the package.

The original ball height on the package for a typical0.8-mm-pitch package is 0.40 mm. After the package ismounted, this typically drops to 0.35 mm, as illustrated inFigure 21.

Figure 21. Solder Ball Collapse

0.40 ± 0.05 mm

0.35 mm typical

PCB

(Not to scale)

PCB

Land on PCB

Controlling the collapse, and thus defining the packagestandoff, is critical to obtaining the optimum jointreliability. Generally, a larger standoff gives better solderjoint fatigue strength, but this should not be achieved byreducing the board land diameter. Reducing the landdiameter will increase the standoff, but will also reducethe minimum cross-section area of the joint. This, in turn,will increase the maximum shear force at the PCB sideof the solder joint. Thus, a reduction of land diameter willnormally result in a worse fatigue life, and should beavoided unless all the consequences are wellunderstood.

ReflowSolder reflow conditions are the next critical step in themounting process. During reflow, the solvent in thesolder paste evaporates, the flux cleans the metalsurfaces, the solder particles melt, wetting of thesurfaces takes place by wicking of molten solder, thesolder balls collapse, and finally solidification of thesolder into a strong metallurgical bond completes theprocess. The desired end result is a uniform solderstructure strongly bonded to both the PCB and thepackage with small or no voids and a smooth, even filletat both ends. Conversely, when all the steps do notcarefully fit together, voids, gaps, uneven joint thickness,discontinuities, and insufficient fillet can occur. While theexact cycle used depends on the reflow system andpaste composition, there are several key points allsuccessful cycles have in common.

The first of these is a warm-up period sufficient to safelyevaporate the solvent. This can be done with a pre-heator a bake, or, more commonly, a hold in the cycle atevaporation temperatures. If there is less solvent in thepaste (such as in a high-viscosity, high-metal-contentpaste), then the hold can be shorter. However, when thehold is not long enough to get all of the solvent out or toofast to allow it to evaporate, many negative thingshappen. These range from solder-particle splatter to



trapped gases, which can cause voids andembrittlement. A significant number of reliabilityproblems with solder joints can be solved with thewarm-up step, so it needs careful attention.

The second key point that successful reflow cycles havein common is uniform heating across the package andthe board. Uneven solder thickness and non-uniformsolder joints may be an indicator that the profile needsadjustment. There can also be a problem when differentsized components are reflowed at the same time. Careneeds to be taken when profiling an oven to be sure thatthe indicated temperatures are representative of whatthe most difficult to reflow parts are seeing. Theseproblems are more pronounced with some reflowmethods, such as infrared (IR) reflow, than with others,such as forced hot-air convection.

Finally, successful reflow cycles strike a balance amongtemperature, timing, and length of cycle. Mistiming maylead to excessive fluxing activation, oxidation, excessivevoiding, or even damage to the package. Heating thepaste too hot too fast before it melts can also dry thepaste, which leads to poor wetting. Processdevelopment is needed to optimize reflow profiles foreach solder paste/flux combination.

The profile shown in Figure 22 is an ideal one for use ina forced-air-convection furnace, which is the most highlyrecommended type. The best results have been found ina nitrogen atmosphere.

The guidelines upon which this profile is based, alsoshown in Figure 22, are general. Modification to the idealreflow profile will be driven by the interplay ofsolder-paste particle size and flux percentage withprocess variables such as heating rates, peaktemperatures, board construction factors andatmosphere. These modifications are dependent uponspecific applications.

It should be noted that while they are more rugged thanmost CSP-type packages, many MicroStar BGApackages are still slightly moisture-sensitive at the timeof printing of this Reference Guide. The time out of a dryenvironment should be controlled according to the labelon the packing material. This will prevent moistureabsorption problems with the package such as“popcorning,” or delamination.

Figure 22. Ideal Reflow Profile

Tem

pera

ture

(°C

)

0

100

200

300

0 100 200 300

Time (sec)

Ideal Reflow Profile

Note: This is an ideal profile, and actual conditions obtainedin any specific reflow oven will vary. This profile is basedon convection or RF plus forced convection heating.

RT to 140°C: 60–90 sec140°C to 180°C: 60–120 secTime above 183°C: 60–150 secPeak temperature: 220°C ± 5°CTime within 5°C peak temperature: 10–20 secRamp-down rate: 6°C/sec maximum

Other concerns with BGA packages are those caused bya PCB bowing or twisting during reflow. As PCBs getthinner, these problems will become more significant.Potential problems from these effects will show up asopen pins, hourglass solder joints, or solderdiscontinuities. Proper support of the PCB through thefurnace, balancing the tab attachments to a panel, and,in worst cases, using a weight to stiffen the PCB can helpprevent this. In general, the small size of CSPs createfewer problems than standard BGAs. It is also true thatBGAs generally have fewer problems than leadedcomponents.

InspectionMicroStar BGA packages have been designed to beconsistent with very high-yield assembly processes.Because of their relatively light weight, MicroStar BGApackages tend to self-align during reflow. Since the pitchof the ball pattern is large compared to that of fine-pitchleaded packages, solder bridging is rarely encountered.It is recommended that a high-quality solder jointassembly process be developed using the variousinspection and analytical techniques, such ascross-sectioning. Once a quality process has beendeveloped, detailed inspection should not be necessary.Visual methods, while obviously limited, can offervaluable clues to the general stability of the process.Electrical checks can confirm interconnection. Bothtransmission X-rays and laminographic X-rays haveproven to be useful nondestructive tools, if desired.


4Packing and Shipping

Packing and Shipping


MicroStar BGAs are shipped in either of two packingmethods:

• Trays

• Tape and reel

TraysThermally resistant plastic trays are currently used toship the majority of the packages. Each family of parts

with the same package outline has its own individuallydesigned tray. The trays are designed to be used withpick-and-place machines. Figure 23 gives typical traydetails, and Table 6 shows the number of units per tray.

Figure 24 shows the packing method used to ship trays.Before the trays are sealed in the aluminum-lined plasticbag, they are baked in accordance with the requirementsfor dry-packing at the appropriate level.

Figure 23. Shipping Tray Detail

Table 6. Number of Units per Shipping Tray

BodySize(mm) Package Code Matrix

Units/Tray

Units/Box

16 x 16 GZY, GHK 6 x 15 90 450

15 x 15 GGW,GHC 6 x 15 90 450

13 x 13 GHG, GHJ, GHV 8 x 20 160 800

12 x 12 GZG, GGB 8 x 20 160 800

11 x 11 GGT 8 x 20 160 800

10 x 10 GGF, GHZ, GGM 8 x 25 200 1000

8 x 8 GGV, GJJ 9 x 25 225 1125

9 x 13 GFZ, GHB, GHN 10 x 18 180 900



Figure 24. Packing Method for Trays1. Arrange the stack of trays to be packed with a tray pad on top and

bottom.

Traypad

Traystack

Traypad

2. Strap the tray stack and pads together with four straps—threecrosswise and one lengthwise. Then place the desiccants and thehumidity indicator on top.

Desiccantpacks

Humidityindicator

3. Place the lot inside the aluminum-lined bag and vacuum-seal it.Place the necessary labels on the sealed bag.

Aluminum-linedbag

Moisture-sensitivity label

ESDlabel

Bar-codelabel

4. Wrap and tape bubble pack around the bag for a snug fit in the innercarton. Place the necessary labels on the inner carton.

Bar-codelabel

ESDlabel

5. Add bubble pack around the inner carton for a snug fit in theskidboard liner.

6. Place four foam corner spacers on the folded skidboard liner beforeplacing it in the outer carton. An enhanced skidboard liner, whicheliminates the need for foam corner spacers, may be used. Sealouter carton and apply necessary labels.



Tape-and-Reel Packing MethodThe embossed tape-and-reel method is generallypreferred by automatic pick-and-place machines. Thiswill be the standard way MicroStar BGA packages will beshipped. Trays will remain an option for those customerswho prefer them. The tape is made from anantistatic/conductive material. The cover tape, whichpeels back during use, is heat-sealed to the carrier tapeto keep the devices in their cavities during shipping andhandling. The tape-and-reel packaging used by TexasInstruments is in full compliance with EIAStandard 481-A, “Taping of Surface-Mount Componentsfor Automatic Placement.” The static-inhibiting materialsused in the carrier-tape manufacturing provides device

protection from static damage, while the rigid, dust-freepolystyrene reels provide mechanical protection andclean-room compatibility with dereeling equipmentcurrently available on most high-speed automatedplacement systems.

Tape Format

Typical tape format is shown in Figure 25. The variablesused in Figure 25 and Table 7 are defined as follows:W is the tape width; P is the pocket pitch; A0 is the pocketwidth; B0 is the pocket length; K0 is the pocket depth; K isthe maximum tape depth; and F is the distance betweenthe drive hole and the centerline of the pocket.

Figure 25. Single Sprocket Tape Dimensions

1.75 ± 0.1

B0

P

4.0 ± 0.10

2.00 ± 0.050.8 MIN

P

K

0.40

F

W

0 MIN K0

Covertape

Carrier tapeembossment

1.5 MINDiameter

A0

Notes: A. Tape widths are 16 and 24 mm.B. Camber per EIA Standard 481-AC. Minimum bending radius per

EIA Standard 481-AD. All linear dimensions are in millimeters.

Direction

of feed

1.5+ 0.1– 0.0

Table 7. Tape Dimensions †

Tape Width(W)

Pocket Pitch(P)

Pocket Width(A0)

Pocket Length(B0)

Pocket Depth(K0)

Max. TapeDepth (K)

Centerline toDrive Hole (F)

PackageSize

16 12 8.2 8.2 1.7 2.0 7.5 8 x 8

24 16 10.2 10.2 1.7 2.0 11.5 10 x 10

24 16 11.35 11.35 1.9 2.2 11.5 11 x 11

24 16 12.4 12.4 1.9 2.2 11.5 12 x 12

24 20 15.25 15.25 2.2 2.5 11.5 15 x 15

† All dimensions are in millimeters.



Figure 26. Reel Dimensions

N is the diameter of the reel hub.

330+ 0.0– 4.0

20.2 MIN

2.5 MIN

TI bar code label1.5 MIN widthNote A: All linear dimensions are in millimeters.

T MAX

N

13.0 ± 0.2

G

Table 8. Reel Dimensions †

TapeWidth

(G)

Reel HubDiameter

(N)

Reel TotalThickness(T MAX)

Parts perReel

16 100 28 1000

24 100 28 1000

† All dimensions are in millimeters.

The reels are shown in Figure 26. In this figure, G is thewidth of the tape, N is the diameter of the hub, and T isthe total reel thickness.

After the parts are loaded into the reel, each individualreel is packed in its own “pizza” box for shipping, asshown in Figure 27.

Figure 27. Tape-and-Reel Packing

Desiccant

Humidityindicator

Reeled units

Aluminumbag

Pizza box

Bar code

ESD label

Device Insertion

Devices are inserted toward the outer periphery of thetape by placing the side with the device name face up andthe side with the balls attached face down. The pin-1indicator is placed in the top right-hand corner of thepocket, next to the sprocket holes.

Packaging Method

For reels, once the taping has been completed, the endof the leader is fixed onto the reel with tape. The productname, lot number, quantity, and date code are recordedon the reel and the cardboard box used for tape delivery.Each reel is separately packed in a cardboard box fordelivery.

Trays are packed with five loaded trays and one emptytray on top for support and to keep packages secure. Thestack is secured with stable plastic straps and sealed ina moisture-proof bag.

Customer-specific bar code labels can be added underrequest or general purchasing specification.

Moisture-sensitive packages are baked before packingand are packed within 8 hours of coming out of the oven.Both the tape-and-reel and the tray moisture-proof bagsare sealed and marked with appropriate labeling warningthat the packages inside the bags are dry-packed andgiving the level of moisture sensitivity.


5Sockets

Sockets


The Design ChallengeThe fine pitch of MicroStar BGA packages makessocketing a special challenge. Mechanical, thermal, andelectrical issues must be accommodated by the socketdesigner. CSP packaging is at the cutting edge ofpackage design and it appears that it is being adoptedfaster than any other previous package technology.Standards are only now beginning to be established. TIfully supports these efforts, and all MicroStar BGAoutlines are being engineered to fit within JEDECstandards where they exist. For instance, all0.8-mm-pitch packages fit within JEDEC MO205. Whilethese standards detail the pitch and I/O placement, theydo allow wide latitude for overall body size variation. Thesize of a specific package within the TI MicroStar BGAfamily is based on the package construction, and isindependent of die size. Thus, a range of die sizes andI/Os within a family will have the same packagedimensions. Each different family has a specific I/O pitchand array. For maximum socket versatility, an adapter or“personalizer” can be customized for each application,allowing a single-socket body to be used with manypackages. This feature is especially useful in the earlydays as the technology is being developed and adoptedand the total volume required is small.

Contacting the BallA number of different approaches for contacting the sol-der ball are shown schematically in Figure 28. The pinchstyle contact has been used extensively for contactingsolder balls in conventional BGAs. A benefit of the pinchstyle is that the socket does not have to push down on thepackage to provide the necessary contact force to pene-trate the oxide film on the solder balls. The issues in utiliz-ing this approach for pitches below 1.27 mm involve:

1. Miniaturizing the contact

2. Developing injection-molding tooling for the pitch

3. Developing cost-effective manufacturing proce-dures for handling and assembling the fragile con-tact

For pitches of 0.75 mm and above, Texas Instrumentshas designed a pinch contact that satisfies all of theserequirements. Further information on the availability ofthese sockets can be obtained from your local TI FieldSales representative.

The contact is designed to grip the solder ball with apinching action. This not only provides electrical contactto the solder ball but also helps retain the package in thesocket. The contact is shown in Figure 29. The contactis stamped and formed from a 0.12-mm-thick strip ofCDA 172, the high-yield-strength beryllium copper alloy.This alloy is used for spring applications that are exposedto high stresses and temperatures because of itsexcellent stress relaxation performance and formability.

Figure 28. Approaches for Contacting the SolderBall

a) Metal pinch b) Metal “Y”

c) Rough bump on flex d) Conductive

e) Etched pocket in silicon f) Metal

Figure 29. Pinch Contact for Solder Balls

Each contact incorporates two beams that provide anoxide-piercing interface with the sides of the balls abovethe central area—the equator. Since the contact is abovethe equator, the resultant force is downward and ensurespackage retention in the socket. No contact is made on

Sockets


the bottom of the solder ball and the original packageplanarity specifications are unchanged. A photo-micrograph of the contact touching the solder balls isshown in Figure 30.

Figure 30. Contact Area on Solder Ball

The witness marks left on the solder ball from the contactare shown in Figure 31. This ball was contacted at roomtemperature and it is clear that there was no damage tothe bottom of the ball or any witness marks from thecontact above the equator.

The effect of burn-in on the probe marks was examinedby simulating a cycle and placing a loaded socket into anoven at 125°C for 9 hours. The result is shown inFigure 32. The penetration of the contact into the solderball due to the higher temperature is greater but is wellwithin the acceptable range. There was no visible pickupof solder on the contact tips. This experiment is beingcontinued to evaluate the impact of longer times on thewitness marks and the solder pickup. The location of thecontact pinch is clearly seen in this photograph.

Figure 31. Witness Marks on Solder Ball

Figure 32. Effect of Burn-in on Probe Marks

Establishing Contact ForceContact force is typically generated as a result of thedeflection of the contact arm. The actual force generatedis a function of the modulus of the material and thespecific geometric details of the design. The solder balldiameters for CSPs tend to be small—in the range of0.25 mm to 0.4 mm, which limits the deflection of thecontact arm to a very small distance. Typically, thisdistance is half the ball diameter. This presents achallenge to the designer who must generate therequired 15 grams of force at the contact tip, yet keep thebending stresses within the contact arms at a low enoughvalue to achieve a 20K-cycle life. The contact forcerequirements are met by incorporating a pre-load, so thateven for small displacements, the desired force isachieved and the socket can operate within acceptablestress levels.

The 15-gram target force is smaller than that associatedwith TSOP-type contact force levels, which require a30-gram minimum. However, based on the contact tipgeometry, this lower force translates to contactpressures that are high enough to achieve oxidepenetration and good electrical continuity.

Conclusions and Future WorkThe importance of continuing the development to0.5-mm pitch is clear. End users want more and moreelectronic functionality in smaller and smaller packages.Sockets for testing these fine pitches are available todaybut are specialty and are considered too expensive forbroad commercial application. Continued developmentincludes innovative approaches as well as refiningpresent methods, but at the time of the preparation of thisReference Guide, a clear-cut favorite technology had notemerged. For current progress in this and other areas of0.5-mm-pitch technology, your local TI Field Salesrepresentative can give you up-to-date information.

Sockets


Growth rates as high as 400% for CSPs in 1998 overthose in 1997 have been forecasted. The opportunity toparticipate in a market with this growth has provided theincentive for the socket companies to develop solutionsfor the infrastructure needed for burn-in test sockets. Theissues of contacting the small, soft solder balls on CSPshave been solved. The price disparity between CSPsockets and TSOP sockets is to be expected during the

early days of the introduction of a new technology and isdue entirely to the embryonic state of the industry and thelow volume. It is believed that once this packagingtechnology matures and volumes increase to those ofconventional burn-in sockets, then the prices for socketsfor CSPs will decrease and be more in line with othercommercial sockets.


6Lead-Free Solutions

Lead-Free Solutions


Environmental concerns are driving the need forlead-free solutions to electronic components andsystems. Texas Instruments (TI) has been a leader inworking with our customers to provide them withproducts which meet their specific needs. The firstpractical lead-free alternative was the Nickel/Palladium(Ni/Pd) finish introduced by TI in 1989. Since then, morethan 30 billion lead-free Ni/Pd components have beensupplied. Texas Instruments continues to be active in thisfield, working with other manufacturers to evaluate otherlead-free finishes to understand their manufacturabilityand reliability.

Continuing this position of leadership, TI has introduceda lead-free solder ball option for the MicroStar BGApackages. Texas Instruments is also evaluatinglead-free solder ball applications for other area arraypackages. In conjunction with this effort, TI is an activeparticipant in the industry-wide effort to evaluate

lead-free solder alloys and lead-free printing wiringboard finishes. Several of the lead-free systems beingproposed require a maximum reflow temperature higherthan that needed with the Sn/Pb systems, so packageand system reliability data must be developed. Securingthe required Board Level Reliability (BLR) under variouscustomer conditions depends on many factors: solderball composition, solder paste, PCB design, land finishand reflow conditions.

The composition TI has selected for lead-free MicroStarBGA packages is an Sn-Ag-Cu alloy. Reliability datapresented in Table 9 shows it to be a robust performer,equivalent to the Sn/Pb eutectic balls it replaces.Extensive assembly testing has shown it to be virtuallyindistinguishable from Sn/Pb eutectic ball performancein current systems and superior in high temperature,lead-free systems. Figure 33 shows a summary of thesetests.

Table 9. Component Reliability Testing and BLR for Pb-free Solder Balls

TEST VEHICLE: 64GGV:D76563GGV 257GJG:F712521GJG 257GHK:F722500AGHK

BODY SIZE: 8 mmsq 16 mmsq 16 mmsq

CHIP SIZE: 230 x 225 mil 407 x 407 mil 312 x 312 mil

TEST ITEM CRITERIA TEST RESULTS

PRECON (LEVEL3) 0/All sample 64GGV:0/330, 257GJG:0/330, 257GHK:0/84

(Condition: 125°C 24h Bake → 30°C/60% 192h Soak → IRR peak255–260x3time → Elec. test)

THB (85oC/85%, 3.6 V) 0/77/600h 257GHK:0/78/1000h,

STRG (150oC) 0/77/600h 64GGV:0/78/1000h, 257GJG:0/78/1000h

T/C (–55/+125oC) 0/77/1000cy 64GGV:0/78/1000cy, 257GJG:0/78/1000cy

T/S (–55/+125oC) 0/77/200cy 64GGV:0/78/1000cy, 257GJG:0/78/1000cy

PCT 0/77/96h 64GGV:0/78/240h, 257GJG:0/78/240h

BLR (–40/+125oC) 0/77/1000cy 64GGV:0/96/1000cy, 257GJG:0/96/1000cy

(Solder paste for PCB mount: Sn/2.5Ag/1Bi/0.5Cu)

Lead-Free Solutions


Figure 33. Assembly Testing of Eutectic vs. Pb-free Solder Balls

Sn/Pb Ball

Sn/Pb Ball

Sn/Pb Paste

Sn/Pb Paste

Current Goal

TransitionPeriod

Not recommended

230oC reflow

Because IRR peak temperatureis not good enough for makingconsistent solder joint

Pb-free Paste250oC reflow

Pb-free Ball

230oC reflow

Pb-free BallPb-free Paste

250oC reflow

The higher reflow temperatures required with thelead-free solders present challenges in two areas: BLRand component moisture sensitivity testing. Arepresentative standard reflow profile for Sn/Pb eutecticsolder is shown in Figure 34. The 235°C peak representsthe highest recommended peak for current package

moisture levels. The new alloys will require a peaktemperature well in excess of even the 235°C shown.While the exact temperature requirements are not wellestablished, the profile shown in Figure 35 representsthe cycle TI recommends for preconditioning and othernon-Pb evaluation studies.

Figure 34. Standard Reflow Profile for Pb/Sn Alloy Solder

Recommended Reflow ProfileIn the case of Sn/Pb eutectic solder paste

140

160

235

200

Reflow temperature is defined at package top.time

Peak Temperature235oC Max < 10 sec

1–5oC/sec

90 +/– 30 sec

30 – 60 sec

oC

Lead-Free Solutions


Figure 35. Example Reflow Profile for Non-Pb Alloy Solder Evaluation/Preconditioning

0.0

50.0

100.0

150.0

200.0

250.0

300.0

Texas Instruments Recommended 260 oC Reflow Profile

Reflow temperature is defined at package top.

Tem

pera

ture

(°C

)

Time (seconds)

0 20 40 60 80 100 120120 140 160 180 200 220 240 260 280 300 320 340 360 380 400

Moisture Sensitivity

A drop of 2+ levels in moisture sensitivity (as perJ-STD-20) has been indicated for several package typeswith the peak temperature of 260°C. Extensive testing ofMicroStar BGA packages has shown they are capable ofresisting the 260°C cycles without an impact on themoisture sensitivity classification. Data shown inTable 10 shows several package and die sizes. TheScanning Acoustic Microscope (SAM) picture inFigure 36 is typical of the results obtained.

Table 10. Moisture Sensitivity Test Results

Evaluation flow: 30°C/60%/192hr Soak (JEDEC level 3)+ IRR × 3 times

Pkg.Type

Pkg.Size(mm)

ChipSize(mm)

260oC Chip SurfaceDelamination

GGV64 8 × 8 5 × 5 0/24 (8 × 3 lot)

GGM100 10 × 10 7.5 × 7.5 0/24 (8 × 3 lot)

GGB128 12 × 12 9 × 9 0/24 (8 × 3 lot)

GJG257 16 × 16 10 × 10 0/24 (8 × 3 lot)

Lead-Free Solutions


Figure 36. Typical SAM Pictures After MoistureSensitivity Testing

SAM picture

Package: GJG257 (16×16 mm)Chip: 10 x 10 mmMSL:L3IRR peak temperature: 256.4°C

Evaluation flow: 30°C/60%/192hr Soak + IRR × 3 times

Board Land Finishes and Solder PasteAny study of BLR must take into account the manychoices available to the PCB manufacturer. There are atleast two main board land finishes and many candidatesfor the solder paste. The board finishes are generally anorganic protective layer over bare copper or an Ni plateprotected with Au flash. The organic finishes areformulated to protect the bare copper from oxidation butto burn off early enough in the reflow cycle so they do notinterfere with the soldering. The various lead-free solderpaste candidates are generally tin-based with variousmetals added as alloying compounds. TexasInstruments conducted a series of tests with two of thesenewer solder paste over both types of board finishes.Lead-free balls on the packages were used. As a control,the present near-eutectic solder balls were used. Thesolder paste compositions used are listed in Table 11.

Table 11. Solder Paste Compositions

SolderSolidusTemp

LiquidusTemp

Metal Composition (wt%)Reflow

Peak forSoldering

SolderPaste

Temp(oC)

Temp(oC) Sn Pb Ag Bi Cu

SolderingEvaluation

(oC)

Eutectic(ref.)

183 183 63 37 – – – 230

Pb-free-1 216 220 95.75 – 3.5 – 0.75 250

Pb-free-2 205 220 94.25 – 2 3 0.75 250

The results on 0.8-mm-pitch MicroStar BGA are shownin Figure 37, Figure 38, and Figure 39. Figure 37 showsthat for the current Sn/Pb solders, there is virtually nodifference in performance between the lead-bearing andthe lead-free ball compositions. However, as the new,lead-free solders are introduced, the lead-free ballsdelay the onset of failure, usually by a significant amount.Failure does tend to be on a steeper slope, and furtherwork is being done to explain this phenomenon. Ofadditional interest, in each case, the pure copper wassuperior to the gold-bearing surface. In the case of theleaded solders, this is expected due to the well-knownembrittlement of lead by gold. In the lead-free systems,not as much detailed analysis has been done and nodetailed explanation exists.

Lead-Free Solutions


Figure 37. Board-Level Reliability Study(Solder Paste: Sn/Pb Eutectic)

99%

90%80%70%60%50%40%30%

20%

10%

1%100 1000 10000

cycles

1%

10%

20%

30%40%50%60%70%80%90%

99%

100 1000 10000cycles

PCB land : Cu bare

PCB land : Au/Ni finish

Package: 12 × 12 mm body, 144i/o, 0.8 mm ball pitchChip: 6-mmsq daisy-chain test chip,PCB: FR-4 25 × 30 × 0.8 mmtSolder paste: Sn/Pb eutectic, Reflow temp: max 230°CTest condition: –40/ +125°C, 10/10 min

Cum

ulat

ive

Pro

babi

lity

Cum

ulat

ive

Pro

babi

lity

Pb-freesolder ball

Standardsolder ball

Standardsolder ball Pb-free

solder ball

Figure 38. Board-Level Reliability Study(Solder Paste: Pb-free-1)

99%

90%80%70%60%50%40%30%

20%

10%

1%

100 1000 10000cycles

PCB land : Cu bare

PCB land : Au/Ni finish99%

90%80%70%60%50%40%30%

20%

10%

1%

100 1000 10000cycles

Cum

ulat

ive

Pro

babi

lity

Cum

ulat

ive

Pro

babi

lity

Pb-freesolder ball

Standardsolder ball

Standardsolder ball

Pb-freesolder ball

Package: 12 × 12 mm body, 144i/o, 0.8 mm ball pitchChip: 6-mmsq daisy-chain test chip,PCB: FR-4 25 × 30 × 0.8 mmtSolder paste: Pb-free-1 (Sn/Ag/Cu), Reflow temp: max 250°CTest condition: –40/ +125°C, 10/10 min

Lead-Free Solutions


Figure 39. Board-Level Reliability Study(Solder Paste: Pb-free-2)

99%

90%80%70%60%50%40%30%20%

10%

1%

100 1000 10000cycles

PCB land : Cu bare

PCB land : Au/Ni finish99%

90%80%70%60%50%40%30%

20%

10%

1%

100 1000 10000

cycles

Cum

ulat

ive

Pro

babi

lity

Cum

ulat

ive

Pro

babi

lity

Package: 12 × 12 mm body, 144i/o, 0.8 mm ball pitchChip: 6-mmsq daisy-chain test chip,PCB: FR-4 25 × 30 × 0.8 mmtSolder paste: Pb-free-2 (Sn/Ag/Cu/Bi), Reflow temp: max 250°CTest condition: –40/ +125°C, 10/10 min

Pb-freesolder ball

Standardsolder ball

Pb-freesolder ball

Standardsolder ball

For many applications, such as wireless phones,electrical reliability after repeated mechanicaldisplacements is a critical parameter. This is commonlymeasured with a Key Push Test, shown in Figure 40. Anevaluation board with a daisy-chained package mountedto it is continually cycled by a load cell. The load is appliedfrom the PCB backside at a constant stain of1300 microstrain through a distance of 3.5 mm at aconstant frequency. Electrical resistivity is continuouslymonitored and when it reaches 1.2 times the initial value,the test is terminated. A typical test pattern is seen inFigure 41. While there are no specific industry-widelimits for this test, Texas Instruments has determined that20k cycles for 0.8-mm-pitch packages and 10k cyclesfor 0.5-mm-pitch packages represent acceptableguidelines. Typical results for MicroStar packages areshown in Figure 42 .

Lead-Free Solutions


Figure 40. Key Push Test Apparatus

Load cell

90 mmOffset push

1300 microstrain at B/D near package corner

100 cyc/min > 20 kcyc (for 0.8-mm pitch)

> 10 kcyc (for 0.5-mm pitch)

120 × 30 × 0.8 mm FR-4

Figure 41. Typical Key Push Test Results

1.40E+01

1.45E+01

1.50E+01

1.55E+01

1.60E+01

1.65E+01

1.70E+01

1.75E+01

1.80E+01

1.85E+01

1.90E+01

1.95E+01

1 223 445 667 889 1111 1333 1555 1777 1999 2221 2443 2665 2887 3109 3331 3553 3775 3997 4219 4441 4663 4885

Key push cycle

Test Termination Criteria: Resistance is 1.2X from initial.

Res

ista

nce

(Ω)

Lead-Free Solutions


Figure 42. Key Push Test Performance

0

10000

20000

30000

40000

50000

60000

70000

80000

90000

0 1 2 3 4 5 6 7

Average

Minimum

Maximum

Key Push Test Performance :GHZ151 (0.5mmP)

Ball Sn/Pb system Pb-free system

PCB Au/Ni

Solder paste Sn/Pb/0.4Ag Sn/2.5Ag/1Bi/0.5Cu

OSP Au/Ni OSP Au/Ni OSP

N=4

Key

Pus

h C

ycle

(cy

c)

Summary• Lead-free MicroStar BGAs showed feasible BLR

performance with Sn/Ag/Cu and Sn/Ag/Cu/Bi solder

paste. The Pb-free balls performed better withnon-Pb-containing solder paste in 0.8-mm-pitchapplications.

• Evaluation samples with daisy-chained chips arealready available.

• Individual customer requirements may need specificBLR evaluation to ensure compliance. Key factorsinclude:– PCB specification– Solder paste– Single-side mount or double-side mount?– Reflow condition– Package location on PCB– Storage condition (environment for board

mount)– Criteria of requirement (BLR, mechanical

performance)– Other

New packages are being added to the list of MicroStarBGAs available in the Pb-free version every day. Contactyour local Field Sales representative for the current listof available packages along with qualification noticesand reliability data.

Lead-Free Solutions



7References

References


K. Ano et al., “MicroStar BGAs,” Application Note,TI SCJ 2328, July 1998.

Gerald Capwell, “High Density Design with MicroStarBGAs,” Texas Instruments Application Note, July 1998.

James Forster, “Performance Drivers for Fine Pitch BGASockets,” Chip Scale Processing, June 1998.

Kevin Lyne, “Chip Scale Packaging From TexasInstruments: MicroStar BGA,” Texas InstrumentsApplication Note, June 1997.

Gary Morrison, Les Stark, Ron Azcarte, S. Capistrano,K. Ano, K. Murata, M. Watanabe, T. Ohuchida,Y. Takahashi, Greg Ryan, “MicroStar BGA Packaging:Critical Interconnections,” SEMICON ’98.

Les Stark and M’hamed Idnabdeljalil, “MicroStar BGAvs. FC-CSP: Finite Element Simulation of BLRPerformance: 144GGF Footprint,” Texas InstrumentsApplication Note, August 1998.

A–1MicroStar BGA Packaging Reference Guide

Appendix

AFrequently Asked Questions

Package QuestionsQ. Do the solder balls come off during shipping?

A. No, this has never been observed. The balls are100% inspected for coplanarity, diameter, and otherphysical properties prior to packing for shipment.Because solder is used during the ball-attachmentprocess, uniformly high ball-attachment strengthsare developed. Also, the ball-attachment strength ismonitored frequently in the assembly process toprevent ball loss from vibration and other shippingforces.

Q. Is package repair possible? Are tools available?

A. Yes, some limited package repair is possible, andthere are some semiautomatic M/C tools available.However, TI does not guarantee the reliability ofrepaired packages.

Q. What are the leads that appear on the packageedge for? Are they connected to the innerpattern?

A. Those leads are used for plating connections duringthe plating of Ni/Au on the copper trace during thefabrication of the substrate. Since they do haveelectrical connection with the inner pattern, they canbe used for test probing and signal analysis. Thereis no reliability risk with them.

Q. What is the composition and melting point of thesolder balls?

A. The balls are a near-Sn/Pb eutectic solder thatincludes some additives to improve thermal fatiguelife. The liquidus temperature is 178°C to 210°C.

Q. Is burn-in testing possible? How about balldamage?

A. There are commercial sockets available for1.00-mm and 0.8-mm pitch package burn-in.Sockets for 0.5-mm pitch packages are nowbecoming available. Vendors include TexasInstruments, Yamaichi, Wells and Enplas. The balldamage observed falls within specified tolerances,so the testing does not affect board mount.

Q. Is tape-and-reel shipping available?

A. Tape-and-reel is the preferred method for shippingMicroStar BGA packages. Tray shipping methodsare available upon customer request.

Q. What about actual market experience?

A. Since TI started production in May of 1996, well over70 million units have been shipped. End products areprimarily DSP Solutions such as wireless phonesand digital camcorders where MicroStar BGA cancreate significant space savings. Technologiesavailable in MicroStar BGAs include DSP, ASIC,Mixed Signal, and Linear devices.

Q. How does the packaging cost compare to QFPs?

A. CSPs are in many ways an ideal solution to costreduction and miniaturization requirements. Theyoffer enormous area reductions in comparison toQFPs and have increasing potential to do so withoutadding to system-level costs. In the best case, CSPscompete today on a cost-per-terminal basis withQFPs. For example, various CSPs from TexasInstruments are now available at cost parity with thinQFPs.

Frequently Asked Questions

A–2MicroStar BGA Packaging Reference Guide

Assembly QuestionsQ. What alignment accuracy is possible?

A. Alignment accuracy for the 0.8-mm-pitch package isdependent upon board-level pad tolerance,placement accuracy, and solder ball positiontolerance. Nominal ball position tolerances arespecified at ±80 µm. These packages areself-aligning during solder reflow, so final alignmentaccuracy may be better than placement accuracy.

Q. Can the solder joints be inspected after reflow?

A. Process yields of 5-ppm (parts per million) rejectsare typically seen, so no final in-line inspection isrequired. Some customers are achievingsatisfactory results during process set-up withlamographic X-ray techniques.

Q. How do the board assembly yields of MicroStarBGAs compare to QFPs?

A. Many customers are initially concerned aboutassembly yields. However, once they had MicroStarBGAs in production, most of them report improvedprocess yields compared to QFPs. This is due to theelimination of bent and misoriented leads, the widerterminal pitch than with 0.5-mm-pitch QFPs, and theability of these packages to self-align during reflow.The collapsing solder balls also mean that thecoplanarity is improved over leaded components.

Q. Are there specific recommendations for SMTprocessing?

A. Texas Instruments recommends alignment with thesolder balls for the CSP package, although it ispossible to use the package outline for alignment.Most customers have found they do not need tochange their reflow profile.

Q. Can the boards be repaired?

A. Yes, there are rework and repair tools and profilesavailable. We strongly recommend that removedpackages be discarded.

Q. Is TI developing a lead-free version of MicroStarBGAs?

A. Yes, Texas Instruments is working towardeliminating lead in the solder balls to comply withlead-free environmental policies. The lead-freesolder is in final evaluation. Only the solder willchange, not the package structure or the mechanicaldimensions. The solder system under developmentis based on Sn-Ag metallurgy. Check with your localTI Field Sales representative for sample availability.

Q. What size land diameter for these packagesshould I design on my board?

A. Land size is the key to board-level reliability, andTexas Instruments strongly recommends followingthe design rules included in this bulletin.

B–1MicroStar BGA Packaging Reference Guide

Appendix

BPackage Data Sheets

Figure 43 shows TI’s strategic package lineup, followedby the package data sheets for the package familiesoffered as standard products by Texas Instruments. Asnew packages are added, they will be placed on the

strategic package lineup. Contact your TI field salesoffice for information on the most current offerings.Samples are available for all packages shown inFigure 43.

Figure 43. TI’s Strategic Package Line-Up

MicroStar BGA Package Product GuideStrategic Package Lineup: HIJI and Philippines

PITCH (mm) PACKAGE SIZE (mm)

6 × 6 8 × 8 10 × 10

0.5

GJK 80

Qual: 4Q 99

GJJ 167

Qual: 4Q 99

GHZ 151

Qual: Complete

GGF 100

Qual: Complete

8 × 8 10 × 10 12 × 12 15 × 15 16 × 16

0.8

GGV 64

Qual: Complete

GGM 80

Qual: Complete

GGU 144

Qual: Complete

GGW 176

Qual: Complete

1.0 mm PITCHGHC 196

Qual: Complete

GHK 257

Qual: Complete

11 × 11GGM 100 GHH 179 GGW 208 GGW 240 GJG 257

GGT 100

Qual: Complete

GGM 100

Qual: Complete

GHH 179

Qual: Complete

GGW 208

Qual: Complete

GGW 240

Qual: Complete

GJG 257

Qual: Complete

Package Data Sheets


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GJK (S-PBGA-N80) PLASTIC BALL GRID ARRAY

NOTES: A. All linear dimensions are in millimeters.B. This drawing is subject to change without notice.C. MicroStar BGA configuration

MicroStar BGA is a trademark of Texas Instruments.

GJK 80 TOP VIEW DAISY CHAIN NET LIST

H5–H6H7–H8G8–F8E8–D8C8–B8B7–B6

B3–C3D3–E3F3–G3

G4–G5G6–G7F7–E7D7–C7C6–C5C4–D4E4–F4F5–F6E6–D6D5–E5

B5–B4

D E JF G H

INDEXMARK

3

1

2

4

5

BA

8

6

7

9

B1–C1D1–E1F1–G1H1–J1J2–J3J4–J5J6–J7J8–J9H9–G9

A8–A7A6–A5A4–A3A2–B2C2–D2E2–F2G2–H2H3–H4F9–E9

D9–C9B9–A9

C

GJK 80 PIN ASSIGNMENT NET LIST

PIN# BALL#1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

C2

B1

D3

E4

C1

D2

E3

D1

E2

F1

F2

G3

G1

G2

H2

H1

J1

H3

J2

G4

F5

J325

27

26

24

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

H4

J4

H5

F6J5

G6

J6

H6

G7

J7

H7

H8

J8

J9

G8

H9

F7

E6

G9

F8

E7

F9

E8

E9

D7

D9

D8

C7

C9

C8

B8

B9

A9

29

30

28

F4

E1

F3

G5

55

56

57

58

60

59

D6

BALL#PIN# PIN# BALL#61

62

63

64

65

66

67

68

69

70

71

72

73

74

B7

A8

C6

D5

A7

B6

C5

A6

B5

A5

C4

A4

B4

C3

A3

B3

B2

A2

E5

75

76

77

78

80

79

D4

PIN# BALL#

Thermal Characteristics

Productization

Electrical Characteristics

$

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GJJ (S-PBGA-N167) PLASTIC BALL GRID ARRAY



GJJ 167 TOP VIEW DAISY CHAIN NET LIST

GJJ 167 PIN ASSIGNMENT NET LIST

B1–C1D1–E1F1–G1H1–J1K1–L1M1–N1A2–B2C2–D2E2–F2G2–H2J2–K2L2–M2N2–N3A3–A4B3–C3D3–E3

F3–G3H3–J3K3–L3M3–M4B4–B5C4–D4E4–F4G4–H4J4–K4L4–L5N4–N5A5–A6C5–C6D5–E5F5–G5H5–J5

K5–K6M5–M6B6–B7D6–D7E6–F6G6–H6J6–J7L6–L7N6–N7A7–A8C7–C8E7–E8H7–H8K7–K8M7–M8B8–B9

D8–D9F8–G8J8–J9L8–L9N8–N9A9–A10C9–C10E9–F9G9–H9K9–K10M9–M10B10–B11D10–E10F10–G10H10–J10L10–L11

N10–N11A11–A12C11–D11E11–F11G11–H11J11–K11M11–M12B12–C12D12–E12F12–G12H12–J12K12–L12N12–N13A13–B13C13–D13E13–F13

G13–H13J13–K13L13–M13

INDEX MARK

3

12

45

BA C D E JF G H K L M N

13121110

8

67

9

NC – F7

B2E5C4A2B3D5A3E6B4C5A4D6B5C6A5E7B6A6D7C7B7A7G8F8A8B8C8

A9D8B9E8

A10C9B10A11D9C10B11A12D10C11A13

BALL#

148

G12106

M764

G222

4241 M2

J5

L136

40393837

K3M1L2J4

35343332

H5K2J3K1

29

3130

2827

H3

H4J2

J1G5

24

2625

23 G4

H2H1

G3

E9125126

8483 M12

J9

B12

167

124123122121120119118117116115114113

112111110109108107

K873

78

8281

7980

77767574

N11

L10N12M11K9

J8M10L9

N10

7172

7069

66

6867

65

L8M9

N9J7

K7

M8N8

L7

F10

C13

D11B13

E10C12

F9D12E11D13

162

166165164163

161160159158

F11

E12

E13G9

G10

F12F13

G11

157156155154153152151150149

D43

F217

21201918

G1F7F6F1

1516

1413

E1F3

F4E2

C18

10

1211

9 E3

F5D1

D27654

E4D3C2B1

12

PIN#

C3

BALL#

129

K1087

K445

105104103102101100999897969594939291908988

59

63626160

5758

5655

M6

N7G6H6N6

N5

L6

K6M5

50

52

5453

51

49484746

N3

L5

J6N4

M4

K5L4M3N2

H12

G13H7H8H13

J13H11

H10J12

143

147146145144

142141

140139

L13

J11

H9K13

K12

J10K11L12M13

134

138137136135

133132131130

8685

PIN#

4344

PIN#

N1L3

BALL# BALL#

N13

L11

128127

PIN#PIN# BALL#PIN# BALL#


Productization


&&%")

# ( !('

Package Data Sheets


' "" "" $ &

GHZ (S-PBGA-N151) PLASTIC BALL GRID ARRAY



GHZ 151 TOP VIEW DAISY CHAIN NET LIST

GHZ 151 PIN ASSIGNMENT NET LIST

VINDEX MARK A

151413121110987654321

NC – E6

B C D E F G H J K L MN P R

B1–B2C1–E5D1–D3E3–E4F1–F4F3–G4G3–H4H1–H3J3–J4K3–K4K1–L4L3–M4M1–M3N3–N4N5–P3P1–P4

R3–R4T1–T3U1–V1U2–V2P5–V3T4–V4R5–T5R6–V6

R8–T7T8–V8R9–T9R10–T10R11–V10R12–T11T12–V12

R13–T13P13–T14R14–V14R15–T15T16–V16V17–V18U17–U18P14–T18R16–R18

N15–N18M15–N16L15–M16L16–L18K15–K16J15–J16

H15–J18

P15–P16R7–T6

G15–H16

C12–D11C13–D12A13–D13C14–D14A15–C15A16–E14A17–B17A18–B18C16–C18D15–D16E15–E18E16–F14F15–F16G16–G18

T U

161718

C10–D10

A5–C5C6–D6A7–C7C8–D7A9–D8C9–D9

A11–C11

A2–A3C3–D4C4–D5

PIN# BALL# BALL#PIN# BALL#PIN# BALL#PIN#

C10

K16

T9

J3

132

94

56

18

V1U1T1

383736

V18V17V16

767574

A18B18C18

114113112

N427

P131

T3R4R3P4

35343332

P3N5N3

302928

M1M3M4L3

26252423

L4K1K3K4

22212019

F15

R13

103

65

V1469

T16R15T15R14

73727170

T14P13T13

686766

E18107

C16D15D16E15

111110109108

E16F14F16

106105104

V12T12R12T11

64636261

R11V10T10R10

60595857

G18G16G15H16

10210110099

H15J18J16J15

98979695

151150

A2A3

D6141

A5145

149148147146

C3D4C4D5

144143142

C5E6C6

140139138137

A7C7D7C8

136135134133

D8A9C9D9

U17

U2

B2

77

39

1

H414

J4H3H1

171615

G3G4F3F1

13121110

D15

F4E3E4D3

9876

E5C1B1

432

R852

R9T8V8

555453

T7R7T6V6

51504948

L1590

K15L16L18

939291

M16M15N16N18

89888786

V443

R6T5R5T4

47464544

P5V3V2

424140

R1881

N15P16P15R16

85848382

P14T18U18

807978

B17115

D11128

131130129

D10C11A11

127126125124

C12D12C13A13

A15119

123122121

120

D13C14D14

C15

118117116

E14A16A17

PIN# BALL#


Productization


$

$#

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Package Data Sheets


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GGM (S-PBGA-N100) PLASTIC BALL GRID ARRAY



GGM 100 TOP VIEW DAISY CHAIN NET LIST

GGM 100 PIN ASSIGNMENT NET LIST


Productization


J KF G H

B9–A9B8–C8A8–B7A7–C7A6–B6C6–D6A5–B5C5–D5D4–A4

J9–J10H9–H8H10–G9G10–G8F10–F9F8–F7E10–E9E8–E7D7–D10

A3–B3A2–A1

C10–C9B10–A10

D9–D8 B4–C4

C D EA B

10

98

76

54321

J2–K2J3–H3K3–J4K4–H4K5–J5H5–G5K6–J6H6–G6G7–K7J7–H7

B2–B1C2–C3C1–D2D1–D3E1–E2E3–E4F1–F2F3–F4G4–G1G2–G3

K8–J8K9–K10

H1–H2J1–K1

NC – E5,E6,F5,F6

INDEX MARK

7980

787776

PIN# BALL#

94

99100

98979695

93929190898887868584838281

B9A9B8C8A8B7A7C7A6B6C6D6E6A5B5C5D5D4A4B4C4A3B3A2A1

PIN# BALL#

34

3940

3738

3635

BALL#

313233

30

2728

26

29

PIN#

54

5960

55565758

515253

50494847464544434241

PIN#

7475

73727170696867666564636261

B2B1C2C3C1D2D1D3E1E2E3E4E5F1F2F3F4G4G1G2G3H1H2J1K1

J2K2J3H3K3J4K4H4K5J5H5G5F5K6J6H6G6G7K7J7H7K8J8K9K10

123456789

10111213141516171819202122232425

BALL#

J9J10H9H8

H10G9

G10G8F10F9F8F7F6

E10E9E8E7D7

D10D9D8

C10C9B10A10

R (Ω) L (nH) C (pF)

Min. 0.071 1.999 0.296Mean 0.076 2.425 0.440Max. 0.081 2.957 0.589

##"

&

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Package Data Sheets


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GGV (S-PBGA-N64) PLASTIC BALL GRID ARRAY



GGV 64 TOP VIEW DAISY CHAIN NET LIST

GGV 64 PIN ASSIGNMENT NET LIST


Productization



Min. 0.071 2.002 0.273Mean 0.076 2.544 0.380Max. 0.082 3.443 0.580

PIN# BALL# BALL#PIN# BALL#PIN# PIN#BALL#

1 – A12 – B13 – C24 – C15 – D46 – D37 – D18 – D29 – E210 – E111 – E312 – F113 – F214 – F315 – G116 – G2

17 – H118 – H219 – G320 – H321 – E422 – F423 – H424 – G425 – G526 – H527 – F528 – H629 – G630 – F631 – H732 – G7

33 – H834 – G835 – F736 – F837 – E538 – E639 – E840 – E741 – D742 – D843 – D644 – C845 – C746 – C647 – B848 – B7

49 – A850 – A751 – B652 – A653 – D554 – C555 – A556 – B557 – B458 – A459 – C460 – A361 – B362 – C363 – A264 – B2

G HE F

H8–G8F7–F8E5–E6E8–E7D7–D8D6–C8C7–C6B8–B7A8–A7B6–A6D5–C5A5–B5

C4–A3B3–C3A2–B2

B4–A4

65

87

CB DA

1234

INDEX MARK

A1–B1C2–C1D4–D3D1–D2E2–E1E3–F1F2–F3G1–G2H1–H2G3–H3E4–F4H4–G4

F5–H6G6–F6H7–G7

G5–H5

$

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GGM (S-PBGA-N80) PLASTIC BALL GRID ARRAY



GGM 80 TOP VIEW DAISY CHAIN NET LIST

GGM 80 PIN ASSIGNMENT NET LIST


Productization



Min. 0.054 1.487 0.215Mean 0.062 1.920 0.315Max. 0.074 2.659 0.428

PIN# BALL# BALL#PIN# BALL#PIN# PIN# BALL#B2B1C2C3C1D2D1D3

J2K2J3H3K3J4K4H4

J9J10H9H8H10G9

G10G8

B9A9B8C8A8B7A7C7

12345678

2122232425262728

4142434445464748

6162636465666768

E2E3F1F2F3G1G2G3H1H2J1

J5H5K6J6H6K7J7H7K8J8K9

F9F8

E10E9E8

D10D9D8C10C9B10

B6C6A5B5C5A4B4C4A3B3A2

1011121314151617181920

3031323334353637383940

5051525354555657585960

7071727374757677787980

E1 K5 F10 A69 29 49 69

H J K

B9–A9B8–C8A8–B7A7–C7A6–B6C6–A5B5–C5

D E F G

J9–J10H9–H8H10–G9G10–G8F10–F9F8–E10E9–E8

A4–B4C4–A3B3–A2

D10–D9D8–C10C9–B10

10

87654321

9

A B C

B2–B1C2–C3C1–D2D1–D3E1–E2E3–F1F2–F3G1–G2G3–H1H2–J1

INDEX MARK

J2–K2J3–H3K3–J4K4–H4K5–J5H5–K6J6–H6K7–J7H7–K8J8–K9

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GGF (S-PBGA-N100) PLASTIC BALL GRID ARRAY



GGF 100 TOP VIEW DAISY CHAIN NET LIST

GGF 100 PIN ASSIGNMENT NET LIST


Productization



Min. 0.011 0.676 0.102Mean 0.022 1.026 0.172Max. 0.035 1.606 0.339

L MNP RF G H J K

P15–N14N15–M14M15–L14L15–K14K15–J14J15–H14G15–G14

E15–E14D15–D14C15–C14B15–A15

F15–F14

A14–B13A13–B12A12–B11A11–B10

A9–B8A7–B7A6–B6A5–B5A4–B4A3–B3A2–A1

A10–B9

15

13121110987654321

14

A B CD

B1–C2C1–D2D1–E2E1–F2F1–G2G1–H2J1–J2

L1–L2M1–M2N1–N2P1–R1

K1–K2

INDEX MARK

R2–P3R3–P4R4–P5R5–P6R6–P7R7–P8R9–P9R10–P10R11–P11R12–P12R13–P13R14–R15

NC–– H1, R8, H15, A8

E

B1C2C1D2D1E2E1F2F1G2G1H2H1J1J2K1K2L1L2M1M2N1N2P1R1

R2P3R3P4R4P5R5P6R6P7R7P8R8R9P9

R10P10R11P11R12P12R13P13R14R15

P15N14N15M14M15L14L15K14K15J14J15H14H15G15G14F15F14E15E14D15D14C15C14B15A15

A14B13A13B12A12B11A11B10A10B9A9B8A8A7B7A6B6A5B5A4B4A3B3A2

12345678910111213141516171819202122232425

26272829303132333435363738394041424344454647484950

51525354555657585960616263646566676869707172737475

767778798081828384858687888990919293949596979899

PIN# BALL# BALL#PIN# BALL#PIN# BALL#PIN#

100 A1

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Package Data Sheets


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GGT (S-PBGA-N100) PLASTIC BALL GRID ARRAY



GGT 100 TOP VIEW DAISY CHAIN NET LIST

GGT 100 PIN ASSIGNMENT NET LIST


Productization



Min. 0.072 2.200 0.254Mean 0.077 2.636 0.398Max. 0.086 3.633 0.582

H J K L

K10J10H10G10F10

D11E9C11D8B11C8

F11

D E F GA CB

87

109

11

1

4

23

5

INDEX MARK

6

K2

H9

L8J7J8H8J9

K3K4K5K6L6

L11

E11E10D10D9C10C9

G11

K11J11G9F9

L1

K7K8L9K9

L7

L2L3L4J6L5

B2

G2H1H3J1

J3J4

F1

C2D2E2F2

L10

A1

G1G3H2H4J2K1

B1C1D1F3E1

NC – E3,J5,H11,A8

PIN#

12345678910

BALL#

11121314151617181920

34

3940

3738

3635

BALL#

313233

30

2728

25

26

29

2223

21

PIN#

24

54

5960

55565758

515253

504948474645

BALL#

44434241

PIN#

74

7980

787776

75

73727170696867666564636261

PIN# BALL#

94

99100

98979695

93929190898887868584838281

A1B2B1C2C1D2E3D1E2F3F2E1F1G1G2G3H1H2H3H4J1J2J3K1J4

L1K2L2K3L3K4J5L4K5J6K6L5L6L7L8K7J7K8J8L9H8K9J9

L10H9

L11K10K11J10J11H10H11G9

G10F9F10G11F11E11D11E10E9

D10C11D9D8C10B11C9C8

A11B10A10B9A9B8A8B7A7C7C6B6A6B5A5C5D4A4B4C4A3B3C3A2D3

""!%

$ $#

Package Data Sheets


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GGU (S-PBGA-N144) PLASTIC BALL GRID ARRAY



GGU 144 TOP VIEW DAISY CHAIN NET LIST

GGU 144 PIN ASSIGNMENT NET LIST


Productization

Electrical CharacteristicsR (Ω) L (nH) C (pF)

Min. 0.052 1.438 0.215Mean 0.055 1.958 0.305Max. 0.062 3.095 0.563

L M NG H J K

C6–D6A5–B5

C7–D7A6–B6

A13–A12

D9–C9

B8–A8B7–A7

B9–A9D8–C8

D10–C10B10–A10

B11–A11

F11–F10E13–E12

G11–G10F13–F12

N13–M13

J10–J11

H12–H13G12–G13

J12–J13H10–H11

K10–K11K12–K13

L12–L13

A2–B2

C5–D5

C4–A3B3–C3

A4–B4

B13–B12

E11–E10

D11–C13C12–C11

D13–D12

10111213

C D E F

6

A

1

4

23

5

B

87

9

INDEX MARK

L7–K7N8–M8L8–K8N9–M9

M3–N3K4–L4M4–N4K5–L5M5–N5K6–L6M6–N6M7–N7

N1–N2A1–B1

H3–H4J1–J2

G3–G4H1–H2

E4–E3

F2–F1G2–G1

E2–E1F4–F3

D4–D3D2–D1

C2–C1

L9–K9N10–M10L10–N11M11–L11

M1–M2

J3–J4

K3–L1L2–L3

K1–K2

N12–M12

A13

BALL#

B11A11

A12

C10

A10B10

D9

B9C9

D10

109

PIN#

111112

110N13

L13L12M13

114115116117118119

K13K12K11

J12J11J10

113K10

D8C8

A8

A7B7

B8

C7

A6D7

C6D6

B6

121122

124125126

123H11H10

G13G12H13H12

127128129

131132

130F13G10G11

F10F11F12

B5

D5C5

A4

C4B4

B3C3

B2A2

A3

134135136137138139

E10E11E12

D11D12D13

141142

144143

C11C12

B12B13

140C13

133 A5E13

120 A9J13

73

PIN#

7576

74

80

7879

818283

77

37383940

PIN#

424344454647

41

M5L5K5N4M4

K4L4

N2M3N3

N1

BALL#

A1

BALL#

C2C1

B11

432

PIN#

D3D2D1E4E3E2

876

11109

5 D4

8586

90

8889

87

919293

9596

94

51525354

4950

555657585960

L6K6

K8L8M8N8K7L7N7M7N6M6

9899

100101102103

105106

108107

104

626364656667

69707172

68L10M10N10K9L9M9

L11

M12N12

M11N11

N961 97

F4F3

F1G2G1

F21413

18171615

G3G4H1

H3H4

H2212019

242322

J2J3J4K1K2K3

282726

313029

L2L3

M2M1

3433

3635

32 L1

25 J1

N54812 E1 84

BALL#

$

$#

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Package Data Sheets


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GHH (S-PBGA-N179) PLASTIC BALL GRID ARRAY



GHH 179 TOP VIEW DAISY CHAIN NET LIST

GHH 179 PIN ASSIGNMENT NET LISTThermal Characteristics

Productization


13121110987654321

A B C D E F G H J K L M NINDEX MARK

14

P

B2–B1

C3–C2

C1–D4

D3–D2

D1–E4

E3–E2

E1–F4

F3–F2

F1–F5

G5–G2

G1–G3

H3–H1

H2–H4

H5–J1

J2–J3

J4–K1

K2–K3

J5–L1

L2–L3

K4–M1

M2–K5

N1–P1

N2–P2

M3–N3

P3–L4

M4–N4

P4–L5

M5–N5

P5–L6

M6–N6

P6–K6

K7–N7

P7–M7

M8–P8

N8–L8

K8–P9

N9–M9

L9–P10

N10–M10

K9–P11

N11–M11

L10–P12

N12–K10

P13–P14

N13–N14

M12–M13

M14–L11

L12–L13

L14–K11

K12–K13

K14–J11

J12–J13

J14–J10

H10–H13

H14–H12

G12–G14

G13–G11

G10–F14

F13–F12

F11–E14

E13–E12

F10–D14

D13–D12

E11–C14

C13–E10

B14–A14

B13–A13

C12–B12

A12–D11

C11–B11

A11–D10

C10–B10

A10–D9

C9–B9

A9–E9

E8–B8

A8–C8

C7–A7

B7–D7

E7–A6

B6–C6

D6–A5

B5–C5

E6–A4

B4–C4

D5–A3

B3–E5

F6–A2

NC ––– D8,G4,H11,L7,A2

123456789101112131415161718192021222324252627282930

3132

PIN# BALL#

333435363738394041424344

BALL#PIN# PIN#BALL#PIN# BALL#

45464748495051525354555657585960

616263646566676869707172737475767778798081828384858687888990

919293949596979899

100101102103104105106107108109110111112113114115116117118119120

121122123124125126127128129130131132133134135136137138139140141142143144145146147148149150

151152153154155156157158159160161162163164165166167168169170171172173174175176177178(179

B2B1C3C2C1D4D3D2D1E4E3E2E1F4F3F2F1F5G5G2G1G3G4H3H1H2H4H5J1J2

J3J4K1K2K3J5L1L2L3K4M1M2K5N1P1N2P2M3N3P3L4M4N4P4L5M5N5P5L6M6

N6P6K6K7N7P7M7L7M8P8N8L8K8P9N9M9L9

P10N10M10K9P11N11M11L10P12N12K10P13P14

N13N14M12M13M14L11L12L13L14K11K12K13K14J11J12J13J14J10H10H13H14H12H11G12G14G13G11G10F14F13

F12F11E14E13E12F10D14D13D12E11C14C13E10B14A14B13A13C12B12A12D11C11B11A11D10C10B10A10D9C9

B9A9E9E8B8A8C8D8C7A7B7D7E7A6B6C6D6A5B5C5E6A4B4C4D5A3B3E5F6 (ID ball))A2180

PIN# BALL#BALL#PIN#

&&%")

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Package Data Sheets


) $$ $$ &"(!

GGW (S-PBGA-N176) PLASTIC BALL GRID ARRAY



GGW 176 TOP VIEW DAISY CHAIN NET LIST

GGW 176 PIN ASSIGNMENT NET LIST


Productization



Min. 0.075 1.595 0.204Mean 0.083 2.417 0.298Max. 0.099 3.284 0.425

UMN P R T

B5–C5C6–A5

A8–B8

A7–B7

A6–B6C7–D7

C8–D8

A9–D9C9–B9

A10–D10C10–B10

B12–A12A13–C12

B11–A11D11–C11

C13–B13B14–A14A15–C14

B3–A2C4–A3A4–B4

A16–B15

G H J KA B C D E F

109

11

141312

17

1516

7654321

INDEX MARK

8

N2–N3M3–N1

H1–H4

M1–M2L3–L4L1–L2K3–K4K1–K2J3–J2J1–J4H3–H2

G2–G1G4–G3F2–F1E1–F3E3–E2D2–D1C1–D3

T13–R13R12–U13U12–T12R11–P11U11–T11R10–P10U10–T10

U8–P8

U9–P9R9–T9

R8–T8

T7–U7P7–R7T6–U6U5–R6R5–T5T4–U4U3–R4

R2–T1P3–R1P1–P2

T15–U16R14–U15U14–T14

B1–C2 U2–T3

L

C16–B17D15–C17D17–D16E16–E15F15–E17

K17–K14

H17–H16

F17–F16G15–G14G17–G16H15–H14

J15–J16J17–J14K15–K16

L16–L17L14–L15M16–M17N17–M15N15–N16P16–P17R17–P15T17–R16

1234567891011121314151617181920212223242526272829303132333435

3637383940414243444546474849505152535455565758596061626364656667686970

7172737475767778798081828384858687888990919293949596979899

100101102103104105

106107108109110111112113114115116117118119120121122123124125126127128129130131132133134135136137138139140

141142143144145146147148149150151152153154155156157158159160161162163164165166167168169170171172173174175176

PIN# BALL# PIN#BALL# PIN# BALL# PIN# BALL# PIN# BALL#

A6B6C6

B5C5A4B4C4A3B3A2

A5

F17F16F15E17

T13R13U14T14

P3R1R2T1

E15D17D16D15C17C16

A16B15A15C14B14A14

B17

B13

A13C12B12A12D11C11B11A11A10D10C10B10

C13

U15T15U16T17R16R17

P16P17N15N16N17M15

P15

T3U3R4T4U4R5

U5R6T6U6P7R7

T5

M17L14L15L16L17K17

K14K15K16J17J14J15J16

T7U7U8P8R8T8U9P9R9T9

U10T10

P10R10

M16

U2

R14

E16

A9D9C9B9A8B8D8C8A7B7C7D7

H17H16H14H15G17G16G15G14

U11T11R11P11U12T12R12U13

B1C2C1D3

D1E3E2E1F3F2

G4G3G2G1H1H4

F1

H2J1J4J3J2K1K2K4K3L1L2L3L4

H3

D2

M1M2M3

N1N2N3P1P2

&&%")

# ( !('

Package Data Sheets


( ## ## %!'







Productization



Min. 0.070 1.824 0.217Mean 0.075 2.266 0.278Max. 0.079 3.416 0.433

R9–T9

U8–P9

R8–T8

U7–P8

R7–T7

U6–P7

R6–T6

U5–P6

R5–T5

U4–P5

R4–T4

U2–U3

T2–T3

R3–U1

R2–T1

P2–R1

P1–P3

N1–P4

N3–N2

M1–N4

M3–M2

L1–M4

L3–L2

K1–L4

K3–K2

J1–K4

J3–J2

H1–J4

H3–H2

G1–H4

G3–G2

F1–G4

F3–F2

E1–F4

E3–E2

D1–E4

D3–D2

B1–C1

B2–C2

1615

17

121314

11

BA

123456789

10

INDEX MARK

C3–A1

B3–A2

B4–A3

A4–C4

A5–D4

C5–B5

A6–D5

C6–B6

A7–D6

C7–B7

A8–D7

C8–B8

A9–D8

C9–B9

A10–D9

C10–B10

A11–D10

C11–B11

A12–D11

C12–B12

A13–D12

C13–B13

A14–D13

C14–B14

A16–A15

B16–B15

C15–A17

C16–B17

D16–C17

D17–D15

E17–D14

E15–E16

F17–E14

F15–F16

G17–F14

G15–G16

H17–G14

H15–H16

J17–H14

J15–J16

K17–J14

K15–K16

L17–K14

L15–L16

M17–L14

M15–M16

N17–M14

N15–N16

P17–N14

P15–P16

T17–R17

T16–R16

R15–U17

T15–U16

T14–U15

U14–R14

U13–P14

R13–T13

U12–P13

R12–T12

U11–P12

R11–T11

U10–P11

R10–T10

U9–P10

UTRPNMLKJHGFEDC

PIN# BALL#

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

PIN# BALL#PIN# BALL#PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN#BALL#

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

101

102

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126

127

128

129

130

131

132

133

134

135

136

137

138

139

140

141

142

143

144

145

146

147

148

149

150

151

152

153

154

155

156

157

158

159

160

161

162

163

164

165

166

167

168

169

170

171

172

173

174

175

176

177

178

179

180

181

182

183

184

185

186

187

188

189

190

191

192

193

194

195

196

197

198

199

200

201

202

203

204

205

206

207

208

B2

C2

B1

C1

D3

D2

D1

E4

E3

E2

E1

F4

F3

F2

F1

G4

G3

G2

G1

H4

H3

H2

H1

J4

J3

J2

J1

K4

K3

K2

K1

L4

L3

L2

L1

M4

M3

M2

M1

N4

T2

T3

U2

U3

R4

T4

U4

P5

R5

T5

U5

P6

R6

T6

U6

P7

R7

T7

U7

P8

R8

T8

U8

P9

R9

T9

U9

P10

R10

T10

U10

P11

R11

T11

U11

P12

R12

T12

U12

P13

T16

R16

T17

R17

P15

P16

P17

N14

N15

N16

N17

M14

M15

M16

M17

L14

L15

L16

L17

K14

K15

K16

K17

J14

J15

J16

J17

H14

H15

H16

H17

G14

G15

G16

G17

F14

F15

F16

F17

E14

B16

B15

A16

A15

C14

B14

A14

D13

C13

B13

A13

D12

C12

B12

A12

D11

C11

B11

A11

D10

C10

B10

A10

D9

C9

B9

A9

D8

C8

B8

A8

D7

C7

B7

A7

D6

C6

B6

A6

D5

N3

N2

N1

P4

P1

P3

P2

R1

R2

T1

R3

U1

R13

T13

U13

P14

U14

R14

T14

U15

T15

U16

R15

U17

E15

E16

E17

D14

D17

D15

D16

C17

C16

B17

C15

A17

C5

B5

A5

D4

A4

C4

B4

A3

B3

A2

C3

A1

%%$!(

" ' '&

Package Data Sheets


) $$ $$ &"(!







Productization


PIN#BALL#

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

PIN#BALL# PIN#BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL#

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

101

102

103

104

105

106

107

108

109

110

111

112

113

114

115

116

117

118

119

120

121

122

123

124

125

126

127

128

129

130

131

132

133

134

135

136

137

138

139

140

141

142

143

144

145

146

147

148

149

150

151

152

153

154

155

156

157

158

159

160

161

162

163

164

165

166

167

168

169

170

171

172

173

174

175

176

177

178

179

180

181

182

183

184

185

186

187

188

189

190

191

192

193

194

195

196

197

198

199

200

201

202

203

204

205

206

207

208

209

210

211

212

213

214

215

216

217

218

219

220

221

222

223

224

225

226

227

228

229

230

231

232

233

234

235

236

237

238

239

240

B2

C2

B1

C1

D3

D2

D1

E5

E4

E3

E2

E1

F5

F4

F3

F2

F1

G5

G4

G3

G2

G1

H5

H4

H3

H2

H1

J5

J4

J3

J2

J1

K5

K4

K3

K2

K1

L5

L4

L3

L2

L1

M5

M4

M3

M2

M1

N4

T2

T3

U2

U3

R4

T4

U4

N5

P5

R5

T5

U5

N6

P6

R6

T6

U6

N7

P7

R7

T7

U7

N8

P8

R8

T8

U8

N9

P9

R9

T9

U9

N10

P10

R10

T10

U10

N11

P11

R11

T11

U11

N12

P12

R12

T12

U12

P13

T16

R16

T17

R17

P15

P16

P17

N13

N14

N15

N16

N17

M13

M14

M15

M16

M17

L13

L14

L15

L16

L17

K13

K14

K15

K16

K17

J13

J14

J15

J16

J17

H13

H14

H15

H16

H17

G13

G14

G15

G16

G17

F13

F14

F15

F16

F17

E14

B16

B15

A16

A15

C14

B14

A14

E13

D13

C13

B13

A13

E12

D12

C12

B12

A12

E11

D11

C11

B11

A11

E10

D10

C10

B10

A10

E9

D9

C9

B9

A9

E8

D8

C8

B8

A8

E7

D7

C7

B7

A7

E6

D6

C6

B6

A6

D5

N3

N2

N1

P4

P1

P3

P2

R1

R2

T1

R3

U1

R13

T13

U13

P14

U14

R14

T14

U15

T15

U16

R15

U17

E15

E16

E17

D14

D17

D15

D16

C17

C16

B17

C15

A17

C5

B5

A5

D4

A4

C4

B4

A3

B3

A2

C3

A1

K15–K16

K13–K14

L16–L17

L14–L15

M17–L13

M15–M16

M13–M14

N16–N17

N14–N15

P17–N13

P15–P16

T17–R17

T16–R16

H3–H2

H5–H4

G2–G1

G4–G3

F1–G5

F3–F2

F5–F4

E2–E1

E4–E3

D1–E5

D3–D2

B1–C1

B2–C2

P2–R1

P1–P3

N1–P4

N3–N2

M1–N4

M3–M2

M5–M4

L2–L1

L4–L3

K1–L5

K3–K2

K5–K4

J2–J1

T14–U15

U14–R14

U13–P14

R13–T13

U12–P13

R12–T12

N12–P12

T11–U11

P11–R11

U10–N11

R10–T10

N10–P10

T9–U9

R8–T8

N8–P8

T7–U7

P7–R7

U6–N7

R6–T6

N6–P6

T5–U5

P5–R5

U4–N5

R4–T4

U2–U3

T2–T3

9

INDEX MARK

2345678

1615

17

121314

1110

EDCBA KJHGF

D16–C17

D17–D15

E17–D14

E15–E16

F17–E14

F15–F16

F13–F14

G16–G17

G14–G15

H17–G13

H15–H16

H13–H14

J16–J17

C10–B10

E10–D10

B11–A11

D11–C11

A12–E11

C12–B12

E12–D12

B13–A13

D13–C13

A14–E13

C14–B14

A16–A15

B16–B15

B4–A3

A4–C4

A5–D4

C5–B5

A6–D5

C6–B6

E6–D6

B7–A7

D7–C7

A8–E7

C8–B8

E8–D8

B9–A9

RPNML UT

J14–J15

K17–J13

J4–J3

H1–J5

R3–U1

R2–T1

R15–U17

T15–U16

P9–R9

U8–N9

C15–A17

C16–B17

D9–C9

A10–E9

C3–A1

B3–A2

&&%")

# ( !('

Package Data Sheets


( ## ## %!'

GHC (S-PBGA-N196) PLASTIC BALL GRID ARRAY



GHC 196 TOP VIEW DAISY CHAIN NET LIST

GHC 196 PIN ASSIGNMENT NET LIST


Productization



Min. 0.078 2.174 0.256Mean 0.092 3.288 0.470Max. 0.123 6.418 1.071

E6

C6

B6

A6

D6

E7

D7

B7

A7

C7

E8

BALL#

A12

C11A13

B11

A14

B12

B13

C12

C13

B14

D13

G13

G14

G12

H10

H12

H14

H13

H11

J10

J11

J14

M12

N12

P13

N11

M11

P12

L11

P11

N10

P10

M10

167

166

165

164

163

162

161

160

159

158

157

141

140

139

138

137

136

135

134

133

132

131

115

114

113

112

111

110

109

108

107

106

105

89

88

87

86

85

84

83

82

81

80

79

PIN#BALL#PIN#BALL#PIN#BALL#PIN#

C3

B3

A2

B4

C4

A3

D4

A4

B5

A5

C5

C8

A8

B8

D8

E9

D9

A9

B9

C9

E10

D10

C10

J13

J12

K10

K11

K12

K14

K13

L14

M14

L12

N14

L13

A10

B10

D12

C14

D11

D14

E13

E14

E12

E11

F10

F12

F13F14

F11

G10

P14

M13

179

178

177

176

175

174

173

172

171

170

169

156

155

154

153

152

151

150

149

148

147

146

145

144

143

130

129

128

127

126

125

124

123

122

121

120

119

118

117

104

103

102

101

100

99

98

97

96

95

94

93

92

91

D5A11G11N13 16814211690

L7

K6

L6

P6

N6

M6

K5

L5

M5

P5

N5

L1

K2

K1

K3

K4

J5

J3

J2

J1

J4

H5

E3

E1

E2

D1

C1

D3

B1

D2

A1

C2

B2

63

62

61

60

59

58

57

56

55

54

53

37

36

35

34

33

32

31

BALL#PIN#BALL#PIN#

30

29

28

27

11

10

9

8

7

6

5

4

3

2

1

BALL#PIN#

P4

P3

M4

P2

N4

P1

N3

N2

M3

M2

N1

L2

L10

K9

M9

N9

P9

L9

K8

L8

N8

P8

M8

K7

M7

P7

L3

M1

H4

H2

H1H3

G5

G3

G1

G2

G4

F5

F4

F1

F2

F3

78

77

76

75

74

73

72

71

70

69

68

67

66

65

52

51

50

49

48

47

46

45

44

43

42

41

40

39

26

25

24

23

22

21

20

19

18

17

16

15

14

13

N7L4E4 643812

Internal connection – E5,F6,F7,F8,F9,G6,G7,G8,G9,H6,H7,H8,H9,J6,J7,J8,J9

INDEX MARK

14

PNMLKJHGFEDCBA

13

12

11

10

9

8

7

6

5

4

2

1

3

C8A8

B8D8

E9D9

A9B9

C9E10

D10C10

J13J12

K10K11

K12K14

K13L14

M14L12

N14L13

P4P3

M4P2

N4P1

N3N2

M3M2

N1L2

B3A2

B4C4

A3D4

A4B5

A5C5

D5E6

C6B6

A6D6

E7D7

B7A7

C7E8

A10B10

A11A12

C11A13

B11A14

B12B13

C12C13

B14D13

D12C14

D11D14

E13E14

E12E11

F10F12

F13F14

F11G10

G11G13

G14G12

H10H12

H14H13

H11J10

J11J14

P14M13

N13M12

N12P13

N11M11

P12L11

P11N10

P10M10

L10K9

M9N9

P9L9

K8L8

N8P8

M8K7

M7P7

N7L7

K6L6

P6N6

M6K5

L5M5

P5N5

L3M1

L4L1

K2K1

K3K4

J5J3

J2J1

J4H5

H4H2

H1H3

G5G3

G1G2

G4F5

F4F1

F2F3

E4E3

E1E2

D1C1

D3B1

D2A1

C2B2

Internal connection – E5,F6,F7,F8,F9,G6,G7,G8,G9,H6,H7,H8,H9,J6,J7,J8,J9

NC – C3

%%$!(

" ' '&

Package Data Sheets


F10E10

B9

F9C9

E9A8

A9

F8

A7E8

C7

A6F7

B7

C8

E7C6A5F6

E6B5

A4

A3B4

B3

C3A2

C4

C5

B6

B8

225

228227

231232

230229

226

235234

239238237236

241

243242

246245244

240

250249248

251

253252

256255254

247

233

A18B18

B17

B16A17

A16C15

C16

B15

C14A15

E13

F12A14

B14

F13

B13A13E12C12

C13

A12

B11

E11C11

A10

C10B10

F11

A11

B12

E14

193

200199198197196195194

207206205204203202

214213212211210209208

221220219218217216

224223222

215

201

K15K14

J14J17J18

H19J15

J19

G19H15H14

F19G14G17G18

H17

F17E19

G15F18

F15E18F14

C19D18D19

B19C17

C18D17

E17

H18

161

168167166165164163162

175174173172171170

182181180179178177176

189188187186185184

192191190

183

169

V18V19

U18U19T18T19R17

T17

N14R18R19P17

N15P19M14

P18

N18N19M15M17

N17

M19

L18L17L15

K19K18K17

L14

L19

M18

P15

129

136135134133132131130

143142141140139138

150149148147146145144

157156155154153152

160159158

151

137

P10R10

V11

P11U11

R11W12V12U12P12

W13R12

U13

W14P13

V13

W11

R13U14W15P14V15R14

W16

W17V16

V17

U17W18

U16

U15

V14

97

1041031021011009998

111110109108107106

118117116115114113112

125124123122121120

128127126

119

105

W2V2

V3

V4W3

U5W4

U4

P7V5

U6W5

R7

P8W6

V6

V7W7R8U8

U7

W8

V9

R9U9

W10

U10V10

P9

W9

V8

R6

65

72717069686766

797877767574

86858483828180

939291908988

969594

87

73

L1

M1

K6K5

L2

L6L3

L5

N1

P1

R1

T1

U1

M3M6M5

N3N6

N2

N5P3

P6R2P5

T2

U2

U3V1

T3

R3

P2

M2

33

40393837363534

474645444342

54535251504948

616059585756

646362

55

41

B2B1

C2C1D2D1E3

D3

G6E2E1F3F2G5F1H6

G2G1H5H3

G3

H1J1J2J3J5J6K1K2K3

H2

F5

1

8765432

151413121110

22212019181716

292827262524

323130

23

9

* %% %% '#)"

GHK (S-PBGA-N257) PLASTIC BALL GRID ARRAY



GHK 257 TOP VIEW DAISY CHAIN NET LIST

GHK 257 PIN ASSIGNMENT NET LIST


Productization


B2–B1

D3–C2

C1–D2

D1–E3

F5–G6

E2–E1

F3–F2

G5–F1

H6–G3

G2–G1

H5–H3

H2–H1

J1–J2

J3–J5

J6–K1

K2–K3

K5–K6

L1–L2

L3–L6

L5–M1

M2–M3

M6–M5

N1–N2

N3–N6

G

654321

A B C D E F H J K L M N P TR U V W

17

1516

1413121110

987

1918

V1–U3

T3–U2

T2–U1

R3–T1

R2–P5

R1–P6

N5–P3

P1–P2

V16–W17

W18–U17

U16–V17

U15–W16

V15–R14

W15–P14

R13–U14

W14–V14

U13–P13

W13–V13

P12–R12

V12–U12

R11–W12

U11–P11

W11–V11

R10–P10

V10–U10

P9–W10

U9–R9

W9–V9

W4–U5

V8–W8

R8–U8

V7–W7

P8–U7

R6–P7

V5–W5

U6–V6

R7–W6

U4–V3

W3–V4

V2–W2

B19–C17

D17–C18

D18–C19

E17–D19

E18–F15

E19–F14

G15–F17

F19–F18

G17–G14

G19–G18

H14–H15

H18–H17

J15–H19

J17–J14

J19–J18

K15–K14

K18–K17

L14–K19

L17–L15

L19–L18

M18–M19

M15–M17

N18–N19

M14–N17

N15–P19

P17–P18

R18–R19

P15–N14

T19–R17

U19–T18

T17–U18

V18–V19

B4–A3

A2–C3

C4–B3

C5–A4

B5–E6

A5–F6

E7–C6

A6–B6

C7–F7

A7–B7

F8–E8

B8–C8

E9–A8

C9–F9

A9–B9

E10–F10

B10–C10

F11–A10

C11–E11

A11–B11

A16–C15

B12–A12

E12–C12

B13–A13

F12–C13

E13–A14

C14–B14

B15–A15

E14–F13

A17–B16

C16–B17

B18–A18

NC–E5

INDEX MARK

ID BALL – E5

PIN#BALL# PIN#BALL# PIN#BALL# PIN#BALL# PIN#BALL# PIN#BALL# PIN#BALL# PIN#BALL#

'' &

#*

$! ) " )(

Package Data Sheets


F9

B9

E9

D9

A9

E10

D10

A8

F8

B8

E8

A7

G7

D8

D7

B7

E7

A6

D6

B6

F7

F6

E6

A5

D5

B4

A4

B5

D4

A3

B3

A2

231

230

229

228

227

226

225

238

237

236

235

234

233

232

245

244

243

242

241

240

239

252

251

250

249

248

247

246

256

255

254

253

A17

A18

B18

D15

B16

A16

B17

A15

B15

E15

B14

A14

D14

E14

B13

E13

F13

A12

F12

D13

A13

E12

D12

B12

E11

B11

A11

D11

A10

F10

F11

B10

193

195

194

197

199

198

196

200

201

206

205

204

203

202

211

213

212

210

209

208

207

215

214

216

218

219

217

220

221

224

223

222

J14

K15

K16

J15

J16

J18

J19

H18

H19

H14

G19

G13

H15

H16

G15

G16

G18

F16

F18

F19

G14

E19

F14

F15

D18

D19

E16

E18

C18

D16

C19

B19

163

162

161

167

166

165

164

170

169

168

174

173

172

171

177

176

175

181

180

179

178

184

183

182

188

187

186

185

191

190

189

192

U19

V19

V18

R16

T18

T19

U18

R18

R19

R15

P18

P19

P16

P15

N18

N15

N14

M19

M14

N16

N19

M15

M16

M18

L15

L18

L19

L16

K19

K14

L14

K18

131

130

129

135

134

133

132

138

137

136

142

141

140

139

145

144

143

149

148

147

146

152

151

150

156

155

154

153

159

158

157

160

P11

R10

T10

R11

T11

V11

W11

V12

W12

P12

W13

N13

R12

T12

R13

T13

V13

T14

V14

W14

P13

W15

P14

R14

V16

W16

T15

V15

V17

T16

W17

W18

99

98

97

103

102

101

100

106

105

104

110

109

108

107

113

112

111

117

116

115

114

120

119

118

124

123

122

121

127

126

125

128

W3

W2

V2

V4

T5

W4

V3

V5

W5

R5

V6

W6

T6

R6

V7

R7

P7

W8

P8

T7

W7

R8

T8

V8

R9

V9

W9

T9

W10

P10

P9

V10

67

66

65

71

70

69

68

74

73

72

78

77

76

75

81

80

79

85

84

83

82

88

87

86

92

91

90

89

95

94

93

96

L6

K5

K4

L5

L4

L2

L1

M2

M1

M6

N1

N7

M5

M4

N5

N4

N2

P4

P2

P1

N6

R1

P6

P5

T2

T1

R4

R2

U2

T4

U1

V1

35

34

33

39

38

37

36

42

41

40

46

45

44

43

49

48

47

53

52

51

50

56

55

54

60

59

58

57

63

62

61

64

3

2

1

7

6

5

4

10

9

8

14

13

12

11

17

16

15

21

20

19

18

24

23

22

28

27

26

25

31

30

29

32

C1

B1

B2

E4

D2

D1

C2

E2

E1

E5

F2

F1

F4

F5

G2

G5

G6

H1

H6

G4

G1

H5

H4

H2

J5

J2

J1

J4

K1

K6

J6

K2

* %% %% '#)"

GJG (S-PBGA-N257) PLASTIC BALL GRID ARRAY



GJG 257 TOP VIEW DAISY CHAIN NET LIST

GJG 257 PIN ASSIGNMENT NET LIST


Productization


INDEX MARK G

654321

A B C D E F H J K L M N P TR U V W

17

1516

1413121110

987

1918

B2–B1

C1–C2

D1–D2

E4–E5

E1–E2

F5–F4

F1–F2

G6–G5

G2–G1

G4–H6

H1–H2

H4–H5

J4–J1

J2–J5

J6–K6

K1–K2

K4–K5L6–L1

L2–L4

L5–M6

M1–M2

M4–M5

N7–N1

N2–N4

U2–V1

U1–T4

T1–T2

R2–R4

P6–R1

P4–P5

P1–P2

N5–N6

W16–V16

V17–W18

W17–T16

V15–T15

P14–W15

T14–R14

W14–V14

R13–P13

V13–T13

N13–W13

T12–R12

W12–V12

R11–P12

V11–T11

P11–W11

T10–R10

W10–V10

P9–P10

V9–R9

T9–W9

T5–R5

T8–R8

W8–V8

T7–P8

V7–W7

W5–V5

R6–T6

W6–V6

P7–R7

W3–V3

W4–V4

V2–W2

C18–B19

C19–D16

D19–D18

E18–E16

F14–E19

F16–F15

F19–F18

G15–G14

G18–G16

G13–G19

H16–H15

H19–H18

J15–H14

J18–J16

J14–J19

K16–K15

K19–K18

L14–K14

L18–L15

L16–L19

M16–M15

M19–M18

N16–M14

N18–N19

N14–N15

P19–P18

P15–P16

R19–R18

R16–R15

T19–T18

U19–U18V18–V19

A4–B4

B3–A2

A3–D4

B5–D5

F6–A5

D6–E6

A6–B6

E7–F7

B7–D7

G7–A7

D8–E8

A8–B8

E9–F8

B9–D9

F9–A9

D10–E10

A10–B10

F11–F10

B11–E11

D11–A11

D15–E15

D12–E12

A12–B12

D13–F12

B13–A13

F13–E13

A14–B14

E14–D14

A15–B15

A16–B16

A17–B17

B18–A18

ID BALL–C3

1PIN MARK – C3

PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN# BALL# PIN#BALL# PIN#BALL#

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#*

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Package Data Sheets


Notes

microstar rg

Documents

ti components

subsidiaries ti

chip scale packages

customers applications

thirdpartys products

suchsemiconductor products

patent right

ti warrants performance