microstructural aspects & performance implications of … · microstructural aspects &...
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![Page 1: Microstructural Aspects & Performance Implications of … · Microstructural Aspects & Performance Implications of Sn-Ag-Cu-Sb Solder in the Presence of Gold Weiqun Peng, Steven O](https://reader030.vdocument.in/reader030/viewer/2022021718/5b8858897f8b9a1a248ec226/html5/thumbnails/1.jpg)
1 W. Peng Pb-free, 2002
Microstructural Aspects & Performance Implications of Sn-Ag-Cu-Sb Solder in
the Presence of Gold
Weiqun Peng, Steven O. DunfordPuligandla Viswanadham and Stephen Quander
Nokia, Dallas, TX75039, U.S.A.
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2 W. Peng Pb-free, 2002
General requirementsof Pb-free in mobile phone applications
• WEEE requires mobile phones be lead-free in 01, 2006• Solder paste must be lead-free• PWB board finish must be lead-free• Component termination finishes & balls must be Pb-free
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3 W. Peng Pb-free, 2002
Purposes
• To investigate reliability of totally lead-free solder joints• To study effects of gold coating thickness on Sn-Ag-Cu-
Sb solder joint performance• To discern failure mechanisms & microstructural evolution
differences in Sn-Ag-Cu-Sb and Sn-Pb-Ag solder joints after thermal cycling
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4 W. Peng Pb-free, 2002
Experimental
• Materials/Hardware• 14 leadless component packages, Ni/Au termination finish
• FR4 high density micro-via test boards, Ni/Au surface finish
• Sn-Ag-Cu-Sb and Sn-Pb-Ag solder pastes• Test
• After reflow, after 200 cycles, after 500 cycles between −40 and 85°C
• Analysis• SEM, EDX for microstructural analysis
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5 W. Peng Pb-free, 2002
Sample Matrix
Flash Au0.02-0.05um
Organicsubstrate
Intermediate Au0.15-0.5um
Ceramicsubstrate
Thick Au0.5-1.2umCeramicsubstrate
14 component packagesAfter reflow
200 cycles (-40 ~ 85°C)500 cycles (-40 ~ 85°C)
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6 W. Peng Pb-free, 2002
Aspects of Analysis
• Voiding• Phase identification• Microstructure & interface• Effect of gold content • Effect of substrate• Effect of package size• Crack generation and development• What is the maximum Au content that can
be tolerated ????
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7 W. Peng Pb-free, 2002
ResultsVoiding vs. Au thickness
Flash gold, round voidsSn-Ag-Cu-Sb solder
Thick gold, irregular voidsSn-Ag-Cu-Sb solder
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8 W. Peng Pb-free, 2002
Voiding vs. solder paste
VoidsVoidsVoidsVoids
Sn-Ag-Cu-Sb, irregular shape.Thick gold
Sn-Pb-Ag, round shape.Thick gold
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9 W. Peng Pb-free, 2002
Effect of gold content on voiding
Solubility of gold in Sn-Ag-Cu-Sb is greater than in Sn-Pb due to high Sn and high reflow temperature
Fraction of AuSn4 in the molten Sn-Ag-Cu-Sb joint is greater than in the Sn-Pb-Ag joint
AuSn4 crystals in molten solder will increase solder viscosity and degrade its spreadability
Increased viscosity restricts the release of gasses, resulting in higher void content
Fast cooling rate and large fraction of AuSn4results in irregular voids in thick gold joint
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10 W. Peng Pb-free, 2002
Phase identification
Sn-Ag-Cu-Sb solder joint with thick gold terminal finish
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11 W. Peng Pb-free, 2002
Ag
AuSn4
Ag3Sn
Sn
Au
Sn
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12 W. Peng Pb-free, 2002
Au contents in Sn-Ag-Cu-Sb joint by EDX
Flash gold, ~1.5wt.% Medium gold ~ 3 wt. %
Special case, 12~17wt.%Thick gold, 5~7wt.%
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13 W. Peng Pb-free, 2002
Microstructure change of Sn-Ag-Cu-Sb joint
Flash gold, reflowed Flash gold, 500cy
Thick gold, reflowed Thick gold, 500cy
No noticeable change in microstructure after thermal cycling
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14 W. Peng Pb-free, 2002
Microstructure change of Sn-Pb-Ag joint
Flash gold, reflowed Flash gold, 500cy
Pb-rich phase becomes irregular
Thick gold, reflowed Thick gold, 500cy
Coarsened Au-needles & Pb-rich phase
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15 W. Peng Pb-free, 2002
Interface of Sn-Ag-Cu-Sb joint after 500 cycles
Cu Ni
AuSn4
(Cu,Ni)6Sn5
Flash gold joint
AuSn4
Ni-Co
Thick gold joint
• (Cu,Ni)6Sn5 between Ni &solder
• Au, Ag, Cu & Ni mixed IMCs
• Micro-cracks at interface
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16 W. Peng Pb-free, 2002
Interface of Sn-Pb-Ag joint after 500 cycles
Pb phase
AuSn4
Flash gold joint Thick gold joint
• Ni3Sn4 at interface• No Pb-rich phase at
interface
• Pb-rich layer at interface• AuSn4 layer at interface • AuSn4 needles throughout
joint
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17 W. Peng Pb-free, 2002
Good joints: Flash gold finish & organic substrate
organic
Sn-Ag-Cu-Sb
500cy
organic
Sn-Ag-Cu-Sb
reflowed
organic500cy
Sn-Pb-Ag
organic
Sn-Pb-Ag
reflowed
Package size: 5.6x5.6x1.6mm
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18 W. Peng Pb-free, 2002
Bad joints: Thick gold finish & ceramic substrate
200cy
ceramic
Sn-Ag-Cu-Sb
ceramic
Sn-Ag-Cu-Sb
500cy
reflowed
Package size, 3.1x3.1x1.2mmMedium Au joints are similar to thick Au joints
ceramic ceramic
Sn-Pb-Ag Sn-Pb-Ag500cy
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19 W. Peng Pb-free, 2002
Effect of package size
9.5x7.5x2mm, 200 cyclesSn-Ag-Cu-Sb
ceramic ceramic
3.1x3.1x1.2mm, 200 cyclesSn-Ag-Cu-Sb
• The joint stress is higher in larger pacakges.
• Sn-Pb-Ag presents the same situation as Sn-Ag-Cu-Sb.
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20 W. Peng Pb-free, 2002
Void in solder gap
Crack generation
Component corner
Rough fillet surface Joint tip
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21 W. Peng Pb-free, 2002
Crack developmentreflowed 200cy
500cy
• Sn-Ag-Cu-Sb solder joints
• Package size: 9.5x7.5x2mm
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22 W. Peng Pb-free, 2002
• Sn-Ag-Cu-Sb solder joint
• Cracks originate at void in gap area
• Easier crack propagation along IMC boundary
Crack development
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23 W. Peng Pb-free, 2002
Crack start from tip
PWB
Crack development
PbSn
AuSn4
• Sn-Pb-Ag solder joint• Cracks start from tip• Propagated along Pb/Sn
interface or in Pb-rich phase• Cracked joint smoother than
Sn-Ag-Cu-Sb joint• Role of Pb-rich phase
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24 W. Peng Pb-free, 2002
High Au content may be tolerated
Sn-Ag-Cu-Sb solder joint after 500 cycles
20Sn80Au
AuSn2
AuSn4
20Sn80Au
AuSn4
SMALL PACKAGE3.0x3.0x1.2mm
12~17wt.% Au
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25 W. Peng Pb-free, 2002
High Au content may be toleratedNo solder joint cracks
I
II
AuAu-Sn
AuAu-Sn
20Sn80Au
AuSn4
Au-Sn IMC
SMALL PACKAGE3.0x3.0x1.2mm
12~17wt.% Au
Sn-Pb-Ag solder joint after 500 cycles
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26 W. Peng Pb-free, 2002
PrimaryAuSn4
Eutectic
Au-Sn-Pb microstructure
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27 W. Peng Pb-free, 2002
High Au can be prevented
20Sn80AuConfined well
I
II
I
II
No big AuSn4in Sn-Pb-Ag joint
Sn-Au solder is confined in component joint as indicated by the white arrow.
Sn-Pb-Ag solder joint after 500 cycles
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28 W. Peng Pb-free, 2002
Conclusions• Microstructure of Sn-Ag-Cu-Sb solder joint is more stable than
that Sn-Pb-Ag joint in the temperature range studied. (p13-16)
• Presence of Au affects voiding because of Au-Sn IMC formation.Thick gold finish results in irregular voids (p7)
Flash gold finish results in spherical voids (p7)
Sn-Ag-Cu solder joint has more, bigger & irregular voids (p8)
• High Au content may be tolerated both in Sn-Ag-Cu-Sb and Sn-Pb-Ag solder joints in specific instances, but further study is needed. (p24-26)
• Combination of gold content and CTE is the main reason for the failures observed, package size plays an important role. (p17-20)
• Flash gold is recommended for all applications. (p17 -20)
• Failure mechanism of Sn-Ag-Cu-Sb solder joint is different from that of Sn-Pb-Ag solder joint. (p21-23)
• Sn-Ag-Cu-Sb solder provides better performance than Sn-Pb-Ag solder
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29 W. Peng Pb-free, 2002
Acknowledgements
• Ted Carper for helpful discussions
• Sridhar Canumalla and Sesil Mathew for analysis support