mlx90392...mlx90392 3d magnetometer datasheet datasheet transportstraat 1 3980 tessenderlo phone:...

MLX90392

3D Magnetometer Datasheet

Datasheet

Transportstraat 1 3980 Tessenderlo

Phone: +32 13 61 16 75 Fax: +32 13 67 07 70

www.melexis.com

Features and Benefits ▪ 3-axis magnetometer device suitable for

compass and position sensors applications

Triaxis Hall Technology

▪ Suitable for space constrained applications (only 2 x 2,5 x 0.4mm)

▪ Compatible with I2C FM+

▪ Low power application – Power down current of 1.5uA

▪ Supply voltage of 1.8V

▪ Ambient temperature range from -40degC to 85degC

▪ Digital Output

o 16-bit Magnetic (XYZ)

o 16-bit Temperature

▪ At runtime selectable modes

o Single Measurement

o Continuous Mode up to 1.4kHz (XYZ)

▪ RoHS Compliant & Green Package

UTDFN-8

Application Examples ▪ Power tools - Screwdriver trigger

▪ Home security - door/ window opening detection

▪ Knobs for White goods

▪ PC peripheral – Mouse roller

▪ Gaming joystick

▪ Anti-tamper for energy metering

Description The device, especially designed for micropower applications, measures magnetic fields along the 3 axis (X, Y being in a plane parallel to the surface of the die, Z being perpendicular to the surface). Those measurements and the IC temperature are converted into 16-bit words which are transferred upon request over I2C communication channel. The device transmits compensated raw measurement data. The MLX90392 is available in 2 magnetic versions:

▪ +/-5mT range for Low noise applications

▪ +/-50mT range for position sensor applications

MLX90392 3D Magnetometer

Revision 002 – 15 Apr 2021 Datasheet of 40 3901090392

1. Ordering information

Ordering Code Temperature Package Type Output Packing

MLX90392ELQ-AAA-010-RE -40°C to 85°C UTDFN-8 2x2.5 +/-5mT I2C Reel MLX90392ELQ-AAA-011-RE -40°C to 85°C UTDFN-8 2x2.5 +/-50mT I2C Reel Table 1 – Ordering codes

Legend:

Product Name

Temperature Code

Package Code

Packing Delivery Form

Option Code for variant

Silicon & Firmware Version



2. Contents

Contents Features and Benefits ........................................................................................................................................... 1

Application Examples ........................................................................................................................................... 1

Description ........................................................................................................................................................... 1

1. Ordering information.................................................................................................................................... 2

2. Contents ....................................................................................................................................................... 3

3. Glossary of terms .......................................................................................................................................... 5

4. Pins Description and Block diagram ............................................................................................................. 6

4.1. Pins description .................................................................................................................................... 6

5. Block Diagram ............................................................................................................................................... 6

6. Conditions and Specifications ....................................................................................................................... 7

6.1. Absolute Maximum Ratings (AMR) ...................................................................................................... 7

6.2. Operating Conditions ............................................................................................................................ 7

6.2.1. General Operating Conditions ...................................................................................................... 7

6.2.2. Electrical Operating Conditions .................................................................................................... 7

6.2.3. Magnetic Operating Conditions.................................................................................................... 7

6.2.4. I2C Timings Conditions ................................................................................................................. 8

6.3. Electrical Specifications ........................................................................................................................ 9

6.4. Magnetic Specifications ......................................................................................................................10

6.5. Timing Specifications ..........................................................................................................................12

6.6. Accuracy Specifications ......................................................................................................................14

7. Functional Description & Interfaces ...........................................................................................................15

7.1. Operating Modes ................................................................................................................................15

7.1.1. Single measurement mode .........................................................................................................15

7.1.2. Continuous measurement Mode ...............................................................................................17

7.1.3. Self-test Mode (recommended for version xxx - 010) ................................................................20

7.1.4. Idle mode ....................................................................................................................................22

7.2. Output protocol (I2C) description ......................................................................................................22

7.2.1. Command implementation ........................................................................................................22

7.3. Memory items description .................................................................................................................24

7.3.1. Memory Structure ......................................................................................................................24

7.3.2. I/O registers description .............................................................................................................24

7.4. Flowchart ............................................................................................................................................29

7.5. Performance Graphs ...........................................................................................................................30

7.5.1. Noise performance .....................................................................................................................30



7.5.1.1.1. Version 010 - Without temperature compensation ...............................................................30

7.6. Temperature compensation ...............................................................................................................33

8. Application Information .............................................................................................................................34

8.1. Recommended Application Diagram ..................................................................................................34

9. Package and Manufacturability information ..............................................................................................34

9.1. ESD precaution ...................................................................................................................................34

9.2. Package information ...........................................................................................................................35

9.2.1. Dimensions .................................................................................................................................35

9.2.2. Sensing element placement .......................................................................................................36

9.2.3. Marking .......................................................................................................................................37

9.3. Standard information on soldering processes ...................................................................................37

10. References ..............................................................................................................................................38

10.1. List of figures ..................................................................................................................................38

10.2. List of tables ....................................................................................................................................38

11. Revision History ......................................................................................................................................39

12. Disclaimer ...............................................................................................................................................40



3. Glossary of terms Term Description

NC Not Connected ADC Analog-to-digital converter LSB Least significant bit MSB Most significant bit

Gauss (G) Units for magnetic flux density – 1mT = 10G RMS Root mean square POR Power On reset NV Non-volatile DSP Digital signal processing



4. Pins Description and Block diagram

4.1. Pins description

Pin # Name (I2C) Description

1 SDA [I/O] Bus Data

2 VDD [S] Supply

3 VSS [S] Ground

4 SCL [I] Bus clock 5 Not used Not connected 6 Not used Not connected 7 Not used Not connected 8 Not used Not connected

Table 2 – Pin description

5. Block Diagram

Figure 1: IC block diagram



6. Conditions and Specifications

6.1. Absolute Maximum Ratings (AMR) Operating Characteristics, TA = -40°C to 85°C (unless otherwise specified)

Parameter Symbol Min. Typ. Max. Unit Conditions

Supply Voltage VS 2.3 V <48h Reverse voltage protection VSREV -0.3 V Room temp, <48h

Output voltage VSDA, VSCL 2.3 V <48h Reverse output voltage VSDAREV -0.3 V

Reverse clock output voltage VSCLREV -0.3 V ESD HBM (all pins) kV

Operating Temperature TA -40 +85 °C Junction Temperature TJUNC +85 °C Storage Temperature Tstorage -40 150 °C

Thermal resistance Rthja 230

40

K/W

K/W

Junction to ambient 1s0p board

Junction to ambient multi layered pcb

Thermal resistance Rthjc 3.4 K/W Junction to case Magnetic Flux density -1 1 T

Table 3– Absolute Maximum Ratings

Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.

6.2. Operating Conditions

6.2.1. General Operating Conditions


Operating Temperature TA -40 +85 °C Storage Temperature Tstorage -40 150 °C

Table 4 – General operating conditions

6.2.2. Electrical Operating Conditions


Supply Voltage VS 1.65 1.8 1.95 V

Table 5 – Electrical Operating conditions

6.2.3. Magnetic Operating Conditions


Magnetic Flux density -5 5 mT version XXX-010 Magnetic Flux density -50 50 mT version XXX-011

Table 6 – Magnetic Operating conditions



6.2.4. I2C Timings Conditions

Electrical Parameter Symbol I2C Standard Mode I2C Fast Mode Plus

Unit Min. Max. Min. Max.

SCL Clock Frequency f (SCL) 0 100 0 1000 kHz SCL Clock Low Time tw (SCLL) 4.7 0.5 µs SCL Clock High Time tw (SCLH) 4 0.26 µs

SDA Setup Time tsu (SDA) 250 50 ns SDA Data Hold Time th (SDA) 0 3.45 0 0.45 µs

START Condition Hold Time th (ST) 4 0.26 µs REPEATED START Condition Setup Time tsu (SR) 4.7 0.26 µs

STOP Condition Setup Time tsu (SP) 4 0.26 µs Bus Free Time Between STOP and START

Condition tw (SP:ST) 4.7 0.5 µs

Table 7: General I2C Timing Specification

Figure 2: I2C Timing Diagram



6.3. Electrical Specifications Operating Characteristics, TA = -40°C to 85°C (unless otherwise specified)


Power On Reset (rising edge) VPOR_LH 1.44 1.5 1.55 V Power On Reset (falling edge) VPOR_HL 1.35 1.4 1.45 V

Conversion Current IDD,CONVXY

IDD,CONVZ

2.2 2.7

2.7 3.6

3.5 5.2

mA mA

XY axis - Version 010 Z axis - Version -010

Conversion Current IDD,CONVXY

IDD,CONVZ 1.4 1.9

1.8 2.8

2.7 4.3

mA mA

XY axis - Version 011 Z axis - Version -011

Conversion current IDD,CONVT 0.6 0.73 0.85 mA Temperature Counting state current IDD,CNT 6 11 16 µA

Idle current IDD,IDLE 0.4 1.5 3 µA Average current

100Hz refresh

IDD,AVG100-0 1.8 2.3 3.2 mA Version xxx-010 Continuous mode XYZT,

OSR_HALL=1 DIG_FILTXY=4 DIG_FILTZ=5

DIG_FILT_TEMP=1 OSR_TEMP=1

Temp Comp enabled

Average current

100Hz refresh

IDD,AVG100-1 1.2 1.7 2.7 mA VersionXXX-011 Continuous mode XYZT,



Temp Comp enabled Average current

100Hz refresh





200Hz refresh





200Hz refresh




Temp Comp enabled




Temperature sensor resolution(1)

TRES 48 50 52 LSB16/°C

Temperature sensor accuracy TLIN -3 3 °C +/-3sigma Input Level High(2) VIH 56 59 63 %VDD SDA, SCL Input Level Low(2) VIL 43 48 54 %VDD SDA, SCL

Input Level Hysteresis VIHYST 5 11 17 %VDD SDA, SCL Input Capacitance(2) Cin 5 10 pF SDA, SCL

Output Level Low VOL 0.5 1 %VDD SDA (Static, 1mA

load) Output on resistance Rdson 5 8 14 ohms +/-3sigma

Output leakage current 0.1 0.3 uA ESD HBM 2 kV All pins ESD CDM 0.5 kV All pins

Table 8 – Electrical Operating conditions

6.4. Magnetic Specifications Operating Characteristics, TA = -40°C to 85°C (unless otherwise specified)


XY Magnetic sensitivity SENSXY 0.135 1.33

0.15 1.5

0.165 1.67

µT/LSB version xxx-010 version xxx-011 room temperature

Z Magnetic Sensitivity SENSZ 0.135 1.33

0.15 1.5

0.165 1.67

µT/LSB version xxx-010 version xxx-011 room temperature

Magnetic measurement range BRANGE ±4421 ±43560

±4912 ±49128

±5403 ±54696

µT µT

version xxx-010 version xxx-011 room temperature

RMS Noise

NXYZ

2.2

2.4 µTrms

version xxx-010 with temperature compensation – 5ms conv time (DIG_FILTXY=3 DIG_FILTZ=4, OSR_HALL=1), room temperature

RMS Noise NXYZ

1.5

1.7 µTrms

version xxx-010 without temperature compensation 5ms conv time (DIG_FILTXY=3 DIG_FILTZ=4, OSR_HALL=1), room temperature

1 The data format is 2’s complement with 0 lsb corresponding to 0degC 2 This specification relates to the sensor and not the I2C bus




RMS Noise NXYZ

11 12 µTrms version xxx-011 without temperature compensation – 5ms conv time (DIG_FILTXY=3 DIG_FILTZ=4, OSR_HALL=1), room temperature

RMS Noise NXYZ

20 21 µTrms version xxx-011 with temperature compensation - 5ms conv time (DIG_FILTXY=3 DIG_FILTZ=4, OSR_HALL=1), room temperature

Sensitivity drift SENSTHD -10 10 % vs. Ta=35degC Hysteresis Bh 200 µT

Table 9 – Magnetic Specifications



6.5. Timing Specifications Operating Characteristics, TA = -40°C to 85°C (unless otherwise specified)


Output refresh rate(3)

Fr1 10 100 700 Hz

With temperature compensation (4)

Fr2 1400 Hz

Without temperature

compensation (4) Oscillator trimming accuracy TOSC_TRIM -5 0.5 5 %

Oscillator Thermal drift TOSC_THD -5 0 5 %

Magnetic axis conversion time(5)

TCONVM 105 111 117 µs Time per axis DIG_FILT=0, OSR=0



TCONVM 13.1 13.8 14.5 ms Time per axis DIG_FILT=7, OSR=1

Start up time TStartup 0.15 1.2 ms Reset to idle mode

DSP Time

TDSP 360

220

380

235

400

250

µs

µs

with temp compensation

enabled (3)

with temp compensation

disabled (3) Table 10 – Timing specifications

3 Fr1 and Fr2 are defined as the period between two set of measurements. It is relevant for the Continuous measurement mode and

is defined by the parameter MODE[3:0]. TREFRESH is adjustable with the following settings: 10Hz, 20Hz, 50Hz, 100Hz, 200Hz, 500Hz and 1.4kHz. The default value in the non-volatile memory is 100Hz. 4 The temperature compensation can be enabled or disabled by the user. 5 This conversion time is defined as the time to acquire a single axis of the magnetic flux density. When measuring XYZ, they are

obtained through time-multiplexing. The conversion time is programmable through DIG_FILT for magnetic and temperature conversion. The total conversion time is obtained by summing up the magnetic & temperature conversion time.



Figure 3: Conversion time

The above graph can be expressed with the following formula:



6.6. Accuracy Specifications Operating Characteristics, TA = -40°C to 85°C (unless otherwise specified). All specifications in this chapter are given with +/- 3 sigma.


Resolution(6) 16 bits XYZ Offset (7) OFFSX

OFFSY OFFSZ

-1100 -1100 -300

-200 -200 300

700 700 900

LSB16 Version xxx-010 Output at 0Gauss.

Room temperature

Offset thermal drift X-axis Offset thermal drift Y-axis Offset thermal drift Z-axis

-840 -750 -440

1030 870 470

LSB16 Version xxx-010 vs. 35degC

Offset (7) OFFSX OFFSY OFFSZ

-150 -330 -340

40 -130 80

220 70

500

LSB16 Version xxx- 011

Output at 0Gauss. Room temperature

Offset thermal drift X-axis Offset thermal drift Y-axis Offset thermal drift Z-axis

-120 -100 -220

90 120 190

LSB16 Version xxx-011 vs. 35degC

Mismatch on the raw signals X, Y and Z

SMISMXY

SMISMXZ

SMISMYZ

-5 -5 -3

-1 -2 -1

2 1 1

% Version xxx-010

Parameter Symbol Min. Typ. Max Units Conditions

Thermal drift of sensitivity mismatch

-110 225 ppm/°C Version xxx-010

Mismatch on the raw signals X, Y and Z

SMISMXY

SMISMXZ

SMISMYZ

-3 7 6

1 10 9

5 13 11

% Version xxx-011

Thermal drift of sensitivity mismatch

-140 265 ppm/°C Version xxx-011

Cross-axis sensitivity (8) SXYi SYXi SXZi SZXi SYZi SZYi

-1.8 -2.7 -8.0 -5.0 -5.7 -4.8

0.5 -0.7 -3.2 -0.2 0.5 0.9

2.6 1.3 1.8 4.5 6.6 3

% Version xxx-010 (guaranteed by

characterization / not by final testing)

Cross-axis sensitivity (8) SXYi SYXi SXZi SZXi SYZi SZYi

-1.5 -1.7 -1.3 -3.0 -9.6 -3.3

0.2 0.0 4.9 1.0 -6.3 -1.6

1.9 1.8

12.4 5.6 -4.1 -0.5

% Version xxx-011 (guaranteed by

characterization / not by final testing)

Table 11 – Accuracy specifications

6 The data format is 2’s complement, further explanation can be found on chapter 7.1.2.6, Table 12 7 Value of measurement data register on shipment test without applying magnetic field on purpose 8 The cross axis sensitivity is measured by applying a force field on one axis and measured on another axis. For instance, SXYi means

that a field was applied along X axis and measured along Y axis.



7. Functional Description & Interfaces

7.1. Operating Modes MLX90392 has the following Application modes 1. Idle mode 2. Single measurement mode 3. Continuous measurement mode (10Hz, 20Hz, 50Hz, 100Hz, 200Hz, 500Hz, 700Hz and 1.4kHz) 4. Self-test mode

Operating Mode

Start of Mode

End of Mode (Return to IDLE)

Measurement Data

Single measurement

Command to enter mode 1

or 9

Measurement finished

(T)XYZ

Continuous mode

Command to enter mode 2, 3, 4, 5, 10, 11,

12, 13

Transition to other mode

(T)XYZ

Idle Mode

Power up or command to

enter mode 0, 7, 8, 15

Transition to other mode

-

Self-test Mode

Command to enter mode 6 and 14 from

Idle

Measurement finished

Z

7.1.1. Single measurement mode

When the Single measurement mode is set, a magnetic measurement is started. After a measurement and when the signal processing is finished, the measurement data is stored to the data registers (X, Y and Z). After this, the sensor will go to the Idle mode automatically. While going to the Idle mode, MODE[3:0] bits turns to 0. At the same time, DRDY bit (Data Ready) in STAT1 register turns to Low. When any of measurement data register (X, Y and Z) is read, DRDY bit turns to Low. It remains High when switching from Idle mode to another mode.

Figure 4: Single measurement mode when data is read out of measurement period



When the sensor is measuring, the data registers (X, Y and Z) keep the previous data. Therefore, it is possible to read out data even during measurement periods.

Figure 5: Single measurement mode when data read started during measurement period



7.1.2. Continuous measurement Mode

When the "Continuous measurement" mode is set, the measurement starts periodically. After measurement and signal processing is finished, the measurement data is stored to the data registers (X, Y, and Z). Almost all internal blocks are disabled ("Counting" power state). After a measurement period, the device wakes up automatically from "Counting" power state and starts a new measurement. The Continuous measurement mode ends when "Idle" mode (MODE[3:0] bits = 0) is set. If the measurement period is changed while the device is already configured in "Continuous measurement" mode, a new measurement starts. STAT1 and measurement data registers (X, Y and Z) will not be initialized by this.

Figure 6: Continuous measurement mode

7.1.2.1. Data Ready

When the measurement data is stored and ready to be read, the DRDY bit (Data ready) in STAT register is set to High. When a measurement is performed correctly, the device sets the Data Ready bit before going back to "Counting" power state.

7.1.2.2. Normal Read Sequence

The stored measurement data is protected during the data reading. There is no update of the data during this time. Consequently, the following sequence should be followed:

1. Check if the Data is Ready or not by polling DRDY bit of STAT1 register

a. DRDY: Data Ready. The Data is ready when set High.

2. Reading of the STAT1 register will not trigger the protection.

3. Read measurement data - When any of the measurement data register (X, Y, or Z) is read, the device enables the protection as soon as the register is copied into the I2C sending register. When data reading starts, DRDY (Data ready) bit turns Low.

4. Read STAT2 register (required for data consistency - provides information on overflow and data skip)

When this read sequence is followed and there is no attempted I2C read during measurement, reading of STAT2 sets the DOR bit to low (see I/O registers description for reference).



Figure 7: Normal read sequence

7.1.2.3. Data Read Start during Measurement

When the sensor is measuring, the measurement data registers (X, Y and Z) keep the previous data. Therefore, it is possible to read out data even in measurement period.

Figure 8: Data read start during measurement



7.1.2.4. Data Skip

If the available data is not read before a new measurement ends, the DRDY bit (Data Ready) remains High. However, a new set of measurement data will replace the previous one.

Figure 9: Data Skip: When data is not read

If the available data is read while a new measurement is being performed, this set of data will be protected. This is also the case even if the reading procedure finishes after the measurement. Consequently, this new set of data is skipped.

Figure 10: Data Skip: When data read has not been finished before the next measurement end



7.1.2.5. End Operation

Set the Idle mode (MODE[3:0] bits = 0) to end the Continuous measurement mode.

7.1.2.6. Magnetic Sensor Overflow

Version - 010 The sum of absolute values of each axis must be smaller than 4912μT to avoid an overflow. (BRG: 0.15μT/LSB)

|X|+|Y|+|Z| < 4912μT

2's complement Hex Dec Magnetic flux density [μT] 0111_1111_1111_0000 7FF0 32752 4912

| | | |

0000_0000_0000_0001 0001 1 0.15

0000_0000_0000_0000 0000 0 0

1111_1111_1111_1111 FFFF -1 -0.15

| | | |

1000_0000_0001_0000 8010 -32752 -4912 Table 12 - Measurement magnetic data format

Version - 011 The sum of absolute values of each axis must be smaller than 49.13mT to avoid an overflow. (BRG: 1.5μT/LSB)

|X|+|Y|+|Z| < 4913μT

2's complement Hex Dec Magnetic flux density [μT] 0111_1111_1111_0000 7FF0 32752 4913

| | | |

0000_0000_0000_0001 0001 1 1.5

0000_0000_0000_0000 0000 0 0

1111_1111_1111_1111 FFFF -1 -1.5

| | | |

1000_0000_0001_0000 8010 -32752 -4913 Table 13 - Measurement magnetic data format

The calculation is done as follows: |X|+|Y|+|Z| < 32752 When the magnetic field exceeds this limitation, this is a Magnetic Sensor Overflow. When magnetic sensor overflow occurs, HOVF bit turns to “High”. The HOVF bit is updated as soon as the measurement data register (X, Y and Z) is updated.

7.1.3. Self-test Mode (recommended for version xxx - 010)

The Self-test mode is used to check if the magnetic sensor is working normally. When the Self-test mode is set, a magnetic field is generated by the internal magnetic source and a measurement is performed. The data is stored to the data registers (X, Y and Z). The sensor will then go to Idle mode automatically. The correct sequence to set the Self-test Mode is described below:

7.1.3.1. Self-test Sequence

1. Set Idle mode.

2. Set Self-test mode.

3. Check Data Ready or not by polling DRDY bit (Data Ready) of STAT1 register.

a. When the data is ready, proceed to the next step.

4. Read measurement data. (X, Y and Z)



7.1.3.2. Self-test Judgment (used by the customer)

The following criteria will help the user to decide if the sensor is correctly calibrated.

DeltaX[15:0] DeltaY[15:0] DeltaZ[15:0] Units

Criteria -150 ≤ X ≤ 150 -150 ≤ Y ≤ 150 -1200 ≤ Z ≤ -400 LSB16

The typical magnetic field generated by the internal coil is around 135μT at room temperature. The self-test judgement are the expected values over temperature and voltage variations



7.1.4. Idle mode

In Idle mode, the device is in minimal power consumption state. All internal blocks including the oscillator are disabled except the POR circuit. Only the communication over the I2C interface is maintained. The digital handling of the communication is clocked by the I2C master clock. All registers remain accessible and the data stored in read/write registers remains.

7.2. Output protocol (I2C) description

7.2.1. Command implementation

The following I2C commands are implemented:

▪ MEM_DIRECT_READ: reads data from memory space, starting from the default address 0x00

▪ MEM_READ: the start address will be specified in the command and the address will be incremented for continuous reading until an I2C stop is detected.

▪ MEM_WRITE: the start address will be specified followed by the data to be stored at addresses starting from the given start address and incremented until an I2C stop is detected.

▪ ADDRESSED_RESET: reset of the device, based on the I2C Slave Address (reset of addressed devices on the I2C bus only)

In the next sections, the format of the different I2C commands is explained. The following legend is used:

7.2.1.1. Read Commands

There are two read commands that are implemented

▪ MEM_DIRECT_READ: reads data from memory space, starting from the default address 0x00

▪ MEM_READ: the start address will be specified in the command and the address will be incremented for continuous reading until an I2C stop is detected.



7.2.1.1.1. MEM_DIRECT_READ (direct read) Command

MEM_DIRECT_READ: reads data from memory space, starting from the default address 0x00

Figure 11: I2C - MEM_DIRECT_READ (direct read) Command

NOTES:

▪ Incremental readout – return 0x00 when address out of valid space

▪ NAK is needed from master to allow going to STOP

7.2.1.1.2. MEM_READ (addressed read)

MEM_READ: the start address will be specified in the command and the address will be incremented for continuous reading until an I2C stop (P) is detected. Incremental read-out starting at a given address (Register Start Address). Normally it will read 1x register only, but the slave will continue to transmit data of sequential register addresses until the master terminates the communication.

Figure 11: I2C - MEM_READ (addressed read)

Important! A repeated START is required to perform an “addressed read”. Without repeated START, the command will be seen as a “direct read”.

As soon as incremental addressing leaves the address space, the slave will respond with all 0x00. NOTES:

▪ Incremental readout – return 0x00 when address out of valid space

▪ NAK is needed from master to allow going to STOP

7.2.1.2. MEM_WRITE (addressed write) Command

MEM_WRITE: the start address will be specified followed by the data to be stored at addresses starting from the given start address and incremented until an I2C stop (P) is detected. Incremental write starting at a given address (Register Start Address). Normally you write 1x register only, but optionally the master can continue to transmit data of sequential register addresses to reduce the communication time when a lot of registers should be written.

Figure 12: I2C - MEM_WRITE (addressed write) Command

The slave is sending AK/NAK based on the fact whether it was able to write data The slave will automatically increment the address of the read out byte, independent if it gave an AK or a NAK to the master. It is up to the master to re-write the byte afterwards. When the device is busy with the write operation, new write commands will be ignored. A read operation will return invalid data.



7.2.1.3. ADDRESSED_RESET: Addressed reset

The addressed reset command brings the device back into a state like it was after power-on. The I2C Slave Address is used, which means that only the addressed devices on the I2C bus will be reset.

7.3. Memory items description

7.3.1. Memory Structure

The MLX90392 has registers (ports) of 16 addresses. Each address consists of 8 bits data. Data is transferred to or received from the external CPU via the I2C interface.

Table 14 – Memory map

DNC=Do Not Change The STAT1 register is mapped on address 0x00, since it is the default address of MEM_DIRECT_READ (direct read) command. The idea is that first the user has to read the status bits DRDY to check if there is new data and if there is new data, to continue the command to read the registers X, Y and Z.

7.3.2. I/O registers description

1. Address 0x00. STAT1[7:0]

7 6 5 4 3 2 1 0

STAT1_7 STAT1_6 STAT1_5 STAT1_4 RT STAT1_2 STAT1_1 DRDY

RW-0 RW-0 RW-0 RW-0 RW-1 RW-0 RW-0 RW-0

NOTE: R=Read access; W=Write access; value following dash (-) = value after reset

Bit 7 – 4 STAT1[7:4]. Reserved (Not used)



Bit 3

RT. The device is reset

0 – The device was not reset

1 – The device was reset and this is the first reading. Automatically set to 0 when the first

reading of STAT register is done


Bit 0

DRDY. Data Ready.

DRDY bit turns to “1” when data is ready in "Single measurement" mode, "Continuous

measurement" mode or "Self-test" mode.

It returns to “0” when any one the measurement data register (X, Y or Z ) is read

0 – Normal

1 – Data is ReaDY

2. Addresses 0x01- 0x06. XYZ[15:0]

Bit 7 – 0

Bit 15 –8

Bit 7 – 0

Bit 15 –8

Bit 7 – 0

Bit 15 –8

X[7:0]. LSB byte of X axis

X[15:8]. МSB byte of X axis

Y[7:0]. LSB byte of Y axis

Y[15:8]. МSB byte of Y axis

Z[7:0]. LSB byte of Z axis

Z[15:8]. МSB byte of Z axis

3. Address 0x07. STAT2[7:0]

7 6 5 4 3 2 1 0

STAT2_7 STAT2_6 STAT2_5 STAT2_4 STAT2_3 STAT2_2 DOR HOVF



STAT2 register contains the following bits:


Bit 1

DOR. Data Overrun

DOR bit turns to “1” when data has been skipped in "Continuous measurement" mode. It returns to

“0” when the data registers (X, Y, Z) are read.

0 – Normal

1 – Data OverRun



Bit 0

HOVF. Magnetic Sensor OverfLow

0 – Normal

1 – Magnetic Sensor Overflow occurred

In "Single measurement" mode, "Continuous measurement" mode and "Self-test" mode, the magnetic sensor may

overflow even though the measurement data register is not saturated. In this case, measurement data is not correct and HOVF bit turns to “1”. When the measurement data register is updated, HOVF bit is updated.

4. Addresses 0x08- 0x09. T[15:0]

Bit 7 – 0

Bit 15 –8

T[7:0]. LSB byte of Temperature

T[15:8]. МSB byte of Temperature

5. Addresses 0x0A. CID[7:0]

Bit 7 – 0 CID[7:0]. Company ID

6. Addresses 0x0B. DID[7:0]

Bit 7 – 0 DID[7:0]. Device ID

7. Addresses 0x10. CTRL[7:0]

7 6 5 4 3 2 1 0

CTRL_7 CTRL_6 CTRL_5 CTRL_4 MODE3 MODE2 MODE1 MODE0



Bit 7 - 4 CTRL[7:4]. Reserved (Not used)

Bit 3 - 0

MODE[3:0]. Application Mode

0 – Idle mode

1 – Single Measurements mode

2 – Continuous measurement mode 10Hz




6 – Self-test mode

7 – Idle mode



8 – Idle mode

9 – Single Measurements mode




13 – Continuous measurement mode 1.4kHz

14 – Self-test mode

15 – Power-down mode

8. Addresses 0x11. RST[7:0]

Bit 7 – 0 RST[7:0]. Addressed RESET when users sends an I2C_ADDRESSED_RESET command

9. Addresses 0x12-0x13. Not used

10. Addresses 0x14. OSR_DIG_FILT[7:0]

7 6 5 4 3 2 1 0

OSR_HALL OSR_TEMP DIG_FILT_HALL_XY2

DIG_FILT_HALL_XY1

DIG_FILT_HALL_XY0

DIG_FILT_TEMP2

DIG_FILT_TEMP1

DIG_FILT_TEMP0



Bit 7

OSR_HALL. Over Sampling Ratio setting for the magnetic measurements

0 - 32

1 - 64

Bit 6

OSR_TEMP. Over Sampling Ratio setting for the temperature measurement

0 - 32

1 - 64

Bits 5 - 3

DIG_FILT_HALL_XY[2:0]. DIG_FILT setting for X and Y magnetic measurements

0 - 0.113ms @ OSR = 0; 0.220ms @ OSR = 1

1 - 0.167ms @ OSR = 0; 0.327ms @ OSR = 1

2 - 0.273ms @ OSR = 0; 0.540ms @ OSR = 1

3 - 0.487ms @ OSR = 0; 0.967ms @ OSR = 1

4 - 0.913ms @ OSR = 0; 1.820ms @ OSR = 1

5 - 1.767ms @ OSR = 0; 3.527ms @ OSR = 1

6 - 3.473ms @ OSR = 0; 6.940ms @ OSR = 1

7 - 6.887ms @ OSR = 0; 13.767ms @ OSR = 1

Bits 2 - 0

DIG_FILT_TEMP[2:0]. DIG_FILT setting for the temperature measurements

0 - 0.113ms @ OSR = 0; 0.220ms @ OSR = 1

1 - 0.167ms @ OSR = 0; 0.327ms @ OSR = 1



2 - 0.273ms @ OSR = 0; 0.540ms @ OSR = 1

3 - 0.487ms @ OSR = 0; 0.967ms @ OSR = 1

4 - 0.913ms @ OSR = 0; 1.820ms @ OSR = 1

5 - 1.767ms @ OSR = 0; 3.527ms @ OSR = 1

6 - 3.473ms @ OSR = 0; 6.940ms @ OSR = 1

7 - 6.887ms @ OSR = 0; 13.767ms @ OSR = 1

11. Addresses 0x15. CUST_CTRL[7:0]

7 6 5 4 3 2 1 0

DNC = 1 DNC = 0 T_COMP_EN DNC = 1 CUST_CTRL3 DIG_FILT_HALL_Z2

DIG_FILT_HALL_Z1

DIG_FILT_HALL_Z0



Bit 7 DNC=1. Value is preloaded from OTP with 0b1. Do not change it


Bit 5

T_COMP_EN. Enable or disable the temperature measurement and compensation

0 - Disabled

1 - Enabled


Bit 3 CUST_CTRL3.Reserved. Not used

Bit 2 - 0

DIG_FILT_HALL_Z[2:0]. DIG_FILT setting for Z magnetic measurements

0 - 0.113ms @ OSR = 0; 0.220ms @ OSR = 1

1 - 0.167ms @ OSR = 0; 0.327ms @ OSR = 1

2 - 0.273ms @ OSR = 0; 0.540ms @ OSR = 1

3 - 0.487ms @ OSR = 0; 0.967ms @ OSR = 1

4 - 0.913ms @ OSR = 0; 1.820ms @ OSR = 1

5 - 1.767ms @ OSR = 0; 3.527ms @ OSR = 1

6 - 3.473ms @ OSR = 0; 6.940ms @ OSR = 1

7 - 6.887ms @ OSR = 0; 13.767ms @ OSR = 1



7.4. Flowchart

Reset

Init ializationTSTARTUP

IdleState

Active State3*TCONVM+TCONVT

+TDSP

CountingState

Single measurement

Continuous measurement

End of single measurement

Power down command

Continuous modeMeasurement finished

Continuous modeNext measurement

Power down command

Figure 13: Sequence flowchart



7.5. Performance Graphs

7.5.1. Noise performance

7.5.1.1.1. Version 010 - Without temperature compensation

Figure 14: version 010 - XY axis RMS noise (typ)

Figure 15: version 010 - Z axis RMS Noise (typ)

Note: When OSR_HALL is set to 0, the above values have to be scaled by sqrt(2).



7.5.1.1.2. With temperature compensation and maximum field

Figure 16: version 010 - XY axes RMS noise(typ)

Figure 17: version 010 - Z axis RMS noise (typ)



7.5.1.1.3. Version 011 - Without temperature compensation

Figure 18: version 011 – XY axis RMS noise (typ)




7.5.1.1.4. With temperature compensation and maximum field

Figure 20: version 011 - XY axis RMS noise (typ)


7.6. Temperature compensation The MLX90392 has a built-in temperature compensation, which is done by a piecewise linear approximation of the temperature coefficient of the Hall plates. A reference temperature is chosen (TREF=35°C), where the result at any temperature, higher than TREF is adjusted by a gain SENT_TC_HT and if the temperature is lower than TREF - by SENS_TC_LT. These two coefficients are calibrated at Melexis and are lumped into the parameter name SENS_TC in the equation below.



SENS_TC_N is a scaling factor needed for the fixed-point calculations. It is determined and written at Melexis during production test. In case the temperature compensation is not needed, bit 5 in T_EN_DIG_FILT_Z register is set to 0. This also disables the temperature measurement and the term in the square brackets of the formula above is equal to 1. The operation is executed on the 19 bits raw magnetic data which is consequently truncated to 16 bit and loaded into the results registers.

8. Application Information

8.1. Recommended Application Diagram

MLX90392

VDD

SDA

SCLGND

RSDA RSCL

100nF

C1VSUP

Figure 22: Recommended application diagram

Note: RSDA and RSCL are part of the bus specifications. Please refer to it.

9. Package and Manufacturability information

9.1. ESD precaution Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products.



9.2. Package information

9.2.1. Dimensions

UTDFN 2x2.5mm



9.2.2. Sensing element placement

0.16 ± 0.03 mm

Magnetic sweet spot

1.00 ± 0.10 mm

1.2

5 ±

0.1

0 m

m

Figure 23: Field convention (Top view of the package with pin 1 at the bottom left)



9.2.3. Marking

Marking :

Part Number MLX90392 (1 digit)

2

Masks revisions (2 digits)

AA2AA0WWY WWY

Assembly Year (Y) and week (WW)

8 7

SDA

SC

L

VS

S

VD

D

1 4

0 Version (1 digit)0->010, 1->011

9.3. Standard information on soldering processes Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level according to standards in place in Semiconductor industry. For further details about test method references and for compliance verification of selected soldering method for product integration, Melexis recommends reviewing on our web site the General Guidelines soldering recommendation (http://www.melexis.com/en/quality-environment/soldering) For all soldering technologies deviating from the one mentioned in above document (regarding peak temperature, temperature gradient, temperature profile etc.), additional classification and qualification tests have to be agreed upon with Melexis. For package technology embedding trim and form post-delivery capability, Melexis recommends consulting the dedicated trim&form recommendation application note: lead trimming and forming recommendations (http://www.melexis.com/en/documents/documentation/application-notes/lead-trimming-and-forming-recommendations). Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/en/quality-environment.



10. References

10.1. List of figures Figure 1: IC block diagram .................................................................................................................................... 6 Figure 2: I2C Timing Diagram ................................................................................................................................ 8 Figure 3: Conversion time ...................................................................................................................................13 Figure 4: Single measurement mode when data is read out of measurement period .......................................15 Figure 5: Single measurement mode when data read started during measurement period .............................16 Figure 6: Continuous measurement mode .........................................................................................................17 Figure 7: Normal read sequence .........................................................................................................................18 Figure 8: Data read start during measurement ..................................................................................................18 Figure 9: Data Skip: When data is not read ........................................................................................................19 Figure 10: Data Skip: When data read has not been finished before the next measurement end ....................19 Figure 11: I2C - MEM_DIRECT_READ (direct read) Command ...........................................................................23 Figure 12: I2C - MEM_WRITE (addressed write) Command ...............................................................................23 Figure 13: Sequence flowchart ...........................................................................................................................29 Figure 14: version 010 - XY axis RMS noise (typ) ................................................................................................30 Figure 15: version 010 - Z axis RMS Noise (typ) ..................................................................................................30 Figure 16: version 010 - XY axes RMS noise(typ) ................................................................................................31 Figure 17: version 010 - Z axis RMS noise (typ) ..................................................................................................31 Figure 18: version 011 – XY axis RMS noise (typ) ...............................................................................................32 Figure 19: version 011 - Z axis RMS noise (typ) ..................................................................................................32 Figure 20: version 011 - XY axis RMS noise (typ) ................................................................................................33 Figure 21: version 011 - Z axis RMS noise (typ) ..................................................................................................33 Figure 22: Recommended application diagram .................................................................................................34 Figure 23: Field convention (Top view of the package with pin 1 at the bottom left) ........................................36

10.2. List of tables Table 1 – Ordering codes ...................................................................................................................................... 2 Table 2 – Pin description ....................................................................................................................................... 6 Table 3– Absolute Maximum Ratings ................................................................................................................... 7 Table 4 – General operating conditions ................................................................................................................ 7 Table 5 – Electrical Operating conditions ............................................................................................................. 7 Table 6 – Magnetic Operating conditions ............................................................................................................ 7 Table 7: General I2C Timing Specification ............................................................................................................. 8 Table 8 – Electrical Operating conditions ...........................................................................................................10 Table 9 – Magnetic Specifications ......................................................................................................................11 Table 10 – Timing specifications .........................................................................................................................12 Table 11 – Accuracy specifications .....................................................................................................................14 Table 12 - Measurement magnetic data format ................................................................................................20 Table 13 - Measurement magnetic data format ................................................................................................20 Table 14 – Memory map .....................................................................................................................................24



11. Revision History

Revision Date Change history

001 13-Jan-2021 First datasheet issue (JED) 002 15-Apr-2021 Revised specifications. Package dimensions updated + Cosmetic changes (JED)



12. Disclaimer The content of this document is believed to be correct and accurate. However, the content of this document is furnished "as is" for informational use only and no representation, nor warranty is provided by Melexis about its accuracy, nor about the results of its implementation. Melexis assumes no responsibility or liability for any errors or inaccuracies that may appear in this document. Customer will follow the practices contained in this document under its sole responsibility. This documentation is in fact provided without warranty, term, or condition of any kind, either implied or expressed, including but not limited to warranties of merchantability, satisfactory quality, non-infringement, and fitness for purpose. Melexis, its employees and agents and its affiliates' and their employees and agents will not be responsible for any loss, however arising, from the use of, or reliance on this document. Notwithstanding the foregoing, contractual obligations expressly undertaken in writing by Melexis prevail over this disclaimer. This document is subject to change without notice, and should not be construed as a commitment by Melexis. Therefore, before placing orders or prior to designing the product into a system, users or any third party should obtain the latest version of the relevant information. Users or any third party must determine the suitability of the product described in this document for its application, including the level of reliability required and determine whether it is fit for a particular purpose. This document as well as the product here described may be subject to export control regulations. Be aware that export might require a prior authorization from competent authorities. The product is not designed, authorized or warranted to be suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-support or life-sustaining equipment or avionics application are specifically excluded by Melexis. The product may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage, recognition or proliferation of: 1. chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons; 2. civil firearms, including spare parts or ammunition for such arms; 3. defense related products, or other material for military use or for law enforcement; 4. any applications that, alone or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any similar violent situation. No license nor any other right or interest is granted to any of Melexis' or third party's intellectual property rights. If this document is marked “restricted” or with similar words, or if in any case the content of this document is to be reasonably understood as being confidential, the recipient of this document shall not communicate, nor disclose to any third party, any part of the document without Melexis’ express written consent. The recipient shall take all necessary measures to apply and preserve the confidential character of the document. In particular, the recipient shall (i) hold document in confidence with at least the same degree of care by which it maintains the confidentiality of its own proprietary and confidential information, but no less than reasonable care; (ii) restrict the disclosure of the document solely to its employees for the purpose for which this document was received, on a strictly need to know basis and providing that such persons to whom the document is disclosed are bound by confidentiality terms substantially similar to those in this disclaimer; (iii) use the document only in connection with the purpose for which this document was received, and reproduce document only to the extent necessary for such purposes; (iv) not use the document for commercial purposes or to the detriment of Melexis or its customers. The confidentiality obligations set forth in this disclaimer will have indefinite duration and in any case they will be effective for no less than 10 years from the receipt of this document. This disclaimer will be governed by and construed in accordance with Belgian law and any disputes relating to this disclaimer will be subject to the exclusive jurisdiction of the courts of Brussels, Belgium. The invalidity or ineffectiveness of any of the provisions of this disclaimer does not affect the validity or effectiveness of the other provisions. The previous versions of this document are repealed. Melexis © - No part of this document may be reproduced without the prior written consent of Melexis. (2021) IATF 16949 and ISO 14001 Certified

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