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MMI EXT CARD HW USER GUIDE

xE922-3GR 1VV0301324 Rev.0.1 – 2016-09-01

MMI EXT CARD HW USER GUIDE xE922-3GR

1VV0301324 Rev.0.1 – 2016-09-01

Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. of 22 Mod. 0805 2015-02 Rev.4

APPLICABILITY TABLE

PRODUCT

HE922-3GR

WE922-3GR


1VV0301324 Rev.0.1 – 2016-09-01


SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes no

liability resulting from any inaccuracies or omissions in this document, or from use of the information

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sale of a product.


1VV0301324 Rev.0.1 – 2016-09-01


Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by

express license agreement only and may be used only in accordance with the terms of such an

agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited by

law. No part of the software or documentation may be reproduced, transmitted, transcribed, stored in a

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without prior written permission of Telit

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-tolerant

and are NOT designed, manufactured, or intended for use as on-line control equipment in the following

hazardous environments requiring fail-safe controls: the operation of Nuclear Facilities, Aircraft

Navigation or Aircraft Communication Systems, Air Traffic Control, Life Support, or Weapons

Systems (High Risk Activities"). Telit and its supplier(s) specifically disclaim any expressed or implied

warranty of fitness for such High Risk Activities.

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The software may include Third Party Right software. In this case you agree to comply with all terms

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the disclaimer of warranty and limitation of liability provisions in this License shall apply to the Third

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TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED FROM

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MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM

WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE USE OF

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LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF ADVISED OF THE

POSSIBILITY OF SUCH DAMAGES.

Copyright © Telit Communications S.p.A. 2011.


1VV0301324 Rev.0.1 – 2016-09-01


Table of Contents

1. Introduction ................................................................................................................... 6

1.1. Scope ....................................................................................................................... 6

1.2. Related Documents .................................................................................................. 6

1.3. Abbreviations ........................................................................................................... 6

2. General description ...................................................................................................... 7

2.1. MMI Board view ....................................................................................................... 8

3. Component Assembly Diagram .................................................................................. 9

4. MMI Card mechanical case ........................................................................................ 11

5. 120-Pin B2B Edge connector ..................................................................................... 14

6. Schematics .................................................................................................................. 17

7. Safety Recommendations .......................................................................................... 21

8. Document History ....................................................................................................... 22

Table of Figures

Figure 1 MMI Card Top View ............................................................................................................................. 8 Figure 2 MMI Card Bottom View ....................................................................................................................... 8 Figure 3 Component Assembly Top (Top View) ................................................................................................ 9 Figure 4 component Assembly Bottom (Bottom View) .................................................................................... 10 Figure 5 MMI Mechanical Case ........................................................................................................................ 11 Figure 6 Screws connecting MMI case to EVB case ......................................................................................... 12 Figure 7 Complete DevKit view ........................................................................................................................ 13

List is Tables

Table 1 JM2 ....................................................................................................................................................... 14


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1. 0BIntroduction

1.1. 8BScope

The scope of this document is to describe the xE922-3GR MMI Board which is included in

Telit EVB-MMI pack, part of the complete xE922-3GR Development Kit.

1.2. 9BRelated Documents

1.3. 10BAbbreviations

Doc # Document Name

1VV0301272 xE922-3GR Hardware User Guide

1VV0301249 Generic Evaluation Board Hardware User Guide

1VV0301285 IFBD HW USER GUIDE_xE922-3GR

Term Definition

EVB Evaluation Board

IFBD Interface Board

MMI Multi-Media-Interface

CSI Camera serial interface

CABC Content Adaptive Backlight Control

DSI Display serial interface

GPIO General-purpose input/output

SD Secure digital

MIPI Mobile Industry Processor Interface

MII Multi-Media Interface

UART Universal asynchronous receiver transmitter

UMTS Universal mobile telecommunications system

USB Universal serial bus

USIF Universal serial interface

WCDMA Wideband code division multiple access

DRD Dual Role Device (USB)

OTG On The Go (USB)


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2. 1BGeneral description The MMI Extension Card is a complementary HW that enables multimedia functionality of Telit xE922-3GR.

The MMI card is custom designed to interface the Telit module xE922-3GR with the MMI peripherals via the

Telit Generic Evaluation Board (EVB) thus forming the complete Development Kit of xE922-3GR.

The MMI card HW design includes the following items:

FPC connector for placing 5.85” FHD display

LCD Backlight Circuit

Multi Touch Support (Via FPC Connector)

Main Camera – 13MP (Via FPC Connector)

Sub Camera – 5MP (Via FPC Connector)

Camera Flash / Flashlight Circuit

Header for connecting optional sensors

Board to Board edge connectors for interfacing the EVB main board


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2.1. 11BMMI Board view

The below pictures show the MMI card Top and bottom view

Figure 1 MMI Card Top View

Figure 2 MMI Card Bottom View


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3. 2BComponent Assembly Diagram

Searchable PDF

CS1774A_Placement

.pdf

Figure 3 Component Assembly Top (Top View)


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Figure 4 component Assembly Bottom (Bottom View)


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4. 3BMMI Card mechanical case In order to improve platform handling, maintenance and shipment and enable enhanced demo, a custom case

was designed to fit the MMI board.

The case enables access and visibility to all required items (LCD, Touch) while covering all the non-active

areas thus protecting the platform from potential damage.

The mechanical case is aligned with Telit Generic EVB mechanical case so that attaching the MMI to the

EVB main board forms a solid and robust DevKit.

The MMI mechanical case is shown below

Figure 5 MMI Mechanical Case


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In order to attach the MMI card to the Generic EVB, user should do the following:

Attach the 120 pin edge connector on MMI to the 120 pin edge connector on the EVB

Mount the screws shown below on the 2 sides of the MMI card connecting the MMI case to EVB case

Figure 6 Screws connecting MMI case to EVB case

Mount the bottom screw connecting the MMI case to ECV case


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The picture below shows the complete DevKit when the MMI card is attached to the EVB

Figure 7 Complete DevKit view


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5. 4B120-Pin B2B Edge connector The interface between MMI extension board and the generic EVB is implemented via a 120p (20p x 6 rows)

SAMTEC SEARAY 1.27mm High Speed/High Density B2B right angle (edge) connector.

The below table describes the MMI connector pin naming as well as the mapping of each MMI signal to the

associated pin of the xE922-3GR module.

Table 1 JM2 Pin # MMI Connector Pin Name Generic EVB Pin Name xE922-3GR Pad Description

1 VBATT_AUX VBATT_AUX Supply for main board

2 VBATT_AUX VBATT_AUX Supply for main board

3 DSI_CLK_N DSI_CLK_N P21 Display Interface

4 DSI_CLK_P DSI_CLK_P M21 Display Interface

5 DSI_D3_N DSI_D3_N H21 Display Interface

6 DSI_D3_P DSI_D3_P K21 Display Interface

7 GND GND GND

8 GND GND GND

9 LCD_TE GPS_PPS AP9 GPS Pulse Sync

10 NC WIFI_SDCMD_TGPIO14 N/A

11 NC WCI_RX N/A

12 DSI_D2_N DSI_D2_N J20 Display Interface

13 1V8_OUT VAUX/PWRMON 1.8V for I/O and LCD

14 CAM1_RESET WIFI_SD4_TGPIO23 G4 Main Camera Reset

15 NC LED_DRV N/A

16 NC WIFI_SDCLK_TGPIO19 N/A

17 NC TGPIO_30_CTS_GPS N/A

18 DSI_D2_P DSI_D2_P L20 Display Interface

19 1.8V 1.8V Not Used

20 NC WIFI_SD3_TGPIO18 N/A

21 VAUX_2P85V LED_DRV_EN AH17 Auto Focus Supply

22 CAM1_TORCH WIFI_SD7_TGPIO26 G6 Main Camera Torch mode enable

23 DSI_D1_N DSI_D1_N N20 Display Interface

24 DSI_D1_P DSI_D1_P R20 Display Interface

25 NC WCI_TX N/A

26 LEDFB_DN RFCLK2_QCA AU17 Backlight feedback Negative


28 CAM1_PD WIFI_SD5_TGPIO24 A4 Main Camera Power Down

29 DSI_D0_N DSI_D0_N P19 Display Interface

30 DSI_D0_P DSI_D0_P S19 Display Interface

31 I2C_SCL_AUX I2C_SCL_AUX AT2 I2C3_SCL

32 I2C_SDA_AUX I2C_SDA_AUX AS1 I2C3_SDA



35 CSI1_CLK_P CSI1_CLK_P C20 Main Camera interface


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Pin # MMI Connector Pin Name Generic EVB Pin Name xE922-3GR Pad Description

36 CSI1_CLK_N CSI1_CLK_N E20 Main Camera interface

37 CAM2_I2C_SDA I2C_SDA_EXT Front Camera I2C (future)

38 CAM2_I2C_SCK I2C_SCL_EXT Front Camera I2C (future)

39 CAM1_FLASH WIFI_SD6_TGPIO25 B7 Main Camera Flash enable

40 GPIO45 WIFI_SDRST_TGPIO13 E10 GPIO45 (reserved for sensors)

41 CSI1_D3_P CSI1_D3_P E18 Main Camera interface

42 CSI1_D3_N CSI1_D3_N G18 Main Camera interface

43 GPIO44 TGPIO_20 G10 GPIO44 (Reserved for Sensors)

44 TP_RESET TGPIO_01 F7 Touch panel Reset

45 CAM_I2C_SDA TGPIO_02 AM17 Main Camera I2C

46 CAM_I2C_SCL TGPIO_03 AP17 Main Camera I2C

47 CSI1_D2_P CSI1_D2_P F19 Main Camera interface

48 CSI1_D2_N CSI1_D2_N H19 Main Camera interface

49 CAM2_RESET TGPIO_21 E4 Front Camera Reset

50 NC TGPIO_04 N/A

51 GPIO0_EINT5 TGPIO_05 AV8 GPIO0 (reserved for Sensors)

52 LCD_RESET TGPIO_06 AP11 Display Reset

53 CSI1_D1_P CSI1_D1_P M19 Main Camera interface

54 CSI1_D1_N CSI1_D1_N K19 Main Camera interface

55 GPIO7 TGPIO_22 AN8 GPIO7 (Reserved for Sensors)

56 TP_SCL TGPIO_07 AB17 Touch panel I2C Clock

57 TP_SDA TGPIO_08 AD17 Touch panel I2C Data

58 TP_IRQ TGPIO_0 F11 Touch panel interrupt

59 CSI1_D0_P CSI1_D0_P D21 Main Camera interface

60 CSI1_D0_N CSI1_D0_N F21 Main Camera interface

61 NC ETH_INT_N N/A

62 CAM2_PD TGPIO_10 H3 Front Camera Power Down

63 NC TGPIO_11 N/A

64 CAM_MCLK TGPIO_12 P17 Camera Main Clock (for both sensors)

65 CSI2_CLK_P CSI2_CLK_P B19 Front Camera Interface

66 CSI2_CLK_N CSI2_CLK_N D19 Front Camera Interface

67 NC ETH_RST_N N/A

68 NC PCIE_CLKREQ_N N/A

69 LEDFB_DP PCIE_EP_WAKE_N AS17 Backlight feedback Positive

70 CAM_MCLK1 PCIE_EP_RESET_N P17 Future Optional Main Camera clock

71 CSI2_D0_P CSI2_D0_P A18 Front Camera Interface

72 CSI2_D0_N CSI2_D0_N C18 Front Camera Interface

73 NC MAC_RXDV_ER N/A

74 NC MAC_MDIO N/A

75 NC TGPIO_29_RTS_GPS N/A

76 NC TGPIO_28_RXD_GPS N/A

77 NC TGPIO_27_TXD_GPS N/A

78 CABC PCIE_REFCLK_M AS15 Content Adaptive Backlight Control

79 NC MAC_CRS_DV N/A


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Pin # MMI Connector Pin Name Generic EVB Pin Name xE922-3GR Pad Description

80 NC MAC_MDC N/A

81 LEDDRV WLAN_SLEEP_CLK AP13 Backlight Driver

82 GPIO55_EINT15 REF_CLK G14 GPIO / External IRQ

83 GND GND GND

84 VAUX_1P8V PCIE_REFCLK_P AA18 Camera/Auxilary 1.8V power supply

85 NC MAC_RXD[3] N/A N/A

86 NC MAC_TXEN_ER N/A N/A

87 NC DVI_CLK N/A N/A

88 NC DVI_WAO N/A N/A

89 NC PCIE_TX_M N/A N/A

90 GND GND GND


92 NC MAC_REF_CLK N/A N/A

93 NC DVI_RX N/A N/A

94 NC DVI_TX N/A N/A

95 NC PCIE_TX_P N/A N/A

96 NC PCIE_RX_M N/A N/A

97 NC MAC_RX_CLK N/A N/A

98 NC MAC_TXD[2] N/A N/A

99 NC SPI_CLK N/A N/A

100 NC SPI_CS N/A N/A

101 GND GND GND

102 NC PCIE_RX_P N/A N/A


104 NC MAC_TX_CLK N/A N/A

105 NC SPI_MISO N/A N/A

106 NC SPI_MOSI N/A N/A

107 NC SGMII_TX_P N/A N/A

108 GND GND GND



111 GND GND GND

112 GND GND GND

113 NC SGMII_TX_M N/A N/A

114 NC SGMII_RX_P N/A N/A



117 NC USB_EXT_D- N/A N/A

118 NC USB_EXT_D+ N/A N/A

119 GND GND GND

120 NC SGMII_RX_M N/A N/A


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6. 5BSchematics Searchable PDF

cs1774A-P1-P4.pdf


1VV0301324 Rev.0.1 – 2016-09-01



1VV0301324 Rev.0.1 – 2016-09-01


7. 6BSafety Recommendations READ CAREFULLY

Be sure the use of this product is allowed in the country and in the environment required. The

use of this product may be dangerous and has to be avoided in the following areas:

Where it can interfere with other electronic devices in environments such as hospitals,

airports, aircrafts, etc.

Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is

responsibility of the user to enforce the country regulation and the specific

environment regulation.

Do not disassemble the product; any mark of tampering will compromise the warranty

validity. We recommend following the instructions of the hardware user guides for a correct

wiring of the product. The product has to be supplied with a stabilized voltage source and the

wiring has to be conforming to the security and fire prevention regulations. The product has to

be handled with care, avoiding any contact with the pins because electrostatic discharges may

damage the product itself. Same cautions have to be taken for the SIM, checking carefully the

instruction for its use. Do not insert or remove the SIM when the product is in power saving

mode.

The system integrator is responsible of the functioning of the final product; therefore, care has

to be taken to the external components of the module, as well as of any project or installation

issue, because the risk of disturbing the GSM network or external devices or having impact

on the security. Should there be any doubt, please refer to the technical documentation and the

regulations in force. Every module has to be equipped with a proper antenna with specific

characteristics. The antenna has

to be installed with care in order to avoid any interference with other electronic devices and

has to guarantee a minimum distance from the body (20 cm). In case of this requirement

cannot be satisfied, the system integrator has to assess the final product against the SAR

regulation.

The European Community provides some Directives for the electronic equipments

introduced on the market. All the relevant information’s are available on the European

Community website:

http://ec.europa.eu/enterprise/sectors/rtte/documents/

The text of the Directive 99/05 regarding telecommunication equipments is available,

while the applicable Directives (Low Voltage and EMC) are available at:

http://ec.europa.eu/enterprise/sectors/electrical/

http://ec.europa.eu/enterprise/sectors/rtte/documents/

http://ec.europa.eu/enterprise/sectors/electrical/


1VV0301324 Rev.0.1 – 2016-09-01


8. 7BDocument History

Revision Date Changes

0.1 2016-09-01 First Release