mobile environment chamber - web services overviewweb.cecs.pdx.edu/~far/past capstone...

2/6/2011

Mobile Environment Chamber

Capstone

2011

Product Design Specifications

Team members:

Duc Tran

Giang Nguyen

Peter Elabd

Tuan Ngo

The Duong

Thien Nguyen

Advisor:

Dr. Mark Weislogel

Maseeh College of Engineering & Computer Science

This report details design criteria, performance

criteria, and customer identification for PSU’s

2011 Intel EXCEL team.

REV. 4

http://web.cecs.pdx.edu/~mmw/

1

Revision History

1. Rev.0 (January 16, 2011): Initial Rev released

2. Rev.1 (January 17, 2011): Introduction, Mission Statement, Identification of Customers

and Risks added

3. Rev.2 (January 25, 2011): Product Design Specification and House of Quality added

4. Rev.3 (January 31, 2011): Complete full document. Ready to final review.

5. Rev.4 (February 6, 2011): Final Rev

2

Contents

Revision History .............................................................................................................................. 1

Introduction .................................................................................................................................... 3

The purpose of this document ........................................................................................................ 3

Mission Statements ........................................................................................................................ 3

Project Plan ..................................................................................................................................... 4

Identification of Customers ............................................................................................................ 5

External Customers ..................................................................................................................... 5

Internal Customers ...................................................................................................................... 6

Customer Interviews and Feedback ............................................................................................... 6

Product Design Specifications ......................................................................................................... 7

House of Quality ........................................................................................................................... 13

Risk Management ......................................................................................................................... 14

Conclusion ..................................................................................................................................... 15

Appendix A .................................................................................................................................... 16

Appendix B .................................................................................................................................... 17

Appendix C .................................................................................................................................... 18

3

Introduction

Functional testing of electronic devices in various temperatures is an important activity in

electronic industries. The thermal test method of Intel can present challenges regarding lack of

mobility, non-uniform temperature distributions throughout the large chamber, and cost. The

goal of this design project is to build a flexible test device chamber for Solid State Drivers (SSDs)

to resolve such issues. A mobile heating-cooling chamber in which the temperature can be

controlled will overcome these difficulties. If successful, the apparatus can be developed

further to test different devices and be implemented in both laboratory and factory

environments in Asia, Europe, and America.

The purpose of this document

This Product Design Specification (PDS) document defines the criteria and requirements for the

design project Mobile Heating and Cooling Chamber. Also, it is an agreement between the

design team and customers about the objectives, engineering requirements, cost, timeline,

methods of verification and other defined criteria.

Mission Statements

By the end of the Spring Term 2011, a Mobile Heating and Cooling Chamber will be designed

and built as the working product, which should be ready to be finalized and used in the factory.

The design will meet all defined criteria and be able to solve problems of the current testing

method. The design will be completely documented by a design report, including: analysis,

detailed drawings, and a bill of materials.

4

Project Plan

A master plan is developed as a general guideline for the team to complete the project on time

as well as to meet due dates for reports and presentations required by the Mechanical

Engineering department. The project is divided into two terms as shown in the Gantt chart

(Appendix A).

Some milestones, tentative finish dates and due dates for presentations and reports required

by PSU are summarized in the following table:

Project Milestones

Milestones Due date

Finish PDS Before 4th Feb

PDS presentation 7th Feb. (PSU required)

PDS report due 9th Feb. (PSU required)

External and internal search presentations 21st Feb. (PSU required)

Final concept Before the end of Winter term

Progress report 7th Mar. (PSU required)

Detailed design and review with sponsor (customer) Beginning of April

Prototype Beginning of April

Testing Middle of May

Final review, optimization Near the end of May

Final product ready for delivery End of May

5

Identification of Customers

Customers are those who set requirements for the product design and performance. The

customers are classified as external and internal.

External Customers

External customers are all those who are not affiliated with PSU. The following list of

requirements identifies external customers and their input on the project.

Intel Corporation

- 10 times lower cost than the current method

- Portability

Andrew Besore, Test Technician

- Compliance with safety requirements in the Semiconductor Equipment

and Materials International (SEMI)

- Prevention of process-chilled water (PCW) leakage.

- Requirement of Emergency Shut-off (EMO) for AC power of the heater.

Milo Juenemann , Test Engineer (End User)

- Scale-up capability

- 19 - inch form factor

- At least 2 weeks continuously functioning as a test time cycle

- Temperature uniformity

Walter Fenk, Test Development Engineer, Intel sponsor

- Timelines

- Capable of loading the temperature/timing profile to automatically

control the temperature inside the chamber

- Feature of reading and saving the set point as well as the actual

temperature

6

Internal Customers

Internal customers are those who are affiliated with the PSU capstone team. The following list

identifies internal customers and their input on the project.

The PSU Capstone Program

- Completion of the project

Dr Etesami, Mechanical Capstone Project Coordinator

- Methodology of design process.

Customer Interviews and Feedback

Asking question and getting feedback are essential and integral parts of our design process. The

team has interviewed two Intel representatives, who are directly related to the device that is

going to be designed.

Andrew Besore, a Test Technician who is operating functional testers, mentioned problems

with the current method of testing. He also described a situation when water leakage occurred

in the test floor caused by a failed connection between the facility and the chamber. Such

failures show a new design of the chamber is necessary.

Milo Juenemann, a Test Engineer who has been working with Solid State Driver (SSD) testing for

a long time, talked about the need for a low cost tester which could be easily adapted for other

applications. Problems with the uniformity of the temperature inside the chamber, and the

imperfect cover causing dust around the UUT, were brought up as issues with the current

chamber.

The team conducted a tour in the Stress Test Lab by Walter Fenk to get better understanding of

the project and the working environment of Intel lab facilities.

7

Product Design Specifications

Shown below is a list of general criteria sorted from high priority (scored 1), medium priority

(scored 2) and low priority (scored 3). Following that are detailed requirement tables also

arranged from high priority to low priority defined by information provided in Appendix B (Intel

requirements) and Appendix C (SEMI). The measurable criteria are clearly defined by a number

and metric column whereas the immeasurable criteria are identified as N/A.

Criteria Priority

Performance 1

Environment 1

Safety 1

Cost 1

Mobility 1

Timelines 1

Ergonomics 2

Testing 2

Quantity 2

Maintenance 2

Materials 2

Quality and Reliability 3

Regulatory 3

Documentation (processes) 3

Company constraints and procedures 3

Legend High priority Medium priority Low priority

8

[1] Section 21 (pgs. 33-35) - SEMI S002-00-0706a (Appendix C)

Performance

Requirements Customer Metrics & Targets Metric Target Target Basis Verification

Temperature range

Intel Inside

temperature Celsius -5 to 105

Customer Defined

Testing

Temperature tolerance

Intel Inside

temperature Celsius +/- 2

Customer Defined

Testing

Transient Intel Rate of change temperature

Celsius/minute +/-10 Customer Defined

Testing

Uniformity Intel

Temperature difference

between any 2 arbitrary points after 5 minutes

soak time

Celsius +/-4 Customer Defined

Testing

Airflow velocity Intel Inside airflow rate Meter/second Minimum:

0.5 Desired: 5

Customer Defined

Testing

Communication Intel Read and write set

point temp & actual temp to PC

N/A N/A Customer Defined

Testing

Over limit protection

Intel

Alarms (or light) activate when

over limit condition detected


Testing

Capacity Intel Max. number of

UUT contained in 1 chamber

Number 3-12 Customer defined

Prototyping

Environment


Chilled water reuse

Intel Percent volume of chilled water recycling within the

chamber % 100

SEMI international Standard[1]

Testing

Chemical selection

Intel Non toxic chemical N/A N/A SEMI

international Standard[1]

Property of chemicals

used

Leakage prevention

Intel Percent of volume

container capable to hold the certain liquid volume

% 110 SEMI


Testing

9

[2] Section 12 (pgs. 17-18) – SEMI S002-00-0706a (Appendix C)

[3] Section 18.6 – Table 1 (pg. 31) - SEMI S002-00-0706a (Appendix C)

[4] Section 10 (pg. 15) - SEMI S002-00-0706a (Appendix C)

[5] Section 17 (pgs. 26-27) - SEMI S002-00-0706a (Appendix C)

Safety


Emergency Shutdown

Intel Chamber equipped with an EMO circuit, EMO actuator

N/A N/A SEMI


Testing

External Temperature

Intel External surfaces, knobs,

grips touching temperatures Celsius

Knobs, Grip: 51 or 60 Surface: 65


Testing

Hazard warning label

Intel

Labels required in associated risky, hazardous parts

(extreme temperature, electrical shock)

N/A N/A SEMI


Similar System

Comparison

Hazardous energy isolation

Intel

Lockable energy isolation capabilities (circuit breaker, disconnect switch, manual

valve)

N/A N/A SEMI


Similar System

Comparison

Cost


Cost of production per UUT slot

Intel Cost Dollars/ UUT slot

150-500 Customer Defined

Bill of all cost

(materials, labors)

10

Timelines


All due date are met

PSU & Intel

Successful complete the tasks on time and follow

detailed plan closely N/A N/A

Course Requirements

Grade

Ergonomics


Easy handling of

device Intel

Number of handles

Number 2 Customer defined

Prototyping

Handle design

Intel Enclosed handle [1], with designed

dimensions Inch

Minimum width: 5 Minimum depth: 1.75 Maximum diameter: 1


Prototyping

Testing


All tests must be conducted

Project team

Tests That Cannot be Conducted With Current

Resources

N/A 0 tests Customer Defined

Review

[6] Table A1-1 (pg. 11) - SEMI S008-00-0307E (Appendix C)

Mobility


19 - inch rack form factor

Intel Width and height of the

chamber Inch

Width:19 Height:1.75x

Standard Server Rack

width Testing

Mobility Intel

Can be moved within a single facility site with

minimal disassembly and facility work. Lifting point

clearly identified

N/A N/A Customer defined

Testing

Weight/density Intel Weight per unit area lb./sq.

ft. ≤75

Customer defined

Testing

11

Maintenance


Components on the tester that are most likely to fail

must be easily replaceable

Intel

The number of components that

cannot be replaced

N/A 0

components Customer Defined

Prototyping and Bill of Materials

Easy reparation

Intel The time to fix

the device Hour

Maximum: 2 hours

Customer Defined

Prototyping

Materials

Requirements Customer Metrics &

Targets Metric Target Target Basis Verification

All materials near or in

contact with UUT must be

electrically dissipative to prevent ESD

Intel

Highly charging components and

ungrounded components

Number 0

components Customer Defined

Bill of Materials

Quality and Reliability

Requirements Customer Metrics &

Targets Metric Target

Target Basis

Verification

The system should be

durable and reliable

Intel

Mean Time Between Failures

(MTBA), Mean Time Between Assists (MTBA)

hour

Fix time>2h:MTBA > 5000h

Customer Defined

Testing

Fix time:6m-2h:MTBA > 2000h

Fix time: <6: MTBA > 125h

Quantity


Capability of being

produced in small batch

Intel The number of chambers to be

produced Number 40 - 160

Customer Defined

Prototyping

12

Documentation


Product is documented completely

Intel The ease of installing,

operating, and maintaining the tool


Prototyping

The design is documented completely

Intel The ease of

redesigning the product


Prototyping

Regulatory


Comply with SEMI and get

Underwritten Laboratories (UL)

approved

Intel

The compliance with SEMI

document and UL standards


Prototyping

13

House of Quality

Technical parameters

Legend:

*** : strong relation

**: medium relation

*: weak relation Im

port

ance

(1

00

)

Co

ntr

ol

syst

em

Wei

gh

t

Wid

th

Ch

amb

er’s

geo

met

ry

# o

f U

UT

in

1 c

ham

ber

Ch

amb

er’s

mat

eria

l

Hea

t so

urc

e

Co

st p

er U

UT

slo

t (d

oll

ar) Legend:

: Good

: Medium

: Poor

Customer demand: Market competition

Performance 35 1 2 3 4 5 6 7 8 FlexStar

Temp. range

(-5C to 105C)

9 ***

Temp. tolerance

2C

11 *** ** * * N/A

Transient at

10C/min.

6 *** * **

Uniform temp.

distribution

9 ** ** **

Safety 11 ** * **

Cost 11 ** * *** *** ** ***

Scalability 11 * * ** *

Mobility 9 *** ** *** **

Ergonomics 11 ** * **

Maintainability 6 * ** * ** N/A

Reliability 6 ** ** ** **

Market competition:

FlexStar N/A 2100

lb

49” N/A 64 N/A N/A

Target PID 70 lb 19” TBD 12 TBD Electric 200

14

Risk Management

The risks will address the cases that resulted in the failure of the final product. The risks and

plans for mitigating the risks are shown in the following table:

Risk Causes Consequences Probability Level Mitigation plan

Monitoring plan

1

Team communication and alignment

Lack of mutual understanding /

differences in schedule

Severe (confusing

lead to delay in project)

Possible High

Exchange information

during weekly meeting,

communicate through emails

and phone when issues emerge

Update status through weekly

meeting

2

Supplier issues and availability

of parts

Do not utilize off-the-shelf

components

Severe (slow down

progress) Possible Medium

Keep design simple. Contact

supplier for availability of part while designing.

An early brainstorming

meeting to try and

anticipate any long lead-

time materials

3

Project exceeds budget

Cost inflation, overly-designed

parts

Marginal (does not

satisfy customer)

Possible Medium Change to simpler design / Consult

sponsors N/A

4 Prototype does

not work Bad

calculation/design

Catastrophic (team must

rework) Possible High

Consult advisor and other related

technical engineers

Testing at each step of fabricating process to

prevent errors going

downstream.

5

Design too complicated to

fabricate

Too many features

Catastrophic (team must

change design, slow

down project)

Unlikely High

Remove unnecessary

features. Keep it as simple as

possible

N/A

15

Conclusion

The design project focuses on solving the current problems of Intel’s mass functional testing

method for SSDs, which affect productivity and testing quality. A mobile chamber is a promising

solution to eliminating many of the problematic issues. All of the requirements are defined in

term of engineering metrics in this report. A master plan is also developed as the main

guideline for completion of the project. With this understanding of the Product Design

Specification, the team is ready for the next phase of research, concept generation and

evaluation.

16

Appendix A

Project Grant Chart

ID Task Name Start Finish Duration27/320/2 6/3

1 19d2/4/20111/14/2011PDS

2 7d1/21/20111/14/2011Customer identification & requirements, existing product

3 7d1/28/20111/21/2011PDS criteria, engineering metrics, HoQ

3/4

Feb 2011

6/2 8/5

Mar 2011 Apr 2011

10/4 17/4 24/413/3 22/523/1 1/513/2

Jan 2011 May 2011

16/1 20/3 15/530/1 27/2

6d2/4/20111/30/2011Review, update tasks4

12d2/13/20111/31/2011External search5

7

14d2/17/20112/2/2011Internal search

14d2/28/20112/13/2011Concept evaluation & selection

6d2/18/20112/13/2011Review ideas8

9 9d2/28/20112/18/2011Finalize concept

6

Main task Sub task

12

11

10 18d4/15/20113/27/2011Detailed design

20d5/1/20114/8/2011Manufacturing, Prototyping

18d5/22/20115/2/2011Testing, optimization, review

Legend:

17

Appendix B

1

Equipment Requirements

Requirements Table Structure

The table that follows lists key feature requirements for the Equipment

The table includes these fields:

Key

Unique alphanumeric identifier to easily identify and reference each requirement.

Main Category

High level requirement category

Secondary Category

Secondary level requirement category

Flexibility/Importance

Rankings system as follows:

1: No flexibility. Imperative. All efforts must be made to meet this requirement

2: Somewhat flexible. Should be attained, but details are negotiable, especially if a significant cost driver.

3: Desirable, very flexible.

4: Suggested or optional.

Risk / Conformity of the design to Requirement

This column is to be filled out as the project evolves as an indication of progress.

3 (green): OK

2 (yellow): Problem defined, but not completely defined. Or, no data yet available to define problem

1 (red): Showstopper. Requirement cannot be met, or cannot be met in time.

Requirement

Description of the requirement.

2

Requirements Table

Key

Main

Category

Secondary

Category

Flexibility/

Importance

Risk Requirement

CS00 1 CS01 Control System General 1 The temperature controller should be a simple,

digital, PID. (Watlow PM3 recommended) CS02 Control System Communication 1 Capable of real time communication via Modbus

TCP/IP(Ethernet) or Modbus RTU (RS485). Need ability to read and write the current setpoint temperature as well as the current actual temperature via an interface to a PC.

CS03 Control System Over limit protection

1 An alarm activates, sound enunciator (and light) when thermal over‐limit condition is detected.

D00 1 D01 Safety General

Environment, Safety, and Ergonomics Requirements.

1 Must comply with SEMI S2‐93: Safety Guidelines for Semiconductor Manufacturing Equipment. This includes an EMO function. If the unit plugs into std 110‐240 AC, (up to 20A), Intel can provide the NC (normally closed) EMO circuit. This also includes a requirement that the external surface of the equipment not exceed a temperature that will cause injury if touched by an operator. The maximum allowable temperature depends on the material that may be touched. If the material is metal, the max temperature is: 60˚C If the material is plastic, the max temperature is: 85˚CRegardless of the material the minimum external temperature should not be less than 0˚C. Intel can provide additional design input / feedback.

D02 Safety Ergonomics 1 Must comply with SEMI S8‐95: Safety Guidelines for Ergonomic/Human Factors Engineering of Semiconductor Manufacturing Equipment. Intel can provide design input / feedback

D03 Safety Over limit Operator warning

1 See CSO3

D04 Safety Over limit test shutdown

1 The equipment should be capable of shutting down to a safe state when a dangerous over limit operation is detected (°C, etc) or when an EMO is pushed.

DM00 DM01 Documentation Users Manual 3 Possible documentation that is desirable, but not

necessarily required for a concept proto. Operations Manual Installation Manual Maintenance Manual Programming Manual (For process controller) Applications Manual (TBD)

3

Key

Main

Category

Secondary

Category

Flexibility/

Importance

Risk Requirement

DM02 Documentation Drawings and Schematics

2 Relevant Drawings: System layout Mechanical detail drawings, as required Assembly drawings Relevant Schematics: Electrical Mechanical Airflow Plumbing

DM03 Documentation Spare Part Identification and replacement guide

3 Listing of all Field Replaceable Units, if any. This would lead to a list of recommended spares.

DM04 Documentation Diagnostic & Troubleshooting

3 Procedural Information Diagnostic Troubleshooting

DM05 Documentation Original Equipment Manuals

3 OEM Equipment Manuals and Part identification sheets

F00 F01 Facilities Transportability 3 Instructions for crating and shipping. (Not needed for

concept proto)

F02 Facilities Mobility 2 Can be moved within a single facility site with minimal disassembly and facilities work. Lifting points clearly identified. The three (3) dimensions of the device must allow for passage through doorway – (83 in high, 60 in wide)

F03 Facilities Weight/Density 4 75 lb./sq. ft. or less F04 Facilities Electrical 3 Accommodate common available power standards

worldwide, especially US, Asia, Europe, Brazil. F05 Facilities Footprint 2 Equipment footprint excluding hood is desired to be

as small as possible. ME00

ME01 Mechanical Thermal Workspace Dimension, X‐Y‐Z

1 See drawing

ME03 Mechanical Hood Exterior Dimension, X‐Y‐Z

2 See drawing/slides

ME04 Mechanical Max Weight 3 TBD ME05 Mechanical UUT Access 1 Each UUT easily accessible from front. Any covering

or assembly in front of the UUTs must hinge or slide out of the way, be removable, or in some other way allow easy access to UUTs. The UUTs will be frequently swapped out and this must be a relatively easy activity for the end user/operator.

ME06 Mechanical Exterior Color 3 Exterior Color TBD. UU00

UU01 UUT Description

UUT Qty. 1 12. See drawing for layout


UUT Dimension (each)

1 Each UUT is a solid state disk drive, 2.5 inch mobile form factor. (16mm thickness)


UUT Material 1 PCB: Printed Circuit Board Assembly and Aluminum case. Additional UUT mass and material thermal property details TBD.

4

Key

Main

Category

Secondary

Category

Flexibility/

Importance

Risk Requirement


UUT Mass 1 TBD

UU05

UUT Description

UUT Live Load 1 9W of power consumption per UUT is maximum. Typical may be less.

M00 M01 Maintenance 3 Components on the tester that are most likely to fail

must be easily replaceable. ( See notes under reliability)

R00 R01 Reliability MTBF 3 Mean time between failure (when time to fix

equipment > 2 hours) > 5000 hours Mean time between failure (when time to fix equipment is between 6 minutes and 2 hours) > 2000 hours

R02 Reliability MTBA 3 Mean time between assists (when time to fix equipment < 6 minutes) > 125 hours An “assist” is any interruption during use of the equipment that requires operator intervention to correct so that use can be restarted. Examples: Fuse blows and needs to be replaced, refrigeration trip, etc.

R03 Reliability MTTR 3 Mean time to repair tester < 2 hours. RG00 RG01 Regulatory First Proto 3 For first unit delivered, all requirements of this section

may be replaced by a single-equipment, 3rd party inspection. However, the equipment should be designed with the intent of eventually complying with all requirements of this section.

RG02 Regulatory UL 3 UL ApprovedRG03 Regulatory SEMI 3 SEMI compliance, including

SEMI S2-0200 and S2-93 (Environmental, Health, and Safety Guidelines for Semiconductor Manufacturing Equipment) SEMI S1-0701 (Safety Guidelines for Equipment Safety Labels) SEMI S8-0701 and SEMI S8-95 (Safety Guidelines for Ergonomics Engineering of Semiconductor Manufacturing Equipment)

RG04 Regulatory International 3 Must be designed and certified to any standards that are required by the following countries for installation and operation of the equipment in manufacturing plant s or laboratory environments. United States Malaysia China Europe (Ireland)

5

Key

Main

Category

Secondary

Category

Flexibility/

Importance

Risk Requirement

RG05 Regulatory International 3 Should be designed certified to any standards that are required by the following countries for installation and operation of the equipment in manufacturing plant s or laboratory environments. Taiwan Korea Europe (Hungary)

RG06 Regulatory International 3 Consider certification to any standards that are required by the following countries for installation and operation of the equipment in manufacturing plant s or laboratory environments. Brazil Mexico India Japan Israel Europe (All European Countries) Canada Australia

TH0 TH1 Thermal

Capability Air Temperature Setpoint Range

1 Must be able to hold temperature of air supplied to UUT Max / Min workspace thermal working range Minimum: +35 C Maximum +65 C

TH2 Thermal Capability

Air Temperature Setpoint Range

2 Must be able to hold temperature of air supplied to UUT Max / Min workspace thermal working range Minimum: ‐5 C Maximum +105 C


Transient 2.5 Air temperature supplied to UUTs can achieve a transient ramp of + and – 10 °C/minute between the min and max temperature setpoint.


Airflow velocity 2 Air flow rate past UUT Required: Minimum average air flow rate across UUT: 0.5 m/s Desired: Minimum average air flow rate across UUT: 5.0 m/s More is better.


Accuracy 1 The accuracy of the temperature measurement at any control point should be +/‐ 2 °C or better.


Uniformity 2 The air temperature measured anywhere within the workspace, after 5 minutes of soak time should be within 4 °C of the control point temperature. Because of live load self heating the temperature of the air temperature deviance within 1cm of the UUT may exceed this requirement.

6

Key

Main

Category

Secondary

Category

Flexibility/

Importance

Risk Requirement


Calibration 3 CalibrationLong term (week – year) Periodic calibration of thermocouple Short term drift (minute – week) Redundant temperature logging (May be provided by Intel) Details TBD, flexible. Provide calibration recommendations.

UE00 UE1 UUT

Environment ESD 3 All materials near or in contact with UUT must be

electrically dissipative to prevent ESD discharge related damage to UUTs

18

Appendix C

The SEMI standard is commercially purchased, copyrighted document. Please go to the link below for more information: http://www.semi.org/en/Standards/index.htm

http://www.semi.org/en/Standards/index.htm

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