Modules assembly plan

19/09/2013

Detector layout

3

Inner Barrel (IB)The Inner Barrel consists of the three innermost layers:

Inner Layerslayer 0, layer 1 and layer 2.

Flexible Printed Circuit (FPC) or Flex.

Pixel Chip

Stave

ColdplateSpaceframe

Inner Barrel (IB): 3 layers pixels

Radial position (mm): 23.4, 31.5, 39.3

Length in z (mm): 270

Nr. of staves: 12, 16, 20

Nr. of chip/stave: 1x9

Nr. of chip: 108, 144, 180

Layout -TDR-5 Baseline for TDR

Outer Barrel (OB): 4 layers pixels

Radial position (mm): 194, 247, 353, 405

Length in z (mm): 843, 1475

Nr. of staves: 22, 28, 40, 46

Nr. of modules: 176, 224, 560, 644

Nr. of chip: 2464, 3136, 7840, 9016

Nr. of chip/module: 2x7

Nr. of modules /half stave: 4, 4, 7, 7

Nr. of modules/stave: 8, 8, 14, 14

Nr. of chips/stave: 112, 112, 196, 196

Spaceframe

Pixel chip

(15mmx30mmx0,05mm)

Module

Layout -TDR-5 Baseline for TDR

Stave

Half-Stave

Cold PlateCold Plate

Quantity of modules and solderings

• Inner barrel– 48 modules x 2 + 10% ~ 110 staves– 990 chips, 49500 solderings

• Outer barrel– 1602 modules +10% ~ 1800 modules– 25200 chips, 1260000 solderings

Total time for production ~ 2 y

Goals of automatic system- achieve placement of chips and position (x,y,z) with 5-10 mm accuracy

- produce ~ 1 module/day with 100% working contacts

Module assembly procedure by laser soldering

1) Placement of chips on vacuum table and position check2) Placement of flex on support and alignment with macor

grid (included in support)3) Placement of flex on chip and alignment4) SnAg balls deposition and check5) Soldering of one chip6) Repeat steps 5 and 6 for all chips7) Soldering check8) Final check of chips position

Additional info:• Fluxless laser soldering might need further tool

and/or steps in the procedure as we are studying:

• Heating of chips (T~ 50-100 C)• Plasma treatment of chips and flex just before soldering• Soldering under N2/H2 (95/5) atmosphere

Module assembly procedure by laser soldering