motion mems and environmental sensor expansion board ......• lis2mdl: mems 3d magnetometer (±50...

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Features LSM6DSO: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000 dps) LIS2MDL: MEMS 3D magnetometer (±50 gauss) LIS2DW12: MEMS 3D accelerometer (±2/±4/±8/±16 g) LPS22HH: MEMS pressure sensor, 260-1260 hPa absolute digital output barometer HTS221: capacitive digital relative humidity and temperature STTS751: Temperature sensor (–40 °C to +125 °C) DIL 24-pin socket available for additional MEMS adapters and other sensors Free comprehensive development firmware library and example for all sensors compatible with STM32Cube firmware I²C sensor hub features on LSM6DSO available Compatible with STM32 Nucleo boards Equipped with Arduino UNO R3 connector RoHS compliant WEEE compliant Description The X-NUCLEO-IKS01A3 is a motion MEMS and environmental sensor evaluation board system. It is compatible with the Arduino UNO R3 connector layout and features the LSM6DSO 3-axis accelerometer + 3-axis gyroscope, the LIS2MDL 3-axis magnetometer, the LIS2DW12 3-axis accelerometer, the HTS221 humidity and temperature sensor, the LPS22HH pressure sensor, and the STTS751 temperature sensor. The X-NUCLEO-IKS01A3 interfaces with the STM32 microcontroller via the I²C pin, and it is possible to change the default I²C port. Product summary iNEMO inertial module, 3-axis accelerometer, 3-axis gyroscope, always- on eco power mode LSM6DSO digital 3-axis magnetometer LIS2MDL 3-axis MEMS accelerometer, ultra low power, configurable single/double-tap recognition, free-fall, wakeup, portrait/ landscape, 6D/4D orientation detections LIS2DW12 digital nano pressure sensor LPS22HH digital sensor for relative humidity and temperature HTS221 low-voltage local digital temperature sensor STTS751 Motion MEMS and environmental sensor expansion board for STM32 Nucleo X-NUCLEO-IKS01A3 DB3851 - Rev 2 - June 2019 For further information contact your local STMicroelectronics sales office. www.st.com

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Page 1: Motion MEMS and environmental sensor expansion board ......• LIS2MDL: MEMS 3D magnetometer (±50 gauss) • LIS2DW12: MEMS 3D accelerometer (±2/±4/±8/±16 g) • LPS22HH: MEMS

Features• LSM6DSO: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope

(±125/±250/±500/±1000/±2000 dps)• LIS2MDL: MEMS 3D magnetometer (±50 gauss)• LIS2DW12: MEMS 3D accelerometer (±2/±4/±8/±16 g)• LPS22HH: MEMS pressure sensor, 260-1260 hPa absolute digital output

barometer• HTS221: capacitive digital relative humidity and temperature• STTS751: Temperature sensor (–40 °C to +125 °C)• DIL 24-pin socket available for additional MEMS adapters and other sensors• Free comprehensive development firmware library and example for all sensors

compatible with STM32Cube firmware• I²C sensor hub features on LSM6DSO available• Compatible with STM32 Nucleo boards• Equipped with Arduino UNO R3 connector• RoHS compliant• WEEE compliant

DescriptionThe X-NUCLEO-IKS01A3 is a motion MEMS and environmental sensor evaluationboard system.

It is compatible with the Arduino UNO R3 connector layout and features theLSM6DSO 3-axis accelerometer + 3-axis gyroscope, the LIS2MDL 3-axismagnetometer, the LIS2DW12 3-axis accelerometer, the HTS221 humidity andtemperature sensor, the LPS22HH pressure sensor, and the STTS751 temperaturesensor.

The X-NUCLEO-IKS01A3 interfaces with the STM32 microcontroller via the I²C pin,and it is possible to change the default I²C port.

Product summary

iNEMO inertial module, 3-axisaccelerometer, 3-axis gyroscope, always-on eco power mode LSM6DSO

digital 3-axis magnetometer LIS2MDL

3-axis MEMS accelerometer, ultra lowpower, configurable single/double-taprecognition, free-fall, wakeup, portrait/landscape, 6D/4D orientation detectionsLIS2DW12

digital nano pressure sensor LPS22HH

digital sensor for relative humidity andtemperature HTS221

low-voltage local digital temperaturesensor STTS751

Motion MEMS and environmental sensor expansion board for STM32 Nucleo

X-NUCLEO-IKS01A3

DB3851 - Rev 2 - June 2019For further information contact your local STMicroelectronics sales office.

www.st.com

Page 2: Motion MEMS and environmental sensor expansion board ......• LIS2MDL: MEMS 3D magnetometer (±50 gauss) • LIS2DW12: MEMS 3D accelerometer (±2/±4/±8/±16 g) • LPS22HH: MEMS

1 Schematic diagrams

Figure 1. X-NUCLEO-IKS01A3 board schematics

1234

JP7

M_INT_Pin16M_INT2M_INT1

M_INT_Pin17

GND

DIL24 Socket for Adapter BoardAccelerometer LIS2DW12 Accelerometer + Gyroscope

M_INT_Pin24

M_SA0/DRDYM_SA0/DEN

LSM6DSO

GND

LIS2

DW

12_I

NT

GND

GND

GND

M_INT2_O

M_INT1_O

USER_INT_O

USER_INT M_INT_Pin16M_INT_Pin17

Arduino & Morpho Connector s

Mor

pho

conn

ecto

r

3V3

12345678

CN6

123456

CN8

1 23 45 67 89 1011 1213 1415 1617 1819 2021 2223 2425 2627 2829 3031 3233 3435 36

3837

Header 19x2

CN7

DNM

Ardu

ino

Con

nect

orAr

duin

oC

onne

ctor

Mor

pho

conn

ecto

r

123456789

10

CN5

12345678

CN9

1 23 45 67 89 1011 1213 1415 1617 1819 2021 2223 2425 2627 2829 3031 3233 3435 36

3837

Header 19x2

CN10

DNMArdu

ino

Con

nect

orAr

duin

oC

onne

ctor

HTS2_DRDY

LPS22HH

_INT

Relative humidity + TemperaturePressure sesnsor LPS22HH

HTS221

CS6 DRDY 3

SCL

2

1V8

1

SDA

4

GN

D5

HTS221U3

GND

GND

100nF

C9

SB3

SB7

SB11

SB24

SB31 SB32

4k7R1

2k2

R3

4k7R2

SB35

SB36

SB41SB40

SB47SB45SB43SB42

SB44SB46

SB2

SB5

I2C ADDw = D6hSB15

I2C

AD

Dw

=B

Ah

SB28

SDO

1

SDx

2

SCx

3

INT1

4

1V8IO 5

GND 6

GND 71V8

8

INT2

9

OC

S10

NC

11

CS12

SCL13

SDA14

LSM6DSOU2

SB14DNM

SB20DNM

SCx

SDx

SCx

SDx

GND

SCL

SDA

GND 10

Vcc20 VL 1

I/O_Vcc89 I/O_VL8 12I/O_VL7 8I/O_VL6 14I/O_VL5 6I/O_VL4 16I/O_VL3 4I/O_VL2 18I/O_VL1 2

OE11

I/O_Vcc713 I/O_Vcc67 I/O_Vcc515 I/O_Vcc45 I/O_Vcc317 I/O_Vcc23 I/O_Vcc119

ST2378EU7

GND

GND

GND

1V8

I2C2_SDA

I2C2_SDA

I2C1_SDA

I2C1_SDA

I2C1_SCL

I2C2_SCL

I2C2_SCL

I2C1_SCL

SDASCL

I2C1_SCL

I2C1_SDA

I2C2_SCL

I2C2_SDA

SDx

SCx

I2C1_SCL

I2C1_SDA

I2C2_SDA

I2C2_SCL

4k7R4DNM4k7

R5DNM

I2C1_SD

A

I2C1_SCL

1V8

1V8

M_INT2

M_INT1

M_INT2_O

M_INT1_O

USER_INT_O USER_INT

I2C1=I2C2 all devices are on same bus (I2Caux = GND)

U3,U4,U8,,U9, Adapter are slave of U22-3

LSM6DSO_INT1LSM6DSO_INT1_O

GND 10

Vcc20 VL 1

I/O_Vcc89 I/O_VL8 12I/O_VL7 8I/O_VL6 14I/O_VL5 6I/O_VL4 16I/O_VL3 4I/O_VL2 18I/O_VL1 2

OE11

I/O_Vcc713 I/O_Vcc67 I/O_Vcc515 I/O_Vcc45 I/O_Vcc317 I/O_Vcc23 I/O_Vcc119

ST2378EU6

GND

LPS22HH_INT_O

LSM6DSO_INT2_O

LPS22HH_INT

M_SA0/DRDY

I2C

BU

SR

OU

TIN

G

M_INT_Pin24M_SA0/DEN

1234

J2

DNMSDASCL

JP7, JP8 must have the shunts in the same position

GND1 2 3

JP9

I2C2_SD

A

I2C2_SCL

1V8

BT_Irq

1V81V8

1V8

1V8

1V8

1V8 1V8

Vin1

EN3

2

Adj 4Vout 5

GND

LDK130M-RU5

2k2

R8

4k7R10

4k7R9

SDA

SCL

1V81V84k7R11

4k7R12

SDx

SCx

1V8

SB29

123456789101112

242322212019181716151413

DIL24 Socket

J1

I2C2 Vio header

GND

I2C ADDw = D4hSB17DNM

SB1DNM

SB4DNM

SB12

SB19

SB37DNM

I2C

AD

Dw

=B8

h

SB30DNM

1 2

JP1

1 2

JP3

12

JP4

1 2

JP2

100nFC16 100nF

C17

100nFC11

100nFC12

100nFC13

100nFC141V8 = 1.8V

15kR7

12k

R6

I2C ADDw = BEh

1 2 3

JP10

1234

JP8

GND

GND

1 2 JP11

Trigger from DRDY MAG in SensorHub Mode

LSM6DSO (U2) as master of I2C1 = I2Cx

1-2 , 3-4

Shunts Description I2C Mode

standard

LSM6DSOSensor HUB

USER_INT routing selector

SB16DNM

SB21DNM

I2C2_SDA

I2C2_SCL

SCxSDx

100nF

C5

GND

100nFC4

GND

1 2 3

JP5

3V3

1V8

GND

GND

10uF

C3

GN

D9

1V8

10

SDO

5

SDA

4

Res

3

SCL2

1V8_IO1

CS 6

INT1 7

GN

D8

LPS22HHU4

100nF

C8

2.2uF

C18

10uFC15

123

JP12

1V8

1V8

1V8

1V8

Vio

Vio Vio

Vio Vio

Vio

Vio

Vio

1V89

1V8_IO10

INT2

11

INT1

12R

es5

SDA/SDI/SDO 4

SDO/SA0 3

CS 2

SCL/SPC 1

GN

D6

RES7

GND8

LIS2DW12U1

I2C ADDw = 32h

SB8I2C ADDw = 30hSB9DNM

GND

SB10DNM SPI_MOSI

SB6DNM SPI_MISO

SB18DNM SPI_CK

SB22DNM SPI_CS

SB25 1V8SB23

LIS2DW12_INTLIS2DW12_INT_O

LIS2DW

12_INT_O

LSM6DSO_INT2

LSM

6DSO

_IN

T1

LIS2MD

L_DRD

Y

LSM6DSO_INT2

LSM6DSO_INT2_OLSM6DSO_INT1_O

LIS2MDL_DRDYLIS2MDL_DRDY_O

LIS2MD

L_DR

DY

_O

LIS2DW

12_INT_O

LIS2MD

L_DR

DY

_O

HTS2_DRDY

LPS22HH_INT_O

SPI_MOSI_OSPI_MISO_O

SPI_CK_O

SPI_CS_O

SB38DNMSB39

SPI_MISO

SPI_MOSI

SPI_CK

SPI_MISO_O

SPI_MOSI_O

SPI_CK_O

SPI_CSSPI_CS_O

SB13

SDA 6

AL/INT2

1V83

SCL1

GND 5

ADDR 4PAD

7

STTS751U9

12

JP13 GND

GND

7K5R13

NTS0104GU12

GND 6

Vcc_A1 Vcc_B 11

B2 9B1 10

OE12

A23 A12

A34

A45 B3 8

B4 7

U10

2.5 to 1.8V

LDK120PU25RVin6

EN4

2

ByPass/Adj 3Vout 1

GND

5

N/C

LDK120pu25

U11 2V5Vio

GND

2V5

1V8

2V5

2V5

SB27I2C1_SDAI2C1_SCL

SB26

STTS751_INT

2V51V8

GND

GND

LIS2MDL_DRDY

220nF

C32

1V8 91V8_IO 10

NC

11N

C12

C15

SDA/SDI/SDO4CS3NC2SCL1

GN

D6

INT/DRDY 7GND 8

LIS2MDLU8

GND

GND

100nFC30

1V8

1 2

JP14

SB34I2C1_SDA

I2C1_SCLSB33

Magnetometer sesnsor LIS2MDL 10uFC31

100nFC80

STTS751_INTSTTS751_INT_O

STTS751_INT_O

Temperature sesnsor STTS751

1 23 45 67 89 1011 1213 14

JP6

Header 7X2

I2C

AD

Dw

=94

h

I2C ADDw = 3Ch

4k7R16

SB48

4k7R17

SB49

GND

I2C1I2C2I2CauxSPInot used

10uF

C6

4k7R14

4k7R15

SB50DNM

LIS2DW12_INT2

LIS2DW12_INT2LIS2DW12_INT2_O

LIS2DW12_INT2_O

DB

3851 - Rev 2

page 2/4

X-NU

CLEO

-IKS01A

3Schem

atic diagrams

Page 3: Motion MEMS and environmental sensor expansion board ......• LIS2MDL: MEMS 3D magnetometer (±50 gauss) • LIS2DW12: MEMS 3D accelerometer (±2/±4/±8/±16 g) • LPS22HH: MEMS

Revision history

Table 1. Document revision history

Date Version Changes

13-Feb-2019 1 Initial release.

17-Jun-2019 2 Corrected typo in features.

X-NUCLEO-IKS01A3

DB3851 - Rev 2 page 3/4

Page 4: Motion MEMS and environmental sensor expansion board ......• LIS2MDL: MEMS 3D magnetometer (±50 gauss) • LIS2DW12: MEMS 3D accelerometer (±2/±4/±8/±16 g) • LPS22HH: MEMS

IMPORTANT NOTICE – PLEASE READ CAREFULLY

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to STproducts and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. STproducts are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design ofPurchasers’ products.

No license, express or implied, to any intellectual property right is granted by ST herein.

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or servicenames are the property of their respective owners.

Information in this document supersedes and replaces information previously supplied in any prior versions of this document.

© 2019 STMicroelectronics – All rights reserved

X-NUCLEO-IKS01A3

DB3851 - Rev 2 page 4/4