murata incredible high performance (ihp) saw filter...found in a low-end smartphone, the sony xperia...

©2019 by System Plus Consulting | Murata Incredible High Performance (IHP) SAW Filter | Sample 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Murata Incredible High Performance (IHP) SAW FilterThe first thin-film SAW filter for 2.4 GHz Wi-Fi smartphonefront-endsSP19454 - RF report by Stéphane ELISABETH

Laboratory Analysis by Youssef EL GMILIOctober 2019 – SAMPLE

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Murata

o SAW Filter technologies

o Sony Xperia XA2 Ultra

Market Analysis 16

o RFFE Market Forecast

o RFFE Supply Chain

Physical Analysis 21

o Summary of the Physical Analysis 22

o Package Assembly 25

Package Views & Dimensions

Package Opening & Cross-Section

o Filter Die 33

Die View & Dimensions

Die Overview: IDT, Reflector, Polyimide

Die Cross-Section

Die Process Characteristic

Manufacturing Process 56

o Die Front-End Process & Fabrication Unit

o Filter Die process Flow

o Final Test & Packaging Fabrication unit

Cost Analysis 67

o Summary of the cost analysis 68

o Yields Explanation & Hypotheses 70

o Filter die 72

Wafer Front-End Cost

Wafer Probe Test & Dicing

Wafer Cost

Die Cost

o Packaging & Component 80

Packaging Cost

Final test

Component Cost

Selling price 90

Physical & Cost Comparison 85

o I.H.P. SAW vs. SAW vs. TC-SAW

o I.H.P SAW vs. BAW (FBAR and SMR)

Feedbacks 94

SystemPlus Consulting services 96




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Physical & Cost Comparison

Related Reports

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of theMurata SAFQA2G45MA0G0A.3

Found in a low-end smartphone, the Sony Xperia XA2 Ultra and the Asus ZenFone 4 Pro, the filter die is packaged using a standard 5-pinLGA manufactured by Murata. The component is located near the Wifi transceiver and is part of the 2.4GHz Wifi Front-End path. Untilnow, it was common to find a BAW filter at this place.

Indeed, due the new structure of the IHP SAW, BAW filter could be replaced by this component. The filter realizes mainly with surfacemicromachining take the SAW filter to a new area. With a thin film of lithium tantalate bonded on a silicon substrate, the structure is ableto provide similar performances of BAW filter at lower cost.

Moreover, compared to other SAW filter that provides Murata to the smartphone industry, the IHP SAW filter show high performances interm of attenuation, insertion losses and thermo compensation. Indeed, the Chip Scale Packaging (CSP) is done in order to provide an aircavity that protect the transducer and limit the temperature effect.

This complete analysis of the IHP SAW Component includes analyses of the filter die and the CSP packaging, along with a cost analysis andprice estimation for the component. It also includes a physical and cost comparison with the Murata’s SAW filters offer. Finally, atechnical and cost comparison is included with the BAW filter technologies.




Overview / Introduction

Company Profile & Supply Chain o Muratao SAW Filters technologieso Sony Xperia XA2 Ultra

Market Analysis

Physical Analysis


Cost Analysis



Related Reports

About System Plus

Sony Xperia XA2 Ultra Schematic

• The I.H.P. SAW is used on the Wifi 2G path between the transceiver and the triplexer before the antenna.

Source: FCC






Market Analysis

Physical Analysis o Summaryo Package Assembly

o Views & Dimensionso Openingo Cross-Sectiono Synthesis

o Filter Dieo Views & Dimensionso Die Overviewo Die Cross-sectiono Synthesis


Cost Analysis



Related Reports

About System Plus

Summary of the Physical Analysis






Market Analysis





Cost Analysis



Related Reports

About System Plus

Package Cross-Section






Market Analysis





Cost Analysis



Related Reports

About System Plus







Market Analysis





Cost Analysis



Related Reports

About System Plus

Die overview






Market Analysis





Cost Analysis



Related Reports

About System Plus

Die Cross-Section






Market Analysis

Physical Analysis

Manufacturing Process Flowo Summaryo Filter Front-End Processo Filter Die process Flowo Filter Fabrication Unito Final Test & Assembly Unit

Cost Analysis



Related Reports

About System Plus

Filter Die Process Flow (1/6)






Market Analysis

Physical Analysis


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso Filter Die Costo Package Costo Component Cost



Related Reports

About System Plus







Market Analysis

Physical Analysis






Related Reports

About System Plus

Component Cost






Market Analysis

Physical Analysis


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Complete Module Price


Related Reports

About System Plus

Estimated Selling Price






Market Analysis

Physical Analysis


Cost Analysis


Physical & Cost Comparisono I.H.P SAW vs. SAW vs. TC-SAWo I.H.P SAW vs. BAW (FBAR and

SMR)

Related Reports

About System Plus

Technical Comparison – I.H.P. SAW vs. SAW and TC-SAW






Market Analysis

Physical Analysis


Cost Analysis



SMR)

Related Reports

About System Plus

Cost Comparison – I.H.P. SAW vs. BAW (FBAR and SMR)






Market Analysis

Physical Analysis


Cost Analysis



Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

RF Devices• 5G’s Impact on RF Front-End Module and Connectivity for Cell

phones 2019• Advanced RF System-in-Package for Cellphones 2019

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

RF• Qualcomm 5G mmWave Front-End Module• RF Front-End Module Techical Comparison 2019• Broadcom AFEM-8092 – High/Mid Band FEM

PATENT ANALYSIS - KNOWMADE

Rf Devices• RF Acoustic Wave Filters – Patent Landscape Analysis 2019



https://www.i-micronews.com/products/rf-acoustic-wave-filters-patent-landscape-analysis-2019/


https://www.systemplus.fr/reverse-costing-reports/broadcom-afem-8092-system-in-package-in-the-apple-iphone-xsxr-series/


https://www.i-micronews.com/products/5gs-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2019/

https://www.i-micronews.com/products/advanced-rf-sip-for-cellphones-2019/





https://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-technical-comparison-2019/


https://www.systemplus.fr/reverse-costing-reports/qualcomms-first-5g-mmwave-chipset-sdx50m-and-qtm052/







SystemPlusConsultingSERVI CES




Market Analysis

Physical Analysis


Cost Analysis



Related Reports

About System Pluso Company serviceso Contact

Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings






Market Analysis

Physical Analysis


Cost Analysis



Related Reports


Contact

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

Mavis WANGTAIWANT :+886 979 336 [email protected]

NANTESHeadquarter

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

KOREAYOLE

America Sales OfficeSteve LAFERRIEREPhoenix, AZWESTERN UST : +1 310 600 [email protected]

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]



mailto:[email protected]




Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Murata

o SAW Filter technologies

o Sony Xperia XA2 Ultra

Market Analysis 16

o RFFE Market Forecast

o RFFE Supply Chain

Physical Analysis 21

o Summary of the Physical Analysis 22

o Package Assembly 25

Package Views & Dimensions

Package Opening & Cross-Section

o Filter Die 33

Die View & Dimensions

Die Overview: IDT, Reflector, Polyimide

Die Cross-Section

Die Process Characteristic

Manufacturing Process 56

o Die Front-End Process & Fabrication Unit

o Filter Die process Flow

o Final Test & Packaging Fabrication unit

Cost Analysis 67

o Summary of the cost analysis 68

o Yields Explanation & Hypotheses 70

o Filter die 72


Wafer Probe Test & Dicing

Wafer Cost

Die Cost

o Packaging & Component 80

Packaging Cost

Final test

Component Cost

Selling price 90

Physical & Cost Comparison 85

o I.H.P. SAW vs. SAW vs. TC-SAW

o I.H.P SAW vs. BAW (FBAR and SMR)

Feedbacks 94

SystemPlus Consulting services 96




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary


Market Analysis

Physical Analysis


Cost Analysis



Related Reports

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling price of theMurata SAFQA2G45MA0G0A.3

Found in a low-end smartphone, the Sony Xperia XA2 Ultra and the Asus ZenFone 4 Pro, the filter die is packaged using a standard 5-pinLGA manufactured by Murata. The component is located near the Wifi transceiver and is part of the 2.4GHz Wifi Front-End path. Untilnow, it was common to find a BAW filter at this place.

Indeed, due the new structure of the IHP SAW, BAW filter could be replaced by this component. The filter realizes mainly with surfacemicromachining take the SAW filter to a new area. With a thin film of lithium tantalate bonded on a silicon substrate, the structure is ableto provide similar performances of BAW filter at lower cost.

Moreover, compared to other SAW filter that provides Murata to the smartphone industry, the IHP SAW filter show high performances interm of attenuation, insertion losses and thermo compensation. Indeed, the Chip Scale Packaging (CSP) is done in order to provide an aircavity that protect the transducer and limit the temperature effect.

This complete analysis of the IHP SAW Component includes analyses of the filter die and the CSP packaging, along with a cost analysis andprice estimation for the component. It also includes a physical and cost comparison with the Murata’s SAW filters offer. Finally, atechnical and cost comparison is included with the BAW filter technologies.





Company Profile & Supply Chain o Muratao SAW Filters technologieso Sony Xperia XA2 Ultra

Market Analysis

Physical Analysis


Cost Analysis



Related Reports

About System Plus

Sony Xperia XA2 Ultra Schematic

• The I.H.P. SAW is used on the Wifi 2G path between the transceiver and the triplexer before the antenna.

Source: FCC






Market Analysis





Cost Analysis



Related Reports

About System Plus

Summary of the Physical Analysis






Market Analysis





Cost Analysis



Related Reports

About System Plus







Market Analysis





Cost Analysis



Related Reports

About System Plus

Die overview






Market Analysis





Cost Analysis



Related Reports

About System Plus

Die Cross-Section






Market Analysis

Physical Analysis

Manufacturing Process Flowo Summaryo Filter Front-End Processo Filter Die process Flowo Filter Fabrication Unito Final Test & Assembly Unit

Cost Analysis



Related Reports

About System Plus

Filter Die Process Flow (1/6)






Market Analysis

Physical Analysis






Related Reports

About System Plus







Market Analysis

Physical Analysis






Related Reports

About System Plus

Component Cost






Market Analysis

Physical Analysis


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Complete Module Price


Related Reports

About System Plus

Estimated Selling Price






Market Analysis

Physical Analysis


Cost Analysis



SMR)

Related Reports

About System Plus

Technical Comparison – I.H.P. SAW vs. SAW and TC-SAW






Market Analysis

Physical Analysis


Cost Analysis



SMR)

Related Reports

About System Plus

Cost Comparison – I.H.P. SAW vs. BAW (FBAR and SMR)






Market Analysis

Physical Analysis


Cost Analysis



Related Reports

About System Plus

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

RF Devices• 5G’s Impact on RF Front-End Module and Connectivity for Cell

phones 2019• Advanced RF System-in-Package for Cellphones 2019

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

RF• Qualcomm 5G mmWave Front-End Module• RF Front-End Module Techical Comparison 2019• Broadcom AFEM-8092 – High/Mid Band FEM

PATENT ANALYSIS - KNOWMADE

Rf Devices• RF Acoustic Wave Filters – Patent Landscape Analysis 2019






















SystemPlusConsultingSERVI CES




Market Analysis

Physical Analysis


Cost Analysis



Related Reports


Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings






Market Analysis

Physical Analysis


Cost Analysis



Related Reports


Contact

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

www.systemplus.fr

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

Mavis WANGTAIWANT :+886 979 336 [email protected]

NANTESHeadquarter

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

KOREAYOLE

America Sales OfficeSteve LAFERRIEREPhoenix, AZWESTERN UST : +1 310 600 [email protected]

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]






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murata incredible high performance (ihp) saw filter...found in a low-end smartphone, the sony xperia...

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