n1 specifications

N1_Specifications

Copyright © Neoway Technology Co., Ltd i

N1 Specifications

Version 1.2

N1_Specifications

Copyright © Neoway Technology Co., Ltd i

Copyright © 2017 Neoway Technology Co., Ltd All right is reserved

is the trademark of Neoway Technology Co., Ltd.

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holders.

Remarks

This document is intended for system engineers (SEs), development engineers, and test engineers.

The information in this document is subject to change without notice due to product version update

or other reasons.

Every effort has been made in preparation of t

his document to ensure accuracy of the contents, but all statements, information, and

recommendations in this document do not constitute a warranty of any kind, express or implied.

Neoway provides customers complete technical support. If you have any question, please contact

your account manager or email to

[email protected]

[email protected]

Website: http://www.neoway.com

N1_Specifications

Copyright © Neoway Technology Co., Ltd ii

Contents 1 Overview ............................................................................................................................. 1

2 Features ................................................................................................................................ 2

3 Dimensions and PCB Foot Print ..................................................................................... 5

3.1 Dimensions ......................................................................................................................................... 5

3.2 PCB Foot Print ................................................................................................................................... 6

4 Electrical Feature and Reliability ................................................................................... 7

4.1 Temperature ........................................................................................................................................ 7

4.2 Work Band .......................................................................................................................................... 7

4.3 TX Power and RX Sensitivity ............................................................................................................ 8

5 Mounting the Module onto the Application Board .................................................. 10

6 Packaging and Storage ................................................................................................... 11

6.1 Packaging ..........................................................................................................................................11

6.2 Storage Conditions ............................................................................................................................11

N1_Specifications

Copyright © Neoway Technology Co., Ltd iii

Revision Record

Version Changes Revised By Date

V1.0 Initial draft Tian 2016-01

V1.1 Added Wi-Fi, BT, GPS Qin 2017-08

V1.2 Modified operating temperature range Dong 2017-09

N1_Specifications

Copyright © Neoway Technology Co., Ltd 1

1 Overview N1is an industrial grade smart module that is developed on Qualcomm platform and supports Android OS

and Windows 10. Its dimensions are 40mm x 40 mm x 2.8mm. It is well applicable to in-vehicle

computers, multimedia terminals, smart homes, IoT terminals, etc, with the following features:

Quad-core ARM Cortex-A7 processors, 1.3 GHz main frequency, 512KB L2 cache, 28 nm

LCD display with MIPI DSI interface, supporting at most 720*1280

MIPI dual-camera, among which the main camera supports at most 8MP, and the sub camera can

support at most 3MP

Multiple-channel audio I/O, supporting stereo headphone

N1 series include the following models:

Band

Model

LTE

B1 B2 B3 B4 B5 B7 B8 B17 B19 B20 B38 B39 B40 B41

N1_CN ● ● ● ● ● ●

N1_EU ● ● ● ● ●

N1_NA ● ● ● ● ●

Band

Model

UMTS CDMA TD-SCDMA GSM

B1 B2 B4 B5 B8 BC0 B34 B39 850 900 1800 1900

N1_CN ● ● ● ● ● ● ● ● ●

N1_EU ● ● ● ● ● ●

N1_NA ● ● ● ● ● ● ● ●

CN: China EU: Europe NA: North America

N1_Specifications


2 Features

Table 2-1 N1 baseband and wireless features

Specifications Description

Power supply VBAT: 3.5V to 4.2V, typical value 3.9V

Current Flight mode: 2 mA

Sleeping mode: 4mA

Recommended operating

temperature -35°C to +75°C

Extended operating

temperature -40 °C to -35 °C and +75 °C to +85 °C

Baseband

Processor Quad-core ARM Cortex-A7 processor

Main frequency: 1.3 GHz

Memory 8Gb LPDDR3 SDRAM

Maximum operation frequency 533MHz

Storage 8GB NAND Flash (4.66 GB is available)

Expandable up to 32 GB

Multimedia processor QDSP6 v5 core

Operation frequency 691 MHz

RF features

Band

N1_CN:

GSM/GPRS/EDGE: 850M/900M/1800M/1900M

TD-SCDMA: B34/B39

CDMA2000 1x/EVDO: BC0

UMTS: B1/B8

FDD-LTE: B1/B3

TDD-LTE: B38/B39/B40/B41

N1_EU:


UMTS: B1/B8

FDD-LTE: B1/B3/B7/B8/B20

N1_NA:


UMTS: B2/B4/B5/B8

FDD-LTE: B2/B4/B5/B7/B17

N1_Specifications


Transmit power

GSM850/EGSM900:+33dBm (Power Class 4)

DCS1800/PCS1900:+30dBm (Power Class 1)

EDGE 850M/900MHz:+27dBm (Power Class E2)

EDGE1800MHz/1900MHz:+26dBm (Power Class E2)

WCDMA/HSPA:+23dBm (Power Class 3)

CDMA/EVDO:+23dBm(Power Class 3)

TD-SCDMA:+23dBm (Power Class 3)

LTE:+23dBm(Power Class 3)

Protocol

GSM/GPRS/EDGE

TD-SCDMA R8 1.28 TDD 4.2Mbps (DL), 2.2Mbps (UL)

WCDMA R99/R9 DC-HSDPA+ 42Mbps(DL),R6 HSUPA 11Mbps(UL)

CDMA2000@1x,1xAdvanced,1xEV-DOrA 3.1Mbps(DL),1.8Mbps(UL)

LTE Cat4 R9, Max.150Mbps (DL),50Mbps (UL)

Satellite positioning GPS / BEIDOU/ GLONASS

Antenna feature 50Ω impedance

Multimedia

Display interface

4-lane MIPI_DSI, each of which supports 1.5 Gbps

Support WVGA (2-lane MIPI_DSI), at most 720qHD (4-lane MIPI_DSI)

24-bit color depth

Camera Interfaces

MIPI_CSI, at most 1.5 Gbps, supporting 2 cameras

Rear camera uses 2-lane MIPI_CSI, supporting at most 8MP

Front camera uses 1-lane MIPI_CSI, supporting at most 3MP

Video processing

Coding:

H.264 BP/MP – HD, 30 fps

MPEG-4 SP / H.263 P0 – WVGA, 30 fps

VP8 – WVGA, 30 fps

Decoding:

H.264 BP/MP/HP – RES, 30 fps

MPEG-4 SP/ASP – RES, 30 fps

DivX 4x/5x/6x – RES, 30 fps

H.263 P0 – WVGA, 30 fps

VP8 – RES, 30 fps

(HEVC) H.265 MP 8 bit – RES, 30 fps

Graphics processing unit Adreno 304, at most 400MHz 3D graphics processing,

Audio

Encoder/decoder

Voice encoding/decoding supports G711, Raw PCM, QCELP;

EVRC, -B, -WB; AMR-NB, -WB; GSM-EFR, -FR, -HR

Audio encoding/decoding supports MP3; AAC, AAC+, eAAC;

AMR-NB, -WB, G.711, WMA 9/10 Pro

Noise rejection

N1_Specifications


Audio Input 2 groups of analog MIC input, embedding internal bias

Audio format MP3, AAC, AAC+, eAAC+, MIDI

Communication interface

UART At most 4 Mbps, 2 groups

I2C 2 groups of I2C

SPI 1 group, supporting only host mode (two peripherals)

At most 52 Mbps

UIM 2 groups, 1.8 V/2.85 V dual-voltage adaptive

USB 1 group of USB2.0 high-speed interface, a maximum transmitting rate of

480 Mbps

SDIO Supporting SD3.0 and SD/MMC cards,4-bit SDIO

Wireless interface

WLAN 2.4G single band, supporting 802.11b/g/n,

Bluetooth BT4.1LE or earlier versions

FM Supporting Rx, 76 to 108MHz, channel spacing of 50 kHz

RDS (Europe), RBDS (USA)

Commissioning Interface

Fastboot mode Forcibly enable USB control

N1_Specifications


3 Dimensions and PCB Foot Print

3.1 Dimensions

Table 3-1 N1 dimensions

Specifications N1

Dimensions (40±0.1)mm*(40±0.1)mm*(2.8±0.1)mm(H*W*D)

Weight 9.0g

Package 152-Pin LCC

Figure 3-1 Top view of N1

Figure 3-2 Bottom view of N1

N1_Specifications


3.2 PCB Foot Print

The N1 module adopts LCC packaging. Figure 3-3 shows the recommended PCB foot print. (Unit: mm)

Figure 3-3 PCC foot print recommended for N1

N1_Specifications


4 Electrical Feature and Reliability

4.1 Temperature

Table 4-1 Temperature Feature

Temperature Minimum Value Typical Value Maximum Value

Recommended -30°C +25°C +75°C

Extended -40°C +85°C

4.2 Work Band

Table 4-2 N1RF work band

Work band Uplink Downlink

GSM850 824~849MHz 869~894MHz

EGSM900 880~915MHz 925~960MHz

DCS1800 1710~1785MHz 1805~1880MHz

PCS1900 1850~1910MHz 1930~1990MHz

UMTS B1 1920~1980MHz 2110~2170MHz

UMTS B2 1850~1910MHz 1805~1880MHz

UMTS B4 1710~1755MHz 2110~2155MHz

UMTS B5 824~849MHz 869~894MHz

UMTS B8 880~915MHz 925~960MHz

CDMA BC0 824~849MHz 869~894MHz

TD-SCDMA B34 2010~2025MHz 2010~2025MHz

TD-SCDMA B39 1880~1920MHz 1880~1920MHz

LTE-FDD B1 1920~1980MHz 2110~2170MHz

LTE-FDD B2 1850~1910MHz 1805~1880MHz

LTE-FDD B3 1710~1785MHz 1805~1880MHz

LTE-FDD B4 1710~1755MHz 2110~2155MHz

LTE-FDD B5 824~849MHz 869~894MHz

LTE-FDD B7 2500~2570MHz 2620~2690MHz

LTE-FDD B8 880~915MHz 925~960MHz

LTE-FDD B17 704~716MHz 734~746MHz

N1_Specifications


LTE-FDD B20 832~862MHz 791~821MHz

LTE-TDD B38 2570~2620MHz 2570~2620MHz

LTE-TDD B39 1880~1920MHz 1880~1920MHz

LTE-TDD B40 2300~2400MHz 2300~2400MHz

LTE-TDD B41 2555~2655 MHz 2555~2655 MHz

Table 4-3 N1 Wi-Fi/BT 2.4G work parameters

Working frequency:

Wi-Fi- 2402MHz—2482MHz

BT:2402——2480MHz

Mode Rate/Grouping TX Power Sensitivity

11b 1Mbps 15±2dbm

11Mbps 15±2dbm -86

11g 6Mbps 13±2dbm

54Mbps 13±2dbm -76

11n(TH20) MCS0 10±2dbm

MCS7 10±2dbm -70

11n(HT40) MCS0 10±2dbm

MCS7 10±2dbm -70

BT

DH5 10dbm -93

2-DH5 8dbm -90

3-DH5 8dbm -85

Table 4-4 N1 GNSS work parameters

Type Frequency Unit Remarks

GPS 1575.42±1.023 MHz Fix position independently

GLONASS 1597.5—1605.8 MHz Fix position independently

BDS 1561.098±2.046 MHz Assist position fix

4.3 TX Power and RX Sensitivity

Table 4-5 N1 RF power and RX sensitivity

Band Transmitting Power Receiving Sensitivity

GSM850 GPRS,EDGE 33 dBm+2/-2dBm <-107dBm

N1_Specifications


GSM900 GPRS,EDGE 33 dBm+2/-2dBm <-107dBm

GSM1800 GPRS,EDGE 30dBm+2/-2dBm <-107dBm

GSM1900 GPRS,EDGE 30dBm+2/-2dBm <-107dBm

UMTS B1 24dBm +1/-3dBm <-107dBm





CDMA BC0 24dBm+3/-1dBm <-107dBm

TD_SCDMA B34/39 24dBm +1/-3dBm <-109dBm

LTE-FDD B1(10MHz) 23 dBm+2/-2dBm <-97dBm

LTE-FDD B2 (10MHz) 23 dBm+2/-2dBm <-95dBm









LTE-TDD B39(10MHz) 23 dBm+2/-2dBm <-97dBm



The bandwidth of LTE-FDD B41 is 100 MHz, and the signal channel ranges from 40240MHzto

41240MHz.

The data in the above tables is obtained by connecting the module to RF test instrument (e.g.

CMU200, CWM500, or Agilent 8960) in lab tests. It is for reference only.

N1_Specifications


5 Mounting the Module onto the Application Board N1 is compatible with industrial standard reflow profile for lead-free SMT process.

The reflow profile is process dependent, so the following recommendation is just a start point guideline:

Only one flow is supported.

Quality of the solder joint depends on the solder volume. The stencil thickness of0.15 mm to 0.20

mm is recommended.

Use bigger aperture size of the stencil than actual pad size.

Use a low-residue, no-clean type solder paste.

N1 is big and use multi-layer HDI board so that it is difficult to solder. For information about cautions in

N1 storage and mounting, refer to Neoway Module Reflow Manufacturing Recommendations.

When maintaining and manually desoldering it, use heat guns with great opening, adjust the temperature

depending on the solder paste type (330°C for solder paste without lead; 300°C for solder past with lead),

and heat the module till the solder paste is melt. Then remove the module using tweezers. Do not shake

the module in high temperature when removing it. Otherwise, the components inside the module might

get misplaced.

N1_Specifications


6 Packaging and Storage

6.1 Packaging

N1 modules are packaged in sealed bags on delivery to guarantee a long shelf life. Package the modules

again in case of opened for any reasons.

Storage environment: the temperature is lower than 40°C and the humidity is lower than 90%.

If the modules are exposed to air for more than 48 hours at conditions not worse than 30°C/60% RH, a

baking procedure should be done before SMT. Or, if the indication card shows humidity greater than 20%,

the baking procedure is also required. The recommended baking conditions are 90°C/12 hours. Do not

bake modules with the package tray directly.

There are 12 pieces on each tray, 10 trays in each sealing bag, and 4 bags in each box.

6.2 Storage Conditions

Temperature: 20°C~ 26°C

Humidity: 40%-60%

Period: 120 days

n1 specifications

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