national tsing hua university electronic packaging/cae labs. national tsing hua university...

National Tsing Hua University

Electronic Packaging/CAE Labs.







清華動機系電子構裝力學課程清華動機系電子構裝力學課程

Electronic Packaging Lab. of NTHUElectronic Packaging Lab. of NTHU國立清華大學動機系電子構裝實驗室









PME535000 電子構裝力學

（1）電子構裝簡介 Functions and requirements of an electronic package The typical electronic package Chip, chip carrier, PCB Material science considerations

（2） Packaging architecture（3） Wafer and Chip（4） Chip attachment, wire bonding, single chip module and MCM（5） Mechanical design, fracture mechanics and finite element for electronic package（6） A brief introduction to Ball Grid Array (BGA)，Flip Chip and Chip Scale

Packaging（7） Thermal performance in plastic BGA and ceramic BGA（8） Reliability of PBGA and CBGA（9） Prediction of solder joint geometry and BGA infrastructure（10） Connector technology（11） Factory and future

Reference books:1. Donald P. Seraphim, Ronald C. Lasky and Che-Yu Li, “Principles of Electronic

Packaging”, McGraw-Hill2. Jhon H. Lau and Yi-Hsin Pao, “Solder Joint Reliability of BGA, CSP, Flip Chip, and

Fine Pitch SMT Assemblies”, McGraw-Hill3. John H. Lau, “Ball Grid Array Technology”, McGraw-Hill4. John H. Lau, “Flip Chip Technologies”, McGraw-Hill5. John H. Lau, “Chip on Board Technologies for Multichip Modules”, Van Nostrand

Reinhold (VNR)









Electronic Packaging/CAE Labs. 研究需求之基礎建設研究成果融入教育

教育需求之基礎建設

尖端研究

基礎建設教育國內所需

（1）針對國內所需開授相關課程（2）人才培育

電子構裝力學電子構裝力學

清華大學動機系電子構裝力學（碩博士班）修課人數85 年： 40 餘人86 年： 40 餘人87 年：約 70 人，修課系所含動機、材料、化工與業界










電子構裝力學教學搭配事項電子構裝力學教學搭配事項

•自有之有限元軟體 ─ for Thermal Management and Thermal Stress/Strain Analysis•清華大學動機系電子構裝網站（ http://140.114.57.4/ep_cae_www.html ）•電子構裝材料庫•錫球回焊成型預估軟體










Reliability Modeling vs. Reliability TestingReliability Modeling vs. Reliability Testing

1. Reliability Testing ( 一般的流程 )

DesignBuild Large Quantity of Prototypes

Accelerated Life Testing

Design

Simulation and Process Modeling

Build Small Quantity of Prototypes

Model Validation

Mass Production

2. Reliability Modeling ( 一個成熟 R&D 團隊的流程，目前世界大廠研發流程 )

Build Test Vehicle

Accelerated Life Testing

3. Reliability Modeling ( 最佳目標流程 )

Design

Simulation and Process Modeling Model

ValidationMass

Production

Build Test Vehicle

Mass Production

•Labor Intensive•Long Cycle Time (e.g. a typical cellular phone requires 4-7 iterations, 4-8 weeks per iteration)•Lack of Physical Insight

•Cycle Time Reduction ( 節省約 2 倍時程 )•Computation Intensive

•Cycle Time Reduction ( 節省約 10 倍時程 )•Computation Intensive•Physical Insight










Development of Next Generation Package SystemDevelopment of Next Generation Package System

•Chip Scale Package, Wafer Level Packaging and Flip Chip will be the Better Solution for The Next Generation Packaging System

•Research on Chip Scale and Wafer Level Packaging are more Suitable for Mechanical Engineering

Key Research Issues Required for Flex CSP and Key Research Issues Required for Flex CSP and Wafer Level PackagingWafer Level Packaging

Manufacturing Infrastructure

IC Factory (XXXX 、 XX ）Packaging House （ XXXX 、 XX ）

Flex Circuit （ XXXX 、 XX ）Surface Mount Technology （ XX ）

其他（ XX ）

Research Infrastructure

Solid Mechanics -- Fracture, Visco/Plastic, Thin Film Mechanics, Statistic Mechanics, Liquid Formation, etc.Material Science -- Material Characterization, New MaterialsManufacturing and AutomationHeat TransferMEMSEtc.










美國在電子工業的世界競爭力

Items Technology Invention Market LeaderCommunication Electronics U.S. Europe/U.S.

Consumer Electronics U.S. Far EastCopiers U.S. Far East

Digital Watches U.S. Far EastDesk-Top Computer U.S. Far East

DRAM U.S. Far EastFax Machine U.S./Europe Far East

Flat Panel Displays U.S. Far EastHand-Held Calculators U.S. Far East

Notebook Computer U.S. Far EastNumber Control Machines U.S. Far East

Robotics U.S. Far EastTelevision Sets U.S. Far East

VCRs U.S. Far EastNote: Far East 大多為日本










美國各大學與協會電子構裝研究分工美國各大學與協會電子構裝研究分工

美國大學電子構裝研究中心研究重點Georgia Institute of Technology General, NSF-funded Electronic

Packaging Research CenterCornell University Solder, micro-machining, AlN, and

PolymersLehigh University Packaging reliability/Die attach

materials/InterfacesUniversity of Maryland Reliability and qualityUniversity of Arizona modeling and simulationUniversity of Arkansas Diamond, MCMs, and integrated passivesSUNY Bringhampton Surface mount assemblyUniversity of Colorado Opto and RF

世界各大學電子構裝研究中心研究重點Tech University – Berlin MCM, Flip Chip reliabilityKAIST, S. Korea MCM, Flip Chip, Thermo-Mechanical

India Inst. Of Science Education, Integrated PassivesUniversity of Tokyo Materials, Sensors, Adhesion and Cu

materialIMEC, Belgium MCM, Flip Chip

美國電子構裝協會主要工作SEMATECH Assembly & Packaging AssigneesMCNC Flip-Chip bumping (ARPA interaction)HDPUG Packaging user needs

Note: 美國研究經費來源 – ARPA, NSF, SRC, NIST, etc.*SRC 是一個結合了近 60 家公司與政府單位的聯盟協會，其主要目標為規畫、指導與提供研究經費給半導體及電子構裝相關之具前瞻性與需長

期性之研究。


national tsing hua university electronic packaging/cae labs. national tsing hua university...

Documents