ncapsulate free-form: plastic encapsulation for mems and sensors · 2015. 12. 21. · mems and...
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nCapsulate free-form: plastic encapsulation for
MEMS and Sensors
Delivering system benefits by embedding mechanical and electronic elements
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Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
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Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
![Page 4: nCapsulate free-form: plastic encapsulation for MEMS and Sensors · 2015. 12. 21. · MEMS and Sensors Delivering system benefits by embedding mechanical and electronic elements](https://reader036.vdocument.in/reader036/viewer/2022062605/5fd6875cc803dc037f3c6947/html5/thumbnails/4.jpg)
Mission
Our mission is to be world class competence center offering development and manufacturing of functional semiconductor assembly solutions.
– Focus on (MEM’s) sensor systems.
– Development from scratch to a manufacturing solution.
– Meeting quality demand of Automotive industry.
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Facts & Figures
• Young company with a long history (since 1987)
• Development & production in the Netherlands
• Captive volume assembly in the Phillipines
• TS16949 & ISO 14001 certified
• > 100,000,000 sensor assemblies for automotive
• Move to Novio Tech Campus Nijmegen November-2015
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Proposition
• Core business:
– Development of functional plasticencapsulation solutions.
– Volume manufacturing of functional packaging.
• Other services:
– Ceramic / plastic fast turn prototyping
– Product & process qualification
– Component supply management
– Wafer processing
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Development for manufacturing
– From packaging idea to manufacturing solution.
– Design for manufacturing.
– Local industrialization assures manufacturable solution.
Transfer intomanufacturing
Packagedevelopment& prototyping
IndustrialisationConcept
engineering
SENCIO
Research institutes
Volume manufacturers
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Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
![Page 9: nCapsulate free-form: plastic encapsulation for MEMS and Sensors · 2015. 12. 21. · MEMS and Sensors Delivering system benefits by embedding mechanical and electronic elements](https://reader036.vdocument.in/reader036/viewer/2022062605/5fd6875cc803dc037f3c6947/html5/thumbnails/9.jpg)
Functional encapsulation solutions
Sensor types
Pressure Gas/fluid Optical Acceleration Magnetic
Overmolded
Premolded
Globtopovermolding
Exposed die molding
Glass on die
nCapsulate
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Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
![Page 11: nCapsulate free-form: plastic encapsulation for MEMS and Sensors · 2015. 12. 21. · MEMS and Sensors Delivering system benefits by embedding mechanical and electronic elements](https://reader036.vdocument.in/reader036/viewer/2022062605/5fd6875cc803dc037f3c6947/html5/thumbnails/11.jpg)
Key aspects for (MEMS) sensors
• Access of the environment to the (sensor) chip surface
– Chemicals
– Blood
– Others…
• Protection of sensitive electronics against this environment
– Interconnect; wired interface of Sensor (bond pads)
– data processing IC.
– Other active or passive components
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Exposed die molding
Sensor types
Pressure Gas/fluid Optical Acceleration Magnetic
Overmolded
Premolded
Globtopovermolding
Exposed die molding
Glass on die
nCapsulate
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Exposed die molding
Principal:– Overmolding with duroplast leaving only the sensor
area free of molding compound.
– Gold wires encapsulated, sensor area exposed.
Technologies:– Patented insert technology.
– FAM molding technology
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Exposed die molding
Highlights:
– Interconnection reliability similar to standard plastic packaging
– Ideal solution for harsh environments
– Applicable for a wide range of plastic packages
– Cavity format & size can be tuned to the application, through hole has been achieved
– Can be applied with multi chip [sensor(s) + ASIC]
– Automotive application for temperatures up to 150°C
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Insert or FAM technology
• Cavity Ø 900 µm.
400 µm
Soft-touchtm
technology
MICROCAVITY by SOFT TOUCH™
QFN package 4x4mm.
NEW
Soft touchtm & FAM
• Cavity Ø 400µm
• Cavity Ø 200µm (in development)
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Oil pressure sensor package
Outline:• SOIC 24 wide body outline.
Advanced Technologies:• Integrated passive components
• Multichip module
• Exposed die overmoldng
• pressure sensor with only
pressure hole exposed.
Mission Profile notes:• Oil pressure measurement
• Lifetime immersed in motor oil.
• Temperature -40 to 150°C
Product developed by Hella Fahrzeugkomponenten GmbH
Package developed by Sencio.
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Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
![Page 18: nCapsulate free-form: plastic encapsulation for MEMS and Sensors · 2015. 12. 21. · MEMS and Sensors Delivering system benefits by embedding mechanical and electronic elements](https://reader036.vdocument.in/reader036/viewer/2022062605/5fd6875cc803dc037f3c6947/html5/thumbnails/18.jpg)
Functional encapsulation solutions
Sensor types
Pressure Gas/fluid Optical Acceleration Magnetic
Overmolded
Premolded
Globtopovermolding
Exposed die molding
Glass on die
nCapsulate
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nCapsulate™
Adding an extra dimension to the encapsulation of your MEMS device /system
• Protection
• Additional functionality
Examples:
• Functional shapes.
• Combination of mechanics with electronics (mechatronics).
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nCapsulate – functional shapes
Encapsulation shape adapted to the application.
• Accurate dimensional shape, stable over temperature
• Applications:
– Alignment features
– Mounting support
– Custom specific shape
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Combination mechanics & electronics
Adding mechanical elements to encapsulated electronics
– Alignment features
– Supporting features
– …
Advantages:
– Improved alignment (measurement accuracy)
– Improved thermal contact
– Simplified design
– Improved efficiency
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Integration of screw-thread
Improved alignment between nut & sensor/semiconductor
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Integration of nut applications
Direct mounting of heat sink
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Integration of nut applications
Mounting of tube access for sensor application
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Integration of nut applications
Fixation of optical elements (lens, fiber..)
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Integration of bearing
Improved alignment between bearing & semiconductor
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Integration of bearing
Application examples:– Magnetic sensor (Hall, AMR) angle
measurement
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Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
![Page 29: nCapsulate free-form: plastic encapsulation for MEMS and Sensors · 2015. 12. 21. · MEMS and Sensors Delivering system benefits by embedding mechanical and electronic elements](https://reader036.vdocument.in/reader036/viewer/2022062605/5fd6875cc803dc037f3c6947/html5/thumbnails/29.jpg)
Example
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Medical sensor application
Sensor types
Pressure Gas/fluid Optical Acceleration Magnetic
Overmolded
Premolded
Globtopovermolding
Exposed die molding
Medical sensor encapsulation
Glass on die
nCapsulate
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Medical sensor encapsulation
• Compatibility encapsulation materials with the bio / life science - materials.
– Resistance of compound against the bio-materials
– Influence of the compound on the bio-materials
• Limited data available
– Very limited support from suppliers.
– Extensive testing needed.
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MrCyte, Life-Science Project
• Magnetic flow cytometry
• Concentration measurement of (rare) cells in blood, by counting cells marked with magnetic nanoparticles.
– Cancer diagnostics.
– Blood analysis.
• Integration of sensor package in microfluidics unit.
MrCyte
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MrCyte Packaging aspects
Exposed die molding
• Exposed magnetic sensor with small structures to guide nanoparticle flow.
• Integrated ASIC
nCapsulate
• Small micro structures on package to guide nano particle flow to sensor.
• Contact pins (no leads)
• Alignment holes for fixation
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MrCyte pictures of the application
Integrated in microfluidic
Cartridge filled with blood
Read out equipment
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Topics
• General company introduction
• Functional encapsulation solutions
• Exposed die molding
• nCapsulate
• (MEMS) sensor applications
• Summary & conclusion
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Summary & Conclusion
• Packaging major contribution in the functionality of a sensor systems for (MEMS) sensor application.
• Exposed die molding proper technology to make sensor area accessible
• nCapsulate adding more functionality to the encapsulation
Sencio BVMicroweg 1-11 | 6545 CL NIJMEGEN | NetherlandsPhone: + 31 24 3714490 | Fax: + 31 24 [email protected] | www.sencio.nl
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