ne imaps symposium adams 050604-1
TRANSCRIPT
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"AlSiC-Based HybridComposite Tool Kit"
By Richard W. Adams
and Mark A. Occhionero
Ceramics Process Systems
111 South Worcester St
Chartley MA 02712-0338
www.alsic.com
New England IMAPS 31 Annual Symposium
Thursday May 6, 2004
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"AlSiC-Based Hybrid Composite Tool Kit"
Abstract:AlSiC and multi-component structures provide unique
thermal management electronic packaging solutions for
microwave, microelectronics, power electronics, and
optoelectronics that result in improved product reliability. This
paper reviews volume AlSiC manufacturing applications today,
and then describes examples of a wide range of possibilities for
multi-component, multi-functional thermal management
structures.
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AlSiC Packaging for Electronics Thermal Management
- Basic Parameters
Controlled Thermal Expansion
Engineered CTE values - for component and assembly
compatibility = reliability
Engineered solutions can create typical CTE values 7-12 ppm/C
Thermal Dissipation
High isotropic thermal conductivity, typical = 200 W/mK
Lightweight
3 g/cm 3
Cost Effective Manufacturing Capability - net shape cast
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CPS AlSiC Fabrication - Defines Properties and Design
SiC to Al-metal ratio defines thermal expansion
1st - SiC preform with controlled and variable volume content
2nd - Infiltrate with Al-metal to form the AlSiC composite
Thermal conductivity determined by components Electronic Grade SiC 230 - 260 W/mK
A356.2 Casting Alloy 160 W/mK
Little influence of ratio of 2 components
net shape forming
preform is ~ smaller than final part
infiltration tool = final dimensions
eliminates costly machining
SiC preforminjection molded
AlSiC productinfiltration casting
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AlSiC - Metal Matrix Composite Material
SiC
SiC particles uniformly distributed
in continuous Al-matrix
C S AlSiC nstantaneous C
9
emperature ( C)
In
n
n
u
C
E
(
/C)
AlSiC-9
AlSiC-
AlSiC-
~ vol% SiC
~ vol% SiC
~ vol% SiC
See www.alsic.com
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AlSiC Tools
Marry Properties to Product Design
Design Functionality
Basic AlSiC
lids
baseplates
package system structures
AlSiC + Concurrent IntegrationTM
Cooling Tubes - active fluid HOPG / Diamond - passive transfer
Dielectric Ceramic Inserts - isolation
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Basic AlSiC Design Pick compatible AlSiC CTE
Seal rings
Substrates
Devices
Design rules for AlSiC casting
Draft Angles
Thicknesses
Radii
Al-Rich Areas for conventionalmachining
See www.alsic.com
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Basic AlSiC - lids
Simple to Complex GeometriesApplications:
MicroprocessorLids
DSP
Flip Chip Lids
Optical Lids
Volumes100 pcs - 40K/week
Price Volume/Complexity $ 2 - $ 5 in volumes of
~100K/yr
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Basic AlSiC - lids
Complex GeometriesProduct is net-shape fabricated -
no machining
multiple pedestals
angled features
radial alignment features
septums and walls
lower cost than machined
Aluminum alternative
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Basic AlSiC - Baseplates
Compatible CTE = unlimited
thermal cycling of package
AlN soldered to AlSiC
Design
Dome Shape - Side 1
Compressing a dome shape
against flat cold plate
maximizes heat transfer
Flat - Side 2
Attachment of flat substrates flat dielectric substrate surface
convex bow cooler plate surface
Thomas Schuetze, Herman Berg, OliverSchilling The new 6.5kV IGBT module: areliable device for medium voltageapplications, PCIM September 2001
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Concurrent IntegrationTM -High Density Interconnect HDI for
GaAs Microwave Transmit/Receive Packages
First, dense dielectric ceramic
ferrules are inserted into the
QuickCastTM infiltration tooling
along with the SiC preform.
Then, the Al-metal, that infiltratesthe SiC preform to form the AlSiC
composite, hermetically bonds and
fills the ferrules to form coaxial
feedthrus. This process is termed
Concurrent IntegrationTM.
Dielectric Feedthrus
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Concurrent IntegrationTM - AlSiC LED Submount
Alloy Metal InsertsProduct Features:
multiple pedestals
angled features
partially machined to expose Alloy
4 pads for assembly
Alloy 4 bonded direct to Al phaseof AlSiC
Alloy 4 pad
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Concurrent IntegrationTM - Optoelectronic AlSiC TE
Cooler Substrate with HOPG
High Thermal Conductivity Insert
Product Features:
Pyrolytic Graphite PG compressively
encapsulated within AlSiC
Thermal conductivity 1300 W/mK PG located near heat source/TE
cooler position.
Selective use of costly material
1350 W/mK
Heat source surface
1350 W/mKAlSiC laser diode TEC substrate system showing TEC
mount area top and the cross section showing the
HOPG insert in the AlSiC composite bottom .
HOPG 1300 W mK
AlSiC
AlSiC
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Concurrent IntegrationTM - Liquid Flow Thru Cooling
Cooling Tube or Heat Exchanger
Product Features:
Tube intimate within AlSiC casting SiC overmolded onto tube
Direct bond AlSiC to tube
Maximize heat transfer AlSiC to tube
Low cost one step assembly
CPS Patented process
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Metallurgical Bonding AlSiC to AlSiC
BAS
TOP
Heat sink and housing are joined by
Friction Stir Welding.
Frictio Stir Weldi g
Bonding of Engineered Al-Rich
Areas within AlSiC casting
Al Solder Bo di g Processes
Various commercially availableDesired Al Skin Present on
AlSiC
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QuickCastTM
High Pressure Precision Aluminum Casting Aluminum-only precision casting
Tolerances in the +/-0.003 Range
Low cost tooling
Rapid product introduction andmoderate production rate
Option for Concurrent IntegrationTM
Diamond, PG, etc inserts
High Output LED light housing
RV, Boats, Theater, Safety Lighting
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S mmary "AlSiC-Based Hybrid Composite Tool Kit"
Basic AlSiC Properties coupled with Concurrent IntegrationTM
AlSiC = Engineered CTE, Thermal Conductivity, Lightweight
CPS AlSiC =
Shape Complexity and Tight Tolerance - net shape
Attractive Value Proposition for many growing number of Applications
Concurrent IntegrationTM Presents Thermal Package Design
Options - limited only to your imagination
AlN, ZTA, Al2O3, Si3N4 Substrates/Ferrules, etc.
Stainless steel, alloy 4 , Titanium inserts
Tubes, Heat exchangers, welded pin fin coolers
High Thermal Conductivity Diamond, PG
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