Thermoelectric Cooling

ECP MSTM 2009-2010 | Arnaud Marchais, Charles-Axel

Dein

IntroductionIntroduction

“[We] have demonstrated that there are no

fundamental barriers to extending Moore’s Law for

another decade”

Intel, June 2001

“[We] have demonstrated that there are no

fundamental barriers to extending Moore’s Law for

another decade”

Intel, June 2001

Power and thermal non-uniformities are constantly

increasing

Power and thermal non-uniformities are constantly

increasing

Existing solutions are inefficient

Existing solutions are inefficient

I – A Technology of Microscale Thermal Management

I – A Technology of Microscale Thermal Management

A – A Top-Down ApproachA – A Top-Down Approach

The Embedded Thermoelectric Cooler

The Embedded Thermoelectric Cooler

Cooling two hot spots (i.e. dual core CPU)

B – The Peltier EffectB – The Peltier Effect

Advantages

•Can be used to generate electricity

(Seebeck effect)

•Very small size and weight

•Solid state (no moving parts, high

reliability)

•Very high pumping power density: up to

150 W/cm2

Smarter use

of the Peltier effect

Nextreme main facts

•Founded in December 2004

•As a spin-off from NTI International (a

research institute)

•35 Employes

•Mainly funded through venture capital

•Location : North Carolina

•IP : 33 patents

Products: CoolersThe OptoCooler

HV14 moduleETEC custom coolers

Products: power generators

Applications: Laser Diodes

Applications: LEDs

Applications: photo detectors and focal plane

arrays

Night vision googles

Applications: deep drilling

Applications: semiconductor tests

Applications: Healthcare

Top management: a team of experts

CEO CFO VP Engineering VP GM

MBAMsc in ChemistryAnd Physics

MBACertified Accountant

Ceramic EngineerMS in materials science

MBAElectrical Engineer

Went from Cronos a spin-off from a research institute

Also from Cronos25 years of financial management

15 years experience in semiconductor technology

27 years of senior executive experience

Investors

Nextreme has raised $35 million from multiple funding

partners

Technology solutions supplier for CIA

Thank you!