nvidia tegra k1 visual computing module - system plus ... · ©2019 by system plus consulting |...

©2019 by System Plus Consulting | SP19514 – Nvidia T124XA – Tegra K1 VCM 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Nvidia Tegra K1 Visual Computing ModuleAudi’s zFAS Calculator and 3D Cluster’s Computing Module for Autonomous Driving.SP19514 – IC report by Stéphane ELISABETH & Belinda DUBE

Laboratory Analysis by Guillaume CHEVALIERDecember 2019 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Nvidia

o Tegra K1 VCM Device

Market Analysis 14

o Market Positionning

Physical Analysis 16

o Summary of the Physical Analysis 17

o Package Assembly 19

Package Views & Dimensions:

Marking, Overview

Package Opening: Components, UF, Sealant, IHS, TIM

Package Cross-Section

Summary of Physical Data

o IC Die 56

Die View & Dimensions

Delayering & main Blocs

Die Process

Die Cross-Section

Die Process Characteristic

o DRAM Die 69

Die View & Dimensions

Die Cross-Section

Manufacturing Process 73

o IC Die Front-End Process & Fabrication Unit

o SiP Packaging Process & Fabrication Unit

Cost Analysis 80

o Summary of the cost analysis 81

o Yields Explanation & Hypotheses 83

o IC die 85

Die Front-End Cost

Die Wafer & Die Cost

o DRAM DRR3 die 89

Die Front-End Cost

Die Wafer & Die Cost

Packaging Cost

Component Cost

o SiP Packaging 93

BoM Component cost

Packaging Cost

Packaging Cost per process steps

Module Cost

Selling price 100

Feedbacks 104

SystemPlus Consulting services 106




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

Related Reports

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the NVIDIA Tegra K1 VCM.

This device named Tegra K1 Visual Computing Module (VCM) is a GPU packaged in System-in-Package configuration. On thesame board, the device features the GPU silicon die along with four DRR3 Memory package, one Flash memory package andseveral passives components. Unlike SiPs on the market, this packaging is not using Epoxy Molding Coupound (EMC) as anencapsulator. The components are soldered on a PCB substrate and an Integrated Heat Spreader (IHS) is glued on top of thesystem. The IHS is specially design for the device and the PCB substrate is using a Built up process with modified Semi-AdditiveProcess (mSAP) from a 2-layer core.

For the supply chain, Nvidia choose a dual sourcing for the DRAM memories, it can be either SKhynix or Samsung. Both supplieroffers the same form factor DRR3 memory package in a 56-ball FCBGA configuration. For the Flash memory, the component issourced from Cypress/Spansion and the Tegra Silicon Die came directly from TSMC.

The report will include a complete analysis of the SiP, featuring die analyses, packaging processes and cross-sections. It willinclude precise measurement of the PCB substrate, the IHS, the Thermal Interface Material (TIM) and the underfill (UF).




Overview / Introduction

Company Profile & Supply Chain o Nvidiao Tegra K1 VCM

Market Analysis

Physical Analysis


Cost Analysis


Feedbacks

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About System Plus

Tegra K1 Visual Computing Module (VCM) Device

zFASAutonomous Calculator

3D Cluster

• XX

• XX

• XX

Source: Nvidia






Market Analysis

Physical Analysis o Synthesiso Package Assembly

o Views & Dimensionso Openingo Cross-Sectiono Synthesis

o GPU Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-sectiono Synthesis

o DRAM Dieo Views & Dimensionso Die Cross Section


Cost Analysis


Feedbacks

Related Reports

About System Plus

Summary of the Physical Analysis

X-Layer PCB Substrate

DRAM Memory

Nvidia Tegra K1 VCM Assembly©2019 by System Plus Consulting

Mdoule Assembly:

o Pick & place die assembly

o WLCSP and Memories package placement

o Electrical Connections and support:

Solder balls, X-Layer PCB Substrate

IC Die:

o Process:

CMOS XX nm XP XXM

o Placement : Lead Solder Ball & XX.

Flash Component:

o Package type: BGA-56

o Die Process:

CMOS XX nm XP XM

o Die Placement : Wire bonding on a X-layer PCB Substrate.

DRAM Components:

o Package type: BGA-96

o Die Process:

CMOS XX nm XM

o Die Placement : Flip-Chip on a X-layer PCB Substrate.Flash Memory

Integrated Heat Spreader






Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Package Marking

• PCB Marking:XXXXXX XX

• Based on the marking, the PCB manufacturer could be XX.






Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Package Opening – Components

• Device Size: XX mm²(XX x XX mm)

• Component Number: XX

• Component to component spacing: XX mm

• Component to Die: XX mm

• Component to Edge of the substrate: XX mm

Component Type Component Number Component Size

Capacitor XX XX

Resistor XX XX

Inductance XX XX

• The PCB substrate seem to have two type of fiducial mark.

• Fiducials Number: Square XX

Round XX

Triangle XX

• Fiducials Size: Square XX mm²

(XX x XX mm)

Round XX mm²

(Ø XX mm)

Triangle XX mm²

½ (XX x XX mm)






Market Analysis






Cost Analysis


Feedbacks

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Package Opening – Underfill

Package Top View – Optical View©2019 by System Plus Consulting

Package Top View – Optical View©2019 by System Plus Consulting

Component#2

Component#1

FiducialsUnderfill

PCB Substrate

Passives

• XX

• Component #1 UF spread: XX mm

• Component #2 UF spread: XX mm






Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Package Opening – IHS

Package Opening – Bottom View – Optical View©2019 by System Plus Consulting

XX

mm

XX mm

XX mm

XX mm

XX mm

XX mm XX mm

XX mm

XX mm

XX mm • TIM spread from edge of die:– Component #1 XX mm

– Component #2 XX mm

– Component #3 XX mm

Package Opening – Modified Pictures©2019 by System Plus Consulting






Market Analysis






Cost Analysis


Feedbacks

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Package Opening – Top Line

Package Opening – Top View – Optical View©2019 by System Plus Consulting

Package Opening – Optical View©2019 by System Plus Consulting

Line (XX mm)

Space (XX mm)

Degassing Hole (Ø XX mm)

• Min. L/S: XX / XX mm

• Min. Line Pitch: XX mm

• Degassing Hole Diameter: XX mm

• Degassing Hole Pitch: XX mm






Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Package Cross-Section

Cross-Section Plan©2019 by System Plus Consulting

•Package total thickness (without balls): XX mm

IHS thickness:XX µm

PCB Substrate thickness:XX mm

IHS (XX mm)

Solder Ball(XX mm)

Prepreg (XX mm)

Package Molding


XX mm

XX mm

XX mm


Underfill (XX mm)

TIM (XX mm)






Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Package Cross-Section – TIM & CUF

Cross-Section Plan©2019 by System Plus Consulting

Package Cross-Section – SEM View©2019 by System Plus Consulting

Component #3

Underfill (XX mm)

XX mm

XX mm

TIM (XX mm)

Solder Ball(XX mm)


X-layer PCB Substrate

• XX

• XX






Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Die Overview & Dimensions

• Die Area: XX mm²(XX x XX mm)

• Nb of PGDW per 12-inch wafer: XX

• Pad number: (Est.) ~XX

XX

mm

XX mm

Die Overview – Optical View ©2019 by System Plus Consulting

PGDW: Potential Good Die per Wafer






Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Die Cross-Section – UBM

Die Cross-Section –UBM – SEM View©2019 by System Plus Consulting

Polyimide (XX µm)

Metal Layers

Die Substrate

Leaded Solder Ball

Underfill

XX.

XX

XX






Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Samsung DRAM DDR3- Die Overview

• Die Area: XX mm²(XX x XX mm)

• Nb of PGDW per 12-inch wafer: XX

• Pad number: (Est.) ~XX

• Die Density: XX Gb/XX mm²

XX Gb/mm²

XX mm

XX

mm






Market Analysis






Cost Analysis


Feedbacks

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About System Plus

Memory capacitors Memory capacitors

MX Cu

XX second upper electrode

MX Al

SiN passivation

XX Bottom metal layers

XX Top Metal Layers

The process uses XX Metal layers:

• XX W - Bottom tungsten layers (wordline,XX,bitline) • XX Cu – top metal layer • XX Al – top metal layer

Die Cross-Section –SEM View©2019 by System Plus Consulting

Samsung DRAM DDR3- Die Cross Section

Die Cross-Sectioning©2019 by System Plus Consulting






Market Analysis

Physical Analysis

Manufacturing Process Flowo Synthesiso GPU Die Front-End Processo GPU Fabrication Unito SiP Process Flowo SiP Assembly Unit

Cost Analysis


Feedbacks

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About System Plus

Global Overview

CMOS Transistors manufacturingXX nm, XP XXM

XX Lithography steps

DieSiP Packaging

Final testDicing

Packaging process

XGb DDR3 Memory

ComponentXX-Mbit Flash Memory

Component

4x






Market Analysis

Physical Analysis

Manufacturing Process Flowo Synthesiso GPU Die Front-End Processo GPU Fabrication Unito SiP Process Flowo SiP Assembly Unit

Cost Analysis


Feedbacks

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About System Plus

Final Assembly Fabrication Unit

• Fab unit:

o Name: XX

o Panel Size: -

o Capacity: -

o Year of start: -

o Process: Assembly

o Location: XX

Drawing not at scale






Market Analysis

Physical Analysis


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso GPU Wafer & Die Costo DRAM Memory Cost Analysiso Package Costo Component Cost


Feedbacks

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About System Plus

IC Front-End Cost






Market Analysis

Physical Analysis





Feedbacks

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About System Plus

Samsung DRAM DDR3 – Packaging Cost






Market Analysis

Physical Analysis





Feedbacks

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About System Plus

BoM Components Cost






Market Analysis

Physical Analysis





Feedbacks

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About System Plus

Module Cost






Market Analysis

Physical Analysis


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Complete Module Price

Feedbacks

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About System Plus

Estimated Manufacturer price






Market Analysis

Physical Analysis


Cost Analysis


Feedbacks

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About System Plus

Related Reports

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https://www.i-micronews.com/products/artificial-intelligence-computing-for-automotive-2019/

https://www.i-micronews.com/products/artificial-intelligence-computing-for-consumer-2019/

https://www.i-micronews.com/products/status-of-the-memory-industry-2019/

https://www.i-micronews.com/products/dram-service-memory-research/

https://www.i-micronews.com/products/nand-service-memory-research/

https://www.systemplus.fr/reverse-costing-reports/mobileye-eyeq4-vision-processor-family/











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