open1ng key notes
TRANSCRIPT
TABLE OF CONTENTS
PREFACE XXVII
CONFERENCE SCOPE XXVIII
CONFERENCE BOARDS XXIX
OPEN1NG KEY NOTES
Eco-Efficiency for Smart Microsystems 3Reichl, Herbert; Middendor f , Andreas • Technische Universität Berlin, Berlin, Germany
Nissen, Nils, F.; Stobbe, Lutz • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM),
Berlin, Germany
Ambitious Targets for Energy Efficiency -A Responsibility Resulting from Climate Policy 7
Gabriel, Sigmar • Federal Environment Minister, Germany
Increasing Energy Efficiency -A Task for National and International Economic Policy 9
W ö h r l , Dagmar • Member of the German Bundestag, Parliamentary State Secretary in the German
Ministry of Economics and Technology
Suff iciency, Resource Efficiency and Sustainable Consumption and Production 11Hobal lah, Arab • UNEP, Head production & Consumption Branch, Division of Technology Industry and
Economics
ICT-Based Innovation for a Low-carbon Economy:European Challenges and Policies 13
Johnston, Peter • European Commission - Information Society and Media DG, Head of Evaluation &
Monitoring, Brüssels, Belgium
Energy Efficient I T - Starts with the Microprocessor but Doesn't End There 15Swope, Wi l l iam A . • Vice President Corporate Affairs, Intel Corporation, Santa Clara, USA
Green IT in Practice 17Wienhol tZ, Rene • CTO, Technology and Innovation, STRATO AG, Berlin, Germany
Regeneration - The Future is Green ; 19Bandle, Ala in D. • Vice President and General Manager, Public Segment Europe, Dell SA, Geneva,
Switzerland
Sustainable Consumption & Production: A Future Chailenge 23Reinhart, Joachim • CEO of Panasonic Europe Ltd. & Member of the Board of Matsushita Electric
Industrial Co., Ltd., (Panasonic Corporation), Wiesbaden, Germany
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Bibliografische Informationenhttp://d-nb.info/990321967
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TECHNICAL SESSIONS
1.1 WEEE REVIEW
Lessons from the 2008 WEEE Review Research Studies 27Huisman, Jaco • United Nations University, Zero Emissions Forum, Bonn, Germany / Delft University of
Technology, Design Engineering, Design for Sustainability Program, Delft, The Netherlands
Magal in i , Federico; Kuehr, Ruediger; Maurer, Claudia - United Nations University, Zero Emissions
Forum, Bonn, Germany
Environmental Care in a Competitive World . . . 35Hieronymi, Klaus • Hewlett Packard, Boeblingen, Germany
Dempsey, Mark • Hewlett Packard, Brackneil, United Kingdom
Practical Aspects of individual Producers Responsibility -Lessons to be Learned from Experiences in Germany 41
Rotter, Susanne; Chancerei, Perrine • University of Technology, Berlin, Germany
Schill, Wol f -Peter • DIW, Berlin, Germany
New Indicators for the Calculation of Recoverability Rates 47Moenne-LoccOZ, Gui l laume • Neopost Technologies SA, Bagneux, France
Math ieux, Fabrice • G-SCOP Laboratory, University of Grenoble, Grenoble, France
Lescuyer, Linda • CODDE, Paris, France
Brissaud, Daniel • G-SCOP Laboratory, University of Grenoble, Grenoble, France
1.2 EUP IMPLEMENTATION 1
Ecodesign Requirements of Energy-using Products:Consequences and Opportunities for Producers 53
Lückefett , Hans-Jochen • Krug und Petersen Government Affairs & Consulting GmbH, Germany
Improvement Options for Complex Set-top Boxes -Results of the EuP Preparatory Study 55
lyama, Sanaee; Turunen, Lea • Bio Intelligence Service S.A.S., Ivry-sur-Seine, France
Schischke, Karsten • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany
Mudga l , Shailendra; Tinet t i , Benolt ; Edon, Marie-Lys • Bio intelligence Service S.A.S.,
Ivry-sur-Seine, France
Stobbe, Lutz • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany
Implementation of the EuP Directive: Status Quo and Critical Observations 61Jepsen, Dirk; Reintjes, Norber t • Ökopol GmbH, Hamburg, Germany
A Model for Gaining Significant Data to Establish Energy Profiles ofPassive Electronic Components 63
Körber, Gu ido • Codemercs, Schönefeld, Germany
Schulz, Gerd • EPCOS, München, Germany
V iehmann , Kurt-Rainer • Vishay, Heilbronn, Germany
Huck, Wal ter • Murata, Nürnberg, Germany
Dietr ich, Marcus • ZVEI, Frankfurt, Germany
Schischke, Karsten; Nissen, Nils F.; Stobbe, Lutz • Fraunhofer-Institut für Zuverlässigkeit und
Mikrointegration (IZM), Berlin, Germany
Reichl, Herber t • Technische Universität Berlin, Berlin, Germany
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1.3 EUP IMPLEMENTATION 2
The Basque Approach to EuP Compliance -A Reference for SMEs and Regional Policy Makers 69
Ruiz, Nerea • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany/
Ingurumenaren Kideak Ingenieria, Bilbao, Spain
Schischke, Karsten; Reichl, Herbert • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration
(IZM), Berlin, Germany
The Ecological Profile and LCA Utilization Model for Ecodesign 75Valkama, Jani; Keskinen, Marika • Tampere University of Technology, Department of Electronics,
Tampere, Finland
Miet t inen, T imo J. • ABB Oy Drives, Helsinki, Finland
Tähkämö, Leena • Helvar Oy Ab, Karkkila, Finland
Korhonen, Pekka • Vaisala Oyj, Helsinki, Finland
Implementing the EuP Directive - Impressions from Germany 83Akkerman, Floris • Federal Institute for Materials Research and Testing (BAM), Berlin, Germany
Mordz io l , Chr is toph; Oehme, Ines • Federal Environment Agency (UBA), Dessau-Roßlau, Germany
1.5 ROHS REVIEW RESULTS, EXEMPTIONS AND EXTENSIONS
Beyond RoHS: Moves Toward Prohibition of a Wider Band of Substances in aLarger Pool of Consumer Products 89
Emilsson, Mathias; Dumort ier, Thierry • ENHESA S/A, Brüssels, Belgium
Beatley, Paul • ENHESA Inc., Washington, USA
New Approach for Homogeneous Material Definition in EU RoHS -How to Keep Things Practical Without Compromising Results? 95
Koskinen, Kaisa-Reeta; Terho, Markus • Nokia Corporation, Espoo, Finland
Review of Exemptions from Electronics-related Material Bans -Status of Reviews, Back-grounds and Experiences of a Reviewer 99
Deubzer, Otmar • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany
Zangl, Stefanie • Öko-Institut e.V. - Institut für angewandte Ökologie, Freiburg, Germany
Reicht, Herbert • Fraunhofer Technische Universität Berlin, Berlin, Germany
1.6 ROHS & REACH: REGULATIONS FOR SUBSTANCE CONTROL
REACH - Implementation Efforts in the Electronics Industry 105Seidel, Michael • Hewlett-Packard GmbH, Environmental Business Organisation EMEA, Böblingen,
Germany
REACHing Asia: Recent Trends in Chemical Regulations of China, Japan and Korea . 109Park, DaeYoung • ENHESA S.A., Brüssels, Belgium
Song, Me-Young - Merck KGaA, Darmstadt, Germany
Lee, Kwi -Ho • REACH Business Service Centre, Seoul, Korea
Cong, X iong - China Chamber of Commerce of Metal, Minerals, Chemicals Importers & Exporters,
Beijing, China
VI!
Environmental Legislation Affecting Electronics Manufacturing - RoHS - REACh -Füll Material Data 117
Michel , Hans-Jürgen • Nokia Siemens Networks GmbH & Co. KG, Bruchsal, Germany
AhtO, Riitta; Tamminen, Jouni • Nokia Siemens Networks Oy, Espoo, Finland
The Newest EU Member State is... New Jersey?:Adoption of the RoHS Directive by U.S. States 121
Welsch, Jack • ENHESA, Inc., Washington, DC, USA
1.8 ROHS SUBSTANCE ANALYTICS AND TESTING
The IEC RoHS Testing Standard (IEC 62321) 125StUtZ, Markus • Dell, Frankfurt, Germany
Loch, Michael • Motorola, Schaumburg, IL, USA
Determining the Testing Frequency for RoHS Relevant Parts 129Hornberger, Markus • Fraunhofer-Institut für Produktionstechnik und Automatisierung (IPA), Produkt-
und Qualitätsmanagement, Stuttgart, Germany
Janusz-Renault, Gabriela • Fraunhofer-Institut für Produktionstechnik und Automatisierung (IPA),
Produkt- und Qualitätsmanagement, Stuttgart, Germany / JDS Uniphase Corporation, Milpitas, USA
(since Oct 2007)
Karl, Georg • AGFA HealthCare GmbH, Munich, Germany
Dully, Stefan • Fraunhofer-Institut für Produktionstechnik und Automatisierung (IPA), Produkt- und
Qualitätsmanagement, Stuttgart, Germany
Information System on Substances in Products and Raw Materials asImportant Step to Reach Compliance with RoHS Directive in a Company 133
Simanovska, Jana; Bazbauers, Gatis; Valters, Kärlis • Institute of Energy Systems and
Environment, Faculty of Energy and Electrical Engineering, Riga Technical University, Latvia
2.1 LEAD-FREE TECHNOLOGIES
Lead-free Solder Strategy of Automotive Suppliers: A Real Options Approach 137Dworak , Christian • Robert Bosch GmbH, Gerlingen-Schillerhöhe, Germany / Institute of Business
Administration Department III - Corporate Finance, University of Stuttgart, Germany
A Case Study for Developing Lead-free Class A Server Products 143Schueiler, Randy; Ables, Wallace; Fitch, Jon • Dell Inc. Austin, Texas, USA
nanoFlux - Solder Pastes Doped with Various Elements 142Zerrer, Patrick; Fix, Andreas • Robert Bosch GmbH, Stuttgart, Germany
"Hutter, Mat th ias; Pape, U w e • Fraunhofer-Institut für Zuverlässigkeitund Mikrointegration (IZM),
Berlin, Germany
Prikhodovsky, Andrey • NMB, Neue Materialien Bayreuth GmbH, Bayreuth, Germany
Immersion Ag as an Alternative in "green" COB Technology 155Schneider-Ramelow, Ma r t i n ; Müller, Jut ta ; Göhre, Jens-Mart in • Fraunhofer-Institut für
Zuverlässigkeit und Mikrointegraticn (IZM), Berlin, Germany
Reichl, Herbert • Technische Universität Berlin, Berlin, Germany
Vüi
2.2 LEAD-FREE RELIABILITY ISSUES
Lead-free Solder Joints: Reliability and Metallurgical Reactions 163Hutter, Matth ias; Schmidt, Ralf; Pape, Uwe ; Oppermann, • Fraunhofer-Institut für
Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany
, Reichl, Herbert • Technische Universität Berlin, Berlin, Germany
Assessing Reliability of Lead-free Solder Joints on the Different PWB Finishes 169Koziol, Grazyna; Bukat, Krystyna; Arazna, Aneta; Borecki, Janusz; Steplewski, Wojciech •
Tele and Radio Research Institute, Warsaw, Poland
Reliability of Backward and Forward Compatible Lead-free andLead-containing BGA Con-nections 173
Biglari, Mostafa • Mat-Tech BV, Son, The Netherlands
KodentSOV, Sacha • University of Technology Eindhoven, Chemical Engineering and Chemistry,
Eindhoven, The NetherlandsYakovleva, Olga; Brom, Erik; Biglari, Mohammed H. • Mat-Tech BV, sön, The Netherlands
Effects of Voiding on Lead-free CSP Solder Joint Reliability with and withoutMicrovia-in-pad 179
Ahrens, Thomas; Poech, Max Hermann • Fraunhofer-Institut für Siliziumtechnologie (ISIT), Itzehoe,
Germany
Höfer, Eberhard • Technische Universität Dresden, Dresden, Germany
Wege , Sonja • ZVE/Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Oberpfaffenhofen,
Germany
Lauer, Thomas • EADS, Ulm, Germany
HaritZ, Helga • Fraunhofer EZRT, Fürth, Germany
2.3 HALOGEN-FREE PRINTED WIRING BOARDS
Halogen-free Laminates: State of Play and Update on Recent Industry A c t i v i t i e s . . . 185Beard, Adr ian • Clariant Produkte (D) GmbH, Hürth, Germany
Dör ing, Manf red • Karlsruhe Institute of Technology, Karlsruhe. Germany
U.S. EPA Flame Retardants in Printed Circuit Boards Partnership 191
U.S. EPA Design for the Environment (DfE) Flame Retardants in Printed Circuit Boards
Partnership Technical Committee • Global Broad-based Stakeholders •
Vokes, Kathleen; Vrabel, Melanie • United States Environmental Protection Agency, Washington, DC,
USA
Connor, Emily • Abt Associates Inc., Bethesda, MD, USA
Fong, A r thu r • IBM Corporation, San Ramon, CA, USA
H a l o g e n Free F lame R e t a r d a n t Sys tems f o r E p o x y Based P r i n t e d W i r i n g B o a r d s . . . . 195
Ihmels, Carsten W. • Nabaltec AG, Schwandorf, Germany
DietZ, Mathias • Clariant Produkte (D) GmbH, Hürth, Germany
2.5 FLAME RETARDANTS
Dell Strategy for Reduction of Brominated Flame Retardants andPolyvinyl Chloride in Elec-tronic Products 201
Martinez, Maureen E.; O'Connell, Scott; Whitley, Allen • Dell Inc., Round Rock, TX, USA
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VECAP™: Paving the Way for REACH 207Tange, Lein • ICL-IP Europe, Amsterdam, The Netherlands
Steukers, Veronique • Albemarle, Louvain-Ia-Neuve, Belgium
Halogen-free Polyamides and Polyesters for Electronics 213Clauss, Margo t ; Hild, David; Kaprinidis, Nikolas • Ciba ine, Basel, Switzerland
Hoero ld, Sebastian • Clariant Produkte (D) GmbH, Gersthofen, Germany
Schmit t , Elmar • Clariant Produkte (D) GmbH, Sulzbach, Germany
2.6 RELIABILITY INFLUENCES ON SUSTAINABILITY
Condition Monitoring of Microsystems Supporting Sustainability 219Bochow-Ness, Olaf; Nissen, Nils F. • Fraunhofer Institut für Zuverlässigkeit und Mikrointegration IZM,
Berlin, GermanyEckert, Tilman; Jaeschke, Johannes; Middendorf, Andreas; Reichl, Herbert • Technische
Universität Berlin, Berlin, Germany
On-Iine Condition Monitoring of Power Semiconductors 225Wernicke, Thies; Gegusch, Rene; Dieckerhoff, Sibylle; Middendorf, Andreas; Seliger,
Günther; Reichl, Herbert • Technische Universität Berlin, Berlin, Germany
Is the Reliability of Remanufactured Second Life Electronic ProductsBetter than That of New? 231
Errington, Mark, Childe, Stephen J. • University of Exeter, School of Engineering, Computing and
Mathematics, Exeter, United Kingdom
Microelectronic Components: How Reliability Impacts Sustainability 237Jacob, Peter • Empa Swiss federal Laboratories for Materials Testing and Research, Duebendorf,
Switzerland
Rutsch, Michael • Vossloh Kiepe GmbH, Düsseldorf, Germany
2.8 BIO-BASED POLYMERS
A Deeper Shade of Green 241Greiner, T im • Pure Strategies, Gloucester, MA, USA
Rossi, Mark • Clean Production Action, Medford, MA, USA
Bioepoxy-flax Composites for Printed Circuit Boards 243Shapiro, Andrew A.; Lincoln, John D.; Earthman, James C; Saphores, Jean-Daniel M.;
Oguseitan, Oladele A.; Schoenung, Julie M. • University of California, Irvine, CA, USA
Expanding the Technological Boundaries of the Biopolymer PHB inElectronic Products 249
Walachowicz, Frank; Petermann, Cornelia • Siemens AG, Berlin, GermanyAchatz, Brigitte; Scherzer, Dietrich; Schneller, Arnold • BASF SE, Ludwigshafen, GermanyScheel, Wolfgang; Schmidt, Ralf; Nissen, Nils F.; Müller, Jutta - Fraunhofer Institut für
Zuverlässigkeit und Mikrointegration IZM, Berlin, Germany
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Sustainability Assessment of Polymers based on Renewable Resources forElectronic Products 253
Achatz, Brigitte; Piepenbrink, Markus; Saling, PeterM; Scherzer, Dietrich • BASF SE,Ludwigshafen, Germany
Walachowicz, Frank; Petermann, Cornelia • Siemens A G , Berlin, Germany
Nissen, Nils F.; Müller, Jutta • Fraunhofer Institut für Zuverlässigkeit und Mikrointegration IZM, Berlin,
Germany
3.1 ENERGY EFFICIENCY
Energy Efficient Products and Processes: Potentials, Barriers and Solutions 257Frey, Otmar • ZVEI - German Electrical and Electronic Manufacturers' Association, Frankfurt am Main,
Germany
An Energy Efficiency Index for Televisions 261Siderius, Hans-Paul • SenterNovem, Utrecht, The Netherlands
Harrison, Robert - UK Market Transformation Program, London, United Kingdom
Kaplan, Katherine • US EPA/Energy Star Program, Washington D.C., USA
Energy Saving Products for Office and Home Application:Technical Features and Environmental Impacts 267
Salhofer, Stefan; Schiff leitner, Andreas; Stachura, Marek • KERP Center of Exceiience Electronics
& Environment, Vienna, Austria
3.2 CO2 FOOTPRINT
Methods and Overview on Activities on Carbon Footprints 271Herrmann, Constantin; Spielmann, Michael • PE INTERNATIONAL, Leinfelden-Echterdingen
(Stuttgart), Germany
Carbon Footprint of Mobile Communications and ICT 277Malmod in , Jens • Ericsson Research, Stockholm, Schweden
Zero-emission Datacenters 283Michel , Bruno • IBM Research GmbH, Zürich Research Laboratory, Rüschlikon, Switzerland
Emerging Methods in Scope 3 GHG Accounting 285Hermanns, Silke • AMD, Dornach/Berlin, Germany
(TCIeireigh, Heather • AMD, Berlin, Germany
3.3 CO2 FOOTPRINT 2
Identifying Climate Leader Companies and their Success Factors 293Meissen, Ronald E. • Baxter International Ine, Deerfield, IL, USA
Eagan, Patrick • University of Wisconsin-Madison, Madison, Wl, USA
Green Manufacturing at Motorola 301W a n g , A i ju ; Liu, Jim; Olson, Bill • Motorola Electronic (China) Ltd., Tianjin, China
XI
Greenpeace's Benchmarking of Electonics Manufacturers on theirCorporate Policies on Chemicals, Energy and Producer Responsibilityfor End-of-life Products 3 0 5
Hojsik, Mar t in • Greenpeace International, Bratislava, Slovakia
Harrell, Casey • Greenpeace International, San Francisco, USA
Kruszewska, Iza • Greenpeace International, Lewes, UK
3.4 GREEN IT: COMPUTATION
Energy Efficient ICT Products & Infrastructures for Data Centers 311Heidegger, Jürgen • Fujitsu Siemens Computers, Munich, Germany
Datacenters with Energy Re-Use 317Brunschwiler, Thomas; Michel, Bruno; Smith, Brian; Rutsche, Erich • IBM Research GmbH,
Zürich Research Laboratory, Rüschlikon, Switzerland
Alternative Compute Models: End-to-end Energy Impact 319Wigle, Lorie; Trainor, Mike; Boitano, Greg; Haas, Jon; Patterson, Mike • Intel Corporation,
Hillsboro, OR, USA
3.5 GREEN IT: ICT SYSTEMS
The Long Term Effects of ICT on International Division of Labour and CO2 Emissions 321MatSUmotO, MitSUtaka; Takahashi, Yukari • National Institute of Advanced Industrial Science and
Technology (AIST), Tsukuba, Japan
The eRoad Less Taken: Cooling the Climate Through ICT 327Harper, Stephen - Intel Corporation, Washington D.C., USA
Wireless Sensor Networks for Agriculture and Automation:Challenges and Chances for Sustainability 333
Beucker, Severin; Clausen, Jens • Borderstep Institut für Innovation und Nachhaltigkeit gGmbH,
Berlin, Germany
Schischke, Karsten; Mwanza , Jenipher; A l tendor f , Peter • Fraunhofer Institut für Zuverlässigkeit
und Mikrointegration IZM, Berlin, Germany
Reichl, Herbert - Technische Universität Berlin, Berlin, Germany
Assessment of Power Consumption from ICT in Current and Future States 339FujimotO, Jun • The University of Tokyo, Research Center for Advanced Science & Technology, Tokyo,
Japan
Hata, Tomoyuk i ; Tamura, Tetsuya; Kashima, Takahiro • NEC Corporation, New Solutions
Development Division, Tokyo, Japan
Al l Authors • Japan Science and Technology Agency, CREST
3.6 MICRO-ENERGY: ALTERNATIVES IN THE SMALL POWER RANGE
Mobile Stand-alone Power Supply Devices for Smali Electrical Appliances andIndustrial Applications 345
Lang, Oliver • Solare Innovative Solarprodukte GmbH, Berlin, Germany
Prornises and Predlctions on Human-powered Energy Systems 351
Jansen, Ar jen; Stevels, A b • Delft University of Technology, Delft, The Netherlands
XII
Application Opportunities of Energy Harvesting Principles into"Non-electric" Output Forms for Small Electric Systems 357
Tsunezawa, Kayoko; Oberender, Christof; Reichl, Herbert • Technische Universität Berlin, Berlin,
Germany
Oberender, Christof • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany
Reichl, Herbert • Technische Universität Berlin, Berlin, Germany
Micro-fuel Cells and the Need for Miniaturization 363Flipsen, Bas • Delft University of Technology, Delft, The Netherlands
3.7 SME SUPPORT
Managing Environmental Changes in an SME. 371Rollet, Patrice • AVANTEC, Vincennes, France
ECO'TRONICs: A Collective Action for Ecodesign Implementation withinSmall and Medium Enterprises 375
Lescuyer, Linda; Janin, Marc; Vital , Xavier • CODDE (COnception, Developpement Durable
Environnement), Moirans, France
Robiolle, Michel • JESSICA FRANCE, GIF sur YVETTE, France
Eco-design, Energy Efficiency, and Cleaner Production Strategies:SME Business Cases from Thailand and Malaysia 383
Schischke, Karsten • Fraunhofer Institut für Zuverlässigkeit und Mikrointegration IZM, Berlin, Germany
Sau Soon, Chen • SIRIM Bhd., Shah Alam, Malaysia
Lohsomboon, Pongvipa • Thailand Environment Institute, Bangkok, Thailand
Chintapanyasakun, Vij i t tra • Leonics Co., Chachoengsao, Thailand
Noi tachang, Soraluck • Thai Energy Conservation Ltd., Suphanburi, Thailand
Rafid Abdu l Wahab, Abdu l • JWR Technology Sdn. Bhd., Penang, Malaysia
Huat, Tan Kim • Akty Technologies Sdn. Bhd., Penang, Malaysia
Jirasithi thamrong, Boonpida • SiamTackCo. Ltd., Bangkok, Thailand
Yong, Ng Kok • Zoomic Electronics Sdn. Bhd., Penang, Malaysia
Kok Leong, Oon • AMPmas Sdn. Bhd., Penang, Malaysia
Chandaeng, Waroonrake • Bitwise (Thailand) Co. Ltd., Samutprakarn, Thailand
Rodrigo, JuÜO • SIMPPLE, Tarragona, Spain
Reichl, Herbert • Technische Universität Berlin, Berlin, Germany
3.8 GREEN MARKETING-CONSUMER ASPECTS
A Simple Switch? 389ten Houten, Maar ten • Philips Lighting / IEC, Eindhoven, The Netherlands
G r e e n P u b l i c P r o c u r e m e n t - A p p r o a c h , C h a l l e n g e s a n d B u s i n e s s O p p o r t u n i t i e s . . . . 3 9 1GÜtter, Jan; Hermanns, Silke • AMD, Dornach/Berlin, Germany
A Research on Correlation among User Dependence, Sustainabfe ProductServkeability and Deyelopment Strategy 393
Chang, Hsiang-Tang • National Kaohsiung First University of Science and Technology, Kaohsiung City, Taiwan
Teng, Chia-Shin • Tunghai University, Taichung City, Taiwan
Positive Consumption - A Contemporary Approach to Fiil the Needs of ConscfousConsumers, Businesses and Overall Sustainability 399
Mäkir intala, Olli-Pekka • Nokia Oyj, Espoo, Finland
XII!
4.1 SUSTAINABILITY ASSESSMENT
Social Impact Assessment of ICT Services in France and JapanUsing Gross Social Feel-good (GSF) Index 405
Nakamura, Jiro; Tsuda, Masayuki; Takahashi, Kazue Ichino; Hara, Minako • NTT Energy andEnvironment Systems Laboratories, NTT Corporation, Kanagawa, Japan
Lagorce, Jacques; Tanaka, Tomoko; Aubree, Marc; Barnole, Valerie • France Telecom, issy-Les-Moulineaux Cedex, France
A Sustainability Assessment of a Mediated Service - A Pilot Study 409Moberg, Äsa; Henriksson, Greger; Räsänen, Minna; Hedberg, Leif; Westermark, Mary •
Royal Institute of Technology, KTH, Stockholm, Sweden
Sustainable Electrical & Electronic Systems for the Automotive Sector - SEES 415Reimann, Kathy; Finkbeiner, Matthias • Technische Universität Berlin, Berlin, Germany
Alber, Sebastian • CIMA-KFT, Szakony, Hungary
Eikelenberg, Nicole • Ford Research and Advanced Engineering Europe, Aachen, Germany
Älvarez, Ignacio • LEAR Automotive EEDS Spain, Valls - Tarragona, Spain
Larrafiaga, Miren • GAIKER Technological Centre, Zamudio, Spain
Sustainable Indicator System for WEEE Recycling Companies 421Engel, Bri t ta; Möller, Mathias; Steinborn, Jenny; Walther, Grit • TU Braunschweig,
Braunschweig, Germany
Schöps, Dirk • ELPRO Elektronik-Produkt Recycling GmbH Braunschweig, Braunschweig, Germany
4.2 DESIGN FLOW INTEGRATION 1
Ecodesign in the Medical Device Industry with Examples from X-ray Equipment,Showing an Adapted Design Process 427
Hove, Ulrich • Philips Healthcare, Hamburg, Germany
Van der Wel , Hans • Philips Healthcare, Best, The Netherlands
Life Cycle Simulation in Design for Environment 433Zhao, X in • Guangzhou Electric Apparatus Research Institute, Guangdong, China
Huang, Haihong • Hefei University of Technology, Hefei, China
Fu, Yonggao; Hu, Jiaqi; W a n g , Ling • Guangzhou Electric Apparatus Research Institute, Guangdong,China
Environmental Regulations in Life Cycle Design Activities 439Fargnoli, Mario; Di Gravio, Giulio; Costantino, Francesco; Bisillo, Simona • University of
Rome "La Sapienza", Rome, Italy
Äctivity of Japanese Electronics Industry on Environmental PerformanceIndicator toward Future Standardization 445
Shinomura, Yoshiko • Fujitsu Limited, Kawasaki, Japan
Ichinohe, Masayuki • Hitachi Ltd., Tokyo, Japan
Shibaike, IMaritO • Matsushita Electric Industrial Co., Ltd., Tokyo, Japan
Tanaka, Motohiro • Mitsubishi Electric Corporation, Tokyo, Japan
Takata, Nor iko • NEC Corporation, Tokyo, Japan
Miyake, Koji • Sanyo Electric Co., Ltd., Moriguchi, Japan
Aihara, Shiro • Sharp Corporation, Osaka, Japan
Takeyama, Nor io • Toshiba Corporation, Tokyo, Japan
XIV
4.3 DESIGN FLOW INTEGRATION 2
Development of LCCBA for Eco-design in the Electronics Industry 451Lee, Sang-Yong; Motoshita, Masaharu; Jeong, In-Tae; Yamaguchi, Hiroshi • AIST (National
Institute of Advanced Science and Technology), Tsukuba, Japan
Itsubo, Norihiro • Musashi University of Technology, Yokohama, Japan
Specifying Mechatronic Systems in Early Design Phases forAnalysing Sustainability Aspects 453
Deyter, Sebastian; Gausemeier, Jürgen - University of Paderborn, Heinz Nixdorf Institute, Germany
Middendor f , Andreas; Reichl, Herbert; Tsunezawa, Kayoko • Technische Universität Berlin,
Berlin, Germany
Steffen, Daniel • Unity AG, Buren, Germany
Walachowicz, Frank • Siemens AG Corporate Technology, Berlin, Germany
Design Support System for Global Environment Conscious Product 459Kumazawa, Takaaki; Hiroshige, Yuzo- Hitachi Ltd, Yokohama, Japan
Deubzer, Otmar • Institut für Zuverlässigkeit und Mikrointegration IZM, Berlin, Germany
4.4 SYSTEM LEVEL ECODESIGN 1
Environmentally Conscious Design for Information &Communication Technology/Consumer Electronics (ICT/CE) 465
Hermann, Ferdinand • Hewlett-Packard GmbH, Augsburg, Germany
Fischer, Thomas • Sony Deutschland GmbH, Germany
Weeren, Silvio • IBM Deutschland, Germany
Streamlined Life Cycle Assessment of anEfficiency-improving Embedded Electronic Device 469
Vickers, Jeffrey J.; Boyle, Carol A . • International Centre for Sustainability Engineering and Research
(ICSER), University of Auckland, New Zealand
Vickers, Jeffrey J.; Boireau, Lüde • Actronic Technologies, Auckland, New Zealand
4.5 SYSTEM LEVEL ECODESIGN 2
Texas Instruments Global Solutions Enable Greener and Cleaner Applications 475Monnier, Olivier • Texas Instruments, Digital Controllers, Analog components, Villeneuve Loubet, France
Pichl, Beatrix • Texas Instruments Deutschland, Freising, Germany
Malleus, Francois • Texas Instruments, Digital Controllers, Analog components, Villeneuve Loubet, France
Environmentally Conscious Design of Medical Devices 477Schröder, Freimut • Siemens Healthcare Sector, Erlangen, Germany
Turnbul l , A idan • ENVIRON, Bath, United Kingdom
Interdependencies between Reiiability and Standby 481Nissen, Nils F. • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany
Middendor f , Andreas • Technische Universität Berlin, Berlin, Germany
Stobbe, Lutz; Schlösser, Alexander • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration
(IZM), Berlin, GermanyReichl, Herbert • Technische Universität Berlin, Berlin, Germany
XV
Device Switching on Demand - A Zero Standby Solution for Ethernet Devices 489Daniel Ulmer • IT-Designers GmbH, Esslingen, Germany
Otmar Deubzer • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany
Nissen, Nils F. • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany
4.6 LCA TOPICS
The More Comprehensive - the Higher the Impact ? LCA Studies in theSector of ICT Before and After the Release of Ecoinvent Data v2.01 491
Hischier, Roland • Empa, Technology & Society Lab/Life Cycle Assessment & Modelling Group, St. Gallen,
Switzerland / ecoinvent Centre, c/o Empa, St. Gallen, Switzerland
Lehmann, Mar t in • Empa, Technology & Society Lab/Life Cycle Assessment & Modelling Group, St.
Gallen, Switzerland
Development of Environmental Database with Focus on Asian Countries andits Applications to Environmental Management 493
Kobayashi, Yoshinori; Hondo, Yoshiyuki; Kobayashi, Hideki • Toshiba Corporation, Kawasaki,Japan
The Use of LCA for Environmental Communication and Sustainable Marketing -A Methodological Framework and Sector-specific Empirical Findings 499
Menichet t i , Emanuela; McHone, Christopher; Valdivia, Sonia • United Nations Environment
Programme, Division of Technology, Industry and Economics (UNEP DTIE), Paris, France
Spare Part Management from the View of Sustainability 505Oberender, Christof - Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin,
Germany
Hiller, Volkmar • Conti Temic microelectronic GmbH, Nürnberg, Germany
Reichl, Herbert • Technische Universität Berlin, Berlin, Germany
4.7 PRODUCT ECODESIGN APPROACHES AND EXAMPLES
Bringing Light to Africa 511Jeanmaire, Corinne • Philips Lighting / IEC, Eindhoven, The Netherlands
On Reduction of Mobile Phone Chargers Stand-by Energy Consumption 513Santiago, Cäceres • Valladolid University, Valladolid, Spain
Pablo, Mon tequ i • Phoenix Solar S.L, Madrid, Spain
Advanced Environmental Technologies for PDP-TV 517Kasahara, Mitsuhiro; Aoki, Takashi; Uehara, Hirotoshi; Yabiku, Hideo -Visual Products And
Display Devices Business Group, Panasonic AVC Networks Company, Matsushita Electric Industria! Co.,Ltd., Osaka, Japan
4.8 MATERIALS & PROCESSES ECODESIGN
Going Green with PVC 521Spinaler, Ernst-Josef • Vinncüt GmbH & Co. KG, Burghausen, Germany
A Novel Green Technology for the Piated Through Hole Process 527Retallick, Richard; Ding, Y ing (Judy) • MacDermid Incorpcrated, Electronics Solutions, Waterbury,
CT, USA
XVI
Ultra-fine Particle Release from Hardcopy Devices 531Wensing, Michael; Delius, Wolfgang; Schripp, Tobias; Uhde, Erik • Fraunhofer wilheim-
Klauditz-Institute, Material Analysis and Indoor Chemistry, Braunschweig, Germany
Salthammer, Tunga • Fraunhofer Wilhelm-Klauditz-Institute, Material Analysis and Indoor Chemistry,
Braunschweig, Germany / University of Applied Sciences Braunschweig/Wolfenbüttel, Wolfenbüttel,
Germany
5.1 HARMONIZATION & STANDARDIZATION
Environmental Conscious Design, Energy Efficiency:Is there a Role for Standards? 537
Fisher, Kevin • Intel Corporation (UK) Ltd, Corporate Technology Group - TPS, Swindon, United Kingdom
Environmental Standardization and the Related Work &Strategy of Ecma International TC38 543
Hermann, Ferdinand • Hewlett-Packard GmbH, Dornach, Germany
Weeren, Silvio • IBM Deutschland, Stuttgart, Germany
Fischer, Thomas • Sony Deutschland, Stuttgart, Germany
Electronic Product Environmental Assessment Tool (EPEAT) 547Rifer, Wayne - Green Electronics Council, Portland, Oregon, USA
Eco-Iabelling Technology - For You and the Planet 553Wil l iams, Wendy • TCO Development, Stockholm, Sweden
5.2 RECYCLING TECHNOLOGIES
Production Methods for Recovering Base Materials in LCDs 559Ranerup, Kenny; Letcher, Bill • Swedish LCD Center, AB Borlänge, Sweden
Lundholm, GÖran • Hans Andersson Metal AB, Enköping, Sweden
Edwards, Mär ten O.M. ; Nyman, Hans • Swedish LCD Center, AB Borlänge, Sweden
Optical Fibre Cable Recycling at the L-FIRE European Project 561Arnaiz, SixtO • GAlKERTechnological Centre, Zamudio, Spain
in ' t Groen, Bart • KEMA Nederland, Arnhem, The Netherlands
Rivera, Consol • OPTRAL, Pineda de Mar, Spain
Sander, Sven • HAMOS, Penzberg, Germany
Caldeira, Gui lherme • CABELTE (former ICB), Vila Nova de Gaia, Portugal
Vaz, Nuno - RECIPOR, Vila Nova de Gaia, Portugal
Arroyo, tnaki • EURO METAL RECYCLING, Valle deTrapaga, Spain
Heße, Shirin • TEIJIN, Wuppertal, Germany
Horst ink, Jan • MVE (Milieu Visie Europe), Dordrecht, The Netherlands
Polychlorinated Biphenyls (PCBs) in Small Capacitors fromWaste Electrical and Electronic Equipment (WEEE) 567
Eugster, Mar t in • Technology and Society Laboratory, Empa, Swiss Institute for Materials Science and
Technology, St. Gallen, Switzerland
Kasser, Ueli • Büro für Umweltchemte, Zürich, Switzerland
Seiler, Cornelia; Zenegg, Markus • Analytical Chemistry Laboratory, Empa, Swiss Institute fcr
Materials Science and Technology, Dübendorf, Switzerland
XVi
Sustainable Plastics Manufacturing:Opportunities and Challenges Using Plastics from Re-cycled Electronics 573
Aro la , Darren; Riise, Brian • MBA Polymers, Richmond, CA, USA
Högger l , Günther; Bliberger, Robert; Polczer, Johann • M B A Polymers Kunststoffverarbeitung
GmbH, Kematen/Ybbs, Austria
5.3 EWASTE CASE STUDIES
Hybrid (WIO) LCA of the Introduction of Active Disassembling Fasteners UsingHydrogen Storing Materials into Electric and Electronic Equipments 579
Yamasue, Eiji • Kyoto University, Kyoto, Japan
Matsubae-Yokoyama, Kazuyo • Tohoku University, Sendai, Japan
Kondo, Yasushi; Nakamura, Shinichiro • Waseda University, Tokyo, Japan
Ishihara, Keiichi N • Kyoto University, Kyoto, Japan
Mining our Computers - Opportunities and Challenges to Recover Scarce andValuable Metals from End-of-life Electronic Devices 585
HagelÜken, Christian • Umicore Precious Metals Refining, Hanau, Germany
Meskers, Christina • Umicore Precious Metals Refining, Hoboken, Belgium
To Recycle or Not to Recycle? 591Marinel l i , Thomas • Philips Consumer Lifestyle, Philips Consumer Lifestyle Sustainability Center,
Eindhoven, The Netherlands
5.4 GREEN SEMICONDUCTORS
Green Semiconductor Manufacturing - Good for Business and Environment 593Higgs, T im; Brady, Todd • Intel Corporation, Chandler, AZ, USA
The Life-cycle Environmental Impacts of Etching Silicon Wafers and(PE)CVD Chamber Cleaning 599
Schottler, Mar t in • M+W Zander FE GmbH, Stuttgart, Germany
de Wi ld-Schol ten, Mariska • Energy research Centre of the Netherlands, Petten, The Netherlands
5.5 GREEN CORPORATE STRATEGIES
The Siemens' Environmental Portfolio 601Pfitzner, Ralf • Siemens AG, Munich, Germany
Sustainable Innovation and ECOMOTO 607Olson, Bill; Pongratz, Siegfr ied; Riess, Michael • Motorola, Motorola Labs, Schaumburg, IL, USA
eco ideas' Declaration -Panasonics Challenges Directed towards Global Warming Prevention 613
Nakamura, Akira • Corporate Environmental Affairs Division, Matsushita Electric Industrial Co., Ltd,Osaka, Japan
Corporate Resource Management Systems 619HohauS, Christ ian; Kathr in Hesse • Fraunhofer -Institut für Materialfluss und Logistik (IML),
Dortmund, Germany
XVIÜ
5.6 COMPLIANCE AND MATERIAL DECLARATIONS
Industry-Ied Substances Declarations Web Database 623Schröder, Freimut • Siemens Healthcare Sector, Erlangen, Germany
Turnbul l , A idan - Siemens Healthcare Sector, Erlangen, Germany
Adopting Environmental Compliance Management Systems in theElectronics Sector 627
Butler, Tom • University College Cork, Cork, Ireland
McGovern, Damien • Compliance and Risks Ltd., Cork, Ireland
REACH, RoHS, LCA... - Managing Several Complex Material ComplianceRequirements Efficiently, Fulfilling Customers' Needs and Evaluation of theEnvironmental Effects of a Product During the Whole Lifecycle in SAP 633
Bachmann, Erik • TechniData AG, Mörfelden - Walldorf, Germany
Clese, Frank-Dieter • TechniData AG, Markdorf, Germany
From Greenwash to Corporate Environmental Responsibility 639McGovern, Damien • Compliance and Risks Ltd., Cork, Ireland
Butler, Tom • University College Cork, Cork, Ireland
5.7 PRINTED AND POLYTRONIC SYSTEMS
Nanoparticle-enabled Printing of Green,Large-area Electronic Hierarchical Systems 645
Handwerker, Carol • Purdue University, West Lafayette, IN, USA
Brazis, Paul; Gamota, Dan • Motorola, Schaumburg, IL, USA
Guo, Yan; Kim, Suk Jun; Slamovich, Elliott; Stach, Eric • Purdue University, West Lafayette, IN, USA
Zhang, Jie • Motorola. Schaumburg, IL, USA
Environmental Risk Assessment of Printable Electronics 647Keskinen, Mar ika; Valkama, Jani • Tampere University of Technology, Department of Electronics,
Tampere, Finland
Heterointegration of Complete Systems Based on Polytronics - Smart Plastics 653Bock, Karlheinz • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Polytronic Systems
Department, Munich, Germany
5.8 CREATIVITY FOR FUTURE TECHNOLOGIES
Biomimetic Joint for Reversible Interconnection 661Hosoda, Naoe • National Institute for Materials Science, Advanced Nano Materials, Tsuku-ba, Japan
Miyaj ima, Ak iyuk i • Shibaura Institute of Technology, Tokyo, Japan
Two TRIZ Based Eco-innovation Methods by Biomimetic Concepts andCase-Based Reasoning 665
Chen, Jahau Lewis; Huang, Lin-Chin; Yang, Cheng Jung • Department of Mechanical
Engineering, National Cheng Kung University, Tainan, Taiwan
Future Initiatives for Sustainability 671Pfahl, Robert C ; O'Malley, Grace • International Electronics Manufacturing Initiative, Inc. (iNEMI), .,
Herndon, VA, USA
. • • • ' . • ; • • . • • • • . " • . • • • • . . . x i x
Global Responsibility for Green Electronics and ICT 677Hansjoerg Griese, Lutz Stobbe • Fraunhofer-Institute for Reliability and Microintegration IZM,
Berlin, GermanyHerbert Reichl • Technical University Berlin, Berlin, Germany
6.1 REUSE AND TRANSBOUNDARY SHIPMENTS(organized jointly with World ReUse Forum)
Material Flow of Second Hand Electrical and Electronic Equipments Exportedfrom Japan to the Philippines 683
Yoshida, Aya; Terazono, AtSUShi • National Institute for Environmental Studies, Research Center for
Material Cycles and Waste Management, Tsukuba, Japan
Assessing the e-waste Situation in Africa 689Schluep, Mathias; Rochat, David - Swiss Materials Science & Technology Institute (Empa), Technology
& Society Lab, St. Gallen, Switzerland
Munyua , Alice Wanjira • Kenya ICT Action Network (KiCTAnet), Nairobi, Kenya
Laissaoui, Salah Eddine • Moroccan Cleaner Production Centre, Casablanca, Morocco
W o n e , Salimata • African Institute for Urban Management (IAGU), Dakar, Senegal
Kane, Cisse • Global Digital Solidarity Fund (DSF), Geneva, Switzerland
Hieronymi, Klaus • Hewlett Packard GmbH, Böblingen, Germany
International Resource Recycling System (IRRS) to Manage e-waste in theAsia-Pacific Region - The Case of Fuji Xerox 691
Suzuki, Masachika; Subramanian, Logakanthi • International University of Japan, Graduate School
of International Management, Minami Uonuma-shi, Japan
Watanabe, Tomio; Hasegawa, Hiroyuki • Fuji Xerox Co., Ltd., Japan
E-waste in Society: The Case of Accra, Ghana 697Fuhriman, Darreil • Department of Geography, Pennsylvania State University, University Park, PA, USA
6.2 REUSE TECHNOLOGY, TOOLS AND DESIGN(organized jointly with World ReUse Forum)
ReLCD Recycling and Re-Use of LCD Panels 703Kopacek, Bernd • SAT, Austrian Society for Systems Engineering and Automation, Vienna, Austria
Computer for Schools in Developing Countries -Decision Making Tool for Sustainable Supply Strategies 707
Böni , Heinz; Streicher-Porte, Mar t i n ; Marthaler, Christian • Empa, Swiss Federal Laboratories for
Materials Testing and Research, St. Gallen, Switzerland
Camacho, Ange l • Computadores para Educar, Bogota, Colombia
Out of the Closet! Signalling Software Reliability in Secondary PC Markets 715Hickey, Stewart; Fitzpatrick, Colin; O'Connell, Maurice - University of Umerick, Limerick, ireland
A Reusable Compact Fluorescent Lamp Design 721Kitamura, Masatsugu • EcoDesign Promotion Network, Tokyo, Japan
Hayashi, Hidetaka • University of Tokyo, Tokyo, Japan
XX
6.3 INITIATIVES TO PROMOTE REUSE(organized jointly with World ReUse Forum)
Maximising ReUse Through End of Life Process - A Producers Perspectives 725Perry, Jonathan • Dell Corporation Ltd, Bracknell, United Kingdom
RREUSE - Reuse and Recycling European Union Social Enterprises:An Umbrella for Sustainable Reuse Business Models 731
Sepp Eisenriegler • ARGE R.U.S.Z GmbH, Austriar RepaNet, Austria; RREUSE, Belgium
Medical Electrical Equipment - Good Refurbishment Practice 737Arglebe, Carlos • Siemens AG Healthcare Sector QM&RA, Erlangen, Germany
Braun, Markus; Plumeyer, Mar t in • Siemens AG Healthcare Sector Refurbished Systems, Forchheim,
Germany
How Much E-waste in US Basements and Attics? Results from a National Survey... 741Saphores, Jean-Daniel • University of California, Department of Civil and Environmental Engineering,
Irvine, CA, USA
Nixon, Hilary • San Jose State University, Department of Urban and Regional Planning, San Jose, CA, USA
Ogunsei tan, Oladele • University of California, Public Health Program, College of Health Sciences; and
Department of Environmental Health, Science, and Policy, School of Social Ecology, Irvine, CA, USA
Shapiro, A n d r e w • University of California, Electrical Engineering & Computer Science Department, The
Henri Samueli School of Engineering, Irvine, CA, USA
6.4 REUSE OR RECYCLING?(organized jointly with World ReUse Forum)
Longer-term Use/Reuse or Replacement? - An Application of 'Prescriptive' LCAto Decision Making on Electrical Home Appliances 747
Tasaki, Tomohi ro • National Institute for Environmental Studies, Research Center for Material Cycles and
Waste Management, Tsukuba, Japan
Motosh i ta , Masaharu • AIST, Tsukuba, Japan
Sasaki, So • MURC, Tokyo, Japan
Build Up Communicative and Efficient ICT Products Return System for ReuseThrough Trade-in 753
Li, Juan • Brandenburg Technical University, Chair of Industrial Sustainability, Cottbus, Germany
Scheidt, LutZ-Guenther • Technical UniversityVienna, Austria
Fischer, Frank • webix Solutions GmbH, Stuttgart, Germany
Sustainability by Using Used Assemblies in Automotive Electronics 759Mente, Thomas; Schuch, Bernhard; Ernst, Christian; Schuster, Alfred • Conti Temic
microelectronic GmbH, Nuremberg, Germany
Böckhorst, Stephan ; Friedrichs, Lars • Hella KGaA Hueck & Co., Uppstadt, Germany
Halser, Klaus • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (EM), Berlin, Germany
Bochow-Neß, Olaf; Middendor f , Andreas; Reichl, Herber t • Technische Universität Berlin,
Berlin, Germany
XX!
6.5 REUSE AND GLOBAL DEFINITIONS(organized jointly with World ReUse Forum)
One Global Understanding of ReUse - Towards Common Definitions 765Scheidt, Lutz-Guenther • Austrian Society for Systems Engineering and Automation, Vienna, Austria
Herrmann, Chr is toph; Luger, Tobias • Technische Universität Braunschweig, Institute of Machine
Tools and Production Technology, Braunschweig, Germany,
6.6 EWASTE: SYSTEM ANALYSIS(organized jointly with World ReUse Forum)
Logistic Concepts for Take-back-systems for UsedElectronic Automotive Spare Parts 767
Stobbe, Irina • STeam - Service Software Sustainability, Berlin, Germany
Metzler, Stefan; Hohaus, Christian • Fraunhofer-Institut für Materialfluss und Logistik (IML),
Dortmund, Germany
Kaerger, Wo l f gang ; Groke, Mat th ias • Callparts System GmbH, Etzin, Germany
Knode, Mar t in • Retek AG, Ihlow, Germany
Oberender, Christof • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM), Berlin, Germany
Scenario Analysis for Sustainable Global Resource Circulation wi thTraceability Index 775
Kishita, Yusuke; Kunii, Eisuke; Fukushige, Shinichi; Umeda, Yasushi • Department ofMechanical Engineering, Graduate School of Engineering, Osaka University, Osaka, Japan
FujimOtO, Jun • Research Center for Advanced Science and Technology, The University of Tokyo, Tokyo,
Japan
"WEEELABEX", the WEEE Forum's Multi-annual Project Related to theHarmonisation of a Common Set of European Standards for Treatmentand Recycling of Electronic and Electrical Waste and for Monitoring theE-waste Processing Companies 783
Hediger, Robert • SENS, Zürich, Switzerland
Leroy, Pascal • WEEE Forum, Brüssels, Belgium
Kasser, Ulrich • Umweltchemie, Zürich, Switzerland
Overview of Japanese HARL Systems & Panasonic's Way of Recycling 789Hiraki, Tokuhiro; Uehigashi, Koj i ; Fukuda, Ko • Recycling Business Promotion Office, Matsushita
Electric Industrial Co., Ltd., Osaka, Japan
6.7 EWASTE: MANAGEMENT AND GUIDELINES(organized jointly with World ReUse Forum)
WEEE Management System: Cases in Norway and Finland 795Roman, Elisabeth • Narvik University College, Narvik, Norway
Ylä-Mel la , Jenni; PongräCZ, Eva • University of Oulu, Department of Process and Environmental
Engineering, Oulu, Finland / University of Oulu, Thule Institut, NorTech Oulu, Finland
Solvang, We i Deng • Narvik University College, Narvik, Norway
Ketski, Riitta - University of Oulu, Department of Process and Environmental Engineering, Oulu, Finland
XXJ1
Cost-profit Analysis of Multilateral Recycling System in Asia 803Kondoh, Shinsuke • National Institute of Advanced Science and Technology (AIST), Tsukuba, Japan
Fujimoto, Jun • The University of Tokyo, Tokyo, Japan
Umeda, Yasushi • Osaka University, Osaka, Japan
Mishima, Nozomu; Matsumoto , MitSUtaka • National Institute of Advanced Science and
Technology (AIST), Tsukuba, Japan
6.8 EWASTE: CASE STUDIES ASIA(organized jointly with World ReUse Forum)
The Study of WEEE in a Representative Range In China 809Hu, Jiaqi; Fu, Yonggao; Zhao, X in ; W a n g , Ling • Guangzhou Electric Apparatus Research Institute,
Guangdong, China
Economic Conditions for Formal and Informal Recycling of E-waste in China 815W a n g , Feng • Delft University of Technology, Delft, The Netherlands
Huisman, Jaco • Delft University of Technology, Delft, The Netherlands / United Nations University, Bonn,
Germany
Marinel l i , Thomas • Philips, Eindhoven, The Netherlands
Zhang, Yuqi • Philips, Shanghai, China
van Ooyen, Stephan • Chiho-Tiande Metals Co.,Ltd., Taizhou, China
An Evaluation of WEEE Recycling in Japan 821Yoshida, Fumikazu • School of Public Policy, Hokkaido University, Sapporo, Japan
Yoshida, Haruyo • Sapporo University, Sapporo, Japan
E-waste Generation and Material Flow in Japan and Other Asia 827Terazono, AtSUShi; Yoshida, Aya • National Institute for Environmental Studies, Research Center for
Material Cycles and Waste Management, Tsukuba, Japan
CLOSING KEY NOTES
Innovation in Governance and Technology - The Key to Sustainability 835Radermacher, Franz Josef • Forschungsinstitut für anwendungsorientierte Wissensverarbeitung/n
(FAW/n), Ulm, Germany
EcoDesign, a Source of Inspiration and of Creativity 837Stevels, A lber t L. N. • Design for Sustainability Lab, Delft University of Technology, Delft, The
Netherlands
XXIIi
POSTER SESS1ONS
A Strategie Approach to Setting Environmental Policy for Cell Phones 847A u n g Lin, Sharon A . Jones • Lafayette College, Easton Pennsylvania, USA
An Evaluation of Valox iQ* Resins Containing Non-Halogenated Flame Retardantsand Post-Consumer Recycled Content for Use in Dell Desktop and Notebook PersonalComputer Products 853
Boisard, Tifenn; Hutchinson, David; O'Connell, Scott • Dell Inc., Austin, TX USAAlcantar, Cesar; Govoni, Gretchen; Poslinski, Andrew; Gopal, Vikram; Joyce, Robert •
SABIC Innovative Plastics, Pittsfield, MA USA
Business Processes and Network Management in Closed-Loop Supply Chains to CloseProduct Cycles 859
Herrmann, Chr is toph; Luger, Tobias • Technische Universität Braunschweig, Institute of Machine
Tools and Production Technology, Braunschweig, Germany
Spengler, Thomas; Walther, Gri t ; Steinborn, Jenny • Technische Universität Braunschweig,
Department of Economics and Business Administration, Institute of Pro-duction and Logistics
Management, Braunschweig, Germany
Common Part Strategies for Variant Management in Closed-Loop Supply Chains. . . 865Steinborn, Jenny; Walther, Gri t ; Spengler, Thomas • TU Braunschweig, Department of Economics
and Business Administration, Institute of Production and Logistics Management, Braunschweig, Germany
Herrmann, Chr is toph; Luger, Tobias • TU Braunschweig, Institute of Machine Tools and Production
Technology, Braunschweig, Germany
Comparison of End-of-Life Strategies of WEEE by LCA in China 871Lu, Bin; Yang, Jianxin • State Key Laboratory of Urban and Regional Ecology, Research Center for Eco-
Environmental Sciences, Chinese Academy of Sciences. Beijing, China
Environmental Contribution by the Advanced Batteries 877Tominaga, Noboru • Quality and Environmental Promotion Center, Matsushita Battery Industrial Co.,
Ltd., Moriguchi, Osaka, Japan
Matsuda, H i romu • Corporate R&D and Manufacturing Planning Group, Matsushita Battery Industrial
Co., Ltd., Moriguchi, Osaka, Japan
Wada , Seiji; Noya, Shigeto; Ogino, Keiji • Dry Battery Business Unit, Matsushita Battery Industrial
Co., Ltd., Moriguchi, Osaka, Japan
Environmental Friendly FR Solutions Based on Intumescent Systems 881Wermter, Hendrik; Futterer, Thomas • Chemische Fabrik Budenheim KG, Germany
Feasibility of a Voluntary Standard for Used Computer Products andRefurbishment Processes , 885
Heunen, Frank; Peet, Dirk-Jan Delft University of Technology, Technology and Policy Analysis,
Technology Dynamics & Sustainabie Devel-opment, Deift, The Nethertands
Huisman, Jaco - United Nations University, Zero Emissions Forum, Bonn, Germany
van Loon, Joep • Flection International B.V., Culemborg, The Netherlands
Green Products and Unfair Competition 887Hofmann, Lothar • HLAW, Wien, Austria
XXIV
High Tech Performance and Zero GWP for Ar/N2/F2 Chamber Clean Gas 889Riva, Marcello; Pittroff, Michael; Schwarze, Thomas; Oshinowo, John • Solvay Fluor GmbH,
Hannover, Germany
Steinberger, Har tmut ; Wie land, Robert • Fraunhofer-Institut für Zuverlässigkeit und
Mikrointegration (IZM), Munich, Germany
IEC TC111 RoHS Sampling Standard 895ten Houten, Maar ten • Philips Lighting/ IEC, Eindhoven, The Netherlands
IEEE, Sustainability and Public Visibility. . . 897Wiesner, Peter • IEEE Technical Activities, NJ, USA
Industrial Activities in EcoDesign - A Comparison Between Sweden and Thailand.. 903Boonkanit , Prin; Kengpol, A t h a k o m • Department of Industrial Engineering, Faculty of Engineering,
King Mongkut's Institute of Technology North Bangkok, Thailand
Lin, Han-Hsuan; Lindahl, Mat t ias; Sakao, Tomohiko • Environmental Technology and
Management, Department of Management and Engineering, Linköping University, Sweden
Industrial Fuse Recycling: The Benelux Approach 909van Kasteren, Johannes M.N. • Eindhoven University of Technology, Eindhoven, The Netherlands
Influence of Lead-Free PCB Coatings on Presence of Voids in Solder Joints 913Sitek, Janusz; Bukat, Krystyna; Koscielski, Marek • Tele and Radio Research Institute, Warsaw,
Poland
New Developments in Non-Halogen Flame Retarded Engineering Polymers 919Kirchner, Olaf N. • Du Pont de Nemours International S.A., Geneva, Switzerland
Une, Narumi; Saga, Yuji • DuPont Japan Ltd., Utsunomiya, Japan
Conrad, Stefanie • Du Pont de Nemours (Deutschland) GmbH, Bad Homburg, Deutschland
Power Management of Company Computers - A Dell Case Study 923Taylor, Jay; StUtZ, Markus • Dell Inc., Environmental Affairs, Austin, TX, USA
Lancaster, Ben • 1E, TX, USA
Practical Problems with Homogeneous Material Definition in EU RoHS -Limitations on RoHS Compliance Testing in the Case of the Small andComplex Components 925
Koskinen, Kaisa-Reeta; Terho, Markus • Nokia Corporation, Espoo, Finland
Rapid Environmental Assessment Lab - Employing Material Assay Methods forRoHS and WEEE assessments and support LCA and REACH evaluations 929
Riess, Michael ; Pongratz, Siegfried • Motorola GmbH, Taunusstein, Germany
Olson, Bill • Motorola Inc., Schaumburg, IL, USA
Reduction of Hydrocarbons in Semiconductor and Solar Cell Manufacturingby Thermal or Catalytic Oxidation - An Ecological Assessment 931
Schottler, Mar t in • M+W Zander FE GmbH, Stuttgart, Germany
Hot tenro th , Heidi ; Schmidt, Mar io • Pforzheim University, Pforzheim, Germany
Results of Accelerated Reliability Tests on Lead-free Soidered Joints 933Drozd, Zdzislaw; Szwech, Marcin • Warsaw University of Technology, Warszawa, Poland
XXV
Technical Tour - Working with Handicapped People in E-waste Recycling 939Blechschmidt, Petra • Petra Blechschmidt Projektmanagement, Berlin, Germany
Glatzel, Hans-Georg • VICUR GmbH, Berlin, Germany
Technological Substitution and its End-of-Life Impact 943Deepali , Sinha Khetr iwal • University of St.Gallen, St.Gallen, Switzerland/EMPA, St.Gallen, Switzerland
The Home-use Fuel Cell Co-generation System in Japan and Panasonic's activities. . 947Kawagur i , Masaaki ; Ryouzou, Kuribayashi; Yasumasa, Kurosaki • Matsushita Home Appliances
Company, Matsushita Electric Industrial Co., Ltd. Kusatsu City, Shiga .Japan
Why Pre-sorting Small Waste Appliances Would Increase Resource Recovery 951Chancerei, Perrine; Rotter, Vera Susanne • Technische Universität Berlin, Institute of Environmental
Technology, Chair for Solid Waste Management, Berlin, Germany
AUTHOR INDEXIndex 959
XXVI