optix osn 1500 hardware description(v100r007_02)

OptiX OSN 1500 Intelligent Optical Transmission System

V100R007

Hardware Description

Issue 02

Date 2007-09-10

Part Number 31401357

Huawei Technologies Proprietary

Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For anyassistance, please contact our local office or company headquarters.

Huawei Technologies Co., Ltd.Address: Huawei Industrial Base

Bantian, LonggangShenzhen 518129People's Republic of China

Website: http://www.huawei.com

Email: [email protected]

Copyright © 2007 Huawei Technologies Co., Ltd. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without prior writtenconsent of Huawei Technologies Co., Ltd. Trademarks and Permissions

and other Huawei trademarks are the property of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders. NoticeThe information in this document is subject to change without notice. Every effort has been made in thepreparation of this document to ensure accuracy of the contents, but the statements, information, andrecommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Proprietary

http://www.huawei.com

mailto:[email protected]

Contents

About This Document.....................................................................................................................1

1 Equipment Structure.................................................................................................................1-1

2 Cabinet.........................................................................................................................................2-12.1 Cabinet Type...................................................................................................................................................2-22.2 Cabinet Configuration.....................................................................................................................................2-2

2.2.1 Cabinet Indicator....................................................................................................................................2-32.2.2 DC PDU.................................................................................................................................................2-32.2.3 Other Configuration...............................................................................................................................2-4

2.3 Technical Specifications.................................................................................................................................2-5

3 Subrack.........................................................................................................................................3-13.1 Structure..........................................................................................................................................................3-23.2 Capacity...........................................................................................................................................................3-33.3 Slot Allocation.................................................................................................................................................3-43.4 Technical Specifications...............................................................................................................................3-17

4 Board List and Classification...................................................................................................4-14.1 Appearance and Dimensions of Boards..........................................................................................................4-24.2 Description of the Barcode on the Board........................................................................................................4-34.3 Board Classification........................................................................................................................................4-4

4.3.1 SDH Processing Boards.........................................................................................................................4-44.3.2 PDH Processing Boards.........................................................................................................................4-64.3.3 Data Processing Boards..........................................................................................................................4-74.3.4 Interface Boards and Switching Boards.................................................................................................4-94.3.5 Cross-Connect Boards and SCC Boards..............................................................................................4-104.3.6 Auxiliary Boards..................................................................................................................................4-104.3.7 WDM Processing Boards.....................................................................................................................4-114.3.8 Optical Amplifier Boards and Dispersion Compensation Board.........................................................4-114.3.9 Power Interface Boards........................................................................................................................4-12

5 SDH Processing Boards............................................................................................................5-15.1 SL1..................................................................................................................................................................5-3

5.1.1 Version Description................................................................................................................................5-35.1.2 Function and Feature..............................................................................................................................5-4

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Contents

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5.1.3 Working Principle and Signal Flow.......................................................................................................5-55.1.4 Front Panel.............................................................................................................................................5-75.1.5 Valid Slots..............................................................................................................................................5-85.1.6 Board Feature Code................................................................................................................................5-95.1.7 Board Configuration Reference.............................................................................................................5-95.1.8 Technical Specifications........................................................................................................................5-9

5.2 SLQ1.............................................................................................................................................................5-115.2.1 Version Description..............................................................................................................................5-115.2.2 Function and Feature............................................................................................................................5-125.2.3 Working Principle and Signal Flow.....................................................................................................5-135.2.4 Front Panel...........................................................................................................................................5-155.2.5 Valid Slots............................................................................................................................................5-165.2.6 Board Feature Code..............................................................................................................................5-175.2.7 Board Configuration Reference...........................................................................................................5-175.2.8 Technical Specifications......................................................................................................................5-17

5.3 SLO1.............................................................................................................................................................5-195.3.1 Version Description..............................................................................................................................5-195.3.2 Function and Feature............................................................................................................................5-195.3.3 Working Principle and Signal Flow.....................................................................................................5-205.3.4 Front Panel...........................................................................................................................................5-225.3.5 Valid Slots............................................................................................................................................5-245.3.6 Board Feature Code..............................................................................................................................5-245.3.7 Board Configuration Reference...........................................................................................................5-245.3.8 Technical Specifications......................................................................................................................5-25

5.4 SLT1..............................................................................................................................................................5-265.4.1 Version Description..............................................................................................................................5-265.4.2 Function and Feature............................................................................................................................5-265.4.3 Working Principle and Signal Flow.....................................................................................................5-275.4.4 Front Panel...........................................................................................................................................5-295.4.5 Valid Slots............................................................................................................................................5-315.4.6 Board Configuration Reference...........................................................................................................5-315.4.7 Technical Specifications......................................................................................................................5-31

5.5 SEP1..............................................................................................................................................................5-325.5.1 Version Description..............................................................................................................................5-335.5.2 Function and Feature............................................................................................................................5-335.5.3 Working Principle and Signal Flow.....................................................................................................5-345.5.4 Front Panel...........................................................................................................................................5-375.5.5 Valid Slots............................................................................................................................................5-395.5.6 TPS Protection for the Board...............................................................................................................5-395.5.7 Board Configuration Reference...........................................................................................................5-405.5.8 Technical Specifications......................................................................................................................5-41

5.6 SL4................................................................................................................................................................5-41

ContentsOptiX OSN 1500 Intelligent Optical Transmission System


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5.6.1 Version Description..............................................................................................................................5-425.6.2 Function and Feature............................................................................................................................5-425.6.3 Working Principle and Signal Flow.....................................................................................................5-435.6.4 Front Panel...........................................................................................................................................5-455.6.5 Valid Slots............................................................................................................................................5-475.6.6 Board Feature Code..............................................................................................................................5-475.6.7 Board Configuration Reference...........................................................................................................5-485.6.8 Technical Specifications......................................................................................................................5-48

5.7 SLD4.............................................................................................................................................................5-495.7.1 Version Description..............................................................................................................................5-505.7.2 Function and Feature............................................................................................................................5-505.7.3 Working Principle and Signal Flow.....................................................................................................5-515.7.4 Front Panel...........................................................................................................................................5-535.7.5 Valid Slots............................................................................................................................................5-555.7.6 Board Feature Code..............................................................................................................................5-555.7.7 Board Configuration Reference...........................................................................................................5-565.7.8 Technical Specifications......................................................................................................................5-56

5.8 SLQ4.............................................................................................................................................................5-575.8.1 Version Description..............................................................................................................................5-585.8.2 Function and Feature............................................................................................................................5-585.8.3 Working Principle and Signal Flow.....................................................................................................5-595.8.4 Front Panel...........................................................................................................................................5-615.8.5 Valid Slots............................................................................................................................................5-635.8.6 Board Feature Code..............................................................................................................................5-635.8.7 Board Configuration Reference...........................................................................................................5-635.8.8 Technical Specifications......................................................................................................................5-63

5.9 SL16..............................................................................................................................................................5-645.9.1 Version Description..............................................................................................................................5-655.9.2 Function and Feature............................................................................................................................5-665.9.3 Working Principle and Signal Flow.....................................................................................................5-675.9.4 Front Panel...........................................................................................................................................5-695.9.5 Valid Slots............................................................................................................................................5-705.9.6 Board Feature Code..............................................................................................................................5-705.9.7 Board Configuration Reference...........................................................................................................5-715.9.8 Technical Specifications......................................................................................................................5-71

5.10 SL16A.........................................................................................................................................................5-735.10.1 Version Description............................................................................................................................5-735.10.2 Function and Feature..........................................................................................................................5-745.10.3 Working Principle and Signal Flow...................................................................................................5-755.10.4 Front Panel.........................................................................................................................................5-775.10.5 Valid Slots..........................................................................................................................................5-795.10.6 Board Feature Code............................................................................................................................5-79


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5.10.7 Board Configuration Reference.........................................................................................................5-795.10.8 Technical Specifications....................................................................................................................5-79

5.11 SF16............................................................................................................................................................5-815.11.1 Version Description............................................................................................................................5-815.11.2 Function and Feature..........................................................................................................................5-815.11.3 Working Principle and Signal Flow...................................................................................................5-835.11.4 Front Panel.........................................................................................................................................5-855.11.5 Valid Slots..........................................................................................................................................5-865.11.6 Board Configuration Reference.........................................................................................................5-865.11.7 Technical Specifications....................................................................................................................5-86

6 PDH Processing Boards............................................................................................................6-16.1 PL1..................................................................................................................................................................6-3

6.1.1 Version Description................................................................................................................................6-36.1.2 Function and Feature..............................................................................................................................6-36.1.3 Working Principle and Signal Flow.......................................................................................................6-46.1.4 Front Panel............................................................................................................................................. 6-66.1.5 Valid Slots..............................................................................................................................................6-76.1.6 Board Feature Code................................................................................................................................6-76.1.7 Board Configuration Reference............................................................................................................. 6-76.1.8 Technical Specifications........................................................................................................................ 6-8

6.2 PD1 .................................................................................................................................................................6-86.2.1 Version Description................................................................................................................................6-96.2.2 Function and Feature..............................................................................................................................6-96.2.3 Working Principle and Signal Flow.....................................................................................................6-106.2.4 Front Panel...........................................................................................................................................6-136.2.5 Valid Slots............................................................................................................................................6-136.2.6 Board Feature Code..............................................................................................................................6-146.2.7 TPS Protection for the Board...............................................................................................................6-156.2.8 Board Configuration Reference...........................................................................................................6-176.2.9 Technical Specifications......................................................................................................................6-17

6.3 PQ1................................................................................................................................................................6-186.3.1 Version Description..............................................................................................................................6-186.3.2 Function and Feature............................................................................................................................6-196.3.3 Working Principle and Signal Flow.....................................................................................................6-206.3.4 Front Panel...........................................................................................................................................6-226.3.5 Valid Slots............................................................................................................................................6-236.3.6 Board Feature Code..............................................................................................................................6-246.3.7 TPS Protection for the Board...............................................................................................................6-246.3.8 Board Configuration Reference...........................................................................................................6-266.3.9 Technical Specifications......................................................................................................................6-26

6.4 PQM .............................................................................................................................................................6-276.4.1 Version Description..............................................................................................................................6-27



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6.4.2 Function and Feature............................................................................................................................6-276.4.3 Working Principle and Signal Flow.....................................................................................................6-286.4.4 Front Panel...........................................................................................................................................6-306.4.5 Valid Slots............................................................................................................................................6-316.4.6 TPS Protection for the Board...............................................................................................................6-326.4.7 Board Configuration Reference...........................................................................................................6-346.4.8 Technical Specifications......................................................................................................................6-34

6.5 PL3................................................................................................................................................................6-356.5.1 Version Description..............................................................................................................................6-356.5.2 Function and Feature............................................................................................................................6-366.5.3 Working Principle and Signal Flow.....................................................................................................6-366.5.4 Front Panel...........................................................................................................................................6-396.5.5 Valid Slots............................................................................................................................................6-406.5.6 TPS Protection for the Board...............................................................................................................6-406.5.7 Board Configuration Reference...........................................................................................................6-426.5.8 Technical Specifications......................................................................................................................6-42

6.6 PL3A.............................................................................................................................................................6-436.6.1 Version Description..............................................................................................................................6-436.6.2 Function and Feature............................................................................................................................6-446.6.3 Working Principle and Signal Flow.....................................................................................................6-456.6.4 Front Panel...........................................................................................................................................6-476.6.5 Valid Slots............................................................................................................................................6-486.6.6 Board Configuration Reference...........................................................................................................6-486.6.7 Technical Specifications......................................................................................................................6-48

6.7 PD3................................................................................................................................................................6-496.7.1 Version Description..............................................................................................................................6-506.7.2 Function and Feature............................................................................................................................6-506.7.3 Working Principle and Signal Flow.....................................................................................................6-516.7.4 Front Panel...........................................................................................................................................6-536.7.5 Valid Slots............................................................................................................................................6-546.7.6 TPS Protection for the Board...............................................................................................................6-556.7.7 Board Configuration Reference...........................................................................................................6-566.7.8 Technical Specifications......................................................................................................................6-57

6.8 PQ3................................................................................................................................................................6-576.8.1 Version Description..............................................................................................................................6-586.8.2 Function and Feature............................................................................................................................6-586.8.3 Working Principle and Signal Flow.....................................................................................................6-586.8.4 Front Panel...........................................................................................................................................6-616.8.5 Valid Slots............................................................................................................................................6-626.8.6 TPS Protection for the Board...............................................................................................................6-626.8.7 Board Configuration Reference...........................................................................................................6-646.8.8 Technical Specifications......................................................................................................................6-64


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6.9 DX1...............................................................................................................................................................6-646.9.1 Version Description..............................................................................................................................6-656.9.2 Function and Feature............................................................................................................................6-656.9.3 Working Principle and Signal Flow.....................................................................................................6-666.9.4 Front Panel...........................................................................................................................................6-676.9.5 Valid Slots............................................................................................................................................6-686.9.6 Board Feature Code..............................................................................................................................6-686.9.7 TPS Protection for the Board...............................................................................................................6-696.9.8 Board Configuration Reference...........................................................................................................6-706.9.9 Technical Specifications......................................................................................................................6-70

6.10 DXA............................................................................................................................................................6-716.10.1 Version Description............................................................................................................................6-716.10.2 Function and Feature..........................................................................................................................6-726.10.3 Working Principle and Signal Flow...................................................................................................6-726.10.4 Front Panel.........................................................................................................................................6-736.10.5 Valid Slots..........................................................................................................................................6-746.10.6 Board Configuration Reference.........................................................................................................6-756.10.7 Technical Specifications....................................................................................................................6-75

6.11 SPQ4............................................................................................................................................................6-756.11.1 Version Description............................................................................................................................6-766.11.2 Function and Feature..........................................................................................................................6-766.11.3 Working Principle and Signal Flow...................................................................................................6-776.11.4 Front Panel.........................................................................................................................................6-806.11.5 Valid Slots..........................................................................................................................................6-816.11.6 TPS Protection for the Board.............................................................................................................6-826.11.7 Board Configuration Reference.........................................................................................................6-836.11.8 Technical Specifications....................................................................................................................6-83

7 Data Processing Boards.............................................................................................................7-17.1 EFT4................................................................................................................................................................7-3

7.1.1 Version Description................................................................................................................................7-37.1.2 Function and Feature..............................................................................................................................7-37.1.3 Working Principle and Signal Flow.......................................................................................................7-47.1.4 Front Panel............................................................................................................................................. 7-67.1.5 Valid Slots..............................................................................................................................................7-87.1.6 Board Configuration Reference............................................................................................................. 7-87.1.7 Technical Specifications........................................................................................................................ 7-8

7.2 EFT8................................................................................................................................................................7-97.2.1 Version Description................................................................................................................................7-97.2.2 Function and Feature..............................................................................................................................7-97.2.3 Working Principle and Signal Flow.....................................................................................................7-107.2.4 Front Panel...........................................................................................................................................7-127.2.5 Valid Slots............................................................................................................................................7-14



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7.2.6 Board Configuration Reference...........................................................................................................7-157.2.7 Technical Specifications......................................................................................................................7-15

7.3 EFT8A...........................................................................................................................................................7-157.3.1 Version Description..............................................................................................................................7-167.3.2 Function and Feature............................................................................................................................7-167.3.3 Working Principle and Signal Flow.....................................................................................................7-177.3.4 Front Panel...........................................................................................................................................7-197.3.5 Valid Slots............................................................................................................................................7-217.3.6 Board Configuration Reference...........................................................................................................7-227.3.7 Technical Specifications......................................................................................................................7-22

7.4 EGT2.............................................................................................................................................................7-227.4.1 Version Description..............................................................................................................................7-237.4.2 Function and Feature............................................................................................................................7-237.4.3 Working Principle and Signal Flow.....................................................................................................7-247.4.4 Front Panel...........................................................................................................................................7-267.4.5 Valid Slots............................................................................................................................................7-277.4.6 Board Feature Code..............................................................................................................................7-277.4.7 Board Configuration Reference...........................................................................................................7-287.4.8 Technical Specifications......................................................................................................................7-28

7.5 EFS0..............................................................................................................................................................7-297.5.1 Version Description..............................................................................................................................7-297.5.2 Function and Feature............................................................................................................................7-307.5.3 Working Principle and Signal Flow.....................................................................................................7-327.5.4 Front Panel...........................................................................................................................................7-357.5.5 Valid Slots............................................................................................................................................7-367.5.6 TPS Protection......................................................................................................................................7-367.5.7 Board Configuration Reference...........................................................................................................7-377.5.8 Technical Specifications......................................................................................................................7-37

7.6 EFS4..............................................................................................................................................................7-377.6.1 Version Description..............................................................................................................................7-387.6.2 Function and Feature............................................................................................................................7-387.6.3 Working Principle and Signal Flow.....................................................................................................7-407.6.4 Front Panel...........................................................................................................................................7-437.6.5 Valid Slots............................................................................................................................................7-457.6.6 Board Configuration Reference...........................................................................................................7-457.6.7 Technical Specifications......................................................................................................................7-45

7.7 EGS2.............................................................................................................................................................7-457.7.1 Version Description..............................................................................................................................7-467.7.2 Function and Feature............................................................................................................................7-467.7.3 Working Principle and Signal Flow.....................................................................................................7-497.7.4 Front Panel...........................................................................................................................................7-517.7.5 Valid Slots............................................................................................................................................7-53


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7.7.6 Board Feature Code..............................................................................................................................7-537.7.7 Board Configuration Reference...........................................................................................................7-537.7.8 Technical Specifications......................................................................................................................7-53

7.8 EMS4.............................................................................................................................................................7-547.8.1 Version Description..............................................................................................................................7-557.8.2 Function and Feature............................................................................................................................7-557.8.3 Working Principle and Signal Flow.....................................................................................................7-577.8.4 Front Panel...........................................................................................................................................7-607.8.5 Valid Slots............................................................................................................................................7-627.8.6 Board Feature Code..............................................................................................................................7-627.8.7 Board Protection...................................................................................................................................7-637.8.8 Board Configuration Reference...........................................................................................................7-657.8.9 Technical Specifications......................................................................................................................7-66

7.9 EGS4.............................................................................................................................................................7-677.9.1 Version Description..............................................................................................................................7-677.9.2 Function and Feature............................................................................................................................7-677.9.3 Working Principle and Signal Flow.....................................................................................................7-697.9.4 Front Panel...........................................................................................................................................7-727.9.5 Valid Slots............................................................................................................................................7-747.9.6 Board Feature Code..............................................................................................................................7-747.9.7 Board Protection...................................................................................................................................7-747.9.8 Board Configuration Reference...........................................................................................................7-777.9.9 Technical Specifications......................................................................................................................7-78

7.10 EGR2...........................................................................................................................................................7-797.10.1 Version Description............................................................................................................................7-797.10.2 Function and Feature..........................................................................................................................7-797.10.3 Working Principle and Signal Flow...................................................................................................7-827.10.4 Front Panel.........................................................................................................................................7-847.10.5 Valid Slots..........................................................................................................................................7-867.10.6 Board Feature Code............................................................................................................................7-867.10.7 Board Configuration Reference.........................................................................................................7-867.10.8 Technical Specifications....................................................................................................................7-86

7.11 EMR0..........................................................................................................................................................7-877.11.1 Version Description............................................................................................................................7-887.11.2 Function and Feature..........................................................................................................................7-897.11.3 Working Principle and Signal Flow...................................................................................................7-927.11.4 Front Panel.........................................................................................................................................7-947.11.5 Valid Slots..........................................................................................................................................7-977.11.6 Board Feature Code............................................................................................................................7-987.11.7 Board Configuration Reference.........................................................................................................7-987.11.8 Technical Specifications....................................................................................................................7-98

7.12 ADL4...........................................................................................................................................................7-99



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7.12.1 Version Description..........................................................................................................................7-1007.12.2 Function and Feature........................................................................................................................7-1007.12.3 Working Principle and Signal Flow.................................................................................................7-1017.12.4 Front Panel.......................................................................................................................................7-1037.12.5 Valid Slots........................................................................................................................................7-1047.12.6 Board Feature Code..........................................................................................................................7-1047.12.7 Board Configuration Reference.......................................................................................................7-1047.12.8 Technical Specifications..................................................................................................................7-105

7.13 ADQ1........................................................................................................................................................7-1067.13.1 Version Description..........................................................................................................................7-1067.13.2 Function and Feature........................................................................................................................7-1067.13.3 Working Principle and Signal Flow.................................................................................................7-1077.13.4 Front Panel.......................................................................................................................................7-1097.13.5 Valid Slots........................................................................................................................................7-1117.13.6 Board Feature Code..........................................................................................................................7-1117.13.7 Board Configuration Reference.......................................................................................................7-1117.13.8 Technical Specifications..................................................................................................................7-112

7.14 IDL4..........................................................................................................................................................7-1137.14.1 Version Description..........................................................................................................................7-1137.14.2 Function and Feature........................................................................................................................7-1137.14.3 Working Principle ...........................................................................................................................7-1157.14.4 Front Panel.......................................................................................................................................7-1177.14.5 Valid Slots........................................................................................................................................7-1187.14.6 Board Feature Code..........................................................................................................................7-1187.14.7 Board Protection...............................................................................................................................7-1187.14.8 Board Configuration Reference.......................................................................................................7-1197.14.9 Technical Specifications..................................................................................................................7-119

7.15 IDQ1..........................................................................................................................................................7-1207.15.1 Version Description..........................................................................................................................7-1207.15.2 Function and Feature........................................................................................................................7-1217.15.3 Working Principle and Signal Flow.................................................................................................7-1227.15.4 Front Panel.......................................................................................................................................7-1247.15.5 Valid Slots........................................................................................................................................7-1267.15.6 Board Feature Code..........................................................................................................................7-1267.15.7 Board Protection...............................................................................................................................7-1267.15.8 Board Configuration Reference.......................................................................................................7-1267.15.9 Technical Specifications..................................................................................................................7-127

7.16 MST4.........................................................................................................................................................7-1287.16.1 Version Description..........................................................................................................................7-1287.16.2 Function and Feature........................................................................................................................7-1287.16.3 Working Principle and Signal Flow.................................................................................................7-1307.16.4 Front Panel.......................................................................................................................................7-132


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7.16.5 Valid Slots........................................................................................................................................7-1337.16.6 Board Feature Code..........................................................................................................................7-1337.16.7 Board Configuration Reference.......................................................................................................7-1347.16.8 Technical Specifications..................................................................................................................7-134

8 Interface Boards and Switching Boards.................................................................................8-18.1 L12S................................................................................................................................................................8-3

8.1.1 Version Description................................................................................................................................8-38.1.2 Function and Feature..............................................................................................................................8-38.1.3 Working Principle and Signal Flow.......................................................................................................8-38.1.4 Front Panel.............................................................................................................................................8-48.1.5 Valid Slots..............................................................................................................................................8-58.1.6 Technical Specifications........................................................................................................................8-5

8.2 D12B...............................................................................................................................................................8-58.2.1 Version Description................................................................................................................................8-68.2.2 Function and Feature..............................................................................................................................8-68.2.3 Working Principle and Signal Flow.......................................................................................................8-68.2.4 Front Panel.............................................................................................................................................8-68.2.5 Valid Slots..............................................................................................................................................8-88.2.6 Technical Specifications........................................................................................................................8-9

8.3 D12S................................................................................................................................................................8-98.3.1 Version Description................................................................................................................................8-98.3.2 Function and Feature..............................................................................................................................8-98.3.3 Working Principle and Signal Flow.......................................................................................................8-98.3.4 Front Panel...........................................................................................................................................8-108.3.5 Valid Slots............................................................................................................................................8-128.3.6 Technical Specifications......................................................................................................................8-13

8.4 L75S..............................................................................................................................................................8-138.4.1 Version Description..............................................................................................................................8-138.4.2 Function and Feature............................................................................................................................8-138.4.3 Working Principle and Signal Flow.....................................................................................................8-148.4.4 Front Panel...........................................................................................................................................8-148.4.5 Valid Slots............................................................................................................................................8-158.4.6 Technical Specifications......................................................................................................................8-15

8.5 D75S..............................................................................................................................................................8-168.5.1 Version Description..............................................................................................................................8-168.5.2 Function and Feature............................................................................................................................8-168.5.3 Working Principle and Signal Flow.....................................................................................................8-168.5.4 Front Panel...........................................................................................................................................8-178.5.5 Valid Slots............................................................................................................................................8-198.5.6 Technical Specifications......................................................................................................................8-20

8.6 D34S..............................................................................................................................................................8-208.6.1 Version Description..............................................................................................................................8-20



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8.6.2 Function and Feature............................................................................................................................8-208.6.3 Working Principle and Signal Flow.....................................................................................................8-218.6.4 Front Panel...........................................................................................................................................8-218.6.5 Valid Slots............................................................................................................................................8-228.6.6 Technical Specifications......................................................................................................................8-23

8.7 C34S..............................................................................................................................................................8-238.7.1 Version Description..............................................................................................................................8-248.7.2 Function and Feature............................................................................................................................8-248.7.3 Working Principle and Signal Flow.....................................................................................................8-248.7.4 Front Panel...........................................................................................................................................8-258.7.5 Valid Slots............................................................................................................................................8-268.7.6 Technical Specifications......................................................................................................................8-26

8.8 EU04..............................................................................................................................................................8-278.8.1 Version Description..............................................................................................................................8-278.8.2 Function and Feature............................................................................................................................8-278.8.3 Working Principle and Signal Flow.....................................................................................................8-278.8.4 Front Panel...........................................................................................................................................8-288.8.5 Valid Slots............................................................................................................................................8-298.8.6 Technical Specifications......................................................................................................................8-30

8.9 EU08..............................................................................................................................................................8-308.9.1 Version Description..............................................................................................................................8-318.9.2 Function and Feature............................................................................................................................8-318.9.3 Working Principle and Signal Flow.....................................................................................................8-318.9.4 Front Panel...........................................................................................................................................8-328.9.5 Valid Slots............................................................................................................................................8-338.9.6 Technical Specifications......................................................................................................................8-33

8.10 OU08 ..........................................................................................................................................................8-348.10.1 Version Description............................................................................................................................8-348.10.2 Function and Feature..........................................................................................................................8-358.10.3 Working Principle and Signal Flow...................................................................................................8-358.10.4 Front Panel.........................................................................................................................................8-358.10.5 Valid Slots..........................................................................................................................................8-388.10.6 Technical Specifications....................................................................................................................8-38

8.11 MU04..........................................................................................................................................................8-398.11.1 Version Description............................................................................................................................8-398.11.2 Function and Feature..........................................................................................................................8-398.11.3 Working Principle and Signal Flow...................................................................................................8-398.11.4 Front Panel.........................................................................................................................................8-408.11.5 Valid Slots..........................................................................................................................................8-418.11.6 Technical Specifications....................................................................................................................8-42

8.12 TSB8............................................................................................................................................................8-428.12.1 Version Description............................................................................................................................8-43


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8.12.2 Function and Feature..........................................................................................................................8-438.12.3 Working Principle and Signal Flow...................................................................................................8-438.12.4 Front Panel.........................................................................................................................................8-448.12.5 Valid Slots..........................................................................................................................................8-458.12.6 Technical Specifications....................................................................................................................8-46

8.13 EFF8............................................................................................................................................................8-468.13.1 Version Description............................................................................................................................8-478.13.2 Function and Feature..........................................................................................................................8-478.13.3 Working Principle and Signal Flow...................................................................................................8-478.13.4 Front Panel.........................................................................................................................................8-488.13.5 Valid Slots..........................................................................................................................................8-498.13.6 Technical Specifications....................................................................................................................8-50

8.14 ETF8............................................................................................................................................................8-518.14.1 Version Description............................................................................................................................8-518.14.2 Function and Feature..........................................................................................................................8-518.14.3 Working Principle and Signal Flow...................................................................................................8-518.14.4 Front Panel.........................................................................................................................................8-528.14.5 Valid Slots..........................................................................................................................................8-548.14.6 Technical Specifications....................................................................................................................8-55

8.15 ETS8............................................................................................................................................................8-568.15.1 Version Description............................................................................................................................8-568.15.2 Function and Feature..........................................................................................................................8-568.15.3 Working Principle and Signal Flow...................................................................................................8-568.15.4 Front Panel.........................................................................................................................................8-578.15.5 Valid Slots..........................................................................................................................................8-598.15.6 Technical Specifications....................................................................................................................8-59

8.16 DM12..........................................................................................................................................................8-608.16.1 Version Description............................................................................................................................8-608.16.2 Function and Feature..........................................................................................................................8-608.16.3 Working Principle and Signal Flow...................................................................................................8-608.16.4 Front Panel.........................................................................................................................................8-618.16.5 Valid Slots..........................................................................................................................................8-648.16.6 Technical Specifications....................................................................................................................8-64

9 Cross-Connect and System Control Boards..........................................................................9-19.1 CXL1...............................................................................................................................................................9-2

9.1.1 Version Description................................................................................................................................9-29.1.2 Function and Feature..............................................................................................................................9-29.1.3 Working Principle and Signal Flow.......................................................................................................9-59.1.4 Front Panel.............................................................................................................................................9-99.1.5 Valid Slots............................................................................................................................................9-119.1.6 Board Feature Code..............................................................................................................................9-119.1.7 Board Configuration Reference...........................................................................................................9-11



xii Huawei Technologies Proprietary Issue 02 (2007-09-10)

9.1.8 Technical Specifications......................................................................................................................9-129.2 CXL4.............................................................................................................................................................9-13

9.2.1 Version Description..............................................................................................................................9-149.2.2 Function and Feature............................................................................................................................9-149.2.3 Working Principle and Signal Flow.....................................................................................................9-179.2.4 Front Panel...........................................................................................................................................9-209.2.5 Valid Slots............................................................................................................................................9-229.2.6 Board Feature Code..............................................................................................................................9-229.2.7 Board Configuration Reference...........................................................................................................9-229.2.8 Technical Specifications......................................................................................................................9-23

9.3 CXL16...........................................................................................................................................................9-249.3.1 Version Description..............................................................................................................................9-259.3.2 Function and Feature............................................................................................................................9-259.3.3 Working Principle and Signal Flow.....................................................................................................9-289.3.4 Front Panel...........................................................................................................................................9-319.3.5 Valid Slots............................................................................................................................................9-339.3.6 Board Feature Code..............................................................................................................................9-339.3.7 Board Configuration Reference...........................................................................................................9-339.3.8 Technical Specifications......................................................................................................................9-34

10 Auxiliary Boards.....................................................................................................................10-110.1 EOW............................................................................................................................................................10-2

10.1.1 Version Description............................................................................................................................10-210.1.2 Function and Feature..........................................................................................................................10-210.1.3 Working Principle and Signal Flow...................................................................................................10-210.1.4 Front Panel.........................................................................................................................................10-310.1.5 Valid Slots..........................................................................................................................................10-510.1.6 Technical Specifications....................................................................................................................10-5

10.2 AUX............................................................................................................................................................10-610.2.1 Version Description............................................................................................................................10-610.2.2 Function and Feature..........................................................................................................................10-610.2.3 Working Principle and Signal Flow...................................................................................................10-710.2.4 Jumper..............................................................................................................................................10-1110.2.5 Front Panel.......................................................................................................................................10-1110.2.6 Valid Slots........................................................................................................................................10-1410.2.7 Technical Specifications..................................................................................................................10-15

10.3 AMU..........................................................................................................................................................10-1510.3.1 Version Description..........................................................................................................................10-1510.3.2 Function and Feature........................................................................................................................10-1510.3.3 Working Principle and Signal Flow.................................................................................................10-1610.3.4 Front Panel.......................................................................................................................................10-1710.3.5 Valid Slots........................................................................................................................................10-2010.3.6 Technical Specifications..................................................................................................................10-20


Issue 02 (2007-09-10) Huawei Technologies Proprietary xiii

10.4 FAN...........................................................................................................................................................10-2110.4.1 Version Description..........................................................................................................................10-2110.4.2 Function and Feature........................................................................................................................10-2110.4.3 Working Principle and Signal Flow.................................................................................................10-2210.4.4 Front Panel.......................................................................................................................................10-2210.4.5 Valid Slots........................................................................................................................................10-2310.4.6 Technical Specifications..................................................................................................................10-23

11 WDM Processing Boards......................................................................................................11-111.1 CMR2..........................................................................................................................................................11-3

11.1.1 Version Description............................................................................................................................11-311.1.2 Function and Feature..........................................................................................................................11-311.1.3 Working Principle and Signal Flow...................................................................................................11-411.1.4 Front Panel......................................................................................................................................... 11-511.1.5 Valid Slots..........................................................................................................................................11-711.1.6 Board Feature Code............................................................................................................................11-711.1.7 Technical Specifications.................................................................................................................... 11-8

11.2 CMR4..........................................................................................................................................................11-911.2.1 Version Description............................................................................................................................11-911.2.2 Function and Feature..........................................................................................................................11-911.2.3 Working Principle and Signal Flow.................................................................................................11-1011.2.4 Front Panel.......................................................................................................................................11-1111.2.5 Valid Slots........................................................................................................................................11-1311.2.6 Board Feature Code..........................................................................................................................11-1311.2.7 Technical Specifications..................................................................................................................11-14

11.3 MR2...........................................................................................................................................................11-1511.3.1 Version Description..........................................................................................................................11-1611.3.2 Function and Feature........................................................................................................................11-1611.3.3 Working Principle and Signal Flow.................................................................................................11-1611.3.4 Front Panel.......................................................................................................................................11-1711.3.5 Valid Slots........................................................................................................................................11-1911.3.6 Board Feature Code..........................................................................................................................11-1911.3.7 Technical Specifications..................................................................................................................11-20

11.4 MR2A........................................................................................................................................................11-2111.4.1 Version Description..........................................................................................................................11-2111.4.2 Function and Feature........................................................................................................................11-2111.4.3 Working Principle and Signal Flow.................................................................................................11-2311.4.4 Front Panel.......................................................................................................................................11-2411.4.5 Valid Slots........................................................................................................................................11-2511.4.6 Technical Specifications..................................................................................................................11-25

11.5 MR2B........................................................................................................................................................11-2611.5.1 Version Description..........................................................................................................................11-2711.5.2 Function and Feature........................................................................................................................11-27



xiv Huawei Technologies Proprietary Issue 02 (2007-09-10)

11.5.3 Working Principle and Signal Flow.................................................................................................11-2811.5.4 Front Panel.......................................................................................................................................11-2911.5.5 Valid Slots........................................................................................................................................11-3011.5.6 Technical Specifications..................................................................................................................11-30

11.6 MR2C........................................................................................................................................................11-3111.6.1 Version Description..........................................................................................................................11-3211.6.2 Function and Feature........................................................................................................................11-3211.6.3 Working Principle and Signal Flow.................................................................................................11-3311.6.4 Front Panel.......................................................................................................................................11-3411.6.5 Valid Slots........................................................................................................................................11-3611.6.6 Technical Specifications..................................................................................................................11-36

11.7 MR4...........................................................................................................................................................11-3711.7.1 Version Description..........................................................................................................................11-3711.7.2 Function and Feature........................................................................................................................11-3711.7.3 Working Principle and Signal Flow.................................................................................................11-3811.7.4 Front Panel.......................................................................................................................................11-3911.7.5 Valid Slots........................................................................................................................................11-4111.7.6 Board Feature Code..........................................................................................................................11-4111.7.7 Technical Specifications..................................................................................................................11-42

11.8 LWX..........................................................................................................................................................11-4311.8.1 Version Description..........................................................................................................................11-4311.8.2 Function and Feature........................................................................................................................11-4311.8.3 Working Principle and Signal Flow.................................................................................................11-4411.8.4 Front Panel.......................................................................................................................................11-4611.8.5 Valid Slots........................................................................................................................................11-4811.8.6 Board Feature Code..........................................................................................................................11-4811.8.7 Technical Specifications..................................................................................................................11-48

11.9 OBU1........................................................................................................................................................11-5111.9.1 Version Description..........................................................................................................................11-5211.9.2 Function and Feature........................................................................................................................11-5211.9.3 Working Principle and Signal Flow.................................................................................................11-5211.9.4 Front Panel.......................................................................................................................................11-5411.9.5 Valid Slots........................................................................................................................................11-5511.9.6 Board Feature Code..........................................................................................................................11-5511.9.7 Technical Specifications..................................................................................................................11-56

11.10 FIB...........................................................................................................................................................11-5711.10.1 Version Description........................................................................................................................11-5711.10.2 Function and Feature......................................................................................................................11-5711.10.3 Working Principle and Signal Flow...............................................................................................11-5811.10.4 Front Panel.....................................................................................................................................11-5811.10.5 Valid Slots......................................................................................................................................11-5911.10.6 Technical Specifications................................................................................................................11-59


Issue 02 (2007-09-10) Huawei Technologies Proprietary xv

12 Optical Amplifier Boards and Dispersion Compensation Boards...............................12-112.1 BA2............................................................................................................................................................. 12-2

12.1.1 Version Description............................................................................................................................12-212.1.2 Function and Feature..........................................................................................................................12-212.1.3 Working Principle and Signal Flow...................................................................................................12-312.1.4 Front Panel......................................................................................................................................... 12-512.1.5 Valid Slots..........................................................................................................................................12-712.1.6 Board Feature Code............................................................................................................................12-712.1.7 Technical Specifications.................................................................................................................... 12-7

12.2 BPA.............................................................................................................................................................12-812.2.1 Version Description............................................................................................................................12-912.2.2 Function and Feature..........................................................................................................................12-912.2.3 Working Principle and Signal Flow.................................................................................................12-1012.2.4 Front Panel.......................................................................................................................................12-1112.2.5 Valid Slots........................................................................................................................................12-1312.2.6 Board Feature Code..........................................................................................................................12-1312.2.7 Technical Specifications..................................................................................................................12-13

12.3 COA..........................................................................................................................................................12-1412.3.1 Version Description..........................................................................................................................12-1512.3.2 Function and Feature........................................................................................................................12-1512.3.3 Working Principle and Signal Flow.................................................................................................12-1812.3.4 Front Panel.......................................................................................................................................12-1912.3.5 Installation Position..........................................................................................................................12-2312.3.6 Board Feature Code..........................................................................................................................12-2412.3.7 Technical Specifications..................................................................................................................12-24

13 Power Interface Boards.........................................................................................................13-113.1 UPM............................................................................................................................................................13-2

13.1.1 Version Description............................................................................................................................13-213.1.2 Function and Feature..........................................................................................................................13-213.1.3 Working Principle and Signal Flow...................................................................................................13-313.1.4 Rear Panel.......................................................................................................................................... 13-413.1.5 Valid Slots..........................................................................................................................................13-613.1.6 Technical Specifications.................................................................................................................... 13-6

13.2 PIU.............................................................................................................................................................. 13-713.2.1 Version Description............................................................................................................................13-813.2.2 Function and Feature..........................................................................................................................13-813.2.3 Working Principle and Signal Flow...................................................................................................13-813.2.4 Front Panel......................................................................................................................................... 13-913.2.5 Valid Slots........................................................................................................................................13-1013.2.6 Technical Specifications..................................................................................................................13-10

13.3 PIUA..........................................................................................................................................................13-1113.3.1 Version Description..........................................................................................................................13-11



xvi Huawei Technologies Proprietary Issue 02 (2007-09-10)

13.3.2 Function and Feature........................................................................................................................13-1113.3.3 Working Principle and Signal Flow.................................................................................................13-1213.3.4 Front Panel.......................................................................................................................................13-1313.3.5 Valid Slots........................................................................................................................................13-1413.3.6 Technical Specifications..................................................................................................................13-14

14 Cables.......................................................................................................................................14-114.1 Fiber Jumper................................................................................................................................................14-2

14.1.1 Types of Fiber Jumpers......................................................................................................................14-214.1.2 Connector...........................................................................................................................................14-3

14.2 Power Cables and Grounding Cables..........................................................................................................14-514.2.1 Cabinet –48 V/BGND/PGND Power Cable.......................................................................................14-514.2.2 Equipment –48 V/–60 V Power Cable/PGND Grounding Cable......................................................14-714.2.3 UPM Power Cable..............................................................................................................................14-9

14.3 Alarm Cable..............................................................................................................................................14-1014.3.1 Alarm Input/Output Cable................................................................................................................14-10

14.4 Management Cable....................................................................................................................................14-1214.4.1 OAM Serial Port Cable....................................................................................................................14-1214.4.2 Serial 1–4/F1/F&f Serial Port Cable................................................................................................14-1414.4.3 RS232/RS-422 Serial Port Cable.....................................................................................................14-1514.4.4 Ordinary Telephone Wire.................................................................................................................14-1714.4.5 COA Concatenating Cable...............................................................................................................14-1814.4.6 Straight Through Cable....................................................................................................................14-1914.4.7 Crossover Cable...............................................................................................................................14-20

14.5 Signal Cable..............................................................................................................................................14-2114.5.1 75-ohm 8 x E1 Cable........................................................................................................................14-2214.5.2 75-ohm 16 x E1 Cable......................................................................................................................14-2314.5.3 120-ohm 8 x E1 Cable......................................................................................................................14-2614.5.4 120-ohm 16 x E1 Cable....................................................................................................................14-2814.5.5 E3/T3/STM-1 Cable.........................................................................................................................14-3014.5.6 Framed E1 Cable..............................................................................................................................14-3114.5.7 N x 64 kbit/s Cables.........................................................................................................................14-31

14.6 Clock Cable...............................................................................................................................................14-4814.6.1 Clock Cable......................................................................................................................................14-4814.6.2 One-Channel and Two-Channel Clock Transfer Cables..................................................................14-50

A Equipment and Board Alarm Indicators.............................................................................A-1A.1 Indicators on the Cabinet...............................................................................................................................A-2A.2 Board Alarm Indicator...................................................................................................................................A-2

B Labels..........................................................................................................................................B-1B.1 Safety Label...................................................................................................................................................B-2

B.1.1 Label Description..................................................................................................................................B-2B.1.2 Label Position.......................................................................................................................................B-3


Issue 02 (2007-09-10) Huawei Technologies Proprietary xvii

B.2 Optical Module Labels...................................................................................................................................B-5B.3 Engineering Labels........................................................................................................................................B-7

C Power Consumption and Weight..........................................................................................C-1

D Board Version Configuration................................................................................................D-1

E Board Loopbacks.......................................................................................................................E-1

F Board Configuration Reference..............................................................................................F-1F.1 SDH Processing Boards..................................................................................................................................F-2F.2 PDH Processing Board...................................................................................................................................F-2F.3 Data Processing Board....................................................................................................................................F-4

F.3.1 SDH Parameters.....................................................................................................................................F-5F.3.2 Ethernet Parameters...............................................................................................................................F-6F.3.3 ATM Parameter.....................................................................................................................................F-7

F.4 Cross-Connect and Timing Unit.....................................................................................................................F-8

G Glossary.....................................................................................................................................G-1

H Acronyms and Abbreviations...............................................................................................H-1

Index.................................................................................................................................................i-1



xviii Huawei Technologies Proprietary Issue 02 (2007-09-10)

Figures

Figure 1-1 Appearance of the OptiX OSN 1500A...............................................................................................1-1Figure 1-2 Appearance of the OptiX OSN 1500B...............................................................................................1-1Figure 2-1 ETSI cabinet.......................................................................................................................................2-2Figure 2-2 Appearance of the DC PDU...............................................................................................................2-4Figure 3-1 Structure of the OptiX OSN 1500A subrack......................................................................................3-2Figure 3-2 Structure of the OptiX OSN 1500B subrack......................................................................................3-3Figure 3-3 Slot access capacity of the OptiX OSN 1500A..................................................................................3-4Figure 3-4 Slot access capacity of the OptiX OSN 1500B..................................................................................3-4Figure 3-5 Slot layout of the OptiX OSN 1500A subrack...................................................................................3-5Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots..........................................3-5Figure 3-7 Slot access capacity of the OptiX OSN 1500A..................................................................................3-5Figure 3-8 Slot layout of the OptiX OSN 1500B subrack...................................................................................3-6Figure 3-9 Slot access capacity of the OptiX OSN 1500B..................................................................................3-6Figure 3-10 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)......................................3-6Figure 3-11 Access capacity of the OptiX OSN 1500B subrack (after the division of slots)..............................3-7Figure 4-1 Barcode of a board..............................................................................................................................4-3Figure 5-1 Block diagram for the working principle of the SL1..........................................................................5-5Figure 5-2 Front panel of the N1SL1/N2SL1......................................................................................................5-7Figure 5-3 Front panel of the R1SL1...................................................................................................................5-8Figure 5-4 Block diagram for the working principle of the SLQ1.....................................................................5-13Figure 5-5 Front panel of the N1SLQ1/N2SLQ1...............................................................................................5-15Figure 5-6 Front panel of the R1SLQ1.............................................................................................................. 5-16Figure 5-7 Block diagram for the working principle of the SLO1.....................................................................5-21Figure 5-8 Front panel of the SLO1...................................................................................................................5-23Figure 5-9 Block diagram for the working principle of the SLT1.....................................................................5-28Figure 5-10 Front panel of the SLT1..................................................................................................................5-30Figure 5-11 Block diagram for the working principle of the SEP1................................................................... 5-35Figure 5-12 Block diagram for the working principle of the SEP used with the EU08.....................................5-35Figure 5-13 Block diagram for the working principle of the SEP used with the OU08.................................... 5-36Figure 5-14 Front panel of the SEP1..................................................................................................................5-38Figure 5-15 Principle of the TPS protection for the SEP1 ................................................................................5-39Figure 5-16 Slot configuration for the 1:1 TPS protection for the SEP1...........................................................5-40Figure 5-17 Block diagram for the working principle of the SL4......................................................................5-44

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Figures

Issue 02 (2007-09-10) Huawei Technologies Proprietary xix

Figure 5-18 Front panel of the N1SL4/N2SL4.................................................................................................. 5-46Figure 5-19 Front panel of the R1SL4...............................................................................................................5-46Figure 5-20 Block diagram for the working principle of the SLD4...................................................................5-52Figure 5-21 Front panel of the N1SLD4/N2SLD4.............................................................................................5-54Figure 5-22 Front panel of the R1SLD4............................................................................................................5-54Figure 5-23 Block diagram for the working principle of the SLQ4...................................................................5-60Figure 5-24 Front panel of the SLQ4.................................................................................................................5-62Figure 5-25 Block diagram for the working principle of the SL16....................................................................5-67Figure 5-26 Front panel of the SL16..................................................................................................................5-69Figure 5-27 Block diagram for the working principle of the N1SL16A and N2SL16A....................................5-75Figure 5-28 Block diagram for the working principle of the N3SL16A............................................................5-76Figure 5-29 Front panel of the SL16A...............................................................................................................5-78Figure 5-30 Block diagram for the working principle of the SF16....................................................................5-83Figure 5-31 Front panel of the SF16..................................................................................................................5-85Figure 6-1 Block diagram for the functions of the PL1.......................................................................................6-4Figure 6-2 Block diagram of the E1 mapping/demapping...................................................................................6-5Figure 6-3 Front panel of the PL1........................................................................................................................6-6Figure 6-4 Block diagram for the functions of the PD1.....................................................................................6-11Figure 6-5 Block diagram of the E1 mapping/ demapping ...............................................................................6-11Figure 6-6 Front panel of the PD1......................................................................................................................6-13Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack..............................6-15Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack..............................6-16Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500A subrack........6-16Figure 6-10 Block diagram for the functions of the PQ1...................................................................................6-20Figure 6-11 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-21Figure 6-12 Front panel of the PQ1....................................................................................................................6-23Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack............................6-25Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1....................................................................6-26Figure 6-15 Block diagram for the functions of the PQM.................................................................................6-28Figure 6-16 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-29Figure 6-17 Front panel of the PQM..................................................................................................................6-31Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack..........................6-33Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack....6-34Figure 6-20 Block diagram for the functions of the PL3...................................................................................6-37Figure 6-21 Block diagram of the E3/T3 mapping/demapping .........................................................................6-37Figure 6-22 Front panel of the PL3....................................................................................................................6-39Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack............................6-41Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack......6-42Figure 6-25 Block diagram for the functions of the PL3A................................................................................6-45Figure 6-26 Block diagram of the E3/T3 mapping/demapping .........................................................................6-45Figure 6-27 Front panel of the PL3A.................................................................................................................6-47Figure 6-28 Block diagram for the functions of the PD3...................................................................................6-51

FiguresOptiX OSN 1500 Intelligent Optical Transmission System


xx Huawei Technologies Proprietary Issue 02 (2007-09-10)

Figure 6-29 Block diagram of the E3/T3 mapping/demapping .........................................................................6-52Figure 6-30 Front panel of the PD3....................................................................................................................6-54Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack............................6-55Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack......6-56Figure 6-33 Block diagram for the functions of the PQ3...................................................................................6-59Figure 6-34 Block diagram of the E3/T3 mapping/demapping .........................................................................6-59Figure 6-35 Front panel of the PQ3....................................................................................................................6-61Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack............................6-62Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack......6-63Figure 6-38 Block diagram for the functions of the DX1..................................................................................6-66Figure 6-39 Front panel of the DX1...................................................................................................................6-67Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack...........................6-69Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-70Figure 6-42 Block diagram for the functions of the DXA................................................................................. 6-72Figure 6-43 Front panel of the DXA..................................................................................................................6-74Figure 6-44 Block diagram for the functions of the SPQ4.................................................................................6-77Figure 6-45 Block diagram of the 140M mapping/demapping .........................................................................6-78Figure 6-46 Block diagram of the SDH overhead processing module...............................................................6-78Figure 6-47 Front panel of the SPQ4................................................................................................................. 6-81Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack......................... 6-82Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4...........................................................6-83Figure 7-1 Block diagram for the functions of the EFT4.....................................................................................7-5Figure 7-2 Front panel of the EFT4......................................................................................................................7-7Figure 7-3 Block diagram for the functions of the EFT8...................................................................................7-11Figure 7-4 Front panel of the EFT8....................................................................................................................7-13Figure 7-5 Block diagram for the functions of the EFT8A................................................................................7-18Figure 7-6 Front panel of the EFT8A.................................................................................................................7-20Figure 7-7 Block diagram for the functions of the EGT2..................................................................................7-24Figure 7-8 Front panel of the EGT2...................................................................................................................7-26Figure 7-9 Block diagram for the functions of the EFS0...................................................................................7-33Figure 7-10 Front panel of the EFS0..................................................................................................................7-35Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500B subrack.............................................................................................................................................................................7-37Figure 7-12 Block diagram for the functions of the EFS4.................................................................................7-41Figure 7-13 Front panel of the EFS4..................................................................................................................7-43Figure 7-14 Block diagram for the functions of the EGS2................................................................................ 7-49Figure 7-15 Front panel of the EGS2.................................................................................................................7-52Figure 7-16 Block diagram for the functions of the EMS4................................................................................7-58Figure 7-17 Front panel of the EMS4................................................................................................................ 7-61Figure 7-18 Normal working of the EMS4........................................................................................................7-63Figure 7-19 Principle of the BPS protection for the EMS4............................................................................... 7-64Figure 7-20 Principle of the PPS protection for the EMS4................................................................................7-65


Issue 02 (2007-09-10) Huawei Technologies Proprietary xxi

Figure 7-21 Block diagram for the functions of the EGS4................................................................................7-70Figure 7-22 Front panel of the EGS4.................................................................................................................7-73Figure 7-23 Normal working of the EGS4.........................................................................................................7-75Figure 7-24 Principle of the BPS protection for the EGS4................................................................................7-76Figure 7-25 Principle of the PPS protection for the EGS4.................................................................................7-77Figure 7-26 Block diagram for the functions of the EGR2................................................................................7-82Figure 7-27 Front panel of the EGR2.................................................................................................................7-85Figure 7-28 Block diagram for the functions of the EMR0...............................................................................7-92Figure 7-29 Front panel of the N1EMR0...........................................................................................................7-95Figure 7-30 Front panel of the N2EMR0...........................................................................................................7-96Figure 7-31 Block diagram for the functions of the ADL4..............................................................................7-101Figure 7-32 Front panel of the ADL4..............................................................................................................7-103Figure 7-33 Block diagram for the functions of the ADQ1.............................................................................7-108Figure 7-34 Front panel of the ADQ1..............................................................................................................7-110Figure 7-35 Block diagram for the functions of the IDL4...............................................................................7-115Figure 7-36 Front panel of the IDL4................................................................................................................7-117Figure 7-37 Block diagram for the functions of the IDQ1...............................................................................7-123Figure 7-38 Front panel of the IDQ1................................................................................................................7-125Figure 7-39 Block diagram for the functions of the MST4..............................................................................7-130Figure 7-40 Front panel of the MST4..............................................................................................................7-132Figure 8-1 Block diagram for the functions of the L12S.....................................................................................8-3Figure 8-2 Front panel of the L12S......................................................................................................................8-4Figure 8-3 Block diagram for the functions of the D12B....................................................................................8-6Figure 8-4 Front panel of the D12B.....................................................................................................................8-7Figure 8-5 Block diagram for the functions of the D12S...................................................................................8-10Figure 8-6 Front panel of the D12S....................................................................................................................8-11Figure 8-7 Block diagram for the functions of the L75S...................................................................................8-14Figure 8-8 Front panel of the L75S....................................................................................................................8-15Figure 8-9 Block diagram for the functions of the D75S...................................................................................8-17Figure 8-10 Front panel of the D75S..................................................................................................................8-18Figure 8-11 Block diagram for the functions of the D34S.................................................................................8-21Figure 8-12 Front panel of the D34S..................................................................................................................8-22Figure 8-13 Block diagram for the functions of the C34S.................................................................................8-24Figure 8-14 Front panel of the C34S..................................................................................................................8-25Figure 8-15 Block diagram for the functions of the EU04.................................................................................8-28Figure 8-16 Front panel of the EU04.................................................................................................................8-29Figure 8-17 Block diagram for the functions of the EU08.................................................................................8-31Figure 8-18 Front panel of the EU08.................................................................................................................8-32Figure 8-19 Block diagram for the functions of the OU08................................................................................8-35Figure 8-20 Front panel of the N1OU08............................................................................................................8-36Figure 8-21 Front panel of the N2OU08............................................................................................................8-37Figure 8-22 Block diagram for the functions of the MU04................................................................................8-40



xxii Huawei Technologies Proprietary Issue 02 (2007-09-10)

Figure 8-23 Front panel of the MU04................................................................................................................8-41Figure 8-24 Block diagram for the functions of the TSB8.................................................................................8-43Figure 8-25 Front panel of the TSB8.................................................................................................................8-44Figure 8-26 Block diagram for the functions of the EFF8.................................................................................8-47Figure 8-27 Front panel of the EFF8..................................................................................................................8-48Figure 8-28 Block diagram for the functions of the ETF8.................................................................................8-52Figure 8-29 Front panel of the ETF8..................................................................................................................8-53Figure 8-30 Block diagram for the functions of the ETS8.................................................................................8-57Figure 8-31 Front panel of the ETS8..................................................................................................................8-58Figure 8-32 Block diagram for the functions of the DM12................................................................................8-61Figure 8-33 Front panel of the DM12................................................................................................................8-62Figure 9-1 Block diagram for the functions of the CXL1....................................................................................9-6Figure 9-2 Block diagram of higher and lower order cross-connect modules....................................................9-9Figure 9-3 Front panel of the CXL1...................................................................................................................9-10Figure 9-4 Block diagram for the functions of the CXL4..................................................................................9-17Figure 9-5 Block diagram of higher and lower order cross-connect modules..................................................9-20Figure 9-6 Front panel of the CXL4...................................................................................................................9-21Figure 9-7 Block diagram for the functions of the CXL16................................................................................9-28Figure 9-8 Block diagram of higher and lower order cross-connect modules..................................................9-31Figure 9-9 Front panel of the CXL16.................................................................................................................9-32Figure 10-1 Block diagram for the functions of the EOW.................................................................................10-3Figure 10-2 Front panel of the EOW..................................................................................................................10-4Figure 10-3 Block diagram for the functions of the R1AUX.............................................................................10-8Figure 10-4 Block diagram for the functions of the R2AUX.............................................................................10-9Figure 10-5 Position of J9 on the AUX............................................................................................................10-11Figure 10-6 Front panel of the AUX................................................................................................................10-12Figure 10-7 Block diagram for the functions of the AMU...............................................................................10-16Figure 10-8 Positions of orderwire bytes in the SDH frame............................................................................10-17Figure 10-9 Front panel of the AMU...............................................................................................................10-18Figure 10-10 Connection of the cabinet alarm indicators................................................................................10-20Figure 10-11 Block diagram for the functions of the FAN..............................................................................10-22Figure 10-12 Front panel of the FAN...............................................................................................................10-23Figure 11-1 Block diagram for the functions of the CMR2...............................................................................11-4Figure 11-2 Front panel of the CMR2................................................................................................................11-6Figure 11-3 Block diagram for the functions of the CMR4.............................................................................11-10Figure 11-4 Front panel of the CMR4..............................................................................................................11-12Figure 11-5 Block diagram for the functions of the MR2................................................................................11-17Figure 11-6 Front panel of the MR2................................................................................................................11-18Figure 11-7 MR2A used as the OTM station...................................................................................................11-22Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADM station...........11-22Figure 11-9 Block diagram for the functions of the MR2A.............................................................................11-23Figure 11-10 Front panel of the MR2A............................................................................................................11-24


Issue 02 (2007-09-10) Huawei Technologies Proprietary xxiii

Figure 11-11 MR2B used as the OTM station.................................................................................................11-27Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADM station......... 11-28Figure 11-13 Block diagram for the functions of the MR2B...........................................................................11-28Figure 11-14 Front panel of the MR2B............................................................................................................11-29Figure 11-15 MR2C used as the OTM station.................................................................................................11-32Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2C and LWX...........................................................................................................................................................................11-33Figure 11-17 Block diagram for the functions of the MR2C...........................................................................11-33Figure 11-18 Front panel of the MR2C............................................................................................................11-35Figure 11-19 Block diagram for the functions of the MR4..............................................................................11-38Figure 11-20 Front panel of the MR4.............................................................................................................. 11-40Figure 11-21 Block diagram for the functions of the LWX.............................................................................11-45Figure 11-22 Front panel of the LWX..............................................................................................................11-47Figure 11-23 Block diagram for the functions of the OBU1............................................................................11-53Figure 11-24 Front panel of the OBU1............................................................................................................11-54Figure 11-25 Location of the FIB in the optical transmission system............................................................. 11-57Figure 11-26 Block diagram for the working principle of the FIB..................................................................11-58Figure 11-27 Front panel of the FIB................................................................................................................ 11-59Figure 12-1 Location of the BA in the optical transmission system..................................................................12-2Figure 12-2 Block diagram for the functions of the BA2..................................................................................12-4Figure 12-3 Front panel of the BA2...................................................................................................................12-6Figure 12-4 Location of the BA and PA in the optical transmission system.....................................................12-9Figure 12-5 Block diagram for the working principle of the BPA...................................................................12-10Figure 12-6 Front panel of the BPA.................................................................................................................12-12Figure 12-7 Appearance of the case-shaped 61COA and N1COA (PA)......................................................... 12-16Figure 12-8 Appearance of the case-shaped 62COA.......................................................................................12-17Figure 12-9 Application of the optical Raman amplifier (62COA).................................................................12-17Figure 12-10 Block diagram for the functions of the 61COA and N1COA.................................................... 12-18Figure 12-11 Front panel of the 61COA and N1COA.....................................................................................12-20Figure 12-12 Front panel of the 62COA..........................................................................................................12-20Figure 12-13 SC/PC fiber connector................................................................................................................12-21Figure 12-14 E2000 flange and fiber connector...............................................................................................12-21Figure 12-15 Position of the 61COA in the ETSI cabinet............................................................................... 12-24Figure 13-1 Appearance of the power supply case............................................................................................13-2Figure 13-2 Rear view of the UPM....................................................................................................................13-4Figure 13-3 Block diagram for the functions of the PIU....................................................................................13-9Figure 13-4 Front panel of the PIU..................................................................................................................13-10Figure 13-5 Block diagram for the functions of the PIUA...............................................................................13-12Figure 13-6 Front panel of the PIUA............................................................................................................... 13-13Figure 14-1 LC/PC optical connector................................................................................................................14-3Figure 14-2 SC/PC optical connector.................................................................................................................14-4Figure 14-3 FC/PC optical connector.................................................................................................................14-4Figure 14-4 E2000/APC optical connector........................................................................................................14-5



xxiv Huawei Technologies Proprietary Issue 02 (2007-09-10)

Figure 14-5 Cabinet –48 V power cable and BGND power grounding cable....................................................14-6Figure 14-6 Cabinet PGND protection grounding cable (JG2)..........................................................................14-6Figure 14-7 Cabinet PGND protection grounding cable (OT)...........................................................................14-6Figure 14-8 Structure of the equipment –48 V/–60 V Power Cable..................................................................14-8Figure 14-9 PGND power cable.........................................................................................................................14-8Figure 14-10 Structure of the UPM power cable...............................................................................................14-9Figure 14-11 Structure of the alarm input/output cable...................................................................................14-11Figure 14-12 Structure of the OAM serial port cable.......................................................................................14-13Figure 14-13 Structure of the Serial 1–4/F1/F&f serial port cable..................................................................14-14Figure 14-14 Structure of the RS232/RS-422 serial port cable........................................................................14-16Figure 14-15 Structure of the ordinary telephone wire....................................................................................14-17Figure 14-16 Structure of the COA concatenating cable.................................................................................14-18Figure 14-17 Structure of the straight through cable........................................................................................14-19Figure 14-18 Structure of the crossover cable..................................................................................................14-20Figure 14-19 Structure of the 75-ohm 8 x E1 cable.........................................................................................14-22Figure 14-20 Structure of the 75-ohm 16 x E1 cable.......................................................................................14-24Figure 14-21 Structure of the 120-ohm 8 x E1 cable.......................................................................................14-26Figure 14-22 Structure of the 120-ohm 16 x E1 cable.....................................................................................14-28Figure 14-23 Structure of the E3/T3/STM-1 cable..........................................................................................14-30Figure 14-24 Structure of the V.35 DCE cable................................................................................................14-33Figure 14-25 Structure of the V.35 DTE cable................................................................................................14-35Figure 14-26 Structure of the V.24 DCE cable................................................................................................14-36Figure 14-27 Structure of the V.24 DTE cable................................................................................................14-38Figure 14-28 Structure of the X.21 DCE cable................................................................................................14-39Figure 14-29 Structure of the X.21 DTE cable................................................................................................14-40Figure 14-30 Structure of the RS449 DCE cable.............................................................................................14-42Figure 14-31 Structure of the RS449 DTE cable.............................................................................................14-43Figure 14-32 Structure of the RS530 DCE cable.............................................................................................14-45Figure 14-33 Structure of the RS530 DTE cable.............................................................................................14-47Figure 14-34 Structure of the 75-ohm clock cable...........................................................................................14-49Figure 14-35 Structure of the 120-ohm 8 x E1 cable.......................................................................................14-49Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)................................14-50Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)................................14-50Figure B-1 Labels on the OptiX OSN 1500B subrack........................................................................................B-4Figure B-2 Labels on the OptiX OSN 1500A subrack........................................................................................B-4Figure B-3 Labels on a board..............................................................................................................................B-5Figure B-4 Optical module labels........................................................................................................................B-5


Issue 02 (2007-09-10) Huawei Technologies Proprietary xxv

Tables

Table 2-1 Indicators on the ETSI cabinet.............................................................................................................2-3Table 2-2 Connection of power terminals at side A and side B...........................................................................2-4Table 2-3 Technical specifications of the ETSI cabinet.......................................................................................2-5Table 3-1 Mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN1500A....................................................................................................................................................................3-7Table 3-2 Mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN1500B....................................................................................................................................................................3-7Table 3-3 Boards and their valid slots for the OptiX OSN 1500A.......................................................................3-8Table 3-4 Boards and their valid slots for the OptiX OSN 1500B.....................................................................3-12Table 3-5 Technical specifications of the OptiX OSN 1500A subrack..............................................................3-17Table 3-6 Maximum power consumption of the OptiX OSN 1500A subrack...................................................3-17Table 3-7 Technical specifications of the OptiX OSN 1500B subrack..............................................................3-18Table 3-8 Maximum power consumption of the OptiX OSN 1500B subrack...................................................3-18Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500........................................................4-2Table 4-2 SDH processing boards for the OptiX OSN 1500A.............................................................................4-4Table 4-3 SDH processing boards for the OptiX OSN 1500B.............................................................................4-5Table 4-4 PDH processing boards for the OptiX OSN 1500A.............................................................................4-7Table 4-5 PDH processing boards for the OptiX OSN 1500B.............................................................................4-7Table 4-6 Data processing boards for the OptiX OSN 1500A.............................................................................4-8Table 4-7 Data processing boards for the OptiX OSN 1500B.............................................................................4-8Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A.....................................4-9Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B......................................4-9Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B.............................................................................................................................................................................4-10Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B......................4-10Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A..................................4-11Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B..................................4-11Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiX OSN 1500A/B.............................................................................................................................................................................4-12Table 5-1 Version Description of the SL1............................................................................................................5-3Table 5-2 Functions and features of the SL1........................................................................................................5-4Table 5-3 Optical interfaces of the SL1................................................................................................................5-8Table 5-4 Relation between the board feature code and the optical interface type..............................................5-9Table 5-5 Specifications of the optical interfaces of the SL1.............................................................................5-10

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Tables

Issue 02 (2007-09-10) Huawei Technologies Proprietary xxvii

Table 5-6 Version Description of the SLQ1.......................................................................................................5-12Table 5-7 Functions and features of the SLQ1...................................................................................................5-12Table 5-8 Optical interfaces of the SLQ1...........................................................................................................5-16Table 5-9 Relation between the board feature code and the optical interface type............................................5-17Table 5-10 Specifications of the optical interfaces of the SLQ1........................................................................5-18Table 5-11 Functions and features of the SLO1 board.......................................................................................5-20Table 5-12 Optical interfaces of the SLO1.........................................................................................................5-23Table 5-13 Relation between the board feature code and the optical interface type..........................................5-24Table 5-14 Specifications of the optical interfaces of the SLO1........................................................................5-25Table 5-15 Functions and features of the SLT1.................................................................................................5-26Table 5-16 Optical interfaces of the SLT1.........................................................................................................5-30Table 5-17 Specifications of the optical interfaces of the SLT1........................................................................5-31Table 5-18 Functions and features of the SEP1.................................................................................................5-33Table 5-19 Access capabilities for the SEP1......................................................................................................5-34Table 5-20 Electrical interfaces of the SEP1......................................................................................................5-39Table 5-21 Slots for the SEP1, EU08 and TSB8................................................................................................5-40Table 5-22 Technical specifications of the SEP1 board.....................................................................................5-41Table 5-23 Version Description of the SL4........................................................................................................5-42Table 5-24 Functions and features of the SL4....................................................................................................5-42Table 5-25 Optical interfaces of the SL4............................................................................................................5-47Table 5-26 Relation between the board feature code and the optical interface type of the SL4........................5-47Table 5-27 Specifications of the optical interfaces of the SL4...........................................................................5-48Table 5-28 Version Description of the SLD4.....................................................................................................5-50Table 5-29 Functions and features of the SLD4.................................................................................................5-50Table 5-30 Optical interfaces of the SLD4.........................................................................................................5-55Table 5-31 Relation between the board feature code and the optical interface type of the SLD4.....................5-56Table 5-32 Specifications of the optical interfaces of the SLD4........................................................................5-56Table 5-33 Version Description of the SLQ4.....................................................................................................5-58Table 5-34 Functions and features of the SLQ4.................................................................................................5-59Table 5-35 Optical interfaces of the SLQ4.........................................................................................................5-62Table 5-36 Relation between the board feature code and the optical interface type of the SLQ4.....................5-63Table 5-37 Specifications of the optical interfaces of the SLQ4........................................................................5-64Table 5-38 Version Description of the SL16......................................................................................................5-65Table 5-39 Functions and features of the SL16..................................................................................................5-66Table 5-40 Optical interfaces of the SL16..........................................................................................................5-70Table 5-41 Relation between the board feature code and the optical interface type for the SL16.....................5-70Table 5-42 Specifications of the optical interfaces of the SL16.........................................................................5-71Table 5-43 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths.............................................................................................................................................................................5-72Table 5-44 Version Description of the SL16A...................................................................................................5-73Table 5-45 Functions and features of the SL16A...............................................................................................5-74Table 5-46 Optical interfaces of the SL16A.......................................................................................................5-78Table 5-47 Relation between the board feature code and the optical interface type..........................................5-79

TablesOptiX OSN 1500 Intelligent Optical Transmission System


xxviii Huawei Technologies Proprietary Issue 02 (2007-09-10)

Table 5-48 Specifications of the optical interfaces of the SL16A......................................................................5-79Table 5-49 Functions and features of the SF16..................................................................................................5-81Table 5-50 Optical interfaces of the SF16..........................................................................................................5-86Table 5-51 Specifications of the optical interfaces of the SF16.........................................................................5-87Table 5-52 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths.............................................................................................................................................................................5-87Table 6-1 Functions and features of the PL1........................................................................................................6-3Table 6-2 Interfaces on the front panel of the PL1...............................................................................................6-7Table 6-3 Relation between the board feature code and the optical interface type of the PL1............................6-7Table 6-4 Specifications of the electrical interfaces of the PL1...........................................................................6-8Table 6-5 Version Description of the PD1...........................................................................................................6-9Table 6-6 Functions and features of the PD1.......................................................................................................6-9Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiX OSN 1500A subrack.............................................................................................................................................................................6-14Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-14Table 6-9 Relation between the board feature code and the interface impedance type.....................................6-15Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B subrack.......6-17Table 6-11 Version Description of the PQ1.......................................................................................................6-18Table 6-12 Functions and features of the PQ1...................................................................................................6-19Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in the OptiX OSN 1500Bsubrack................................................................................................................................................................6-24Table 6-14 Relation between the board feature code and the interface impedance type...................................6-24Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B subrack.......6-25Table 6-16 Functions and features of the PQM..................................................................................................6-27Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiX OSN 1500Bsubrack................................................................................................................................................................6-32Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-33Table 6-19 Version description of the PL3........................................................................................................6-35Table 6-20 Functions and features of the PL3....................................................................................................6-36Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-40Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack........6-41Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-42Table 6-24 Version description of the PL3A......................................................................................................6-44Table 6-25 Functions and features of the PL3A.................................................................................................6-44Table 6-26 Specifications of the electrical interfaces of the PL3A....................................................................6-48Table 6-27 Version Description of the PD3.......................................................................................................6-50Table 6-28 Functions and features of the PD3...................................................................................................6-50Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-55Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack.......6-56Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-56


Issue 02 (2007-09-10) Huawei Technologies Proprietary xxix

Table 6-32 Functions and features of the PQ3...................................................................................................6-58Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-62Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack.......6-63Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-63Table 6-36 Functions and features of the DX1...................................................................................................6-65Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-68Table 6-38 Relation between the board feature code and the interface impedance type...................................6-69Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack....................................................6-70Table 6-40 Functions and features of the DXA..................................................................................................6-72Table 6-41 Version Description of the SPQ4.....................................................................................................6-76Table 6-42 Functions and features of the SPQ4.................................................................................................6-76Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN 1500B subrack.............................................................................................................................................................................6-82Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack.......................................6-83Table 7-1 Functions and features of the EFT4.....................................................................................................7-3Table 7-2 Optical interfaces of the EFT4.............................................................................................................7-7Table 7-3 Pins of the RJ-45 of the EFT4..............................................................................................................7-8Table 7-4 Functions and features of the EFT8.....................................................................................................7-9Table 7-5 Optical interfaces of the EFT8...........................................................................................................7-14Table 7-6 Pins of the RJ-45 of the EFT8............................................................................................................7-14Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A.............................................................................................................................................................................7-15Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B.............................................................................................................................................................................7-15Table 7-9 Functions and features of the EFT8A................................................................................................7-16Table 7-10 Optical interfaces of the EFT8A......................................................................................................7-21Table 7-11 Pins of the RJ-45 of the EFT8A.......................................................................................................7-21Table 7-12 Functions and features of the EGT2.................................................................................................7-23Table 7-13 Optical interfaces of the EGT2.........................................................................................................7-27Table 7-14 Relation between the board feature code and the optical interface type..........................................7-27Table 7-15 Specifications of the optical interfaces of the EGT2........................................................................7-28Table 7-16 Version Description of the EFS0.....................................................................................................7-30Table 7-17 Functions and features of the EFS0.................................................................................................7-30Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500Bsubrack................................................................................................................................................................7-36Table 7-19 Version Description of the EFS4.....................................................................................................7-38Table 7-20 Functions and features of the EFS4.................................................................................................7-39Table 7-21 Optical interfaces of the EFS4.........................................................................................................7-44Table 7-22 Pins of the RJ-45 of the EFS4..........................................................................................................7-44Table 7-23 Version Description of the EGS2.....................................................................................................7-46Table 7-24 Functions and features of the EGS2.................................................................................................7-47Table 7-25 Optical interfaces of the EGS2.........................................................................................................7-53



xxx Huawei Technologies Proprietary Issue 02 (2007-09-10)

Table 7-26 Relation between the board feature code and the optical interface type..........................................7-53Table 7-27 Specifications of the optical interfaces of the EGS2........................................................................7-54Table 7-28 Functions and features of the EMS4................................................................................................7-55Table 7-29 Optical interfaces of the EMS4........................................................................................................7-62Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500Asubrack................................................................................................................................................................7-62Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500Bsubrack................................................................................................................................................................7-62Table 7-32 Relation between the board feature code and the optical interface type..........................................7-63Table 7-33 Specifications of the optical interfaces of the EMS4.......................................................................7-66Table 7-34 Functions and features of the EGS4.................................................................................................7-68Table 7-35 Optical interfaces of the EGS4.........................................................................................................7-74Table 7-36 Relation between the board feature code and the optical interface type..........................................7-74Table 7-37 Specifications of the optical interfaces of the EGS4........................................................................7-78Table 7-38 Functions and features of the EGR2................................................................................................7-79Table 7-39 Optical interfaces of the EGR2 .......................................................................................................7-86Table 7-40 Relation between the board feature code and the optical interface type..........................................7-86Table 7-41 Specifications of the interfaces of the EGR2...................................................................................7-87Table 7-42 Version description of the EMR0....................................................................................................7-88Table 7-43 Comparison of features of the N1EMR0 and N2EMR0..................................................................7-88Table 7-44 Functions and features of the EMR0................................................................................................7-89Table 7-45 Optical interfaces of the EMR0 .......................................................................................................7-97Table 7-46 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500Asubrack................................................................................................................................................................7-97Table 7-47 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500Bsubrack................................................................................................................................................................7-97Table 7-48 Relation between the board feature code and the optical interface type..........................................7-98Table 7-49 Specifications of the optical interfaces of the EMR0.......................................................................7-98Table 7-50 Functions and features of the ADL4..............................................................................................7-100Table 7-51 Optical interface of the ADL4 .......................................................................................................7-104Table 7-52 Relation between the board feature code and the optical interface type........................................7-104Table 7-53 Specifications of the optical interfaces of the ADL4.....................................................................7-105Table 7-54 Functions and features of the ADQ1..............................................................................................7-107Table 7-55 Optical interfaces of the ADQ1 .....................................................................................................7-111Table 7-56 Relation between the board feature code and the optical interface type........................................7-111Table 7-57 Specifications of the optical interfaces of the ADQ1.....................................................................7-112Table 7-58 Functions and features of the IDL4................................................................................................7-114Table 7-59 Optical interface of the IDL4 ........................................................................................................7-118Table 7-60 Relation between the board feature code and the optical interface type........................................7-118Table 7-61 Specifications of the optical interfaces of the IDL4.......................................................................7-119Table 7-62 Functions and features of the IDQ1...............................................................................................7-121Table 7-63 Optical interfaces of the IDQ1 ......................................................................................................7-126Table 7-64 Relation between the board feature code and the optical interface type........................................7-126


Issue 02 (2007-09-10) Huawei Technologies Proprietary xxxi

Table 7-65 Specifications of the optical interfaces of the IDQ1......................................................................7-127Table 7-66 Functions and features of the MST4..............................................................................................7-129Table 7-67 Services and service rates provided by the MST4.........................................................................7-129Table 7-68 Optical interfaces of the MST4......................................................................................................7-133Table 7-69 Relation between the board feature code and service type............................................................7-133Table 7-70 Specifications of the optical interfaces of the MST4.....................................................................7-134Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500A subrack...............................................................................................................................................................................8-5Table 8-2 Interfaces on the front panel of the D12B............................................................................................8-7Table 8-3 Pins of the DB44 interfaces of the D12B.............................................................................................8-8Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN 1500B subrack...............................................................................................................................................................................8-8Table 8-5 Interfaces on the front panel of the D12S..........................................................................................8-11Table 8-6 Pins of the DB44 interfaces of the D12S...........................................................................................8-12Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN 1500B subrack.............................................................................................................................................................................8-12Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S...........................................................8-15Table 8-9 Interfaces on the front panel of the D75S..........................................................................................8-18Table 8-10 Pins of the DB44 interfaces of the D75S.........................................................................................8-19Table 8-11 Valid slots for the PQ1/PQM and corresponding slots for the D75S in the OptiX OSN 1500B subrack.............................................................................................................................................................................8-19Table 8-12 Interfaces of the D34S......................................................................................................................8-22Table 8-13 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack.............................................................................................................................................................................8-23Table 8-14 Specifications of the electrical interfaces of the D34S....................................................................8-23Table 8-15 Interfaces of the C34S......................................................................................................................8-26Table 8-16 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack.............................................................................................................................................................................8-26Table 8-17 Specifications of the electrical interfaces of the C34S.....................................................................8-26Table 8-18 Interfaces of the EU04.....................................................................................................................8-29Table 8-19 Valid slots for the SEP and corresponding slots for the EU04........................................................8-30Table 8-20 Specifications of the electrical interfaces of the EU04....................................................................8-30Table 8-21 Interfaces of the EU08.....................................................................................................................8-33Table 8-22 Valid slots for the SEP and corresponding slots for the EU08........................................................8-33Table 8-23 Specifications of the electrical interfaces of the EU08....................................................................8-33Table 8-24 Version description of the OU08.....................................................................................................8-34Table 8-25 Interfaces of the N1OU08................................................................................................................8-37Table 8-26 Interfaces of the N2OU08................................................................................................................8-38Table 8-27 Valid slots for the SEP and corresponding slots for the OU08........................................................8-38Table 8-28 Specifications of the optical interfaces of the OU08........................................................................8-38Table 8-29 Interfaces of the MU04....................................................................................................................8-41Table 8-30 Valid slots for the SPQ4 and corresponding slots for the MU04.....................................................8-42Table 8-31 Specifications of the electrical interfaces of the MU04...................................................................8-42Table 8-32 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04....................................8-45



xxxii Huawei Technologies Proprietary Issue 02 (2007-09-10)

Table 8-33 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S.......................................8-45Table 8-34 Valid slots for the TSB8 and corresponding slots for the SEP and EU04.......................................8-45Table 8-35 Valid slots for the TSB8 and corresponding slots for the SEP and EU08.......................................8-45Table 8-36 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.....................................8-46Table 8-37 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S........................................8-46Table 8-38 Interfaces of the EFF8......................................................................................................................8-49Table 8-39 Valid slots for the EFT8 and corresponding slots for the EFF8......................................................8-49Table 8-40 Valid slots for the EFS0 and corresponding slots for the EFF8.......................................................8-49Table 8-41 Valid slots for the EMS4 and corresponding slots for the EFF8.....................................................8-49Table 8-42 Valid slots for the EMR0 and corresponding slots for the EFF8.....................................................8-50Table 8-43 Specifications of the optical interfaces of the EFF8........................................................................8-50Table 8-44 Interfaces of the ETF8......................................................................................................................8-53Table 8-45 Pins of the RJ-45 connector of the ETF8.........................................................................................8-54Table 8-46 Valid slots for the EFT8 and corresponding slots for the ETF8......................................................8-54Table 8-47 Valid slots for the EFS0 and corresponding slots for the ETF8......................................................8-55Table 8-48 Valid slots for the EMS4 and corresponding slots for the ETF8.....................................................8-55Table 8-49 Valid slots for the EMR0 and corresponding slots for the ETF8.....................................................8-55Table 8-50 Specifications of the electrical interfaces of the ETF8....................................................................8-55Table 8-51 Interfaces of the ETS8......................................................................................................................8-58Table 8-52 Pins of the RJ-45 connector of the ETS8.........................................................................................8-59Table 8-53 Valid slots for the EFS0 and corresponding slots for the ETS8......................................................8-59Table 8-54 Specifications of the electrical interfaces of the ETS8....................................................................8-59Table 8-55 Interfaces on the front panel of the DM12.......................................................................................8-62Table 8-56 Pins of the DB44 interfaces of the DM12........................................................................................8-63Table 8-57 Pins of the DB28 interfaces of the DM12........................................................................................8-64Table 8-58 Valid slots for the DX1 and corresponding slots for the DM12......................................................8-64Table 9-1 Function and feature of the SDH processing unit of the CXL1...........................................................9-3Table 9-2 Function and feature of the SCC unit of the CXL1.............................................................................9-3Table 9-3 Function and feature of the cross-connect unit of the CXL1...............................................................9-4Table 9-4 Function and feature of the clock unit of the CXL1............................................................................9-5Table 9-5 Optical interface and switches on the CXL1......................................................................................9-11Table 9-6 Relation between the board feature code and the optical interface type............................................9-11Table 9-7 Logical slots displayed on the T2000 for the CXL1..........................................................................9-12Table 9-8 Specifications of the optical interfaces of the CXL1.........................................................................9-12Table 9-9 Function and feature of the SDH processing unit of the CXL4.........................................................9-14Table 9-10 Function and feature of the SCC unit of the CXL4.........................................................................9-15Table 9-11 Function and feature of the cross-connect unit of the CXL4...........................................................9-16Table 9-12 Function and feature of the clock unit of the CXL4........................................................................9-16Table 9-13 Optical interface and switches on the CXL4....................................................................................9-22Table 9-14 Relation between the board feature code and the optical interface type..........................................9-22Table 9-15 Logical slots displayed on the T2000 for the CXL4........................................................................9-23Table 9-16 Specifications of the optical interfaces of the CXL4.......................................................................9-23


Issue 02 (2007-09-10) Huawei Technologies Proprietary xxxiii

Table 9-17 Function and feature of the SDH processing unit of the CXL16.....................................................9-25Table 9-18 Function and feature of the SCC unit of the CXL16.......................................................................9-26Table 9-19 Function and feature of the cross-connect unit of the CXL16.........................................................9-27Table 9-20 Function and feature of the clock unit of the CXL16......................................................................9-27Table 9-21 Optical interface and switches on the CXL16..................................................................................9-33Table 9-22 Relation between the board feature code and the optical interface type..........................................9-33Table 9-23 Logical slots displayed on the T2000 for the CXL16......................................................................9-34Table 9-24 Specifications of the optical interfaces of the CXL16.....................................................................9-34Table 10-1 Functions and features of the EOW.................................................................................................10-2Table 10-2 Interfaces on the front panel of the EOW........................................................................................10-4Table 10-3 Pins of the PHONE interface of the EOW.......................................................................................10-5Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW......................................................................10-5Table 10-5 Functions and features of the AUX..................................................................................................10-7Table 10-6 Interfaces on the front panel of the AUX.......................................................................................10-12Table 10-7 Pins of the CLK interface of the AUX...........................................................................................10-13Table 10-8 Pins of the ETH and COM interfaces of the AUX.........................................................................10-13Table 10-9 Pins of the ALM interface of the AUX..........................................................................................10-13Table 10-10 Pins of the OAM interface of the AUX.......................................................................................10-14Table 10-11 Pins of the F&f interface of the AUX..........................................................................................10-14Table 10-12 Functions and features of the AMU.............................................................................................10-16Table 10-13 Interfaces on the front panel of the AMU....................................................................................10-18Table 10-14 Pins of the PHONE interface of the AMU...................................................................................10-19Table 10-15 Pins of the S1 and S2 interfaces of the AMU..............................................................................10-19Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU.............................................................10-19Table 10-17 Functions and features of the FAN..............................................................................................10-21Table 11-1 Functions and features of the CMR2...............................................................................................11-3Table 11-2 Optical interfaces of the CMR2.......................................................................................................11-7Table 11-3 Feature code of the CMR2...............................................................................................................11-7Table 11-4 Specifications of the optical interfaces of the CMR2......................................................................11-8Table 11-5 Functions and features of the CMR4.............................................................................................11-10Table 11-6 Optical interfaces of the CMR4.....................................................................................................11-13Table 11-7 Feature code of the CMR4.............................................................................................................11-13Table 11-8 Specifications of the optical interfaces of the CMR4....................................................................11-14Table 11-9 Functions and features of the MR2................................................................................................11-16Table 11-10 Optical interfaces of the MR2......................................................................................................11-19Table 11-11 Feature code of the MR2..............................................................................................................11-19Table 11-12 Specifications of the optical interfaces of the MR2.....................................................................11-20Table 11-13 Functions and features of the MR2A...........................................................................................11-22Table 11-14 Optical interfaces of the MR2A...................................................................................................11-25Table 11-15 Specifications of the optical interfaces of the MR2A..................................................................11-25Table 11-16 Functions and features of the MR2B...........................................................................................11-27Table 11-17 Optical interfaces of the MR2B...................................................................................................11-30



xxxiv Huawei Technologies Proprietary Issue 02 (2007-09-10)

Table 11-18 Specifications of the optical interfaces of the MR2B..................................................................11-30Table 11-19 Functions and features of the MR2C...........................................................................................11-32Table 11-20 Optical interfaces of the MR2C...................................................................................................11-35Table 11-21 Specifications of the optical interfaces of the MR2C..................................................................11-36Table 11-22 Functions and features of the MR4..............................................................................................11-37Table 11-23 Optical interfaces of the MR4......................................................................................................11-41Table 11-24 Board feature code.......................................................................................................................11-41Table 11-25 Specifications of the optical interfaces of the MR4.....................................................................11-42Table 11-26 Functions and features of the LWX.............................................................................................11-44Table 11-27 Optical interfaces on the front panel of the LWX........................................................................11-48Table 11-28 Relation between the board feature code and the receive/transmit scheme.................................11-48Table 11-29 Specifications of the client-side optical interfaces of the LWX...................................................11-48Table 11-30 Specifications of the WDM-side optical interfaces of the LWX.................................................11-49Table 11-31 Functions and features of the OBU1............................................................................................11-52Table 11-32 Optical interfaces of the OBU1....................................................................................................11-55Table 11-33 Feature code of the OBU1............................................................................................................11-55Table 11-34 Specifications of optical interfaces of the OBU1.........................................................................11-56Table 11-35 Functions and features of the FIB................................................................................................11-58Table 11-36 Optical interfaces of the FIB .......................................................................................................11-59Table 11-37 Specifications of the optical interfaces of the FIB.......................................................................11-60Table 12-1 Functions and features of the BA2...................................................................................................12-3Table 12-2 Optical interfaces of the BA2 ..........................................................................................................12-7Table 12-3 Relation between the board feature code and output optical power for the BA2............................12-7Table 12-4 Specifications of the optical interfaces of the BA2..........................................................................12-8Table 12-5 Functions and features of the BPA...................................................................................................12-9Table 12-6 Optical interfaces of the BPA .......................................................................................................12-13Table 12-7 Relation between the board feature code and output optical power for the BPA..........................12-13Table 12-8 Specifications of the optical interfaces of the BPA........................................................................12-14Table 12-9 Version Description of the COA....................................................................................................12-15Table 12-10 Functions and features of the 61COA and N1COA.....................................................................12-16Table 12-11 Functions and features of the 62COA..........................................................................................12-18Table 12-12 Pins of the RS232 interface..........................................................................................................12-22Table 12-13 Pins of the MONITOR-1 and MONITOR-2 interfaces...............................................................12-22Table 12-14 Pins of the RJ-45 connector of the 62COA..................................................................................12-23Table 12-15 Relation between the board feature code and output optical power for the 61COA...................12-24Table 12-16 Specifications of the optical interfaces of the COA.....................................................................12-24Table 13-1 Functions and features of the UPM..................................................................................................13-3Table 13-2 Interfaces on the rear panel of the UPM..........................................................................................13-5Table 13-3 Pins of the RS232 interface of the UPM..........................................................................................13-5Table 13-4 Specifications of the power supply of the UPM..............................................................................13-6Table 13-5 Functions and features of the PIU....................................................................................................13-8Table 13-6 Interfaces on the front panel of the PIU.........................................................................................13-10


Issue 02 (2007-09-10) Huawei Technologies Proprietary xxxv

Table 13-7 Functions and features of the PIUA...............................................................................................13-12Table 13-8 Interfaces and switch on the front panel of the PIUA....................................................................13-14Table 14-1 Types of fiber jumpers.....................................................................................................................14-2Table 14-2 Types of connectors.........................................................................................................................14-3Table 14-3 Equipment –48 V/–60 V power cable..............................................................................................14-8Table 14-4 Connection of the UPM power cable...............................................................................................14-9Table 14-5 Specifications of the UPM power cable.........................................................................................14-10Table 14-6 Pin assignment of the alarm input/output cable.............................................................................14-11Table 14-7 Pin assignment of the OAM serial port cable................................................................................14-13Table 14-8 Pin assignment of the Serial 1–4/F1/F&f serial port cable............................................................14-15Table 14-9 Pin assignment of the RS232/RS-422 serial port cable.................................................................14-16Table 14-10 Pin assignment of the ordinary telephone wire............................................................................14-17Table 14-11 Pin assignment of the COA concatenating cable.........................................................................14-18Table 14-12 Pin assignment of the straight through cable...............................................................................14-19Table 14-13 Pin assignment of the crossover cable.........................................................................................14-20Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable.................................................................................14-22Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable...............................................................................14-24Table 14-16 Pin assignment of the 120-ohm E1 cable.....................................................................................14-27Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable.............................................................................14-28Table 14-18 Pin assignment of the DB28 connector of the DM12..................................................................14-31Table 14-19 Pin assignment of the V.35 DCE cable........................................................................................14-33Table 14-20 Pin assignment of the V.35 DTE cable........................................................................................14-35Table 14-21 Pin assignment of the V.24 DCE cable........................................................................................14-36Table 14-22 Technical specifications of the V.24 DCE cable..........................................................................14-37Table 14-23 Pin assignment of the V.24 DTE cable........................................................................................14-38Table 14-24 Technical specifications of the V.24 DTE cable..........................................................................14-38Table 14-25 Pin assignment of the X.21 DCE cable........................................................................................14-39Table 14-26 Technical specifications of the X.21 DCE cable..........................................................................14-40Table 14-27 Pin assignment of the X.21 DTE cable........................................................................................14-41Table 14-28 Technical specifications of the X.12 DTE cable..........................................................................14-41Table 14-29 Pin assignment of the RS449 DCE cable.....................................................................................14-42Table 14-30 Specifications of the RS449 DCE cable.......................................................................................14-43Table 14-31 Pin assignment of the RS449 DTE cable.....................................................................................14-43Table 14-32 Specifications of the RS449 DTE cable.......................................................................................14-44Table 14-33 Pin assignment of the RS530 DCE cable.....................................................................................14-45Table 14-34 Specifications of the RS530 DCE cable.......................................................................................14-46Table 14-35 Pin assignment of the RS530 DTE cable.....................................................................................14-47Table 14-36 Specifications of the RS530 DTE cable.......................................................................................14-48Table 14-37 Pin assignment of the 120-ohm clock cable.................................................................................14-49Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms)........................14-51Table B-1 Labels on the equipment.....................................................................................................................B-2Table B-2 Optical module code and type mapping table.....................................................................................B-5



xxxvi Huawei Technologies Proprietary Issue 02 (2007-09-10)

Table B-3 Huawei specifications for engineering labels.....................................................................................B-7Table C-1 Power consumption and weight of each board for the OptiX OSN 1500..........................................C-1Table D-1 Board versions that are compatible with the OptiX OSN products....................................................D-1Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment...........................................................E-1Table E-2 Loopbacks of the PDH boards for the OptiX OSN equipment...........................................................E-2Table E-3 Loopbacks of the Ethernet boards for the OptiX OSN equipment.....................................................E-3Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment.....................................................E-4Table F-1 Mapping relation between the service type and setting of the C2.......................................................F-2Table F-2 Mapping relation between the service type and setting of the C2.......................................................F-3Table F-3 Mapping relation between the service type and setting of the V5.......................................................F-3Table F-4 Mapping relation between the service type and setting of the V5.......................................................F-6


Issue 02 (2007-09-10) Huawei Technologies Proprietary xxxvii

About This Document

OverviewThis document describes the equipment structure, subrack structure and board classification.This document also describes each board of different classes in details.

This document helps you get the detailed information on the equipment hardware.

Product VersionsThe following table lists the product versions related to this document.

Product Name Version

OptiX OSN 1500 V100R007

OptiX iManager T2000 V200R005C01

Intended AudienceThe intended audience of this document are:

l Network planners and designers

l Installation personnel

l Commissioning engineers

l Network monitors

l Data configuration engineers

l Maintenance engineers

l On-site maintenance engineers

OrganizationThis document describes the cabinet, subrack, boards and each unit of the boards in terms of thefunction and working principle.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description About This Document

Issue 02 (2007-09-10) Huawei Technologies Proprietary 1

Chapter Description

1 Equipment Structure This chapter describes the structure of the equipment.

2 Cabinet This chapter describes the dimensions, appearance andtechnical specifications of the cabinet. This chapter alsodescribes the configuration of the equipment in eachcabinet.

3 Subrack This chapter describes the structure of the subrack.

4 Board List andClassification

This chapter describes the classification of boards andappearance of the boards.

5 SDH Processing Boards This chapter describes the SDH processing boards in termsof the function, principle, front panel, interface andtechnical specifications.

6 PDH Processing Boards This chapter describes the PDH processing boards in termsof the function, principle, front panel, interface andtechnical specifications.

7 Data Processing Boards This chapter describes the data processing boards in termsof the function, principle, front panel, interface andtechnical specifications.

8 Interface Boards andSwitching Boards

This chapter describes the interface boards and switchingboards in terms of the function, principle, front panel,interface and technical specifications.

9 Cross-Connect and SystemControl Boards

This chapter describes the cross-connect and system controlboards in terms of the function, principle, front panel,interface and technical specifications.

10 Auxiliary Boards This chapter describes the auxiliary boards in terms of thefunction, principle, front panel, interface and technicalspecifications.

11 WDM Processing Boards This chapter describes the WDM processing boards interms of the function, principle, front panel, interface andtechnical specifications.

12 Optical Amplifier Boardsand DispersionCompensation Boards

This chapter describes the optical amplifier boards anddispersion compensation boards in terms of the function,principle, front panel, interface and technicalspecifications.

13 Power Interface Boards This chapter describes the power interface boards in termsof the function, principle, front panel, interface andtechnical specifications.

14 Cables This chapter describes the external cables and internalcables in terms of the structure, appearance, pin assignmentand technical specifications.

A Equipment and BoardAlarm Indicators

This appendix describes the indication of the equipment andboard alarm indicators.

About This DocumentOptiX OSN 1500 Intelligent Optical Transmission System


2 Huawei Technologies Proprietary Issue 02 (2007-09-10)

Chapter Description

B Labels This appendix describes the safety labels, optical modulelabels and engineering labels.

C Power Consumption andWeight

This appendix describes the power consumption and weightof each board.

D Board VersionConfiguration

This appendix describes the compatibility among theproduct versions.

E Board Loopbacks This appendix describes the loopback capabilities of theboards.

F Board ConfigurationReference

This appendix describes the parameters that can beconfigured by using the T2000.

G Glossary This appendix lists the terms used in this document.

H Acronyms andAbbreviations

This appendix lists the acronyms and abbreviations used inthis document.

Conventions

Symbol ConventionsThe following symbols may be found in this document. They are defined as follows.

Symbol Description

DANGERIndicates a hazard with a high level of risk which, if notavoided, will result in death or serious injury.

WARNINGIndicates a hazard with a medium or low level of risk which,if not avoided, could result in minor or moderate injury.

CAUTIONIndicates a potentially hazardous situation that, if notavoided, could cause equipment damage, data loss, andperformance degradation, or unexpected results.

TIP Indicates a tip that may help you solve a problem or saveyou time.

NOTE Provides additional information to emphasize orsupplement important points of the main text.

General ConventionsConvention Description

Times New Roman Normal paragraphs are in Times New Roman.



Convention Description

Boldface Names of files, directories, folders, and users are in boldface. Forexample, log in as user root.

Italic Book titles are in italics.

Courier New Terminal display is in Courier New.

Command ConventionsConvention Description

Boldface The keywords of a command line are in boldface.

Italic Command arguments are in italic.

[ ] Items (keywords or arguments) in square brackets [ ] are optional.

{ x | y | ... } Alternative items are grouped in braces and separated by vertical bars.One is selected.

[ x | y | ... ] Optional alternative items are grouped in square brackets andseparated by vertical bars. One or none is selected.

{ x | y | ... } * Alternative items are grouped in braces and separated by vertical bars.A minimum of one or a maximum of all can be selected.

GUI ConventionsConvention Description

Boldface Buttons, menus, parameters, tabs, window, and dialog titles are inboldface. For example, click OK.

> Multi-level menus are in boldface and separated by the “>” signs. Forexample, choose File > Create > Folder.

Keyboard OperationFormat Description

Key Press the key. For example, press Enter and press Tab.

Key 1+Key 2 Press the keys concurrently. For example, pressing Ctrl+Alt+A meansthe three keys should be pressed concurrently.

Key 1, Key 2 Press the keys in turn. For example, pressing Alt, A means the two keysshould be pressed in turn.




Mouse OperationAction Description

Click Select and release the primary mouse button without moving the pointer.

Double-click Press the primary mouse button twice continuously and quickly withoutmoving the pointer.

Drag Press and hold the primary mouse button and move the pointer to a certainposition.

Update HistoryUpdates between document versions are cumulative. Therefore, the latest document versioncontains all updates made to previous versions.

Updates in Issue 02 (2007-09-10) Based on Product Version V100R007

The updated contents are as follows.

This release of the document fixes several bugs, adds product labels, and checks the parametersof the dimensions and weight. It also details function block diagram and relative description foreach board.


This document of the V100R007 version is of the first release. Compared with the V100R006,this version has the following new or optimized content:l The N3SL16, N3SL16A, N2PQ3, N2PD3, N2PL3, N2PL3A, TN11OBU1, TN11MR2,

TN11MR4, TN11CMR2, TN11CMR4 are added.l Appendix E "Board Loopbacks" and Appendix F "Board Configuration Reference" are

added.l The structure of the board description is adjusted and optimized. First the board version is

described, and then the board function and feature, working principle and signal flow, frontpanel, valid slots, board feature code, board configuration reference, technicalspecifications and so on are described.



This release of the document fixes several bugs, adds product labels. It also checks the parametersof the slots and optical interfaces. In addition, it adds the description on the N1SL64 board.



This release of the document fixes several bugs in the document of previous version. The T2000is upgraded from V200R003C02 to V200R004C01.



Updates in Issue 01 (2006-09-20) Based on Product Version V100R006This document of the V100R006 version is of the first release.

Updates in Issue 03 (2006-11-20) Based on Product Version V100R005The updated contents are as follows.

With updated naming of versions, this release of the document fixes several bugs in the manualof the previous version.

Updates in Issue 02 (2006-06-20) Based on Product Version V100R005The former manual version is T2-042521-20060620-C-1.51.


This release of the document fixes several bugs in the manual of the previous version.

Updates in Issue 01 (2006-03-20) Based on Product Version V100R005The former manual version is T2-042521-20060320-C-1.50.

This document of the V100R005 version is of the first release.




1 Equipment Structure

The OptiX OSN 1500A and the OptiX OSN 1500B are both case-shaped equipment. The OptiXOSN 1500A/B subrack can be installed in a 300-mm or 600-mm ETSI cabinet, or a 19-inchcabinet. The OptiX OSN 1500A/B can also be installed against the wall. The OptiX OSN 1500Acan be installed on the desk.

Figure 1-1 shows the appearance of the OptiX OSN 1500A.

Figure 1-1 Appearance of the OptiX OSN 1500A

Figure 1-2 shows the appearance of the OptiX OSN 1500B.

Figure 1-2 Appearance of the OptiX OSN 1500B

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 1 Equipment Structure

Issue 02 (2007-09-10) Huawei Technologies Proprietary 1-1

2 Cabinet

About This Chapter

The OptiX OSN subracks are installed in the cabinets.

2.1 Cabinet TypeThe OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inchcabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrackcan be installed against the wall.

2.2 Cabinet ConfigurationOn the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit(PDU).

2.3 Technical SpecificationsThe specifications of the cabinet cover the dimensions, weight and number of allowed subracks.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 2 Cabinet


2.1 Cabinet TypeThe OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inchcabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrackcan be installed against the wall.

The OptiX OSN 1500 can be installed in the following cabinets:

l 300-mm deep ETSI cabinet

l 600-mm deep ETSI cabinet

l 19-inch cabinet

l Cabinet used for the access network equipment

2.2 Cabinet ConfigurationOn the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit(PDU).

Figure 2-1 shows where the cabinet indicators and the DC PDU are on the cabinet.

Figure 2-1 ETSI cabinet

1

2

PowerCritical MajorMinor

Power distribution unit

W

H

D

1. Cabinet indicator 2. DC PDU

2.2.1 Cabinet IndicatorThe indicators on the ETSI cabinet are power supply indicators and alarm severity indicators.

2.2.2 DC PDUThe DC PDU is on the top of the cabinet and used to supply power for the equipment.

2.2.3 Other Configuration

2 CabinetOptiX OSN 1500 Intelligent Optical Transmission System


2-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)

The external case-shaped devices can be installed in the cabinet as required.

2.2.1 Cabinet IndicatorThe indicators on the ETSI cabinet are power supply indicators and alarm severity indicators.

Table 2-1 lists the information about the indicators on the ETSI cabinet.

Table 2-1 Indicators on the ETSI cabinet

Indicator State Indication

Normal power supply indicator: Power(green)

Lit The power is suppliedto the equipment.

Unlit No power is supplied tothe equipment.

Critical alarm indicator: Critical (red) Lit Critical alarms aregenerated in theequipment.

Unlit No critical alarms aregenerated in theequipment.

Major alarm indicator: Major (orange) Lit Major alarms aregenerated in theequipment.

Unlit No major alarms aregenerated in theequipment.

Minor alarm indicator: Minor (yellow) Lit Minor alarms aregenerated in theequipment.

Unlit No minor alarms aregenerated in theequipment.

CAUTIONThe cabinet indicators are driven by the subrack. The cabinet indicators can be lit only after thecables are correctly connected and the subrack is powered on.

2.2.2 DC PDUThe DC PDU is on the top of the cabinet and used to supply power for the equipment.

Figure 2-2 shows the appearance of the DC PDU.



Figure 2-2 Appearance of the DC PDU

NEG2(-)

INPUT

RTN2(+)RTN1(+) NEG1(-)

2 3 4 5

ON

OFF20A32A 32A 20A

ON

OFF

1 2 3 4

1 6

1 2 3 4

20A32A 32A 20A

OUTPUT OUTPUTA B

7 8

1. Power terminal (A) 2. Power cable RTN1 (+)3. Power cable RTN2 (+) 4. Power cable NEG1 (–)5. Power cable NEG2 (–) 6. Power terminal (B)7. PGND 8. Power switch

For the OptiX OSN 1500A, the power terminals at side A and side B supply power to the PIUboards at side A and side B of the subrack respectively. Table 2-2 shows the connections of thepower terminals at side A and side B.

For the OptiX OSN 1500B, the power terminals at sides A and B supply power to the PIU boardsat the upper and lower subrack respectively.

Table 2-2 Connection of power terminals at side A and side B

PowerTerminal atSide A

Corresponding Subrackand PIU Board

PowerTerminalat Side B

Corresponding Subrackand PIU Board

1 The PIU board at side A ofthe first subrack

1 The PIU board at side B ofthe first subrack

2 The PIU board at side A ofthe second subrack

2 The PIU board at side B ofthe second subrack

3 The PIU board at side A ofthe third subrack

3 The PIU board at side B ofthe third subrack

4 The PIU board at side A ofthe fourth subrack

4 The PIU board at side B ofthe fourth subrack

2.2.3 Other ConfigurationThe external case-shaped devices can be installed in the cabinet as required.l UPM

The UPM numbered GIE4805S can directly supply power to the OptiX OSN 1500. The UPMdirectly converts the 220 V mains supply to the –48 V DC power supply required by the

2 CabinetOptiX OSN 1500 Intelligent Optical Transmission System



communication equipment. If operators cannot provide the –48 V DC power supply for theequipment or require that the battery be used, the UPM can be applied.

l COA

l Fiber management spool, which is used to spool the redundant fibers inside the cabinet.

2.3 Technical SpecificationsThe specifications of the cabinet cover the dimensions, weight and number of allowed subracks.

Table 2-3 lists the technical specifications of the ETSI cabinet.

Table 2-3 Technical specifications of the ETSI cabinet

Dimensions (mm) Weight (kg) Number of Allowed OptiXOSN 1500A/1500B Subracks

600 (W) x 300 (D) x 2000 (H) 55 The number of allowed OptiXOSN 1500A/1500B subracksvaries with the cabinet capacityand the number of the powersupplies.

600 (W) x 600 (D) x 2000 (H) 79

600 (W) x 300 (D) x 2200 (H) 60

600 (W) x 600 (D) x 2200 (H) 84

600 (W) x 300 (D) x 2600 (H) 70

600 (W) x 600 (D) x 2600 (H) 94



3 Subrack

About This Chapter

This chapter describes the cabinet in terms of the structure, capacity, slot allocation and technicalspecifications.

3.1 StructureThe OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot areafor boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrackis of a two-layer structure. The subrack consists of the slot area for processing boards, slot areafor interface boards, slot area for the auxiliary interface board, power supply area and fan area.

3.2 CapacityBoth the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into half-width slots. These slots have different service access capacities before and after the slot division.

3.3 Slot AllocationThe OptiX OSN 1500A subrack has only one tier, where 12 slots are present before the divisionof slots. The OptiX OSN 1500B subrack has two tiers. The upper tier of the subrack, where fourslots are present, is the slot area for interface boards. The lower tier of the subrack, where tenslots are present before the division of slots (including slots 4 and 5), is the slot area for processingboards.

3.4 Technical SpecificationsThe specifications of the subrack cover dimensions, weight and maximum power consumption.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 3 Subrack


3.1 StructureThe OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot areafor boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrackis of a two-layer structure. The subrack consists of the slot area for processing boards, slot areafor interface boards, slot area for the auxiliary interface board, power supply area and fan area.

Figure 3-1 shows the structure of the OptiX OSN 1500A subrack.

Figure 3-1 Structure of the OptiX OSN 1500A subrack

1

2

4

5

6

3

W

H

D

1. Fan area 2. Slot area for boards 3. Power supply area4. Slot area for interface boards 5. Fiber routing area 6. Mounting ear

The functions of these areas are as follows:

l Slot area for boards: This area is used to house the boards for the OptiX OSN 1500A.

l Fan area: This area is used to house one fan module, which dissipates heat generated bythe equipment.

l Power supply area: This area is used to house two PIU boards, which are used to supplypower for the equipment.

l Fiber routing area: This area is used to route fibers and cables in the subrack.

Figure 3-2 shows the structure of the OptiX OSN 1500B subrack.

3 SubrackOptiX OSN 1500 Intelligent Optical Transmission System



Figure 3-2 Structure of the OptiX OSN 1500B subrack

3

4

5

6

7

1

2

4

W

H

D

1. Slot area for interface boards 2. Power supply area 3. Fan area4. Slot area for processing boards 5. Slot area for the auxiliary interface board 6. Fiber routing area7. Mounting ear

The functions of these areas are as follows:

l Slot area for interface boards: This area is used to house the tributary interface boards andEthernet interface boards for the OptiX OSN 1500B.

l Slot area for processing boards: This area is used to house the line, tributary and Ethernetprocessing boards for the OptiX OSN 1500B.

l Fan area: This area is used to house one fan module, which dissipates heat generated bythe equipment.

l Slot area for the auxiliary interface board: This area is used to house the auxiliary interfaceboard, which provides alarm interfaces, orderwire phone interface, management andmaintenance interface, and clock interface.

l Power supply area: This area is used to house two PIU boards, which are used to supplypower for the equipment.

l Fiber routing area: This area is used to route fibers and cables in the subrack.

3.2 CapacityBoth the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into half-width slots. These slots have different service access capacities before and after the slot division.

In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots. In theOptiX OSN 1500B subrack, slots 11–13 can be divided into half-width slots. Figure 3-3 shows



the slot access capacity of the OptiX OSN 1500A. Figure 3-4 shows the slot access capacity ofthe OptiX OSN 1500B.

In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots.

l When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12.


l When slots 12 and 13 are not divided, the access capacity of each slot is 2.5 Gbit/s.

l When slots 12 and 13 are divided, the access capacity of each half-width slot is 1.25 Gbit/s.

In the OptiX OSN 1500B subrack, slots 11–13 can be divided into half-width slots.




l When slots 11–13 are not divided, the access capacity of each slot is 2.5 Gbit/s.

l When slots 11–13 are divided, the access capacity of each half-width slot is 1.25 Gbit/s.

Figure 3-3 Slot access capacity of the OptiX OSN 1500A

XCS A XCS B

Slot20

Slot 1 Slot 11 Slot 6

Slot 2/12 Slot 7

Slot 3/13 Slot 8

Slot 4 Slot 9

Slot 5 Slot 102.5Gbit/s

2.5Gbit/s

2.5Gbit/s

2.5Gbit/s

1.25Gbit/s

1.25Gbit/s

1.25Gbit/s

1.25Gbit/s

PIU PIU

FAN

AUX

Figure 3-4 Slot access capacity of the OptiX OSN 1500B

Slot 14 Slot 18 PIU

Slot 15

Slot 16

Slot 17

Slot 20

FAN

Slot 1/11

Slot 2/12

Slot 3/13

Slot 4

Slot 19 PIU

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10 AUX Slot 5

2.5Gbit/s

2.5Gbit/s

2.5Gbit/s

2.5Gbit/s

2.5Gbit/s

622Mbit/s

622Mbit/s

622Mbit/s

622Mbit/s

3.3 Slot AllocationThe OptiX OSN 1500A subrack has only one tier, where 12 slots are present before the divisionof slots. The OptiX OSN 1500B subrack has two tiers. The upper tier of the subrack, where four




slots are present, is the slot area for interface boards. The lower tier of the subrack, where tenslots are present before the division of slots (including slots 4 and 5), is the slot area for processingboards.

Figure 3-5 shows the slot layout of the OptiX OSN 1500A subrack.

Figure 3-5 Slot layout of the OptiX OSN 1500A subrack

Slot 20

FAN

Slot 1

Slot 12

Slot 13

Slot 4

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10 AUX Slot 5

CXL16/4/1

CXL16/4/1

EOW

Slot 11

Slots 12 and 13 in the OptiX OSN 1500A subrack can be divided into two half-width slotsrespectively. See Figure 3-6.

Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots

Slot 20

FAN

Slot 1

Slot 2

Slot 3

Slot 4

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10 AUX Slot 5

CXL16/4/1

CXL16/4/1

EOW

Slot 12

Slot 11

Slot 13

Figure 3-7 shows the slot access capacity of the OptiX OSN 1500A.

Figure 3-7 Slot access capacity of the OptiX OSN 1500A

XCS A XCS B

Slot20


Slot 2/12 Slot 7

Slot 3/13 Slot 8

Slot 4 Slot 9

Slot 5 Slot 102.5Gbit/s

2.5Gbit/s

2.5Gbit/s

2.5Gbit/s

1.25Gbit/s

1.25Gbit/s

1.25Gbit/s

1.25Gbit/s

When slots 12 and 13 are not divided, the access capacity of each slot is 2.5 Gbit/s. When slots12 and 13 are divided, the access capacity of each slot is 1.25 Gbit/s.

The slots in the OptiX OSN 1500A subrack are allocated as follows:

l Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 4–5

l Slots for processing boards before the division of slots: slots 6–9 and 12–13

l Slots for processing boards after the division of slots: slots 6–9, 12–13, and 2–3

l Slot for the orderwire board: slot 9 (also for the processing board)

l Slot for the auxiliary interface board: slot 10



l Slots for PIU boards: slots 1 and 11

l Slots for the fan board: slot 20

Figure 3-8 shows the slot layout of the OptiX OSN 1500B subrack. Figure 3-9 shows the slotaccess capacity of the OptiX OSN 1500B.

Figure 3-8 Slot layout of the OptiX OSN 1500B subrack

Slot 14 Slot 18 PIU

Slot 15

Slot 16

Slot 17

Slot 20

FAN

Slot 11

Slot 12

Slot 13

Slot 4

Slot 19 PIU

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10 AUX Slot 5

CXL16/4/1CXL16/4/1

EOW

Interface board

Interface board

Interface board

Interface boardProcessing board

Processing board

Processing board

Processingboard

Processingboard

Processingboard

Figure 3-9 Slot access capacity of the OptiX OSN 1500B

Slot 14 Slot 18 PIU

Slot 15

Slot 16

Slot 17

Slot 20

FAN

Slot 11

Slot 12

Slot 13

Slot 4

Slot 19 PIU

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10 AUX Slot 5

2.5Gbit/s

2.5Gbit/s

2.5Gbit/s

2.5Gbit/s

2.5Gbit/s

622Mbit/s

622Mbit/s

622Mbit/s

622Mbit/s

NOTE

Slots 11–13 in the OptiX OSN 1500B subrack can be divided. As shown in Figure 3-10, the divided slotsare in the dashed area. The slots in the left portion of the original slots are slots 1–3, and the slots in theright portion of the original slots are slots 11–13. After the division of slots, the maximum access capacityof each slot is 1.25 Gbit/s. See Figure 3-11.

Figure 3-10 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)

Slot 14 Slot 18 PIU

Slot 15

Slot 16

Slot 17

Slot 20

FAN

Slot 1

Slot 2

Slot 3

Slot 4

Slot 19 PIU

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10 AUX Slot 5

CXL16/4/1

CXL16/4/1

EOW

Slot 11

Slot 12

Slot 13

Interface boardInterface board

Interface board

Interface board

Interface boardProcessing

boardProcessing

boardProcessing

board

Processingboard

Processingboard

Processingboard




Figure 3-11 Access capacity of the OptiX OSN 1500B subrack (after the division of slots)

Slot 14 Slot 18 PIU

Slot 15

Slot 16

Slot 17

Slot 20

FAN

Slot 1

Slot 2

Slot 3

Slot 4

Slot 19 PIU

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10 AUX Slot 5

2.5 Gbit/s

2.5 Gbit/s

622 Mbit/s

622 Mbit/s

622 Mbit/s

622 Mbit/s

Slot 11

Slot 12

Slot 13

1.25 Gbit/s

1.25 Gbit/s

1.25 Gbit/s

1.25 Gbit/s

1.25 Gbit/s

1.25 Gbit/s

The slots in the OptiX OSN 1500B subrack are allocated as follows:

l Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 4–5

l Slots for processing boards before the division of slots: slots 6–9 and 11–13

l Slots for processing boards after the division of slots: slots 1–9 and 11–13

l Slots for the interface boards: slots 14–17

l Slot for the orderwire board: slot 9 (also for the processing board)

l Slot for the auxiliary interface board: slot 10

l Slots for PIU boards: slots 18 and 19

l Slot for the fan board: slot 20

Mapping Relation Between Slots for Interface Boards and Slots for ProcessingBoards

Table 3-1 lists the mapping relation between slots for interface boards and slots for processingboards of the OptiX OSN 1500A.

Table 3-1 Mapping relation between slots for interface boards and slots for processing boardsof the OptiX OSN 1500A.

Slots for Processing Boards Slots for Interface Boards

Slot 12 Slots 6 and 7

Table 3-2 lists the mapping relation between slots for interface boards and slots for processingboards of the OptiX OSN 1500B.

Table 3-2 Mapping relation between slots for interface boards and slots for processing boardsof the OptiX OSN 1500B.

Slots forProcessingBoards

Slots for InterfaceBoards



Slot 2 Slot 14 Slot 3 Slot 16








Slot 12 Slots 14 and 15 Slot 13 Slots 16 and 17

The corresponding interface boards for the PD3, PL3, SEP, and SPQ4 can be housed only inslots of even numbers.

The boards housed in slots 12 and 7 share the same interface board housed in slot 15, and theboards housed in slots 13 and 8 share the same interface board housed in slot 17. Therefore,when you configure the boards:

l If slot 12 houses the N1EMS4 (used with an interface board) or R1PD1, slot 7 cannot houseany board used with an interface board.

l If slot 13 houses the N1EMS4 (used with an interface board) or R1PD1, slot 8 cannot houseany board used with an interface board.

Boards and Their Valid Slots

Table 3-3 lists the boards and their valid slots for the OptiX OSN 1500A.

Table 3-3 Boards and their valid slots for the OptiX OSN 1500A

Board Full Name Valid Slots

Q2CXL16 STM-16 integrated board of theSCC, cross-connect, timing andline units

Slots 4 and 5


Slots 4 and 5


Slots 4 and 5

N1SL16 (A) 1 x STM-16 optical interfaceboard

Slots 12 and 13


Slots 12 and 13


Slots 12 and 13

N1SF16 1 x STM-16 optical interfaceboard (with FEC)

Slots 12 and 13

N1SLQ4 4 x STM-4 optical interface board Slots 12 and 13






N1SLD4 2 x STM-4 optical interface board Slots 12 and 13

N2SLD4 2 x STM-4 optical interface board Slots 12 and 13

N1SL4 1 x STM-4 optical interface board Slots 12 and 13


N1SLT1 12 x STM-1 optical interfaceboard

Slots 12 and 13

N2SLO1 8 x STM-1 optical interface board Slots 12 and 13





N1SEP1 2 x STM-1 line processing board Slots 12 and 13

R1SLD4 2 x STM-4 optical interface board(half-width)

Slots 2–3, 6–9, and 12–13

R1SL4 1 x STM-4 optical interface board(half-width)

Slots 2–3, 6–9, and 12–13

R1SLQ1 4 x STM-1 optical interface board(half-width)

Slots 2–3, 6–9, and 12–13


Slots 2–3, 6–9, and 12–13

N1PL3A 3 x E3/T3 processing board (notused with the interface board)

Slots 12 and 13


Slots 12 and 13

R1PD1A 32 x E1 processing board (half-width)

Slots 2 and 12

R1PD1B 32 x E1 processing board (half-width)

Slots 2 and 12

R2PD1 32 x E1/T1 hybrid processingboard (half-width)

Slots 2 and 12

R1PL1A 16 x E1 processing board (half-width)

Slots 6–9

R1PL1B 16 x E1 processing board (half-width)

Slots 6–9




R1L75S 16 x EI 75-ohm interface board(half-width)

Slots 6 and 7

R1L12S 16 x E1 120-ohm interface board(half-width)

Slots 6 and 7

N2EGR2 2 x GE Ethernet ring processingboard

Slots 12 and 13 (2.5 Gbit/s)

N1EGS2 2 x GE Ethernet processing board Slots 12 and 13 (2.5 Gbit/s)


N1EFS4 4 x 10M/100M Ethernetprocessing board

Slots 12 and 13



N1EMS4 4 x GE Ethernet processing board Slots 12 and 13 (2.5 Gbit/s)


N1EGT2 2 x GE Ethernet transparenttransmission board


R1EFT4 4 x 10M/100M Ethernettransparent transmission board(half-width)

Slots 2–3, 12–13 and 6–9 (622Mbit/s)

N1EFT8 (not usedwith the interfaceboard)

8 x 10M/100M Ethernettransparent transmission board

Slots 12–13 (622 Mbit/s)

N1EMR0 (not usedwith the interfaceboard)

1 x GE and 4 x FE Ethernetprocessing board





N1EFT8A 8 x FE transparent transmissionboard (interfaces are available onthe front panel)

Slots 12 and 13 (622 Mbit/s)

N1ADL4 1 x STM-4 ATM processingboard


N1ADQ1 4 x STM-1 ATM processingboard


N1IDL4 1 x STM-4 IMA processing board Slots 12 and 13 (1.25 Gbit/s)

N1IDQ1 4 x STM-1 IMA processing board Slots 12 and 13 (1.25 Gbit/s)





N1MST4 4-channel multiservice (SAN orvideo service) transparenttransmission board


N1LWX Arbitrary rate access board Slots 12 and 13

N1MR2A Arbitrary two-wavelength add/drop board (processing board)

Slots 12 and 13

N1MR2B Arbitrary two-wavelength add/drop board (half-width)

Slots 12 and 13

TN11OBU1 Optical booster amplifier board Slots 12 and 13

TN11MR2 2-channel optical add/dropmultiplexing board

Slots 12 and 13


Slots 12 and 13

TN11CMR2 2-channel CWDM optical add/drop multiplexing board

Slots 12 and 13


Slots 12 and 13

N1DXA N x 64 kbit/s convergence andprocessing board

Slots 12 and 13

R1AMU Orderwire processing or alarmconcatenation board

Slot 9

N1FIB Filter isolating board Slots 12 and 13

ROP Single wavelength long-haulboard (remote pumping)

Slot 103 (external)

R1AUX System auxiliary processing unit Slot 10


R1PIUA PIU board Slots 1 and 11

CAU CAU power monitoring board Slot 50

COA COA board Slots 101 and 102

N1BA2 2-channel optical boosteramplifier board

Slots 12 and 13

N1BPA 1-channel amplifier and 1-channel preamplifier board

Slots 12 and 13

R1FAN Fan board Slot 20

R1EOW Orderwire communication board Slot 9



Table 3-4 lists the boards and their valid slots for the OptiX OSN 1500B.

Table 3-4 Boards and their valid slots for the OptiX OSN 1500B



Slots 4 and 5


Slots 4 and 5


Slots 4 and 5


Slots 11–13


Slots 11–13


Slots 11–13

N1SF16 1 x STM-16 outband opticalinterface board (with FEC)

Slots 11–13

N1SLQ4 4 x STM-4 optical interface board Slots 11–13


N1SLD4 2 x STM-4 optical interface board Slots 11–13

N2SLD4 2 x STM-4 optical interface board Slots 11–13

N1SL4 1 x STM-4 optical interface board Slots 11–13






R1SLD4 2 x STM-4 optical interface board(half-width)

Slots 1–3 and 11–13 (for theboard housed in any of slots 1–3and 11–13, two optical interfacescan be configured), slots 6–9 (forthe board housed in any of slots6–9, one optical interface can beconfigured)






Slots 1–3, 6–9 and 11–13

R1SLQ1 4 x STM-1 optical interface board(half-width)

Slots 1–3, 6–9 and 11–13


Slots 1–3, 6–9 and 11–13

N1SEP 8 x STM-1 (e) processing board(used with the interface board)

Slots 12–13

N1SEP1 2 x STM-1 (e) processing board(not used with the interface board)

Slots 11–13

N1SLT1 12 x STM-1 optical interfaceboard

Slots 11–13

N2SPQ4 4 x STM-1/E4 (e) processingboard (used with the interfaceboard)

Slots 12 and 13

N1EU08 8 x STM-1 (e) electrical interfaceboard

Slots 14 and 16

N1OU08 8 x STM-1 optical interface board Slots 14 and 16

N2OU08 8 x STM-1 optical interface board Slots 14 and 16

N1EU04 4 x STM-1 (e) electrical interfaceboard

Slots 14 and 16

N2SLO1 8 x AU-3 high density accessboard

Slots 11–13

R1PL1A 16 x E1 interface and processingboard (interfaces available on thefront panel)

Slots 6–9

R1PL1B 16 x E1 interface and processingboard (interfaces available on thefront panel)

Slots 6–9

N2PQ3 12 x E3/T3 processing board Slots 12 and 13

N2PD3 6 x E3/T3 processing board Slots 12 and 13

N2PL3 3 x E3/T3 processing board Slots 12 and 13


Slots 11–13


Slots 11–13

N1PD3 6 x E3/T3 processing board Slots 12 and 13




N1PL3 3 x E3/T3 processing board Slots 12 and 13

N1C34S 3 x 34M/45M electrical interfaceswitching board

Slots 14 and 16

N1D34S 6 x 34M/45M electrical interfaceswitching board

Slots 14–17

N1SPQ4 4 x E4/STM-1 processing board Slots 12–13

N1MU04 4 x E4/STM-1 processing board Slots 14 and 16

N1PQ1A 63 x E1 75-ohm processing board Slots 11–13

N1PQ1B 63 x E1 120-ohm processingboard

Slots 11–13

N1PQM 63 x E1 75-ohm or 120-ohmprocessing board

Slots 11–13

N2PQ1 63 x E1/T1 hybrid processingboard

Slots 11–13

R2PD1 32 x E1/T1 hybrid processingboard

Slots 1–3, 6–8 and 11–13

N1D75S 32 x E1/T1 75-ohm electricalinterface switching board

Slots 14–17


Slots 14–17

N1D12B 32 x E1/T1 120-ohm electricalinterface board

Slots 14–17

N1DX1 N x 64 kbit/s access andconvergence board

Slots 11–13

N1DXA N x 64 kbit/s convergence andprocessing board

Slots 11–13

N1DM12 N x 64 kbit/s interface board Slots 14–17

N1EMS4 (used withthe interface board)



N1EMS4 (not usedwith the interfaceboard)

4 x GE Ethernet processing board Slots 11–13 (2.5 Gbit/s)

N1EGS4 4 x GE Ethernet processing board Slots 11–13 (2.5 Gbit/s)


Slots 11–13 (1.25 Gbit/s)





N4EFS0 10M/100M Ethernet processingboard (used with the interfaceboard)


N1EFT8A 8 x FE transparent transmissionboard (interfaces available on thefront panel)


N1EFT8 (not usedwith the interfaceboard)



N1EFT8 (used withthe interface board)



R1AMU Orderwire processing or alarmconcatenation board

Slot 9

N1FIB Filter isolating board Slots 12 and 13

ROP Single wavelength long-haulboard (remote pumping)

Slot 103 (external)

R2AUX System auxiliary interface board Slot 10



N2EMR0 (used withthe interface board)






R1EFT4 4 x FE processing board(interfaces available on the frontpanel)

Slots 1–3, 11–13 and 6–9 (622Mbit/s)

N1TSB8 8-channel electrical interfaceswitching board

Slots 14 and 15

N1TSB4 4-channel electrical interfaceswitching board

Slot 14

N1EFS0 (used withthe interface board)

10M/100M Ethernet processingboard


N2EFS0 (used withthe interface board)

10M/100M Ethernet processingboard


N1ETF8 8 x FE Ethernet electrical interfaceboard

Slots 14–17


Slots 11–13







N1MST4 4-channel multiservicetransparent transmission board



N1EMR0 (used withthe interface board)






N1EFF8 8-channel Ethernet opticalinterface board

Slots 14–17

N1ETS8 8 x 10/100M Ethernet twisted pairinterface switching board

Slots 14 and 16

N1ADQ1 4 x STM-1 or 1 x STM-4 ATMprocessing board


N1ADL4 1 x STM-4 ATM processing board Slots 11–13 (1.25 Gbit/s)

N1IDQ1 4 x STM-1 IMA processing board Slots 11–13 (1.25 Gbit/s)

N1IDL4 1 x STM-4 IMA processing board Slots 11–13 (1.25 Gbit/s)

CAU CAU power monitoring board Slot 50

COA COA board Slots 101–102

N1BA2 2-channel optical boosteramplifier board

Slots 11–13

N1BPA Optical booster preamplifierboard

Slots 11–13

R1PD1 32 x E1 processing board (half-width)

Slots 1–3, 6–8 and 11–13

R1FAN Fan board Slot 20


R1EOW Orderwire communication board Slot 9

R1PIU PIU board Slots 18–19

N1MR2A Arbitrary two-wavelength add/drop board

Slots 11–13





N1MR2B Arbitrary two-wavelength add/drop board (half-width)

Slots 1–3, 6–9 and 11–13

N1MR2C Arbitrary two-wavelength add/drop board

Slots 14–17

N1LWX Arbitrary rate access board Slots 11–13

TN11OBU1 Optical booster amplifier board Slots 11–13


Slots 11–13


Slots 11–13


Slots 11–13


Slots 11–13

3.4 Technical SpecificationsThe specifications of the subrack cover dimensions, weight and maximum power consumption.

Table 3-5 lists the technical specifications of the OptiX OSN 1500A subrack.

Table 3-5 Technical specifications of the OptiX OSN 1500A subrack

Dimensions (mm) Weight (kg)

444 (W) x 262 (D) x 131 (H) 8 (the backplane, fans and two PIUboards included)

Table 3-6 lists power consumption of the OptiX OSN 1500A subrack.

Table 3-6 Maximum power consumption of the OptiX OSN 1500A subrack

Subrack Type Maximum PowerConsumption

Fuse Capacity

OptiX OSN 1500A generalsubrack

200 W 10 A

OptiX OSN 1500A enhancedsubrack

313 W 15 A

Table 3-7 lists the technical specifications of the OptiX OSN 1500B subrack.



Table 3-7 Technical specifications of the OptiX OSN 1500B subrack

Dimensions (mm) Weight (kg)

444 (W) x 263 (D) x 221 (H) 9 (the backplane, fans and two PIUboards included)

Table 3-8 lists power consumption of the OptiX OSN 1500B subrack.

Table 3-8 Maximum power consumption of the OptiX OSN 1500B subrack

Subrack Type Maximum PowerConsumption

Fuse Capacity

OptiX OSN 1500B generalsubrack

280 W 10 A

OptiX OSN 1500B enhancedsubrack

400 W 15 A




4 Board List and Classification

About This Chapter

This chapter describes the appearance, barcode and classification of boards used for the OptiXOSN systems.

4.1 Appearance and Dimensions of BoardsDifferent boards have different appearance and dimensions.

4.2 Description of the Barcode on the BoardThe barcode on the front panel of the board indicates the board version, name and board features.

4.3 Board ClassificationBy function, the boards can be classified into SDH processing boards, PDH processing boards,data processing boards, WDM processing boards and auxiliary boards.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 4 Board List and Classification


4.1 Appearance and Dimensions of BoardsDifferent boards have different appearance and dimensions.

Table 4-1 lists the appearance figures and dimensions of boards for the OptiX OSN 1500.

Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500

Item Appearance and Dimensions

Boardappearance

Boardclassification

Integrated board of theSCC, cross-connect andline units (CXL)

Board housed in a dividedslot (PD1/PIUA/AUX/EOW)

Service interfaceboard (D75S, forexample)

Height(mm)

262.05 111.8 262.05

Depth (mm) 220 220 110

Width (mm) 25.4 25.4 22

Note: The figure in the right cell illustrates the three dimensions. Theheight and width are measured for the front panel and the depth ismeasured for the printed circuit board (PCB). W

H

D

CAUTIONWear the anti-static wrist strap when holding the board with hands. Make sure that the anti-staticwrist strap is well grounded. Otherwise, the static discharge may cause damage to the board.

DANGERAvoid direct eye exposure to laser beams launched from the optical interface board or opticalinterfaces. Otherwise, damage may be caused to the eyes.

4 Board List and ClassificationOptiX OSN 1500 Intelligent Optical Transmission System



CAUTIONl Do not directly insert the attenuators into the level optical modules. If the attenuators are

required, use the attenautors at the ODF side.l If a board requires an attenuator, insert the attenuator in the IN interface instead of the OUT

interface.l When performing the loopback, use attenuators to prevent damage to the optical modules.

4.2 Description of the Barcode on the BoardThe barcode on the front panel of the board indicates the board version, name and board features.

Two types of barcodes are used for the boards of the OptiX OSN 1500.

l 16-character manufacturing code + board version + board name + board feature code

l 20-character manufacturing code + board version + board name + board feature code

The barcode is stuck on the front panel of a board. Figure 4-1 shows a barcode with 16-charactermanufacturing code.

Figure 4-1 Barcode of a board

0364401055000015 -SSN3SL16A01

① ② ③ ④

① Last 6-character serial code of BOM② Internal code③

④

Board versionBoard name

Bar code

Board feature code

5

5



NOTE

For details on the board feature code, see the section that describes the board feature code for each board.

4.3 Board ClassificationBy function, the boards can be classified into SDH processing boards, PDH processing boards,data processing boards, WDM processing boards and auxiliary boards.

4.3.1 SDH Processing BoardsThe OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1levels.

4.3.2 PDH Processing BoardsThe OptiX OSN 1500 supports PDH processing boards at different rates and of differentimpedance.

4.3.3 Data Processing BoardsThe OptiX OSN 1500 supports data processing boards with the transparent transmission,switching or RPR function.

4.3.4 Interface Boards and Switching BoardsThe OptiX OSN 1500 supports the optical interface boards, electrical interface boards andswitching boards.

4.3.5 Cross-Connect Boards and SCC BoardsThe OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line unitsat different rates.

4.3.6 Auxiliary BoardsThe OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boardsand fan boards.

4.3.7 WDM Processing BoardsThe OptiX OSN 1500 supports WDM processing boards such as the optical add/dropmultiplexing boards and optical power amplifier boards.

4.3.8 Optical Amplifier Boards and Dispersion Compensation BoardThe OptiX OSN 1500 supports several optical booster amplifier boards.

4.3.9 Power Interface BoardsThe OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports theUPM and R1PIU.

4.3.1 SDH Processing BoardsThe OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1levels.

Table 4-2 lists the SDH processing boards supported by the OptiX OSN 1500A.

Table 4-2 SDH processing boards for the OptiX OSN 1500A

Board Full Name

N1SL16 1 x STM-16 optical interface board




Board Full Name



N1SL16A 1 x STM-16 optical interface board



N1SF16 1 x STM-16 optical interface board (with FEC)



R1SL4 1 x STM-4 optical interface board (half-width)

N1SLQ4 1 x STM-4 optical interface board


N1SLD4 2 x STM-4 optical interface board


R1SLD4 2 x STM-4 optical interface board (half-width)

N1SLT1 12 x STM-1 optical interface board



R1SLQ1 4 x STM-1 optical interface board (half-width)




N1SEP1 2 x STM-1 line processing board when interfaces are availableon the front panel

N2SLO1 8 x STM-1 optical interface board

Table 4-3 lists the SDH processing boards supported by the OptiX OSN 1500B.

Table 4-3 SDH processing boards for the OptiX OSN 1500B

Board Full Name





Board Full Name





N1SF16 1 x STM-16 optical interface board (with FEC)








R1SLD4 2 x STM-4 optical interface board (half-width)

N1SLT1 12 x STM-1 optical interface board



R1SLQ1 4 x STM-1 optical interface board (half-width)




N1SEP1 2 x STM-1 line processing board when interfaces are availableon the front panel8 x STM-1 line processing board when used with an interfaceboard

N2SLO1 8 x STM-1 optical interface board

4.3.2 PDH Processing BoardsThe OptiX OSN 1500 supports PDH processing boards at different rates and of differentimpedance.

Table 4-4 lists the PDH processing boards supported by the OptiX OSN 1500A.




Table 4-4 PDH processing boards for the OptiX OSN 1500A

Board Full Name Board Full Name

R1PL1 16 x E1 processing board N1PL3A 3 x E3/T3 processing board(interfaces available on thefront panel)

R1PD1 32 x E1 processing board N2PL3A 3 x E3/T3 processing board(interfaces available on thefront panel)

R2PD1 32 x E1/T1 processing board N1DXA DDN service convergenceboard

Table 4-5 lists the PDH processing boards supported by the OptiX OSN 1500B.

Table 4-5 PDH processing boards for the OptiX OSN 1500B


R1PL1 16 x E1 processing board N2PL3A 3 x E3/T3 processing board(interfaces available on thefront panel)

R1PD1 32 x E1 processing board N1PD3 6 x E3/T3 processing board

R2PD1 32 x E1/T1 processing board N2PD3 6 x E3/T3 processing board

N1PQ1 63 x E1 processing board N2PQ3 12 x E3/T3 processing board

N2PQ1 63 x E1 processing board N1DX1 DDN service access andconvergence board

N1PQM 63 x E1/T1 processing board N1DXA DDN service convergenceboard

N1PL3 3 x E3/T3 processing board N1SPQ4 4 x E4/STM-1 electricalprocessing board

N2PL3 3 x E3/T3 processing board N2SPQ4 4 x E4/STM-1 electricalprocessing board

N1PL3A 3 x E3/T3 processing board(interfaces available on the frontpanel)

- -

4.3.3 Data Processing BoardsThe OptiX OSN 1500 supports data processing boards with the transparent transmission,switching or RPR function.

Table 4-6 lists the data processing boards supported by the OptiX OSN 1500A.



Table 4-6 Data processing boards for the OptiX OSN 1500A


N1EFT4 4 x FE Ethernet transparenttransmission board (half-width)

N1EGS4 4 x GE Ethernet convergenceboard

N1EFT8 8 x FE Ethernet transparenttransmission board


N1EFT8A

8 x FE Ethernet transparenttransmission board

N1EMR0 4 x FE and 1 x GE Ethernet ringprocessing board


N2EMR0 4 x FE and 1 x GE Ethernet ringprocessing board

N1EFS4 4 x FE Ethernet processingboard with Lanswitch




N1EGS2 2 x GE Ethernet processingboard with Lanswitch

N1IDL4 1 x STM-4 ATM processingboard


N1IDQ1 4 x STM-1 ATM processingboard

N1EMS4 4 x GE Ethernet transparenttransmission and convergenceboard

N1MST4 4-port multi-service transparenttransmission board

Table 4-7 lists the data processing boards supported by the OptiX OSN 1500B.

Table 4-7 Data processing boards for the OptiX OSN 1500B


N1EFT4 4 x FE Ethernet transparenttransmission board (half-width)

N1EMS4 4 x GE and 16 x FE Ethernettransparent transmission andconvergence board

N1EFT8 8 x FE or 16 x FE Ethernettransparent transmission board

N1EGS4 4 x GE Ethernet convergenceboard

N1EFT8A

8 x FE Ethernet transparenttransmission board



N1EMR0 12 x FE and 1 x GE Ethernetring processing board

N1EFS0 8-port Fast Ethernet processingboard with Lanswitch

N2EMR0 12 x FE and 1 x GE Ethernetring processing board










N1IDL4 1 x STM-4 ATM processingboard


N1IDQ1 4 x STM-1 ATM processingboard


N1MST4 4-port multi-service transparenttransmission board


- -

4.3.4 Interface Boards and Switching BoardsThe OptiX OSN 1500 supports the optical interface boards, electrical interface boards andswitching boards.

Table 4-8 lists the interface boards and switching boards supported by the OptiX OSN 1500A.

Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A

Board Full Name

R1L12S 16 x E1/T1 120-ohm electrical interface switching board

R1L75S 16 x E1 75-ohm electrical interface switching board

Table 4-9 lists the interface boards and switching boards supported by the OptiX OSN 1500B.

Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B


N1EU08 8 x STM-1 electrical interfaceboard

N1D12S 32 x E1/T1 120-ohmelectrical interface switchingboard

N1OU08 8 x STM-1 optical interfaceboard (LC)

N1D12B 32 x E1/T1 120-ohmelectrical interface board

N2OU08 8 x STM-1 optical interfaceboard (SC)

N1EFF8 8 x 100M Ethernet opticalinterface board


N1ETF8 8 x 100M Ethernet twistedpair interface board

N1MU04 4 x STM-1 electrical interfaceboard

N1ETS8 8 x 10/100M Ethernettwisted pair interfaceswitching board




N1D34S 6 x E3/T3 electrical interfaceswitching board

N1DM12 DDN service interface board

N1C34S 3 x E3/T3 electrical interfaceswitching board

N1TSB4 4-channel electricalinterface switching board

N1EU04 4 x STM-1 electrical interfaceboard

N1TSB8 8-channel electricalinterface switching board

4.3.5 Cross-Connect Boards and SCC BoardsThe OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line unitsat different rates.

Table 4-10 lists the cross-connect boards and SCC boards supported by the OptiX OSN 1500Aand the OptiX OSN 1500B.

Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and theOptiX OSN 1500B

Board Full Name

Q2CXL1 Integrated board of the SCC, cross-connect and line units at theSTM-1 level



4.3.6 Auxiliary BoardsThe OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boardsand fan boards.

Table 4-11 lists the auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN1500B.

Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B


R1EOW Orderwire phoneprocessing board

R1AUX/R2AUX

System auxiliaryinterface board

R1AMU Orderwire processing oralarm concatenationboard

R1FAN Fan board




4.3.7 WDM Processing BoardsThe OptiX OSN 1500 supports WDM processing boards such as the optical add/dropmultiplexing boards and optical power amplifier boards.

Table 4-12 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500A.

Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A


TN11CMR2 2-channel optical add/dropmultiplexing board

N1MR2C 2-channel optical add/dropmultiplexing board


N1LWX Arbitrary bit rate wavelengthconversion board

MR2 2-channel optical add/dropmultiplexing board

TN11OBU1 Optical booster amplifierboard


N1FIB Filter isolating board

N1MR2A 2-channel optical add/dropmultiplexing board

- -

Table 4-13 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500B.

Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B



N1MR2B 2-channel optical add/dropmultiplexing board


N1MR2C 2-channel optical add/dropmultiplexing board


N1LWX Arbitrary bit rate wavelengthconversion board


TN11OBU1 Optical booster amplifierboard

N1MR2A 2-channel optical add/dropmultiplexing board

N1FIB Filter isolating board

4.3.8 Optical Amplifier Boards and Dispersion CompensationBoard

The OptiX OSN 1500 supports several optical booster amplifier boards.

Table 4-14 lists the optical amplifier boards and dispersion compensation boards supported bythe OptiX OSN 1500A and the OptiX OSN 1500B.



Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiXOSN 1500A/B

Board Full Name

N1BPA Optical booster and pre-amplifier board

N1BA2 Optical booster amplifier board

N1COA/61COA/62COA Case-shaped optical amplifier

4.3.9 Power Interface BoardsThe OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports theUPM and R1PIU.

The UPM is an uninterruptible power module.

The R1PIUA is used for the OptiX OSN 1500A as the power interface board.

The R1PIU is used for the OptiX OSN 1500B as the power interface board.




5 SDH Processing Boards

About This Chapter

This chapter describes the SDH processing boards at the STM-1, STM-4, and STM-16 levels.

5.1 SL1This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and specifications.

5.2 SLQ1This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.

5.3 SLO1This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.

5.4 SLT1This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and specifications.

5.5 SEP1This section describes the SEP1 board, in terms of the version, function, working principle, frontpanel, and specifications.


5.7 SLD4This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version,function, working principle, front panel and specifications.

5.8 SLQ4This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version,function, working principle, front panel and specifications.


OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 5 SDH Processing Boards


5.10 SL16AThis section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version,function, working principle, front panel and specifications.

5.11 SF16This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FECfunction, in terms of the version, function, working principle, front panel and specifications.

5 SDH Processing BoardsOptiX OSN 1500 Intelligent Optical Transmission System




5.1.1 Version DescriptionThe SL1 board has three versions: R1, N1 and N2. The difference among the three versions liesin the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, whichis housed in a divided slot in a subrack.

5.1.2 Function and FeatureThe SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forthe STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.

5.1.3 Working Principle and Signal FlowThe SL1 board consists of the O/E conversion module, CDR module, SDH overhead processingmodule, RST and so on.

5.1.4 Front PanelOn the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safetyclass label. On the front panel of the R1SL1, there are indicators, interfaces and barcode.

5.1.5 Valid SlotsThe slots valid for the SL1 vary with the version of the board.

5.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL1 indicates the optical interface type.

5.1.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SL1.

5.1.8 Technical SpecificationsThe technical specifications of the SL1 cover the optical interface specifications, boarddimensions, weight and power consumption.

5.1.1 Version DescriptionThe SL1 board has three versions: R1, N1 and N2. The difference among the three versions liesin the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, whichis housed in a divided slot in a subrack.

Table 5-1 lists the details on the versions of the SL1 board.

Table 5-1 Version Description of the SL1

Item Description

Functionalversion

The SL1 has three versions, R1, N1 and N2.

Difference The N2SL1 supports the TCM function. The N1SL1 and R1SL1 do notsupport the TCM function. The R1SL1 is housed in a divided slot.



Item Description

Replaceability The versions cannot be replaced by each other.

5.1.2 Function and FeatureThe SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forthe STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.

Table 5-2 lists the functions and features of the SL1.

Table 5-2 Functions and features of the SL1

Function andFeature

SL1

Basic function Transmits and receives 1 x STM-1 optical signals.

Specification ofthe opticalinterface

Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 andVe-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 typescomply with ITU-T G.957 in features. The optical interface of the Ve-1.2type complies with the standards defined by Huawei.

Specification ofthe opticalmodule

Supports detection and query of the information on the optical module.Supports the usage and detection of the pluggable optical module SFP foreasy maintenance.The optical interface supports the function of setting the on/off state of thelaser and the ALS function.

Serviceprocessing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overheadprocessing

Supports the processing of the SOH bytes of the STM-1 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.

Alarm andperformanceevent

Provides rich alarms and performance events for easy management andmaintenance of the equipment.

Protectionscheme

Supports the two-fiber bidirectional MSP protection ring, linear MPS,SNCP, SNCTP and SNCMP.

Maintenancefeature

Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.





Figure 5-1 shows the block diagram for the working principle of the SL1.

Figure 5-1 Block diagram for the working principle of the SL1

Communicationand control

module

Cross-connect unit A

+3.3 Vbackup power

+3.3 V

SDH overhead processing moduleDCC

SCC unit

LOSLaser shut down SCC unit

Communication

High speed bus

+5 V

+1.8 V

+3.3 V -48 V/ -60 VDC/DCconverter

Fuse

FuseDC/DC

converter

Cross-connect unit

Cross-connect unit BHigh speed bus

155 MHzPLL

Cross-connect unit155 MHz Reference clock

K1 and K2 insertion/extration

MSA HPTMSTRST

IIC

CDR

. . . .

. . . .

CDR

-48 V/ -60 V

155Mbit/sO/E

O/E

SPI

O/E

O/E

SPI

Frame headerCross-connect unit

K1 and K2155Mbit/s 155Mbit/s

155Mbit/s

155Mbit/s155Mbit/s

155Mbit/s 155Mbit/s 155Mbit/s

155Mbit/s

PLL: phase-locked loop SPI: SDH physical interface SDH: synchronous digital hierarchyRST: regenerator sectiontermination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit CDR: clock and data recovery

The function modules of the STM-1 units are described below:

O/E Conversion Modulel In the receive direction, the module converts the received optical signals into electrical

signals.l In the transmit direction, the module converts the electrical signals into SDH optical signals,

and then sends optical signals to fibers for transmission.l The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Modulel It recovers the data signal and the clock signal.

SDH Overhead Processing Modulel This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.



RSTl In the receive direction, RST performs frame alignment detection (A1, A2), regenerator

section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l In the transmit direction, RST performs frame alignment insertion, regenerator section pathtrace insertion, BIP-8 calculation and insertion.

MSTl In the receive direction, MST performs BIP-24 errored block count, multiplex section-

remote error indication (MS_REI) recovery, multiplex section-remote defect indication(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REIMS_RDI and MS_AIS insertion.

l MST provides extraction or insertion of K1 byte and K2 byte.

MSAl In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS

detection, pointer justification.

l In the transmit direction, MST it performs administration unit group (AUG) assembly,AU-4 pointer generation, AU_AIS generation.

HPTl OH termination

l J1 path trace message recovery

l REI information recovering

l HP_RDI detection (path status monitoring)

l UNEQ and AIS detection (signal label monitoring)

l VC-4 BIP-8 errored block count

Communication and Control Modulel Manages and configures other modules of the boards.

l Performs inter-board communication through internal Ethernet interface.

l Traces the clock signal from the active and the standby cross-connect units.

l Controls the laser.

l Realizes the pass-through of orderwire and embedded control channel (ECC) bytes betweenthe paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

l Selects the clock and frame header from the active or the standby cross-connect units.

l Controls the indicator on the board.

DC/DC Converter

It provides the board with required DC voltages. It converts the –48/–60 V power supply to thefollowing voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.




5.1.4 Front PanelOn the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safetyclass label. On the front panel of the R1SL1, there are indicators, interfaces and barcode.

Appearance of the Front PanelFigure 5-2 shows the appearance of the front panel of the N1SL1/N2SL1.

Figure 5-2 Front panel of the N1SL1/N2SL1

SL1

SL1

STATACTPROGSRV

CLASS1LASER

PRODUCT

OUT

IN

Figure 5-3 shows the appearance of the front panel of the R1SL1.



Figure 5-3 Front panel of the R1SL1

STATACTPROGSRV

OU

TIN

SL1

SL1

IndicatorsThe following indicators are present on the front panel of the board:

l Board hardware state indicator (STAT), which is green or red when lit.

l Service activating state indicator (ACT), which is green when lit.

l Board software state indicator (PROG), which is green or red when lit.

l Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

InterfacesThere is one pair of optical interfaces on the front panel of the SL1. Table 5-3 lists the type andusage of the optical interfaces.

Table 5-3 Optical interfaces of the SL1

Interfaces on theFront Panel

Interface Type Usage

IN LC Receives optical signals.

OUT LC Transmits optical signals.


The slots valid for the SL1 are as follows:

l The R1SL1 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500Asubrack.




l The N1SL1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.


l The R1SL1 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500Bsubrack.

l The N1SL1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.



Table 5-4 lists the relation between the board feature code and optical interface type for the SL1.

Table 5-4 Relation between the board feature code and the optical interface type

Board Feature Code Optical Interface Type

SSN1SL110, SSN2SL110 10 S-1.1

SSN1SL111, SSN2SL111 11 L-1.1

SSN1SL112, SSN2SL112 12 L-1.2

SSN1SL113, SSN2SL113 13 Ve-1.2

SSN1SL114, SSN2SL114 14 I-1


You can use the T2000 to set the following parameters for the SL1:

l J0

l J1

l C2

For details on the parameters, refer to F Board Configuration Reference.


Optical Interface Specifications

Table 5-5 lists the specifications of the optical interfaces of the SL1.



Table 5-5 Specifications of the optical interfaces of the SL1

Item Specification

Nominalbit rate

155.52 Mbit/s

Line code NRZ

Opticalinterfacetype

I-1 S-1.1 L-1.1 L-1.2 Ve-1.2

Opticalsource type

MLM MLM MLM, SLM SLM SLM

Workingwavelength (nm)

1260–1360 1261–1360 1263–1360 1480–1580 1480–1580

Launchedopticalpower(dBm)

–15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0

Receiversensitivity(dBm)

–23 –28 –34 –34 –34

Overloadopticalpower(dBm)

–8 –8 –10 –10 –10

Min.extinctionratio (dB)

8.2 8.2 10 10 10

Note: MLM indicates the multi-longitudinal mode and SLM indicates the single-longitudinalmode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1.

The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications

The mechanical specifications of the N1SL1/N2SL1 are as follows:

l Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

The mechanical specifications of the R1SL1 are as follows:




l Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

l Weight (kg): 0.3

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the N1SL1/N2SL1 is14 W.

In the normal temperature (25℃), the maximum power consumption of the R1SL1 is 10.3 W.

5.2 SLQ1This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.

5.2.1 Version DescriptionThe SLQ1 board has three versions, R1, N1 and N2. The difference among the three versionslies in the support for the TCM function. The R1SLQ1 is a 4 x STM-1 optical interface board,which is housed in a divided slot in a subrack.

5.2.2 Function and FeatureThe SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forthe STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.

5.2.3 Working Principle and Signal FlowThe SLQ1 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module, RST and so on.

5.2.4 Front PanelOn the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and lasersafety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode.

5.2.5 Valid SlotsThe slots valid for the SLQ1 vary with the version of the board.

5.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLQ1 indicates the optical interface type.

5.2.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLQ1.

5.2.8 Technical SpecificationsThe technical specifications of the SLQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.

5.2.1 Version DescriptionThe SLQ1 board has three versions, R1, N1 and N2. The difference among the three versionslies in the support for the TCM function. The R1SLQ1 is a 4 x STM-1 optical interface board,which is housed in a divided slot in a subrack.

Table 5-6 lists the details on the versions of the SLQ1 board.



Table 5-6 Version Description of the SLQ1

Item Description

Functionalversion

The SLQ1 has three versions, R1, N1 and N2.

Difference The N2SLQ1 supports the TCM function. The N1SLQ1 and R1SLQ1do not support the TCM function. The R1SLQ1 is housed in a dividedslot.


5.2.2 Function and FeatureThe SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forthe STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.

Table 5-7 lists the functions and features of the SLQ1.

Table 5-7 Functions and features of the SLQ1

Function andFeature

SLQ1





Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and detection of the pluggable optical module SFP foreasy maintenance.

Serviceprocessing


Overheadprocessing

Supports the processing of the SOH bytes of the STM-1 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.Supports one to four channels of ECC communication.



Protectionscheme

Supports the two-fiber unidirectional MSP protection ring, linear MSP,SNCP, SNCTP and SNCMP.




Function andFeature

SLQ1

Maintenancefeature



Figure 5-4 shows the block diagram for the working principle of the SLQ1.

Figure 5-4 Block diagram for the working principle of the SLQ1


module


+3.3 Vbackup power

+3.3 V


SCC unit


Communication

High speed bus

+5 V

+1.8 V


Fuse

FuseDC/DC

converter

Cross-connect unit


155 MHzPLL



MSA HPTMSTRST

IIC

CDR

. . . .

. . . .

CDR

-48 V/ -60 V

155Mbit/sO/E

O/E

SPI

O/E

O/E

SPI



155Mbit/s

155Mbit/s155Mbit/s


155Mbit/s













section trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path

trace insertion, BIP-8 calculation and insertion.






detection, pointer justification.l In the transmit direction, MST it performs administration unit group (AUG) assembly,

AU-4 pointer generation, AU_AIS generation.

HPTl OH termination
















DC/DC ConverterIt provides the board with required DC voltages. It converts the –48/–60 V power supply to thefollowing voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.2.4 Front PanelOn the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and lasersafety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode.

Appearance of the Front PanelFigure 5-5 shows the appearance of the front panel of the N1SLQ1/N2SLQ1.

Figure 5-5 Front panel of the N1SLQ1/N2SLQ1

SLQ1

SLQ1STATACTPROGSRV

CLASS1LASER

PRODUCT

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4

Figure 5-6 shows the appearance of the front panel of the R1SLQ1.



Figure 5-6 Front panel of the R1SLQ1

SLQ1

SLQ1

STATACTPROGSRV

OU

T1IN

1O

UT2

OU

T3O

UT4

IN2

IN3

IN4

Indicators

The following indicators are present on the front panel of the board:






Interfaces

There are four pairs of optical interfaces on the front panel of the SLQ1. Table 5-8 lists the typeand usage of the optical interfaces.

Table 5-8 Optical interfaces of the SLQ1

Interfaces Interface Type Usage

IN1-IN4 LC Receives optical signals.

OUT1-OUT4 LC Transmits optical signals.

5.2.5 Valid SlotsThe slots valid for the SLQ1 vary with the version of the board.

The slots valid for the SLQ1 are as follows:

l The R1SLQ1 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500Asubrack.




l The N1SLQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l The N2SLQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l The R1SLQ1 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500Bsubrack.

l The N1SLQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

l The N2SLQ1 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.


Table 5-9 lists the relation between the board feature code and optical interface type for theSLQ1.



SSN2SLQ110,SSN1SLQ110

10 S-1.1


11 L-1.1


12 L-1.2


13 Ve-1.2


14 I-1


You can use the T2000 to set the following parameters for the SLQ1:

l J0

l J1

l C2






Table 5-10 lists the specifications of the optical interfaces of the SLQ1.

Table 5-10 Specifications of the optical interfaces of the SLQ1

Item Specification

Nominal bitrate

155.52 Mbit/s

Line code NRZ

Opticalinterface type

I-1 S-1.1 L-1.1 L-1.2 Ve-1.2

Optical sourcetype

MLM MLM MLM,SLM

SLM SLM

Workingwavelength(nm)

1260–1360 1261–1360 1263–1360 1480–1580 1480–1580

Launchedoptical power(dBm)

–15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0


–23 –28 –34 –34 –34

Overloadoptical power(dBm)

–8 –8 –10 –10 –10

Min. extinctionratio (dB)

8.2 8.2 10 10 10

Laser Safety Class




The mechanical specifications of the N1SLQ1/N2SLQ1 are as follows:


l Weight (kg): 1.0

The mechanical specifications of the R1SLQ1 are as follows:


l Weight (kg): 0.4




Power Consumption

In the normal temperature (25℃), the maximum power consumption of the N1SLQ1/N2SLQ1 is 15 W.

In the normal temperature (25℃), the maximum power consumption of the R1SLQ1 is 12 W.

5.3 SLO1This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.

5.3.1 Version DescriptionThe functional version of the SLO1 board is N1.

5.3.2 Function and FeatureThe SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to thesignals, to insert or extract the overhead bytes, and to generate alarm signals.

5.3.3 Working Principle and Signal FlowThe SLO1 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module, RST and so on.

5.3.4 Front PanelOn the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety classlabel.

5.3.5 Valid SlotsIf the SLO1 is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to eightoptical interfaces can be configured. If the SLO1 is housed in any of slots 11–13 of the OptiXOSN 1500B subrack, one to eight optical interfaces can be configured.

5.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLO1 indicates the optical interface type.

5.3.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLO1.

5.3.8 Technical SpecificationsThe technical specifications of the SLO1 cover the optical interface specifications, boarddimensions, weight and power consumption.

5.3.1 Version DescriptionThe functional version of the SLO1 board is N1.

5.3.2 Function and FeatureThe SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to thesignals, to insert or extract the overhead bytes, and to generate alarm signals.

Table 5-11 lists the functions and features of the SLO1.



Table 5-11 Functions and features of the SLO1 board

Function andFeature

SLO1

Basic function Receives and transmits 8 x STM-1 optical signals.

Specification of theoptical interface

Supports standard optical interfaces of the I-1.1, S-1.1, L-1.1, L-1.2and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 andL-1.2 types comply with ITU-T G.957 in features. The optical interfaceof the Ve-1.2 type complies with the standards defined by Huawei.

Specification of theoptical module

The optical module is pluggable. When optical modules of other typesare inserted, an alarm indicating the mismatch of the optical module isreported.Supports detection and query of the information on the optical module.Supports the default off state of the laser. The laser is turned off beforethe software finishes the initialization when the board is powered on.Supports the usage and detection of the pluggable optical module SFP.Supports the setting and query of the on/off state of the laser. An alarmis generated when the laser is turned off. Performance events arereported to indicate the performance of the optical module.

Service processing Supports the processing of the VC-12, VC-3 and VC-4 services.

Overheadprocessing

Supports the processing of the SOH bytes of the STM-1 signals.Supports the transparent transmission and termination of the POHbytes.If the two SCC boards are not in service, the SLO1 does not transmitoverhead bytes (long 0s) to the two SCC boards.Supports one to eight channels of ECC communication.

Alarm andperformance event


Protection scheme Supports the two-fiber unidirectional MSP protection ring, linear MSP,SNCP, SNCTP and SNCMP.

Maintenancefeature

Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information ofthe board.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.

5.3.3 Working Principle and Signal FlowThe SLO1 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module, RST and so on.

Figure 5-7 shows the block diagram for the working principle of the SLO1.




Figure 5-7 Block diagram for the working principle of the SLO1


module


+3.3 Vbackup power

+3.3 V


SCC unit


Communication

High speed bus

+5 V

+1.8 V


Fuse

FuseDC/DC

converter

Cross-connect unit


155 MHzPLL



MSA HPTMSTRST

IIC

CDR

. . . .

. . . .

CDR

-48 V/ -60 V

155Mbit/sO/E

O/E

SPI

O/E

O/E

SPI



155Mbit/s

155Mbit/s155Mbit/s


155Mbit/s




















detection, pointer justification.

l In the transmit direction, MST it performs administration unit group (AUG) assembly,AU-4 pointer generation, AU_AIS generation.

HPTl OH termination













DC/DC Converter

It provides the board with required DC voltages. It converts the –48/–60 V power supply to thefollowing voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.3.4 Front PanelOn the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety classlabel.

Figure 5-8 shows the front panel of the SLO1.




Figure 5-8 Front panel of the SLO1

SLO1

SLO1STATACTPROGSRV

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4

OU

T5O

UT6

OU

T7O

UT8

IN5

IN6

IN7

IN8

CLASS1LASER

PRODUCT

Indicators







Interfaces

There are eight pairs of optical interfaces on the front panel of the SLO1. Table 5-12 lists thetype and usage of the optical interfaces.

Table 5-12 Optical interfaces of the SLO1

Interfaces Interface Type Usage

IN1–IN8 LC Receives optical signals.

OUT1–OUT8 LC Transmits optical signals.



NOTE

The optical interfaces of the SLO1 are level optical interfaces and indented by 20 mm. The SLO1 boardcan use the pluggable optical modules for easy maintenance.

WARNINGThe optical interfaces of the SLO1 board are level optical interfaces. Thus, use the opticalattenuator only at the ODF side.

5.3.5 Valid SlotsIf the SLO1 is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to eightoptical interfaces can be configured. If the SLO1 is housed in any of slots 11–13 of the OptiXOSN 1500B subrack, one to eight optical interfaces can be configured.

5.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLO1 indicates the optical interface type.

Table 5-13 lists the relation between the board feature code and optical interface type for theSLO1.



SSN2SLO110 10 S-1.1

SSN2SLO111 11 L-1.1

SSN2SLO112 12 L-1.2

SSN2SLO113 13 Ve-1.2

SSN2SLO114 14 I-1

5.3.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLO1.

You can use the T2000 to set the following parameters for the SLO1:

l J0

l J1

l C2





5.3.8 Technical SpecificationsThe technical specifications of the SLO1 cover the optical interface specifications, boarddimensions, weight and power consumption.


Table 5-14 lists the specifications of the optical interfaces of the SLO1.

Table 5-14 Specifications of the optical interfaces of the SLO1

Item Specification

Nominal bit rate 155520 kbit/s

Line code NRZ

Optical interfacetype

I-1.1 S-1.1 L-1.1 L-1.2 Ve-1.2

Optical source type MLM MLM MLM,SLM

SLM SLM


1261–1360 1261–1360

1263–1360

1480–1580

1480–1580

Launched opticalpower (dBm)

–15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0

Receiversensitivity (dBm)

–23 –28 –34 –34 –34

Overload opticalpower (dBm)

–8 –8 –10 –10 –10


8.2 8.2 10 10 10

Laser Safety Class




The mechanical specifications of the SLO1 are as follows:


l Weight (kg): 1.1

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the SLO1 is 26W.



5.4 SLT1This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and specifications.

5.4.1 Version DescriptionThe functional version of the SLT1 board is N1.

5.4.2 Function and FeatureThe SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forSTM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.

5.4.3 Working Principle and Signal FlowThe SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processingmodule, RST and so on. The external services are accessed by the external interface boards EU08and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board.

5.4.4 Front PanelOn the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety classlabel.

5.4.5 Valid SlotsThe SLT1, housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to twelve opticalinterfaces can be configured. For the SLT1, housed in any of slots 11–13 of the OptiX OSN1500B subrack, one to twelve optical interfaces can be configured.

5.4.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLT1.

5.4.7 Technical SpecificationsThe technical specifications of the SLT1 cover the optical interface specifications, boarddimensions, weight and power consumption.

5.4.1 Version DescriptionThe functional version of the SLT1 board is N1.

5.4.2 Function and FeatureThe SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion forSTM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.

Table 5-15 lists the functions and features of the SLT1.

Table 5-15 Functions and features of the SLT1

Function andFeature

SLT1





Function andFeature

SLT1


Supports S-1.1 standard optical interfaces compliant with ITU-T G.957in features.


Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and detection of the pluggable optical module SFP foreasy maintenance.

Serviceprocessing


Overheadprocessing

Supports the processing of the SOH bytes of the STM-1 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.Supports one to eight channels of ECC communication.



Protectionscheme

Supports the two-fiber unidirectional MSP protection ring, linear MSPprotection ring, SNCP, SNCTP, and SNCMP.

Maintenancefeature


5.4.3 Working Principle and Signal FlowThe SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processingmodule, RST and so on. The external services are accessed by the external interface boards EU08and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board.

Figure 5-9 shows the block diagram for the working principle of the SLT1.



Figure 5-9 Block diagram for the working principle of the SLT1


module


+3.3 Vbackup power

+3.3 V


SCC unit


Communication

High speed bus

+5 V

+1.8 V


Fuse

FuseDC/DC

converter

Cross-connect unit


155 MHzPLL



MSA HPTMSTRST

IIC

CDR

. . . .

. . . .

CDR

-48 V/ -60 V

155Mbit/sO/E

O/E

SPI

O/E

O/E

SPI



155Mbit/s

155Mbit/s155Mbit/s


155Mbit/s























HPTl OH termination














5.4.4 Front PanelOn the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety classlabel.

Appearance of the Front PanelFigure 5-10 shows the appearance of the front panel of the SLT1.



Figure 5-10 Front panel of the SLT1

SLT1

SLT1STATACTPROGSRV

CLASS1LASER

PRODUCT

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4

OU

T5O

UT6

OU

T7O

UT8

OU

T9O

UT10

IN5

IN6

IN7

IN8

IN9

IN10

OU

T11O

UT12

IN11

IN12

Indicators







Interfaces

There are 12 pairs of optical interfaces on the front panel of the SLT1. Table 5-16 lists the typeand usage of the optical interfaces.

Table 5-16 Optical interfaces of the SLT1

Interface InterfaceType

Usage






WARNINGThe optical interfaces of the SLT1 board are level optical interfaces. Thus, use the opticalattenuator only at the ODF side.

5.4.5 Valid SlotsThe SLT1, housed in any of slots 12–13 of the OptiX OSN 1500A subrack, one to twelve opticalinterfaces can be configured. For the SLT1, housed in any of slots 11–13 of the OptiX OSN1500B subrack, one to twelve optical interfaces can be configured.

5.4.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLT1.

You can use the T2000 to set the following parameters for the SLT1:

l J0

l J1

l C2


5.4.7 Technical SpecificationsThe technical specifications of the SLT1 cover the optical interface specifications, boarddimensions, weight and power consumption.


Table 5-17 lists the specifications of the optical interfaces of the SLT1.

Table 5-17 Specifications of the optical interfaces of the SLT1

Item Specification

Nominal bit rate 155.52 Mbit/s

Line code NRZ

Optical interface type S-1.1

Optical source type MLM

Working wavelength (nm) 1261–1360

Launched optical power (dBm) –15 to –8

Receiver sensitivity (dBm) –28

Overload optical power (dBm) –8

Min. extinction ratio (dB) 8.2



Laser Safety Class




The mechanical specifications of the SLT1 are as follows:


l Weight (kg): 1.2

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the SLT1 is 15 W.

5.5 SEP1This section describes the SEP1 board, in terms of the version, function, working principle, frontpanel, and specifications.

5.5.1 Version DescriptionThe functional version of the SEP1 board is N1.

5.5.2 Function and FeatureThe SEP1 board processes STM-1 electrical signals.

5.5.3 Working Principle and Signal FlowThe SEP1 board consists of the line interface module and CDR module, SDH overheadprocessing module, RST and so on. The external services are accessed by the external interfaceboards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an opticalinterface board.

5.5.4 Front PanelOn the front panel of the SEP1, there are indicators, interfaces and barcode.

5.5.5 Valid SlotsWhen the SEP1 board is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, itcannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces areavailable on the front panel of the SEP1 board, it can be housed in any of slots 11–13. When theSEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housedin any of slots 12–13.

5.5.6 TPS Protection for the BoardThe TPS protection is equipment-level protection. When the working board fails, the accessedservices are switched to the protection board.

5.5.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SEP1.

5.5.8 Technical SpecificationsThe technical specifications of the SEP1 cover the board dimensions, weight and powerconsumption.




5.5.1 Version DescriptionThe functional version of the SEP1 board is N1.

When interfaces are available on the front panel of the SEP1 (the logical board is displayed asthe SEP1 on the T2000), the SEP1 processes 2 x STM-1 electrical signals. In this case, the SEP1is a 2 x STM-1 signal processing board. When the SEP1 is used with the interface board (thelogical board is displayed as the SEP on the T2000), the SEP1 processes 8 x STM-1 electricalsignals. In this case, the SEP1 is an 8 x STM-1 signal processing board. The physical boards forthe 2 x STM-1 signal processing board and 8 x STM-1 signal processing board are both theSEP1. Thus, they are defined as the SEP1 when the logical boards are not differentiated.

5.5.2 Function and FeatureThe SEP1 board processes STM-1 electrical signals.

Table 5-18 lists the functions and features of the SEP1.

Table 5-18 Functions and features of the SEP1

Function andFeature

SEP1

Basic function Processes 2 x STM-1 signals when interfaces are available on the frontpanel.Processes 8 x STM-1 signals when used with the interface board.


Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state of thelaser and the ALS function.Supports the usage and monitoring of the pluggable optical module SFP.

Serviceprocessing


Overheadprocessing




Protectionscheme

Supports the TPS protection when used with the interface board and theswitching board.Supports the two-fiber unidirectional MSP protection ring, linear MSPprotection, and SNCP.



Function andFeature

SEP1

Maintenancefeature


When the SEP1 is used with different interface boards and electrical interface switching boards,the access capabilities for the STM-1 signals are different. See Table 5-19.

Table 5-19 Access capabilities for the SEP1

Interface Board SEP1

None Accesses and processes 2 x STM-1 electrical signals, and does notsupport the TPS protection.

EU08 Accesses and processes 8 x STM-1 electrical signals.

OU08 Accesses and processes 8 x STM-1 optical signals.

EU08+OU08 The hybrid usage is not supported.

EU08+TSB8 Accesses and processes 8 x STM-1 electrical signals, and supports theTPS protection for the SEP1 board.

CAUTIONWhen the SEP1 is used with the interface board, the two interfaces on the front panel are invalid.The hybrid usage of the EU08 and OU08 is not supported.

5.5.3 Working Principle and Signal FlowThe SEP1 board consists of the line interface module and CDR module, SDH overheadprocessing module, RST and so on. The external services are accessed by the external interfaceboards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an opticalinterface board.

Figure 5-11 shows the block diagram for the working principle of the SEP1.




Figure 5-11 Block diagram for the working principle of the SEP1

Port 1

Port 2

Communication andcontrol module

Cross-connectunit A

SDH overhead processing module

DCC

K1 and K2insertion/extration

SCC unit

LOS

SCC unitCommunication

high speedbus

RST MST MSA HPT

Cross-connect unit

Cross-connectunit B

high speedbus

155 MHz PLL Cross-connect unitReference clock

155 Mbit/s

155 Mbit/s 155 Mbit/s

155 Mbit/sCDRTransfor

mer

CMI NRZ

155 Mbit/s

155 Mbit/s 155 Mbit/sCDR

CMI NRZ 155 Mbit/s

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V

-48 V/ -60 VDC/DCconverter

+1.8 V

Encode/Decode

Transformer

Frame header Cross-connectunit

K1 and K2

Encode/Decode

SPI

Figure 5-12 shows the block diagram for the working principle of the SEP used with the EU08.

Figure 5-12 Block diagram for the working principle of the SEP used with the EU08


Cross-connect unitA

SDH overhead processingmodule

DCC


SCC unit

LOS


high speedbus

RST MST MSA HPT

Cross-connectunit

Cross-connect unitB

high speedbus

155 MHz PLL Cross-connectunit

Reference clock

155 Mbit/s



mer

CMI NRZ

155 Mbit/s

155 Mbit/s 155 Mbit/sCDR

CMI NRZ

155 Mbit/s

155 Mbit/s

155 Mbit/s

155 Mbit/s

155 Mbit/s

155 Mbit/sCMI

155 Mbit/s

155 Mbit/sEncode

/Decode

Transformer

CMI

Port 1

Port 8

Port 1

Port 2

CDR

CDR155 Mbit/s

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


+1.8 V

Transformer

Transformer

EU08

Encode/

Decode

Encode/Decode

Encode/Decode

SPI


K1 and K2

Figure 5-13 shows the block diagram for the working principle of the SEP used with the OU08.



Figure 5-13 Block diagram for the working principle of the SEP used with the OU08

Port 1

Port 2




DCC


SCC unit

LOS


high speedbus

RST MST MSA HPT

Cross-connect unit

Cross-connect unitB

high speedbus

155 MHz PLL Cross-connect unitReference clock

155 Mbit/s



mer

CMI NRZ

155 Mbit/s

155 Mbit/s 155 Mbit/sCDRCMI NRZ

155 Mbit/s

155 Mbit/s

155 Mbit/s

155 Mbit/s

CDR

CDR155 Mbit/s

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


+1.8 V

Transformer

LOSLaser shut down

155 Mbit/s

155 Mbit/s

155 Mbit/s

155 Mbit/sPort 1

Port 8

O/E

O/E

O/E

O/E

OU08

NRZ

NRZ

Encode/Decode

Encode/Decode

SPI

SPI

Frame header Cross-connect unit

K1 and K2

The function modules are described below:

Line Interface Module and CDR Modulel In the receive direction, the received electrical signals (CMI code) are isolated through the

converter and then transmitted to the decoding unit. The CDR module then recovers thedata and clock signals after decoding.

l In the transmit direction, the SDH signals, which are processed by the overhead processingunit, are transmitted to the encoding unit. After isolation by converter, 155 Mbit/s electricalsignals (CMI code) are output. The encoding and decoding unit monitors R_LOS alarms.

SDH Overhead Processing Modulel This module includes RST, MST, MSA and HPT. It also provides inloop and outloop

function.




MSTl In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery,

MS_RDI and MS_AIS detection.l In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI

MS_RDI and MS_AIS insertion.




l Provides extraction or insertion of K1 byte and K2 byte.


detection, pointer justification.l In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation,

AU_AIS generation.

HPTl OH termination








l Traces the clock signal from the active and the standby cross-connect unit.


l Realizes the pass-through of orderwire and ECC bytes between the paired slots constitutingthe ADM when the CXL is not online.



DC/DC Converter ModuleIt provides the board with required DC voltages. It converts the –48 V/ –60 V power supply tothe following voltages: + 3.3 V, + 1.8 V. It also provides protection for +3.3 V power supply.

5.5.4 Front PanelOn the front panel of the SEP1, there are indicators, interfaces and barcode.

Appearance of the Front PanelFigure 5-14 shows the appearance of the front panel of the SEP1.



Figure 5-14 Front panel of the SEP1

SEP1

SEP1

STATACTPROGSRV

OU

T1IN

1O

UT2

IN2







InterfacesThere are two pairs of optical interfaces on the front panel of the SEP1. Table 5-20 lists the typeand usage of the optical interfaces.




Table 5-20 Electrical interfaces of the SEP1

Interface Interface Type Usage

IN1-IN2 75-ohm SMB Receives the STM-1 signals.

OUT1-OUT2 75-ohm SMB Transmits the STM-1 signals.

Note: The SEP1 board can also be used with interface boards EU08 and OU08. In this case,the SEP1 is defined as the SEP. When the SEP1 is used with the interface board, the twointerfaces on the front panel are invalid.

5.5.5 Valid SlotsWhen the SEP1 board is housed in any of slots 12–13 of the OptiX OSN 1500A subrack, itcannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces areavailable on the front panel of the SEP1 board, it can be housed in any of slots 11–13. When theSEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housedin any of slots 12–13.

5.5.6 TPS Protection for the BoardThe TPS protection is equipment-level protection. When the working board fails, the accessedservices are switched to the protection board.

In this way, complex network-level protection, such as the MSP and SNCP, are not triggered,but the reliability of the equipment can be ensured.

The OptiX OSN 1500B supports the TPS protection for the SEP1. The SEP1 board can be usedwith the EU08 and TSB8 boards to realize the 1:1 TPS protection for 2 x STM-1 electricalsignals. The OptiX OSN 1500A does not support the SEP1 board.

Protection PrincipleFigure 5-15 shows the principle of the TPS protection for the SEP1 board.

Figure 5-15 Principle of the TPS protection for the SEP1

SEP

TSB8 EU08

SLOT12

SLOT 9/10

12 1 2

8×STM-1(e)

SLOT13

SEP

Switch controlsignal

Fail

WorkingProtection

Cross-connect

and timingboard



l Normal state: When the working boards are running normally, the control switch of theEU08 is in position 1 and the EU08 directly accesses the service signals to the SEP1 board.

l Switching state: When a failure is detected on the working board, the working board housedin each slot can be protected in the following ways.– When the working board housed in slot 13 fails, the control switch of the corresponding

EU08 shifts from position 1 to position 2. At the same time, the control switch of theTSB8 shifts from position 1 to position 2, and thus the working board housed in slot 13is protected by the protection board housed in slot 12.

Hardware Configuration

Figure 5-16 shows the slot configuration for the 1:1 TPS protection for the SEP1.

Figure 5-16 Slot configuration for the 1:1 TPS protection for the SEP1

Slot 14PIU

Slot 20

FAN

AUX

TSB8

EU08

Protection

Working

CXL16/4/1 EOW

PIU

Slot 15

Slot 16

Slot 17

Slot 11

Slot 12

Slot 13

Slot 4

Slot 5

Slot 18

Slot 19

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10CXL16/4/1

As shown in Figure 5-16, the protection board housed in slot 12 protects the board housed inslot 13.

Table 5-21 lists the slots for the SEP1, EU08 and TSB8.

Table 5-21 Slots for the SEP1, EU08 and TSB8

Board Protection Group

SEP1 (working board) Slot 12

TSB8 Slot 14

SEP1 (working board) Slot 13

EU08 Slot 16

5.5.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SEP1.

You can use the T2000 to set the following parameters for the SEP1:

l J0




l J1

l C2


5.5.8 Technical SpecificationsThe technical specifications of the SEP1 cover the board dimensions, weight and powerconsumption.

Table 5-22 Technical specifications of the SEP1 board

Item Specification

Nominal bit rate 155.520 Mbit/s

Line code Coded mark inversion (CMI), NRZ

Connector SMB

Mechanical SpecificationsThe mechanical specifications of the SEP1 are as follows:


l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the SEP1 is 17 W.


5.6.1 Version DescriptionThe SL4 board has three versions, R1, N1 and N2. The difference among the three versions liesin the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which ishoused in a divided slot in a subrack.

5.6.2 Function and FeatureThe SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overheadbytes, and to perform the MSP protection.


5.6.4 Front PanelOn the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safetyclass label.On the front panel of the R1SL4, there are indicators, interfaces and barcode.

5.6.5 Valid Slots



The slots valid for the SL4 vary with the version of the board.




5.6.1 Version DescriptionThe SL4 board has three versions, R1, N1 and N2. The difference among the three versions liesin the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which ishoused in a divided slot in a subrack.



Item Description

Functionalversion

The SL4 has three versions, R1, N1 and N2.

Difference The N2SL4 supports the TCM function. The N1 and R1SL4 do notsupport the TCM function. The R1SL4 is housed in a divided slot.


5.6.2 Function and FeatureThe SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overheadbytes, and to perform the MSP protection.

The SL4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion forSTM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.



Function andFeature

SL4

Basic function Receives and transmits 1 x STM-4 optical signals, and processes 1 xSTM-4 standard or concatenation services.


Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 andVe-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2types comply with ITU-T G.957 in features. The optical interface of theVe-4.2 type complies with the standards defined by Huawei.




Function andFeature

SL4

Specification ofthe optical module

Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and monitoring of the pluggable optical module SFP.

Serviceprocessing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenationservices.

Overheadprocessing




Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP protectionring, linear MSP, SNCP, SNCTP, and SNCMP.Supports the optical-path-shared MSP and SNCP protection.

Maintenancefeature








module


+3.3 Vbackup power

+3.3 V


SCC unit


Communication

High speed bus

+5 V

+1.8 V


Fuse

FuseDC/DC

converter

Cross-connect unit


155 MHzPLL



MSA HPTMSTRST

IIC

CDR

. . . .

. . . .

CDR

-48 V/ -60 V

O/E

O/E

SPI

O/E

O/E622Mbit/s

SPI


K1 and K2

622Mbit/s

622Mbit/s


622Mbit/s

622Mbit/s

622Mbit/s622Mbit/s























HPTl OH termination














5.6.4 Front PanelOn the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safetyclass label.On the front panel of the R1SL4, there are indicators, interfaces and barcode.

Appearance of the Front PanelFigure 5-18 shows the appearance of the front panel of the N1SL4/N2SL4.



Figure 5-18 Front panel of the N1SL4/N2SL4

SL4

SL4

STATACTPROGSRV

CLASS1LASER

PRODUCT

OUT

IN

Figure 5-19 shows the appearance of the front panel of the R1SL4.

Figure 5-19 Front panel of the R1SL4

STATACTPROGSRV

OU

TIN

SL4

SL4

Indicators










Interfaces

There is one pair of optical interfaces on the front panel of the SL4. Table 5-25 lists the typeand usage of the optical interfaces.





The SL4 board can use the pluggable optical modules for easy maintenance.


The slots valid for the SL4 are as follows:

l The R1SL4 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500Asubrack.



l The R1SL4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500Bsubrack.




Table 5-26 lists the relation between the board feature code and optical interface type for theSL4.

Table 5-26 Relation between the board feature code and the optical interface type of the SL4


SSN1SL410, SSN2SL410 10 S-4.1




SSN1SL411, SSN2SL411 11 L-4.1

SSN1SL412, SSN2SL412 12 L-4.2

SSN1SL413, SSN2SL413 13 Ve-4.2

SSN1SL414, SSN2SL414 14 I-4



l J0

l J1

l C2






Item Specification


Line code NRZ


I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

Optical sourcetype

MLM MLM SLM SLM SLM


1261–1360 1274–1356 1280–1335 1480–1580 1480–1580


–15 to –8 –15 to –8 –3 to +2 –3 to +2 –3 to +2


–23 –28 –28 –28 –34




Item Specification


–8 –8 –8 –8 –13


8.2 8.2 10 10 10.5

Laser Safety ClassThe safety class of the laser on the board is CLASS 1.


Mechanical SpecificationsThe mechanical specifications of the N1SL4/N2SL4 are as follows:


l Weight (kg): 1.0

The mechanical specifications of the R1SL4 are as follows:


l Weight (kg): 0.5

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the N1SL4/N2SL4 is15 W.

In the normal temperature (25℃), the maximum power consumption of the R1SL4 is 10 W.

5.7 SLD4This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version,function, working principle, front panel and specifications.

5.7.1 Version DescriptionThe SLD4 board has three versions, R1, N1 and N2. The difference among the three versionslies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board,which is housed in a divided slot in a subrack.

5.7.2 Function and FeatureThe SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion forSTM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.

5.7.3 Working Principle and Signal FlowThe SLD4 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module so on.

5.7.4 Front PanelOn the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and lasersafety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode.



5.7.5 Valid SlotsThe slots valid for the SLD4 vary with the cross-connect capacity of the subrack.

5.7.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLD4 indicates the optical interface type.

5.7.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLD4.

5.7.8 Technical SpecificationsThe technical specifications of the SLD4 cover the optical interface specifications, boarddimensions, weight and power consumption.

5.7.1 Version DescriptionThe SLD4 board has three versions, R1, N1 and N2. The difference among the three versionslies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board,which is housed in a divided slot in a subrack.

Table 5-28 lists the details on the versions of the SLD4 board.

Table 5-28 Version Description of the SLD4

Item Description

Functionalversion

The SLD4 has three versions, R1, N1 and N2.

Difference The N2SLD4 supports the TCM function. The N1SLD4 and R1SLD4do not support the TCM function. The SLD4 board of the R1SLD4 ishoused in a divided slot.


5.7.2 Function and FeatureThe SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion forSTM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.

Table 5-29 lists the functions and features of the SLD4.

Table 5-29 Functions and features of the SLD4

Function andFeature

SLD4

Basic function Receives and transmits 2 x STM-4 optical signals, and processes 2 xSTM-4 standard or concatenation services.


Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 andVe-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2types comply with ITU-T G.957 in features. The optical interface of theVe-4.2 type complies with the standards defined by Huawei.




Function andFeature

SLD4

Specifications ofthe optical module

Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and monitoring of the pluggable optical module SFP.

Serviceprocessing


Overheadprocessing

Supports the processing of the SOH bytes of the STM-4 signals.Supports the transparent transmission or termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.Supports one to two channels of ECC communication.



Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP protectionring, linear MSP, SNCP, SNCTP, and SNCMP.Supports the optical-path-shared MSP and SNCP protection.

Maintenancefeature


5.7.3 Working Principle and Signal FlowThe SLD4 board consists of the O/E conversion module, CDR module, SDH overheadprocessing module so on.

Figure 5-20 shows the block diagram for the working principle of the SLD4.



Figure 5-20 Block diagram for the working principle of the SLD4


module


+3.3 Vbackup power

+3.3 V


SCC unit


Communication

High speed bus

+5 V

+1.8 V


Fuse

FuseDC/DC

converter

Cross-connect unit


155 MHzPLL



MSA HPTMSTRST

IIC

CDR

. . . .

. . . .

CDR

-48 V/ -60 V

O/E

O/E

SPI

O/E

O/E622Mbit/s

SPI


K1 and K2

622Mbit/s

622Mbit/s


622Mbit/s

622Mbit/s

622Mbit/s622Mbit/s























HPTl OH termination














5.7.4 Front PanelOn the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and lasersafety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode.

Appearance of the Front PanelFigure 5-21 shows the appearance of the front panel of the N1SLD4/N2SLD4.



Figure 5-21 Front panel of the N1SLD4/N2SLD4

SLD4

SLD4

STATACTPROGSRV

CLASS1LASER

PRODUCT

OU

T1IN

1O

UT2

IN2

Figure 5-22 shows the appearance of the front panel of the R1SLD4.

Figure 5-22 Front panel of the R1SLD4

STATACTPROGSRV

SLD4

SLD4

OU

TIN

OU

TIN










InterfacesThere are two pairs of optical interfaces on the front panel of the SLD4. Table 5-30 lists thetype and usage of the optical interfaces.

Table 5-30 Optical interfaces of the SLD4




The SLD4 board can use the pluggable optical modules for easy maintenance.

5.7.5 Valid SlotsThe slots valid for the SLD4 vary with the cross-connect capacity of the subrack.

The slots valid for the SLD4 are as follows:

l The R1SLD4 can be housed in any of slots 2–3, 6–9 and 12–13 in the OptiX OSN 1500Asubrack.

l The N1SLD4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l The N2SLD4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

l The R1SLD4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500Bsubrack. For the board housed in any of slots 1–3 and 11–13, two optical interfaces can beconfigured. For the board housed in any of slots 6–9, one optical interface can be configured.

l The N1SLD4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

l The N2SLD4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.7.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SLD4 indicates the optical interface type.

Table 5-31 lists the relation between the board feature code and optical interface type for theSLD4.



Table 5-31 Relation between the board feature code and the optical interface type of the SLD4


SSN1SLD410,SSN2SLD410

10 S-4.1


11 L-4.1


12 L-4.2


13 Ve-4.2


14 I-4

5.7.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SLD4.

You can use the T2000 to set the following parameters for the SLD4:

l J0

l J1

l C2


5.7.8 Technical SpecificationsThe technical specifications of the SLD4 cover the optical interface specifications, boarddimensions, weight and power consumption.


Table 5-32 lists the specifications of the optical interfaces of the SLD4.

Table 5-32 Specifications of the optical interfaces of the SLD4

Item Specification


Line code NRZ


I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

Optical sourceinterface

MLM MLM SLM SLM SLM




Item Specification


1261–1360 1274–1356 1280–1335 1480–1580 1480–1580


–15 to –8 –15 to –8 –3 to +2 –3 to +2 –3 to +2


–23 –28 –28 –28 –34


–8 –8 –8 –8 –13


8.2 8.2 10 10 10.5



Mechanical SpecificationsThe mechanical specifications of the N1SLD4/N2SLD4 are as follows:


l Weight (kg): 1.0

The mechanical specifications of the R1SLD4 are as follows:


l Weight (kg): 0.5

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the N1SLD4/N2SLD4is 15 W.

In the normal temperature (25℃), the maximum power consumption of the R1SLD4 is 11 W.

5.8 SLQ4This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version,function, working principle, front panel and specifications.

5.8.1 Version DescriptionThe SLQ4 board has two versions, N1 and N2. The difference between the two versions lies inthe support for the TCM function.



5.8.2 Function and FeatureThe SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion forSTM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.


5.8.4 Front PanelOn the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety classlabel.

5.8.5 Valid SlotsThe SLQ4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SLQ4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.




5.8.1 Version DescriptionThe SLQ4 board has two versions, N1 and N2. The difference between the two versions lies inthe support for the TCM function.

Table 5-33 lists the details on the versions of the SLQ4 board.

Table 5-33 Version Description of the SLQ4

Item Description

Functionalversion

The SLQ4 has two versions, N1 and N2.

Difference The N2SLQ4 supports the TCM function. The N1SLQ4 does not supportthe TCM function.


5.8.2 Function and FeatureThe SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion forSTM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.

Table 5-34 lists the functions and features of the SLQ4.




Table 5-34 Functions and features of the SLQ4

Function andFeature

SLQ4





Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and monitoring of the pluggable optical module SFP .

Serviceprocessing


Overheadprocessing

Supports the processing of the SOH bytes of the STM-4 signals.Supports the transparent transmission or termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.Supports one to four channels of ECC communication.



Protectionscheme

Supports the two-fiber MSP protection ring, four-fiber MSP protectionring, linear MSP, SNCP, SNCTP and SNCMP.Supports the optical-path-shared MSP and SNCP protection.

Maintenancefeature



Figure 5-23 shows the block diagram for the working principle of the SLQ4.



Figure 5-23 Block diagram for the working principle of the SLQ4


module


+3.3 Vbackup power

+3.3 V


SCC unit


Communication

High speed bus

+5 V

+1.8 V


Fuse

FuseDC/DC

converter

Cross-connect unit


155 MHzPLL



MSA HPTMSTRST

IIC

CDR

. . . .

. . . .

CDR

-48 V/ -60 V

O/E

O/E

SPI

O/E

O/E622Mbit/s

SPI


K1 and K2

622Mbit/s

622Mbit/s


622Mbit/s

622Mbit/s

622Mbit/s622Mbit/s























HPTl OH termination














5.8.4 Front PanelOn the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety classlabel.

Appearance of the Front PanelFigure 5-24 shows the appearance of the front panel of the SLQ4.



Figure 5-24 Front panel of the SLQ4

SLQ4

SLQ4

STATACTPROGSRV

CLASS1LASER

PRODUCT

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4







InterfacesThere are four pairs of optical interfaces on the front panel of the SLQ4. Table 5-35 lists thetype and usage of the optical interfaces.

Table 5-35 Optical interfaces of the SLQ4




The SLQ4 board can use the pluggable optical modules for easy maintenance.




5.8.5 Valid SlotsThe SLQ4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SLQ4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.


Table 5-36 lists the relation between the board feature code and optical interface type for theSLQ4.

Table 5-36 Relation between the board feature code and the optical interface type of the SLQ4

Board Feature Code Optical interface type


10 S-4.1


11 L-4.1


12 L-4.2


13 Ve-4.2


14 I-4


You can use the T2000 to set the following parameters for the SLQ4:

l J0

l J1

l C2




Table 5-37 lists the specifications of the optical interfaces of the SLQ4.



Table 5-37 Specifications of the optical interfaces of the SLQ4

Item Specification


Line code NRZ


I-4 S-4.1 L-4.1 L-4.2 Ve-4.2

Optical sourcetype

MLM MLM SLM SLM SLM


1261–1360 1274–1356 1280–1335 1480–1580 1480–1580


–15 to –8 –15 to –8 –3 to +2 –3 to +2 –3 to +2


–23 –28 –28 –28 –34


–8 –8 –8 –8 –13


8.2 8.2 10 10 10.5



Mechanical SpecificationsThe mechanical specifications of the SLQ4 are as follows:


l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the SLQ4 is 16 W.


5.9.1 Version Description




The SL16 board has three versions, N1, N2 and N3. The difference among the three versionslies in the support for the TCM function and AU-3 services.

5.9.2 Function and FeatureThe SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process theoverhead.

5.9.3 Working Principle and Signal FlowThe SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overheadprocessing module, RST and so on.

5.9.4 Front PanelOn the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label,and APD alarm label.

5.9.5 Valid SlotsThe SL16 board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and anyof slots 11–13 in the OptiX OSN 1500B subrack.




5.9.1 Version DescriptionThe SL16 board has three versions, N1, N2 and N3. The difference among the three versionslies in the support for the TCM function and AU-3 services.



Item Description

Functionalversion

The SL16 has three versions, N1, N2 and N3.

Difference The N1SL16 does not support the TCM function and AU-3 services.The N2SL16 supports the TCM function, and it can be configured withAU-3 services.The TCM function and AU-3 services cannot be configured on theN3SL16 at the same time.The N3SL16 supports the board version replacement function.



Item Description

Replaceability The N1SL16 and N2SL16 cannot be replaced by each other.When the TCM function and AU-3 services are not required, the N3SL16can fully replace the N2SL16 and N1SL16.The N3SL16 supports the board version replacement function and canreplace the N1SL16. After the N1SL16 is replaced, the N3SL16 isconsistent with the N1SL16 in configuration and service status.

5.9.2 Function and FeatureThe SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process theoverhead.



Functionand Feature

SL16


Specificationof the opticalinterface

Supports optical interfaces of the L-16.2, L-16.2Je, V-16.2Je (with BA),U-16.2Je (with BA and PA) types. The optical interface of the L-16.2 typecomplies with ITU-T G.957 and ITU-T G.692 in features. The opticalinterfaces of the L-16.2Je, V-16.2Je (with BA), and U-16.2Je (with BA andPA) comply with the standards defined by Huawei.Supports the output of standard wavelengths that comply with ITU-T G.692.The U-16.2Je optical interface can be directly connected to the DWDMequipment.

Specificationof the opticalmodule

Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state of thelaser and the ALS function.

Serviceprocessing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, andVC-4-16c concatenation services.Supports AU-3 services.

Overheadprocessing

Supports the processing of the SOH of the STM-16 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.


Provides rich alarms and performance events.

Processing ofthe K byte

Processes two sets of K bytes. One SL16 board supports a maximum of twoMSP protection rings.




Functionand Feature

SL16

Specificationsof the REG

Supports the setting and query of the REG working mode.

Protectionscheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring,linear MSP protection, SNCP, SNCTP and SNCMP.Supports the optical-path-shared MSP and SNCP protection.

Maintenancefeature

Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.

5.9.3 Working Principle and Signal FlowThe SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overheadprocessing module, RST and so on.



2.488Gbit/s

2.488Gbit/s


module

Cross-connectunit A

+3.3 V backup power+3.3 V

16 x 155Mbit/s


DCCSCC unit


Communication

2.488Gbit/s

2.488Gbit/s

high speed bus

5 V

+1.8 V

+3.3 V -48 V/-60 VDC/DCconverter

Fuse

FuseDC/DC

converter

Cross-connectunit

Cross-connectunit B

high speed bus

155 MHzPLL

Cross-connectunit

155 MHz Reference clock

16 x 155Mbit/s


MSA HPTMSTRST

MUX

DEMUX

IIC

-48 V/-60 V


K1 and K2

O/E

SPI

O/E

O/E Conversion Modulel In the receive direction, it converts the received optical signals into electrical signals.



l In the transmit direction, it converts the electrical signals into SDH optical signals, and thensend optical signals to fibers for transmission.

l The SPI detects the R_LOS alarm and provides the function to shut down the laser.

MUX/DEMUX Modulel In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into

multiple parallel electrical signals, and recovery the clock signal at the same time.l In the transmit direction, the MUX part multiplexes the parallel electrical signals received

from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing ModuleIt includes RST, MST, MSA and HPT, and provides outloop and inloop function.

RSTl In the receiving direction, RST performs frame alignment detection (A1, A2), regenerator

section trace recovery (J0) and mismatch detection, and BIP-8 errored block count.l In the transmitting direction, RST performs frame alignment insertion, regenerator section

path trace insertion, BIP-8 calculation and insertion.

MSTl In the receiving direction, MST performs BIP-24 errored block count, MS_REI recovery,

MS_RDI and MS_AIS detection.l In the transmitting direction, MST performs calculation and insertion of BIP-24, insertion

of MS_REI MS_RDI and MS_AIS.l Provides extraction or insertion of K1 byte and K2 byte.

MSAl In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS

detection, pointer justification.l In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation, and

AU_AIS generation.

HPTl OH termination











l Tracing the clock signal from the active and the standby cross-connect units.

l Implements laser controlling function.




DC/DC Converter Modulel This module provides the board with required DC voltages. It converts the –48/–60 V power

supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also providesprotection for the board +3.3V power supply.

5.9.4 Front PanelOn the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label,and APD alarm label.

Appearance of the Front Panel

Figure 5-26 shows the appearance of the front panel of the SL16.

Figure 5-26 Front panel of the SL16

SL16

SL16

STATACTPROGSRV

CLASS 1LASER

PRODUCT

OUT

IN

! APDReceiver

MAX:-9dBm



Indicators







Interfaces

There is one pair of optical interfaces on the front panel of the SL16. Table 5-40 lists the typeand usage of the optical interfaces.





5.9.5 Valid SlotsThe SL16 board can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, and anyof slots 11–13 in the OptiX OSN 1500B subrack.


Table 5-41 lists the relation between the board feature code and optical interface type for theSL16.

Table 5-41 Relation between the board feature code and the optical interface type for the SL16

Board Feature Code Optical interface type

SSN1SL1601, SSN2SL1601 01 L-16.2

SSN1SL1602,SSN2SL1602, SSN3SL1602

02 L-16.2Je


03 V-16.2Je


04 U-16.2






l J0

l J1

l C2






Item Specification

Nominalbit rate

2488320 kbit/s

OpticalInterfaceType

L-16.2 L-16.2Je V-16.2Je (BA) U-16.2Je (BA+PA)

Opticalsource type

SLM SLM SLM SLM


1500–1580 1530–1560 1530–1565 1550.12


–2 to +3 5 to 7 –2 to +3(withoutBA)

13 to 15(with BA)

–2 to +3(withoutBA andPA)

15 to 18(with BA)


–28 –28 –28 –28(withoutPA andBA)

–32 (withPA)


–9 –9 –9 –9(withoutPA andBA)

–10 (withPA)



Item Specification


8.2 8.2 8.2 8.2

Note: The optical interface of the Le-16.2 type is the same as the optical interface of theL-16.2Je type.The launched optical power of the optical interface of the V-16.2Je type is measured whenthe booster amplifer (BA) is added. The launched optical power of the optical interfaces ofthe V-16.2Je and U-16.2Je types ranges from –2 dBm to –3 dBm when no BA is added.

Table 5-43 Specifications of the ITU-T G.692-compliant optical interfaces that output standardwavelengths

Item Specification


Dispersion limit (km) 170 640

Mean launched optical power (dBm) –2 to +3 –5 to –1

Receiver sensitivity (dBm) –28 –28

Min. overload (dBm) –9 –9

Max. allowed dispersion (ps/nm) 3400 10880

Min. extinction ratio (dB) 8.2 10



Mechanical SpecificationsThe mechanical specifications of the SL16 are as follows:


l Weight (kg): 1.1

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the N1SL16 is 20 W.

In the normal temperature (25℃), the maximum power consumption of the N2SL16 is 20 W.

In the normal temperature (25℃), the maximum power consumption of the N3SL16 is 22 W.




5.10 SL16AThis section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version,function, working principle, front panel and specifications.

5.10.1 Version DescriptionThe SL16A board has three versions, N1, N2, and N3. The difference among the three versionslies in the support for the TCM function.

5.10.2 Function and FeatureThe SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process theoverhead bytes, and to perform the MSP protection.

5.10.3 Working Principle and Signal FlowThe SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDHoverhead processing module, RST and so on.

5.10.4 Front PanelOn the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label,and APD alarm label.

5.10.5 Valid SlotsThe SL16A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SL16Acan be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.10.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL16A indicates the optical interface type.

5.10.7 Board Configuration ReferenceYou can use the T2000 to set the J0 parameter for the SL16A.

5.10.8 Technical SpecificationsThe technical specifications of the SL16A cover the optical interface specifications, boarddimensions, weight and power consumption.

5.10.1 Version DescriptionThe SL16A board has three versions, N1, N2, and N3. The difference among the three versionslies in the support for the TCM function.

Table 5-44 lists the details on the versions of the SL16A board.

Table 5-44 Version Description of the SL16A

Item Description

Functionalversion

The SL16A has three versions, N1, N2, and N3.



Item Description

Difference The N1SL16A does not support the TCM function and AU-3 services.The N2SL16A supports the TCM function, and it can be configured withAU-3 services.The TCM function and AU-3 services cannot be configured on theN3SL16A at the same time.The N3SL16A supports the board version replacement function and canreplace the N3SL16A and N1SL16A. After the N3SL16A and N1SL16Aare replaced, the N3SL16A and N1SL16A are consistent with theN1SL16A in configuration and service status.

Replaceability The N1SL16A and N2SL16A cannot be replaced by each other.When the TCM function and AU-3 services are not required, theN3SL16A can fully replace the N2SL16A and N1SL16A.

5.10.2 Function and FeatureThe SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process theoverhead bytes, and to perform the MSP protection.

Table 5-45 lists the functions and features of the SL16A.

Table 5-45 Functions and features of the SL16A

Function andFeature

SL16A

Basic function Transmit and receive 1 x STM-16 optical signals.


Supports optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2 types.The optical interfaces comply with ITU-T G.957 and ITU-T G.692 infeatures.Supports the output of standard wavelengths that comply with ITU-TG.692 and can be directly connected to the DWDM equipment.


Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state ofthe laser and the ALS function.Supports the usage and monitoring of the SFP pluggable opticalmodule.

Service processing Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, andVC-4-16c concatenation services.

Overheadprocessing

Supports the processing of the SOH bytes of the STM-16 signals.Supports the transparent transmission and termination of the POHbytes. Supports the setting and query of the J0 bytes.


Provides rich alarms and performance events.




Function andFeature

SL16A

Processing of the Kbyte

Processes two sets of the K bytes.

Specifications ofthe REG


Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSP protectionring, linear MSP protection, SNCP, SNCTP and SNCMP.Supports the optical-path-shared MSP and SNCP protection.

Maintenancefeature

Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports AU-3 services.

5.10.3 Working Principle and Signal FlowThe SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDHoverhead processing module, RST and so on.

Figure 5-27 shows the block diagram for the working principle of the N1SL16A and N2SL16A.

Figure 5-27 Block diagram for the working principle of the N1SL16A and N2SL16A

2.488Gbit/s

2.488Gbit/s


module

Cross-connectunit A


16 x 155Mbit/s


DCCSCC unit


Communication

2.488Gbit/s

2.488Gbit/s

high speed bus

5 V

+1.8 V


Fuse

FuseDC/DC

converter

Cross-connectunit

Cross-connectunit B

high speed bus

155 MHzPLL

Cross-connectunit


16 x 155Mbit/s


MSA HPTMSTRST

MUX

DEMUX

IIC

-48 V/-60 V


K1 and K2

O/E

SPI

O/E



Figure 5-28 shows the block diagram for the working principle of the N3SL16A.

Figure 5-28 Block diagram for the working principle of the N3SL16A

2.488Gbit/s

2.488Gbit/s


module

Cross-connectunit A



DCCSCC unit


Communication

2.488Gbit/s

2.488Gbit/s

high speed bus

5 V

+1.8 V


Fuse

FuseDC/DC

converter

Cross-connectunit

Cross-connectunit B

high speed bus

155 MHzPLL

Cross-connectunit


16 x 155Mbit/s


MSA HPTMSTRST

MUX

DEMUX

IIC

-48 V/-60 V


K1 and K2

O/E

SPI

O/E

16 x 155Mbit/s

O/E Conversion Modulel In the receive direction, it converts the received optical signals into electrical signals.

l In the transmit direction, it converts the electrical signals into SDH optical signals, and thensend optical signals to fibers for transmission.

l The SPI detects the R_LOS alarm and provides the function to shut down the laser.


multiple parallel electrical signals, and recovery the clock signal at the same time.

l In the transmit direction, the MUX part multiplexes the parallel electrical signals receivedfrom the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, and provides outloop and inloop function.

RSTl In the receiving direction, RST performs frame alignment detection (A1, A2), regenerator

section trace recovery (J0) and mismatch detection, and BIP-8 errored block count.

l In the transmitting direction, RST performs frame alignment insertion, regenerator sectionpath trace insertion, BIP-8 calculation and insertion.




MSTl In the receiving direction, MST performs BIP-24 errored block count, MS_REI recovery,

MS_RDI and MS_AIS detection.l In the transmitting direction, MST performs calculation and insertion of BIP-24, insertion

of MS_REI MS_RDI and MS_AIS.l Provides extraction or insertion of K1 byte and K2 byte.

MSAl In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS

detection, pointer justification.l In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation, and

AU_AIS generation.

HPTl OH termination








l Tracing the clock signal from the active and the standby cross-connect units.





DC/DC Converter Modulel This module provides the board with required DC voltages. It converts the –48/–60 V power

supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also providesprotection for the board +3.3V power supply.

5.10.4 Front PanelOn the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label,and APD alarm label.

Appearance of the Front PanelFigure 5-29 shows the appearance of the front panel of the SL16A.



Figure 5-29 Front panel of the SL16A

SL16A

SL16A

STATACTPROGSRV

CLASS 1LASER

PRODUCT

OUT

IN

MAX:-9dBm

! APDReceiver







InterfacesThere is one pair of optical interfaces on the front panel of the SL16A. Table 5-46 lists the typeand usage of the optical interfaces.

Table 5-46 Optical interfaces of the SL16A







5.10.5 Valid SlotsThe SL16A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SL16Acan be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.10.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the SL16A indicates the optical interface type.

Table 5-47 lists the relation between the board feature code and optical interface type for theSL16A.



SSN1SL16A01,SSN2SL16A01,SSN3SL16A01

01 I-16


02 S-16.1


03 L-16.1


04 L-16.2

5.10.7 Board Configuration ReferenceYou can use the T2000 to set the J0 parameter for the SL16A.

For details on the parameter, refer to F Board Configuration Reference.

5.10.8 Technical SpecificationsThe technical specifications of the SL16A cover the optical interface specifications, boarddimensions, weight and power consumption.

Optical Interface SpecificationsTable 5-48 lists the specifications of the optical interfaces of the SL16A.

Table 5-48 Specifications of the optical interfaces of the SL16A

Item Specification

Nominalbit rate

2488320 kbit/s



Item Specification

OpticalInterfaceType

I-16 S-16.1 L-16.1 L-16.2

Opticalsource type

MLM SLM SLM SLM


1266–1360 1260–1360 1280–1335 1500–1580


–10 to –3 –5 to 0 –2 to +3 –2 to +3


–18 –18 –27 –28


–3 0 –9 –9


8.2 8.2 8.2 8.2

Laser Safety Class




The mechanical specifications of the SL16A are as follows:


l Weight (kg):– N1SL16A and N2SL16A:1.1

– N3SL16A:0.9

l Weight (kg):1.1

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the N1SL16A andN2SL16A are 20 W.

In the normal temperature (25℃), the maximum power consumption of the N3SL16A is 17 W.




5.11 SF16This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FECfunction, in terms of the version, function, working principle, front panel and specifications.

5.11.1 Version DescriptionThe functional version of the SF16 board is N1.

5.11.2 Function and FeatureThe SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) opticalsignals and to process the overhead.

5.11.3 Working Principle and Signal FlowThe SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDHoverhead processing module and so on.

5.11.4 Front PanelOn the front panel of the SF16, there are indicators, interfaces, barcode and laser safety classlabel.

5.11.5 Valid SlotsThe SF16 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SF16 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.11.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the SF16.

5.11.7 Technical SpecificationsThe technical specifications of the SF16 cover the optical interface specifications, boarddimensions, weight and power consumption.

5.11.1 Version DescriptionThe functional version of the SF16 board is N1.

5.11.2 Function and FeatureThe SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) opticalsignals and to process the overhead.

Table 5-49 lists the functions and features of the SF16.

Table 5-49 Functions and features of the SF16

Function andFeature

SF16

Basic function Receives and transmits 1 x OTU1 (2.666 Gbit/s, FEC) optical signals.Supports the enabling or disabling of the FEC function.



Function andFeature

SF16

Specificationof the opticalinterface

Supports optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f types.The optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f typescomply with the standards defined by Huawei.The optical interface supports the output of standard wavelengths thatcomply with ITU-T G.692 and can be directly connected to the DWDMequipment.

Specificationof the opticalmodule

Supports detection and query of the information on the optical module.The optical interface supports the function of setting the on/off state of thelaser and the ALS function.

Serviceprocessing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, andVC-4-16c concatenation services.Supports AU-3 services.The SF16 board encapsulates and encodes signals with the FEC function,and processes overhead bytes, which comply with ITU-T G.709.

Overheadprocessing

Supports the processing of the OTU, ODU, and OPU overhead bytes,performance monitoring, and alarm detection, which comply with ITU-TG.709.Supports the processing of the SOH of the STM-16 signals.Supports the transparent transmission and termination of the POH bytes.Supports the setting and query of the J0/J1/C2 bytes.


Provides rich alarms and performance events.Supports alarms and performance events related to the OTU, ODU, andOPU layers and the FEC function.

Processing ofthe K byte

Processes two sets of K bytes. One SF16 board supports a maximum of twoMSP protection rings.

Specificationof the REG


Protectionscheme

Supports the two-fiber MSP protection ring, four-fiber MSP protectionring, linear MSP protection, SNCP, SNCTP and SNCMP.Supports the optical-path-shared MSP and SNCP protection.

Maintenancefeature

Supports inloop and outloop for optical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.




5.11.3 Working Principle and Signal FlowThe SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDHoverhead processing module and so on.

Figure 5-30 shows the block diagram for the working principle of the SF16.

Figure 5-30 Block diagram for the working principle of the SF16

2.666Gbit/s

2.666Gbit/s

FEC


module

Cross-connect unit

+3.3 V backup power

16x155Mbit/s

16x155Mbit/s


DCC


SCC unit


2.666Gbit/s

2.666Gbit/s

high speed bus

5 V

+1.8 V

+3.3 V

RST MST MSA HPT

O/E

-48 V/-60 VDC/DCconverter

Fuse

FuseDC/DC

converter

Cross-connect unit

Cross-connect unit

155 MHz PLL Cross-connect unit155 MHz Reference clock

16x166Mbit/s

16x166Mbit/s

166 MHz PLLIIC

MUX

155 MHz PLL

DEMUX

-48 V/-60 V

Cross-connect unit

K1 and K2

Communication

Frame header

SPI

O/Ehigh speed bus

The function modules are described below:

O/E Conversion Modulel In the receive direction, the module converts the received 2.666 Gbit/s FEC optical signals

into electrical signals.

l In the transmit direction, the module converts the electrical signals into SDH optical signals,and then send optical signals to fibers for transmission.

l The SPI detects the R_LOS alarm and provides function to shut down the laser.


multiple parallel electrical signals, and recovers the clock signal at the same time.

l In the transmit direction, the MUX part multiplexes the parallel electrical signals receivedfrom the FEC module into high rate electrical signals.

FEC Modulel In the downstream direction, the FEC encoding and decoding module receives 2.488 Gbit/

s SDH signals, which are sent by the SDH overhead processing chip. After frame search,



FEC encoding, data packets encapsulation and scrambling, the 2.488 Gbit/s SDH signalsare converted to 2.666 Gbit/s signals and then transmitted to the MUX module.

l In the upstream direction, signals take the reverse process. The FEC encoding and decodingmodule receives the 2.666 Gbit/s signals from the DEMUX module. After frame search,FEC encoding, data packets encapsulation and scrambling in the FEC module, the 2.488Gbit/s signals are recovered and then transmitted to SDH overhead processing chip. Theframe format of the 2.666 Gbit/s signals complies with ITU G.709.

l The FEC processing module connects to the communication and control unit through aCPU bus. The CPU controls working modes of the FEC module by configuring the internalregister. The working mode can be regenerator mode, that is, REG mode. The CPU canmonitor the performance through the internal register.

SDH Overhead Processing ModuleThis module includes RST, MST, MSA and HPT. It also provides inloop and outloop function.


section trace recovery (J0), mismatch detection, BIP-8 errored block count.l In the transmit direction, RST performs frame alignment insertion, regenerator section path




MS_RDI and MS_AIS insertion.l Provides extraction or insertion of K1 byte and K2 byte.


detection, pointer justification.l In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation, and

AU_AIS generation.

HPTl OH termination










l Performs inter-board communication through internal Ethernet interface.l Traces the clock signal from the active and the standby cross-connect unit.l Controls the laser.l Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting

the ADM when the CXL is not online.l Selects the clock and frame header from the active or the standby cross-connect units.l Controls the indicator on the board.

DC/DC ConverterIt provides the board with required DC voltages. It converts the –48 V/–60 V power supply tothe following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3V powersupply.

5.11.4 Front PanelOn the front panel of the SF16, there are indicators, interfaces, barcode and laser safety classlabel.

Appearance of the Front PanelFigure 5-31 shows the appearance of the front panel of the SF16.

Figure 5-31 Front panel of the SF16

SF16

SF 16

STATACTPROGSRV

CLASS 1LASER

PRODUCT

OUT

IN









InterfacesThere is one pair of optical interfaces on the front panel of the SF16. Table 5-50 lists the typeand usage of the optical interfaces.

NOTE

The SF16 uses the unpluggable optical module.

Table 5-50 Optical interfaces of the SF16


Usage



5.11.5 Valid SlotsThe SF16 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The SF16 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

5.11.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the SF16.

You can use the T2000 to set the following parameters for the SF16:

l J0

l J1

l C2


5.11.7 Technical SpecificationsThe technical specifications of the SF16 cover the optical interface specifications, boarddimensions, weight and power consumption.

Optical Interface SpecificationsTable 5-51 lists the specifications of the optical interfaces of the SF16.




Table 5-51 Specifications of the optical interfaces of the SF16

Item Specification

Nominal bit rate 2666057.143 kbit/s

Service processingcapability

1 x STM-16 standard services or concatenation services

Line code NRZ

Optical InterfaceTypea

Ve-16.2c Ve-16.2d Ve-16.2f

FEC+BA(14)+PA

FEC+BA(17)+PA

FEC+BA(17)+RA+PA

Optical source type SLM SLM SLM

Wavelength (nm) 1550.12

Launched opticalpower (dBm)b

–5 to –1 –5 to –1 –5 to –1

Launched opticalpower (dBm)c

13–15 13–15 15–18

Receiver sensitivity(dBm)b

–27.5 –27.5 –27.5

Receiver sensitivity(dBm)d

–37 –37 –42

Overload opticalpower (dBm)d

–10 –10 –10

Min. extinction ratio(dB)b

10 10 10

a: The numbers in the brackets indicate the specifications. For example, BA (14) indicatesthat the optical power amplified by the BA is 14 dBm. "FEC+BA+PA+RA" indicates that theoptical interface is used with the FEC, PA, Raman amplifier and BA.b: The specifications are for the optical module itself rather than for the amplifier.c: The specifications are for the BA.d: The specifications are for the PA.

Table 5-52 Specifications of the ITU-T G.692-compliant optical interfaces that output standardwavelengths

Item Specification

Nominal bit rate 2666057.143 kbit/s

Dispersion limit (km) 640

Mean launched optical power (dBm) –5 to –1



Item Specification

Receiver sensitivity (dBm) –28

Min. overload (dBm) –9

Max. allowed dispersion (ps/nm) 10880

Min. extinction ratio (dB) 8.2



Mechanical SpecificationsThe mechanical specifications of the SF16 are as follows:


l Weight (kg): 1.1

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the SF16 is 26 W.




6 PDH Processing Boards

About This Chapter

This chapter describes the PDH processing boards for the E1/T1, E3/T3, E4/STM-1, and DDNsignals.

6.1 PL1This section describes the PL1, a 16 x E1 processing board, in terms of the version, function,working principle, front panel and specifications.

6.2 PD1This section describes the PD1, a 32 x E1 processing board, in terms of the version, function,working principle, front panel and specifications.

6.3 PQ1This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.4 PQMThis section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.5 PL3This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.6 PL3AThis section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.7 PD3This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.8 PQ3This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.9 DX1

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 6 PDH Processing Boards


This section describes the DX1, a DDN interface convergence board, in terms of the version,function, principle, front panel, configuration and specifications.

6.10 DXAThis section describes the DXA, a DDN convergence board, in terms of the version, function,principle, front panel, configuration and specifications.

6.11 SPQ4This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version,function, working principle, front panel and specifications.

6 PDH Processing BoardsOptiX OSN 1500 Intelligent Optical Transmission System



6.1 PL1This section describes the PL1, a 16 x E1 processing board, in terms of the version, function,working principle, front panel and specifications.

6.1.1 Version DescriptionThe functional version of the PL1 is R1.

6.1.2 Function and FeatureThe PL1 is used to directly access and process E1 electrical signals, to process the overhead, toreport alarms and performance events and to provide the maintenance features.

6.1.3 Working Principle and Signal FlowThe PL1 consists of the PPI, E1 mapping/demapping, interface conversion module,communication and control module and so on.

6.1.4 Front PanelOn the front panel of the PL1, there are indicators and interfaces.

6.1.5 Valid SlotsThe PL1 can be housed in any of slots 6–9 of the OptiX OSN 1500A subrack or the OptiX OSN1500B subrack.

6.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PL1 indicates the interface impedance type.

6.1.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PL1.

6.1.8 Technical SpecificationsThe technical specifications of the PL1 cover the optical interface specifications, boarddimensions, weight and power consumption.

6.1.1 Version DescriptionThe functional version of the PL1 is R1.

6.1.2 Function and FeatureThe PL1 is used to directly access and process E1 electrical signals, to process the overhead, toreport alarms and performance events and to provide the maintenance features.

Table 6-1 lists the functions and features of the PL1.

Table 6-1 Functions and features of the PL1

Function andFeature

PL1

Basic function Processes 16 x E1 signals (interfaces available on the front panel).

Service processing Directly accesses and processes 16 x E1 electrical signals.



Function andFeature

PL1

Overhead processing Supports the transparent transmission and termination of POH bytesat the VC-12 level, such as the J2 byte.


Provides rich alarms and performance events for easy managementand maintenance of the equipment.

Maintenance feature Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information ofthe board.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affectingservices.Supports the PRBS function.

6.1.3 Working Principle and Signal FlowThe PL1 consists of the PPI, E1 mapping/demapping, interface conversion module,communication and control module and so on.

Figure 6-1 shows the block diagram for the functions of the PL1.

Figure 6-1 Block diagram for the functions of the PL1

E1

E1

E1mapping/

demapping


Cross-connect unitA

155 Mbit/s

155 Mbit/s

LOS

6 x 2 Mbit/s High speed bus

SCC UnitCommunication

Frame header

Outloop/Inloop control

Interfacecoversion

module

1.5 MHz/2 MHzOSC

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V

-48 V/ -60 VDC/DCconverter+1.8 V

+2.5 V

155 MHzPLL

Reference clockCross-connect unit

LIU

LIU

PPI

6 x 2 Mbit/s Cross-connect unitB

Cross-connect unit

High speed bus

Figure 6-2 shows the block diagram of the E1 mapping/demapping.




Figure 6-2 Block diagram of the E1 mapping/demapping

E1 STM-1

PDH AISDetector

E1 mapping/demapping

LPA LPT HPA HPT

LPOH(V5/J2/N2/K4)

insertionTU-AIS/TU-LOP

Detector

E1 STM-1LPA LPT HPA HPT

LPOH(V5/J2/N2/K4)

Extraction

The function modules are described as follows.

PPI

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloopfunction. This module:

l Encodes and decodes signals.

l Recovers data and clock.

l Processes the PDH LOS signals.

E1 mapping/demappingl LPA

l The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as tobe transported into the synchronous network for check of the PDH AIS.

l LPT

l The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theVC-12 container and POH. The latter contains nine octets equally distributed within theframe bytes for VC-12: V5, J2, N2, and K4.

l HPA

l HPA generates and processes channel level TU-PTR. In the receive direction, the signalsare split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TU-AIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are locatedprecisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytesinterleaving. The sequence is: TUG2->TUG3->VC-4.

l HPT



l The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets aredistributed within a 125 us interval (for example, one STM–1 period), and consists of theC4 container and POH.

l MST and RST

l These two functions are necessary to create a proprietary STM–1 signal in order to interfacethe “E1 mapping/demapping” block with the multiplex unit.

Interface conversion moduleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.

Communication and control modulel Manages and configures other modules of the boards.




l Control the indicator on the board.

DC/DC converterIt provides the board with required DC voltages. It converts the –48 V/–60 V power supply tothe following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power areprovided to the board.

6.1.4 Front PanelOn the front panel of the PL1, there are indicators and interfaces.

Appearance of the Front PanelFigure 6-3 shows the appearance of the front panel of the PL1.

Figure 6-3 Front panel of the PL1

PL1

1-16

STATACTPROGSRV










InterfacesThere are 16 2mmHM interfaces on the front panel of the PL1. Table 6-2 lists the type and usageof the interfaces.

Table 6-2 Interfaces on the front panel of the PL1


Usage

1–8 2mmHM Receives the first eight channels (1–8) of E1 signals.

9–16 2mmHM Receives the last eight channels (9–16) of E1 signals.

6.1.5 Valid SlotsThe PL1 can be housed in any of slots 6–9 of the OptiX OSN 1500A subrack or the OptiX OSN1500B subrack.

6.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PL1 indicates the interface impedance type.

Table 6-3 lists the relation between the board feature code and interface impedance type for thePL1.

Table 6-3 Relation between the board feature code and the optical interface type of the PL1

Board Feature Code Interface Impedance Type

SSR1PL1A01 A01 75 ohms

SSR1PL1B01 B01 120 ohms


You can use the T2000 to set the following parameters for the PL1:

l J2 byte



l V5 byte

l Tributary loopback

l Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.1.8 Technical SpecificationsThe technical specifications of the PL1 cover the optical interface specifications, boarddimensions, weight and power consumption.

Electrical Interface SpecificationsTable 6-4 lists the specifications of the optical interfaces of the PL1.

Table 6-4 Specifications of the electrical interfaces of the PL1

InterfaceType

Code OutputSignal BitRate

AllowedInputFrequencyDeviation

AllowedInputAttenuation

InputJitterTolerance

2048 kbit/s HDB3 Compliant with ITU-T G.703

Mechanical SpecificationsThe mechanical specifications of the PL1 are as follows:


l Weight (kg): 0.5

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the PL1 is 7 W.

6.2 PD1This section describes the PD1, a 32 x E1 processing board, in terms of the version, function,working principle, front panel and specifications.

6.2.1 Version DescriptionThe PD1 has two versions, R1 and R2. The two versions have different functions.

6.2.2 Function and FeatureThe PD1 is used to process E1 signals and the overhead, to report alarms and performance events,and to provide the maintenance features and TPS protection.

6.2.3 Working Principle and Signal FlowThe PD1 consists of the PPI, E1 mapping/demapping, interface conversion module,communication and control module and so on.

6.2.4 Front Panel




On the front panel of the PD1, there are indicators.

6.2.5 Valid SlotsThe PD1 must be used with the L75S or L12S.

6.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PD1 indicates the interface impedance type.

6.2.7 TPS Protection for the BoardThe PD1 supports the 1:N TPS protection.

6.2.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the PD1.

6.2.9 Technical SpecificationsThe technical specifications of the PD1 cover the electrical interface specifications, boarddimensions, weight and power consumption.

6.2.1 Version DescriptionThe PD1 has two versions, R1 and R2. The two versions have different functions.

Table 6-5 lists the details on the versions of the PD1 board.

Table 6-5 Version Description of the PD1

Item Description

Functionalversion

The PD1 has two versions, R1 and R2.

Difference The R2PD1 supports the E13 function and the board version replacementfunction.

Replaceability The R1PD1A can be replaced by the R2PD1A.The R1PD1B can be replaced by the R2PD1B.

6.2.2 Function and FeatureThe PD1 is used to process E1 signals and the overhead, to report alarms and performance events,and to provide the maintenance features and TPS protection.

Table 6-6 lists the functions and features of the PD1.

Table 6-6 Functions and features of the PD1

FunctionandFeature

PD1

R1PD1 R2PD1

Basicfunction

Processes 32 x E1signals.

Processes 32 x E1 signals.



FunctionandFeature

PD1

R1PD1 R2PD1

Serviceprocessing

Accesses andprocesses 32 x E1electrical signalswhen used with theinterface board.

Accesses and processes 32 x E1 electrical signals whenused with the interface board.Supports the E13 function, which is used to convergeE1 services into E3 services.

Overheadprocessing

Supports the transparent transmission and termination of the POH bytes at theVC-12 level, such as the J2 byte.



Maintenance feature

Supports inloop and outloop for the electrical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of the board.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.

Protectionscheme

Supports the TPS protection when used with the electrical interface switchingboard.

6.2.3 Working Principle and Signal FlowThe PD1 consists of the PPI, E1 mapping/demapping, interface conversion module,communication and control module and so on.

Figure 6-4 shows the block diagram for the functions of the PD1.




Figure 6-4 Block diagram for the functions of the PD1

E1

E1

E1mapping/

demapping


Cross-connect unitA

155 Mbit/s

155 Mbit/s

LOS

6 x 2 Mbit/s High speed bus


Frame header


Interfacecoversion

module

1.5 MHz/2 MHzOSC

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


+2.5 V

155 MHzPLL


LIU

LIU

PPI


Cross-connect unit

High speed bus

Figure 6-5 shows the block diagram of the E1mapping/ demapping.

Figure 6-5 Block diagram of the E1 mapping/ demapping

E1 STM-1

PDH AISDetector

E1 mapping/demapping

LPA LPT HPA HPT

LPOH(V5/J2/N2/K4)


Detector

E1 STM-1LPA LPT HPA HPT

LPOH(V5/J2/N2/K4)

Extraction


PPI







E1 mapping/demappingl LPA

l The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as tobe transported into the synchronous network for check of the PDH AIS.

l LPT


l HPA


l HPT


l MST and RST

l These two functions are necessary to create a proprietary STM–1 signal in order to interfacethe “E1 mapping/demapping” block with the multiplex unit.











6.2.4 Front PanelOn the front panel of the PD1, there are indicators.

Appearance of the Front PanelFigure 6-6 shows the appearance of the front panel of the PD1.

Figure 6-6 Front panel of the PD1

PD1

STATACTPROGSRV







InterfacesThere are no interfaces on the front panel of the PD1.

In the OptiX OSN 1500A subrack, the PD1 is used with the L75S or L12S, which provides 75-ohm or 120-ohm E1 interfaces. For details, see the sections that describe the L75S and L12S.

In the OptiX OSN 1500B subrack, the PD1 is used with the D75S or D12S, which provides 75-ohm or 120-ohm E1 interfaces. For details, see the sections that describe the D75S and D12S.

6.2.5 Valid SlotsThe PD1 must be used with the L75S or L12S.

In the OptiX OSN 1500A subrack, the PD1 can be housed in any of half-width slots 2 and 12.Table 6-7 lists the valid slots for the PD1 and corresponding slots for the L75S and L12S.



Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiXOSN 1500A subrack

Valid Slot for the PD1 Corresponding Slot for the L75S and L12S

Slot 12 Slot 7 (1–16 channels services)Slot 6 (17–32 channels services)

NOTE

Slot 2 can house a protection board of the TPS protection. The board housed in slot 2 protects the boardhoused in slot 12.

In the OptiX OSN 1500B subrack, the PD1 can be housed in any of slots 1–3, 6–8 and 11–13.Table 6-8 lists the valid slots for the PD1 and the corresponding slots for the D75S and D12S.

Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiXOSN 1500B subrack

Valid Slot for the PD1 Corresponding Slot for the D75S andD12S

Slot 2 Slot 14

Slot 3 Slot 16

Slots 7 and 12 Slot 15

Slots 8 and 13 Slot 17

NOTE

l Boards housed in slots 7 and 12 share the interface board housed in slot 15. The boards housed in slots7 and 12 cannot be used with the interface board housed in slot 15 to add or drop services at the sametime.

l Boards housed in slots 8 and 13 share the interface board housed in slot 17. The boards housed in slots8 and 13 cannot be used with the interface board housed in slot 17 to add or drop services at the sametime.

l Slot 1 can house a protection board of the TPS protection. The board housed in slot 1 protects the boardshoused in slots 2 and 3.

l Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects theboards housed in slots 12 and 13.

l Slot 6 can house a protection board of the TPS protection. The board housed in slot 6 protects the boardshoused in slots 7 and 8.

6.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PD1 indicates the interface impedance type.

Table 6-9 lists the relation between the board feature code and interface impedance type for thePD1.




Table 6-9 Relation between the board feature code and the interface impedance type

Board Feature Code Interface ImpedanceType

SSR1PD1A01,SSR2PD1A01

A01 75 ohms

SSR1PD1B01,SSR2PD1B01

B01 120 ohms


Protection PrincipleIn the OptiX OSN 1500A subrack, used with the L75S or L12S, two PD1 boards can get 1:1TPS protection. Figure 6-7 shows the principle for the TPS protection of the PD1.

Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack

Detectboard fault

PD1

L75SL75S

PD1

SLOT2

SLOT12

SLOT6

SLOT7

E1protection bus

E1 service

bus

Fail

TPSswitching

control busCross-connect and timingboard

Protection

Working

In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PD1 boards can get 1:N(1≤2) TPS protection. Figure 6-8 shows the principle of the TPS protection for the PD1.



Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack

Detectboard fault

E1 protection bus

E1 service bus

TPS switchingcontrol bus

PD1PD1 PD1

D75S

D75S

Fail

Protection Working Working

Cross-connect andtiming board

When detecting a failure in the working PD1 board, the cross-connect board issues a commandto switch the services from the faulty PD1 to the protection PD1. In this way, services areprotected.

Hardware ConfigurationIn the OptiX OSN 1500A subrack, PD1 boards can be housed in the half-width slots to realizethe 1:1 TPS protection. Figure 6-9 shows the slot configuration for the 1:1 TPS protection forthe PD1.

Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500Asubrack

Slot 20

FAN

Slot 1

Slot 2

Slot 3

Slot 4

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10 AUX Slot 5

CXL16/4/1

CXL16/4/1

EOW

Slot 12

Slot 11

Slot 13

PD1(P) PD1(W) L75S(1~16)

L75S(17~32)

Table 6-10 shows the slot configuration for the 1:2 TPS protection for the PD1 in the OptiXOSN 1500B subrack.




Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500Bsubrack

Board Protection Group Beforethe Slot Division

Protection Group After the SlotDivision

PD1(protection)


PD1(working)

Slots 7 and 8 Slots 2 and3

Slots 12 and13

Slots 7 and8

D75S/D12S Slots 15 and 17 Slots 14 and16

Slots 15 and17

Slots 15and 17

The two protection groups that contain slots 6 and 11 share the protection bus and thus cannotcoexist. Before the slots are divided, the OptiX OSN 1500B supports one group of TPS protectionfor E1 services. After the slots are divided, the OptiX OSN 1500B supports a maximum of twoTPS protection groups for E1 services.


You can use the T2000 to set the following parameters for the PD1:

l J2 byte

l V5 byte





Electrical Interface Specifications

The L12S, L75S, D12S or D75S board provides electrical interfaces for the PD1. Forspecifications of the electrical interfaces, see the sections that describe these boards.


The mechanical specifications of the PD1 are as follows:


l Weight (kg)– 0.5 (R1PD1)

– 0.56 (R2PD1)



Power Consumption

In the normal temperature (25℃), the maximum power consumption of the R1PD1 is 15 W.

In the normal temperature (25℃), the maximum power consumption of the R2PD1 is 10.4 W.

6.3 PQ1This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.3.1 Version DescriptionThe PQ1 has two versions, R1 and R2. The two versions have different functions.

6.3.2 Function and FeatureThe PQ1 can be used to process E1 signals and the overhead, to report alarms and performanceevents, to provide the maintenance feature and the TPS protection.

6.3.3 Working Principle and Signal FlowThe PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and soon.

6.3.4 Front PanelOn the front panel of the PQ1, there are indicators.

6.3.5 Valid SlotsThe PQ1 must be used with the D75S, D12S or D12B.

6.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PQ1 indicates the interface impedance type.

6.3.7 TPS Protection for the BoardThe PQ1 supports the 1:N TPS protection.

6.3.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the PQ1.

6.3.9 Technical SpecificationsThe technical specifications of the PQ1 cover the electrical interface specifications, boarddimensions, weight and power consumption.

6.3.1 Version DescriptionThe PQ1 has two versions, R1 and R2. The two versions have different functions.

Table 6-11 lists the details on the versions of the PQ1 board.

Table 6-11 Version Description of the PQ1

Item Description

Functionalversion

The PQ1 has two versions, N1 and N2.




Item Description

Difference The N2PQ1 supports the E13 function and the board version replacementfunction.The N2PQ1 does not perform the tributary timing function.

Replaceability When the tributary timing function is not required, the N1PQ1A can bereplaced by the N2PQ1A.When the tributary timing function is not required, the N1PQ1B can bereplaced by the N2PQ1B.

NOTE: When the impedance of interfaces is ignored, the PQ1A (75 ohms) and PQ1B (100ohms/120 ohms) are called PQ1 hereinafter.

6.3.2 Function and FeatureThe PQ1 can be used to process E1 signals and the overhead, to report alarms and performanceevents, to provide the maintenance feature and the TPS protection.

Table 6-12 lists the functions and features of the PQ1.

Table 6-12 Functions and features of the PQ1

FunctionandFeature

PQ1

N1PQ1 N2PQ1

Basicfunction

Processes 63 x E1signals.

Processes 63 x E1 signals.

Serviceprocessing

Processes 63 x E1electrical signalswhen used with aninterface board.

Processes 63 x E1 electrical signals when used with aninterface board.Supports the E13 function, which is used to convergeE1 services into E3 services.

Overheadprocessing

Supports the transparent transmission and termination of the POH bytes at theVC-12, such as the J2 byte.



Maintenance feature

Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of the board.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.



FunctionandFeature

PQ1

N1PQ1 N2PQ1

Protectionscheme

Supports the TPS protection when used with the interface board.When the working board is the PQ1, the protection board can be the PQM. Inthis way, the hybrid protection is provided.

6.3.3 Working Principle and Signal FlowThe PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and soon.

Figure 6-10 shows the block diagram for the functions of the PQ1.

Figure 6-10 Block diagram for the functions of the PQ1

E1/T1

E1/T1

E1/T1mapping/

demapping


Cross-connect unitA

155 Mbit/s

155 Mbit/s

LOS

6 x 1.5 Mbit/s/6 x 2 Mbit/s High speed bus


Frame header


Interfacecoversion

module

1.5 MHz/2 MHzOSC

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


+2.5 V

155 MHzPLL


LIU

LIU

PPI 6 x 1.5 Mbit/s/


Cross-connect unit

High speed bus

Figure 6-11 shows the block diagram of the E1/T1 mapping/ demapping.




Figure 6-11 Block diagram of the E1/T1 mapping/ demapping

E1/T1 STM-1

PDH AISDetector

E1/T1 mapping/demapping

LPA LPT HPA HPT

LPOH(V5/J2/N2/K4)


Detector

E1/T1 STM-1LPA LPT HPA HPT

LPOH(V5/J2/N2/K4)

Extraction


PPI





E1/T1 mapping/demappingl LPA

l The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to beadapted so as to be transported into the synchronous network for check of the PDH AIS.

l LPT


l HPA


l HPT




l MST and RST

l These two functions are necessary to create a proprietary STM–1 signal in order to interfacethe “E1/T1 mapping/demapping” block with the multiplex unit.









Appearance of the Front PanelFigure 6-12 shows the appearance of the front panel of the PQ1.




Figure 6-12 Front panel of the PQ1

PQ1

PQ1

STATACTPROGSRV

Indicators







Interfaces

There are no interfaces on the front panel of the PQ1.

The D75S, D12S or D12B provides 75-ohm or 120-ohm E1/T1 interfaces for the PQ1. Fordetails, see the sections that describe the D75S, D12S and D12B.

6.3.5 Valid SlotsThe PQ1 must be used with the D75S, D12S or D12B.

The OptiX OSN 1500A does not support the PQ1 board.



In the OptiX OSN 1500B subrack, the PQ1 can be housed in any of slots 11–13, and must beused with the D75S, D12S or D12B.

Table 6-13 lists the valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B.

Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in theOptiX OSN 1500B subrack

Valid Slot for the PQ1 Corresponding Slot for the D75S, D12Sand D12B

Slot 12 Slot 14 (1–32 channels of services)Slot 15 (33–63 channels of services)


NOTE


l If the interface board for the boards housed in slot 12 and 13 is the D12B, the boards housed in slot 12and 13 cannot get the TPS protection.

6.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the PQ1 indicates the interface impedance type.

Table 6-14 lists the relation between the board feature code and interface impedance type forthe PQ1.


Board Feature Code Interface ImpedanceType

SSN1PQ1A01,SSN2PQ1A01

A01 75 ohms

SSN1PQ1B01,SSN2PQ1B01

B01 120 ohms


Protection Principle

In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PQ1 can get the 1:N (≤2)TPS protection. Figure 6-13 shows the principle of the TPS protection for the PQ1.




Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack

Protection

D75S

D75S

D75S

D75S

SLOT11

SLOT14

SLOT15

SLOT16

SLOT17

E1protection bus

E1 service

bus


Working

Working

Fail

SLOT12

SLOT13

Detectboard fault


When detecting a failure in the working PD1 board, the cross-connect board issues a commandto switch the services from the faulty PQ1 to the protection PQ1. In this way, services areprotected.

Hardware ConfigurationTable 6-15 lists the slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN1500B subrack.

Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500Bsubrack

Working Board Protection Board Slot

PQ1A (75 ohms) PQ1A (75 ohms) Slot 11 can house the protection board.The board in slot 11 protects the boardsin slots 12 and 13. Figure 6-14 shows theslot configuration for the 1:2 TPSprotection for the PQ1.

PQ1B (120 ohms) PQ1B (120 ohms) orPQM



Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1

Slot 14 Slot 18 PIU

Slot 20

FAN

PIU

AUX

D75S

D75S

WorkingWorking

CXL16/4/1

EOW

D75S

D75S

Protection

Slot 15

Slot 16

Slot 17

Slot 11

Slot 12

Slot 13

Slot 5

Slot 19

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10

Slot 4 CXL16/4/1


You can use the T2000 to set the following parameters for the PQ1:

l J2 byte

l V5 byte






The D75S, D12S or D12B provides electrical interfaces for the PQ1. For the specifications ofthese electrical interfaces, see the section that describes the D75S, D12S or D12B.


The mechanical specifications of the PQ1 are as follows:


l Weight (kg): 1.0

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the N1PQ1 is 19 W.

In the normal temperature (25℃), the maximum power consumption of the N2PQ1 is 13 W.




6.4 PQMThis section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.4.1 Version DescriptionThe functional version of the PQM board is N1.

6.4.2 Function and FeatureThe PQM is used to process E1/T1 signals and the overhead, to report alarms and performanceevents, and to provide the maintenance features and TPS protection.

6.4.3 Working Principle and Signal FlowThe PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module,communication and control module and so on.

6.4.4 Front PanelOn the front panel of the PQM, there are indicators.

6.4.5 Valid SlotsThe OptiX OSN 1500A does not support the PQM board.

6.4.6 TPS Protection for the BoardThe PQM supports the 1:N TPS protection.

6.4.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PQM.

6.4.8 Technical SpecificationsThe technical specifications of the PQM cover the electrical interface specifications, boarddimensions, weight and power consumption.

6.4.1 Version DescriptionThe functional version of the PQM board is N1.

6.4.2 Function and FeatureThe PQM is used to process E1/T1 signals and the overhead, to report alarms and performanceevents, and to provide the maintenance features and TPS protection.

Table 6-16 lists the functions and features of the PQM.

Table 6-16 Functions and features of the PQM

Functionand Feature

PQM

Basic function Processes 63 x E1/T1 signals.

Serviceprocessing

The PQM accesses and processes 63 x E1/T1 electrical signals when usedwith the interface board. Each channel can be configured as E1 or T1.



Functionand Feature

PQM

Overheadprocessing

Supports the transparent transmission and termination of the POH bytes atthe VC-12 level, such as the J2 byte.



Maintenancefeature

Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affect services.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.

Protectionscheme

When used with the interface board, the PQM supports the TPS protection.When the working board is the PQ1, the protection board can be the PQM.In this way, the hybrid protection is provided.

6.4.3 Working Principle and Signal FlowThe PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module,communication and control module and so on.

Figure 6-15 shows the block diagram for the functions of the PQM.

Figure 6-15 Block diagram for the functions of the PQM

E1/T1

E1/T1

E1/T1mapping/

demapping


Cross-connect unitA

155 Mbit/s

155 Mbit/s

LOS

6 x 1.5 Mbit/s/6 x 2 Mbit/s High speed bus


Frame header


Interfacecoversion

module

1.5 MHz/2 MHzOSC

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


+2.5 V

155 MHzPLL


LIU

LIU

PPI 6 x 1.5 Mbit/s/


Cross-connect unit

High speed bus




Figure 6-16 shows the block diagram of the E1/T1 mapping/ demapping.

Figure 6-16 Block diagram of the E1/T1 mapping/ demapping

E1/T1 STM-1

PDH AISDetector


LPA LPT HPA HPT

LPOH(V5/J2/N2/K4)


Detector


LPOH(V5/J2/N2/K4)

Extraction


PPI






l The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to beadapted so as to be transported into the synchronous network for check of the PDH AIS.

l LPT


l HPA


l HPT




l MST and RST

l These two functions are necessary to create a proprietary STM–1 signal in order to interfacethe “E1/T1 mapping/demapping” block with the multiplex unit.








6.4.4 Front PanelOn the front panel of the PQM, there are indicators.

Appearance of the Front PanelFigure 6-17 shows the appearance of the front panel of the PQM.




Figure 6-17 Front panel of the PQM

PQM

PQM

STATACTPROGSRV







InterfacesThere are no interfaces on the front panel of the PQM.

The D12S or D12B provides 100-ohm T1/E1 interfaces for the PQM. For details, see the sectionsthat describe the D12S and D12B.

6.4.5 Valid SlotsThe OptiX OSN 1500A does not support the PQM board.

In the OptiX OSN 1500B subrack, the PQM can be housed in any of slots 11–13, and must beused with the D12S or D12B.



Table 6-17 lists the valid slots for the PQM and corresponding slots for the D12S and D12B.

Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiXOSN 1500B subrack

Valid Slot for the PQM Corresponding Slot for the D12S andD12B



NOTE


l If the interface board for the boards housed in slots 12 and 13 is the D12B, the boards housed in slots12 and 13 cannot get the TPS protection.

6.4.6 TPS Protection for the BoardThe PQM supports the 1:N TPS protection.

Protection PrincipleIn the OptiX OSN 1500B, used with the D12S, the PQM can be configured into one 1:N (N≤2) TPS protection group. Figure 6-18 shows the principle of the TPS protection for the PQM.




Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack

Protection

D12S

SLOT11

SLOT14

SLOT15

SLOT16

SLOT17

E1/T1protection bus

E1/T1 service

bus


Working

Working

Fail

SLOT12

SLOT13

Detectboard fault


D12S

D12S

D12S

When detecting a fault in the working PQM board, the cross-connect board issues a commandto switch the services from the faulty PQM to the protection PQM. In this way, services areprotected.

Hardware ConfigurationTable 6-18 lists the slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN1500B subrack.

Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500Bsubrack

WorkingBoard

Protection Board Slot

PQM (E1) PQM (E1) Slot 11 can house the protection board. The boardin slot 11 protects the boards in slots 12 and 13.Figure 6-19 shows the slot configuration for the1:2 TPS protection for the PQM.

PQM (T1) PQM (T1)



Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500Bsubrack

Slot 14 Slot 18 PIU

Slot 20

FAN

PIU

AUX

D12S

D12S

WorkingWorking

CXL16/4/1

EOW

D12S

D12S

Protection

Slot 15

Slot 16

Slot 17

Slot 11

Slot 12

Slot 13

Slot 5

Slot 19

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10

Slot 4 CXL16/4/1

6.4.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the PQM.

You can use the T2000 to set the following parameters for the PQM:

l J2 byte

l V5 byte



l Path service type


6.4.8 Technical SpecificationsThe technical specifications of the PQM cover the electrical interface specifications, boarddimensions, weight and power consumption.


The D12S or D12B provides electrical interfaces for the PQM. For the specifications of theelectrical interfaces, see the sections that describe the D12S and D12B.


The mechanical specifications of the PQM are as follows:


l Weight (kg): 1.0

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the PQM is 22 W.




6.5 PL3This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.5.1 Version DescriptionThe PL3 has two versions, N1 and N2. The two versions have different functions.

6.5.2 Function and FeatureThe PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performanceevents, to provide the maintenance feature and the TPS protection.

6.5.3 Working Principle and Signal FlowThe PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.

6.5.4 Front PanelOn the front panel of the PL3, there are indicators.

6.5.5 Valid SlotsThe OptiX OSN 1500A does not support the PL3 board.

6.5.6 TPS Protection for the BoardThe PL3 supports the 1:N TPS protection.


6.5.8 Technical SpecificationsThe technical specifications of the PL3 cover the electrical interface specifications, boarddimensions, weight and power consumption.

6.5.1 Version DescriptionThe PL3 has two versions, N1 and N2. The two versions have different functions.

Table 6-19 lists the details on the versions of the PL3 board.

Table 6-19 Version description of the PL3

Item Description

Functionalversion

The PL3 has two versions, N1 and N2.

Difference The N1PL3 does not support the E13/M13 function.The N2PL3 supports the E13/M13 function.The N2PL3 supports the board version replacement function and canreplace the N1PL3. After the N1PL3 is replaced, the N2PL3 is consistentwith the N1PL3 in configuration and service status.

Replaceability The N2PL3 can fully replace the N1PL3.



6.5.2 Function and FeatureThe PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performanceevents, to provide the maintenance feature and the TPS protection.

Table 6-20 lists the functions and features of the PL3.

Table 6-20 Functions and features of the PL3

Function andFeature

PL3


Service processing Accesses and processes 3 x E3/T3 electrical signals.

Overheadprocessing

Supports the setting and query of all path overhead bytes at the VC-3level.



Maintenancefeature

Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.

Protection scheme Supports the TPS protection when used with the interface board and theswitching board.

6.5.3 Working Principle and Signal FlowThe PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.

Figure 6-20 shows the block diagram for the functions of the PL3.




Figure 6-20 Block diagram for the functions of the PL3

E3/T3

E3/T3

E3/T3mapping/

demapping


Cross-connect unitA

2 x 155 Mbit/s

2 x 155 Mbit/s

LOS

6 x 34 Mbit/s/6 x 45 Mbit/s

Highspeed bus


Frame header


Interfacecoversion

module

34 MHz/45 MHz

OSC

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


+1.8 V

155 MHzPLL


LIU

LIU

PPI 6 x 34 Mbit/s/


Highspeed bus

Cross-connect unit

OSC: Oscillator PPI: PDH physical interface

Figure 6-21 shows the block diagram of the E3/T3 mapping/demapping.

Figure 6-21 Block diagram of the E3/T3 mapping/demapping

E3/T3 STM-1

PDH AISDetector


LPA LPT HPA HPT

LPOH(J1/C2/B3)insertion

TU-AIS/TU-LOPDetector


LPOH(J1/C2/B3)extraction

LPA: Low order Path Adaptation LPT: Low order Path TerminationHPA: High order Path Adaptation HPT: High order Path Termination




PPIl The PPI module mainly consists of line interface units (LIUs). It provides inloop and

outloop function. This module:



l Processes the A_LOS alarm.


l The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adaptedso as to be transported into the synchronous network.

l LPT

l The virtual container (VC-3) is formatted by lower order path termination (LPT).

l The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,one STM–1 period), and consists of the VC-3 container and POH. The latter contains nineoctets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,and N1.

l HPA

l HPA generates and processes channel level TU-PTR. In the receive direction, the signalsare split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In thetransmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3sare multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.

l HPT


l MST and RST

l The functions are necessary to create a proprietary STM–1 signal in order to connect theinterface conversion module.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.









DC/DC converter moduleThrough the DC/ DC converting module, different direct currents are provided to each chip onthe board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3V power are provided to the board.

6.5.4 Front PanelOn the front panel of the PL3, there are indicators.

Appearance of the Front PanelFigure 6-22 shows the appearance of the front panel of the PL3.

Figure 6-22 Front panel of the PL3

PL3

PL3

STATACTPROGSRV









InterfacesThere are no interfaces on the front panel of the PL3.

The C34S, an electrical interface switching board, provides the E3/T3 interfaces for the PL3.For details, see the section that describes the D34S.

6.5.5 Valid SlotsThe OptiX OSN 1500A does not support the PL3 board.

In the OptiX OSN 1500B subrack, the PL3 can be housed in any of slots 12–13, and must beused with the C34S.

Table 6-21 lists the valid slots for the PL3 and corresponding slots for the C34S.

Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN1500B subrack

Valid Slot for the PL3 Corresponding Slot for the C34S

Slot 12 Slot 14

Slot 13 Slot 16

6.5.6 TPS Protection for the BoardThe PL3 supports the 1:N TPS protection.

Protection PrincipleIn the OptiX OSN 1500B, used with the C34S and TSB8, the PL3 can be configured into one1:1 TPS protection group. Figure 6-23 shows the principle of the TPS protection for the PL3.




Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack

TSB8

SLOT12

PL3

1 2

SLOT13

3 xE3/T3

C34S

PL3

SLOT 4/5

123

Switchcontrolsignal

Protection Working

Fail

Cross-connect

and timingboard

l Normal stateWhen the working boards are running normally, the control switch of the C34S is in position1 and services are directly accessed to the PL3 board.

l Switching stateWhen the working board detects a fault and requires a switching, the control switch of theC34S is shifted to position 2 and the control switch of the TSB8 is shifted to a correspondingposition. In this way, the protection board protects the faulty working board.

Hardware ConfigurationTable 6-22 lists the slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN1500B subrack.

Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500Bsubrack

WorkingBoard


PL3 (E3) PL3 (E3)/PD3 (E3) If the working board is the PL3, the PD3can be the protection board. Figure 6-24shows the slot configuration for the 1:1 TPSprotection for the PL3.

PL3 (T3) PL3 (T3)/PD3 (T3)



Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500Bsubrack

Slot 14PIU

Slot 20

FAN

AUX

TSB8

C34S

CXL16/4/1 EOW

PIU

Slot 15

Slot 16

Slot 17

Slot 11

Slot 12

Slot 13

Slot 4

Slot 5

Slot 18

Slot 19

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10CXL16/4/1

Working

Protection


Table 6-23 lists the slots for the PL3, C34S and TSB8.

Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack


PL3 (working) Slot 13

PL3/PD3 (protection) Slot 12

TSB8 Slot 14

C34S Slot 16


You can use the T2000 to set the following parameters for the PL3:

l J1 byte

l C2 byte



l Path service type


6.5.8 Technical SpecificationsThe technical specifications of the PL3 cover the electrical interface specifications, boarddimensions, weight and power consumption.




Electrical Interface SpecificationsThe C34S provides electrical interfaces for the PL3. For the specifications of the electricalinterfaces, see the section that describes the C34S.



l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the N1PL3 is 15 W.

In the normal temperature (25℃), the maximum power consumption of the N2PL3 is 12 W.

6.6 PL3AThis section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.6.1 Version DescriptionThe PL3A board has two functional versions, N1 and N2. The difference between the twoversions lies in the support for the E13/M13 function.

6.6.2 Function and FeatureThe PL3A can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.

6.6.3 Working Principle and Signal FlowThe PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.

6.6.4 Front PanelOn the front panel of the PL3A, there are indicators and interfaces.

6.6.5 Valid SlotsThe PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500Bsubracks

6.6.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the PL3A.

6.6.7 Technical SpecificationsThe technical specifications of the PL3A cover the electrical interface specifications, boarddimensions, weight and power consumption.

6.6.1 Version DescriptionThe PL3A board has two functional versions, N1 and N2. The difference between the twoversions lies in the support for the E13/M13 function.

Table 6-24 lists the details on the versions of the PL3A board.



Table 6-24 Version description of the PL3A

Item Description

Functionalversion

The PL3A has two versions, N1 and N2.

Difference The N1PL3A does not support the E13/M13 function.The N2PL3A supports the E13/M13 function.The N2PL3A supports the board version replacement function and canreplace the N1PL3A. After the N1PD3A is replaced, the N2PD3A isconsistent with the N1PD3A in configuration and service status.

Replaceability The N2PD3A can fully replace the N1PD3A.

6.6.2 Function and FeatureThe PL3A can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.

Table 6-25 lists the functions and features of the PL3A.

Table 6-25 Functions and features of the PL3A

Function andFeature

PL3A

Basic function Processes 3 x E3/T3 signals.The N2PL3A supports the E13 function, which is used to converge E1services into E3 services.The N2PL3A supports the M13 function, which is used to converge T1services into T3 services.

Serviceprocessing

Accesses and processes 3 x E3/T3 electrical signals.

Overheadprocessing

Supports the setting and query of all path overhead bytes at the VC-3 level.



Maintenancefeature

Supports inloop and outloop for electrical interfaces.Supports warm reset and cold reset. The warm reset does not affectservices.Supports the function of querying the manufacturing information of theboard.Supports the in-service loading of the FPGA.Supports the upgrade of the board software without affecting services.Supports the PRBS function.




6.6.3 Working Principle and Signal FlowThe PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.

Figure 6-25 shows the block diagram for the functions of the PL3A.

Figure 6-25 Block diagram for the functions of the PL3A

E3/T3

E3/T3

E3/T3mapping/

demapping


Cross-connect unitA

2 x 155 Mbit/s

2 x 155 Mbit/s

LOS


Highspeed bus


Frame header


Interfacecoversion

module

34 MHz/45 MHz

OSC

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


+1.8 V

155 MHzPLL


LIU

LIU

PPI 6 x 34 Mbit/s/


Highspeed bus

Cross-connect unit




E3/T3 STM-1

PDH AISDetector


LPA LPT HPA HPT





LPA: Low order Path Adaptation LPT: Low order Path Termination



HPA: High order Path Adaptation HPT: High order Path Termination



outloop function. This module:l Encodes and decodes signals.





l LPT



l HPA


l HPT


l MST and RST











DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip onthe board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3V power are provided to the board.

6.6.4 Front PanelOn the front panel of the PL3A, there are indicators and interfaces.


Figure 6-27 shows the appearance of the front panel of the PL3A.

Figure 6-27 Front panel of the PL3A

PL3A

PL3A

STATACTPROGSRV

OU

T1IN

1O

UT2

IN2

IN3

OU

T3

Indicators









Interfaces

There are three pairs of 75-ohm unbalanced interfaces, which are of the SMB type.

6.6.5 Valid SlotsThe PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500Bsubracks

The PL3A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.

The PL3A can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

6.6.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the PL3A.

You can use the T2000 to set the following parameters for the PL3A:

l J1 byte

l C2 byte



l Path service type


6.6.7 Technical SpecificationsThe technical specifications of the PL3A cover the electrical interface specifications, boarddimensions, weight and power consumption.


Table 6-26 lists the specifications of the electrical interfaces of the PL3A.

Table 6-26 Specifications of the electrical interfaces of the PL3A

Interface Type Code OutputSignal BitRate




34368 kbit/s HDB3 Compliant with ITU-T G.703




Interface Type Code OutputSignal BitRate




44736 kbit/s B3ZS Compliant with ITU-T G.703


The mechanical specifications of the PL3A are as follows:


l Weight (kg): 1.0

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the N1PL3A is 15 W.

In the normal temperature (25℃), the maximum power consumption of the N2PL3A is 12 W.

6.7 PD3This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.7.1 Version DescriptionThe PD3 board has two functional versions, N1 and N2. The difference between the two versionslies in the support for the E13/M13 function.

6.7.2 Function and FeatureThe PD3 can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.

6.7.3 Working Principle and Signal FlowThe PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.


6.7.5 Valid SlotsThe OptiX OSN 1500A does not support the PD3 board.






6.7.1 Version DescriptionThe PD3 board has two functional versions, N1 and N2. The difference between the two versionslies in the support for the E13/M13 function.

Table 6-27 lists the details on the versions of the PD3 board.

Table 6-27 Version Description of the PD3

Item Description

Functionalversion

The PD3 has two functional versions, N1 and N2.

Difference The N1PD3 does not support the E13/M13 function.The N2PD3 supports the E13/M13 function.The N2PD3 supports the board version replacement function and canreplace the N1PD3. After the N1PD3 is replaced, the N2PD3 is consistentwith the N1PD3 in configuration and service status.

Replaceability The N2PD3 can fully replace the N1PD3.

6.7.2 Function and FeatureThe PD3 can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.

Table 6-28 lists the functions and features of the PD3.

Table 6-28 Functions and features of the PD3

Functionand Feature

PD3


Serviceprocessing

Accesses and processes 6 x E3/T3 electrical signals.The N2PD3 supports the E13 function, which is used to converge E1services into E3 services.The N2PD3 supports the M13 function, which is used to converge T1services into T3 services.

Overheadprocessing







Functionand Feature

PD3

Maintenancefeature


Protectionscheme

Supports the TPS protection when used with the interface and switchingboards.

6.7.3 Working Principle and Signal FlowThe PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.

Figure 6-28 shows the block diagram for the functions of the PD3.

Figure 6-28 Block diagram for the functions of the PD3

E3/T3

E3/T3

E3/T3mapping/

demapping


Cross-connect unitA

2 x 155 Mbit/s

2 x 155 Mbit/s

LOS


Highspeed bus


Frame header


Interfacecoversion

module

34 MHz/45 MHz

OSC

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


+1.8 V

155 MHzPLL


LIU

LIU

PPI 6 x 34 Mbit/s/


Highspeed bus

Cross-connect unit






E3/T3 STM-1

PDH AISDetector


LPA LPT HPA HPT








outloop function. This module:l Encodes and decodes signals.





l LPT



l HPA


l HPT





l MST and RST


Interface converting moduleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.






DC/DC converter moduleThrough the DC/ DC converting module, different direct currents are provided to each chip onthe board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3V power are provided to the board.


Appearance of the Front PanelFigure 6-30 shows the appearance of the front panel of the PD3.



Figure 6-30 Front panel of the PD3

PD3

PD3

STATACTPROGSRV







InterfacesNo interfaces are present on the front panel of the PD3.

The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PD3.For details, see the section that describes the D34S.

6.7.5 Valid SlotsThe OptiX OSN 1500A does not support the PD3 board.

In the OptiX OSN 1500B subrack, the PD3 can be housed in any of slots 12–13, and must beused with the D34S.

Table 6-29 lists the valid slots for the PD3 and corresponding slots for the D34S.




Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN1500B subrack

Valid Slot for the PD3 Corresponding Slot for the D34S

Slot 12 Slot 14

Slot 13 Slot 16


Protection PrincipleFor the OptiX OSN 1500B, when used with the D34S and TSB8, the PD3 can be configuredinto one 1:1 TPS protection group. Figure 6-31 shows the principle of the TPS protection forthe PD3.

Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack

TSB8

SLOT12

PD3

1 2

SLOT13

6 xE3/T3

D34S

PD3

SLOT 4/5

123

Switchcontrolsignal

Protection Working

Fail

Cross-connect

andtimingboard

l Normal stateWhen the working boards are running normally, the control switch of the D34S is in position1 and services are directly accessed to the PD3 board.

l Switching stateWhen the working board detects a fault and requires a switching, the control switch of theD34S is shifted to position 2 and the control switch of the TSB8 is shifted to a correspondingposition. In this way, the protection board protects the faulty working board.

Hardware ConfigurationTable 6-30 lists the slot configuration for the TPS protection for the PD3 in the OptiX OSN1500B subrack.



Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500Bsubrack

WorkingBoard


PD3 (E3) PD3 (E3) Figure 6-32 shows the slot configuration forthe 1:1TPS protection for the PD3

PD3 (T3) PD3 (T3)

Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500Bsubrack

Slot 14PIU

Slot 20

FAN

AUX

TSB8

D34S

CXL16/4/1 EOW

PIU

Slot 15

Slot 16

Slot 17

Slot 11

Slot 12

Slot 13

Slot 4

Slot 5

Slot 18

Slot 19

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10CXL16/4/1

Working

Protection


Table 6-31 lists the slots for the PD3, D34S and TSB8.

Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack


PD3 (working) Slot 13

PD3 (protection) Slot 12

TSB8 Slot 14

D34S Slot 16


You can use the T2000 to set the following parameters for the PD3:

l J1 byte

l C2 byte



l Path service type






Electrical Interface SpecificationsThe D34S provides electrical interfaces for the PD3. For the specifications of the electricalinterfaces, see the section that describes the D34S.

Mechanical SpecificationsThe mechanical specifications of the PD3 are as follows:


l Weight (kg): 1.1

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the N1PD3 is 19 W.

In the normal temperature (25℃), the maximum power consumption of the N2PD3 is 12 W.

6.8 PQ3This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function,principle, front panel, configuration and specifications.

6.8.1 Version DescriptionThe functional version of the PQ3 board is N2.

6.8.2 Function and FeatureThe PQ3 can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.

6.8.3 Working Principle and Signal FlowThe PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.


6.8.5 Valid SlotsThe OptiX OSN 1500A does not support the PQ3 board.



6.8.8 Technical Specifications



The technical specifications of the PQ3 cover the electrical interface specifications, boarddimensions, weight and power consumption.

6.8.1 Version DescriptionThe functional version of the PQ3 board is N2.

6.8.2 Function and FeatureThe PQ3 can be used to process E3/T3 signals and the overhead, to report alarms andperformance events, to provide the maintenance feature and the TPS protection.

Table 6-32 lists the functions and features of the PQ3.

Table 6-32 Functions and features of the PQ3

Function andFeature

PQ3


Serviceprocessing

Accesses and processes 12 x E3/T3 electrical signals.Supports the E13 function, which is used to converge E1 services into E3services.Supports the M13 function, which is used to converge T1 services into T3services.

Overheadprocessing




Maintenancefeature


Protectionscheme

Supports the TPS protection when used with the interface board and theswitching board.

6.8.3 Working Principle and Signal FlowThe PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,communication and control module and so on.

Figure 6-33 shows the block diagram for the functions of the PQ3.




Figure 6-33 Block diagram for the functions of the PQ3

E3/T3

E3/T3

E3/T3mapping/

demapping


Cross-connect unitA

2 x 155 Mbit/s

2 x 155 Mbit/s

LOS


Highspeed bus


Frame header


Interfacecoversion

module

34 MHz/45 MHz

OSC

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


+1.8 V

155 MHzPLL


LIU

LIU

PPI 6 x 34 Mbit/s/


Highspeed bus

Cross-connect unit




E3/T3 STM-1

PDH AISDetector


LPA LPT HPA HPT
















l LPT



l HPA


l HPT


l MST and RST


Interface conversion module











Through the DC/ DC converting module, different direct currents are provided to each chip onthe board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3V power are provided to the board.



Figure 6-35 shows the appearance of the front panel of the PQ3.

Figure 6-35 Front panel of the PQ3

PQ3

PQ3STATACTPROGSRV

Indicators









InterfacesThere are no interfaces on the front panel of the PQ3.

The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PQ3.For details, see the section that describes the D34S.

6.8.5 Valid SlotsThe OptiX OSN 1500A does not support the PQ3 board.

In the OptiX OSN 1500B subrack, the PQ3 can be housed in any of slots 12–13, and must beused with the D34S.

Table 6-33 lists the valid slots for the PQ3 and corresponding slots for the D34S.

Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN1500B subrack

Valid Slot for the PQ1 Corresponding Slot for the D34S




Protection PrincipleIn the OptiX OSN 1500B, used with the D34S and TSB8, the PQ3 can be configured into one1:1 TPS protection group. Figure 6-36 shows the principle of the TPS protection for the PQ3.

Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack

TSB8

1 2

6 xE3/T3

D34S

SLOT13

PQ3

SLOT 4/5

1 2

6 xE3/T3

D34S

1 2

TSB8

1 2

SLOT12

PQ3

Switchcontrolsignal

WorkingProtection

Fail

Cross-connect

and timingboard




l Normal stateWhen the working boards are running normally, the control switch of the D34S is in position1 and services are directly accessed to the PQ3 board.

l Switching stateWhen the working board detects a fault and requires a switching, the control switch of theD34S is shifted to position 2 and the control switch of the TSB8 is shifted to a correspondingposition. In this way, the protection board protects the faulty working board.

Hardware ConfigurationNOTE

Two TSB8 boards are required to configure the TPS protection for the N2PQ3.

Table 6-34 lists the slot configuration for the TPS protection for the PQ3 in the OptiX OSN1500B subrack.

Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500Bsubrack

WorkingBoard


PQ3 (E3) PQ3 (E3) Figure 6-37 shows the slot configuration forthe 1:3 TPS protection for the PQ3.

PQ3 (T3) PQ3 (T3)

Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500Bsubrack

Slot 14PIU

Slot 20

FAN

AUX

TSB8

D34S

CXL16/4/1 EOW

PIU

Slot 15

Slot 16

Slot 17

Slot 11

Slot 12

Slot 13

Slot 4

Slot 5

Slot 18

Slot 19

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10CXL16/4/1

TSB8

D34S

Protection

Working


Table 6-35 lists the slots for the PQ3, D34S and TSB8.

Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack


PQ3 (working) Slot 13

PQ3 (protection) Slot 12




TSB8 Slots 14–15

D34S Slots 16–17


You can use the T2000 to set the following parameters for the PQ3:

l J1 byte

l C2 byte



l Path service type



Electrical Interface SpecificationsThe D34S provides electrical interfaces for the PQ3. For the specifications of the electricalinterfaces, see the section that describes the D34S.



l Weight (kg): 1.1

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the PQ3 is 13 W.

6.9 DX1This section describes the DX1, a DDN interface convergence board, in terms of the version,function, principle, front panel, configuration and specifications.

6.9.1 Version DescriptionThe functional version of the DX1 board is N1.

6.9.2 Function and FeatureThe DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k levelat the system side.




6.9.3 Working Principle and Signal FlowThe DX1 consists of the interface and frame processing module, encoding/decoding module,timeslot cross-connect module, framing/deframing module and so on.

6.9.4 Front PanelOn the front panel of the DX1, there are indicators.

6.9.5 Valid SlotsThe OptiX OSN 1500A does not support the DX1 board.

6.9.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the DX1 indicates the interface impedance type.

6.9.7 TPS Protection for the BoardThe DX1 supports the 1:N TPS protection.

6.9.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the DX1.

6.9.9 Technical SpecificationsThe technical specifications of the DX1 cover the electrical interface specifications, boarddimensions, weight and power consumption.

6.9.1 Version DescriptionThe functional version of the DX1 board is N1.

6.9.2 Function and FeatureThe DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k levelat the system side.

Table 6-36 lists the functions and features of the DX1.

Table 6-36 Functions and features of the DX1

FunctionandFeature

DX1

Basicfunction

Processes eight channels of N x 64 kbit/s services and 8 x framed E1 services.Cross-connects 48 channels of N x 64 kbit/s signals at the system side.

Used withthe interfaceboard

Accesses eight channels of N x 64 kbit/s and 8 x framed E1 services andrealizes the 1:N TPS protection when used with the DM12.One DX1 board should be used with two DM12 boards.



Connector The connectors of the DB28 and DB44 are present on the front panel of theDM12. The DB28 is for the N x 64 kbit/s signals, and the DB44 is for theframed E1 signals.



FunctionandFeature

DX1

Loopbackfunction

Supports inloop and outloop.

PRBS self-test

Supported.

6.9.3 Working Principle and Signal FlowThe DX1 consists of the interface and frame processing module, encoding/decoding module,timeslot cross-connect module, framing/deframing module and so on.

Figure 6-38 shows the block diagram for the functions of the DX1.

Figure 6-38 Block diagram for the functions of the DX1

Frame E1interfacemodule

N x 64 kbit/sinterfacemodule

64kbit/sTimeslot

cross-connectmodule

Framing/deframing

module

mapping/demapping

module

Cross-connect unit

DM12DX1

N x 64 kbit/sinterfacemodule

DM12

8XNx64 kbit/s

8XFrame E1

Frame E1encoding/decoding

and frameprocessing

module

Backplane

Power

Nx64k bit/sinterface and

frameprocessing

module

SCC unit

8XNx64 kbit/s

Power

Backplane

Frame E1interfacemodule

+3.3 Vbackuppower

+3.3 V -48 V/-60 VFuse

Fuse

-48 V/-60 V


module

DC/DCconverter

DC/DCconverter

In the transmit directionThe SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module,which recovers the signals. The framing/deframing module converts the signals to framed E1signals and transmits the signals to the timeslot cross-connect module. The timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/s granularities, andtransmits the services that are dropped at the NE to the interface module.

In the receive directionThe DX1 accesses 8 x framed E1 signals from the framed E1 interface module and eight channelsof N x 64 kbit/s services from the N x 64 kbit/s interface module of the DM12. In addition, theDX1 recovers the clock and data signals.




The DX1 decodes the framed E1 signals and processes the frames. The DX1 also converts theN x 64 kbit/s signals, processes the frames. The DX1 then transmits the signals to the 64 kbit/scross-connect module. The timeslot cross-connect module cross-connects and grooms thesignals in the 64 kbit/s granularities. The timeslot cross-connect module then transmits thesignals to the framing/deframing module. The framing/deframing module then maps the signalsinto the VC-4 and transmits the signals into the SDH cross-connect board.

Control and communication moduleThe control and communication module performs the board communication, control and serviceconfiguration.

DC/DC converter moduleThe DC/DC converter module provides the DC voltages required by the modules of the board.

6.9.4 Front PanelOn the front panel of the DX1, there are indicators.

Appearance of the Front PanelFigure 6-39 shows the appearance of the front panel of the DX1.

Figure 6-39 Front panel of the DX1

DX1

DX1

STATACTPROGSRV



Indicators







Interfaces

There are no interfaces on the front panel of the DX1.

When used with the DM12, the DX1 can input and output the framed E1 and N x 64 kbit/ssignals. For details, see the section that describes the DM12.

6.9.5 Valid SlotsThe OptiX OSN 1500A does not support the DX1 board.

In the OptiX OSN 1500B subrack, the DX1 can be housed in any of slots 11–13, and must beused with the DM12.

Table 6-37 lists the valid slots for the DX1 and corresponding slots for the DM12.

Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN1500B subrack

Valid Slot for the DX1 Corresponding Slot for the DM12



NOTE


l One DX1 should be used with two DM12 to access eight channels of N x 64 kbit/s signals. The DM12board housed in the slot with a smaller slot number is used to access 8 x framed E1 and four channelsof N x 64 kbit/s signals. The DM12 board housed in the slot with a larger slot number is used to accessfour channels of N x 64 kbit/s signals.

6.9.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the DX1 indicates the interface impedance type.

Table 6-38 lists the relation between the board feature code and interface impedance type forthe DX1.





Board Barcode Feature Code Interface ImpedanceType

SSN1DX1A01 A01 75 ohms

SSN1DX1B01 B01 120 ohms

6.9.7 TPS Protection for the BoardThe DX1 supports the 1:N TPS protection.

Protection PrincipleIn the OptiX OSN 1500B, used with the DM12, the DX1 can be configured into one 1:N (N≤2) TPS protection group. Figure 6-40 shows the principle of the TPS protection for the DX1.

Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack

protection bus

DM

12D

M12

DM

12D

M12

SLOT13

SLOT12

SLOT11

SLOT14

SLOT15

SLOT16

SLOT17

service bus

TPSswitching

control bus

Fail

Working

Working

Protection

Cross-connect and timingboard

Detectboard fault

When detecting a fault in the working DX1 board, the cross-connect board issues a commandto switch the services from the faulty DX1 to the protection DX1. In this way, services areprotected.

Hardware ConfigurationFigure 6-41 shows the slot configuration for the 1:2 TPS protection for the DX1 in the OptiXOSN 1500B subrack.



Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500Bsubrack

Slot 14PIU

Slot20

FAN

PIU

AUX

DM12

WorkingWorking

CXL16/4/1

EOW

Protection

DM12DM12

DM12

Slot 15

Slot 16

Slot 17

Slot 11

Slot 12

Slot 13

Slot 4 CXL16/4/1

Slot 5

Slot 18

Slot 19

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10

As shown in Figure 6-41, the protection board housed in slot 11 protects the boards housed inslots 12–13.

Table 6-39 lists the slots for the DX1 and DM12 in the OptiX OSN 1500B subrack.

Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack


DX1 (working) Slots 12 and 13

DX1 (protection) Slot 11

DM12 Slots 14–17

6.9.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the DX1.

You can use the T2000 to set the following parameters for the DX1:

l J2 byte



l Protocol mode of serial ports

l DDN clock source management


6.9.9 Technical SpecificationsThe technical specifications of the DX1 cover the electrical interface specifications, boarddimensions, weight and power consumption.





The DM12 provides electrical interfaces for the DX1. For the specifications of the electricalinterfaces, see the section that describes the DM12.


The mechanical specifications of the DX1 are as follows:


l Weight (kg): 1.0

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the DX1 is 15 W.

NOTE

After the TPS protection is performed, the power consumption of the DX1 is 31 W.

6.10 DXAThis section describes the DXA, a DDN convergence board, in terms of the version, function,principle, front panel, configuration and specifications.

6.10.1 Version DescriptionThe functional version of the DXA board is N1.

6.10.2 Function and FeatureThe DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k levelat the system side.

6.10.3 Working Principle and Signal FlowThe DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/demapping module, control and communication module and power supply module.

6.10.4 Front PanelOn the front panel of the DXA, there are indicators.

6.10.5 Valid SlotsThe DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500Bsubracks.

6.10.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the DXA.

6.10.7 Technical SpecificationsThe technical specifications of the DXA cover the optical interface specifications, boarddimensions, weight and power consumption.

6.10.1 Version DescriptionThe functional version of the DXA board is N1.



6.10.2 Function and FeatureThe DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k levelat the system side.

Table 6-40 lists the functions and features of the DXA.

Table 6-40 Functions and features of the DXA

Function andFeature

DXA

Basic function Cross-connects 63 x framed E1 signals.



Loopback function Supports inloop and outloop.

PRBS self-test Not supported.

6.10.3 Working Principle and Signal FlowThe DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/demapping module, control and communication module and power supply module.

Figure 6-42 shows the block diagram for the functions of the DXA.

Figure 6-42 Block diagram for the functions of the DXA

64 kbit/stimeslot

crossconnectmodule

Framing/deframing

module

Mapping/demapping

module

Control andcommunication

module

Cross-connect

unit

Backplane

Cross-connect

unit

+3.3 V BackupPower


Fuse

Fuse

-48 V/-60 VDC/DC

converter

In the transmit directionThe SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module,which recovers the signals. The framing/deframing module converts the signals to framed E1




signals and transmits the signals to the timeslot cross-connect module. The timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/s granularities.

In the receive directionThe timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/sgranularities. The timeslot cross-connect module then transmits the signals to the framing/deframing module. The framing/deframing module then maps the signals into the VC-4 andtransmits the signals into the SDH cross-connect board.

Control and communication moduleThe control and communication module performs the board communication, control and serviceconfiguration.

DC/DC converter moduleThe DC/DC converter module provides the DC voltages required by the modules of the board.

6.10.4 Front PanelOn the front panel of the DXA, there are indicators.

Appearance of the Front PanelFigure 6-43 shows the appearance of the front panel of the DXA.



Figure 6-43 Front panel of the DXA

DXA

DXA

STATACTPROGSRV







InterfacesThere are no interfaces on the front panel of the DXA.

6.10.5 Valid SlotsThe DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500Bsubracks.

The DXA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack.




The DXA can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

6.10.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the DXA.

You can use the T2000 to set the following parameters for the DXA:

l J2 byte



l Protocol mode of serial ports

l DDN clock source management


6.10.7 Technical SpecificationsThe technical specifications of the DXA cover the optical interface specifications, boarddimensions, weight and power consumption.

Mechanical SpecificationsThe mechanical specifications of the DXA are as follows:


l Weight (kg): 0.8

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the DXA is 10 W.

6.11 SPQ4This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version,function, working principle, front panel and specifications.

6.11.1 Version DescriptionThe SPQ4 has two versions, N1 and N2. The two versions have different functions.

6.11.2 Function and FeatureThe SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarmsand performance events, and to provide the maintenance features and protection.

6.11.3 Working Principle and Signal FlowThe SPQ4 consists of the interface module, encoding/decoding module, frame synchronizationand scramble processing module, mapping/demapping module, SDH overhead processingmodule, logic control module, and power supply module.

6.11.4 Front PanelOn the front panel of the SPQ4, there are indicators.

6.11.5 Valid Slots



The OptiX OSN 1500A does not support the SPQ4 board.

6.11.6 TPS Protection for the BoardThe SPQ4 supports the 1:N TPS protection.

6.11.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SPQ4.

6.11.8 Technical SpecificationsThe technical specifications of the SPQ4 cover the electrical interface specifications, boarddimensions, weight and power consumption.

6.11.1 Version DescriptionThe SPQ4 has two versions, N1 and N2. The two versions have different functions.

Table 6-41 lists the details on the versions of the SPQ4 board.

Table 6-41 Version Description of the SPQ4

Item Description

Functionalversion

The SPQ4 has two versions, N1 and N2.

Difference The equipment of the V100R001 and V100R002 versions support theN1SPQ4. The equipment of the V100R003 and later versions support theN2SPQ2.

Replaceability The N1SPQ4 can be replaced by the N2SPQ4. When the N1SPQ4 isreplaced, the NE should be upgraded.

6.11.2 Function and FeatureThe SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarmsand performance events, and to provide the maintenance features and protection.

Table 6-42 lists the functions and features of the SPQ4.

Table 6-42 Functions and features of the SPQ4

Function andFeature

SPQ4

Basic function Processes 4 x STM-1/E4 signals.

Serviceprocessing

Accesses and processes 4 x E4/STM-1 electrical signals. For eachchannel, the E4 and STM-1 signals are compatible. Supports theprocessing of the VC-12, VC-3 and VC-4 services.

Overheadprocessing

Supports the processing of SOH bytes for the STM-1 signals, such as B1,B2, K1, K2, M1, F1, and D1–D12.Supports the transparent transmission and termination of POH bytes,including J1, B3, C2, G1, and H4.Supports the setting and query of the J0/J1/C2 bytes.




Function andFeature

SPQ4



Protectionscheme

Supports the TPS protection when used with the interface board and theswitching board.Supports the two-fiber unidirectional MSP protection ring, linear MSPprotection, and SNCP.

Maintenancefeature


6.11.3 Working Principle and Signal FlowThe SPQ4 consists of the interface module, encoding/decoding module, frame synchronizationand scramble processing module, mapping/demapping module, SDH overhead processingmodule, logic control module, and power supply module.

Figure 6-44 shows the block diagram for the functions of the SPQ4.Figure 6-45 shows the blockdiagram of the 140M mapping/ demapping. Figure 6-46 shows the block diagram of the SDHoverhead processing module.

Figure 6-44 Block diagram for the functions of the SPQ4

E4/STM-1

140M mapping/demapping

Interfaceconversion

module


module

Cross-connectunit A

DCC SCC unit

LOS

Outloop/Inloop control SCC unitCommunication

4x139 Mbit/s

Cross-connectunit B

High speed bus

34 MHzOSC

EN 140M/155M Frame header Cross-connectunit

SDH overhead processingmodule

4x155 Mbit/s

4x155 Mbit/s

4x155 Mbit/s

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


5 V

+1.8V+2.5V

155 MHzPLL

Reference clock Cross-connect unit

LIU

LIU

PPI/SPI

K1 and K2 Cross-connectunit

High speed bus



Figure 6-45 Block diagram of the 140M mapping/demapping

139Mbit/s

140M mapping/demapping

PDH AISdetector

E4 AISinsertionJ1/C2/B3

139Mbit/s

E4 AISinsertion

155Mbit/s

155Mbit/s

LPA HPT PG MST RST

RSTMSTHPTLPASIPO

Figure 6-46 Block diagram of the SDH overhead processing module

155 Mbit/s

155 Mbit/s


DCC


SCC unit

155 Mbit/s

RST MST MSA HPT

Cross-connect unit

155 Mbit/s

The principle of the E4/ STM-1 electrical interface units is described below.

PPI/SPIl The PPI module mainly consists of line interface units (LIUs). It provides inloop and





l The SPI module mainly consists of line interface units (LIUs). It provides inloop andoutloop function. This module:



l Processes the R_LOS signals.




SDH Overhead Processing Module and 140M Mapping/Demapping Module

SDH Overhead Processing Module (155Mbit/s SDH Signals)The functions required to manage 155 Mbit/s SDH signals are implemented by the SDHoverhead processing module.






MS_RDI and MS_AIS insertion.l Provides extraction or insertion of K1 byte and K2 byte.


detection, pointer justification.l In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation,

AU_AIS generation.

HPTl OH terminationl J1 path trace message recoverl REI information recoveringl HP_RDI detection (path status monitoringl UNEQ and AIS detection (signal label monitoring)l VC-4 BIP-8 errored block count

140M mapping/demapping (140Mbit/s PDH signals)The functions required to manage 140 Mbit/s PDH signals are implemented by the 140Mmapping/demapping module.

LPAThe 140 Mbit/s plesiochronous stream is inserted in a C4 container to be adapted so as to betransported into the synchronous network. PDH AIS is monitored and E4 AIS in inserted.

HPTThe virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributedwithin a 125 us interval (for example, one STM–1 period), and consists of the C4 container and



POH. The latter contains nine octets equally distributing within the frame. These overhead bytescan be extracted: J1, B3. C2, G1, F2, H4, F3, K3 and N1.E4 AIS can be inserted in downstreamdirection.

PG (Pointer generator)

A fixed pointer value is inserted in the SOH to structure the AU4 signal.

MST and RSTThese two functions are necessary to create a proprietary STM–1 signal in order to connect withinterface conversion module. In the receive direction, MST and RST perform frame alignmentdetection (A1, A2).





l Realizes the pass-through of orderwire and ECC bytes between the two service processingboards constituting the ADM when the GSCC is not online.



DC/DC converter moduleIt provides the board with required DC voltages. It converts the –48 V/–60 V power supply tothe following voltages: +2.5 V, + 3.3 V, + 1.8 V, + 5 V. In addition, protection for +3.3 V powerare provided to the board.

6.11.4 Front PanelOn the front panel of the SPQ4, there are indicators.

Appearance of the Front PanelFigure 6-47 shows the appearance of the front panel of the SPQ4.




Figure 6-47 Front panel of the SPQ4

SPQ4

SPQ4

STATACTPROGSRV







InterfacesThere are no interfaces on the front panel of the SPQ4. When used with the MU04, the SPQ4can input or output the E4/STM-1 signals. For details, see the section that describes the MU04.

6.11.5 Valid SlotsThe OptiX OSN 1500A does not support the SPQ4 board.

In the OptiX OSN 1500B subrack, the SPQ4 can be housed in any of slots 12–13, and must beused with the MU04.



Table 6-43 lists the valid slots for the SPQ4 and corresponding slots for the MU04.

Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN1500B subrack

Valid Slot for the SPQ4 Corresponding Slot for the DMU04

Slot 12 Slot 14

Slot 13 Slot 16

6.11.6 TPS Protection for the BoardThe SPQ4 supports the 1:N TPS protection.

Protection PrincipleIn the OptiX OSN 1500B, used with the MU04 and TSB8, the SPQ4 can be configured into one1:1 TPS protection group. Figure 6-48 shows the principle of the TPS protection for the SPQ4.

Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack

TSB8

SLOT12

SPQ4

1 2

SLOT13

SPQ4

SLOT 4/5

123

4×E4/STM-1

MU04

Cross-connect

andtimingboard

Switchcontrolsignal

Fail

Protection Working

l Normal stateWhen the working boards are running normally, the control switch of the MU04 is inposition 1 and the MU04 directly accesses the service signals to the SLH1.

l Switching stateWhen the working board detects a fault and requires a switching, the control switch of theMU04 is shifted to position 2 and the control switch of the TSB8 is shifted to acorresponding position. In this way, the protection board protects the faulty working board.

Hardware ConfigurationFigure 6-49 shows the slot configuration for the 1:2 TPS protection for the SPQ4 in the OptiXOSN 1500B subrack.




Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4

Slot 14PIU

Slot 20

FAN

AUX

TSB8

MU04

CXL16/4/1 EOW

PIU

Slot 15

Slot 16

Slot 17

Slot 11

Slot 12

Slot 13

Slot 4

Slot 5

Slot 18

Slot 19

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10CXL16/4/1

Working

Protection


Table 6-44 lists the slots for the SPQ4, MU04 and TSB8.

Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack


SPQ4 (working) Slot 13

SPQ4 (protection) Slot 12

MU04 Slot 16

TSB8 Slot 14

6.11.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the SPQ4.

You can use the T2000 to set the following parameters for the SPQ4:

l J1 byte

l C2 byte


6.11.8 Technical SpecificationsThe technical specifications of the SPQ4 cover the electrical interface specifications, boarddimensions, weight and power consumption.


The MU04 provides electrical interfaces for the SPQ4. For the specifications of the electricalinterfaces, see the section that describes the MU04.



Mechanical SpecificationsThe mechanical specifications of the SPQ4 are as follows:


l Weight (kg): 0.9

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the SPQ4 is 24 W.




7 Data Processing Boards

About This Chapter

This chapter describes the data processing boards for the FE, GE, ATM, and SAN signals.

7.1 EFT4This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms ofthe version, function, principle, front panel, configuration and specifications.

7.2 EFT8This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in termsof the version, function, principle, front panel, configuration and specifications.

7.3 EFT8AThis section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in termsof the version, function, principle, front panel, configuration and specifications.

7.4 EGT2This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms ofthe version, function, principle, front panel, configuration and specifications.

7.5 EFS0This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.

7.6 EFS4This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.

7.7 EGS2This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.

7.8 EMS4This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission andconvergence board, in terms of the version, function, principle, front panel, configuration andspecifications.

7.9 EGS4

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 7 Data Processing Boards


This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version,function, principle, front panel, configuration and specifications.

7.10 EGR2This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version,function, principle, front panel, configuration and specifications.

7.11 EMR0This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in termsof the version, function, principle, front panel, configuration and specifications.

7.12 ADL4This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.

7.13 ADQ1This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.

7.14 IDL4This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.

7.15 IDQ1This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.

7.16 MST4This section describes the MST4, a 4-channel multi-service transparent transmission board, interms of the version, function, principle, front panel, configuration and specifications.

7 Data Processing BoardsOptiX OSN 1500 Intelligent Optical Transmission System



7.1 EFT4This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms ofthe version, function, principle, front panel, configuration and specifications.

7.1.1 Version DescriptionThe functional version of the EFT4 board is R1.

7.1.2 Function and FeatureThe EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames.

7.1.3 Working Principle and Signal FlowThe EFT4 consists of the ethernet access module, mapping module, interface converting module,Communication and control module and so on.

7.1.4 Front PanelOn the front panel of the EFT4, there are indicators, interfaces and barcode.

7.1.5 Valid SlotsThe EFT4 can be housed in any of slots 2, 3, 6–9 and 12–13 in the OptiX OSN 1500A subrack.The EFT4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack.

7.1.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFT4.

7.1.7 Technical SpecificationsThe specifications of the EFT4 cover the mechanical specifications and power consumption.

7.1.1 Version DescriptionThe functional version of the EFT4 board is R1.


Table 7-1 lists the functions and features of the EFT4.

Table 7-1 Functions and features of the EFT4

Function andFeature

EFT4

Basic function Transmits 4 x FE services.


Supports 10Base-T/100Base-TX signals. The optical interfaces complywith IEEE 802.3u.

Format of serviceframes

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG.Supports frames with a length ranging from 64 bytes to 9600 bytes.Supports Jumbo frames with a length less than 9600 bytes.



Function andFeature

EFT4

Max. uplinkbandwidth

622 Mbit/s.

Number ofVCTRUNKs

4.

Encapsulationformat

HDLC.LAPS.GFP-F.

Mappinggranularity

Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).

Ethernet servicetype

Supports EPL.

MPLS Not supported.

VLAN Supports VLAN transparent transmission.

LPT Not supported.

CAR Not supported.

Flow controlfunction

Supports the IEEE 802.3x flow control based on FE port.

LCAS Dynamically increases or decreases the bandwidth, and realizes theprotection function, compliant with ITU-T G.7042.

Test frame Receives and transmits Ethernet test frames.

Ethernetperformancemonitoring

Supports Ethernet performance monitoring at the port level.



7.1.3 Working Principle and Signal FlowThe EFT4 consists of the ethernet access module, mapping module, interface converting module,Communication and control module and so on.

Figure 7-1 shows the block diagram for the functions of the EFT4.




Figure 7-1 Block diagram for the functions of the EFT4

Ethernetaccessmodule


moduleSCC unit

FE

SCC unit

Communication

Cross-connect unit

Reference clock and frame header

Cross-connect unit

Clock module

77MHz

125MHz

155MHz

LOS

Interfaceconverting

module

ENCP

DENCP

Mapping module

VCP

Lasershutdown

- 48 V/-60V

+3.3 V backuppower

+3.3 V+2.5 V

+3.3 V - 48 V/-60VDC/DCconverter

Fuse

FuseDC/DCconverter

+1.8 V+1.5 V

The function modules of ethernet switching boards are described below:

ENCP: data encapsulation module DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet access module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/Econversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.

In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,signals are encoded and converted from electrical signals to optical signals.

Mapping module

The mapping module consists of encapsulation and mapping.

In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.The concatenation is processed. Ethernet signals are then converted into SDH signals.

In the downstream direction, SDH signals are demapped. The time delay of virtual concatenationis compensated. After aligning, packets are decapsulated as per encapsulation format. Thedecapsulated data are transmitted to the network processor module in packets.




Communication and control moduleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:

l Manages and configures other modules of the boards.


The control module also contains basic logic units. This module enjoys the following functions:

l Writes and reads register

l Provides interface for CPU

l Checks, selects clock

l Performs phase discrimination and frequency division to the clock

l Checks the in-service state of the cross-connect, the SCC and the line boards

l Controls the shutting down of the optical module

l Processes communication

l Control indicators

Clock unitThis clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC converter moduleThrough the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,this unit also provides protection for the board +3.3 V power supply.


Appearance of the Front PanelFigure 7-2 shows the appearance of the front panel of the EFT4.




Figure 7-2 Front panel of the EFT4

EFT4

STATACTPROGSRV

FE1FE2

FE3FE4






l Connection status indicator (LINK), which is green when lit.

l Data receiving and transmission indicator (ACT), which is orange when lit.


InterfacesThere are four FE interfaces on the front panel of the EFT4. Table 7-2 lists the type and usageof the interfaces.

Table 7-2 Optical interfaces of the EFT4


FE1 RJ-45 Transmits and receives the 10Base-T/100Base-TXsignals.




Table 7-3 lists the pins of the RJ-45 interface.



Table 7-3 Pins of the RJ-45 of the EFT4

Pin Description

1 Transmitting positive

2 Transmitting negative

3 Receiving positive

4 Grounding

5 Grounding

6 Receiving negative

7 Grounding

8 Grounding

7.1.5 Valid SlotsThe EFT4 can be housed in any of slots 2, 3, 6–9 and 12–13 in the OptiX OSN 1500A subrack.The EFT4 can be housed in any of slots 1–3, 6–9 and 11–13 in the OptiX OSN 1500B subrack.

NOTE

The slots are divided slots.


You can use the T2000 to set the following parameters for the EFT4:

l Working mode

l Enabling of the LCAS

l Maximum packet length

l Mapping protocol



Mechanical SpecificationsThe mechanical specifications of the EFT4 are as follows:


l Weight (kg): 0.5

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EFT4 is 14 W.




7.2 EFT8This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in termsof the version, function, principle, front panel, configuration and specifications.

7.2.1 Version DescriptionThe functional version of the EFT8 board is N1.


7.2.3 Working Principle and Signal FlowThe EFT8 consists of the ethernet access module, mapping module, interface converting module,communication and control module and so on.


7.2.5 Valid SlotsThe EFT8 can be used with the ETF8 and EFF8.



7.2.1 Version DescriptionThe functional version of the EFT8 board is N1.


Table 7-4 lists the functions and features of the EFT8.

Table 7-4 Functions and features of the EFT8

Function andFeature

EFT8

Basic function Transmits 8 x FE or 16 x FE services

Used with theinterface board

Accesses 8 x Ethernet signals at the electrical port.Accesses 16 x Ethernet signals at the electrical port when used with theETF8.Accesses 8 x Ethernet optical signals and 8 x Ethernet electrical signalswhen used with the EFF8.



Function andFeature

EFT8


Supports the 10Base-T/100Base-TX signals when used with the ETF8.Supports the 100Base-FX/100Base-TX signals when used with theEFF8. The optical interfaces comply with IEEE 802.3u.


Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supportsframes with a length ranging from 64 bytes to 9600 bytes. SupportsJumbo frames with a length less than 9600 bytes.


1.25 Gbit/s.

Number ofVCTRUNKs

16.

Encapsulationformat

Supports HDLC, LAPS, and GFP-F.

Mappinggranularity



Supports EPL.

MPLS Not supported.

VLAN Supports the VLAN transparent transmission.

LPT Not supported.

CAR Not supported.




Test frame Receives and transmits GFP test frames.



Alarms andperformanceevents


7.2.3 Working Principle and Signal FlowThe EFT8 consists of the ethernet access module, mapping module, interface converting module,communication and control module and so on.

Figure 7-3 shows the block diagram for the functions of the EFT8.




Figure 7-3 Block diagram for the functions of the EFT8



moduleSCC unit

FE

SCC unit

Communication

Cross-connect unit


Cross-connect unit

Clock module

77MHz

125MHz

155MHz

LOS

Interfaceconverting

module

ENCP

DENCP

Mapping module

VCP

Lasershutdown

- 48 V/-60V

+3.3 V backuppower

+3.3 V+2.5 V


Fuse

FuseDC/DCconverter

+1.8 V+1.5 V

ENCP: data encapsulation module DENCP: decapsulation moduleVCP: virtual concatenation processing module


Ethernet Access Module



Mapping Module






Interface Converting ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.

Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:












Clock UnitThis clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter ModuleThrough the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,this unit also provides protection for the board +3.3 V power supply.


Appearance of the Front PanelFigure 7-4 shows the appearance of the front panel of the EFT8.




Figure 7-4 Front panel of the EFT8

EFT8

EFT8

STATACTPROGSRV

FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

Indicators









Interfaces

There are eight interfaces on the front panel of the EFT8. Table 7-5 lists the type and usage ofthe interfaces.



Table 7-5 Optical interfaces of the EFT8











Table 7-6 Pins of the RJ-45 of the EFT8

Pin Description




4 Grounding

5 Grounding


7 Grounding

8 Grounding

7.2.5 Valid SlotsThe EFT8 can be used with the ETF8 and EFF8.

Table 7-7 and Table 7-8 list the valid slots for the EFT8 and corresponding slots for the ETF8and EFF8.




Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiXOSN 1500A

Valid Slot for the EFT8 Corresponding Slot for the ETF8 and EFF8

Slot 12 Without the interface board


Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiXOSN 1500B

Valid Slot for the EFT8 Corresponding Slot for the ETF8 and EFF8


Slot 12 Slot 14

Slot 13 Slot 16


You can use the T2000 to set the following parameters for the EFT8:

l Working mode



l Mapping protocol



Mechanical SpecificationsThe mechanical specifications of the EFT8 are as follows:


l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EFT8 is 26 W.

7.3 EFT8AThis section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in termsof the version, function, principle, front panel, configuration and specifications.



7.3.1 Version DescriptionThe functional version of the EFT8A board is N1.

7.3.2 Function and FeatureThe EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames.

7.3.3 Working Principle and Signal FlowThe EFT8A consists of the ethernet access module, mapping module, interface convertingmodule, communication and control module and so on.

7.3.4 Front PanelOn the front panel of the EFT8A, there are indicators, interfaces and barcode.

7.3.5 Valid SlotsThe EFT8A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFT8Acan be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.3.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFT8A.

7.3.7 Technical SpecificationsThe specifications of the EFT8A cover the mechanical specifications and power consumption.

7.3.1 Version DescriptionThe functional version of the EFT8A board is N1.

7.3.2 Function and FeatureThe EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames.

Table 7-9 lists the functions and features of the EFT8A.

Table 7-9 Functions and features of the EFT8A

Function andFeature

EFT8A

Basic function Transparently transmits 8 x FE services.


Supports 10Base-T/100Base-TX signals. The optical interfacescomply with IEEE 802.3u.




622 Mbit/s.

Number ofVCTRUNKs

8.

Encapsulationformat


Mapping granularity Supports VC-12, VC-3, VC-12-Xv (X≤63), and VC-3-Xv (X≤3).




Function andFeature

EFT8A

Ethernet service type Supports EPL.

MPLS Not supported.


LPT Not supported.

CAR Not supported.




Test frame Receives and transmits GFP test frames.





7.3.3 Working Principle and Signal FlowThe EFT8A consists of the ethernet access module, mapping module, interface convertingmodule, communication and control module and so on.

Figure 7-5 shows the block diagram for the functions of the EFT8A.



Figure 7-5 Block diagram for the functions of the EFT8A



moduleSCC unit

FE

SCC unit

Communication

Cross-connect unit


Cross-connect unit

Clock module

77MHz

125MHz

155MHz

LOS

Interfaceconverting

module

ENCP

DENCP

Mapping module

VCP

Lasershutdown

- 48 V/-60V

+3.3 V backuppower

+3.3 V+2.5 V


Fuse

FuseDC/DCconverter

+1.8 V+1.5 V






Mapping Module






















7.3.4 Front PanelOn the front panel of the EFT8A, there are indicators, interfaces and barcode.

Appearance of the Front PanelFigure 7-6 shows the appearance of the front panel of the EFT8A.



Figure 7-6 Front panel of the EFT8A

EFT8A

EFT8A

STATACTPROGSRV

FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

Indicators









Interfaces

There are eight FE interfaces on the front panel of the EFT8A. Table 7-10 lists the type andusage of the interfaces.




Table 7-10 Optical interfaces of the EFT8A











Table 7-11 Pins of the RJ-45 of the EFT8A

Pin Description




4 Grounding

5 Grounding


7 Grounding

8 Grounding

7.3.5 Valid SlotsThe EFT8A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFT8Acan be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.



7.3.6 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFT8A.

You can use the T2000 to set the following parameters for the EFT8A:

l Working mode



l Mapping protocol


7.3.7 Technical SpecificationsThe specifications of the EFT8A cover the mechanical specifications and power consumption.

Mechanical SpecificationsThe mechanical specifications of the EFT8A are as follows:


l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EFT8A is 26 W.

7.4 EGT2This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms ofthe version, function, principle, front panel, configuration and specifications.

7.4.1 Version DescriptionThe functional version of the EGT2 board is N1.

7.4.2 Function and FeatureThe EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames.

7.4.3 Working Principle and Signal FlowThe EGT2 consists of the ethernet access module, mapping module, interface convertingmodule, interface converting module, Communication and Control Module and so on.

7.4.4 Front PanelOn the front panel of the EGT2, there are indicators, interfaces and barcode.

7.4.5 Valid SlotsThe EGT2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGT2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.4.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGT2 indicates the optical interface type.




7.4.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGT2.

7.4.8 Technical SpecificationsThe specifications of the EGT2 cover the optical interface specifications, mechanicalspecifications and power consumption.

7.4.1 Version DescriptionThe functional version of the EGT2 board is N1.

7.4.2 Function and FeatureThe EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames.

Table 7-12 lists the functions and features of the EGT2.

Table 7-12 Functions and features of the EGT2

Function andFeature

EGT2

Basic function Transparently transmits 2 x GE services.


The optical interfaces are 1000Base-SX/LX/ZX Ethernet opticalinterfaces. The optical interfaces support the auto-negotiation, compliantwith IEEE 802.3z. The optical interfaces use the hot-swappable opticalmodule SFP. When multimode optical fiber is used, the maximumtransmission distance is 550 m. When single-mode optical fiber is used,the maximum transmission distance is 10 km. The optical modules canbe used for different requirements for the transmission distance, such as40 km and 70 km.




2.5 Gbit/s.

Number ofVCTRUNKs

2.

Encapsulationformat


Mappinggranularity



Supports EPL.

MPLS Not supported.


LPT Not supported.



Function andFeature

EGT2

CAR Not supported.


Supports the IEEE 802.3x flow control based on GE port.

LCAS Dynamically increases or decreases the bandwidth and realizes theprotection function, compliant with ITU-T G.7042.






7.4.3 Working Principle and Signal FlowThe EGT2 consists of the ethernet access module, mapping module, interface convertingmodule, interface converting module, Communication and Control Module and so on.

Figure 7-7 shows the block diagram for the functions of the EGT2.

Figure 7-7 Block diagram for the functions of the EGT2



moduleSCC unit

GE

SCC unit

Communication

Cross-connect unit


Cross-connect unit

Clock module

77MHz

125MHz

155MHz

LOS

Interfaceconverting

module

ENCP

DENCP

Mapping module

VCP

Lasershutdown

- 48 V/-60V

+3.3 V backuppower

+3.3 V+2.5 V


Fuse

FuseDC/DCconverter

+1.8 V+1.5 V

ENCP: data encapsulation module DENCP: decapsulation module




VCP: virtual concatenation processing module


Ethernet Access ModuleIn the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/Econversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.


Mapping ModuleThe mapping module consists of encapsulation and mapping.


















Clock Unit

This clock unit tracing the system reference clock and generates the required working clocks foreach chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,this unit also provides protection for the board +3.3 V power supply.

7.4.4 Front PanelOn the front panel of the EGT2, there are indicators, interfaces and barcode.


Figure 7-8 shows the appearance of the front panel of the EGT2.

Figure 7-8 Front panel of the EGT2

EGT2

EGT2

STATACTPROGSRVLINK1ACT1

ACT2LINK2

CLASS 1LASER

PRODUCT

OU

T1IN

1O

UT2

IN2




Indicators









Interfaces

There are two GE interfaces on the front panel of the EGT2. Table 7-13 lists the type and usageof the interfaces.

Table 7-13 Optical interfaces of the EGT2


IN1/OUT1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.

IN2/OUT2 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.

7.4.5 Valid SlotsThe EGT2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGT2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.4.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGT2 indicates the optical interface type.

Table 7-14 lists the relation between the board feature code and optical interface type for theEGT2.


Board Barcode Feature Code Optical Interface Type

SSN1EGT210 10 1000Base-SX (0.55 km)

SSN1EGT211 11 1000Base-LX (10 km)

SSN1EGT212 12 1000Base-ZX (40 km)

SSN1EGT213 13 1000Base-ZX (70 km)



7.4.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGT2.

You can use the T2000 to set the following parameters for the EGT2:

l Working mode



l Mapping protocol


7.4.8 Technical SpecificationsThe specifications of the EGT2 cover the optical interface specifications, mechanicalspecifications and power consumption.

Optical Interface SpecificationsTable 7-15 lists the specifications of the interfaces of the EGT2.

Table 7-15 Specifications of the optical interfaces of the EGT2

Item Specification


1000Base-ZX(70 km)

1000Base-ZX(40 km)

1000Base-LX(10 km)

1000Base-SX(0.55 km)

Optical sourcetype

MLM MLM MLM MLM


–4 to +2 –2 to +5 –9 to –3 –9.5 to 0

Centralwavelength(nm)

1480 to 1580 1270 to 1355 1270 to 1355 770 to 860


–3 –3 –3 0


–22 –23 –19 –17

Extinction ratio(dB)

9 9 9 9







The mechanical specifications of the EGT2 are as follows:


l Weight (kg): 0.9

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the EGT2 is 29 W.

7.5 EFS0This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.

7.5.1 Version DescriptionThe EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version isstopped.

7.5.2 Function and FeatureThe EFS0 supports Layer 2 switching, MPLS and broadcast.

7.5.3 Working Principle and Signal FlowThe EFS0 consists of the ethernet access module, network processor module, mapping module,interface converting module and so on.

7.5.4 Front PanelOn the front panel of the EFS0, there are indicators, interfaces and barcode.

7.5.5 Valid SlotsThe EFS0 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack.

7.5.6 TPS ProtectionThe EFS0 supports the 1:N TPS protection.

7.5.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EFS0.

7.5.8 Technical SpecificationsThe specifications of the EFS0 cover the mechanical specifications and power consumption.

7.5.1 Version DescriptionThe EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version isstopped.

The OptiX OSN 1500A does not support the EFS0. The OptiX OSN 1500B supports the EFS0.

Table 7-16 lists the details on the versions of the EFS0 board.



Table 7-16 Version Description of the EFS0

Item Description

Functionalversion

The EFS0 has three versions, N1, N2, and N4.

Difference The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s.The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s.The N1EFS0 supports the port flow, port+VLAN ID flow, and port+VLAN PRI flow.The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow,and port+VLAN PRI flow.

Replaceability The N2EFS0 supports the board version replacement function and canreplace the N1EFS0.The N4EFS0 supports the board version replacement function and canreplace the N1EFS0 and N2EFS0.


Table 7-17 lists the functions and features of the EFS0.

Table 7-17 Functions and features of the EFS0

Function andFeature

EFS0

Basic function Processes 8 x FE services.


Accesses 8 x FE signals at the electrical interface when used with theETF8.Accesses 8 x FE signals at the optical interface when used with the EFF8.Realizes the TPS protection for 8 x FE signals at the electrical interfacewhen used with the ETS8 and TSB8.


Supports the 10Base-T/100Base-TX signals when used with the ETF8.Supports the 100Base-FX signals when used with the EFF8. The opticalinerfaces comply with IEEE 802.3u.


Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frameswith a length ranging from 64 bytes to 9600 bytes. Supports Jumboframes with a length less than 9600 bytes.


The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s.The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s.The maximum uplink bandwidth of the N4EFS0 is 1.25 Gbit/s.




Function andFeature

EFS0

Number ofVCTRUNKs

The number of the VCTRUNKs of the N1EFS0 is 12.The number of the VCTRUNKs of the N2EFS0 is 24.The number of the VCTRUNKs of the N4EFS0 is 24.

Mappinggranularity


Encapsulationformat

GFP.

EPL Supports transparent transmission based on port and Ethernet private lineservices based on port+VLAN.

EVPL Supports EVPL services that use the frame encapsulation formats ofMartinioE and stack VLAN.

EPLAN Supports the Layer 2 convergence and point to multipoint convergence.Supports the Layer 2 forwarding function.Supports switching at the client and SDH sides.Supports the function of self-learning the source MAC address. Thelength of the MAC address table is 16k. The aging time of the MACaddress can be set and queried.Supports the configuration of static MAC route.The N1EFS0 and N2EFS0 support the dynamic query of the MACaddress, and support the query of the number of the learned MACaddresses according to VB+VLAN or VB+LP.The N4EFS0 does not support the dynamic query of the MAC address,but it supports the query of the number of the learned MAC addressesaccording to VB+VLAN or VB+LP.Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of the VB. The maximumnumber of the VBs is 16. The maximum number of logical ports for eachVB is 30.

EVPLAN Supports EVPLAN services. The N1EFS0 uses the frame encapsulationformats of MPLS MartinioE, MPLS MartinioP and stack VLAN. TheN2EFS0 and N4EFS0 use the frame encapsulation formats of MPLSMartinioE and stack VLAN.

MPLS Supported.

VLAN Compliant with IEEE 802.1q/p.

VLANconvergence

Supported (4k VLAN).

RSTP Supports broadcast packet suppression and RSTP, compliant with IEEE802.1w.



Function andFeature

EFS0

Multicast (IGMPSnooping)

Supported.

CAR Supported.The granularity is 64 kbit/s.

Service basedQoS flowclassification

The N1EFS0 supports the port service, port+VLAN ID service, and port+VLAN PRI service.The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow,and port+VLAN PRI flow.


LPT Supports the LPT function, which can be enabled or disabled.


Supports the IEEE 802.3x flow control based on port.


Loopbackfunction

Supports inloop at the Ethernet port (PHY layer or MAC layer). Supportsinloop and outloop at the VC-3 level.





7.5.3 Working Principle and Signal FlowThe EFS0 consists of the ethernet access module, network processor module, mapping module,interface converting module and so on.

Figure 7-9 shows the block diagram for the functions of the EFS0.




Figure 7-9 Block diagram for the functions of the EFS0


FE Interfacecoversion

module

ENCP

DENCP

Mapping module

VCP

Control

Data

Switchfabric

Networkprocessor

Network processor module

Communicationand control module

SCC unit

SCC unit

Communication


Clock module

77MHz

125MHz

155MHz

LOSLasershutdown

50MHz

+2.5 V+1.8 V+1.5 V

Cross-connect unit

Cross-connect unit

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V







Network Processor Module

The network processor module consists of network processor and switch fabric. The networkprocessor first performs MAC functions, which include code conversion, framing of Ethernetpackets, CRC check and Ethernet performance statistics.

After the striped Ethernet frame enters the core of network processor, the flow is classified asper service type and configuration requirements. The frame is encapsulated or decapsulated.These packets formats are supported:

l Multi-protocol label switching (MPLS)

l L2MPLS VPN

l Ethernet/ VLAN



In the receive direction, services are mapped and forwarded by adding Tunnel and VC doublelabels as per service configuration. In the transmit direction, Tunnel or VC is extracted as perthe level (P or PE) of the equipment. Services are then routed or forwarded.

The network processor module:

l Supports flow sense and flow classification

l Supports uni-cast, multi-cast and broadcast of the flow

l Provides data priority setting

l Provides weighted fair queuing (WFQ)

l Provides four classes of services (CoS)

Mapping Module


In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.The concatenation is processed. The LCAS function is supported. Ethernet signals are thenconverted into SDH signals.


Interface Conversion Module


Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:















Clock Unit



Through the DC/DC module, the power converting unit generates required voltages for eachchip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3V. In addition, this unit also provides protection for the board +3.3 V power supply.



Figure 7-10 shows the appearance of the front panel of the EFS0.

Figure 7-10 Front panel of the EFS0

EFS0

EFS0

STATACTPROGSRV









InterfacesThere are no interfaces on the front panel of the EFS0. The interfaces are present on the ETF8or EFF8.

7.5.5 Valid SlotsThe EFS0 can be housed in any of slots 12–13 in the OptiX OSN 1500B subrack.

When the N1EFS0 is housed in any of slots 12–13 in the OptiX OSN 1500B subrack, thebandwidth is 622 Mbit/s.

When the N2EFS0 or N4EFS0 is housed in any of slots 12–13 in the OptiX OSN 1500B subrack,the bandwidth is 1.25 Gbit/s.

The EFS0 can be used with the ETF8 and EFF8.

Table 7-18 lists the valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8.

Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8 in the OptiXOSN 1500B subrack

Valid Slot for the EFS0 Corresponding Slot for the ETF8 and EFF8

Slot 12 Slot 14

Slot 13 Slot 16

7.5.6 TPS ProtectionThe EFS0 supports the 1:N TPS protection.

Figure 7-11 shows the slot configuration for the 1:1 TPS protection for the EFS0.




Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500Bsubrack

Slot 14PIU

Slot 20

FAN

AUX

TSB8

ETS8

EFS0 Protection

EFS0 Working

CXL16/4/1 EOW

PIU

Slot 15

Slot 16

Slot 17

Slot 11

Slot 12

Slot 13

Slot 4

Slot 5

Slot 18

Slot 19

Slot 6

Slot 7

Slot 8

Slot 9

Slot 10CXL16/4/1

As shown in Figure 7-11, the protection board housed in slot 12 protects the board housed inslot 13. The ETS8, housed in slot 16, is used with the working ETS0. The TSB8, housed in slot14, is used with the protection EFS0.


You can use the T2000 to set the following parameters for the EFS0:

l Working mode



l Mapping protocol



Mechanical SpecificationsThe mechanical specifications of the EFS0 are as follows:


l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EFS0 is 35 W.

7.6 EFS4This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.



7.6.1 Version DescriptionThe EFS4 has two functional versions, N1 and N2. The two versions have different maximumuplink bandwidth.


7.6.3 Working Principle and Signal FlowThe EFS4 consists of the interface module, service processing module, encapsulation andmapping module, interface converting module, control and communication Module and thepower supply module


7.6.5 Valid SlotsThe EFS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFS4 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.



7.6.1 Version DescriptionThe EFS4 has two functional versions, N1 and N2. The two versions have different maximumuplink bandwidth.

Table 7-19 lists the details on the versions of the EFS4 board.

Table 7-19 Version Description of the EFS4

Item Description

Functionalversion

The EFS4 has two versions, N1 and N2.

Difference The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s.The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s.The N2EFS4 supports the board version replacement function.

Replaceability The N2EFS4 supports the board version replacement function and canreplace the N1EFS4.


Table 7-20 lists the functions and features of the EFS4.




Table 7-20 Functions and features of the EFS4

Function andFeature

EFS4

Basic function Processes 4 x FE services.

Specification ofthe opticalinterfaces

Supports 10Base-T/100Base-TX signals. The optical interfaces complywith IEEE 802.3u.


Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frameswith a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frameswith a length less than 9600 bytes.


The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s.The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s.

Number ofVCTRUNKs

The number of the VCTRUNKs of the N1EFS4 is 12.The number of the VCTRUNKs of the N2EFS4 is 24.

Mappinggranularity


Encapsulationformat

GFP.

EPL Supports transparent transmission based on port and Ethernet private lineservices based on port+VLAN.

EVPL Supports EVPL services that use the frame encapsulation formats ofMartinioE and stack VLAN.

EPLAN Supports the Layer 2 convergence and point to multipoint convergence.Supports the Layer 2 forwarding function and switching at the client andSDH sides.Supports the function of self-learning the source MAC address. Thelength of the MAC address table is 16k. The aging time of the MACaddress can be set and queried.Supports the configuration of static MAC route.The N1EFS4 supports the dynamic query of the MAC address, andsupports the query of the number of the learned MAC addresses accordingto VB+VLAN or VB+LP.The N2EFS4 does not support the dynamic query of the MAC address,but it supports the query of the number of the learned MAC addressesaccording to VB+VLAN or VB+LP.Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of the VB. The maximumnumber of the VBs is 16 (a maximum of two VBs for the N2EGS2). Themaximum number of logical ports for each VB is 30.



Function andFeature

EFS4

EVPLAN Supports EVPLAN services. The N1EFS4 uses the frame encapsulationformats of MPLS MartinioE, MPLS MartinioP and stack VLAN. TheN2EFS4 uses the frame encapsulation formats of MPLS MartinioE andstack VLAN.

MPLS Supported.


VLANconvergence




Supported.


Service based The N1EFS4 supports the port service, port+VLAN ID service, and port+VLAN PRI service.

QoS flowclassification

The N2EFS4 supports the port flow, port+VLAN ID flow, and port+VLAN PRI flow.






Loopbackfunction






7.6.3 Working Principle and Signal FlowThe EFS4 consists of the interface module, service processing module, encapsulation andmapping module, interface converting module, control and communication Module and thepower supply module




Figure 7-12 shows the block diagram for the functions of the EFS4.

Figure 7-12 Block diagram for the functions of the EFS4


FE Interfacecoversion

module

ENCP

DENCP

Mapping module

VCP

Control

Data

Switchfabric

Networkprocessor



SCC unit

SCC unit

Communication


Clock module

77MHz

125MHz

155MHz

LOSLasershutdown

50MHz

+2.5 V+1.8 V+1.5 V

Cross-connect unit

Cross-connect unit

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V






Network Processor ModuleThe network processor module consists of network processor and switch fabric. The networkprocessor first performs MAC functions, which include code conversion, framing of Ethernetpackets, CRC check and Ethernet performance statistics.



l L2MPLS VPN



l Ethernet/ VLAN











Interface Conversion ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.
















Clock Unit



Through the DC/DC module, the power converting unit generates required voltages for eachchip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3V. In addition, this unit also provides protection for the board +3.3 V power supply.



Figure 7-13 shows the appearance of the front panel of the EFS4.

Figure 7-13 Front panel of the EFS4

EFS4

EFS4

STATACTPROGSRV

FE1

FE2

FE3

FE4



Indicators









Interfaces

There are four FE interfaces on the front panel of the EFS4. Table 7-21 lists the type and usageof the interfaces.

Table 7-21 Optical interfaces of the EFS4







Table 7-22 Pins of the RJ-45 of the EFS4

Pin Description




4 Grounding

5 Grounding


7 Grounding




Pin Description

8 Grounding

7.6.5 Valid SlotsThe EFS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EFS4 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.


You can use the T2000 to set the following parameters for the EFS4:

l Working mode



l Mapping protocol



Mechanical SpecificationsThe mechanical specifications of the EFS4 are as follows:


l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EFS4 is 30 W.

7.7 EGS2This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in termsof the version, function, principle, front panel, configuration and specifications.

7.7.1 Version DescriptionThe EGS2 has two functional versions, N1 and N2. The two versions have different functionsand features.

7.7.2 Function and FeatureThe EGS2 supports Layer 2 switching, MPLS and broadcast.

7.7.3 Working Principle and Signal FlowThe EGS2 consists of the ethernet access module, network processor module, mapping module,interface converting module, communication and control module and so on.



7.7.4 Front PanelOn the front panel of the EGS2, there are indicators, interfaces and barcode.

7.7.5 Valid SlotsThe EGS2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGS2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.7.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGS2 indicates the optical interface type.

7.7.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGS2.

7.7.8 Technical SpecificationsThe specifications of the EGS2 cover the optical interface specifications, mechanicalspecifications and power consumption.

7.7.1 Version DescriptionThe EGS2 has two functional versions, N1 and N2. The two versions have different functionsand features.

Table 7-23 lists the details on the versions of the EGS2 board.

Table 7-23 Version Description of the EGS2

Item Description

Functionalversion

The EGS2 has two versions, N1 and N2.

Difference The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s. Themaximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s.The number of the VCTRUNKs of the N1EGS2 is 24. The number of theVCTRUNKs of the N2EGS2 is 48.The encapsulation formats of the N1EGS2 are GFP, LAPS, and HDLC.The encapsulation format of the N1EGS2 is GFP.The N1EGS2 supports the MartinioP encapsulation of the MPLS. TheN2EGS2 does not support the MartinioP encapsulation.The N2EGS2 supports the board version replacement function.

Replaceability On certain conditions, the N2EGS2 can replace the N1EGS2. When theN2EGS2 replaces the N1EGS2, the N1EGS2 should not be configuredwith MartinioP or CoS of the MPLS.


Table 7-24 lists the functions and features of the EGS2.




Table 7-24 Functions and features of the EGS2

Function andFeature

EGS2

Basic function Processes 2 x GE services.


The optical interfaces are 1000Base-SX/LX/ZX Ethernet opticalinterfaces.The optical interfaces support the auto-negotiation, compliant with IEEE802.3z. The optical interfaces use the hot-swappable optical moduleSFP.When multimode optical fiber is used, the maximum transmissiondistance is 550 m. When single-mode optical fiber is used, the maximumtransmission distance is 10 km.The optical modules can be used for different requirements for thetransmission distance, such as 40 km and 70 km.


Supports Ethernet II, IEEE 802.3, and IEEE 802.1q/p. Supports frameswith a length ranging from 64 bytes to 9600 bytes. Supports Jumboframes with a length less than 9600 bytes.


The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s.The maximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s.

Number ofVCTRUNKs

The number of the VCTRUNKs of the N1EGS2 is 24.The number of the VCTRUNKs of the N2EGS2 is 48.

Mappinggranularity


Encapsulationformat

The encapsulation formats for the N1EGS2 are GFP, LAPS, and HDLC.The encapsulation format for the N2EGS2 is GFP.

EPL Supports transparent transmission based on port and Ethernet privateline services based on port+VLAN.

EVPL Not supported by the N1EGS2.The N2EGS2 supports EVPL services that use the frame encapsulationformats of MartinioE and stack VLAN.

EPLAN Supports the Layer 2 convergence and point to multipoint convergence.Supports the Layer 2 forwarding function and switching at the client andSDH sides.Supports the function of self-learning the source MAC address. Thelength of the MAC address table is 16k. The aging time of the MACaddress can be set and queried.Supports the configuration of the static MAC route.Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of the VB. The maximumnumber of the VBs is 2. The maximum number of logical ports for eachVB is 30.



Function andFeature

EGS2

EVPLAN Not supported by the N1EGS2.The N2EGS2 supports EVPL services that use the frame encapsulationformats of MPLS MartinioE, MPLS MartinioP and stack VLAN. TheN2EGS2 does not support the encapsulation format of MPLS MartinioP.

MPLS Not supported by the N1EGS2.Supported by the N2EGS2.


VLANconvergence


RSTP Not supported by the N1EGS2.The N2EGS2 supports broadcast packet suppression and RSTP,compliant with IEEE 802.1w.


Not supported by the N1EGS2.Supported by the N2EGS2.


Service basedQoS flowclassification

The N1EGS2 supports the port service, port+VLAN ID service, and port+VLAN PRI service.The N2EGS2 supports the port flow, port+VLAN ID flow, and port+VLAN PRI flow.

LCAS Not supported by the N1EGS2.The N2EGS2 supports LCAS, compliant with ITU-T G.7042.Dynamically increases or decreases the bandwidth, and realizes theprotection function.





Loopbackfunction









7.7.3 Working Principle and Signal FlowThe EGS2 consists of the ethernet access module, network processor module, mapping module,interface converting module, communication and control module and so on.

Figure 7-14 shows the block diagram for the functions of the EGS2.

Figure 7-14 Block diagram for the functions of the EGS2


GE Interfacecoversion

module

ENCP

DENCP

Mapping module

VCP

Control

Data

Switchfabric

Networkprocessor



SCC unit

SCC unit

Communication


Clock module

77MHz

125MHz

155MHz

LOSLasershutdown

50MHz

+2.5 V+1.8 V+1.5 V

Cross-connect unit

Cross-connect unit

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V







Network Processor Module

The network processor module consists of network processor and switch fabric. The networkprocessor first performs MAC functions, which include code conversion, framing of Ethernetpackets, CRC check and Ethernet performance statistics.





l L2MPLS VPN

l Ethernet/ VLAN




























DC/DC Converter ModuleThrough the DC/DC module, the power converting unit generates required voltages for eachchip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3V. In addition, this unit also provides protection for the board +3.3 V power supply.


Appearance of the Front PanelFigure 7-15 shows the appearance of the front panel of the EGS2.



Figure 7-15 Front panel of the EGS2

EGS2

EGS2

STATACTPROGSRVLINK1ACT1

ACT2LINK2

CLASS 1LASER

PRODUCT

OU

T1IN

1O

UT2

IN2

Indicators









Interfaces

There are two GE interfaces on the front panel of the EGS2. Table 7-25 lists the type and usageof the interfaces.




Table 7-25 Optical interfaces of the EGS2


OUT1/IN1 LC (pluggable) Transmits and receives the 1000Base-SX/LX/ZXsignals.




Table 7-26 lists the relation between the board feature code and optical interface type for theEGS2.



SSN2EGS210 10 1000Base-SX (0.55 km)

SSN2EGS211 11 1000Base-LX (10 km)

SSN2EGS212 12 1000Base-ZX (40 km)



You can use the T2000 to set the following parameters for the EGS2:

l Working mode



l Mapping protocol


7.7.8 Technical SpecificationsThe specifications of the EGS2 cover the optical interface specifications, mechanicalspecifications and power consumption.



Optical Interface SpecificationsTable 7-27 lists the specifications of the interfaces of the EGS2.

Table 7-27 Specifications of the optical interfaces of the EGS2

Item Specification


1000Base-ZX(70 km)

1000Base-ZX(40 km)

1000Base-SX(10 km)

1000Base-LX(0.55 km)

Optical sourcetype

MLM MLM MLM MLM


–4 to +2 –2 to +5 –9 to –3 –9.5 to 0

Centralwavelength (nm)

1480 to 1580 1270 to 1355 1270 to 1355 770 to 860


–3 –3 –3 0


–22 –23 –19 –17


9 9 9 9



Mechanical SpecificationsThe mechanical specifications of the EGS2 are as follows:


l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EGS2 is 43 W.

7.8 EMS4This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission andconvergence board, in terms of the version, function, principle, front panel, configuration andspecifications.

7.8.1 Version DescriptionThe functional version of the EMS4 board is N1.




7.8.2 Function and FeatureThe EMS4 supports Layer 2 switching, link convergence, and multicast.

7.8.3 Working Principle and Signal FlowThe EMS4 consists of the ethernet access module, mapping module, interface conversion moduleand so on.

7.8.4 Front PanelOn the front panel of the EMS4, there are indicators, interfaces and barcode.

7.8.5 Valid SlotsThe EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without theinterface board, the EMS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.With the interface board, the EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500Bsubrack.

7.8.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EMS4 indicates the optical interface type.

7.8.7 Board ProtectionThe EMS4 supports the board protection switching (BPS) and port protection switching (PPS)protection.

7.8.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the EMS4.

7.8.9 Technical SpecificationsThe specifications of the EMS4 cover the optical interface specifications, laser safety class,mechanical specifications and power consumption.

7.8.1 Version DescriptionThe functional version of the EMS4 board is N1.

7.8.2 Function and FeatureThe EMS4 supports Layer 2 switching, link convergence, and multicast.

Table 7-28 lists the functions and features of the EMS4.

Table 7-28 Functions and features of the EMS4

Function andFeature

EMS4

Basic function Accesses and processes 4 x GE services, and processes 16 x FEservices.


Accesses 16 x FE signals at the electrical interface when used withthe ETF8.Accesses 16 x FE signals at the optical interface when used with theEFF8.Accesses 8 x FE signals at the electrical interface and 8 x FE signalsat the optical interface when used with the ETF8 and EFF8.



Function andFeature

EMS4


The optical interfaces are 1000Base-SX/LX/ZX Ethernet opticalinterfaces. Supports the auto-negotiation, compliant with IEEE802.3z.The optical interfaces use the hot-swappable optical module SFP.When multimode optical fiber is used, the maximum transmissiondistance is 550 m. When single-mode optical fiber is used, themaximum transmission distance is 10 km.The optical modules can be used for different requirements for thetransmission distance, such as 40 km and 70 km.Supports 10Base-T/100Base-TX signals when used with the ETF8.Supports 100Base-FX signals when used with the EFF8.The optical interfaces are compliant with IEEE 802.3u.


Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE802.1p TAG.Supports frames with a length ranging from 64 bytes to 9216 bytes.Supports Jumbo frames with a length less than 9216 bytes.


2.5 Gbit/s.

Mapping granularity Virtual concatenation: VC-12, VC-3, VC-4, VC-12-Xv (X≤64),VC-3-Xv (X≤24), and VC-4-Xv (X≤8).

VCG A maximum of 64.

Encapsulation format Supports GFP-F, LAPS, and HDLG.

EPL Supports transparent transmission based on port. Supports 42 xbidirectional services.

EVPL Supports EVPL services based on port+VLAN. Supports amaximum of 8000 links.Supports EVPL services based on QinQ. Supports serviceforwarding based on port.

EPLAN Supports the Layer 2 forwarding function and switching at the clientand SDH sides.Supports 1k MAC switching or 4K VLAN MAC switching.Supports the function of self-learning the source MAC address.The length of the MAC address table is 128k. The aging time of theMAC address can be set and queried.The configuration of static MAC routes is supported.Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of VB. The maximumnumber of VBs is two.




Function andFeature

EMS4

VLAN Supports VLAN and QinQ, the addition, deletion and switching ofVLAN labels, compliant with IEEE 802.1q/p.

RSTP Supports broadcast packet suppression and RSTP, compliant withIEEE 802.1w.

Multicast(IGMP-Snooping)

Supported.

ETH-OAM Supports CC for the multicast and LB test for the unicast.

Test frame Supported.

Service mirroring Not supported.

Link convergence Supports manual link convergence and static link convergence.

VLAN convergence Supported (4095 VLAN).

Protection Supports the 1+1 hot backup for the board and the PPS protection.


Flow classification Supports the port flow and port+VLAN ID flow.


LPT Supported.

Flow control function Supports the IEEE 802.3x flow control based on port.

Loopback function Supports inloop at the Ethernet port (PHY layer) and outloop at theSDH side.

Ethernet performancemonitoring

Supports Ethernet performance monitoring RMON at the port leveland VCTRUNK.



7.8.3 Working Principle and Signal FlowThe EMS4 consists of the ethernet access module, mapping module, interface conversion moduleand so on.

Figure 7-16 shows the block diagram for the functions of the EMS4.



Figure 7-16 Block diagram for the functions of the EMS4


GE/FE Interfacecoversion

module

ENCP

DENCP

Mapping module

VCP

Control

Data

Switchfabric

Networkprocessor



SCC unit

SCC unit

Communication


Clock module

77MHz

125MHz

155MHz

LOSLasershutdown

50MHz

+2.5 V+1.8 V+1.5 V

Cross-connect unit

Cross-connect unit

+3.3 VDC/DC

converterFuse -48 V/ -60 V



In the Transmit Direction

The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals tothe EGS4 through the backplane. The interface module transmits the signals to the encapsulationand mapping module. The encapsulation and mapping module then compensates for the timedelay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames,strips the data packets, and transmits the data packets to the service processing module. Finally,the service processing module converges the data and transmits the data through the ethernetphysical interface.

In the Receive Direction

The interface module accesses the signals from external Ethernet device, such as the Ethernetswitch and router. The interface module then decodes the signals and converts the series signalsinto parallel signals. The service processing module then aligns the frames, strips the preamblecode, terminates the CRC code and performs the Ethernet statistics for the Ethernet performance.In addition, the service processing module classifies the flow (Ethernet or VLAN packet formats)according to the service type and configuration.

If the switch is not required on the local, the data services are forwarded to other local portsaccording to the configuration. If the data services are to be transmitted to the upstream SDHline, the encapsulation module encapsulates the Ethernet frames in the GFP-F, LAPS or HDLCformats. Finally, the encapsulation module transmits the frames to the mapping module, whichmaps frames into VC-4/VC-3/VC-12, concatenated frames or a single VC-3 concatenated frame.The interface module then transmits the frames to the cross-connect unit.








l Ethernet/ VLAN








In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP or HDLCformat. The concatenation is processed. The LCAS function is supported. Ethernet signals arethen converted into SDH signals.


















DC/DC Converter ModuleThrough the DC/DC module, the power converting unit generates required voltages for eachchip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3V.

7.8.4 Front PanelOn the front panel of the EMS4, there are indicators, interfaces and barcode.

Appearance of the Front PanelFigure 7-17 shows the appearance of the front panel of the EMS4.




Figure 7-17 Front panel of the EMS4

EMS4

EMS4STATACTPROGSRV

CLASS 1LASER

PRODUCT

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4

LINK ACT


l Board hardware state indicator (STAT), which is green or red when lit.l Service activating state indicator (ACT), which is green when lit.l Board software state indicator (PROG), which is green or red when lit.l Service alarm indicator (SRV), which is red, green or yellow when lit.l Connection status indicator (LINK), which is green when lit.l Data receiving and transmission indicator (ACT), which is orange when lit.


InterfacesThere are four pairs of optical interfaces on the front panel of the EMS4. Table 7-29 lists thetype and usage of the optical interfaces.



Table 7-29 Optical interfaces of the EMS4






7.8.5 Valid SlotsThe EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without theinterface board, the EMS4 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.With the interface board, the EMS4 can be housed in any of slots 12–13 in the OptiX OSN 1500Bsubrack.

The EMS4 can be used with the ETF8 and EFF8.

Table 7-30 and Table 7-31 list the valid slots for the EMS4 and corresponding slots for theETF8 and EFF8.

Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in theOptiX OSN 1500A subrack

Valid Slot for the EMS4 Corresponding Slot for the ETF8 and EFF8



Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in theOptiX OSN 1500B subrack

Valid Slot for the EMS4 Corresponding Slot for the ETF8 and EFF8




7.8.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EMS4 indicates the optical interface type.

Table 7-32 lists the relation between the board feature code and optical interface type for theEMS4.






SSN1EMS410 10 1000Base-LX (0.55 km)

SSN1EMS411 11 1000Base-SX (10 km)

SSN1EMS412 12 1000Base-ZX (40 km)

SSN1EMS413 13 1000Base-ZX (70 km)

7.8.7 Board ProtectionThe EMS4 supports the board protection switching (BPS) and port protection switching (PPS)protection.

Protection PrincipleWhen the BPS protection is performed to the EMS4, the GE and FE ports use the single-feddual-selective scheme to get protected. The EMS4 has four four GE ports and 16 FE ports, whichmay be connected to many communication devices. Normally, the active board is working andservices are transmitted in the two directions of the active link. On the backup link, the EMS4disables the transmission of all ports. In this case, the ports of opposite board are in the Linkdownstate. At the same time, the opposite board enables the transmission and does not transmitservices. In this way, the receive ports of the backup EMS4 are not in the Linkdown state. Thesolid lines in Figure 7-18 show how the EMS4 normally works.

Figure 7-18 Normal working of the EMS4

EMS4Active

EMS4Standby

XCS

No.1

No.2

No.3

No.1

No.2

No.3

Activecommunication

equipment

Standbycommunication

equipment

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

A

B

C



l BPS Protection

For the BPS protection, when the active board detects the Linkdown fault of any link or anyboard fault, the cross-connect board switches all services to the standby board. In this way,services are protected. As the solid lines shown in Figure 7-19. The services numbered 1, 2 and3 are all switched to the standby EMS4 and corresponding communication equipment.

Figure 7-19 Principle of the BPS protection for the EMS4

EMS4Active

EMS4Standby

XCS

No.1

No.2

No.3

No.1

No.2

No.3

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

A

B

C

l PPS Protection

For the PPS protection, when the active board detects the Linkdown fault of any link or anyboard fault, the cross-connect board switches all services to the standby board. In this way,services are protected. The solid lines in Figure 7-20 show how the PPS protection is performed.Only the service numbered 1 is switched to the standby EMS4 and the standby communicationequipment.




Figure 7-20 Principle of the PPS protection for the EMS4

EMS4Active

EMS4Standby

XCS

No.1

No.2

No.3

No.1

No.2

No.3

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

A

B

C

The conditions that trigger the protection for the EMS4 are as follows:

l Fault at at the PHY layer of the MAC port, also Linkdown

l Fault in key board hardware units, such as the power supply module and the optical module

WARNINGWhen the board-level protection is performed, FE ports only support the 100M full duplex modeand GE ports support the auto-negotiation and 1000M full duplex mode.

Board ConfigurationTwo EMS4 boards should be configured for the protection. One EMS4 is the active board andthe other is the standby board. For the protection, the access capacity of the slot for the standbyboard must be larger than that of the slot for the active board.

7.8.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the EMS4.

You can use the T2000 to set the following parameters for the EMS4:



l Working mode



l Mapping protocol


7.8.9 Technical SpecificationsThe specifications of the EMS4 cover the optical interface specifications, laser safety class,mechanical specifications and power consumption.


Table 7-33 lists the specifications of the interfaces of the EMS4.

Table 7-33 Specifications of the optical interfaces of the EMS4

Item Specification


1000Base-ZX(70 km)

1000Base-ZX(40 km)

1000Base-SX(10 km)

1000Base-LX(0.55 km)

Optical sourcetype

MLM MLM MLM MLM


–4 to +2 –2 to +5 –9 to –3 –9.5 to 0


1480 to 1580 1270 to 1355 1270 to 1355 770 to 860


–3 –3 –3 0


–22 –23 –19 –17


9 9 9 9

Laser Safety Class




The mechanical specifications of the EMS4 are as follows:


l Weight (kg): 1.1




Power Consumption

In the normal temperature (25℃), the maximum power consumption of the EMS4 is 65 W ifthe EMS4 is not used with an interface board.

In the normal temperature (25℃), the maximum power consumption of the EMS4 is 75 W ifthe EMS4 is used with an interface board.

7.9 EGS4This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version,function, principle, front panel, configuration and specifications.

7.9.1 Version DescriptionThe functional version of the EGS4 board is N1.


7.9.3 Working Principle and Signal FlowThe EGS4 consists of the interface module, service processing module, encapsulation andmapping module, interface converting module, control and communication module and thepower supply module.




7.9.7 Board ProtectionThe EGS4 supports the board protection switching (BPS) and port protection switching (PPS)protection.


7.9.9 Technical SpecificationsThe specifications of the EGS4 cover the optical interface specifications, laser safety class,mechanical specifications and power consumption.

7.9.1 Version DescriptionThe functional version of the EGS4 board is N1.


Table 7-34 lists the functions and features of the EGS4.



Table 7-34 Functions and features of the EGS4

Function andFeature

EGS4

Basic function Accesses and processes 4 x GE services.


The optical interfaces are 1000Base-SX/LX/ZX Ethernet opticalinterfaces.The optical interfaces support the auto-negotiation, compliant withIEEE 802.3z. The optical interfaces use the hot-swappable opticalmodule SFP.When multimode optical fiber is used, the maximum transmissiondistance is 550 m. When single-mode optical fiber is used, themaximum transmission distance is 10 km.The optical modules can be used for different requirements for thetransmission distance, such as 40 km and 70 km.


Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE802.1p TAG.Supports frames with a length ranging from 64 bytes to 9216 bytes.Supports Jumbo frames with a length less than 9216 bytes.


2.5 Gbit/s.

Mapping granularity Virtual concatenation: VC-12, VC-3, VC-4, VC-12-Xv (X≤64),VC-3-Xv (X≤24), and VC-4-Xv (X≤8).

VCG 64 to the maximum.

Encapsulation format Supports GFP-F, LAPS, and HDLG.

EPL Supports transparent transmission based on port.

EVPL Supports EVPL services based on port+VLAN. Supports a maximumof 8000 links.Supports EVPL services based on QinQ. Supports service forwardingbased on port.

EPLAN Supports the Layer 2 forwarding function and switching at the clientand SDH sides.Supports 1k MAC switching or 4k VLAN MAC switching.Supports the function of self-learning the source MAC address. Thelength of the MAC address table is 128k. The aging time of the MACaddress can be set and queried. The configuration of static MACroutes is supported.Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of VB. The maximumnumber of VBs is two.

VLAN Supports VLAN and QinQ, the addition, deletion and switching ofVLAN labels, compliant with IEEE 802.1q/p.




Function andFeature

EGS4


Multicast(IGMP-Snooping)

Supported.

ETH-OAM Supports CC for the multicast and LB test for the unicast.

Test frame Supported.

Service mirroring Not supported.

Link convergence Supports manual link convergence and static link convergence.

VLAN convergence Supported (4095 VLAN).

Protection Supports the 1+1 hot backup for the board and the PPS protection.


Flow classification Supports the port flow and port+VLAN ID flow.


LPT Supported.



Loopback function Supports inloop at the Ethernet port (PHY layer).


Supports Ethernet performance monitoring RMON at the port leveland VCTRUNK.



7.9.3 Working Principle and Signal FlowThe EGS4 consists of the interface module, service processing module, encapsulation andmapping module, interface converting module, control and communication module and thepower supply module.

Figure 7-21 shows the block diagram for the functions of the EGS4.



Figure 7-21 Block diagram for the functions of the EGS4


GE Interfacecoversion

module

ENCP

DENCP

Mapping module

VCP

Control

Data

Switchfabric

Networkprocessor



SCC unit

SCC unit

Communication


Clock module

77MHz

125MHz

155MHz

LOSLasershutdown

50MHz

+2.5 V+1.8 V+1.5 V

Cross-connect unit

Cross-connect unit

+3.3 VDC/DC

converterFuse -48 V/ -60 V


In the Transmit DirectionThe cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals tothe EGS4 through the backplane. The interface module transmits the signals to the encapsulationand mapping module. The encapsulation and mapping module then compensates for the timedelay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames,strips the data packets, and transmits the data packets to the service processing module. Finally,the service processing module converges the data and transmits the data through the ethernetphysical interface.

In the Receive DirectionThe interface module accesses the 1000Base-SX/LX/ZX signals from external Ethernet device,such as the Ethernet switch and router. The interface module then decodes the signals andconverts the series signals into parallel signals. The service processing module then aligns theframes, strips the preamble code, terminates the CRC code and performs the Ethernet statisticsfor the Ethernet performance. In addition, the service processing module classifies the flow(Ethernet or VLAN packet formats) according to the service type and configuration.

If the switch is not required on the local, the data services are forwarded to other local portsaccording to the configuration. If the data services are to be transmitted to the upstream SDHline, the encapsulation module encapsulates the Ethernet frames in the GFP-F, LAPS or HDLCformats. Finally, the encapsulation module transmits the frames to the mapping module, whichmaps frames into VC-4/VC-3/VC-12 or concatenated frames. The interface module thentransmits the frames to the cross-connect unit.

Ethernet Access ModuleIn the receive direction, the optical signals from Ethernet equipment, such as switch and router,are converted into electrical signals. For the signals accessed from electrical interfaces, O/E




conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOSalarms are tested. The electrical signals are converted from serial signals to parallel signals andthen sent to network processor.




l Ethernet/ VLAN








In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP or HDLCformat. The concatenation is processed. The LCAS function is supported. Ethernet signals arethen converted into SDH signals.


















DC/DC Converter ModuleThrough the DC/DC module, the power converting unit generates required voltages for eachchip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3V.


Appearance of the Front PanelFigure 7-22 shows the appearance of the front panel of the EGS4.




Figure 7-22 Front panel of the EGS4

EGS4

EGS4STATACTPROGSRV

CLASS 1

LASERPRODUCT

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4

LINK ACT









InterfacesThere are four pairs of optical interfaces on the front panel of the EGS4. Table 7-35 lists thetype and usage of the optical interfaces.



Table 7-35 Optical interfaces of the EGS4








Table 7-36 lists the relation between the board feature code and optical interface type for theEGS4.



SSN1EGS410 10 1000Base-SX (0.55 km)

SSN1EGS411 11 1000Base-LX (10 km)



7.9.7 Board ProtectionThe EGS4 supports the board protection switching (BPS) and port protection switching (PPS)protection.

Protection PrincipleWhen the BPS protection is performed to the EGS4, the GE and FE ports use the single-fed dual-selective scheme to get protected. The EGS4 has four four GE ports and 16 FE ports, which maybe connected to many communication devices. Normally, the active board is working andservices are transmitted in the two directions of the active link. On the standby link, the EGS4disables the transmission of all ports. In this case, the ports of the opposite board are in theLinkdown state. At the same time, the opposite board enables the transmission and does not




transmit services. In this way, the receive ports of the standby EGS4 are not in the Linkdownstate. The solid lines in Figure 7-23 show how the EGS4 normally works.

Figure 7-23 Normal working of the EGS4

EGS4Active

EGS4Standby

XCS

No.1

No.2

No.3

No.1

No.2

No.3

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

A

B

C

l BPS Protection

For the BPS protection, when the active board detects the Linkdown fault of any link or anyboard fault, the cross-connect board switches all services to the standby board. In this way,services are protected. The lines in Figure 7-24 show how the BPS protection is performed. Theservices numbered 1, 2 and 3 are all switched to the standby EGS4 and correspondingcommunication equipment.



Figure 7-24 Principle of the BPS protection for the EGS4

EGS4Active

EGS4Standby

XCS

No.1

No.2

No.3

No.1

No.2

No.3

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

A

B

C

l PPS Protection

For the PPS protection, when the active board detects the Linkdown fault of any link or anyboard fault, the cross-connect board switches all services to the standby board. In this way,services are protected. The solid lines in Figure 7-25 show how the PPS protection is performed.Only the service numbered 1 is switched to the standby EGS4 and the standby communicationequipment.




Figure 7-25 Principle of the PPS protection for the EGS4

EGS4Active

EGS4Standby

XCS

No.1

No.2

No.3

No.1

No.2

No.3

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

Activecommunication

equipment


equipment

A

B

C

The conditions that trigger the protection for the EGS4 are as follows:

l Fault at at the PHY layer of the MAC port, also Linkdown

l Fault in key board hardware units, such as the power supply module and the optical module

WARNINGWhen the protection is performed, the GE ports support auto-negotiation and 1000M full duplexmodes.

Board Configuration

Two EGS4 boards should be configured for the protection. One EGS4 is the active board andthe other is the standby board. For the protection, the access capacity of the slot for the standbyboard must be larger than that of the slot for the active board.


You can use the T2000 to set the following parameters for the EGS4:



l Working mode



l Mapping protocol


7.9.9 Technical SpecificationsThe specifications of the EGS4 cover the optical interface specifications, laser safety class,mechanical specifications and power consumption.


Table 7-37 lists the specifications of the interfaces of the EGS4.

Table 7-37 Specifications of the optical interfaces of the EGS4

Item Specification


1000Base-ZX(70 km)

1000Base-ZX(40 km)

1000Base-LX(10 km)


Optical sourcetype

MLM MLM MLM MLM


–4 to +2 –2 to +5 –9 to –3 –9.5 to 0


1480–1580 1270–1355 1270–1355 770–860


–3 –3 –3 0


–22 –23 –19 –17


9 9 9 9

Laser Safety Class




The mechanical specifications of the EGS4 are as follows:


l Weight (kg): 1.1




Power Consumption

In the normal temperature (25℃), the maximum power consumption of the EGS4 is 70 W.

7.10 EGR2This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version,function, principle, front panel, configuration and specifications.

7.10.1 Version DescriptionThe functional version of the EGR2 board is N2.

7.10.2 Function and FeatureThe EGR2 supports Layer 2 switching, port convergence, and RPR.

7.10.3 Working Principle and Signal FlowThe EGR2 consists of the ethernet processing module, network processor module, RPR protocolprocessing module and so on.

7.10.4 Front PanelOn the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety classlabel.

7.10.5 Valid SlotsThe EGR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGR2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.10.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGR2 indicates the optical interface type.

7.10.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGR2.

7.10.8 Technical SpecificationsThe technical specifications of the EGR2 cover the optical interface specifications, boarddimensions, weight and power consumption.

7.10.1 Version DescriptionThe functional version of the EGR2 board is N2.

7.10.2 Function and FeatureThe EGR2 supports Layer 2 switching, port convergence, and RPR.

Table 7-38 lists the functions and features of the EGR2.

Table 7-38 Functions and features of the EGR2

Function andFeature

EGR2

Basic function Accesses and processes 2 x GE services. Supports the RPR feature.



Function andFeature

EGR2


The optical interfaces are 1000Base-SX/LX/ZX Ethernet opticalinterfaces. The optical interfaces support the auto-negotiation,compliant with IEEE 802.3z.The optical interfaces use the hot-swappable optical module SFP.When multimode optical fiber is used, the maximum transmissiondistance is 550 m. When single-mode optical fiber is used, themaximum transmission distance is 10 km. The optical modules can beused for different requirements for the transmission distance, such as40 km and 70 km.


Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG.Supports frames with a length ranging from 64 bytes to 9600 bytes.Supports Jumbo frames with a length less than 9600 bytes.


2.5 Gbit/s.

Mappinggranularity

Supports VC-3, VC-3-2v, VC-4, and VC-4-Xv (X≤8).

Encapsulationformat

Supports GFP-F and LAPS.

EVPL Supports EVPL services. The frame format can be Ethernet II, IEEE802.3, IEEE 802.1q TAG, or MPLS Martini.Supports the MPLS encapsulation and forwarding based on port andport+VLAN.Supports five types of LSP, including ingress LSP, egress LSP, transitLSP, RPR ingress LSP, and RPR transit LSP. Supports 512 LSPs.

EVPLAN Supports EVPLAN services and uses the stack VLAN encapsulation.Supports the function of self-learning the source MAC address. For theN2EGR2, the capacity of the MAC address table is 64k. The aging timeof the MAC address can be set and queried.Supports the configuration of static MAC routes (maximum: 4k).Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of the VB. The maximumnumber of the VBs is 16. The maximum number of logical ports foreach VB is 32.

MPLS Supports MartinioE.

Stack VLAN Supported.

VLAN Supports 4096 VLAN labels, the addition and deletion of VLAN labels,and the switching function, compliant with IEEE 802.1q/p.

VLANconvergence





Function andFeature

EGR2

VLAN switching Supports the replacement of VLAN in Ethernet signal frames.

Port convergence Supports the convergence at a maximum of two GE ports.

RPR Supports RPR, compliant with IEEE 802.17.The ring network supports a maximum of 255 nodes, and it supportsthe dropping of sink nodes and weighted fairness algorithm.Supports five priority levels, including A0, A1, B_EIR, B_CIR and C.Provides topology automatic discovery function, and detects thenetwork status in real time.Supports three protection modes, including Steering, Wrapping, andWrapping+Steering. The invalid time for signals is less than 50 ms.Supports the manual configuration of the ringlet route in the RPR ringnetwork.Supports the ringlet self-learning, which learns the mapping relationbetween the MAC address and node number.



Supported.


Flow classification Supports the port flow, port+VLAN ID flow, and port+VLAN ID+VLAN PRI flow.




Echo test frame Supports the Echo function of the PRP OAM, which is used to test theavailability of the link.

Loopback function Supports inloop at the Ethernet port (PHY layer or MAC layer).





Weighted fairnessalgorithm

Supported.



Function andFeature

EGR2

Topologyautomaticdiscovery

Supported.

Max. number ofnodes

255.

Service prioritylevel

Supports A0, A1, B_CIR, B_EIR and C.

7.10.3 Working Principle and Signal FlowThe EGR2 consists of the ethernet processing module, network processor module, RPR protocolprocessing module and so on.

Figure 7-26 shows the block diagram for the functions of the EGR2.

Figure 7-26 Block diagram for the functions of the EGR2

Interfaceconversion

module


GE/FE

RPR protocolprocess module Mapping module


Controlsingnal

Data

+2.5 V

+1.8 V

+1.5 V

ENCP

DNCP

VCP

Cross-connect

unit


Communication

Switchfabric

Networkprocessor

RPRMACwest


Clock module

77 MHZ

50 MHZ

125 MHZ

100 MHZ

RPRMACeast

LOS

Laser shut down

Cross-connect

unit

SCC unit

Cross-connectunit

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


RPR: resilient package ring

The function modules are described as follows:









l MPLS

l L2MPLS VPN

l Ethernet/ VLAN








RPR Protocol Processing ModuleRPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protectionswitching schemes. By applying the RPR protocol and RPR weight fair algorithm, this modulecontrols the bandwidth of each node to access the ring network. Therefore, the RPR ring featuresspatial reuse and statistic multiplex. Bandwidth utilization is then improved.

Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol fortopology auto-discovery provides correct and reliable means to fast find topologies of all nodesand the changes to these topologies.

RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reusedspatially.

The entire RPR ring accommodates 255 nodes to the maximum.


In the upstream direction, the virtual concatenation supports LCAS function. The encapsulationformats are LAPS and GFP.



In the downstream direction, virtual concatenations are received. The time delay of virtualconcatenation is compensated. After aligning, packets are decapsulated as per encapsulationformat. The decapsulated data are transmitted to the RPR protocol processing module in packets.

Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.


The communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module:












Clock Unit



Through the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,this unit also provides protection for the board +3.3 V power supply.

7.10.4 Front PanelOn the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety classlabel.


Figure 7-27 shows the appearance of the front panel of the EGR2.




Figure 7-27 Front panel of the EGR2

EGR2

EGR2

LINK1ACT1

ACT2LINK2

STATACTPROGSRV

CLASS 1

LASER

PRODUCT

OU

T1IN

1O

UT2

IN2









InterfacesThere are two optical interfaces on the front panel of the EGR2. Table 7-39 lists the type andusage of the optical interfaces.



Table 7-39 Optical interfaces of the EGR2




7.10.5 Valid SlotsThe EGR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The EGR2can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.10.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EGR2 indicates the optical interface type.

Table 7-40 lists the relation between the board feature code and optical interface type for theEGR2.



SSN2EGR210 10 1000Base-SX (0.55 km)

SSN2EGR211 11 1000Base-LX (10 km)

SSN2EGR212 12 1000Base-ZX (40 km)

SSN2EGR213 13 1000Base-ZX (70 km)

7.10.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EGR2.

You can use the T2000 to set the following parameters for the EGR2:

l Working mode



l Mapping protocol


7.10.8 Technical SpecificationsThe technical specifications of the EGR2 cover the optical interface specifications, boarddimensions, weight and power consumption.

Table 7-41 lists the specifications of the interfaces of the EGR2.




Table 7-41 Specifications of the interfaces of the EGR2

OpticalInterface Type

OpticalSourceType

LaunchedOpticalPower(dBm)

CentralWavelength(nm)

Overload OpticalPower(dBm)

ReceiverSensitivity (dBm)

ExtinctionRatio(dB)

1000Base-ZX(70 km)

MLM –4 to +2 1480 to1580

–3 –22 9

1000Base-ZX(40 km)

MLM –2 to +5 1270 to1355

–3 –23 9

1000Base-LX(10 km)

MLM –9 to –3 1270 to1355

–3 –19 9


MLM –9.5 to 0 770 to860

0 –17 9



Mechanical SpecificationsThe mechanical specifications of the EGR2 are as follows:


l Weight (kg): 1.1

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EGR2 is 40 W.

7.11 EMR0This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in termsof the version, function, principle, front panel, configuration and specifications.

7.11.1 Version DescriptionThe EMR0 has two versions, N1 and N2. The production of the N1 version is stopped.

7.11.2 Function and FeatureThe EMR0 supports Layer 2 switching, port convergence, and RPR.

7.11.3 Working Principle and Signal FlowThe EMR0 consists of the ethernet processing module, network processor module, RPR protocolprocessing module, mapping module and so on.

7.11.4 Front PanelOn the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety classlabel.



7.11.5 Valid SlotsThe EMR0 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without theinterface board, the EMR0 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.With the interface board, the EMR0 can be housed in any of slots 12–13 in the OptiX OSN1500B subrack.

7.11.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EMR0 indicates the optical interface type.

7.11.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EMR0.

7.11.8 Technical SpecificationsThe technical specifications of the EMR0 cover the optical interface specifications, boarddimensions, weight and power consumption.

7.11.1 Version DescriptionThe EMR0 has two versions, N1 and N2. The production of the N1 version is stopped.

Table 7-42 lists the details on the versions of the EMR0 board.

Table 7-42 Version description of the EMR0

Item Description

Functionalversion

The EMR0 has two versions, N1 and N2.

Difference The N2EMR0 supports all functions of the N1EMR0. The N2EMR0 alsohas some new functions and extends some functions of the N1EMR0. Fordetails, see Table 7-43.

Replaceability The N2EMR0 can replace the N1EMR0.

Table 7-43 Comparison of features of the N1EMR0 and N2EMR0

Item N1EMR0 N2EMR0

Port convergencefunction

- Supports the convergence function at amaximum of eight FE ports.

VLAN labelswitching

- Supports the VLAN label switching forthe Ethernet data.

EVPLAN services Supports EVPLAN servicesand uses the stack VLANencapsulation.

Supports EVPLAN services and usesthe stack VLAN encapsulation.

MAC address table Supports the 16k MACaddress table.

Supports the 64k MAC address table.




Item N1EMR0 N2EMR0

VB features Supports the creation,deletion and query of the VB.The maximum number of theVBs is 32. The maximumnumber of logical ports foreach VB is 16.

Supports the creation, deletion andquery of the VB. The maximum numberof the VBs is 16. The maximum numberof logical ports for each VB is 32.

PRP ring network - Supports the manual configuration ofthe ringlet route in the RPR ringnetwork.

RPR OAM - Supports the Echo function of the PRPOAM, which is used to test theavailability of the link.

CAR Supported. Supported.

Flow classification Supports the port flow, port+VLAN ID flow, and port+VLAN PRI flow.

Supports the port flow, port+VLAN IDflow, and port+VLAN ID+VLAN PRIflow.

7.11.2 Function and FeatureThe EMR0 supports Layer 2 switching, port convergence, and RPR.

Table 7-44 lists the functions and features of the EMR0.

Table 7-44 Functions and features of the EMR0

Function andFeature

EMR0

Basic function Accesses and processes 12 x FE services and 1 x GE services. Supportsthe RPR feature.


Supports four FE ports and one GE ports.Accesses 12 x FE signals at the electrical interface when used with theETF8.Accesses 8 x FE signals at the optical interface when used with theEFF8.


Supports the 10Base-T/100Base-TX signals when used with the ETF8.The maximum transmission distance is 100 m.Supports the 100Base-FX signals when used with the EFF8, compliantwith IEEE 802.3u.


Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG . Supportsframes with a length ranging from 64 bytes to 9600 bytes. SupportsJumbo frames with a length less than 9600 bytes.


2.5 Gbit/s.



Function andFeature

EMR0

Mappinggranularity

VC-3, VC-3-2v, VC-4, and VC-4-Xv (X≤8).

Encapsulationformat

Supports GFP-F and LAPS.

EVPL Supports EVPL services. The frame format can be Ethernet II, IEEE802.3, IEEE 802.1q TAG, or MPLS Martini. EVPL services supportthe MPLS encapsulation and forwarding based on port and port+VLAN. Supports five types of LSP, including ingress LSP, egressLSP, transit LSP, RPR ingress LSP, and RPR transit LSP. Supports 512LSPs.

EVPLAN Supports EVPLAN services and uses the stack VLAN encapsulation.Supports the function of self-learning the source MAC address. For theN2EMR0, the capacity of the MAC address table is 16k. The aging timeof the MAC address can be set and queried.Supports the configuration of static MAC routes (maximum: 4k).Supports data isolation based on VB+VLAN.Supports the creation, deletion and query of the VB. The N2EMR0supports a maximum of 16 VBs. The maximum number of logical portsfor each VB is 32. The N1EMR0 supports a maximum of 32 VBs. Themaximum number of logical ports for each VB is 16.

MPLS Supports MartinioE.

Stack VLAN Supported.

VLAN Supports 4096 VLAN labels, the addition and deletion of VLAN labels,and the switching function, compliant with IEEE 802.1q/p.

VLANconvergence


VLAN switching Supports the replacement of VLAN in Ethernet signal frames.

Port convergence Supports the convergence function at a maximum of eight FE ports.




Function andFeature

EMR0

RPR Supported and compliant with IEEE 802.17.Supports a maximum of 255 nodes in the ring network, and the droppingof sink nodes.Supports weighted fairness algorithm.Supports five priority levels, including A0, A1, B_EIR, B_CIR and C.Provides topology automatic discovery function, and detects thenetwork status in real time. Supports three protection modes, includingSteering, Wrapping, and Wrapping+Steering. The invalid time forsignals is less than 50 ms.Supports the ringlet self-learning, which learns the mapping relationbetween the MAC address and node number.The N2EMR0 supports the manual configuration of the ringlet route inthe RPR ring network.



Supported.


Flow classification The N1EMR0 supports the port flow, port+VLAN ID flow, and port+VLAN PRI flow.The N2EMR0 supports the port flow, port+VLAN ID flow, and port+VLAN ID+VLAN PRI flow.




Echo test frame Supports the Echo function of the PRP OAM, which is used to test theavailability of the link.

Loopback function Supports inloop at the Ethernet port (PHY layer or MAC layer).



Alarm andperformanceevents


Weighted fairnessalgorithm

Supported.



Function andFeature

EMR0

Topologyautomaticdiscovery

Supported.

Max. number ofnodes

255.

Service prioritylevels

Supports A0, A1, B_CIR, B_EIR and C.

7.11.3 Working Principle and Signal FlowThe EMR0 consists of the ethernet processing module, network processor module, RPR protocolprocessing module, mapping module and so on.

Figure 7-28 shows the block diagram for the functions of the EMR0.

Figure 7-28 Block diagram for the functions of the EMR0

Interfaceconversion

module


GE/FE

RPR protocolprocess module Mapping module


Controlsingnal

Data

+2.5 V

+1.8 V

+1.5 V

ENCP

DNCP

VCP

Cross-connect

unit


Communication

Switchfabric

Networkprocessor

RPRMACwest


Clock module

77 MHZ

50 MHZ

125 MHZ

100 MHZ

RPRMACeast

LOS

Laser shut down

Cross-connect

unit

SCC unit

Cross-connectunit

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

-48 V/ -60 V


RPR: resilient package ring










l MPLS

l L2MPLS VPN

l Ethernet/ VLAN








RPR Protocol Processing ModuleRPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protectionswitching schemes. By applying the RPR protocol and RPR weight fair algorithm, this modulecontrols the bandwidth of each node to access the ring network. Therefore, the RPR ring featuresspatial reuse and statistic multiplex. Bandwidth utilization is then improved.

Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol fortopology auto-discovery provides correct and reliable means to fast find topologies of all nodesand the changes to these topologies.

RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reusedspatially.

The entire RPR ring accommodates 255 nodes to the maximum.


In the upstream direction, the virtual concatenation supports LCAS function. The encapsulationformats are LAPS and GFP.



In the downstream direction, virtual concatenations are received. The time delay of virtualconcatenation is compensated. After aligning, packets are decapsulated as per encapsulationformat. The decapsulated data are transmitted to the RPR protocol processing module in packets.

Interface Converting ModuleThe interface converting module mainly converts 622 Mbit/s low voltage differential signals(LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplaneinterface connects to low-rate interface chip of the transmitting system.















7.11.4 Front PanelOn the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety classlabel.

Appearance of the Front PanelFigure 7-29 shows the appearance of the front panel of the N1EMR0.

Figure 7-30 shows the appearance of the front panel of the N2EMR0.




Figure 7-29 Front panel of the N1EMR0

EMR0

EMR0

STATACTPROGSRVLINKACT

CLASS 1

LASER

PRODUCT

OU

T1IN

1

FE1

FE2

FE3

FE4



Figure 7-30 Front panel of the N2EMR0

EMR0

EMR0

STAT

ACT

PROG

SRV

LINK

ACT

CLASS 1

LASER

PRODUCT

OU

T1IN

1

FE1

FE2

FE3

FE4

Indicators












InterfacesThere are five interfaces on the front panel of the EMR0. Table 7-45 lists the type and usage ofthe interfaces.

Table 7-45 Optical interfaces of the EMR0







7.11.5 Valid SlotsThe EMR0 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. Without theinterface board, the EMR0 can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.With the interface board, the EMR0 can be housed in any of slots 12–13 in the OptiX OSN1500B subrack.

The EMR0 can be used with the ETF8 and EFF8.

Table 7-46 and Table 7-47 list the valid slots for the EMR0 and corresponding slots for theETF8 and EFF8.

Table 7-46 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in theOptiX OSN 1500A subrack

Valid Slot for the EMR0 Corresponding Slot for the ETF8 and EFF8



Table 7-47 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in theOptiX OSN 1500B subrack

Valid Slot for the EMR0 Corresponding Slot for the ETF8 and EFF8


Slot 12 Slot 15

Slot 13 Slot 17



7.11.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the EMR0 indicates the optical interface type.

Table 7-48 lists the relation between the board feature code and optical interface type for theEMR0.



SSN2EMR010 10 1000Base-SX (0.55 km)

SSN2EMR011 11 1000Base-LX (10 km)

SSN2EMR012 12 1000Base-ZX (40 km)

SSN2EMR013 13 1000Base-ZX (70 km)

7.11.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the EMR0.

You can use the T2000 to set the following parameters for the EMR0:

l Working mode



l Mapping protocol


7.11.8 Technical SpecificationsThe technical specifications of the EMR0 cover the optical interface specifications, boarddimensions, weight and power consumption.

Table 7-49 lists the specifications of the interfaces of the EMR0.

Table 7-49 Specifications of the optical interfaces of the EMR0

Item Specification


1000Base-ZX(70 km)

1000Base-ZX(40 km)

1000Base-LX(10 km)


Optical sourcetype

MLM MLM MLM MLM


–4 to +2 –2 to +5 –9 to –3 –9.5 to 0




Item Specification


1480 to 1580 1270 to 1355 1270 to 1355 770 to 860


–3 –3 –3 0


–22 –23 –19 –17


9 9 9 9



Mechanical SpecificationsThe mechanical specifications of the EMR0 are as follows:


l Weight (kg): 1.2

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EMR0 is 50 W.

7.12 ADL4This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.

7.12.1 Version DescriptionThe functional version of the ADL4 board is N1.

7.12.2 Function and FeatureThe ADL4 supports the ATM switching and ATM protection.

7.12.3 Working Principle and Signal FlowThe ADL4 consists of the O/E converting module, physical layer module, ATM module and soon.

7.12.4 Front PanelOn the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety classlabel.

7.12.5 Valid SlotsThe ADL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADL4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.12.6 Board Feature Code



The code behind the board name in the barcode is the board feature code. The board feature codeof the ADL4 indicates the optical interface type.

7.12.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the ADL4.

7.12.8 Technical SpecificationsThe technical specifications of the ADL4 cover the optical interface specifications, boarddimensions, weight and power consumption.

7.12.1 Version DescriptionThe functional version of the ADL4 board is N1.

7.12.2 Function and FeatureThe ADL4 supports the ATM switching and ATM protection.

Table 7-50 lists the functions and features of the ADL4.

Table 7-50 Functions and features of the ADL4

Function andFeature

ADL4

Basic function Accesses and processes 1 x STM-4 ATM services.

Optical interface type Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2types.

Connector type LC.

Optical module type SFP.

E3 ATM interface Supports 12 x E3 signals, which are accessed by the PD3/PL3/N1PL3A.

IMA function Not supported.

Max. uplink bandwidth Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4.

ATM switchingcapability

1.2 Gbit/s.

Mapping granularity Supports VC-3, VC-4, or VC-4-Xv (X: 1–4).

Service type Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection 2048.

Statistical multiplexing Supported.

Flow type and QoS Supports IETF RFC2514, ATM forum TM4.0.

ATM multicastconnection

Supports spacial multicast and logical multicast.




Function andFeature

ADL4

ATM protection (ITU-T I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring protection schemes.

OAM function (ITU-TI.610)

Supports AIS, RDI, LB , and CC.

Maintenance feature Supports inloop and outloop at the ATM layer levels, supportsinloop at the optical interface, which are used for maintenance andfault locating.

Alarm and performanceevent

Provides rich alarms and performance events. The loopback is usedfor maintenance and fault locating.

7.12.3 Working Principle and Signal FlowThe ADL4 consists of the O/E converting module, physical layer module, ATM module and soon.

Figure 7-31 shows the block diagram for the functions of the ADL4.

Figure 7-31 Block diagram for the functions of the ADL4

E/O

O/E

PHYmodule

ATMmodule

Mappingmodule

E3module

high speed bus


LOS

Laser shut down


Communication

Cross-connet unit

Scc unit

Clock module

50 MHz

77 MHz

100 MHz

622Mbit/s

Cross-connet unit A

+3.3 V backuppower

3.3 V Fuse

Fuse

-48 V/ -60 V

-48 V/ -60 V

DC/DCconverter

+2.5 V

+1.8 V

+1.5 V

+1.2 V

DC/DCconverter

high speed busCross-connet unit B

622Mbit/s

622Mbit/s622Mbit/s




O/E Converting ModuleIn the receive direction, optical signals are converted to electrical signals. In the transmitdirection, electrical signals are converted to optical signals.

Physical Layer ModuleThe physical layer module mainly:

l Mappings ATM cells into SDH frames

l Demappings SDH frames to ATM cells

l Processes ATM service physical layer functions: cell delimitation, test and generation ofHEC series

ATM ModuleThe ATM module mainly performs ATM layer functions in the ATM protocol. These functionsinclude:

l Flow control

l Extraction and generation of cell headers

l ATM switching

E3 ModuleThe E3 module mainly processes the ATM services at E3 rate. This module:

l Mappings the ATM cells into E3 containers

l Demappings E3 containers to ATM cells

l Perform ATM physical layer function to the ATM service at E3 rate

Mapping ModuleThe mapping module:

l Mappings ATM cells into SDH frame payload

l Demappings SDH frame payload to ATM cells

l Supports ATM physical layer functions

l Supports VC-4-Xv (X≤4) virtual concatenation

Communication and Control ModuleThe communication and control module:

l Controls writing and reading of each chip

l Communicates with the NE

l Issues configured services

l Reports alarms of each functional module

l Checks R_LOS alarms of optical modules




l Controls the shutting of transmission

Clock ModuleThis module mainly generates working clocks for each chip. The frequencies of the clocks are50 MHz, 77 MHz and 100 MHz.

DC/DC Converter ModuleThrough the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. Inaddition, this unit also provides protection for the board +3.3 V power supply.

7.12.4 Front PanelOn the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety classlabel.

Appearance of the Front PanelFigure 7-32 shows the appearance of the front panel of the ADL4.

Figure 7-32 Front panel of the ADL4

ADL4

ADL4

STATACTPROGSRV

CLASS 1

LASER

PRODUCT

IN1

OU

T1









InterfacesThere is one optical interface on the front panel of the ADL4. Table 7-51 lists the type and usageof the optical interface.

Table 7-51 Optical interface of the ADL4


Usage

OUT1/IN1 LC(pluggable)

Transmits and receives STM-4 optical signals.

7.12.5 Valid SlotsThe ADL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADL4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.12.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the ADL4 indicates the optical interface type.

Table 7-52 lists the relation between the board feature code and optical interface type of theADL4.



SSN1ADL410 10 S-4.1

SSN1ADL411 11 L-4.1

SSN1ADL412 12 L-4.2

SSN1ADL413 13 Ve-4.2

7.12.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the ADL4.

You can use the T2000 to set the following parameters for the ADL4:




l Port type

l Flow type

l Service type

l Peak cell rate (PCR)

l Sustainable cell rate (SCR)

l Maximum cell burst size

l Cell delay variation tolerance (CDVT)

For details on these parameters, refer to F Board Configuration Reference.

7.12.8 Technical SpecificationsThe technical specifications of the ADL4 cover the optical interface specifications, boarddimensions, weight and power consumption.


Table 7-53 lists the specifications of the optical interfaces of the ADL4.

Table 7-53 Specifications of the optical interfaces of the ADL4

Item Specification


S-4.1 L-4.1 L-4.2 Ve-4.2

Optical sourcetype

MLM SLM SLM SLM

Transmissiondistance (km)

2–15 15–40 40–80 80–100

Wavelength (nm) 1274–1356 1280–1335 1480–1580 1480–1580


–8 –8 –8 –8


–23 –28 –28 –33


–15 to –8 –3 to +2 –3 to +2 –2 to +2

Laser Safety Class




The mechanical specifications of the ADL4 are as follows:




l Weight (kg): 0.9

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the ADL4 is 41 W.

7.13 ADQ1This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.

7.13.1 Version DescriptionThe functional version of the ADQ1 board is N1.

7.13.2 Function and FeatureThe ADQ1 supports the ATM switching and ATM protection.

7.13.3 Working Principle and Signal FlowThe ADQ1 consists of the O/E converting module, physical layer module, ATM module and soon.

7.13.4 Front PanelOn the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety classlabel.

7.13.5 Valid SlotsThe ADQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADQ1can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.13.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the ADQ1 indicates the optical interface type.

7.13.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the ADQ1.

7.13.8 Technical SpecificationsThe technical specifications of the ADQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.

7.13.1 Version DescriptionThe functional version of the ADQ1 board is N1.

7.13.2 Function and FeatureThe ADQ1 supports the ATM switching and ATM protection.

Table 7-54 lists the functions and features of the ADQ1.




Table 7-54 Functions and features of the ADQ1

Function andFeature

ADQ1


Optical interface type Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 andVe-1.2 types.

Connector type LC.

Optical module type SFP.

E3 ATM interface Supports 12 x E3 signals, which are accessed by the PD3/PL3/N1PL3A.

IMA function Not supported.

Max. uplink bandwidth Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4.


1.2 Gbit/s.

Mapping granularity Supports VC-3, VC-4, or VC-4-Xv (X: 1–4).



Statisticalmultiplexing

Supported.

Flow type and QoS Supports IETF RFC2514 and ATM forum TM4.0.



ATM protection (ITU-T I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring protection schemes.

OAM function (ITU-TI.610)


Maintenance feature Supports inloop and outloop at the ATM layer levels, supportsinloop at the optical interface, which are used for maintenance andfault locating.


Provides rich alarms and performance events, which are used formaintenance and fault locating.


Figure 7-33 shows the block diagram for the functions of the ADQ1.



Figure 7-33 Block diagram for the functions of the ADQ1

E/O

O/E

PHYmodule

4x155 Mbit/s

4x155Mbit/s

ATMmodule

Mappingmodule

E3module

high speed bus


LOS

Laser shut down


Communication

Cross-connet unit

Scc unit

Clock module

50 MHz

77 MHz

100 MHz

Cross-connet unit A

+3.3 V backuppower

3.3 V Fuse

Fuse

-48 V/ -60 V

-48 V/ -60 V

DC/DCconverter

+2.5 V

+1.8 V

+1.5 V

+1.2 V

DC/DCconverter


4x155Mbit/s

4x155Mbit/s


O/E Converting ModuleIn the receive direction, optical signals are converted to electrical signals. In the transmitdirection, electrical signals are converted to optical signals.




l Processes ATM service physical layer functions: cell delimitation, test and generation ofHEC series


l Flow control


l ATM switching




E3 Module

The E3 module mainly processes the ATM services at E3 rate. This module:

l Mappings the ATM cells into E3 containers

l Demappings E3 containers to ATM cells

l Perform ATM physical layer function to the ATM service at E3 rate

Mapping Module

The mapping module:






The communication and control module:







Clock Module

This module mainly generates working clocks for each chip. The frequencies of the clocks are50 MHz, 77 MHz and 100 MHz.


Through the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. Inaddition, this unit also provides protection for the board +3.3 V power supply.

7.13.4 Front PanelOn the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety classlabel.


Figure 7-34 shows the appearance of the front panel of the ADQ1.



Figure 7-34 Front panel of the ADQ1

ADQ1

ADQ1

STATACTPROGSRV

CLASS 1

LASER

PRODUCT

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4







InterfacesThere are four pairs of optical interfaces on the front panel of the ADQ1. Table 7-55 lists thetype and usage of the optical interfaces.




Table 7-55 Optical interfaces of the ADQ1


OUT1/IN1 LC (pluggable) Transmits and receives STM-1 optical signals.




7.13.5 Valid SlotsThe ADQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The ADQ1can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.13.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the ADQ1 indicates the optical interface type.

Table 7-56 lists the relation between the board feature code and optical interface type for theADQ1.



SSN1ADQ110 10 S-1.1

SSN1ADQ111 11 L-1.1

SSN1ADQ112 12 L-1.2

SSN1ADQ113 13 Ve-1.2

SSN1ADQ114 14 Ie-1

7.13.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the ADQ1.

You can use the T2000 to set the following parameters for the ADQ1:

l Port type

l Flow type

l Service type








7.13.8 Technical SpecificationsThe technical specifications of the ADQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.


Table 7-57 lists the specifications of the optical interfaces of the ADQ1.

Table 7-57 Specifications of the optical interfaces of the ADQ1

Item Specification


Ie-1 S-1.1 L-1.1 L-1.2 Ve-1.2

Optical sourcetype

MLM MLM MLM, SLM SLM SLM

Wavelength(nm)

1260 to1360

1261 to 1360 1263 to 1360 1480 to1580

1480 to 1580


0 to 0.5 2 to 15 15 to 40 40 to 80 80 to 100


–19 to –14 –15 to –8 –5 to 0 –5 to 0 –3 to 0

Receivingoptical power(dBm)

–31 –28 –34 –34 –34


–14 –8 –10 –10 –10

Laser Safety Class




The mechanical specifications of the ADQ1 are as follows:


l Weight (kg): 0.9

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the ADQ1 is 37 W.




7.14 IDL4This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.

7.14.1 Version DescriptionThe functional version of the IDL4 board is N1.

7.14.2 Function and FeatureThe IDL4 supports the ATM switching, IMA, and ATM protection.

7.14.3 Working PrincipleThe IDL4 consists of the O/E converting module, physical layer module, ATM module and soon.

7.14.4 Front PanelOn the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety classlabel.

7.14.5 Valid SlotsThe IDL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDL4 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.14.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the IDL4 indicates the optical interface type.

7.14.7 Board ProtectionThe IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should behoused in paired slots.

7.14.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the IDL4.

7.14.9 Technical SpecificationsThe technical specifications of the IDL4 cover the optical interface specifications, boarddimensions, weight and power consumption.

7.14.1 Version DescriptionThe functional version of the IDL4 board is N1.

7.14.2 Function and FeatureThe IDL4 supports the ATM switching, IMA, and ATM protection.

Table 7-58 lists the functions and features of the IDL4.



Table 7-58 Functions and features of the IDL4

Function andFeature

IDL4



Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2types.

Connector type LC.

Optical moduletype

SFP.

E3 ATM interface Not supported.

IMA function(ATM Forum IMA1.1 standard)

Accesses and processes IMA services when used with E1 serviceprocessing board N1PQ1/N1PQM.Supports a maximum of 63 IMA E1 services.One ATM port supports a maximum of 16 IMA groups. Each IMA groupsupports 1–32 E1 signals.One ATM port supports a maximum of E1 links of 16 non-IMA groups.The maximum IMA multichannel delay is 226 ms.


Supports 8 x VC-4, or 63 x VC-12 and +7 x VC-4.


1.0 Gbit/s.

Mappinggranularity

Supports VC-12, VC-4, or VC-4-Xc (X:1–4), VC-12-Xv (X:1–32).

IMA feature Accesses and processes IMA services when used with E1 serviceprocessing board.Processes IMA services for a maximum of 63 x E1 signals.Supports a maximum of 16 IMA groups. Each IMA group supports 1–32 E1 signals.The maximum IMA multichannel delay is 226 ms.




Supported.




ATM protection(ITU-T I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ringprotection schemes.




Function andFeature

IDL4

Board level 1+1protection

Supported.

OAM function(ITU-T I.610)


Maintenancefeature

Supports inloop and outloop at the ATM layer levels, supports inloopat the optical interface, which are used for maintenance and faultlocating.



Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group cancoexist with single E1. The IMA group can dynamically increase or decrease the bandwidthto enhance the bandwidth utilization. The IMA group can also converge 2M services, and canconnect to other IMA equipment.

7.14.3 Working PrincipleThe IDL4 consists of the O/E converting module, physical layer module, ATM module and soon.

Figure 7-35 shows the block diagram for the functions of the IDL4.

Figure 7-35 Block diagram for the functions of the IDL4

+1.5 V

high speed bus


LOS

Laser shut down


Communication

Cross-connet unit

Scc unit

50 MHz

77 MHz

100 MHz

622 Mbit/s

Cross-connet unit A

+3.3 V

+2.5 V+1.8 V

+1.2 V

Clockmodule

DC/DCconverters

ATMmodule

PHYmodule

Mappingmodule

E/O

O/E IMAmodule

+3.3 V backuppower

DC/DCconverter

Fuse

Fuse

-48 V/ -60 V

-48 V/ -60 V


622 Mbit/s




E/O Converting ModuleThe E/O converting module is responsible for E/O conversion.




l Processes ATM service physical layer functions: cell delimitation, test and generation ofheader error control (HEC) sequence


l Flow control


l ATM switching

IMA ModuleThis module mainly performs IMA protocol functions. These functions are:

l Separation and re-creation of ATM cells

l Frame synchronization

l Insertion and extraction of IMA control protocol (ICP) cells

l Management of IMA groups

Mapping ModuleThe mapping module:





Communication and Control ModuleThe communication and control module:










Clock ModuleThis module mainly generates working clocks for each chip. The frequencies of the clocks are50 MHz, 77 MHz and 100 MHz.

DC/DC Converter ModuleThrough the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. Inaddition, this unit also provides protection for the board +3.3 V power supply.

7.14.4 Front PanelOn the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety classlabel.

Appearance of the Front PanelFigure 7-36 shows the appearance of the front panel of the IDL4.

Figure 7-36 Front panel of the IDL4

IDL4

IDL4

STATACTPROGSRV

CLASS 1

LASER

PRODUCT

IN1

OU

T1









InterfacesThere are one optical interface on the front panel of the IDL4. Table 7-59 lists the type andusage of the optical interface.

Table 7-59 Optical interface of the IDL4


Usage

OUT1/IN1 LC(pluggable)

Transmits and receives STM-4 optical signals.

7.14.5 Valid SlotsThe IDL4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDL4 canbe housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.14.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the IDL4 indicates the optical interface type.

Table 7-60 lists the relation between the board feature code and optical interface type for theIDL4.



SSN1IDL410 10 S-4.1

SSN1IDL411 11 L-4.1

SSN1IDL412 12 L-4.2

SSN1IDL413 13 Ve-4.2

7.14.7 Board ProtectionThe IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should behoused in paired slots.




The paired slots for the IDL4 are slots 13 and 12.

7.14.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the IDL4.

You can use the T2000 to set the following parameters for the IDL4:

l Port type

l Flow type

l Service type






7.14.9 Technical SpecificationsThe technical specifications of the IDL4 cover the optical interface specifications, boarddimensions, weight and power consumption.

Optical Interface SpecificationsTable 7-61 lists the specifications of the optical interfaces of the IDL4.

Table 7-61 Specifications of the optical interfaces of the IDL4

Item Specification


S-4.1 L-4.1 L-4.2 Ve-4.2

Optical source type MLM SLM SLM SLM

Wavelength (nm) 1274 to 1356 1280 to 1335 1480 to 1580 1480 to 1580


2 to 15 15 to 40 40 to 80 80 to 100


–15 to –8 –3 to +2 –3 to +2 –3 to +2

Receiver sensitivity(dBm)

–28 –28 –28 –33


–8 –8 –8 –13






The mechanical specifications of the IDL4 are as follows:


l Weight (kg): 1.0

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the IDL4 is 41 W.

7.15 IDQ1This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version,function, principle, front panel, configuration and specifications.

7.15.1 Version DescriptionThe functional version of the IDQ1 board is N1.

7.15.2 Function and FeatureThe IDQ1 supports the ATM switching, IMA, and ATM protection.


7.15.4 Front PanelOn the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety classlabel.

7.15.5 Valid SlotsThe IDQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDQ1can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.15.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the IDQ1 indicates the optical interface type.

7.15.7 Board ProtectionThe IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should behoused in paired slots.

7.15.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the IDQ1.

7.15.9 Technical SpecificationsThe technical specifications of the IDQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.

7.15.1 Version DescriptionThe functional version of the IDQ1 board is N1.




7.15.2 Function and FeatureThe IDQ1 supports the ATM switching, IMA, and ATM protection.

Table 7-62 lists the functions and features of the IDQ1.

Table 7-62 Functions and features of the IDQ1

Function andFeature

IDQ1



Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 and Ve-1.2types.

Connector type LC.

Optical moduletype

SFP.

E3 ATM interface Not supported.

IMA function(ATM Forum IMA1.1 standard)

Accesses and processes IMA services when used with E1 serviceprocessing board N1PQ1/N1PQM.Supports a maximum of 63 IMA E1 services.One ATM port supports a maximum of 16 IMA groups. Each IMA groupsupports 1–32 E1 signals.One ATM port supports a maximum of E1 links of 16 non-IMA groups.The maximum IMA multichannel delay is 226 ms.


Supports 8 x VC-4, or 63 x VC-12 and 7 x VC-4.


1.0 Gbit/s.

Mappinggranularity

Suppports VC-12, VC-4, or VC-4-Xc (X:1–4), VC-12-Xv (X:1–32).

IMA feature Accesses and processes IMA services when used with E1 serviceprocessing board.Processes IMA services for a maximum of 63 x E1 signals.Supports a maximum of 16 IMA groups. Each IMA group supports 1–32 E1 signals.The maximum IMA multichannel delay is 226 ms.




Supported.




Function andFeature

IDQ1



ATM protection(ITU-T I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ringprotection schemes.

Board level 1+1protection

Supported.

OAM function(ITU-T I.610)


Maintenancefeature

Supports inloop and outloop at the ATM layer levels, supports inloopat the optical interface, which are used for maintenance and faultlocating.



Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group cancoexist with single E1. The IMA group can dynamically increase or decrease the bandwidthto enhance the bandwidth utilization. The IMA group can also converge 2M services, and canconnect to other IMA equipment.


Figure 7-37 shows the block diagram for the functions of the IDQ1.




Figure 7-37 Block diagram for the functions of the IDQ1

+1.5 V

4 x 155Mbit/s

4 x 155Mbit/s

4 x 155Mbit/s

4 x 155Mbit/s

high speed bus


LOS

Laser shut down


Communication

Cross-connet unit

Scc unit

50 MHz

77 MHz

100 MHz

Cross-connet unit A

+3.3 V

+2.5 V+1.8 V

+1.2 V

Clockmodule

DC/DCconverters

ATMmodule

PHYmodule

Mappingmodule

E/O

O/E IMAmodule

+3.3 V backuppower

DC/DCconverter

Fuse

Fuse

-48 V/ -60 V

-48 V/ -60 V


E/O Converting Module

The E/O converting module is responsible for E/O conversion.

Physical Layer Module

The physical layer module mainly:



l Processes ATM service physical layer functions: cell delimitation, test and generation ofheader error control (HEC) sequence

ATM Module

The ATM module mainly performs ATM layer functions in the ATM protocol. These functionsinclude:

l Flow control


l ATM switching



IMA Module

This module mainly performs IMA protocol functions. These functions are:

l Separation and re-creation of ATM cells

l Frame synchronization

l Insertion and extraction of IMA control protocol (ICP) cells

l Management of IMA groups

Mapping Module

The mapping module:






The communication and control module:







Clock Module

This module mainly generates working clocks for each chip. The frequencies of the clocks are50 MHz, 77 MHz and 100 MHz.


Through the DC/DC module, the power unit generates required voltages for each chip on theboard. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. Inaddition, this unit also provides protection for the board +3.3 V power supply.

7.15.4 Front PanelOn the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety classlabel.


Figure 7-38 shows the appearance of the front panel of the IDQ1.




Figure 7-38 Front panel of the IDQ1

IDQ1

IDQ1

STATACTPROGSRV

CLASS 1

LASER

PRODUCT

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4







InterfacesThere are four optical interfaces on the front panel of the IDQ1. Table 7-63 lists the type andusage of the optical interfaces.



Table 7-63 Optical interfaces of the IDQ1






7.15.5 Valid SlotsThe IDQ1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The IDQ1can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.15.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the IDQ1 indicates the optical interface type.

Table 7-64 lists the relation between the board feature code and optical interface type for theIDQ1.



SSN1IDQ110 10 S-1.1

SSN1IDQ111 11 L-1.1

SSN1IDQ112 12 L-1.2

SSN1IDQ113 13 Ve-1.2

SSN1IDQ114 14 Ie-1

7.15.7 Board ProtectionThe IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should behoused in paired slots.

The paired slots for the IDQ1 are slots 13 and 12.

7.15.8 Board Configuration ReferenceYou can use the T2000 to set parameters for the IDQ1.

You can use the T2000 to set the following parameters for the IDQ1:

l Port type

l Flow type

l Service type









7.15.9 Technical SpecificationsThe technical specifications of the IDQ1 cover the optical interface specifications, boarddimensions, weight and power consumption.


Table 7-65 lists the specifications of the optical interfaces of the IDQ1.

Table 7-65 Specifications of the optical interfaces of the IDQ1

Item Specification


Ie-1 S-1.1 L-1.2 Ve-1.2 L-1.1

Optical sourcetype

MLM MLM SLM SLM MLM, SLM

Wavelength(nm)

1260 to1360

1261 to 1360 1480 to1580

1480 to 1580 1263 to 1360


0 to 0.5 2 to 15 40 to 80 80 to 100 15 to 40


–19 to –14 –15 to –8 –5 to 0 –3 to 0 –5 to 0


–31 –28 –34 –34 –34


–14 –8 –10 –10 –10

Laser Safety Class




The mechanical specifications of the IDQ1 are as follows:




l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the IDQ1 is 41 W.

7.16 MST4This section describes the MST4, a 4-channel multi-service transparent transmission board, interms of the version, function, principle, front panel, configuration and specifications.

7.16.1 Version DescriptionThe functional version of the MST4 board is N1.

7.16.2 Function and FeatureThe MST4 is used to access multiple services, and to maintain alarms.

7.16.3 Working Principle and Signal FlowThe MST4 consists of the client-side access module, FC protocol processing module,encapsulation and mapping module, Communication and control module and so on.

7.16.4 Front PanelOn the front panel of the MST4, there are indicators, interfaces and barcode.

7.16.5 Valid SlotsThe MST4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The MST4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.16.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the MST4 indicates the service type, optical interface type and transmission distance.

7.16.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the MST4.

7.16.8 Technical SpecificationsThe specifications of the MST4 cover the optical interface specifications, mechanicalspecifications and power consumption.

7.16.1 Version DescriptionThe functional version of the MST4 board is N1.

7.16.2 Function and FeatureThe MST4 is used to access multiple services, and to maintain alarms.

Table 7-66 lists the functions and features of the MST4.




Table 7-66 Functions and features of the MST4

Function andFeature

MST4

Basic function Provides four independent ports to access multiple services, and supportsthe transparent transmission of the SAN and Video services.

Connector type LC.

Optical moduletype

SFP.

Service type Supports the FC100/FICON, FC200, ESCON, and DVB-ASIservices.Table 7-67 lists types and rates of the services.Accesses four-channel FC services (FC100/FICON and FC200) at thesame time, and the total bandwidth is less than 2.5 Gbit/s.Supports the full-rate transmission of the FC services (one-channel FC200services or two-channel FC100 services).Accesses four-channel ESCON or DVB-ASI services, and the totalbandwidth is less than 2.5 Gbit/s.

Distanceextension

The first and second ports support the distance extension function at theSDH side. (FC100: 3000 km; FC200: 1500 km)


2.5 Gbit/s (Four 622 Mbit/s buses are present on the backplane to directlyconnect to the cross-connect unit.)

Mappinggranularity

Supports VC-4-Xc (X: 4, 8, 16).

ESCON Accesses four-channel ESCON services, and the total bandwidth is lessthan 2.5 Gbit/s.

DVB-ASI Accesses four-channel DVB-ASI services, and the total bandwidth is lessthan 2.5 Gbit/s.

Encapsulationformat

Supports GFP-T, compliant with ITU-T G.7041.

Maintenancefeature

Supports the inloop and outloop at the port level of the client side. Theloopack is used for maintenance and fault locating.



Table 7-67 Services and service rates provided by the MST4

Service Type Rate Remarks

FC100/FICON 1062.5 Mbit/s SAN service

FC200 2125 Mbit/s SAN service

ESCON 200 Mbit/s. SAN service.



Service Type Rate Remarks

DVB-ASI 270 Mbit/s Video service

7.16.3 Working Principle and Signal FlowThe MST4 consists of the client-side access module, FC protocol processing module,encapsulation and mapping module, Communication and control module and so on.

Figure 7-39 shows the block diagram for the functions of the MST4.

Figure 7-39 Block diagram for the functions of the MST4

Interfaceconversion

module

Client-side

accessmodule

FC50FC100FC200FICONDVB-ASI



FC processing module

FC1_SND

Encapsulation

Decapsulation

FC1_RCV

FC2 FC1_SND

FC2

Communication and controlmodule

Clockmodule

135 MHz125 MHz100 MHz

212.5 MHz622 MHz

Cross-connect unit

+1.2 V+1.5 V

+2.5 V+1.8 V

FC1_RCV

Mapping

ESCON

Encapsulation andmapping module

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

FuseDC/DC

converter

-48 V/ -60 V

-48 V/ -60 V

Cross-connectunit A/B

Cross-connectunit A/B


Client-side Access ModuleThe client-side access module accesses FC50, FC100, FC200, FICON, DVB-ASI and ESCONservices. The client-side interface unit performs O/E conversion for services and monitors theoptical signals at client side.

In the upstream direction, the client-side data interface (CDI) receives serial data signals inputby the SFP optical module. The serial data signals are then transmitted to the PCS functionmodule for physical layer and 8B/10B line performance monitoring.

In the downstream direction, 8B/ 10B conversion is performed to the signals from FC. Thesignals are then adapted into client reference clock by inserting or discarding idle packets. Afterbeing converted from parallel signals to serial signals, the signals are transmitted through theCDI interface to the optical module at client side.




FC protocol Processing ModuleThe FC protocol processing unit mainly extends the distance the FC services. This modulesupports transmitting 2 x FC100 services up to 3,000 km or 1 x FC200 services up to 1500 km.

The FC protocol processing unit performs FC1 layer and FC2 layer functions. The FC1 layerfunctions include:

l 8B/10B conversion

l Synchronous processing

l Extraction of primitive signal and primitive sequence

The FC2 layer functions include:

l Check and statistics of all special frames

l Modification of values of some special frames (FLOG1, PLOG1 and ELP)

l CRC check

Encapsulation and Mapping ModuleThe encapsulation and mapping module mainly:

l Encapsulates and mappings data

l Decapsulates and demappings data

According to signal flow direction, the function modules inside the chip can be classified intomodules in ingress direction and ones in egress direction. The ingress direction is for processingfrom client side to line side. The egress direction is for line-side processing.

Ingress direction:

Through GFP-T encapsulation, 64B/65B conversion is performed to data bytes after decoding.The data bytes are then mapped under GFP-T protocol.

Egress direction:

SDH data frames are received from the line-side interface module. After the overhead isprocessed, GFP-T data frames are extracted from SDH concatenated channels and then aretransmitted to the decapsulating module for decapsulation.

Communication and Control ModuleThe communication and control module consists of CPU, register, oscillator, Ethernet port andHDLC controller. This module connects to external circuits through bus. The communicationand control module manages and configures other modules of the boards. This module containsbasic logic units:



l Checks and selects clock



l Checks reset control circuits of each chip




l Processes communications

l Controls indicators

System Clock Module

This module provides required reference clocks for boards. The clock frequencies are 100 MHz,125 MHz and so on.


Through the DC/DC module, the power unit generates direct currents for each chip on the board.The –48 V/ –60 V powers are converted to the following direct currents: +1.2 V, +1.8 V, +2.5V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power.

7.16.4 Front PanelOn the front panel of the MST4, there are indicators, interfaces and barcode.


Figure 7-40 shows the appearance of the front panel of the MST4.

Figure 7-40 Front panel of the MST4

MST4

MST4

STATACTPROGSRV

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4




Indicators







Interfaces

There are four pairs of optical interfaces on the front panel of the MST4. Table 7-68 lists thetype and usage of the optical interfaces.

Table 7-68 Optical interfaces of the MST4


Usage

IN1-IN4 LC Receives multi-service optical signals.

OUT1-OUT4 LC Transmits multi-service optical signals.

7.16.5 Valid SlotsThe MST4 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack. The MST4can be housed in any of slots 11–13 in the OptiX OSN 1500B subrack.

7.16.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the MST4 indicates the service type, optical interface type and transmission distance.

Table 7-69 lists the relation between the board feature code and service type.

Table 7-69 Relation between the board feature code and service type

Board Barcode FeatureCode

Service Type (Optical InterfaceType)

TransmissionDistance

SSN1MST410 10 2 x FC (SM) 2 km


SSN1MST412 12 2 x FC (MM) 0.5 km

SSN1MST413 13 4 x ESCON/DVB-ASI (SM) 15 km

SSN1MST414 14 4 x ESCON/DVB-ASI (MM) 2 km

SSN1MST415 15 1 x FC2 (MM) -



Board Barcode FeatureCode

Service Type (Optical InterfaceType)

TransmissionDistance

ESCON/DVB-ASI (MM)

SSN1MST416 16 1 x FC2 (MM) -

ESCON/DVB-ASI (SM)


2 x ESCON/DVB-ASI (SM) -


2 x ESCON/DVB-ASI (MM) -

7.16.7 Board Configuration ReferenceYou can use the T2000 to set parameters for the MST4.

You can use the T2000 to set the following parameters for the MST4:

l J1 byte

l C2 byte


7.16.8 Technical SpecificationsThe specifications of the MST4 cover the optical interface specifications, mechanicalspecifications and power consumption.

Optical Interface SpecificationsThe optical interfaces of the MST4 can use several types of the optical interfaces. Table 7-70lists the specifications of the optical interfaces.

Table 7-70 Specifications of the optical interfaces of the MST4

Item Specification


X3.296/(DVB-ASI )EN50083-9200-M5-SN-I 200-SM-LC-I

Optical modulecode

34060277 34060287 34060325 34060288 34060278

Service type ESCON/DVB FC200, FC100

Service rate STM-4 STM-1 2.125 Gbit/s STM-16

Optical sourcetype

SLM LED LED MLM SLM




Item Specification

Wavelength(nm)

1310 850 1310


15 2 0.5 2 15

Max. launchedoptical power(dBm)

–8 –14 -2.5 -3 0

Min. launchedoptical power(dBm)

–15 –19 -9.5 -10 -5


–31 –30 –17 –21


–8 –14 0 –3 0

Mechanical SpecificationsThe mechanical specifications of the MST4 are as follows:


l Weight (kg): 0.9

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the MST4 is 26 W.



8 Interface Boards and Switching Boards

About This Chapter

This chapter describes the interface and switching boards. The interface boards are used to accesscables and fibers. The switching boards are used to provide the TPS protection.

8.1 L12SThis section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.

8.2 D12BThis section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version,function, principle, front panel and specifications.

8.3 D12SThis section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.

8.4 L75SThis section describes the L75S, a 16 x E1 electrical interface switching board, in terms of theversion, function, principle, front panel and specifications.



8.7 C34SThis section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.

8.8 EU04This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version,function, working principle, front panel and specifications.

8.9 EU08

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 8 Interface Boards and Switching Boards


This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version,function, working principle, front panel and specifications.

8.10 OU08This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.

8.11 MU04This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of theversion, function, principle, front panel and specifications.

8.12 TSB8This section describes the TSB8, an 8-channel optical interface switching board, in terms of theversion, function, principle, front panel and specifications.

8.13 EFF8This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of theversion, function, principle, front panel and specifications.

8.14 ETF8This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms ofthe version, function, principle, front panel and specifications.

8.15 ETS8This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board,in terms of the version, function, principle, front panel and specifications.

8.16 DM12This section describes the DM12, a DDN interface board, in terms of the version, function,principle, front panel and specifications.

8 Interface Boards and Switching BoardsOptiX OSN 1500 Intelligent Optical Transmission System



8.1 L12SThis section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.

8.1.1 Version DescriptionThe functional version of the L12S is R1.8.1.2 Function and FeatureThe L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must beused with the PD1.8.1.3 Working Principle and Signal FlowThe L12S consists of the interface module, switch matrix module, and power supply module.8.1.4 Front PanelOn the front panel of the L12S, there are interfaces and barcode.8.1.5 Valid SlotsAs the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiXOSN 1500A subrack.8.1.6 Technical SpecificationsThe technical specifications of the L12S cover the board dimensions, weight and powerconsumption.

8.1.1 Version DescriptionThe functional version of the L12S is R1.

8.1.2 Function and FeatureThe L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must beused with the PD1.

8.1.3 Working Principle and Signal FlowThe L12S consists of the interface module, switch matrix module, and power supply module.

Figure 8-1 shows the block diagram for the functions of the L12S.

Figure 8-1 Block diagram for the functions of the L12S

Swictchmatrix

module

E1/T1

E1/T1

PD1

Backplane

Interfacemodule

+3.3 V Power+3.3 V Fuse

PD1

Cross-connectboard

Powersupplymodule



Interface Module

The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PD1 board. When the TPS protection is performed, the switchmatrix module transmits the signals to the protection board for bridging.

In the transmit direction, the working direction of the switch matrix module is the reverse of thereceive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.1.4 Front PanelOn the front panel of the L12S, there are interfaces and barcode.


Figure 8-2 shows the appearance of the front panel of the L12S.

Figure 8-2 Front panel of the L12S

L12S

1-16

Interfaces

On the front panel of the L12S, there are two 2mmHM connectors, which are used to access 16x E1/T1 electrical signals.




8.1.5 Valid SlotsAs the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiXOSN 1500A subrack.

Table 8-1 lists the valid slots for the PD1 and corresponding slots for the L12S. The L12S housedin the slot with a smaller number accesses the first 16 (1–16) channels of E1/T1 electrical signals.The L12S housed in the slot with a larger number accesses the last 16 (17–32) channels of E1/T1 electrical signals.

Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500Asubrack

Valid Slot for the PD1 Corresponding Slot for the L12S


8.1.6 Technical SpecificationsThe technical specifications of the L12S cover the board dimensions, weight and powerconsumption.


The mechanical specifications of the L12S are as follows:


l Weight (kg): 0.27

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the L12S is 4.5 W.

8.2 D12BThis section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version,function, principle, front panel and specifications.

8.2.1 Version DescriptionThe functional version of the D12B board is N1.

8.2.2 Function and FeatureThe D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must beused with the PQ1 or PQM.

8.2.3 Working Principle and Signal FlowThe D12B consists of the interface module and power supply module.

8.2.4 Front PanelOn the front panel of the D12B, there are interfaces and barcode.

8.2.5 Valid Slots



The D12B can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12Bcan be used as the interface board for the PQ1 or PQM.

8.2.6 Technical SpecificationsThe technical specifications of the D12B cover the board dimensions, weight and powerconsumption.

8.2.1 Version DescriptionThe functional version of the D12B board is N1.

8.2.2 Function and FeatureThe D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must beused with the PQ1 or PQM.

8.2.3 Working Principle and Signal FlowThe D12B consists of the interface module and power supply module.

Figure 8-3 shows the block diagram for the functions of the D12B.

Figure 8-3 Block diagram for the functions of the D12B

E1/T1

E1/T1

PQ1/PQM

+3.3 V+3.3 V Fuse

PQ1/PQM

Interfacemodule

Backplane

PowerPowersupplymodule

Interface ModuleThe interface module receives and transmits the E1/T1 electrical signals.

Power Supply ModuleThe power supply module provides the DC voltages required by the modules of the board.

8.2.4 Front PanelOn the front panel of the D12B, there are interfaces and barcode.

Appearance of the Front PanelFigure 8-4 shows the appearance of the front panel of the D12B.




Figure 8-4 Front panel of the D12B

D12B

17～

249～

161～

825

～32

D12B

InterfacesThere are four DB44 interfaces on the front panel of the D12B. Table 8-2 lists the type andusage of the interfaces.

Table 8-2 Interfaces on the front panel of the D12B


Usage

1–8 DB44 Receive eight channels (1–8) of E1/T1 signals.



25–32 DB44 Receive eight channels (25-32) of E1/T1 signals.

Table 8-3 lists the pins of the DB44 interfaces.



Table 8-3 Pins of the DB44 interfaces of the D12B

Front View Pin Usage Pin Usage

1

44

38 R1 to receive thefirst channel ofsignals.

34 R5 to receive thefifth channel ofsignals.23 19

37 R2 to receive thesecond channel ofsignals.

33 R6 to receive thesixth channel ofsignals.22 18

36 R3 to receive thethird channel ofsignals.

32 R7 to receive theseventh channel ofsignals.21 17

35 R4 to receive thefourth channel ofsignals.

31 R8 to receive theeighth channel ofsignals.20 16

15 T1 to transmit thefirst channel ofsignals.

11 T5 to transmit thefifth channel ofsignals.30 26

14 T2 to transmit thesecond channel ofsignals.

10 T6 to transmit thesixth channel ofsignals.29 25

13 T3 to transmit thethird channel ofsignals.

9 T7 to transmit theseventh channel ofsignals.28 24

12 T4 to transmit thefourth channel ofsignals.

8 T8 to transmit theeighth channel ofsignals.27 7

8.2.5 Valid SlotsThe D12B can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12Bcan be used as the interface board for the PQ1 or PQM.

Table 8-4 lists the valid slots for the PQ1/PQM and corresponding slots for the D12B. The D12Bhoused in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1 electricalsignals. The D12B housed in the slot with a larger number accesses the last 31 (33–63) channelsof E1/T1 electrical signals.

Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN1500B subrack

Valid Slot for the PQ1/PQM Corresponding Slot for the D12B






8.2.6 Technical SpecificationsThe technical specifications of the D12B cover the board dimensions, weight and powerconsumption.

Mechanical SpecificationsThe mechanical specifications of the D12B are as follows:

l Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

l Weight (kg): 0.3

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the D12B is 0 W.


8.3.1 Version DescriptionThe functional version of the D12S board is N1.

8.3.2 Function and FeatureThe D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must beused with the PQ1 or PQM.

8.3.3 Working Principle and Signal FlowThe D12S consists of the interface module, switch matrix module, and power supply module.

8.3.4 Front PanelOn the front panel of the D12S, there are interfaces and barcode.

8.3.5 Valid SlotsThe D12S can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12Scan be used as the interface board for the PQ1 or PQM.

8.3.6 Technical SpecificationsThe technical specifications of the D12S cover the board dimensions, weight and powerconsumption.






Figure 8-5 shows the block diagram for the functions of the D12S.

Figure 8-5 Block diagram for the functions of the D12S

Swictchmatrix

module

E1/T1

E1/T1PQ1/PQM

Backplane

Interfacemodule


Cross-connectboard

Powersupplymodule

PQ1/PQM


Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PD1 or PQM board. When the TPS protection is performed,the switch matrix module transmits the signals to the protection board for bridging.




Appearance of the Front PanelFigure 8-6 shows the appearance of the front panel of the D12S.




Figure 8-6 Front panel of the D12S

D12S

D12S

17～24

9～

161～

825

～32

InterfacesThere are four DB44 interfaces on the front panel of the D12S. Table 8-5 lists the type and usageof the optical interfaces.

Table 8-5 Interfaces on the front panel of the D12S


Usage








Table 8-6 Pins of the DB44 interfaces of the D12S


1

44


34 R5 to receive the fifthchannel of signals.

23 19


33 R6 to receive the sixthchannel of signals.

22 18













8.3.5 Valid SlotsThe D12S can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack. The D12Scan be used as the interface board for the PQ1 or PQM.

Table 8-7 lists the valid slots for the PQ1/PQM and corresponding slots for the D12S. The D12Shoused in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1 electricalsignals. The D12S housed in the slot with a larger number accesses the last 31 (33–63) channelsof E1/T1 electrical signals.

Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN1500B subrack

Valid Slot for the PQ1/PQM Corresponding Slot for the D12S








The mechanical specifications of the D12S are as follows:


l Weight (kg): 0.4

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the D12S in the switchingstate is 9 W and that of the D12S in the normal state is 0 W.

8.4 L75SThis section describes the L75S, a 16 x E1 electrical interface switching board, in terms of theversion, function, principle, front panel and specifications.


8.4.2 Function and FeatureThe L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be usedwith the PD1.



8.4.5 Valid SlotsThe L75S can be housed in any slots of 6–7 in the subrack. The L75S can be used as the interfaceboard for the PD1.



8.4.2 Function and FeatureThe L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be usedwith the PD1.




Figure 8-7 shows the block diagram for the functions of the L75S.

Figure 8-7 Block diagram for the functions of the L75S

Swictchmatrix

module

E1

E1

Backplane

Interfacemodule


Cross-connectboard

Powersupplymodule

PD1

PD1

Interface Module

The interface module receives and transmits the E1 electrical signals.


In the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PD1 board. When the TPS protection is performed, the switchmatrix module transmits the signals to the protection board for bridging.


Power Supply Module




Figure 8-8 shows the appearance of the front panel of the L75S.




Figure 8-8 Front panel of the L75S

L75S

1-16

Interfaces

On the front panel of the L75S, there are two 2mmHM connectors, which are used to access 16x E1 electrical signals.

8.4.5 Valid SlotsThe L75S can be housed in any slots of 6–7 in the subrack. The L75S can be used as the interfaceboard for the PD1.

Table 8-8 lists the valid slots for the PD1 and corresponding slots for the L75S. The L75S housedin the slot with a smaller number accesses the first 16 (1–16) channels of E1 electrical signals.The L75S housed in the slot with a larger number accesses the last 16 (17–32) channels of E1electrical signals.

Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S

Valid Slot for the PD1 Corresponding Slot for the L75S




The mechanical specifications of the L75S are as follows:


l Weight (kg): 0.24



Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the L75S is 2.7 W.






8.5.5 Valid SlotsAs the interface board for the PQ1 or PQM, the D75S can be housed in any of slots 14–17 inthe OptiX OSN 1500B subrack.










Swictchmatrix

module

E1/T1

Backplane

Interfacemodule


Cross-connectboard

Powersupplymodule

PQ1/PQM

PQ1/PQME1/T1


Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PQ1 or PQM board. When the TPS protection is performed,the switch matrix module transmits the signals to the protection board for bridging.




Appearance of the Front PanelFigure 8-10 shows the appearance of the front panel of the D75S.




D75S

D75S

17～24

9～

161～

825

～32

InterfacesThere are four DB44 interfaces on the front panel of the D75S. Table 8-9 lists the type and usageof the DB44 interfaces.

Table 8-9 Interfaces on the front panel of the D75S


Usage





Table 8-10 lists the pins of the DB44 interface.




Table 8-10 Pins of the DB44 interfaces of the D75S


1

44


34 R5 to receive the fifthchannel of signals.

23 19


33 R6 to receive the sixthchannel of signals.

22 18













8.5.5 Valid SlotsAs the interface board for the PQ1 or PQM, the D75S can be housed in any of slots 14–17 inthe OptiX OSN 1500B subrack.

Table 8-11 lists the valid slots for the PQ1/PQM and corresponding slots for the D75S. TheD75S housed in the slot with a smaller number accesses the first 32 (1–32) channels of E1/T1electrical signals. The D75S housed in the slot with a larger number accesses the last 31 (33–63) channels of E1/T1 electrical signals.

Table 8-11 Valid slots for the PQ1/PQM and corresponding slots for the D75S in the OptiXOSN 1500B subrack

Valid Slot for the PQ1/PQM Corresponding Slot for the D75S







The mechanical specifications of the D75S are as follows:


l Weight (kg): 0.4

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the D75S in the switchingstate is 6 W and that of the D75S in the normal state is 0 W.



8.6.2 Function and FeatureThe D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must beused with the PD3.



8.6.5 Valid SlotsAs the interface board for the PD3, the D34S can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.

8.6.6 Technical SpecificationsThe technical specifications of the D34S cover the electrical interface specifications, boarddimensions, weight and power consumption.


8.6.2 Function and FeatureThe D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must beused with the PD3.







E3/T3

E3/T3

PD3

+3.3 V+3.3 V Fuse

PD3

TSB8

TSB8

Interfacemodule

Swictchmatrix

module

Power

BackplaneCross-

connectboard

Powersupplymodule

Interface Module

The interface module receives and transmits the E3/T3 electrical signals.


In the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PD3 board. When the TPS protection is performed, the switchmatrix module transmits the signals to the TSB8 board for bridging.


Power Supply Module




Figure 8-12 shows the appearance of the front panel of the D34S.




D34S

D34S

OU

T4IN

4O

UT5

IN5

OU

T6IN

6O

UT1

IN1

OU

T2IN

2O

UT3

IN3

InterfacesThere are six pairs of electrical interfaces on the front panel of the D34S.

Table 8-12 lists the type and usage of interfaces on the D34S.

Table 8-12 Interfaces of the D34S


Usage

IN1–IN6 SMB Receive six channels (1–6) of E3/T3 electrical signals.

OUT1–OUT6 SMB Transmit six channels (1–6) of E3/T3 electrical signals.

8.6.5 Valid SlotsAs the interface board for the PD3, the D34S can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.

Table 8-13 lists the valid slots for the PD3 and corresponding slots for the D34S.




Table 8-13 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN1500B subrack

Valid Slot for the PD3 Corresponding Slot for the D34S

Slot 12 Slot 14

Slot 13 Slot 16

8.6.6 Technical SpecificationsThe technical specifications of the D34S cover the electrical interface specifications, boarddimensions, weight and power consumption.

Electrical Interface SpecificationsTable 8-14 lists the specifications of the electrical interfaces of the D34S.

Table 8-14 Specifications of the electrical interfaces of the D34S

Item Specification

Interface type 34368 kbit/s and 44736k bit/s

Code HDB3 (E3) and B3ZS (T3)

Output signal bit rate Compliant with ITU-T G.703

Allowed input frequencydeviation

Allowed input attenuation

Input jitter tolerance

Mechanical SpecificationsThe mechanical specifications of the D34S are as follows:


l Weight (kg): 0.4

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the D34S in the switchingstate is 2 W and that of the D34S in the normal state is 0 W.

8.7 C34SThis section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms ofthe version, function, principle, front panel and specifications.

8.7.1 Version Description



The functional version of the C34S board is N1.

8.7.2 Function and FeatureThe C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must beused with the PL3.

8.7.3 Working Principle and Signal FlowThe C34S consists of the interface module, switch matrix module, and power supply module.

8.7.4 Front PanelOn the front panel of the C34S, there are interfaces and barcode.

8.7.5 Valid SlotsAs the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiXOSN 1500B subrack.

8.7.6 Technical SpecificationsThe technical specifications of the C34S cover the electrical interface specifications, boarddimensions, weight and power consumption.

8.7.1 Version DescriptionThe functional version of the C34S board is N1.

8.7.2 Function and FeatureThe C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must beused with the PL3.

8.7.3 Working Principle and Signal FlowThe C34S consists of the interface module, switch matrix module, and power supply module.

Figure 8-13 shows the block diagram for the functions of the C34S.

Figure 8-13 Block diagram for the functions of the C34S

+3.3 Vbackeuppower

E3/T3

E3/T3

PL3

+3.3 V -48 V/-60 VFuse

Fuse

-48 V/-60 V

PL3

TSB8

TSB8

Interfacemodule

Cross-connectboard

Backplane

Powersupplymodule

Powersupplymodule

Swictchmatrix

module





Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the PL3 board. When the TPS protection is performed, the switchmatrix module transmits the signals to the TSB8 board for bridging.



8.7.4 Front PanelOn the front panel of the C34S, there are interfaces and barcode.

Appearance of the Front PanelFigure 8-14 shows the appearance of the front panel of the C34S.

Figure 8-14 Front panel of the C34S

C34S

C34S

OU

T1IN

1O

UT2

IN2

OU

T3IN

3

InterfacesThere are three pairs of electrical interfaces on the front panel of the C34S.



Table 8-15 lists the type and usage of interfaces on the C34S.

Table 8-15 Interfaces of the C34S


Usage

IN1–IN3 SMB Receive the first three channels (1–3) of E3/T3 electricalsignals.

OUT1–OUT3 SMB Transmit the first three channels (1–3) of E3/T3 electricalsignals.

8.7.5 Valid SlotsAs the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiXOSN 1500B subrack.

Table 8-16 lists the valid slots for the PL3 and corresponding slots for the C34S.

Table 8-16 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN1500B subrack

Valid Slot for the PL3 Corresponding Slot for the C34S

Slot 12 Slot 14

Slot 13 Slot 16

8.7.6 Technical SpecificationsThe technical specifications of the C34S cover the electrical interface specifications, boarddimensions, weight and power consumption.

Electrical Interface SpecificationsTable 8-17 lists the specifications of the electrical interfaces of the C34S.

Table 8-17 Specifications of the electrical interfaces of the C34S

Item Specification

Interface type 34368 kbit/s and 44736 kbit/s

Code HDB3 (E3) and B3ZS (T3)









The mechanical specifications of the C34S are as follows:


l Weight (kg): 0.3

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the C34S in the switchingstate is 2 W and that of the C34S in the normal state is 0 W.

8.8 EU04This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version,function, working principle, front panel and specifications.

8.8.1 Version DescriptionThe functional version of the EU04 board is N1.

8.8.2 Function and FeatureThe EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must beused with the SEP.

8.8.3 Working Principle and Signal FlowThe EU04 consists of the interface module, switch matrix module, and power supply module.

8.8.4 Front PanelOn the front panel of the EU04, there are interfaces and barcode.

8.8.5 Valid SlotsAs the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.

8.8.6 Technical SpecificationsThe technical specifications of the EU04 cover the electrical interface specifications, boarddimensions, weight and power consumption.




Figure 8-15 shows the block diagram for the functions of the EU04 when it processes 1 x STM-1signals.



Figure 8-15 Block diagram for the functions of the EU04

+3.3 Vbackeuppower

STM-1(e)

+3.3 V -48 V/-60 VFuse

Fuse

-48 V/-60 V

TSB8Interfacemodule

Cross-connectboard

Backplane

Powersupplymodule

Powersupplymodule

Swictchmatrix

module

STM-1(e)SEP

TSB8SEP

Interface ModuleThe interface module receives and transmits the STM-1 electrical signals.

Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the SEP board. When the TPS protection is performed, the switchmatrix module transmits the signals to the TSB8 board for bridging.




Appearance of the Front PanelFigure 8-16 shows the appearance of the front panel of the EU04.




Figure 8-16 Front panel of the EU04

EU04

EU04

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4

InterfacesThere are four pairs of electrical interfaces on the front panel of the EU04.

Table 8-18 lists the type and usage of interfaces on the EU04.

Table 8-18 Interfaces of the EU04


Usage

IN1–IN4 SMB Receive four (1–4) channels of electrical interfaces.

OUT1–OUT4 SMB Transmit four (1–4) channels of electrical interfaces.


Table 8-19 lists the valid slots for the SEP and corresponding slots for the EU04.



Table 8-19 Valid slots for the SEP and corresponding slots for the EU04

Valid Slot for the SEP Corresponding Slot for the EU04

Slot 12 Slot 14

Slot 13 Slot 16



Table 8-20 lists the specifications of the electrical interfaces of the EU04.

Table 8-20 Specifications of the electrical interfaces of the EU04

Item Specification

Interface Type 155520 kbit/s

Code CMI





The mechanical specifications of the EU04 are as follows:


l Weight (kg): 0.4

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the EU04 is 6 W.

8.9 EU08This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version,function, working principle, front panel and specifications.


8.9.2 Function and Feature




The EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must beused with the SEP.








Figure 8-17 shows the block diagram for the functions of the EU08.

Figure 8-17 Block diagram for the functions of the EU08

+3.3 Vbackeuppower

STM-1(e)

+3.3 V

TSB8Interfacemodule

Cross-connectboard

Backplane

Powersupplymodule

Swictchmatrix

module

STM-1(e)SEP

TSB8SEP

Fuse

Interface ModuleThe interface module receives and transmits the STM-1 electrical signals.

Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signals



from the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the SEP board. When the TPS protection is performed, the switchmatrix module transmits the signals to the TSB8 board for bridging.




Appearance of the Front PanelFigure 8-18 shows the appearance of the front panel of the EU08.

Figure 8-18 Front panel of the EU08

EU08

EU08

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4

OU

T5IN

5O

UT6

IN6

OU

T7IN

7O

UT8

IN8

InterfacesThere are eight pairs of electrical interfaces on the front panel of the EU08.




Table 8-21 lists the type and usage of interfaces on the EU08.

Table 8-21 Interfaces of the EU08


Usage

IN1–IN8 SMB Receive eight (1–8) channels of electrical interfaces.

OUT1–OUT8 SMB Transmit eight (1–8) channels of electrical interfaces.


Table 8-22 lists the valid slots for the SEP and corresponding slots for the EU08 in the OptiXOSN 1500B.

NOTE

The OptiX OSN 1500A does not support the EU08 board.

Table 8-22 Valid slots for the SEP and corresponding slots for the EU08

Valid Slot for the SEP Corresponding Slot for the EU08

Slot 12 Slot 14

Slot 13 Slot 16


Electrical Interface SpecificationsTable 8-23 lists the specifications of the electrical interfaces of the EU08.

Table 8-23 Specifications of the electrical interfaces of the EU08

Item Specification

Interface type 155520 kbit/s

Code CMI


Allowed input frequency deviation






The mechanical specifications of the EU08 are as follows:


l Weight (kg): 0.4

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the EU08 is 11 W.

8.10 OU08This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version,function, working principle, front panel and parameters.

8.10.1 Version DescriptionThe OU08 has two versions, N1 and N2. The main difference between the two versions lies inthe connector type for optical interfaces and the pluggability of the optical modules.

8.10.2 Function and FeatureThe OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must beused with the SEP.

8.10.3 Working Principle and Signal FlowThe OU08 consists of the interface module and power supply module.

8.10.4 Front PanelOn the front panel of the OU08, there are interfaces and barcode.

8.10.5 Valid SlotsAs the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.

8.10.6 Technical SpecificationsThe technical specifications of the OU08 cover the optical interface specifications, boarddimensions, weight and power consumption.

8.10.1 Version DescriptionThe OU08 has two versions, N1 and N2. The main difference between the two versions lies inthe connector type for optical interfaces and the pluggability of the optical modules.

Table 8-24 lists the details on the two versions of the OU08 board.

Table 8-24 Version description of the OU08

Item Specification

Functionalversion

The OU08 has two versions, N1 and N2.

Commonness The N1 and N2 versions share the same working principle.




Item Specification

Difference The optical interface of the N1OU08 uses the LC connector. The opticalinterface of the N2OU08 uses the SC connector. The N1OU08 uses thepluggable optical module. The N2OU08 does not use the pluggableoptical module.

Replaceability None.

8.10.2 Function and FeatureThe OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must beused with the SEP.

8.10.3 Working Principle and Signal FlowThe OU08 consists of the interface module and power supply module.

Figure 8-19 shows the block diagram for the functions of the OU08.

Figure 8-19 Block diagram for the functions of the OU08

STM-1(o) SEP

+3.3 V+3.3 V Fuse

SEP

Backplane

Power

Interfacemodule

STM-1(o)

Powersupplymodule

Interface ModuleIn the receive direction, the interface module performs O/E convertion for the STM-1 signals,and transmits the signals to the SEP board.

In the transmit direction, the interface module performs the E/O convertion for the STM-1signals, and transmits the signals to the optical interface.


8.10.4 Front PanelOn the front panel of the OU08, there are interfaces and barcode.



Appearance of the Front PanelFigure 8-20 and Figure 8-21 show the appearance of the front panels of the N1OU08 andN2OU08 respectively.

Figure 8-20 Front panel of the N1OU08

OU08

OU08

OU

T4IN

4O

UT3IN

3O

UT2

IN2

OU

T1IN1

OU

T8IN

8O

UT7IN

7O

UT6IN

6O

UT5IN

5




Figure 8-21 Front panel of the N2OU08

OU08

OU08

IN8

IN7

OU

T8O

UT7

OU

T6IN

6O

UT5

IN5

OU

T4IN

4O

UT3

IN3

OU

T2IN

2O

UT1

IN1

InterfacesThere are eight pairs of optical interfaces on each front panel of the N1OU08 and N2OU08.

Table 8-25 lists the interface type and usage for the N1OU08. Table 8-26 lists the interface typeand usage for the N2OU08.

Table 8-25 Interfaces of the N1OU08


Usage

IN1–IN8 LC Receive eight (1–8) channels of STM-1 optical signals.

OUT1–OUT8 LC Transmit eight (1–8) channels of STM-1 optical signals.



Table 8-26 Interfaces of the N2OU08


Usage

IN1–IN8 SC Receive eight (1–8) channels of STM-1 optical signals.

OUT1–OUT8 SC Transmit eight (1–8) channels of STM-1 optical signals.

8.10.5 Valid SlotsAs the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.

Table 8-27 lists the valid slots for the SEP and corresponding slots for the OU08.

Table 8-27 Valid slots for the SEP and corresponding slots for the OU08

Valid Slot for the SEP Corresponding Slot for the OU08

Slot 12 Slot 14

Slot 13 Slot 16

8.10.6 Technical SpecificationsThe technical specifications of the OU08 cover the optical interface specifications, boarddimensions, weight and power consumption.


Table 8-28 lists the specifications of the optical interfaces of the OU08.

Table 8-28 Specifications of the optical interfaces of the OU08

Item Specification


Line code NRZ

Optical interface type S-1.1

Working wavelength(nm)

N1OU08 (1260–1360)N2OU08 (1261–1360)


Mean launched opticalpower (dBm)

–15 to –8


–28





The mechanical specifications of the OU08 are as follows:


l Weight (kg): 0.4

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the OU08 is 6 W.

8.11 MU04This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of theversion, function, principle, front panel and specifications.

8.11.1 Version DescriptionThe functional version of the MU04 board is N1.

8.11.2 Function and FeatureThe MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 mustbe used with the SPQ4.

8.11.3 Working Principle and Signal FlowThe MU04 consists of the interface module, switch matrix module, and power supply module.

8.11.4 Front PanelOn the front panel of the MU04, there are interfaces and barcode.

8.11.5 Valid SlotsAs the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.

8.11.6 Technical SpecificationsThe technical specifications of the MU04 cover the optical interface specifications, boarddimensions, weight and power consumption.

8.11.1 Version DescriptionThe functional version of the MU04 board is N1.

8.11.2 Function and FeatureThe MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 mustbe used with the SPQ4.

8.11.3 Working Principle and Signal FlowThe MU04 consists of the interface module, switch matrix module, and power supply module.

Figure 8-22 shows the block diagram for the functions of the MU04.



Figure 8-22 Block diagram for the functions of the MU04

+3.3 Vbackeuppower

+3.3 V

TSB8Interfacemodule

Cross-connectboard

Backplane

Powersupplymodule

Swictchmatrix

module

E4/STM-1(e)SPQ4

TSB8

Fuse

E4/STM-1(e) SPQ4

Interface ModuleThe interface module receives and transmits the E4/STM-1 electrical signals.

Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the SPQ4 board. When the TPS protection is performed, theswitch matrix module transmits the signals to the TSB8 board for bridging.



8.11.4 Front PanelOn the front panel of the MU04, there are interfaces and barcode.

Appearance of the Front PanelFigure 8-23 shows the appearance of the front panel of the MU04.




Figure 8-23 Front panel of the MU04

MU04

MU04

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4

InterfacesThere are four pairs of electrical interfaces on the front panel of the MU04.

Table 8-29 lists the type and usage of interfaces on the MU04.

Table 8-29 Interfaces of the MU04


Usage

IN1–IN4 SMB Receive four (1–4) channels of E4/STM-1 electricalinterfaces.

OUT1–OUT4 SMB Transmit four (1–4) channels of E4/STM-1 electricalinterfaces.

8.11.5 Valid SlotsAs the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.

Table 8-30 lists the valid slots for the SPQ4 and corresponding slots for the MU04.



Table 8-30 Valid slots for the SPQ4 and corresponding slots for the MU04

Valid Slot for the SPQ4 Corresponding Slot for the MU04

Slot 12 Slot 14

Slot 13 Slot 16

8.11.6 Technical SpecificationsThe technical specifications of the MU04 cover the optical interface specifications, boarddimensions, weight and power consumption.

Electrical Interface SpecificationsTable 8-31 lists the specifications of the electrical interfaces of the MU04.

Table 8-31 Specifications of the electrical interfaces of the MU04

Item Specification

Interface Type 139264 kbit/s and 155520 kbit/s

Code CMI


Allowed input frequency deviation


Mechanical SpecificationsThe mechanical specifications of the MU04 are as follows:


l Weight (kg): 0.4

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the MU04 is 2 W.

8.12 TSB8This section describes the TSB8, an 8-channel optical interface switching board, in terms of theversion, function, principle, front panel and specifications.

8.12.1 Version DescriptionThe functional version of the TSB8 board is N1.

8.12.2 Function and FeatureThe TSB8, an eight-channel electrical interface switching board, is used to provide the TPSprotection.




8.12.3 Working Principle and Signal FlowThe TSB8 consists of the switch matrix module and power supply module.

8.12.4 Front PanelOn the front panel of the TSB8, there is the barcode.

8.12.5 Valid SlotsWhen used with different processing boards and interface boards to realize the TPS protection,the TSB8 can be housed in different slots. The OptiX OSN 1500A does not support the TSB8.

8.12.6 Technical SpecificationsThe technical specifications of the TSB8 cover the board dimensions, weight and powerconsumption.

8.12.1 Version DescriptionThe functional version of the TSB8 board is N1.

8.12.2 Function and FeatureThe TSB8, an eight-channel electrical interface switching board, is used to provide the TPSprotection.l When used with the MU04, the TSB8 provides the TPS protection for the SPQ4.

l When used with the C34S, the TSB8 provides the TPS protection for the PL3.

l When used with the D34S, the TSB8 provides the TPS protection for the PD3.

l When used with the EU04, the TSB8 provides the TPS protection for the SEP1.

l When used with the EU08, the TSB8 provides the TPS protection for the SLH1/SEP1.

l When used with the ETS8, the TSB8 provides the TPS protection for the EFS0.

8.12.3 Working Principle and Signal FlowThe TSB8 consists of the switch matrix module and power supply module.

Figure 8-24 shows the block diagram for the functions of the TSB8 when it processes one-channel signals.

Figure 8-24 Block diagram for the functions of the TSB8

Standbyprocessing

board

Interfaceboard 1

+3.3 V+3.3

V Fuse

BackplaneBackplaneCross-

connectboard

PowerPowermodule

Swictchmatrix

module

Interfaceboard 2Interfaceboard 3




In the receive direction, the switch matrix module selects signals from one of the three interfaceboards according to the TPS protection control signals from the cross-connect board, and outputsthe signals to the backup processing board.


Power Supply Module


8.12.4 Front PanelOn the front panel of the TSB8, there is the barcode.


Figure 8-25 shows the appearance of the front panel of the TSB8.

Figure 8-25 Front panel of the TSB8

TSB8

TSB8




8.12.5 Valid SlotsWhen used with different processing boards and interface boards to realize the TPS protection,the TSB8 can be housed in different slots. The OptiX OSN 1500A does not support the TSB8.

Table 8-32 lists the valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04.

Table 8-32 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04

Valid Slot for the TSB8 Valid Slot for the SPQ4 Corresponding Slot forthe MU04


Table 8-33 lists the valid slots for the TSB8 and corresponding slots for the PD3 and D34S.

Table 8-33 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S

Valid Slot for the TSB8 Valid Slot for the PD3 Corresponding Slot forthe D34S


Table 8-34 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU04.

Table 8-34 Valid slots for the TSB8 and corresponding slots for the SEP and EU04

Valid Slot for the TSB8 Valid Slot for the SEP Corresponding Slot forthe EU04


Table 8-35 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU08.

Table 8-35 Valid slots for the TSB8 and corresponding slots for the SEP and EU08

Valid Slot for the TSB8 Valid Slot for the SEP Corresponding Slot forthe EU08


NOTE

On the T2000, the SEP is displayed as the SEP or SEP1. When interfaces are available on the front panelof the SEP, the SEP is displayed as the SEP1 on the T2000. When the SEP is used with the interface boardto realize the TPS protection, the SEP is displayed as the SEP on the T2000.

Table 8-36 lists the valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.



Table 8-36 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8

Valid Slot for the TSB8 Valid Slot for the EFS0 Corresponding Slot forthe ETS8


Table 8-37 lists the valid slots for the TSB8 and corresponding slots for the PL3 and C34S.

Table 8-37 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S

Valid Slot for the TSB8 Valid Slot for the PL3 Corresponding Slot forthe C34S


8.12.6 Technical SpecificationsThe technical specifications of the TSB8 cover the board dimensions, weight and powerconsumption.

Mechanical SpecificationsThe mechanical specifications of the TSB8 are as follows:


l Weight (kg): 0.3

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the TSB8 in theswitching state is 5 W and that of the TSB8 in the normal state is 0 W.

8.13 EFF8This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of theversion, function, principle, front panel and specifications.

8.13.1 Version DescriptionThe functional version of the EFF8 board is N1.

8.13.2 Function and FeatureThe EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 mustbe used with the Ethernet processing board.

8.13.3 Working Principle and Signal FlowThe EFF8 consists of the interface module, switch matrix module, and power supply module.

8.13.4 Front PanelOn the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety classlabel.

8.13.5 Valid Slots




When used with different Ethernet processing boards, the EFF8 can be housed in different slots.

8.13.6 Technical SpecificationsThe technical specifications of the EFF8 cover the optical interface specifications, boarddimensions, weight and power consumption.

8.13.1 Version DescriptionThe functional version of the EFF8 board is N1.

8.13.2 Function and FeatureThe EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 mustbe used with the Ethernet processing board.

8.13.3 Working Principle and Signal FlowThe EFF8 consists of the interface module, switch matrix module, and power supply module.

Figure 8-26 shows the block diagram for the functions of the EFF8 when it processes 1 x 100MEthernet signals.

Figure 8-26 Block diagram for the functions of the EFF8

EFT8/ EFS0/EMS4/EMR0

Backplane

+3.3 V Backup Power+3.3 V Fuse

EFT8/EFS0/EMS4/EMR0

100M

100M

moduleInterface

Powermodule

Interface Module

In the receive direction, the interface module performs the O/E convertion for the Ethernetsignals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board.

In the transmit direction, the interface module performs the E/O convertion for the Ethernetsignals, and transmits the signals to the optical interface.

Power Supply Module




8.13.4 Front PanelOn the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety classlabel.


Figure 8-27 shows the appearance of the front panel of the EFF8.

Figure 8-27 Front panel of the EFF8

EFF8

EFF8

LINKACT

12345678

OU

T1IN

1O

UT2

IN2

OU

T3IN

3O

UT4

IN4

OU

T5IN

5O

UT6

IN6

OU

T7IN

7O

UT8

IN8

CLASS 1LASER

PRODUCT

Indicators

For indication of indicators, see A Equipment and Board Alarm Indicators.

Interfaces

There are eight pairs of optical interfaces on the front panel of the EFF8.

Table 8-38 lists the type and usage of interfaces on the EFF8.




Table 8-38 Interfaces of the EFF8


Usage

IN1–IN8 LC Receives eight (1–8) channels of Ethernet optical signals.

OUT1 – OUT8 LC Transmits eight (1–8) channels of Ethernet opticalsignals.

8.13.5 Valid SlotsWhen used with different Ethernet processing boards, the EFF8 can be housed in different slots.

The slots valid for the EFF8 are as follows:

l As the interface board for the EFT8, the EFF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.

l As the interface board for the EFS0, the EFF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.

l As the interface board for the EMS4, the EFF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.

l As the interface board for the EMR0, the EFF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.

Table 8-39 lists the valid slots for the EFT8 and corresponding slots for the EFF8.

Table 8-39 Valid slots for the EFT8 and corresponding slots for the EFF8

Valid Slot for the EFT8 Corresponding Slot for the EFF8



Table 8-40 lists the valid slots for the EFS0 and corresponding slots for the EFF8.

Table 8-40 Valid slots for the EFS0 and corresponding slots for the EFF8

Valid Slot for the EFS0 Corresponding Slot for the EFF8



Table 8-41 lists the valid slots for the EMS4 and corresponding slots for the EFF8.

Table 8-41 Valid slots for the EMS4 and corresponding slots for the EFF8

Valid Slot for the EMS4 Corresponding Slot for the EFF8




Valid Slot for the EMS4 Corresponding Slot for the EFF8


Table 8-42 lists the valid slots for the EMR0 and corresponding slots for the EFF8.

Table 8-42 Valid slots for the EMR0 and corresponding slots for the EFF8

Valid Slot for the EMR0 Corresponding Slot for the EFF8



8.13.6 Technical SpecificationsThe technical specifications of the EFF8 cover the optical interface specifications, boarddimensions, weight and power consumption.


Table 8-43 lists the specifications of the optical interfaces of the EFF8.

Table 8-43 Specifications of the optical interfaces of the EFF8

Item Specification

Nominal bit rate 10 Mbit/s or 100 Mbit/s

Line code Manchester encoding signal (10M) or MLT-3 encoding signal(100M)

Optical interface type 100Base-FX


100Base-FX (15 km): 1261 to 1360

100Base-FX (2 km): 1270 to 1380


Mean launchedoptical power (dBm)

100Base-FX (15 km): –15 to –8

100Base-FX (2 km): –19 to –14


100Base-FX (15 km): –28

100Base-FX (2 km): –30

Min. overload (dBm) 100Base-FX (15 km): –7

100Base-FX (2 km): –14

Min. extinction ratio(dB)

10





The mechanical specifications of the EFF8 are as follows:


l Weight (kg): 0.4

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the EFF8 is 6 W.

8.14 ETF8This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms ofthe version, function, principle, front panel and specifications.

8.14.1 Version DescriptionThe functional version of the ETF8 board is N1.

8.14.2 Function and FeatureThe ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8must be used with the Ethernet processing board.

8.14.3 Working Principle and Signal FlowThe ETF8 consists of the interface module, switch matrix module, and power supply module.

8.14.4 Front PanelOn the front panel of the ETF8, there are interfaces and barcode.

8.14.5 Valid SlotsWhen used with different Ethernet processing boards, the ETF8 can be housed in different slots.

8.14.6 Technical SpecificationsThe technical specifications of the ETF8 cover the electrical interface specifications, boarddimensions, weight and power consumption.

8.14.1 Version DescriptionThe functional version of the ETF8 board is N1.

8.14.2 Function and FeatureThe ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8must be used with the Ethernet processing board.

8.14.3 Working Principle and Signal FlowThe ETF8 consists of the interface module, switch matrix module, and power supply module.

Figure 8-28 shows the block diagram for the functions of the ETF8 when it processes 1 x 100MEthernet signals.



Figure 8-28 Block diagram for the functions of the ETF8

100M EFT8/ EFS0/EMS4/EMR0

+3.3 V+3.3 V Fuse

EFT8/EFS0/EMS4/EMR0100M

Backplane

moduleInterface

Powermodule

Power

Interface ModuleIn the receive direction, the interface module performs the O/E convertion for the Ethernetsignals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board.

In the transmit direction, the interface module performs the E/O convertion for the Ethernetsignals, and transmits the signals to the optical interface.


8.14.4 Front PanelOn the front panel of the ETF8, there are interfaces and barcode.

Appearance of the Front PanelFigure 8-29 shows the appearance of the front panel of the ETF8.




Figure 8-29 Front panel of the ETF8

ETF8

ETF8

FE1FE2

FE3FE4

FE5FE6

FE7FE8

InterfacesThere are eight electrical interfaces on the front panel of the ETF8.

Table 8-44 lists the type and usage of interfaces on the ETF8.

Table 8-44 Interfaces of the ETF8


Usage

FE1–FE8 RJ-45 Receive eight (1–8) channels of Ethernet electricalsignals.

Table 8-45 lists the pins of the RJ-45 connector of the ETF8.



Table 8-45 Pins of the RJ-45 connector of the ETF8

Front View Pin Specification

8 7 6 5 4 3 2 1

1 Transmittingpositive

2 Transmittingnegative


4 Grounding

5 Grounding

6 Receivingnegative

7 Grounding

8 Grounding

8.14.5 Valid SlotsWhen used with different Ethernet processing boards, the ETF8 can be housed in different slots.

The slots valid for the ETF8 are as follows:

l As the interface board for the EFT8, the ETF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.

l As the interface board for the EFS0, the ETF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.

l As the interface board for the EMS4, the ETF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.

l As the interface board for the EMR0, the ETF8 can be housed in any of slots 14–17 in theOptiX OSN 1500B subrack.

Table 8-46 lists the valid slots for the EFT8 and corresponding slots for the ETF8.

Table 8-46 Valid slots for the EFT8 and corresponding slots for the ETF8

Valid Slot for the EFT8 Corresponding Slot for the ETF8



Table 8-47 lists the valid slots for the EFS0 and corresponding slots for the ETF8.




Table 8-47 Valid slots for the EFS0 and corresponding slots for the ETF8

Valid Slot for the EFS0 Corresponding Slot for the ETF8



Table 8-48 lists the valid slots for the EMS4 and corresponding slots for the ETF8.

Table 8-48 Valid slots for the EMS4 and corresponding slots for the ETF8

Valid Slot for the EMS4 Corresponding Slot for the ETF8



Table 8-49 lists the valid slots for the EMR0 and corresponding slots for the ETF8.

Table 8-49 Valid slots for the EMR0 and corresponding slots for the ETF8

Valid Slot for the EMR0 Corresponding Slot for the ETF8



8.14.6 Technical SpecificationsThe technical specifications of the ETF8 cover the electrical interface specifications, boarddimensions, weight and power consumption.

Electrical Interface SpecificationsTable 8-50 lists the specifications of the electrical interfaces of the ETF8.

Table 8-50 Specifications of the electrical interfaces of the ETF8

Item Specification

Rate 10 Mbit/s or 100 Mbit/s

Code Manchester encoding signal (10M) or MLT-3 encoding signal(100M)

Interface standard Compliant with IEEE 802.3u

Mechanical SpecificationsThe mechanical specifications of the ETF8 are as follows:




l Weight (kg): 0.4

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the ETF8 is 2 W.

8.15 ETS8This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board,in terms of the version, function, principle, front panel and specifications.

8.15.1 Version DescriptionThe functional version of the ETS8 board is N1.

8.15.2 Function and FeatureThe ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, andthe ETS8 must be used with the EFS0.

8.15.3 Working Principle and Signal FlowThe ETS8 consists of the interface module, switch matrix module, and power supply module.

8.15.4 Front PanelOn the front panel of the ETS8, there are interfaces and barcode.

8.15.5 Valid SlotsAs the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.

8.15.6 Technical SpecificationsThe technical specifications of the ETS8 cover the electrical interface specifications, boarddimensions, weight and power consumption.

8.15.1 Version DescriptionThe functional version of the ETS8 board is N1.

8.15.2 Function and FeatureThe ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, andthe ETS8 must be used with the EFS0.

8.15.3 Working Principle and Signal FlowThe ETS8 consists of the interface module, switch matrix module, and power supply module.

Figure 8-30 shows the block diagram for the functions of the ETS8 when it processes 1 x 100MEthernet signals.




Figure 8-30 Block diagram for the functions of the ETS8

+3.3 Vbackeuppower

+3.3 V

TSB8Interfacemodule

Cross-connectboard

Backplane

Powersupplymodule

Swictchmatrix

module

100MEFS0

TSB8

Fuse

100M EFS0

Interface ModuleThe interface module receives and transmits the Ethernet optical signals.

Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the EFS0 board. When the TPS protection is performed, theswitch matrix module transmits the signals to the TSB8 board for bridging.



8.15.4 Front PanelOn the front panel of the ETS8, there are interfaces and barcode.

Appearance of the Front PanelFigure 8-31 shows the appearance of the front panel of the ETS8.



Figure 8-31 Front panel of the ETS8

ETS8

ETS8

FE1FE2

FE3FE4

FE5FE6

FE7FE8

InterfacesThere are eight electrical interfaces on the front panel of the ETS8.

Table 8-51 lists the type and usage of interfaces on the ETS8.

Table 8-51 Interfaces of the ETS8


Usage

FE1–FE8 RJ-45 Receive eight (1–8) channels of Ethernet electricalsignals.

Table 8-52 lists the pins of the RJ-45 connector of the ETS8.




Table 8-52 Pins of the RJ-45 connector of the ETS8

Front View Pin Specification

8 7 6 5 4 3 2 1




4 Grounding

5 Grounding


7 Grounding

8 Grounding

8.15.5 Valid SlotsAs the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in theOptiX OSN 1500B subrack.

Table 8-53 lists the valid slots for the EFS0 and corresponding slots for the ETS8.

Table 8-53 Valid slots for the EFS0 and corresponding slots for the ETS8

Valid Slot for the EFS0 Corresponding Slot for the ETS8

Slot 12 Slot 14

Slot 13 Slot 16

8.15.6 Technical SpecificationsThe technical specifications of the ETS8 cover the electrical interface specifications, boarddimensions, weight and power consumption.


Table 8-54 lists the specifications of the electrical interfaces of the ETS8.

Table 8-54 Specifications of the electrical interfaces of the ETS8

Item Specification

Rate 10 Mbit/s or 100 Mbit/s

Code Manchester encoding signal (10M) or MLT-3 encodingsignal (100M)

Interface standard Compliant with IEEE 802.3u




The mechanical specifications of the ETS8 are as follows:


l Weight (kg): 0.37

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the ETS8 in the switchingstate is 3 W and that of the ETS8 in the normal state is 0 W.

8.16 DM12This section describes the DM12, a DDN interface board, in terms of the version, function,principle, front panel and specifications.

8.16.1 Version DescriptionThe functional version of the DM12 board is N1.

8.16.2 Function and FeatureThe DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1electrical signals, and the DM12 must be used with the DX1.

8.16.3 Working Principle and Signal FlowThe DM12 consists of the interface module, switch matrix module, and power supply module.

8.16.4 Front PanelOn the front panel of the DM12, there are interfaces and barcode.

8.16.5 Valid SlotsAs the interface board for the DX1, the DM12 can be housed in any of slots 14–17 in the OptiXOSN 1500B subrack.

8.16.6 Technical SpecificationsThe technical specifications of the DM12 cover the board dimensions, weight and powerconsumption.

8.16.1 Version DescriptionThe functional version of the DM12 board is N1.

8.16.2 Function and FeatureThe DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1electrical signals, and the DM12 must be used with the DX1.

8.16.3 Working Principle and Signal FlowThe DM12 consists of the interface module, switch matrix module, and power supply module.

Figure 8-32 shows the block diagram for the functions of the DM12 when it processes onechannel of N x 64 kbit/s or framed E1 electrical signals.




Figure 8-32 Block diagram for the functions of the DM12

Nx64kbit/s /Frame E1

DX1

+3.3 V+3.3 V Fuse

DX1

Nx64kbit/s /Frame E1

Interfacemodule

Swictchmatrix

module

Power

Cross-connectboard

Backplane

Powersupplymodule

Interface ModuleThe interface module receives and transmits one channel of N x 64 kbit/s or framed E1 electricalsignals.

Switch Matrix ModuleIn the receive direction, the switch matrix module accesses signals from the interface module,and selects the output direction of the signals according to the TPS protection control signalsfrom the cross-connect board. When the TPS protection is not performed, the switch matrixmodule transmits the signals to the DX1 board. When the TPS protection is performed, the switchmatrix module transmits the signals to the DX1 board for bridging.



8.16.4 Front PanelOn the front panel of the DM12, there are interfaces and barcode.

Appearance of the Front PanelFigure 8-33 shows the appearance of the front panel of the DM12.



Figure 8-33 Front panel of the DM12

DM12

DM12

DD

N1

DD

N2

DD

N3

DD

N4

E1(1-8)

InterfacesOn the front panel of the DM12, there are DB44 and DB28 interfaces. Table 8-55 lists thespecifications of the interfaces.

Table 8-55 Interfaces on the front panel of the DM12


Usage

E1 (1–8) DB44 Access 8 x framed E1 signals.

DDN1–DDN4 DB28 Access four channels of N x 64 kbit/s signals.





Table 8-56 Pins of the DB44 interfaces of the DM12

Front View Pin Specification Pin Specification

1

44

30 T1 to transmitthe first channelof signals.


29 T2 to transmitthe secondchannel ofsignals.

36 R3 to receive thethird channel ofsignals.14 21

28 T3 to transmitthe third channelof signals.

35 R4 to receive thefourth channel ofsiganls.13 20

27 T4 to transmitthe fourthchannel ofsignals.

34 R5 to receive thefifth channel ofsignals.12 19

26 T5 to transmitthe fifth channelof signals.

33 R6 to receive thesixth channel ofsignals.11 18

25 T6 to transmitthe sixth channelof signals.


24 T7 to transmitthe seventhchannel ofsignals.



44–39, 6–1 Grounding

23

37 R2 to receive thesecond channelof signals.22




Table 8-57 Pins of the DB28 interfaces of the DM12

Front View Pin Specification Pin Specification

1

28

1 Transmits datasignals.

19 Receives data signals.

2 20

3 Transmits theclock signals.

21 Grounds.

4 22 Loopbacks thecontrol signals.

11 Detects thecarrier.

23 Permits thetransmission.

12 24

13 Requests fortransmission.

25 Prepares theterminatingequipment.14 26

15 Transmits theclock of theexternalequipment.

27 Prepares the terminalequipment.

16 28

17 Receives theclock signals.

- -

18

8.16.5 Valid SlotsAs the interface board for the DX1, the DM12 can be housed in any of slots 14–17 in the OptiXOSN 1500B subrack.

Table 8-58 lists the valid slots for the DX1 and corresponding slots for the DM12. The DM12housed in the slot with a smaller number accesses the 8 x framed E1 signals and four channelsof N x 64 kbit/s signals. The DM12 housed in the slot with a larger number accesses only fourchannels of N x 64 kbit/s signals.

Table 8-58 Valid slots for the DX1 and corresponding slots for the DM12

Valid Slot for the DX1 Corresponding Slot for the DM12



8.16.6 Technical SpecificationsThe technical specifications of the DM12 cover the board dimensions, weight and powerconsumption.

Mechanical SpecificationsThe mechanical specifications of the DM12 are as follows:





l Weight (kg): 0.5

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the DM12 in theswitching state is 8 W and that of the DM12 in the normal state is 0 W.



9 Cross-Connect and System Control Boards

About This Chapter

The chapter describes the integrated boards of the cross-connect, SCC and line units at differentrates.

9.1 CXL1This section describes the CXL1, an integrated board of the SCC, cross-connect and line units,in terms of the version, principle, function, principle, front panel and specifications.



OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 9 Cross-Connect and System Control Boards



9.1.1 Version DescriptionThe functional version of the CXL1 is Q2. The Q1CXL1 is not manufactured any more. TheOptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL1.

9.1.2 Function and FeatureThe CXL1 is used to process SDH signals, control communication, groom services, and to inputand output the clock.

9.1.3 Working Principle and Signal FlowThe CXL1 consists of the SDH overhead processing module, RST, MST and so on.

9.1.4 Front PanelOn the front panel of the CXL1, there are indicators, interfaces, barcode and laser safety classlabel.

9.1.5 Valid SlotsThe CXL1 can be housed in any of slots 4–5 in the subrack.

9.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the CXL1 indicates the optical interface type.

9.1.7 Board Configuration ReferenceThe physical slot that houses the CXL1 is different from the logical slot displayed on the T2000.You can use the T2000 to set parameters for the CXL1.

9.1.8 Technical SpecificationsThe technical specifications of the CXL1 cover the optical interface specifications, boarddimensions, weight and power consumption.



SDH Processing UnitTable 9-1 lists the function and feature of the SDH processing unit of the CXL1.

9 Cross-Connect and System Control BoardsOptiX OSN 1500 Intelligent Optical Transmission System



Table 9-1 Function and feature of the SDH processing unit of the CXL1

Function andFeature

CXL1



Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, andVe-1.2 types.


l Supports detection and query of the information on the opticalmodule.

l Supports the function of setting the on/off state of the laser and theALS function.

Service processing Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing l Supports the processing of the SOH bytes of the STM-1 signals.

l Supports the transparent transmission and termination of the POHbytes. Supports the setting and query of the J0/J1/C2 bytes.



Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSPprotection ring, linear MSP protection, and SNCP.

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports the warm reset and cold reset. The warm reset does notaffect services.

l Supports the function of querying the manufacturing informationof the board.

l Supports the in-service loading of the FPGA.

l Supports the upgrade of the board software without affectingservices.

SCC UnitTable 9-2 lists the function and feature of the SCC unit of the CXL1.

Table 9-2 Function and feature of the SCC unit of the CXL1

Function andFeature

CXL1

Basic function Configures and monitors services, monitors the service performance,and collects performance events and alarm information.



Function andFeature

CXL1


l Provides 10M/100M compatible Ethernet NMS interface.

l Provides the F&f interface to manage the COA, and the F&finterface is present on the auxiliary interface board.

l Provides one 10M/100M Ethernet interface, which is used forinter-board communication.

l Provides one 10M Ethernet interface, which is used forcommunication between the active and standby SCC boards.

l Provides the RS232 OAM interface that is present on the auxiliaryinterface board to connect to the PC or workstation. Supports theremote maintenance by using the RS232 DCE modem.

DCC processingcapability

Processes 40-channel DCC.

Fan alarmmanagement

Manages fan alarms.

PIU management Provides the in-service check function for the PIU board, and thefailure check function for the lightning protection module of the PIU.

Protection scheme Supports 1+1 hot backup for the SCC unit.

Cross-Connect UnitTable 9-3 lists the function and feature of the cross-connect unit of the CXL1.

Table 9-3 Function and feature of the cross-connect unit of the CXL1

Function andFeature

CXL1

Basic function Completes 20 Gbit/s non-blocking full cross-connection at the VC-4level, and 20 Gbit/s non-blocking full cross-connection at the VC-12or VC-3 level.

Fast emergencychannel

Provides two 4M HDLC fast emergency channels, which are used forthe MSP and SNCP protection switching.

Service processing l Dynamically grooms services.

l Adds or deletes services without interrupting services.

l Supports the SNCP protection at the VC-3 and VC-12 levels.

l Supports concatenation services at the VC-4-4c, VC-4-8c, andVC-4-16c levels.

Protection scheme Supports the 1+1 hot backup (non-revertive) for the cross-connectunit.




Clock UnitTable 9-4 lists the function and feature of the clock unit of the CXL1.

Table 9-4 Function and feature of the clock unit of the CXL1

Function andFeature

CXL1

Basic function Provides standard system synchronization clock.

Other function Supports the extraction, insertion and management of the SSM andclock ID.

Input and output l Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, andselects the external timing source.

l Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.


Figure 9-1 shows the block diagram for the functions of the CXL1.



Figure 9-1 Block diagram for the functions of the CXL1

STM-1DEMUX

MUX

Cross-connectunit B

16x155Mbit/s data

16x155Mbit/s data


K1/K2insertion/extration SCC unit

Per

form

ance

repo

rt

Lase

r shu

t dow

n

high speed bus

RST MST MSA HPTO/E

O/E

-48 V/-60V

Fuse

DC/DCconverter

Cross-connectunit A

high speed bus

155 MHz

XC Cross Connect

(HPC)

Another CXL

ETH interface

OAM interface

Boot ROM NVRAMRAMFLASH

K1/K2 bytesprocess

Other unit


Laser control

Another CXLunit

Anotherconnect unit

DCC

DCCK1/K2 bytes

XC Cross Connect

(LPC)

155MHz PLL

high speed bus

+1.6V

+1.8V

+1.2V

DCCprocess

STM-1

Pow

er m

onito

r

Master and slaver board comunication

ETH channels comunication

-48 V/-60V

AUX

AUX

+5V

Line unit

F&f interface

Phone interface

S1-S4 interfaceEOW

Time &synchronizaton

(SETS)

SETG

38MHzOSC

Line units

Tributary units

Frame header

T1

T2

T3

T0

AUX

T0 (reference clock)

T4(Clock external output)

PIU

Service units

Service units

+3.3 V DC/DCconverter

high speed bus


Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit andthe cross-connect unit in central timing distribution mode. This unit also selects one from 12reference clock sources as the reference clock for synchronous timing. The 12 reference clocksources are from the line board (T1), the tributary board (T2), the external synchronous clocksource (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronoussource (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active andthe standby boards tracing the same reference source to ensure the identity between the systemclocks of the active and the standby boards.

The synchronous timing unit can extract timing from three types of timing signal:




l Timing signal (T1) from STM-N

l Timing signal (T2) from PDH

l Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l T0, system clock (38 MHz)

l T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Modulel In receive direction, it converts the received optical signals into electrical signals.

l In transmit direction, it converts the electrical signals into SDH optical signals, and thensend optical signals to fibers for transmission.

l The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Modulel In receive direction, the DEMUX part demultiplexes the high rate electrical signals into


l In transmit direction, the MUX part multiplexes the parallel electrical signals received fromthe SDH overhead processing module into high rate electrical signals.


It includes RST, MST, MSA and HPT, provides inloop and outloop function.

RSTl In receiving direction, performs frame alignment detection (A1, A2), regenerator section

trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l In transmitting direction, it performs frame alignment insertion, regenerator section pathtrace insertion, BIP-8 calculation and insertion.

MSTl In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI

and MS_AIS detection.

l In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDIand MS_AIS insertion.


MSAl In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,

pointer justification.

l In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AISgeneration.



HPTl OH termination



l HP_RDI detection (path status monitoring



Communication and Control Modulel Traces the clock signal from the active and the standby cross-connect unit.




l CPU control unit, which controls and monitors other function modules. The unit alsoinitializes other function modules after power on.

l ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.

l OAM interface, which provides serial port for network management. This port can be usedas the MODEM port and thus can be configured as a serial port to connect to MODEM portin running state.

l F&f interface, which provides F&f interface to manage COA. This serial port multiplexeswith the commissioning serial port and is the commissioning serial port in BIOS state.

l COM interface for commissioning port

l Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the activeand the standby CXL unit.

Cross-connect ModuleThe cross-connect module consists of two parts:

l SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCPswitching

l Higher and lower order cross-connect module, which performs the functions of higher andlower order cross-connect units. This module consists of higher order cross-connect unitand lower order cross-connect unit.

Figure 9-2 illustrates the block diagram of higher and lower order cross-connect modules.




Figure 9-2 Block diagram of higher and lower order cross-connect modules

Data DataInputinterface

VC_DATA_FIFO RX_TOP

high speed bus

Lower orderconnection

XC_TOP

Higher orderconnection

XCconnection

Ouputinterface

TX_TOP

high speed bus

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higherorder services with VC-4 as the minimum service grooming granularity.

The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower orderservices.

Other Functionsl Responses to and processes k bytes

l Collects performance data of the optical module and shuts output of the optical module

l Collects and processes DCC of each board

l Inserts the DCC back into each line board after processing

l Monitors the power supply of the board

l Resets the unit

l Cuts alarms

DC/DC Converter ModuleThis module provides the board with required DC voltages. It converts the –48/–60 V powersupply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.


Appearance of the Front PanelFigure 9-3 shows the front panel of the CXL1.



Figure 9-3 Front panel of the CXL1

CXL1

CXL1STATACTXACTCPROGSRVXSRVLSYNCALMC

CLASS 1LASER

PRODUCT

RESET

ALM CUT

OU

TIN

Indicators



l Activating state indicator for the services at the cross-connect unit (ACTX), which is greenwhen lit.

l Active/standby state indicator for the SCC units (ACTC), which is green when lit.


l Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellowwhen lit.

l Alarm indicator (SRVL) for services at the line units , which is red, green or yellow whenlit.

l Synchronization clock state indicator (SYNC), which is red or green when lit.

l Alarm cutting indicator (ALMC), which is yellow when lit.


Interfaces

On the front panel of the CXL1, there are one optical interface and two switches. Table 9-5 liststhe type and usage of the optical interface and switches on the CXL1.




Table 9-5 Optical interface and switches on the CXL1


Usage

IN LC Receives optical signals. The pluggable optical module isused for easy maintenance.

OUT LC Transmits optical signals. The pluggable optical module isused for easy maintenance.

RESET Warm resetswitch

Press the switch to reset the SCC unit.

ALM CUT Alarm cutswitch

Press the switch to mute the alarm. Press the switch for threeseconds to mute the alarm permanently. Press the switchagain for three seconds to resume the alarm sound.



Table 9-6 lists the relation between the board feature code and optical interface type for theCXL1.



SSQ2CXL110 orSSQ1CXL110

10 S-1.1 (LC)


11 L-1.1 (LC)


12 L-1.2 (LC)


13 Ve-1.2 (LC)


14 I-1 (LC)




Displayed SlotThe CXL1 is housed in one slot in the subrack.

The logical boards for the CXL1 are the Q1SL1, EXCL and GSCC.

Table 9-7 lists the logical slots displayed on the T2000.

Table 9-7 Logical slots displayed on the T2000 for the CXL1

Board Logical Board Logical Slot

CXL1 Q1SL1 Slots 4–5

ECXL Slots 80–81

GSCC Slots 82–83

Board Parametersl J1 byte

l C2 byte

l Clock parameters



Optical Interface SpecificationsTable 9-8 lists the specifications of the optical interfaces of the CXL1.

Table 9-8 Specifications of the optical interfaces of the CXL1

Item Specification


Line code NRZ


I-1 S-1.1 L-1.1 L-1.2 Ve-1.2


1260 to1360

1261 to1360

1263 to1360

1480 to1580

1480 to1580

Optical sourcetype

MLM, LED MLM MLM, SLM SLM SLM

Mean launchedoptical power(dBm)

–15 to –8 –15 to –8 –5 to 0 –5 to 0 –3 to 0




Item Specification


–23 –28 –34 –34 –34

Min. overload(dBm)

–8 –8 –10 –10 –10


8.2 8.2 10 10 10

Cross-Connect CapacityThe cross-connect capacity of the CXL1 is as follows:

l Higher order cross-connect capacity: 20 Gbit/s

l Lower order cross-connect capacity: 20 Gbit/s

l Access capacity: 18.75 Gbit/s

Clock Access CapabilityThe clock access capability of the CXL1 is described as follows:

l External input clock: two channels, 2048 kbit/s or 2048 kHz

l External output clock: two channels, 2048 kbit/s or 2048 kHz



Mechanical SpecificationsThe mechanical specifications of the CXL1 are as follows:


l Weight (kg): 1.1

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the CXL1 is 40 W.














SDH Processing Unit

Table 9-9 lists the function and feature of the SDH processing unit of the CXL4.


Function andFeature

CXL4


Specifications ofoptical interfaces

Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, andVe-4.2 types.

Specifications of theoptical module






Function andFeature

CXL4

Service processing Supports VC-12, VC-3, and VC-4 services and VC-4-4cconcatenation services.



Alarms andperformance events


Protection schemes Supports the two-fiber MSP protection ring, four-fiber MSPprotection ring, linear MSP protection, and SNCP.

Maintenancefeatures

l Supports inloop and outloop for optical interfaces.

l Supports warm reset and cold reset. The warm reset does not affectservices.




SCC UnitTable 9-10 lists the function and feature of the SCC unit of the CXL4


Function andFeature

CXL4

Basic function Configures and monitors services, monitors the service performance,and collencts performance events and alarm information.



l Provides the F&f interface to manage the COA, and the F&finterface is on the auxiliary interface board.



l Provides the RS232 OAM interface that is present on on theauxiliary interface board to connect to the PC or workstation.Supports the remote maintenance by using the RS232 DCEmodem.





Function andFeature

CXL4

Fan alarmmanagement

Manages fan alarms.



Cross-Connect Unit

Table 9-11 lists the function and feature of the cross-connect unit of the CXL4.


Function andFeature

CXL4




Service processing l Dynamically grooms services.



l Supports concatenation services at the VC-4-4c level.


Clock Unit

Table 9-12 lists the function and feature of the clock unit of the CXL4.


Function andFeature

CXL4











STM-4DEMUX

MUX

Cross-connectunit B

16x155Mbit/s data

16x155Mbit/s data



Per

form

ance

repo

rt

Lase

r shu

t dow

n

high speed bus

RST MST MSA HPTO/E

O/E

-48 V/-60V

Fuse

DC/DCconverter

Cross-connectunit A

high speed bus

155 MHz

XC Cross Connect

(HPC)

Another CXL

ETH interface

OAM interface


K1/K2 bytesprocess

Other unit


Laser control

Another CXLunit

Anotherconnect unit

DCC

DCCK1/K2 bytes

XC Cross Connect

(LPC)

155MHz PLL

high speed bus

+1.6V

+1.8V

+1.2V

DCCprocess

STM-4

Pow

er m

onito

r



-48 V/-60V

AUX

AUX

+5V

Line unit

F&f interface

Phone interface

S1-S4 interfaceEOW


(SETS)

SETG

38MHzOSC

Line units

Tributary units

Frame header

T1

T2

T3

T0

AUX



PIU

Service units

Service units


high speed bus


Synchronous Timing UnitThe synchronous timing unit provides system clock T0 to the service board, the control unit andthe cross-connect unit in central timing distribution mode. This unit also selects one from 12reference clock sources as the reference clock for synchronous timing. The 12 reference clocksources are from the line board (T1), the tributary board (T2), the external synchronous clocksource (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous



source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active andthe standby boards tracing the same reference source to ensure the identity between the systemclocks of the active and the standby boards.












multiple parallel electrical signals, and recovery the clock signal at the same time.l In transmit direction, the MUX part multiplexes the parallel electrical signals received from

the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing ModuleIt includes RST, MST, MSA and HPT, provides inloop and outloop function.


trace recovery (J0) and mismatch detection, BIP-8 errored block count.l In transmitting direction, it performs frame alignment insertion, regenerator section path



and MS_AIS detection.l In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI

and MS_AIS insertion.l Provides extraction or insertion of K1 byte and K2 byte.


pointer justification.




l In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AISgeneration.

HPTl OH termination
























VC_DATA_FIFO RX_TOP

high speed bus


XC_TOP


XCconnection

Ouputinterface

TX_TOP

high speed bus








l Resets the unit

l Cuts alarms

DC/DC Converter ModuleThis module provides the board with required DC voltages. It converts the –48/–60 V powersupply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.







CXL4


CLASS 1LASER

PRODUCT

RESET

ALM CUT

OU

TIN











InterfacesOn the front panel of the CXL4, there are one optical interface and two switches. Table 9-13lists the type and usage of the optical interface and switches on the CXL4.





Usage













10 S-4.1 (LC)


11 L-4.1 (LC)


12 L-4.2 (LC)


13 Ve-4.2 (LC)


14 I-4 (LC)











ECXL Slots 80–81

GSCC Slots 82–83


l C2 byte

l Clock parameters



Optical Interface SpecificationsTable 9-16 lists the specifications of the optical interfaces of the CXL4.


Item Specification


Line code NRZ


I-4 S-4.1 L-4.1 L-4.2 Ve-4.2


1261 to1360

1274 to1356

1280 to1335

1480 to1580

1480 to1580

Optical sourcetype

MLM MLM SLM SLM SLM


–15 to –8 –15 to –8 –3 to –2 –3 to –2 –3 to –2



Item Specification


–23 –28 –28 –28 –34

Min. overload(dBm)

–8 –8 –8 –8 –13


8.2 8.2 10 10 10.5

Cross-Connect CapacityThe cross-connect capacity of the CXL4 is described as follows:











l Weight (kg): 1.1



9.3.1 Version DescriptionThe functional version of the CXL16 is Q2. The Q1CXL16 is not manufactured any more. TheOptiX OSN NG-SDH equipment of V100R004 and later versions does not support theQ1CXL16.




9.3.2 Function and FeatureThe CXL16 is used to process SDH signals, control communication, groom services, and toinput and output the clock.







9.3.1 Version DescriptionThe functional version of the CXL16 is Q2. The Q1CXL16 is not manufactured any more. TheOptiX OSN NG-SDH equipment of V100R004 and later versions does not support theQ1CXL16.

9.3.2 Function and FeatureThe CXL16 is used to process SDH signals, control communication, groom services, and toinput and output the clock.

SDH Processing Unit

Table 9-17 lists the function and feature of the SDH processing unit of the CXL16.


Function andFeature

CXL16



Supports the optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2types.






Function andFeature

CXL16

Service processing Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c,and VC-4-16c concatenation services.





Protection scheme Supports the two-fiber MSP protection ring, four-fiber MSPprotection ring, linear MSP protection, and SNCP.

Maintenance feature l Supports inloop and outloop for optical interfaces.

l Supports warm reset and cold reset. The warm reset does not affectservices.




SCC UnitTable 9-18 lists the function and feature of the SCC unit of the CXL16


Function andFeature

CXL16

Basic function Configures and monitors services, monitors the service performance,and collects performance events and alarm information.



l Provides the F&f interface to manage the COA, and the F&finterface is on the auxiliary interface board.



l Provides the RS232 OAM interface that is present on on theauxiliary interface board to connect to the PC or workstation.Supports the remote maintenance by using the RS232 DCEmodem.






Function andFeature

CXL16

Fan alarmmanagement

Manages fan alarms.



Cross-Connect UnitTable 9-19 lists the function and feature of the cross-connect unit of the CXL16.


Function andFeature

CXL16




Service processing l Dynamically grooms services, such as the cross-connect andbroadcast services.



l Supports concatenation services at the VC-4-4c, VC-4-8c, andVC-4-16c levels.


Clock UnitTable 9-20 lists the function and feature of the clock unit of the CXL16.


Function andFeature

CXL16





Function andFeature

CXL16






STM-16DEMUX

MUX

Cross-connectunit B

16x155Mbit/s data

16x155Mbit/s data



Per

form

ance

repo

rt

Lase

r shu

t dow

n

high speed bus

RST MST MSA HPTO/E

O/E

-48 V/-60V

Fuse

DC/DCconverter

Cross-connectunit A

high speed bus

155 MHz

XC Cross Connect

(HPC)

Another CXL

ETH interface

OAM interface


K1/K2 bytesprocess

Other unit


Laser control

Another CXLunit

Anotherconnect unit

DCC

DCCK1/K2 bytes

XC Cross Connect

(LPC)

155MHz PLL

high speed bus

+1.6V

+1.8V

+1.2V

DCCprocess

STM-16

Pow

er m

onito

r



-48 V/-60V

AUX

AUX

+5V

Line unit

F&f interface

Phone interface

S1-S4 interfaceEOW


(SETS)

SETG

38MHzOSC

Line units

Tributary units

Frame header

T1

T2

T3

T0

AUX



PIU

Service units

Service units


high speed bus





Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit andthe cross-connect unit in central timing distribution mode. This unit also selects one from 12reference clock sources as the reference clock for synchronous timing. The 12 reference clocksources are from the line board (T1), the tributary board (T2), the external synchronous clocksource (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronoussource (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active andthe standby boards tracing the same reference source to ensure the identity between the systemclocks of the active and the standby boards.













l In transmit direction, the MUX part multiplexes the parallel electrical signals received fromthe SDH overhead processing module into high rate electrical signals.


It includes RST, MST, MSA and HPT, provides inloop and outloop function.


trace recovery (J0) and mismatch detection, BIP-8 errored block count.

l In transmitting direction, it performs frame alignment insertion, regenerator section pathtrace insertion, BIP-8 calculation and insertion.


and MS_AIS detection.



l In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDIand MS_AIS insertion.



pointer justification.l In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS

generation.

HPTl OH termination

























VC_DATA_FIFO RX_TOP

high speed bus


XC_TOP


XCconnection

Ouputinterface

TX_TOP

high speed bus








l Resets the unit

l Cuts alarms

DC Converter ModuleThis module provides the board with required DC voltages. It converts the –48/–60 V powersupply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.






CXL16


CLASS 1LASER

PRODUCT

OU

TIN

RESET

ALM CUT

Indicators














InterfacesOn the front panel of the CXL16, there are one optical interface and two switches. Table 9-21lists the type and usage of the optical interface and switches on the CXL16.



Usage












SSQ2CXL1601 01 I-16

SSQ2CXL1602 02 S-16.1

SSQ2CXL1603 03 L-16.1

SSQ2CXL1604 04 L-16.2










ECXL Slots 80–81

GSCC Slots 82–83


l C2 byte

l Clock parameters




Table 9-24 lists the specifications of the optical interfaces of the CXL16.


Item Specification


Line code NRZ


I-16 S-16.1 L-16.1 L-16.2


1266 to 1360 1260 to 1360 1280 to 1335 1500 to 1580

Optical sourcetype

MLM SLM SLM SLM


–10 to –3 –5 to 0 –2 to 3 –2 to 3


–18 –18 –27 –28




Item Specification

Min. overload(dBm)

–3 0 –9 –9


8.2 8.2 8.2 8.2

Cross-Connect CapacityThe cross-connect capacity of the CXL16 described as follows:











l Weight (kg): 1.1




10 Auxiliary Boards

About This Chapter

This chapter describes the auxiliary boards, such as the EOW, AUX, AMU, and FANA.

10.1 EOWThis section describes the EOW, an orderwire processing board, in terms of the version, function,principle, front panel and specifications.

10.2 AUXThis section describes the AUX, a system auxiliary interface board, in terms of the version,function, working principle, front panel and specifications.

10.3 AMUThis section describes the AMU, an orderwire processing and alarm concatenation board, interms of the version, function, principle, front panel and specifications.

10.4 FANThis section describes the FAN, a fan control board, in terms of the version, function, principle,front panel, configuration and specifications.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 10 Auxiliary Boards


10.1 EOWThis section describes the EOW, an orderwire processing board, in terms of the version, function,principle, front panel and specifications.

10.1.1 Version DescriptionThe functional version of the EOW is R1.

10.1.2 Function and FeatureThe EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other databytes.

10.1.3 Working Principle and Signal FlowThe EOW consists of the clock module, switch module, OHP module, and DC/DC convertermodule.

10.1.4 Front PanelOn the front panel of the EOW, there are indicators and interfaces.

10.1.5 Valid SlotsThe EOW can be housed in slot 9 in the subrack.

10.1.6 Technical SpecificationsThe technical specifications of the EOW cover the board dimensions, weight and powerconsumption.

10.1.1 Version DescriptionThe functional version of the EOW is R1.

10.1.2 Function and FeatureThe EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other databytes.

Table 10-1 lists the functions and features of the EOW.

Table 10-1 Functions and features of the EOW

Function andFeature

EOW

Auxiliary interface Provides four broadcast data interfaces (Serial 1–4).

Orderwire interface Provides one orderwire interface.

Overheadprocessing

Processes the E1, E2, and Serial 1–4 bytes.

10.1.3 Working Principle and Signal FlowThe EOW consists of the clock module, switch module, OHP module, and DC/DC convertermodule.

10 Auxiliary BoardsOptiX OSN 1500 Intelligent Optical Transmission System



Figure 10-1 shows the block diagram for the functions of the EOW.

Figure 10-1 Block diagram for the functions of the EOW

S1~S4interface

Phone interface

Clockmodule


SwitchmoduleOHP module

S1~S4

E1/E2

+3.3 V backuppower from AUX

+5 V

+1.8 V

+3.3 V -48 V/ -60 VFuse

-48 V/ -60 V

Fuse

+3.3 V

DC/DCconverter

DC/DCconverter

SLIC

CXL unit A/B

CXL unit A/B

Clock ModuleThe clock module first divides frequencies of the system clock and header sent from the cross-connect board. The system clock and header are then transmitted to other modules as OHPProcess module and the switch module.

Switch ModuleThe switch module performs non-blocking switching of 4096 x 4096 or 1024 x 1024 timeslotsunder control of micro processor. The switch module can switch any timeslot of overhead signalsent from the SCC to any timeslot of output overhead signals.

OHP Modulel Processes E1 and E2 bytes sent by the CXL board.

l Realizes interconnection between orderwire audio interface.

l Interconnects with orderwire phone port through SLIC unit.

l Processes serial1–serial4 sent from the CXL board.

l Provides S1–S4 as RS232/RS422 serial transparent data interfaces, the level of which canbe set by software.

DC/DC ConverterThrough the DC/DC converter module, the power converting module generates required DCvoltages for each chip. The following DC voltages are provided: +1.8 V, +3.3 V, +5 V. Inaddition, protection is provided to board +3.3 V power supply.

10.1.4 Front PanelOn the front panel of the EOW, there are indicators and interfaces.



Appearance of the Front PanelFigure 10-2 shows the appearance of the front panel of the EOW.

Figure 10-2 Front panel of the EOW

EOW

EOW

PH

ON

ES

1S

2S

3S

4

STATPROG







InterfacesThere are five interfaces on the front panel of the EOW. Table 10-2 lists the type and usage ofthese interfaces.

Table 10-2 Interfaces on the front panel of the EOW


Usage

PHONE RJ-11 Orderwire phone interface

S1 RJ-45 Broadcast data interface S1





Usage




Table 10-3 lists the pins of the PHONE interface.

Table 10-3 Pins of the PHONE interface of the EOW

Front View Pin Usage

8 7 6 5 4 3 2 1

4 Signal 1

5 Signal 2

1–3 and 6–8 Not defined

Table 10-4 lists the pins of the S1, S2, S3 and S4 interfaces.

Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW


8 7 6 5 4 3 2 1

1 RS-422 data transmitting positive

2 RS-422 data transmitting negative

3 RS-422 data receiving positive

4 RS232 data receive end

5 Grounding

6 RS-422 data receiving negative

7 Not defined

8 RS232 data transmit end

10.1.5 Valid SlotsThe EOW can be housed in slot 9 in the subrack.

10.1.6 Technical SpecificationsThe technical specifications of the EOW cover the board dimensions, weight and powerconsumption.



Mechanical SpecificationsThe mechanical specifications of the EOW are as follows:


l Weight (kg): 0.4

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the EOW is 10 W.

10.2 AUXThis section describes the AUX, a system auxiliary interface board, in terms of the version,function, working principle, front panel and specifications.

10.2.1 Version DescriptionThe AUX has two versions, R1 and R2.

10.2.2 Function and FeatureThe AUX is used to provide various management and auxiliary interfaces, and to provide thecentral backup of the +3.3 V power supply for the boards in the subrack.

10.2.3 Working Principle and Signal FlowThe AUX consists of the control module, communication module, DC/DC converter moduleand so on.

10.2.4 JumperA jumper, J9, is present on the lower right of the AUX. The jumper is used to set the subrack asthe main subrack or extended subrack.

10.2.5 Front PanelOn the front panel of the AUX, there are many types of interfaces.

10.2.6 Valid SlotsThe AUX can be housed in slot 10 in the subrack.

10.2.7 Technical SpecificationsThe technical specifications of the AUX cover the board dimensions, weight and powerconsumption.

10.2.1 Version DescriptionThe AUX has two versions, R1 and R2.

The R1AUX and R2AUX are two versions developed in different periods. The two versions canbe replaced by each other.

10.2.2 Function and FeatureThe AUX is used to provide various management and auxiliary interfaces, and to provide thecentral backup of the +3.3 V power supply for the boards in the subrack.

Table 10-5 lists the functions and features of the AUX.




Table 10-5 Functions and features of the AUX

Item AUX

Managementinterface

Provides the OAM/F&f interface, which supports the X.25 protocol.Provides the ETH NMS interface.

Clock interface Provides two BITS clock input interfaces and two BITS clock outputinterfaces (impedance: 120 ohms).

Alarm interface Provides three alarm input and one alarm output interfaces.

Commissioninginterface

Provides one commissioning COM interface.

Internalcommunication

Realizes the inter-board communication among boards in thesubrack.

Backup and check ofthe power supply

Monitors the two independent –48 power supplies in the subrack,and performs the overvoltage (–72 V) check and undervoltage (–38.4V) check.Provides the central backup of the +3.3 V power supply for theboards in the subrack, which is the 1:N protection for the secondarypower supply of each board. The power of the +3.3 V power supplyis 80 W.Performs the overvoltage (3.8 V) check and undervoltage (3.1 V)check on the output of the +3.3 V backup power supply.

Audible alarm Supports the audible alarm and the clearing of the audible alarm.

10.2.3 Working Principle and Signal FlowThe AUX consists of the control module, communication module, DC/DC converter moduleand so on.

Figure 10-3 shows the block diagram for the functions of the R1AUX.



Figure 10-3 Block diagram for the functions of the R1AUX

Control module

3 x input and1 x output -48 V/ -60 V

F&f/OAMinterface CXL

CLK interface CXL

Other unitETH

interface

COMinterface

100/10 Mbit/s Ehernet bus

2 X 100/10 Mbit/s

100/10 Mbit/s

100/10 Mbit/sCXL

Housekeepinginput/output

-48 V/BAK 3.3 Vpower test &

thunder-proof test

Communication module

+1.8 V

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

DC/DCconverter

-48 V/ -60 V

-48 V/ -60 V

Figure 10-4 shows the block diagram for the functions of the R2AUX.




Figure 10-4 Block diagram for the functions of the R2AUX

Control module

3 x input and1 x output -48 V/ -60 V

F&f/OAMinterface CXL

CLK interface CXL

Otherunit

ETHinterface

COMinterface

100/10 Mbit/s Ehernet bus

2 x 100/10 Mbit/s

100/10 Mbit/s

100/10 Mbit/sCXL

Housekeepinginput/output

-48 V/BAK 3.3 Vpower test &

thunder-proof test

Communication module

+1.8 V

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

DC/DCconverter

-48 V/ -60 V

-48 V/ -60 V

CXL

The function modules of the R1AUX board are described below:

Communication ModuleThis module applies LAN Switch principle to construct inter-board communication for the OptiXOSN 1500. This module provides:

l 13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connectthe SCC, the cross-connect, the line and the tributary boards for inter-board communicationof the OptiX OSN 1500.

l 2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioningnetwork interface for service slots, which forms a VLAN with the 13 inter-boardcommunication network interfaces. The other interface is the interface for networkmanagement.

l 2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLBboards. These two interfaces and one network interface on the front panel are of the sameVLAN.

Control ModuleThe control module mainly consists of CPUs and monitors the running state of the board.

Alarm Input and Output ModuleThis module reads and sets 3 x input and 1 x output alarms.



Detection of –48 V and Backup +3.3 V Powers and Lightening Protection ModuleThis module detects:

l Over-voltage and under-voltage of –48 V and backup +3.3 V powers

l System lightening protection fault

Other Functionl F&f interface

l OAM serial interface for network management

l Two-in and two-out BITS clock interface (120 ohms)

l COM, ETH, F&f and OAM interfaces

DC/DC Converter ModuleThrough the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides40 W/+3.3 V backup power supply for the system.

The function modules of the R2AUX board are described below:

Communication ModuleThis module applies LAN Switch principle to construct inter-board communication for the OptiXOSN 1500. This module provides:

l 13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connectthe SCC, the cross-connect, the line and the tributary boards for inter-board communicationof the OptiX OSN 1500.

l 2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioningnetwork interface for service slots, which forms a VLAN with the 13 inter-boardcommunication network interfaces. The other interface is the interface for networkmanagement.

l 2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLBboards. These two interfaces and one network interface on the front panel are of the sameVLAN.

Control ModuleThe control module mainly consists of CPLDs and reports the local board state to the CXL boardthrough the control bus with the CXL board. This module also obtains the control informationof the local board.

Alarm Input and Output ModuleThis module reads and sets 3 x input and 1 x output alarms.

Detection of –48 V and Backup +3.3 V Powers and Lightening Protection ModuleThis module detects:




l Over-voltage and under-voltage of –48 V and backup +3.3 V powersl System lightening protection fault

Other Functionl F&f interfacel OAM serial interface for network managementl Two-in and two-out BITS clock interface (120 ohms)l COM, ETH, F&f and OAM interfaces

DC/DC Converter ModuleThrough the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides40 W/+3.3 V backup power supply for the system.

10.2.4 JumperA jumper, J9, is present on the lower right of the AUX. The jumper is used to set the subrack asthe main subrack or extended subrack.

Figure 10-5 shows where the jumper J9 is located on the AUX board.

Figure 10-5 Position of J9 on the AUX

PowerModule

J9

Use the J9 to set the subrack as follows:

l Cap the jumper to set the subrack as the main subrack.l Remove the cap from the jumper to set the subrack as the extended subrack.

10.2.5 Front PanelOn the front panel of the AUX, there are many types of interfaces.



Appearance of the Front PanelFigure 10-6 shows the appearance of the front panel of the AUX.

Figure 10-6 Front panel of the AUX

AUX

AUX

ETH

CO

MC

LKA

LMO

AM

/F&f

InterfacesThere are five interfaces on the front panel of the AUX. Table 10-6 lists the type and usage ofthese interfaces.

Table 10-6 Interfaces on the front panel of the AUX


Usage

ETH RJ-45 NM interface

COM RJ-45 Commissioning interface

CLK RJ-45 120-ohm external clock input/output interface

ALM RJ-45 3 x input and 1 x output alarm interface

OAM/F&f RJ-45 Serial NM and management interface

Table 10-7 lists the pins of the CLK interface.




Table 10-7 Pins of the CLK interface of the AUX


8 7 6 5 4 3 2 1

1 Receiving negative for 120-ohm clock 1

2 Receiving positive for 120-ohm clock 1

3 Receiving negative for 120-ohm clock 2

4 Transmitting negative for 120-ohm clock 1

5 Transmitting positive for 120-ohm clock 1

6 Receiving positive for 120-ohm clock 2

7 Transmitting negative for 120-ohm clock 2

8 Transmitting positive for 120-ohm clock 2

Table 10-8 lists the pins of the ETH and COM interfaces.

Table 10-8 Pins of the ETH and COM interfaces of the AUX


8 7 6 5 4 3 2 1




4 Not defined

5 Not defined


7–8 Not defined

Table 10-9 lists the pins of the ALM interface.

Table 10-9 Pins of the ALM interface of the AUX


8 7 6 5 4 3 2 1

1 Positive for critical and major alarm signaloutput

2 Negative for critical and major alarm signaloutput

3 Positive for minor and warning alarm signaloutput

4 Positive for alarm signal output 1




5 Negative for alarm signal output 1

6 Negative for minor and warning alarm signaloutput

7 Positive for alarm signal output 2

8 Negative for alarm signal output 2

Controlled by the software, a specific interface can be used as the OAM or F&f interface. Table10-10 lists pins of the interface used as the OAM interface.

Table 10-10 Pins of the OAM interface of the AUX


8 7 6 5 4 3 2 1

1 Requests for transmission.

2 Prepares the DTE.

3 Transmits data.

4 Grounds.

5 Grounds.

6 Receives data.

7 Prepare the DCE.

8 Prepares for the receiving ofsignals.

Table 10-11 lists the pins of the interface used as the F&f interface.

Table 10-11 Pins of the F&f interface of the AUX


8 7 6 5 4 3 2 1

4 RS232 receive end

5 Grounding end

8 RS232 transmit end


10.2.6 Valid SlotsThe AUX can be housed in slot 10 in the subrack.




10.2.7 Technical SpecificationsThe technical specifications of the AUX cover the board dimensions, weight and powerconsumption.


The mechanical specifications of the AUX are as follows:


l Weight (kg): 1.0

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the AUX is 19 W.

10.3 AMUThis section describes the AMU, an orderwire processing and alarm concatenation board, interms of the version, function, principle, front panel and specifications.

10.3.1 Version DescriptionThe functional version of the AMU board is R1.

10.3.2 Function and FeatureThe AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for theequipment.

10.3.3 Working Principle and Signal FlowThe AMU consists of the clock module, overhead processing module and power supply module.

10.3.4 Front PanelOn the front panel of AMU, there are board indicators and interfaces of many types.

10.3.5 Valid SlotsThe AMU can be housed in slot 9 in the subrack.

10.3.6 Technical SpecificationsThe technical specifications of the AMU cover the board dimensions, weight and powerconsumption.

10.3.1 Version DescriptionThe functional version of the AMU board is R1.

10.3.2 Function and FeatureThe AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for theequipment.

Table 10-12 lists the functions and features of the AMU.



Table 10-12 Functions and features of the AMU

Item AMU

Auxiliary interface Provides two broadcast data interfaces (Serial 1–2).

Cabinet alarmindicator

Drives and concatenates the four cabinet indicators.

Orderwire interface Provides one orderwire interface.

Commissioninginterface

Supports the commissioning serial port and 100M commissioningnetwork port, when connected to the AUX.

Overhead processing Processes the E1, E2, and Serial 1–2 bytes.

Backup and check ofthe power supply

Performs the overvoltage/undervoltage check on the output of thepower supply modules.

10.3.3 Working Principle and Signal FlowThe AMU consists of the clock module, overhead processing module and power supply module.

Figure 10-7 shows the block diagram for the functions of the AMU.

Figure 10-7 Block diagram for the functions of the AMU

Reference clock

S1~S4

E1/E2

+3.3 V power backupfrom AUX

-48 V

CXL unit

CXL unit

Clockmodule

Overheadprocessmodule

＋3.3 V

Backplane

Powersupplymodule

Clock Module

The clock module extracts and processes the reference clock signals from the CXL.

Overhead Processing Module

The overhead processing module processes the E1 and E2 bytes transmitted by the CXL, anduses the orderwire bytes for the connection of the orderwire phones. This module also processesSerial1 and Serial2 bytes, provides transparent data interfaces RS232 and RS422, drives andconcatenates the cabinet indicators. Figure 10-8 shows the positions of the orderwire bytes inthe SDH frame.




Figure 10-8 Positions of orderwire bytes in the SDH frame

A1 A1 A1 A2 A2 A2 J0

B1 E1

D1 D2 D3 Serial 1 Serial2

AU_PTR

B2 B2 B2 K1 K2

D4 D5 D6

D7 D8 D9

D10 D11 D12

S1 M1 E2

Power Supply ModuleThe power supply module provides supplies power to the AMU board and provides centralized+3.3 V power backup for other boards.

10.3.4 Front PanelOn the front panel of AMU, there are board indicators and interfaces of many types.

Appearance of the Front PanelFigure 10-9 shows the appearance of the front panel of the AMU.



Figure 10-9 Front panel of the AMU

PH

ON

ES

1S

2LA

MP

1

STATPROG

LAM

P2

AMU

AMU

Indicators







Interfaces

There are five interfaces on the front panel of the AMU. Table 10-13 lists the type and usageof these interfaces.

Table 10-13 Interfaces on the front panel of the AMU


PHONE RJ-11 Orderwire phone interface



LAMP1 RJ-45 Cabinet alarm indicator output interface

LAMP2 RJ-45 Cabinet concatenated alarm indicator inputinterface




Table 10-14 lists the pins of the PHONE interface.

Table 10-14 Pins of the PHONE interface of the AMU


8 7 6 5 4 3 2 1

4 Signal 1

5 Signal 2


Table 10-15 lists the pins of the S1 and S2 interfaces.

Table 10-15 Pins of the S1 and S2 interfaces of the AMU


8 7 6 5 4 3 2 1

1 RS-422 data transmittingpositive

2 RS-422 data transmittingnegative

3 RS-422 data receiving positive

4 RS232 data receive end

5 Grounding

6 RS-422 data receiving negative

7 Not defined

8 RS232 data transmit end

Table 10-16 lists the pins of the LAMP1 and LAMP2 interfaces.

Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU


8 7 6 5 4 3 2 1

1 Positive for critical alarmsignals

2 Negative for critical alarmsignals

3 Positive for major alarmsignals




4 Positive for power indicatorsignals

5 Negative for power indicatorsignals

6 Negative for major alarmsignals

7 Positive for minor alarmsignals

8 Negative for minor alarmsignals

Connection for Alarm ConcatenationThe AMU provides the concatenation interface for the cabinet alarm indicators. Connect theLAMP1 of the subrack 2 to the LAMP2 of the subrack 1. Finally, connect the LAMP1 of thesubrack 1 to the indicator interface on the top of the cabinet.

Figure 10-10 shows how to connect the cabinet alarm indicators.

Figure 10-10 Connection of the cabinet alarm indicators

LAMP1

Subrack 2

Cabinet

Cabinetindicators

LAMP2

LAMP1 LAMP2

Subrack 1

10.3.5 Valid SlotsThe AMU can be housed in slot 9 in the subrack.

10.3.6 Technical SpecificationsThe technical specifications of the AMU cover the board dimensions, weight and powerconsumption.





The mechanical specifications of the AMU are as follows:


l Weight (kg): 0.5

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the AMU is 8 W.

10.4 FANThis section describes the FAN, a fan control board, in terms of the version, function, principle,front panel, configuration and specifications.

10.4.1 Version DescriptionThe functional version of the FAN board is R1.

10.4.2 Function and FeatureThe FAN is used to adjust the fan speed, check the fan status, report the fault of the fan controlboard, and to report the off-service alarm of the fan.

10.4.3 Working Principle and Signal FlowThe FAN consists of the power interface unit, soft start unit, state detecting unit and fans.

10.4.4 Front PanelThere are no indicators on the front panel of the FAN.

10.4.5 Valid SlotsThe FAN can be housed in slot 20 in the subrack.

10.4.6 Technical SpecificationsThe technical specifications of the FAN cover the board dimensions, weight, power consumptionand working voltage.

10.4.1 Version DescriptionThe functional version of the FAN board is R1.

10.4.2 Function and FeatureThe FAN is used to adjust the fan speed, check the fan status, report the fault of the fan controlboard, and to report the off-service alarm of the fan.

Table 10-17 lists the functions and features of the FAN.

Table 10-17 Functions and features of the FAN

Function andFeature

FAN

Hot swap function Provides the hot swap function for the fan frame.



Function andFeature

FAN

Status checkfunction

Provides the function of fan status check.

Alarm checkfunction

Reports the fan alarm and in-service information.

10.4.3 Working Principle and Signal FlowThe FAN consists of the power interface unit, soft start unit, state detecting unit and fans.

Figure 10-11 shows the block diagram for the functions of the FAN.

Figure 10-11 Block diagram for the functions of the FAN

Poweraccess

unit

Statusdetection

unitVoltagedrop unit

FanDelaystart unit

- 48 V 1

- 48 V 2

GND1

GND2

GND

- 48 V

GND

- 48 V

-48 V

GN

D

- 48 V GND

Fan alarmsignals

Power Interface UnitThe power interface unit accesses the –48 V power supply for the FAN.

State Detecting UnitThis unit detects the on/off state of the fans. If any of the six fans stops, the unit reports the alarmto the CXL to indicate the off state of the fan and drives the alarm indicator.

10.4.4 Front PanelThere are no indicators on the front panel of the FAN.

Appearance of the Front PanelThe OptiX OSN equipment applies a modular fan platform.

One OptiX OSN 1500 subrack uses one fan tray assembly.

Figure 10-12 shows the appearance of the front panel of the FAN.




Figure 10-12 Front panel of the FAN

FANRUN

ALM


l Board running state (RUN), which is green when lit.

l Fan alarm indicator (ALM), which is red when lit.


10.4.5 Valid SlotsThe FAN can be housed in slot 20 in the subrack.

10.4.6 Technical SpecificationsThe technical specifications of the FAN cover the board dimensions, weight, power consumptionand working voltage.

Mechanical SpecificationsThe mechanical specifications of the FAN are as follows:

l Board dimensions (mm): 120 (H) x 220 (D) x 25.4 (W)

l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃) and with –48 V input voltage, the maximum powerconsumption of the FAN is 20 W.

Working VoltageThe working voltage for the FAN can be –48 V±20% DC.



11 WDM Processing Boards

About This Chapter

This chapter describes the WDM processing boards, such as the CMR2, CMR4, MR2, MR2A,MR2B, MR2C, MR4, LWX, OBU1, and FIB.

11.1 CMR2This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.

11.2 CMR4This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.

11.3 MR2This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.

11.4 MR2AThis section describes the MR2A, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.

11.5 MR2BThis section describes the MR2B, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.

11.6 MR2CThis section describes the MR2C, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.

11.7 MR4This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.

11.8 LWXThis section describes the LWX, an arbitrary rate wavelength converting board, in terms of theversion, function, principle, front panel, configuration and specifications.

11.9 OBU1

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 11 WDM Processing Boards


This section describes the TN11OBU1, an optical booster amplifier board, in terms of theversion, function, principle, front panel, configuration and specifications.

11.10 FIBThis section describes the FIB, a wavelength filter and isolation board, in terms of the version,function, principle, front panel, configuration and specifications.

11 WDM Processing BoardsOptiX OSN 1500 Intelligent Optical Transmission System



11.1 CMR2This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.

11.1.1 Version DescriptionThe functional version of the CMR2 board is TN11.

11.1.2 Function and FeatureThe CMR2 is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.

11.1.3 Working Principle and Signal FlowThe CMR2 consists of the OADM optical module, control and communication module, and DC/DC converter module.

11.1.4 Front PanelOn the front panel of the CMR2, there are board indicators, interfaces and laser safety class label.

11.1.5 Valid SlotsThe CMR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.

11.1.6 Board Feature CodeThe board feature code of the CMR2 contains eight characters, which indicate the wavelengthsfor the 2-channel optical signals processed by the board.

11.1.7 Technical SpecificationsThe technical specifications of the CMR2 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.



Table 11-1 lists the functions and features of the CMR2.

Table 11-1 Functions and features of the CMR2

Function andFeature

CMR2

Basic function Adds/Drops two wavelengths to/from the multiplexed signals.



Function andFeature

CMR2

Channel expansion Provides the intermediate port used for expansion. Under certainconditions, the capacity of upstream and downstream channels can beexpanded when the intermediate port is connected to other opticaladd/drop multiplexing boards.

Wavelength query Specifies and queries the added/dropped wavelengths.


Figure 11-1 shows the block diagram for the functions of the CMR2.

Figure 11-1 Block diagram for the functions of the CMR2

Control and communication module

OADM module

IN

D01 D02 A01 A02

Drop Add OUT

MO MI

SCC

+5 V DC/DCconverter

Power supply module

Delayedstartup

-48 V/-60 V

Fuse

-48 V/-60 V SCCBack plane

The CMR2 mainly includes the optical add/drop multiplexer (OADM) module adding/droppingtwo channels of signals. The OADM adds/drops and multiplexes two channels of signals. It alsoprovides concatenation interfaces to connect other add/drop multiplexing boards for morepowerful add/drop capability. The CMR2 is a passive board that has no interface with thebackplane.




OADM moduleThe board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01 and D02 two wavelengthsfrom the signal. These two dropped wavelengths are output from the MO optical interface.

The MI optical interface receives one multiplexed signal that travels over the main optical path.The Add optical module adds two wavelengths through optical interfaces A01 and A02 andmultiplexes them with the signal in the main optical path into one signal. This multiplexed signalis output through OUT.

Control and communication modulel Controls the entire board operation.

l Collects the information, such as the alarms and performance events, working status, andvoltage detection, of each functional module of the board.

l Communicates data with the SCC.

DC/DC converter moduleConverts –48 V DC or –60 V DC to a voltage required by each module of the board.


Appearance of the Front PanelFigure 11-2 shows the appearance of the front panel of the CMR2.



Figure 11-2 Front panel of the CMR2

CMR2

CMR2

STAT

LASERRADIATION

DO NOT VIEW DIRECTLYWITH OPTICALINSTRUMENTS

CLASS 1M LASERPRODUCT

OU

TIN

MO

MI

D1

A1

D2

A2

IndicatorOn the front panel of the CMR2, there is one board hardware state indicator (STAT), which isred or green when lit.

For indication of the indicator, see A Equipment and Board Alarm Indicators.

InterfacesThere are eight optical interfaces on the front panel of the CMR2. Table 11-2 lists the type andusage of the optical interfaces.




Table 11-2 Optical interfaces of the CMR2


Usage

A1–A2 LC Receive the signals output from the optical wavelengthconverting board or centralized client-side equipment.

D1–D2 LC Transmit signals to the optical wavelength converting boardor centralized client-side equipment.

IN LC Receives multiplexed signals.

OUT LC Transmits multiplexed signals.

MO LC Acts as a concatenation output optical interface and connectsto the input optical interfaces of other OADM boards.

MI LC Acts as a concatenation input optical interface and connectsto the output optical interfaces of other OADM boards.



Table 11-3 lists the details on the board feature code.

Table 11-3 Feature code of the CMR2

Barcode Indication Description

First four characters Wavelength for the opticalsignals

The wavelength is for thefirst channel of opticalsignals processed by theboard.

Last four characters Wavelength for the opticalsignals

The wavelength is for thesecond channel of opticalsignals processed by theboard.

For example, the feature code of the TN11CMR2 is 14711571.

l "1471" indicates that the wavelength for the first channel of optical signals is 1471 nm.

l "1571" indicates that the wavelength for the second channel of optical signals is 1571 nm.





Table 11-4 lists the specifications of optical interfaces of the CMR2.

Table 11-4 Specifications of the optical interfaces of the CMR2

OpticalInterface

Item Specification

- Working wavelength range(nm)

1271–1611

- Channel spacing (GHz) 20

IN-D1IN-D2

0.5 dB passband bandwidth(nm)

≥ ±6.5

Insertion loss (dB) in thechannel for droppingwavelengths

≤ 1.5

Adjacent channel isolation(dB)

> 25

Non-adjacent channelisolation (dB)

> 35

A1-OUTA2-OUT


≥ ±6.5

Insertion loss (dB) in thechannel for addingwavelengths

≤ 1.5

IN-MOMI-OUT

Insertion loss (dB) ≤ 1.0

Isolation (dB) > 13

- Return loss (dB) > 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1M.

The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)to 22.15 dBm (164 mW).

Mechanical Specificationsl Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)




l Weight (kg): 0.8

Power Consumptionl In the normal temperature (25℃), the maximum power consumption of the CMR2 is 0.2

W.l In the high temperature (55℃), the maximum power consumption of the CMR2 is 0.3 W.

11.2 CMR4This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.










Table 11-5 lists the functions and features of the CMR4.



Table 11-5 Functions and features of the CMR4

Function andFeature

CMR4

Basic function Adds/Drops four wavelengths to/from the multiplexed signals.




Figure 11-3 shows the block diagram for the functions of the CMR4.

Figure 11-3 Block diagram for the functions of the CMR4


OADM module

IN

D01 D03 A01 A04

Drop Add OUT

MO MI

SCC

+5 V DC/DCconverter

Power supply module

Delayedstartup

-48 V/-60 V

Fuse


D02 D04 A02 A03

OADM module

The board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01–D04 four wavelengthsfrom the signal. These four dropped wavelengths are output from the MO optical interface.




The MI optical interface receives one multiplexed signal that travels over the main optical path.The Add optical module adds four wavelengths through optical interfaces A01–A04 andmultiplexes them with the signal in the main optical path into one signal. This multiplexed signalis output through OUT.






Appearance of the Front PanelFigure 11-4 shows the appearance of the front panel of the CMR4.



Figure 11-4 Front panel of the CMR4

CMR4

CMR4

STAT

LASERRADIATION



OU

TIN

MO

MI

D1

A1

D2

A2

D3

A3

D4

A4

IndicatorOne the front panel of the CMR4, there is one board hardware state indicator (STAT), which isred or green when lit.

For indication of the indicator, see A Equipment and Board Alarm Indicators.

InterfacesThere are twelve optical interfaces on the front panel of the CMR4. Table 11-6 lists the typeand usage of these optical interfaces.




Table 11-6 Optical interfaces of the CMR4


Usage


D1–D4 LC Transmit signals to the optical wavelength convertingboard or centralized client-side equipment.



MI LC Acts as a concatenation input optical interface andconnects to the output optical interfaces of otherOADM boards.

MO LC Acts as a concatenation output optical interface andconnects to the input optical interfaces of other OADMboards.




Table 11-7 Feature code of the CMR4


Characters 1–2 Wavelength for the opticalsignals

The characters are twomiddle characters of the fourthat indicate the wavelengthfor the first channel of opticalsignals.


The characters are twomiddle characters of the fourthat indicate the wavelengthfor the second channel ofoptical signals.





The characters are twomiddle characters of the fourthat indicate the wavelengthfor the third channel ofoptical signals.


The characters are twomiddle characters of the fourthat indicate the wavelengthfor the fourth channel ofoptical signals.

For example, the feature code of the TN11CMR4 is 47495961.

l "47" indicates that the wavelength for the first channel of optical signals is 1471 nm.

l "49" indicates that the wavelength for the second channel of optical signals is 1491 nm.

l "59" indicates that the wavelength for the third channel of optical signals is 1591 nm.

l "61" indicates that the wavelength for the fourth channel of optical signals is 1611 nm.



Table 11-8 lists the specifications of the optical interfaces of the CMR4.

Table 11-8 Specifications of the optical interfaces of the CMR4

OpticalInterface

Item Specification

– Working wavelength range(nm)

1291 to 1611 (1371 nm excluded)

– Channel spacing (GHz) 20

IN-D1IN-D2IN-D3IN-D4


≥ ±6.5


≤ 2


> 25


> 35




OpticalInterface

Item Specification

A1-OUTA2-OUTA3-OUTA4-OUT


≥ ±6.5


≤ 2

IN-MOMI-OUT


Isolation (dB) > 13

– Return loss (dB) > 40

Laser Safety Class




l Weight (kg): 0.9

Power Consumptionl In the normal temperature (25℃), the maximum power consumption of the CMR4 is 0.2

W.l In the high temperature (55℃), the maximum power consumption of the CMR4 is 0.3 W.

11.3 MR2This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.

11.3.1 Version DescriptionThe functional version of the MR2 board is TN11.

11.3.2 Function and FeatureThe MR2 is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.

11.3.3 Working Principle and Signal FlowThe MR2 consists of the OADM optical module, control and communication module, and DC/DC converter module.

11.3.4 Front PanelOn the front panel of the MR2, there are board indicators, interfaces and laser safety class label.



11.3.5 Valid SlotsThe MR2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.

11.3.6 Board Feature CodeThe board feature code of the MR2 contains eight characters, which indicate the frequency forthe 2-channel optical signals processed by the board.

11.3.7 Technical SpecificationsThe technical specifications of the MR2 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.



Table 11-9 lists the functions and features of the MR2.

Table 11-9 Functions and features of the MR2

Function andFeature

MR2

Basic function Adds/Drops two wavelengths to/from the multiplexed signals.




Figure 11-5 shows the block diagram for the functions of the MR2.




Figure 11-5 Block diagram for the functions of the MR2


OADM module

IN

D01 D02 A01 A02

Drop Add OUT

MO MI

SCC

+5 V DC/DCconverter

Power supply module

Delayedstartup

-48 V/-60 V

Fuse


OADM module

The board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01 and D02 two wavelengthsfrom the signal. These two dropped wavelengths are output from the MO optical interface.






Converts –48 V DC or –60 V DC to a voltage required by each module of the board.




Appearance of the Front PanelFigure 11-6 shows the appearance of the front panel of the MR2.

Figure 11-6 Front panel of the MR2

MR2

MR2

STAT

LASERRADIATION



OU

TIN

MO

MI

D1

A1

D2

A2

IndicatorOn the front panel of the MR2, there is one board hardware state indicator (STAT), which is redor green when lit.


InterfacesThere are eight optical interfaces on the front panel of the MR2. Table 11-10 lists the type andusage of the optical interfaces.




Table 11-10 Optical interfaces of the MR2


Usage








11.3.6 Board Feature CodeThe board feature code of the MR2 contains eight characters, which indicate the frequency forthe 2-channel optical signals processed by the board.


Table 11-11 Feature code of the MR2


First four (1–4) characters Frequency of optical signals The four characters are thelast four characters of thefigure that marks thefrequency of the first channelof optical signals.

Last four (5–8) characters Frequency of optical signals The four characters are thelast four characters of thefigure that marks thefrequency of the secondchannel of optical signals.

For example, the feature code of the TN11MR2 is 93609370.

l "9360" indicates that the frequency of the first channel of optical signals is 193.60 THz.



l "9370" indicates that the frequency of the second channel of optical signals is 193.70 THz.


Optical Interface SpecificationsTable 11-12 lists the specifications of the optical interfaces of the MR2.

Table 11-12 Specifications of the optical interfaces of the MR2

OpticalInterface

Item Specification


1529 to 1561


IN-D1IN-D2


≥ ±0.11


≤ 1.5


> 25


> 35

A1-OUTA2-OUT


≥ ±0.11


≤ 1.5

IN-MOMI-OUT


Isolation (dB) > 13








l Weight (kg): 0.9

Power Consumptionl In the normal temperature (25℃), the maximum power consumption of the MR2 is 0.2 W.

l In the high temperature (55℃), the maximum power consumption of the MR2 is 0.3 W.

11.4 MR2AThis section describes the MR2A, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.

11.4.1 Version DescriptionThe functional version of the MR2A board is N1.

11.4.2 Function and FeatureThe MR2A is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.

11.4.3 Working Principle and Signal FlowThe MR2A consists of the OADM module, control and communication module, and DC/DCconverter module.

11.4.4 Front PanelOn the front panel of the MR2A, there are interfaces and laser safety class label.

11.4.5 Valid SlotsThe MR2A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.

11.4.6 Technical SpecificationsThe technical specifications of the MR2A cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.

11.4.1 Version DescriptionThe functional version of the MR2A board is N1.

11.4.2 Function and FeatureThe MR2A is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.

Table 11-13 lists the functions and features of the MR2A.



Table 11-13 Functions and features of the MR2A

Function andFeature

MR2A

Basic function Adds/Drops two arbitrary adjacent wavelengths, which are compliantwith ITU-T G.692 (DWDM). The signals are transparentlytransmitted, and the working wavelength ranges from 1535.82 nm to1560.61 nm.

OTM function The MR2A can be used as the two-channel wavelength adding/dropping OTM station. Two MR2C boards can be concatenated andupgraded to the four-channel wavelength adding/dropping OTMstation. See Figure 11-7.

OADM function Realizes the two-channel wavelength adding/dropping OADM station,when used with the LWX. See Figure 11-8.

Central wavelength Supports the ITU-T-compliant standard wavelength with a channelspacing of 100 GHz.

Figure 11-7 MR2A used as the OTM station

(2)(1)

MR2A

IN

OUT

MO

MI

D1 D2

A1 A2

Add

Drop

(1) MR2A can serve as an OTM station adding/dropping two channels.Two MR2A boards connected in serial can serve as an OTM station adding/dropping four channels.(2)

MR2A

IN

OUT

MO

MI

D1 D2

A1 A2

Add

Drop

MR2A

IN

OUT

MO

MI

D1 D2

A1 A2

Add

Drop

Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADMstation

In

Out

MI

MO

D1 A1

A2 D2

MR2A

LWX

LWX




11.4.3 Working Principle and Signal FlowThe MR2A consists of the OADM module, control and communication module, and DC/DCconverter module.

Figure 11-9 shows the block diagram for the functions of the MR2A.

Figure 11-9 Block diagram for the functions of the MR2A


OADM module

IN

D01 D02 A01 A02

Drop Add OUT

MO MI

SCC

+5 V DC/DCconverter

Power supply module

Delayedstartup

-48 V/-60 V

Fuse


The MR2A mainly includes the optical add/drop multiplexer (OADM) module adding/droppingtwo channels of signals. The OADM adds/drops and multiplexes two channels of signals. It alsoprovides concatenation interfaces to connect other add/drop multiplexing boards for morepowerful add/drop capability. The MR2A is a passive board that has no interface with thebackplane.









11.4.4 Front PanelOn the front panel of the MR2A, there are interfaces and laser safety class label.

Appearance of the Front PanelFigure 11-10 shows the appearance of the front panel of the MR2A.

Figure 11-10 Front panel of the MR2A

MR2A

MR2A

CLASS 1LASER

PRODUCTO

UT

AO

1A

O2

M I

M O

DO

2D

O1

IN




Interfaces

There are four pairs of LC optical interfaces on the front panel of the MR2A. Table 11-14 liststhe type and usage of the optical interfaces.

Table 11-14 Optical interfaces of the MR2A


Usage

A01–A02 LC Adds two wavelengths of signals from the local.

D01–D02 LC Drops two wavelengths of signals to the local.

IN LC Receives multiplexed signals of two wavelengths.

OUT LC Transmits multiplexed signals of two wavelengths.

MO/MI LC Acts as a concatenation optical interface and concatenatesseveral MR2A boards.

11.4.5 Valid SlotsThe MR2A can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.

11.4.6 Technical SpecificationsThe technical specifications of the MR2A cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.


Table 11-15 lists the specifications of the optical interfaces of the MR2A.

Table 11-15 Specifications of the optical interfaces of the MR2A

Item Description

Working wavelength 1535.82 nm to 1560.61 nm. The working wavelengths can beany two adjacent standard wavelengths defined in ITU-T G.692(DWDM).

Line code NRZ

Channel spacing (GHz) 100

Insertion loss (dB) in thechannel for adding ordropping wavelengths

< 2


> 25



Item Description


> 35

–0.5 dB channel bandwidth(nm)

< ±0.11

Laser Safety ClassThe safety class of the laser on the board is CLASS 1M.


Mechanical SpecificationsThe mechanical specifications of the MR2A are as follows:


l Weight (kg): 1.0

Power Consumption

In the normal temperature (25℃), the MR2A does not consume power.

11.5 MR2BThis section describes the MR2B, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.

11.5.1 Version DescriptionThe functional version of the MR2B board is N1.

11.5.2 Function and FeatureThe MR2B is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.

11.5.3 Working Principle and Signal FlowThe MR2B consists of the OADM module, control and communication module, and DC/DCconverter module.

11.5.4 Front PanelOn the front panel of the MR2B, there are interfaces and laser safety class label.

11.5.5 Valid SlotsThe MR2B can be housed in any of slots 2–3, 6–9, and 12–13 in the OptiX OSN 1500A subrack,or any of slots 1–3, 6–9, and 11–13 in the OptiX OSN 1500B subrack.

11.5.6 Technical SpecificationsThe technical specifications of the MR2B cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.




11.5.1 Version DescriptionThe functional version of the MR2B board is N1.

11.5.2 Function and FeatureThe MR2B is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.

Table 11-16 lists the functions and features of the MR2B.

Table 11-16 Functions and features of the MR2B

Function andFeature

MR2B

Basic function Adds/Drops two arbitrary adjacent wavelengths, which arecompliant with ITU-T G.692 (DWDM). The signals aretransparently transmitted, and the working wavelength ranges from1535.82 nm to 1560.61 nm.

OTM function The MR2B can be used as the two-channel wavelength adding/dropping OTM station. Two MR2B boards can be concatenated andupgraded to the four-channel wavelength adding/dropping OTMstation. See Figure 11-11.

OADM function Realizes the two-channel wavelength adding/dropping OADMstation, when used with the LWX. See Figure 11-12.

Central wavelength Supports the ITU-T-compliant standard central wavelength with achannel spacing of 100 GHz.

Figure 11-11 MR2B used as the OTM station

(2)(1)

MR2B

IN

OUT

MO

MI

D1 D2

A1 A2

Add

Drop

(1) MR2B can serve as an OTM station adding/dropping two channels.Two MR2B boards connected in serial can serve as an OTM station adding/dropping four channels.(2)

MR2B

IN

OUT

MO

MI

D1 D2

A1 A2

Add

Drop

MR2B

IN

OUT

MO

MI

D1 D2

A1 A2

Add

Drop



Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADMstation

In

Out

MI

MO

D1 A1

A2 D2

MR2B

LWX

LWX

11.5.3 Working Principle and Signal FlowThe MR2B consists of the OADM module, control and communication module, and DC/DCconverter module.

Figure 11-13 shows the block diagram for the functions of the MR2B.

Figure 11-13 Block diagram for the functions of the MR2B


OADM module

IN

D01 D02 A01 A02

Drop Add OUT

MO MI

SCC

+5 V DC/DCconverter

Power supply module

Delayedstartup

-48 V/-60 V

Fuse


The MR2B mainly includes the optical add/drop multiplexer (OADM) module adding/droppingtwo channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also




provides concatenation interfaces to connect other add/drop multiplexing boards for morepowerful add/drop capability. The MR2B is a passive board that has no interface with thebackplane.







11.5.4 Front PanelOn the front panel of the MR2B, there are interfaces and laser safety class label.

Appearance of the Front PanelFigure 11-14 shows the appearance of the front panel of the MR2B.

Figure 11-14 Front panel of the MR2B

MR2B

CLASS 1LASER

PRODUCT

MR2B

MR2B

OU

TA

O1

AO

2M

ID

O2

DO

1IN

MO



Interfaces

There are four pairs of optical interfaces on the front panel of the MR2B. Table 11-17 lists thetype and usage of the optical interfaces.

Table 11-17 Optical interfaces of the MR2B


Usage





MO/MI LC Acts as a concatenation optical interface and concatenatesseveral MR2B boards.

11.5.5 Valid SlotsThe MR2B can be housed in any of slots 2–3, 6–9, and 12–13 in the OptiX OSN 1500A subrack,or any of slots 1–3, 6–9, and 11–13 in the OptiX OSN 1500B subrack.

11.5.6 Technical SpecificationsThe technical specifications of the MR2B cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.


Table 11-18 lists the specifications of the optical interfaces of the MR2B.

Table 11-18 Specifications of the optical interfaces of the MR2B

Item Description

Working wavelength 1535.82 nm to 1560.61 nm. The working wavelengths can beany two adjacent standard wavelengths defined in ITU-T G.692.

Line code NRZ


Insertion loss in thewavelength-addingchannel (dB)

< 2


> 25




Item Description


> 35


< ±0.11



Mechanical SpecificationsThe mechanical specifications of the MR2B are as follows:


l Weight (kg): 1.0

Power Consumption

In the normal temperature (25℃), the MR2B does not consume power.

11.6 MR2CThis section describes the MR2C, a dual-channel optical add/drop multiplexing board, in termsof the version, function, principle, front panel, configuration and specifications.

11.6.1 Version DescriptionThe functional version of the MR2C board is N1.

11.6.2 Function and FeatureThe MR2C is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.

11.6.3 Working Principle and Signal FlowThe MR2C consists of the OADM module, control and communication module, and DC/DCconverter module.

11.6.4 Front PanelOn the front panel of the MR2C, there are interfaces and laser safety class label.

11.6.5 Valid SlotsThe MR2C can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.The MR2Ccan be housed in any of slots 19–26 and 29–36 in the subrack. If an extended subrack is used,the MR2C can also be housed in any of slots 69–76 and 79–86.

11.6.6 Technical SpecificationsThe technical specifications of the MR2C cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.



11.6.1 Version DescriptionThe functional version of the MR2C board is N1.

11.6.2 Function and FeatureThe MR2C is used to the coarse code division multiple access (CDMA) system. The spacingwavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing,channel expansion and query of wavelengths.

Table 11-19 lists the functions and features of the MR2C.

Table 11-19 Functions and features of the MR2C

Function andFeature

MR2C

Basic function Adds/Drops two arbitrary adjacent wavelengths, which arecompliant with ITU-T G.692 (DWDM). The signals aretransparently transmitted, and the working wavelength ranges from1535.82 nm to 1560.61 nm.

OTM function The MR2C can be used as the two-channel wavelength adding/dropping OTM station. Two MR2C boards can be concatenated andupgraded to the four-channel wavelength adding/dropping OTMstation. See Figure 11-15.

OADM function Realizes the two-channel wavelength adding/dropping OADMstation, when used with the LWX. See Figure 11-16.

Central wavelength Supports the ITU-T-compliant standard wavelength with a channelspacing of 100 GHz.

Figure 11-15 MR2C used as the OTM station

(2)(1)

MR2C

IN

OUT

MO

MI

D1 D2

A1 A2

Add

Drop

(1) MR2C can serve as an OTM station adding/dropping two channels.Two MR2C boards connected in serial can serve as an OTM station adding/dropping four channels.(2)

MR2C

IN

OUT

MO

MI

D1 D2

A1 A2

Add

Drop

MR2C

IN

OUT

MO

MI

D1 D2

A1 A2

Add

Drop




Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2Cand LWX

In

Out

MI

MO

D1 A1

A2 D2

MR2C

LWX

LWX

11.6.3 Working Principle and Signal FlowThe MR2C consists of the OADM module, control and communication module, and DC/DCconverter module.

Figure 11-17 shows the block diagram for the functions of the MR2C.

Figure 11-17 Block diagram for the functions of the MR2C


OADM module

IN

D01 D02 A01 A02

Drop Add OUT

MO MI

SCC

+5 V DC/DCconverter

Power supply module

Delayedstartup

-48 V/-60 V

Fuse


The MR2C mainly includes the optical add/drop multiplexer (OADM) module adding/droppingtwo channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also



provides concatenation interfaces to connect other add/drop multiplexing boards for morepowerful add/drop capability. The MR2C is a passive board that has no interface with thebackplane.







11.6.4 Front PanelOn the front panel of the MR2C, there are interfaces and laser safety class label.

Appearance of the Front PanelFigure 11-18 shows the appearance of the front panel of the MR2C.




Figure 11-18 Front panel of the MR2C

MR2C

MR2C

CLASS 1LASER

PRODUCT

OU

TA

O1

AO

2M

IM

OD

O2

DO

1IN

InterfacesThere is four pairs of optical interfaces on the front panel of the MR2C. Table 11-20 lists thetype and usage of the optical interfaces.

Table 11-20 Optical interfaces of the MR2C


Usage





MO/MI LC Acts as a concatenation optical interface and concatenatesseveral MR2C boards.



11.6.5 Valid SlotsThe MR2C can be housed in any of slots 14–17 in the OptiX OSN 1500B subrack.The MR2Ccan be housed in any of slots 19–26 and 29–36 in the subrack. If an extended subrack is used,the MR2C can also be housed in any of slots 69–76 and 79–86.

11.6.6 Technical SpecificationsThe technical specifications of the MR2C cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.

Optical Interface SpecificationsTable 11-21 lists the specifications of the optical interfaces of the MR2C.

Table 11-21 Specifications of the optical interfaces of the MR2C

Item Description

Working wavelength 1535.82 nm to 1560.61 nm. The working wavelengths can beany two adjacent standard wavelengths defined in ITU-T G.692.

Line code NRZ


Insertion loss in the add/drop channel (dB)

< 2


> 25


> 35


< ±0.11



Mechanical SpecificationsThe mechanical specifications of the MR2C are as follows:


l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the MR2C does not consume power.




11.7 MR4This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, interms of the version, function, principle, front panel, configuration and specifications.






11.7.6 Board Feature CodeThe feature code of the MR4 has eight numbers, which identify the frequency of the first andfourth channels of optical signals the board process.




Table 11-22 lists the functions and features of the MR4.

Table 11-22 Functions and features of the MR4

Function andFeature

MR4

Basic function Adds/Drops four wavelengths to/from the multiplexed signals.



Function andFeature

MR4




Figure 11-19 shows the block diagram for the functions of the MR4.

Figure 11-19 Block diagram for the functions of the MR4


OADM module

IN

D01 D03 A01 A04

Drop Add OUT

MO MI

SCC

+5 V DC/DCconverter

Power supply module

Delayedstartup

-48 V/-60 V

Fuse


D02 D04 A02 A03

OADM module

The board receives through IN one multiplexed optical signal that travels from the upstreamstation. The Drop optical module drops through optical interfaces D01–D04 four wavelengthsfrom the signal. These four dropped wavelengths are output from the MO optical interface.

The MI optical interface receives one multiplexed signal that travels over the main optical path.The Add optical module adds four wavelengths through optical interfaces A01–A04 and




multiplexes them with the signal in the main optical path into one signal. This multiplexed signalis output through OUT.






Appearance of the Front PanelFigure 11-20 shows the appearance of the front panel of the MR4.



Figure 11-20 Front panel of the MR4

MR4

MR4

STAT

LASERRADIATION



OU

TIN

MO

MI

D1

A1

D2

A2

D3

A3

D4

A4

IndicatorOn the front panel of the MR4, there is one board hardware state indicator (STAT), which is redor green when lit.


InterfacesThere are twelve optical interfaces on the front panel of the MR4. Table 11-23 lists the type andusage of the optical interfaces.




Table 11-23 Optical interfaces of the MR4


Usage








11.7.6 Board Feature CodeThe feature code of the MR4 has eight numbers, which identify the frequency of the first andfourth channels of optical signals the board process.


Table 11-24 Board feature code


First four characters Frequency of optical signals The four characters are thelast four characters of thefigure that marks thefrequency of the first channelof optical signals.

Last four characters Frequency of optical signals The four characters are thelast four characters of thefigure that marks thefrequency of the fourthchannel of optical signals.

For example, the feature code of the TN11MR4 is 92109240.

l "9210" indicates that the frequency of the first channel of optical signals is 192.10 THz.



l "9240" indicates that the frequency of the fourth channel of optical signals is 192.40 THz.

The four channels of optical signals the MR4 processes are successive:

l The frequency of the second channel of optical signals is 192.20 THz.

l The frequency of the third channel of optical signals is 192.30 THz.



Table 11-25 lists the specifications of the optical interfaces of the MR4.

Table 11-25 Specifications of the optical interfaces of the MR4

OpticalInterface

Item Specification


1529 to 1561


IN-D1IN-D2IN-D3IN-D4


≥ ±0.11

Insertion loss in thewavelength-droppingchannel (dB)

≤ 2.2


> 25


> 35

A1-OUTA2-OUTA3-OUTA4-OUT


≥ ±0.11

Insertion loss in thewavelength-adding channel(dB)

≤ 2.2

IN-MOMI-OUT


Isolation (dB) > 13


Laser Safety Class







l Weight (kg): 0.9

Power Consumptionl In the normal temperature (25℃), the maximum power consumption of the MR4 is 0.2 W.

l In the high temperature (55℃), the maximum power consumption of the MR4 is 0.3 W.

11.8 LWXThis section describes the LWX, an arbitrary rate wavelength converting board, in terms of theversion, function, principle, front panel, configuration and specifications.

11.8.1 Version DescriptionThe functional version of the LWX board is N1.

11.8.2 Function and FeatureThe LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength.

11.8.3 Working Principle and Signal FlowThe LWX consists of the O/E conversion module, cross-connect module, CDR module and soon.

11.8.4 Front PanelOn the front panel of the LWX, there are indicators and interfaces.

11.8.5 Valid SlotsThe LWX can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.

11.8.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The feature code ofthe LWX indicates the schemes the optical interfaces use to receive and transmit signals.

11.8.7 Technical SpecificationsThe technical specifications of the LWX cover the optical interface specifications, boarddimensions, weight and power consumption.

11.8.1 Version DescriptionThe functional version of the LWX board is N1.

11.8.2 Function and FeatureThe LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength.

The LWX supports the optical wavelength convertion, 3R, protection, and loopback.



Table 11-26 lists the functions and features of the LWX.

Table 11-26 Functions and features of the LWX

Functionand Feature

LWX

Basicfunction

Realizes the convertion between the wavelength at an arbitrary rate at theclient side and the wavelength compliant with ITU-T G.692 (DWDM).Transparently transmits signals.

3R function Provides the 3R function for the signals at the client side ranging from 10Mbit/s to 2.7 Gbit/s. Recovers the clock, and monitors the rate.

Protectionscheme

Single fed and singlereceiving

Supports the inter-board protection and 1+1 inter-board hot backup. The switching time is less than 50ms.

Dual fed andselective receiving

Supports the intra-board protection. The opticalchannel protection can be realized by one board. Theswitching time is less than 50 ms.

ALS function Supports the ALS function. When no signals are received, the correspondingoptical transmit module is automatically turned off.

Loopbackfunction

Provides the inloop and outloop at the optical interface level, which are usedfor locating faults.

Performanceand alarmmonitoring

Provides rich alarms and performance events for easy maintenance.

Centralwavelength

Supports the ITU-T-compliant standard wavelength with a channel spacingof 100 GHz.

11.8.3 Working Principle and Signal FlowThe LWX consists of the O/E conversion module, cross-connect module, CDR module and soon.

Figure 11-21 shows the block diagram for the functions of the LWX.




Figure 11-21 Block diagram for the functions of the LWX

-48 V/ -60 V

-48 V/ -60 V

LOS

Laser shut down

SCC Unit

Referenceclock

Multi-rateCDR

2×2 Cross-connection

Multi-rate

CDR

2×2 Cross-connection

Data

Reference clock

Loopback control

Loopback control

LOSLaser shut down

LOS

communicationand control

module

WDM sideloopback

Client side loopback

Clock

Data

Optical module 2at WDM side

10 Mbit/s~2.7 Gbit/sO/E

10 Mbit/s~2.7 Gbit/s


Optical module 1at WDM side

Opticalsplitter

O/E

O/E

Optical module at

client side

O/E

O/E

+3.3 V backuppower

+3.3 VDC/DC

converterFuse

Fuse

DC/DCconverter

+1.8 V

+1.5 V+ 5 V



Communication

communicationand control

module

module

module

O/E Conversion Modulel The optical module at client side applies SFP encapsulation and can be configured as

different types of optical module. This module supports accessing optical signals at the rateof 10 Mbit/s-2.7 Gbit/s.

l At WDM side, the module can be configured as an optical tranceiver module or an opticaltranceiver module and an optical receiver module. When two modules are configured atWDM side, an optical splitter is used to realize dual feeding.

l In the receive direction, the module converts the received optical signals into electricalsignals.



l In the transmit direction, the module converts the electrical signals into SDH optical signals,and then send optical signals to fibers for transmission.

l Detect the R_LOS alarm and provide the function to shut down the laser.

Cross-connect Modulel Supports data selection from client side to WDM side and from WDM side to client side

l Supports WDM side optical module selection

l Supports loopback of client side signals

l Supports loopback of WDM side signals

CDR Modulel Supports recovering data and clock signals from 10 Mbit/s to 2.7 Gbit/s

l Supports reading rates of accessed services

Communication and Control Modulel Supports Ethernet communication

l Supports reference clock of the CDR module

l Selects and configures services of other modules

l Implements laser controlling function

l Selects the clock from the active or the standby cross-connect board

l Control the indicator on the board

DC/DC Converter ModuleThrough the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. The –48 V/–60 V voltage is converted to the followingvoltages: +1.5 V, +3.3 V, +1.8 V and ±5 V. In addition, this module provides protection for theboard +3.3 V power supply.

11.8.4 Front PanelOn the front panel of the LWX, there are indicators and interfaces.

Appearance of the Front PanelFigure 11-22 shows the appearance of the front panel of the LWX.




Figure 11-22 Front panel of the LWX

LWX

LWX

STATACTPROGSRV

CLASS 1LASER

PRODUCT

TXR

XO

UT1

IN1

OU

T2IN

2







InterfacesThere are six optical interfaces on the front panel of the LWX. Table 11-27 lists the type andusage of the optical interfaces.



Table 11-27 Optical interfaces on the front panel of the LWX


Usage

IN1/IN2 LC Receives signals from the optical add/drop multiplexingboard, MR2A.

OUT1/OUT2 LC Transmits signals to the optical add/drip multiplexingboard, MR2A.

TX LC Transmits signals to the client-side equipment.

RX LC Receives signals from the client-side equipment.

Note: IN1/OUT1 and IN2/OUT2 are two pairs of optical interfaces.

11.8.5 Valid SlotsThe LWX can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.

11.8.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The feature code ofthe LWX indicates the schemes the optical interfaces use to receive and transmit signals.

Table 11-28 lists the relation between the board feature code and the receive/transmit scheme.

Table 11-28 Relation between the board feature code and the receive/transmit scheme

Board Barcode Feature Code Receive/Transmit Scheme

SSN1LWX01 01 Single-fed single selective

SSN1LWX02 02 Dual-fed single selective

11.8.7 Technical SpecificationsThe technical specifications of the LWX cover the optical interface specifications, boarddimensions, weight and power consumption.

Optical Interface SpecificationsTable 11-29 and Table 11-30 list the specifications of the client-side and WDM-side opticalinterfaces of the LWX.

Table 11-29 Specifications of the client-side optical interfaces of the LWX

Item Specification

Nominal bit rate 10 Mbit/s to 2.7 Gbit/s

Line code NRZ




Item Specification

Optical source type SLM SLM SLM


15 40 80

Feature of the transmitter at S point

Working wavelengthrange (nm)

1260 to 1360 1260 to 1360 1500 to 1580

Max. mean launchedoptical power (dBm)

0 +3 +3

Min. mean launchedoptical power (dBm)

–5 –2 –2

Min. extinction ratio(dB)

+8.2 +8.2 +8.2

Side modesuppression ratio(dB)

30 30 30

Eye pattern Compliant with thetemplate defined inITU-T G.957Recommendations

Compliant with thetemplate defined inITU-T G.957Recommendations

Compliant with thetemplate defined inITU-T G.957Recommendations

Feature of the receiver at S point

Receiver type PIN PIN APD

Wavelength range(nm) of the receivedsignals

1200 to 1600 1200 to 1600 1200 to 1600


–18 –18 –28

Min. overload (dBm) 0 –9 –9

Max. reflectioncoefficient (dB)

–27 –27 –27

Table 11-30 Specifications of the WDM-side optical interfaces of the LWX

Item Specification

Channelspacing (GHz)

100

Line code NRZ

Feature of the transmitter at Sn point



Item Specification

Targettransmissiondistance (km) ofopticalinterfaces

640 170 (2 mW) 170 (10 mW) 360

Max. meanlaunched opticalpower (dBm)

–2 –2 +7 –2

Min. meanlaunched opticalpower (dBm)

+3 +3 +5 +3


+10 +10 +10 +10

Nominal centralfrequency(THz)

192.10 to196.00

192.10 to196.00

192.10 to196.00

192.10 to196.00

Centralfrequencydeviation (GHz)

±12.5 ±12.5 ±12.5 ±12.5

Max. –20 dBspectral width(nm)

0.2 0.4 0.4 0.4

Min. side modesuppressionratio (dB)

35 35 35 35

Dispersioncompensation(ps/nm)

12800 2400 3200 1600

Eye pattern Compliant withthe templatedefined in ITU-T G.957Recommendations

Compliant withthe templatedefined in ITU-T G.957Recommendations



Feature of the receiver at Rn point

Receiver type APD PIN

Receivingwavelengthrange (nm)

1200 to 1600 1200 to 1600




Item Specification


–28 –18

Min. overload(dBm)

–9 0

Max. reflectioncoefficient (dB)

–27 –27


The mechanical specifications of the LWX are as follows:


l Weight (kg): 1.1

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the LWX is 30 W.

11.9 OBU1This section describes the TN11OBU1, an optical booster amplifier board, in terms of theversion, function, principle, front panel, configuration and specifications.

11.9.1 Version DescriptionThe functional version of the OBU1 is TN11.

11.9.2 Function and FeatureThe OBU1 supports the in-service optical performance monitoring, gain-locking technology,and transient control technology.

11.9.3 Working Principle and Signal FlowThe OBU1 consists of the EDFA optical module, optical splitter, and the control andcommunication module.

11.9.4 Front PanelOn the front panel of the OBU1, there are indicators, interfaces, and laser safety class label.

11.9.5 Valid SlotsThe OBU1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.

11.9.6 Board Feature CodeThe feature code of the OBU1 contains six characters and indicates the gain and maximumnominal input optical power of the optical signals.

11.9.7 Technical SpecificationsThe technical specifications of the OBU1 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.



11.9.1 Version DescriptionThe functional version of the OBU1 is TN11.

11.9.2 Function and FeatureThe OBU1 supports the in-service optical performance monitoring, gain-locking technology,and transient control technology.

Table 11-31 lists the functions and features of the OBU1.

Table 11-31 Functions and features of the OBU1

Function andFeature

OBU1

Basic function Amplifies a maximum of 40-channel optical signals (channel spacing:100 GHz) at the same time.Supports the transmission without electrical trunks for different spans.

Typical gain The typical gain of the OBU101 is 20 dB. The typical gain of theOBU102 is 23 dB.

In-service opticalperformancemonitoring

Provides in-service performance monitoring optical interface. A smallvolume of optical signals are output at the optical interface to the opticalspectrum analyzer or optical spectrum analyzing board. The opticalspectrum analyzer or optical spectrum analyzing board monitors themultiplexed optical signals and optical performance withoutinterrupting services.

Gain-lockingtechnology

The EDFA of the board has the gain-locking function. When one ormore channels are added or dropped, or optical signals of certainchannels fluctuate, the signal gains of other channels are not affected.

Transient controltechnology

The EDFA of the board has the transient control function. Whenchannels are added or dropped, the system can be upgraded or expandedwithout interrupting services if the optical power fluctuation issuppressed.

Performance andalarm monitoring

Checks and reports the optical power.Controls the temperature of the pumping laser.Checks the pumping drive current, back facet current, cooling current,temperature of the pumping laser, and the ambient temperature of theboard.

NOTE

The OBU1 is of two types: OBU101 and OBU102. The OBU101 is used at the receive end. The OBU102is used at the transmit end.

11.9.3 Working Principle and Signal FlowThe OBU1 consists of the EDFA optical module, optical splitter, and the control andcommunication module.




Figure 11-23 shows the block diagram for the functions of the OBU1.

Figure 11-23 Block diagram for the functions of the OBU1


IN

Pumping and detection module

Pumpingcurrent

Detecting fortemperature andpumping current

SCC

PIN

EDFA optical module Splitter

Power supply module

+5 V DC/DCconverter

-48 V/-60 V

+5 V DC/DCconverter

+5 V

Delayedstartup

Fuse

-48 V/-60 V

Backplane

Signal Flow

The OBU1 accesses the multiplexed optical signals, which are amplified by the EDFA opticalmodule. The OBU1 then outputs the amplified optical signals through the OUT port. The OBU1also outputs few monitoring signals to the test instrument for performance analysis.

EDFA Optical Module

The EDFA module is used to amplify the input optical signals. The EDFA optical module appliesthe gain auto-adjustment technology. With this technology, the EDFA can change the gain ofworking wavelength signals in the allowed range.

Optical Splitter

The splitter is used to split the optical signals received from the EDFA optical module into twochannels of signals with different power. One channel of signlas are output from OUT opticalinterface and then transmitted in the main optical channel. The other channel of signals are outputto the MON port for sepctrum detection and monitoring. The power of signals at the MON isone ninety-nineth of that at the OUT interface. In other words, the power of signals at MON is20 dB lower than that at the OUT interface.



Control and Communication ModuleThe control and communication module is used to control and monitor the functional modulesof the board, and to manage the communication.

This module collects the information on alarms and performance events, and data of workingstatus and voltage detection of each functional module. This module then reports the informationand data to the SCC.

The control and communication module receives commands from the SCC to control andcoordinate the working of each functional module.

11.9.4 Front PanelOn the front panel of the OBU1, there are indicators, interfaces, and laser safety class label.

Appearance of the Front PanelFigure 11-24 shows the appearance of the front panel of the OBU1.

Figure 11-24 Front panel of the OBU1

OBU1

OBU1

MO

NO

UT

IN

STATACTPROGSRV

LASERRADIATION






Indicators







Interfaces

There are three pairs of optical interfaces on the front panel of the OBU1. Table 11-32 lists thetype and usage of the optical interfaces.

Table 11-32 Optical interfaces of the OBU1


Usage

IN LC Inputs multiplexed signals to be amplified.

OUT LC Outputs the amplified multiplexed signals.

MON LC Connects to the test instrument to monitor the in-service performance.

11.9.5 Valid SlotsThe OBU1 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any ofslots 11–13 in the OptiX OSN 1500B subrack.

11.9.6 Board Feature CodeThe feature code of the OBU1 contains six characters and indicates the gain and maximumnominal input optical power of the optical signals.


Table 11-33 Feature code of the OBU1


First character – Fixed as G

Next two (2–3) characters Gain Gain

Fourth character – Fixed as I

Last two (5–6) characters Maximum nominal inputoptical power

Maximum nominal inputoptical power



For example, the feature code of the TN11OBU1 is G23I-3. The feature code indicates that thegain is 23 dB and the maximum nominal input optical power is –3 dBm.

11.9.7 Technical SpecificationsThe technical specifications of the OBU1 cover the optical interface specifications, boarddimensions, weight, power consumption and laser safety class.


Table 11-34 lists the specifications of the optical interfaces of the OBU1.

Table 11-34 Specifications of optical interfaces of the OBU1

Item Specification

OBU1C01 OBU1C02

Working wavelength range (nm) 1529 to 1561 1529 to 1561

Range of input optical power(dBm)

–32 to –4 –32 to –3

Range of output optical power(dBm)

–12 to 16 –9 to 20

Input power (dBm) of a typicalsingle wavelength

–20 –19

Maximum nominal output opticalpower (dBm) of a singlewavelength

0 4

Path gain (dB) 20±1.5 23±1.5

Noise figure (dB) ≤ 5.5 ≤ 6.0

Gain flatness (dB) ≤ 2.0 ≤ 2.0

Pre-incline of the gain spectralform

0±0.2 1.0±0.2

Laser Safety Class




l Weight (kg): 1.3




Power Consumptionl The power consumption of OBU101:

– In the normal temperature (25℃), the maximum power consumption of the OBU1 is16 W.

– In the high temperature (55℃), the maximum power consumption of the OBU1 is 17.6W.

l The power consumption of OBU102:– In the normal temperature (25℃), the maximum power consumption of the OBU1 is

18 W.– In the high temperature (55℃), the maximum power consumption of the OBU1 is 19.8

W.

11.10 FIBThis section describes the FIB, a wavelength filter and isolation board, in terms of the version,function, principle, front panel, configuration and specifications.

11.10.1 Version DescriptionThe functional version of the FIB board is N1.11.10.2 Function and FeatureThe FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals.11.10.3 Working Principle and Signal FlowThe FIB consists of an isolator and a filter.11.10.4 Front PanelOn the front panel of the FIB, there are two pairs of optical interfaces.11.10.5 Valid SlotsThe FIB can be housed in any of slots 12–13 in the subrack.11.10.6 Technical SpecificationsThe technical specifications of the FIB cover the optical interface specifications, boarddimensions, weight and power consumption.

11.10.1 Version DescriptionThe functional version of the FIB board is N1.

11.10.2 Function and FeatureThe FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals.

The FIB is used in the remote optical pump amplifier (ROPA) system. Used with the ROP, asingle-wavelength long distance board, the FIB can realize long-distance optical regenerationtransmission. Figure 11-25 shows the position of the FIB in an optical transmission system.

Figure 11-25 Location of the FIB in the optical transmission system.

G.652ROP Filter

1550.12

a(54dB) b(18dB)

C

BA17G.652

ROP 1550.12

a(54dB) b(18dB)

(single span)

ISOàSingle span Optical receiverErbium doped

FIB



Table 11-35 lists the functions and features of the FIB.

Table 11-35 Functions and features of the FIB

Function andFeature

FIB

Optical isolator The isolator lets optical signals pass in a unidirectional manner. Theworking wavelength ranges from 1529 nm to 1561 nm.

Optical filter The filter filters all signals carried in wavelengths except those in the1550.12 nm wavelength.

11.10.3 Working Principle and Signal FlowThe FIB consists of an isolator and a filter.

Figure 11-26 shows the block diagram for the functions of the FIB.

Figure 11-26 Block diagram for the working principle of the FIB

Isolator Filter

After travelling for a long distance in fibers, optical signals are heavily attenuated and thendegraded. The degraded signals cannot be normally received by optical receiver. In this case,the ROP should be used to amplify the gain of the optical signals. The ROP has high opticalpower. To prevent other factors from affecting the ROP, use the FIB to filter wavelengths.

The filter of the FIB lets optical signals pass in a unidirectional manner. The filter filters allsignals carried in other wavelengths except those in the 1550.12 nm wavelength. In this way,the optical receiver can normally receive optical signals.

11.10.4 Front PanelOn the front panel of the FIB, there are two pairs of optical interfaces.

Appearance of the Front PanelFigure 11-27 shows the appearance of the front panel of the FIB.




Figure 11-27 Front panel of the FIB

FIB

FIB

OU

TIN

CLASS1LASER

PRODUCT

InterfacesOn the front panel of the FIB, there are a LC optical interface and a E2000 optical interface,which are used to receive and transmit 1-channel 2.5 Gbit/s optical signals. The optical interfacesuse pluggable optical modules for easy maintenance.

Table 11-36 Optical interfaces of the FIB


Usage

IN E2000 Receive 1-channel 2.5 Gbit/s optical signals.

OUT LC Transmit 1-channel 2.5 Gbit/s optical signals.

11.10.5 Valid SlotsThe FIB can be housed in any of slots 12–13 in the subrack.

11.10.6 Technical SpecificationsThe technical specifications of the FIB cover the optical interface specifications, boarddimensions, weight and power consumption.



Optical Interface SpecificationsTable 11-37 lists the specifications of the optical interfaces of the FIB.

Table 11-37 Specifications of the optical interfaces of the FIB

Item Specification


Line code NRZ

Central wavelength(nm)

1550.12±0.05

–0.5 dB bandwidth(nm)

> 0.4

Mechanical SpecificationsThe mechanical specifications of the FIB are as follows:


l Weight (kg): 0.4

Power ConsumptionThe FIB does not consume power.




12 Optical Amplifier Boards andDispersion Compensation Boards

About This Chapter

This chapter describes the optical amplifier boards, such as the BA2, BPA, and COA, and thedispersion compensation boards, such as the DCU.

12.1 BA2This section describes the BA2, 2-channel optical booster amplifier board, in terms of theversion, function, working principle, front panel and specifications.

12.2 BPAThis section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, interms of the version, function, principle, front panel and specifications.

12.3 COAThis section describes the COA, a case-shaped optical amplifier, in terms of the version, function,principle, front panel, installation position and specifications.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description

12 Optical Amplifier Boards and Dispersion CompensationBoards


12.1 BA2This section describes the BA2, 2-channel optical booster amplifier board, in terms of theversion, function, working principle, front panel and specifications.

12.1.1 Version DescriptionThe functional version of the BA2 board is N1.

12.1.2 Function and FeatureDuring the long-haul transmission of optical signals, the attenuation of signals is high. The BAshould be used, and thus the optical receiver can normally receive optical signals.

12.1.3 Working Principle and Signal FlowThe BA2 consists of the EDFA module, control module, communication module, and DC/DCconverter module.

12.1.4 Front PanelOn the front panel of the BA2, there are indicators and interfaces.

12.1.5 Valid SlotsThe BA2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.

12.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the BA2 indicates the output optical power of the optical interfaces.

12.1.7 Technical SpecificationsThe technical specifications of the BA2 cover the optical interface specifications, boarddimensions, weight and power consumption.

12.1.1 Version DescriptionThe functional version of the BA2 board is N1.

12.1.2 Function and FeatureDuring the long-haul transmission of optical signals, the attenuation of signals is high. The BAshould be used, and thus the optical receiver can normally receive optical signals.

Figure 12-1 shows the location of the BA in the optical transmission system.

Figure 12-1 Location of the BA in the optical transmission system

BATransmit Receive

The BA2 amplifies the power of two-channel optical signals. Table 12-1 lists the functions andfeatures of the BA2.




Table 12-1 Functions and features of the BA2

Function andFeature

BA2

Basic function Increases the launched optical power of the line board to 13–15 dBmor 15–18 dBm. Thus, when the G.652 optical fiber with a loss of 0.275dB/km is used, the transmission distance can be 120 km, 130 km, orabove.

EDFA Automatically controls the optical power and laser temperature of theEDFA module.Automatically monitors the input and output optical power of the EDFAmodule and queries the optical power.Protects the EDFA module. When no optical signals are input, the laseris automatically turned off. When optical signals are input, the laser isautomatically turned on.

Performance andalarm monitoring

Reports the performance parameters of the laser. Provides rich alarmsand performance events for easy management and maintenance of theequipment.

Software upgrade Supports the software upgrade and expansion without interruptingservices.

NOTE

The BA2 provides the IPA function. When the IPA function is enabled, the pumping laser is turned off ifno input signals are detected on the receive end of the line board. Thus, this function is used to prevent thehigh laser power from damaging eyes.

12.1.3 Working Principle and Signal FlowThe BA2 consists of the EDFA module, control module, communication module, and DC/DCconverter module.

Figure 12-2 shows the block diagram for the functions of the BA2.




Figure 12-2 Block diagram for the functions of the BA2

Fiberdistributor

Inputisolate

DopederbiumfiberWDM

coupler

Laser pumpInputpower

monitor(Pin1)

Outputpower

monitor(Pin2)

Opticalsplitter

TemperaturePumpcurrentdetect

Pumpcurrent

Filter

Pumptemperature

control

Lasershutdown

Inputpower

Outputpower

LOS inManualcontrol


Optical output

AD/DA

Control&Generation alarms

Optical input Outputisolate

Communicationmodule

EDFA module

Control module

+3.3 V backuppower

+3.3 V DC/DCconverter Fuse

Fuse

DC/DCconverter

5 V

-48 V/ -60 V

-48 V/ -60 V

module

module

EDFA ModuleThe optical amplifier unit consists of two EDFA modules. One is BA and the other PA. Whenthe board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the centralwavelength is added to the optical output end of the module. A booster amplifier (BA) does nothave the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in theerbium fiber inside the EDFA module. Bump light and input signal light are coupled into theerbium fiber through an optical coupler. The input and output optical signals of the module areled out by two fiber splitters as per a specific coupling ratio. The optical signals are then convertedto optical current by two PIN photoelectrical diodes. The input and output powers of the EDFAmodule are determined as per the optical signals. The module also applies optical isolatingmeasures at the input and the output ends to improve the performance of the module.

Control ModuleThe control module:

l Detects and drives bump electricity

l Controls the pump temperature of laser

l Detects input and output power

l Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/Dconverting unit converts the temperature value of the cooling electricity and the input/output




optical power from analog values to digital values. The converted values are then sent to CPU,which generates performance reporting event or alarm. The A/D converting unit also convertsbump electricity from analog values to digital values. The converted values are then sent to CPU.After the CPU processes the converted values, the D/A converting unit controls precisely thedriving analog circuit of the bump laser of the EDFA optical module. The internal temperatureof the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputstemperature change to drive cooler to keep the internal temperature of the bump laser moduleat 25℃.

Communication ModuleThe communication module supports ethernet communication.

DC/DC Converter ModuleThrough the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. Inaddition, this module provides protection to the board +3.3 V power supply.

12.1.4 Front PanelOn the front panel of the BA2, there are indicators and interfaces.

Appearance of the Front PanelFigure 12-3 shows the appearance of the front panel of the BA2.




Figure 12-3 Front panel of the BA2

BA2

BA2

STATACTPROGSRV

OU

T1O

UT2

IN1

IN2







InterfacesOn the front panel of the BA2, there are two pairs of LC optical interfaces, which use thepluggable optical modules for easy maintenance. Table 12-2 lists the type and usage of theseoptical interfaces.




Table 12-2 Optical interfaces of the BA2


Usage

IN1 LC Receives the first channel of optical signals.

OUT1 LC Transmits the first channel of optical signals.

IN2 LC Receives the second channel of optical signals.

OUT2 LC Transmits the second channel of optical signals.

12.1.5 Valid SlotsThe BA2 can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.

12.1.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the BA2 indicates the output optical power of the optical interfaces.

Table 12-3 lists the relation between the board feature code and the output optical power.

Table 12-3 Relation between the board feature code and output optical power for the BA2

Board Barcode Feature Code Output Optical Power

SSN1BA201 01 14 dBm for dual-channeloptical power amplification

SSN1BA202 02 17 dBm for dual-channeloptical power amplification

SSN1BA203 03 14 dBm for optical poweramplification

SSN1BA204 04 17 dBm for optical poweramplification

SSN1BA205 05 14 or 17 dBm for dual-channeloptical power amplification

12.1.7 Technical SpecificationsThe technical specifications of the BA2 cover the optical interface specifications, boarddimensions, weight and power consumption.


Table 12-4 lists the specifications of the optical interfaces of the BA2.




Table 12-4 Specifications of the optical interfaces of the BA2

Item Specification

Nominal bit rate 2488320 kbit/s and 9953280 kbit/s

Optical interface type V-16.2, U-16.2, L-64.2, V-64.2, U-64.2

Line code NRZ

Input wavelength (nm) BA: 1530 to 1565

Range of input opticalpower (dBm)

BA: –6 to +3

Output optical power(dBm)

BA: 13 to 15 or 15 to 17

Noise figure (dB) BA: < 6.5

Mechanical SpecificationsThe mechanical specifications of the BA2 are as follows:


l Weight (kg): 1.0

Power Consumption

In the normal temperature (25℃), the maximum power consumption of the BA2 is 20 W.

12.2 BPAThis section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, interms of the version, function, principle, front panel and specifications.

12.2.1 Version DescriptionThe functional version of the BPA board is N1.

12.2.2 Function and FeatureDuring the long-haul transmission of optical signals, the attenuation of signals is high. The BAand PA should be used, and thus the optical receiver can normally receive optical signals.

12.2.3 Working Principle and Signal FlowThe BPA consists of the EDFA module, control module, communication module, and DC/DCconverter module.

12.2.4 Front PanelOn the front panel of the BPA, there are indicators and interfaces.

12.2.5 Valid SlotsThe BPA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.

12.2.6 Board Feature Code




The code behind the board name in the barcode is the board feature code. The board feature codeof the BPA indicates the output optical power of the optical interfaces.

12.2.7 Technical SpecificationsThe technical specifications of the BPA cover the optical interface specifications, boarddimensions, weight and power consumption.

12.2.1 Version DescriptionThe functional version of the BPA board is N1.

12.2.2 Function and FeatureDuring the long-haul transmission of optical signals, the attenuation of signals is high. The BAand PA should be used, and thus the optical receiver can normally receive optical signals.

Figure 12-4 shows the location of the BA and PA in the optical transmission system.

Figure 12-4 Location of the BA and PA in the optical transmission system

BA

PA Receive

Transmit

Transmit

Receive

Table 12-5 lists the functions and features of the BPA.

Table 12-5 Functions and features of the BPA

Function andFeature

BPA

Basic function Increases the launched optical power of the line board to 13–15 dBmor 15–18 dBm. Thus, when the G.652 optical fiber with a loss of 0.275dB/km is used, the transmission distance can be 120 km, 130 km, orabove.

Function of the PA Provides the PA module to preamplify the received optical signals.Increases the power of the small volume of optical signals by 22–25dB, and thus enhances the sensitivity of the receiver to –37 dBm.

EDFA l Automatically controls the optical power and laser temperature ofthe EDFA module.

l Automatically monitors the input and output optical power of theEDFA module and queries the optical power.

l Protects the EDFA module. When no optical signals are input, thelaser is automatically turned off. When optical signals are input, thelaser is automatically turned on.




Function andFeature

BPA

Performance andalarm monitoringa

Reports the performance parameters of the laser. Provides rich alarmsand performance events for easy management and maintenance of theequipment.

Software upgrade Supports the software upgrade and expansion without interruptingservices.

a:The BPA does not support the alarm in the test state and the query of the power supplyvoltage.

12.2.3 Working Principle and Signal FlowThe BPA consists of the EDFA module, control module, communication module, and DC/DCconverter module.

Figure 12-5 shows the block diagram for the functions of the BPA.

Figure 12-5 Block diagram for the working principle of the BPA

Fiberdistributor

Inputisolate

DopederbiumfiberWDM

coupler


monitor(Pin1)

Outputpower

monitor(Pin2)

Opticalsplitter


Pumpcurrent

Filter

Pumptemperature

control

Lasershutdown

Inputpower

Outputpower

LOS inManualcontrol


Optical output

AD/DA



Communicationmodule

EDFA module

Control module

+3.3 V backuppower


Fuse

DC/DCconverter

5 V

-48 V/ -60 V

-48 V/ -60 V

module

module

EDFA ModuleThe optical amplifier unit consists of two EDFA modules. One is BA and the other PA. Whenthe board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the centralwavelength is added to the optical output end of the module. A booster amplifier (BA) does not




have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in theerbium fiber inside the EDFA module. Bump light and input signal light are coupled into theerbium fiber through an optical coupler. The input and output optical signals of the module areled out by two fiber splitters as per a specific coupling ratio. The optical signals are then convertedto optical current by two PIN photoelectrical diodes. The input and output powers of the EDFAmodule are determined as per the optical signals. The module also applies optical isolatingmeasures at the input and the output ends to improve the performance of the module.

Control ModuleThe control module:




l Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/Dconverting unit converts the temperature value of the cooling electricity and the input/outputoptical power from analog values to digital values. The converted values are then sent to CPU,which generates performance reporting event or alarm. The A/D converting unit also convertsbump electricity from analog values to digital values. The converted values are then sent to CPU.After the CPU processes the converted values, the D/A converting unit controls precisely thedriving analog circuit of the bump laser of the EDFA optical module. The internal temperatureof the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputstemperature change to drive cooler to keep the internal temperature of the bump laser moduleat 25℃.

Communication ModuleThe communication module supports ethernet communication.

DC/DC Converter ModuleThrough the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. Inaddition, this module provides protection to the board +3.3 V power supply.

12.2.4 Front PanelOn the front panel of the BPA, there are indicators and interfaces.

Appearance of the Front PanelFigure 12-6 shows the appearance of the front panel of the BPA.




Figure 12-6 Front panel of the BPA

BPA

BPA

STATACTPROGSRV

POU

TB

OU

TB

INPIN







InterfacesOn the front panel of the BPA, there are two pairs of LC optical interfaces, which use thepluggable optical modules for easy maintenance. Table 12-6 lists the type and usage of theseoptical interfaces.




Table 12-6 Optical interfaces of the BPA


Usage

BIN LC Receives one channel of optical signals for amplification.

BOUT LC Transmits one channel of amplified optical signals.

PIN LC Receives one channel of optical signals for pre-amplification.

POUT LC Transmits one channel of pre-amplified optical signals.

12.2.5 Valid SlotsThe BPA can be housed in any of slots 12–13 in the OptiX OSN 1500A subrack, or any of slots11–13 in the OptiX OSN 1500B subrack.

12.2.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the BPA indicates the output optical power of the optical interfaces.


Table 12-7 Relation between the board feature code and output optical power for the BPA

Board Barcode Feature Code Description

SSN1BPA01 01 Receiver sensitivity of the PAmodule: –37 dBmOutput optical power of the BAmodule: 14 dBm

SSN1BPA02 02 Receiver sensitivity of the PAmodule: –37 dBmOutput optical power of the BAmodule: 17 dBm

12.2.7 Technical SpecificationsThe technical specifications of the BPA cover the optical interface specifications, boarddimensions, weight and power consumption.

Optical Interface SpecificationsTable 12-8 lists the specifications of the optical interfaces of the BPA.




Table 12-8 Specifications of the optical interfaces of the BPA

Item Specification

Nominal bit rate 2488320 kbit/s and 9953280 kbit/s

Optical interface type V-16.2, U-16.2, L-64.2, V-64.2, U-64.2

Line code NRZ

Input wavelength (nm) BA: 1530 to 1565PA: 1550.12


BA: –6 to +3PA: –10 to –37


BA: +13 to +15 or +15 to +17

Sensitivity (dBm) PA: –37

Noise figure (dB) BA: < 6.5PA: < 6

NOTE

When performing loopback to the PA module of the BPA, prevent the damage caused by high input opticalpower to the optical module.

Mechanical SpecificationsThe mechanical specifications of the BPA are as follows:


l Weight (kg): 1.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the BPA is 20 W.

12.3 COAThis section describes the COA, a case-shaped optical amplifier, in terms of the version, function,principle, front panel, installation position and specifications.

12.3.1 Version DescriptionThe COA has three versions, 61, 62 and N1.

12.3.2 Function and FeatureThe COA is used to integrate the EDFA module, drive circuit, and communication circuit in analuminium case.

12.3.3 Working Principle and Signal FlowThe 61COA and N1COA consist of the EDFA module, control module, communication module,and DC/DC converter module.




12.3.4 Front PanelOn the front panel of the COA, there are indicators and interfaces.

12.3.5 Installation PositionThe COA is case-shaped, and thus it is does not occupy a slot in the subrack.

12.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the 61COA indicates the output optical power of the optical interfaces.

12.3.7 Technical SpecificationsThe technical specifications of the COA cover the dimensions, weight and power consumption.

12.3.1 Version DescriptionThe COA has three versions, 61, 62 and N1.

The 62COA, 61COA and N1COA share the working principle. The difference among them liesin the optical amplifier modules they use. The 62COA uses the Raman optical amplifier module.The 61COA and N1COA use the EDFA optical amplifier module.

Table 12-9 lists the details on the versions of the COA.

Table 12-9 Version Description of the COA

Item Description

Functionalversion

The COA has three versions, 61, 62, and N1.

Difference The 61COA is the EDFA optical amplifier in the 1550-nm fibercommunication window.The N1COA is the EDFA optical amplifier in the 1530 nm to 1560 nmfiber communication window.The N1COA does not have the filter and is a multi-wavelength amplifier.The 62COA uses the Raman optical amplifier module.


12.3.2 Function and FeatureThe COA is used to integrate the EDFA module, drive circuit, and communication circuit in analuminium case.

The COA is an external and independent amplifier, which does not occupy a slot and can workindependently. The maximum numbers of the 61COA, N1COA, and 62COA that can beconfigured in a system are two, two, and one respectively.

61COA and N1COAThe 61COA and N1COA, erbium doped amplifiers, can be configured with only one EDFAoptical module and be used as the BA, PA, or LA. Figure 12-7 shows the appearance of the61COA and N1COA.

The optical features of the 61COA are the same as those of the BPA and BA2. The maindifference is that the 61COA and N1COA are external optical amplifier units, which are directly




installed in the ETSI cabinetwithout occupying slots in the subrack and are independentlypowered.

Figure 12-7 Appearance of the case-shaped 61COA and N1COA (PA)

The application of the 61COA and N1COA in the optical transmission system is the same asthat of the BA2 and BPA. Table 12-10 lists the functions and features of the 61COA and N1COA.

Table 12-10 Functions and features of the 61COA and N1COA

Function andFeature

61COA and N1COA

Function of the BA The 61COA enhances the launched optical power to 13–15 dBm or15–17 dBm, and thus the valid transmission distance of opticalsignals can be extended.

Function of the PA The N1COA is a PA, with a receiver sensitivity of –38 dBm.

Automatic laser shut-down

Supports the ALS function.

Function of the serialcommunication

Communicates with the CXL through the RS232 serial port, reportsthe alarms and performance events from the COA to the T2000, andreceives the configuration commands issued by the T2000.

62COAThe 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the SDHequipment.

The 62COA inputs counter-propagated pumping optical signals to fibers for distributed Ramanamplification. Different from that of the 61COA, the gain medium of Raman amplification isthe line fiber that can realize better noise performance. Thus, the 62COA can extend thetransmission distance, lower the signal-to-noise ratio and realize ultra long hop transmission fora single span.

Figure 12-8 lists the appearance of the 62COA.




Figure 12-8 Appearance of the case-shaped 62COA

5

12

3

4

1. Captive screw 2. Ejector lever 3. COA board4. ESD jack 5. Power access board

The 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the transmissionsystem. During the transmission, the 62COA amplifies optical signals based on the stimulatedRaman scattering of the fiber. The 62COA provides optical transmission for more than 170 km,when used with the EDFA. See Figure 12-9.

Figure 12-9 Application of the optical Raman amplifier (62COA)

Transmitting end

Opticalreceiver

Pump light

Receiving end

Signal light

Laser

EDFA Pump light

Fiber

Raman Amplifier

Coupler

During the optical transmission, the Raman amplifier amplifies optical signals by inputingcounter-propagated pumping optical signals to fibers for distributed Raman amplification. Thus,the phase of optical signals is significantly different from that of pumping signals. The powerfluctuation of the Raman pumping is offset in the counter-propagation, and thus the noise causedby the pumping can be effectively suppressed.

Table 12-11 lists the functions and features of the 62COA.




Table 12-11 Functions and features of the 62COA

Function andFeature

62COA

Basic function Configured at the receive end of the SDH system, and provides extralong-haul transmission (more than 170 km), when used with anEDFA at the transmit end with an output power of 17 dBm.

Function of the PA The 62COA is a PA, with a receiver sensitivity of -39 dBm.

Automatic laser shut-down

Supports the ALS function.

Function of the serialcommunication

Communicates with the CXL through the RS232 serial port, reportsthe alarms and performance events from the COA to the T2000, andreceives the configuration commands issued by the T2000.

12.3.3 Working Principle and Signal FlowThe 61COA and N1COA consist of the EDFA module, control module, communication module,and DC/DC converter module.

The working principle of the N1COA is similar to that of the 61COA. The 61COA has the filterunit but the N1COA does not.

Figure 12-10 shows the block diagram for the functions of the 61COA and N1COA.

Figure 12-10 Block diagram for the functions of the 61COA and N1COA

Fiberdistributor

Inputisolate

DopederbiumfiberWDM

coupler


monitor(Pin1)

Outputpower

monitor(Pin2)

Opticalsplitter


Pumpcurrent

Filter

Pumptemperature

control

Lasershutdown

Inputpower

Outputpower

LOS inManualcontrol


Optical output

AD/DA



Communicationmodule

EDFA module

Control module

+3.3 V backuppower


Fuse

DC/DCconverter

5 V

-48 V/ -60 V

-48 V/ -60 V

module

module




EDFA Module

The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. Whenthe board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the centralwavelength is added to the optical output end of the module. A booster amplifier (BA) does nothave the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in theerbium fiber inside the EDFA module. Bump light and input signal light are coupled into theerbium fiber through an optical coupler. The input and output optical signals of the module areled out by two fiber splitters as per a specific coupling ratio. The optical signals are then convertedto optical current by two PIN photoelectrical diodes. The input and output powers of the EDFAmodule are determined as per the optical signals. The module also applies optical isolatingmeasures at the input and the output ends to improve the performance of the module.

Control Module

The control module:




l Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/Dconverting unit converts the temperature value of the cooling electricity and the input/outputoptical power from analog values to digital values. The converted values are then sent to CPU,which generates performance reporting event or alarm. The A/D converting unit also convertsbump electricity from analog values to digital values. The converted values are then sent to CPU.After the CPU processes the converted values, the D/A converting unit controls precisely thedriving analog circuit of the bump laser of the EDFA optical module. The internal temperatureof the bump laser module is kept at 25℃. The temperature sensor inside the bump laser outputstemperature change to drive cooler to keep the internal temperature of the bump laser moduleat 25℃.

Communication Module

The communication module supports ethernet communication.


Through the DC/DC converter module, the power converting module provides required DCvoltages for each chip on the board. The following voltages are provided: ±5 V and +3.3 V. Inaddition, this module provides protection to the board +3.3 V power supply.

12.3.4 Front PanelOn the front panel of the COA, there are indicators and interfaces.


Figure 12-11 shows the appearance of the front panels of the 61COA and N1COA.




Figure 12-11 Front panel of the 61COA and N1COA

1 2 3 4 5 6 7

8 9 10

11

1. ID DIP switch 2. Running indicator 3. Alarm indicator 4. RS232-15. RS232-2 6. MONITOR-1 7. MONITOR-2 8. IN optical port9. OUT optical port 10. Power switch 11. –48 V power interface

Figure 12-12 shows the appearance of the front panel of the 62COA.

Figure 12-12 Front panel of the 62COA

1. SC/PC optical interface 2. E2000 optical interface 3. Air filter4. Fan board 5. RJ-45

8. DIP switch (8–5 bits) 9. DIP switch (4–1 bits)10. Power input interface 11. Power switch

6. RS232-1-27. RS232


l Board running state (RUN), which is green when lit.

l Fan alarm indicator (ALM), which is red when lit.


InterfacesOn the front panel of the 61COA and N1COA, there are one pair of SC/PC optical interfaces,which are used to input or output one channel of optical signals. The input optical interface ofthe 62COA is connected to the E2000 flange and the output optical interface is connected to theSC flange. Figure 12-13 shows the SC/PC optical interfaces of the 61COA and N1COA.




Figure 12-13 SC/PC fiber connector

Figure 12-14 shows the flange and fiber connector used at the input optical interface of the62COA.

Figure 12-14 E2000 flange and fiber connector

NOTE

The dust cap is specially designed for the E2000 fiber jumper. Do not remove the cap during fiberconnection. For normal fiber connection, directly insert the fiber jumper into the E2000 flange.

The COA has two RS232 serial interfaces, which are connected to the SCC unit for reportingof alarms and performance events.

Table 12-12 lists the pins of the RS232 interface.




Table 12-12 Pins of the RS232 interface

Front View RS232-1 RS232-2 Definition

1

9

2 2 Pin for receivingdata

3 3 Pin fortransmitting data

5 5 Pin for commongrounding

TIP

For the communication with the CXL, the RS232-1 interface of the COA is connected to the F&f interfacethrough the serial control cable.

The RS232-2 interface is used in the case of several COA on one NE.

Use the serial interface cable to connect the RS232-2 interface of the COA numbered 1 to theRS232-1 interface of the COA numbered 2. Then connect the RS232-2 interface of the COAnumbered 2 to the RS232-1 of the COA numbered 1. Connect the RS232-1 and RS232-2interfaces in this way. All the COA use the RS232-1 interface of the COA numbered 1 tocommunicate with the SCC unit in the subrack.

The COA has two MONITOR interfaces. The MONITOR-1 and MONITOR-2 interfaces arethe alarm output interfaces when the 61COA is used separately. The two interfaces are the same.Table 12-13 lists the pins of the MONITOR-1 and MONITOR-2 interfaces.

Table 12-13 Pins of the MONITOR-1 and MONITOR-2 interfaces

Front View MONITOR-1

MONITOR-2 Definition

1

9

1, 6 1, 6 The input optical power of theEDFA module is too low.

2, 7 2, 7 The working current of the pumplaser of the EDFA module crossesthe threshold.

3, 8 3, 8 The cooling current of the pumplaser of the EDFA module crossesthe threshold.

4, 9 4, 9 The ambient temperature of theEDFA crosses the threshold.

5 5 Digital ground.

The 62COA has one RJ-45 connector, through which the 62COA is connected to the computerfor software loading. Table 12-14 lists the pins of the RJ-45 connector of the 62COA.




Table 12-14 Pins of the RJ-45 connector of the 62COA

Front View Pin Description

8 7 6 5 4 3 2 1




4 Not defined

5 Not defined


7–8 Not defined

The COA has a DIP switch.

l The DIP switch of the 61COA or N1COA is on the lower left panel and is used to set theID for 61COA or N1COA. When you turn it upside, it is OFF. When you turn it downside,it is ON. The SCC uses the IDs to identify and communicate with the 61COA or N1COA.

l The DIP switch of the 62COA is used to set the ID of 62COA and the type of fibers. TheDIP switch has eight bits, from the left to right. The most left one is 8 and the most rightone is 1. For each bit, when you turn it upside, it means 0; when you turn it downside, itmeans 1. The first four bits (1–4) are used to set the board ID, which ranges from 20 to 35and from 20 to 27 in actual using. The fifth bit is used to set the fiber type. If it is turnedas 0, it indicates the fiber is of the G.652 type. If it is turned as 1, it indicates the fiber is ofthe G.655 type.

12.3.5 Installation PositionThe COA is case-shaped, and thus it is does not occupy a slot in the subrack.

In an ETSI cabinet, the 61COA or N1COA is intalled in a special bracket, and the 62COA isinstalled directly in the cabinet with the mounting ears. On the T2000, the logical slots of the61COA, N1COA, and 62COA are slots 101–102.

Installation of the 61COA or N1COAThe installation of the 61COA is taken as an example. The bracket with guide rails is fixed onthe crossbars on both sides the cabinet. The 61COA is pushed into the brackets along the guiderails and then fixed. One bracket can house two 61COA horizontally. The front panel of the61COA is at the front side of the cabinet. Figure 12-15 shows the installation of the 61COA.




Figure 12-15 Position of the 61COA in the ETSI cabinet

Installation of the 62COAThe case-shaped 62COA can be installed in the 300 mm or 600 mm ETSI cabinet with mountingears and screws. If the upward-wiring scheme is applied, the 62COA is installed at the bottomof the ETSI cabinet (first and third floating nuts). If the downward-wiring scheme is applied,the 62COA is installed in any idle place of the 2.6 m high cabinet or in the ETSI cabinet whichis not fully configured.

12.3.6 Board Feature CodeThe code behind the board name in the barcode is the board feature code. The board feature codeof the 61COA indicates the output optical power of the optical interfaces.


Table 12-15 Relation between the board feature code and output optical power for the 61COA

Board Barcode Feature Code Output Optical Power

SS61COA01 01 14 dBm

SS61COA02 02 17 dBm

12.3.7 Technical SpecificationsThe technical specifications of the COA cover the dimensions, weight and power consumption.

Optical Interface SpecificationsTable 12-16 lists the specifications of the optical interfaces of the COA.

Table 12-16 Specifications of the optical interfaces of the COA

Item Specification

61COA N1COA 62COA

Line code NRZ




Item Specification

61COA N1COA 62COA


1550 1550.12


BA: -6 to +3PA: -10 to -37

-10 to -37 –39 to –20 (2.5 Gbit/s signalswithout FEC)


+13 to +15 +15 to +17 NA

Pump wavelength(nm)

NA 1451.2

Max. on/off gain (dB) NA > 15 (for the G.652 fiber)

Noise figure (dB) NA < –1.5

Mechanical SpecificationsThe mechanical specifications of the 61COA and N1COA are as follows:

l Board dimensions (mm): 50 (H) x 190 (D) x 240 (W)

l Weight (kg): 3.5

The mechanical specifications of the 62COA are as follows:

l Board dimensions (mm): 86 (H) x 436 (D) x 294 (W)

l Weight (kg): 8.0

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the 61COA and N1COAis 10 W.

In the normal temperature (25℃), the maximum power consumption of the 62COA is 75 W.




13 Power Interface Boards

About This Chapter

This chapter describes the power interface boards, such as the UPM (CAU), PIU, and PIUA.

13.1 UPMThis section describes the UPM, an uninterruptable power module, in terms of the version,function, principle, front panel and specifications.

13.2 PIUThis section describes the PIU, a power interface unit, in terms of the version, function, principle,front panel, configuration and specifications.

13.3 PIUAThis section describes the PIUA, a power interface unit, in terms of the version, function,principle, front panel, configuration and specifications.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 13 Power Interface Boards


13.1 UPMThis section describes the UPM, an uninterruptable power module, in terms of the version,function, principle, front panel and specifications.

13.1.1 Version DescriptionNone13.1.2 Function and FeatureThe UPM, a special power supply system, is coded GIE4805S.13.1.3 Working Principle and Signal FlowThe UPM receives power from one channel of 220 V AC mains supply, which is rectified to –48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DCpower supplies and one channel of battery power supply.13.1.4 Rear PanelOn the rear panel of UPM, there are indicators and interfaces of many types.13.1.5 Valid SlotsThe UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, thelogical slot of the UPM is slot 50.13.1.6 Technical SpecificationsThe technical specifications of the UPM cover dimensions and weight.

13.1.1 Version DescriptionNone

13.1.2 Function and FeatureThe UPM, a special power supply system, is coded GIE4805S.

The UPM directly converts the 110 V or 220 V AC mains to the –48 DC communication voltage.As a result, the requirements of telecommunication carriers who cannot provide the –48 DCpower to communication equipment or who require the usage of the storage battery can be met.

The UPM consists of the power supply case (110 V or 220 V to –48 V) and storage battery. Theoutput power of one UPM is 2 x 270 W. Figure 13-1 shows the appearance of the power supplycase with a height of 1U. The power supply case of the UPM can be directly installed in a 19-inch or ETSI cabinet.

Figure 13-1 Appearance of the power supply case

GIE480

5S

13 Power Interface BoardsOptiX OSN 1500 Intelligent Optical Transmission System



NOTE

One the T2000, the UPM is displayed as a CAU board. Thus, add a CAU on the T2000 to manage andmaintain the UPM.

The storage battery of the UPM is used with the power supply case. If the external AC currentnormally charges the storage battery, the storage battery can provide power for four hours whenthe external 110 V or 220 V AC current is interrupted. When the UPM provides power supplyfor the OptiX OSN equipment, only one power supply case should be connected to the storagebattery group.

The OptiX OSN equipment requires two power supply cases and one storage battery groupcomposed of four 12 V –40 Ah storage batteries. If the equipment does not require the storagebattery, only configure one power supply case. The standard full configuration for each powersupply case requires two rectifier modules and one monitoring module.

Table 13-1 lists the functions and features of the UPM.

Table 13-1 Functions and features of the UPM

Item UPM

Two-channel hotbackup

The converting portion of the UPM has the hot backup function oftwo-channel AC/DC rectifier modules. In addition, the two rectifiermodules with the function of load balance can work at the same. Ifone rectifier module fails, the other one immediately takes over theentire load. As a result, the working equipment is not affected, andthe system stability is enhanced.

Hot swap function In the UPM power supply system, the AC/DC rectifier modules havethe hot swap function. When the faulty rectifier module is removed,the other rectifier module is not affected. Thus, the systemmaintainability is enhanced.

Protection functionfor the storagebattery

The UPM can protect the storage battery. When the mains supply isinterrupted, the power supply system can automatically switch to thestorage battery. Thus, the normal running of equipment is notaffected. The capacity of the storage battery module is 40 Ah.

Function ofmonitoring

The UPM integrates the monitoring module and T2000 monitoringmodule. The monitoring module monitors and controls theparameters and states of the rectifier module, AC/DC powerdistribution, and storage battery group in real time, and then reportsthe parameters and states to the T2000. The storage batteryautomaticallly realizes the floating charging and current limitingmanagement.

Band loadingcapacity

The band loading capacity of each rectifier module is 270 W.

13.1.3 Working Principle and Signal FlowThe UPM receives power from one channel of 220 V AC mains supply, which is rectified to –48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DCpower supplies and one channel of battery power supply.



When the UPM works normally, the monitoring module controls the rectifier module, batteryloop circuit and loading loop circuit, which then work according to the preset parameters anduser settings. The monitoring module also monitors their status and data.

When the mains power supply goes faulty, the battery power supply system supplies power tothe equipment. Before the mains power supply goes faulty, the battery power supply systemmust be present. When the mains power supply fails and the battery starts discharging, themonitoring module reports the alarms indicating the fault of the mains power supply. As thebattery discharges, the battery voltage decreases. When the battery voltage decreases to 45 V,the monitoring module reports the alarm indicating the undervoltage. When the battery voltagedecreases to 43 V, the battery cuts off the connection to the equipment and protects itself.

When the mains power supply recovers, the UPM works normally.

13.1.4 Rear PanelOn the rear panel of UPM, there are indicators and interfaces of many types.

Appearance of the Front PanelFigure 13-2 shows the rear view of the UPM (subject to the UPM on site ).

Figure 13-2 Rear view of the UPM

AC100~240 ALMRUN

RS232

1 32

ALM Vout ALM Vout

4

5 6

BAT-

BAT+

48V+

48V-

LOAD1 LOAD2

CAUTION!DO NOT INVERT POLARITY注意极性防止反接

BAT

1. AC input 2. Rectifier module/air outlet 3. Communication interface 4. Battery interface5. Load 6. Load

IndicatorsThe following indicators are for the rectifier module on the left of the UPM.

l Rectifier module fault indicator (ALM), which is red when lit.

l Rectifier module output state indicator (Vout), which is green when lit.

The following indicators are for the monitoring module on the top panel of the UPM.

l Power supply system fault indicator (ALM), which is red when lit.




l Power supply system indicator (RUN), which is green when lit.


InterfacesThere are four interfaces on the rear panel of the UPM. Table 13-2 lists the type and usage ofthese interfaces.

Table 13-2 Interfaces on the rear panel of the UPM


AC100–240 Power interface Acts as a socket for the AC mains supply andaccesses 110 V or 220 V AC power supply.

Red switch button Button Locates on the right of the panel of the rectifiermodule. Press the switch button to enable ordisable the functioning of the rectifier module.

RS232communicationinterface

RS232 The power supply system can connect to theSCC of the OptiX OSN equipment through thisinterface to realize the functions such as thealarm reporting and remote control. Connect theRS232 serial interface of one power box to theF&f interface of the OptiX OSN equipment. TheT2000 then can monitor the battery and thepower box. Connect the RS232 interface of theother power box to the ALM1 interface of theOptiX OSN equipment. The T2000 then canmonitor the other power box.

Power outputinterface

Power interface Three power output interfaces are on the mostright of the power box. The top interface is abattery interface, which can be connected to thesocket on the battery by using battery cables.The bottom two are loading interfaces, whichcan be connected to the OptiX OSN equipmentand supply power to the equipment.

Table 13-3 lists the pins of the RS232 interface.

Table 13-3 Pins of the RS232 interface of the UPM

Item Pin Usage or on/off State

Pin for receiving data 2 Receives data.

Pin for transmitting data 3 Transmits data.

Pin for common grounding 5 Grounds.



Item Pin Usage or on/off State

Pins for alarms indicatingfaults of the rectifiermodule

8–9 On

Pins for normal state of therectifier module

8–9 Off

Pins for alarms indicatingthe off state of the ACpower supply

8–7 On

Pins for the normal state ofthe AC power supply

8–7 Off

Pins for the alarmindicating undervoltagedischarged from the battery

8–6 On

Pins for the alarmindicating no dischargefrom the battery

8–6 Off

13.1.5 Valid SlotsThe UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, thelogical slot of the UPM is slot 50.

13.1.6 Technical SpecificationsThe technical specifications of the UPM cover dimensions and weight.

Specifications of the power supply

Table 13-4 lists the specifications of the power supply of the UPM.

Table 13-4 Specifications of the power supply of the UPM

Item Specification

Input AC voltage range 90–264 V AC

AC input One channel of monophase three-wire AC power: 47 Hz–63 Hz

Rated input current ≤ 3.5 A

Nominal output voltage 54.0±0.5 V

Rated output current 8 A (Two loading outputs, each of which has the loadingvoltage not more than 5 A)

Number of backup battery groups 1 (40 Ah)




Item Specification

Charging current of the backupbattery

≤ 3 A

Fuse of the backup battery 10 A

Undervoltage DC point of thebattery

46±0.5 V

Termination voltage point of thebattery

43.5±0.5V

Floating charge voltage of thebattery

-54.0±0.5 V

Regulated voltage precision ≤ ±1%

Non-balance of load sharing ≤ ±5% (50%–100% loading)

Rated efficiency of the integrateddevice

≥ 80%

Peak stray noise voltage ≤ 200 mV

Voltage drop in the power panel(20℃)

≤ 500 mV

Electrical network adjustmentrate

≤ ±0.1%

Mechanical SpecificationsThe mechanical specifications of the UPM are as follows:

l Dimensions of the UPM (mm): 438 (H) x 240 (D) x 44 (W)

l Dimensions of a battery (mm): 197 (H) x 165 (D) x 170 (W)

13.2 PIUThis section describes the PIU, a power interface unit, in terms of the version, function, principle,front panel, configuration and specifications.

The OptiX OSN 1500B supports the PIU and the OptiX OSN 1500A does not.

13.2.1 Version DescriptionThe functional version of the PIU is R1.

13.2.2 Function and FeatureThe PIU is used to access the power supply, and to provide the lightning protection and filtering.

13.2.3 Working Principle and Signal FlowThe PIU consists of the protecting unit, filter unit, power detecting unit and clock protectingunit.

13.2.4 Front PanelOn the front panel of the PIU, there are indicators and power interfaces.



13.2.5 Valid SlotsThe PIU can be housed in any of slots 18–19 in the OptiX OSN 1500B subrack.

13.2.6 Technical SpecificationsThe technical specifications of the PIU cover the dimensions, weight, power consumption, inputvoltage and fuse tube.

13.2.1 Version DescriptionThe functional version of the PIU is R1.

13.2.2 Function and FeatureThe PIU is used to access the power supply, and to provide the lightning protection and filtering.

Table 13-5 lists the functions and features of the PIU.

Table 13-5 Functions and features of the PIU

Function andFeature

PIU

Function oflightning protection

Provides the lightning protection, and reports the alarm indicating thefailure of the lightning protection module.

Function offiltering

Enhances the electromagnetic compatibility of the system by filteringthe power supply port and shielding the board.

Power supplyinterface

Provides one 50 W power interface for external devices, such as theCOA.

Power supply of theFAN

Provides –48 V ± 20% voltage for the FAN.

Clock interface Provides 75-ohm clock input and output interfaces, and protects clocksignals.

Alarm monitoring Reports the board in-service alarm.

Power supplybackup

Supports the 1+1 hot backup. Any one PIU can provide power for theentire subrack by itself.

13.2.3 Working Principle and Signal FlowThe PIU consists of the protecting unit, filter unit, power detecting unit and clock protectingunit.

Figure 13-3 shows the block diagram for the functions of the PIU.




Figure 13-3 Block diagram for the functions of the PIU

NEG(-)

RTN(+)

NEG(-)

RTN(+)

Clock input Clock output

Powerdetecting

unit

Protectingunit

Filterunit

LEDindication

Clockprotecting

unit

Filter UnitThe filter unit uses the electromagnetic interference (EMI) filter to filter the electromagneticinterference signals and thus to keep the equipment running in a stable manner.

Protecting UnitThis unit is used to prevent the equipment from overcurrent and lightning.

Power Detecting UnitThe power detecting unit checks whether the input power supply is valid and uses indicators toindicate the status of the input power supply.

Clock Protecting UnitThis unit is used to protect the input clock signals.

13.2.4 Front PanelOn the front panel of the PIU, there are indicators and power interfaces.

Appearance of the Front PanelFigure 13-4 shows the appearance of the front panel of the PIU.



Figure 13-4 Front panel of the PIU

PIU

POWER

PWR

O I

NEG

(-)R

TN(+)

CLK

OU

T

CLK

IN

PWS

PIU

Indicators

A power supply indicator (POWER) is present on the front panel of the board and is green whenlit..


Interfaces

There are three power interfaces on the front panel of the PIU. Table 13-6 lists the type andusage of the interfaces.

Table 13-6 Interfaces on the front panel of the PIU


Usage

PWR Power inputinterface

Inputs the –48 V power supply.

ClK IN SMB 75-ohm clock input interface (SMB)

ClK OUT SMB 75-ohm clock output interface (SMB)

13.2.5 Valid SlotsThe PIU can be housed in any of slots 18–19 in the OptiX OSN 1500B subrack.

13.2.6 Technical SpecificationsThe technical specifications of the PIU cover the dimensions, weight, power consumption, inputvoltage and fuse tube.




Mechanical SpecificationsThe mechanical specifications of the PIU are as follows:

l Board dimensions (mm): 108 (H) x 110 (D) x 41.5 (W)

l Weight (kg): 1.3

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the PIU is 1.5 W.

Input VoltageThe input voltage of the PIU ranges from –38.4 V to –72 V.

Fuse TubeThe main loop fuse of the PIU is 250 V-10 A-0.006 ohm.

13.3 PIUAThis section describes the PIUA, a power interface unit, in terms of the version, function,principle, front panel, configuration and specifications.

The OptiX OSN 1500A supports the PIUA and the OptiX OSN 1500B does not.

13.3.1 Version DescriptionThe functional version of the PIUA is R1.

13.3.2 Function and FeatureThe PIUA is used to access the power supply, and to provide the lightning protection andfiltering.

13.3.3 Working Principle and Signal FlowThe PIUA consists of the power interface unit, protecting unit, filter unit, power supply detectingunit, fan power supply unit and external power supply interface unit.

13.3.4 Front PanelOn the front panel of the PIUA, there are indicators and power interfaces.

13.3.5 Valid SlotsThe PIUA can be housed in any of slots 1–11 in the subrack.

13.3.6 Technical SpecificationsThe technical specifications of the PIUA cover the dimensions, weight, power consumption,input voltage and fuse tube.

13.3.1 Version DescriptionThe functional version of the PIUA is R1.

13.3.2 Function and FeatureThe PIUA is used to access the power supply, and to provide the lightning protection andfiltering.



Table 13-7 lists the functions and features of the PIUA.

Table 13-7 Functions and features of the PIUA

Function andFeature

PIUA

Function oflightning protection

Provides the lightning protection, and reports the alarm indicating thefailure of the lightning protection module.

Function offiltering

Enhances the electromagnetic compatibility of the system by filteringthe power supply port and shielding the board.

Power supplyinterface

Provides one 50 W power interface for external devices, such as theCOA.

Power supply of theFAN

Provides 48 V ± 20% voltage for the FAN.

Alarm monitoring Reports the board in-service alarm.

Power supplybackup

Supports the 1+1 hot backup. Any one PIU can provide power for theentire subrack by itself.

13.3.3 Working Principle and Signal FlowThe PIUA consists of the power interface unit, protecting unit, filter unit, power supply detectingunit, fan power supply unit and external power supply interface unit.

Figure 13-5 shows the block diagram for the functions of the PIUA.

Figure 13-5 Block diagram for the functions of the PIUA

NEG(-)

RTN(+)

NEG(-)

RTN(+)

Externalpower supply

interface

Powerdetection

Lightningprotection

module

Filtermodule

LEDindication

Fan powermodule

Power Interface UnitThis unit accesses the –48 V or –60 V power supply for the system.

Protection UnitThis unit is used to prevent the equipment from overcurrent and lightning.




Filter UnitThe filter unit uses the electromagnetic interference (EMI) filter to filter the electromagneticinterference signals and thus to keep the equipment running in a stable manner.

Power Detecting UnitThe power detecting unit checks whether the input power supply is valid and uses indicators toindicate the status of the input power supply.

Fan Power Supply UnitThis unit is used to supply stable power to the fans.

External Power Supply Interface UnitThis unit supplies –48 V power to the external equipment, such as the COA. The interfaces arepresent on the panel.

13.3.4 Front PanelOn the front panel of the PIUA, there are indicators and power interfaces.

Appearance of the Front PanelFigure 13-6 shows the appearance of the front panel of the PIUA.

Figure 13-6 Front panel of the PIUA

PIUA

NEG

(-)R

TN(+)

PIUA

POWER

PWS

I O

IndicatorsA power supply indicator (POWER) is present on the front panel of the board and is green whenlit..




InterfacesOn the front panel of the PIUA, there are two interfaces and one switch. Table 13-8 lists thetype and usage of the interfaces and switch.

Table 13-8 Interfaces and switch on the front panel of the PIUA


PWR Inputs the –48 Vpower supply.

Inputs the –48 V power supply.

PWS Output interfacefor the 50 Wpower supply

Outputs the 50 W power supply for the COA or HUB.

Power switch Switch Turn the switch to position 1 or ON to supply powerto the equipment. Turn the switch to position 0 or OFFto shut the power supply to the equipment.

13.3.5 Valid SlotsThe PIUA can be housed in any of slots 1–11 in the subrack.

13.3.6 Technical SpecificationsThe technical specifications of the PIUA cover the dimensions, weight, power consumption,input voltage and fuse tube.

Mechanical SpecificationsThe mechanical specifications of the PIUA are as follows:


l Weight (kg): 1.5

Power ConsumptionIn the normal temperature (25℃), the maximum power consumption of the PIUA is 3 W.

Input VoltageThe input voltage of the PIUA ranges from –38.4 V to –72 V.

Fuse tubeThe main loop fuse of the PIU is 250 V-10 A-0.006 ohm.




14 Cables

About This Chapter

This chapter describes the cables used for the equipment. The cables include the fiber jumpers,power cables, alarm cables, management cables, signal cables and clock cables.

14.1 Fiber JumperThe following section describes the types of fiber jumpers and connectors.

14.2 Power Cables and Grounding CablesThe power cables and grounding cables include the cabinet power cable, equipment supply cable,and UPM power cable.

14.3 Alarm CableThe alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable,alarm concatenation cable and alarm input/output cable.

14.4 Management CableThe management cable includes the serial port cable, ordinary phone wire, COA concatenatingcable and network cable.

14.5 Signal CableThe signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signalcable. The OptiX OSN 1500A supports only the E1/E3 signal cable.

14.6 Clock CableThe clock cable includes the clock cable and clock transfer cable.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description 14 Cables


14.1 Fiber JumperThe following section describes the types of fiber jumpers and connectors.

14.1.1 Types of Fiber JumpersThe OptiX OSN equipment can use various types of fiber jumpers.

14.1.2 ConnectorThe OptiX OSN equipment can use various types of connectors.

14.1.1 Types of Fiber JumpersThe OptiX OSN equipment can use various types of fiber jumpers.

Table 14-1 lists the types of fiber jumpers used by the OptiX OSN equipment.

Table 14-1 Types of fiber jumpers

Usage Connector1

Connector2

Cable Length

Optical fiber thatconnects theOptiX OSNequipment to theODF or connectsthe interfaceboard of theOptiX OSNequipment to theoptical fiber ofother equipment

LC/PC FC/PC 2 mm SLMoptical fiber

6 m, 10 m, 20 m, 30 m,50 m

2 mm MLMoptical fiber

3 m, 5 m, 10 m, 20 m,30 m, 50 m

LC/PC SC/PC 2 mm SLMoptical fiber

5m, 10 m, 20 m, 30 m,50 m


10 m, 20 m, 30 m, 50m

SC/PC SC/PC 2 mm SLMoptical fiber

2m, 5 m, 10 m, 20 m,30 m, 50 m, 80 m

Optical fiber thatinterconnects theOptiX OSNequipment

LC/PC LC/PC 2 mm SLMoptical fiber

1.5 m, 3 m, 5 m, 10 m,20 m, 30 m


3 m, 5 m, 10 m, 20 m,30 m

LC/PC FC/PC 2 mm SLMoptical fiber

6 m, 10 m, 20 m, 30 m,50 m

LC/PC SC/PC 2 mm SLMoptical fiber

5m, 10 m, 20 m, 30 m,50 m

Select the fiber connector and the fiber length according to the on-site survey.

14 CablesOptiX OSN 1500 Intelligent Optical Transmission System



CAUTIONWhen selecting the fiber connector, make sure that the single-longitudinal mode or multi-longitudinal mode optical transmitting module is connected to the single-mode fiber.

14.1.2 ConnectorThe OptiX OSN equipment can use various types of connectors.

The four types of fiber connectors are listed as follows:

l Interfaces on the front panel of boards are mostly the LC/PC optical interfaces. See Figure14-1.

l The N2OU08 and 61COA provide the SC/PC optical interfaces.

l The "IN" interface on the externally-installed case-shaped 62COA uses the E2000/APCconnector. See Figure 14-4.

l The ODF at the client side uses the FC/PC or SC/PC optical interface. Figure 14-3 andFigure 14-2 show the corresponding FC/PC and SC/PC optical connectors.

Table 14-2 lists the description of the four optical connectors.

Table 14-2 Types of connectors

Internal FiberConnector

Description

LC/PC Plug-in square fiber connector/protruding polished

E2000/APC Connector with dust-proof cover/protruding polished (8 degrees)

FC/PC Round fiber connector/protruding polished

SC/PC Square fiber connector/protruding polished

LC/PC Optical ConnectorFigure 14-1 shows the appearance of the LC/PC optical connector.

Figure 14-1 LC/PC optical connector



The axial operation instead of rotation is required to insert or remove the LC/PC optical interface.

Align the head of the fiber jumper with the optical interface with proper strength to insert thefiber jumper into the LC/PC connector. To remove the LC/PC fiber jumper, first press the clip,and then push fiber connector inward slightly, and pull out the connector.

SC/PC Optical ConnectorFigure 14-2 shows the appearance of the SC/PC optical connector.

Figure 14-2 SC/PC optical connector

FC/PC Optical ConnectorFigure 14-3 shows the appearance of the FC/PC optical connector.

Figure 14-3 FC/PC optical connector

E2000/APC Optical InterfaceFigure 14-4 shows the appearance of the E2000/APC optical interface.




Figure 14-4 E2000/APC optical connector

14.2 Power Cables and Grounding CablesThe power cables and grounding cables include the cabinet power cable, equipment supply cable,and UPM power cable.

14.2.1 Cabinet –48 V/BGND/PGND Power CableThe –48 V, BGND and PGND power cables are used to supply power to the equipment in thecabinet. One end of the power cable connects to the power distribution cabinet and groundingbar in the equipment room, and the other end connects to the power distribution unit at the cabinettop.

14.2.2 Equipment –48 V/–60 V Power Cable/PGND Grounding CableThe equipment –48 V/–60 V power cable/PGND grounding cable directly connects to theexternal –48 V/–60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinettop and the PIU board on the subrack. The external –48 V/–60 V power supply is led out to theOptiX OSN 1500 equipment.

14.2.3 UPM Power CableThis section describes the UPM power cable in terms of the structure, connection and technicalspecifications.

14.2.1 Cabinet –48 V/BGND/PGND Power CableThe –48 V, BGND and PGND power cables are used to supply power to the equipment in thecabinet. One end of the power cable connects to the power distribution cabinet and groundingbar in the equipment room, and the other end connects to the power distribution unit at the cabinettop.

StructureFigure 14-5 shows the structure of the –48 V cabinet power cable/BGND power groundingcable. Figure 14-6 and Figure 14-7 show the structure of the PGND protection grounding cable.



Figure 14-5 Cabinet –48 V power cable and BGND power grounding cable

1 2

3

1. Cord end terminal 2. Bare connector-OT type 3. Cable tie

Figure 14-6 Cabinet PGND protection grounding cable (JG2)

1. Bare connector-OT type 2. Cable tie 3. Bare connector (JG2)4. Heat-shrink tube 5. Main tag 6. Wire7. Heat-shrink tube

Figure 14-7 Cabinet PGND protection grounding cable (OT)

1. Bare connector-OT type 2. Cable tie 3. Bare connector (OT)4. Heat-shrink tube 5. Main tag 6. Wire7. Heat-shrink tube

Pin AssignmentNone




Technical SpecificationsItem Description

–48 V cabinetpower cable

Connector 2 Bare crimping terminal-OT type-16 mm2-M8-tin plating-bare ring terminal

Connector 1 Single cord end terminal-16 mm2-length 24 mm-inserted 12mm deep-80A-green

Cable type Power cable-450 V/750 V-16 mm2-round and bllue-85A

Cabinet BGNDpowergrounding cable

Connector 2 Bare crimping terminal-OT type-16 mm2-M8-tin plating-bare ring terminal

Connector 1 Single cord end terminal-16 mm2-length 24 mm-inserted 12mm deep-80A-green

Cable type Power cable-450 V/750 V-16 mm2-round and black-85A

Cabinet PGNDprotectiongrounding cable

Connector 1 Bare crimping terminal-OT type-25mm2-M8-tin plating-bare ring terminal

Connector 3 Bare crimping connector-JG2-25 mm2-M6-95A-tinplating, or bare crimping connector-JG2-25 mm2-M8-95A-tin plating, or bare crimping terminal-OT type-25 mm2-M8-tin plating-bare ring terminal

Cable type Power cable-450 V/750 V-25 mm2-yellow and green-85 A

Fireproof level CM

Length 10 m, 20 m, 30 m

14.2.2 Equipment –48 V/–60 V Power Cable/PGND GroundingCable

The equipment –48 V/–60 V power cable/PGND grounding cable directly connects to theexternal –48 V/–60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinettop and the PIU board on the subrack. The external –48 V/–60 V power supply is led out to theOptiX OSN 1500 equipment.

StructureFigure 14-8 shows the structure of the equipment –48 V/–60 V power cable. Figure 14-9 showsthe structure of the PGND grounding cable.



Figure 14-8 Structure of the equipment –48 V/–60 V Power Cable

AA3

A1

A2

Figure 14-9 PGND power cable

1. Bare connector-OT type 2. Cable tie 3. Bare connector 4. Heat-shrink tube5. Main tag 6. Wire 7. Heat-shrink tube

Pin AssignmentFor details on the pin assignment, refer to Table 14-3.

Table 14-3 Equipment –48 V/–60 V power cable

Cable connector Corresponding cable Core color

A1 W1 Blue (–48 V/–60 V power)

A3 W2 Black (power ground)

Technical SpecificationsItem Equipment –48 V/–60 V

power cablePGND grounding cable

Cable connector Cable connector-Dtype-3PIN-female

Bare crimping connector-OT-6 mm2-M4-tin plating-pre-insulated ringterminal-12–10AWG bare crimpingconnector-OT-6 mm2-M8-tin plating-insulated ring terminal-12–10AWG

Cable Type Wire-300 V-16AWG-black (the core is blue andblack)-13A

Wire-600 V-10AWG-yellow/green-50A




Item Equipment –48 V/–60 Vpower cable

PGND grounding cable

Number ofcores

2 1

Fireprooflevel

CM CM

Color Blue or black Yellow and green

Length 15 m, 30 m 15 m, 30 m

14.2.3 UPM Power CableThis section describes the UPM power cable in terms of the structure, connection and technicalspecifications.

StructureFigure 14-10 shows the power cable that is used to connect the UPM to the OptiX OSN 1500.

Figure 14-10 Structure of the UPM power cable

X1 X2

A B

A

BA1A2A3

12

Connection of the UPM Power CableTable 14-4 lists the connections of the UPM power cables.

Table 14-4 Connection of the UPM power cable

CableConnector X1

Corresponding Cable

Cable ConnectorX2

Core Color

A1 W1 1 Blue (–48 V/–60 V powersupply)

A3 W2 2 Black (ground for the powersupply)



Specifications of the UPM Power Cable

Table 14-5 Specifications of the UPM power cable

Item UPM Power Cable

Cable connector X1 Cable connector-D type-3PIN-female (two female and one male)

Cable connector X2 Common plug-2PIN-single row

Cable Type Cable-300 V-1.31 mm2-16 AWG-black (core: blue or black)-13 A

Number ofcores

2

Fireproofclass

CM

Color Core: blue or black

Length 2.5 m

14.3 Alarm CableThe alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable,alarm concatenation cable and alarm input/output cable.

14.3.1 Alarm Input/Output CableThe alarm input cable is used to input the alarm signals of the external equipment to the OptiXOSN equipment. The alarm output cable is used to output the alarm signals to the central alarmmonitoring equipment.

14.3.1 Alarm Input/Output CableThe alarm input cable is used to input the alarm signals of the external equipment to the OptiXOSN equipment. The alarm output cable is used to output the alarm signals to the central alarmmonitoring equipment.

One end of the alarm input/output cable uses an RJ-45 connector to connect to the alarm input/output interface of the equipment. The other end uses a connector to connect to the externalequipment or central alarm monitoring equipment. The connector should be made according tothe on-site equipment. Each alarm input/output alarm cable can transmits four channels of alarmsignals.

StructureFigure 14-11 shows the structure of the alarm input/output cable.




Figure 14-11 Structure of the alarm input/output cable

1. Network interface connector–RJ-45 2. Main tag A-A. Sectional view in direction A

Pin Assignment

Table 14-6 lists the pin assignment of the alarm input/output cable.

Table 14-6 Pin assignment of the alarm input/output cable

Connector X1

Color Relation Alarm Output Alarm Input

X1.1 Blue Twisted pair Positive for critical and majoralarms

SW_INPUT 1+

X1.2 White Negative for critical andmajor alarms

SW_INPUT 1–

X1.3 Orange Twisted pair Positive for minor andwarning alarms

SW_INPUT 2+

X1.6 White Negative for minor andwarning alarms

SW_INPUT 2–

X1.4 Green Twisted pair Positive for alarm signaloutput 1

SW_INPUT 3+

X1.5 White Negative for alarm signaloutput 1

SW_INPUT 3–

X1.7 Brown Twisted pair Positive for alarm signaloutput 2

SW_INPUT 4+

X1.8 White Negative for alarm signaloutput 2

SW_INPUT 4–

Technical Specifications

Item Description

Connector X1 Network interface connector-8PIN-8 bit-shielded-crystal plug



Item Description

Cable type Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 cores-PANTONE 430UTwisted pair cable-100±15 ohms-shielded enhanced type 5 CAT5ESFTP-24AWG-8 core-PANTONE445U

Number ofcores

8

Fireproof class CM

Core diameter 0.5 mm

Length 10 m, 20 m, 30 m

14.4 Management CableThe management cable includes the serial port cable, ordinary phone wire, COA concatenatingcable and network cable.

14.4.1 OAM Serial Port CableThe OAM serial port cable is used for management and remote maintenance of the OptiX OSNequipment.

14.4.2 Serial 1–4/F1/F&f Serial Port CableUse the RJ-45 connector to connect one end of the serial port cable to the Serial 1–4 interface,F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detectingdevice or managed external device.

14.4.3 RS232/RS-422 Serial Port CableThe RS232/RS-422 serial port cable is used to transmit the management signaling betweendifferent subnets.

14.4.4 Ordinary Telephone WireThe telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends.Connect one end to PHONE interface of the equipment and connect the other end to the interfaceof the orderwire phone.

14.4.5 COA Concatenating CableWhen several COA are installed in one cabinet, use the RS232 or RS-422 serial port cables toconnect these COA.

14.4.6 Straight Through CableThe straight through cable is used for the communication between the OptiX OSN equipment,the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends.

14.4.7 Crossover CableThe crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment.

14.4.1 OAM Serial Port CableThe OAM serial port cable is used for management and remote maintenance of the OptiX OSNequipment.




Use the RJ-45 connector to connect one end of the cable to the OAM interface of the equipment.Use the DB25 or DB9 connector to connect the other end to a laptop, T2000 computer or modem.

Structure

Figure 14-12 shows the structure of the OAM serial port cable (DB25 connector).

Figure 14-12 Structure of the OAM serial port cable

1. Network interfaceconnector–RJ-45

2. Main tag 3. Cable connector-DB25 male

A-A. Sectional view indirection A

B-B. Sectional view indirection B

Pin Assignment

Table 14-7 lists the pin assignment of the alarm input/output cable.

Table 14-7 Pin assignment of the OAM serial port cable

ConnectorX1

Connector X2 Relation Description

X1.2 X2.20 Single Data terminal ready (DTR)

X1.3 X2.2 Single Transmit data (TD)

X1.6 X2.3 Single Receive data (RD)

X1.4 X2.7 Twisted pair Signaling ground (SG)

X1.5


Item Description


Connector X2 Cable connector-D type-25PIN-male or cable connector-D type-9PIN-male



Item Description

Type Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-PANTONE 430U

Number ofcores

8

Fireproof class CM

Length 5000 mm

14.4.2 Serial 1–4/F1/F&f Serial Port CableUse the RJ-45 connector to connect one end of the serial port cable to the Serial 1–4 interface,F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detectingdevice or managed external device.

The Serial 1–4/F1/F&f serial port cable is used for the following functions:

l Transparently transmits the environment detecting data signals.

l Manages the external device such as the COA.

StructureFigure 14-13 shows the structure of the Serial 1–4/F1/F&f serial port cable.

Figure 14-13 Structure of the Serial 1–4/F1/F&f serial port cable

1. Network interfaceconnector–RJ-45

2. Main tag 3. Cable connector-DB25 male

A-A. Sectional view indirection A

B-B. Sectional view indirection B

Pin AssignmentTable 14-8 lists the pin assignment of the Serial 1–4/F1/F&f cable.




Table 14-8 Pin assignment of the Serial 1–4/F1/F&f serial port cable

Connector X1 Connector X2 Relation Description

X1.1 X2.8 Twisted pair RS-422RX+

X1.2 X2.9 RS-422RX–

X1.3 X2.6 Twisted pair RS-422TX+

X1.6 X2.7 RS-422TX–

X1.4 X2.3 Twisted pair RS232RX

X1.8 X2.2 RS232TX

X1.5 X2.5 Single SG



Connector X2 Cable connector-D type-9 PIN-male

Cable type 1. Twisted pair-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-PANTONE430U 2. Twisted pair-100 ohms-SEYVP-0.48 mm-26AWG-8 core-black

Number ofcores

8

Fireproof class CM

Length 15 m for cable type 1 and 3 m for cable type 2

14.4.3 RS232/RS-422 Serial Port CableThe RS232/RS-422 serial port cable is used to transmit the management signaling betweendifferent subnets.

Use the RJ-45 connectors at both ends. Connect one end to the RS232 or RS-422 serial port ofthe equipment. Connect the other end to the RS232 or RS-422 serial port of the equipment thatrequires the orderwire phone communication.

StructureFigure 14-14 shows the structure of the RS232/RS-422 serial port cable.



Figure 14-14 Structure of the RS232/RS-422 serial port cable

1. Network interface connector–RJ-45 2. Main tag A-A. Sectional view in direction A

Pin AssignmentTable 14-9 lists the pin assignment of the RS232/RS-422 serial port cable.

Table 14-9 Pin assignment of the RS232/RS-422 serial port cable

ConnectorX1

Connector X2 Relation Description

X1.3 X2.1 Twisted pair RX+

X1.6 X2.2 RX–

X1.1 X2.3 Twisted pair TX+

X1.2 X2.6 TX–

X1.5 X2.5 Twisted pair SG

X1.4 X2.8 232RX

X1.8 X2.4 Single 232TX


Connector X1/X2 Network interface connector-8PIN-8 bit-shielded-crystal plug

Cable type Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-PANTONE 430U

Number of cores 8

Fireproof class CM

Length 15 m




14.4.4 Ordinary Telephone WireThe telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends.Connect one end to PHONE interface of the equipment and connect the other end to the interfaceof the orderwire phone.

StructureFigure 14-15 shows the structure of the ordinary telephone wire.

Figure 14-15 Structure of the ordinary telephone wire

1. Phone connector-RJ-11crystal plug 2. Main tag

Pin AssignmentTable 14-10 lists the pin assignment of the ordinary telephone wire.

Table 14-10 Pin assignment of the ordinary telephone wire

Connector X1 Connector X2 Description

X1.1 X2.1 No connected


X1.3 X2.3 TIP

X1.4 X2.4 RING




Connector X1/X2 Network interface connector-6PIN-26 to 28AWG

Cable type Power cable-150 V-UL20251-0.08 mm2-28AWG-black-1A-2-coretelephone wire

Number of cores 2

Fireproof class CM

Length 15 m



14.4.5 COA Concatenating CableWhen several COA are installed in one cabinet, use the RS232 or RS-422 serial port cables toconnect these COA.

Use the DB9 connectors at both ends. Connect one end to the RS232-1 of one COA and connectthe other end to the RS232-2 of another COA.

StructureFigure 14-16 shows the structure of the COA concatenating cable.

Figure 14-16 Structure of the COA concatenating cable

1. Cable connector-DB25 male 2. Tag A-A. Sectional view in direction A

Pin AssignmentTable 14-11 lists the pin assignment of the COA concatenating cable.

Table 14-11 Pin assignment of the COA concatenating cable

Connector X1 Connector X2 Remarks

3 2 One pair

2 3

5 5 Grounding


Connector X1/X2 Cable connector-D type-9 PIN-male

Cable type Twisted pair-100 ohms-UL2464-0.32 mm-28AWG-2P-Huaweigray

Number of cores Two pairs

Fireproof class CM

Length 0.6 m, 2.5 m




14.4.6 Straight Through CableThe straight through cable is used for the communication between the OptiX OSN equipment,the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends.

StructureFigure 14-17 shows the structure of the straight through cable.

Figure 14-17 Structure of the straight through cable

1. Network interface connector–RJ-45 2. Tag 1 3. Main tag 4. Tag 2

Pin AssignmentTable 14-12 lists the pin assignment of the straight through cable.

Table 14-12 Pin assignment of the straight through cable

ConnectorX1

Connector X2 Color Relation

X1.1 X2.1 White or orange Twisted pair

X1.2 X2.2 Orange

X1.3 X2.3 White or orange Twisted pair

X1.6 X2.6 Green

X1.4 X2.4 Blue Twisted pair

X1.5 X2.5 White or orange

X1.7 X2.7 White or brown Twisted pair

X1.8 X2.8 Brown




Connector X1/X2 Network interface connector-crystal plug-8PIN-8bit-shielded-24 to26AWG-CAT 6/used with SFTP network cable

Cable type Communication cable-10015 ohms-shielded enhance type 5-CAT5E-SFTP 24AWG-8 cores-PANTONE 445U

Number of cores 8

Fireproof class CM

Length 5 m, 10 m, 20 m, 30 m

14.4.7 Crossover CableThe crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment.

Uses the RJ-45 connectors at both ends. Connect one end to the ETH interface of the equipmentand connect the other end to the network interface of the computer.

StructureFigure 14-18 shows the structure of the crossover cable.

Figure 14-18 Structure of the crossover cable

1. Network interface connector–RJ-45 2. Tag 1 3. Main tag 4. Network cable 5. Tag 2

Pin AssignmentTable 14-13 lists the pin assignment of the crossover cable.

Table 14-13 Pin assignment of the crossover cable

ConnectorX1


X1.6 X2.2 Orange Twisted pair

X1.3 X2.1 White or orange

X1.1 X2.3 White or green Twisted pair

X1.2 X2.6 Green




ConnectorX1


X1.4 X2.4 Blue Twisted pair

X1.5 X2.5 White or blue

X1.7 X2.7 White or brown Twisted pair

X1.8 X2.8 Brown


Connector X1/X2 Network interface connector-crystal plug-8PIN-8bit-shielded-24 to26AWG-CAT 6/used with SFTP network cable

Cable type Communication cable-1005 ohms-CAT5E-SFTP 24AWG-8 cores-PANTONE 445U

Number of cores 8

Fireproof class CM

Length 5 m, 30 m

14.5 Signal CableThe signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signalcable. The OptiX OSN 1500A supports only the E1/E3 signal cable.

14.5.1 75-ohm 8 x E1 CableThe 75-ohm 8 x E1 cable is used to input and output E1 signals.

14.5.2 75-ohm 16 x E1 CableThe 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected tothe interface of the L75S interface board.



14.5.5 E3/T3/STM-1 CableThe E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMBconnector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connectorto connect the other end to the DDF. The connector should be made according to the on-siterequirements.

14.5.6 Framed E1 CableThe framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1signals.

14.5.7 N x 64 kbit/s Cables



The N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channelof N x 64 kbit/s services.


Use the DB44 connector at one end to connect the cable to the 75-ohm 8 x E1 electrical interfaceboard. Use a connector to connect the other end to the digital distribution frame (DDF). Theconnector should be made according to the on-site requirements. Each cable can transmit eightchannels of E1 signals.

StructureFigure 14-19 shows the structure of the 75-ohm 8 x E1 cable.

Figure 14-19 Structure of the 75-ohm 8 x E1 cable

1. Cable connector-D type-44 PIN-male 2. Tag 1, marked: "W1 (E1:1 to 4)"3. Tag 3, marked: "W2 (E1:5 to 8)" 4. Main tag

Pin AssignmentTable 14-14 lists the pin assignment of the 75-ohm 8 x E1 cable.

Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable

Connector

Cable W1 Remarks Connector Cable W2 Remarks

Core No. Core No.

38 Ring 1 R1 34 Ring 1 R5

23 Tip 19 Tip


22 Tip 18 Tip


21 Tip 17 Tip




Connector

Cable W1 Remarks Connector Cable W2 Remarks

Core No. Core No.


20 Tip 16 Tip

15 Ring 2 T1 11 Ring 2 T5

30 Tip 26 Tip


29 Tip 25 Tip


28 Tip 24 Tip


27 Tip 7 Tip

Shell External braid shield layer Shell External braid shield layer


Item Description

Connector X Cable connector-D type-44 PIN-male

Cable type Coaxial cable-SYFVZP-75-1-1x8(A)-75 ohm-9.65 mm-1.2mm-0.252 mm-Huawei white

Fireproof class CM

Number of cores 8 x E1

Cover diameter-insulation diameter-conductor diameter

9.65 mm-1.2 mm-0.252 mm

Length 3 m, 10 m, 15 m, 20 m, 25 m, 30 m, 40 m

CAUTIONThe pin assignment table for the E1 cable is placed in the same packing case with the cable. Donot discard it before installation.

14.5.2 75-ohm 16 x E1 CableThe 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected tothe interface of the L75S interface board.



Use the 2mmHM connector at one end to connect the cable to the 75-ohm E1 electrical interfaceboard. Use a connector to connect the other end to the DDF. The connector should be madeaccording to the on-site requirements. Each cable can transmit 16 channels of E1 signals.



Main tag

1. Cable connector 2. Terminal



Connector X

Cable W Remarks

Connector X

Cable W Remarks

Core No. Core No.

a1 Tip 1 R1 a10 Tip 17 R9

a2 Ring a11 Ring

a3 Tip 2 T1 a12 Tip 18 T9

a4 Ring a13 Ring

a6 Tip 3 R2 a15 Tip 19 R10

a7 Ring a16 Ring

a8 Tip 4 T2 a17 Tip 20 T10

a9 Ring a18 Ring

b1 Tip 5 R3 b10 Tip 21 R11

b2 Ring b11 Ring

b3 Tip 6 T3 b12 Tip 22 T11

b4 Ring b13 Ring




Connector X

Cable W Remarks

Connector X

Cable W Remarks

Core No. Core No.

b6 Tip 7 R4 b15 Tip 23 R12

b7 Ring b16 Ring

b8 Tip 8 T4 b17 Tip 24 T12

b9 Ring b18 Ring

c1 Tip 9 R5 c10 Tip 25 R13

c2 Ring c11 Ring

c3 Tip 10 T5 c12 Tip 26 T13

c4 Ring c13 Ring

c6 Tip 11 R6 c15 Tip 27 R14

c7 Ring c16 Ring

c8 Tip 12 T6 c17 Tip 28 T14

a9 Ring c18 Ring

d1 Tip 13 R7 d10 Tip 29 R15

d2 Ring d11 Ring

d3 Tip 14 T7 d12 Tip 30 T15

d4 Ring d13 Ring

d6 Tip 15 R8 d15 Tip 31 R16

d7 Ring d16 Ring

d8 Tip 16 T8 d17 Tip 32 T16

d9 Ring d18 Ring


Connector X 2mmHM conductor connector-4 x 18PIN-28 to 30AWG-crimp

Cable type W Coaxial cable-SYFVZP-75-1-1x32(A)-75 ohms-18 mm-1.2mm-0.254 mm-Huawei gray

Fireproof class CM

Number of cores 16 x E1



Item Description

Cover diameter-insulation diameter-conductor diameter

18mm-1.2 mm-0.254mm

Length 10 m, 15 m, 20 m, 25 m, 30 m

CAUTIONThe pin assignment table for the E1 cable is placed in the same packing case with the cable. Donot discard it before installation.


Use the DB44 connector at one end to connect the cable to the 120-ohm E1 electrical interfaceboard. Use a connector to connect the other end to the DDF. The connector should be madeaccording to the on-site requirements. Each cable can transmit 8 channels of E1 signals.



1. Cable connector-D type-44PIN-male 2. Tag 1, marked:" W1 (TX1~8) "3. Tag 3, marked:" W2 (RX1~8) " 4. Main tag





Table 14-16 Pin assignment of the 120-ohm E1 cable

Connector

Cable W1 Remarks

Connector

Cable W2 Remarks

Core No. Core No.

15 Blue Twistedpair

Tx1 38 Blue Twistedpair

Rx1

30 White 23 White

14 Orange

Twistedpair

T×2 37 Orange

Twistedpair

R×2

29 White 22 White

13 Green Twistedpair

T×3 36 Green Twistedpair

R×3

28 White 21 White

12 Brown

Twistedpair

T×4 35 Brown Twistedpair

R×4

27 White 20 White

11 Grey Twistedpair

T×5 34 Grey Twistedpair

R×5

26 White 19 White

10 Blue Twistedpair

T×6 33 Blue Twistedpair

R×6

25 Red 18 Red

9 Orange

Twistedpair

T×7 32 Orange

Twistedpair

R×7

24 Red 17 Red

8 Green Twistedpair

T×8 31 Green Twistedpair

R×8

7 Red 16 Red

Shell External braid shield layer Shell External braid shield layer


Connector X Cable connector-D type-44PIN-male

Cable type Communication cable-120 ohms-SEYPVPV-0.5 mm-24AWG-16core-PANTONE 430U

Number of cores 16

Inner conductordiameter

0.5 mm

Fireproof class CM



Item Description

Length 10 m, 15 m, 20 m, 30 m, 40 m


Use the 2mmHM connector at one end to connect the cable to the 120-ohm E1 electrical interfaceboard, L12S or PL1B. Use a connector to connect the other end to the DDF. The connectorshould be made according to the on-site requirements. Each cable can transmit 16 channels ofE1 signals.

Structure

Figure 14-22 shows the structure of the 120-ohm 16 x E1 cable.

Figure 14-22 Structure of the 120-ohm 16 x E1 cable3

1

2X

W2

W1

1. Cable connector 2. Terminal 3. Main tag

Pin Assignment

Table 14-17 lists the pin assignment of the 120-ohm 16 x E1 cable.


Connector X

Cable W1 Remarks

Connector X

Cable W2 Remarks

Core No. Core No.

a1 Blue Twisted pair

Rx1 a3 Blue Twisted pair

Tx1

a2 White a4 White

a6 Orange Twisted pair

Rx2 a8 Orange Twisted pair

Tx2

a7 White a9 White

b1 Green Twisted pair

Rx3 b3 Green Twisted pair

Tx3

b2 White b4 White




Connector X

Cable W1 Remarks

Connector X

Cable W2 Remarks

Core No. Core No.

b6 Brown Twisted pair

Rx4 b8 Brown Twisted pair

Tx4

b7 White b9 White

c1 Grey Twisted pair

Rx5 c3 Grey Twisted pair

Tx5

c2 White c4 White

c6 Blue Twisted pair

Rx6 c8 Blue Twisted pair

Tx6

c7 Red c9 Red

d1 Orange Twisted pair

Rx7 d3 Orange Twisted pair

Tx7

d2 Red d4 Red

d6 Green Twisted pair

Rx8 d8 Green Twisted pair

Tx8

d7 Red d9 Red

a10 Brown Twisted pair

Rx9 a12 Brown Twisted pair

Tx9

a11 Red a13 Red

a15 Grey Twisted pair

Rx10 a17 Grey Twisted pair

Tx10

a16 Red a18 Red

b10 Blue Twisted pair

Rx11 b12 Blue Twisted pair

Tx11

b11 Black b13 Black

b15 Orange Twisted pair

Rx12 b17 Orange Twisted pair

Tx12

b16 Black b18 Black

c10 Green Twisted pair

Rx13 c12 Green Twisted pair

Tx13

c11 Black c13 Black

c15 Brown Twisted pair

Rx14 c17 Brown Twisted pair

Tx14

c16 Black c18 Black

d10 Grey Twisted pair

Rx15 d12 Grey Twisted pair

Tx15

d11 Black d13 Black

d15 Blue Twisted pair

Rx16 d17 Blue Twisted pair

Tx16

d16 Yellow d18 Yellow

a5 Shell External braid shieldlayer

a14 Shell External braid shieldlayer




Item Description

Connector X 2mmHM conductor connector-4 x 18PIN-24 to 26AWG-crimp

Cable typeW1/W2

Nominal twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-32core-PANTONE 430U

Number ofcores

32

Innerconductordiameter

0.5 mm

Fireproof class CM

Length 10 m, 15 m, 20 m, 25 m, 30 m

14.5.5 E3/T3/STM-1 CableThe E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMBconnector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connectorto connect the other end to the DDF. The connector should be made according to the on-siterequirements.

Structure

Figure 14-23 shows the structure of the E3/T3/STM-1 cable.

Figure 14-23 Structure of the E3/T3/STM-1 cable

1. Coaxial connector-SMB 2. Main tag 3. Coaxial cable

Pin Assignment

None


Item Description

Connector Coaxial connector-SMB-75 ohms-straight and female

Cable I Coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded




Item Description

Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34mm

Length: 10 m, 15 m, 20 m, 30 m

Cable II Coaxial cable-75 ohms-4.4 mm-2.4 mm-0.4 mm-shielded-gray


Length: 15 m, 20 m, 25 m, 30 m, 40 m

Cable III Coaxial cable-75 ohms-6.7 mm-3.8 mm-0.61 mm-shielded-gray


Length: 15 m, 20 m, 25 m, 30 m, 130 m

Cable IV Coaxial cable-75 ohms-5.80 mm-3.71 mm-0.643 mm-black

Cover diameter 5.80 mm-insulation diameter 3.71 mm-conductor diameter0.643 mm

Length: 30 cm

Fireproofclass

CM

14.5.6 Framed E1 CableThe framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1signals.

The framed E1 cables of 75 ohms and 120 ohms are available.

l See the section that describes the 75-ohm 8 x E1 cable for details on the structure, pinassignment and technical specifications of the 75-ohm framed E1 cable.

l See the section that describes the 120-ohm 8 x E1 cable for details on the structure, pinassignment and technical specifications of the 120-ohm framed E1 cable.

14.5.7 N x 64 kbit/s CablesThe N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channelof N x 64 kbit/s services.

Table 14-18 lists the pin assignment of the DB28 connector.

Table 14-18 Pin assignment of the DB28 connector of the DM12

Pin Signal Direction

Description

1 TXD+ ---> Transmits data.



Pin Signal Direction

Description

2 TXD– ---> Transmits data.

3 TXC+ <--> The DCE provides the transmitting clock to theDTE.

4 TXC– <--> The DCE provides the transmitting clock to theDTE.

5 NC - -

6 GND ----- Circuit_GND

7 MODE0 <--- Identifies the cable type.



10 MODE_DCE <--- Identifies the DCE/DTE cable type.

11 DCD+ <--> Detects the carrier.

12 DCD– <--> Detects the carrier.

13 RTS+ ---> Requests for transmission.

14 RTS– ---> Requests for transmission.

15 TXCE+ ---> Transmitting data clock for DCE and loopbackclock for DTE.

16 TXCE– ---> Transmitting data clock for DCE and loopbackclock for DTE.

17 RXC+ <--- Receives clock.

18 RXC– <--- Receives clock.

19 RXD+ <--- Receives data.

20 RXD– <--- Receives data.

21 GND ----- Shield_GND

22 LL <--> Loopback control signals.

23 CTS+ <--- Prepares for transmission.

24 CTS– <--- Prepares for transmission.

25 DSR+ <--- Prepares the DCE.

26 DSR– <--- Prepares the DCE.

27 DTR+ ---> Prepares the DTE.

28 DTR– ---> Prepares the DTE.




According to the protocols for the N x 64 kbit/s signals, the N x 64 kbit/s cables are classifiedinto the following ten types.

l V.35 DCE cable

l V.35 DTE cable

l V.24 DCE cable

l V.24 DTE cable

l X.21 DCE cable

l X.21 DTE cable

l RS449 DCE cable

l RS449 DTE cable

l RS530 DCE cable

l RS530 DTE cable

V.35 DCE Cable

Figure 14-24 shows the structure of the V.35 DCE cable.

Figure 14-24 Structure of the V.35 DCE cable

21

Pos.28

Pos.1

A-A

A

3

B

D

J

N

T

X

BB

FF

LL

B

F

L

R

V

Z

DD

JJ

NN

C

H

M

S

W

AA

EE

KK

A

E

K

P

U

Y

CC

HH

MM

X1 X2

W

B-B

1. Cable connector-D28 male 2. Main tag3. Cable connector-D34 female + D34 plastic shell

Table 14-19 lists the pin assignment of the V.35 DCE cable.

Table 14-19 Pin assignment of the V.35 DCE cable

Connector X1 Connector X2 Relation

19 P Twisted pair

20 S

1 R Twisted pair

2 T




15 V Twisted pair

16 X

3 Y Twisted pair

4 AA

17 U Twisted pair

18 W

11 F -

22 J -

23 C -

13 D -

25 H -

27 E -

21 B -

6+7+8 A Short circuiting for 6–8

The technical specifications of the V.35 DCE cable are as follows.

Item Description

Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cablesolder-spacing 0.8 mm-28 to 30AWG, exclusively used for OEM

Connector X2 Cable connector-V35 plug-34PIN-injection molding shell-tube,exclusively used for OEM

Cable connector-V35 DCE plug-34PIN-female-cable crimping-core,exclusively used for OEM

Cable type Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 core-PANTONE 296U-exclusively used by OEM

Number of cores 5 pairs and 8 cores


Length 3 m

V.35 DTE CableFigure 14-25 shows the structure of the V.35 DTE cable.




Figure 14-25 Structure of the V.35 DTE cable

A-A B-B

21

Pos.28

Pos.1

A

DJNTX

BBFFLL

BFLRVZ

DDJJNN

CHMSWAAEEKK

AEKPUY

CCHHMM

3 4

B

5

X2X1

W

1. Cable connector-D28 male 2. Main tag 3. Cable connector-D34 plastic shell4. Ordinary terminal 5. Cable connector-D34 male

Table 14-20 lists the pin assignment of the V.35 DTE cable.

Table 14-20 Pin assignment of the V.35 DTE cable


1 P Twisted pair

2 S

19 R Twisted pair

20 T

17 V Twisted pair

18 X

3 Y Twisted pair

4 AA

15 U Twisted pair

16 W

11 F -

22 J -

13 C -

23 D -

27 H -

25 E -

21 B -

6+10+7+8 A Short circuiting 6, 7, 8 and 10



The technical specifications of the V.35 DTE cable are as follows.

Item Description

ConnectorX1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

ConnectorX2

Cable connector-V35 plug-34PIN-injection molding shell-tube, exclusivelyused for OEM

Cable connector-V35 DTE plug-34PIN-male-cable crimping-core,exclusively used for OEM


Number ofcores

5 pairs and 8 cores

Corediameter

0.32 mm

Length 3 m

V.24 DCE Cable

Figure 14-26 shows the structure of the V.24 DCE cable.

Figure 14-26 Structure of the V.24 DCE cable

2 3

Pos.1

Pos.28

A B

Pos.25

Pos.1

1

X1X2

W

A-A B-B

1. Cable connector-D25 female 2. Main tag 3. Cable connector-D28 male

Table 14-21 lists the pin assignment of the V.24 DCE cable.

Table 14-21 Pin assignment of the V.24 DCE cable


19 2 Twisted pair

1 3

23 4 Twisted pair

13 5





25 20 Twisted pair

27 6

11 8 Twisted pair

22 18

3 15 Twisted pair

17 24

15 17 -

21 1 Single

6+7 7 Short circuiting 6 and 7

The technical specifications of the V.24 DCE cable are as follows.

Table 14-22 Technical specifications of the V.24 DCE cable

Item Description

Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2 Cable connector-D type-25PIN-female-cable solder


Number ofcores

5 pairs and 8 cores


Length 3 m

V.24 DTE CableFigure 14-27 shows the structure of the V.24 DTE cable.



Figure 14-27 Structure of the V.24 DTE cable

2 31

Pos.1

Pos.28

A B

Pos.1

Pos.25 X1X2

W

A-A B-B

1. Cable connector-D25 male 2. Main tag 3. Cable connector-D28 male

Table 14-23 lists the pin assignment of the V.24 DTE cable.

Table 14-23 Pin assignment of the V.24 DTE cable


1 2 Twisted pair

19 3

13 4 Twisted pair

23 5

27 20 Twisted pair

25 6

11 8 Twisted pair

22 18

3 15 Twisted pair

15 24

17 17 -

21 1 Single

6+10+7 7 Short circuiting 6, 10 and 7

The technical specifications of the V.24 DTE cable are as follows.

Table 14-24 Technical specifications of the V.24 DTE cable

Item Description

ConnectorX1


ConnectorX2

Cable connector-D type-25PIN-male-cable solder




Item Description


Number ofcores

5 pairs and 8 cores

Corediameter

0.32 mm

Length 3 m

X.21 DCE Cable

Figure 14-28 shows the structure of the X.21 DCE cable.

Figure 14-28 Structure of the X.21 DCE cable

2 3

Pos.1

Pos.28

BA

Pos.15

Pos.1

1

X1X2

W

A-A B-B


Table 14-25 lists the pin assignment of the X.21 DCE cable.

Table 14-25 Pin assignment of the X.21 DCE cable


13 5 Twisted pair

14 12

23 3 Twisted pair

24 10

19 2 Twisted pair

20 9

1 4 Twisted pair

2 11

15 6 Twisted pair




16 13

21 1 –


The technical specifications of the X.21 DCE cable are as follows.

Table 14-26 Technical specifications of the X.21 DCE cable

Item Description

ConnectorX1


ConnectorX2

Cable connector-D type-15PIN-female-cable solder


Number ofcores

5 pairs and 8 cores

Corediameter

0.32 mm

Length 3 m

X.21 DTE CableFigure 14-29 shows the structure of the X.21 DTE cable.

Figure 14-29 Structure of the X.21 DTE cable

2 3

Pos.1

Pos.28

BA

Pos.1

Pos.15

1

X2 X1

W

A-A B-B


Table 14-27 lists the pin assignment of the X.21 DTE cable.




Table 14-27 Pin assignment of the X.21 DTE cable


13 3 Twisted pair

14 10

23 5 Twisted pair

24 12

19 4 Twisted pair

20 11

1 2 Pair

2 9

15 6 Twisted pair

16 13

17 6 Twisted pair

18 13

21 1 –


The technical specifications of the X.21 DTE cable are as follows.

Table 14-28 Technical specifications of the X.12 DTE cable

Item Description

Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2 Cable connector-D type-15PIN-male-cable solder


Number ofcores

5 pairs and 8 cores


Length 3 m

RS449 DCE CableFigure 14-30 shows the structure of the RS449 DCE cable.



Figure 14-30 Structure of the RS449 DCE cable

2 3

Pos.1

Pos.28

BA

Pos.1

Pos.15

1

X2 X1

W

A-A B-B

1. Cable connector-D28 male 2. Main tag 3. Cable connector-D37 female-I

Table 14-29 lists the pin assignment of the RS449 DCE cable.

Table 14-29 Pin assignment of the RS449 DCE cable


27 11 Twisted pair

28 29

25 12 Twisted pair

26 30

13 9 Twisted pair

14 27

23 7 Twisted pair

24 25

11 13 Twisted pair

12 31

19 4 Twisted pair

20 22

1 6 Twisted pair

2 24

15 8 Twisted pair

16 26

17 17 Twisted pair

18 35

3 5 Twisted pair

4 23





22 10 –

21 1 –


The technical specifications of the RS449 DCE cable are as follows.

Table 14-30 Specifications of the RS449 DCE cable

Item Description

Connector X1 Cable connector-D type dual-edge tube-28PIN-straight male-cablesolder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2 Cable connector-D type-37PIN-female-cable solder-exclusively usedfor OEM

Cable type Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26core-PANTONE 296U-exclusively used for OEM

Number of cores 26


Length 3 m

RS449 DTE CableFigure 14-31 shows the structure of the RS449 DTE cable.

Figure 14-31 Structure of the RS449 DTE cable

Pos.28

21 3

Pos.1

BA

Pos.37

Pos.1X2X1

W

A-A B-B

1. Cable connector-D28 male 2. Main tag 3. Cable connector-D37 male-I

Table 14-31 lists the pin assignment of the RS449 DTE cable.

Table 14-31 Pin assignment of the RS449 DTE cable


27 12 Twisted pair




28 30

25 11 Twisted pair

26 29

13 7 Twisted pair

14 25

23 9 Twisted pair

24 27

11 13 Twisted pair

12 31

19 6 Twisted pair

20 24

1 4 Twisted pair

2 22

15 17 Twisted pair

16 35

17 8 Twisted pair

18 26

3 5 Twisted pair

4 23

22 10 -

21 1 -


The technical specifications of the RS449 DTE cable are as follows.

Table 14-32 Specifications of the RS449 DTE cable

Item Description

ConnectorX1


ConnectorX2

Cable connector-D type-SUB plug-37PIN-straight male-cable solder-2 row,standard installation hole, exclusively used for OEM




Item Description

Cable type Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 core-PANTONE 296U-exclusively used for OEM

Number ofcores

26

Corediameter

0.32 mm

RS530 DCE Cable

Figure 14-32 shows the structure of the RS530 DCE cable.

Figure 14-32 Structure of the RS530 DCE cable

Pos.1

2 31

Pos.1

Pos.28

A B

Pos.25

X1X2

W

B-BA-A


Table 14-33 lists the pin assignment of the RS530 DCE cable.

Table 14-33 Pin assignment of the RS530 DCE cable


28 22 Twisted pair

27 6

26 23 Twisted pair

25 20

24 19 Twisted pair

23 4

22 18 Single

21 1 Single

20 14 Twisted pair

19 2




18 11 Twisted pair

17 24

16 9 Twisted pair

15 17

14 13 Twisted pair

13 5

12 10 Twisted pair

11 8

4 12 Twisted pair

3 15

2 16 Twisted pair

1 3


The technical specifications of the RS530 DCE cable are as follows.

Table 14-34 Specifications of the RS530 DCE cable

Item Description

ConnectorX1


ConnectorX2

Cable connector-D type-25PIN-female-cable solder


Number ofcores

26

Corediameter

0.32 mm

Length 3 m

RS530 DTE CableFigure 14-33 shows the structure of the RS530 DTE cable.




Figure 14-33 Structure of the RS530 DTE cable

A-A

Pos.28

2 31

Pos.1

A B

Pos.1

Pos.25X1

X2

W

B-B


Table 14-35 lists the pin assignment of the RS530 DTE cable.

Table 14-35 Pin assignment of the RS530 DTE cable


27 20 Twisted pair

28 23

25 6 Twisted pair

26 22

13 4 Twisted pair

14 19

23 5 Twisted pair

24 13

11 8 Twisted pair

12 10

19 3 Twisted pair

20 16

1 2 Twisted pair

2 14

15 24 Twisted pair

16 11

17 17 Twisted pair

18 9

3 15 Twisted pair

4 12




22 18 –

21 1 –

6+7+9+10 7 Short circuiting 6, 7, 9 and 10

The technical specifications of the RS530 DTE cable are as follows.

Table 14-36 Specifications of the RS530 DTE cable

Item Description

ConnectorX1


ConnectorX2

Cable connector-D type-25PIN-male-cable solder


Number ofcores

26

Corediameter

0.32 mm

Length 3 m

14.6 Clock CableThe clock cable includes the clock cable and clock transfer cable.

14.6.1 Clock CableThe clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to inputand output external clock signals.

14.6.2 One-Channel and Two-Channel Clock Transfer CablesThe clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) andtwo-channel clock transfer cable (75 ohms to 120 ohms).

14.6.1 Clock CableThe clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to inputand output external clock signals.

For the 75-ohm clock cable, use the SMB connector at one end to connect the cable to the externalclock interface of the OptiX OSN equipment. Use a connector to connect the other end to theexternal clock equipment. The connector should be made according to the on-site requirements.For the 120-ohm clock cable, use the RJ-45 connector at one end to connect the cable to theexternal clock interface of the OptiX OSN equipment. Use a connector to connect the other endto the external clock equipment. The connector should be made according to the on-siterequirements.




Structure

Figure 14-34 and Figure 14-35 show the structure of the 75-ohm clock cable and the 120-ohmclock cable respectively.

Figure 14-34 Structure of the 75-ohm clock cable

1. Coaxial connector-SMB 2. Tag


1. Tag 1 (R) and Tag2 (T) 2. Communication cable 3. Main tag 4. Network interface connector-RJ-45

Pin Assignment

Table 14-37 lists the pin assignment of the 120-ohm clock cable.

Table 14-37 Pin assignment of the 120-ohm clock cable

X1 W Remark

X1.1 Blue W1

X1.2 White

X1.4 Orange W2

X1.5 White


Item Description

75-ohmclock cable

Connector: coaxial connector-SMB-75 ohms-straight and female

Cable type: coaxial cable-75 ohms-3.9 mm-2.1mm-0.34 mm-shielded




Item Description

Length: 10 m, 15 m, 20 m, 30 m

120-ohmclock cable

Connector X: network interface connector-8PIN-8 bit-shielded-crystal modelconnector

Cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2 pairs-Pantone 430U

Inner conductor diameter: 0.4 mm/26AWG

Length: 5 m, 10 m, 20 m, 30 m, 40 m, 50 m, 70 m, 100 m

14.6.2 One-Channel and Two-Channel Clock Transfer CablesThe clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) andtwo-channel clock transfer cable (75 ohms to 120 ohms).

StructureFigure 14-36 and Figure 14-37 show the structure of the one-channel clock transfer cable andtwo-channel clock transfer cable respectively.

Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)

1. Coaxial connector-SMB-75 ohms-straight/plug-female 2. Main tag 3. 75 ohms/120 ohms transfer PCB

Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)

1. Coaxial connector-SMB-75 ohms-straight/plug-female 2. Tag 1:"1#" 3. Tag 2:"2#" 4. Main tag5. 75 ohms/120 ohms transfer PCB 6. Tag 3:"1#" 7. Tag 4:"2#"

Pin AssignmentTable 14-38 lists the pin assignment of the two-channel clock transfer cable (75 ohms to 120ohms).




Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms)

Connector 75-ohm Cable Color 120-ohm Cable

X1 Core Blue W3

Shielding layer White

X2 Core Blue W4

Shielding layer White


Onechannel

Connector: coaxial connector-SMB-75 ohms-straight and female

75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded

75 ohms Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductordiameter 0.34 mm

120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2pairs-Pantone 430U

Inner conductor diameter: 0.4 mm/26AWG

Length: 30 m

Twochannels

Connector X1/X2: coaxial connector-SMB-75 ohms-straight and female

75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded

75 ohms cable: cover diameter 3.9 mm-insulation diameter 2.1 mm-conductordiameter 0.34 mm

120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2pairs-Pantone 430U

Inner conductor diameter of the 120-ohm cable: 0.4 mm/26AWG

Length: 30 m



A Equipment and Board Alarm Indicators

This chapter describes the equipment and board alarm indicators for the OptiX OSN equipment.

A.1 Indicators on the CabinetThis section describes the indicators on the cabinet for the OptiX OSN equipment.

A.2 Board Alarm IndicatorThis section describes the board alarm indicators and their indications.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description A Equipment and Board Alarm Indicators

Issue 02 (2007-09-10) Huawei Technologies Proprietary A-1

A.1 Indicators on the CabinetThis section describes the indicators on the cabinet for the OptiX OSN equipment.

Indicator Indication

Normal power supply indicator: Power(green)

When it is lit, it indicates that the power is suppliedto the equipment.

When it is unlit, it indicates that no power issupplied to the equipment.

Critical alarm indicator: Critical (red) When it is lit, it indicates that critical alarms aregenerated in the equipment.

When it is unlit, it indicates that no critical alarmsare generated in the equipment.

Major alarm indicator: Major (orange) When it is lit, it indicates that major alarms aregenerated in the equipment.

When it is unlit, it indicates that no major alarms aregenerated in the equipment.

Minor alarm indicator: Minor (yellow) When it is lit, it indicates that minor alarms aregenerated in the equipment.

When it is unlit, it indicates that no minor alarmsare generated in the equipment.

A.2 Board Alarm IndicatorThis section describes the board alarm indicators and their indications.

Board Hardware State Indicator (STAT)

Status Description Indication

Lit (green) The board is working normally.

Lit (red) The board hardware is faulty.

Unlit No power is supplied to the board.

Service Activating State Indicator (ACT)


Lit (green) The service is in the activating state and the board isworking.

Unlit The service is in the non-activating state.

A Equipment and Board Alarm IndicatorsOptiX OSN 1500 Intelligent Optical Transmission System


A-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)

Board Software State Indicator (PROG)Status Description Indication

Lit (green) The board software or software for FPGA is loadedsuccessfully, or the board software is initializednormally.

Circularly lit for 100 ms and unlit for100 ms (green)

The board software or FPGA is being loaded to theFLASH.

Circularly lit for 300 ms and unlit for300 ms (green)

The board software is being initialized and is in theBIOS boot state.

Lit (red) The board software or FPGA in the FLASH is lost.The loading and initialization of the board softwarefails.

Unlit No power is input.

Service Alarm Indicator (SRV)Status Description Indication

Lit (green) The service is running normally and no service alarmsare generated.

Lit (red) Critical or major alarms occur to the service.

Lit (yellow) Minor or remote alarms occur to the service.

Unlit The board is not configured with services and noalarms is generated, or no power is supplied to theboard.

Synchronization Clock State IndicatorStatus Description Indication

Lit (green) l The clock is working in the free-run mode and thesystem clock priority list is not set. By default, thesystem clock priority list contains only the internalsource.

l The clock is working in the tracing mode andtracing the clock source rather than the internalsource in the priority list.

Lit (red) The system clock priority list is set. Except theinternal clock source, all clock sources are lost. Theclock is working in the hold-over or free-run mode.



Alarm Cutting Indicator (ALMC)Status Description Indication

Lit (yellow) The board is in the alarm cutting state.

Unlit Sound is generated to indicate the alarm.

Ethernet IndicatorIndicator Status

DescriptionIndication

Connection status indicator(LINK), which is green whenlit.

Lit The network cable is successfullyconnected to the equipment.

Unlit The network cable is not connected tothe equipment.

Data receiving andtransmitting indicator (ACT),which is orange when lit.

Flashing The data is being transmitted orreceived.

Unlit No data is being transmitted orreceived.

Service activating state indicator of the cross-connect unit (ACTX)Status Description Indication

Lit (green) The cross-connect unit is in the active state.

Unlit The cross-connect unit is in the standby state.

Active/standby state indicator (ACTC) of the SCC unitStatus Description Indication

Lit (green) The cross-connect unit is in the active state.

Unlit The cross-connect unit is in the standby state.

Service alarm indicator of the line unit (SRVL)Status Description Indication

Lit (green) The line service is normal and no alarms aregenerated.

Lit (red) Critical alarms or major alarms occur to the lineservice.

Lit (yellow) Minor or remote alarms occur to the line service.





Unlit The unit is not configured with services and no alarmsis generated, or no power is supplied to the unit.

Fan tray assembly indicatorIndicator Status Description Indication

Board runningstate indicator(RUN)

Lit (green) The board is working normally.

Unlit The board is not powered on.

Fan alarmindicator (ALM)

Lit (red) The fan stops.

Unlit The fan is running normally.

Indicator on the panel of the COAIndicator Status Description Indication

Green runningindicator (RUN)

Flash once every twoseconds (green)

The COA is running normally.

Flash once every fourseconds (green)

The COA in in the database protectionmode. The communication between theCOA and the SCC fails.

Flash five times everysecond (green)

The program is starting or being loaded.

Alarm indicator(ALM)

Lit (red) The self-check of the memory fails.

Flash thrice every othersecond (red)

Critical alarms are generated.

Flash twice every othersecond (red)

Major alarms are generated.

Flash once every othersecond (red)

Minor alarms are generated.

Power indicator (POWER)Status Description Indication

Lit (green) The input of the power supply is normal.

Unlit No power supply is input or the power supply fails.



Indicator on the UPMModule Indicator Status

DescriptionIndication

Rectifiermodule

ALM Lit (red) The rectifier module fails. Normally, it is unlit.

Vout Lit (green) The output of the rectifier module is normal.

Monitoring module

RUN Flashes (green) The entire power supply system is normal.

ALM Lit (red) The entire power supply system becomesfaulty. Normally, it is unlit.




B Labels

This chapter describes various labels for the OptiX OSN equipment, including the safety labels,optical module labels, and cable labels.

B.1 Safety LabelMany safety labels are stuck on the equipment. This section describes the suggestions andlocations of these safety labels.

B.2 Optical Module LabelsOptical module labels are used to recognize different types of optical modules. Optical modulelabel is stuck to the optical module.

B.3 Engineering LabelsThe engineering labels should be made according to the the local engineering specifications orHuawei engineering specifications.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description B Labels

Issue 02 (2007-09-10) Huawei Technologies Proprietary B-1

B.1 Safety LabelMany safety labels are stuck on the equipment. This section describes the suggestions andlocations of these safety labels.

B.1.1 Label DescriptionOn the subrack, there are labels such as the ESD protection label, subrack grounding label andfan warning label.

B.1.2 Label PositionThe ESD protection label and the subrack grounding label are stuck on the subrack. The laserclass label and the APD warning label are stuck on the front panel of each board.

B.1.1 Label DescriptionOn the subrack, there are labels such as the ESD protection label, subrack grounding label andfan warning label.

Table B-1 Labels on the equipment

Label Type Suggestion

ESD protection label The equipment is electrostaticsensitive.

CLASS 1LASER

PRODUCT

LASERRADIATION

DO NOT VIEW DIRECTLYWITH OPTICALINSTRUMENTSCLASS 1M

LASERPRODUCT

Laser safety class The label suggests the class ofthe laser source.

Subrack grounding label This label suggests thegrounding position.

ATTENTION 警告

CLEAN PERIODICALLY 定期清洗

! Regular cleaning label Regularly clean the air filter.

严禁在风扇高速旋转时接触叶片

DON'T TOUCH THEFAN LEAVES BEFORETHEY SLOW DOWN !

Fan warning label Do not the fan leaves beforethe fan stops.

! APDReceiver

MAX:-9dBm

APD warning label The overload point of theindicator is –9 dBm.

B LabelsOptiX OSN 1500 Intelligent Optical Transmission System


B-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)

Label Type Suggestion

RoHS label The equipment is in line withthe RoHS-relatedenvironment-friendlyrequirements.

This device complies with Part 15 of the FCC Rules.Operation is subject to the following two conditions:(1) this device may not cause harmful interference,and (2) this device must accept any interferencereceived, including interference that may causeundesired operation.

POWER RATING: -48－ -60V ; 4.5A

华为技术有限公司中国制作MADE IN CHINA

电源额定值

OptiX OSN 1500A

HUAWEI TECHNOLOGIES CO.,LTD.

N14036


POWER RATING: -48－ -60V ; 6A


电源额定值

OptiX OSN 1500


N14036

For the enhanced subrack:




电源额定值

OptiX OSN 1500A


N14036




电源额定值

OptiX OSN 1500


N14036

Product nameplate label The label suggests theproduct name andcertification.

合格证/QUALIFICATION CARD

华为技术有限公司中国制作MADE IN CHINAHUAWEI TECHNOLOGIES CO.,LTD.

HUAWEI

Qualification card label The equipment is qualified.

B.1.2 Label PositionThe ESD protection label and the subrack grounding label are stuck on the subrack. The laserclass label and the APD warning label are stuck on the front panel of each board.



Figure B-1 Labels on the OptiX OSN 1500B subrack



HUAWEI

ATTENTION 警告




POWER RATING: -48－ -60V ; 6A


电源额定值

OptiX OSN 1500


N14036


Figure B-2 Labels on the OptiX OSN 1500A subrack



HUAWEI

ATTENTION 警告






电源额定值

OptiX OSN 1500A


N14036





Figure B-3 Labels on a board

LASERRADIATION



BA2

SL16

CLASS 1LASER

PRODUCT! APD

ReceiverMAX:-9dBm

B.2 Optical Module LabelsOptical module labels are used to recognize different types of optical modules. Optical modulelabel is stuck to the optical module.

Figure B-4 shows the optical module labels.

Figure B-4 Optical module labels

As shown in Table B-2, different types of optical module have different codes.

Table B-2 Optical module code and type mapping table

OpticalModule Code

Optical Type

34060288 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM-16-–3 dBm-–10 dBm-–21 dBm-LC-2 km



OpticalModule Code

Optical Type

34060278 Optical transceiver-ESFP (internal and external alignment)-1310-STM-16-0 dBm-–5 dBm-–21 dBm-LC-15 km

34060289 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM-16-3 dBm-–2 dBm-–30 dBm-LC-40 km



34060280 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM-4-2 dBm-–3 dBm-–30 dBm-LC-40 km

34060284 Optical transceiver-ESFP (internal and external alignment)-1550 nm-STM-4-2 dBm-–3 dBm-–30 dBm-LC-80km

34060285 Optical transceiver-ESFP (internal and external alignment)-1550 nm-STM-4-2 dBm-–3 dBm--36 dBm-LC-100km


34060281 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM–1-0 dBm-–5 dBm-–37 dBm-LC-40 km


34060299 Optical transceiver-ESFP (internal and external alignment)-1310 nm-STM-1-–8 dBm-–15 dBm-–31 dBm-LC (private)-15 km

34060286 Optical transceiver-ESFP (internal and external alignment)-850nm-2.125G multirate-–2.5 dBm-–9.5 dBm-–17 dBm-LC-0.5 km

34060219 Optical transceiver-ESFP (internal and external alignment)-1310nm-1.25 Gbit/s-–3 dBm-–9.5 dBm-–20 dBm-LC-10 km

34060298 Optical transceiver-ESFP (internal and external alignment)-1310nm-1.25 Gbit/s-3 dBm-–4.5 dBm-–22.5 dBm-LC-40 km

34060274 Optical transceiver-ESFP (internal and external alignment)-1550nm-1.25 Gbit/s-5 dBm-–2 dBm-–23 dBm-LC-80 km

34060325 Optical transceiver-ESFP (internal and external alignment)-850nm-2.125 G multirate-–2.5 dBm-–9.5dBm-–17 dBm-LC (private)-multimode-0.5 km

34060049 Optical transceiver-SFP-850 nm-1.25 Gbit/s-0 dBm-–9.5 dBm-–17dBm-LC-–0.55 km

34060050 Optical transceiver-SFP-1310 nm-1.25 Gbit/s-–3 dBm-–9 dBm-–20dBm-LC-–10 km




OpticalModule Code

Optical Type

34060207 Optical transceiver-SFP-1310 nm-1.25 Gbit/s-5 dBm-–2 dBm-–23 dBm-LC-–40 km

34060051 Optical transceiver-SFP-1550 nm-1.25 Gbit/s-2 dBm-–4 dBm-–22 dBm-LC-–70 km

34060287 Optical transceiver-SFP-1310 nm-STM-1-–14 dBm-–19 dBm-–30 dBm-LC (TX disable)-2 km

34060053 Optical transceiver-SFP-1310 nm-STM-1-–8 dBm-–15 dBm-–28 dBm-LC-15 km

34060209 Optical transceiver-SFP-1310 nm-STM-1-0 dBm-–5 dBm-–34 dBm-LC-40 km

B.3 Engineering LabelsThe engineering labels should be made according to the the local engineering specifications orHuawei engineering specifications.

The engineering labels should be made according to the the local engineering specifications orHuawei engineering specifications. Table B-3 lists the Huawei engineering specifications forengineering labels.

For details on how to make and stick cable labels, see the OptiX OSN 1500 Intelligent OpticalTransmission System Installation Guide.

Table B-3 Huawei specifications for engineering labels

Label Illustration Suggestion

Engineeringlabels forpowercables

(1) (2)

TO: A01 -48V2 B08

TO: B03 -48V2

(1) Indicates the label on the loadedcabinet side, which carries theinformation about the position ofthe cable on the power distributionunit.(2) Indicates the label on thedistribution unit side, which carriesthe information about the positionof the cable on the loaded cabinetside.

(1) On the loaded cabinet side, the labelmarked "A01/B08-–48V2" on the cableindicates that the cable is –48V2 DC powersupply, which is from the eighth connecteron the second row of the –48V bus bar inthe cabinet on Row A, and Column 1 in theequipment room.(2) On the distribution unit side, the labelmarked "B03--48V2" indicates that thecable is –48V2 DC power supply, which isfrom the loaded cabinet on Row B, Column03 in the equipment room. For PGND andBGND, it is only necessary to give the rowand column of the power distribution unit,instead of the specific serial number of theterminal block on the copper bar.




Engineeringlabels foralarmexternalcables

The external alarm cables are connected tothe first subscriber cabinet of each row(used for power distribution). Engineeringlabels posted on the first cabinet of eachrow should indicate which equipment isusing the access terminal. Engineeringlabels are not needed on the equipment sideunless there are special requirements.The label marked "A01" indicates that thealarm cable connects the first cabinet andthe cabinet on Row A, Column 01 in theequipment room.

Engineeringlabels forEthernetcables

"A01-03-06-05" indicates that on the localend of the Ethernet cable is connected toEthernet Port 05, Slot 6, Frame 03 of thecabinet on Row A, Column 01 in theequipment room."B02-03-12" indicates that the other end ofthe Ethernet cable is connected to EthernetPort 12, Frame 03 of the cabinet on RowB, Column 02 in the equipment room. Noslot number is specified.

Engineeringlabels forfibersthatconnectequipment

"A01-01-05-05-R" indicates that the localend of the fiber jumper is connected withOptical Receiving Interface 05 on Slot 5,Frame 01 in the cabinet on Row A, Column01 in the equipment room."G01-01-01-01-T" indicates that theopposite end of the fiber jumper isconnected with optical transmittinginterface 01 on Slot 01, Frame 01 in thecabinet on Row G, Column 01 in theequipment room.

Labelsfor fibersthatconnecttheequipment to theODF

"ODF-G01-01-01-R" indicates that thelocal end of the fiber jumper is connectedto the optical receiving terminal on Row01, Column 01 of the ODF in Row GColumn 01 in the equipment room."A01-01-05-05-R" indicates that the otherend of the fiber jumper is connected tooptical receiving interface 5 on Slot 05,frame 01 in the cabinet on Row A, Column01 in the equipment room.





Labelsfor trunkcablesthatconnecttheequipment to theODF

"A01-03-01-01-R" indicates that local endof the trunk cable connects with thereceiving terminal of Trunk Cable 01 inSlot 01, Frame 03 of the cabinet on RowA, Column 01 in the equipment room."DDF-G01-01-01-AR" indicates that theopposite end of the trunk cable connectsthe receiving terminal of Direction A(connected to optical network equipment)on Row 01, Column 01 of the DDF on RowG and Column 01 in the equipment room.

Engineeringlabels forsubscriber cables

TO:

"A01-03-01-01" indicates that the localend of the subscriber cable connects withTerminal 01 on Slot 1, Frame 03 of thecabinet on Row A, Column 01 in theequipment room."MDF-G01-01-01" indicates that theopposite end of the cable connects with theterminal on Row 01, Column 01 of theMDF on Row G, Column 01 in theequipment room.



C Power Consumption and Weight

This chapter describes the power consumption and weight of each board for the OptiX OSN1500.

Table C-1 Power consumption and weight of each board for the OptiX OSN 1500

Board Consumption (W)

Weight (kg) Board Consumption (W)

Weight (kg)

N1ADL4 41 0.9 N1LWX 30 1.1

N1ADQ1 41 1.0 N1MR2B 0 1.0

AUX 19 1.0 N1MR2C 0 1.0

R1AMU 8 0.5 N1FIB 0 0.4

N1BA2 20 1.0 N1MST4 26 0.9

N1BPA 20 1.0 N1MU04 2 0.4

Q2CXL16 40 1.1 N1OU08 6 0.4

Q2CXL4 40 1.1 N2OU08 6 0.4

Q2CXL1 40 1.1 R1PD1 15 0.5

N1EFT8A 26 1.0 N3SL16 22 1.1

N3SL16A 17 0.9 N2PQ3 13 0.9

N2PD3 12 0.9 N2PL3 12 0.9

N2PL3A 12 0.9 TN11OBU1 16 1.3

TN11MR2 0.2 0.9 TN11MR4 0.2 0.9

TN11CMR2

0.2 0.8 TN11CMR4 0.2 0.9

N1D12B 0 0.3 N1PD3 19 1.1

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description C Power Consumption and Weight

Issue 02 (2007-09-10) Huawei Technologies Proprietary C-1



Weight (kg)

N1D12S 9(switching),0 (normal)9

0.4 PIU 1.5 1.3

N1D34S 2(switching),0 (normal)

0.4 R1PL1A 6.7 0.5

N1D75S 6(switching),0 (normal)

0.4 R1PL1B 6.7 0.5

N1EFF8 6 0.4 N1PL3 15 1.0

N1EFS0 35 1.0 N1PQ1 19 1.0

N2EFS0 35 1.0 N1PQM 22 1.0

N4EFS0 35 1.0 R2PD1 10 0.6

N1EFS4 30 1.0 N1PL3A 15 1.1

N2EFS4 30 1.0 N1SEP1 17 1.0

R1EFT4 14 0.5 N1SF16 26 1.1

N1EFT8 26 1.0 N1SL1 14 1.0

N1EGS2 40 1.0 N2SL1 14 1.0

N2EGS2 43 1.0 N1SL16,N1SL16A

20 1.1

N1EGT2 29 0.9 N2SL16 20 1.1

N1EMR0 50 1.2 N1SL4 15 1.0

N2EMR0 50 1.2 N2SL4 15 1.0

EOW 10 0.4 N1SLD4 15 1.0

N1ETF8 2 0.4 N2SLD4 15 1.0

N1ETS8 3(switching),0 (normal)

0.4 N1SLQ1 15 1.0

N1EU04 6 0.4 N2SLQ1 15 1.0

N1EU08 11 0.4 N1SLQ4 16 1.0

R1FAN 20 1.0 N2SLQ4 16 1.0

N1IDL4 41 1.0 N1SLT1 15 1.2

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C-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)



Weight (kg)

N1IDQ1 41 1.0 N1SPQ4 24 0.9

R1L12S 2.7 0.2 N2SPQ4 24 0.9

R1L75S 4.5 0.3 R1SL1 10 0.5

N1TSB4 2.5 0.3 R1SL4 10 0.5

N1C34S 2(switching),0 (normal)

0.3 R1SLD4 11 0.5

N1TSB8 5(switching),0 (normal)

0.3 R1SLQ1 12 0.5

N1EGS4 70 1.1 N1DX1 15 1.0

N1EMS4 65 (not usedwith theinterfaceboard), 75(used withthe interfaceboard)

1.1 N2PQ1 13 1.0

N1DXA 10 0.8 - - -

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description C Power Consumption and Weight

Issue 02 (2007-09-10) Huawei Technologies Proprietary C-3

D Board Version Configuration

This chapter describes the version compatibility for each board.

Table D-1 lists the board versions that are compatible with the OptiX OSN products.

Table D-1 Board versions that are compatible with the OptiX OSN products

Product OptiXOSN7500

OptiXOSN3500

OptiXOSN3500T

OptiXOSN2500

OptiXOSN 2500REG

OptiXOSN1500A

OptiXOSN1500B

N1SL64 Y Y Y N Y N N

N2SL64 N Y Y N Y N N

T2SL64 Y N N N N N N

T2SL64A Y N N N N N N

N1SF64 Y Y Y N Y N N

N1SLD64 Y Y Y N N N N

N1SL16 Y Y Y Y N Y Y

N2SL16 Y Y Y Y Y Y Y

N3SL16 Y Y Y Y Y Y Y

N1SL16A Y Y Y Y N Y Y

N2SL16A Y Y Y Y N Y Y

N3SL16A Y Y Y Y Y Y Y

N1SLD16 N Y Y N N N N

N2SLQ16 Y Y Y N N N N

N1SF16 Y Y Y Y Y Y Y

N1SL4 Y Y Y Y N Y Y

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description D Board Version Configuration

Issue 02 (2007-09-10) Huawei Technologies Proprietary D-1


OptiXOSN3500

OptiXOSN3500T

OptiXOSN2500

OptiXOSN 2500REG

OptiXOSN1500A

OptiXOSN1500B

N2SL4 Y Y Y Y N Y Y

R1SL4 N N N Y N Y Y

N1SLQ4 Y Y Y Y N Y Y


N1SLD4 Y Y Y Y N Y Y

N2SLD4 Y Y Y Y N Y Y

R1SLD4 N N N Y N Y Y

N1SLT1 Y Y Y Y N Y Y



R1SLQ1 N N N Y N Y Y

N1SL1 Y Y Y Y N Y Y

N2SL1 Y Y Y Y N Y Y

R1SL1 N N N Y N Y Y

N1SLH1 Y Y Y N N N N

N1SEP1 Y Y Y Y N Y Y

N2SLO1 Y Y Y Y N Y Y

R1PL1 N N N N N Y Y

R1PD1 N N N Y N Y Y

R2PD1 N N N Y N Y Y

N1PQ1 Y Y Y Y N N Y

N2PQ1 Y Y Y Y N N Y

N1PQM Y Y Y Y N N Y

N1PL3 Y Y Y Y N N Y

N2PL3 Y Y Y Y N N Y

N1PL3A Y Y Y Y N Y Y

N2PL3A Y Y Y Y N Y Y

N1PD3 Y Y Y Y N N Y

N2PD3 Y Y Y Y N N Y

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D-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)


OptiXOSN3500

OptiXOSN3500T

OptiXOSN2500

OptiXOSN 2500REG

OptiXOSN1500A

OptiXOSN1500B

N2PQ3 Y Y Y Y N N Y

N1DX1 Y Y Y Y N N Y

N1DXA Y Y Y Y N Y Y

N1SPQ4 N Y Y Y N N Y

N2SPQ4 Y Y Y Y N N Y

R1EFT4 N N N Y N Y Y

N1EFT8 Y Y Y Y N Y Y

N1EFT8A Y Y Y Y N Y Y

N1EGT2 Y Y Y Y N Y Y

N1EFS0 N Y Y Y N N Y

N2EFS0 Y Y Y Y N N Y

N4EFS0 Y Y Y Y N N Y

N1EFS4 Y Y Y Y N Y Y

N2EFS4 Y Y Y Y N Y Y

N1EGS2 N Y Y Y N Y Y

N2EGS2 Y Y Y Y N Y Y

N1EMS4 Y Y Y Y N Y Y

N1EGS4 Y Y Y Y N Y Y

N2EGR2 Y Y Y Y N Y Y

N1EMR0 N Y Y Y N Y Y

N2EMR0 Y Y Y Y N Y Y

N1ADL4 Y Y Y Y N Y Y

N1ADQ1 Y Y Y Y N Y Y

N1IDL4 Y Y Y Y N Y Y

N1IDQ1 Y Y Y Y N Y Y

N1MST4 Y Y Y Y N Y Y

N1EU08 Y Y Y Y N N Y

N1OU08 Y Y Y Y N N Y

N2OU08 Y Y Y Y N N Y




OptiXOSN3500

OptiXOSN3500T

OptiXOSN2500

OptiXOSN 2500REG

OptiXOSN1500A

OptiXOSN1500B

N1D75S Y Y Y Y N N Y

N1MU04 Y Y Y Y N N Y


N1C34S Y Y Y Y N N Y

N1EU04 N Y Y Y N N Y


N1D12B Y Y Y Y N N Y

R1L12S N N N N N Y N

R1L75S N N N N N Y N

N1EFF8 Y Y Y Y N N Y

N1ETF8 Y Y Y Y N N Y

N1ETS8 Y Y Y Y N N Y

N1DM12 Y Y Y Y N N Y

N1TSB4 N Y Y Y N N Y

N1TSB8 Y Y Y Y N N Y

Q2CXL1 N N N Y N Y Y



T1GXCSA Y N N N N N N

N1GXCSA N Y Y N N N N

T1EXCSA Y N N N N N N

N1EXCSA N Y Y N N N N

T2UXCSA Y N N N N N N

N1UXCSA N Y Y N N N N

N1UXCSB N Y Y N N N N

T1SXCSA Y N N N N N N

T2SXCSA Y N N N N N N

N1SXCSA N Y Y N N N N

N1SXCSB N Y Y N N N N





OptiXOSN3500

OptiXOSN3500T

OptiXOSN2500

OptiXOSN 2500REG

OptiXOSN1500A

OptiXOSN1500B

T1IXCSA Y N N N N N N

N1IXCSA N Y Y N N N N

N1IXCSB N Y Y N N N N

N1XCE N Y Y N N N N

N1GSCC N Y N N N N N

N2GSCC Y N N N N N N

N3GSCC Y Y Y N N N N

CRG N N N N Y N N

T1EOW Y N N N N N N

R1EOW N N N N N Y Y

T1AUX Y N N N N N N

N1AUX N Y Y N N N N

R1AUX N N N N N Y Y

R2AUX N N N N N Y Y

R1AMU N N N N N Y Y

Q1SAP N N N Y Y N N

Q2SAP N N N Y Y N N

Q1SEI N N N Y Y N N

N1FAN N Y Y Y Y N N

R1FAN N N N N N Y Y

N1FANA Y Y Y N N N N

TN11CMR2

Y Y Y Y N Y Y

TN11CMR4

Y Y Y Y N Y Y

TN11MR2 Y Y Y Y N Y Y

TN11MR4 Y Y Y Y N Y Y

N1MR2A Y Y Y Y N Y Y

N1MR2B N N N Y N Y Y

N1MR2C Y Y Y Y N N Y




OptiXOSN3500

OptiXOSN3500T

OptiXOSN2500

OptiXOSN 2500REG

OptiXOSN1500A

OptiXOSN1500B

N1LWX Y Y Y Y N Y Y

TN11OBU1

Y Y Y Y Y Y Y

N1FIB Y Y Y Y Y Y Y

N1BA2 Y Y Y Y Y Y Y

N1BPA Y Y Y Y Y Y Y

61COA Y Y Y Y Y Y Y

62COA Y Y Y Y Y Y Y

N1COA Y Y Y Y Y Y Y

N1DCU Y Y Y N Y N N

N2DCU Y Y Y N Y N N

UPM N N N Y Y Y Y

T1PIU Y N N N N N N

N1PIU N Y Y N N N N

Q1PIU N N N Y Y N N

R1PIU N N N N N Y Y

R1PIUA N N N N N Y N




E Board Loopbacks

The SDH, PDH, data processing board for the OptiX OSN equipment support various types ofloopbacks.

In the case of the SDH boards for the OptiX OSN equipment, Table E-1 lists the capability ofsupporting the loopbacks.

Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment

Board Port Inloop Port Outloop VC-4 Inloop VC-4 Outloop

Q2SL1 Supported. Supported. Supported. Not supported.



N1SL64 Supported. Supported. Supported. Supported.

N2SL64 Supported. Supported. Not supported. Not supported.

T2SL64 Supported. Supported. Not supported. Not supported.

T2SL64A Supported. Supported. Not supported. Not supported.

N1SF64 Supported. Supported. Supported. Supported.

N1SLD64 Supported. Supported. Supported. Supported.

N1SL16 Supported. Supported. Supported. Not supported.


N3SL16 Supported. Supported. Supported. Supported.

N1SL16A Supported. Supported. Supported. Not supported.

N2SL16A Supported. Supported. Not supported. Not supported.

N3SL16A Supported. Supported. Supported. Supported.

N1SLD16 Supported. Supported. Supported. Supported.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description E Board Loopbacks

Issue 02 (2007-09-10) Huawei Technologies Proprietary E-1

Board Port Inloop Port Outloop VC-4 Inloop VC-4 Outloop

N2SLQ16 Supported. Supported. Not supported. Not supported.

N1SF16 Supported. Supported. Supported. Not supported.



R1SL4 Supported. Supported. Supported. Not supported.

N1SLQ4 Supported. Supported. Supported. Not supported.


N1SLD4 Supported. Supported. Supported. Not supported.

N2SLD4 Supported. Supported. Not supported. Not supported.

R1SLD4 Supported. Supported. Supported. Not supported.

N1SLT1 Supported. Supported. Supported. Not supported.

N1SLQ1 Supported. Supported. Supported. Not supported.


R1SLQ1 Supported. Supported. Supported. Not supported.



R1SL1 Supported. Supported. Supported. Not supported.

N1SLH1 Supported. Supported. Supported. Not supported.

N1SEP1 Supported. Supported. Supported. Not supported.

N2SLO1 Supported. Supported. Not supported. Not supported.

In the case of the PDH boards for the OptiX OSN equipment, Table E-2 lists the capability ofsupporting the loopbacks.

Table E-2 Loopbacks of the PDH boards for the OptiX OSN equipment

Board Port Inloop Port Outloop

R1PL1 Supported. Supported.

R1PD1 Supported. Supported.

N1PQ1 Supported. Supported.

N1PQM Supported. Supported.

N1PD3 Supported. Supported.

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E-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)

Board Port Inloop Port Outloop

N1PL3 Supported. Supported.

N2SPQ4 Supported. Supported.

In the case of the Ethernet boards for the OptiX OSN equipment, Table E-3 lists the capabilityof supporting the loopbacks.

Table E-3 Loopbacks of the Ethernet boards for the OptiX OSN equipment

Board MACLayerOutloop

MACLayerInloop

PHYLayerOutloop

PHYLayerInloop

VC-4Inloop,VC-4Outloop


N1EFS4 Notsupported.

Supported. Notsupported.


Supported.




Supported.




Supported.




Supported.




Supported.

N1EGS2 Notsupported.



Supported.

N1EGT2 Supported.



Notsupported.

N1EFT8 Supported.



Supported.

N1EFT8A

Supported.



Supported.

R1EFT4 Supported.



Supported.

N1EMS4 Notsupported.

Notsupported.

Notsupported.


Notsupported.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description E Board Loopbacks

Issue 02 (2007-09-10) Huawei Technologies Proprietary E-3

Board MACLayerOutloop

MACLayerInloop

PHYLayerOutloop

PHYLayerInloop




Notsupported.

Notsupported.


Notsupported.


Notsupported.

Notsupported.


Notsupported.

N2EGR2 Notsupported.



Notsupported.

N1EMR0 Notsupported.



Notsupported.

N2EMR0 Notsupported.



Notsupported.

N1MST4 Notsupported.

Notsupported.

Supported. Supported. Notsupported.

Notsupported.

In the case of the ATM/IMA boards for the OptiX OSN equipment, Table E-3 lists the capabilityof supporting the loopbacks.

Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment

Board External PortOutloop

External PortInloop

Internal PortOutloop

Internal PortInloop

N1ADL4 Not supported. Supported. Supported. Supported.

N1ADQ1 Not supported. Supported. Supported. Supported.

N1IDL4 Not supported. Supported. Supported. Supported.

N1IDQ1 Not supported. Supported. Supported. Supported.

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E-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)

F Board Configuration Reference

The T2000 can be used to configure various parameters for SDH boards, PDH boards, dataprocessing boards, and cross-connect and timing boards.

F.1 SDH Processing BoardsThe parameters that can be configured for the SDH processing boards include the J0 byte, J1byte, C2 byte and V5 byte.

F.2 PDH Processing BoardThe parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2byte , V5 byte and tributary loopback.

F.3 Data Processing BoardThe parameters that should be set for data processing boards include SDH parameters, Ethernetparameters and ATM parameters.

F.4 Cross-Connect and Timing UnitThe clock parameters should be set on the cross-connect and timing unit.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description F Board Configuration Reference

Issue 02 (2007-09-10) Huawei Technologies Proprietary F-1

F.1 SDH Processing BoardsThe parameters that can be configured for the SDH processing boards include the J0 byte, J1byte, C2 byte and V5 byte.

J0 Byte

J0 is the section trace byte, the J0 are transmitted in a successive manner. Hence, the receiveend learns that it is in the continuous connection with the specified transmit end. The value ofJ1 is "0" by default.

J1 Byte

The J1 byte is the path tracing byte. The transmit end uses the J1 byte to transmit the higherorder access point identifiers in a successive manner. Hence, the receive end learns that it is inthe continuous connection with the specified transmit end in this channel. When the receive enddetects the J1 mismatch, the corresponding VC-4 channel generates an HP_TIM alarm.

Set the J1 byte as " HuaWei SBS " for the SL01 and as "0" for all other boards.

NOTE

By default, the J1 byte is " HuaWei SBS ". One space is present before "HuaWei SBS" and five behind.

C2 Byte

The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of theVC frames and the payload property. The received C2 should be the same as the transmitted C2.If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm.

Table F-1 lists the mapping relation between the service type and setting of the C2.

Table F-1 Mapping relation between the service type and setting of the C2

Input Service Type C2 Byte (in Hex)

TUG structure 02

34M/45M asynchronously mapped intoa C-3

04

140M asynchronously mapped into aC-4

12

Unequipped 00

F.2 PDH Processing BoardThe parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2byte , V5 byte and tributary loopback.

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F-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)

J1 ByteThe J1 byte is the path tracing byte. The transmit end transmits the higher order access pointidentifiers in a successive manner. Hence, the receive end learns that it is in the continuousconnection with the specified transmit end. When the receive end detects the J1 mismatch, thecorresponding VC-4 channel generates an HP_TIM alarm.

By default, the J1 byte is set to "0".

NOTE

By default, the J1 byte is "HuaWei SBS ".

C2 ByteThe C2 byte is the signal label byte, which is used to indicate the multiplexing structure of theVC frames and the payload property. The received C2 should be the same as the transmitted C2.If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm.

Table F-2 lists the mapping relation between the service type and setting of the C2.

Table F-2 Mapping relation between the service type and setting of the C2

Input Service Type C2 Byte (in Hex)

TUG structure 02

34M/45M asynchronously mapped intoa C-3

04

140M asynchronously mapped into aC-4

12

Unequipped 00

J2 ByteThe J2 is a VC-12 channel tracing byte. The transmit end uses the J2 byte to transmit the lowerorder access point identifiers in a successive manner. Hence, the receive end learns that it is inthe continuous connection to the specified transmit end in this channel.

V5 ByteThe V5 is a channel status and signal identification byte. This byte is used to detect bit error andindicate remote faults or defect in lower order channel. The LP_REI and LP_RFI alarms aregenerated accordingly. Table F-3 lists the mapping relation between the service type and settingof the V5.

Table F-3 Mapping relation between the service type and setting of the V5

Input Service Type V5 Byte (in Hex)

Asynchronization 02

Byte synchronization 04




HDLC/PPP mapping 0A

Unequipped or Supervisory-Unequipped 00

Equipping IndicationWhen a service channel just carries the service and does not process the service, selectUnequipped or Supervisory-Unequipped.

When a service channel carries the service and also processes the service, select Equipped-Unspecific Payload.

Tributary LoopbackThe tributary loopback function is used to locate faults in the service channels.

The tributary loopback is also a diagnosis function. When the tributary loopback is performed,related services are interrupted.

Path Service TypeThis parameter is set to specify service type for the channel.

l Select E1 or T1 for E1/T1 processing boards according to the actual service type in thechannel.

l Select E3 or T3 for E3/T3 processing boards according to the actual service type in thechannel.

Serial Port Protocol ModeFor the DX1, select the protocol mode of the N x 64 kbit/s signals. The protocol mode includesV.35, V.24, X.21, RS449, RS530 and RS530A.

DDN Clock Source ManagementThe timing scheme and working clock source can be set for the DX1.

Set the timing scheme of the DDN channels 10–12 and 14–16 to the DCE internal scheme, DCEslave scheme or DTE external scheme. Set the timing scheme of the DDN channels 9 and 13 tothe DCE internal scheme, DCE slave scheme, DTE external scheme, DTE internal scheme, DTEslave scheme or DCE external scheme. By default, the timing scheme is the DCE internal schemefor channels 9 and 13 is the DCE internal scheme.

F.3 Data Processing BoardThe parameters that should be set for data processing boards include SDH parameters, Ethernetparameters and ATM parameters.

F.3.1 SDH ParametersThe SDH parameters that should be set for data processing boards include the J1 byte, C2 byte,J2 byte and V5 byte.




F.3.2 Ethernet ParametersThe Ethernet parameters that should be set for the Ethernet boards include the working modeand LCAS state.

F.3.3 ATM ParameterThe ATM parameters that the ATM boards should be set include port type and flow type.

F.3.1 SDH ParametersThe SDH parameters that should be set for data processing boards include the J1 byte, C2 byte,J2 byte and V5 byte.

J1 ByteThe J1 byte is the path tracing byte. The transmit end transmits the J1 byte in a successive manner.Hence, the receive end learns that it is in the continuous connection to the specified transmit endin this path.

When detecting the J1 mismatch, the receive end generates the LP_TIM_VC3 alarm in the VC-3path and the HP_TIM_VC4 in the VC-4 path.

If the J1 byte is of the default value, "0", these alarms are not reported.

NOTE

l For the N1EFS4 and MST4, the J1 byte is " HuaWei SBS " by default. For other boards, the J1byte is "0".

l For the EMS4 and EGS4, set the J1 byte as " HuaWei SBS ".

C2 ByteThe C2 byte is the signal label byte, which is used to indicate the multiplexing structure of theVC frames and the payload property. The received C2 should be the same as the transmitted C2.

In case of the C2 mismatch, the LP_SLM_VC3 alarm is generated in the VC-3 path and theHP_SLM_VC4 alarm is generated in the VC-4 path.

J2 ByteThe J2 is a VC-12 path tracing byte. The transmit end uses the J2 byte to transmit the lowerorder access point identifiers in a successive manner. Hence, the receive end learns that it is inthe continuous connection to the specified transmit end in this path.

In case of the J2 mismatch, the LP_TIM_VC12 alarm is generated in the VC-12 path.

If the J1 byte is of the default value, "0", these alarms are not reported.

V5 ByteThe V5 is a path status and signal identification byte. This byte is used to detect bit error andindicate remote faults or defect in lower order path. The LP_REI and LP_RFI alarms aregenerated accordingly.

When detecting the V5 mismatch, the receive end generates the LP_SLM_VC12 in the VC-12path.

Table F-4 lists the mapping relation between the service type and setting of the V5.



Table F-4 Mapping relation between the service type and setting of the V5


Asynchronization 02

Byte synchronization 04

HDLC/PPP mapping 0A

Unequipped or Supervisory-Unequipped 00

F.3.2 Ethernet ParametersThe Ethernet parameters that should be set for the Ethernet boards include the working modeand LCAS state.

Working Mode

Generally, the interconnected equipment should work in the same fixed working mode. If theworking modes at both ends mismatch, packets may be lost or the rate becomes less. In case oflarge volume of data, services may be even interrupted.

For EGT2, EGS2 and EGS4, set the working mode to auto-negotiation or 1000M full-duplex.

For the EFT8 and EFT8A, set the working mode to auto-negotiation or 10/100M full-duplex.

For the EFS4 and EFS0, set the working mode to auto-negotiation, 10M half-duplex, 10M full-duplex, 100M half full-duplex or 100M full-duplex.

For the GE ports of the EMS4, EMR0 and EGR2, set the working mode to auto-negotiation or1000M full-duplex. For the FE ports, set the working mode to auto-negotiation, 10M half-duplex,10M full-duplex, 100M half full-duplex or 100M full-duplex.

LCAS State

Enable or disable the LCAS.

Maximum Packet Length

For external ports, set the maximum packet length, which is 1522-byte by default.

Mapping Protocol

The mapping protocols of the interconnected equipment should be the same.

For the EGT2, EFT8, EFT8A, EFF8 and ETF8, set the mapping protocol to HDLC, LAPS andGFP-F. By default, the mapping protocol is GFP-F.

Choose the GFP-F mapping protocol for the EGS2, EFS4 and EFS0.

For the EMR0 and EGR2, set the mapping protocol to LAPS and GFP. By default, the mappingprotocol is GFP.




TAG Flag

The TAG flag is used to identify the type of packets. The TAG flag can be set to TAG Aware,Access and Hybrid.

1. When the TAG flag is set as the TAG Aware for a port, the port transparently transmits thepackets with a TAG and discards the packets without a TAG.

2. When the TAG flag is set as Access for a port, the port adds a TAG to the received packetsthat does not contain any TAG according to the VLAN ID of the port, and discards thepackets that contain a TAG.

3. When the TAG flag is set as Hybrid for a port, the port can process the packets with a TAGor without any TAG. In this case, the port adds a TAG to the received packets that doesnot contain any TAG according to the VLAN ID of the port.

VLAN ID

Set the default VLAN ID of the local port.

Port Type

For the boards that support the MPLS function, set the port type to P or PE. Provider edge (PE)indicates the edge port of the service provider and provider (P) indicates the core network portof the service provider. When configuring the EVPL and EVPLAN services, set this parameter.Set the external port to PE and the internal port to P.

Port Encapsulation Format

The encapsulation format can be set to MartinioE or stack VLAN. When the port is of the Ptype, this attribute is valid. For EVPL services, set the encapsulation format to MartinioE. ForEVPLAN services, set the encapsulation format to stack VLAN.

Port Attribute

For boards that support the QinQ function, set the port attribute to UNI, NNI, U-NNI, S-Awareor C-Aware.

F.3.3 ATM ParameterThe ATM parameters that the ATM boards should be set include port type and flow type.

Port Type

The port types include NNI and UNI (default).

Flow Type

The flow type should meet the requirements of the port.

Service Type

There are four service types, CBR, rt-VBR, nrt-VBR, and UBR.



Peak Cell RateSet the peak cell rate (PCR) on ATM services. The PCR should be set on all service types.

Sustainable Cell RateSet the sustainable cell rate (SCR) on ATM services. The SCR should be set on rt-VBR and nrt-VBR services.

Maximum Cell Burst SizeSet the maximum cell burst size (MCBS) on ATM serivces. The MCBS should be set on rt-VBRand nrt-VBR services.

Cell Delay Variation ToleranceSet the cell delay variation tolerance (CDVT) on ATM serivces. The CDVT should be set onCBR, rt-VBR and UBR services.

F.4 Cross-Connect and Timing UnitThe clock parameters should be set on the cross-connect and timing unit.

Set the following parameters when synchronization status message (SSM) is not enabled andthe external clock is unavailable.

l Reference clock source

l Reference clock source level

Set the following parameters when the external clock is configured and the SSM is enabled.

l Reference clock source

l Reference clock source level

l Building integrated timing supply (BITS) type

l S1 byte

l Threshold for selecting the clock in case of the switching protection




G Glossary

This document defines the following terms:

1

1:N protection A 1:N protection architecture has N normal traffic signals, N workingSNCs/trails and one protection SNC/trail. It may have one extra trafficsignal.

1+1 protection A 1+1 protection architecture has one normal traffic signal, one workingSNC/trail, one protection SNC/trail and a permanent bridge.

100Base-TX Physical Layer specification for a 100 Mbit/s CSMA/CD local areanetwork over two pairs of Category 5 unshielded twisted-pair (UTP) orshielded twisted-pair (STP) wire.

10BASE-T Physical Layer specification for a 10 Mb/s CSMA/CD local areanetwork over two pairs of twisted-pair telephone wire.

19-inch cabinet A cabinet which is 19 inches in width and 600mm in depth, compliantwith the standards of the IEC297.

A

Add/DropMultiplexer

A multiplexer capable of extracting and inserting lower-rate signalsfrom a higher-rate multiplexed signal without completelydemultiplexing the signal.

ADM add/drop multiplexer. see add/drop multiplexer.

Administrator A user who has authority to access all the Management Domains of theEML Core product. He has access to the whole network and to all themanagement functionalities.

AIS Alarm Indication Signal. A signal sent downstream in a digital networkif an upstream failure has been detected and persists for a certain time.

Alarm cable The cable which is used to transmit alarm signals.

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description G Glossary

Issue 02 (2007-09-10) Huawei Technologies Proprietary G-1

Alarm A visible or an audible indication to notify the person concerned that afailure or an emergency has occurred. See also Event.

AMI Alternate Mark Inversion. The line-coding format in transmissionsystems where successive ones (marks) are alternatively inverted (sentwith polarity opposite that of the preceding mark).

APD Avalanche Photodiode. A semiconductor photodetector with integraldetection and amplification stages. Electrons generated at a p/n junctionare accelerated in a region where they free an avalanche of otherelectrons. APDs can detect faint signals but require higher voltages thanother semiconductor electronics.

Asynchronous A network where transmission system payloads are not synchronizedand each network terminal runs on its own clock.

ATM Asynchronous Transfer Mode. A transfer mode in which the informationis organized into cells. It is asynchronous in the sense that the recurrenceof cells containing information from an individual user is not necessarilyperiodic. It is a protocol within the OSI layer 1. An ATM cell consistsof a 5 octet header followed by 48 octets of data.

Attenuation Reduction of signal magnitude or signal loss, usually expressed indecibels.

Attenuator A passive component that attenuates an electrical or optical signal.

Attribute Property of an object.

AU administrative unit. see administrative unit

Auto-negotiation The rate/work mode of the communication party set as self-negotiationis specified through negotiation according to the transmission rate of theopposite party.

B

Back up A method to copy the important data into a backing storage in case thatthe original is damaged or corrupted.

Backplane A PCB circuit board in the subrack, which is connected with all theboards in position.

Bandwidth Information-carrying capacity of a communication channel. Analogbandwidth is the range of signal frequencies that can be transmitted bya communication channel or network.

BITS Building Integrated Timing Supply. A building timing supply thatminimises the number of synchronization links entering an office.Sometimes referred to as a synchronization supply unit.

G GlossaryOptiX OSN 1500 Intelligent Optical Transmission System


G-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)

Board VersionReplacementFunction

A function that enables a board supporting several board IDs. Generally,a board of an old version is used to the NE also of an old version, whichdoes not support the board of a new version. When a board of a newversion is used to replace a board of an old version, the former shouldwork with the ID of the board of the old version. The board of a newversion works on the NE of a new version with the ID of the board ofnew version. In this way, the board of the new version has several boardIDs.

Bridge The action of transmitting identical traffic (SPE contents) on both theworking and protection channels.

Broadcast The act of sending a frame addressed to all stations on the network

C

Cable tie The tape used to bind the cables.

CBR Constant Bit Rate. The Constant Bit Rate service category is used byconnections that request a static amount of bandwidth that iscontinuously available during the connection lifetime. This amount ofbandwidth is characterized by a peak cell Rate (PCR) value.

CDVT Cell Delay Variation Tolerance. Information sent in the forward andbackward direction to determine the upper bound of the toleranceadmitted for the time interval between cells pertaining to a given cellflow. The backward CDVT values included in the IAM and MOD shallbe interpreted as maximum acceptable values for the cell flow in thebackward direction.

Channel spacing The center to center difference in frequency or wavelength betweenadjacent channels in a WDM device.

Channel The smallest subdivision of a circuit that provides a type ofcommunication service; usually a path with only one direction.

Circuit A communications path or network; usually a pair of channels providingbi-directional communication.

Client A kind of terminal (PC or workstation) connected to a network that cansend instructions to a server and get results through a user interface. Seealso server.

Coded MarkInversion

This is the STS-3 line code. This is a two level non-return to zero code.A binary 1 is coded by either of the amplitude levels, +A or -A, for onefull unit time interval (T) in such a way that the level alternates forsuccessive binary ones. For a binary zero there is always a positivetransition (-A to +A) at the mid point of the binary unit interval (T/2).



Configuration data The data that configures the NE hardware for coordination between thisNE and other NEs in the entire network, and for operation of specifiedservices. Configuration data is the instruction file of NEs, and it is a keyelement to ensure that the network runs efficiently. The typicalconfiguration data includes board configuration, clock configurationand protection relationship.

Configure To set the basic parameters of an operation object.

Connection A "transport entity" which consists of an associated pair of"unidirectional connections" capable of simultaneously transferringinformation in opposite directions between their respective inputs andoutputs.

Convergence The process of developing a model of the echo path which will be usedin the echo estimator to produce the estimate of the circuit echo.

Conversion In the context of message handling, a transmittal event in which an MTAtransforms parts of a message content from one encoded informationtype to another, or alters a probe so it appears that the described messageswere so modified.

CyclicRedundancyCheck

A technique for using overhead bits to detect transmission errors.

D

DDF Digital Distribution Frame. A frame which is used to transfer cables.

DenseWavelengthDivisionMultiplexing

The higher capacity version of WDM, which is a means of increasingthe capacity of fiber-optic data transmission systems through themultiplexing of multiple wavelengths of light. Commercially availableDWDM systems support the multiplexing of from 8 to 40 wavelengthsof light.

Drop The port on a network element where the service to an end customermay be connected, e.g., a tributary card on a SONET ADM. Forexample, a drop for a DS1 customer service may be provided by a VT1.5card terminating a VT1.5 trail.

Dual-Fed A description of a ring that has entry nodes that add traffic to the ringvia the bridging function.

DWDM Dense Wavelength Division Multiplexing. The technology utilizes thecharacteristics of broad bandwidth and low attenuation of single modeoptical fiber, employs multiple wavelengths with specific frequencyspacing as carriers, and allows multiple channels to transmitsimultaneously in the same fiber.

E




E13 A funciton used to multiplex E1 signals into E3 signals or to demultipexE3 signals into E1 signals.

ECC Embedded Control Channel. An ECC provides a logical operationschannel between SDH NEs, utilizing a data communications channel(DCC) as its physical layer.

EDFA Erbium-Doped Fiber Amplifier. The optical amplifier that its fiberdoped with the rare earth element erbium, which can amplify at 1530 to1610 nm when the optical amplifier is pumped by an external lightsource.

Ejector lever A component at the two ends of the front panel of a board, which is usedfor inserting or removing the board.

Encapsulation In 1000BASE-X, the process by which a MAC packet is enclosed withina PCS code-group stream

EPL Ethernet Private Line. An EPL service is a point-to-pointinterconnection between two UNIs without SDH bandwidthsharing.Transport bandwidth is never shared between differentcustomers.

ESCON Enterprise System Connection. A path protocol which connects the hostwith various control units in an storage system. It is a serial bit streamtransmission protocol. The transmission rate is 200 Mbit/s.

ESD jack Electrostatic discharge jack. A hole in the cabinet or subrack, whichconnect the subrack or cabinet to the insertion of ESD wrist strap.

ESD Electrostatic Discharge. The phenomena the energy being produced byelectrostatic resource discharge instantly.

Ethernet A data link level protocol comprising the OSI model's bottom two layers.It is a broadcast networking technology that can use several differentphysical media, including twisted pair cable and coaxial cable. Ethernetusually uses CSMA/CD. TCP/IP is commonly used with Ethernetnetworks.

ETSI European Telecommunications Standards Institute

EVPL Ethernet Virtual Private Line. An EVPL service is a service that is botha line service and a virtual private service.

Eye pattern A graphic presentation formed by the superimposition of the waveformsof all possible pulse sequences.

F

Fan tray assembly A module which contains fans used for heat dissipation.

Fault A fault is the inability of a function to perform a required action. Thisdoes not include an inability due to preventive maintenance, lack ofexternal resources, or planned actions.



FC Fiber Channel. A standard of data storage network for transmittingsignals at 100 Mbit/s to 4.25Gbit/s over fiber or (at slow speeds) copper.

Fiber connector A device mounted on the end of a fiber-optic cable, light source,receiver, or housing that mates to a similar device to couple light intoand out of optical fibers. A connector joins two fiber ends, or one fiberend and a light source or detector.

Fiber jumper The fiber which is used to connect the subrack with the ODF.

FICON Fibre Connect. A new generation connection protocol which connectsthe host with various control units. It carries single byte commandprotocol through the physical path of fiber channel, and provides higherrate and better performance than ESCON.

Flow An aggregation of packets that have the same characteristics. On theT2000 or NE software, flow is a group of classification rules. On boards,it is a group of packets that have the same quality of service (QoS)operation. At present, two flows are supported: port flow and port +VLAN flow. Port flow is based on port ID and port + VLAN flow isbased on port ID and VLAN ID. The two flows cannot coexist in thesame port.

Frame A cyclic set of consecutive time slots in which the relative position ofeach time slot can be identified.

Free-run mode An operating condition of a clock, the output signal of which is stronglyinfluenced by the oscillating element and not controlled by servo phase-locking techniques. In this mode the clock has never had a networkreference input, or the clock has lost external reference and has no accessto stored data, that could be acquired from a previously connectedexternal reference. Free-run begins when the clock output no longerreflects the influence of a connected external reference, or transitionfrom it. Free-run terminates when the clock output has achieved lock toan external reference.

Full duplex Pertaining to both parties that can send and receive data at the same timeon the communication link.

G

Gain The ratio between the optical power from the input optical interface ofthe optical amplifier and the optical power from the output opticalinterface of the jumper fiber, which expressed in dB.

Grooming Consolidating or segregating traffic for efficiency.

Guide rail A groove in the subrack, which ensures the correct connection of a boardto the backplane.

H




Half duplex Pertaining to, both parties that only one party can send data, while theother party can only receive data on the communication link.

I

IMA frame The IMA frame is used as the unit of control in the IMA protocol. It isa logical frame defined as M consecutive cells, numbered 0 to M-l,transmitted on each of the N links in an IMA group.

IMA Inverse Multiplexing for ATM. The ATM inverse multiplexingtechnique involves inverse multiplexing and de-multiplexing of ATMcells in a cyclical fashion among links grouped to form a higherbandwidth logical link whose rate is approximately the sum of the linkrates. This is referred to as an IMA group.

Interface boardarea

The area for the interface boards on the subrack.

Isolation A nonreciprocal optical device intended to suppress backwardreflections along an optical fiber transmission line while havingminimum insertion loss in the forward direction.

J

Jitter Short waveform variations caused by vibration, voltage fluctuations,control system instability, etc.

L

Label A mark on a cable, a subrack, or a cabinet for identification.

Laser The device that generates the directional light covering a narrow rangeof wavelengths. Laser light is more coherent than ordinary light.Semiconductor diode lasers are the used light source in fiber-opticsystem.

Layer A concept used to allow the transport network functionality to bedescribed hierarchically as successive levels; each layer being solelyconcerned with the generation and transfer of its characteristicinformation.

LCAS Link Capacity Adjustment Scheme. A solution features flexiblebandwidth and dynamic adjustment. In addition, it provides a failuretolerance mechanism, which enhances the viability of virtualconcatenations and enables the dynamic adjustment to bandwidth (non-service affecting).



Link A "topological component" that provides transport capacity betweentwo endpoints in different subnetworks via a fixed (i.e., inflexiblerouting) relationship. The endpoints are "subnetwork termination pointpools" for SONET, and link termination points for ATM. Multiple linksmay exist between a pair of subnetworks. A link also represents a set of"link connections".

Loopback The fault of each path on the optical fiber can be located by settingloopback for each path of the line. There are three kinds of loopbackmodes: No loopback, Outloop, Inloop.

Lower subrack The subrack close to the bottom of the cabinet when a cabinet containsseveral subracks.

M

M13 A function used to multiplex T1 signals into T3 signals or to demultiplexT3 signals into T1 signals.

MAC Media Access Control. The data link sublayer that is responsible fortransferring data to and from the Physical Layer.

Mapping A procedure by which tributaries are adapted into virtual containers atthe boundary of an SDH network.

Mean launchedpower

The average power of a pseudo-random data sequence coupled into thefiber by the transmitter.

Mounting ear A component on the side of a subrack, which is used to install the subrackin a cabinet.

MPLS Multiprotocol Label Switching. Multi-protocol label switching. It is astandard routing and switching technology platform, capable ofsupporting various high level protocols and services. The datatransmission over an MPLS network is independent of route calculating.MPLS, as a connection-oriented transmission technology, guaranteesQoS effectively, supports various network level technologies, and isindependent of the link layer.

MSP The MSP function provides capability for switching a signal betweenand including two MST functions, from a working to a protectionchannel.

Multicast Transmission of a frame to stations specified by a group address.

Multiplex sectionprotection

A function provides capability for switching a signal between andincluding two MST functions, from a working to a protection channel.

Multiplex To transmit two or more signals over a single channel.

Multiplexer An equipment which combines a number of tributary channels onto afewer number of aggregate bearer channels, the relationship betweenthe tributary and aggregate channels being fixed.




Multiplexing A procedure by which multiple lower order path layer signals areadapted into a higher order path or the multiple higher order path layersignals are adapted into a multiplex section.

N

NNI Network Node Interface. NNI identifies the interface between the ATMnetwork nodes. Compare SDH NNI.

Noise figure The specification to scale the random signal in the system presenting inaddition to any wanted signal.

Non-revertive In non-revertive mode, when a protection switch occurs, the workingservice will be switched to the protection service and the status willremain after it returns normal.

NRZ Non Return to Zero. A digital code in which the signal level is low fora 0 bit and high for a 1 bit and dose not return to 0 between successive1 bits.

O

OADM Optical Add/Drop Multiplexer. A device that can be used to add theoptical signals of various wavelengths to one channel and drop theoptical signals of various wavelengths from one channel.

ODF Optical Distribution Frame. A frame which is used to transfer and spoolfibers.

ONE Optical Network Element. A stand-alone physical entity in an opticaltransmission network that supports at least network element functions.

Optical add/dropmultiplexing

A process that add the optical signals of various wavelengths to onechannel and drop the optical signals of various wavelengths from onechannel.

Optical Amplifier A device or subsystem in which optical signals can be amplified bymeans of stimulated emission taking place in an suitable active medium.It is used to amplify the optical signal of the optical transmission system.

Optical connector A component normally attached to an optical cable or piece of apparatusfor the purpose of providing frequent optical interconnection/disconnection of optical fibers or cables.

Optical interface A device to allow two or more corresponding optical transmitting unitsto be connected.

OTM Optical Terminal Multiplexer. A device that multiplex or demultiplexoptical signals into a transmission link or into the client side.

OTU Optical Transponder Unit. A device that access service signalscompliant with standards at the client side and convert them intostandard DWDM or CWDM wavelengths.



Output opticalpower

The ranger of optical energy level of output signals.

Overhead Extra bits in a digital stream used to carry information besides trafficsignals. Orderwire, for example, would be considered overheadinformation.

P

Packing case A case which is used for packing the board or subrack.

Paired Slots When SDH boards are used to configure the MSP ring, the two boardsforming a ring must be inserted in paired slots.

Pass-Through The action of transmitting by a node exactly what is received by thatnode for any given direction of transmission. A pass-through can beunidirectional or bidirectional. For BLSRs, a pass-through refers to theK1 and the K2 bytes and the protection channels. Three types of pass-through are used in BLSRs: K byte pass through, unidirectional fullpass-through, and bidirectional full pass-through.

Path protection The working principle of path protection: When the system works inpath protection mode, the PDH path uses the dual-fed and signalselection mode. Through the tributary unit and cross-connect unit, thetributary signal is sent simultaneously to the east and west lines.Meanwhile, the cross-connect matrix sends the signal dually sent fromthe opposite end to the tributary board through the active and standbybuses, and the hardware of the tributary board automatically andselectively receive the signal from the two groups of buses automaticallyaccording to the AIS number of the lower order path.

Path A logical connection between the point at which a standard frame formatfor the signal at the given rate is assembled, and the point at which thestandard frame format for the signal is disassembled.

PCR Peak Cell Rate. An upper limit on the rate at which cells can be submittedon an ATM connection.

PDH Plesiochronous Digital Hierarchy. PDH is the digital networkinghierarchy that was used before the advent of Sonet/SDH.

PIN Photodiode. A semiconductor detector with an intrinsic (i) regionseparating the p- and n-doped regions. It has fast linear response and isused in fiber-optic receivers.

Plesiochronous A network with nodes timed by separate clock sources with almost thesame timing.

Pointer An indicator whose value defines the frame offset of a virtual containerwith respect to the frame reference of the transport entity on which it issupported.

Power unit A direct current power distribution unit at the upper part of a cabinet,which supplies power for the subracks in the cabinet.




PRBS When there are cross-connections between a line board and a tributary/data board, many alarms are raised on the tributary/data board if alarmsare raised on the line board. These alarms are all reported to the T2000.Such a large number of alarms can disturb the troubleshooting and affectthe problem solution efficiency. Therefore, the inter-board alarmsuppression function is used to solve this problem.

Private line Both communication parties are connected permanently.

Procedure A generic term for an action.

Process A generic term for a collection of actions.

Processing boardarea

An area for the processing boards on the subrack.

Provisioning The process of making available various telecommunications resources(such as switching systems and transport facilities) fortelecommunication services. Provisioning includes forecasting thedemand for services, determining the additions or changes to thenetwork that will be needed, determining where and when they will beneeded, and installing all the necessary network elements to providesuch services.

R

Receiver overload Receiver overload is the maximum acceptable value of the receivedaverage power at point R to achieve a 1 x 10-10 BER.

Receiversensitivity

Receiver sensitivity is defined as the minimum acceptable value ofaverage received power at point R to achieve a 1 x 10-10 BER.

Reference clock A clock of very high stability and accuracy that may be completelyautonomous and whose frequency serves as a basis of comparison forthe frequency of other clocks.

REG A device that performs regeneration.

Regeneration The process of receiving and reconstructing a digital signal so that theamplitudes, waveforms and timing of its signal elements are constrainedwithin specified limits.

Revertiveswitching

In revertive switching, there is a working and protection line, board andso on. Services always revert back to the original working line or boardif the switch requests are terminated; that is, when the working line orboard has recovered from the fault or the external request is cleared.

RPR Resilient Packet Ring. A metropolitan area network (MAN) technologysupporting data transfer among stations interconnected in a dual-ringconfiguration.

RS232 In the asynchronous transfer mode and there is no hand-shaking signal.It can communicate with RS232 and RS422 of other stations in point-to-point mode and the transmission is transparent. Its highest speed is19.2 kbit/s.



S

S1 byte The byte defined in ITU-T to transmit the network synchronizationstatus information.

SAN Storage Area Network. A dedicated high-speed data storage networkwhich interconnects multiple independent storage systems with multipleservers through fiber path switch or other switch equipment.

SDH Synchronous Digital Hierarchy. A hierarchical set of digital transportstructures, standardized for the transport of suitably adapted payloadsover physical transmission networks.

Section The portion of a SONET transmission facility, including terminatingpoints, between (i) a terminal network element and a regenerator or (ii)two regenerators. A terminating point is the point after signalregeneration at which performance monitoring is (or may be) done.

Settings Parameters of an operation that can be selected by the user.

SF signal fail.See signal fail.

SFP small form-factor pluggable.see small form-factor pluggable.

Side modesuppression ratio

The ratio of the largest peak of the total source spectrum to the secondlargest peak.

Side panel The panel on the side of the cabinet.

Signal cable The cable which is used to transmit electrical signals, different from thepower cable or fiber.

Signal fail A signal indicating the associated data has failed in the sense that a near-end defect condition (not being the degraded defect) is active.

SNCMP The SNCMP is an N+1 protection scheme, which means multipleprotection paths protect a working path.

SNCTP The SNCTP provides protection paths at the VC-4 level. When theworking path is faulty, all its services can be switched to the protectionpath.

Span The set of SONET lines between two adjacent nodes on a ring.

SSM Synchronization Status Message. ITU-T defines S1 byte to transmit thenetwork synchronization status information. It uses the lower four bitsof the multiplex section overhead S1 byte to indicate 16 types ofsynchronization quality grades.

Synchronous A network where transmission system payloads are synchronized to amaster (network) clock and traced to a reference clock.

T




T2000 The T2000 is a subnet management system (SNMS). In thetelecommunication management network architecture, the T2000 islocated between the NE level and network level, which can supports allNE level functions and part of the network level management functions.See also NM.

TCM Tandem Connection Monitor. In the SDH transport hierarchy, the TCMis located between the AU/TU management layer and HP/LP layer. Ituses the N1/N2 byte of POH overhead to monitor the quality of thetransport channels on a transmission section (TCM section).

TPS Tributary Protection Switching. A function provided by the equipment,is intended to protect N tributary processing boards through a standbytributary processing board.

Tray A discal component in the cabinet, which is used to place the chassis orother equipment.

Tributaryloopback

A fault location method. A fault can be located for each service path byperforming loopback on each path of the tributary board. There are threetypes of loopback modes: Non-loopback, Outloop and Inloop.

TUG tributary unit group.see tributary unit group.

U

Upload To report all or part of the configuration data of the NE to the T2000and overwrite the configuration data saved in the NE layer on the T2000.

Upper subrack The subrack close to the top of the cabinet when a cabinet containsseveral subracks.

V

VC virtual container. see virtual container.

Virtualconcatenation

The payload whose transmission bandwidth is bigger than VC4. Virtualconcatenation combines multiple VC4 payloads (successive or non-successive) to form a virtual large structure VC4-Xv in cascade modefor transmission. The transmission of the broadband cascaded payloadis implemented via the virtual cascade, thus improving the SDHtransmission payload bandwidth capability from VC4 to VC4-4C.

VLAN Virtual local area network. A subset of the active topology of a BridgedLocal Area Network. Associated with each VLAN is a VLAN Identifier(VID).

VPN Virtual Private Network. Enables IP service to be transmitted securelyover a public TCP/IP network by encrypting all service from onenetwork to another.



W

WavelengthDivisionMultiplexing

A means of increasing the capacity of fiber-optic data transmissionsystems through the multiplexing of multiple wavelengths of light.WDM systems support the multiplexing of as many as four wavelengths.




H Acronyms and Abbreviations

A

ADM Add/Drop Multiplexer

AMI Alternate Mark Inversion

APS Automatic Protection Switching

ATM Asynchronous Transfer Mode

B

BITS Building Integrated Timing Supply

C

CAR Committed Access Rate

CBR Constant Bit Rate

CC Continuity Check

CMI Coded Mark Inversion

COA Case-shaped Optical Amplifier

CPU Central Processing Unit

CRC Cyclic Redundancy Check

D

DC Direct Current

DCC Data Communication Channel

DCE Data Circuit-terminal Equipment

DCU Dispersion Compensation Unit

DDF Digital Distribution Frame

DTR Data Terminal Ready

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description H Acronyms and Abbreviations

Issue 02 (2007-09-10) Huawei Technologies Proprietary H-1

DVB-ASI Digital Video Broadcast-Asynchronous Serial Interface

DWDM Dense Wavelength Division Multiplexing

E

ECC Embedded Control Channel

EDFA Erbium-Doped Fiber Amplifier

EMC Electromagnetic Compatibility

EMI Electro Magnetic Interference

EPL Ethernet Private Line

EPLAN Ethernet Private LAN

ESCON Enterprise Systems Connection

ETS European Telecommunication Standards

ETSI European Telecommunications Standards Institute

EVPL Ethernet Virtual Private Line

EVPLAN Ethernet Virtual Private LAN

F

FC Fiber Channel

FE Fast Ethernet

FEC Forward Error Correction

FICON Fiber Connection

FPGA Field Programmable Gate Array

G

GE Gigabit Ethernet

GFP Generic Framing Procedure

H

HDB3 High Density Bipolar of order 3 code

HDLC High level Data Link Control

I

IEEE Institute of Electrical and Electronics Engineers

IS-IS Intermedia System-Intermedia System

ITU-T International Telecommunication Union - TelecommunicationStandardization Sector

H Acronyms and AbbreviationsOptiX OSN 1500 Intelligent Optical Transmission System


H-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)

L

LAPS Link Access Procedure-SDH

LB LoopBack

LCAS Link Capacity Adjustment Scheme

LCT Local Craft Terminal

M

MPLS Multi-protocol Label Switch

MSP Multiplex Section Protection

MLM Multi-Longitudinal Mode

N

NA Not available

NRZ Non Return to Zero

O

OAM Operation Administration and Maintenance

OSPF Open Shortest Path First

P

PA Power Amplifier

PDH Plesiochronous Digital Hierarchy

RAM Random-access Memory

R

RD Receive Data

RIP Routing Information Protocol

RSTP Rapid Spanning Tree Protocol

S

SDH Synchronous Digital Hierarchy

SG Signaling Ground

SLM Single- Longitudinal Mode

SNCP Sub-Network Connection Protection

SSM Synchronization Status Message

T

TD Transmit Data

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description H Acronyms and Abbreviations

Issue 02 (2007-09-10) Huawei Technologies Proprietary H-3

TPS Tributary Protection Switching

U

UBR Unspecified Bit Rate

UPM Uninterruptible Power Modules

V

VBR Variable Bit Rate

VLAN Virtual Local Area Network

VPN Virtual Private Network

W

WDM Wavelength Division Multiplexing

H Acronyms and AbbreviationsOptiX OSN 1500 Intelligent Optical Transmission System


H-4 Huawei Technologies Proprietary Issue 02 (2007-09-10)

Index

AADL4

configuration reference, 7-104feature code, 7-104front panel, 7-103function and feature, 7-100principle and signal flow, 7-101technical specifications, 7-105valid slots, 7-104version, 7-100

ADQ1configuration reference, 7-111feature code, 7-111front panel, 7-109function and feature, 7-106principle and signal flow, 7-107technical specifications, 7-112valid slots, 7-111version, 7-106

AMUfront panel, 10-17function and feature, 10-15principle and signal flow, 10-16technical specification, 10-20valid slot, 10-20version, 10-15

AUXfront panel, 10-12function and feature, 10-6jumper, 10-11principle and signal flow, 10-7technical specification, 10-15valid slot, 10-14version, 10-6

BBA2

board feature code, 12-7front panel, 12-5function and feature, 12-2principle and signal flow, 12-3technical specification, 12-7

valid slot, 12-7version, 12-2

boardbarcode, 4-3classification

Amplifier, 4-11Auxiliary, 4-10Compensation, 4-11Control, 4-10Data, 4-7Interface, 4-9PDH, 4-6Power, 4-12SDH, 4-4Switching, 4-9WDM, 4-11

loopbacks, E-1version configuration, D-1

BPAboard feature code, 12-13Front Panel, 12-11function and feature, 12-9principle and signal flow, 12-10technical specification, 12-13valid slot, 12-13version, 12-9

CC34S

front panel, 8-25function and feature, 8-24principle and signal flow, 8-24technical specification, 8-26valid slot, 8-26version, 8-24

cabinetconfiguration, 2-2

DC PDU, 2-3indicator, 2-3

technical specifications, 2-5type, 2-2

Cabinet ConfigurationOther, 2-4

OptiX OSN 1500 Intelligent Optical Transmission SystemHardware Description Index

Issue 02 (2007-09-10) Huawei Technologies Proprietary i-1

CMR2feature code, 11-7front panel, 11-5function and feature, 11-3principle and signal flow, 11-4technical specification, 11-8valid slot, 11-7version, 11-3

CMR4board feature code, 11-13front panel, 11-11function and feature, 11-9principle and signal flow, 11-10technical specification, 11-14valid slot, 11-13version, 11-9

COAboard feature code, 12-24front panel, 12-19function and feature, 12-15installation position, 12-23principle and signal flow, 12-18technical specification, 12-24version, 12-15

CXL1board configuration reference, 9-11board feature code, 9-11front panel, 9-9function and feature, 9-2principle and signal flow, 9-5technical specification, 9-12valid slot, 9-11version, 9-2



DD12B

front panel, 8-6function and feature, 8-6principle and signal flow, 8-6

technical specification, 8-9valid slot, 8-8version, 8-6

D12Sfront panel, 8-10function and feature, 8-9principle and signal flow, 8-10technical specification, 8-13valid slot, 8-12version, 8-9



DM12front panel, 8-61function and feature, 8-60principle and signal flow, 8-60technical specification, 8-64valid slot, 8-64version, 8-60

DX1board configuration reference, 6-70board feature code, 6-68front panel, 6-67function and feature, 6-65principle and signal flow, 6-66technical specification, 6-70TPS Protection, 6-69valid slot, 6-68version, 6-65

DXAboard configuration reference, 6-75front panel, 6-73function and feature, 6-72principle and signal flow, 6-72technical specification, 6-75valid slot, 6-74version, 6-71

EEFF8

front panel, 8-48function and feature, 8-47principle and signal flow, 8-47technical specification, 8-50valid slot, 8-49

IndexOptiX OSN 1500 Intelligent Optical Transmission System


i-2 Huawei Technologies Proprietary Issue 02 (2007-09-10)

version, 8-47EFS0

configuration reference, 7-37front panel, 7-35function and feature, 7-30principle and signal flow, 7-32technical specifications, 7-37TPS protection, 7-36valid slots, 7-36version, 7-29

EFS4configuration reference, 7-45front panel, 7-43function and feature, 7-38principle and signal flow, 7-40technical specifications, 7-45valid slots, 7-45version, 7-38

EFT4configuration reference, 7-8front panel, 7-6function and feature, 7-3principle and signal flow, 7-4technical specifications, 7-8valid slots, 7-8version, 7-3

EFT8configuration reference, 7-15front panel, 7-12function and feature, 7-9principle and signal flow, 7-10technical specifications, 7-15valid slots, 7-14version, 7-9

EFT8Aconfiguration reference, 7-22front panel, 7-19function and feature, 7-16principle and signal flow, 7-17technical specifications, 7-22valid slots, 7-21version, 7-16

EGR2configuration reference, 7-86feature code, 7-86front panel, 7-84function and feature, 7-79principle and signal Flow, 7-82technical specifications, 7-86valid slots, 7-86version, 7-79

EGS2configuration reference, 7-53feature code, 7-53front panel, 7-51function and feature, 7-46principle and signal flow, 7-49technical specifications, 7-53

valid slots, 7-53version, 7-46

EGS4configuration reference, 7-77feature code, 7-74front panel, 7-72function and feature, 7-67principle and signal flow, 7-69protection, 7-74technical specifications, 7-78valid slots, 7-74version, 7-67

EGT2configuration reference, 7-28feature code, 7-27front panel, 7-26function and feature, 7-23principle and signal flow, 7-24technical specifications, 7-28valid slots, 7-27version, 7-23

EMR0configuration reference, 7-98feature code, 7-98front panel, 7-94function and feature, 7-89principle and pignal Flow, 7-92technical Specifications, 7-98valid slots, 7-97version, 7-88

EMS4configuration reference, 7-65feature code, 7-62front panel, 7-60function and feature, 7-55principle and signal flow, 7-57protection, 7-63technical specifications, 7-66valid slots, 7-62version, 7-55

EOWfront panel, 10-3function and feature, 10-2principle and signal flow, 10-2technical specification, 10-6valid slot, 10-5version, 10-2

ETF8front panel, 8-52function and feature, 8-51principle and signal flow, 8-51technical specification, 8-55valid slot, 8-54version, 8-51

ETS8front panel, 8-57function and feature, 8-56principle and signal flow, 8-56



technical specification, 8-59valid slot, 8-59version, 8-56

EU04front panel, 8-28function and feature, 8-27principle and signal flow, 8-27technical specification, 8-30valid slot, 8-29version, 8-27

EU08front panel, 8-32function and feature, 8-31principle and signal flow, 8-31technical specification, 8-33valid slot, 8-33version, 8-31

FFAN


FIBfront panel, 11-58function and feature, 11-57principle and signal flow, 11-58technical specification, 11-60valid slot, 11-59version, 11-57

IIDL4

board protection, 7-119configuration reference, 7-119feature code, 7-118front panel, 7-117function and feature, 7-113principle and signal flow, 7-115technical specifications, 7-119valid slots, 7-118version, 7-113

IDQ1configuration reference, 7-126feature code, 7-126front panel, 7-124function and feature, 7-121principle, 7-122protection, 7-126signal flow, 7-122technical specifications, 7-127valid slots, 7-126version, 7-120

indicatorsalarm, A-2cabinet, A-2

LL12S


L75Sfront panel, 8-14function and feature, 8-13principle and signal flow, 8-14technical specification, 8-15valid slot, 8-15version, 8-13

Labeldescription, B-2Position, B-3Safety Label, B-2

LWXboard feature code, 11-48front panel, 11-46function and feature, 11-43principle and signal flow, 11-44technical specification, 11-48valid slot, 11-48version, 11-43

MMR2

board feature code, 11-19front panel, 11-17function and feature, 11-16principle and signal flow, 11-16technical specification, 11-20valid slot, 11-19version, 11-16

MR2Afront panel, 11-24function and feature, 11-21principle and signal flow, 11-23technical specification, 11-25valid slot, 11-25version, 11-21

MR2Bfront panel, 11-29function and feature, 11-27principle and signal flow, 11-28technical specification, 11-30valid slot, 11-30version, 11-27

MR2C





MR4board feature code, 11-41front panel, 11-39function and feature, 11-37principle and signal flow, 11-38technical specification, 11-42valid slot, 11-41version, 11-37

MST4configuration reference, 7-134feature code, 7-133front panel, 7-132function and feature, 7-128principle and pignal Flow, 7-130technical specifications, 7-134valid slots, 7-133version, 7-128

MU04front panel, 8-40function and feature, 8-39principle and signal flow, 8-39technical specification, 8-42valid slot, 8-41version, 8-39

OOBU1

feature code, 11-55front panel, 11-54function and feature, 11-52principle and signal flow, 11-52technical specification, 11-56valid slot, 11-55version, 11-52

OU08front panel, 8-35function and feature, 8-35principle and signal flow, 8-35technical specification, 8-38valid slot, 8-38version, 8-34

PPD1

board configuration reference, 6-17board feature code, 6-14front panel, 6-13function and feature, 6-9principle and signal flow, 6-10technical specification, 6-17

TPS protection, 6-15valid slot, 6-13version, 6-9

PD3board configuration reference, 6-56front panel, 6-53function and feature, 6-50principle and signal flow, 6-51technical specification, 6-57TPS protection, 6-55valid slot, 6-54version, 6-50

PIUfront panel, 13-9function and feature, 13-8principle and signal flow, 13-8technical specifications, 13-10valid slot, 13-10version, 13-8

PIUAfront panel, 13-13function and feature, 13-12principle and signal flow, 13-12technical specifications, 13-14valid slot, 13-14version, 13-11

PL1board configuration reference, 6-7board feature code, 6-7front panel, 6-6function and feature, 6-3principle and signal flow, 6-4technical specification, 6-8valid slot, 6-7version, 6-3

PL3board configuration reference, 6-42front panel, 6-39function and feature, 6-36principle and signal flow, 6-36technical specification, 6-42TPS protection, 6-40valid slot, 6-40version, 6-35

PL3Aboard configuration reference, 6-48front panel, 6-47function and feature, 6-44principle and signal flow, 6-45technical specification, 6-48valid slot, 6-48version, 6-43

PQ1board configuration reference, 6-26board feature code, 6-24front panel, 6-22function and feature, 6-19principle and signal flow, 6-20



technical specification, 6-26TPS protection, 6-24valid slot, 6-23version, 6-18

PQ3board configuration reference, 6-64front panel, 6-61function and feature, 6-58principle and signal flow, 6-58technical specification, 6-64TPS protection, 6-62valid slot, 6-62version, 6-58

PQMboard configuration reference, 6-34front panel, 6-30function and feature, 6-27principle and signal flow, 6-28technical specification, 6-34TPS protection, 6-32valid slot, 6-31version, 6-27

SSEP1

configuration reference, 5-40front panel, 5-37function and feature, 5-33principle and signal flow, 5-34technical specifications, 5-41TPS Protection, 5-39valid slot, 5-39version, 5-33

SF16configuration reference, 5-86front panel, 5-85function and feature, 5-81principle and signal flow, 5-83technical specifications, 5-86valid slots, 5-86version, 5-81

SL1board configuration reference, 5-9board feature code, 5-9front panel, 5-7function and feature, 5-4principle and signal flow, 5-5technical specification, 5-9valid slot, 5-8version, 5-3

SL16board feature code, 5-70configuration reference, 5-71front panel, 5-69function and feature, 5-66principle and signal flow, 5-67technical specifications, 5-71

valid slot, 5-70version, 5-65

SL16Aboard feature code, 5-79configuration reference, 5-79front panel, 5-77function and feature, 5-74principle and signal flow, 5-75technical specifications, 5-79valid slot, 5-79version, 5-73

SL4board feature code, 5-47configuration reference, 5-48front panel, 5-45function and feature, 5-42principle and signal flow, 5-43technical specifications, 5-48valid slot, 5-47version, 5-42

SLD4board feature code, 5-55configuration reference, 5-56front panel, 5-53function and feature, 5-50principle and signal flow, 5-51technical specifications, 5-56valid slots, 5-55version, 5-50

SLO1board feature code, 5-24configuration reference, 5-24front panel, 5-22function and feature, 5-19principle and signal flow, 5-20technical specifications, 5-25valid slot, 5-24version, 5-19

SLQ1board configuration reference, 5-17feature Code, 5-17front panel, 5-15function and feature, 5-12principle and signal flow, 5-13technical specification, 5-17valid slot, 5-16version, 5-11

SLQ4board feature code, 5-63configuration reference, 5-63front panel, 5-61function and feature, 5-58principle and signal flow, 5-59technical specifications, 5-63valid slot, 5-63version, 5-58

SLT1configuration reference, 5-31




front panel, 5-29function and feature, 5-26principle and signal flow, 5-27technical specifications, 5-31valid slot, 5-31version, 5-26

SPQ4board configuration reference, 6-83front panel, 6-80function and feature, 6-76principle and signal flow, 6-77technical specification, 6-83TPS protection, 6-82valid slot, 6-81version, 6-76

SubrackStructure, 3-2

subrackcapacity, 3-3technical specifications, 3-17

TTSB8


UUPM

function and feature, 13-2principle and signal flow, 13-3rear panel, 13-4technical specifications, 13-6valid slot, 13-6



optix osn 1500 hardware description(v100r007_02)

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