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OptiX PTN 1900 Packet Transport Platform of PTN Series V100R002C01 Hardware Description Issue 04 Date 2010-10-15 HUAWEI TECHNOLOGIES CO., LTD.

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OptiX PTN 1900 Packet Transport Platform of PTNSeriesV100R002C01

Hardware Description

Issue 04

Date 2010-10-15

HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2010. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without prior writtenconsent of Huawei Technologies Co., Ltd. Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respective holders. NoticeThe purchased products, services and features are stipulated by the contract made between Huawei and thecustomer. All or part of the products, services and features described in this document may not be within thepurchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information,and recommendations in this document are provided "AS IS" without warranties, guarantees or representationsof any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in thepreparation of this document to ensure accuracy of the contents, but all statements, information, andrecommendations in this document do not constitute the warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.Address: Huawei Industrial Base

Bantian, LonggangShenzhen 518129People's Republic of China

Website: http://www.huawei.com

Email: [email protected]

Issue 04 (2010-10-15) Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

i

About This Document

Related VersionsThe following table lists the product versions related to this document.

Product Name Version

OptiX PTN 1900 V100R002C01

Huawei iManager U2000 V100R002C00

Intended AudienceThis document describes the equipment structure, subrack structure and board classification.This document also describes each board of different classes in details.

This document helps you get the detailed information on the equipment hardware.

The intended audiences of this document are:

l Network planning engineers

l Hardware installation engineers

l System maintenance engineers

Symbol ConventionsThe symbols that may be found in this document are defined as follows.

Symbol Description

DANGERIndicates a hazard with a high level of risk, which if notavoided, will result in death or serious injury.

WARNINGIndicates a hazard with a medium or low level of risk, whichif not avoided, could result in minor or moderate injury.

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Symbol Description

CAUTIONIndicates a potentially hazardous situation, which if notavoided, could result in equipment damage, data loss,performance degradation, or unexpected results.

TIP Indicates a tip that may help you solve a problem or savetime.

NOTE Provides additional information to emphasize or supplementimportant points of the main text.

GUI ConventionsThe GUI conventions that may be found in this document are defined as follows.

Convention Description

Boldface Buttons, menus, parameters, tabs, window, and dialog titlesare in boldface. For example, click OK.

> Multi-level menus are in boldface and separated by the ">"signs. For example, choose File > Create > Folder.

Change HistoryUpdates between document issues are cumulative. Therefore, the latest document issue containsall updates made in previous issues.

Changes in Issue 04 (2010-10-15) Based on Product Version V100R002C01The updates of the document are as follow:

Safety Label

Updates the description of the labels.

Others

l Updates dimensions of certain boards.l Modifies the known anomalies.

Changes in Issue 03 (2010-05-20) Based on Product Version V100R002C01The updates of the document are as follow:

Board Overview

Updates the inter-board relation diagram.

About This DocumentOptiX PTN 1900 Packet Transport Platform of PTN Series

Hardware Description

iv Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

Issue 04 (2010-10-15)

Changes in Issue 02 (2010-03-30) Based on Product Version V100R002C01The updates of the document are as follow:

Processing Boards

Description of the functions of the MD1 and CD1: Adds the description of the port bandwidthutilization statistics.

Interface Boards

Description of the functions of the ETFC, EFG2, EFF8, and POD41: Adds the description ofthe port bandwidth utilization statistics.

Others

l Updates the table providing the board weight and power consumption.l Optimizes certain figures.l Modifies the known anomalies.

Changes in Issue 01 (2010-01-15) Based on Product Version V100R002C01This document is the first release of the V100R002C01 version.

The updates of the document are as follows:

Interface Boards

l Adds the description of the GE electrical interface to the description of the front panel andtechnical specifications of the EFG2.

Others

l Adds the description of the filler panel.l Adds the description of the pluggable optical and pulggable electrical module.l Optimizes the description of indicators.l Optimizes certain figures.l Modifies the known anomalies.

Changes in Issue 02 (2009-10-30) Based on Product Version V100R002C00The updates of the document are as follow:

Cabinet

In the part about the DC PDU, a note about the equipment supporting only the DC-I powerdistribution mode is added.

Subrack

l The subrack structure diagram is updated.l The information about the processing capacity of slots is added.l The power consumption of the entire equipment is added in the part of technical

specifications of the subrack.

Board Overview

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l The inter-board relation diagram is updated.l The operating temperature of boards is updated.

Processing Boards

l The number of concatenated PWs supported by the AD1 is updated to 512.

Interface Boards

l The technical specifications of the optical interfaces on the EFG2 are updated.l The technical specifications of the optical interfaces on the POD41 are updated.

Cross-Connect and System Control Boards

The description about jumpers on the TN71CXP and TN72CXP is updated.

Others

l In the part of technical specifications of each board, the board power consumption is added.l In the part of interfaces on the front panel of each board, fiber/cable connections to the

interfaces are added.l In the part of labels for optical modules, the label diagrams, and the mapping relations

between optical modules and boards are added.l Certain figures and tables are optimized.l Known defects are fixed.

Changes in Issue 01 (2009-06-30) Based on Product Version V100R002C00This document is the first release of the V100R002C00 version.

The updates of the document are as follow:

Subrack:

Information about the AFO1 is new in section Valid Slots for Boards and section MappingRelation Between Processing Boards and Interface Boards.

Board Overview

Information about the AFO1 is new in section Boards and section Inter-Board Relation. Theinter-board relation diagram is refreshed.

Processing Boards

Specifications of the CD1 are refreshed.

Interface Boards

Details on the AFO1 is new.

Others

l Certain figures and tables are optimized.l Known defects are fixed.

Changes in Issue 07 (2009-06-01) Based on Product Version V100R001Updates in this document are as follows:

About This DocumentOptiX PTN 1900 Packet Transport Platform of PTN Series

Hardware Description

vi Huawei Proprietary and ConfidentialCopyright © Huawei Technologies Co., Ltd.

Issue 04 (2010-10-15)

l Certain figures and tables are optimized.l Known defects are fixed.

Changes in Issue 06 (2009-04-20) Based on Product Version V100R001Updates in this document are as follows:

l Specifications of the optical interfaces are refreshed.l Optical module labels are refreshed.

Changes in Issue 05 (2009-03-16) Based on Product Version V100R001Updates in this document are as follows:

Known defects are fixed.

Changes in Issue 04 (2009-02-20) Based on Product Version V100R001Updates in this document are as follows:

Cabinet:

l The appearance of the cabinets is refreshed in section Cabinet.l The appearance of the DC PDU is refreshed, and the information about the Short-circuit

Copper Connector is new in section Cabinet Indicators and DC Power Distribution.l Information about the number of allowed subracks is new in section Technical

Specification.

Subrack

Information about the EFF8 is new in section Valid Slots for Boards and section MappingRelation Between Processing Boards and Interface Boards.

Board Overview

Information about the EFF8 is new in section Boards and section Inter-Board Relation. Theinter-board relation diagram is refreshed.

Processing Boards

l Specifications of the MD1 are refreshed (the maximum of ATM remote service connectionssupported by the equipment from 512 to 1k, and the maximum of ATM local serviceconnections supported by the equipment from 256 to 512).

l Specifications of the CD1 are refreshed (the maximum of ATM remote service connectionssupported by the equipment from 512 to 1k, and the maximum of ATM local serviceconnections supported by the equipment from 256 to 512).

Interface Boards

Details on the EFF8 is new.

Cross-connect and System Control Boards

l Details on TN72CXP is newl Information about that TN72CXP supports the IEEE 1588 V2 clock function.

Others

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l In section Board Indicators, information about indicators on the EFF8 is new. In sectionPower Consumption and Weight, specifications of the EFF8 are new.

l Specifications of the 75-ohm 8 x E1 Cable are refreshed.

l Product nameplate label is refreshed.

l Known defects are fixed.

Changes in Issue 03 (2008-10-20) Based on Product Version V100R001

Updates in this document are as follows:

Processing Boards

l Specifications such as local service, remote service, local connection, and remoteconnection are new for the AD1, MD1, and CD1. The parameters that can be set for eachboard are corrected.

l Specifications of the MD1 are refreshed (supported PW connections from 254 to 256, anda maximum of 256 ATM remote services supported by the equipment).

l Specifications of the CD1 are refreshed (supported PW connections from 254 to 256, PWssupported by each port from 127 to 128, and a maximum of 256 ATM remote servicessupported by the equipment).

l Specifications of the AD1 are refreshed (the maximum of ATM service connectionssupported by the equipment from 1022 to 1k).

Interface Boards

l ETFC, EFG2, and POD41: The specifications are refreshed (MPLS-Tunnel from 256 to1k, PWs from 1k to 2k, and APS protection groups from 64 to 256).

l L12 and L75: Slot limitations are new. Information about the DB44 pins is corrected.

Changes in Issue 02 (2008-08-20) Based on Product Version V100R001

The updates of the document are as follow:

Cabinet

Information about the N63E 2.0 m cabinet is new. The case where the OptiX PTN 1900 subrackand the OptiX PTN 3900 subrack are installed in the same cabinet is also described. In addition,diagrams of cable connections are updated.

Processing Boards

In the "AD1" section, information about the ATM concatenation is new.

Others

l The number of APS protection groups is corrected through the document.The number ofAPS protection groups is changed from 128 to 64.

l Some diagrams in this document are optimized.

Changes in Issue 01 (2008-05-10) Based on Product Version V100R001

This document is the first release of the V100R001 version.

About This DocumentOptiX PTN 1900 Packet Transport Platform of PTN Series

Hardware Description

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Contents

About This Document...................................................................................................................iii

1 Equipment Structure.................................................................................................................1-1

2 Cabinet.........................................................................................................................................2-12.1 Cabinet Types..................................................................................................................................................2-22.2 Cabinet Indicators and DC Power Distribution...............................................................................................2-3

2.2.1 Cabinet Indicators.................................................................................................................................. 2-32.2.2 DC Power Distribution Unit...................................................................................................................2-4

2.3 Technical Specification...................................................................................................................................2-7

3 Subrack.........................................................................................................................................3-13.1 Subrack Structure and Slots............................................................................................................................ 3-23.2 Valid Slots for Boards.....................................................................................................................................3-43.3 Technical Specification...................................................................................................................................3-5

4 Board Overview..........................................................................................................................4-14.1 Appearance and Dimensions of Boards..........................................................................................................4-24.2 Board Classification........................................................................................................................................4-44.3 Inter-Board Relation........................................................................................................................................4-54.4 Board Running Environment.......................................................................................................................... 4-6

5 Processing Boards.......................................................................................................................5-15.1 MD1................................................................................................................................................................ 5-2

5.1.1 Version Description................................................................................................................................5-25.1.2 Functions and Features...........................................................................................................................5-25.1.3 Working Principle and Signal Flow.......................................................................................................5-45.1.4 Front Panel............................................................................................................................................. 5-65.1.5 Valid Slots..............................................................................................................................................5-65.1.6 TPS Protection for Boards......................................................................................................................5-75.1.7 Board Configuration Reference............................................................................................................. 5-95.1.8 Technical Specifications........................................................................................................................ 5-9

5.2 CD1................................................................................................................................................................. 5-95.2.1 Version Description..............................................................................................................................5-105.2.2 Functions and Features.........................................................................................................................5-105.2.3 Working Principle and Signal Flow.....................................................................................................5-12

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5.2.4 Front Panel...........................................................................................................................................5-145.2.5 Valid Slots............................................................................................................................................5-155.2.6 Board Configuration Reference...........................................................................................................5-155.2.7 Technical Specifications......................................................................................................................5-15

5.3 AD1...............................................................................................................................................................5-175.3.1 Version Description..............................................................................................................................5-185.3.2 Functions and Features.........................................................................................................................5-185.3.3 Working Principle and Signal Flow.....................................................................................................5-195.3.4 Front Panel...........................................................................................................................................5-215.3.5 Valid Slots............................................................................................................................................5-225.3.6 Board Configuration Reference...........................................................................................................5-225.3.7 Technical Specifications......................................................................................................................5-22

6 Interface Boards..........................................................................................................................6-16.1 ETFC...............................................................................................................................................................6-2

6.1.1 Version Description................................................................................................................................6-26.1.2 Functions and Features...........................................................................................................................6-26.1.3 Working Principle and Signal Flow.......................................................................................................6-36.1.4 Front Panel.............................................................................................................................................6-46.1.5 Valid Slots..............................................................................................................................................6-66.1.6 Board Configuration Reference.............................................................................................................6-66.1.7 Technical Specifications........................................................................................................................6-6

6.2 EFF8................................................................................................................................................................6-76.2.1 Version Description................................................................................................................................6-76.2.2 Functions and Features...........................................................................................................................6-76.2.3 Working Principle and Signal Flow.......................................................................................................6-86.2.4 Front Panel...........................................................................................................................................6-106.2.5 Valid Slots............................................................................................................................................6-126.2.6 Board Configuration Reference...........................................................................................................6-126.2.7 Technical Specifications......................................................................................................................6-13

6.3 EFG2.............................................................................................................................................................6-146.3.1 Version Description..............................................................................................................................6-156.3.2 Functions and Features.........................................................................................................................6-156.3.3 Working Principle and Signal Flow.....................................................................................................6-166.3.4 Front Panel...........................................................................................................................................6-176.3.5 Valid Slots............................................................................................................................................6-206.3.6 Board Configuration Reference...........................................................................................................6-206.3.7 Technical Specifications......................................................................................................................6-20

6.4 POD41...........................................................................................................................................................6-226.4.1 Version Description..............................................................................................................................6-236.4.2 Functions and Features.........................................................................................................................6-236.4.3 Working Principle and Signal Flow.....................................................................................................6-246.4.4 Front Panel...........................................................................................................................................6-25

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6.4.5 Valid Slots............................................................................................................................................6-266.4.6 Board Configuration Reference...........................................................................................................6-276.4.7 Technical Specifications......................................................................................................................6-27

6.5 AFO1.............................................................................................................................................................6-296.5.1 Version Description..............................................................................................................................6-296.5.2 Functions and Features.........................................................................................................................6-306.5.3 Working Principle and Signal Flow.....................................................................................................6-316.5.4 Front Panel...........................................................................................................................................6-336.5.5 Valid Slots............................................................................................................................................6-356.5.6 Board Configuration Reference...........................................................................................................6-356.5.7 Technical Specifications......................................................................................................................6-35

6.6 L75/L12.........................................................................................................................................................6-376.6.1 Version Description..............................................................................................................................6-386.6.2 Function and Feature............................................................................................................................6-386.6.3 Working Principle and Signal Flow.....................................................................................................6-386.6.4 Front Panel...........................................................................................................................................6-396.6.5 Valid Slots............................................................................................................................................6-426.6.6 Board Configuration Reference...........................................................................................................6-436.6.7 Technical Specifications......................................................................................................................6-43

7 Cross-Connect and System Control Boards..........................................................................7-17.1 TN71CXP........................................................................................................................................................7-2

7.1.1 Version Description................................................................................................................................7-27.1.2 Functions and Features...........................................................................................................................7-37.1.3 Working Principle and Signal Flow.......................................................................................................7-37.1.4 Jumper....................................................................................................................................................7-57.1.5 Front Panel............................................................................................................................................. 7-77.1.6 Valid Slots............................................................................................................................................7-127.1.7 TPS Protection for Boards....................................................................................................................7-137.1.8 Board Configuration Reference...........................................................................................................7-137.1.9 Technical Specifications......................................................................................................................7-13

7.2 TN72CXP......................................................................................................................................................7-137.2.1 Version Description..............................................................................................................................7-147.2.2 Functions and Features.........................................................................................................................7-147.2.3 Working Principle and Signal Flow.....................................................................................................7-147.2.4 Jumper..................................................................................................................................................7-167.2.5 Front Panel...........................................................................................................................................7-197.2.6 Valid Slots............................................................................................................................................7-247.2.7 TPS Protection for Boards....................................................................................................................7-257.2.8 Board Configuration Reference...........................................................................................................7-257.2.9 Technical Specifications......................................................................................................................7-25

8 Power Supply and Fan Boards.................................................................................................8-18.1 PIU.................................................................................................................................................................. 8-2

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8.1.1 Version Description................................................................................................................................8-28.1.2 Functions and Features...........................................................................................................................8-28.1.3 Working Principle and Signal Flow.......................................................................................................8-38.1.4 Front Panel.............................................................................................................................................8-48.1.5 Valid Slots..............................................................................................................................................8-58.1.6 Technical Specifications........................................................................................................................8-5

8.2 FANA..............................................................................................................................................................8-58.2.1 Version Description................................................................................................................................8-68.2.2 Functions and Features...........................................................................................................................8-68.2.3 Working Principle and Signal Flow.......................................................................................................8-68.2.4 Front Panel.............................................................................................................................................8-78.2.5 Valid Slots..............................................................................................................................................8-88.2.6 Technical Specifications........................................................................................................................8-8

8.3 FANB..............................................................................................................................................................8-88.3.1 Version Description................................................................................................................................8-98.3.2 Functions and Features...........................................................................................................................8-98.3.3 Working Principle and Signal Flow.......................................................................................................8-98.3.4 Front Panel...........................................................................................................................................8-108.3.5 Valid Slots............................................................................................................................................8-118.3.6 Technical Specifications......................................................................................................................8-11

9 Filler Panel...................................................................................................................................9-19.1 Functions and Features....................................................................................................................................9-29.2 Appearance and Valid Slots............................................................................................................................9-2

10 Pluggable Optical Modules..................................................................................................10-110.1 Appearance and Application.......................................................................................................................10-210.2 Optical Module Labels................................................................................................................................10-2

11 Pluggable Electrical Module................................................................................................11-1

12 Cables....................................................................................................................................... 12-112.1 Fiber............................................................................................................................................................12-2

12.1.1 Types of Fiber....................................................................................................................................12-212.1.2 Connector...........................................................................................................................................12-2

12.2 Power Supply Cable and Grounding Cable.................................................................................................12-412.2.1 Cabinet -48 V/BGND/PGND Power Cable.......................................................................................12-512.2.2 Cabinet Door Grounding Cable..........................................................................................................12-712.2.3 Subrack Power Cable.........................................................................................................................12-8

12.3 Service Cable...............................................................................................................................................12-912.3.1 Ethernet Cable....................................................................................................................................12-912.3.2 75-ohm 8 x E1 Cable........................................................................................................................12-1512.3.3 120-ohm 8 x E1 Cable......................................................................................................................12-17

12.4 Management Cable....................................................................................................................................12-1912.4.1 Straight Through Cable....................................................................................................................12-19

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12.4.2 Crossover Cable...............................................................................................................................12-1912.5 Clock Cable...............................................................................................................................................12-20

12.5.1 External Clock Cable.......................................................................................................................12-2012.5.2 Clock Bridging Cable.......................................................................................................................12-21

12.6 Cabinet Indicator Cable.............................................................................................................................12-2312.7 Alarm Input/Output Cable.........................................................................................................................12-24

A Indicators...................................................................................................................................A-1A.1 Cabinet Indicators..........................................................................................................................................A-2A.2 Board Indicators............................................................................................................................................A-2

B Labels..........................................................................................................................................B-1B.1 Safety Label...................................................................................................................................................B-2

B.1.1 Labels....................................................................................................................................................B-2B.1.2 Label Position.......................................................................................................................................B-3

B.2 Engineering Labels........................................................................................................................................B-4

C Power Consumption and Weight..........................................................................................C-1

D Board Configuration Parameters..........................................................................................D-1

E Glossary.......................................................................................................................................E-1

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Figures

Figure 1-1 OptiX PTN 1900 subrack installed in the cabinet..............................................................................1-1Figure 2-1 Appearance of the cabinets used to house the OptiX PTN 1900........................................................2-2Figure 2-2 Position of cabinet indicators and DC PDU.......................................................................................2-3Figure 2-3 Appearance of the DC PDU...............................................................................................................2-4Figure 2-4 Appearance of the front panel of the DC PDU...................................................................................2-5Figure 2-5 Internal connection of the DC PDU...................................................................................................2-6Figure 2-6 Appearance of the Short-circuit Copper Connector...........................................................................2-7Figure 3-1 Structure of the OptiX PTN 1900 subrack.........................................................................................3-2Figure 3-2 Slot layout of the OptiX PTN 1900....................................................................................................3-3Figure 4-1 Diagram of the inter-board relation of boards for the OptiX PTN 1900............................................4-6Figure 5-1 Block diagram for the working principle of the MD1........................................................................5-5Figure 5-2 Appearance of the front panel of the MD1.........................................................................................5-6Figure 5-3 TPS protection principle of the service sub-board MD1....................................................................5-8Figure 5-4 Hardware configuration of two 1:1 TPS protection groups provided by the service sub-board MD1...............................................................................................................................................................................5-8Figure 5-5 Block diagram for the working principle of the CD1.......................................................................5-12Figure 5-6 Appearance of the front panel of the CD1........................................................................................5-14Figure 5-7 Block diagram for the working principle of the AD1.......................................................................5-19Figure 5-8 Appearance of the front panel of the AD1........................................................................................5-21Figure 6-1 Block diagram for the working principle of the ETFC.......................................................................6-3Figure 6-2 Appearance of the front panel of the ETFC........................................................................................6-5Figure 6-3 Block diagram for the functions of the EFF8.....................................................................................6-9Figure 6-4 Font Panel of the EFF8.....................................................................................................................6-11Figure 6-5 Block diagram for the working principle of the EFG2.....................................................................6-16Figure 6-6 Appearance of the front panel of the EFG2......................................................................................6-18Figure 6-7 Block diagram for the working principle of the POD41..................................................................6-24Figure 6-8 Appearance of the front panel of the POD41...................................................................................6-25Figure 6-9 Block diagram for the working principle of the AFO1....................................................................6-31Figure 6-10 Front panel of the AFO1.................................................................................................................6-34Figure 6-11 Block diagram for the working principle of the L75/L12..............................................................6-38Figure 6-12 Appearances of the front panel of the L75 and the L12.................................................................6-40Figure 7-1 Block diagram for the working principle of the TN71CXP...............................................................7-3Figure 7-2 J2 on the TN71CXP............................................................................................................................7-6Figure 7-3 Appearance of the front panel of the TN71CXP................................................................................7-8

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Figure 7-4 Block diagram for the working principle of the TN72CXP.............................................................7-15Figure 7-5 J2 on the TN72CXP..........................................................................................................................7-17Figure 7-6 Appearance of the front panel of the TN72CXP..............................................................................7-19Figure 8-1 Block diagram for the working principle of the PIU..........................................................................8-3Figure 8-2 Appearance of the front panel of the PIU...........................................................................................8-4Figure 8-3 Block diagram for the working principle of the FANA.....................................................................8-6Figure 8-4 Appearance of the front panel of the FANA......................................................................................8-7Figure 8-5 Block diagram for the working principle of the FANB......................................................................8-9Figure 8-6 Appearance of the front panel of the FANB.....................................................................................8-10Figure 9-1 Appearances of filler panels...............................................................................................................9-2Figure 10-1 Appearance of the eSFP optical module.........................................................................................10-2Figure 10-2 Optical module labels.....................................................................................................................10-2Figure 11-1 Appearance of the GE SFP electrical module................................................................................ 11-1Figure 12-1 LC/PC optical connector................................................................................................................ 12-3Figure 12-2 FC/PC optical connector.................................................................................................................12-4Figure 12-3 SC/PC optical connector.................................................................................................................12-4Figure 12-4 Structure of the cabinet -48 V power cable and BGND power grounding cable...........................12-5Figure 12-5 Structure of the cabinet PGND protection grounding cable (JG2&OT)........................................ 12-6Figure 12-6 Appearance of the cabinet PGND protection grounding cable (JG2&OT)....................................12-6Figure 12-7 Structure of the cabinet door grounding cable................................................................................12-7Figure 12-8 Appearance of the cabinet door grounding cable...........................................................................12-7Figure 12-9 Structure of the subrack power cable (1)........................................................................................12-8Figure 12-10 Structure of the subrack power cable (2)......................................................................................12-8Figure 12-11 RJ-45 connector..........................................................................................................................12-10Figure 12-12 Structure of the straight through cable........................................................................................12-10Figure 12-13 Appearance of the straight through cable...................................................................................12-11Figure 12-14 Structure of the crossover cable..................................................................................................12-11Figure 12-15 Appearance of the crossover cable.............................................................................................12-12Figure 12-16 Pin assignment of the straight through cable..............................................................................12-12Figure 12-17 Structure of the crossover cable..................................................................................................12-13Figure 12-18 Structure of the 75-ohm E1 cable...............................................................................................12-15Figure 12-19 Structure of the 120-ohm 8 x E1 cable.......................................................................................12-17Figure 12-20 Appearance of the 120-ohm 8 x E1 cable...................................................................................12-18Figure 12-21 Connector structure of the 120-ohm clock cable........................................................................12-20Figure 12-22 Structure of the clock bridging cable..........................................................................................12-21Figure 12-23 Structure of the cabinet indicator cable......................................................................................12-23Figure 12-24 Appearance of the cabinet indicator cable..................................................................................12-23Figure 12-25 Structure of the alarm input/output cable connector...................................................................12-25Figure B-1 Position of labels on the subrack.......................................................................................................B-3

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Tables

Table 2-1 Indicators on the ETSI cabinet.............................................................................................................2-3Table 2-2 Specifications of the cabinets for the OptiX PTN 1900 subrack.........................................................2-7Table 3-1 Mapping relation between slots for processing boards and interface boards of the OptiX PTN 1900...............................................................................................................................................................................3-3Table 3-2 Mapping relation between processing boards and interface boards of the OptiX PTN 1900..............3-4Table 3-3 Valid slots for boards in the OptiX PTN 1900 subrack.......................................................................3-4Table 3-4 Specifications of the OptiX PTN 1900 subrack...................................................................................3-5Table 4-1 Appearance and dimensions of boards for the OptiX PTN 1900.........................................................4-2Table 4-2 Boards and their key functions.............................................................................................................4-4Table 4-3 Requirements for the board running environment...............................................................................4-6Table 5-1 Functions and features of the MD1......................................................................................................5-2Table 5-2 Mapping relation between slots for the CXP that houses the MD1 and slots for the corresponding interfaceboard......................................................................................................................................................................5-7Table 5-3 Mapping relation between slots for the working boards and slots for the protection boards of the TPSprotection for the service sub-board MD1............................................................................................................5-9Table 5-4 Functions and features of the CD1.....................................................................................................5-10Table 5-5 Types and usage of the interfaces on the CD1...................................................................................5-15Table 5-6 Technical specifications of the STM-1 optical interface...................................................................5-16Table 5-7 Related optical module part numbers of single-fiber bidirectional interface optical interface andwavelength allocation..........................................................................................................................................5-17Table 5-8 Functions and Features of the AD1....................................................................................................5-18Table 5-9 Types and usage of the interfaces on the AD1...................................................................................5-22Table 5-10 Technical specifications of the STM-1 optical interface.................................................................5-23Table 5-11 Related optical module part numbers of single-fiber bidirectional interface optical interface andwavelength allocation..........................................................................................................................................5-24Table 6-1 Functions and Features of the ETFC....................................................................................................6-2Table 6-2 Types and usage of the interfaces on the ETFC...................................................................................6-6Table 6-3 Pin assignment of the RJ-45 connector on the ETFC..........................................................................6-6Table 6-4 Interface specifications of the ETFC....................................................................................................6-7Table 6-5 Functions and Features of the EFF8.....................................................................................................6-8Table 6-6 Interfaces of the EFF8........................................................................................................................6-12Table 6-7 Performance specifications of the FE optical interface......................................................................6-13Table 6-8 Related optical module part numbers of 100BASE-BX optical interfaces and wavelength allocation.............................................................................................................................................................................6-14Table 6-9 Functions and Features of the EFG2..................................................................................................6-15

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Table 6-10 Types and usage of the interfaces on the EFG2...............................................................................6-19Table 6-11 Pins for the GE electrical interface..................................................................................................6-20Table 6-12 Technical specifications of the GE optical interface........................................................................6-20Table 6-13 Related optical module part numbers of 1000BASE-CWDM optical interfaces and related opticalmodule wavelength allocation.............................................................................................................................6-22Table 6-14 Related optical module part numbers of 1000BASE-BX optical interfaces and wavelength allocation.............................................................................................................................................................................6-22Table 6-15 Specifications of the electrical interfaces on the EFG2...................................................................6-22Table 6-16 Functions and Features of the POD41.............................................................................................6-23Table 6-17 Types and usage of the interfaces on the POD41.............................................................................6-26Table 6-18 Technical specifications of the STM-1 optical interface.................................................................6-27Table 6-19 Related optical module part numbers of single-fiber bidirectional interface optical interface andwavelength allocation..........................................................................................................................................6-28Table 6-20 Technical specifications of the STM-4 optical interface.................................................................6-28Table 6-21 Functions and Features of the AFO1...............................................................................................6-30Table 6-22 Types and usage of the interfaces on the AFO1...............................................................................6-35Table 6-23 Technical specifications of the STM-1 optical interface.................................................................6-36Table 6-24 Related optical module part numbers of single-fiber bidirectional interface optical interface andwavelength allocation..........................................................................................................................................6-37Table 6-25 Types and usage of the interfaces on the L75..................................................................................6-41Table 6-26 Pins of the 75-ohm DB44 interfaces................................................................................................6-41Table 6-27 Pins of the 120-ohm DB44 interfaces..............................................................................................6-42Table 6-28 Interface specifications of the L75/L12...........................................................................................6-43Table 7-1 Jumpers on the TN71CXP...................................................................................................................7-6Table 7-2 J42 jumpers..........................................................................................................................................7-7Table 7-3 Types and usage of the interfaces on the TN71CXP...........................................................................7-9Table 7-4 Pin assignment of the ETH and EXT interfaces................................................................................7-10Table 7-5 Pin assignment of the LAMP1 and LAMP2 interfaces......................................................................7-10Table 7-6 Pin assignment of the F&f interface...................................................................................................7-11Table 7-7 Pin assignment of the CLK1 and CLK2 interfaces............................................................................7-11Table 7-8 Pin assignment of the ALMO interface.............................................................................................7-12Table 7-9 Pin assignment of the ALMI interface...............................................................................................7-12Table 7-10 Jumpers on the TN72CXP...............................................................................................................7-18Table 7-11 J42 jumpers......................................................................................................................................7-18Table 7-12 Types and usage of the interfaces on the TN72CXP.......................................................................7-20Table 7-13 Pin assignment of the ETH and EXT interfaces..............................................................................7-21Table 7-14 Pin assignment of the LAMP1 and LAMP2 interfaces....................................................................7-22Table 7-15 Pin assignment of the F&f interface.................................................................................................7-22Table 7-16 Pin assignment of the CLK1/TOD1 and CLK2/TOD2 interfaces...................................................7-23Table 7-17 Pin assignment of the ALMO interface...........................................................................................7-24Table 7-18 Pin assignment of the ALMI interface.............................................................................................7-24Table 8-1 Functions and features of the PIU........................................................................................................8-2Table 8-2 Types and usage of the interfaces on the PIU......................................................................................8-4

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Table 9-1 Valid slots for filler panels...................................................................................................................9-3Table 10-1 Boards where the eSFP optical module is applicable...................................................................... 10-2Table 10-2 Part numbers and types of optical modules......................................................................................10-3Table 11-1 Part number and type of electrical module.......................................................................................11-1Table 12-1 Types of Fiber..................................................................................................................................12-2Table 12-2 Fiber Connector................................................................................................................................12-3Table 12-3 Pin assignment of subrack power cable...........................................................................................12-9Table 12-4 Pin assignment of the straight through cable.................................................................................12-13Table 12-5 Pin assignment of the crossover cable...........................................................................................12-13Table 12-6 Technical specifications of the straight through cable...................................................................12-14Table 12-7 Technical specifications of the crossover cable.............................................................................12-14Table 12-8 Pin assignment of the 75-ohm E1 cable ........................................................................................12-16Table 12-9 Pin assignment of the 120-ohm E1 cable.......................................................................................12-18Table 12-10 Pin assignment of the 120-ohm clock cable.................................................................................12-20Table 12-11 Pin assignment of the clock bridging cable connector.................................................................12-22Table 12-12 Technical specifications of the clock bridging cable...................................................................12-22Table 12-13 Pin assignment of the cabinet indicator cable..............................................................................12-24Table 12-14 Pin assignment of the alarm input................................................................................................12-25Table A-1 Start status indicator combination......................................................................................................A-8Table B-1 Labels..................................................................................................................................................B-2Table B-2 Huawei specifications for engineering labels.....................................................................................B-4Table C-1 Power consumption and weight..........................................................................................................C-1Table D-1 Mapping relation between the service type and C2 byte....................................................................D-1Table D-2 Mapping relation between the service type and V5 byte...................................................................D-2

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1 Equipment Structure

The OptiX PTN 1900 equipment consists of the subrack and boards.

Figure 1-1 shows the subrack installed in the cabinet.

Figure 1-1 OptiX PTN 1900 subrack installed in the cabinet

Mounting ear

Subrack

Cabinet

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2 Cabinet

About This Chapter

This chapter describes the types, configuration and technical specifications of the cabinet.

2.1 Cabinet TypesThe OptiX PTN 1900 can be installed in a 300 mm deep ETSI cabinet (N63E cabinet or T63cabinet) or in a third-party 19-inch cabinet.

2.2 Cabinet Indicators and DC Power DistributionOn the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit(PDU).

2.3 Technical SpecificationTechnical specifications of the cabinet cover the types, dimensions, and weight.

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2.1 Cabinet TypesThe OptiX PTN 1900 can be installed in a 300 mm deep ETSI cabinet (N63E cabinet or T63cabinet) or in a third-party 19-inch cabinet.

NOTE

The OptiX PTN 1900 does not support outdoor installation.

Figure 2-1 shows the cabinets used to house the OptiX PTN 1900 subrack.

Figure 2-1 Appearance of the cabinets used to house the OptiX PTN 1900

T63 cabinet N63E cabinet

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2.2 Cabinet Indicators and DC Power DistributionOn the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit(PDU).

Figure 2-2 shows the position of the cabinet indicators and the DC PDU.

Figure 2-2 Position of cabinet indicators and DC PDU

Cabinet indicator

DC PDU

2.2.1 Cabinet IndicatorsCabinet indicators are on the top of the ETSI cabinet. The cabinet indicators indicate the powersupply status and the severity of current alarms generated in the equipment. Observing thecabinet indicators, you can acknowledge the current running status of the equipment.

2.2.2 DC Power Distribution UnitThe OptiX PTN 1900 supports various power supply devices, one of which is the DC powerdistribution unit (PDU). The DC power distribution unit (PDU) is located under the cabinetindicates and installed in the ESTI cabinet to input the external power supply. The DC PDUprovides the -48 V or -60 V DC power supply to the PIU. The DC PDU, which uses the magneticcircuit breaker, can be flexibly configured.

2.2.1 Cabinet IndicatorsCabinet indicators are on the top of the ETSI cabinet. The cabinet indicators indicate the powersupply status and the severity of current alarms generated in the equipment. Observing thecabinet indicators, you can acknowledge the current running status of the equipment.

The indicators on the ETSI cabinet are of four colors, as shown in Figure 2-2. Table 2-1 providesthe description of the cabinet indicators.

Table 2-1 Indicators on the ETSI cabinet

Indicator Status Indication

Power indicator, which is green Lit. The power is supplied to theequipment.

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Indicator Status Indication

Unlit. No power is supplied to theequipment.

Critical alarm indicator, which is red Lit. Critical alarms are generated in theequipment.

Unlit. No critical alarms are generated inthe equipment.

Major alarm indicator, which isorange

Lit. Major alarms are generated in theequipment.

Unlit. No major alarms are generated inthe equipment.

Minor alarm indicator, which isyellow

Lit. Minor alarms are generated in theequipment.

Unlit. No minor alarms are generated inthe equipment.

NOTE

The cabinet indicators are driven by boards in the subrack. The cabinet indicators can be lit only after thealarm cables are correctly connected and the subrack is powered on. For details of the alarm cable, see12.7 Alarm Input/Output Cable.

2.2.2 DC Power Distribution UnitThe OptiX PTN 1900 supports various power supply devices, one of which is the DC powerdistribution unit (PDU). The DC power distribution unit (PDU) is located under the cabinetindicates and installed in the ESTI cabinet to input the external power supply. The DC PDUprovides the -48 V or -60 V DC power supply to the PIU. The DC PDU, which uses the magneticcircuit breaker, can be flexibly configured.

Figure 2-3 shows the appearance of the DC PDU.

Figure 2-3 Appearance of the DC PDU

Figure 2-4 shows the appearance of the front panel of the DC PDU.

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Figure 2-4 Appearance of the front panel of the DC PDU

12 23 3

A B

4

1 2 3 4

INPUT A

1 2 3 4

OUTPUT A

1 2 3 4

INPUT B

RTN(+) RTN(+) RTN(+) RTN(+)NEG(-) NEG(-) NEG(-) NEG(-)

1 2 3 4

RTN(+) RTN(+) RTN(+) RTN(+)NEG(-) NEG(-) NEG(-) NEG(-)

1 2 3 4

- - - -+ + + +1 2 3 4

- - - -+ + + +1 2 3 4

SW1 SW2 SW3 SW4SW1 SW2 SW3 SW41 2 3 4

OUTPUT B

1. Power supply inputarea

2. Power supply switcharea

3. Power supply outputarea

4. Grounding schemeindication hole

A. Area A of the DC PDU B. Area B of the DC PDU

NOTE

Area A and area B serve as mutual backups.

CAUTIONThe DC PDU should be maintained when the power supply is normal. Area A and area B, whichserve as mutual backups, cannot be maintained at the same time.

The DC PDU consists of the following areas.l Power supply input area: This area provides eight channels of power input terminals, which

are used to access eight channels of DC power supplies.l Power supply switch area: Eight switches, which are used to control the output of the power

supply, are present at the left and right sides of the DC PDU (four at each side).l Power supply output area: Eight groups of power terminals are present at the left and right

sides of the DC PDU (four groups at each side) . Eight groups of power terminals correspondto eight power switches at the left and right sides of the DC PDU (four at each side).

Functions and FeaturesFunctions and features of the DC PDU are listed as follows:

l The DC PDU supports the input and output of eight channels (four active and four standby)of stand-alone power supplies. The input DC voltage ranges from -38.4 V to -57.6 V or -48V to -72 V. The output current of each channel ranges from 0 A to 50 A.

l Dual OT terminals, which are used to input and output the power supply, are used. Thedual OT terminals can effectively prevent cables from rotating or being loosened.

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l Area A and area B of the DC PDU serve as mutual hot backups.l If the OpitX PTN 1900 is installed in the same cabinet with the OpitX PTN 3900 , the DC

PDU supports the external power supply equal to or larger than 50 A and supports the fusecapacity of 50 A. If the OpitX PTN 1900 is installed separately, the DC PDU supports theexternal power supply equal to or larger than 30 A and supports the fuse capacity of 30A. If the backup is available, the switch can be removed or replaced when the power is on.For details, see OptiX PTN 1900 Quick Installation Guide.

l The DC PDU supports two grounding schemes, DC-C and DC-I, while the OptiX PTN1900 only supports the DC-I scheme.

NOTE

For the DC-C scheme, DC return conductors at multiple points can be connected to the common groundingnetwork. For the DC-I scheme, the DC return conductor at only one point can be connected to the commongrounding network. The short-circuit copper bar inside the DC PDU determines whether the DC-C or DC-I scheme is used. You can check whether the short-circuit copper bar is available by looking through thegrounding scheme indication hole on the front panel of the DC PDU. If the short-circuit copper bar isavailable, the grounding scheme is DC-C. Otherwise, the grounding scheme is DC-I. Figure 2-4 showsthe grounding scheme indication hole.

Internal ConnectionThe internal connection of the DC PDU is shown in Figure 2-5.

Figure 2-5 Internal connection of the DC PDU

1 2 3 4 1 2 3 4

1 2 3 4 1 2 3 4

+ + + + + + + +

- - - - - - - -

INPUT A INPUT B

INPUT A INPUT B

ON

OFF

ON

OFF

ON

OFF

ON

OFF

ON

OFF

ON

OFF

ON

OFF

ON

OFF

1 2 3 4

1 2 3 4

1 2 3 4

1 2 3 4

- - - -

+ + + +

- - - -OUTPUT B

+ + + +OUTPUT B

OUTPUT A

OUTPUT A

Power output terminalNEG(-)

Power supply switchforthe subrack

Power input terminalRTN(+)

Power output terminalRTN(+) Power input terminal

NEG(-)

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External ConnectionThe DC PDU can input or output eight channels of 30 A power supplies. The DC PDU canprovide power supplies to four OptiX PTN 1900 subracks at the same time, each of which canaccess two channels of power supplies. Two PIU boards are present in each subrack. Each PIUcan access one channel of power supply to provide power supply to the subrack. The two PIUboards use the 1+1 backup scheme. When one PIU fails, the other PIU can ensure the normalrunning of the equipment.

NOTE

If eight channels of power supplies cannot be accessed in the input area of the PDU, you can use a short-circuit copper connector to access four channels of power supplies, which are then divided into eightchannels of power supplies. Figure 2-6 shows the appearance of the short-circuit copper connector.

Figure 2-6 Appearance of the Short-circuit Copper Connector

The DC PDU can provide power supply to the independently installed OptiX PTN 1900 subrack,or provide power supplies to the OptiX PTN 3900 and OptiX PTN 1900 subracks installed inthe same cabinet.For the connection between the DC PDU and OptiX PTN 1900 subrack, seethe OptiX PTN 1900 Quick Installation Guide.

2.3 Technical SpecificationTechnical specifications of the cabinet cover the types, dimensions, and weight.

Table 2-2 lists the technical specifications of the cabinet of the OptiX PTN 1900.

Table 2-2 Specifications of the cabinets for the OptiX PTN 1900 subrack

Cabinet type Dimensions (mm) Weight(kg)

300 mm deep ETSI cabinet (T63) 600 (width) x 300 (depth) x 2200(height)

60

300 mm deep ETSI cabinet (N63E) 600 (width) x 300 (depth) x 2000(height)

42

600 (width) x 300 (depth) x 2200(height)

45

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Cabinet type Dimensions (mm) Weight(kg)

W

HD

The OptiX PTN 1900 can be installed in a third-party 19-inch cabinet.

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3 Subrack

About This Chapter

The subrack, which is used to house various types of boards, is the basic unit of the OptiX PTN1900.

3.1 Subrack Structure and SlotsThe OptiX PTN 1900 is of a dual-layer structure. The subrack consists of the processing boardarea, interface board area, power supply board area and fan area.

3.2 Valid Slots for BoardsThe OptiX PTN 1900 provides 11 slots in total. Service sub-boards must be inserted on the CXPboard.

3.3 Technical SpecificationTechnical specifications of the subrack cover the dimensions, weight, maximum powerconsumption, voltage range and maximum current.

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3.1 Subrack Structure and SlotsThe OptiX PTN 1900 is of a dual-layer structure. The subrack consists of the processing boardarea, interface board area, power supply board area and fan area.

Subrack StructureFigure 3-1 shows the structure of the OptiX PTN 1900 subrack.

Figure 3-1 Structure of the OptiX PTN 1900 subrack

Interface board area

Fan area Power supply board area

Processing board area

Functions of these areas of the subrack are as follows.

l Processing board area, which is used to house the system control, cross-connect andmultiprotocol unit (CXP) and service sub-boards.

l Interface board area, which is used to house the interface boards.l Power supply board area, which is used to house the power supply boards.l Fan area, which is used to house the fan tray assembly.

Slot AllocationThe upper layer of the OptiX PTN 1900 subrack has eight slots and the lower layer has threeslots. Each of slots 1 and 2 has two sub-slots for sub-boards.

Figure 3-2 shows the position of each slot in the OptiX PTN 1900 subrack.

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Figure 3-2 Slot layout of the OptiX PTN 1900

SLOT 8(PIU)

SLOT 9(PIU)

SLOT 3SLOT 4SLOT 5SLOT 6SLOT 7

SLOT10

(FANA)

SLOT11

(FANB)

SLOT 1-1 SLOT 1-2

SLOT 2-1 SLOT 2-2

SLOT 1

SLOT 2

Mapping Relation Between Processing Boards and Interface BoardsTable 3-1 lists the mapping relation between slots for processing boards and interface boards.

Table 3-1 Mapping relation between slots for processing boards and interface boards of theOptiX PTN 1900

Slots for Processing Boards Slots for Interface Boards

Slot 1-1 Slots 3 - 4

Slot 1-2 Slots 5 - 6

Slot 2-1 Slots 3 - 4

Slot 2-2 Slots 5 - 6

Slots 1, 2 Slots 3 - 7

NOTEl The ETFC, EFF8, EFG2, AFO1 and POD41 can be housed in any slots of slots 3 - 7.

l When the ETFC is housed in slot 3, the last 5 ports is not available.

l When the EFF8 or AFO1 is housed in slot 3, the last port is not available.

l In the case of the TPS protection, slot 1-1 and slot 2-1 protect each other and house service sub-boardsof the same type.

l In the case of the TPS protection, slot 1-2 and slot 2-2 protect each other and house service sub-boardsof the same type.

l When the MD1 is not configured with TPS protection, insert the MD1 to the CXP in slot 1.

Table 3-2 lists the mapping relation between processing boards and interface boards.

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Table 3-2 Mapping relation between processing boards and interface boards of the OptiX PTN1900

Processing Board Service Sub-Board Interface Board

CXP MD1 L75, L12

AD1, CD1 -

- ETFC, EFG2, POD41,EFF8, AFO1

3.2 Valid Slots for BoardsThe OptiX PTN 1900 provides 11 slots in total. Service sub-boards must be inserted on the CXPboard.

Table 3-3 lists the valid slots for boards in the OptiX PTN 1900 subrack.

Table 3-3 Valid slots for boards in the OptiX PTN 1900 subrack

Board Full Name Valid Slot Remarks

CXP System control, cross-connect and multiprotocolprocessing board

Slots 1 - 2 -

PIU Power interface unit Slots 8 - 9 -

FANA Fan board for the interfaceboard area

Slot 10 -

FANB Fan board for the processingboard area

Slot 11 -

MD1 32 x E1 hybrid service sub-board

Slots 1-1, 1-2, 2-1and 2-2

l The MD1 should bejointly used withthe CXP and L12/L75.

l When the MD1 isnot configured withTPS protection,insert the MD1 tothe CXP in slot 1.

l For TPS protection,slot 2-1 protectsslot 1-1 and slot 2-2protects slot 1-2.

CD1 2 x channelized STM-1 sub-board

Slots 1-1, 1-2, 2-1and 2-2

The CD1 should bejointly used with theCXP.

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Board Full Name Valid Slot Remarks

AD1 2 x ATM STM-1 sub-board Slots 1-1, 1-2, 2-1and 2-2

The AD1 should bejointly used with theCXP.

AFO1 8 x ATM STM-1 interfaceboard

Slots 3 - 7 The AFO1 should bejointly used with theCXP.

ETFC 12 x FE electrical interfaceboard

Slots 3 - 7 The ETFC should bejointly used with theCXP.

EFF8 8 x FE optical interface board Slots 3 - 7 The EFF8 should bejointly used with theCXP.

EFG2 2 x GE optical interfaceboard

Slots 3 - 7 The EFG2 should bejointly used with theCXP.

POD41 2 x STM-4/STM-1 POSinterface board

Slots 3 - 7 The POD41 should bejointly used with theCXP.

L12 16 x E1 120-ohm electricalinterface board

Slots 3 - 6 The L12 should bejointly used with theMD1 and the CXP.

L75 16 x E1 75-ohm electricalinterface board

Slots 3 - 6 The L75 should bejointly used with theMD1 and the CXP.

3.3 Technical SpecificationTechnical specifications of the subrack cover the dimensions, weight, maximum powerconsumption, voltage range and maximum current.

Table 3-4 lists the technical specifications of the subrack of the OptiX PTN 1900.

Table 3-4 Specifications of the OptiX PTN 1900 subrack

Item Specification

Dimensions (mm) 436 (width) x 295 (depth) x 221 (height)

Weight (kg) Empty subrack: 7 (no boards or air filter housed)

Fully configured subrack: 17.2

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Item Specification

Power consumptionHeat dissipation(W, with typicalconfiguration, roomtemperature)

l Typical configuration I (With system protection and TPSprotection):Power consumption: 260Heat dissipation: 260Configuration: 2 x GE + 12 x FE + 32 x E1

l Typical configuration II:Power consumption: 160Heat dissipation: 160Configuration: 2 x GE + 8 x FE + 16 x E1

Voltage range (V, DC) -38.4 to -57.6 (-48 V power supply)-48.0 to -72.0 (-60 V power supply)

W

HD

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4 Board Overview

About This Chapter

This section describes the appearance, dimension, classification, inter-board relation, andrunning environment of boards.

4.1 Appearance and Dimensions of BoardsAppearance and dimensions vary with types of boards.

4.2 Board ClassificationBoards of the OptiX PTN 1900 include the service sub-board, interface board, system control,cross-connect and multiprotocol processing board, fan board and power supply board.

4.3 Inter-Board RelationBoards for the OptiX PTN 1900 are used together to provide various functions for the equipment.

4.4 Board Running EnvironmentThe equipment should be running in the qualified environment, and thus boards can runnormally.

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4.1 Appearance and Dimensions of BoardsAppearance and dimensions vary with types of boards.

Table 4-1 provides the appearance and dimensions of boards for the OptiX PTN 1900.

Table 4-1 Appearance and dimensions of boards for the OptiX PTN 1900

Board type Appearance Dimensions (mm)

System control, cross-connect and multiprotocolprocessing board(CXP)

50.8 (width) x 265.3 (depth)x 378.0 (height)

Service sub-board(Such as AD1)

25.4 (width) x 197.1 (depth)x 128.1 (height)

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Board type Appearance Dimensions (mm)

Interface board(Such as ETFC)

22.0 (width) x 156.9 (depth)x 264.1 (height)

PIU 55.0 (width) x 157.1 (depth)x 108.6 (height)

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Board type Appearance Dimensions (mm)

FANA 45.4 (width) x 148.8 (depth)x 111.0 (height)

FANB 44.4 (width) x 258.7 (depth)x 102.6 (height)

NOTE

W

HD

4.2 Board ClassificationBoards of the OptiX PTN 1900 include the service sub-board, interface board, system control,cross-connect and multiprotocol processing board, fan board and power supply board.

Table 4-2 lists the boards of the OptiX PTN 1900 and their functions.

Table 4-2 Boards and their key functions

Board Type Board Name Key Function

Service sub-board MD1, CD1, AD1 Processes E1 signals.Accesses and processeschannelized STM-1 andATM STM-1 signals.

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Board Type Board Name Key Function

Interface board ETFC, EFG2, POD41, L12,L75, EFF8, AFO1

Accesses FE, GE, POSSTM-1/STM-4, ATMSTM-1, and E1 signals.

System control, cross-connect and multiprotocolprocessing board

CXP Acts as a service processingboard and processes servicesaccessed.Grooms services accessed.Provides the auxiliaryinterfaces.Performs the system controlfunction.Processes the clock and time.

Fan board FANA, FANB Dissipates heat generated bythe equipment.

Power supply board PIU Accesses the external powersupply.

4.3 Inter-Board RelationBoards for the OptiX PTN 1900 are used together to provide various functions for the equipment.

Figure 4-1 shows the inter-board relation of boards for the OptiX PTN 1900.

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Figure 4-1 Diagram of the inter-board relation of boards for the OptiX PTN 1900

NNI

ATM STM-1

E1

Channelized STM-1

UNI

Cabinet indicator interface

Alarm interface

NM interface

Control and administration

module

Service processing and

forwardingmodule

Clock module

MD1

AD1

CD1

L75/L12

ETFC

Power supply module

(PIU)

Heat dissipation module

(FANA, FANB)

CXP

FE

-48V/-60V

-48V/-60V

F&f

EFG2GE

MD1 L75/L12

CD1

EFF8FEPOS STM-1/STM-4

E1

GE

Channelized STM-1

EFF8FE

POD41

EFG2

AFO1ATM STM-1

NOTE

On the UNI side, the equipment is connected to the customer edge to access user services to the packetswitching network (PSN).

On the NNI side, the equipment is connected to the PSN equipment to complete the transmission of userservices in the PSN network.

4.4 Board Running EnvironmentThe equipment should be running in the qualified environment, and thus boards can runnormally.

Table 4-3 lists the requirements for the board running environment.

Table 4-3 Requirements for the board running environment

Running Period Ambient Temperature Relative Humidity

Long-time running -5°C to 55°C 5% to 85%

Short-time running 5% to 95%

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NOTEShort-time running: the continuous running period not more than 72 hours, and the accumulated running periodof a year not more than 15 days.

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5 Processing Boards

About This Chapter

For the OptiX PTN 1900, processing boards, such as the MD1, CD1 and AD1, are available.

5.1 MD1This section describes the MD1, a 32 x E1 service sub-board, in terms of the version, function,feature, working principle, front panel, valid slots and technical specifications.

5.2 CD1This section describes the CD1, a 2 x channelized STM-1 sub-board, in terms of the version,function, feature, working principle, front panel, valid slots and technical specifications.

5.3 AD1This section describes the AD1, a 2 x STM-1 ATM sub-board, in terms of the version, function,feature, working principle, front panel, valid slots and technical specifications.

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5.1 MD1This section describes the MD1, a 32 x E1 service sub-board, in terms of the version, function,feature, working principle, front panel, valid slots and technical specifications.

5.1.1 Version DescriptionThe function version of the MD1 is TN81.

5.1.2 Functions and FeaturesThe MD1 mainly processes CES E1, IMA E1, ATM E1 and ML-PPP E1 services. The MD1and the CXP form a 32-channel multiprotocol packet E1 processing system.

5.1.3 Working Principle and Signal FlowThe MD1 mainly consists of the line processing module, service converting module, link layerprocessing module, data processing module, logic control module, clock module and powersupply module.

5.1.4 Front PanelOn the front panel of the MD1, there are indicators.

5.1.5 Valid SlotsWhen the MD1 is used as a service sub-board, it should be housed in the sub-slot of the CXP.

5.1.6 TPS Protection for BoardsWhen used with the CXP and interface board, the MD1 can provide two 1:1 TPS protectiongroups.

5.1.7 Board Configuration ReferenceYou can use the U2000 to configure parameters for the MD1.

5.1.8 Technical SpecificationsSpecifications of the MD1 board cover board dimensions, weight and power consumption.

5.1.1 Version DescriptionThe function version of the MD1 is TN81.

5.1.2 Functions and FeaturesThe MD1 mainly processes CES E1, IMA E1, ATM E1 and ML-PPP E1 services. The MD1and the CXP form a 32-channel multiprotocol packet E1 processing system.

Table 5-1 lists the functions and features of the MD1.

Table 5-1 Functions and features of the MD1

Function andFeature

Description

Basic function Used with an interface board, the MD1 can access 32 x E1 services,and works with the CXP and the L12/L75 to process the 32-channelmultiprotocol packet E1 services.

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Function andFeature

Description

The CES, IMA, and ML-PPP protocols can be flexibly configuredbased on the E1 port.Supports the Fractional E1. Supports the CES services and IMAservices at 64 kbit/s level.

Collection of bandwidthutilization statistics at anIMA/ML-PPP port

Supported.

Inband DCN Supported.

Bit error testfunction

Supported. If bit errors occur in a certain period, the board reports analarm.

PRBSa Supports the PRBS function in framed or unframed mode of an E1port in the receive/transmit direction.

IMA Number of supported IMAgroups

32

Maximum number ofsupported E1 links of eachIMA group

32

Dynamically enables/disables IMA groups, restarts the IMA groupprotocol, and dynamically add/delete IMA group members.

Supported traffic type Constant Bit Rate (CBR)Unspecified Bit Rate (UBR)UBR+Real Time Variable Bit Rate (rt-VBR)Non-real Time Variable Bit Rate (nrt-VBR)

Number of supported ATMservices

256

Number of supported ATMVP/VC switchingconnections

1 k

Supports the encapsulation from ATM VPC/VCC to PWE3 in the N-to-1 (N≤32) and 1-to-1 formats.

Supports the PW encapsulation for the ATM cells in the concatenationand non-concatenation formats. The number of PW connections thatsupport the cell concatenation is 256, and the maximum number ofconcatenated cells is 31.

UNI-side ATM OAM Supports the connection confirm (CC)test.

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Function andFeature

Description

Supports the loopback (LB) test.

Supports the AIS.

Supports the RDI.

CES Number of supported CESservices

32

Supported emulation mode CESoPSNSAToP

Supports the timeslot suppression function. Provides the idle 64 kbit/s timeslot suppression function for the CES services in the CESoPSNmode to save the transmission bandwidth.

Supported clock mode RetimingSelf-adaptation

Supports setting of the jitter compensation buffer time for the CESservice. (Range: 0.375 ms to 64 ms; step: 0.125 ms)

Supports setting of the packet loading time for the CES service.(Range: 0.125 ms to 3 ms; step: 0.125 ms)

ML-PPP Supported number of ML-PPP groups.

32

Maximum number ofsupported links in each ML-PPP group.

16

Used as the NNI.

APS for ML-PPPlinks

APS 1+1 and 1:1 protection and APS 1+1 protection can be configuredfor the LSPs carried by ML-PPP links.

TPS protection Supports the TPS protection.

Clock Work with the interface boards to process the line clocks.

a: The PRBS test function and the port loopback function can not be enabled at the same time.

5.1.3 Working Principle and Signal FlowThe MD1 mainly consists of the line processing module, service converting module, link layerprocessing module, data processing module, logic control module, clock module and powersupply module.

Figure 5-1 shows the block diagram for the working principle of the MD1.

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Figure 5-1 Block diagram for the working principle of the MD1

Line processing module

Link layer processing

module

Data processing module

32 x E1Interface boards

Service signals

CXPManagement

module

Power supply module

3.3V

1.2V

.

.

.

.

.

.

Management bus

Clock module

Management busManagement busManagement bus

Service signals

Service signals

In the Transmit DirectionThe MD1 first distributes packets, sent by the CXP, to different protocol processing modulesby the service type. For data processing module, decapsulation should be performed. The ingressqueue is then buffered and the egress queue is groomed by the service type. Then packets aresent to the link layer processing module. The line processing module performs encoding, de-jitter, pulse shaping and line driving for the services, which are finally sent to the interface board.

In the Receive DirectionThe interface board accesses E1 signals. The line processing module then performs impedancematch, signal equalization, electrical level conversion, clock data recovery, de-jitter anddecoding for the E1 signals. The link layer processing module and data processing moduleperform encapsulation and mapping of IMA E1, CES E1 and ML-PPP E1 services to PWE3. Inaddition, PW grooming is performed. Finally, the E1 services are sent to the CXP in the Ethernetpacket format.

Line Processing ModuleIn the receive channels, impedance match, signal equalization, electrical level conversion, clockdata recovery, de-jitter and decoding are performed to signals. In the transmit channels,encoding, de-jitter, pulse shaping and line driving are performed to signals.

Link Layer Processing ModuleThis module supports three protocol types, that is, IMA, CES and ML-PPP. The TDM circuitswitching, ATM cell switching can be performed on a uniform hardware platform.

Data Processing ModuleThis module performs encapsulation or decapsulation of IMA, CES and ML-PPP services to orfrom PWE3. In this way, data can be forwarded from the PPP to the MPLS. In addition, thismodule buffers the upstream and downstream packets, and grooms services.

Management ModuleThis module manages and controls the modules on the board.

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Clock ModuleThis module works with the CXP to process the line clock.

Power Supply ModuleThis module converts the voltage sent by the CXP to DC voltages required by each module onthe MD1.

5.1.4 Front PanelOn the front panel of the MD1, there are indicators.

Appearance of the Front PanelFigure 5-2 shows the appearance of the front panel of the MD1.

Figure 5-2 Appearance of the front panel of the MD1

IndicatorThe following indicators are present on the front panel of the MD1.

l STAT indicator, red, green, or orange, which indicates the working statusl ACT indicator, green, which indicates the service activation statusl SRV indicator, red, green, or orange, which indicates the service status

For details on indications of indicators, see A.2 Board Indicators.

5.1.5 Valid SlotsWhen the MD1 is used as a service sub-board, it should be housed in the sub-slot of the CXP.

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Table 5-2 lists the mapping relation between slots for the CXP that houses the MD1 and slotsfor the corresponding interface board.

Table 5-2 Mapping relation between slots for the CXP that houses the MD1 and slots for thecorresponding interface board

Slot for the CXP That Houses the MD1 Slot for the Interface Board

Slot 1-1 Slots 3, 4

Slot 1-2 Slots 5, 6

Slot 2-1 Slots 3, 4

Slot 2-2 Slots 5, 6

CAUTIONWhen used as the active sub-board, the MD1 can be housed only in sub-slot 1-1 and sub-slot1-2.

5.1.6 TPS Protection for BoardsWhen used with the CXP and interface board, the MD1 can provide two 1:1 TPS protectiongroups.

NOTE

The interface boards for the MD1 are L75 and L12. The two interface boards can realize the TPS protectionwhen used with the MD1 and CXP. In addition, the protection principles and hardware configuration modesare the same. The TPS protection described in this document considers the L75 as an example.

Protection PrincipleFigure 5-3 shows the TPS protection principle of the MD1.

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Figure 5-3 TPS protection principle of the service sub-board MD1

TPS switching control bus

32 x E1

L75

21

L75

21

Protection boardWorking board

MD1

CXP CXP

FailureMD1

When the CXP detects that a working MD1 is faulty, the CXP performs the protection switchingby using the TPS control bus to trigger the switch on the interface board. After the switching,the services accessed by the interface board are switched to the protection board for processing.Thus, the protection is realized.

Hardware ConfigurationThe MD1 is a service sub-board, which should be housed in the sub-slot of the CXP. When usedwith the CXP and interface board, the MD1 can provide two 1:1 TPS protection groups. Figure5-4 shows the hardware configuration.

Figure 5-4 Hardware configuration of two 1:1 TPS protection groups provided by the servicesub-board MD1

SLOT 8 PIU

SLOT 9 PIUSLOT 7

SLOT10

(FANA)

SLOT11

(FANB)

SLOT 1

SLOT 2

SLOT 1-1CXP

MD1

CXP

SLOT 1-2

SLOT 2-2SLOT 2-1 MD1 MD1

MD1

SLOT 3SLOT 4SLOT 5SLOT 6

L75L75L75L75

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NOTE

In the figure, each CXP houses a service sub-board MD1. The two TPS protection groups are of the 1:1protection. The board housed in slot 2-1 protects the board housed in slots 1-1. The board housed in slot2-2 protects the board housed in slots 1-2.

Table 5-3 shows the mapping relation between slots for the working boards and slots for theprotection boards of the TPS protection.

Table 5-3 Mapping relation between slots for the working boards and slots for the protectionboards of the TPS protection for the service sub-board MD1

Slot for the WorkingBoard

Slot for the ProtectionBoard

Slot for the InterfaceBoard

Slot 1-1 Slot 2-1 Slots 3, 4

Slot 1-2 Slot 2-2 Slots 5, 6

5.1.7 Board Configuration ReferenceYou can use the U2000 to configure parameters for the MD1.

You can use the U2000 to configure the following parameters for the MD1.

l Spare timeslot recovery value

For details on the parameters, see D Board Configuration Parameters.

5.1.8 Technical SpecificationsSpecifications of the MD1 board cover board dimensions, weight and power consumption.

Board dimensions (mm): 128.1 (H) x 197.1 (D) x 25.4 (W)

Weight (kg): 0.34

Power consumption (W): 20.7

5.2 CD1This section describes the CD1, a 2 x channelized STM-1 sub-board, in terms of the version,function, feature, working principle, front panel, valid slots and technical specifications.

5.2.1 Version DescriptionThe function version of the CD1 is TN81.

5.2.2 Functions and FeaturesWhen used with the CXP, the CD1 processes channelized STM-1 services. The CD1 can mappacket E1 data into VC-12 for transmission. The CES, IMA, ATM E1 and ML-PPP E1 can bebundled for transmission.

5.2.3 Working Principle and Signal Flow

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The CD1 mainly consists of the SDH processing module, link layer processing module, dataprocessing module, management module, clock module and power supply module.

5.2.4 Front PanelOn the front panel of the CD1, there are indicators, a laser safety class label and interfaces.

5.2.5 Valid SlotsThe CD1, which is a service sub-board, should be housed in the sub-slot of the CXP.

5.2.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the CD1.

5.2.7 Technical SpecificationsSpecifications of the CD1 board cover specifications of interfaces, board dimensions, weightand power consumption.

5.2.1 Version DescriptionThe function version of the CD1 is TN81.

5.2.2 Functions and FeaturesWhen used with the CXP, the CD1 processes channelized STM-1 services. The CD1 can mappacket E1 data into VC-12 for transmission. The CES, IMA, ATM E1 and ML-PPP E1 can bebundled for transmission.

Table 5-4 lists the functions and features of the CD1.

Table 5-4 Functions and features of the CD1

Function andFeature

Description

Basic function Supports two channelized STM-1 optical interfaces on the front panel.Supports the Fractional E1. Supports the CES services and IMAservices at 64 kibt/s level.Supports collection of bandwidth utilization statistics at an IMA/ML-PPP port.

Interface function Automatic shutdown of thelaser at the port

Supported.

Type of the loopback at theport

Inloop at an STM-1 portOutloop at an STM-1 portInloop in a VC-12 channelOutloop in a VC-12 channel

Automatic releasing of theloopback at the port

Supported.

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Function andFeature

Description

All VC-12 timeslots of each CD1 optical interface support the DCNfunction. By default, only the first, seventeenth, thirty-third, and forty-ninth channels of VC-12 timeslots of each optical interface supportthe DCN function.Manually enabling or disabling the DCN function of VC-12 timeslotsof CD1 optical interface is supported.

PRBSa Supports the PRBS function in framed or unframed mode of a VC-12channel in the receive/transmit direction.

IMA Number of supported IMAgroups

126

Maximum number ofsupported VC-12 timeslotsof each IMA group

32

Dynamically enables/disables IMA groups, restarts the IMA groupprotocol, and dynamically add/delete IMA group members.

Supported traffic type CBRUBRUBR+rt-VBRnrt-VBR

Number of supported ATMservices

256 (128 supported by each opticalinterface)

Number of supported ATMVP/VC switchingconnections

1 k (512 supported by each opticalinterface)

Supports the encapsulation from ATM VPC/VCC to PWE3 in the N-to-1 (N≤32) and 1-to-1 formats.

Supports the PW encapsulation for the ATM cells in the concatenationand non-concatenation formats. The number of PW connections thatsupport the cell concatenation is 256, and the maximum number ofconcatenated cells is 31.

UNI-side ATM OAM Supports the CC test.

Supports the LB test.

Supports the AIS.

Supports the RDI.

CES Number of supported CESservices

126

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Function andFeature

Description

Supported emulation mode CESoPSNSAToP

Supports the timeslot suppression function. Provides the idle 64 kbit/s timeslot suppression function for the CES services in the CESoPSNmode to save the transmission bandwidth.

Supported clock mode RetimingSelf-adaptation

Supports setting of the jitter compensation buffer time for the CESservice. (Range: 0.375 ms to 64 ms; step: 0.125 ms)

Supports setting of the packet loading time for the CES service.(Range: 0.125 ms to 3 ms; step: 0.125 ms)

ML-PPP Supported number of ML-PPP groups.

64

Maximum number ofsupported links in each ML-PPP group.

16

Used as the NNI.

Extraction andinsertion of S1 bytes

Supported.

LMSP protection Supports the 1+1 LMSP and 1:1 LMSP protection.

a: The PRBS test function and the port loopback function can not be enabled at the same time.

5.2.3 Working Principle and Signal FlowThe CD1 mainly consists of the SDH processing module, link layer processing module, dataprocessing module, management module, clock module and power supply module.

Figure 5-5 shows the block diagram for the working principle of the CD1.

Figure 5-5 Block diagram for the working principle of the CD1

SDH processing

module

Link layer processing

module

Data processing

module

Channelized STM-1

CXPManagement

module

Power supply module

3.3V

1.2V

.

.

.

.

.

.

Management bus

Clock module

Service signals Service signalsService signals

Management bus Management busManagement bus

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In the Transmit DirectionThe CD1 first distributes signals, sent by the CXP, to different protocol processing modulesaccording to the service type. These chips then decapsulate these signals. The data processingmodule buffers the ingress queues and grooms the egress queues according to the service type.The data processing module then sends the packets to the link layer processing module. The linklayer processing module processes the packets according to different protocols, and then framesthe processed signals and sends the signals to the SDH processing module, which adds overheadto the signals and multiplexes the signals to STM-1 signals.

In the Receive DirectionThe SDH processing module first processes overhead of the channelized STM-1 signals that areaccessed, and demultiplexes the signals to E1 signals. The SDH processing module sends theE1 signals to the link layer processing module, which frames the E1 signals and processes theframed signals according to the different protocols. The processed signals are then sent to thedata processing module. The data processing module performs PWE3 encapsulation for IMA,CES and ML-PPP services, and grooms the PW connections. Finally, the data processing modulesends the packets to the CXP.

SDH Processing ModuleIn the transmit direction, this module adds overhead to the signals and multiplexes the E1 signalsto STM-1 signals. In the receive direction, this module processes overhead of the STM-1 signals,and demultiplexes the channelized STM-1 signals into E1 signals.

Link Layer Processing ModuleThis module frames E1 siganals, and supports three protocol types, that is, IMA, CES and ML-PPP. The TDM circuit switching, ATM cell switching can be performed on a uniform hardwareplatform.

Data Processing ModuleThis module performs PWE3 encapsulation and decapsulation for IMA, CES and ML-PPPmultiple services, and forwards data according to the MPLS tags in the PPP packets. In addition,this module buffers the upstream and downstream packets, and grooms services.

Management ModuleThis module manages and controls the modules on the board.

Clock ModuleThis module works with the CXP to process the line clock.

Power Supply ModuleThis module converts the voltage, sent by the CXP, to DC voltages required by each module onthe CD1.

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5.2.4 Front PanelOn the front panel of the CD1, there are indicators, a laser safety class label and interfaces.

Appearance of the Front Panel

Figure 5-6 shows the appearance of the front panel of the CD1.

Figure 5-6 Appearance of the front panel of the CD1

Indicator

The following indicators are present on the front panel of the CD1.

l STAT indicator, red, green, or orange, which indicates the working status

l ACT indicator, green, which indicates the service activation status

l SRV indicator, red, green, or orange, which indicates the service status

For details on indications of indicators, see A.2 Board Indicators.

Laser Safety Class Label

The laser safety class is of CLASS 1. For an optical interface of this class, the maximum outputoptical power is less than 10 dBm (10 mW).

Interface

On the CD1, two SFP interfaces are present. Table 5-5 lists the types and usage of the interfaces.For fiber corresponding to the interfaces, see 12.1.1 Types of Fiber.

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Table 5-5 Types and usage of the interfaces on the CD1

Interface onthe FrontPanel

InterfaceType

Usage

IN1 - IN2 LC When a two-fiber bidirectional optical module is used, this interface is used asan input interface for the STM-1 optical signal.When a single-fiber bidirectional optical module is used, this interface is notused.

OUT1 - OUT2 LC When a two-fiber bidirectional optical module is used, this interface is used asan output interface for the STM-1 optical signal.When a single-fiber bidirectional optical module is used, this interface is usedas an input/output interface for the STM-1 optical signal.

NOTEThe SFP interface should be used with an optical module.

l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left and right sides of the opticalmodule. Each interface uses one fiber, which is used to transmit or receive service signals.

l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the left side of the opticalmodule. This optical interface uses only one fiber, which is used to transmit and receive service signals at the same time.

5.2.5 Valid SlotsThe CD1, which is a service sub-board, should be housed in the sub-slot of the CXP.

5.2.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the CD1.

You can use the U2000 to configure the following parameters for the CD1.

l Automatic Laser Shutdownl J0l J1l J2l C2l V5l SDH Interfacel Path Configurationl Spare Timeslot Recovery Value

For details on the parameters, see D Board Configuration Parameters.

5.2.7 Technical SpecificationsSpecifications of the CD1 board cover specifications of interfaces, board dimensions, weightand power consumption.

Table 5-6 lists the specifications of interfaces on the CD1.

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Table 5-6 Technical specifications of the STM-1 optical interface

Item Specification

Nominal bit rate(kbit/s)

155520

Optical interfacetype

Two-fiber bidirectional interface Single-fiber bidirectional interface

S-1.1(15 km)

L-1.1(40 km)

L-1.2(80 km)

S-1.1(10 km)

L-1.1(40 km)

Fiber type Single-mode Single-mode Single-mode Single-mode Single-mode

Workingwavelengthrange (nm)

1261 to 1360 1263 to 1360 1480 to 1580 For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

Mean launchedoptical power(dBm)

-15 to -8 -5 to 0 -5 to 0 -15 to -8 -5 to 0

Receiversensitivity(dBm)

-28 -34 -34 -28.2 -30

Minimumoverload (dBm)

-8 -10 -10 -8 -10

Minimumextinction ratio(dB)

8.2 10 10 6.6 10

Optical modulepart number

34060276 34060281 34060282 For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart number ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

NOTEFor details of the optical module, see 10.2 Optical Module Labels.

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Table 5-7 Related optical module part numbers of single-fiber bidirectional interface optical interface andwavelength allocation

Item Local Remote

Optical module part number(15 km)

34060363 34060364

Optical module part number(40 km)

34060328 34060329

Transmitter wavelength (nm) 1260 to 1360 1480 to 1580

Receiver wavelength (nm) 1480 to 1580 1260 to 1360

Board dimensions (mm): 128.1 (H) x 197.1 (D) x 25.4 (W)

Weight (kg): 0.34

Power consumption (W): 26.4

5.3 AD1This section describes the AD1, a 2 x STM-1 ATM sub-board, in terms of the version, function,feature, working principle, front panel, valid slots and technical specifications.

5.3.1 Version DescriptionThe function version of the AD1 is TN81.

5.3.2 Functions and FeaturesThe AD1, an ATM service processing board, is used to access 2 x STM-1 ATM services, switchATM services and map ATM services to the PWE3. The AD1 processes the protocols for ATMservices, manages connections and resources, performs performance counting, grooms the trafficand controls the congestion for the ATM layer. The AD1 complies with RFC 2515. The AD1should be used with the CXP.

5.3.3 Working Principle and Signal FlowThe AD1 mainly consists of the ATM access module, ATM processing module, data processingmodule, management module, clock module and power module.

5.3.4 Front PanelOn the front panel of the AD1, there are indicators, a laser safety class label and interfaces.

5.3.5 Valid SlotsThe AD1, which is a service sub-board, should be used with the CXP.

5.3.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the AD1.

5.3.7 Technical SpecificationsSpecifications of the AD1 cover specifications of interfaces, board dimensions, weight andpower consumption.

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5.3.1 Version DescriptionThe function version of the AD1 is TN81.

5.3.2 Functions and FeaturesThe AD1, an ATM service processing board, is used to access 2 x STM-1 ATM services, switchATM services and map ATM services to the PWE3. The AD1 processes the protocols for ATMservices, manages connections and resources, performs performance counting, grooms the trafficand controls the congestion for the ATM layer. The AD1 complies with RFC 2515. The AD1should be used with the CXP.

Table 5-8 lists the functions and features of the AD1.

Table 5-8 Functions and Features of the AD1

Function andFeature

Description

Basic function Service interface on thefront panel

Two ATM STM-1 optical interfaces.

Interface function Automatic shutdown of thelaser at the port

Supported.

Type of the loopback at theport

InloopOutloop

Automatic releasing of theloopback at the port

Supported.

ATM Supported traffic type CBRUBRUBR+rt-VBRnrt-VBR

Number of supported ATMservices

1 k (512 supported by each opticalinterface)

Number of supported ATMVP/VC switchingconnections

2 k (1 k supported by each opticalinterface)

Supports the encapsulation from ATM VPC/VCC to PWE3 in the N-to-1 (N≤32) and 1-to-1 formats.

Supports the PW encapsulation for the ATM cells in the concatenationand non-concatenation formats. The number of PW connections thatsupport the cell concatenation is 512, and the maximum number ofconcatenated cells is 31.

UNI-side ATM OAM Supports the CC test.

Supports the LB test.

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Function andFeature

Description

Supports the AIS.

Supports the RDI.

LMSP protection Supports the 1+1 LMSP and 1:1 LMSP protection. The protectionswitching time is less than 50 ms.

Extraction andinsertion of S1 bytes

Supported.

5.3.3 Working Principle and Signal FlowThe AD1 mainly consists of the ATM access module, ATM processing module, data processingmodule, management module, clock module and power module.

Figure 5-7 shows the block diagram for the working principle of the AD1.

Figure 5-7 Block diagram for the working principle of the AD1

ATM access module

ATM processing

module

Data processing

module

ATM STM-1Service signals

Service signals

Service signals

CXPManagement module

Power supply module

3.3V

1.2V

.

.

.

.

.

.

Management bus

Management bus Management busManagement bus

Clock module

In the Transmit DirectionThe CXP sends packets to the data processing module, which demaps the PWE3 to ATM servicesand switches the ATM services. The data processing module then sends the ATM services tothe ATM lprocessing module. The ATM processing module processes the protocols for ATMservices, manages connections and resources, performs performance counting, grooms the trafficand controls the congestion for the ATM layer. The ATM processing module then sends theservices to the ATM access module. In the ATM access module, ATM services are mapped intoSDH services, which become STM-1 ATM optical signals after converted from electrical signalsto optical signals.

In the Receive DirectionFirst, 2 x STM-1 ATM optical signals are converted to electrical signals and sent to the ATMaccess module. This module extracts ATM cells from the SDH services and sends the ATM cellsto the ATM layer processing module. The ATM processing module then processes the protocols

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for ATM services, manages connections and resources, performs performance counting, groomsthe traffic and controls the congestion for the ATM layer. The services are then sent to the dataprocessing module. The data processing module switches the ATM services and maps the ATMservices to the PWE3. Finally, services are sent to the CXP.

ATM Access Module

This module performs the following functions:

l In the upstream direction, the SDH overheads, alarms, and pointers are processed on theaccessed ATM STM-1 signals. The ATM cells are extracted from the SDH signals, andthen the ATM cells are sent to the ATM processing module, where the line clock isextracted.

l In the downstream direction, the ATM cells from the ATM processing module are mappedto the SDH signals, and then the SDH overhead processing, alarm processing, and pointerprocessing are performed on the signals. In this manner, the SDH frames are formed.

ATM Processing Module

This module mainly realizes the VP/VC switching, QoS functions such as traffic management,traffic shaping, queue scheduling, and OAM function for the ATM cells.

l In the upstream direction, this module determines the traffic priority of the ATM cells. Ifcongestion occurs, this module determines whether to discard the cells or to continuetransmitting cells according to the traffic priority. If the cells are continued to be transmitted,the VP/VC switching is performed on the cells, which are then sent to the data processingmodule.

l In the downstream direction, this module processes the cell packet headers, and performsthe VP/VC switching on the cells. If congestion occurs, this module determines whetherto discard the cells or to continue transmitting cells according to the traffic priority. If thecells are continued to be transmitted, they are sent to the ATM access module.

l Supports the ATM OAM functions:

– Supports the CC test.

– Supports the LB test.

Data Processing Module

This module performs the following functions.

l Encapsulates or decapsulate ATM cells to or from the PWE3.

l Concatenates or deconcatenate ATM cells to or from the PWE3.

Management Module

This module manages and controls the modules on the board.

Clock Module

This module works with the CXP to process the line clock.

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Power Supply ModuleThis module converts the voltage, sent by the CXP, to DC voltages required by each module onthe AD1.

5.3.4 Front PanelOn the front panel of the AD1, there are indicators, a laser safety class label and interfaces.

Appearance of the Front PanelFigure 5-8 shows the appearance of the front panel of the AD1.

Figure 5-8 Appearance of the front panel of the AD1

IndicatorThe following indicators are present on the front panel of the AD1.

l STAT indicator, red, green or orange, which indicates the board statel ACT indicator, green, which indicates that the service is activatedl SRV indicator, red, green or orange, which indicates service alarms

For details on indications of indicators, see A.2 Board Indicators.

Laser Safety Class LabelThe laser safety class is of CLASS 1. For an optical interface of this class, the maximum outputoptical power is less than 10 dBm (10 mW).

InterfaceOn the AD1, two SFP interfaces are present. Table 5-9 lists the types and usage of the interfaces.For fiber corresponding to the interfaces, see 12.1.1 Types of Fiber.

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Table 5-9 Types and usage of the interfaces on the AD1

Interface onthe FrontPanel

InterfaceType

Usage

IN1-IN2 LC When a two-fiber bidirectional optical module is used, this interface is usedas an input interface for the STM-1 optical signal.When a single-fiber bidirectional optical module is used, this interface is notused.

OUT1-OUT2 LC When a two-fiber bidirectional optical module is used, this interface is usedas an output interface for the STM-1 optical signal.When a single-fiber bidirectional optical module is used, this interface is usedas an input/output interface for the STM-1 optical signal.

NOTEThe SFP interface should be used with an optical module.

l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left and right sides of the opticalmodule. Each interface uses one fiber, which is used to transmit or receive service signals.

l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the left side of the opticalmodule. This optical interface uses only one fiber, which is used to transmit and receive service signals at the same time.

5.3.5 Valid SlotsThe AD1, which is a service sub-board, should be used with the CXP.

5.3.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the AD1.

You can use the U2000 to configure the following parameters for the AD1.

l Automatic Laser Shutdownl J0l J1l C2l SDH Interface

For details on the parameters, see D Board Configuration Parameters.

5.3.7 Technical SpecificationsSpecifications of the AD1 cover specifications of interfaces, board dimensions, weight andpower consumption.

Table 5-10 lists the specifications of interfaces on the AD1.

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Table 5-10 Technical specifications of the STM-1 optical interface

Item Specification

Nominal bit rate(kbit/s)

155520

Optical interfacetype

Two-fiber bidirectional interface Single-fiber bidirectional interface

S-1.1(15 km)

L-1.1(40 km)

L-1.2(80 km)

S-1.1(10 km)

L-1.1(40 km)

Fiber type Single-mode Single-mode Single-mode Single-mode Single-mode

Workingwavelengthrange (nm)

1261 to 1360 1263 to 1360 1480 to 1580 For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

Mean launchedoptical power(dBm)

-15 to -8 -5 to 0 -5 to 0 -15 to -8 -5 to 0

Receiversensitivity(dBm)

-28 -34 -34 -28.2 -30

Minimumoverload (dBm)

-8 -10 -10 -8 -10

Minimumextinction ratio(dB)

8.2 10 10 6.6 10

Optical modulepart number

34060276 34060281 34060282 For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart number ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

NOTEFor details of the optical module, see 10.2 Optical Module Labels.

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Table 5-11 Related optical module part numbers of single-fiber bidirectional interface optical interface andwavelength allocation

Item Local Remote

Optical module part number(15 km)

34060363 34060364

Optical module part number(40 km)

34060328 34060329

Transmitter wavelength (nm) 1260 to 1360 1480 to 1580

Receiver wavelength (nm) 1480 to 1580 1260 to 1360

Board dimensions (mm): 128.1 (H) x 197.1 (D) x 25.4 (W)

Weight (kg): 0.35

Power consumption (W): 22.0

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6 Interface Boards

About This Chapter

Interface boards are mainly used to connect to cables and fibers. This chapter describes theinterface boards for the OptiX PTN 1900, in terms of the version, function, working principle,front panel, and parameters.

6.1 ETFCThis section describes the ETFC, a 12 x FE electrical interface board, in terms of the version,function, feature, working principle, front panel, valid slots and technical specifications.

6.2 EFF8This section describes the EFF8, which is an 8 x FE optical interface board, with regard to theversion, functions, features, working principle, front panel, valid slots, and technicalspecifications.

6.3 EFG2This section describes the EFG2, a 2 x GE optical interface board, in terms of the version,function, feature, working principle, front panel, valid slots and technical specifications.

6.4 POD41This section describes the POD41, a 2 x 622M/155M POS interface board, in terms of theversion, function, feature, working principle, front panel, valid slots and technical specifications.

6.5 AFO1This section describes the AFO1, an 8-channel ATM STM-1 service interface board, in termsof the version, function, feature, working principle, front panel, valid slots, and technicalspecifications.

6.6 L75/L12This section describes the L75/L12, a 16 x E1 75-ohm interface board, in terms of the version,function, feature, working principle, front panel, valid slots and technical specifications.

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6.1 ETFCThis section describes the ETFC, a 12 x FE electrical interface board, in terms of the version,function, feature, working principle, front panel, valid slots and technical specifications.

6.1.1 Version DescriptionThe function version of the ETFC is TN81.

6.1.2 Functions and FeaturesThe ETFC accesses 12 x FE electrical signals, and processes the services with the processingboard CXP.

6.1.3 Working Principle and Signal FlowThe ETFC mainly consists of interface conversion module, service processing module,management module, clock module and power supply module.

6.1.4 Front PanelOn the front panel of the ETFC, there are indicators and interfaces.

6.1.5 Valid SlotsFor the OptiX PTN 1900, the ETFC can be housed in any of slots 3 - 7 in the interface area.When used with the active and standby CXP, the ETFC can access and process services fromthe Ethernet electrical interface.

6.1.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the ETFC.

6.1.7 Technical SpecificationsSpecifications of the ETFC board cover the interface specifications, board dimensions, weightand power consumption.

6.1.1 Version DescriptionThe function version of the ETFC is TN81.

6.1.2 Functions and FeaturesThe ETFC accesses 12 x FE electrical signals, and processes the services with the processingboard CXP.

Table 6-1 lists the functions and features of the ETFC.

Table 6-1 Functions and Features of the ETFC

Function and Feature Description

Basic function Service interface on the frontpanel

12 FE electrical interfaces

Interface function Type of the loopback at theport

PHY layer inloopMAC layer inloop

Automatic releasing of theloopback at the port

Supported.

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Function and Feature Description

Port bandwidth utilizationstatistics

Supported.

Supports the inband DCN, which can be manually enabledand disabled. The DCN function is enabled for the first fourports by default.

LAG Inter-board Supported.

Intra-board Supported.

6.1.3 Working Principle and Signal FlowThe ETFC mainly consists of interface conversion module, service processing module,management module, clock module and power supply module.

Figure 6-1 shows the block diagram for the working principle of the ETFC.

Figure 6-1 Block diagram for the working principle of the ETFC

CXP AInterface conversion

module

Clock module

Service processing

module

Management module

12 x FE signals Service signalsService signals

Management bus

Management bus

System clock

-48V/-60V

-48V/-60V

3.3V...

1.2V

PIU

PIU

Power supply module

.

.

.

CXP

Backplane

CXP

Service signalsCXP B

In the Downstream DirectionThe high speed service packets from the CXP are accessed through the ports on the backplaneof the ETFC, and then sent to the service processing module. The service processing moduleconverts the high speed packets to the FE service packets, and sends the processing packets tothe interface conversion module, which performs the coding/decoding and parallel/serialconversion on the service packets. Finally, the service signals are sent though the FE ports.

In the Upstream DirectionThe FE services are accessed to the interface conversion module through the FE ports. Theinterface conversion module performs the coding/decoding and serial/parallel conversion, andthen sends the packets to the service processing module, which converts the FE service packetsto the high speed packets. Finally, the high speed packets are sent to the CXP through theinterface on the ports on the backplane.

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Interface Conversion Module

This module performs the following functions:

l In the upstream direction, this module accesses the FE services and performs the lightningprotection, and then performs the coding/decoding and serial/parallel conversion. Finally,the processing service packets are sent to the service processing module.

l In the downstream direction, this module receives the service packets sent by the serviceprocessing module, and performs the coding/decoding and serial/parallel conversion.Finally, the service packets are sent to each FE port.

Service Processing Module

This module performs the following functions:

l In the upstream direction, this module receives the service packets sent by the interfaceconversion module, and converts the FE service packets to the high speed packets, and thensends the packets to the ports on the backplane.

l In the downstream direction, this module converts the high speed packets, sent through theports on the backplane, to the FE service packets, and then sends the packets to the interfaceconversion module.

Management Module

This module manages and controls the modules on the board.

Clock Module

This module performs the following functions:

Realizes the clock phase-locked function, and provides the working clock for each module onthe board.

Power Supply Module

This module provides the DC voltages for each module on the board.

6.1.4 Front PanelOn the front panel of the ETFC, there are indicators and interfaces.

CAUTIONIt is not recommended that the FE ports on the ETFC be used as the network-side ports.

Appearance of the Front Panel

Figure 6-2 shows the appearance of the front panel of the ETFC.

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Figure 6-2 Appearance of the front panel of the ETFC

Indicator

The following indicators are present on the front panel of the ETFC.

l STAT indicator, red, green, or orange, which indicates the working status

l ACT indicator, green, which indicates the service activation status

l SRV indicator, red, green, or orange, which indicates the service status

For details on indications of indicators, see A.2 Board Indicators.

Interface

Table 6-2 lists the types and usage of the interfaces of the ETFC. These interfaces support auto-adaptation to a straight-through network cable or a crossover network cable. For details on thecables connected to the interfaces, see 12.3.1 Ethernet Cable.

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Table 6-2 Types and usage of the interfaces on the ETFC

Interface on the FrontPanel

Interface Type Usage

FE1 - FE12 RJ-45 Access the first to twelfthEthernet electrical signals.

Table 6-3 lists the pin assignment of the RJ-45 connector on the ETFC.

Table 6-3 Pin assignment of the RJ-45 connector on the ETFC

Front View Pin No. Usage

18 24 3567

1 Positive of twisted pair 1

2 Negative of twisted pair 1

3 Positive of twisted pair 2

4 Unspecified

5 Unspecified

6 Negative of twisted pair 2

7 Unspecified

8 Unspecified

6.1.5 Valid SlotsFor the OptiX PTN 1900, the ETFC can be housed in any of slots 3 - 7 in the interface area.When used with the active and standby CXP, the ETFC can access and process services fromthe Ethernet electrical interface.

NOTE

When the ETFC is housed in slot 3, the last 5 ports are not available.

6.1.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the ETFC.

You can use the U2000 to configure the following parameters for the ETFC.

l Ethernet Interface

For details on the parameters, see D Board Configuration Parameters.

6.1.7 Technical SpecificationsSpecifications of the ETFC board cover the interface specifications, board dimensions, weightand power consumption.

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Table 6-4 lists the interface specifications of the ETFC.

Table 6-4 Interface specifications of the ETFC

Item Specification

Electrical interface rate 10 Mbit/s, 100 Mbit/s

RJ-45 electrical interface specification Compliant with the IEEE 802.3

Board dimensions (mm): 261.4 (H) x 156.9 (D) x 22.0 (W)

Weight (kg): 0.55

Power consumption (W): 15.0

6.2 EFF8This section describes the EFF8, which is an 8 x FE optical interface board, with regard to theversion, functions, features, working principle, front panel, valid slots, and technicalspecifications.

6.2.1 Version DescriptionThe function version of the EFF8 is TN81.

6.2.2 Functions and FeaturesThe EFF8 mainly accesses 8 x FE services, and processes the services with the processing boardCXP.

6.2.3 Working Principle and Signal FlowThe EFF8 mainly consists of the interface conversion module, service processing module,management module, clock module, and power module.

6.2.4 Front PanelOn the front panel of the EFF8, there are indicators and interfaces.

6.2.5 Valid SlotsIn the case of the OptiX PTN 1900, the EFF8 can be housed in any of slots 3 to 7 in the interfacearea. The EFF8 accesses and processes the Ethernet services when used together with the CXP.

6.2.6 Board Configuration ReferenceYou can use the U2000 to set parameters for the EFF8.

6.2.7 Technical SpecificationsThe technical specifications of the EFF8 include the interface specifications, board dimensions,weight and power consumption.

6.2.1 Version DescriptionThe function version of the EFF8 is TN81.

6.2.2 Functions and FeaturesThe EFF8 mainly accesses 8 x FE services, and processes the services with the processing boardCXP.

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Table 6-5 lists the functions and features of the EFF8.

Table 6-5 Functions and Features of the EFF8

Function and Feature Description

Basic function Service interface on the frontpanel

Eight FE optical interfaces.

Interface function Type of the loopback at theport

PHY layer inloopMAC layer outloop

Automatic releasing of theloopback at the port

Supported.

Port bandwidth utilizationstatistics

Supported.

Supports the inband DCN, which can be manually enabled anddisabled. The DCN function is enabled for the first four portsby default.

Automatic laser shutdown Supported.

LAG Inter-board Supported.

Intra-board Supported.

Back pressure Supported

Clock Synchronous Ethernet Supported.

IEEE 1588 V2 protocol1588 ACR clock

Supported.

Transmitting and receivingthe synchronous statusmessage (SSM) ofsynchronous Ethernet ports.

Supported.

6.2.3 Working Principle and Signal FlowThe EFF8 mainly consists of the interface conversion module, service processing module,management module, clock module, and power module.

Figure 6-3 shows the block diagram for the functions of the EFF8.

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Figure 6-3 Block diagram for the functions of the EFF8

CXP AInterface conversion

module

Clock module

Service processing

module

Management module

8 x FE signals Service signalsService signals

Management bus

Management bus

System clock

-48V/-60V

-48V/-60V

3.3V...

1.2V

PIU

PIU

Power supply module

.

.

.

CXP

Backplane

IEEE 1588 V2 packetsSynchronous Ethernet clocksManagement bus

Synchronous Ethernet clocks

IEEE 1588 V2 packets

CXP BService signals

CXPCXPCXP

In the Downstream Direction

The high speed service packets from the CXP are accessed through the port on the backplane ofthe EFF8, and then sent to the service processing module. The service processing moduleconverts the high speed packets to the FE service packets, and sends the processing packets tothe interface conversion module, which performs the coding/decoding and parallel/serialconversion on the service packets. Finally, the service signals are sent though the FE ports.

In the Upstream Direction

The FE services are accessed to the interface conversion module through the FE ports. Theinterface conversion module performs the coding/decoding and serial/parallel conversion, andthen sends the packets to the service processing module, which converts the FE service packetsto the high speed packets. Finally, the high speed packets are sent to the CXP through theinterface on the port on the backplane.

Interface Conversion Module

This module performs the following functions:

l In the upstream direction, this module accesses the FE services, and then performs thecoding/decoding and serial/parallel conversion. Finally, the processing service packets aresent to the service processing module.

l In the downstream direction, this module receives the service packets sent by the serviceprocessing module, and performs the coding/decoding and serial/parallel conversion.Finally, the service packets are sent to each FE port.

Service Processing Module

This module performs the following functions:

l In the upstream direction, this module receives the service packets sent by the interfaceconversion module, and converts the FE service packets to the high speed packets, and thensends the packets to the ports on the backplane.

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l In the downstream direction, this module converts the high speed packets, sent through theports on the backplane, to the FE service packets, and then sends the packets to the interfaceconversion module.

l Extracts and inserts synchronous Ethernet clock signals.l Extracts and inserts IEEE 1588 V2 packets.

Management ModuleThis module manages and controls the modules on the board.

Clock ModuleThis module performs the following functions:

l Provides the working clock for each module on the EFF8.l Supports the synchronous Ethernet.l Supports the IEEE 1588 V2 protocol.l Supports the 1588 ACR clock.

Power Supply ModuleThis module performs the power supplies for the modules on the board.

6.2.4 Front PanelOn the front panel of the EFF8, there are indicators and interfaces.

Appearance of the Front PanelFigure 6-4 shows the appearance of the front panel of the EFF8.

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Figure 6-4 Font Panel of the EFF8

Indicators

The following indicators are present on the front panel of the EFF8:

l STAT indicator, red, green, or orange, which indicates the working status

l ACT indicator, green, which indicates the service activation status

l SRV indicator, red, green, or orange, which indicates the service status

l L/A1 to L/A8 indicators, orange or green, which indicate the service transmit and receivestatus

For details on indications of indicators, see A.2 Board Indicators.

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Interfaces

Eight SFP interfaces are present on the EFF8. Table 6-6 lists the number of interfaces, types,and usage of the interfaces. For fiber corresponding to the interfaces, see 12.1.1 Types ofFiber.

Table 6-6 Interfaces of the EFF8

Interface on theFront Panel

InterfaceType

Usage

IN1 - IN8 LC When a two-fiber bidirectional optical module is used,this interface is used as an input interface for the FEoptical signal.When a single-fiber bidirectional optical module isused, this interface is not used.

OUT1 - OUT8 LC When a two-fiber bidirectional optical module is used,this interface is used as an output interface for the FEoptical signal.When a single-fiber bidirectional optical module isused, this interface is used as an input/output interfacefor the FE optical signal.

NOTEThe SFP interface should be used with an optical module.

l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left andright sides of the optical module. Each interface uses one fiber, which is used to transmit or receiveservice signals.

l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the leftside of the optical module. This optical interface uses only one fiber, which is used to transmit andreceive service signals at the same time.

6.2.5 Valid SlotsIn the case of the OptiX PTN 1900, the EFF8 can be housed in any of slots 3 to 7 in the interfacearea. The EFF8 accesses and processes the Ethernet services when used together with the CXP.

NOTE

If the EFF8 is housed in slot 3, the last port of the board cannot be used.

6.2.6 Board Configuration ReferenceYou can use the U2000 to set parameters for the EFF8.

You can use the U2000 to set the following parameter for the EFF8:

l Ethernet interface

l Automatic Laser Shutdown

For details on the parameters, see D Board Configuration Parameters.

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6.2.7 Technical SpecificationsThe technical specifications of the EFF8 include the interface specifications, board dimensions,weight and power consumption.

Interface SpecificationsTable 6-7 lists the specifications of the optical interfaces of the EFF8.

Table 6-7 Performance specifications of the FE optical interface

Item Specification

Optical interfacetype

Two-fiber bidirectional interface Single-fiber bidirectional interface

100BASE-FX(15 km)

100BASE-FX(40 km)

100BASE-FX(80 km)

100BASE-BX(10 km)

100BASE-BX(40 km)

Fiber type Single-mode Single-mode Single-mode Single-mode Single-mode

Workingwavelengthrange (nm)

1261 to 1360 1263 to 1360 1480 to 1580 For details, seethe followingtable, relatedoptical modulepart numbers of100BASE-BXopticalinterfaces andwavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart number of100BASE-BXopticalinterfaces andwavelengthallocation.

Mean launchedoptical power(dBm)

-15 to -8 -5 to 0 -5 to 0 -15 to -8 -5 to 0

Receiversensitivity(dBm)

-28 -34 -34 -28.2 -30

Minimumoverload (dBm)

-8 -10 -10 -8 -10

Minimumextinction ratio(dB)

8.2 10 10 6.6 10

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Item Specification

Optical modulepart number

34060276 34060281 34060282 For details, seethe followingtable, relatedoptical modulepart numbers of100BASE-BXopticalinterfaces andwavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart numbers of100BASE-BXopticalinterfaces andwavelengthallocation.

NOTEFor details of the optical module, see 10.2 Optical Module Labels.

Table 6-8 Related optical module part numbers of 100BASE-BX optical interfaces and wavelength allocation

Item Local Remote

Optical module part number(15 km)

34060363 34060364

Optical module part number(40 km)

34060328 34060329

Transmitter wavelength (nm) 1260 to 1360 1480 to 1580

Receiver wavelength (nm) 1480 to 1580 1260 to 1360

Other SpecificationsBoard dimensions (mm): 261.4 (H) x 156.9 (D) x 22.0 (W)

Weight (kg): 0.64

Power consumption (W): 16.3

6.3 EFG2This section describes the EFG2, a 2 x GE optical interface board, in terms of the version,function, feature, working principle, front panel, valid slots and technical specifications.

6.3.1 Version DescriptionThe function version of the EFG2 is TN81.

6.3.2 Functions and FeaturesThe EFG2 is mainly used to access 2 x GE data services, and processes the services with theprocessing board CXP.

6.3.3 Working Principle and Signal Flow

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The EFG2 consists of the interface conversion module, service processing module, managementmodule, clock module and power supply module.

6.3.4 Front PanelOn the front panel of the EFG2, there are indicators, a laser safety class label and interfaces.

6.3.5 Valid SlotsIn the case of the OptiX PTN 1900, the EFG2 can be housed in any of slots 3 to 7 in the interfacearea. The EFG2 accesses and processes the Ethernet services when used together with the CXP.

6.3.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the EFG2.

6.3.7 Technical SpecificationsSpecifications of the EFG2 cover specifications of interfaces, board dimensions, weight andpower consumption.

6.3.1 Version DescriptionThe function version of the EFG2 is TN81.

6.3.2 Functions and FeaturesThe EFG2 is mainly used to access 2 x GE data services, and processes the services with theprocessing board CXP.

Table 6-9 lists the functions and features of the EFG2.

Table 6-9 Functions and Features of the EFG2

Function and Feature Description

Basic function Service interface on the frontpanel

Two GE interfaces.

Interface function Type of the loopback at theport

PHY layer inloop andoutloop

Automatic releasing of theloopback at the port

Supported.

Port bandwidth utilizationstatistics

Supported.

Supports the inband DCN. The DCN function is enabled forthe two ports by default, and can be manually enabled anddisabled.

Automatic laser shutdown Supported.

LAG Inter-board Supported.

Intra-board Supported.

Back pressure Supported

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Function and Feature Description

Clock Synchronous Ethernet Supported by the opticalinterfaces.

IEEE 1588 V2 protocol1588 ACR clock

Supported by the opticalinterfaces.

Transmitting and receivingthe synchronous statusmessage (SSM) ofsynchronous Ethernet ports.

Supported by the opticalinterfaces.

6.3.3 Working Principle and Signal FlowThe EFG2 consists of the interface conversion module, service processing module, managementmodule, clock module and power supply module.

Figure 6-5 shows the block diagram for the working principle of the EFG2.

Figure 6-5 Block diagram for the working principle of the EFG2

CXP AInterface conversion

module

Clock module

Service processing

module

Management module

2 x GE signals Service signalsService signals

Management bus

Management bus

System clock

-48V/-60V

-48V/-60V

3.3V...

1.2V

PIU

PIU

Power module

.

.

.

CXP

Backplane

IEEE 1588 V2 packetsSynchronous Ethernet clocksManagement bus

Synchronous Ethernet clocks

IEEE 1588 V2 packets

CXP BService signals

CXPCXPCXP

In the Downstream DirectionThe service packets from the CXP are accessed through the ports on the backplane of the EFG2,and then sent to the service processing module. The service processing module buffers andgrooms the service packets, and sends the processing packets to the interface conversion module,which performs the coding/decoding and parallel/serial conversion on the service packets.Finally, the service signals are sent though the GE ports.

In the Upstream DirectionThe GE services are accessed to the interface conversion module through the GE ports. Theinterface conversion module performs the coding/decoding and serial/parallel conversion, andthen sends the packets to the service processing module, which buffers and grooms the service

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packets. Finally, the high speed packets are sent to the CXP through the interface on the portson the backplane.

Interface Conversion ModuleThis module performs the following functions:

l In the upstream direction, this module accesses the GE services, and then performs thecoding/decoding and serial/parallel conversion. Finally, the processing service packets aresent to the service processing module.

l In the downstream direction, this module receives the service packets sent by the serviceprocessing module, and performs the coding/decoding and serial/parallel conversion.Finally, the service packets are sent to each GE port.

Service Processing ModuleThis module performs the following functions:

l In the upstream direction, this module receives the service packets sent by the interfaceconversion module, and buffers and grooms the service packets, and then sends the packetsto the ports on the backplane.

l In the downstream direction, this module buffers and grooms the service packets sentthrough the ports on the backplane, and then sends the packets to the interface conversionmodule.

l Extracts and inserts synchronous Ethernet clock signals.l Extracts and inserts IEEE 1588 V2 packets.

Management ModuleThis module manages and controls the modules on the board.

Clock ModuleThis module performs the following functions:

l Provides the working clocks for the modules on the boards.l Supports the synchronous Ethernet.l Supports the IEEE 1588 V2 protocol.l Supports the 1588 ACR clock.

Power Supply ModuleThis module supplies 1.2 V and 3.3 V power for the board.

6.3.4 Front PanelOn the front panel of the EFG2, there are indicators, a laser safety class label and interfaces.

Appearance of the Front PanelFigure 6-6 shows the appearance of the front panel of the EFG2.

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Figure 6-6 Appearance of the front panel of the EFG2

IndicatorThe following indicators are present on the front panel of the EFG2.

l STAT indicator, red, green, or orange, which indicates the working statusl ACT indicator, green, which indicates the service activation statusl SRV indicator, red, green, or orange, which indicates the service statusl L/A1, L/A2 indicators, green or orange, which indicate the port connection state or data

transmission state.

For details on indications of indicators, see A.2 Board Indicators.

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Laser Safety Class LabelThe laser safety class is of CLASS 1. For an optical interface of this class, the maximum outputoptical power is less than 10 dBm (10 mW).

InterfaceOn the EFG2, two SFP interfaces are present. Table 6-10 and Table 6-11 list the types and usageof the interfaces. For fiber corresponding to the interfaces, see 12.1.1 Types of Fiber. For cablescorresponding to the interfaces, see 12.4.1 Straight Through Cable and 12.4.2 CrossoverCable.

Table 6-10 Types and usage of the interfaces on the EFG2

Interface on the Front Panel Interface Type Usage

Optical interfaces IN1-IN2 LC When a two-fiber bidirectional optical module isused, this interface is used as an input interface forthe GE optical signal.When a single-fiber bidirectional optical moduleis used, this interface is not used.

OUT1-OUT2 LC When a two-fiber bidirectional optical module isused, this interface is used as an output interfacefor the GE optical signal.When a single-fiber bidirectional optical moduleis used, this interface is used as an input/outputinterface for the GE optical signal.

Electricalinterfaces

OUT1 IN1-OUT2IN2

RJ-45 Input/Output interfaces for GE electrical signalsFor the pins for the GE electrical interface, seeTable 6-11.

NOTEThe SFP interface on the front panel can function as either an optical interface or an electrical interface.

When the SFP interface functions as an optical interface, it need to be used with an optical module.

l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left and right sides of the opticalmodule. Each interface uses one fiber, which is used to transmit or receive service signals.

l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the left side of the opticalmodule. This optical interface uses only one fiber, which is used to transmit and receive service signals at the same time.

When the SFP interface functions as an electrical interface, it need to be used with an electrical module.

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Table 6-11 Pins for the GE electrical interface

Front View Pin Usage

18 24 3567

1 Positive of twisted pair cable 1

2 Negative of twisted pair cable 1

3 Positive of twisted pair cable 2

4 Positive of twisted pair cable 3

5 Negative of twisted pair cable 3

6 Negative of twisted pair cable 2

7 Positive of twisted pair cable 4

8 Negative of twisted pair cable 4

6.3.5 Valid SlotsIn the case of the OptiX PTN 1900, the EFG2 can be housed in any of slots 3 to 7 in the interfacearea. The EFG2 accesses and processes the Ethernet services when used together with the CXP.

6.3.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the EFG2.

You can use the U2000 to configure the following parameters for the EFG2.

l Ethernet Interfacel Automatic Laser Shutdown

For details on the parameters, see D Board Configuration Parameters.

6.3.7 Technical SpecificationsSpecifications of the EFG2 cover specifications of interfaces, board dimensions, weight andpower consumption.

Table 6-12 lists the specifications of interfaces on the EFG2.

Table 6-12 Technical specifications of the GE optical interface

Item Specification

Opticalinterface type

Two-fiber bidirectional interface Single-fiberbidirectionalinterface

1000BASE-SX(0.5 km)

1000BASE-LX(10 km)

1000BASE-VX(40 km)

1000BASE-ZX(80 km)

1000BASE-CWDM(80 km)

1000BASE-BX(10 km)

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Item Specification

Fiber type Multi-mode Single-mode Single-mode Single-mode Single-mode Single-mode

Workingwavelengthrange (nm)

770 to 860 1270 to 1360 1260 to 1360 1500 to 1580 For details, seethe followingtable, relatedoptical modulepart numbersof 1000BASE-CWDMopticalinterfaces andwavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart numbersof 1000BASE-BX opticalinterfaces andwavelengthallocation.

Meanlaunchedoptical power(dBm)

-9.5 to 0 -11 to -3 -5 to 0 -2 to 5 0 to 5 -9 to -3

Receiversensitivity(dBm)

-17 -19 -22 -22 -28 -19.5

Minimumoverload(dBm)

0 -3 -3 -3 -9 -3

Minimumextinctionratio (dB)

9 9 9 9 8.2 6

Opticalmodule partnumber

34060286 34060473 34060298 34060360 For details, seethe followingtable, relatedoptical modulepart numbersof 1000BASE-CWDMopticalinterfaces andwavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart numbersof 1000BASE-BX opticalinterfaces andwavelengthallocation.

NOTEFor details of the optical module, see 10.2 Optical Module Labels.

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Table 6-13 Related optical module part numbers of 1000BASE-CWDM optical interfaces and related optical modulewavelength allocation

SN Optical modulepart number

Wavelength (nm) SN Opticalmodule partnumber

Wavelength (nm)

1 34060483 1464.5 to 1477.5 5 34060478 1544.5 to 1557.5

2 34060481 1484.5 to 1497.5 6 34060476 1564.5 to 1577.5

3 34060479 1504.5 to 1517.5 7 34060477 1584.5 to 1597.5

4 34060482 1524.5 to 1537.5 8 34060480 1604.5 to 1617.5

Table 6-14 Related optical module part numbers of 1000BASE-BX optical interfaces and wavelength allocation

Item Local Remote

Optical part number 34060470 34060475

Transmitter wavelength (nm) 1260 to 1360 1480 to 1500

Receiver wavelength (nm) 1480 to 1500 1260 to 1360

Table 6-15 Specifications of the electrical interfaces on the EFG2

Item Specification Requirement

Interface rate 1000 Mbit/s

RJ-45 electrical interfacespecification

Complies with IEEE 802.3 and enterpriseregulations.

Board dimensions (mm): 261.4 (H) x 156.9 (D) x 22.0 (W)

Weight (kg): 0.52

Power consumption (W): 8.8

6.4 POD41This section describes the POD41, a 2 x 622M/155M POS interface board, in terms of theversion, function, feature, working principle, front panel, valid slots and technical specifications.

6.4.1 Version DescriptionThe function version of the POD41 is TN81.

6.4.2 Functions and FeaturesThe POD41 mainly accesses 2 x STM-4/STM-1 services. The POD41 should be used with theprocessing board CXP.

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6.4.3 Working Principle and Signal FlowThe POD41 mainly consists of the interface conversion module, service processing module,management module, power supply module, and clock module.

6.4.4 Front PanelOn the front panel of the POD41, there are indicators, a laser safety class l label and interfaces.

6.4.5 Valid SlotsFor the OptiX PTN 1900, the POD41 can be housed in any of slots 3-7 in the interface area.When used with the active and standby CXP, the POD41 can access and process STM-1/STM-4line signals.

6.4.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the POD41.

6.4.7 Technical SpecificationsSpecifications of the POD41 board cover specifications of interfaces, board dimensions, weightand power consumption.

6.4.1 Version DescriptionThe function version of the POD41 is TN81.

6.4.2 Functions and FeaturesThe POD41 mainly accesses 2 x STM-4/STM-1 services. The POD41 should be used with theprocessing board CXP.

Table 6-16 lists the following functions and features of the POD41.

Table 6-16 Functions and Features of the POD41

Function and Feature Description

Basic function Service interface on the frontpanel

Two STM-1/STM-4 opticalinterfaces

Interface function Type of the loopback at theport

InloopOutloop

Automatic releasing of theloopback at the port

Supported.

Automatic laser shutdown Supported.

Port bandwidth utilizationstatistics

Supported.

Supports the inband DCN. The DCN function is enabled forthe two ports by default, and can be manually enabled anddisabled.

Used as the NNI.

LMSP protection Supports the 1+1 LMSP and 1:1 LMSP protection. Theprotection switching time is less than 50 ms.

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Function and Feature Description

Clock Recovers the line clocks

6.4.3 Working Principle and Signal FlowThe POD41 mainly consists of the interface conversion module, service processing module,management module, power supply module, and clock module.

Figure 6-7 shows the block diagram for the working principle of the POD41.

Figure 6-7 Block diagram for the working principle of the POD41

CXP AInterface conversion

module

Clock module

Service processing

module

Management module

2 x STM-1/STM-4 signals

Service signalsService signals

Management bus

Management bus

System clock

-48V/-60V

-48V/-60V

3.3V...

1.2V

PIU

PIU

Power supply module

.

.

.

Backplane

Line clocksManagement bus

Line clocksCXP

CXP

CXP

CXP BService signals

Interface Conversion ModuleThis module converts rates of interfaces.

Service Processing ModuleThis module converts the STM-4 or STM-1 serial differential signals to parallel signals, andoutputs the parallel signals through the interfaces. In addition, this module sends the frame alarmsignals, received alarm signals and inserted signals indicating bit error found during the paritycheck. Finally, this module reports its status through the management module.

Management ModuleThis module manages and controls the modules on the board.

Power supply moduleThis module provides DC voltages required by each module on the board.

Clock ModuleThis module locks the phase for the system clock and provides the line clock.

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6.4.4 Front PanelOn the front panel of the POD41, there are indicators, a laser safety class l label and interfaces.

Appearance of the Front Panel

Figure 6-8 shows the appearance of the front panel of the POD41.

Figure 6-8 Appearance of the front panel of the POD41

Indicatorl STAT indicator, red, green, or orange, which indicates the working status

l ACT indicator, green, which indicates the service activation status

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l SRV indicator, red, green, or orange, which indicates the service status

For details on indications of indicators, see A.2 Board Indicators.

Laser Safety Class Label

The laser safety class is of CLASS 1. For an optical interface of this class, the maximum outputoptical power is less than 10 dBm (10 mW).

Interface

Two SFP interfaces are present on the front panel of the POD41. Table 6-17 lists the types andusage of the interfaces. For fiber corresponding to the interfaces, see 12.1.1 Types of Fiber.

Table 6-17 Types and usage of the interfaces on the POD41

Interface onthe FrontPanel

InterfaceType

Usage

IN1-IN2 LC When a two-fiber bidirectional optical module is used, thisinterface is used as an input interface for the STM-1/STM-4optical signal.When a single-fiber bidirectional optical module is used, thisinterface is not used.

OUT1-OUT2 LC When a two-fiber bidirectional optical module is used, thisinterface is used as an output interface for the STM-1/STM-4optical signal.When a single-fiber bidirectional optical module is used, thisinterface is used as an input/output interface for the STM-1optical signal.The STM-4 interface does not support the single-fiberbidirectional optical module.

NOTEThe SFP interface should be used with an optical module.

l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left andright sides of the optical module. Each interface uses one fiber, which is used to transmit or receiveservice signals.

l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the leftside of the optical module. This optical interface uses only one fiber, which is used to transmit andreceive service signals at the same time.

6.4.5 Valid SlotsFor the OptiX PTN 1900, the POD41 can be housed in any of slots 3-7 in the interface area.When used with the active and standby CXP, the POD41 can access and process STM-1/STM-4line signals.

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6.4.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the POD41.

You can use the U2000 to configure the following parameters for the POD41.

l Automatic Laser Shutdown

l J0

l J1

l C2

l SDH Interface

For details on the parameters, see D Board Configuration Parameters.

6.4.7 Technical SpecificationsSpecifications of the POD41 board cover specifications of interfaces, board dimensions, weightand power consumption.

Table 6-18 and Table 6-20 list the specifications of interfaces on the POD41.

Table 6-18 Technical specifications of the STM-1 optical interface

Item Specification

Nominal bit rate(kbit/s)

155520

Optical interfacetype

Two-fiber bidirectional interface Single-fiber bidirectional interface

S-1.1(15 km)

L-1.1(40 km)

L-1.2(80 km)

S-1.1(10 km)

L-1.1(40 km)

Fiber type Single-mode Single-mode Single-mode Single-mode Single-mode

Workingwavelengthrange (nm)

1261 to 1360 1263 to 1360 1480 to 1580 For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

Mean launchedoptical power(dBm)

-15 to -8 -5 to 0 -5 to 0 -15 to -8 -5 to 0

Receiversensitivity(dBm)

-28 -34 -34 -28.2 -30

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Item Specification

Minimumoverload (dBm)

-8 -10 -10 -8 -10

Minimumextinction ratio(dB)

8.2 10 10 6.6 10

Optical modulepart number

34060276 34060281 34060282 For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart number ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

NOTEFor details of the optical module, see 10.2 Optical Module Labels.

Table 6-19 Related optical module part numbers of single-fiber bidirectional interface optical interface andwavelength allocation

Item Local Remote

Optical module part number(15 km)

34060363 34060364

Optical module part number(40 km)

34060328 34060329

Transmitter wavelength (nm) 1260 to 1360 1480 to 1580

Receiver wavelength (nm) 1480 to 1580 1260 to 1360

Table 6-20 Technical specifications of the STM-4 optical interface

Item Specification

Nominal bit rate (kbit/s) 622080

Optical interface type Two-fiber bidirectional interface

S-4.1(15 km)

L-4.1(40 km)

L-4.2(80 km)

Fiber type Single-mode Single-mode Single-mode

Working wavelength range (nm) 1261 to 1360 1280 to 1355 1480 to 1580

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Item Specification

Launched optical power (dBm) -15 to -8 -3 to 2 -3 to 2

Receiver sensitivity (dBm) -28 -28 -28

Minimum overload (dBm) -8 -8 -8

Minimum extinction ratio (dB) 8.2 10 10

Optical module code 34060277 34060280 34060284

NOTEFor details of the optical module, see 10.2 Optical Module Labels.

Board dimensions (mm): 261.4 (H) x 156.9 (D) x 22.0 (W)

Weight (kg): 0.55

Power consumption (W): 11.6

6.5 AFO1This section describes the AFO1, an 8-channel ATM STM-1 service interface board, in termsof the version, function, feature, working principle, front panel, valid slots, and technicalspecifications.

6.5.1 Version DescriptionThe function version of the AFO1 is TN81.

6.5.2 Functions and FeaturesThe AFO1 is used to access 8 x ATM STM-1 services. When used with the processing boardCXP, the AFO1 can process the ATM services.

6.5.3 Working Principle and Signal FlowThe AFO1 mainly consists of the ATM access module, ATM processing module, data processingmodule, management module, clock module, and power supply module.

6.5.4 Front PanelOn the front panel of the AFO1, there are indicators and eight optical interfaces.

6.5.5 Valid SlotsIn the case of the OptiX PTN 1900, the AFO1 can be housed in any of slots 3 to 7 in the interfacearea. The AFO1 accesses and processes the ATM STM-1 services when used together with theCXP.

6.5.6 Board Configuration ReferenceYou can use the U2000 to set parameters for the AFO1.

6.5.7 Technical SpecificationsThe technical specifications of the AFO1 cover the interface specifications, board dimensions,weight and power consumption.

6.5.1 Version DescriptionThe function version of the AFO1 is TN81.

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6.5.2 Functions and FeaturesThe AFO1 is used to access 8 x ATM STM-1 services. When used with the processing boardCXP, the AFO1 can process the ATM services.

Table 6-21 lists the functions and features of the AFO1.

Table 6-21 Functions and Features of the AFO1

Function andFeature

Description

Basic function Service interface on thefront panel

Eight ATM STM-1 optical interfaces

Interface function Automatic shutdown of thelaser at the port

Supported.

Type of the loopback at theport

InloopOutloop

Automatic releasing of theloopback at the port

Supported.

ATM Supported traffic type CBRUBRUBR+rt-VBRnrt-VBR

Number of supported PW 4 k

Number of supported ATMVP/VC switchingconnections

2 k

Supports the encapsulation from ATM VPC/VCC to PWE3 in the N-to-1 (N≤32) and 1-to-1 formats.

Supports the PW encapsulation for the ATM cells in the concatenationand non-concatenation formats. The number of PW connections thatsupport the cell concatenation is 2 k, and the maximum number ofconcatenated cells is 31.

UNI-side ATM OAM Supports the CC test.

Supports the LB test.

Supports the AIS.

Supports the RDI.

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Function andFeature

Description

LMSP protection Supports the LMSP. The protection switching time is less than 50 ms.l Supports the inter-board and intra-board 1+1 LMSP.l Supports the intra-board 1:1 LMSP.l Supports one group of intra-board 1:N (N≤7) LMSP.

Extraction andinsertion of S1 bytes

Supported.

6.5.3 Working Principle and Signal FlowThe AFO1 mainly consists of the ATM access module, ATM processing module, data processingmodule, management module, clock module, and power supply module.

Figure 6-9 shows the block diagram for the working principle of the AFO1.

Figure 6-9 Block diagram for the working principle of the AFO1

Clock module

Power supply module

-48 V/-60 V

-48 V/-60 V

Service signals

PIU

PIU

CXP

CXP A

System clock signals

3.3 V ...

1.1 V

Backplane

CXP BService signals

ATM processing module

ATM access module

Data processing module

Management module

Management bus

Management bus

8 x STM-1 ATM signals ATM cells ATM cells

Management bus Management bus

CXP

In the upstream DirectionThe ATM STM-1 service signals accesses the ATM access module through the optical interface.The ATM access module extracts the ATM cells, and transmits the cells to the ATM processingmodule for service processing. Then, QoS functions such as VP/VC switching, ATM OAM, andtraffic management are performed on the cells. The PW encapsulation is performed on theprocessed cells on the data processing module. Finally, the cells are transmitted to the processingboard CXP through the port on the backplane.

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In the downstream Direction

The data services are accessed to the processing module through the port on the backplane. ThePW decapsulation is performed on the services, and then the services are sent to the ATMprocessing module. On the ATM processing module, QoS functions such as ATM OAM andtraffic management are performed on the services. Then, the services are sent to the ATM accessmodule, where the TAM cells are mapped to SDH signals. Then, the signals are sent out throughthe corresponding optical interface.

ATM Access Module

This module performs the following functions:

l In the upstream direction, the SDH overheads, alarms, and pointers are processed on theaccessed 8 x ATM STM-1 signals at a rate of 155 Mbit/s. The ATM cells are extractedfrom the SDH signals, and then the ATM cells are sent to the ATM processing module,where the line clock is extracted.

l In the downstream direction, the ATM cells from the ATM processing module are mappedto the SDH signals, and then the SDH overhead processing, alarm processing, and pointerprocessing are performed on the signals. In this manner, the SDH frames are formed.

ATM Processing Module

This module mainly realizes the VP/VC switching, QoS functions such as traffic management,traffic shaping, queue scheduling, and OAM function for the ATM cells.

l In the upstream direction, this module determines the traffic priority of the ATM cells. Ifcongestion occurs, this module determines whether to discard the cells or to continuetransmitting cells according to the traffic priority. If the cells are continued to be transmitted,the VP/VC switching is performed on the cells, which are then sent to the data processingmodule.

l In the downstream direction, this module processes the cell packet headers, and performsthe VP/VC switching on the cells. If congestion occurs, this module determines whetherto discard the cells or to continue transmitting cells according to the traffic priority. If thecells are continued to be transmitted, they are sent to the ATM access module.

l Provides the back pressure mechanism, and realizes the traffic management function.

l Supports the F4 and F5 ATM OAM functions:

– Supports the CC test.

– Supports the LB test.

Data Processing Module

This module mainly realizes the PW encapsulation and decapsulation for the packets.

l In the upstream direction, this module receives the ATM cells, and performs the PWencapsulation for the cells in the concatenation or non-concatenation format. Then, the cellsare sent to the processing board CXP through the port on the backplane.

l In the downstream direction, this module receives the PWE3 packets from the port on thebackplane, identifies the packets, performs the PW decapsulation to obtain the ATM cells,and then transmits the cells to the ATM processing module.

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Management ModuleThis module performs the following functions:

l Manages and controls other modules on the board.l Processes various clock signals when used with the clock module.

Clock ModuleThis module provides clock signals for other modules of the board.

Power Supply ModuleThis module provides the working power supply for each module of the board.

6.5.4 Front PanelOn the front panel of the AFO1, there are indicators and eight optical interfaces.

Appearance of the Front PanelFigure 6-10 shows the appearance of the front panel of the AFO1.

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Figure 6-10 Front panel of the AFO1

IndicatorsThe following indicators are present on the front panel of the AFO1:

l STAT indicator, red, green, or orange, which indicates the working statusl ACT indicator, green, which indicates the service activation statusl SRV indicator, red, green, or orange, which indicates the service status

For details on indications of indicators, see A.2 Board Indicators.

InterfacesEight SFP interfaces are present on the AFO1. Table 6-22 lists the number, types, and usage ofthe interfaces on the AFO1. For fiber corresponding to the interfaces, see 12.1.1 Types ofFiber.

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Table 6-22 Types and usage of the interfaces on the AFO1

Interface on theFront Panel

InterfaceType

Usage

IN1 - IN8 LC When a two-fiber bidirectional optical module is used,this interface is used as an input interface for the STM-1optical signal.When a single-fiber bidirectional optical module isused, this interface is not used.

OUT1 - OUT8 LC When a two-fiber bidirectional optical module is used,this interface is used as an output interface for theSTM-1 optical signal.When a single-fiber bidirectional optical module isused, this interface is used as an input/output interfacefor the STM-1 optical signal.

NOTEThe SFP interface should be used with an optical module.

l When a two-fiber bidirectional optical module is used, two LC interfaces are provided on the left andright sides of the optical module. Each interface uses one fiber, which is used to transmit or receiveservice signals.

l When a single-fiber bidirectional optical module is used, only one LC interface is provided on the leftside of the optical module. This optical interface uses only one fiber, which is used to transmit andreceive service signals at the same time.

6.5.5 Valid SlotsIn the case of the OptiX PTN 1900, the AFO1 can be housed in any of slots 3 to 7 in the interfacearea. The AFO1 accesses and processes the ATM STM-1 services when used together with theCXP.

NOTE

If the AFO1 is housed in slot 3, the last port of the AFO1 cannot be used.

6.5.6 Board Configuration ReferenceYou can use the U2000 to set parameters for the AFO1.

You can use the U2000 to set the following parameters for the AFO1:

l Automatic laser shutdown

l SDH interface

For details on the parameters, see D Board Configuration Parameters.

6.5.7 Technical SpecificationsThe technical specifications of the AFO1 cover the interface specifications, board dimensions,weight and power consumption.

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Interface SpecificationsTable 6-23 lists the specifications of interfaces on the AFO1.

Table 6-23 Technical specifications of the STM-1 optical interface

Item Specification

Nominal bit rate(kbit/s)

155520

Optical interfacetype

Two-fiber bidirectional interface Single-fiber bidirectional interface

S-1.1(15 km)

L-1.1(40 km)

L-1.2(80 km)

S-1.1(10 km)

L-1.1(40 km)

Fiber type Single-mode Single-mode Single-mode Single-mode Single-mode

Workingwavelengthrange (nm)

1261 to 1360 1263 to 1360 1480 to 1580 For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

Mean launchedoptical power(dBm)

-15 to -8 -5 to 0 -5 to 0 -15 to -8 -5 to 0

Receiversensitivity(dBm)

-28 -34 -34 -28.2 -30

Minimumoverload (dBm)

-8 -10 -10 -8 -10

Minimumextinction ratio(dB)

8.2 10 10 6.6 10

Optical modulepart number

34060276 34060281 34060282 For details, seethe followingtable, relatedoptical modulepart numbers ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

For details, seethe followingtable, relatedoptical modulepart number ofsingle-fiberbidirectionaloptical interfaceand wavelengthallocation.

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Item Specification

NOTEFor details of the optical module, see 10.2 Optical Module Labels.

Table 6-24 Related optical module part numbers of single-fiber bidirectional interface optical interface andwavelength allocation

Item Local Remote

Optical module part number(15 km)

34060363 34060364

Optical module part number(40 km)

34060328 34060329

Transmitter wavelength (nm) 1260 to 1360 1480 to 1580

Receiver wavelength (nm) 1480 to 1580 1260 to 1360

Other SpecificationsBoard dimensions (mm): 261.4 (H) x 156.9 (D) x 22.0 (W)

Weight (kg): 0.78

Power consumption (W): 27.2

6.6 L75/L12This section describes the L75/L12, a 16 x E1 75-ohm interface board, in terms of the version,function, feature, working principle, front panel, valid slots and technical specifications.

NOTE

The mapping impedance of an interface on the L75 is 75 ohm, and the mapping impedance of an interfaceon the L12 is 120 ohm. Except the difference of mapping impedance, the functions and features of the L75and L12 are the same.

6.6.1 Version DescriptionThe function version of the L75/L12 is TN71.

6.6.2 Function and FeatureThe L75 is mainly used to input and output 16 x 75-ohm E1 signals, and the L12 is mainly usedto input and output 16 x 120-ohm E1 signals. Used with the MD1 and the CXP, the L75/L12provides TPS protection for E1 services.

6.6.3 Working Principle and Signal FlowThe L75/L12 mainly consists of the isolation protection module, relay trail selecting moduleand power supply module.

6.6.4 Front PanelOn the front panel of the L75/L12, there are interfaces.

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6.6.5 Valid SlotsThe slot that houses the L75/L12 in the interface area is determined by the slot that houses theprocessing board used with the L75/L12.

6.6.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the L75/L12.

6.6.7 Technical SpecificationsSpecifications of the L75/L12 board cover interface specifications, board dimensions, weightand power consumption.

6.6.1 Version DescriptionThe function version of the L75/L12 is TN71.

6.6.2 Function and FeatureThe L75 is mainly used to input and output 16 x 75-ohm E1 signals, and the L12 is mainly usedto input and output 16 x 120-ohm E1 signals. Used with the MD1 and the CXP, the L75/L12provides TPS protection for E1 services.

The L75/L12 board supports the inband DCN, which can be manually enabled and disabled.The DCN function is enabled for the first port by default.

The interfaces on the front panel of the L75/L12 supports the inloop and the outloop.

6.6.3 Working Principle and Signal FlowThe L75/L12 mainly consists of the isolation protection module, relay trail selecting moduleand power supply module.

Figure 6-11 shows the block diagram for the working principle of the L75/L12.

Figure 6-11 Block diagram for the working principle of the L75/L12

12 V powersupply

Fuse12 V

Backplane

E1 signalWorking

processing board

Protectionprocessing boardIsolation protection module

Thunder-proof unit

Relay trailselectingmodule

Power supplymodule

TransformerImpedancematching

unit

E1signal

E1signal

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Isolation Protection ModuleThis module mainly consists of the thunder-proof unit, transformer and impedance matchingunit.

The thunder-proof unit mainly protects circuits against transient anomalies, such as overcurrentand lightning.

The transformer uses the isolation feature to isolate the common mode interference, and thusprotects the board against the common mode interference.

The impedance matching unit ensures that the impedances in the transmit and receive directionsmatch with the internal impedance.

Relay Trail Selecting ModuleThis module realizes the TPS protection for interface boards according to the control signalssent by the system control board.

Power Supply ModuleThis module provides DC voltages required by each module on the L75/L12.

6.6.4 Front PanelOn the front panel of the L75/L12, there are interfaces.

Appearance of the Front PanelFigure 6-12 shows the appearances of the front panel of the L75 and the L12.

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Figure 6-12 Appearances of the front panel of the L75 and the L12

InterfaceThere are two DB44 interfaces on the front panel of the L75/L12. Table 6-25 lists the types andusage of the interfaces. For cables corresponding to the 75-ohm interfaces, see 12.3.2 75-ohm8 x E1 Cable, and for cables corresponding to the 120-ohm interfaces, see 12.3.3 120-ohm 8 xE1 Cable.

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Table 6-25 Types and usage of the interfaces on the L75

Interfaceon theFrontPanel

Interface Type

Usage

L75 L12

1-8 DB44 75-ohm interface, which is usedto transmit or receive the first toeighth channels of E1 services.

120-ohm interface, which isused to transmit or receive thefirst to eighth channels of E1services.

9-16 DB44 75-ohm interface, which is usedto transmit or receive the ninth tosixteenth channels of E1services.

120-ohm interface, which isused to transmit or receive theninth to sixteenth channels of E1services.

Table 6-26 lists the pin assignment of the 75-ohm DB44 interfaces, and Table 6-27 lists the pinassignment of the 120-ohm DB44 interfaces.

Table 6-26 Pins of the 75-ohm DB44 interfaces

Front View Pin Usage Remarks Pin Usage Remarks

1

4438 Grounding end R1 15 Grounding end T1

23 Receive end 30 Transmit end

37 Grounding end R2 14 Grounding end T2

22 Receive end 29 Transmit end

36 Grounding end R3 13 Grounding end T3

21 Receive end 28 Transmit end

35 Grounding end R4 12 Grounding end T4

20 Receive end 27 Transmit end

34 Grounding end R5 11 Grounding end T5

19 Receive end 26 Transmit end

33 Grounding end R6 10 Grounding end T6

18 Receive end 25 Transmit end

32 Grounding end R7 9 Grounding end T7

17 Receive end 24 Transmit end

31 Grounding end R8 8 Grounding end T8

16 Receive end 7 Transmit end

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Table 6-27 Pins of the 120-ohm DB44 interfaces

Front View Pin Usage Remarks Pin Usage Remarks

1

4438 Negative receive

endR1 15 Negative transmit

endT1

23 Positive receiveend

30 Positive transmitend

37 Negative receiveend

R2 14 Negative transmitend

T2

22 Positive receiveend

29 Positive transmitend

36 Negative receiveend

R3 13 Negative transmitend

T3

21 Positive receiveend

28 Positive transmitend

35 Negative receiveend

R4 12 Negative transmitend

T4

20 Positive receiveend

27 Positive transmitend

34 Negative receiveend

R5 11 Negative transmitend

T5

19 Positive receiveend

26 Positive transmitend

33 Negative receiveend

R6 10 Negative transmitend

T6

18 Positive receiveend

25 Positive transmitend

32 Negative receiveend

R7 9 Negative transmitend

T7

17 Positive receiveend

24 Positive transmitend

31 Negative receiveend

R8 8 Negative transmitend

T8

16 Positive receiveend

7 Positive transmitend

6.6.5 Valid SlotsThe slot that houses the L75/L12 in the interface area is determined by the slot that houses theprocessing board used with the L75/L12.

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For the OptiX PTN 1900, the L75/L12 can be housed in any of slots 3 - 6 in the interface areato input and output 16 x E1 signals. In addition, when used with the processing board, the L75/L12 can provide the TPS protection for the E1 signals.

6.6.6 Board Configuration ReferenceYou can use the U2000 to configure parameters for the L75/L12.

You can use the U2000 to configure the following parameters for the L75/L12.

l E1 Interface

For details on the parameters, see D Board Configuration Parameters.

6.6.7 Technical SpecificationsSpecifications of the L75/L12 board cover interface specifications, board dimensions, weightand power consumption.

Table 6-28 lists the interface specifications of the L75/L12.

Table 6-28 Interface specifications of the L75/L12

Item Specification

Nominal bit rate: (kbit/s) 2048

Interface impedance (ohm) 75 (L75)120 (L12)

Code HDB3

Pulse shape at output port Compliant with ITU-T G.703

Attenuation tolerance of input interface at 1024kHz frequency point (dB)

0 to 6

Anti-interference capability of input port Compliant with ITU-T G.703

Input jitter tolerance Compliant with ITU-T G.823

Output jitter Compliant with ITU-T G.823

Board dimensions (mm): 261.4 (H) x 156.9 (D) x 22.0 (W)

Weight (kg): 0.53

Power consumption (W): 0.1

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7 Cross-Connect and System Control Boards

About This Chapter

For the OptiX PTN 1900, the system control, cross-connect and multiprotocol processing boardis the CXP.

7.1 TN71CXPThis section describes the TN71CXP, a system control, cross-connect and multiprotocolprocessing board, in terms of the version, function, feature, working principle, front panel, validslots, TPS protection, and technical specifications.

7.2 TN72CXPThis section describes the TN72CXP, a system control, cross-connect and multiprotocolprocessing board, in terms of the version, function, feature, working principle, front panel, validslots, TPS protection, and technical specifications.

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7.1 TN71CXPThis section describes the TN71CXP, a system control, cross-connect and multiprotocolprocessing board, in terms of the version, function, feature, working principle, front panel, validslots, TPS protection, and technical specifications.

7.1.1 Version DescriptionThe function version of the TN71CXP is TN71.

7.1.2 Functions and FeaturesThe TN71CXP board supports functions such as system control and communication, serviceprocessing and grooming, and system clock and time processing.

7.1.3 Working Principle and Signal FlowThe TN71CXP consists of the system control and communication module, service processingand grooming module, service sub-board module, clock processing module and power supplymodule.

7.1.4 JumperThe TN71CXP provides jumpers for selecting the board starting mode and for enabling thebattery.

7.1.5 Front PanelOn the front panel of the TN71CXP, there are indicators, sub-slots, button and interfaces.

7.1.6 Valid SlotsThe TN71CXP can be housed in any of slots 1 or slot 2 of the subrack.

7.1.7 TPS Protection for BoardsThe TN71CXP provides the TPS protection for the service sub-board MD1.

7.1.8 Board Configuration ReferenceFor the details of configuring the TN71CXP board, refer to the configuration of the insertedservice sub-boards.

7.1.9 Technical SpecificationsSpecifications of the TN71CXP board cover board dimensions, weight and power consumption.

7.1.1 Version DescriptionThe function version of the TN71CXP is TN71.

NOTE

The CXP has two function versions, TN71 and TN72. The difference between the two versions are asfollows:

l The TN72CXP supports external time interfaces.

l The TN72CXP supports the board version replacement function. That is, the TN72CXP can replacethe TN71CXP. When a board with a later version is used with a board with an earlier version on oneNE, if you query the board with a later version on the NMS, the logical version of the board with alater version is the same as that of the board with an earlier version.

In this document, the TN71CXP and TN72CXP are referred to as the CXP, unless otherwise specified.

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7.1.2 Functions and FeaturesThe TN71CXP board supports functions such as system control and communication, serviceprocessing and grooming, and system clock and time processing.

The CXP board mainly supports the following functions and features:

l System control and communication

l Service processing and grooming

l Clock synchronization and time synchronization

l 1+1 protection for the TN71CXP board and TPS protection for the service sub-board

7.1.3 Working Principle and Signal FlowThe TN71CXP consists of the system control and communication module, service processingand grooming module, service sub-board module, clock processing module and power supplymodule.

Figure 7-1 shows the block diagram for the working principle of the TN71CXP.

Figure 7-1 Block diagram for the working principle of the TN71CXP

Clock Module

Power supply module

Control and communication module

12V...

0.75V

Service sub-board module

Service sub-board 1

Service sub-board 2

Service signal

Service signal

Service processing and switching module

Interface boards

Service sub-board module on another

CXP

Service signal

Interface boardsManagement bus

State management bus

State management bus

Interface boards/PIU/FAN

Working/protection backup bus

Working/protection management bus

Another CXP

Another CXP

ETH

EXT

Inter-board communication bus

F&f

ALMI/ALMO

LAMP1/LAMP2

CLK1

CLK2

External clock input/output

Another CXP

Another CXP

IEEE 1588V2 packets

Line clocks

Line clocks Interface boards

System clock

Interface boards/Service sub-

board module/ Another CXP

-48V/-60V

-48V/-60V

PIU

PIU

Backplane

Interface boards

Another CXP

Backplane

External clock input/output

Service signal

Another CXP

Another CXP

Another CXP

Service signal

.

.

.

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Control and Communication Module

This module performs the following functions.

l Realizes configuration of boards and services.

l Processes protocol packets.

l Monitors the system status and collects data on alarms and performance events.

l If two TN71CXP boards are configured, the working and protection TN71CXP boardsmonitor the status of each other. If the working TN71CXP fails, this module controls theswitching of the working and protection TN71CXP boards. In this way, the TN71CXP gets1+1 protection.

l Monitors the status of the PIU and the status of the system power supply accessed from thePIU.

l Monitors the status of the fan boards, provides fan alarms and manage fans.

l Provides ETH, a 10M/100M auto-negotiation Ethernet interface to connect to the U2000.

l Provides EXT, a 10M/100M auto-negotiation Ethernet extended interface.

l Provides LAMP1, an interface for 4 x cabinet alarm indicators output.

l Provides LAMP2, an interface for 4 x alarm indicators concatenation.

l Provides ALMI, an interface for 4 x alarm inputs.

l Provides ALMO, a common interface for 2 x alarm outputs and 2 x alarm concatenations.

l Provides F&f, an administration and maintenance (OAM) interface, which is used toconnect the TN71CXP to a PC or workstation.

Service Processing and Grooming Module

This module performs the following functions.

l Processes FE services accessed from the ETFC and EFF8, POS services accessed from thePOD41, ATM STM-1 services accessed from the AFO1, or GE services accessed from theEFG2.

l Provides two service sub-slots and process different services accessed from E1, channelizedSTM-1 interfaces or ATM STM-1 interfaces with different sub-boards housed.

l Grooms services of 10 Gbit/s cross-connect capacity.

l Provides the hierarchical QoS to ensure quality of services.

Service Sub-Board Module

On the TN71CXP, there are two sub-slots for service boards, which are independent from eachother. The TN71CXP supports the following service sub-boards.

l MD1

l AD1

l CD1

Clock Processing Module

This module performs the following functions.

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l Traces the external clock source, line clock source, and provide the synchronous clocksource for the equipment.

l Provides two combined interface for input and output of 120-ohm clock signals. Inputs oroutputs the 2 MHz or 2 Mbit/s clock..

l Supports the IEEE 1588 V2 protocol.l Supports the 1588 ACR clock.

Power Supply ModuleThis module converts the input DC voltage into various DC voltages required by each moduleon the board.

7.1.4 JumperThe TN71CXP provides jumpers for selecting the board starting mode and for enabling thebattery.

CAUTIONDo not change the default setting of the jumpers. Otherwise, the board may become faulty.

The following jumpers are present on the TN71CXP board:

l J2, which is used to enable the battery. Figure 7-2 shows where J2 is located on theTN71CXP.

l J42, which is used to select the board starting mode. J2 corresponds to DEBUG4-DEBUG1,which form a line in the left-to-right order and indicate a four-bit binary numeral. The mostleft one bit of this binary numeral is the high bit. Refer to Table 7-2. Figure 7-2 showswhere J42 is located on the TN71CXP.

NOTE

TN71CXP consists of two boards (upper one and lower one). J2 is located on the upper board, and J42 islocated on the lower board.

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Figure 7-2 J2 on the TN71CXP

J2123

J424 3 2 1

Table 7-1 lists details on the jumpers on the TN71CXP.

Table 7-1 Jumpers on the TN71CXP

Jumper Function Description

J2 Enables the battery. The jumper cap is inserted in 1-2 by default, the batteryis enabled. In this manner, the real-time clock does notlost after the board is powered off.

J42 Selects the boardstarting mode.

If the jumper is not capped, the corresponding bit is "0".If the jumper is capped, the corresponding bit is "1".The bits form a line in the high-to-low order andindicate a four-bit binary numeral. The most left one bitof this binary numeral is the high bit. See Table 7-2.

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Table 7-2 J42 jumpers

DEBUG4

DEBUG3

DEBUG2

DEBUG1

CorrespondingValue

Description

0 0 0 0 0000 Indicates the running state, the default state,where the watchdog is enabled.

0 0 1 1 0011 Indicates the debugging state.

0 1 0 0 0100 Indicates the running state where thewatchdog is disabled.

0 1 0 1 0101 Indicates the maintenance state.

0 1 1 0 0110 Indicates the emulation running state.

1 0 1 1 1011 Erases file system, the extended BIOS andsystem parameter field.

1 1 0 0 1100 Erases file system.

1 1 0 1 1101 Erases the database, NE software (patchincluded).

1 1 1 0 1110 Erases the NE software (patch included).

1 1 1 1 1111 Erases the database.

1 0 1 0 1010 Recovers the system parameter field asdefault.

7.1.5 Front PanelOn the front panel of the TN71CXP, there are indicators, sub-slots, button and interfaces.

Appearance of the Front PanelFigure 7-3 shows the appearance of the front panel of the TN71CXP.

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Figure 7-3 Appearance of the front panel of the TN71CXP

IndicatorThe following indicators are present on the front panel of the CXP.

l STAT indicator, red, green, or orange, which indicates the working statusl PROG indicator, red or green, which indicates the running status of the programl SRV indicator, red, green, or orange, which indicates the service statusl ACTX indicator, green, which indicates the cross-connection or clock active/standby statusl ACTC indicator, green, which indicates the active/standby system control boardl SYNC indicator, red or green, which indicates the clock synchronization status

For details on indications of indicators, see A.2 Board Indicators.

Board reset buttonThe reset button is marked as RESET on the front panel of the board. The RESET button is usedfor cold reset of the TN71CXP.

Sub-SlotThe TN71CXP has two sub-slots, which are used to house one service sub-board respectively.

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When only one TN71CXP is configured on the OptiX PTN 1900, select two service sub-boardsfor the two sub-slots as required. When two TN71CXP are configured on the OptiX PTN 1900,use service sub-boards by adhering to the following principles.

l Slot 1-1 and slot 2-1 form a TPS protection group. Slot 1-2 and slot 2-2 form another TPSprotection group. The two TPS protection groups are independent from each other.

l You can insert one service sub-board in either of the two sub-slots of each protection group.In this way, the protection group has no protection.

l You can insert two MD1s in the two sub-slots of each protection group. In this way, theservice sub-boards are of 1:1 TPS protection.

l Do not insert different sub-boards in the two sub-slots of the each protection group.l If slot 1-1 and slot 2-1 are not configured as a protection group, slot 1-1 and slot 2-1 can

house different sub-boards.

NOTESlot x-y indicates the sub-slot y (service sub-board y)on the CXP housed in slot x. For example, slot 1-2indicates the service sub-slot 2 (sub-board 2) on the TN71CXP housed in the first slot .

Auxiliary InterfaceTable 7-3 lists the types and usage of the interfaces of the TN71CXP.

Table 7-3 Types and usage of the interfaces on the TN71CXP

Interface on theFront Panel

Interface Type Usage

ETH RJ-45 10M/100M autosensing Ethernet interface forconnecting to the NMS

EXT RJ-45 10M/100M autosensing Ethernet interface usingas an NMS concatenation interface

LAMP1 RJ-45 Interface for outputting cabinet indicators

LAMP2 RJ-45 Interface for concatenating cabinet indicators

F&f RJ-45 OAM serial interface

CLK1 RJ-45 Common interface for outputting and inputtingthe 120-ohm external clock

CLK2 RJ-45 Common interface for outputting and inputtingthe 120-ohm external clock

ALMO RJ-45 Common interface for 2 x alarm outputs and 2 xalarm concatenations

ALMI RJ-45 Interface for inputting the first to fourth channelsof alarms

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CAUTIONDo not connect the ETH and EXT interfaces on one NE to the same PC.

If two CXP boards are configured on the same NE, do not use the ETH or EXT interfaces onboth the working and protection CXP boards.

Table 7-4 lists the pin assignment of the ETH and EXT. These interfaces support auto-adaptationto a straight-through network cable or a crossover network cable. For cable corresponding to theinterface, see 12.3.1 Ethernet Cable.

Table 7-4 Pin assignment of the ETH and EXT interfaces

Front View Pin No. Usage

18 24 3567

1 Positive of twisted pair 1

2 Negative of twisted pair 1

3 Positive of twisted pair 2

4 Unspecified

5 Unspecified

6 Negative of twisted pair 2

7 and 8 Unspecified

Table 7-5 lists the pin assignment of the RJ-45 connector for the LAMP1 and LAMP2 interfaces.For cable corresponding to the interface, see 12.6 Cabinet Indicator Cable.

Table 7-5 Pin assignment of the LAMP1 and LAMP2 interfaces

Front View Pin No. Usage

18 24 3567

1 Positive for the critical alarms

2 Negative for the critical alarms

3 Positive for the minor alarms

4 Positive for power indication

5 Negative for power indication

6 Negative for the minor alarms

7 Positive for the major alarms

8 Negative for the major alarms

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Table 7-6 lists the pin assignment of the F&f interface. For cable corresponding to the interface,see 12.3.1 Ethernet Cable.

Table 7-6 Pin assignment of the F&f interface

Front View Pin No. Usage

18 24 3567

1 Transmit end of the commissioning serial port

2 Receive end of the commissioning serial port

3 Transmit end of OAM signals

4 Grounding

5 Grounding

6 Receive end of OAM signals

7 Grounding end

8 Grounding end

Table 7-7 lists the pin assignment of the CLK1 and CLK2 interfaces. For cable correspondingto the interface, see 12.5.1 External Clock Cable and 12.5.2 Clock Bridging Cable.

Table 7-7 Pin assignment of the CLK1 and CLK2 interfaces

Front View Pin No. Usage

18 24 3567

1 Negative receive end of 120-ohm external clock

2 Positive receive end of 120-ohm external clock

3 Unspecified

4 Negative transmit end of 120-ohm external clock

5 Positive transmit end of 120-ohm external clock

6 Unspecified

7 Unspecified

8 Unspecified

Table 7-8 lists the pin assignment of the RJ-45 connector for the ALMO interface. For cablecorresponding to the interface, see 12.7 Alarm Input/Output Cable.

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Table 7-8 Pin assignment of the ALMO interface

Front View Pin No. Usage

18 24 3567

1 Positive output end for alarm signal 1

2 Negative output end for alarm signal 1

3 Positive output end for alarm signal 2

4 Positive end for alarm concatenation signal 1

5 Negative end for alarm concatenation signal 1

6 Negative output end for alarm signal 2

7 Positive end for alarm concatenation signal 2

8 Negative end for alarm concatenation signal 2

Table 7-9 lists the pin assignment of the RJ-45 connector for the ALMI interface. For cablecorresponding to the interface, see 12.7 Alarm Input/Output Cable.

Table 7-9 Pin assignment of the ALMI interface

Front View Pin No. Usage

18 24 3567

1 Positive for alarm input 1

2 Negative for alarm input 1

3 Positive for alarm input 2

4 Positive for alarm input 3

5 Negative for alarm input 3

6 Negative for alarm input 2

7 Positive for alarm input 4

8 Negative for alarm input 4

7.1.6 Valid SlotsThe TN71CXP can be housed in any of slots 1 or slot 2 of the subrack.

CAUTIONWhen the OptiX PTN 1900 is configured with only one TN71CXP and the MD1 is required,insert the TN71CXP in slot 1.

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7.1.7 TPS Protection for BoardsThe TN71CXP provides the TPS protection for the service sub-board MD1.

The TN71CXP provides the TPS protection for the service sub-board MD1. For details, see5.1.6 TPS Protection for Boards

7.1.8 Board Configuration ReferenceFor the details of configuring the TN71CXP board, refer to the configuration of the insertedservice sub-boards.

7.1.9 Technical SpecificationsSpecifications of the TN71CXP board cover board dimensions, weight and power consumption.

Board dimensions (mm): 378.0 (H) x 266.8 (D) x 50.8 (W)

Weight (kg): 2.34

Power consumption (W): 73.3

7.2 TN72CXPThis section describes the TN72CXP, a system control, cross-connect and multiprotocolprocessing board, in terms of the version, function, feature, working principle, front panel, validslots, TPS protection, and technical specifications.

7.2.1 Version DescriptionThe function version of the TN72CXP is TN72.

7.2.2 Functions and FeaturesThe TN72CXP board supports functions such as system control and communication, serviceprocessing and grooming, and system clock and time processing.

7.2.3 Working Principle and Signal FlowThe TN72CXP consists of the control and communication module, service processing andgrooming module, service sub-board module, clock processing module and power supplymodule.

7.2.4 JumperThe TN72CXP provides jumpers for selecting the board starting mode and for enabling thebattery.

7.2.5 Front PanelOn the front panel of the TN72CXP, there are indicators, sub-slots, button and interfaces.

7.2.6 Valid SlotsThe TN72CXP can be housed in any of slots 1 or slot 2 of the subrack.

7.2.7 TPS Protection for BoardsThe TN72CXP provides the TPS protection for the service sub-board MD1.

7.2.8 Board Configuration ReferenceFor the details of configuring the TN72CXP board, refer to the configuration of the insertedservice sub-boards.

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7.2.9 Technical SpecificationsSpecifications of the TN72CXP board cover board dimensions, weight and power consumption.

7.2.1 Version DescriptionThe function version of the TN72CXP is TN72.

NOTE

The CXP has two function versions, TN71 and TN72. The difference between the two versions are asfollows:

l The TN72CXP supports external time interfaces.

l The TN72CXP supports the board version replacement function. That is, the TN72CXP can replacethe TN71CXP. When a board with a later version is used with a board with an earlier version on oneNE, if you query the board with a later version on the NMS, the logical version of the board with alater version is the same as that of the board with an earlier version.

In this document, the TN71CXP and TN72CXP are referred to as the CXP, unless otherwise specified.

7.2.2 Functions and FeaturesThe TN72CXP board supports functions such as system control and communication, serviceprocessing and grooming, and system clock and time processing.

The TN72CXP board mainly supports the following functions and features:l System control and communicationl Service processing and groomingl Clock synchronization and time synchronizationl 1+1 protection for the TN72CXP board and TPS protection for the service sub-board

7.2.3 Working Principle and Signal FlowThe TN72CXP consists of the control and communication module, service processing andgrooming module, service sub-board module, clock processing module and power supplymodule.

Figure 7-4 shows the block diagram for the working principle of the TN72CXP.

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Figure 7-4 Block diagram for the working principle of the TN72CXP

Clock Module

Power supply module

Control and communication module

12V...

0.75V

Service sub-board module

Service sub-board 1

Service sub-board 2

Service signal

Service signal

Service processing and switching module

Interface boards

Service sub-board module on another

CXP

Service signal

Interface boardsManagement bus

State management bus

State management bus

Interface boards/PIU/FAN

Working/protection backup bus

Working/protection management bus

Another CXP

Another CXP

ETH

EXT

Inter-board communication bus

F&f

ALMI/ALMO

LAMP1/LAMP2

CLK1/TOD1

CLK2/TOD2

External clock or time input/output

Another CXP

Another CXP

IEEE 1588V2 packets

Line clocks

Line clocks Interface boards

System clockInterface boards/Service

sub-board module/ Another CXP

-48V/-60V

-48V/-60V

PIU

PIU

Backplane

Interface boards

Another CXP

Backplane

Service signal

Another CXP

Another CXP

Another CXP

Service signal

External clock or time input/output

.

.

.

Control and Communication Module

This module performs the following functions.

l Realizes configuration of boards and services.l Processes protocol packets.l Monitors the system status and collects data on alarms and performance events.l If two TN72CXP boards are configured, the working and protection TN72CXP boards

monitor the status of each other. If the working TN72CXP fails, this module controls theswitching of the working and protection TN72CXP boards. In this way, the TN72CXP gets1+1 protection.

l Monitors the status of the PIU and the status of the system power supply accessed from thePIU.

l Monitors the status of the fan boards, provides fan alarms and manage fans.l Provides ETH, a 10M/100M auto-negotiation Ethernet interface to connect to the U2000.l Provides EXT, a 10M/100M auto-negotiation Ethernet extended interface.l Provides LAMP1, an interface for 4 x cabinet alarm indicators output.l Provides LAMP2, an interface for 4 x alarm indicators concatenation.

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l Provides ALMI, an interface for 4 x alarm inputs.l Provides ALMO, a common interface for 2 x alarm outputs and 2 x alarm concatenations.l Provides F&f, an administration and maintenance (OAM) interface, which is used to

connect the TN72CXP to a PC or workstation.

Service Processing and Grooming Module

This module performs the following functions.

l Processes FE services accessed from the ETFC and EFF8, POS services accessed from thePOD41, ATM STM-1 services accessed from the AFO1, or GE services accessed from theEFG2.

l Provides two service sub-slots and process different services accessed from E1, channelizedSTM-1 interfaces or ATM STM-1 interfaces with different sub-boards housed.

l Grooms services of 10 Gbit/s cross-connect capacity.l Provides the hierarchical QoS to ensure quality of services.

Service Sub-Board Module

On the TN72CXP, there are two sub-slots for service boards, which are independent from eachother. The TN72CXP supports the following service sub-boards.

l MD1l AD1l CD1

Clock Processing Module

This module performs the following functions.

l Traces the external clock source, line clock source, and provide the synchronous clocksource for the equipment.

NOTE

The external clock source includes the external clock signals accessed from this TN72CXP andanother one.

l Provides two combined interface for input or output of 120-ohm clock/time signals. Inputsor outputs the 2 MHz or 2 Mbit/s clock.

l Supports the IEEE 1588V2 protocol.l Supports the 1588 ACR clock.

Power Supply Module

This module converts the input DC voltage into various DC voltages required by each moduleon the board.

7.2.4 JumperThe TN72CXP provides jumpers for selecting the board starting mode and for enabling thebattery.

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CAUTIONDo not change the default setting of the jumpers. Otherwise, the board may become faulty.

The following jumpers are present on the TN72CXP board:

l J2, which is used to enable the battery. Figure 7-5 shows where J2 is located on theTN72CXP.

l J42, which is used to select the board starting mode. J2 corresponds to DEBUG4-DEBUG1,which form a line in the left-to-right order and indicate a four-bit binary numeral. The mostleft one bit of this binary numeral is the high bit. Refer to Table 7-11. Figure 7-5 showswhere J42 is located on the TN72CXP.

l J6, which is used to load the control program. J6 is only for the board commissioning beforethe delivery.

NOTE

TN72CXP consists of two boards (upper one and lower one). J2 is located on the upper board, and J6 andJ42 is located on the lower board.

Figure 7-5 J2 on the TN72CXP

J2123

J424 3 2 1

J64 3 2 1

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Table 7-10 lists details on the jumpers on the TN72CXP.

Table 7-10 Jumpers on the TN72CXP

Jumper Function Description

J2 Enables the battery. The jumper cap is inserted in 1-2 by default, the batteryis enabled. In this manner, the real-time clock does notlost after the board is powered off.

J42 Selects the boardstarting mode.

If the jumper is not capped, the corresponding bit is "0".If the jumper is capped, the corresponding bit is "1".The bits form a line in the high-to-low order andindicate a four-bit binary numeral. The most left one bitof this binary numeral is the high bit. See Table 7-11.

Table 7-11 J42 jumpers

DEBUG4

DEBUG3

DEBUG2

DEBUG1

CorrespondingValue

Description

0 0 0 0 0000 Indicates the running state, the default state,where the watchdog is enabled.

0 0 1 1 0011 Indicates the debugging state.

0 1 0 0 0100 Indicates the running state where thewatchdog is disabled.

0 1 0 1 0101 Indicates the maintenance state.

0 1 1 0 0110 Indicates the emulation running state.

1 0 1 1 1011 Erases file system, the extended BIOS andsystem parameter field.

1 1 0 0 1100 Erases file system.

1 1 0 1 1101 Erases the database, NE software (patchincluded).

1 1 1 0 1110 Erases the NE software (patch included).

1 1 1 1 1111 Erases the database.

1 0 1 0 1010 Recovers the system parameter field asdefault.

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7.2.5 Front PanelOn the front panel of the TN72CXP, there are indicators, sub-slots, button and interfaces.

Appearance of the Front PanelFigure 7-6 shows the appearance of the front panel of the TN72CXP.

Figure 7-6 Appearance of the front panel of the TN72CXP

IndicatorThe following indicators are present on the front panel of the CXP.

l STAT indicator, red, green, or orange, which indicates the working statusl PROG indicator, red or green, which indicates the running status of the programl SRV indicator, red, green, or orange, which indicates the service statusl ACTX indicator, green, which indicates the cross-connection or clock active/standby statusl ACTC indicator, green, which indicates the active/standby system control boardl SYNC indicator, red or green, which indicates the clock synchronization status

For details on indications of indicators, see A.2 Board Indicators.

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Board reset button

The reset button is marked as RESET on the front panel of the board. The RESET button is usedfor cold reset of the TN72CXP.

Sub-Slot

The TN72CXP has two sub-slots, which are used to house one service sub-board respectively.

When only one TN72CXP is configured on the OptiX PTN 1900, select two service sub-boardsfor the two sub-slots as required. When two TN72CXP are configured on the OptiX PTN 1900,use service sub-boards by adhering to the following principles.

l Slot 1-1 and slot 2-1 form a TPS protection group. Slot 1-2 and slot 2-2 form another TPSprotection group. The two TPS protection groups are independent from each other.

l You can insert one service sub-board in either of the two sub-slots of each protection group.In this way, the protection group has no protection.

l You can insert two MD1 boards in the two sub-slots of each protection group. In this way,the service sub-boards are of 1:1 TPS protection.

l Do not insert different sub-boards in the two sub-slots of the each protection group.

l If slot 1-1 and slot 2-1 are not configured as a protection group, slot 1-1 and slot 2-1 canhouse different sub-boards.

NOTESlot x-y indicates the sub-slot y (service sub-board y) on the TN72CXP housed in slot x. For example, slot1-2 indicates the service sub-slot 2 (sub-board 2) on the TN72CXP housed in the first slot .

Auxiliary Interface

Table 7-12 lists the types and usage of the interfaces of the TN72CXP.

Table 7-12 Types and usage of the interfaces on the TN72CXP

Interface on theFront Panel

Interface Type Usage

ETH RJ-45 10M/100M autosensing Ethernet interface forconnecting to the NMS

EXT RJ-45 10M/100M autosensing Ethernet interface usingas an NMS concatenation interface

LAMP1 RJ-45 Interface for outputting cabinet indicators

LAMP2 RJ-45 Interface for concatenating cabinet indicators

F&f RJ-45 OAM serial interface

CLK1/TOD1 RJ-45 Common interface for outputting and inputtingthe 120-ohm external clock/time

CLK2/TOD2 RJ-45 Common interface for outputting and inputtingthe 120-ohm external clock/time

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Interface on theFront Panel

Interface Type Usage

ALMO RJ-45 Common interface for 2 x alarm outputs and 2 xalarm concatenations

ALMI RJ-45 Interface for inputting the first to fourth channelsof alarms

CAUTIONDo not connect the ETH and EXT interfaces on one NE to the same PC.If two CXP boards are configured on the same NE, do not use the ETH or EXT interfaces onboth the working and protection CXP boards.

Table 7-13 lists the pin assignment of the ETH and EXT. These interfaces support auto-adaptation to a straight-through network cable or a crossover network cable. For cablecorresponding to the interface, see 12.3.1 Ethernet Cable.

Table 7-13 Pin assignment of the ETH and EXT interfaces

Front View Pin No. Usage

18 24 3567

1 Positive of twisted pair 1

2 Negative of twisted pair 1

3 Positive of twisted pair 2

4 Unspecified

5 Unspecified

6 Negative of twisted pair 2

7 and 8 Unspecified

Table 7-14 lists the pin assignment of the RJ-45 connector for the LAMP1 and LAMP2interfaces. For cable corresponding to the interface, see 12.6 Cabinet Indicator Cable.

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Table 7-14 Pin assignment of the LAMP1 and LAMP2 interfaces

Front View Pin No. Usage

18 24 3567

1 Positive for the critical alarms

2 Negative for the critical alarms

3 Positive for the minor alarms

4 Positive for power indication

5 Negative for power indication

6 Negative for the minor alarms

7 Positive for the major alarms

8 Negative for the major alarms

Table 7-15 lists the pin assignment of the F&f interface. For cable corresponding to the interface,see 12.3.1 Ethernet Cable.

Table 7-15 Pin assignment of the F&f interface

Front View Pin No. Usage

18 24 3567

1 Transmit end of the commissioning serial port

2 Receive end of the commissioning serial port

3 Transmit end of OAM signals

4 Grounding

5 Grounding

6 Receive end of OAM signals

7 Grounding end

8 Grounding end

Table 7-16 lists the pin assignment of the CLK1/TOD1 and CLK2/TOD2 interfaces. For cablecorresponding to the interface, see 12.5.1 External Clock Cable and 12.5.2 Clock BridgingCable.

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Table 7-16 Pin assignment of the CLK1/TOD1 and CLK2/TOD2 interfaces

Front View PinNo.

Working Mode

ExternalClock

ExternalTime Input(1PPS + TimeInformation)

ExternalTimeOutput(1PPS +TimeInformation)

ExternalTime input(DCLS)

ExternalTimeoutput(DCLS)

18 24 3567

1 Negativereceive endof 120-ohmexternalclock

Unspecified Unspecified Unspecified Unspecified

2 Positivereceive endof 120-ohmexternalclock

Unspecified Unspecified Unspecified Unspecified

3 Unspecified NegativeRS422 inputfor the 1ppssignal

NegativeRS422 outputfor the 1ppssignal

NegativeRS422 inputfor the DCLStime signal

NegativeRS422 outputfor the DCLStime signal

4 Negativetransmit endof 120-ohmexternalclock

Grounding end Groundingend

Groundingend

Groundingend

5 Positivetransmit endof 120-ohmexternalclock

Grounding end Groundingend

Groundingend

Groundingend

6 Unspecified PositiveRS422 inputfor the 1ppssignal

PositiveRS422 outputfor the 1ppssignal

PositiveRS422 inputfor the DCLStime signal

PositiveRS422 outputfor the DCLStime signal

7 Unspecified NegativeRS422 inputfor timeinformation

NegativeRS422 outputfor timeinformation

Unspecified Unspecified

8 Unspecified PositiveRS422 inputfor timeinformation

PositiveRS422 outputfor timeinformation

Unspecified Unspecified

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NOTE

The CLK1/TOD1 and CLK2/TOD2 interfaces can only be configured to one of the five working modes.

Table 7-17 lists the pin assignment of the RJ-45 connector for the ALMO interface. For cablecorresponding to the interface, see 12.7 Alarm Input/Output Cable.

Table 7-17 Pin assignment of the ALMO interface

Front View Pin No. Usage

18 24 3567

1 Positive output end for alarm signal 1

2 Negative output end for alarm signal 1

3 Positive output end for alarm signal 2

4 Positive end for alarm concatenation signal 1

5 Negative end for alarm concatenation signal 1

6 Negative output end for alarm signal 2

7 Positive end for alarm concatenation signal 2

8 Negative end for alarm concatenation signal 2

Table 7-18 lists the pin assignment of the RJ-45 connector for the ALMI interface. For cablecorresponding to the interface, see 12.7 Alarm Input/Output Cable.

Table 7-18 Pin assignment of the ALMI interface

Front View Pin No. Usage

18 24 3567

1 Positive for alarm input 1

2 Negative for alarm input 1

3 Positive for alarm input 2

4 Positive for alarm input 3

5 Negative for alarm input 3

6 Negative for alarm input 2

7 Positive for alarm input 4

8 Negative for alarm input 4

7.2.6 Valid SlotsThe TN72CXP can be housed in any of slots 1 or slot 2 of the subrack.

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CAUTIONWhen the OptiX PTN 1900 is configured with only one TN72CXP and the MD1 is required,insert the TN72CXP in slot 1.

7.2.7 TPS Protection for BoardsThe TN72CXP provides the TPS protection for the service sub-board MD1.

The TN72CXP provides the TPS protection for the service sub-board MD1. For details, see5.1.6 TPS Protection for Boards

7.2.8 Board Configuration ReferenceFor the details of configuring the TN72CXP board, refer to the configuration of the insertedservice sub-boards.

7.2.9 Technical SpecificationsSpecifications of the TN72CXP board cover board dimensions, weight and power consumption.

Board dimensions (mm): 378.0 (H) x 266.8 (D) x 50.8 (W)

Weight (kg): 2.36

Power consumption (W): 80.3

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8 Power Supply and Fan Boards

About This Chapter

This chapter describes the power supply boards and fan boards, used for the OptiX PTN 1900in terms of the version, function, working principle, front panel, valid slots and technicalspecifications.

8.1 PIUThis section describes the PIU, used for the OptiX PTN 1900 in terms of the version, function,feature, working principle, front panel, valid slots and technical specifications.

8.2 FANAThis section describes the FANA, used for the OptiX PTN 1900, in terms of the version, function,feature, working principle, front panel, valid slots and technical specifications.

8.3 FANBThis section describes the FANB, used for the OptiX PTN 1900, in terms of the version, function,feature, working principle, front panel, valid slots and technical specifications.

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8.1 PIUThis section describes the PIU, used for the OptiX PTN 1900 in terms of the version, function,feature, working principle, front panel, valid slots and technical specifications.

8.1.1 Version DescriptionThe function version of the PIU is TN71.

8.1.2 Functions and FeaturesThe PIU, a power interface unit, is used to access power, protect the equipment against lightningand perform filter.

8.1.3 Working Principle and Signal FlowThe PIU mainly consists of the power access module, lightning protection and filter module,power supply module, start-delay module and alarm detection module.

8.1.4 Front PanelOn the front panel of the PIU, there are power interfaces, indicators and label.

8.1.5 Valid SlotsThe PIU can be housed in slot 8 or slot 9 of the subrack.

8.1.6 Technical SpecificationsSpecifications of the PIU board cover board dimensions, weight, power consumption, thermaldesign consumption and input voltage.

8.1.1 Version DescriptionThe function version of the PIU is TN71.

8.1.2 Functions and FeaturesThe PIU, a power interface unit, is used to access power, protect the equipment against lightningand perform filter.

Table 8-1 lists functions and features of the PIU.

Table 8-1 Functions and features of the PIU

Function and Feature Description

Power interface Provides one channel of -48 V or -60 V DC power supply for theequipment In addition, provides the 12 V power supply for the fanboard and interface board.

Protection againstlightning

Protects the equipment against lightning and report alarms if theprotection fails.

Filter Provides power filtering function and perform structure shield forthe board to enhance the electromagnetic compatibility of thesystem.

Alarm monitoring Detects and reports power alarms.

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Function and Feature Description

Power backup Two PIU boards can provide 1+1 hot backup. One PIU can supplyrequired power for the entire subrack.

8.1.3 Working Principle and Signal FlowThe PIU mainly consists of the power access module, lightning protection and filter module,power supply module, start-delay module and alarm detection module.

Figure 8-1 shows the block diagram for the working principle of the PIU.

Figure 8-1 Block diagram for the working principle of the PIU

Backplane

12 V

-48 V/ -60V

-48V/ -60V

Power access module

Lightning protection andfilter module

Alarm detection module

Start-delay module

Power supply module

Alarm detection bus

-48 V/ -60V

XCS

Power Access Module

This module accesses the -48 V DC or -60 V DC power output by the DC PDU.

Lightning Protection and Filter Module

This module protects the equipment against lightning.

Power Supply Module

This module consists of 12 V power units and supplies power for fans and interface boards.

Start-Delay Module

This module performs the buffer function for circuits. This module also provides -48 V powersupply.

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Alarm Detection Module

This module detects the lightning protection failure, overvoltage and undervoltage of the powersupply, and reports the results to the system control unit.

8.1.4 Front PanelOn the front panel of the PIU, there are power interfaces, indicators and label.

Appearance of the Front Panel

Figure 8-2 shows the appearance of the front panel of the PIU.

Figure 8-2 Appearance of the front panel of the PIU

Indicators

The following indicators are present on the front panel of the PIU.

l PWR indicator, green, which indicates the power statusl ALM indicator, red, which indicates a fault of the power supply board

For details on indications of indicators, see A.2 Board Indicators.

Interfaces

Interfaces for one channel of power supply are present on the front panel of the PIU. Table8-2 lists the types and usage of the interfaces. For cable corresponding to the interface, see 12.3.275-ohm 8 x E1 Cable.

Table 8-2 Types and usage of the interfaces on the PIU

Interface on the Front Panel Usage

RTN(+) Input BGND power.

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Interface on the Front Panel Usage

NEG(-) Input -48 V power.

Label

No hot plug label: It indicates that do not insert or remove the component when the power is on.

8.1.5 Valid SlotsThe PIU can be housed in slot 8 or slot 9 of the subrack.

8.1.6 Technical SpecificationsSpecifications of the PIU board cover board dimensions, weight, power consumption, thermaldesign consumption and input voltage.

Board dimensions (mm): 108.6 (height) x 157.1 (depth) x 55.0 (width)

Weight (kg): 0.62

Power consumption (W): 7.0

Input voltage range (V DC):

-38.4 to -57.6 (-48 V power supply)

-48.0 to -72.0 (-60 V power supply)

8.2 FANAThis section describes the FANA, used for the OptiX PTN 1900, in terms of the version, function,feature, working principle, front panel, valid slots and technical specifications.

8.2.1 Version DescriptionThe function version of the FANA is TN71.

8.2.2 Functions and FeaturesThe FANA is used to adjust the fan rotating speed and detect states of fans.

8.2.3 Working Principle and Signal FlowThe FANA mainly consists of the start-delay/combiner module, fan speed adjustment moduleand management module.

8.2.4 Front PanelOn the front panel of the FANA, there are indicators and Fan warning label.

8.2.5 Valid SlotsThe FANA can be housed in slot 10 of the subrack.

8.2.6 Technical SpecificationsSpecifications of the FANA board cover board dimensions, weight, power consumption andworking voltage.

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8.2.1 Version DescriptionThe function version of the FANA is TN71.

8.2.2 Functions and FeaturesThe FANA is used to adjust the fan rotating speed and detect states of fans.

The FANA has the following functions and features.

l Dissipates heat for the system.

l Controls the fan rotating speed according to signals sent by the system control unit.

l Indicatse the running state of the FANA and alarms according to signals sent by the systemcontrol unit.

l Reports signals indicating the fan rotating speed to the system control unit.

l Provides in-position signals of the FANA and board version number.

l Provides alarm indicators, including system alarm indicators and board state indicators.

l Provides functions of testing alarms and cutting alarms.

8.2.3 Working Principle and Signal FlowThe FANA mainly consists of the start-delay/combiner module, fan speed adjustment moduleand management module.

The FANA consists of four fans.

Figure 8-3 shows the block diagram for the working principle of the FANA.

Figure 8-3 Block diagram for the working principle of the FANA

CXP

12V

12V

12V

3.3V

Backplane outputBackplane input

Speed 1~4

Start-delay/combiner module

Start delay

Start delay

Combining

Fan speed adjustmentmodule

Management module CXP

CXP

fan

Start-Delay/Combiner Module

This module combines two channels of 12 V power supplies that pass the start-delay circuits. Ifstart-delay of one channel of the power supply fails, the fans can still work normally.

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Fan Speed Adjustment ModuleThis module is controlled by the system control unit. The system control unit issues signals toadjust the fan rotating speed.

Management ModuleThis module manages fan alarms and manufacturing information.

8.2.4 Front PanelOn the front panel of the FANA, there are indicators and Fan warning label.

Appearance of the Front PanelFigure 8-4 shows the appearance of the front panel of the FANA.

Figure 8-4 Appearance of the front panel of the FANA

IndicatorsThe following indicators are present on the front panel of the FANA.

l CRIT indicator, red, which indicates critical alarmsl MAJ indicator, orange, which indicates major alarmsl MIN indicator, yellow, which indicates minor alarmsl ALMC indicator, orange, which indicate alarm cutting

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l STAT indicator, red or green, which indicates the fan status

For details on indications of indicators, see A.2 Board Indicators.

ButtonTwo buttons are present on the front panel.

l One is the LAMP TEST button, which is used to test the indicators of the equipment. Whenyou press the LAMP TEST button, the board indicators except the Ethenet service electricalinterface indicators and the L/A indicators of the EFF8 should be on.

l The other is the ALM CUT button, which is used for cutting off subrack audio alarms. IfALM CUT button is pressed down for then released immediately, the indicator of thecurrent audio alarm is muted. If you press the ALM CUT button for more than three seconds,the audio alarm is muted permanently, and the ALMC indicator is on. If you press the ALMCUT button for more than three seconds again, the mute function of the audible alarm ispermanently canceled, and the ALMC indicator is off.

Fan Warning LabelFan warning label indicates that do not touch the fan leaves before the fan stops.

8.2.5 Valid SlotsThe FANA can be housed in slot 10 of the subrack.

8.2.6 Technical SpecificationsSpecifications of the FANA board cover board dimensions, weight, power consumption andworking voltage.

Board dimensions (mm): 111.0 (height) x 148.8 (depth) x 45.4 (width)

Weight (kg): 0.56

Power consumption (W)

l Low rate: 8.0l Medium rate: 12.0l High rate: 21.0

Working voltage: 12 V

8.3 FANBThis section describes the FANB, used for the OptiX PTN 1900, in terms of the version, function,feature, working principle, front panel, valid slots and technical specifications.

8.3.1 Version DescriptionThe function version of the FANB is TN71.

8.3.2 Functions and FeaturesThe FANB is used to adjust the fan rotating speed and detect states of fans.

8.3.3 Working Principle and Signal Flow

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The FANB mainly consists of the start-delay/combiner module, fan speed adjustment moduleand management module.

8.3.4 Front PanelOn the front panel of the FANB, there are indicators Fan warning label.

8.3.5 Valid SlotsThe FANB can be housed in slot 11 of the subrack.

8.3.6 Technical SpecificationsSpecifications of the FANB board cover board dimensions, weight, power consumption andworking voltage.

8.3.1 Version DescriptionThe function version of the FANB is TN71.

8.3.2 Functions and FeaturesThe FANB is used to adjust the fan rotating speed and detect states of fans.

The FANB has the following functions and features.

l Dissipates heat for the system.l Controls the fan rotating speed according to signals sent by the system control unit.l Indicates the running state of the FANB and alarms according to signals sent by the system

control unit.l Reports signals indicating the fan rotating speed to the system control unit.l Provides in-position signals of the FANB and board version number.l Provides alarm indicators.

8.3.3 Working Principle and Signal FlowThe FANB mainly consists of the start-delay/combiner module, fan speed adjustment moduleand management module.

The FANB consists of eight fans.

Figure 8-5 shows the block diagram for the working principle of the FANB.

Figure 8-5 Block diagram for the working principle of the FANB

CXP

12V

12V

12V

3.3V

Backplane outputBackplane input

Speed 1 - 8

Start-delay/combiner module

Start delay

Start delay

Combining

Fan speed adjustmentmodule

Management module CXP

CXP

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Start-Delay/Combiner ModuleThis module combines two channels of 12 V power supplies that pass the start-delay circuits. Ifstart-delay of one channel of the power supply fails, the fans can still work normally.

Fan Speed Adjustment ModuleThis module is controlled by the system control unit. The system control unit issues signals toadjust the fan rotating speed.

Management ModuleThis module manages fan alarms and manufacturing information.

8.3.4 Front PanelOn the front panel of the FANB, there are indicators Fan warning label.

Appearance of the Front PanelFigure 8-6 shows the appearance of the front panel of the FANB.

Figure 8-6 Appearance of the front panel of the FANB

IndicatorsOne indicator is present on the front panel of the FANB.

l STAT indicator, red or green, which indicates the fan status

For details on indications of indicators, see A.2 Board Indicators.

Fan warning labelFan warning label indicates that do not touch the fan leaves before the fan stops.

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8.3.5 Valid SlotsThe FANB can be housed in slot 11 of the subrack.

8.3.6 Technical SpecificationsSpecifications of the FANB board cover board dimensions, weight, power consumption andworking voltage.

Board dimensions (mm): 102.6 (height) x 258.7 (depth) x 44.4 (width)

Weight (kg): 0.8

Power consumption (W)

l Low rate: 12.0l Medium rate: 19.0l High rate: 35.0

Working voltage: 12 V

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9 Filler Panel

About This Chapter

A filler panel is used to cover any idle slot in a subrack.

9.1 Functions and FeaturesA filler panel can be used to perform electromagnetic shielding, keep out foreign substances,and ensure proper ventilation.

9.2 Appearance and Valid SlotsThere is no indicator or interface on a filler panel.There are various dimensions for filler panels,and filler panels of different dimensions can be housed in different slots.

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9.1 Functions and FeaturesA filler panel can be used to perform electromagnetic shielding, keep out foreign substances,and ensure proper ventilation.

Main functions of a filler panel are as follows:

l Performs electromagnetic shielding and ensures that the subrack meets the requirement ofelectromagnetic radiation.

l Prevents foreign substances from getting into the subrack.l Prevents internal voltage and current from being exposed.l Ensures proper ventilation of cooling current inside the subrack.

9.2 Appearance and Valid SlotsThere is no indicator or interface on a filler panel.There are various dimensions for filler panels,and filler panels of different dimensions can be housed in different slots.

Appearance

Figure 9-1 show appearances of filler panels of different types.

Figure 9-1 Appearances of filler panels

1 2 3 4

1. Filler panel for an integrated board of the system control, cross-connect, and timing units2. Filler panel for an interface board3. Filler panel for a service sub-board4. Filler panel for a power supply board

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Valid SlotsDifferent types of filler panels are housed in different areas in subracks. Table 9-1 lists the validslots for filler panels.

Table 9-1 Valid slots for filler panels

Filler Panel Valid Slots

Filler panel for an integrated board of thesystem control, cross-connect, and timingunits

Slots 1-2

Filler panel for an interface board Slots 3-7

Filler panel for a service sub-board Sub-slots on the CXP

Filler panel for a power supply board Slots 8-9

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10 Pluggable Optical Modules

About This Chapter

Optical interface boards for the OptiX PTN 1900 use the enhanced small form-factor pluggable(eSFP) optical module.

The eSFP optical module, which is a protocol-independent optical transceiver applicable tooptical communication, implements O/E and E/O conversion for signals, and supports query ofinformation such as the transceiver performance and manufacturer.

10.1 Appearance and ApplicationThe eSFP optical module can be inserted in GE, FE, STM-4, and STM-1 optical interfaces.

10.2 Optical Module LabelsOptical module labels, stuck on the back of optical modules, are used to distinguish differenttypes of optical modules.

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10.1 Appearance and ApplicationThe eSFP optical module can be inserted in GE, FE, STM-4, and STM-1 optical interfaces.

AppearanceFigure 10-1 shows the appearance of the eSFP optical module.

Figure 10-1 Appearance of the eSFP optical module

ApplicationTable 10-1 lists the boards where the eSFP optical module is applicable.

Table 10-1 Boards where the eSFP optical module is applicable

Board Type Board Name

GE optical interface board EFG2

FE optical interface board EFF8

STM-4 optical interface board POD41

STM-1 optical interface board POD41, AFO1, AD1, CD1

10.2 Optical Module LabelsOptical module labels, stuck on the back of optical modules, are used to distinguish differenttypes of optical modules.

Figure 10-2 shows the optical module labels.

Figure 10-2 Optical module labels

1.25G-80km-1550nm34060360

Optical module part number

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As shown in Table 10-2, different types of optical modules have different part numbers.

Table 10-2 Part numbers and types of optical modules

Optical ModulePart Numbers

Optical interfacetype

Optical Module Basic Information Mapping Board

34060286 1000BASE-SX(0.5 km)

Optical Transceiver, eSFP, 850 nm, 2.125 Gbit/s (Multi rate), LC, Multi-mode, 0.5 km

EFG2

34060473 1000BASE-LX(10 km)

Optical transceiver, eSFP, 1310 nm, 1.25 Gbit/s, LC, Single-mode, 10 km

34060298 1000BASE-VX(40 km)

Optical Transceiver, eSFP, 1310 nm, 1.25 Gbit/s, LC, Single-mode, 40 km

34060360 1000BASE-ZX(80 km)

Optical Transceiver, eSFP, 1550 nm, 1.25 Gbit/s, LC, Single-mode, 80 km

34060483 1000BASE-CWDM(80 km)

Optical transceiver, eSFP, 1471 nm, 100 Mbit/s to 2.67 Gbit/s, LC, Single-mode, 80 km

34060481 1000BASE-CWDM(80 km)

Optical transceiver, eSFP, 1491 nm, 100 Mbit/s to 2.67 Gbit/s, LC, Single-mode, 80 km

34060479 1000BASE-CWDM(80 km)

Optical transceiver, eSFP, 1511 nm, 100 Mbit/s to 2.67 Gbit/s, LC, Single-mode, 80 km

34060482 1000BASE-CWDM(80 km)

Optical transceiver, eSFP, 1531 nm, 100 Mbit/s to 2.67 Gbit/s, LC, Single-mode, 80 km

34060478 1000BASE-CWDM(80 km)

Optical transceiver, eSFP, 1551 nm, 100 Mbit/s to 2.67 Gbit/s, LC, Single-mode, 80 km

34060476 1000BASE-CWDM(80 km)

Optical transceiver, eSFP, 1571 nm, 100 Mbit/s to 2.67 Gbit/s, LC, Single-mode, 80 km

34060477 1000BASE-CWDM(80 km)

Optical transceiver, eSFP, 1591 nm, 100 Mbit/s to 2.67 Gbit/s, LC, Single-mode, 80 km

34060480 1000BASE-CWDM(80 km)

Optical transceiver, eSFP, 1611 nm, 100 Mbit/s to 2.67 Gbit/s, LC, Single-mode, 80 km

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Optical ModulePart Numbers

Optical interfacetype

Optical Module Basic Information Mapping Board

34060277 S-4.1(15 km)

Optical transceiver, eSFP, 1310 nm, STM4, LC,Single-mode, 15 km

POD41

34060280 L-4.1(40 km)

Optical transceiver, eSFP, 1310 nm, STM4, LC,Single-mode, 40 km

34060284 L-4.2(80 km)

Optical transceiver, eSFP, 1550 nm, STM4, LC,Single-mode, 80 km

34060276 100BASE-FX(15 km)

Optical Transceiver, eSFP, 1310 nm, STM1,LC, Single-mode, 15 km

EFF8AFO1AD1CD1POD41

S-1.1(15 km)

34060281 100BASE-FX(40 km)

Optical Transceiver, eSFP, 1310 nm, STM1,LC, Single-mode, 40 km

L-1.1(40 km)

34060282 100BASE-FX(80 km)

Optical Transceiver, eSFP, 1550 nm, STM1,LC, Single-mode, 80 km

L-1.2(80 km)

34060475 1000BASE-BX(10 km)

Optical Transceiver, eSFP, Tx 1490 nm/Rx1310 nm, 1.25 Gbit/s, LC, Single-mode, 10 km

EFG2

34060470 1000BASE-BX(10 km)

Optical Transceiver, eSFP, Tx 1310 nm/Rx1490 nm, 1.25 Gbit/s, LC, Single-mode, 10 km

34060364 100BASE-BX(10 km)

Optical Transceiver, eSFP, Tx 1550 nm/Rx1310 nm, STM1, LC, Single-mode, 15 km

EFF8AFO1AD1CD1POD41

S-1.1(15 km)

34060363 100BASE-BX(10 km)

Optical Transceiver, eSFP, Tx 1310 nm/Rx1550 nm, STM1, LC, Single-mode, 15 km

S-1.1(15 km)

34060329 100BASE-BX(40 km)

Optical Transceiver, eSFP, Tx 1550 nm/Rx1310 nm, STM1, LC, Single-mode, 40 km

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Optical ModulePart Numbers

Optical interfacetype

Optical Module Basic Information Mapping Board

L-1.1(40 km)

34060328 100BASE-BX(40 km)

Optical Transceiver, eSFP, Tx 1310 nm/Rx1550 nm, STM1, LC, Single-mode, 40 km

L-1.1(40 km)

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11 Pluggable Electrical Module

A pluggable electrical module is used at a GE SFP interface to transmit/receive GE electricalsignals.

AppearanceFigure 11-1 shows the appearance of the SFP electrical module.

Figure 11-1 Appearance of the GE SFP electrical module

Part NumberTable 11-1 lists the part number and the type of the pluggable module.

Table 11-1 Part number and type of electrical module

ElectricalModule PartNumbers

Electricalinterface type

Electrical Module BasicInformation

Mapping Board

34100052 1000BASE-T 1000BASE-T (RJ45) SFPElectrical Module, 100m

EFG2

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12 Cables

About This Chapter

This chapter describes the cables used for the equipment. The cables include the fiber, powersupply cables, grounding cables, service cables, management cables, clock cables, indicator andalarm cables.

12.1 FiberThis section mainly describes the types of fiber and connectors.

12.2 Power Supply Cable and Grounding CableThe power supply cable and grounding cable include the cabinet power supply wire, subrackpower supply wire, power supply wire that connects the external equipment, and cabinet doorgrounding cable.

12.3 Service CableThe service cable includes the Ethernet cable, 75-ohm 8 x E1 cable and 120-ohm 8 x E1 cable.

12.4 Management CableThe management cable includes straight through cable and crossover cable.

12.5 Clock CableThe clock cable includes the 120-ohm clock cable. The clock cable is used to input and outputexternal clock signals.

12.6 Cabinet Indicator CableThe cabinet indicator cable is used to connect the CXP board on the OptiX PTN 1900 and thecabinet indicators. It transmits the indicator signals output by the CXP to the cabinet indicator.

12.7 Alarm Input/Output CableThe alarm input cable is used to input the alarm signals of the external equipment to the OptiXPTN 1900 equipment. The alarm output cable is used to output the alarm signals to the centralalarm monitoring equipment.

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12.1 FiberThis section mainly describes the types of fiber and connectors.

12.1.1 Types of FiberThe OptiX PTN 1900 equipment can use various types of fiber.

12.1.2 ConnectorThe OptiX PTN 1900 equipment can use various types of connectors.

12.1.1 Types of FiberThe OptiX PTN 1900 equipment can use various types of fiber.

Table 12-1 lists the types of fiber used by the OptiX PTN 1900 equipment.

Table 12-1 Types of Fiber

Usage Connector 1 Connector 2 Cable Length

Connects theOptiX PTN1900 to theODF orconnects theinterfaceboard of theOptiX PTN1900 to otherequipment

LC/PC FC/PC 2 mm single-mode opticalfiber

6 m, 10 m, 20 m, 30m, 50 m

2 mm multi-mode opticalfiber

3 m, 5 m, 10 m, 20m, 30 m, 50 m

LC/PC SC/PC 2 mm single-mode opticalfiber

5 m, 10 m, 20 m, 30m, 50 m

2 mm multi-mode opticalfiber

10 m, 20 m, 30 m, 50m

Connectsfibersbetween theOptiX PTN1900

LC/PC LC/PC 2 mm single-mode opticalfiber

1.5 m, 3 m, 5 m, 6 m,10 m, 20 m, 30 m, 50m

2 mm multi-mode opticalfiber

3 m, 5 m, 10 m, 20m, 30 m, 50m

Select the fiber connector and the fiber length according to the on-site survey.

12.1.2 ConnectorThe OptiX PTN 1900 equipment can use various types of connectors.

The fiber connectors can be classified into three types.

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l Interfaces on the boards require the LC/PC optical connectors. Figure 12-1 shows the LC/PC optical connector.

l The ODF at the client side uses the FC/PC or SC/PC optical connectors. Figure 12-2 andFigure 12-3 show the corresponding FC/PC and SC/PC optical connectors.

Table 12-2 lists details of the three fiber connectors.

Table 12-2 Fiber Connector

Fiber Connector Description

LC/PC Plug-in square fiber connector/protruding polished

FC/PC Round fiber connector/protruding polished

SC/PC Square fiber connector/protruding polished

LC/PCFigure 12-1 shows the appearance of the LC/PC optical connector.

Figure 12-1 LC/PC optical connector

The axial operation instead of rotation is required to insert or remove the LC/PC opticalconnector. The specific operation is as follows:

l To insert the fiber into the LC/PC connector, align the head of the fiber with the opticalinterface, and then push the fiber with proper strength into the connector.

l To remove the LC/PC fiber, first press the clip, and then push fiber connector inwardslightly, and pull out the connector.

FC/PCFigure 12-2 shows the appearance of the FC/PC optical connector.

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Figure 12-2 FC/PC optical connector

When inserting or removing the FC/PC optical connector, do as follows.

l To insert the fiber into the FC/PC connector, align the head of the fiber with the opticalinterface on the optical interface board carefully, to avoid damaging the internal ceramicpipe. After inserting the fiber to the bottom of the optical interface, clockwise rotate theexternal screw to tighten the fiber into the optical interface.

l To remove the fiber, first anticlockwise rotate the external screw of the optical interface.When the screw is loosened, remove the fiber with proper strength from the opticalinterface.

SC/PCFigure 12-3 shows the appearance of the SC/PC optical connector.

Figure 12-3 SC/PC optical connector

When inserting or removing the SC/PC optical connector, do as follows.

l To insert the fiber into the SC/PC connector, align the head of the fiber with the opticalinterface, and then push the fiber with proper strength into the connector.

l To remove the fiber, first press the clip, and then push the fiber connector inward slightly,and pull out the connector.

12.2 Power Supply Cable and Grounding CableThe power supply cable and grounding cable include the cabinet power supply wire, subrackpower supply wire, power supply wire that connects the external equipment, and cabinet doorgrounding cable.

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12.2.1 Cabinet -48 V/BGND/PGND Power CableThe -48 V, BGND and PGND power cables are used to supply power to the equipment in thecabinet. One end of the power cable connects to the power distribution cabinet and groundingbar in the equipment room, and the other end connects to the power distribution unit at the cabinettop.

12.2.2 Cabinet Door Grounding CableThe cabinet door grounding cable is used to ground the front door, rear door and side panels.The cables are correctly connected before delivery.

12.2.3 Subrack Power CableThe subrack power cable connects the power distribution unit (PDU) at the cabinet top and thePIU board on the subrack. The -48 V power supply is led out from the top of the cabinet to thesubrack.

12.2.1 Cabinet -48 V/BGND/PGND Power CableThe -48 V, BGND and PGND power cables are used to supply power to the equipment in thecabinet. One end of the power cable connects to the power distribution cabinet and groundingbar in the equipment room, and the other end connects to the power distribution unit at the cabinettop.

StructureFigure 12-4 shows the structure of the cabinet -48 V power cable and that of the BGND powergrounding cable.

Figure 12-4 Structure of the cabinet -48 V power cable and BGND power grounding cable

Bare crimpingterminal (JG2) Bare crimping

connector (OT)

Figure 12-5 shows the structure of the cabinet PGND protection grounding cable, and Figure12-6 shows the appearance of the cabinet PGND protection grounding cable.

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12-5

Figure 12-5 Structure of the cabinet PGND protection grounding cable (JG2&OT)

Cable tieL = 3 cm

Main label

W

Heat-shrink tube

Bare crimpingterminal (JG2) Heat-shrink tube

Bare crimpingconnector (OT)

Figure 12-6 Appearance of the cabinet PGND protection grounding cable (JG2&OT)

Technical SpecificationsItem Specification

Terminal Bare crimping terminal-JG2 type-25mm2-M8-95A-tinplating

Bare crimping terminal-OT type-25mm2-M8-tin plating-bare ring terminal

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12.2.2 Cabinet Door Grounding CableThe cabinet door grounding cable is used to ground the front door, rear door and side panels.The cables are correctly connected before delivery.

Structure

Figure 12-7 shows the structure of the cabinet door grounding cable. Figure 12-8 shows theappearance of the cabinet door grounding cable.

Figure 12-7 Structure of the cabinet door grounding cable

Main labelBare crimpingconnector (OT)

Heat-shrink tube

Figure 12-8 Appearance of the cabinet door grounding cable

Technical Specifications

Item Specification

Connector Bare crimping terminal-OT-10mm2-M6-tin plating-bareterminal-

Cable Type Wire-600V-UL1015-10AWG-50A-yellow and green

Fireproofclass

CM

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Item Specification

Length 0.3 m

12.2.3 Subrack Power CableThe subrack power cable connects the power distribution unit (PDU) at the cabinet top and thePIU board on the subrack. The -48 V power supply is led out from the top of the cabinet to thesubrack.

Structure

Figure 12-9 and Figure 12-10 show the structure of the subrack power cable.

Figure 12-9 Structure of the subrack power cable (1)

A - A

Cableconnector

Cabletie

Main lable

LableCord endterminal

X3W2

W1

X2X1

AA3

A1

Lable

Figure 12-10 Structure of the subrack power cable (2)

A1

A3A

View A

X1

Main lable

Cable tie

Lable

LableBare crimping

terminal

Bare crimpingterminal

X2

X3

NOTE

Select subrack power cables with different connectors according to the different power boxes.

Pin Assignment

Table 12-3 lists the pin assignment of the cable.

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Table 12-3 Pin assignment of subrack power cable

CableConnector

BareConnector

Connection Relation Core Color

X1.A1 X2 A1 connects to X2. Blue (-48 V power)

X1.A3 X3 A3 connects to X3. Black (ground for thepower supply)

Technical SpecificationsItem Specification

Cable connector X1 Cable connector-D type-3PIN-female-cable welding injectionmolding-without intermediate male terminal

Bare crimping terminalX2/X3

l The model of the bare crimping terminal in Figure 12-9 is cordend terminal-4 mm2-20A-inserted 10mm-grey

l The model of the bare crimping terminal in Figure 12-10is barecrimping terminal-JG2-6 mm2-M6-40A-tin plating, 19.05 mmhole pitch

Cable Type l The cable type in Figure 12-9 is electronic/electriccable-600V-5.26mm2-10AWG

l The cable type in Figure 12-10 is electronic/electric-600V-5.2mm2-10AWG

Color Blue and black

12.3 Service CableThe service cable includes the Ethernet cable, 75-ohm 8 x E1 cable and 120-ohm 8 x E1 cable.

12.3.1 Ethernet CableEthernet cable is also called network cable. It is classified into straight through network cableand crossover network cable based on the different connection sequence of the copper wire inthe cable.

12.3.2 75-ohm 8 x E1 CableThe 75-ohm 8 x E1 cable is used to input and output E1 signals.

12.3.3 120-ohm 8 x E1 CableThe 120-ohm 8 x E1 cable is used to input and output E1 signals.

12.3.1 Ethernet CableEthernet cable is also called network cable. It is classified into straight through network cableand crossover network cable based on the different connection sequence of the copper wire inthe cable.

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StructureThe straight through cable and crossover cable both are standard shielded cable and adopt RJ-45connector, as shown in Figure 12-11.

Figure 12-11 RJ-45 connector

PIN #1PIN #8

The straight through cable is used for the communication among the OptiX PTN 1900 equipment,the NM computer and the Ethernet. Figure 12-12 shows the structure of the straight throughcable, and Figure 12-13 shows the appearance of straight through cable.

Figure 12-12 Structure of the straight through cable

RJ-45 networkinterface connector

Label 1

W

X1 X2

8

1

8

1

Label 2Main label

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Figure 12-13 Appearance of the straight through cable

The crossover cable is used to directly connect the NMS computer to the OptiX PTN 1900equipment. Figure 12-14 shows the structure of the crossover cable, and Figure 12-15 showsthe appearance of crossover cable.

Figure 12-14 Structure of the crossover cable

1

8

1

8

X1 X2

RJ-45 networkinterface connector Label 1 Label 2Main label

Networkcable

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Figure 12-15 Appearance of the crossover cable

NOTE

Wire 1 and wire 3 of one end of the crossover cable must be respectively connected to wire 3 and wire 1of the other end, and wire 2 and wire 6 of one end of the crossover cable must be respectively connectedto wire 6 and wire 2 of the other end.

Pin AssignmentFigure 12-16 shows the pin assignment relations of the straight through cable.

Figure 12-16 Pin assignment of the straight through cable

褐色

White ororangePin 1

Connector X1 Connector X2

Orange

White orgreen

Blue

White orblue

Green

White orbrown

Brown

White ororange

Orange

White orgreen

Blue

White orblue

Green

White orbrown

Brown

Pin 1

Pin 2 Pin 2

Pin 3 Pin 3

Pin 4 Pin 4

Pin 5 Pin 5

Pin 6 Pin 6

Pin 7 Pin 7

Pin 8 Pin 8

Table 12-4 lists the pin assignment of the straight through cable.

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Table 12-4 Pin assignment of the straight through cable

ConnectorX1

Connector X2 Color Relation

X1.1 X2.1 White or orange Twisted pair

X1.2 X2.2 Orange

X1.3 X2.3 White or green Twisted pair

X1.6 X2.6 Green

X1.4 X2.4 Blue Twisted pair

X1.5 X2.5 White or blue

X1.7 X2.7 White or brown Twisted pair

X1.8 X2.8 Brown

Figure 12-17 shows the pin assignment relations of the crossover cable.

Figure 12-17 Structure of the crossover cable

褐色

White ororangePin 1

Connector X1 Connector X2

Orange

White orgreen

Blue

White orblue

Green

White orbrown

Brown

White ororange

Orange

White orgreen

Blue

White orblue

Green

White orbrown

Brown

Pin 1

Pin 2 Pin 2

Pin 3 Pin 3

Pin 4 Pin 4

Pin 5 Pin 5

Pin 6 Pin 6

Pin 7 Pin 7

Pin 8 Pin 8

Table 12-5 lists the pin assignment of the crossover cable.

Table 12-5 Pin assignment of the crossover cable

ConnectorX1

Connector X2 Color Relation

X1.6 X2.2 Orange Twisted pair

X1.3 X2.1 White or orange

X1.1 X2.3 White or green Twisted pair

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ConnectorX1

Connector X2 Color Relation

X1.2 X2.6 Green

X1.4 X2.4 Blue Twisted pair

X1.5 X2.5 White or blue

X1.7 X2.7 White or brown Twisted pair

X1.8 X2.8 Brown

Technical SpecificationsTable 12-6 lists the technical specifications of the straight through cable. Table 12-7 lists thetechnical specifications of crossover cable. For details on connectors X1 and X2 listed in thefollowing table, refer to Figure 12-12 and Figure 12-13.

Table 12-6 Technical specifications of the straight through cable

Item Specification

Connector X1/X2 Network interface connector-crystal model connector-8PIN-8bit-shielded-connector-24 to 26AWG-CAT 6/used with SFTP networkcablel Adaptation wire gauge: 24 to 26AWGl Cable type: CAT 6/used with lead shielded twisted cable

Cable type Communication cable-100±15 ohms-CAT5E-SFTP 24AWG-8 cores-PANTONE 445Ul Transmission resistance: 100±15 ohmsl Wire gauge: CAT5E SFTP 24AWGl Color: Pantone 430U

Number of cores 8

Fireproof class CM

Table 12-7 Technical specifications of the crossover cable

Item Specification

Connector X1/X2 Network interface connector-crystal model connector-8PIN-8bit-shielded-24 to 26AWG-CAT 6/used with SFTP network cablel Adaptation wire gauge: 24 to 26AWGl Cable type: CAT 6/used with lead shielded twisted cable

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Item Specification

Cable type Communication cable-100 15 ohms-CAT5E-SFTP 24AWG-8 cores-PANTONE 646Ul Transmission resistance: 100±15 ohmsl Wire gauge: CAT5E SFTP 24AWGl Color: Pantone 430U

Number of cores 8

Fireproof class CM

12.3.2 75-ohm 8 x E1 CableThe 75-ohm 8 x E1 cable is used to input and output E1 signals.

Use the DB44 connector at one end to connect the cable to the 75-ohm 8 x E1 electrical interfaceboard. Use a connector to connect the other end to the digital distribution frame (DDF). Theconnector should be made according to the on-site requirements.

Structure

Figure 12-18 shows the structure of the 75-ohm 8 x E1 cable.

Figure 12-18 Structure of the 75-ohm E1 cable

Cable connector-D type-44PIN-

malePos.44 A-A

Pos.1A

W

X

Main label

Pin Assignment of the 75-ohm E1 cable

Table 12-8 list the pin assignment of the 75-ohm 8 x E1 cable.

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Table 12-8 Pin assignment of the 75-ohm E1 cable

Connectorpin

Cable W Remarks Connectorpin

Cable W Remarks

Core No. Core No.

38 Ring 1 R1 34 Ring 9 R5

23 Tip 19 Tip

37 Ring 3 R2 33 Ring 11 R6

22 Tip 18 Tip

36 Ring 5 R3 32 Ring 13 R7

21 Tip 17 Tip

35 Ring 7 R4 31 Ring 15 R8

20 Tip 16 Tip

15 Ring 2 T1 11 Ring 10 T5

30 Tip 26 Tip

14 Ring 4 T2 10 Ring 12 T6

29 Tip 25 Tip

13 Ring 6 T3 9 Ring 14 T7

28 Tip 24 Tip

12 Ring 8 T4 8 Ring 16 T8

27 Tip 7 Tip

Shell External braid shield layer

Technical Specifications of the 75-ohm E1 cableItem Specification

Connector X Cable connector-D type-44PIN-male

Cable type Coaxial cable-SYFVZ-LC-75-1x16(A)-75 ohm-12.4 mm-1.2mm-0.254 mm-Pantone Warm Gray 1U

Fireproof class CM

Number of cores 16

Cover diameter-insulation diameter-conductor diameter

12.4 mm-1.2 mm-0.254 mm

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CAUTIONThe pin assignment table for the E1 cable is placed in the same packing case with the cable. Donot discard it before installation.

12.3.3 120-ohm 8 x E1 CableThe 120-ohm 8 x E1 cable is used to input and output E1 signals.

Use the DB44 connector at one end to connect the cable to the 120-ohm E1 electrical interfaceboard. Use a connector to connect the other end to the DDF. The connector should be madeaccording to the on-site requirements.

StructureFigure 12-19 shows the structure of the 120-ohm 8 x E1 cable.

Figure 12-19 Structure of the 120-ohm 8 x E1 cable

Main lable

W1

A

Cable connector-Dtype-44PIN-male

X

Lable 2

W2

Lable 1

Pos.44 A-A

Pos.1

Figure 12-20 shows the appearance of the 120-ohm 8 x E1 cable.

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Figure 12-20 Appearance of the 120-ohm 8 x E1 cable

Pin AssignmentTable 12-9 lists the pin assignment of the 120-ohm 8 x E1 cable.

Table 12-9 Pin assignment of the 120-ohm E1 cable

Connectorpin

Cable W1 Remarks

Connector pin

Cable W2 Remarks

Core No. Core No.

15 Blue Twisted pair

T x 1 38 Blue Twistedpair

R x 1

30 White 23 White

14 Orange Twisted pair

T x 2 37 Orange Twistedpair

R x 2

29 White 22 White

13 Green Twisted pair

T x 3 36 Green Twistedpair

R x 3

28 White 21 White

12 Brown Twisted pair

T x 4 35 Brown Twistedpair

R x 4

27 White 20 White

11 Grey Twisted pair

T x 5 34 Grey Twistedpair

R x 5

26 White 19 White

10 Blue Twisted pair

T x 6 33 Blue Twistedpair

R x 6

25 Red 18 Red

9 Orange Twisted pair

T x 7 32 Orange Twistedpair

R x 7

24 Red 17 Red

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Connectorpin

Cable W1 Remarks

Connector pin

Cable W2 Remarks

Core No. Core No.

8 Green Twisted pair

T x 8 31 Green Twistedpair

R x 8

7 Red 16 Red

Shell External braid shield layer Shell External braid shield layer

Technical SpecificationsItem Specification

Connector X Cable connector-D type-44PIN-male

Cable type Communication cable-120 ohms-SEYVP-24AWG-16 core-PANTONE 430U

Number of cores 16

Inner conductordiameter

0.4 mm

Fireproof class CM

12.4 Management CableThe management cable includes straight through cable and crossover cable.

12.4.1 Straight Through CableThe straight through cable is used for the communication among the OptiX PTN 1900 equipment,the NMS computer and the Ethernet.

12.4.2 Crossover CableThe crossover cable is used to directly connect the NMS computer to the OptiX PTN 1900equipment.

12.4.1 Straight Through CableThe straight through cable is used for the communication among the OptiX PTN 1900 equipment,the NMS computer and the Ethernet.

For the description of the straight through cable, refer to 12.3.1 Ethernet Cable.

12.4.2 Crossover CableThe crossover cable is used to directly connect the NMS computer to the OptiX PTN 1900equipment.

For the description of the crossover cable, refer to 12.3.1 Ethernet Cable.

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12.5 Clock CableThe clock cable includes the 120-ohm clock cable. The clock cable is used to input and outputexternal clock signals.

12.5.1 External Clock CableThe 120-ohm clock cable uses the RJ-45 connector.

12.5.2 Clock Bridging CableOn the OptiX PTN 1900, the 120-to-75-ohm clock cable is used as the clock bridging cable.

12.5.1 External Clock CableThe 120-ohm clock cable uses the RJ-45 connector.

Structure

Figure 12-21 shows the connector structure of the 120-ohm clock cable.

Figure 12-21 Connector structure of the 120-ohm clock cable

PIN #1PIN #8

Pin Assignment

Table 12-10 shows the pin assignment of the cable.

Table 12-10 Pin assignment of the 120-ohm clock cable

Connectorpin

Relation

Description

External ClockMode

External TimeMode(1PPS + TimeInformation )

External TimeMode(DCLS)

1 Twisted pair

Negative receive endof CLK

Unspecified Unspecified

2 Twisted pair

Positive receive endof CLK

Unspecified Unspecified

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Connectorpin

Relation

Description

External ClockMode

External TimeMode(1PPS + TimeInformation )

External TimeMode(DCLS)

3 Twisted pair

Unspecified Negative of 1PPSsignals

Negative of DCLSsignals

6 Twisted pair

Unspecified Positive of 1PPSsignals

Positive of DCLSsignals

4 Twisted pair

Negative transmitend of CLK

Grounding end Grounding end

5 Twisted pair

Positive transmit endof CLK

Grounding end Grounding end

7 Twisted pair

Unspecified Negative of timeinformation

Unspecified

8 Twisted pair

Unspecified Positive of timeinformation

Unspecified

Technical SpecificationsItem Specification

Connector of the120-ohm clockcable

Network interface connector-8PIN-8 bit-shielded-crystal modelconnector

12.5.2 Clock Bridging CableOn the OptiX PTN 1900, the 120-to-75-ohm clock cable is used as the clock bridging cable.

StructureFigure 12-22 shows the structure of the 120-to-75-ohm clock bridging cable.

Figure 12-22 Structure of the clock bridging cable

RJ-45 connector

Main label Heat-shrink tube

120-ohm or 75-ohm conversion

connector Label

View A

18

30 m

W1

W2

W3

W4

W5A

X1

Heat-shrink tube

Heat-shrink tube

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Pin AssignmentTable 12-11 lists the pin assignment of the clock bridging cable connector.

Table 12-11 Pin assignment of the clock bridging cable connector

120-Ohm Cable 75-OhmCable

ConnectorPin

Color Description Relation Core No.

X1.1 Orange Negative receive end of 120-ohm external clock

Twisted pair W1

X1.2 White Positive receive end of 120-ohm external clock

X1.4 Blue Negative transmit end of 120-ohm external clock

Twisted pair W2

X1.5 White Positive transmit end of 120-ohm external clock

X1.3 Green Unspecified Twisted pair W3

X1.6 White Unspecified

X1.7 White Unspecified Twisted pair W4

X1.8 Brown Unspecified

Technical SpecificationsTable 12-12 lists the technical specifications of the clock bridging cable.

Table 12-12 Technical specifications of the clock bridging cable

Item Specification

Cable Single Cable, 120 ohm To 75 ohm Clock Cable, 30 m, MP8-II,120CC4P0.4P430U(S)+4*SYV75-2/0.34(S)

Connector X1type

Network Interface Connector,8-Bit 8PIN, Crystal Model Connector

120-ohm cabletype

Twisted-Pair Cable, 120 ohm, SEYVP, 0.4 mm, 26AWG, 4Pairs, Pantone430U

75-ohm cabletype

Coaxial Cable, SYV-75-2-2(4.0Z)-1/0.34 mm, OD3.9 mm, Double-LayerCopper Braid Shielded

Cable length 30 m

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12.6 Cabinet Indicator CableThe cabinet indicator cable is used to connect the CXP board on the OptiX PTN 1900 and thecabinet indicators. It transmits the indicator signals output by the CXP to the cabinet indicator.

Structure

Figure 12-23 shows the structure of the cabinet indicator cable. Figure 12-24 shows theappearance of the cabinet indicator cable.

Figure 12-23 Structure of the cabinet indicator cable

2

A-A

81

AX1

W

X5

X4

X3

X2B

Label

1B-B

Main labelHeat-shrink tube

Heat-shrink tube

Figure 12-24 Appearance of the cabinet indicator cable

Pin Assignment

Table 12-13 lists the pin assignment of the cabinet indicator cable.

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Table 12-13 Pin assignment of the cabinet indicator cable

ConnectorX1

Connector X2/X3/X4/X5 Relation Label Print

X1.4 X2.2 Twistedpair

Green

X1.5 X2.1

X1.1 X3.2 Twistedpair

Red

X1.2 X3.1

X1.3 X4.2 Twistedpair

Orange

X1.6 X4.1

X1.7 X5.2 Twistedpair

Yellow

X1.8 X5.1

Technical Specifications

Item Specification

Connector X1 Network interface connector-8PIN-8 bit-shielded-crystal model connector

Connector X2/X3/X4/X5 Common plug-2PIN-single row/2.5 mm

Cable type Twisted pair cable-120 ohms-SEYPVPV-0.5mm-24AWG-8 core-PANTONE 430U

Number of cores 8

Fireproof class CM

Core diameter 0.5mm

12.7 Alarm Input/Output CableThe alarm input cable is used to input the alarm signals of the external equipment to the OptiXPTN 1900 equipment. The alarm output cable is used to output the alarm signals to the centralalarm monitoring equipment.

One end of the alarm input/output cable uses an RJ-45 connector to connect to the alarm input/output interface of the equipment. The other end uses a connector to connect to the externalequipment or central alarm monitoring equipment. The connector should be made according tothe on-site equipment.

Structure

Figure 12-25 shows the structure of the alarm input/output cable connector.

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Figure 12-25 Structure of the alarm input/output cable connector

Pin AssignmentTable 12-14 lists the pin assignment of the alarm input/output cable.

Table 12-14 Pin assignment of the alarm input

Connector

Color Alarm Input

1 White and orange Positive for alarm input 1

2 Orange Negative for alarm input 1

3 White and green Positive for alarm input 2

4 Blue Positive for alarm input 3

5 White and blue Negative for alarm input 3

6 Green Negative for alarm input 2

7 White and brown Positive for alarm input 4

8 Brown Negative for alarm input 4

Technical SpecificationsItem Specification

Connector Network interface connector-8PIN-8 bit-shielded-crystal model connector

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A Indicators

This chapter describes the board indicators for the OptiX PTN 1900 and their indications.

A.1 Cabinet IndicatorsThis section describes the ETSI cabinet indicators for the OptiX PTN 1900.

A.2 Board IndicatorsThis section describes the board indicators and their indications.

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A.1 Cabinet IndicatorsThis section describes the ETSI cabinet indicators for the OptiX PTN 1900.

Indicator Name Description

Power indicator, green, which indicates whetherthe power supply is normal

When the indicator is lit, it indicates thatthe power is supplied to the equipment.

When the indicator is unlit, no power issupplied to the equipment.

Critical alarm indicator, red When the indicator is lit, it indicates thatcritical alarms are generated in theequipment.

When the indicator is unlit, it indicatesthat no critical alarms are generated inthe equipment.

Major alarm indicator, orange When the indicator is lit, it indicates thatmajor alarms are generated in theequipment.

When the indicator is unlit, it indicatesthat no major alarms are generated in theequipment.

Minor alarm indicator, yellow When the indicator is lit, it indicates thatminor alarms are generated in theequipment.

When the indicator is unlit, it indicatesthat no minor alarms are generated in theequipment.

A.2 Board IndicatorsThis section describes the board indicators and their indications.

Index of Indicators

For boards and their indicators, see Boards and Their Indicators.

For board status indicators, see:

l Description of the Working Status Indicator (STAT)l Description of the Service Activation Status and Board Working/Protection Status

Indicator (ACT)l Description of the Working/Protection Status of the Cross-Connect and Timing Board

(ACTX)

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l Description of the Working/Protection Status of the System Control Board (ACTC)l Description of the Program Status Indicator (PROG)l Description of the Service Status Indicator (SRV)l Description of the Synchronization Status Indicator (SYNC)l Description of the Power Supply Board Fault Indicator (ALM)l Description of the Fan State Indicator(STAT)l Description of the Power Supply Status Indicator (PWR)

For service port status indicators, see:

l Service Port Connection Status Indicator (LINK)l Description of the Service Interface Transmitting/Receiving Status Indicator (ACT)l Description of the Interface Connection and Data Transmitting/Receiving Status

Indicators (L/A)

For system alarm indicators, see:

l Description of the Alarm Cutting Indicator (ALMC)l Description of the Critical Alarm Indicator (CRIT)l Description of the Major Alarm Indicator (MAJ)l Description of the Minor Alarm Indicator (MIN)

For the start status indicator combination in each phase when the service sub-board, and systemcontrol board are started, see Description of the Start Status Indicator Combination on theBoard.

Boards and Their IndicatorsBoard Indicator

MD1 STAT, ACT, SRV

CD1 STAT, ACT, SRV

AD1 STAT, ACT, SRV

ETFC STAT, ACT, SRV, LINK, ACT

EFG2 STAT, ACT, SRV, L/A1, L/A2

EFF8 STAT, ACT, SRV, L/A1 to L/A8

AFO1 STAT, ACT, SRV

POD41 STAT, ACT, SRV

CXP STAT, PROG, SRV, ACTX, ACTC, SYNC

PIU PWR, ALM

FANA CRIT, MAJ, MIN, ALMC, STAT

FANB STAT

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Description of the Working Status Indicator (STAT)

Status Description

On (green) The board is working normally.

On (red) The board hardware is faulty.

On (orange) The interface board or service sub-board is not loaded with thelogic.

Off l No power is input.l The board is not running.

NOTEIf the logic is loaded to the board but the board is not created, the board cannot be activated. In this case,the STAT indicator is on (green), but the SRV indicator is off.

The description does not involve the STAT indicator on the FANA and FANB. For details on the STATindicator on the FANA and FANB, see Description of the Fan State Indicator(STAT).

Description of the Service Activation Status and Board Working/Protection StatusIndicator (ACT)

Status Description

On (green) l service sub-board are in the active state, and the board isworking.

l The MD1 configured in a TPS protection group is in theworking state.

Off l service sub-board are not activated.l The MD1 configured in a TPS protection group is in the

backup state or protected state.

Description of the Working/Protection Status of the Cross-Connect and TimingBoard (ACTX)

Status Description

On (green) The board is in the working state.

Off The board is in the protection state.

Description of the Working/Protection Status of the System Control Board (ACTC)

Status Description

On (green) The board is in the working state.

A IndicatorsOptiX PTN 1900 Packet Transport Platform of PTN Series

Hardware Description

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Status Description

Blinking (green) at 100ms internals

Databases of the equipment are backed up in batch.

Off The board is in the protection state.

CAUTIONWhen the ACT indicator on the protection system control board is flashing, it indicates that the workingsystem control board is backing up databases in batch to the protection system control board. At this time,do not reset the working system control board or remove and then insert the working system control board.Otherwise, the equipment may work abnormally.

Description of the Program Status Indicator (PROG)

Status Description

On (green) l The board software is being initialized.l The board software is normally initialized, and the board

software is running normally.

On (red) l The memory self-check fails.l The board software or the logic file is lost.l Loading of the board software fails.

Blinking (green) at 100ms internals

Loading of the board software is in process.

Blinking (green) at 300ms internals

The BIOS is guiding the upper-layer software.

Blinking (red) at 100 msinternals

The BIOS self-check fails.

Off No power is input.

Description of the Service Status Indicator (SRV)

Status Description

On (green) Services are running normally and no service-related alarmoccurs (including the situation where the board is activated butnot configured with services).

On (red) A critical or major service-related alarm occurs.

On (orange) A minor or remote service-related alarm occurs.

Off l No power is input.l The board is not running.

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Description of the Synchronization Status Indicator (SYNC)

Status Description

On (green) l The clock works in free-run mode and the system clockpriority list is not configured. By default, the system clockpriority list contains only internal sources.

l The clock works in locked mode and is tracing a clock sourceother than the internal source in the priority list.

l The system clock is working in time synchronization mode,and the PTP time and system clock are in the tracing state.

On (red) l The system clock priority list is configured. All the clocksources, however, are lost except the internal clock sources.The clock works in holdover mode or free-run mode.

l The system clock is working in time synchronization mode,but no synchronization source is available. The system clockand PTP time are working in holdover or free-run mode.

Description of the Power Supply Board Fault Indicator (ALM)

Status Description

On (red) The power supply board is faulty.

Off The power supply board is normal.

Description of the Fan State Indicator(STAT)

Status Description

On (green) The fans are working normally.

On (red) l A fan is faulty.l A fan is working abnormally.

Off The fans are not powered.

Description of the Power Supply Status Indicator (PWR)

Status Description

On (green) The power supply is normal.

Off l The power supply is lost.l The power supply fails.

A IndicatorsOptiX PTN 1900 Packet Transport Platform of PTN Series

Hardware Description

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Service Port Connection Status Indicator (LINK)Status Description

On (green) The service port is correctly connected to the cable.

Off The service port fails to be connected to the cable.

Description of the Service Interface Transmitting/Receiving Status Indicator (ACT)Status Description

Blinking (orange) The service interface is transmitting or receiving data.

Off l The service port is not connected to the cable.l The service port is incorrectly connected to the cable.

Description of the Interface Connection and Data Transmitting/Receiving StatusIndicators (L/A)

Status Description

On (green) The service port is correctly connected to the fiber/cable.

Blinking (orange) The service port is correctly connected to the fiber/cable, and thedata are transmitted/received at the port.

Off The service port fails to be connected to the fiber/cable.

Description of the Alarm Cutting Indicator (ALMC)Status Description

On (red) The audible alarm of the equipment is disabled.

Off The audible alarm of the equipment is enabled. When an alarmassociated with the audible function is reported, sound isgenerated to indicate the alarm.

Description of the Critical Alarm Indicator (CRIT)Status Description

On (red) Critical alarms are generated.

Off No critical alarm is generated.

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Description of the Major Alarm Indicator (MAJ)

Status Description

On (red) Major alarms are generated.

Off No major alarm is generated.

Description of the Minor Alarm Indicator (MIN)

Status Description

On (yellow) Minor alarms are generated.

Off No minor alarm is generated.

Description of the Start Status Indicator Combination on the Board

From power on to normal running, the service sub-board, and system control board go throughvarious statuses. Table A-1 shows the indicator combination corresponding to these statuses.

Table A-1 Start status indicator combination

SN Status Indicator

STAT PROG ACT/ACTC/ACTX

SRV

1 The board is not poweredon.

Off Off Off Off

2 The BIOS is beingstarted.

Off Green Off Off

3 The BIOS is started, andguides and loads theboard software.

Off Blinking(green)

Off Off

4 The upper-layersoftware is beinginitialized.

Green Green Off Off

5 The upper-layersoftware initialization iscomplete, but the boardis not running.

Green Green Off Off

6 The board is running. Green Green Off/Green/Blinking (green)a

Always onb

A IndicatorsOptiX PTN 1900 Packet Transport Platform of PTN Series

Hardware Description

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SN Status Indicator

STAT PROG ACT/ACTC/ACTX

SRV

NOTEa: When the board is running, the ACT/ACTC/ACTX indicator may be off, on (green), or flashing (green). When services arenormal, the indicator is on (green). For other statuses, see Description of the Service Activation Status and Board Working/Protection Status Indicator (ACT), Description of the Working/Protection Status of the Cross-Connect and Timing Board(ACTX), and Description of the Working/Protection Status of the System Control Board (ACTC).b: When the board is running, the SRV indicator may be in red, orange, or green. When services are normal, the indicator is green.For other statuses of the indicator, see Description of the Service Status Indicator (SRV).

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B Labels

On the OptiX PTN 1900, safety labels, optical module labels and engineering labels are stuck.

B.1 Safety LabelVarious safety labels are stuck on the equipment. This section describes positions and indicationsof these safety labels.

B.2 Engineering LabelsThe engineering labels should be made according to the the local engineering specifications orHuawei engineering specifications.

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B-1

B.1 Safety LabelVarious safety labels are stuck on the equipment. This section describes positions and indicationsof these safety labels.

B.1.1 LabelsLabels are present on the subrack and boards.

B.1.2 Label PositionSome labels such as the ESD protection label and subrack grounding label are stuck on thesubrack.

B.1.1 LabelsLabels are present on the subrack and boards.

Table B-1 Labels

Label Type Indication

ESD protection label The equipment is electrostatic sensitive.

CLASS 1LASER

PRODUCT

LASERRADIATION

DO NOT VIEW DIRECTLYWITH OPTICALINSTRUMENTSCLASS 1M

LASERPRODUCT

Laser safety class The label indicates the class of the lasersource.

Subrack grounding label This label indicates the groundingposition.

ATTENTION 警告

CLEAN PERIODICALLY 定期清洗

! Regular cleaning label Regularly clean the air filter.

严禁在风扇高速旋转时接触叶片

DON'T TOUCH THEFAN LEAVES BEFORETHEY SLOW DOWN !

Fan warning label Do not touch the fan leaves before the fanstops.

!

Multi-channel powersupply label

Multiple channels of power supply areavailable.

此单元严禁带电插拔!Do not hot plug this unit !

No hot plug label Do not insert or remove the componentwhen the power is on.

B LabelsOptiX PTN 1900 Packet Transport Platform of PTN Series

Hardware Description

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Label Type Indication

合格证/QUALIFICATION CARD

华为技术有限公司 中国制作MADE IN CHINAHUAWEI TECHNOLOGIES CO.,LTD.

HUAWEI

Qualification label The equipment is qualified.

OptiX PTN 1900POWER RATING: -48--60V;12A

华为技术有限公司 中国制造

电源额定值

HUAWEI TECHNOLGIES CO.,LTD. MADE IN CHINA

Class 1 Laser Product

N14036

Product nameplate label The label suggests the product name andcertification.

B.1.2 Label PositionSome labels such as the ESD protection label and subrack grounding label are stuck on thesubrack.

Figure B-1 shows where labels are stuck on the subrack.

Figure B-1 Position of labels on the subrack合格证/QUALIFICATION CARD

华为技术有限公司 中国制造MADE IN CHINAHUAWEI TECHNOLOGIES CO.,LTD.

HUAWEI

ATTENTION 警告

CLEAN PERIODICALLY 定期清洗

!

OptiX PTN 1900POWER RATING: -48--60V;12A

华为技术有限公司 中国制造

电源额定值

HUAWEI TECHNOLGIES CO.,LTD. MADE IN CHINA

Class 1 Laser Product

N14036

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B.2 Engineering LabelsThe engineering labels should be made according to the the local engineering specifications orHuawei engineering specifications.

The engineering labels should be made according to the the local engineering specifications orHuawei engineering specifications. Table B-2 lists the Huawei engineering specifications forengineering labels.

Table B-2 Huawei specifications for engineering labels

Label Illustration Indication

Engineeringlabels forpowercables

(1) (2)

TO: A01 -48V2 B08

TO: B03 -48V2

(1) Label on the cable at the loadedcabinet side, which indicates theposition of the cable at the powerdistribution cabinet side(2) Label on the cable at the powerdistribution cabinet side, whichindicates the position of the cable atthe loaded cabinet side

(1) On the loaded cabinet side, the labelmarked "A01/B08--48V2" on the cableindicates that the cable is used for the-48V2 DC power supply, which comesfrom the eighth connector on the secondrow of the -48 V bus bar in the cabinet onRow A, and Column 01 in the equipmentroom.(2) On the distribution unit side, the labelmarked "B03--48V2" indicates that thecable is -48V2 DC power supply, whichcomes from the loaded cabinet on Row B,Column 03 in the equipment room. ForPGND and BGND, it is only necessary togive the row and column of the powerdistribution unit, instead of the specificserial number of the terminal block on thecopper bar.

Engineeringlabels foralarmexternalcables

The external alarm cables are connected tothe first subscriber cabinet of each row(used for power distribution). Engineeringlabels stuck on the first cabinet of each rowshould indicate which equipment is usingthe access terminal. Engineering labels arenot needed on the equipment side unlessthere are special requirements. The labelmarked "A01" indicates that the alarmcable connects the first cabinet and thecabinet on Row A, Column 01 in theequipment room.

B LabelsOptiX PTN 1900 Packet Transport Platform of PTN Series

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Label Illustration Indication

Engineeringlabels forEthernetcables

"A01-03-06-05" indicates that one end ofthe Ethernet cable is connected to EthernetPort 05, Slot 6, Frame 03 of the cabinet onRow A, Column 01 in the equipment room."B02-03-12" indicates that the other end ofthe Ethernet cable is connected to EthernetPort 12, Frame 03 of the cabinet on RowB, Column 02 in the equipment room. Noslot number is specified.

Engineeringlabels forfibersthatconnectequipment

"A01-01-05-05-R" indicates that the localend of the fiber is connected with OpticalReceiving Interface 05 on Slot 5, Frame 01in the cabinet on Row A, Column 01 in theequipment room. "G01-01-01-01-T"indicates that the opposite end of the fiberis connected with Optical TransmittingInterface 01 on Slot 01, Frame 01 in thecabinet on Row G, Column 01 in theequipment room.

Labelsfor fibersthatconnecttheequipment to theODF

"ODF-G01-01-01-R" indicates that thelocal end of the fiber is connected to theoptical receiving terminal on Row 01,Column 01 of the ODF in Row G Column01 in the equipment room. "A01-01-05-05-R" indicates that the other end of the fiberis connected to optical receiving interface5 on Slot 05, frame 01 in the cabinet onRow A, Column 01 in the equipment room.

Labelsfor trunkcablesthatconnecttheequipment to theODF

"A01-03-01-01-R" indicates that local endof the trunk cable connects to the receivingterminal of Trunk Cable 01 in Slot 01,Frame 03 of the cabinet on Row A, Column01 in the equipment room. "DDF-G01-01-01-AR" indicates that the oppositeend of the trunk cable connects thereceiving terminal of Direction A(connected to optical network equipment)on Row 01, Column 01 of the DDF on RowG and Column 01 in the equipment room.

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C Power Consumption and Weight

This chapter lists the power consumption and weight of each board used for the OptiX PTN1900.

Table C-1 lists the power consumption and weight of each board used for the OptiX PTN1900.

Table C-1 Power consumption and weight

Board Weight (kg) Power Consumption (W)

MD1 0.34 20.7

CD1 0.34 26.4

AD1 0.35 22.0

ETFC 0.55 15.0

EFF8 0.64 16.3

EFG2 0.52 8.8

POD41 0.55 11.6

AFO1 0.78 27.2

L12 0.53 0.1

L75 0.53 0.1

TN71CXP 2.34 73.3

TN72CXP 2.36 80.3

PIU 0.62 7.0

FANA 0.56 l Low rate: 8.0l Medium rate: 12.0l High rate: 21.0

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Board Weight (kg) Power Consumption (W)

FANB 0.80 l Low rate: 12.0l Medium rate: 19.0l High rate: 35.0

C Power Consumption and WeightOptiX PTN 1900 Packet Transport Platform of PTN Series

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D Board Configuration Parameters

You can use the U2000 to configure each parameter of the processing board, interface board,cross-connect and system control board.

Parameters of the Processing BoardThe configurable parameters of the processing board are the J0, J1, J2, C2, V5, SDH interface,Ethernet interface, automatic laser shutdown (ALS) and spare timeslot recovery value.

l The J0 byte is continually transmitted to carry section access point identifiers, accordingto which the receive end verifies the constant connection to the intended transmit end. It isrecommended to set the J0 byte to "0".

l The J1 byte is the path tracing byte. The transmit end successively transmits the higherorder access point identifiers, according to which the receive end verifies the constantconnection to the intended transmit end. When detecting mismatch of the J1 bytes, thereceive end inserts the HP_TIM alarm in the corresponding path.

l The J2 byte is a VC-12 path tracing byte. The transmit end successively transmits the lowerorder access point identifiers based on the negotiation of the two ends. According to theseaccess point identifiers, the receive end verifies the constant connection to the intendedtransmit end in this path.

l The C2 byte is the signal label byte, which indicates the multiplexing structure of the VCframes and the payload property. The received C2 should be consistent with the transmittedC2. If the C2 bytes are mismatched, the local end inserts the HP_SLM alarm in thecorresponding VC-4 path.Table D-1 lists the mapping relation between the service type and setting of the C2.

Table D-1 Mapping relation between the service type and C2 byte

Input Service Type C2 Byte (in Hex)

TUG structure 02

ATM mapping 13

HDLC, PPP framed signal mapping 16

Unequipped 00

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l As a path status and signal identification byte, the V5 byte detects the bit error and indicatesthe remote fault and failure in the lower order path. Table D-2 lists the mapping relationbetween the service type and V5 byte.

Table D-2 Mapping relation between the service type and V5 byte

Input Service Type V5 Byte (in Hex)

Asynchronization 02

Unequipped or supervisory unequipped 00

l The attributes of an SDH interface cover the general attributes, Layer 2 attributes, Layer 3

attributes and advanced attributes. To configure an SDH interface, configure the physicalparameters, link layer parameters and network layer parameters.

l The attributes of an Ethernet interface cover the general attributes, Layer 2 attributes, Layer3 attributes, advanced attributes and flow control. To configure an Ethernet interface,configure the physical parameters, link layer parameters, network layer parameters andflow control schemes.

l To configure the ALS is to set the parameters of the optical interface.l To ensure the valid utilization of the path, the spare timeslots are eliminated when the

signals are encapsulated into the network. In this way, the TDM frame is partially stuffed.To recover the TDM frame at the service sink, the spare timeslots eliminated duringencapsulation are added again.

Parameters of the Interface BoardThe configurable parameters of the interface board are the J0, J1, C2, SDH interface, Ethernetinterface, E1 interface, ALS and spare timeslot recovery value.l The attributes of an E1 interface cover the general attributes, Layer 3 attributes and

advanced attributes. To configure an E1 interface, configure the physical parameters,network layer parameters, signal frame format, clock mode and loopback scheme.

l For details on these parameters, see "Parameters of the Processing Board".

Parameters of the Cross-Connect and System Control BoardThe configurable parameters of the CXP board are the environment monitor interface and phase-locked source output by external clock.

You can set the relay control mode and enable or disable the major alarm relay and critical alarmrelay to configure the environment monitor interface.

You can set the output mode, output timeslot, output threshold, failure condition and failureaction of the 2M phase-locked source external clock.

For details, see OptiX PTN 1900 Configuration Guide.

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E Glossary

A

Administrator A user who has authority to access all the Management Domains of the EMLCoreproduct. He has access to the whole network and to all the management functionalities.

Alarm A message reported when a fault is detected by a device or by the network managementsystem during the process of polling devices. Each alarm corresponds to a recoveryalarm. After a recovery alarm is received, the status of the corresponding alarm changesto cleared.

alarm cable The cable for generation of visual or audio alarms.

APS See Automatic Protection Switching

AsynchronousTransfer Mode

A data transfer technology based on cell, in which packets allocation relies on channeldemand. It supports fast packet switching to achieve efficient utilization of networkresources. The size of a cell is 53 bytes, which consist of 48-byte payload and 5-byteheader.

ATM See Asynchronous Transfer Mode

Automatic ProtectionSwitching

Automatic Protection Switching (APS) is the capability of a transmission system todetect a failure on a working facility and to switch to a standby facility to recover thetraffic.

B

backup A periodic operation performed on the data stored in the database for the purposes ofdatabase recovery in case that the database is faulty. The backup also refers to datasynchronization between active and standby boards.

bandwidth A range of transmission frequencies that a transmission line or channel can carry in anetwork. In fact, it is the difference between the highest and lowest frequencies thetransmission line or channel. The greater the bandwidth, the faster the data transfer rate.

BER See Bit Error Rate

binding strap The binding strap is 12.7 mm wide, with one hook side (made of transparentpolypropylene material) and one mat side (made of black nylon material).

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bit error An incompatibility between a bit in a transmitted digital signal and the correspondingbit in the received digital signal.

Bit Error Rate Bit error rate. Ratio of received bits that contain errors. BER is an important index usedto measure the communications quality of a network.

breaker A breaker is a device that connects/disconnects power to a circuit.

bundling An optional multiplexing operation, whereby more than one user message may be carriedin the same SCTP packet.

C

Cable distribution plate A component which is used to arrange the cables in order.

cable tie The tape used to bind the cables.

CE See Customer Edge

CES See Circuit Emulation Service

Circuit EmulationService

A function with which the E1/T1 data can be transmitted through ATM networks. At thetransmission end, the interface module packs timeslot data into ATM cells. These ATMcells are sent to the reception end through the ATM network. At the reception end, theinterface module re-assigns the data in these ATM cells to E1/T1 timeslots. The CEStechnology guarantees that the data in E1/T1 timeslots can be recovered to the originalsequence at the reception end.

client A device that sends requests, receives responses, and obtains services from the server.

Customer Edge A part of BGP/MPLS IP VPN model. It provides interfaces for direct connection to theService Provider (SP) network. A CE can be a router, switch, or host.

D

Data CommunicationNetwork

A communication network used in a TMN or between TMNs to support the DataCommunication Function (DCF).

DCN See Data Communication Network

DDF See Digital Distribution Frame

diamond-shaped nut A type of nut that is used to fasten the wiring frame to the cabinet.

Digital DistributionFrame

A type of equipment used between the transmission equipment and the exchange withtransmission rate of 2 to 155 Mbit/s to provide the functions such as cables connection,cable patching, and test of loops that transmitting digital signals.

E

E-AGGR Ethernet-Aggregation

E-LAN See Ethernet LAN

ejector lever A lever for removing circuit boards from an electronic chassis.

E GlossaryOptiX PTN 1900 Packet Transport Platform of PTN Series

Hardware Description

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electromagneticcompatibility

Electromagnetic compatibility is the condition which prevails when telecommunicationsequipment is performing its individually designed function in a common electromagneticenvironment without causing or suffering unacceptable degradation due to unintentionalelectromagnetic interference to or from other equipment in the same environment.[NTIA]

ElectroStatic Discharge The sudden and momentary electric current that flows between two objects at differentelectrical potentials caused by direct contact or induced by an electrostatic field.

EMC See electromagnetic compatibility

ESD See ElectroStatic Discharge

Ethernet A technology complemented in LAN. It adopts Carrier Sense Multiple Access/CollisionDetection. The speed of an Ethernet interface can be 10 Mbit/s, 100 Mbit/s, 1000 Mbit/s or 10000 Mbit/s. The Ethernet network features high reliability and easy maintaining..

Ethernet LAN Ethernet LAN. A L2VPN service type that is provided for the user Ethernet in differentdomains over the PSN network. For the user Ethernet, the entire PSN network serves asa Layer 2 switch.

ETSI See European Telecommunications Standards Institute

EuropeanTelecommunicationsStandards Institute

A standards-setting body in Europe. Also the standards body responsible for GSM.

F

fault A failure to implement the function while the specified operations are performed. A faultdoes not involve the failure caused by preventive maintenance, insufficiency of externalresources and intentional settings.

frame A frame, starting with a header, is a string of bytes with a specified length. Frame lengthis represented by the sampling circle or the total number of bytes sampled during a circle.A header comprises one or a number of bytes with pre-specified values. In other words,a header is a code segment that reflects the distribution (diagram) of the elements pre-specified by the sending and receiving parties.

G

GE See Gigabit Ethernet

Gigabit Ethernet GE adopts the IEEE 802.3z. GE is compatible with 10 Mbit/s and 100 Mbit/s Ethernet.Itruns at 1000Mbit/s. Gigabit Ethernet uses a private medium, and it does not supportcoaxial cables or other cables. It also supports the channels in the bandwidth mode. IfGigabit Ethernet is, however, deployed to be the private bandwidth system with a bridge(switch) or a router as the center, it gives full play to the performance and the bandwidth.In the network structure, Gigabit Ethernet uses full duplex links that are private, causingthe length of the links to be sufficient for backbone applications in a building and campus.

guide rail Components to guide, position, and support plug-in boards.

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H

hot standby A mechanism of ensuring device running security. The environment variables andstorage information of each running device are synchronized to the standby device. Whenthe faults occur on the running device, the standby device can take over the services inthe faulty device in automatic or manual way to ensure the normal running of the entiresystem.

HSB See hot standby

I

IEC See International Electrotechnical Commission

IEEE See Institute of Electrical and Electronics Engineers

IMA See Inverse Multiplexing over ATM

Institute of Electricaland ElectronicsEngineers

A society of engineering and electronics professionals based in the United States butboasting membership from numerous other countries. The IEEE focuses on electrical,electronics, computer engineering, and science-related matters.

InternationalElectrotechnicalCommission

The International Electrotechnical Commission (IEC) is an international and non-governmental standards organization dealing with electrical and electronical standards.

InternationalTelecommunicationUnion -TelecommunicationStandardization Sector

An organization that coordinates standards for telecommunications on behalf of theInternational Telecommunication Union (ITU). It is based in Geneva, Switzerland. Priorto 1992, the ITU-T was known as the International Telegraph and TelephoneConsultative Committee (CCITT, from the French name "Comit¨| consultatifinternational t¨|l¨|phonique et t¨|l¨|graphique").

Internet Protocol The TCP/IP standard protocol that defines the IP packet as the unit of information sentacross an internet and provides the basis for connectionless, best-effort packet deliveryservice. IP includes the ICMP control and error message protocol as an integral part. Theentire protocol suite is often referred to as TCP/IP because TCP and IP are the twofundamental protocols. IP is standardized in RFC 791.

Inverse Multiplexingover ATM

Inverse Multiplexing over ATM. The ATM inverse multiplexing technique involvesinverse multiplexing and de-multiplexing of ATM cells in a cyclical fashion among linksgrouped to form a higher bandwidth logical link whose rate is approximately the sum ofthe link rates. This is referred to as an IMA group.

IP See Internet Protocol

ITU-T See International Telecommunication Union - Telecommunication StandardizationSector

L

L3VPN Layer3 Virtual Private Network

Label Switching Router The Label Switching Router (LSR) is the basic element of MPLS network. All LSRssupport the MPLS protocol. The LSR is composed of two parts: control unit andforwarding unit. The former is responsible for allocating the label, selecting the route,creating the label forwarding table, creating and removing the label switch path; the latterforwards the labels according to groups received in the label forwarding table.

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LAN See Local Area Network

Laser A component that generates directional optical waves of narrow wavelengths. The laserlight has better coherence than ordinary light. The fiber system takes the semi-conductorlaser as the light source.

LB See Loopback

link A network communications channel consisting of a circuit or transmission path and allrelated equipment between a sender and a receiver. A link is used to connect signalingpoints (SPs) and signaling transfer points (STPs) and transmit signaling messages.

LMSP Linear Multiplex Section Protection

Local Area Network A network formed by the computers and workstations within the coverage of a few squarekilometers or within a single building. It features high speed and low error rate. Ethernet,FDDI, and Token Ring are three technologies used to implement a LAN. Current LANsare generally based on switched Ethernet or Wi-Fi technology and running at 1,000 Mbit/s (that is, 1 Gbit/s).

Loopback A troubleshooting technique that returns a transmitted signal to its source so that thesignal or message can be analyzed for errors.

Lower subrack The subrack close to the bottom of the cabinet when a cabinet contains several subracks.

LSR See Label Switching Router

M

Maintenance Point Maintenance Point (MP) is one of either a MEP or a MIP.

Merge Point Merge Point. The LSR where one or more backup tunnels rejoin the path of the protectedLSP downstream of the potential failure. The same LSR may be both an MP and a PLRsimultaneously.

MP See Merge Point

MP See Maintenance Point

MPLS See Multi-Protocol Label Switch

Multi-Protocol LabelSwitch

A technology that uses short tags of fixed length to encapsulate packets in different linklayers, and provides connection-oriented switching for the network layer on the basis ofIP routing and control protocols. It improves the cost performance and expandability ofnetworks, and is beneficial to routing.

N

N63E cabinet A cabinet which is 600 mm in width and 300 mm in depth, compliant with the standardsof the ETSI.

NE See network element

network element A network element (NE) contains both the hardware and the software running on it. OneNE is at least equipped with one system control board which manages and monitors theentire network element. The NE software runs on the system control board.

Network to NetworkInterface

This is an internal interface within a network linking two or more elements.

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NNI See Network to Network Interface

O

OAM See Operation, Administration and Maintenanc

ODF See Optical Distribution Frame

Operation,Administration andMaintenanc

Operation, Administration and Maintenance. A group of network support functions thatmonitor and sustain segment operation, activities that are concerned with, but not limitedto, failure detection, notification, location, and repairs that are intended to eliminate faultsand keep a segment in an operational state and support activities required to provide theservices of a subscriber access network to users/subscribers.

Optical DistributionFrame

A frame which is used to transfer and spool fibers.

P

packet 1. A sequence of binary digits including data and call control signals that is switched asa composite whole. The data, call control signals, and possibly error control information,are arra nged in a specific format. 2. A short block of data of fixed length and destinationinformation. It is the information transmission unit of the packet switching network. Themaximum length of the information packet reaches 8000 bit. The information packet canbe tranfered from one metwork to another network. 3. Data packets and local packets.Logical grouping of information that includes a header containing control informationand (usually) user data. Packets are most often used to refer to network layer units ofdata.

Packet over SDH/SONET

A MAN and WAN technology that provides point-to-point data connections. The POSinterface uses SDH/SONET as the physical layer protocol, and supports the transport ofpacket data (such as IP packets) in MAN and WAN.

PCB See Printed Circuit Board

PDU See Power Distribution Unit

PDU Protocol Data Unit

Point-to-Point Protocol A protocol on the data link layer, provides point-to-point transmission and encapsulatesdata packets on the network layer. It is located in layer 2 of the IP protocol stack.

POS See Packet over SDH/SONET

Power DistributionUnit

The power distribution unit performs AC or DC power distribution.

PPP See Point-to-Point Protocol

Printed Circuit Board A board used to mechanically support and electrically connect electronic componentsusing conductive pathways, tracks, or traces, etched from copper sheets laminated ontoa non-conductive substrate.

Pseudo wire An emulated connection between two PEs for transmitting frames. The PW is establishedand maintained by PEs through signaling protocols. The status information of a PW ismaintained by the two end PEs of a PW.

PTN Packet Transport Network

E GlossaryOptiX PTN 1900 Packet Transport Platform of PTN Series

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PW See Pseudo wire

R

Radio NetworkController

A device used in the RNS to control the usage and integrity of radio resources.

RNC See Radio Network Controller

route A route is the path that network traffic takes from its source to its destination. In a TCP/IP network, each IP packet is routed independently. Routes can change dynamically.

S

SDH See Synchronous Digital Hierarchy

signal cable Common signal cables cover the E1cable, network cable, and other non-subscriber signalcable.

Synchronous DigitalHierarchy

SDH is a transmission scheme that follows ITU-T G.707, G.708, and G.709. It definesthe transmission features of digital signals such as frame structure, multiplexing mode,transmission rate level, and interface code. SDH is an important part of ISDN and B-ISDN. It interleaves the bytes of low-speed signals to multiplex the signals to high-speedcounterparts, and the line coding of scrambling is only used only for signals. SDH issuitable for the fiber communication system with high speed and a large capacity sinceit uses synchronous multiplexing and flexible mapping structure.

T

T63 cabinet A cabinet which is 600 mm in width and 300 mm in depth, compliant with the standardsof the ETSI.

TPS See Tributary Protection Switch

Tributary ProtectionSwitch

Tributary protection switching, a function provided by the equipment, is intended toprotect N tributary processing boards through a standby tributary processing board.

Tunnel A channel on the packet switching network that transmits service traffic between PEs.In VPN, a tunnel is an information transmission channel between two entities. The tunnelensures secure and transparent transmission of VPN information. In most cases, a tunnelis an MPLS tunnel.

U

Upload An operation to report some or all configuration data of an NE to the T2000. Theconfiguration data then covers the configuration data stored at the T2000 side.

Upper subrack The subrack close to the top of the cabinet when a cabinet contains several subracks.

upward cabling Cables or fibres connect the cabinet with other equipment from the top of the cabinet.

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V

Virtual Local AreaNetwork

A logical grouping of two or more nodes which are not necessarily on the same physicalnetwork segment but which share the same IP network number. This is often associatedwith switched Ethernet.

VLAN See Virtual Local Area Network

E GlossaryOptiX PTN 1900 Packet Transport Platform of PTN Series

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