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Bromont, Quebec, Canada — Holdingfast to the company’s goal of provid-ing seamless connectivity, track,trace and control (TTC) systemsprovider Cogiscan has partneredwith MIRTEC to develop an Industry4.0 solution for MIRTEC’s suite ofoptical inspection machines and soft-ware. Cogiscan’s Co-NECT produc-tion software is a standalone connec-

tivity solution for communication be-tween different machines, softwareand enterprise systems.

MIRTEC develops and manufac-tures automated optical inspectiontechnology for the SMT and LED in-dustries. For the past 18 years, thecompany has offered inspection ma-chines and a portfolio of related soft-ware applications.

Investing heavily in research anddevelopment, MIRTEC has also creat-ed a complete technology roadmap forIndustry 4.0 that involves close collab-oration with other leading machineand software vendors, in order to en-able the smart factory.

Chanwha Pak, CEO of MIRTEC,commented, “Connectivity with othermachines and software applications isthe key to enabling Industry 4.0.Seamless connectivity requires morethan just a communication protocol. Itrequires a complete and robust con-nectivity platform supported by ateam of integration experts to make itwork. Cogiscan and its Co-NECT

Fremont, CA — Specialized CoatingServices is expected to open a secondfacility in Billerica, Massachusetts,in mid-February of 2018. The 13,000ft2 (1,208m2) facility is designed tomeet the demand for professionalconformal coating and potting servic-es on the U.S. East Coast. Co-founders Rick Ramirez and KimAtkins spent the last few years re-searching various locations for thefacility before settling on Billerica.

Specialized Coating Services

has been providing contract confor-mal coating, potting and encapsula-tion, and ruggedization of PCBssince 1996. The company meets de-mand in a variety of industries, in-cluding medical, military, aerospace,commercial, and retail.

The new facility is currently be-ing equipped with the latest roboticand conventional spray systems,plasma treatment, cleaning, and ion-ic test equipment, as well as pottingand encapsulation meter mix sys-tems. “We’ve been providing confor-mal coating services to our Midwestand East Coast accounts for over fif-teen years. By opening a facility clos-er to these customers, it will enableus to provide quicker turns and re-duce freight costs. In addition, theneed for our services in these areascontinues to grow.” says Ramirez.

Certifications currently held inCalifornia and planned for the new

THE GLOBAL HI-TECH ELECTRONICS PUBLICATION February, 2018

Executives from Cogiscan and MIRTEC sign a partnership agreement to develop a collaborative Industry 4.0 solution.

Specialized Coating Services to Open Facility

Cogiscan and MIRTEC in Industry 4.0 Partnership

Continued on page 8

Next Month’s Focus

Assembly andProduction

Milpitas, CA — The year-end updateto the SEMI World Fab Forecast re-port reveals 2017 spending on fabequipment investments will havereached an all-time high of $57 bil-lion. High chip demand, strong pric-ing for memory and fierce competi-tion are driving the high level of fabinvestments, with many companiesinvesting at previously unseen levelsfor new fab construction and fabequipment.

The SEMI World Fab Forecastdata shows fab equipment spendingin 2017 increased 41 percent year-over-year. In 2018, spending is ex-pected to increase 11 percent to $63billion. While many companies, in-cluding Intel, Micron, Toshiba, West-ern Digital, and GLOBAL-FOUNDRIES increased fab invest-ments for 2017 and 2018, the strongincrease reflects spending by just twocompanies and primarily one region.

SEMI data shows a surge of in-vestments in Korea, due primarily toSamsung, which is expected to in-crease its fab equipment spending by128 percent in 2017, from $8 billion to$18 billion. SK Hynix also increasedfab equipment spending, by about 70percent, to $5.5 billion, the largestspending level in its history. Whilethe majority of Samsung and SKHynix spending remains in Korea,some will take place in China and theUnited States. Both Samsung and SKHynix are expected to maintain high

ATX/MD&MWest

This Month's Focus:

Test and Measurement

SEMI: NewHighs in FabSpending

JST Manufacturing developsan automated resist-strippingtool that slashes chemical us-age. EMS section begins on…

Tech-Etch releases new low-profile board-level shields.Product Preview begins on…

Page 72

Page 20

VOLUME 33 - NUMBER 1

Continued on page 8

Stripping Costs

From Photoresist

Processing

Page 58

Amber builds wireless mod-ules on the Raspberry Pi;MVP celebrates 25 years of in-spection and metrology; GLOptic measures LED lumi-nance to the latest CIE stan-dard. This issue’s Special Features begin on…

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In 2010, the U.S. dropped into second place as the world’s largest manufac-turer, with China taking the lead. Many complaints have been hurled atU.S. policy toward manufacturing over the last few years, such as the ex-

pense of employees and heavy-handed environmental regulations. Still, theU.S. is one of the best places to do business, with a wealth of advanced tech-nology available and strong intellectual property (IP) protection.

The number of jobs is changing, certainly, with less unskilled labor re-quired in many industries. However, according to Joel Kotkin, professor of ur-ban studies at Chapman University in California, 52 of the country’s 70largest metropolitan regions have seen growth in industrial employment since2011. A report by the U.S. Bureau of Economic Analysis showed that manu-facturing generates $1.40 for each dollar put in. This is much larger than themultiplier for business services, information, retail, or finance.

In fact, due to the accessibility of advanced technology and the securityof IP, manufacturing executives expect that by 2020, the U.S. will once againbe the most competitive manufacturing economy in the world. The decline ofactual manufacturing employment can be seen as a natural process that hasaffected many other industries, such as agriculture. As things become easierto do, or are changed by better information technology and automation, theyfrequently require fewer people.

As we begin 2018, many of the trade shows in our industry focus heavi-ly on automation and ever-greater efficiencies in production and material han-dling. February 6 to 8 we will be covering ATX/MD&M West in Anaheim, abroad-sweeping look at developments in everything from PCB production andstandalone robotics to packaging and plastics. After that, we gear up for IPCAPEX in San Diego, one of the most concentrated and influential electronicsmanufacturing exhibitions every year.

The lowering costs of automation, as well as software services that allowfactories and production lines to run more efficiently, are offering high-mix,low-volume manufacturers a chance to gain a competitive edge.

The dynamic electronics industry is tied closely to the pace of innovation.As new ideas and devices are created, manufacturers must be able to meet de-mand. Since the U.S. is the world’s cap-ital of tech innovation, the country’smanufacturers are well-positioned toget in on the ground floor of some trulyincredible products. r

Which comes first, greater speed, more storage, or greater connectivity?Do you really want your refrigerator to order your groceries? Howcomfortable are you about getting into a car with no steering wheel?

We are on the verge of assembling an entire cyber-physical environment, de-signed to blend seamlessly with our devices, homes and vehicles. While algo-rithm-creating titans, such as Google and Facebook, progress toward generalartificial intelligence (AI), a host of other technologies have cropped up. All ofthese incredible developments will require faster wireless communication,much higher bandwidths and more distributed computing.

Next-generation mobile network 5G, which is being developed by Sam-sung, Intel, Nokia, and others, promises to enable the massive data transfernecessary for applications like driverless automobiles and Internet of Things(IoT) devices. Besides improving coverage over 4G, 5G will offer data rates of100 megabits per second for metropolitan areas and tens of megabits per sec-ond for tens of thousands of simultaneous users. While chipmakers have beenpreparing for this new standard for the past couple of years, we can expect tosee the first implementations in the U.S. by Verizon and AT&T later this year.

Even with this sort of communications network in place, we will begin torely more heavily on edge computing — sending data processing to the edgesof a network, where it is most needed. With edge computing networks, data nolonger has to be trafficked through a central server, as with cloud computing,and can be spread over a huge area. With edge computing, devices can trans-mit data more efficiently, in smaller volumes, with lower latency, and withhigher security. Small packets of data are easier to screen for viruses, whichcan be detected early, before the data is moved further on toward the net-work’s core.

With millions of computing devices distributed throughout a smart city,for example, keeping track of them and each of their individual processesseems nearly impossible. Using blockchain technology, the underlying digitalledger system for cryptocurrencies like bitcoin, all of these devices can auto-matically record and verify each other’s actions, keeping the entire history vis-ible and completely secure from tampering. Combining blockchain with theIoT could enable traffic control across an entire city, optimizing the flow of au-tomated vehicles.

With all of this complicated computing infrastructure in place, the onlything missing is a way to control it easily. Interfacing with our devices is fi-nally shifting from typing and tapping to speaking. Amazon Alexa and GoogleAssistant are already in our homes and phones, and third-party developersare scrambling to include voice control in millions of new devices. These digi-tal assistants can control our home entertainment systems, answer questionsabout schedules and weather, look up information on the Internet and relayit, make calls and purchases, and all kinds of other things. Short of mind con-trol, what is easier than speaking to the device to let it know what we want?

Last year, analytics firm Flurry released a report showing that U.S. con-sumers spend up to five hours per day on mobile devices. This number hasgrown at an astonishing rate over the last decade. This rise in screen time islikely to continue as long as no other technology supplants the smartphone.However, the time is ripe for another shot at consumer heads-up displays(HUDs), even with the spectacular controversy in 2013-2014 around theGoogle Glass. Smash hit mobile game Pokémon Go blew the brakes off a nowbillion-dollar augmented reality (AR) entertainment industry.

Apart from the smartphone, AR offers another, more integrated ap-proach to digitally interacting with the physical world. With a set of stylishAR glasses, the phone can stay in the pocket and all the information we wantwill be in front of our eyes at any time. This makes it easy to stock virtual in-ventory in stores, dress mannequins and change them with a hand gesture,translate the language of signage, and customize interactive advertising expe-riences to each individual viewer. For manufacturing, Google is now offeringits Glass Enterprise Edition, which provides hands-free information to work-ers as they perform complex assembly tasks.

All of this technology is ushering in a new era of efficiency and conven-ience, but is not without its challenges. Cybersecurity and privacy will befront and center. Regulations at all levels, from localities to the federal gov-ernment, will need to be hashed out. In the end, consumers themselves willultimately determine the pace of adoption. r

February, 2018www.us- tech.com

SOUNDING OFF

By Michael Skinner,

Editor

Not the Matrix: The EmergingCyber-Physical Landscape

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levels of investment in 2018.This year, China is expected to

begin equipping many fabs con-structed in 2017. In the past, non-Chinese companies accounted for themost fab investment in China. Forthe first time, Chinese-owned devicemanufacturers will approach parity,spending nearly as much on fabequipment as their non-Chinesecounterparts. In 2018, Chinese-owned companies are expected to in-vest about $5.8 billion, while non-Chinese will invest $6.7 billion.Many new companies, such asYangtze Memory Technology, FujianJin Hua, Hua Li, and Hefei Chang

Xin Memory, are investing heavily inthe region.

Historic highs in equipmentspending in 2017 and 2018 reflectgrowing demand for advanced de-vices. This spending follows unprece-dented growth in construction spend-ing for new fabs also detailed in theSEMI World Fab Forecast report.Construction spending will reach all-time highs with China constructionspending taking the lead at $6 billionin 2017 and $6.6 billion in 2018, es-tablishing another record. No regionhas ever spent more than $6 billionin a single year for construction.Web: www.semi.org r

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Contents

Continued from page 1

SEMI: Fab Spending

Organ-on-a-Chip Models Heart Disease

Washington, D.C. — When studyingdiseases or testing potential drugtherapies, researchers usually turnto cultured cells in Petri dishes or ex-periments with lab animals, but re-cently, researchers have been devel-oping a different approach: small, or-gan-on-a-chip devices that mimic thefunctions of human organs, servingas potentially cheaper and more ef-fective tools.

Researchers have built a newdevice that is especially good formodeling atherosclerosis — the con-striction of blood vessels that is theleading cause of heart attacks andstrokes. In a paper appearing in APLBioengineering, from AIP Publishing,researchers illustrate how the newdevice can be used to study impor-tant inflammatory responses in cellsthat line the vessel in ways thatcould not be done in animal models.The research team also explains howthis organ-on-a-chip could improveblood testing for patients.

“Atherosclerosis is a very im-portant and complex disease,” says

Han Wei Hou, a biomedical engineerat Nanyang Technological Universityin Singapore. It develops when fat,cholesterol and other substances inthe blood form plaque that accumu-lates on the inside walls of arteries.This buildup constricts the blood ves-sel, causing cardiovascular diseases.

Understanding what regulatesthis abnormal vessel constriction iscrucial to studying and treating ves-sel disease and preventing acute car-diac arrest. While researchers havepreviously developed organ-on-a-chipmodels of blood vessels, those devicesfocused more on recreating the ves-sel’s biological complexity than on itsshape and geometry — which are keyfactors in atherosclerosis, Hou says.“It involves not just the biological as-pect of endothelial dysfunction, butalso the biomechanics of blood flow.”

To address blood flow, the re-searchers built a device that fits on a1 in.2 (6.5 cm2) chip, consisting of twostacked chambers separated by athin and flexible polymer membrane.

Continued on page 8

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technology is a staple of the electron-ics industry. We want to partner withthe best company to provide the bestvalue to our customers.”

Co-NECT is built on the stan-dard Cogiscan TTC platform thatwas created more than 15 years ago.It adapts to each individual cus-tomer’s requirements, regardless ofthe mix of machines and software al-ready in place. Mitch Decaire, globalaccount manager for equipment part-ners at Cogiscan, said, “We are very

excited to announce this new part-nership. We look forward to helpingMIRTEC and its customers gain acompetitive edge by achieving theconnected factory.”

Contact: Cogiscan, Inc., 28-Bboulevard de l’Aeroport, Bromont,Quebec, Canada J2L 2N8 % 450-534-2644 E-mail: [email protected]: www.cogiscan.com andMIRTEC Corp., 3 Morse Road, Ox-ford, CT 06478 % 203-881-5559 fax: 203-881-3322 E-mail: [email protected] Web: www.mirtec.com r

Cogiscan and MIRTEC...Continued from page 1

facility include AS9100D, ISO9001:2015, ITAR, and ANSI/ESDS20.20 mid-2018, with NADCAPplanned for late 2018. “With thesecertifications, our customers knowthat their boards will be handled incompliance with the latest practicesand procedures,” says Atkins.

The investment in the new U.S.facility underscores the company’scommitment to reshoring manufactur-ing jobs and growing the business.Specialized Coating Services has re-designed its website to focus on the in-formation that potential buyers needto make purchasing decisions. Thecompany also focused on developing astrategic presence on ThomasNet.com,a popular product sourcing and suppli-er discovery website.

As a result, the company hasgrown from a local service providerto a global specialist, attractingworldwide accounts and bringingmanufacturing jobs back to the U.S.One specific customer that made aconnection through ThomasNet.com

manufactures between 3,000 and5,000 parts per month and shipsthem to Specialized Coating Servic-es before final assembly.

Contact: Specialized CoatingServices, 42680 Christy Street, Fremont, CA 94538 % 510-226-8742 E-mail: [email protected] Web: www.speccoat.com r

Specialized Coating ServicesContinued from page 1

Neu Dynamics Corp is an ISO 9001:2008 certified Tool, Mold and Die man-ufacturer specializing in tooling and equipment used in buildingSemiconductors, Electronics, components and a wide variety of the devicesused in automotive, telecommunications, solar and medical applications.

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The bottom contains air while the topcontains a flowing fluid similar inmechanical properties to blood. In-side the fluid-filled chamber on top ofthe membrane, the researchers growendothelial cells — the cells that linethe inside of blood vessels. The re-searchers pump air into the bottomchamber, so the membrane stretcheslike a balloon and forms a bubblethat blocks the fluid flow. Thisprocess simulates the narrowing of avessel.

The fluid-filled chamber con-stricts, causing the fluid to flowfaster in some regions and slower inothers. When the researchers grewthe cells under continuous but slowfluid flow, endothelial cells wereable to grow and express a proteincalled ICAM-1. This protein is asso-ciated with inflammation and is im-portant in the development of ather-osclerosis.

The researchers found thatwhen they replaced the cell culturemedia with human blood, more im-mune cells called monocytes bound tothe endothelial cells in low-flow re-gions. Monocytes are mainly respon-sible for the accumulation of lipids,which eventually develop into theplaque that causes atherosclerosis.

These results on a chip are con-sistent with the widely-accepted pic-ture of the disease: Disturbed blood

flow in constricted vessels promotesvascular inflammation, which en-courages the recruitment of mono-cytes to help create plaques. “Thenew model can more accurately sim-ulate atherosclerosis because the re-searcher can precisely tune constric-tion by controlling the air pressure,”Hou says. This device could poten-tially help researchers better under-stand atherosclerosis and developnew treatments.

“The device has a lot of promisein terms of diagnostics,” Hou says. Asa proof-of-concept experiment, the re-searchers pumped blood spiked withTNF-alpha, a protein that is a sign ofinflammation, into their device. Theinflamed blood caused more immunecells to bind to the endothelial cellsthan normal. Measuring the numberof bound immune cells can reveal thelevel of inflammation in the blood, anindicator of early atherosclerosis. Incontrast to other tests that onlycount the number of immune cellscirculating in blood, this techniquecould more accurately assess earlyimmune responses in patients.

Web: www.aip.org r

The full article, “A Tunable Mi-crofluidic 3D Stenosis Model to StudyLeukocyte-Endothelial Interactionsin Athersclerosis,” can be found at:www.aip.scitation.org/doi/full/10.1063/1.4993762

Organ-on-a-Chip...Continued from page 6

Specialized Coating Services'

cofounders Kim Atkins (left)

and Rick Ramirez (right).

http://WWW.NDC-INT.COM

http://www.MasterAppliance.com

www.us- tech.comFebruary, 2018

http://www.kohyoung.com/

The promise of LiFi (light fideli-ty), which uses the same LEDlights that illuminate a work

space to transmit secure, high-speed,wireless data at rates that can gowell beyond those possible with Wi-Fi, has now advanced to the point ofintroducing a new form of main-stream implementation.

This new development resultsfrom the introduction of the firstLED “light bar” fixtures equippedwith the required transmission tech-nology and designed to replace themost ubiquitous form of lighting incommercial and industrial facilities:fluorescent tubes.

With an estimated three to fourbillion fluorescent tubes installedglobally, the integration of built-inLiFi transmission technology in newand retrofit LED light bars is nowmoving LiFi beyond the pilot stage tofull-scale implementation in offices,schools, warehouses, and other facil-ities.

What is LiFi?

LiFi is a high-speed, secure, ful-ly-networked wireless communica-tion technology similar to Wi-Fi.However, LiFi makes use of the en-tire light spectrum where Wi-Fi usesradio frequencies (RF).

To do this, the LED light fix-tures used in many energy-conscioushomes and offices are outfitted witha module that controls the light foroptical data transmission. The highspeed light pulses are invisible to thenaked eye, yet can be used to trans-mit data at extremely high speeds toa receiving device located in a laptop,computer tower, cellphone, or othersmart device.

In the future, LiFi will be em-bedded into the mobile devices weuse every day, as well as play a keyrole in machine-to-machine (M2M)communication and the Internet ofThings (IoT).

The utilization of visible lightprovides a host of intriguing benefits

that far outpace what is currentlypossible with the radio frequencywaves used by Wi-Fi and cellularnetworks.

When compared with the over-loaded full RF spectrum, the lightspectrum is 1,000 times larger and iscurrently unregulated, with no li-censing fees. In lab conditions, thetechnology is already capable of 10Gb/s speeds, and with the availablebandwidth potential, data transmis-sion speeds up to 100 times fasterwill be possible in the near future.

LED Manufacturers Advance LiFi Technology

According to Harald Haas, co-founder and chief science officer ofpureLiFi, a company that is spear-heading the development of the tech-nology, the implementation of thetechnology into lighting fixtures hasnecessitated a close partnership withLED light manufacturers.

“The lighting manufacturersare critical to moving LiFi forward,”says Haas. “They know how to designlights and fixtures, and we knowwhat needs to be done to create high-speed data networks out of light.”

Until recently, most of these fix-tures were small lamps or recessedcan lights. Now, one of pureLiFi’spartners, Linmore LED, is introduc-ing the first LiFi-enabled LED lightbars designed to replace fluorescenttube lighting.

Linmore LED is currently dem -on strating a complete, functional LiFisystem at its facility in Fresno, Cali-fornia. With this technology, uploadand download data speeds of 43 Mb/shave been recorded.

According to Paul Chamberlain,CEO of Linmore LED, the partner-ship with pureLiFi was a good fit,due to the modular nature of thecompany’s LED light bars. The prod-uct’s design allowed for the integra-tion of the LiFi modules in the idealposition on the light bar, without af-fecting critical aspects, such as light-ing distribution, thermal dissipationand overall performance.

Retrofit fixtures, even thosethat are not LiFi-enabled, are ingreat demand, as many facilitiesseek to drive down energy costs by asmuch as 70 to 80 percent by convert-ing to LED technology. This trend isalso being driven by the increasedoperating life of LEDs and concernsabout the toxic mercury within fluo-rescent lamps that complicates dis-posal.

Security Benefits

Among the expected earlyadopters of the technology are thosethat seek greater security of datatransmission than is possible with

Wi-Fi. Initial markets expected toadopt LiFi technology include federalgovernment and defense, banking, fi-nancial institutions, and hospitals.

LiFi is a far more secure form ofdata transmission than Wi-Fi, be-cause a receiving device must be di-rectly within the cone of light to re-ceive a broadcasted signal. Visiblelight, including near-infrared wave-lengths, cannot penetrate opaque ob-jects like walls, which means thatthe wireless signal is constrained towithin a strictly-defined area of illu-

mination.Wi-Fi, on the other hand, uti-

lizes radio waves that are widelybroadcast, even outside a building,where it can be easily intercepted formalicious purposes.

In a “man-in-the-middle” at-tack, the attacker must be able to in-tercept all relevant messages passingbetween the two victims and injectnew ones. This is straightforward inmany circumstances. For example,an attacker within reception range ofan unencrypted wireless access point(Wi-Fi) can insert himself as a manin the middle.

File access is permitted only if adevice is connected to the LiFi net-work. Once a user connects to the Li-Fi network, they can download andmodify certain files. It is also impossi-ble for a nearby employee to interceptinformation sent to the server/net-work by another employee, since theuplink communication is on a differ-ent frequency than the downlink.

Every device that can connect tothe network can be tracked using thetechnology. The same LiFi module en-ables “communication on the move”by tracking the transmission sourceelectronically, with no moving parts.

Now that one of the final barri-ers to full-scale implementation hasbeen overcome with the introductionof LiFi enabled LED light bars, thetechnology is expected to continue toadvance under an “aggressive strate-gy of miniaturization and lowercosts,” says Haas.

Contact: pureLiFi, 9 HaymarketTerrace, Edinburgh, Scotland, UK,EH12 5EZ % +44-0-131-516-1816Web: www.purelifi.com r

Tech WaTch


Tech WaTch

LiFi Ready for its Moment in the Spotlight

By Jeff Elliott

LiFi is a high-speed, secure, fully-networkedwireless communication

technology similar to Wi-Fi.However, LiFi makes use of

the entire light spectrumwhereas Wi-Fi uses (themuch narrower) radio frequency (RF) band.

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Procurement organizations man -aging electronic components are facingonslaughts from two powerful stormfronts — a major surge in demand onone side and a critical shortage ofparts and materials on the other.These two factors are aligning perfect-

ly to batter buyers with successivewaves of shortages, price hikes andlengthening lead times. With thischallenging climate forecasted tolinger at least through the first half of2018, buyers need to take immediatemeasures to ensure supply continuity.

The mobile and automotivemarkets are driving demand for keycommodities, particularly passives,diodes, transistors, and memorychips. Each new high-end smart-phone released during the last threeyears has doubled its memory con-tent, on average. Meanwhile, theelectronic content of cars is increas-ing sharply, with electric vehicles re-quiring three to four times as manymultilayer ceramic capacitors thanconventional gas-powered cars.

This increase in usage is strain-ing the capability of suppliers tomeet demand. Many suppliers ofcomponents have shifted their capac-ity to leading-edge technologies. This

has resulted in shortages of mature,less-profitable product families. Sup-pliers that continue to manufacturesuch legacy products will only pro-duce those parts at profitable levels,generating price increases across thewider customer base.

Some manufacturers of stan-dard commodity products have con-firmed with Jabil that they are im-plementing allocation processes.With these sources rationing supplyon a customer-by-customer basis,many buyers may be unable to se-cure sufficient quantities of parts.

Because no lessening of demandis expected for the mobile and auto-motive markets in the near term,these market dynamics are unlikelyto change soon. In light of this reality,Jabil strongly recommends that buy-ers provide visibility to demand, andwhere possible, place extended ordersfor components in order to lock in sup-ply. When a buyer enters such a long-term supply agreement, it should en-able the supplier to reserve capacityto manufacture the longer-term com-ponent demand. This kind of insightleads to better support and servicefrom the supplier.

Passive Commodities. Supplies ofceramic capacitors are dwindling assmartphone makers dominate theconsumption of smaller-case-size,high-capacitance MLCCs, while au-tomotive makers secure most of thehigh-reliability components. Avail-ability of other types of MLCCs havealso decreased, because suppliershave shifted their investments to thetypes required by smartphone andautomotive makers.

Ceramic capacitor lead timesare increasing, particularly for smallcase sizes and automotive-gradeparts. This is expected to persist forthe next 9 to 12 months. Lead timesfor film capacitors have stretched to24 to 38 weeks, due to capacity con-

straints. Film capacitor companieshave no plans to expand manufactur-ing capacity in the short term.

Semiconductor Commodities. Inthe analog semiconductor segment,the average lead time for standardlinear parts has expanded to between8 and 10 weeks. The lead time forhigh-performance analog is now 10 to14 weeks. Capacity utilization formanufacturers of these parts now ex-ceeds 90 percent. Lead times are ex-pected to increase through Q1 2018.

High-End Semiconductor. Overallsupply is tight for high-end semicon-ductors, including chipsets, microcon-trollers, programmable logic, and ap-plication-specific ICs. Demand fromthe automotive market remainsstrong, due to the increasing electron-ic content in vehicles.

Major mobile device brands areexpected to generate strong sales. In-dustrial markets are picking up. Thebook-to-bill ratio for high-end semi-conductors is higher than 1.00, indi-cating continued strong demand.Suppliers are continuing to build-to-order for high-end semiconductors.In order to retain allocation, buyersshould avoid pushing out orders.

Interconnect Commodities. In theconnector market, no allocation ormajor constraints in supply are ex-pected for the next six months, withthe exception of products from a fewspecific suppliers. Most suppliers areexperiencing strong demand fromthe automotive market.

PCB Commodities. Revenue ex-panded for the major PCB suppliersbased in Japan, Taiwan and Chinaduring the first six months of 2017.The majority of the increased rev-enue for Japanese and Taiwanesemanufacturers was generated bysales to smartphone manufacturersand the automotive industry. Load-ing for PCB shops in Chinese plantsis running at between 75 and 85 per-cent. Chinese PCB suppliers are at90 percent capacity, mainly drivenby demand from the automotive mar-ket. The average lead time is 6 to 8weeks for conventional PCBs and 10weeks for complex boards.

Contact: Jabil Circuit, Inc.,10560 Dr. Martin Luther King Jr.Street N, St. Petersburg, FL 33716% 727-577-9749 Web: www.jabil.com r

The full report is available on-line at https://www.jabil.com/solu-tions/featured-solutions/supply-chain-orchestration/idsc-managed-services/procurement-services/gat-ed_content/procurement_intelli-gence_commodity_report.html

Supply Chain


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Jabil Introduces Procurement Intelligence Commodity (PIC) Report

By Graham Scott, Senior Director of Global Commodity Management, Jabil

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PeoPle in the news

Optical-Control Hires Todd O’Neil toLead North AmericaAtkinson, NH — Optical-Control GmbH & Co. KG, a manufacturer of automat-ed component counting technology using X-ray imaging, has hired Todd O’Neilto build and manage its team in North America. Mr. O’Neil is a veteran of theelectronics industry and has more than 25 years of experience. Optical-ControlGmbH & Co. KG is a full-service EMS company and a part of the Elsysko Group,with 180 employees, four SMT lines, and two throughput lines. In 2012 it formeda sales and service organization for the CCX (component counter X-ray) and de-buted its first system in 2013. Web: www.optical-control.de

Texas Wai Sze JoinsOptimal Electronics in ChinaAustin, TX — Optimal Electronics Corporation has hired Texas Wai Sze as thesales manager for its new office in Shenzhen, China. The company is buildingits presence in China, offering smart factory software for the electronics as-sembly industry. Mr. Wai Sze has years of experience in software sales, estab-lishing partnerships and hiring engineers to provide local support. He will beresponsible for supporting the company’s expansion in China and providingOptimal Electronics’ Optel™ smart factory software. Web: www.optelco.com

Don Phifer Joins Outside Sales at MicroCareNew Britain, CT — MicroCare has appointed Don Phifer West Coast regionalmanager for precision cleaning products. Mr. Phifer comes to MicroCare with 28years of experience in electronics and electrical distribution. While in distribu-tion, Mr. Phifer developed a specialty service, orchestrating a “vendor managed”inventory program, which helped clients to reduce their inventory carrying costs.Prior to joining MicroCare, Mr. Phifer worked for EIS, Inc. His industry-specificexperience spans medical, aerospace, defense, automotive, and commercial elec-tronics. Web: www.microcare.com

Ersa Strengthens Service Team withQuin Van Den BergPlymouth, WI — Kurtz Ersa North America has hired Quin Van Den Berg asthe newest member of its service team. Mr. Van Den Berg will report to ChadSuckow and will be responsible for helping the tools, rework and inspectionteam support growing service needs. Mr. Van Den Berg comes to the compa-ny from Wells Vehicle Electronics, where he was a test engineering technicianand was responsible for building, wiring and installing production and lab testequipment and fixtures. He also has experience as a lab test technician wherehe used data acquisition systems to conduct testing and quality assuranceanalysis. Web: www.ersa.com

Scienscope Promotes Don Jeka to National Sales ManagerChino, CA — Scienscope International has promoted Don Jeka to nationalsales and marketing manager for its X-ray division. Mr. Jeka joined Scien-scope in February 2016 as eastern regional sales manager, handling the salesmanagement responsibilities for the eastern half of the U.S. and Canada forScienscope’s X-ray products division. In his new role, Mr. Jeka will head upScienscope’s sales and marketing efforts, further enhancing the company’s po-sition in the market and highlighting its “customer first” strategy. Mr. Jekawas formerly vice president of sales and marketing for Vitronics Corporation.Web: www.scienscope.com

Tapecon Promotes Jeff Davis to Sales ManagerBuffalo, NY — Tapecon has promoted Jeff Davis to sales manager. Mr. Davisjoined the company in 2011 and has worked in several departments of the com-pany. He started at the company as a project coordinator and advanced quicklythrough several positions before his most recent position as customer servicemanager. Tapecon is a five-generation, family-owned contract manufacturer.The company manufactures functional graphics and materials for challengingenvironments, as well as offering specialized industrial printing, flexible elec-tronics and disposable medical device manufacturing. Web: www.tapecon.com

UNITRON Appoints Mark Clymer Director of MarketingCommack, NY — UNITRON has appointed Mark Clymer director of market-ing. In this newly-created position, Mr. Clymer will be responsible for all ofthe company’s marketing activities, including the areas of product marketing,product management and public relations. A 30-year veteran of microscopyand optical imaging, Mr. Clymer has made significant contributions in mar-keting and sales roles with leading microscope manufacturers and a globalpharmaceutical company. He also has experience in R&D positions in phar-maceuticals and biotech. Mr. Clymer is a regular lecturer on the topic of mi-croscopy and has authored numerous articles. Webb: www.unitronusa.com

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Business newsBusiness news

Mycronic Renews Partnership withAegis for FactoryLogixRowley, MA — Mycronic will includeAegis Software’s FactoryLogix NPIas the main programming interfacefor its MY700 jet printer and jet dis-penser. The customized software,branded FactoryLogix Express, willalso have the capability to preparedata for Mycronic’s range of pick-and-place machines, through an op-tional TPSys output interface.

“The MY700 is a fast jet dis-pensing platform, capable of shootinga vast range of media, including sol-der paste, at speeds up to 300 dots

per second. Aegis’ powerful Factory-Logix software provides the type ofversatile and field-proven NPI capa-bility that makes the MY700 an ex-cellent solution for both high-mixand high-speed dispensing applica-tions,” says Clemens Jargon, VPglobal dispensing, Mycronic.

As part of the agreement, My-cronic will provide an upgrade path forearlier generation machines, enablingMY500 and MY600 users to also bene-fit from the renewed partnership.

“We are proud to be part of My-

cronic’s offering,” says Jason Spera,CEO of Aegis. “Mycronic and Aegishave a long history of cooperation, go-ing back more than 15 years. It’s withgreat pleasure that we see this coop-eration continued and strengthened.”

Contact: Mycronic, Inc., 320Newburyport Turnpike, Rowley, MA01969 % 978-948-6919 fax: 978-948-6915 Web: www.mycronic.com andAegis Industrial Software Corp., 5Walnut Grove Drive, Suite 320, Hor-sham, PA 19044 % 215-773-3571Web: www.aiscorp.com r

Gilching, Germany — Electronic As-sembly GmbH began by buildingpower saving kits for LCD clocks in1977. Today, the company is one ofthe leading manufacturers of indus-trial display technology.

When the company began, de-mand for LCD screens was very high,and functional modules, such as volt-meters and various counter modulesdeveloped quickly. Soon, the first con-troller boards were invented, assem-bled and distributed along with LCDs.

With segment and dot matrixmodules, and later with graphic dis-plays, Electronic Assembly capturedits market.

In the mid-1990s, the companywas one of the first to develop touchpanels and launched a professionalcontrol unit with its own flash mem-ory, operating software and integrat-ed touch panel.

The company strives for thehighest quality, long-term availabili-ty, excellent support, and has one ofthe largest display warehouses inEurope. The company ranks amongthe top R&D companies in the Euro-pean display market, due to develop-

ment efforts, advanced production,and decades of experience.

The company is now successfulworldwide and recently introducedits DISPLAY VISIONS brand to theinternational market.

Along with other new displayseries, such as the special chip-on-glass series, the intelligent uniTFT

and its OLED series launched in2017, the company is well-positionedfor the future.

Contact: Electronic AssemblyGmbH, Zeppelinstrasse 19, 82205Gilching, Germany % +49-0-8105-77-8090 fax: +49-0-8105-77-8099 E-mail: [email protected] Web: www.lcd-module.com r

Electronic Assembly GmbHCelebrates 40 Years

Electronic Assembly general managers Carola Wittmann (left) and Stefan Eber (right).

Schleuniger to Acquire adaptronic Prüftechnik GmbHManchester, NH — Schleuniger Group has signedan agreement to acquire 60 percent of adaptronicPrüftechnik GmbH, based in Wertheim, Germany.The transaction is expected to be concluded earlythis year. A manufacturer of wiring test systemsand functional test systems, adaptronic has around140 employees.

By acquiring adaptronic, Schleuniger isadding customized solutions for testing cable har-nesses, connectors and assemblies for aviation,railway technology, automotive, automation, andindustrial technology to its existing service range.

adaptronic Prüftechnik creates application-specific test systems and adapter solutions for wireharnesses, which it supplies to customers in a widerange of markets. Its product portfolio comprises

wiring test systems, adapters, test tables, and testconsoles for high- and low-voltage applications, allbacked by software.

The company generates a significant portionof its sales through customer-specific applicationengineering and the maintenance of the test sys-tems that it supplies.

Following the transaction, the remaining 40percent of the business will remain primarily inthe hands of adaptronic’s founder and currentprincipal owner Peter Müller and the current mi-nority shareholder, Stefan Friedrich.

Contact: Schleuniger, Inc., 87 Colin Drive, Manchester, NH 03103 % 603-668-8117 E-mail: [email protected] Web: www.schleuniger-na.com r

HELUKABELBreaksGround forNew U.S.HeadquartersElgin, IL — HELUKABEL® USA hasbroken ground for its new U.S. head-quarters. The eight acre property islocated in the Chicago suburb of WestDundee. The initial structure will bea 75,000 ft2 (6,968m2) facility, with7,000 ft2 (650m2) allotted for officespace and the rest for warehousingthe company’s cabling products andaccessories. The site will allow thecompany to expand up to 200,000 ft2

(18,581m2) as it grows in the future.HELUKABEL USA was found-

ed in 2007 and has expanded rapidly.“This is the second physical expan-sion over the last 10 years. The com-pany started out in a 13,000 ft2

(1,208m2) facility and moved into a43,000 ft2 (3,995m2) five years ago,”says Markus Dannheim, president ofHELUKABEL USA. “It was impor-tant to find a property in close prox-imity to our current location, in orderto maintain our existing employeebase. Our employees and the relation-ships they have created with cus-tomers around the world are a funda-mental key factor for the continuedsuccess of our company.” It was alsoimportant for the company to haveimmediate interstate access, mini-mizing lead times for customers.

The groundbreaking ceremonywas attended by HELUKABEL exec-utives and management, as well asseveral city officials, including ChrisNelson, mayor of West Dundee. Theacquisition of the property and con-struction of the new building is astrategic milestone for the company,creating additional office, opera-tional and warehouse space.

Contact: HELUKABEL USA,Inc., 1490 Crispin Drive, Elgin, IL60123 % 847- 930-5118 E-mail: [email protected]: www.helukabel.com r

Executives from Schleuniger Group and adaptronic celebrate the acquisition.

Business Briefs

Heraeus Signs Agreement with Mozaik West Conshohocken, PA — Heraeus Electronics has signed a global licensingagreement with Mozaik Technology Ventures, a manufacturer of fine thick-film technology, including photoimageable thick-film paste technology. Thepartnership with Mozaik will enable Heraeus to meet the needs of customerswho manufacture sensors, 5G high-frequency communication circuits, smallpassive electronic components and touchscreen displays. The photoimageabletechnology will be used to create a platform of thick-film pastes, such as sil-ver, silver-platinum, silver-palladium, gold, platinum conductors, and ceram-ic/glass insulators for these specific applications.

Contact: Heraeus, Inc., 24 Union Hill Road, West Conshohocken, PA19428 % 215-944-9981 E-mail: [email protected] Web: www.heraeus-electronics.com

Lenthor Sees Solid Q3 2017 ResultsMilpitas, CA — Lenthor Engineering, a manufacturer and assembler of rigid-flex and flex PCBs has released its Q3 2017 financial results. Total revenuecame in two percent higher than Q3 2016. Profit levels remained steadythroughout the year, with an expectation that they will be higher overall thanin 2016. The company’s strong financial position allows it to continue fundingits business expansion plans including total capital expenditures of $2.4 mil-lion for 2017. This investment includes both SPI and component AOI systems,along with a new pick-and-place line.

Contact: Lenthor Engineering, 311 Turquoise Street, Milpitas, CA 95035% 408-957-3487 E-mail: [email protected] Web: www.lenthor.com

Panasonic Pick-and-Place Wins Global Technology AwardRolling Meadows, IL — Panasonic has won a “Global Technology” award fromGlobal SMT and Packaging for its new NPM-W2S component placement system.The award was given at productronica in November. The NPM-W2S is the nextplatform in the company’s NPM series and is designed for manufacturers whovalue reduced set up and changeover time over faster throughput. Equipped witha multi-recognition camera, the machine provides component alignment, defectinspection, chip thickness, and 3D coplanarity inspection in a single pass.

Contact: Panasonic Factory Solutions Company of America, 1701 Golf Road, Suite 3-1200, Rolling Meadows, IL 60008 % 847-637-9600 E-mail: [email protected] Web: www.panasonicfa.com

IQD Frequency Products Now Part ofWürth GroupWaldenburg, Germany — IQD Frequency Products, Ltd., based in Crewkerne,U.K., and IQD Frequency Products, Inc., based in Palm Springs, California,U.S.A, are now part of the Würth Elektronik eiSos Group. This expandsWürth Elektronik’s existing selection of passive components with a compre-hensive range of quartz crystals and oscillators. IQD develops, manufacturesand markets quartz crystals, oscillators, VCXOs, TCXOs, OCXOs, GPS-syn-chronized OCXOs, and rubidium oscillators. The company also offers productsbuilt to customer specifications in a range of industries, including communi-cations, computing, consumer, automotive, aerospace, and medical.

Contact: Würth Elektronik eiSos GmbH & Co. KG, Max-Eyth-Strasse 1,74638 Waldenburg, Germany % +49-7942-945-5186 E-mail: [email protected] Web: www.we-online.de

Jabil to Manufacture Baicells Mini-Cell Base StationsSt. Petersburg, FL — Jabil is now supporting Baicells by manufacturing thecompany’s 10W mini-cell base station, an LTE wireless broadband access de-vice. Under the agreement, Jabil will provide manufacturing services to sitesin the U.S., China, Southeast Asia, Brazil, and Europe. At the same time, Bai-cells will leverage Jabil’s expertise in design for manufacturing (DFM), testdevelopment and hardware design to improve the reliability and quality of itswireless products. As wireless networks and hardware continue to evolve from4G to 5G, strong design capabilities allow manufacturers to help telecom ven-dors remain competitive.

Contact: Jabil Circuit, Inc., 10560 Dr. Martin Luther King Jr. Street N,St. Petersburg, FL 33716 % 727-577-9749 E-mail: [email protected]: www.jabil.com

HARTING Garners “Innovator of theYear” AwardElgin, IL — At a ceremony in Munich, Germany, HARTING was given an “In-novator of the Year” award by trade magazine DESIGN&ELEKTRONIK. Theaward was presented in recognition of HARTING’s ix Industrial® connector.The connector was developed by HARTING, in partnership with Japan’s HI-ROSE technology group. The partners standardized the mating face of the ix In-dustrial to meet IEC/PAC 61076-3-124 requirements. This provides investmentsecurity, as well as a new solution for Internet of Things (IoT) applications.

Contact: HARTING North America, 1370 Bowes Road, Elgin, IL 60123 % 847-717-9217 E-mail: [email protected] Web: www.harting.com


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Supplier information, customerdata, processes and procedures,and intellectual property (IP)

are all examples of “crown jewel” da-ta that manufacturers must protect.In the brave new world of networkeddata, mobile devices and the Internetof Things (IoT), manufacturers needto shift their thinking to protect thiscritical information.

Before the Internet, mobile de-vices and cloud-based applications,manufacturing was disconnected andlargely isolated. Control was mucheasier to be had when the perimeterswere defined by the physical facility.Data security was never an issue,rather, the issues were of perform-ance, safety and reliability.

Harder to Stay Safe

As more systems are networkedtogether, their points of weaknessmultiply. Hackers don’t need to de-feat an entire system, they need onlyto exploit a single weak point, suchas a software bug, poor password or anegligent or even malicious employeewith security credentials.

A few years ago, Foxconn wasbreached by a hacktivist group thatreleased employees’ login informa-tion. In 2017, the WannaCry ran-somware attack affected more than200,000 systems in 150 countriesaround the world. While the malwarewas not explicitly designed to targetindustrial control systems, it man-aged to infiltrate them nonetheless.

The Verizon 2017 Data BreachInvestigation Report noted that mostcomputer intrusions in the manufac-turing industry begin with a well-crafted spear-phishing e-mail. Thismessage contains a malicious link orattachment that is sent to a companyemployee. In such cases, malware isinstalled after the attachment isopened, giving the attacker remoteaccess to an internal computer.

In 2016, social engineering andmalware-based cyber attacks com-bined accounted for 73 percent of da-ta breaches in the manufacturingsector. Cyber espionage is anotherdrive behind many attacks. As Veri-zon stated in its report: “When youmake stuff, there is always someoneelse who wants to make it better, orat least, cheaper. A great way tomake something cheaper is to letsomeone else pay for all of the R&Dand then simply steal their intellec-tual property.”

A recent threat intelligence re-port found that cyber attacks in-creased 24 percent globally duringthe second quarter of 2017, comparedwith the first three months of theyear — with the manufacturing in-dustry being the most heavily target-ed. The report goes on to attributethe increase of attacks within manu-facturing to three factors: fierce com-petition in a sector where IP is at apremium; the fact that industrialcontrol systems are often left un-guarded; and a lack of investment incybersecurity, due to a focus on pro-ductivity and efficiency.

Increased connectivity throughuse of the IoT opens the door to addi-tional vulnerability as well. The reportalso highlights that 21 percent of man-ufacturers have suffered a loss of IP incyberattacks, and more than 90 per-cent of the material stolen has beenclassified as secret or proprietary.

Taking Steps to Battle Threats

The need to protect operations,IP, and infrastructure assets, as wellas customer and employee informa-tion requires a heavy focus on datasecurity. The following are a few rec-ommendations to help protect data:

l Segment sensitive data from non-sensitive data.l Employ a policy of least privilegeto ensure that only those who needaccess to data can have it.l Ensure the security of IoT devices,while ensuring the security of net-work computers and other hard-ware. This includes changing anydefault passwords and using strongpassword policies.

l Craft a policy that dictates whatis allowed regarding use of mobile

devices to access network data.

l Since it is likely a matter of when,not if, a data breach occurs, a readyincident response plan is necessaryto help in recovery and to mitigatecost and reputation damage.

l Vet the security programs of part-ners in your supply chain, particu-larly those who have access to sensi-tive data, equipment, and IoT. En-gage with legal counsel to ensurethat contracts with partners andvendors include language regardingdata breach responsibility.

l Use monitoring software to trackactions on sensitive data. This typeof software can detect potentiallysuspicious behavior, such as employ-ees downloading data not relevantto their positions or an employeecopying data to an external drive orsending it to his or her personalemail account.

It will be hard to implementthese tactics without winning thesupport of leadership and employees.Leaders control the purse strings toimplement data security plans, andemployees are typically the weakestlink in an organization’s securitychain.

Many manufacturers do nothave extensive data classificationpolicies, leaving the managementwith only a vague semblance of thecyber assets that need to be protect-ed. This shortcoming may make itdifficult for senior leadership to sup-port strategies — and provide fund-ing — for needed cyber security steps,as it is not clear what needs to beprotected.

Security awareness educationshould be a part of employee on-boarding, and regular security re-minders are required. Trainingshould be as specific as possible, fo-cusing on the employees that haveaccess to high-risk data and the is-sues and threats that are likely to oc-cur. Security education can also helpemployees identify signs of IP theftrisk in coworkers.

In this era of massive data gen-eration and our reliance on instantaccess to it, taking the steps to secureIP and operations data is no longer aluxury, but a necessity.

Contact: Teramind, Inc., 37-2424th Street, Suite 140, Long IslandCity, NY 11101 % 212-603-9617 E-mail: [email protected] Web: www.teramind.co r

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Tier one EMS companies are in-vesting heavily in smart tech-nologies. But, how relevant is

Industry 4.0 and the smart factory forthe average electronics manufactur-er? The first question is why? What isthe motivation for any investmentand what is the justification?

Any new trend or technology isa means to an end. Before decidingwhether to invest time and money in-to smart factory technologies, thegoals and objectives need to be clear-ly defined.

While implementation mayvary from company to company,there are sweeping benefits to pro-duction that companies of any sizecan obtain.

l Manufacturing Perfection.In the smart factory, a much

higher percentage of products can bemade right the first time. In the past,a broken calculator or digital camerawas an annoyance. But, today elec-tronics are ubiquitous and we dependon them to be reliable and to perform,not only in pacemakers and vehicleair bag controllers, but in all things.

Even when electronics are notmission-critical, companies still suf-

fer deeply when their products arenot reliable. Users have choices andthe information to make them. Nega-

tive reviews can be shared instantlyworldwide. Mediocre quality can noteasily be hidden.

l Elimination of Human Error.l Lowered Production Costs.l Flexible Factory.

We are entering a future ofmass customization, which is alreadybeginning to negatively affect factory

productivity. Production line utiliza-tion is becoming worse. The smartfactory enables faster NPI and theramp up to volume production.

l Documentation.Interconnecting the factory dig-

itally allows process transparencyand traceability down to each PCB aswell as BOM genealogy.

l Sustainable Production.The smart factory has environ-

mental benefits as well. These includea reduction of energy use, the elimina-tion of harmful or illegal products, andproduct lifecycle recycling.

The benefits are numerous andclear, but it does not necessarily helpanybody to decide whether to makethe leap to the smart factory. To dothat it may be helpful to divide thelist into “must do” vs. “want to do.”

Must Do

According to Siemens AG, aspart of the second phase of its Indus-try 4.0 initiative, Siemens will requireall of its vendors to comply with newtraceability and documentation re-quirements. Because the company’sproducts include parts from these oth-


ElEctronic Mfg SErvicESElEctronic Mfg SErvicES

Smart Factory Technology is NotOnly for the Big Players

By Vitor Barros, General Manager, KIC Europe

Continued on next page

Technicians now have real-time production and process visibilitythrough dashboards on authorized PCs and mobile devices

anywhere.

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er companies, all of those vendors in the future willbe required to develop a smart factory with all rele-vant documentation.

Then Siemens took it a step further. Also, be-cause the company’s vendors have other suppliersthemselves, Siemens will eventually require all ofits vendors’ suppliers also implement Industry 4.0operations.

This trend will likely trickle down from thelargest companies to the smaller facilities. Withcompetition at an all-time high, factories that weresuccessful in the past with only average perform-ance will probably not succeed in the future, with-out significant smart factory improvements.

Want to Do

Poor quality is expensive. Low productionline utilization is ruinous. Unneces-sary electricity consumption is costly.The average manufacturing engineerspends 40 percent of his or her timelooking for information. The smartfactory can reduce production costand improve productivity even in anenvironment with more NPIs, shorterproduction runs and frequent produc-tion line changeover.

Smart factory technologies en-able real-time production and processvisibility in dashboards that are ac-cessible from authorized PCs and mo-bile devices anywhere at any time.Engineers make better and faster de-cisions. Alternatively, machines nowmake decisions without the need toinvolve a technician, as exemplifiedby closed-loop SPI and stencil print-er. The result is consistent quality,faster troubleshooting and human er-ror reduction.

Factory engineers and man-agers are like circus jugglers withhundreds of balls in the air at anygiven time. Complexity grows expo-nentially between different produc-tion runs, clients, job shifts, produc-tion lines, etc. The connected factoryorganizes all such tasks across theentire facility and supply chain,while verifying compliance and actu-al performance results.

For EMS companies, there is yetanother motivation. Differentiation.Implementing smart factory systemsseparates them from their competi-tors with new capabilities that clientsnow demand. These include fullprocess control, low risk of productlifespan failure, full transparencyand easy access to traceability data,fast NPI, and fast ramp. Investing inthe smart factory can be a move towin more premium orders.

Wade in or Take the Plunge?

Converting a traditional factoryinto a smart factory can be a high-risk project that requires significantcapital. The entire company and all ofits employees will be impacted. Thealternative is to select a small seg-ment of the factory and move that toan Industry 4.0 level. When doing so,the company will encounter most ofthe speed bumps and challenges as-sociated with any Industry 4.0 proj-ect, regardless of scope.

One example is the conflict be-tween IT (information technology)and OT (operational technology). ITworkers are responsible for the effi-cient, secure flow of data throughouta factory. This includes avoidingviruses, lost data and hacking, aswell as backing up information. ITengineers are understandably conser-vative and protective of their domain.

On the other hand are the OTengineers, who want a complete rev-olution. They want machine-to-ma-

chine (M2M) connectivity, extreme levels of au-tomation, data analytics, robots, augmented real-ity, artificial intelligence, and more. But, theyneed the data to run on the existing IT infrastruc-ture.

Regardless of the scale of the smart factoryconversion, companies must decide how to safelyand responsibly create new forms of data man-agement. Higher level management will mostlikely be necessary to sort out the conflicts be-tween IT and OT.

Another example is M2M communication.Closed-loop SPI and stencil printer operation hasbecome very popular. Similar connectivities arepopping up all over the factory, even between thethermal process, SPI and AOI. Communicationprotocols are being developed at IPC and throughthe Hermes initiative, but they are not yet widely

available. Any company investing in smart factorytechnologies must still work directly with equip-ment vendors to secure connectivity and compati-bility between their machines.

The benefit of initially focusing on a smallsegment of the factory is the the reduction of timeand capital it takes to upgrade. The company willquickly decipher the learning curve in a lower riskenvironment. Once successful, the company will bewell-positioned to convert the rest of the companyat a faster, more effective conversion rate. Smartfactory conversion is no longer limited to largecompanies. Eventually, even the most average fa-cility will be under pressure to upgrade.

Contact: KIC, 16120 Bernardo Center Drive,San Diego, CA 92127 % 858-673-6050 E-mail: [email protected] Web: www.kicthermal.com r


Smart Factory Technology is Not Only for Big PlayersContinued from previous page

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Any U.S. manufacturer whostarts out in the PCB assemblyindustry needs a complex as-

sortment of equipment and materi-als. This includes a source for solderbar, wire, fluxes, pastes, and more.There is a wide range of choices, butmany of them are offshore. To choosea vendor and qualify the products, itis helpful if the vendor is not anocean away.

It is ideal to be able to drive ortake a short flight to the vendor’s fac-tory, verify product quality and askquestions face-to-face. If there is aproblem, the vender can also comeout to the manufacturer and workwith the engineers there to adjustthe assembly process.

Now, the list of solder suppliershas grown a little longer. Amerway,Inc., is not a new company, butrather new in the role of domesticsupplier of high-purity solder to thePCB assembly industry.

Established in 1989 in Altoona,Pennsylvania, the company is a fam-ily-owned business run by its secondgeneration. It employs approximate-ly 40 people and operates threeshifts. The company is also growing.Amerway recently purchased 25,000ft2 (2,322.6m2), adding to its current50,000 ft2 (4,645.2m2) facility.

“We’re not yet a household

name in SMT and PCB assembly, butwe plan to be,” predicts Terry Buck,Amerway’s president and a veteranof the electronics manufacturing in-dustry. “Although we are originallybetter known to other industries that

use solder, particularly stained glassand industrial applications, we havemanufactured for the electronics in-dustry and are further expandingour focus there.”

Specialty Alloys and Fluxes

“The range of solder productsand forms that we offer is wide, andconstantly growing,” says Buck. “Itincludes bar solder, wire solder and

different formulations of fluxes. Wealso offer the highest-quality solderpaste and preforms through our part-nership with Balver Zinn Cobar. But,we can customize alloys and fluxes to

meet the specialized needs of our in-dividual customers. We’ve been lead-ing the way in that area for a longtime and it’s a capability that we’vebecome recognized for. We workclosely with our customers to engi-neer specific solutions for theirprocess requirements.”

Amerway also creates specialtyanodes and solder, an essential com-ponent of high-grade copper roofs.Developing solutions for various spe-cialized industries has helped Amer-way take a leading role in process de-velopment and problem solving formany different applications. This ex-perience is positioning the companywell to serve the electronics manu-facturing industry in North America.

That capability is enhanced,Buck adds, by Amerway’s location inthe heart of the U.S. Mid-Atlantic re-gion. “We’re a U.S. company, and wemake all of our Amerway productsright here in Altoona,” he says. “Youcan drive here, or we’ll be happy tovisit your manufacturing facilitywhere we can learn firsthand whatyour needs are.”

“We are specialists in formulat-ing fluxes to help customers obtainoptimum wetting and results withvarious alloys,” says Tim Brown,sales manager. “Our solder wire is

“Cradle-to-Grave” Soldering Solutionsfor SMT Assembly

By Michael L. Martel, Contributing Editor

Solder processing at Amerway’s facility in Altoona, Pennsylvania.


See at APEX, Booth 919

http://WWW.CONECSUSLLC.COM

one of our most popular products. We offer lead-free cored wire, lead-free solid wire, and leadedversions of both for military and hi-rel applica-tions. We also specialize in bar solder products andoffer cast notch bar, lead extruded bar, lead-free bar solder, and Style 60 cast solder ingot.”

“We can customize any order to suit spe-cific needs,” says Mark Fink, production man-ager. “We can provide any wire diameter size,spool size, alloy, flux core or solid wire, lead,lead-free, bar weight, bar dimensions, cast bar,or extruded bar.”

Solder Analytics Lab

“We especially want to make sure thatwhen customers buy our products, they startout with great results, and have continued suc-cess,” says Brown. “That’s why we offer a sol-der pot analysis program for our cus-tomers. We recommend a periodicsolder pot analysis to maintain solderpot integrity and to check for any con-taminants that may affect qualityand solderability. Our state-of-the-art SpectraMax spectroanalysis ma-chine determines the level of solderimpurities and tin levels that helpsus identify any process or potentialsolder joint problems.”

Amerway provides solder potanalysis for the following elements:tin (Sn), lead (Pb), antimony (Sb), sil-ver (Ag), copper (Cu), nickel (Ni), bis-muth (Bi), arsenic (As), zinc (Zn), in-dium (In), aluminum (Al), iron (Fe),cadmium (Cd), cobalt (Co), gold (Au),phosphorus (P), and sulfur (S). Allsamples are analyzed using the Spec-traMax. “Our testing equipment iscalibrated using known standards foreach analysis. We use atomic absorp-tion as the test method. It’s fast andaccurate,” adds Brown.

Making Cobar Solder

Recently, the company addedBalver Zinn Cobar solder products,including the well-known, lead-freeSN100C family of alloys developed byNihon Superior, to its premium lineof solder bar, solder wire, fluxes, andcustom alloys.

Balver Zinn Cobar SN100C is anickel-stabilized, tin-copper eutecticthat contains a small amount of ger-manium to reduce oxidation. SN100Cgenerates bright and shiny solderjoints, comparable with lead-contain-ing solders. In 2005, NASA tests indi-cated that SN100C is the most reli-able soft solder for wave soldering.SN100C is especially preferred for thehigher process temperatures of selec-tive soldering. Amerway is one of veryfew licensees globally that are allowedby Balver Zinn Cobar to manufactureand sell SN100C in the U.S.

ISO 9001 Quality Certification

Amerway achieved a milestonewhen it was awarded its ISO 9001quality certification. It took time anda great deal of effort and cooperationfrom the company’s team members,recalls Tyler Port, quality and projectmanager. Port was brought into thecompany specifically to help achievethe ISO 9001 goal.

“Although the process began inApril of 2016, I was hired to completethe ISO certification when I returnedfrom a scheduled military deploy-ment,” says Port. “Prior to joining themilitary, I had worked for Amerwayfor more than three years. During mydeployment, I researched and learnedeverything I could regarding ISO cer-tification, so that when I returned, Icould immediately get to work.”

Based on his prior experience

with Amerway, as well as his research into ISO,his efforts enabled Amerway to achieve ISO 9001certification in five months. “We see the certifica-tion as a testament to our company’s dedication toproduct quality assurance and purity,” he says.

Recycling Partnership

Amerway has also partnered with metalswaste recycler Conecsus, LLC, to offer customers a“cradle-to-grave” soldering solution.

The service begins at Amerway’s solder-ing products and continues with Conecsus’recycling programs for dross and other met-als waste byproducts. Conecsus is an ISO14001 EMS-certified recycling company anda refiner of SMT solder and solder pastewastes and residues, as well as a variety ofmetals from other industries. Conecsus con-verts these wastes into usable metal prod-ucts, paying for it in cash.

“This partnership with Conecsus allowsus to offer our customers a ‘green’ solution tohandling metals waste at the end of the elec-tronics assembly process, putting money

“Cradle-to-Grave” Soldering Solutions for SMT Assembly


Continued from previous page

Lead-free solder wire. Continued on page 25


http://www.HakkoUSA.com


Stripping Costs From Photoresist Processing

Silicon and compound semiconductor wafersundergo many critical procedures during themicrofabrication process, including the recur-

ring stripping of photoresist. This is the light-sen-sitive material (liquid or film) that is depositedduring various steps of wafer production. Reexam-ining the wet process of stripping of thick photore-sist, which occurs at the back-end of wafer pro-cessing, can significantly reduce the amount ofchemicals required, as well as related disposalcosts.

Photoresist materials are designed tomask, or “resist,” UV light to accomplish back-end-of-line tasks, such as the etching and elec-troplating of circuits and copper pillars used asbonding pads for wafer packaging.

In recent years, wafer foundries, as wellas semiconductor and compound semiconduc-tor manufacturers, have begun to incorporatecopper pillars into their fabrication processes.The advantages of copper over solder have be-come increasingly clear, enabling higher pincounts and interconnect densities. Copper alsooffers higher reliability and improved electri-cal and thermal performance.

It is worth noting that back-end processesrequire the use of solvents while front-end-of-line processes typically employ acids, includingsulfuric acid and peroxide. These would attack sur-faces, such as copper pillars, and damage them. Al-so, back-end processes use much thicker photore-sist materials, and because the solvents used forback-end stripping are less aggressive, chunks ofundissolved resist residue often accumulate in thebath. These chunks can block bath circulation andfiltration, shortening bath life and increasing sol-vent chemistry consumption substantially.

Evaluating Wet Processing Challenges

After deciding to adopt copper pillars for in-house wafer production, one wafer manufacturerran into some obstacles. Two situations caused themanufacturer to rethink the process by which itstripped the “thick” resist from its wafers duringthe copper pillar attachment process. Both issues

stemmed from the chemical bath tool that was in-tegral to the stripping process.

“Our customer, an amplifier manufacturer,was dealing with a 50 to 100 micron thick resistfilm on its wafers, about 15 times thicker than re-sist used on front-end processes,” explains RyanZrno, chief technical officer of JST Manufacturing,

a specialist in wet processing equipment for theMEMS, nano, photovoltaic, wafer, and related in-dustries. “The traditional solvent chemistry wasleaving large amounts of chunky resist residue inthe bath, which was interfering with both circula-tion and filtration. This was causing increasedbath changes, resulting in production delays and

excessive use of expensive chemical solvents.”Zrno adds that the customer also wanted

to find an alternative to the solvent that hadbeen used in the past, one based on TMAH(tetramethylammonium hydroxide). Althoughnot used in toxic amounts, this solvent had astrong odor and was not the most effectivechemical for resist stripping of wafers with cop-per pillars.

To evaluate the problems and propose asolution, Zrno invited the customer to visitJST’s applications lab and run some tests withthe engineering staff. The company also coordi-nated a series of tests with appropriate sol-vents made to order from Diamalloy, the cus-tomer’s chemical supplier.

Tailoring a Solution

“We ran a set of three different kinds oftests, each in our standard down-flow bath tool,”

Zrno says. “Each time we would learn somethingvaluable about possible solutions. It was a three-way development team composed of the customer’sstaff, the chemical company and our engineers.”

After a few weeks of testing, the proposed so-lution was a new wet processing tool that did notleave large deposits of solubilized resist in thebath. Instead, a new chemistry was recommendedalong with a series of screens that were incorporat-

By Ed Sullivan

JST Manufacturing’s semiconductor processing applications lab.


http://www.corelis.com

ed into quick-dump exchanges.This meant that the bath sol-

vent chemistry was circulated insuch a way that it flowed over thescreens, removing any large clustersof resist before they could become to-tally solubilized and deplete the ef-fectiveness of the bath solvent. Re-moval of resist clusters also meantthat they were no longer a threat tobath filtration or circulation.

The next step was to build a testmodule, which included a bath with asingle series of screens, a reservoir,basic control system, and a pump.

“Once completed, the customercame back out and we did testingagain,” Zrno says. “After successfultesting of the module, JST designedand built a fully-automated produc-tion tool with a 6-gallon bath and 20-gallon reservoir. We also added otherproprietary components that enabledthe tool to meet the customer’s needs.”

The customer ordered two of thenew production tools in order to runparallel processes and meet through-put requirements.A Combination of Savings

As anticipated, this new, auto-mated resist-stripping tool reducedchemical usage, and the series ofscreens prevented the recirculatingbath chemistry from plugging up thefilters.

Chemical usage dropped bytwo-thirds at the customer’s resiststripping stations, mainly due to theincreased bath life. Also significantwas the reduction of downtime forchanging baths, which normally took30 to 60 minutes. That time was re-duced by two-thirds as well, as wasthe associated downtime to drain andrecharge bath solutions.

The new resist stripping stationincludes a menu of built-in settings,which were tested and installed at theJST factory lab. This menu makes itunnecessary for users to go to anotherfacility to establish new settings, aprocess that could increase production

downtime by up to several days.According to Zrno, it makes a lot

of sense to periodically review produc-tion systems, such as wet processingequipment, particularly when produc-tion procedures change. In many cas-es, making minor modifications to ex-isting equipment, whether standardor custom, can help companies savesignificantly.

Contact: JST Manufacturing,Inc., 219 E 50th Street, Boise, ID83714 208-377-1120 fax: 208-377-3645 E-mail: [email protected] Web: www.jstmfg.com


back into their pockets,” Buck says.“It’s truly a ‘cradle-to-grave’ solutionfor electronics manufacturers. Aspartners, we can offer these productsand services as seamlessly as if wewere one company. This relationshipmakes both companies stronger andmore competitive in the market-place.”

“Amerway is a small, family-owned business with the technologyand capabilities of much larger cor-porations,” Buck concludes. “We of-fer a free solder pot analysis, high-purity material, shorter industrylead times, a certificate of analysis,and certificate of conformance withevery order upon request. Buyingfrom Amerway means buying direct-ly from the manufacturer.”

Contact: Amerway, Inc., 3701Beale Avenue, Altoona, PA 16601 814-944-0200 Web: www.amerway.com


Cradle toGrave SolderSolutions


Stripping Costs From Photoresist Processing

Versa Electronics AchievesNew ISO Certification

Minneapolis, MN — In accordancewith ISO 9001:2015, and based on therecently completed assessment by itsregistrar, Orion Registrar, Inc., VersaElectronics is on the leading edge of agroup of companies that decided tocomplete transition to the new ISO9001:2015 standard in 2017.

Versa Electronics has a long his-tory of producing medical devices andsubassemblies. Versa’s services to themedical device OEM market includePCB assembly, wire harness/cable as-semblies and electronic subassem-blies. Versa is demonstrating its com-mitment to the medical device commu-nity by achieving ISO 13485:2003.

The company’s quality manage-ment system and the addition of thenew ISO certification broadens its po-tential market to over 602 establish-ments in Minnesota alone, enhancingthe company’s FDA registration.

Versa is a privately-owned elec-tronics contract manufacturer thatbuilds products for OEMs in themedical, utility and power, communi-cations, security, and other markets.

Contact: Versa Electronics,3943 Quebec Avenue North, Min-neapolis, MN 55427 763-557-6737fax: 763-557-8073 E-mail: [email protected] Web: www.versae.com

http://www.hanwhaprecisionmachinery.com

ElEctronic Mfg Products

www.us- tech.com

ElEctronic Mfg Products

February, 2018

Carlsbad, CA — Nordson YESTECHhas launched its latest innovation,the FX-942UV ACI, an inline, dual-side optical inspection system for

PCB conformal coating and parts.With dual-side viewing cameras andproprietary UV lighting, the systeminspects conformal coating coverageand verifies correct part assembly.

Advanced, high-power UV light-ing and newly-available image pro-

cessing technology integrate severaltechniques, including coverage in-spection, color inspection, normal-ized correlation, and rule-based algo-

rithms, to provide completeinspection coverage withlow false failure rates. The3.9 in. (10 cm) clearanceenables the inspection oftall components.

The FX-942 ACI sys-tem complements the re-cently-launched FX-942AOI, which is designed forSMT and through-hole de-vice inspection. The FX-942 AOI is highly effectivefor selective solder, post-wave and connector inspec-tion and has a picture inpicture (PinP) feature, of-fline programming to max-imize machine utilizationand real-time SPC moni-toring. The FX-942 AOI is

compatible with manufacturing exe-cution systems and Industry 4.0.

Contact: Nordson YESTECH,2747 Loker Avenue West, Carlsbad,CA 92010 % 760-918-8471 E-mail: [email protected] Web: www.nordsonyestech.com

FX-942UV ACI inline optical inspection system.

Nordson YESTECH: Inline,Dual-Side Inspection System

CyberOptics IntegratesMRS into New SPI System

Minneapolis, MN — CyberOptics hasintroduced its SE3000™ SPI system,which is the first SPI system to incor-

porate the company’s multiple reflec-tion suppression (MRS) technology.MRS boosts the system’s accuracy,repeatability and reproducibility, foreven small paste deposits.

The SE3000’s sensor architec-ture simultaneously captures andtransmits multiple images in paral-

lel, while sophisticated fus-ing algorithms merge theimages together. The sys-tem can deliver microscopicimage quality at productionspeed. Combined witheasy-to-use software, theSPI provides the precisionnecessary for the moststringent requirements.

For maximum versa-tility, the new SE3000-DD3D AOI, dual-lane, dual-sensor system caters tovarying widths. This de-sign offers the flexibility toinspect high volumes, theconvenience of inspectingdifferent board sizes simul-taneously, and can switchfrom dual- to single-lanemode to inspect very largeboards.

Contact: CyberOpticsCorp., 5900 Golden Hills Drive, Minneapolis, MN 55416 % 763-542-5000 fax: 763-542-5100 E-mail: [email protected] Web: www.cyberoptics.com

SE3000 SPI system.

http://www.microcontrol.com/ems/

This year was a stellar year for the electronicsmanufacturing industry. Real progress hasbeen made toward the smart factory/Indus-

try 4.0 nirvana that we have been talking about forso long.

One of the biggest obstacles, standards,seems to be out of the way, thanks to the efforts bythose involved in the Hermes standard and in theIPC CFX committee. These advances are a testa-ment to the industry’s ability to collaborate whenbenefits are mutual and the objectiveis clearly defined.

While leaps forward have beenmade and some examples of deploy-ment and ROI are beginning to beseen, there is still a long way to go.So, what can we expect from 2018?

Mergers and Acquisitions. Theidea of being “better together” ismanifesting itself in many ways, in-cluding in mergers and acquisitions.In recent years, we have seen morecompanies move toward offering fullline solutions. Filling the existingspaces in their product lines throughthe acquisition of domain experts isone way. Developing all new technol-ogy to fill a process gap is challeng-ing, expensive and time consuming.It also adds an additional player to acrowded market. In the pursuit of thesmart factory, we are seeing the im-portance of bringing the best ele-ments together, as well as a need forreal domain expertise.

Partnerships and Collaborations.Like acquisitions, collaborations aredriving Industry 4.0 solutions. Work-ing together to create the standardsthat the industry wants has helpedus all understand what can beachieved through teamwork. Consor-tia have emerged around the Hermesstandard and IPC’s CFX that haveshown that putting the industry be-fore corporate goals helps everyone.

Over the last few months wehave seen several partnership an-nouncements, as companies start todevelop ideas and solutions together.Software companies working withequipment manufacturers or con-sumables suppliers, and even withother software companies are findingthat they can bring solutions to mar-

ket faster if they combine their energy, their expe-rience and their resources.

New Entries. At productronica we saw the likesof CST, ABB and Kuka from the robotics industrystart to develop offerings for the SMT line, often incollaboration with the more traditional players. Atthe Hannover Fair in April, we also saw IBM, Mi-crosoft, Google, and HP pitch ideas in the manu-facturing sector.

As we turn to artificial intelligence (AI), aug-

mented reality (AR) and additive manufacturing tohelp us improve performance, expect to see morenew players in the market, both individuals andpartnerships.

Smart Manufacturing. Smart manufacturing isthe dominant trend in our industry. Now, it haseven become an essential part of any contractor’smanufacturing strategy. It is something that willnot only separate the leaders from the laggards,


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Philip Stoten is an internation-ally recognized EMS industryexpert. Known for his skills asan inter viewer, reporter and

panel moderator, Philip is a fea-tured multi-media contributor to

U.S. Tech on a regular basis.

Continued on page 32


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Hayward, CA — Seika Machinery isnow offering McDry electronic drystorage cabinets. These are usedworldwide for the storage of automo-tive parts, such as engine compo-

nents, bearings, springs, ball sensorsfor gyroscopes, plungers, and rawmetallic components. The McDryDXU-1001 and DXU-1002 storagecabinets can maintain a relative hu-

midity (RH) of one percent.The door on the systems can be

opened once every 20 to 40minutes, they are compliantto ESD-IEC61340-5-1, comeequipped with a digital RHmeter, have locking doorsand adjustable shelves thatsupport up to 220 lb (100 kg),and are grounded to preventstatic shock.

The cabinets have alsobeen used for the drying andstoring of fiber optics, such asmicro-lenses for WDM andCCD solid state image sen-sors. During the manufactur-ing of quartz oscillators,McDry can store quartz crys-tals and electrode adhesives.There are many McDry stor-age cabinet models to choosefrom for any size application.

Other storage applications forthe cabinets include original prints,PCBs, polymide film, tape reels, feed-ers, and various electronic compo-nents and materials. McDry cabinets

conform to IPC/JEDEC J-STD 033Cand IPC 1601 guidelines.

Contact: Seika Machinery, Inc.,26218 Industrial Boulevard, Hay-ward, CA 94545 % 510-293-0580 E-mail: [email protected] Web: www.seikausa.com

Hamilton, NJ — POSITAL’s Wiegandassemblies offer a compact and effi-cient way of harvesting power forelectronic circuits in electromechani-cal devices, eliminating the need forbackup batteries.

A Wiegand wire is a shortlength of prepared Vicalloy (vanadi-um-iron-cobalt) wire. When exposedto a changing external magneticfield, the wire will initially retain itsmagnetic polarity and then abruptlyflip polarity once the field reaches acertain threshold.

This sudden change in the mag-netic state of the core induces a cur-rent pulse in a copper coil wound

around the Vicalloy core. This currentpulse is very short-lived, but the ener-gy harvested from the mechanical mo-tion of the magnet can be capturedand used to activate a low-power elec-

tronic circuit. An important feature ofthe Wiegand effect is that the amountof electric power generated with eachreversal of the magnetic polarizationis constant and completely independ-ent of the rate of change of the exter-nal magnetic field, even if this hap-pens very slowly.

Wiegand assemblies are a corecomponent in POSITAL’s IXARCmulti-turn absolute rotary encoders,providing a maintenance-free methodfor powering the counter that recordsthe number of complete rotations thatthe device experiences. POSITAL alsooffers Wiegand assemblies to othermanufacturers.

These consist of a 0.6 in. (15mm) length of Wiegand wire sur-rounded by a copper coil, all con-tained in an SMD-mountable plasticstructure. Wiegand wire productionis carried out at locations in the U.S.and Europe, ensuring a stable, reli-able supply chain. These assembliescan be used wherever low-cost, zero-maintenance, battery-free energyharvesting systems are needed to en-ergize low-power electronic devices.

Contact: POSITAL-FRABA,1800 East State Street, Suite 148,Hamilton, NJ 08609 % 609-750-8705fax: 609-750-8703 E-mail: [email protected] Web: www.posital.com


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Koh Young AOI NowSupports Panasonic

MountersChandler, AZ — Koh Young Technol-ogy has fully connected its Zenith 3DAOI system to Panasonic’s NPM(Next Production Modular) compo-nent mounter and mounter APC (Ad-

vanced Process Control) systems.The Zenith 3D AOI system is thefirst certified APC-ready 3D AOI for008004 (0201M) components, whichcan improve yields in high-densityplacements.

The Zenith 3D AOI is able tofeed correct mounting position values(x, y, theta) to Panasonic NPM moun-ters, ensuring that components aremounted in the correct positions.

This feature, also known as APC-MFB (Advanced Process Control-Mounter Feedback), improves pro cessrepeatability by automatically adjust-ing component placement to the paste,

rather than to the pad location. More-over, APC-MFB will catch the shifttrend and conduct further position cor-rection by using true 3D measurementdata from the AOI system.

To achieve this machine-to-ma-chine (M2M) feedback control sys-tem, Koh Young has undergone rig-orous verification with 0.4 and 0.6mil (10 and 15 µm) resolution Zenith3D AOI systems.

Upon successful completion oftesting, Koh Young was certified for008004 (0201M) components, in ad-dition to 01005 (0402M) components.

Contact: Koh Young America,Inc., 6150 W Chandler Boulevard,Suite 39, Chandler, AZ 85226 % 480-403-5000 fax: 480-403-5001 E-mail: [email protected] Web: www.kohyoung.com

Koh Young’s inspection systems now communicate and provide feedback to Panasonic’s NPM component mounters.

See at ATX / MD&M West, Booths 2342 and 525

http://www.solderstar.com

http://www.MicroCare.com/UST

McHenry, IL — Dispense Works hasintroduced its RD 2500, a flexible,large-format dispensing table. It com-bines a smart workbench with a built-in, precision, overhead servo, x/y/zgantry system. Mechanisms are neat-ly tucked in and do not add to the

width of the bench. This provides easyaccess to the front, sides and top, re-quiring less operator reach to the cen-ter of the table.

Another design feature is itsT-slot table baseplate. With 25full-length slots, the table pro-vides many fixturing possibilities.Under the table surface, the actu-al machine base is fabricated fromsteel tubing and is then ground toa specified flatness.

The modular design pro-vides a foundation for mountingnearly any type of surface, in-cluding a T-slot table, vacuumtable, panel conveyor, or customplates.

The standard machine can trav-el at over 32 in./s (81.3 cm/s) and isavailable with travels of 8.3 x 4.1 ft(2.5 x 1.3m) and 4.1 x 4.1 ft (1.3 x

1.3m). The company also offers cus-tomization for other sizes. DispenseWorks is a full-service designer,manufacturer and developer of robot-

ic dispensing solutions. The RDseries is available with all DW,Inc., control options, includingvision, meter/mix control, up toeight axes of motion control, andfull production logging/trackingand reporting software.

Contact: Dispense Works,Inc., 4071 Albany Street,McHenry, IL 60050 815-363-3524 fax: 815-363-8089 E-mail: [email protected] Web: www.dispenseworks.com


RD 2500 large-format dispensing table.

Dispense Works Intros Large Format Dispensing Table

Renton, WA — Omron MicroscanSystems, Inc., has introduced itsnewest smart camera, the HAWKMV-4000. With exceptional process-ing capabilities and a compact formfactor, this powerful camera fits be-tween PC-based devices and averagesmart cameras.

This camera’s processing powerhas been quadrupled over the previousgeneration, with up to six times theframe rate of its predecessor andachieving a real-time trigger responseusing an FPGA. The new camera is ex-cellent for code reading and verifica-

tion, inspection, guidance, and gaug-ing, with state-of-the-art algorithms.

The camera has a wide array ofsensors, ranging from 0.3 to 5 MP,with a pixel size of 0.2 mil (4.8 μm).The system can be optimized for al-most any application, by combiningthese sensors with a C-mount lensoption and plug-and-play externallighting. Automotive applicationscan benefit from the camera’s long-range imaging and field of view.

The camera has intuitive setup,testing and runtime user interfaces(UIs) to program the inspection and toset up communication between thecamera and other components on theline. The user interface is image-cen-tric, with intuitive drag-and-drop pro-gramming. Reading, verification, andvision tools are ready to use right outof the box, without time-consumingparameter adjustments. Two UIs areavailable: the AutoVISION UI, in-tended for most operators or techni-cians, and the more advanced and cus-tomizable FrontRunner UI, designedfor machine vision professionals.

Although the HAWK MV-4000is a smart camera rather than a PC-based device, its processing powerenables speeds nearly equivalent tothose reached by vision systems rely-ing on external PC processing.

Contact: Omron Microscan Sys-tems, Inc., 700 SW 39th Street, Renton, WA 98057 425-203-4873 E-mail: [email protected] Web: www.microscan.com

See at ATX/MD&M West, Booth 4395

HAWK MV-4000 smart camera.

Omron Microscan Releases Latest Smart Camera

http://www.sakiglobal.com


Now even the need for humantouch is being replaced by testprobes. INGUN’s new PKS-

399 series of air-activated, capacitivetest probes mimic human fingers forautomated touchscreen testing.

Pneumatic probes are excellentfor various test applications whereindividual probes need to be activat-ed, rather than contacting every-thing at once inside a bed-of-nailstest fixture. These solutions can alsobe used for contacting a device fromvarious angles, instead of beingbound to vertical motion for bottomor top side contacting only.

According to the company, theseprobes are the first-ever pneumatictest probes for touchscreens. To actu-ate, compressed air at 86 psi is fedinto the probe at its tail end. Theplunger then activates and makescontact with the device under test.

The touchscreen probe can beused for activating or deactivatingseveral functions on a smartphone,tablet or any similar device. If it isused in conjunction with a roboticx/y/z positioner, it could be used tocalibrate touchscreens by gentlymoving over the surface with its con-ductive tip. The tip is designed toleave no scratches on the surface ofthe device.

In order for the probe to func-

tion properly, it needs to be connect-ed to ground, with a lead. INGUN of-fers its KL-300 clip connection,which is the preferred solution for

fast probe replacement. Filtered, oil-and contaminant-free air will ensurea long lifecycle of the test probe.

Contact: INGUN USA, Inc., 252Latitude Lane, Suite 105-106, LakeWylie, SC 29710 % 803-831-1200fax: 803-656-5080 E-mail: [email protected] Web: www.ingun.us r

Automated TouchScreen Testing with

Air-Activated Capacitive Probes

By Matthias Zapatka, CTO, INGUN USA

Capacitive touchscreen probe.

but will become table stakes for any-one who wishes to be considered formanufacturing contracts from theworld’s largest brands.

Expect to see OEMs demandingto see a company’s smart factoryroadmap as a part of a request for bidprocess in the near future. As thishappens, I also expect to see themajor, and some of the minor, EMScompanies driving to demonstratethat they are the smartest.

Additive Manufacturing. 3Dprinting is moving from the hobbyistto mass industrialization, due to thework of some of the major EMS com-panies and, of course, printing com-panies. Jabil and HP’s partnership toprint the printer is one example ofwhat can be achieved when a tier oneEMS company takes a technology,applies decades of manufacturing ex-pertise, and moves it toward a tip-ping point where it can meet theneeds of mass production.

Additive manufacturing has thepotential to completely change theway we design, manufacture and de-liver new products. It may also shiftthe way global manufacturing is dis-tributed. Additive thinking, additivedesign and additive economics willall become part of our ever-expand-ing vocabulary in 2018.

Diversification in Market asLines Blur. Manufacturers are pro-

ficient at bringing innovative prod-ucts to market quickly. The EMS in-dustry is among the world’s mostcompetitive and skilled manufactur-ing and supply chain sectors. I expectthat the larger suppliers in our in-dustry will start manufacturingmore diverse products, including ap-parel, health care products, andmuch more. Some are already mov-ing beyond the bounds of electronics.As they spend more time outside theelectronics industry, they will be ableto showcase their ability to produceand deliver within tight margins.

More Disruption. There is nolonger a status quo. The only con-stant is change. Any lines that exist-ed between industry sectors haveblurred or disappeared completely.Expect more disruption, more start-ups and more new players. Competi-tion will come from every part of thevalue chain. The winners will bethose that embrace change and be-come disruptors themselves. Thewinners will be companies that wel-come new players to the industry.The winners will be the companiesthat collaborate and create partner-ships with shared goals, throughopen communication. Exciting dayslie ahead for manufacturing. Weshould embrace the new, learn fromthe old, and drive the industry tosmarter, better and even more pros-perous times. r

Seven Industry Predictions for 2018Continued from page 27


http://WWW.MICROSCAN.COM


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Radiant Vision IntrosInline Visual

Inspection SystemRedmond, WA — Radiant Vision Sys-tems has released its INSPECT.as-sembly system, a turnkey, automat-ed visual inspection station for inlineassembly verification. The IN-SPECT.assembly is fully-integratedwith Radiant technology and config-ured to precise tolerances to meet the

production-level inspection needs ofcomplex electronic assemblies.

The system detects the pres-ence, position, and integrity of com-ponents, including screws, cables,connectors, and other critical fea-tures, before final device enclosure toautomate assembly inspection.

The INSPECT.assembly is aturnkey inspection station that em-ploys ProMetric® Y imaging systemswith camera resolution up to 29 MPand a dynamic range above 70 dB.Because INSPECT.assembly is fully-integrated with Radiant camera,lighting, fixturing, and software, Ra-diant engineers are able to designeach INSPECT.assembly to match

the specifications of each customerapplication.

This vision technology solvescritical inspection challenges utiliz-ing a combination of the image regis-tration and analysis functions of thecamera with proprietary machine vi-sion INSPECT software.

The software blendsmultiple machine visionsoftware algorithms into asingle tool to enable com-prehensive anal ysis of spe-cific features.

Occupying the samephysical footprint as ahuman operator on theline, the INSPECT.assem-bly system rolls easily ontomoving conveyers, adjust-ing to heights from 20.7 to37 in. (52.5 to 95 cm). The

system has a touchscreen for resultsmonitoring, adjustment of inspectiontolerances, and part changes.

The software is configured withmultiple inspection tool recipes spe-cific to each part, enabling adaptabil-ity to line changeover.

The system also offers reportingfunctionality, barcode reading anddata output for traceability of inspec-tion results and enhanced processcontrol.

Contact: Radiant Vision Sys-tems, 22908 NE Alder Crest Drive,Suite 100, Redmond, WA 98053 % 425-844-0152 E-mail:[email protected] Web: www.radiantvisionsystems.com

INSPECT.assembly automated visual inspection system.

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It takes a unique perspective and a lot of expert-ise to build the PCBs that others turn down.These boards often have challenging dimen-

sions, novel materials and embedded elements, butin the end, still have to be delivered functioning tothe customer.

Through Brigitflex’s 40 years of experience,the company has manufactured all types of circuitboards. From simple to conceptual, the company

professes to try almost anything. It has developeda unique ability to understand the processes in-volved in creating large-format circuit boards on awide variety of materials.

Many of the company’s projects include an-tennas, RF filters and R cards. Brigitflex has builtboards in sizes of 5 x 9 ft (1.5 x 2.7m) and 1.3 x 16ft (0.4 x 4.9m) and handles any thickness of mate-rial. The company has an in-house vacuum lami-nation press that can press material up to 24 x 36in. (61 x 91 cm) in size. Material sizes larger thanthis are supplied from an outside source.

The company builds custom tooling, fixtures

and entire work environments to accommodatethese large-format boards, keeping handling is-sues to a minimum. These custom-built fixtures in-clude transportation carts, vacuum tables for im-aging and light tables for inspecting photolithogra-phy. The company also has a cleanroom for imag-ing large panels when small circuitry is required.This helps to keep any particles from interferingwith the imaging process.

Clear Communication is Key

From the beginning, open and clearcommunication is the key to a successfulproduct build. Materials, customer require-ments, price points, and delivery schedulesneed to be discussed before a quote is evensent. This ensures that both parties areconfident in the build.

A drawing may look fairly simple untiltough requirements crop up in the final prod-uct. These may include size or shape, materi-al type, copper thickness, etch tolerances,multilayer lamination cycles, and drillingspecifications.

Most builds that require special materi-als revolve around the lead times of that ma-

terial. In many cases the lead times can be quite longand need to be taken into consideration.

Often, a trial run or test sample must be creat-ed so that process steps can be tested and recordedbefore moving onto the final product, saving moneyin the long run.

Some of Brigitflex’s most recent projects in-clude successfully pressing OhmegaPly® resistormaterial to Rogers RO6202 laminate for a high-frequency, multilayer board with a panel size of 24x 36 in. (61 x 91 cm). The company has also recent-ly begun to plate copper to stainless steel laminat-ed polyimide for a heater application, with dimen-

sions of 1.2 x 16 ft (0.4 x 4.9m) and a thickness of3 mil (76.2 µm).

Brigitflex has come up with a process to cre-ate fine-line circuitry on Kapton as thin as 0.5 mil(12.7 µm), as well as laminating resistor materialincluding Ticer and Ohmega. These thin boardsare attached to a thick support backing to avoidany damage during handling. The boards are thenshipped with the backing as well.

The company strives for a positive relation-ship with its vendors. Communicating customerrequirements to vendors is important so that spe-cialty requirements can be met. The company alsoinforms customers of vendor-specific requirementsand capabilities.

In the incredibly fast-paced world of technol-ogy, many engineers have ideas that need to betried and proven. Brigitflex is committed to thesetypes of niche projects, turning them into success-ful and repeatable products.

Contact: Brigitflex, Inc., 1725 FleetwoodDrive, Elgin, IL 60123 % 847-741-1452 E-mail: [email protected] Web: www.brigitflex.com r

Brigitflex Takes Challenging Boardsfrom Concept to Creation

Brigitflex’s cleanroom keeps particles in the air from interfering with board inspection.

Custom material built 0.5 in. (1.3 cm) thickthrough sequential lamination cycles.

By Brigitte Lawrence, Brigitflex

See at APEX, Booth 2827

http://www.jnj-industries.com


Manchester, NH — Schleuniger hasdeveloped a new machine for laserwire and cable stripping, the Mercu-ry-5. This concept machine can stripwires and cables that range in diam-

eter from 0.12 to 0.79 in. (1 to 20mm). Using the color touchscreen,the operator programs the cable di-ameter, strip length and power level.

Wire or cable is inserted intothe machine and stripped by press-ing a foot pedal. The cable is auto-matically centered and gripped,while the laser performs the strip-ping process. The Mercury-5 canstrip all kinds of polymer insulation

materials. It can also perform anaxial slit, making it easier to removethe insulation after stripping.

The company also offers bench-top cable stripping machines, includ-ing the CoaxStrip 5200 and theUniStrip 2300. The CoaxStrip 5200is a multistep stripping machine forcoaxial, multi-conductor cable andsingle-conductor wire. Due to its uni-versally-designed blades, centraliz-ers and clamping jaws, the machinecan process a full range of cableswithout the need for mechanical ad-

justments, saving the user time andincreasing output when switchingbetween applications. The UniStrip2300 contains a preprogrammedcable library and a highly-responsivetrigger sensor that is great for small,flexible wires. In addition, the ma-chine is also able to strip differentwire sizes without requiring mechan-ical adjustments. Both the CoaxStrip5200 and UniStrip 2300 have user-friendly, high-resolution color touch-screen interfaces and are pro-grammed easily.

Schleuniger’s EcoStrip 9300 cutand strip machine offers a completefeature set at a cost-effective pricepoint. This flexible machine has a vari-ety of capabilities, due to its quick-change transport unit and is compati-ble with a wide range of accessories, in-cluding prefeeding, marking, stacking,and coiling.

Contact: Schleuniger, Inc., 87Colin Drive, Manchester, NH 03103% 603-668-8117 fax: 603-668-8119E-mail: [email protected] Web: www.schleuniger-na.com

Berlin, Germany — Semiconductorand photovoltaic equipment manu-facturer Budatec has partnered withBoschman Technologies to createmanual silver sintering productionequipment. This collaboration en-ables Boschman to extend its in-house sintering technology with Bu-datec’s expertise in vacuum systemsand various protective gas environ-ments. The new systems are intend-ed to offer customers small, compactresearch and development systems,as well as high-throughput versionsof soldering/sintering equipment.The first prototype system is expect-ed to be finished in June 2018.

Budatec is located in Berlin andfocuses mainly on thermal systemsand electronic manufacturing prod-ucts. The company builds vacuum sol-dering systems, ranging from smallbatch installations to fully-automatedproduction models. Bosch man Tech-nologies is a niche producer of semicon-ductor packaging machines. The com-pany provides full solutions for packag-ing, specifically in transfer moldingand silver sintering die attach.

Contact: Budatec GmbH, Melli-Beese-Strasse 28, 12487, Berlin,Germany % +49-30-632-24-071 E-mail: [email protected] Web: www.budatec.de and

Boschman Technologies B.V.,Stenograaf 3, 6921 EX, Duiven,Netherlands % +31-26-319-4900 E-mail: [email protected] Web: www.boschman.nl

UniStrip 2300 benchtop cablestripping machine.

Budatec andBoschman Develop SilverSinteringEquipment

Schleuniger Debuts New Wire Processing Equipment

Making Ovens Smarter

Data Analytics Traceability

MES Connectivity Dashboard

KIC SMART FACTORY STARTER KIT

Learn moreVisit us at APEX Booth # 3301

KIC World Headquarters+1 [email protected] www.kicthermal.com

KIC International Sales - [email protected]

KIC International Sales - Singapore [email protected]

KIC International Sales - [email protected]

Low risk, low investment package to put you on the Smart Factory fast track

http://www.kicthermal.com


Saki Corp. Joins the

ASYS PULSE CommunityFremont, CA — Saki Corporation hasjoined the ASYS PULSE community,networking its automated inspectionand measurement systems withother PULSE member companies’electronics production equipment.

ASYS created PULSE to bringtogether system manufacturers inthe electronics sector. These systemshave custom connections to thePULSE open interface. ASYS’ goalwith the community is to offer itscustomers a solution for an entireproduction line. This allows the com-pany to meet its customers’ require-ments in a way that is not manufac-

turer-dependent. With the inclusion of Saki’s in-

spection machines, PULSE lines arebetter able to monitor and controlproduction through the PULSE net-work. PULSE provides a practical,

convenient and visual way to moni-tor the assembly process and comple-ments the quality assurance andprocess controls built into Saki’s in-spection and measurement systems.

Contact: Saki America, Inc.,48016 Fremont Boulevard, Fremont,CA 94538 % 510-623-7254 E-mail: [email protected] Web: www.sakicorp.com

Saki’s inspection and measurement systems now integrate with PULSE.

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TopLine 2018 ProductGuide Now Available

Irvine, CA — TopLine has finished its2018 product guide, which contains160 pages of updated information.TopLine manufactures a wide range ofdaisy chain semiconductor packagesfor process development, experimenta-tion, machine evaluation, solder train-ing, and SMT assembly practice.

The company’s products providehands-on learning for engineers.TopLine manufactures CCGA col-umn grid array IC packages, and re-cently, introduced new particle im-pact dampers (PIDs) that reduceharmful PCB vibrations and extend

hardware life and reliability.The new guide is a comprehen-

sive resource for customers. The com-pany offers its product guide to helpengineers solve problems, followhunches, gain knowledge, and im-prove their products. For 28 years,TopLine has been continuously ac-tive in promoting its products and so-lutions in the global market.

Contact: TopLine Corp., 95Highway 22 W, Milledgeville, GA31061 % 800-776-9888 E-mail: [email protected] Web: www.topline.tv

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Uneven mating surfaces, �oating height requirements, and exposure to extreme vibration all challenge the integrity of electrical connections. Field proven for performance and reliability in harsh environments, Mill-Max spring-loaded contacts ensure continuity across a wide variety of length and stroke con�gurations, including new low and ultra-low pin pro�les.

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1 9/9/14 10:25 AM

Amerway Offers CustomElectroplating Anodes

Altoona, PA — Amerway is now offer-ing many types of standard and cus-tom anodes for electroplatingprocesses. Electroplating applica-tions include surface preparation,

decorative finishing on metals andplastics, sealing, aircraft bearings,and electrical interconnects in micro-electronic devices.

Amerway’s anodes are madewith high-purity, virgin materials to

ensure that the products are highquality. The company’s state-of-the-art manufacturing facility appliesthe latest methods of advanced pro-duction control to ensure high quali-

ty and consistency. Strict labora-tory control of the manufacturingprocess ensures repeatable quali-ty. The company’s tin anodes aremade in its facility in Altoona,Pennsylvania, and are used inelectronics plating operationsacross North America.

Anode metals include copper,nickel, copper-tin, lead, tin-lead,tin-zinc, zinc, and others. Typicalanode forms include bars, stars,

ovals, ingots, flats, chunks, foil, rib-bon, rectangles, slugs, and many cus-tom shapes for various plating setups.

Contact: Amerway, Inc., 3701Beale Avenue, Altoona, PA 16601 % 814-944-0200 Web: www.amerway.com

Electroplating anodes.

Nordson DIMA Unveils InlineHot Bar Bonding Concept

Deurne, Netherlands — NordsonDIMA has created a standardized,automated, inline concept for heatseal bonding, called C-Quence™. Theline includes three modules for align-

ment, ACF laminating and finalbonding. Additional modules can beadded for more process options.

The company also offers a range

of benchtop hot bar soldering andheat seal bonding systems, as well asstandalone versions. These systemsare excellent for connecting flex cir-cuits to PCBs, flex to flex and wiresto PCBs.

Nordson DIMA serves the globalmarket with hot bar bonding and sol-dering application solutions and offersa range of dispensing and coatingproducts exclusively in Europe. Thecustomer-inspired systems supportmany different industries, from elec-tronics and automotive to medical, de-fense, aerospace, and solar energy.

Contact: Nordson DIMA,Beukelsdijk 2, 5753 PA Deurne,Netherlands % +31-493-352-752 E-mail: [email protected] Web: www.nordsondima.com

C-Quence inline hot bar bonding system.

Elk Grove Village, IL — TransducersUSA has introduced its FLIP (Fre-quency-Low, Indicator-Piezo) seriesof low-frequency piezo audio indica-

tors. These solid-state devices aresuitable replacements for electro-mechanical audio devices that in-clude moving parts, which eventuallywear out. This innovation representsa new approach to engineering audi-ble signal devices, as opposed tousing older electromechanical tech-nology.

The audio indicators containsolid-state piezoceramic benders, un-like electromechanical devices, whichincorporate magnetic-field-generat-ing coil that drives a hammer, hits amembrane and actuates the buzzer.

The FLIP series actuates its buzzerwhen voltage is applied to the piezodevice itself. Without moving parts,the FLIP audio device is designed toprovide a much longer life and lowerfailure rate than its electromechani-cal counterparts.

The new FLIP Series is usefulfor audible emergency alarms, suchas those used in hospitals, nursinghomes and medical centers. They canalso be used for smoke, CO2 andother detectors. The low-frequencybuzzer, in combination with high-fre-quency beepers, provides a spectrumof alternative frequencies.

The frequency of the FLIP se-ries audio indicators is 400 Hz, ± 50Hz, and can range from 350 to 450Hz. The SPL is 95 dBA at 4 in. (10cm) and the voltage rating is 12 VDC.The company also provides modifica-tions to standard FLIP parts, as wellas custom FLIP indicators, with vari-ations in parts and packaging.

Contact: Transducers USA, Inc.,1400 Howard Street, Elk Grove Vil-lage, IL % 847-956-1920 fax: 847-956-1950 E-mail: [email protected]: www.tusainc.com

FLIP series piezo audio indicators.

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Bremen, Germany — Schneider &Koch has developed a new high-volt-age LED testing system, which isavailable in two versions. With high-voltage testing, dielectric break-down, as well as processing faults ininsulation, can be determined in seri-al production. These tests are part ofnational and international safetystandards and are an important part

of electrical safety inspections.High-voltage testing is general-

ly done with both AC and DC. This isnecessary for LED-populated circuitboards with metal undersides. Aleakage current flows between the

voltage-bearing components and thecircuit board’s metal underside dur-ing testing. A minimum distance be-tween the voltage-bearing compo-nents and the metal base can be as-sumed should no flash-over occur.

The high-voltage tester is avail-able in two sizes. The standard designhandles boards up to 3.2 ft (1m) to betested. The system can also be expand-ed to accommodate board lengths of4.9 ft (1.5m). The system can be config-ured to be inline and can be integratedinto any assembly line with standardSMEMA interfaces.

Contact: Prüftechnik Schneider& Koch IngenieurgesellschaftGmbH, Universitatsallee 22, 28359Bremen, Germany % +49-421-696-358-0 E-mail: [email protected] Web: www.prueftechnik-sk.de

Schneider & Koch ExpandsLED Test System Portfolio

Data I/O Sentrix Now Supports Maxim

DeepCover ICsRedmond, WA — Data I/O now offerssecurity provisioning support for theDS28C36 and DS2476 DeepCover® se-cure authentication ICs from MaximIntegrated Products, on the SentriX™security provisioning platform.

OEMs for Internet of Things(IoT) devices are increasingly con-cerned with the risk of IP theft, prod-uct cloning and system hacking bynefarious actors exploiting vulnera-bilities found in connected devices.Attacks on connected products usedin building automation, smart gridand commercial applications haveled to billions of dollars in lost rev-enue, brand credibility and consumerconfidence.

Many security experts agree thatsoftware methods alone are insuffi-cient to protect devices from increas-ingly sophisticated hackers. The bestmethod to prevent attacks is for OEMsto design hardware-based security di-rectly into their products.

Data I/O’s SentriX platformprovides a trusted and secured provi-sioning solution for any company toembed a hardware-based root-of-trust in silicon in the manufacturingflow. Maxim’s DeepCover DS28C36and DS2476 devices solve a range of

security issues for connected devices,including product quality and safety,counterfeit protection, secure down-load and boot, and IoT device integri-ty and authenticity.

Authentication ICs, such asthese two Maxim DeepCover devices,enable hardware-based security toprovide trust, protect IP and to se-cure communications. These devicesenable mutual authentication of IoTproducts with an OEM’s service in-frastructure, so that both the deviceand the service can verify the identi-ty of the other.

Companies can personalizethese devices by provisioning themwith asymmetric keys, symmetrickeys and certificates. This process ofprovisioning enables OEMs to addtheir own unique identity to the em-bedded root-of-trust. An IoT productsecured in this way enables OEMs toprovide secure updates to their prod-ucts in the field, as well as to securetheir supply chains from counterfeitsand clones.

Contact: Data I/O Corp., 6464185th Avenue NE, Suite 101, Redmond, WA 98052 % 425-867-6922 E-mail: [email protected] Web: www.dataio.com

High-voltage LED test system.

http://www.dltechnology.com

http://www.TRANSITIONAUTOMATION.COM

Easton, MD — JTAG Technologies has releasedthe latest version of its Visualizer graphical view-ing tool for board (PCB) layouts and schematics.The software allows users to assess fault coveragedata and pinpoint production test faults quickly.

Users can import schematic data direct fromMentor (PADS, DxDesigner, Capture), Cadence,Altium, and Zuken tools, as well as board layoutinformation in ODB++ and many other vendor spe-cific formats.

Introduced in this version, the new maps fea-ture offers a basic test accessibility view at theclick of a mouse. The view can be fine-tuned easilyby adding a few key component descriptions to thelookup table.

Customizable colors can be added to indicatetest coverage levels or access types and a color-coded schematic can be displayed or printed. Oncethe design has been optimized for boundary scantest coverage and committed to lay-out, final application developmentcan begin in the JTAG ProVision de-veloper tool.

The latest version of Visualizeradds several new features. A “visual-ize on (test) fail” feature now showsall failing circuit nets on a schematicview, a layout view or both — auto-matically. This feature is great forsmall-scale production systems,where the operator is also responsi-ble for fault diagnosis and rework.

A “locate next” feature allows the user totrack the course of a net connection through the

layers of a PCB layout or the sheets of a schemat-ic. Multiple color themes can be defined to distin-guish different net classifications, e.g. for percent-age fault coverage in schematics or fault nets inlayouts.

Operators can now view through layers. Ahighlighted fault net, perhaps as a result of a de-tected board connection fault, can now be viewedalong its entire path and as it changes coursethrough the PCB layers.

Notes can now be added anywhere at a fixedposition on the schematic or layout. This is usefulfor conveying additional information about testprocesses or passing design details between users.

Contact: JTAG Technologies, Inc., 111 NWest Street, Suite A, Easton, MD 21601 % 410-770-4415 fax: 410-770-4774 E-mail: [email protected] Web: www.jtag.com


Visit us at www.nordsonasymtek.com

The only constant in manufacturing is change.

Move your process

FORWARD.

So why should your dispensing and coating process remain static?

QUANTUMHigh-value automated dispensing system – uncompromising quality, value and productivity for in-line and batch fluid dispensing applications.

Nordson ASYMTEK understands the needs of those in electronics packaging and assembly. We offer affordable, efficient productivity solutions backed by our unequalled application support. Drawing on decades of accumulated experience, we are able to provide our customers with capable yet affordable tools to enhance workflows and improve end products.

ConexisMid-volume, high-accuracy modular conformal coating system – provides quality and value for your automated process.

Somerset, NJ — Alpha Assembly So-lutions has introduced its ALPHA®

TrueHeight® solder preforms, whichare engineered with embedded spac-er technology. This technology is de-signed to address all major applica-tions that require bondline thick-nesses of 3 mil (75 µm) and greater.

The preforms are designed to besimple and easy to implement, whilemaximizing solder performance. Thearchitecture of the design not onlyaddresses the bondline thickness re-quirement, but also reduces the op-portunity for voiding. When com-pared with other technologies, thedesign minimizes areas where gasescan be trapped during the reflowprocess.

The preforms have the advan-tage of flexible spacer positioning, sostrategic locations can be chosen toensure consistent bondline thick-ness. The preforms can also be fluxcoated with a wide selection of fluxes.

Contact: Alpha Assembly Solu-tions, 300 Atrium Drive, Somerset,NJ 08873 % 908-791-3045 fax: 908-791-2399 E-mail: [email protected] Web: www.alphaassembly.com

Alpha: SolderPreforms forConsistentBondlineThickness

ALPHA TrueHeight solder preforms.

JTAG Visualizer graphical viewing tool.

JTAG Visualizer Adds Features for Faster Debug

http://www.nordsonasymtek.com


Eliminating Harmful Airborne Pollutants in Electronics Assembly

By Stefan Meissner, Head of Corporate Communications, ULT AG, and Arne Neiser, Product Manager Wave and Reflow Soldering Systems, SEHO Systems GmbH

All soldering processes produceairborne pollutants that canhave harmful effects on em-

ployees, equipment and products.Soldering today comprises a varietyof processes, including wave, reflow,dip, hot air, selective, laser, vacuum,and vapor phase soldering.

In the production of electronicassemblies, soft soldering is used al-most exclusively. The melting tem-perature of the solder is lower thanthat of the elements to be joined, e.g.component leads to PCB pads, whichfalls in the range of 356 to 500° F(180 to 260°C). The molten solderflows between the metal parts to cre-ate a firm, airtight, corrosion-resist-ant, conductive interconnection.

Solder alloys are often suppliedin the form of wire, solder bar or sol-der paste. Depending on the particu-lar application, these alloys are com-posed of tin, lead, antimony, silver,and copper. Fluxing agents can becontained in the solder, which includedifferent chemical compositions, suchas rosin. Normally, halogen-free fluxagents are used to the support thebuilding of proper solder joints.

A Shift Toward Automation

Decades ago, soldering was ac-complished by numerous workersequipped with soldering irons who

soldered individual assemblies en-tirely by hand. Today, automated sol-dering systems of many differentshapes and sizes are used. However,hand soldering at manual work-benches is still found in the majorityof assembly production plants. Handsoldering is most often employed forpre-production runs, prototyping, re-work, and repair.

These machines are highly-spe-cialized systems that can performunique soldering techniques, such as

reflow or selective soldering. Whichsystem is used depends on the typeand lot size of the product. Many pro-duction lines have multiple systemsthat are used for different assemblies.

Airborne Pollutants

Depending on the applicationand requirements of specific compo-nents in an assembly, various solder-

ing alloys and flux agents are consid-ered. During soldering, large parts ofthe flux agent and a small portion of

the solder will evaporate, releasingaerosols and particles into the ambi-ent air.

Besides spreading unpleasantodors, these fumes can harm humanworkers in the area, which can leadto serious medical conditions. Gasesare also released from coatings, ad-hesives and substrates during theheating of the assembly. Aldehydesare particularly dangerous sub-stances that emerge from materialsthat contain colophony — some ofwhich can be carcinogenic.

These gases and fumes alsotransport sticky aerosols, which buildup in the soldering machines or on theproducts themselves. This leads to in-creased cleaning and maintenancecosts, and can impair the operation ofthe plant. Products can even be cor-roded by the contamination, affectingquality and functionality.

In conventional wave solderingprocesses, the entire PCB is fluxed.The emerging spray mists from alco-hol-based fluxes and other evapora-tions may lead to explosive, highly-flammable vapor/air mixtures.

Legal Regulations

Airborne pollutants are classi-fied according to particle size. Thisclassification is determined primari-

Fumes released from a PCB during wave soldering (photo credit: SEHO Systems).


www.westbond.com1551 S. Harris Court Anaheim, CA 92806 Tel 714·978·1551

Manufactured in the U.S.A. since 1966


http://www.westbond.com

http://www.ko-ki.co.jp/en


ly by the effects of the emissions on humans. Adistinction is made between whether they areinhalable (I-fraction) or alveolar (A-fraction).A-fraction pollutants can pass between theblood-air barrier, which separates the air-filled cavities of the pulmonary alveoli fromthe blood in the capillaries.

DIN EN 481 defines statutory limit values.To meet the regulations of various countries, itis often necessary to use extraction and filtra-tion systems to clear the air of pollutants.

Eliminating Particles

In order to eliminate air pollutants, it isnot enough to only provide ventilation in themanufacturing environment. The use of effi-cient extraction and filtration technology ismandatory according to the Employ-er’s Liability Insurance Association.

There is a wide variety of avail-able extraction and filtration systems.Selecting the appropriate system de-

pends on the type and volume of pro-duction, the use of automated, semi-automated, or manual productionequipment, as well as any require-ments for mobility and flexibility.State-of-the-art extraction and filtra-tion units can process ambient air sowell that the cleaned air can even berecirculated into the work area.

Collecting the airborne pollu-tants is a significant part of the task.Close proximity to the source of emis-sion is critical. This not only capturesparticles before they reach the ambi-ent air and build up on equipment,but also minimizes the cost of the ex-traction system. The larger the dis-tance between the source of emissionand the collector, the higher the suc-tion capacity of the machine needs tobe. This has a huge impact on overallenergy consumption.

There are many different kinds ofcollection elements, which are the fit-tings on the ends of the extractionarms. These are designed to ensure op-timal absorption of the emissions indifferent processes. Depending on thetype and the amount of pollution, aswell as airflow principles, users can se-lect from a wide variety of elements.Complete enclosures are also available.

Choosing the proper collecting el-ement is key to the quality of the en-tire extraction and filtration system.The level of pollutant capture is the

basis for subsequent high-grade filtration,which defines the overall efficiency of the sys-tem and the residual pollution in the recircu-lated air.

Besides removing unpleasant odors, thegoal of air purification is to eliminate haz-ardous airborne substances. Air purificationcan play a major role in determining whichcompanies survive in the highly-competitiveelectronics manufacturing space, as air quali-ty has a significant impact on employee well-being and product quality.

Contact: ULT, LLC, 6000 W. ExecutiveDrive, Suite G, Mequon, WI 53092 andSEHO North America, Inc., 1420 JamikeDrive, Suite 300, Erlanger, Kentucky 41018 % 859-371-7346 E-mail: [email protected] Web: www.sehona.com r

Eliminating Harmful Airborne Pollutants

ULT’s JUMBO Filtertrolley 2.0LRA mobile extraction and

filtration unit.

Various collecting elements.


http://www.btu.com


cogiscan.com

E n a b l i n g I n d u s t r y 4 . 0

CONNEC T I V I T Y MAT E R I A L CO N T R O L T R A C E A B I L I T Y A N A LY T I C S

®

B O O T H # 3 8 2 5

T RT O L

rr yy y 44 .4 . 000

with

14:27

ClassOne Slashes Compound Semi ViaLiner Plating Costs

Kalispell, MT — ClassOne Technolo-gy has developed a new plating tech-nique that provides significant costreductions for compound semicon-ductor manufacturers who use gold-plated vias.

According to the company, imple-menting copper plating on the Sol-stice ECD system with the Clas-sOne’s CopperMax™ chamber re-duces costs dramatically. These re-ductions can be as much as 70 per-cent in metallization costs, com-pared with the previous approach.

The new savings result notjust from replacing the bulk ofthe gold with copper, but alsofrom the additional copper-plat-ing efficiencies made possible bythe CopperMax chamber design.Consumables have been thelargest single-cost factor in cop-per plating, because the processtypically requires large volumesof expensive organic additivesover the lifetime of the bath. Butnow, by employing a cation-exchangemembrane to separate anolyte fromcatholyte, the CopperMax chambereffectively isolates additives from theanode, drastically reducing additivedepletion, and therefore usage. Andsince the CopperMax bath remainsclean much longer, bath life is ex-tended by 15 to 20 times, resulting inincreased uptime and throughput.

CopperMax also reduces copperanode expenses. Instead of solid, ma-chined copper material the new cham-ber is able to use less expensive bulk

anode pellets, cutting anode costs byover 50 percent. Since the pellets pro-vide much greater surface area, maxi-mum plating rates can be increased.

In addition to the process im-provements, the net result is a verysignificant reduction in cost per

wafer. Compared with previous cop-per processes, the CopperMax cham-ber reduces additive consumption byover 95 percent, resulting in an over-all cost of ownership reduction of al-most 50 percent. And, for users whoswitch from gold to copper via linersand do the plating on a Solstice sys-tem with CopperMax, the costs arecut by roughly 70 percent.

Contact: ClassOne Technology,109 Cooperative Way, Kalispell, MT59901 % 406-407-7814 E-mail: [email protected] Web: www.classone.com

Solstice S8 electroplating system.

http://www.cogiscan.com

http://www.nozzles4smt.com

Fujipoly: NewLow-CostGeneral Purpose TIM

Concord, CA — Nordson MARCH hasintroduced its latest RollVIA plasmasystem, a self-contained vacuum plas-

ma system for roll-to-roll materialhandling during flex PCB manufac-turing. The new RollVIA incorporatesspecial vacuum and gas flow technolo-gy, new process controls, updated elec-trode designs, and superior tempera-ture management, with precise controlof roll speed, tension, and edge guid-ance for uniform plasma treatment ofsubstrates as thin as 1 mil (25 µm).

The RollVIA system is used forplasma applications, such as surfaceactivation for improved adhesion,

carbon removal and descum/desmearfor cleaner surfaces, as well as etch-back. Etchback removes a slightamount of dielectric contaminationbetween internal copper planes dur-ing PCB production.

Roll-to-roll processing, alsoknown as web processing, reel-to-reelprocessing, or R2R, is the process ofcreating electronic devices on a roll offlexible plastic or metal foil. The Roll - VIA plasma treatment system is self-contained, so that the vacuum system,plasma chamber, control electronics,

and 40 kHz power supply are housedin a single enclosure.

The system has a compact 5.8 x6.7 x 7.7 ft (1.8 x 2 x 2.4m) footprintand can handle and process webwidths from 1.9 to 23.6 in. (4.8 to 60cm). A service-friendly design withthree doors for full front and rear ac-cess makes substrate loading simple.

The RollVIA system’s perform-ance capabilities are complemented bylow cost-of-ownership features. In ad-dition to the its compact and service-friendly design, the RollVIA allows for

vertical processing, so that equal plas-ma treatment can be applied to bothsides of the substrate, maximizingproduct quality and throughput. Thefast vacuum pump-down and processcycle times further add to its produc-tivity. It is configurable with one,three or five plasma cells to meet var-ious process requirements.

Contact: Nordson MARCH,2470-A Bates Avenue, Concord, CA94520 % 925-827-1240 E-mail: [email protected] Web: www.nordsonmarch.com


Nordson MARCH Introduces Next-Gen RollVIA Plasma System

Carteret, NJ — Sarcon® GR14A-50GY from Fujipoly® is a low-cost,general-purpose thermal interfacematerial (TIM) that is offered insheets or custom shapes to fit specif-ic applications. When placed betweenheat-generating components and anearby heat sink, this 0.02 in. (0.5mm) thick, highly-conformable gapfiller pad can transfer heat with athermal conductivity of 1.6 W/m-Kwhile exhibiting a thermal resistanceof 0.61°Cin2/W at 14.5 psi.

To improve material handlingand ease of installation, Sarcon GR-14A is available in three constructions:tacky surface, hardened surface or re-inforced with nylon mesh. These spe-cial treatments can dramatically re-duce elongation, tearing and damageduring cutting and final assembly.

The TIM is designed for opera-tional environments that range from–22 to +248°F (–30 to +120°C). Cus-tomers can order the product in sheetsup to 11.8 x 7.9 in. (30 x 20 cm) or spec-ify an exact size or die-cut shape.

Contact: Fujipoly AmericaCorp., 900 Milik Street, Carteret,NJ 07008 % 732-969-0100 fax: 732-969-3311 E-mail: [email protected]: www.fujipoly.com

Sarcon GR14A-50GY thermal interface material.

RollVIA vacuum plasma system.

http://WWW.KYZEN.COM

San Diego, CA — AMETEK Engi-neered Solutions Group (ESG), thepower and automated test solutionsunit of AMETEK ProgrammablePower, has introduced its firstscaleable, integrated test and meas-urement systems. The FlexSys™ sys-tems are designed for use in medium-to high-mix production environments.

FlexSys™ ATE systems are con-figured from precision power, instru-mentation and switching blocks pro-duced by AMETEK ProgrammablePower and AMETEK VTI Instru-ments. Applications for these systemsinclude aerospace and defense, envi-ronmental stress screening (ESS) andelectronics manufacturing testing.

FlexSys systems are configured

to address the specific test specs andbudgets of each individual customer.This allows manufacturers to focusentirely on optimizing the design oftheir products.

Manufacturers with multipleproduction facilities that standardizeon the FlexSys automated test corecan reduce their development costssubstantially by reusing commoncode. The system’s flexible modularcore software and hardware architec-ture are designed to scale economi-cally to accommodate changing testrequirements. A hardware abstrac-tion layer insulates all instrumentsfrom the application code, so obsoleteones can be replaced quickly. Thesoftware is designed to interface eas-

ily with standard application devel-opment environments for creatingapplication-specific functions.

FlexSys systems are configuredwith Sorensen™ DC power supplies,California™ Instruments and ElgarAC sources, and AMREL power loads.A convenient LAN interface simplifiescommunications and remote control,while intuitive front panel controlsallow for manual operation.

ATE hardware from AMETEKVTI Instruments includes compactmainframes and high-density pluginmodules to minimize the system’sfootprint. A 16-slot LXI mainframesupports multichannel scanning tooptional 6-1/2-digit DMM and high-voltage switching and analog out-

puts. For data-intensive applica-tions, an optional 9-slot PXI Expresshybrid chassis offers 8 GB/s systemthroughput.

An expandable 18-slot mass in-terconnect provides robust termina-tion points for power, RF and signal

I/O. Harness assemblies are specifiedto ensure maximum signal integrityand serviceability. An optional self-test adapter simplifies verifying end-to-end system functionality.

Systems are integrated into24U or 42U racks or enclosures, eachequipped with power control and dis-tribution, grounding, and cooling ca-pabilities.

Contact: AMETEK Programma-ble Power, 9250 Brown Deer Road,San Diego, CA 92121 % 858-450-0085 E-mail: [email protected]: www.programmablepower.com


16:36

AMETEK Launches Scaleable, Compact Test Systems

FlexSys configurable ATE system.

Ingleside, IL — IDENTCO Interna-tional’s operations in Monterrey, Mex-ico, have been awarded ISO 14001:2015 certification for environmentalmanagement systems. One of theworld’s most widely-used standards,ISO 14001:2015 helps organizationsmanage their environmental responsi-bilities in a systematic manner.

Currently, IDENTCO Mexico iscertified to ISO 9001:2008 for its qual-ity management system and ISO/TS16949:2009 for automotive sector-specific quality management, as wellas FSC Chain of Custody certification.FSC Chain of Custody certificationverifies that products are handled cor-rectly at every stage of production.

With headquarters outside Chic -ago, IDENTCO has been deliveringtechnology-driven, high-performancelabeling solutions since 1986. Thecompany strives to develop innovativesolutions that can withstand extremesand meet the strictest performancestandards. With ISO-certified manu-facturing facilities in the U.S., Mexicoand Germany, the company has aglobal presence and local expertise.

Contact: IDENTCO, 28164 Con-crete Drive, Ingleside, IL 60041 % 815-385-0011 fax: 815-385-0359 E-mail: [email protected] Web: www.identco.com

IDENTCOMexicoAwarded ISO14001:2015Certification

http://www.jtag.com

Acton, MA — CAMI Research has released a high-voltage QuickMount™ housing for its CableEye®

automation-ready cable and wire harness testingsystems. As a freestanding, quick-release board fix-ture, it allows users to connect CAMI’s test inter-face boards to the 64-pin headers of any expansionmodule — even at some distance. The housing maybe used with any CableEye model and is rated for2,100 VDC and 1,500 VAC.

CAMI offers its CableEye suite of productscomplete with accessories, such as plug-in connec-tor boards. The selection of these test fixtureboards is constantly growing and currently num-bers more than 60 — most of which are populatedwith families of connectors. When pre-populatedboards are used, the tester GUI automatically dis-plays a graphic of the connectors under test.

This freestanding board-fixture supports anyCAMI connector board. It can be used to connect

these boards to an expansion module, or for appli-cations in which the connector boards must be sep-arated from the tester. If desired, boards may belocked in place using supplied nylon thumbscrews.

A length of expansion cable can extend thehousing away from the tester. For systems largerthan 256 test points, multiple QuickMount hous-ings with increasingly longer expansion cables canbe used.

There are two types of expansion cables. Fortest voltages up to 500V, the company offers ribboncables. For higher test voltages, CAMI offers op-tional AMPMODU cables. The item ships with two5 in. (12.7 cm) ribbon expansion cables.

Contact: CAMI Research, Inc., 42 Nagog Park, Suite 115, Acton, MA 01720 % 978-266-2655 fax: 978-266-2658 E-mail: [email protected] Web: www.camiresearch.com


Introducing the new MYPro series

The new MYPro series – the perfect fi t for any intelligent factory The future of high-mix production belongs to those who can mount any component on any board. Handle any batch or series with zero changeover times. And jet solder paste and adhesive deposits with high-precision at record speeds. The new MYPro series combines two of the industry’s most productive platforms – the MY300 and MY700 – giving you more capabilities than ever before within a 40% smaller footprint than previous generations. Simply put, it’s the smartest way to boost quality and utilization across a vast range of challenging applications.

Whatever your ambitions, the future is already here. In fact, it’s just in time.

THE FUTURE IS ALREADY HERE. IS YOUR FACTORY PREPARED?

Meet us at booth

# 3511at

IPC APEX EXPO 2018

CableEye QuickMount Tester.

CAMI Intros QuickMount Housing for CableEye Systems

Mequon, WI — Fume extraction spe-cialist ULT has opened a subsidiary inthe U.S. ULT, LLC, is directed byWolfgang Kohler, and has its head-quarters in Mequon, Wisconsin, about20 mi (32.2 km) north of Milwaukee.

Kohler is responsible for strate-gy and operations in the NorthAmerican market, with a focus onmarket development and expansion.The operational focus is on air purifi-cation solutions for several indus-tries and applications. In addition toproviding customers with solderingand welding fume extraction technol-ogy, well-proven systems for laserfume extraction, dust collection, orfiltration of gases, vapors and odorsare now available.

According to Kohler there arestrict regulations on occupationalhealth and safety, particularly re-garding air pollution control. This iscreating an increased demand for airtreatment systems to guaranteeprocess safety within the manufac-turing industry.

ULT’s North American cus-tomers will benefit from the compa-ny’s highly-efficient, energy-saving,

low-noise systems, as well as fromextensive service and support.

Founded in 1994, ULT AG is aglobal vendor of industrial air filtra-tion and fume extraction systems, aswell as dust collectors. The broadrange of equipment has been designedfor use in many industries, such asmachine construction, electronics pro-duction, general manufacturing, andmedical. The company offers turnkeyproducts, as well as custom-built unitsfor special applications.

Contact: ULT, LLC, 6000 W Ex-ecutive Drive, Suite G, Mequon, WI% 414-377-1376 E-mail: [email protected] Web: www.ult-usa.com

Air filtration and fume extraction systems.

ULT OpensSubsidiary inUnited States

http://www.mycronic.com


SIKAMA INTERNATIONAL, INC.

Small Footprint • E�cient Power UseConsistent High Yields • Precise Temperature Gradient

FALCON ULTRA PROFILE 1200

REFLOW SOLDERING SYSTEMS

www.sikama.com

35 YEARS OF

EXCELLENCE

Smart Sonic Offers Ultrasonic Stencil Cleaner

Cleveland, OH — Smart Sonic’sstencil cleaning process hasbeen evaluated for environmen-tal safety, user safety andcleaning efficiency.

The company’s Series 1500stencil cleaner incorporatesthe best of Smart Sonic’s tech-nology. The Series 1500 is com-patible with all aqueous ultra-sonic stencil cleaning chem -istries. However, when usingthe company’s 440-R SMT de-tergent, the wastewater may besafely evaporated in standardevaporating equipment or fil-tered and treated like otheraqueous stencil cleaner waste-water. This provides high flexi-bility in waste management.

Smart Sonic also offers a money-back guarantee that the Series 1500will clean any type of solder pastefrom any fine-pitch stencil.

Contact: Smart Sonic Corp., 837E 79 Street, Cleveland, OH 44103 % 818-610-7900 fax: 216-881-8950 E-mail: [email protected] Web: www.smartsonic.com

Series 1500 ultrasonic

SMT stencil cleaner.

Mansfield, TX — Mouser Electronicsis now stocking the DS28E38 Deep-Cover® secure ECDSA authenticatorfrom Maxim Integrated.

Designed to protect devicesagainst security attacks, theDS28E38 is an elliptic curve digitalsignature algorithm (ECDSA) publickey-based secure authenticator. Itincorporates Maxim’s patentedChipDNA™ physical unclonable

function (PUF) technology. This de-vice is the first secure authenticatorto integrate the Maxim ChipDNA ca-pability to protect all device storeddata from invasive discovery.

Contact: Mouser Electronics,Inc., 1000 N Main Street, Mansfield,TX 76063 % 817-804-3888 fax: 817-804-3899 E-mail: [email protected] Web: www.mouser.com

Mouser Now Offering MaximSecure Authenticator

http://www.sikama.com

http://www.xytronic-usa.com/shop/default.aspx

Chandler, AZ — The test adapter forthe SMARC computer-on-modulestandard, developed by Yamaichi, isnow suitable for SMARC 2.0. Thetest adapter enables correct align-ment of the contacts for 100 percentcontacting reliability. Its springprobe pins allow very high contactcycles to be reached.

SMARC stands for Smart Mo-bility ARChitecture, which is a spec-ification published by the Standardi-zation Group for Embedded Tech-nologies e.V. (SGET) for computers-on-modules (CoMs). It enables lowpower consumption of the modules,due to the implementation of ARM orother low-power processors.

Yamaichi’s YED900 seriesSMARC test adapter is an imped-ance-controlled test system, whichmeets the SGET SMARC specifica-tion. It is designed to be durable andhighly reliable. It is also volume testready, which can increase test outputconsiderably.

The socket is designed withcompression mount technology, so nosoldering is necessary. Selected ma-terials, such as aircraft aluminum,PEEK and ceramic PEEK make theadapter robust.

SMARC modules have goldpads for the contacting surface. Thebest contact technology for such sur-face areas are fine pitch probe pins.

The lifetime for the company’sSMARC test adapter is specified upto 50,000 mechanical cycles.

For contacting the module pads,a conical plunger tip is used. Usingthese tips, only small witness marksare formed on the module contactpad. Yamaichi also offers test contac-tors and burn-in sockets. The springprobe pins used in these adaptersand sockets are manufactured by thecompany as well.

Contact: Yamaichi ElectronicsCo., Ltd., 7240 W Erie Street, Suite4, Chandler, AZ 85226 % 480-940-9000 fax: 480-940-9082 E-mail: [email protected] Web: www.yeu.com


YED900 series SMARC test adapter.

Yamaichi: Computer-on-Module Standard Test Adapter

Delaware, OH — Engineered Materi-al Systems (EMS) is now offering a0.2 mil (5 µm) thick dry film negativephotoresist for use in microelectro-mechanical systems (MEMS), wafer-level packaging and CMOS applica-tions (metallization). This materialformulation has been optimized forhot roll or vacuum lamination andprocessing on MEMS and IC wafers.

According to the company, theseare the thinnest dry film negativephotoresists available on the market.The dry films are capable of extreme-ly fine line and space definition incomplex patterns with resolutionsdown to 0.1 mil (3 µm). The curedchemistry can withstand harsh envi-ronments, including resistance to ex-treme moisture conditions and corro-sive chemicals.

EMS dry film photoresists haveglass transition temperatures rang-ing from 248 to 392°F (120 to 200°C).They are hydrophobic in nature, pro-viding chemical and moisture resist-ance. EMS dry films are compatiblewith and can be used in contact withthe company’s line of spin-coatablenegative tone photoresists.

This 0.2 mil (5 µm) dry film neg-ative photoresist is the latest addi-tion to the company’s full line of filmand liquid negative photoresists formaking microfluidic channels onMEMS devices and ICs.

Contact: Engineered MaterialsSystems, Inc., 100 Innovation Court,Delaware, OH 43015 % 740-362-4444 fax: 740-362-4433 Web: www.emsadhesives.com

Super ThinDry FilmNegativePhotoresistfrom EMS

http://www.smartsonic.com


Cranston, RI — Epoxies, Etc. hasadded new products that are pack-aged in the company’s TriggerBond®

system. TriggerBond cartridges are aconvenient, cost-effective way to dis-pense two-component epoxies, ure-thanes and silicones for bonding,sealing or potting applications.

The system eliminates the need

for measuring or hand mixing, whilemaintaining a consistent mix ratio. Italso allows users to apply a virtually

air-free mixture directly into acavity or onto a substrate.

The TriggerBond dis-pensing system includes 1.7,6.8 and 13.5 fl oz (50, 200 and400 ml) cartridges and corre-sponding dispensing gunswith different static mixersto fit nearly any application.The company’s chemists andengineers are available toprovide product selection and

detailed use support.Contact: Epoxies, Etc.,

21 Starline Way, Cranston, RI 02921% 401-946-5564 fax: 401-946-5526 E-mail: [email protected] Web: www.epoxies.com2

800 .424 .9850401 .823 .5200www.advanced.com i n f o @ a d v a n c e d . c o m

M a d e i n U S A

Solving Your Board to Board Connector Design Challenges

1.0mm PitchSMT Connector

1 3/7/17 1:00 PM

Epoxies, Etc. Adds Productsto TriggerBond System

TriggerBond manual dispensing system.

Round Lake, IL — Grieve’s No. 892 isa 500°F (260°C) electrically-heatedbelt conveyor oven, currently usedfor curing sealant on filters at a cus-tomer’s facility. Workspace dimen-sions of the oven measure 18 x 32 x26 in. (45.7 x 81.3 x 66 cm). Nichromewire heating elements provide 36 kWof power. Airflow is generated by a1,500 ft3/min (42.5m3/min) down-ward-facing blower.

The oven has an 18 in. (45.7 cm)open belt loading zone and a 24 in.(61 cm) open unloading zone. Fea-tures include a 12 in. (30.5 cm) insu-lated, unheated entrance vestibule,32 in. (81.3 cm) insulated heat zonewith recirculated airflow and a 12 in.(30.5 cm) insulated, unheated exitvestibule.

Additional features include a 12in. (30.5 cm) wide, 1 x 1 in. (2.5 x 2.5cm) stainless steel flat wire conveyorbelt with 1/4 HP motor drive, vari-able from 0.6 to 11.7 in./min (1.5 to29.7 cm/min), 4 in. (10.2 cm) insulat-ed walls and aluminized steel interi-or and exterior. The oven also has aleg stand with casters. Controls onthe system include a digital tempera-ture controller, 10 in. (25.4 cm) diam-eter circular chart recorder and SCRpower controller.

Contact: Grieve Corp., 500 HartRoad, Round Lake, IL 60073 % 847-546-8225 fax: 847-546-9210 E-mail: [email protected] Web: www.grievecorp.com

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Duluth, GA — Viscom has released its vVision 2.4operating system. Among the latest enhancementsare time-saving inspection program creation, espe-cially for new and special components, and com-prehensive 3D advancements, such as 3D solderjoint inspection for chips.

Rapid product changeovers and various com-ponent manufacturers in electronics productiondemand flexible automatic optical inspection. WithvVision 2.4, switching between existing inspectionprograms and the development of new programs ismuch easier. A new inspection pattern tool for NPIwas also developed to handle new componenttypes.

This tool effectively uses existing libraries, aswell as the 3D technology of AOI systems, to auto-matically assign components in the new layout toexisting inspection patterns. With this approach,time for inspection program creationis reduced significantly.

In addition to an evaluated de-fect image in the center of the display,optional good and bad examples arepresented for comparison. The defect

site and further additional information can be dis-played on a second monitor or by pressing the shiftkey. Based on the images from the cameras and the3D height measurement, along with 360° viewing,components can be inspected from all angles.

This avoids inaccuracy on component sides orshadowing. The texture from all viewing directions— including the side views — ensures that the in-spected component is represented as true to life aspossible. Inspection results from special compo-nents can be checked visually for detected defectsand faulty solder joints.

To support traceability, screenshots and 3Dimages can now be directly saved at any time withthe integrated Live Snapper. The new version alsoincludes advanced OCR recognition, which uses in-telligent algorithms to ensure automatic componentreading and reliable evaluation.

Contact: Viscom Inc., 1775 BreckinridgeParkway, Suite 500, Duluth, GA 30096 % 678-966-9835 fax: 678-966-9828 E-mail: [email protected] Web: www.viscomusa.com


3D image from vVsion 2.4.

Viscom Optimizes Inspection with vVision 2.4

Gardner, MA — SEGGER has intro-duced its Flasher ATE, a new modu-lar gang programmer. It uses thesame Turbo-Mode and UniversalFlash loaders proven in the FlasherPRO and other members of theFlasher family.

Flasher ATE supports up to 10completely individual parallel pro-gramming channels. Each channelhas its own programming circuit andmemory, allowing it to be used indi-vidually and at maximum program-ming speed on every channel.

In mass production, the in-sys-tem programming process is usuallytightly coupled with the testing facil-ities, such as automatic test equip-ment (ATE) or similar devices.

Flasher ATE comes with aready-to-use UART communicationchannel, handshake lines, USB, andEthernet interfaces. Any of these canbe used to control its operation. Thebuilt-in web and FTP servers allowupdates and monitoring from a near-by production control office.

Support for programming ofunique serial numbers and patchdata is also included.

Flasher ATE can program anyon- or off-chip memory. All that isrequired is a flash loader, which isalready available for most populardevices and can be created for allothers.

Contact: SEGGER Microcon-troller Systems, LLC, 101 SuffolkLane, Gardner, MA 01440 % 978-874-0299 fax: 978-874-0599 E-mail: [email protected] Web: www.segger.com

Flasher ATE modular gang programmer.

SEGGER Offers NewModular GangProgrammer

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Hoffman Estates, IL — OMRON’s in-spection division has introduced itslatest series of 3D automated inspec-tion equipment. The company’s lat-est 3D-AXI with computed tomogra-phy (CT), VT-X750, is claimed to bethe fastest CT X-ray inspection sys-tem available.

The VT-X750 increases auto-mated inspection speed through 3DCT. OMRON’s 3D CT reconstructionalgorithms offer highly-accurate sol-der shape recognition and defect de-tection. The VT-X750 is able to in-spect boards up to 20.3 x 24 in. (51.6x 61 cm) in size, taking up 32.2 ft2

(2.99m2) of overall space.The company is also offering

two new 3D AOI machines. The VT-S530 and VT-S730-H are designed toprovide high-quality solder joint in-spection. The VT-S530 provides full3D AOI. The machine provides excel-lent first-pass yield, zero escapes andfew false rejects.

The technology in the systemhas been proven in the existing VT-S730 and VT-S730-H, with which itshares the company’s new image-capture module. The VT-S530 is ver-satile and can be used for both pre- orpost-reflow, single- or dual-lane in-spection. It is compatible with com-ponents as small as 01005 (0402M)and handles board sizes up to 12.1 x26.8 in. (51 x 68 cm).

The VT-S730-H combines the

high performance of the VT-S730with speed for the most demandingproduction requirements. The VT-S730-H post-reflow inspection ma-

chines have been widely adopted inproduction lines where stringentquality control is required, such asthe automotive industry. The resultis an AOI inspection machine that of-fers fully-3D component and solderinspection.

Contact: OMRON Electronics,LLC, 2895 Greenspoint Parkway,Suite 100, Hoffman Estates, IL60169 % 224-520-7650 fax: 224-520-7680 Web: www.omron.com

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Production

Copper dissolution was not studied, or even considered, prior to the ad-vent of lead-free soldering. The reason is that the older Sn/Pb soldershad a much lower dissolution rate, to the point that it was rarely a fac-

tor in the failure of a solder joint. Until the late 1990s, many in the industrywere totally unfamiliar with the term. However, a raft of early mortality of as-semblies, coinciding with the deployment of lead-free soldering, caused an ur-gent need to better understand the problem.

A second contributor to the growing awareness of the importance of copperdissolution was the increase in the use of selective soldering. Selective solderingis not new, but it became very popular with the decrease in through-hole compo-nents and the increase in assemblies with little to no through-hole. The tradition-al wave solder system became too cumbersome for the limited number ofthrough-hole connections that are present in modern SMT assemblies.

The combination of lead-free solders and selective soldering brought cop-per dissolution into the mainstream. The end result was an awareness of aneed to control the time allowed for the formation of a solder joint. The indus-try calls this time-on-joint, or TOJ.

TOJ Guidelines

We have been told that a reasonable figure for TOJ in selective soldersystems is one to six seconds, depending upon the type of surface finish, thethickness of the through-hole copper, and the clearance between the compo-nent lead and the hole.

What is not discussed is where these guidelines come from. The one sec-ond comes from the pure physics of the formation of the desired tin/copper in-terface (Cu6Sn5) and the thermodynamics of the heat flow required to achievethis intermetallic formation. The recommended upper limit is less clear.

The six second (selective solder system) recommendation for TOJ is dueto the rate of copper dissolution that occurs in high-tin solders. SAC305 (Sn,3 percent Ag, 0.05 percent Cu) is by far the most aggressive. Studies haveshown that there is an almost linear relationship between the amount of cop-per dissolved by the liquidus solder and the time the liquidus solder is in in-timate contact with the copper pad and plated through-hole.

The contact time with the plated through-hole is important, but morecritical is the refresh rate of the virgin solder. This is where the selective sol-der system creates difficulty. The solder nozzle is continuously refreshed byvirgin solder from the solder pot. In a stagnant system, with no new solder,the dissolved copper in the solder will quickly bring the process to a steadystate. In theory, a selective solder system never approaches a steady state andtherefore always has hot virgin solder in contact with the joint.

Variables that Affect Dissolution

An absolute dissolution rate is difficult to define because there are manyvariables that affect the dissolution rate. The most common are:

l The type of solder and the tin content, as well as other elements known toslow the dissolution process, such as antimony, bismuth, nickel, and germa-nium. SAC305 (SnAg3Cu.5) is the most aggressive. Sn/Pb (Sn63Pb37) is theleast aggressive, while SN100C (Sn99.3Cu.7) is in the middle.

l The temperature of the solder. A 15°C increase in the solder temperaturecan double the dissolution rate. Pot temperatures typically range from 509to 572°F (265 to 300°C).

l The flow rate of the virgin solder. Typically this is defined as pump rpm,as no effective flow measurements are present on selective solder systems.

An additional factor in TOJ maximum time is the thickness of the cop-per plating in the through-hole. The most aggressive attack occurs in the kneeof the plated hole. When the standard for plated copper thickness was 1 mil(25.4 µm) in the hole, the knee was usually thicker and therefore could with-stand an attack on the copper.

However, with an IPC 6012 Class 2 definition of acceptable copper being0.711 mil (18.1 µm), the margin for error has been significantly reduced. Allof these factors create the difficulty in determining a precise copper dissolu-tion rate. Hence the use of a nominal time of six seconds. If the TOJ is longerthan the time required to completely dissolve the knee of the plated hole, thenthe operator quickly discovers that additional time heating the solder jointwill not increase the percentage of solder in the plated barrel.

It is even possible for solder to migrate back down the plated hole towardthe virgin solder or heat source, resulting in even less hole fill. This is thoughtto be due to the formation of an undesirable intermetallic (Sn3Cu) that is gen-erally unsolderable.

A reasonable rule-of-thumb for the rate of copper dissolution for SAC305is 100 µin. (0.0254 µm) per second of contact. This means that a selective sol-der system with an IPC 6012 Class 2 PCB, plated with the minimum through-hole copper, can dissolve all of the copper in the plated knee in about 7 sec-onds. Therefore, the recommendation for TOJ for a selective solder system isbetween one and six seconds.

Contact: RapidProto, 8116 Zionsville Road, Indianapolis, IN 46268 % 317-975-2060 fax: 317-663-0729 E-mail: www.rapidproto.com r

Copper Dissolution’s Effect on Time-on-Jointfor Selective SolderingBy Stanley Bentley, P.E., Senior Technical Advisor, RapidProto

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Germany’s roughly 30,000 windturbines currently producearound 50,000 MW of electric-

ity for households and companies.The expansion of wind energy bothonshore and offshore is helping to de-termine the pace and success of theshift in energy policy introduced atthe beginning of the decade — a moveaway from nuclear power toward re-newable energies, as well as reducedenergy consumption.

Profitability and efficiency arecritically important to the site prepa-

ration, installation, operation, andmaintenance of wind turbines. Com-bined, these factors contribute to in-vestment and operating costs and ul-timately determine the economic im-pact that a wind power plant canprovide. Plants that are down pro-duce no energy, receive no feed-intariffs and leave their potential togenerate revenue untapped.

A Partner to the Wind Industry

With its connection technology,the HARTING Technology Group is

accompanying the transformationunder way in the energy sector.HARTING’s product portfolio rangesfrom single components to completecustomer-specific solutions and digi-tization strategies. The company’s of-ferings also include consultationservices, providing the basis for long-term, lucrative and secure invest-ments in the sector.

Wind turbines are subjected toextraordinary stresses both onshoreand offshore, due to the particulari-ties of their respective locations, cli-mates, corrosion, and other environ-mental influences. Creating the foun-dation for maximum value retentionof these systems requires optimal re-liability, the best materials, high me-chanical robustness, rapid assembly,strategic maintenance cycles, andservice that is easy to perform.

HARTING connectors help toreduce the cost of erecting and oper-ating wind turbines. Modular windturbines have flexible designs andcomponents that are easy to switchout. Connectors significantly in-crease the modularity of these facili-ties and an ever-increasing numberof wind turbines are being designedthis way.

The pre-assembly of individualunits makes the modular conceptwork. Components are assembledquickly and joined together at thewind turbine’s final location.

Connecting Turbine Modules

HARTING connectors offer anumber of benefits. Using these con-nectors for wind turbine modules canreduce the costs accrued during in-stallation and operation of theplants. An example is the type of con-nector used between the slip ringbody and stationary nacelle. The slipring is used to transmit signals forthe pitch systems that determine theangle of incidence of the rotor blades.A pluggable design, HARTING’sHan-Modular® contact inserts andhinged frame, has many advantagesover permanently-attached wiring.

The slip ring can be replacedquickly, reducing downtimes andminimizing revenue loss. If servicingis required, the slip ring can be re-placed without intervention in thepitch system and without disman-tling the connecting cables.

The drives for rotor blade ad-justment, blade heating, lightingsystems, and yawing, as well as thegenerator brakes, can also be con-

nected easily. Complex wiring is nolonger required. In the event ofmaintenance, worn parts can bequickly and easily replaced. Connec-tors also facilitate the work of the as-semblers, who often need to installcomponents in difficult-to-reachplaces on the gondola and tower.

Many types of wind turbinesuse a gearbox to tune the speed andtorque between the rotor and thegenerator to optimize efficiency. Con-nectors speed up installation thereas well. Pre-assembled cables andconnectors with a high degree of pro-tection, e.g. the Han® Eco, Han HPRor Han M, quickly make the neces-sary connections between the gearunits.

Using HARTING connectorsalso offers advantages for towerlighting. The energy bus elementsfor the lighting can be pre-installedin the tower segments. At the con-struction site, fitters only need to putthe segments together.

Connectors speed up installa-tion and increase the modularity of awind turbine, reduce investment andoperating costs, and provide optionsfor the optimization and modulariza-tion of the power cabinets. In addi-tion, without a modular design, theonsite logistics of onshore plantswith an average output of 3.3 MW —including connectors — would quick-ly reach their limits. As a rule, thecost associated with the use of plug-in connectors is usually amortizedwithin a few years.

In addition, the company pro-duces LED lighting systems asturnkey system solutions with plug-gable device connections, pre-as-sembled cables, distribution unitsand, if required, uninterruptedpower supplies.

The HARTING TechnologyGroup is a partner to the wind indus-try and is contributing to the world-wide energy transformation. Thecompany researches and produces —partly autonomously and partly withwind turbine manufacturers — con-cepts, components and customizedsystems for the specific requirementsof wind turbines on land and at sea.Making connections between modu-lar wind turbine components is help-ing to advance the global energy in-dustry.

Contact: HARTING NorthAmerica, 1370 Bowes Road, Elgin,IL 60123 % 847-717-9217 E-mail: [email protected]


PartneringPartnering

HARTING Connectors Boost

Efficiency of Wind Power PlantsBy Carsten Edler, Industry Segment Manager — Wind Energy, and

Norbert Weiss, Team Leader Marketing Services — Han®, HARTING Electric GmbH & Co. KG

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Distribution

Vitronics Soltec Repped by Murray Percival and Kurt WhitlockMinneapolis, MN — ITW EAE, the electronic assembly equipment division ofIllinois Tool Works, has entered partnership agreements with the MurrayPercival Company and Kurt Whitlock Associates. Murray Percival will repre-sent and distribute Vitronics Soltec soldering equipment in the states of Indi-ana, Kentucky, Michigan, and Ohio. Kurt Whitlock Associates will be repre-senting and offering the selection of soldering systems in Florida. This agree-ment expands the two companies’ representation of ITW EAE’s product line,which includes MPM printers, Camalot dispensers, and Electrovert solderingand cleaning equipment.

Contact: ITW EAE, 8860 207th Street, Minneapolis, MN 55044 % 952-469-5424 Web: www.itweae.com

Digi-Key Now Offering Cypress BLEPioneer KitThief River Falls, MN — Customers who opted in to be early adopters of theCypress Semiconductor PSoC 6® BLE (Bluetooth low energy) Pioneer Kitthrough Digi-Key Electronics, will be seeing the product arrive shortly. Thecompany has received the highly-anticipated stock and has begun to processand ship customer preorders. Cypress’ PSoC 6 microcontroller is designed todeliver the ultra-low-power, high-performance and built-in security featuresthat tomorrow’s IoT devices demand.

Contact: Digi-Key Corp., 701 Brooks Avenue South, Thief River Falls,MN 56701 % 218-681-6674 fax: 218-681-3380 E-mail: [email protected]: www.digikey.com

Heilind Electronics Stocks Hirose SDI ConnectorsWilmington, MA — Heilind Electronics has expanded its selection of intercon-nect solutions with the Hirose BNC75 series connector. The serial digital in-terface (SDI) compliant connectors support transmission speeds up to 12 Gb/s.Hirose’s BNC75 series has an easy-on, easy-off bayonet lock system and israted for 75W, but can be mated with 50W-based BNC connectors. The minia-ture BNC75 series radio frequency (RF) connector has an optimized centercontact design that simplifies PCB layout and supports SMT processing, ulti-mately decreasing labor and assembly time.

Contact: Heilind Electronics, Inc., 58 Jonspin Road, Wilmington, MA01887 % 978-657-4870 Web: www.heilind.com

“Ask Avnet” Web Agent Now Availablein AmericasPhoenix, AZ — Avnet has moved its “Ask Avnet” web agent into open beta,providing access to anyone in the Americas who visits www.avnet.com to a di-verse base of engineering knowledge. This contains information across the en-tire Avnet ecosystem, including Avnet, Hackster.io and element14. The serv-ice combines artificial intelligence (AI) and human expertise to streamline theonline customer experience. Customers ranging from professional engineersto procurement specialists can use Ask Avnet to gain insight and informationto bring new technologies to market.

Contact: Avnet, Inc., 2211 S. 47th Street, Phoenix, AZ 85034 % 480-643-2000 E-mail: [email protected] Web: www.avnet.com

Future Electronics Signs DistributionAgreement with LumentumMontreal, Quebec, Canada — Future Electronics has signed an America’s dis-tribution agreement with Lumentum. Under the terms of the agreement, Fu-ture Electronics is authorized to sell Lumentum’s optical transceiver prod-ucts. Lumentum is a manufacturer of optical and photonic products that en-able optical networking and commercial laser technologies. The company’scommercial lasers are used in diverse applications, including next-generation3D sensing. Lumentum has headquarters in Milpitas, California, with R&D,manufacturing facilities and sales offices worldwide.

Contact: Future Electronics, 237 Hymus Boulevard, Pointe Claire, Que-bec, Canada, H9R 5C7 % 514-694-7710 E-mail: [email protected] Web: www.futureelectronics.com

Haecker Automation Joins NDC LineupIvyland, PA — NDC International is now representing Haecker Automationin North America. For more than 20 years, Haecker Automation has provid-ed future-oriented solutions in microsystems technology. The family-owned,German company operates worldwide in the fields of microassembly, micro-and nanodispensing and micro-laser soldering. Haecker’s OurPlant assemblyplatform is a modular system designed to move manufacturers from conceptto series production quickly. The modular setup allows the user to choose theright processing equipment for each phase of the production cycle.

Contact: NDC International, 110 Steamwhistle Drive, Ivyland, PA18974 % 215-355-2460 E-mail: [email protected] Web: www.neudynamics.com

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When Machine Vision Products, Inc., (MVP)was founded 25 years ago, cell phones werein their infancy and portable electronics

simply didn’t exist. The majority of manufacturingwas through-hole, the i486 was the main computingplatform and Windows 3.1 was flashy and new.

Dr. George T. Ayoub built the company whenno one had seen a smartphone, flatscreen TV, mp3player, solid state drive, GPS system, hybrid car,digital photograph, and many other technologiesubiquitous today. And, who could foresee theimpact that the Internet would have?

In 1993, cell phone usage in the U.S. hadrisen to 11 million users, whereas by 2017, 81 per-cent of the population, approximately 265 millionpeople, had cell phones. At the time, the Sparcprocessor — MVP’s original computer of choice —

had 0.8 million transistors. Today, the Xeonprocessor used in MVP’s systems contains up to 7.2billion transistors. When the company was found-ed, there were only 50 Internet (www) serversworldwide. Now, more than 50 percent of theworld’s population has access to the web.

The rate of change in technology and man-ufacturing in the electronics industry has beenexponential. Famous for his prediction of thedoubling of the number of transistors in ICsapproximately every two years, Intel’s formerpresident, Gordon Earle Moore, should be proud.

New Challenges Ahead

MVP has always endeavored to provideinnovations, solutions and capabilities to meetthe needs of the rapidly-changing market. Theseinclude statistical process control (SPC) for AOI,SPI and 3D AOI, multi-spectral lighting, multi-camera inspection, wirebond inspection, and diemetrology.

In the early 1990s, a system with 1 to 2 mil(25 to 50 µm) resolution may have been suitable toinspect a 486 motherboard. In 2017, 0.4 to 0.6 mil(10 to 15 µm) resolution was enough for basic com-

ponent assembly. But, moving forward, resolutionsin the single-digit micron range will be required forkey electronic hardware.

The next generation of chip components arechallenging SMT inspection with geometries of 5mil (125 µm) and solder fillets below 1 mil (25 µm).Even thermal expansion on a board can change theposition of these components dramatically, so spe-cial registration techniques will be required. MVP,with its 2020, 850, Spectra, and Ultra platforms, iswell-positioned to deliver the solutions for thisnext level of integration.

Into the 2020s

Key goals for any manufacturerare to increase quality at the most criti-cal stages of manufacturing, increaseyields and decrease costs. Although the10 times rule for the cost of identifyinga defect at each stage is less accurate astime goes on, the concept is still true.

Using the automotive industry asan example, finding a defect at the leadframe process may cost less than $1.Finding one during SMT assembly maycost between $10 and $300. Finding adefect in the field can cost between$1,000 and $3,000.

Finding defects as early as possibleis critical to providing the highest possible qualityat the lowest cost. This is true for all aspects ofelectronics manufacturing. The 10x rule varies bymarket and while 10x may be accurate for con-sumer electronics, high-rel products may be 100xand mil/aero 1,000x.

Looking toward the next decade, MVP hasexpanded its range of systems to meet the future’snew and challenging inspection requirements. Thecompany offers front-end semiconductor processinspection, including wafer, die and post-dice

inspection. Back-end semiconductor processesinclude lead-frame and wirebond inspection, dieplacement metrology, surface and substrate

inspection, packaging inspection, and hybrid andMCM inspection. For SMT assembly, the companyoffers backplane, solder paste, post-placement,post-reflow, and conformal coat inspection.

Front-End Processes. The latest series of 850platforms provide fully-automated handling ofwafers in film frames for surface and post dicinginspection. Surface damage, FM and edge damagecan be identified. These systems can be configuredfor cleanrooms up to Class 100. The companyoffers fully-automated handling for wafers in ringframes, top/bottom side inspection, defect mark-ing, and defect mapping.

Back-End Processes. The company’s offering forback-end processes are split between two plat-forms: the 850 and its latest platform, the 2020.These processes cover wirebond, die, edge, surface,FM, eutectic, lead frame, BGA, bump, flux, and

paste inspection. Each solution offers high-resolution telecen-

tric optics, 3D laser inspection, confocal, or 3D pro-jector imaging. This makes these platformsextremely flexible. In addition, the systems pro-vide capable registration tools, allowing dice,wires and substrates to be registered on the fly,with inspection requirements calculated on apart-by-part basis.

Throughput and automated handling arekey. Depending on the configuration, the 2020DWMS is capable of more than 150,000 unitsper hour. For handling, MVP microelectronicsAOI platforms can be configured for lot solu-tions, including magazine handling,lifters/indexers, JEDEC trays, waffle packs, andAuer boats. The company’s inline solutions offerboth single- and dual-lane processing, strip han-dling and inline wafer handling. MVP can also

provide custom handling solutions for specializedinspection applications.


Machine Vision Products: Designing the Future’s Inspection Machines

By Paul Groome, Semiconductor Business Director, Machine Vision Products

1993 — i486 motherboard: PGA processor, dual inlinethrough-hole, through-hole passives, QFP, J-lead.


2016 — i5 motherboard: flip-chip process,SMT (to 01005), QFN.

Rate of change in chip components.

From decentralized intelligenceand cyber-physical systems tothe smart home and smart fac-

tory — the Internet of Things (IoT) is

being brought to the fore. However,the IoT does not only mean connect-ing devices using the Internet. Whencables get in the way and Wi-Fi is notpracticable, other wireless standardshave to be used. AMBER wireless, aWürth Elektronik eiSos Group com-pany, is now making the evaluationof this process simple with a wirelessapplications design kit for theRaspberry Pi.

AMBER offers various radiomodules operating in the 868 or 915MHz frequency band as a sub-GHzsolution. In contrast to the 868 MHzmodules, the 915 MHz modules areFCC-certified and use spread spec-trum technology (FHSS and DSSS).These modules are footprint-compat-ible and provide the same AMBERRF stack functionality as their 868MHz counterparts.

For quick and easy developmentof power-saving sub-GHz wirelesssolutions, developers can use theRaspberry Pi and the AMBER PI kit,a deluxe evaluation board. TheRaspberry Pi already provides 2.4GHz interfaces, such as Wi-Fi andBluetooth, but is missing a sub-GHzradio interface. AMBER wireless,with its AMBER PI, offers a simplemeans of equipping Raspberry Piwith extensive wireless communica-tion options.

Besides hardware, the AMBERPI AMB8826-PI design kit containsthe necessary software to integratethe supplied peripherals with theRaspberry PI. The plug-on board issuitable for all Raspberry Pi modelswith a 40 pin header. The AMB8826wireless module on the AMBER PIenables wireless communication inthe 868 MHz frequency band. It alsocontains two serial peripheral inter-faces (SPIs) and two I2C interfaces toconnect sensors or other electroniccomponents.

Energy-Saving Wireless Module

The AMB8826 radio module isthe main component for wirelesscommunication and is accessed bythe Raspberry Pi UART interface. Ithas a low power consumption of 26mA at 14 dBm transmission powerand only 0.2 µA in the sleep state,which is excellent for battery-operat-

ed applications. The AMB8826 iscapable of transmission distancesover 1.2 mi (2 km). It also offers along-range mode to allow wirelessconnections up to 6.2 mi (10 km).

But, the 868 MHz band offersadvantages over Wi-Fi or Bluetooth,which bridge greater distances. It isbetter equipped to deal with interfer-ence, as there is less wireless com-

munication in this frequency band,and the lower frequency means thatobjects have less impact on the wire-less quality and range.

Contacting

In order to retain the variabilityand adaptability of the Raspberry Pi,despite the plug-on board, theAMBER PI pins connect through the

Raspberry Pi. This allows furtherplug-on boards to connect to the pinsof the I2C interface and SPIs. Threeplug-on boards with sensors are sup-plied, along with the evaluationboard.

These measure temperature,air pressure, relative humidity, andmotion. Besides the sensors, a plug-


AMBER’s Wireless Applications Kit forRaspberry Pi Makes Evaluation Simple

By Selina Schuler, Software Developer, AMBER wireless GmbH


The AMBER PI is an expansionboard for the Raspberry Pi 3Dthat equips the board with the

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On the production/testing floor, is it better topass a failing device or to reject a good one?Obviously both are bad choices. If you reject

a good device, you shoot yourself in the foot, sinceyou lower the yield of your manufacturing facilityand take a hit to profits. But, if you pass a failingdevice, the undetected manufacturing flaw willeventually be found in the field at a cost severaltimes higher than on the manufacturing floor,impacting profits and, worse, your reputation withcustomers.

This is still true today, and in fact, it has justgotten worse. Recent statistics reveal that the costof testing a batch of chips after manufacturing, inorder to determine which parts are free of defects(as opposed to free from design bugs), adds up to 40percent of the cost of building the chip.

These considerations drove the industry todevise methods to build testability into the chip atthe design stage, aimed at lowering the testingcosts. Called design-for-testability (DFT), it is pos-sible to ensure the detection of all faults in a cir-cuit, reduce the cost and time associated with testdevelopment and to reduce the execution time oftesting fabricated chips.

Broadly speaking, over time, the industrydeveloped two forms of DFT: ad hoc and struc-tured. Ad hoc DFT consists of a set of rules to pro-mote “good” design practices to ease and acceleratethe testing process. Examples include making allflip-flops initializable by providing set and resetsignals, avoiding asynchronous logic feedbacksthat can result in oscillation, eschewing gates witha large fan-in, since they make the inputs difficultto observe and outputs difficult to control. Or, pro-vide test control for difficult-to-control signals.

For example, signals produced by a long

counter require many clock cycles to control, whichincreases the length of the test sequence.Generally speaking, ad hoc DFT does not add logic,meaning it does not consume silicon in the design.

Structured DFT: Scan and BIST

Structured DFT involves adding extra logicfor test according to some procedure. The mostcommonly-used structured methods are scan andbuilt-in-self-test (BIST). Scan was first mentionedby Williams and Angell in 1973. Sequential cir-cuits — as opposed to combinatorial designs — aredifficult to test. The main idea behind scan was tomake the internal memory elements part of ashifter register chain to provide controllability andobservability through serial shifts.

With scan chain, the problem of testing anycircuit is reduced to testing the combinational logicbetween registers. The basics are to convert eachflip-flop to a scan register. The only cost is one extra

multiplexer. In normal mode, flip-flops behave asusual. In scan mode, they behave like a shift regis-ter. The contents of flops can be scanned out andnew values scanned in. More to the point, themethod allowed the development of automatic testpattern generators (ATPGs), and alleviated thetime-consuming and tedious task of creating testvectors.

As circuit complexity increased over time,VLSI designs in the 1990s and in the new millen-nium of SoC chips, tester costs surged dramatical-ly as did the cost of test program development. Anextremely high and ever-increasing logic-to-pinratio on the chip makes it harder to accurately con-trol and observe the inner workings of the device —essential for testing. Consider these difficulties:

l SoC devices are increasingly denser and fasterwith each drop in process technology node.

l Test pattern generation and application are becoming extremely long.

l Prohibitive amounts of test data must be storedin the ATE.

l It is increasingly difficult and expensive to perform at-speed testing (at GHz).

l Unfamiliarity with gate-level structures of theDUT, since logic is now automatically synthesized from hardware description languages (HDLs), thus compounding the problem of testability insertion.

l Dramatic lack of skilled test engineers.

To cope with this unstoppable trend, theindustry responded by integrating some testercapabilities onto the chip, hence the name BIST.BIST reduced the complexity, decreasing the costand reliance upon external (pattern-programmed)test equipment in two ways.

With a DFT app, user inputs are fed into thehardware emulation’s compiler. The emula-tor then creates a representation of the DUT.



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in board for the SPI interface is also included.This allows designers to develop their own pro-totypes in-house, connect additional sensors tothe board and experiment with unique circuits,beyond the examples provided with the designkit.

In addition to the AMBER PI as a plug-onboard for the Raspberry Pi, the design includesthe AMB8665 USB stick. This USB stick turnsany PC into a remote wireless communicationstation. The AMBER PI and AMB8665 areready for immediate use and can communicatewith one another right out of the box.

AMBER RF Stack

The AMBER RF Stack is usedacross all AMBER wireless modulesand is integrated within theAMB8826 firm ware, allowing theAMB8826 command mode to be used.The host — in this case the RaspberryPi — can send predefined commandsto the wireless module through theUART interface to initiate its config-uration or to transmit wireless mes-sages.

The module, in turn, respondsto this by confirming that the com-mand has been implemented. Inaddition, the AMB8826 can be pro-grammed to transmit independently,for example, if a wireless messagehas been received.

The command always startswith the start signal, a byte with thevalue 0x02 to display the beginningof a message. This is followed by thecommand byte, which describeswhich command is involved. A lengthbyte then follows, which determinesthe number of the subsequent databyte. The command is concluded witha checksum to verify correct trans-mission between the host and mod-ule. After successfully sending themessage, the module responds with aframe with a data byte of 0x00 if thecommand was executed correctly, or0x01 if there was an error.

The AMBER PI software devel-opment kit (SDK) is provided withsource code in C. It contains the driv-ers for the hardware supplied(AMB8826, AMB8665 and sensors)and implements the command inter-face of the AMBER RF stack. Heresimple functions configure a com-mand, transmit it to the modulethrough the UART interface andinterpret the response. The returnedvalue of the boolean functions indi-cates whether the command has beensuccessfully executed by the moduleor not.

Besides communication withthe AMB8826, the SDK also includesthe drivers for the sensors supplied,so they can be controlled quickly andeasily.

The SDK also contains anexample application. This periodical-ly reads the sensors plugged in andtransmits their values to the USBstick. This application can providethe basis for a project or supplement-ed with additional code.

With the AMBER PI Kit as a completepackage of hardware and software, a simplesolution is now available to equip the RaspberryPi with wireless communication functionality inthe sub-GHz spectrum.

Typical applications include remote moni-toring and radio control, replacement of serialcable connections or sensor networks in industri-al automation. By paying special attention tosimplicity of use and flexibility in configuration,a large number of diverse projects can be imple-mented easily.

Contact: AMBER wireless GmbH, Rudi-Schillings-Strasse 31, 54296 Trier,Germany % +49-651-99355-71 E-mail: [email protected] Web: www.amber-wireless.de r


The AMBER PI including plug-on sensor boards.

Wireless Applications Kit for Raspberry Pi Makes Evaluation SimpleContinued from page 59

AMBER wireless, with itsAMBER PI, offers a simple

means of equippingRaspberry Pi with extensive wireless

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First, it decreased the durationof the test cycle. Second, it eased thecomplexity of test/probe set up, byshrinking the number of I/O signalsthat must be driven/examined undertester control.

Further, BIST made it possibleto test circuits at speed (at GHz),

leading to more thorough examina-tions.

The basic approach was to com-press “good” test responses into a“signature” and implement pseudo-random (or pseudo-exhaustive) pat-tern generators (PRG) onto the chip.BIST is indeed the integration of pat-tern generation and response evalua-tion on the chip.

In the most popular BISTmethodology, scan cells are modifiedto generate pseudorandom test vec-tors at the input to a logic block, andthen to collect a signature at the out-put, using a linear feedback shift reg-ister (LFSR). Examples of BIST in -clude LFSR and MISR (multiple-sig-nature input register) used to gener-ate the signature of the tested circuit.

BIST consumes more silicon

area and more verification cycles (aspseudorandom), but saves the cost ofgenerating and storing test vectors.Also, BIST often takes less time as itcan be run at full clock rate.

DFT Verification

Scan and BIST are usuallyincorporated in the design after it hasbeen verified to be functionally cor-

rect. Unfortunately, the insertion ofthe on-chip test infrastructure, suchas scan chain, BIST structure andcompression/decompression logic,may interfere with its functional cor-rectness. It is essential to perform agate-level verification of the design,after the DFT implant.

Right off the bat, HDL simula-tion cannot do the job. Given the levelof design complexity, gate-level simu-lation would require many months —or years — for complete verification.This task is a perfect match for ahardware emulation platform.

Emulation with a DFT App

Mentor Graphics offers a DFT“app” for hardware emulation thatincludes everything necessary toachieve this objective. Its compiler

creates the necessary testing infra-structure for reading test vectorsfrom the STIL file, applying them tothe synthesized DUT, and for com-paring the outputs. The compiler alsore-compiles and synthesizes the usernetlist into a structural descriptioncompatible with emulation.

The DFT app enables executionof complete pattern sets for DFT veri-fication in a reasonable time to short-en the pattern development cycle.Scalable hardware and a compilerenables test pattern validation forlarge gate-level designs with scan andother test structures embedded into

the design. The DFT app is interoper-able with other tools, by supportingstandard STIL format files.

An emulation session providesenough verification power to pull theDFT schedule within the time theproject management has scheduled.This powerful tool can acceleratetime-to-market, increase the yieldand ultimately raise profits.

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The process of determining theideal plasma treatment thatwill resolve a challenging bond-

ing or adhesion issue is an exact sci-ence, often the domain of chemistsand physicists. However, with multi-ple options and chemistries at theirdisposal, coming up with the idealplasma “recipe” often involves havinga precise understanding of the sur-face free energy.

Unfortunately, many of the tra-ditional devices used to measure sur-face energy are limited in the extentof information that they provide. Inaddition, many fail to measure thepolar and dispersive components ofsurfaces that otherwise have thesame surface energy.

This is critically important,says Dr. Michael Barden, head ofresearch and development at PVATePla America, because differenttypes of adhesives will form a superi-or bond with a surface that is polarvs. dispersive. Organic adhesives, forexample, often bond better to disper-sive surfaces, whereas two-compo-nent epoxies, carbonates or ureaswork better with a polar surface.

“When all these factors can bemore precisely measured, plasmaexperts are able to dial in the besttreatment solutions faster, withmore consistent results,” saysBarden.

Dyne Tests

Plasma treatments are oftenused to create a high surface energyto increase the “wettability” of sur-faces and assist the spreading ofchemical adhesives. To measure thissurface energy, dyne tests are oftenperformed to derive a value indynes/centimeter.

These tests come in manyforms, but include dyne pens thatcome with a specific dyne level listedon them. When run across a solidsurface, the liquid from the pen willspread or wet-out if the dyne level islower than the material’s surfaceenergy. If the ink’s dyne level isequal or higher, it tends to remain indroplets. While, economical and sim-ple to perform, dyne pen and inktests provide only an approximationof the surface energy.

“In about 70 percent of the proj-ects we work on, dyne testing rough-ly correlates to the adhesion,” says

Barden. “However, it can only deter-mine if bonding is working within aspecific range.”

Barden says customers regular-ly ask for dyne tests to determine thesurface energy is, for example, “55dyne/cm or better.” However, deriv-ing a quantitative number can beimportant if a plasma treatmentworks best at, say, precisely 60dyne/cm.

“By more completely measuring

the surface free energy, we can comeup with a measure of the quantita-tive change that occurs before andafter plasma treatment,” saysBarden. “This allows the customer tocorrelate those measurements withtheir actual bonding experiments toensure the best possible bond isbeing achieved.”

To do this, designers and manu-facturers of plasma systems like PVATePla America often turn to the most

advanced drop shape analyzers fromglobal manufacturers such as Krüss.

Drop Shape Analyzers

Drop shape analyzers measurethese contact angles visually. Adroplet is deposited by a syringe,which is positioned above the samplesurface, and a high-resolution cameracaptures the image from the profile orside view. The image is then meas-


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In March 2015, the International Commission onIllumination (CIE) published the first interna-tional standard with guidelines on LED light

source measurements. Previous standards onlyaddressed measurements of traditional light sources.

LED-based sources initially introduced to themass market had limited quality control, becauseolder standards did not cover such products. Evencomparatively recent European standards did notlead to uniform measurement methods.

The latest CIE S 025/E:2015 standard pre-cisely describes conditions of repetitive photomet-ric and colorimetric measurements of LED lamps,modules and luminaires (in equipment).

Availability of precise photometric data forLED sources is the basic requirement for designinggood lighting systems and assessing product effi-ciency. Data from measurements made in stan-dardized conditions are consistent. The standardassumes that if the same assessment were to bemade in different laboratories, all of them wouldobtain the same results (allowing for measurementuncertainty errors).

There are two accepted methods to determineluminous flux. The indirect method calculates lumi-nous flux based on light intensity using a goniopho-tometer. The direct method uses an integratingsphere, a closed spherical space with an interiorcoating with excellent light diffusing properties.The reflection factor should be high and should bediffusive in accordance with Lambert’s law.

Integrating Sphere

An integrating sphere is a hollow spheremade from material that prevents penetration byexternal light. The sphere diameter should be suf-ficiently large enough to provide the required dis-

tance between the measured object and the spherediffusion surface. This allows multiple reflectionsof light inside the sphere without any interactionwith the measured source.

The diameter of the sphere for compact lampsshould be at least ten times larger than the DUTand, for tube-like sources, at least double thelongest dimension of the source. In accordancewith this principle, 4.9 ft (1.5m) long tube lightsshould be measured in an integrating sphere witha diameter of 9.8 ft (3m), and never smaller than6.5 ft (2m).

The sphere interior should be uniformly cov-ered with a diffuse coating having reflective and

spatial distribution properties similar toLambert’s distribution. The literature and CIETechnical Committee in 1989 recommended thatthe total reflection factor of the coating should beequal to approximately 80 percent. This was corre-lated to the properties of available barium sulfatepaints. At a low reflection factor, high spectralreflection factors through the entire wavelengthrange was obtained. When a paint mixture with ahigher total reflection factor was used, the spectralreflection factor for wavelengths below 400 nm wassignificantly lower.

Because of these properties, a coating with alower total factor was recommended. It allowed forproper diffusion of light in the entire spectralrange inside the integrating sphere. However, dueto the lower reflection factor, the number of multi-ple reflections was also lower.

New CIE Recommendations

In 2007, the CIE Technical Committee pub-lished the first document detailing principles forthe measurement of LEDs. The documentdescribes the markedly different characteristics ofLED lamps vs. traditional wideband light sources.

Among the requirements, the measurementinstrument should have photometric correction sothat mismatch error is less than three percent,according to CIE 1987b classification, unless cor-rection of the spectral mismatch is always made.The error here results from differences in the spec-tral characteristics of the filters used in photomet-ric heads and our photopic response — the vision ofthe human eye in well-lit conditions.

This difference creates much larger errorsduring colored diode measurements, because the

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ured using image analysis software.Most of these systems are soft-

ware-controlled to enable directdetermination of the precise contactangle and surface free energy, meas-ured in millinewton per meter(mN/m). This value has a direct 1:1relationship to dyne/cm.

In addition, the Krüss equip-ment can simulate surface treatmentprocess conditions using precisiontemperature-control methods andother accessories. This enables wet-ting processes to be optimized for eachprocess. For example, contact anglemeasurements can be carried out ataccurately controlled temperaturesbetween –22 and +752°F (–30 and+400°C) or at a precise humidity level.

According to Barden, one of themost important benefits of usingadvanced drop shape analyzers is thecapability to evaluate the polar anddispersive components of surface freeenergy. Although water is often usedfor contact angle measurement, it isnot sufficient for determining if thesurface is polar or dispersive.Instead, multiple types of known liq-uids must be used, the data fed intocomplex mathematical equations,analyzed and then graphed.

This type of approach can alsobe used to determine if a surface is“oleophobic,” or repels oils. In appli-cations, such as fluorinated coatings,that ideally need to repel water andother organic materials, drop shapeanalyzers play a key role.

When an engineer wants tobond assorted polymers, he or shewill often want to know if they areoleophobic as well as hydrophobic,and the Krüss system provides thatinformation,” explains Barden.

Armed with this type of quanti-tative and qualitative data, plasmaexperts can then alter surfaces byaltering the plasma treatment

applied. Physical plasma, take helium,for example, would create a dispersivesurface that allows liquid to spreadbroadly; oxygen plasma along with ahydroxyl or carboxyl coating could beused to create a polar surface thatwould alter the spreading mechanism.

Leveraging Surface Analysis

PVA TePla offers this technolo-gy as a service, supported by an in-house team of materials scientistsand engineers. With this type of sys-tem, users can dial in precise equa-tions that provide the best options forsuccessful surface treatments.

In addition to designing and

manufacturing plasma systems, thecompany also serves as a contractmanufacturer and has the in-houseequipment to process materials andconduct a full range of experiments.

This provides customers anopportunity to brainstorm with theirtechnical team and run experimentstogether. According to Barden, thesetechnical customer/supplier meet-ings often produce the best experi-mental matrices and ideas.

Contact: PVA TePla America,251 Corporate Terrace, Corona, CA92879 % 951-371-2500 E-mail: [email protected] Web: www.pvateplaamerica.com r


Precise Measurement of Surface Free EnergyPromotes Superior AdhesionContinued frompage 63

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Acoustic micro imaging tools, oracoustic microscopes, are well-known for their ability to pulse

ultrasound into a sample, collect theechoes and create acoustic images.These images show the desired depthwithout harming the sample. Thesetools can even create nondestructivecross-sections.

Acoustic micro imaging can alsobe used to inspect the surface of asample, rather than its interior. Thepurpose may be simply to ascertainthat a batch of newly-packageddevices have a surface that meets themanufacturer’s specifications. Theremay be surface features, such asmold marks, but the rest of the sur-face should meet flatness standards.

Imaging the surface can also beuseful as an early indicator of inter-nal defects. An internal void, forexample, may cause local elevation of

the surface. Internal material stress-es, even in the absence of a void orother gap, can also cause surface dis-turbances. Such stresses are espe-

cially significant, since they are like-ly to turn into field failures.

Basic Acoustic Imaging

At a basic level, the laterally-scanning transducer of the acousticmicroscope may cover 3.3 ft/s (1m/s)

when scanning a tray of parts. Inthat second, it will perform severalthousand pulse-echo functions ateach of several thousand x/y loca-tions on the sample’s surface. Eachpulse travels from the transducerthrough water at about 4,900 ft/s(1,500 m/s) to the sample. The trans-

ducer is typically a few millimetersabove the sample’s surface.

If, for example, the transduceris 0.25 in. (6 mm) above the surface,ultrasound will reach the samplesurface in 4.044 µs and return at thesame rate. The time is so brief that

each pulse-echo sequence is discrete.When imaging the surface, the

echoes are said to be gated on thesurface — meaning that echoes fromother depths may arrive at the trans-ducer later, but are ignored.Ultrasound pulsed into the sampletravels through the sample until

enough of the pulse has beenabsorbed that no readable echo ispossible, or until the pulse exits thebackside of the sample. In Sonoscan’sC-SAM® tools, one of the many imag-ing modes scans the backside of sam-ples to detect those regions where noultrasound exits. These acousticshadows are caused by gap-typedefects higher in the sample.

Measuring Surface Flatness

When mapping the flatness of asample, what matters is the eleva-tion of each of the thousands, or mil-lions, of x/y locations that will con-tribute pixels to the acoustic image.When an ultrasonic pulse strikes amaterial interface, part of the ultra-sound is typically reflected as a col-lection of echoes, while the rest istransmitted across the interface.

The percent of ultrasoundreflected or transmitted depends onthe physical properties of the twomaterials at the interface. The inter-face between water and an ordinarymold compound used in a plastic-encapsulated IC reflects about 35 to40 percent of the ultrasound andtransmits the rest.

The degree of reflection givesthe echo its amplitude, or signalstrength. The echo also has polarity— positive if the interface was from a

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dominant wavelengths are mostlyoutside of our photopic vision. Thishas a small impact on mismatch, butstill leads to considerable measure-ment errors.

Considerable measurement er -rors of monochromatic diodes arepossible even when a good qualitymeasurement head is used, e.g.,when single RBG channels are meas-ured. It is not sufficient to only referto the mismatch characteristic toselect the measurement head tomeasure diodes with different wave-lengths. The actual spectral curvemust be taken into account and thecorrection of mismatch should bedefined on that basis.

Spectrometric Measurement

The color of LEDs and the spa-tial distribution of light intensitychange significantly, depending onthe viewing angle. Therefore, anintegrating sphere is recommendedto help determine average values forflux, colorimetric coordinates, colortemperature, and color renderingindex. CIE recommendations andNIST publications describe spectro-radiometric measurements in anintegrating sphere, on the basis ofwhich both photometric and colori-metric values are calculated.

There are a few important rea-sons why spectral measurement ofdiodes seems more precise than sim-ple photometer measurements. Aspectroradiometer measures the diodespectrum on the basis of the signalread for each wavelength, so, theoret-ically, there is no problem of spectralmismatch, as in the case of a singlephotodiode with optical correction.

With spectroradiometers, colori-metric quantities are measured con-currently with luminous flux. Color isdefined as the average for the spatialdistribution. A ruler consisting ofminiature photo elements (pixels) isthe light-sensitive element in thespectrometer. Diffused light with agiven wavelength falls on the photoelements, facilitated by proper loca-tion of the diffraction grating. Eachphotocell changes optical radiationinto current. In this way it is possibleto determine the amount of radiationenergy at each individual wavelength.

CIE 127:2007 describes a con-cept of spectral measurements,according to which a spectroradiome-ter can be used as a detector in anintegrating sphere and the totalluminous flux can be measured with-out spectral mismatch — if it isadapted to the measurements ofradiation energy generated by LEDs.

NIST Coating Recommendations

Due to the variables of spheregeometry, size and location of measur-ing aperture, location of detector, anddifferent non-homogenous shapes ofthe photometric body, measurementsare burdened with errors resultingfrom the spatial non-uniformity of theintegrating sphere. Depending wherethe luminous flux falls on the surfacesof the integrating sphere, readings inthe detector change.

The higher the reflection factor ofvarious coatings, the greater the num-ber of multiple reflections of the lumi-nous flux will appear within the inte-grating sphere. In the case of a coating

with a lower factor, the number ofreflections is significantly reduced.There fore, the flux falling on the partof the sphere that is not seen by thedetector is gradually smaller andsmaller and does not hit the measure-ment window.

With a higher reflection factor,the signal in the measurement win-dow increases and the dependence ofmeasurement accuracy on the shapeof the photometric body or place onwhich the luminous flux falls duringmeasurements in the sphere decreas-es. This is particularly important in

the case of narrow stream sources orluminaires.

Currently, paint mixtures madewith barium sulfate are available onthe market. Their spectral reflectionfactor is relatively high in the entirespectral range, including in therange of short blue and ultravioletwaves. This mixture can be used tomake a coating with total reflectionfactor higher than 97 percent.

LEDs require different meas-urement techniques for several rea-sons. LEDs have a different spectraldistribution than halogen lamps or

discharge lamps. LED lamps alsohave different structures and moredirectional light distribution. CIErecommendations and tests conduct-ed by NIST support that an integrat-ing sphere should be used togetherwith a spectrometer and the coatingof the sphere should be made of bari-um sulfate with total reflection factorabove 90 percent. This allows accu-rate and repeatable simultaneouscapturing of photometric and colori-metric quantities of LEDs.

Contact: GL OpticLichtmesstechnik GmbH,Tobelwasenweg 24, 73235Weilheim/Teck, Germany % +49-7023-9504-0 E-mail: [email protected] Web: www.gloptic.com r


A new era in process control begins

Get the full power of3D inspection with SIGMA Line.

Zero defects. Perfect solder joints. No false calls. With the new SIGMA Line software module from Vi TECHNOLOGY, you get an automated optical inspection gatekeeper that guarantees the highest quality of every PCB. Based on extended functionality, SIGMA Line combines precision real-time analysis of inspection data from the award-winning programming-free PI series 3D SPI and the high-precision 5K3D AOI with its complete defect coverage. In short, one fully integrated solution for automated optical inspection to improve your SMT process and productivity.

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In all likelihood, your wave soldering machine is not responsible for your wave solder quality issues or the messy work area

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Most problems stem from not ge ng enough flux where you need it and ge ng too much flux where it causes problems. Un l now, it was not possible to accurately control how flux was applied to each joint. Previously, the only op on was to increase flux over the en re board, and this causes a new set of adverse consequences. Process engineers were forced to magnify one problem to solve the other and create a mess in the process.

InterFlux ICSF-Select is an Intelligent Fluxer. It gives process engineers the freedom to independently tailor the volume, pressure, and loca on of flux je ed at each joint. They can add more flux for increased ac vity or more pressure for deeper penetra on. The flux is only applied where needed and does not migrate where it is unwanted. Improved quality and less mess – problems solved!

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Resolve bridging Increase top-side fill Increase flux ac vityUse flux with up to 40% solidsEliminate top-side raining Stop wicking Prevent flux from migra ng beyond the boardReduce flux residue dras callyDecrease flux consump on by 65-95%

The progress toward smart fac-tories, intelligent, adaptiveproduction lines, and automat-

ed supply chains is picking up steam.Whether we call it IoM (Internet ofManufacturing), IoT (Internet ofThings), IIoT (Industrial Internet ofThings), or Industry 4.0 — the con-cept is, at its core, all about commu-nication.

Swissbit, a manufacturer ofindustrial flash memory solutions,has found a way to manage IoT com-munications risks: secure storagemodules as a solution for the chal-lenges of networked electronics.

Networked machines andautonomous communication between“things” comes with risks. How doesa “thing” know that another “thing”is entitled to send or to receive data?How does a “thing” ensure that othersystem components are what theysay they are? There is a clear dangerof giving hackers control ofautonomous cars, which can beaccomplished through little morethan some clever code and smart-phone. We certainly do not wantanother Stuxnet event or large-scalecorporate data breach.

Secure Communications

So, while we embrace the com-munication of things, we have to

make sure that it complies with ITsecurity standards beyond pass-words. Secure communication re -quires identification, authenticationand authorization to rule out abuse.Thus, systems communicating witheach other through a network mustprovide an identity that cannot becloned and should have the ability tosend and receive encrypted data.This requires a secure element inte-grated into each connected compo-nent.

Secure memory card technologycan be integrated easily intomachines. Vendors can use a securestorage card in each machine thatcontains not only a flash memorychip, but also a secure element, suchas a TPM. If machines on the shopfloor have USB interfaces, USBsticks with integrated smart cardscould be used to secure them. Still,each manufacturing company has todevelop and implement its own IoMsecurity concept. Machines could be“IoM security ready” and even retro-fitted fairly soon — all at low cost andbased on well-known technology.

Contact: Swissbit NA, Inc., 18Willett Avenue, Suite 202, PortChester, NY 10573 % 914-935-1400fax: 914-935-9865 E-mail: [email protected] Web: www.swissbit.com r

By Hubertus Grobbel, Security Products Manager, Swissbit AG

Swissbit Enables “IoM Security Ready”

Manufacturing


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material of lower acoustic velocity toa material of higher acoustic velocity,and negative if the reverse. Thearrival time tells the distance of eachx/y coordinate from the transducer,and thus its altitude on the sample.Sonoscan calls this method AcousticSurface Flatness™ (ASF).

Figure 2 is the ASF image of anunpopulated FR-4 PCB measuring7.5 x 3.5 in.(19 x 8.8 cm). It wasimaged by a C-SAM system using a100 MHz transducer and a focallength of 0.5 in. (1.3 cm) The colormap at the left border shows therange of elevations. If the board wereperfectly flat, or even acceptably flat,the entire board might display only asingle color. But that is not the casehere. The lowest surface regions aredark red, along the upper left edge.

The most elevated surfaceregions are near the bottom-centerand are pink. The maximum differ-ence in elevation between two sur-face points in these regions is 0.06 in.(1.5 mm). Holes where the surface isabsent are black. The white rectan-gular feature at the lower left of theimage is a hole in the board. It iswhite because it is so far from theother values on the color map.

Each ultrasonic pulse struck asingle x/y coordinate and reportedthe distance to the coordinate. Thisdistance was converted into color.But the echo also reported the ampli-tude of each signal. Surface featureslarge and small differ slightly in dis-tance and/or amplitude from the sur-rounding area. These small differ-ences make many surface featuresvisible. In some regions, however,the resulting contrast is very slightand few details are visible. There arefew details in the green region, forexample.

Causes of Warpage

Warped PCBs fall into two cate-gories. Many are warped over theirentire surfaces. Some, however, havestrictly local warpage, typicallycaused by a defect within the body ofthe board, such as a bubble betweenlayers.

Surface flatness is also meas-ured in many plastic-packaged com-ponents. Although any componentpackage can be warped, warping isespecially critical in thin, large-areacomponents, such as BGAs. Warpagemay simply be the result of forcesencountered during production of thecomponent, creating packages thatare dished (the edges are the highestpoints) or domed (the center is thehighest point). Warpage will likely bemore complex and less symmetricalif an internal gap, such as a void, ispresent.

Package-on-package (PoP) as -sem blies can also display surface dis-tortions caused by warpage. De -viations from flatness are often seenin packages where a memory chiprests on top of a processing chip.

Like individual components,wafers also have flatness issues, butthe nature of the risk is not the same.A significantly non-flat component isunlikely to be used in populating aboard, but a significantly warpedwafer may contain nothing but flaw-less components.

But, the wafer still needs to bescanned acoustically to image andevaluate the features within eachdevice. The acoustic micro imaging

tool’s transducer expects a wafer tobe flat. If it is not, regions above andbelow the expected focal plane will

not be imaged.Sonoscan solved this problem

by incorporating distance-measuring

technology to automatically adjustthe transducer during the scanningof wafer.

The resulting image of a warpedwafer will show, acoustically, a flatwafer, but all anomalies will havebeen found.

The tool can even take the tech-nology one step farther: if the devicesin the wafer are destined to be usedin a stack, it can measure thewarpage of individual devices todetermine their fitness for stacking.

Contact: Sonoscan, Inc., 2149 EPratt Boulevard, Elk Grove Village,IL 60007 % 847-437-6400 fax: 847-437-1550 E-mail: [email protected] Web: www.sonoscan.com r


Measuring Surface Flatness with Acoustic Micro Imaging Tools

Figure 2: Acoustic map showing elevation difference on a PCB.



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Bedford, NH — Powerbox haslaunched the second generation of itsseries of power supplies designed formarine applications. The company hasresponded to demand from marineequipment manufacturers to simplifylogistics and to reduce energy con-sumption. The new PT578 power sup-ply integrates programmed digitalprotection, built-in redundancy andparalleling circuitry.

The new supply has a typicalefficiency of 94 percent and operatesin temperatures of –13 to +158°F(–25 to +70°C). It includes an activePFC, three output protection modesthat are firmware-reconfigurable,and is designed for convection cool-ing. It is protected against humidityand corrosion by conformal coatingand can withstand high levels ofshock and vibration.

The technology developed forthe PT578 is suitable for immersedcomputing systems that require thepower unit to operate safely withinneutral fluid containers. It is part ofthe company’s PRBX custom powerlibrary.

To simplify installation, thePT578 has built-in circuitry thatmakes it possible for the user toselect “single mode” or “parallelmode with droop current sharing.”This reduces the number of productsto keep in inventory as well the spaceused in the power rack.

The PT578 operates with wideAC input voltages of 90 to 265 VACand with a DC bus voltage of 125 to375 VDC. The input AC frequency is

47 to 63 Hz, and for naval airborne,440 Hz with reduced PFC. Covering alarge range of marine applications,from sea to air, the PT578 is specifiedto operate up to 10,000 ft (3 km) andup to 30,000 ft (9.1 km) non-operating.

Two versions with adjustable

output voltages are available as stan-dard, 24 VDC (23 to 29 VDC) and 48VDC (47 to 56 VDC). They provideoutput power of 500W with peakpower up to 750W.

The power supply complies withvibration regulations specified byDNV-GL Table 7 High VibrationStrain, class B. Protected by a confor-mal coating, the PT578 works in ahumid environment of up to 100 per-cent. The supply has an isolation of3,000 VAC input to output and 2,000VAC input to chassis.

Contact: Powerbox USA, Inc., 15Constitution Drive, Suite 1A,Bedford, NH 03110 % 603-310-5200fax: 603-310-5001 E-mail: [email protected] Web: www.prbx.com

PT578 500W marine power supply.

Powerbox: Marine PowerSupplies for Immersed

Computers

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Viscom’s new automatic 3D inspection system, the X7056-II, is based on

cutting edge X-ray technology that combines extremely rapid handling

(under 4 seconds) with unsurpassed inspection coverage, so even con-

cealed components or solder joints and material defects can be identified.

This prize-winning system has the option of combining optical and X-ray

inspection for maximum throughput in an in-line installation, providing

electronic manufacturing with unmatched flexibility and efficiency.

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Particulates, oils and inorganic contamination buildup on nearly every medical device during manufac-turing. It can be challenging to identify a cleaning

process that is suitable for the complex assemblies, intri-cate shapes and delicate parts.

In the past, vapor degreasing was the cleaningmethod of choice for medical device components, becausesolvent-based cleaners were easy to use and very effec-tive. This changed about 20 years ago when environmen-tal concerns about solvents were raised. As there werefew alternative solvents, device manufacturers wereforced to switch to water-based cleaning systems.

Recently this has been turned on its head. Today,there are many new solvent options available that areeffective, safe, environmentally-friendly, and afford-able. Medical device manufacturers are realizing againthat vapor degreasing is the most effective method forcritical cleaning.

One such product is a cleaning chemistry fromMicroCare Corp. The new halogen-free Tergo™ chlorine-free cleaning fluid is being recognized for its outstandingenvironmental credentials and cleaning excellence.

MicroCare is changing perceptions of the use ofvapor degreasing and helping to make it the cleaning

method of choice in the medical device industry.Advances in solvent technology are leading to environ-mentally-acceptable cleaning options that also greatlyminimize bioburden — the number of bacteria living ona surface that has not been sterilized. In fact, manymanufacturers and engineers are discovering that aproperly designed and maintained vapor degreaser canbe more environmentally friendly than a water-basedcleaning system, and the most effective cleaningprocess and lower-cost option.

Tergo chlorine-free cleaning fluid has been engi-neered for use in standard vapor degreasers and incor-porates a non-flammable, fast-drying chemistry thatdelivers excellent cleaning of all types of solder fluxes,oils, waxes, and other stubborn contamination, clean-ing the complex shapes regularly found within medicalcomponents.

Minimizing Bioburden Risk

Bioburden can be a huge issue during the cleaningprocess, especially if the cleaning method uses aqueoustechnologies. Using aqueous cleaning systems not onlyraises a bioburden risk, but it also generates a waste-


Vapor Degreasing — ChangingPerspectives in Medical Device Cleaning

MicroCare chemist VenesiaHurtubise conducts a test of a clean-

ing protocol in a vapor degreaser.

By Mike Jones, Vice President, MicroCare


http://www.TheBranfordGroup.com

Carson, CA — EPSON Robots is now offering a range ofinnovative, high-precision robotics solutions designedfor maximum efficiency and productivity in a widevariety of factory automation applications.

The new T3 all-in-one SCARA robot comes with abuilt-in controller, a feature that reduces spacerequirements and simplifies set up at low cost. It offersan easy-to-install and fast integration solution, excel-lent for simple applications. It is useful for customerslooking to automate their factory without wasting timeor money on complex, slide-based systems.

The Flexion N2 six-axis space-saving robot has acompact folding arm design, which reduces requiredworkspace up to 40 percent, when compared with stan-dard six-axis robots similar in size and payload capabili-ty. It meets the increasingly high demands for efficientmovement and precise placement and offers tight-spacemotion capability for applications inadvanced manufacturing.

The G6 SCARA robot deliversfast cycle times and is designed for

applications that require high speed and high preci-sion. It has a high-rigidity arm design, which helpsto reduce vibration and deliver fast speeds and highprecision with no overshoot or ringing. The smallerfootprint translates to less factory space require-ments and lower overall costs.

The C8 six-axis robot provides high perform-ance in a slimline design. Compact, yet powerful,with high repeatability and fast cycle times, C8robots are useful for demanding applications thatrequire six-axis dexterity.

Contact: EPSON Robots, 1650 E GlennCurtiss Street, Carson, CA 90746 % 562-290-5910 fax: 562-290-5999 E-mail: [email protected] Web: www.robots.epson.com



IT’S WHAT’S ON THE INSIDE THAT COUNTS®

E L E C T R O N I C S C O R P.

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PCB TEST POINTS AND JUMPERS

Color Keyed THM Test Points SMT Test Points THM Test Points

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EPSON T3 all-in-one SCARA robot.

EPSON Demos Factory Automation Robotics

Aspen IntrosCompactRefrigeratedLiquid ChillerMarlborough, MA — Compact size,minimal weight and industrial-classreliability are essential componentsfor many cooling applications. AspenSystems has introduced its LCS-600, anew turnkey liquid chiller system. TheLCS-600 is a result of the company’scumulative years of expertise in sup-plying OEM refrigeration solutions tothe military, medical, laser, and elec-tronics industrial markets and it issuitable for many applications.

The Aspen Q-series compressoris very small and its brushless DCmotor permits variable speed to matchthe cooling load, regardless of whetherit is steady-state or dynamicallychanging. Power consumption is excel-lent and it has been used in a numberof battery-powered applications. Eachsystem is hermetically-sealed, chargedand tested, prior to shipment.

The system offers 600W of cool-ing, four to six times the efficiency ofthermoelectrics, an ultra-compactsize, is lightweight, and its compres-sor is rated for more than 90,000hours MTBF.

Typical applications include:laser cooling, electronics cooling, per-sonal cooling, medical devices, thermalregulation, environmental control, labequipment, centrifuge processing,blood treatment, and patient cooling.

Contact: Aspen Systems, 24Saint Martin Drive, Marlborough,MA 01752 % 508-281-5322 E-mail: [email protected] Web: www.aspensystems.com


LCS-600 refrigerated liquid chiller.


http://www.keyelco.com

Monrovia, CA — Amada Miyachi America offers afull range of resistance welding, laser welding,marking, cutting, and micro-machining equip-ment. These systems include the UB29 linear DCwelder, Series 320 electronic resistance spot weld-ing head, and the LMWS workstation, which canbe paired with either the LMF70-HP pulsed fiberlaser for welding or the LMF20 for marking andengraving.

The UB29 linear DC welder offers precisioncontrol for micro-miniature resistance welding.The welder is an excellent choice for wire assem-blies, sensors, connectors, squibs, catheters, ortho-dontic appliances, pacemakers, and implantablehearing devices.

The Series 320 electronic resistance spotwelding head is a high-precision, low-force headdesigned for applications that require tight posi-

tion and force control. This versatile series hasnumerous features to meet the process demands of

microelectronics manufacturing, yet is robustenough to endure industrial environments.

The company’s ADAM process control systemmonitors what happens during the weld, as well aswhat happens before the weld is triggered, offeringa 360° view of the process. Sophisticated SPCcapabilities enable customers to analyze and col-lect data. Other key features include current, volt-age, power, resistance, force, and gas flow monitor-ing, high-resolution sensors, pre- and post-triggerviewing, envelope limits, and Ethernet communi-cations.

The LMWS paired with the LMF70-HP 70Wpulsed fiber laser offers an advanced processingsystem for marking, welding and cutting thin met-als up to 9.8 mil (250 µm). It is also useful for weld-ing dissimilar metals, including copper to alu-minum, aluminum to stainless steel, and copper to

stainless steel. The LMWS paired with the

LMF20-SM pulsed fiber laser offers a20W precision engraving system formarking metal and plastic parts.These units are capable of UDI-com-pliant marks. Amada MiyachiAmerica serves a wide range of mar-kets, including medical devices, bat-teries, aerospace, automotive, andelectronic components.

Contact: Amada MiyachiAmerica, Inc., 1820 South MyrtleAvenue, Monrovia, CA % 626-930-8560 E-mail: [email protected]: www.amadamiyachi.com



Amada Miyachi: Laser and Resistance Welding Systems

UB29A linear DC welding system.

Billerica, MA — Teledyne DALSAhas launched its GV 4000 vision sys-tem. This new multi-camera systemoffers more memory resources,power-enabled camera ports and asmall step-up in performance overthe GV 3000. The camera is aimed atapplications using multiple large-for-mat Genie Nano cameras. The 4000model is also smaller and runs coolerthan its predecessor.

With over eight times the pro-cessing performance of the entry-level GV 300 and more than fourtimes the performance of the GV1000, the ruggedized GV 4000 pro-vides a robust, affordable, and high-ly-capable solution for applicationson the factory floor, including finalinspection of large assemblies.

The GV 4000 is equipped with alow power, Gen6 Core i7 processor,16 GB of RAM, rendering it a high-speed system with ample resourcesto manage multi-camera applica-tions. Each of the four Gigabit-com-pliant Ethernet camera ports con-nects internally through independ-ent data lanes to alleviate bandwidthbottlenecks. Each port is expandableby using external switches to accom-modate larger camera configura-tions. The camera ports are compati-ble with a range of monochrome orcolor area or line scan GigE cameras.

Contact: Teledyne DALSA, Inc.,605 McMurray Road, Waterloo,Ontario, Canada N2V 2E9 % 519-886-6000 fax: 519-886-8023 Web: www.teledynedalsa.com

TeledyneDALSALaunchesNext-GenVision System

HTTP://WWW.MENTOR.COM/NPI

Tyngsborough, MA — Transition Automationhas introduced its precision Permalex® Edgemetal squeegee assembly designed to improvethe printing performance of single-squeegeeYamaha printers. The new squeegee assemblydesign eliminates fasteners altogether, consti-tuting a major improvement over first genera-tion Permalex assemblies for Yamaha.

The first-generation assemblies included arow of custom fasteners that would hold thesqueegee and clamp bar to the main structureof the squeegee assembly. The new designincludes a proprietary adhesive and uniquelyformed mating surfaces that maximize bondand surface area between the bladeand holder, eliminating the need forfasteners.

The result is a flush, flat, and featurelesssurface for the solder paste to roll and printalong the stencil.

The assembly is also easy to clean andmaintain during production pauses. The newassemblies are assigned part number PLX-YAM-DBL-C-XX-PR, and are available 10 daysA.R.O. These assemblies may be purchased inlengths from 8.6 to 19.7 in. (21.9 to 50 cm).

Contact: Transition Automation, 5 TraderCircle, Building D, Tyngsborough, MA % 978-649-2400 fax: 978-649-2491 E-mail: [email protected] Web: www.transitionautomation.com


Double-Edged Squeegee Assembly fromTransition Automation

Cary, NC — Building on the successof its YuMi® series of collaborative,dual-arm industrial robots, ABB hasunveiled a single-arm version. Thenew robot contains many of the samecapabilities, but has a much smallerfootprint.

Collaborative robots, also calledcobots, are designed to work along-side humans on the factory floor,

raising overall productivity and sup-porting companies in performingmass customization.

Like YuMi, the small-partsassembly robot introduced in 2015,the new robot has a payload of 1.1 lb(0.5 kg). Due to its compact size, itcan be integrated easily into existingassembly lines. The new robot canalso be programmed easily, eliminat-ing the need for specialized trainingfor operators. As companies begin toimplement smart factory technolo-gies, the new robot, combined withABB’s Ability™ digital solutions, willprovide new levels of efficiency andreliability.

Contact: ABB, 12040 RegencyParkway, Cary, NC 27518 % 919-856-2360 fax: 919-807-5022 Web: www.abb.com


Single-arm YuMi collaborative robot.

ABB Unveils

Latest YuMi

Collaborative

Robot

Double-edged squeegee assembly.

http://www.optical-control.com


The material matters in material handling

Plymouth, MA — Tech-Etch Slim -Shield is a low-profile, two-piece,board-level shielding line with shieldheights as low as 0.06 in. (1.5 mm).Shields have a dimpled cover that

snaps into etched holes on the fence.The photo-etching process providescomplete design freedom and fastdelivery. Standard dimple toolingoffers variable dimple location withexcellent cover retention at low cost.

There is no tooling cost for stan-dard two-piece designs, as well as noadditional cost for holes and slots forheat dissipation, logos and part num-bers. An optional flange for addedrigidity is available on larger fencedesigns. Multi-cavity designs areachieved by incorporating internalfences that enable multiple compo-nents to be shielded with the samepart. Mounting pins are offered in

any configuration. A configurablePDF sales drawing for low-profile,board-level shields can be down-loaded from the company’s website.

Tech-Etch also offers economi-

cal, standard one-piece designs withdepth-etched bend lines for easyhand forming, as well as standardtwo-piece designs that utilize aspring-finger attachment betweenfence and cover. Custom designsoffer nearly unlimited possibilitiesfor materials and shapes. The com-pany’s product engineers can helpdevelop the best design for any spe-cific application.

Contact: Tech-Etch, Inc., 45Aldrin Road, Plymouth, MA 02360% 508-747-0300 E-mail: [email protected] Web: www.tech-etch.com


Tech-Etch Offers Low-ProfileBoard Shielding

Low-profile PCB shields.

TT Electronics IntroducesHeat Sink for Power

ResistorsPerry, OH — TT Electronics hasintroduced its WMHP-HS heat sink,specifically designed to optimize thethermal performance of its WMHPseries power resistors. Providing acombination of high surface area,excellent cooling performance, com-pact dimensions, and lightweight, the PCB mountingheat sink is a good choice forpower supplies, power ampli-fiers, motor drives, andinrush current control appli-cations that require resistorsoperating in the 20 to 100Wrange.

The WMHP-HS heatsink is aimed at designersusing TO-220 or TO-247power resistors in compactpower electronic assembliesin the industrial and medicalmarkets. Factors drivingdemand are the growth in dis-tributed power managementand motion control in industrial andautomated systems, as well as thepressure to reduce size and weight,while increasing cooling effectivenessand product reliability.

Extruded from 6063-T5 alu-minum, the WMHP-HS heat sink’scompact footprint of 1.7 x 1 in. (42 x25 mm) minimizes the use of valu-able PCB area, and its low thermalresistance keeps assemblies cool.Reducing overall product weight andassembly time, the heat sink usestwo solderable tinned brass pins

instead of fixings to secure it. It hasa black anodized finish, and has anoptimized profile with ridged fins forhigh surface area and low mass.

A TO-220 package resistor maybe fitted to either side of the heatsink as the thermal performance is

the same for both mounting surfaces.Two packages may be fitted, one oneach side, provided that the totalpower dissipated does not exceed therating of either. A TO-247 packagecan be fitted to the wider of the twomounting surfaces.

Contact: TT Electronics, 3700Lane Road, Perry, OH 44081 % 440-352-8961 E-mail: [email protected] Web: www.ttelectronics.com


WMHP-HS series heat sink and power resistors.


http://www.mfgtray.com

http://www.plasmaetch.com

water stream that requires expensive treatment.Higher temperatures are also required for effectivecleaning, which means more energy is used.

There are many conditions that can cause biobur-den, but water is a primary growth medium for bacte-ria. Even trace amounts of moisture in hard-to-reachlocations can encourage the growth of bacteria, compro-mising the ability to properly sterilize a device.Therefore, it is important to completely remove waterfrom the cleaning process to minimize this threat. If notproperly addressed, this can result in increased compli-cations during the product validation.

A solvent-based cleaning process is a nonpyro-genic environment. This feature alone significantlyreduces the risk of bioburden. Solvents dry quicklyand completely, leaving no residues on parts afterthey exit the vapor degreaser, and they do notrequire additional mechanical action or increasedtemperatures to be effective.

The low viscosity and surface ten-sion of solvents, combined with theirvolatility, allow them to clean very effec-tively, even in small gaps and areas thatwater in aqueous systems cannot easilypenetrate. Medical device manufactur-ers can be sure that all surfaces of thefinished product will be effectivelycleaned and safe for the patient.

As medical devices are evolvinginto more compact and complex compo-nents, cleaning becomes more andmore difficult. Perfecting and validat-ing a cleaning method that workseffectively on the intricate parts ofmedical components is vital to ensur-ing patient safety. Vapor degreasingoffers a simple, proven and reliableanswer to cleaning processes withinthe medical manufacturing industry.

Simplicity of Vapor Degreasing

A vapor degreaser is a relativelysimple machine, typically consisting oftwo chambers filled with a nonflamma-ble solvent. The “boil sump” heats thesolvent to around 104°F (40°C) whichgenerates a vapor cloud that risesupward in the machine. As the vaporsrise, they contact cooling coils whichare arrayed around the inner walls ofthe machine. The cooling coils con-dense the vapors into a liquid state.

This distilled solvent then is direct-ed back to the “rinse sump” where theparts are rinsed as the final step in thecleaning process. When filled with sol-vent, the rinse sump overflows back intothe boil sump, completing the recyclingloop. This closed-loop system has fewmoving parts and ensures that the sol-vent is ready for the next cleaning.

Cleaning is fast and easy with avapor degreaser. A basket containingthe contaminated components is low-ered through the vapors and into theboil sump for their first cleaning. Theparts are then moved into the rinsesump, which always contains pure,clean solvent that has been distilledfrom the solvent vapors. Ultrasonics inthe rinse sump can further ensureresidue-free parts. This process is easilyprogrammable and allows for excellentprocess control and repeatability. Com -ponents come out clean, dry, at roomtemperature, and immediately ready forpackaging or further processing.

A “Greener” Cleaner

Today’s solvents are muchimproved over the products used 20years ago. New products must meetstrict environmental standards andregulations. Those containing environ-mentally-unfriendly chemicals, includ-ing HCFC-225, nPB and TCE arebeing phased out and cleaning meth-ods are being changed to newer, betterand safer alternatives.

MicroCare’s Tergo chlorine-freecleaning fluid is an excellent replace-ment for high Kb-value solvents such as

perchloroethylene, trichloroethylene, methylene chlo-ride, or nPB, all of which are under regulatory pres-sure. It has a low global warming impact, is complete-ly ozone-safe and does not include any smog-producingvolatile organics (VOCs). The product is formulated

and packaged to be acceptable in almost every countryaround the world, making it a sound choice to replaceboth harmful solvents or aqueous cleaning methods.

The benefits of using a vapor degreaser areclear. It delivers high levels of cleanliness to ensurepatient safety and product performance. It also is asafe, environmentally-friendly and affordableprocess. The systems are small, use little electricityand never use any water. A well-engineered solventcleaning system is easy to validate and will simplifydevice sterilization by removing sources of bioburdenfrom the finished products.

Contact: MicroCare Corp., 595 John DowneyDrive, New Britain, CT 06051 % 860-827-0626 E-mail: [email protected] Web: www.microcare.com r

See at ATX/MD&M West, Booths 525 and 2342


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Key Specifications:•Capable of fine-pitch inspection at 0.2 mm•Four-terminal resistance measurement betweenIC leads and pad to detect insufficient solder•Soft landing feature to prevent board damage•Supplementary AOI functions including componentpresence polarity and displacement•Test resistors, capacitors, diodes, zener diodes, coils, transistors, digital transistors and photocouplers•Optional CAD conversions•User-friendly Windows operation

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Chateauguay, Quebec, Canada —

Visual Knowledge Share (VKS) is amodule-based solution devel-oped to help manufacturersimprove their operationsthrough im provements inquality and productivity.

VKS allows companies tocreate and share visual workinstructions, digital check-lists, and more, through aneasy-to-use interface. VKS isan integrated solution to cap-ture real-time data thatranges from productivitymetrics to work order details.

Whether a company ispurely looking to enhancetheir work instructions, or fora full factory-wide solution with fullintegration capabilities, VKS is anexcellent solution.

With customers around theglobe and an emphasis on sharingknowledge, VKS helps companies

eliminate tribal knowledge and buildthings right the first time.

Contact: Visual KnowledgeShare (VKS), Ltd., 1241 CascadesStreet, Chateauguay, Quebec,Canada J6J 4V2 % 1-866-376-6204E-mail: [email protected] Web: www.vksapp.com

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LEMO Redesigns S Series Connector Shell

Rohnert Park, CA — LEMO hasredesigned the outer shell of its pop-ular S series connectors. The new Sseries uses a half-moon insert config-uration and is fully-compati-ble with existing S series con-nectors. Both the straightplug and free receptacle nowuse the same collet as thecompany’s B series, offering aslightly different cable rangethan the previous S series.The new S series is availablein 0S, 1S and 2S sizes forcables ranging from 0.06 to0.4 in. (1.4 to 9.9 mm) andoffers multiple contacts from2 to 10, as well as unipole,coax, triax, and multi-concen-tric configurations.

The S series is designed for suchapplications as: broadcast, audio/video, communications (GPS, anten-nas, and transmitters), test andmeasurement (high-end probes), bat-tery chargers, high current and highpower, medical probes, and other

general-purpose applications. The SSeries is an excellent solution foranti-rotation and blind mating appli-cations.

Contact: LEMO USA, Inc., 635Park Court, Rohnert Park, CA94928 % 707-578-8811 fax: 707-206-3774 E-mail: [email protected] Web: www.lemo.com


Redesigned S series connectors.

Bedford, NH — The new A4 series ofcompact APC (automatic power con-trol) laser diodes from LaserComponents offers additional protec-tion for eye-safe radiation beamapplications. As soon as the operat-ing current exceeds a certain level,the APC shuts down the laser diode.The company’s A4 laser diodes areinsensitive to electrostatic dis-charges of up to 10 kV and guaranteea stable output power or supply volt-ages of 2.5 to 6 VDC.

Like the previous version, thecontrol is located at an ASIC (appli-cation-specific integrated circuit) onthe same chip as the photodiode andthe emitting laser diode. This is inte-grated in compact TO housings,either 0.13 or 0.22 in. (3.3 or 5.6 mm)

in size. These laser diodes are avail-able in wavelengths from 635 to 850nm, suiting them to use in high-pre-cision measuring devices.

Laser Components specializesin the development, manufacture,and sale of components and servicesfor the laser and optoelectronicsindustry. The company has produc-tion facilities in Germany, Canadaand the United States and more than220 employees worldwide.

Contact: Laser ComponentsUSA, Inc., 116 South River Road,Building C, Bedford, NH 03110 % 603-821-704 fax: 603-821-704 E-mail: [email protected]: www.lasercomponents.com


Laser Components ImprovesLaser Diode Safety

http://www.seikausa.com


Chandler, AZ — The MEC17xx and MEC14xx fami-lies of embedded controllers with enhanced serialperipheral interface (eSPI), the host interface sup-ported by the latest PC computing chip sets, arenow available from Microchip Technology. Bothfamilies support the eSPI bus technology that isrequired for new, upcoming computing applications.

The MEC17xx family is based on an ARM®

Cortex®-M4F core and has advanced hardware-accel-erated cryptography algorithms to efficiently supportthe secure boot of a computer. The family offers sev-eral additional features, such as two UARTS and anextended industrial operating temperature rangethat make it suitable for industrial computing.

Microchip’s popular MIPS-based MEC 14xxfamily has been expanded to include functionality tosupport the new eSPI slave attached flash (SAF) fea-ture, which allows the embedded controller to bedirectly connected to an SPI Flashmemory using an onboard master con-troller. These new embedded con-trollers are part of an expanded familyof devices that have been a force behindthe the computing industry’s transitionfrom LPC to eSPI. The MEC17xx addssecurity through cryptography func-tionality to advance secure boot, a secu-rity feature developed to ensure that asystem boots only from software that istrusted by the manufacturer. The addi-tion of two UARTS and support forindustrial temperature is necessary forindustrial computing applications.

The latest members of theMEC14xx family add a new level ofdesign functionality for computingengineers by adding SAF, which is anoptimal solution for USB Type-Cpower delivery. The latest MEC1428devices are pin and register compatible

with the MEC140x and MEC141x families, whichallows designers to easily add eSPI and additionalfeatures and add more flexibility to their designs.

Both families retain eSPI master attached flash(MAF) capability. All of the company’s computingembedded controllers are supported by a variety ofdevelopment and debug tools and evaluation boards,plus datasheets and other documentation.

The eSPI interface has numerous benefits, suchas enabling multiple input/output signals to be con-figured to support either 3.3 or 1.8V, which reducesthe system cost by eliminating the need for externalvoltage translators. These features allow for seam-less migration of IP across multiple x86 computingplatforms, including those based on Intel’s Atom™

processors, Intel’s iCore™ processors and AMD’sRyzen™ processors.

Contact: Microchip Technology, Inc., 2355West Chandler Boulevard, Chandler, AZ 85224E-mail: [email protected] % 480-792-4386 Web: www.microchip.comMEC17xx secure embedded controller.

Microchip Adds Two Embedded Controller Families

Germantown, WI — The new WAGOsmartCUTTER automates the cut-ting of marking material on the com-pany’s smartPRINTER. WAGO’sthermal transfer printer, a fast ter-minal block labeling system, is nowmade even faster by automatic cut-ting. The compact smartPRINTER(version 1.1) prints and cuts a widerange of marking materials for ter-minal blocks, cables or conductors,and devices.

WAGO offers its proprietaryCAGE CLAMP® spring pressure con-

nection technology and an extensiverange of interconnect, interface andautomation solutions, such as thefieldbus-independent WAGO-I/O-SYSTEM.

Contact: WAGO Corp., N120W19129 Freistadt Road,Germantown, WI 53022 % 800-346-7245 fax: 262-255-3232 E-mail: [email protected] Web: www.wago.us

WAGO automatic marking material cutter.

WAGO AddsAutomatedCutting toLabel Printer

http://www.optelco.com

Charlotte, NC — Curtiss-Wright’s Industrial divi-sion has launched its NRH305DR, a non-contactrotary position sensor. The new device expands thecompany’s portfolio of position sensors and offersan optimal combination of performance, safety andcost for manufacturers who design vehicles andcontrol systems.

The new sensor shares many of the same fea-tures and benefits as the NRH300DP, which waslaunched in 2016, and is a part of the Penny &Giles brand family. It is designed to enhance sys-tem performance by incorporating two completelyindependent power supplies and output channelsfor full electrical redundancy, operating from a 5VDC regulated supply.

With a 0.3 in. (8 mm) low-profile sensor bodyand small footprint, this fully encapsulated,IP68/IP69K-rated sensor offers exceptional levelsof performance against water, dust, shock, vibra-

tion, and temperature. The separate magnetassembly that activates the sensor can have a per-missible air gap between 0.06 and 0.3 in. (1.5 and

8 mm) (depending on magnet style) and can accom-modate up to ±0.08 in. (±2 mm) radial offset to easesetup and installation.

Versatile, factory-programmable electronicscan be set to one of two analog voltage outputranges or one of three PWM frequencies. The polar-ities of each of the analog outputs can be independ-ently set, with onboard diagnostic functions ensur-ing the outputs are put into safe, pre-defined states,should an internal sensor error be detected.

Features include: non-contact design and sens-ing technology for wear-free operation; can be facto-ry set to correspond to rotations of 20 to 360° in 1°increments; industry-standard 1.5 in. (3.8 cm)mounting centers; analog output from 0.5 to 4.5V or0.2 to 4.8V; and transmissive measurements can bemade through non-magnetic materials.

Contact: Curtiss-Wright Corp., 13925Ballantyne Corporate Place, Suite 400, Charlotte,

NC 28277 % 704-869-4600 E-mail: [email protected] Web: www.curtiswright.com

See at ATX/MD&M West,Booth 741


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Curtiss-Wright Expands Rotary Sensor Family

NRH305DR rotary position sensors.

Malvern, PA — Applied EnergySystems (AES) is now offering itsVERSA-GAS™ vSource™ rack-mount system for the delivery of non-hazardous process or purge gases.Industrial or speciality gas applica-tions require source systems to sup-port their high-purity processes andpurge routines. AES’ rack-mountedsystems are a mobile alternative towall-mounted source equipment.This mobility is particularly valuablein environments where facility spaceis limited, or where it is often recon-figured, such as laboratories.

The modular design of AES’vSource rack-mount systems furtheradds to their versatility. The systemsare available in manual, semi-auto-mated or fully automated configura-tions to support high- or low-pres-sure applications.

Features include: an 11 gaugesteel mounting rack; high-purity 316LSS components orbitally welded in aClass 100 cleanroom; tied-diaphragmpressure regulators; a SEMI S2-certi-fied design and helium leak testingsystem validation to 1.0 x 10–9 atm-cm3/s; and front-mounted componentsto make maintenance easy.

Contact: Applied EnergySystems, Inc., 180 Quaker Lane,Malvern, PA 19355 % 610-647-8744fax: 610-640-4548 E-mail: [email protected] Web: www.appliedenergysystems.com

VERSA-GAS vSource gas delivery system.

AES OffersModularRack-MountGas DeliverySystem

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© Copyright 2017 Panasonic Corporation of North America. All rights reserved. Changes may be made without notice to specifications and appearance for product improvement.

New NPM-W2Sfor manufacturers who value reduced setupand changeover time over volume…

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New Albany, IN — Harwin has intro-duced a new female contact for itsDatamate connectors, significantlyincreasing the amount of power thatcan be transferred. Using a propri-etary, six-finger design made from a

single piece of beryllium copper, theT-Contact raises the current capacityon compact 0.08 in. (2 mm) pitchinterconnection systems. Up to 8.5Aper contact can be supported. It fur-ther improves the size, weight andpower (SWaP) requirements of thecompany’s Datamate products andaddresses the growing need for engi-

neers to ramp up power in space-con-strained designs.

The patented design offers morecontact points, enhancing itsresilience to shock (100G) and vibra-tional forces (40G for six hours — two

hours on each axis). The crimp bar-rels accept 22 AWG wire and complywith IPC-A-620 cable harnessingspecifications. The contacts are alsogold-plated to ensure reliable per-formance. The connectors withstandup to 1,000 mating cycles and oper-ate in a temperature range of –67 to+257°F (–55 to +125°C).

The T-Contact exhibits 60 per-cent greater contact wipe when com-pared with existing Datamate con-tacts. This improves the self-cleaningaction and reduces the possibility ofsurface contamination. To accompa-ny these contacts, the company offersa variety of dual-row housings withdifferent jackscrews, which are avail-able direct from stock in a broad

range of sizes, with 4 to 50 positionoptions.

Contact: Harwin, Inc., 3602Northgate Court, Suite 33, NewAlbany, IN 47150 % 603-893-5376E-mail: [email protected] Web: www.harwin.com


Harwin Intros Female Contact forDatamate Connectors

Female Datamate contact for 0.08 in. (2 mm) pitch connectors.

Grayhill Offers Long-LifeOptical Encoders

La Grange, IL — Grayhill is now of -fer ing its Series 62AG, 62NG and62SG optical encoders. These includeoptical switching technology to pro-vide exceptionally long operationallife and tactile feedback to the user.

Grayhill encoders are designedfor durability, including side load,impact load and pull-out strength.They also offer reduced shaft wobble,switch haptics, such as torque consis-tency, and seal integrity.

Output options include absoluteor quadrature two-bit binary code.Custom shaft and threaded bushingsizes are available, as well as othercustomizable features includingdetents and their tactile feel.

Grayhill offers a range of prod-ucts, including optical and Hall effectencoders, discrete and Hall effect joy-sticks, rotary switches, keypads, andpushbuttons. The company createsergonomic panels and product shells

that integrate various interface tech-nologies, including displays, propri-

etary components and gesture-recog-nizing multitouch technology.

Contact: Grayhill, Inc., 561Hillgrove Avenue, La Grange, IL60525 % 708-354-1040 fax: 708-354-2820 E-mail: [email protected] Web: www.grayhill.com

Series 62 optical encoder.

http://www.shenmao.com


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This past year we saw the chal-lenges of the connected factory,breakthroughs in modular and

compact production equipment, andthe issues surrounding the genera-tion of manufacturing data and howit can be leveraged brought to thefore. These trends are quickly mov-ing from concept to realization, with

the barrier to smart factory entrydropping significantly. These tech-nologies promise to fundamentallychange the way products are madeand the way supply chains are man-aged. As these topics are likely toonly grow in importance in 2018, weasked several industry experts to

offer an opinion on what they see asthe biggest agents of change in 2018. Bjorn Dahle. “2018 is going to be anexciting year for everyone involved insmart factory and Industry 4.0 initia-tives. This is where the rubber reallyhits the road, where the talk is doneand people get to work on real proj-ects that deliver measurable ROIand performance improvements.That’s why we introduced ourIndustry 4.0 starter kit, which allowspeople to kick off their journey with alow-cost, low-risk project that showsthem how a smart factory projectcould work.

The industry has come to real-ize that no single company can pro-vide an out-of-the-box solution thatdelivers everything for Industry 4.0implementation. Those with sys-tems-wide knowledge and those withdeep domain expertise play their ownroles in delivering and managing thedata that is specific to particularparts of the manufacturing process.

In our case, that domain expert-ise is in the thermal process, othersmight be experts in inspection orplacement. By working together, wecan provide best-in-class solutionsfor a specific process and deliver datain an open, shared format that candrive value to other processes on theline and overall production planning

and management solutions.The progress made this year in

the realm of standards has been agreat example of companies leaving

personal interests and competitiveissues at the door and collaboratingfor the good of the entire industry.”Erich Hoch. “Disruption andchange are our norms and they accel-erate every year. I’m expecting moreof the same in 2018, with someenabling technologies reaching a tip-ping point of adoption and applica-

tion. Digital natives are breaking thecode for the most efficient end-to-endengagement with customers and con-sumers, with the digital thread flow-ing through the value chain fromideation through product develop-ment and manufacturing, on to finalfulfillment.

Technologies such as AR (aug-mented reality) and VR (virtual real-ity) will make maintenance, trainingand global product launches seam-less. The meaning of globalization ischanging as mass customization orpersonalization at scale becomes areality, powered by additive manu-facturing. This is likely to change theway products are made and fulfilledand could radically change the num-ber of manufacturing locations fromhundreds to thousands, with 3Dprinters deployed closer to the finalconsumer. Expect a major shift in theway manufacturing is distributed.

Terms like AI (artificial intelli-gence) and digital twin are findingtheir way into our daily vocabulary,all connected by that same digitalthread that delivers better productsto market, faster and more efficient-ly than ever. Smart factories areimproving the way we manufactureand smart supply chains are improv-ing the way we deliver. Further,

Agents of Change: What Will Disrupt

the SMT Industry in 2018?

Bjorn Dahle, CEO, KIC.


By Philip Stoten (@philipstoten)

Erich Hoch, CEO, Jabil Digital Solutions.

See at ATX / MD&M West, Booth 4161 See at ATX / MD&M West, Booth 4091

http://www.janome-ie.com

http://www.bofaamericas.com

intelligent tools like our ownInControl Supply Chain Orchestra -tion will continue to improve our per-formance and ability to support andenable our increasingly digital cus-tomers.

What excites me most is whatall of this can do for the end user.These technologies, combined withengineering rigor and the experienceto industrialize them, allows us toempower brands to change the worldfor the better through better medicalproducts, greater road safety,

smarter energy usage, and muchmore.”

Francois Monette. “I expect thatthe biggest agent for change will bethe increasing sense of urgency frommanufacturers to implement effec-tive industry 4.0 solutions. Leadingcompanies have already started thisjourney and the competitive pressureis building fast for others to catch up.

In 2018, it will no longer be pos-sible to sit on the sidelines, hopingand waiting that other companieswill solve all the issues. The smartfactory is a long-term journey and itshould start today. A practicalroadmap must consider the installedbase, which means that data collec-tion systems must be flexible, open,able to work with all existing andfuture standards and protocols, andbe backward-compatible.

Of course, the future is stillunclear, the only thing that is certainis that technology will continue tochange faster and faster. In this con-text, manufacturers must select sys-tems and platforms that are flexibleenough to handle today’s and tomor-row’s challenges. The time has cometo jump on the Industry 4.0 band-wagon or be left behind.”

Brent Fischthal. “The electronicsindustry is acutely aware of the chal-lenges faced by manufacturers, dueto a chronic shortage of U.S. workerswith the necessary skillsets to fillmanufacturing positions. Job hop-ping and employee misalignmentfurther compound the shortage witha high turnover.

While leading industry organi-zations like IPC and SMTA are tack-ling the issue with educational pro-grams and training initiatives, it isnot enough. Equipment suppliers,such as Koh Young, are working dili-gently to expedite the adoption andimplementation of communicationstandards between manufacturers.

The standards for machine tomachine (M2M) communication,guided in part by Industry 4.0, arequickly altering the manufacturingprocess by improving metrics, suchas first pass yield and throughput, byimplementing autonomous processadjustments.

Far beyond a simple linechangeover between two differentproducts, emerging communicationstandards allow companies to pro-vide closed-loop feedback to bothscreen printers and pick-and-placemachines. This two-way communica-tion with other equipment suppliersallows the machines to automaticallyadjust production parameters toincrease board quality, which lowers

costs by eliminating rework andscrap. While the lack of skilledresources remains a challenge,Industry 4.0 and its associated bene-fits will help to advance the entireindustry.”

Mattias Andersson. “Industry 4.0is all about collaboration: collabora-tion that is borderless, limitless andwith instant access to the correctinformation. I believe that this willfurther disrupt our industry.

Modularity will gain greaterimportance, not only in productdesign, but also allow us to clusterthe supply chains further, down toindividual processes — with exact


What Will Disrupt the SMT Industry in 2018?Continued from previous page

Francois Monette, VP sales andmarketing, Cogiscan.

Brent Fischthal, senior marketing manager —

Americas, Koh Young. Continued on next page

http://www.lenthor.com

Santa Rosa, CA — To meet the safetyrequirements of a range of applica-tions, SCHURTER submits its prod-ucts to accredited safety institutionsfor testing. These tests are conductedaccording to national and interna-tional standards, or other generally-recognized regulating bodies for tech-nology, as well as those establishedto protect the environment.

Their certification/approvalmarks confirm the manufacturer’sobservance of the requirements for

which electric appliances, and thematerials and methods used to pro-duce them, must fulfill.

It is also essential to ensureeasy access to up-to-date referencesand documentation when customersare selecting, procuring and usingproducts. For this reason, the compa-ny has changed its website to betterorganize this information and pro-vide greater detail. A link has beeninstalled in the HTML and PDF datasheets where the approval marks

were provided. The link takes theuser to an entirely new approvalsand compliances section. The sectioncan also be accessed through a newtab in the HTML data sheet, or aspart of the PDF data sheet, followingthe technical data.

The new and expandedapprovals and compliances sectioncontains approvals, product stan-dards, application standards, andcompliances for each product, withclear headings above each category.

Information regarding productapprovals and conformance is shownfirst, while the product and applica-tion standards follow as supplemen-

tary information to clarify the prod-uct’s intended use. Links to approvalcertifications and compliance descrip-tions are provided accordingly.

Contact: SCHURTER, Inc., 447Aviation Boulevard, Santa Rosa, CA95403 % 707-636-3000 E-mail: [email protected] Web: www.schurterinc.com



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traceability of all events.In 2018, truly open ecosystems

will start to surface. We will see con-stellations of major players coexistingwith more agile startups that canjointly create completely new businessmodels and value propositions, shift-ing the foundation of the industry.” r

Mattias Andersson, founder andCEO, MTEK Consulting.


What WillDisrupt theSMT Industryin 2018?

SCHURTER Expands ComplianceInformation on Data Sheets

Updated approvals and compliances information on

SCHURTER data sheets.


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New Hyde Park, NY — Keystone Electronicshas introduced a new line of battery insulatorsdesigned to protect batteries and circuitryfrom energizing during shipping and storage.

These new insulating pull tabs areinstalled in a product, along with the batter-ies, to insulate and prevent them from ener-gizing prior to use. The tab is pulled out fromunder the battery contact to activate. Clearlabeling and arrows on the pull tabs simplifyremoval.

Manufactured from thin, flexible poly-ester, these pull tabs can be easily removedfrom a battery compartment even if the com-partment is closed. For button cell throughAAA batteries, the company offers catalog#111. For 0.5 in. (12.7 mm) coin cells and AAor larger cylindrical cells, the company offerscatalog #117. Both styles are sup-plied on a 3 in. (7.6 cm) adhesive-backed carrier strip in rolls of 1,000pieces. Pull tabs are available

through Keystone’s global distribution net-work. Online ordering is also available.

Keystone offers a comprehensive line ofinterconnect components and electronic hard-ware. Modifications, special designs, stamp-ing, machining, assembly services, and appli-cation-engineering support are also available.Keystone is ISO 9001:2008 certified, withheadquarters in the U.S. and global offices inEurope, Canada, Asia, and Australia.

Contact: Keystone Electronics Corp., 55South Denton Avenue, New Hyde Park, NY11040 % 516-328-7500 fax: 516-328-1080 E-mail: [email protected] Web: www.keyelco.com



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Elgin, IL — HELUKABEL’s entireTOPSERV and TOPGEBER productportfolios of servomotor power andfeedback cables have recieved a heat-resistant UL upgrade from 176 to194°F (80 to 90°C).

Currently, the UL style marketstandard for cables is resistance to176°F (80°C). Higher heat resistancenow allows for a longer service life.Following intensive testing, the com-pany confirmed that it achieved ther-mal stability at up to 194°F (90°C)for over 30,000 hours.

Over the past few years,HELUKABEL has been optimizingits insulation materials and manu-facturing methods. Today, the com-pany uses special polypropylene (PP)materials for the conductor insula-tion that can withstand tempera-tures of up to 230°F (110°C).

For the servo and feedbackcable jackets, the company usespolyvinyl chloride (PVC) andpolyurethane (PUR). PUR has manyadvantages in dynamic drag chainapplications, where continuous flex-ing is common and high abrasionresistance is necessary.

Contact: HELUKABEL USA,1490 Crispin Drive, Elgin, IL 60123% 847- 930-5118 fax: 847-622-8766E-mail: [email protected]: www.helukabel.com


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Chester, NY — Tray cables typicallyprovide robust and reliable powerand control connections for staticautomation applications, includingbottle filling and packagingmachines, as well as for machinetools. However, the automation sec-tor is now calling for cables that canhandle motion along several axes,severe acceleration and braking, anda vast number of bending cycles.

Nexans has launched itsINTERCOND® tray cable range thatcombines the benefits of a tray cablewith the dynamic capabilities of an

advanced automation cable suitablefor servo motor installations.

Tray Cables from the INTER-COND range are available in servomotor and multicore versions. Theyare suitable for dynamic applica-tions, for example in drag chain ormoving machine parts as well as inwind turbines. They offer a fasterhomologation process for machinetools, in particular, with reducedinstallation cost and effort as thecables can be installed without theneed for metal conduits.

According to tests carried out by

the company, the cables providesuperior dynamic performance — upto three million cycles when bendingat 7.5 times the cable diameter indrag chain applications — as well assupporting speeds up to 787.4 ft/min(240 m/min) with an acceleration ofup to 32.8 ft/s2 (10 m/s2).

The new tray cables are UL andCSA listed — a key requirement formachine tool makers that operate inthe U.S. and Canadian markets.They are also MTW (machine toolwire) and WTTC (wind turbine traycable) approved. Due to their CIC

(control and instrumentation cable)and TC-ER (tray cable — exposedrun) approvals, they can be installedwithout the use of metal conduits.

Resistant to abrasion, as well asoils, coolants, and chemicals, theyare also suitable for direct burialunderground without the need forany extra sheathing or piping. Thecables can operate in temperaturesvarying between –23 to +176°F (–5 to+80°C) with a nominal voltage up to1,000V.

Contact: Nexans, 25 OaklandAvenue, Chester, NY 10918 % 845-469-2141 fax: 845-469-9935 E-mail: [email protected] Web: www.nexans.us


flexlink.com

We move electronics.Boost your production efficiency

Our new dual head laser marker combines speed with efficiency. From laser marking to PCB handling solutions, FlexLink automate production flow solutions that increases overall line efficiency.

With our range of stand-alone units to turnkey solutions, our PCBinclude independent modules with a wide variety of functions.

For more information, please contact us at 610-973-8200 or by email at [email protected].

FlexLink is part of Coesia, a group of innovation-based industrial solutions companies operating globally headquartered in Bologna, Italy. www.coesia.com

Nexans Launches Tray Cable Range for Dynamic Applications

Nexans’ INTERCOND cables are

aimed at automation.

Walnut, CA — LinkCom has intro-duced its 100 to 150W HVA series,the latest addition to its INCOREfamily of high-performance, con-stant-current, LED power supplies.Models in the HVO series are avail-able with power ratings of 100, 120and 150W. All models are greaterthan 90 percent efficient, when pow-ered from a 200 VAC or highersource voltage.

Weatherproof IP67 packagingand a wide operating temperature of–40 to +140°F (–40 to +60°C) suit theseries to applications in street light-ing, industrial illumination andother high-lumen output equipment.The units also provide a built-in 5Wauxiliary output power source tooperate environmental sensors. TheHVO series also includes three-in-one dimming (0 to 10 VDC, 10VPWM or resistance).

To ensure flicker-free lighting,the series contains two-stage, flybackconverters with integral active powerfactor correction.

The units also provide a fullrange of circuit protections and canwithstand up to 2 kV surges. TheHVO series power supplies meetUL8750 and complies with FCCemission standards and RoHS.

Contact: LinkCom USA, 350Paseo Sonrisa, Walnut, CA 91789 % 909-595-5262 fax: 909-595-5789 E-mail: [email protected] Web: www.linkcomusa.com

LinkCom’sLED PowerSupplies Getan OutputBoost


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Torrance, CA — PATLITE® has introduced its LA6 POELED signal tower, a fully-customizable signal towerseries with Ethernet (Modbus/TCP UDP) connectivity.The LA6-POE is able to read and write all necessarydata through a network-connected Ethernet cable. Itsupports PoE (Power over Ethernet), so there is no needfor input and output modules for PLCs or runningwires.

The LA6 series contains multicolor LEDs thatcan display 21 colors, 11 buzzers, animated patterns(using an internal timer function), and nearly endlessflash rate settings. No longer are users limited to thecommon three or five stack lights with preset lightmodules. The LA6 has clear modules equipped withmulti-color LEDs, allowing users to customize the sig-nal tower specifically for each application.

Easy-to-use PC software is available at no chargeto program the LA6’s light and soundpatterns. The LA6 can then be con-trolled by simple discrete I/O orModbus/TCP UDP using a PLC todisplay all the programs from the PC.

The LA6 was designed to solvethe drawbacks of traditional stacklights. Individual stack light modulescan be difficult to see across largeplant floors. To fix this issue, the LA6can be programmed to display onesingle, solid color throughout theentire unit when an error occurs,

making it highly visible even from the farthest ends ofa factory.

Another issue with some stack lights is that theyonly show that an error has occurred, with a singleblinking light, and give no additional information.The LA6 can be programmed to show any number ofprocesses with different colors or alarm sounds, suchas: indicating the severity of an error on a machine,showing the progress of a machine process, or visual-ly indicating the depletion of tank fluids in real time.It can even be used in a countdown mode, visually aid-ing the pace of an assembly line.

Contact: PATLITE (U.S.A) Corp., 20130 SWestern Avenue, Torrance, CA 90501 310-328-3222 fax: 310-328-2676 Web: www.patlite.com



LA6 POE LED signal tower.

PATLITE Adds Ethernet to LED Signal Tower

Adrian, MI — Wacker ChemicalCorporation, part of the global chemi-cal group Wacker Chemie AG, is plan-ning a number of concurrent expan-sion projects in the Americas to sup-port regional growth and demand forsilicones and HDK® pyrogenic silica.

The company’s current invest-ment strategy in infrastructure incapacity in the Americas will involveseveral coordinated projects. Thecompany recently opened a siliconesR&D center in Ann Arbor, Michigan.Currently under construction is thecompany’s HDK plant in Charleston,Tennessee. The plant is scheduled tobe opened in mid-2019. The plantwill provide a regionally-sourcedsupply of pyrogenic silica to cus-tomers in the area, with an annualcapacity of some 14,330 tons (13,000metric tons).

Complementing these projects,Wacker sites that manufacture sili-cone elastomers, fluids and emul-sions, are planning to significantlyexpand production capacity throughinfrastructure development andinvestments in additional equip-ment. Engineering planning for anumber of projects is already under-way. These plans include the addi-tion of capacities for elastomers,intermediate production processesand further investment in antifoamcompounds and silicone emulsionproduction.

Contact: Wacker ChemicalCorp., 3301 Sutton Road, Adrian,MI 49221 888-922-5374 fax: 517-264-8246 E-mail: [email protected] Web: www.wacker.com


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PACE introduces the PH 100 low profile IR preheater for the most challenging PCBs

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EpoxySet Showcases

Advanced Adhesive SolutionsLincoln, RI — EpoxySet is showcas-ing its innovative line of epoxies, ure-thanes, silicones, and thermal greas-es at ATX/MD&M West. The compa-ny has been providing high-perform-ance, advanced polymers to medicaland electronics device manufacturerssince 1997.

The company is highlighting itspolymers that are used extensivelyfor medical device manufacturing.Included are high-performance, bio-compatible adhesives, sealants, andpotting materials approved and certi-fied to USP Class VI and ISO-10993-5. Special emphasis is being placedon UV-cure formulations, designed tobond various plastics, as well as met-als, ceramics and glass.

The UV-8504E is a low-viscosi-ty, cationic epoxy that can be cured

under medium UV light in less than60 seconds to produce a rigid,durable polymer. This optically-clearmaterial offers excellent moistureand chemical resistance and can pro-tect components in underwater envi-ronments.

The UV8504E has a glass tran-sition temperature of 257°F (125°C)and can withstand continuous opera-tion at 392°F (200°C). It is an excel-lent choice for applications thatrequire temperature cycling or otherharsh conditions.

Contact: EpoxySet, Inc., 1Industrial Circle, Lincoln, RI 02865% 401-726-4500 fax: 401-726-4502E-mail: [email protected] Web: www.epoxyset.com


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Elmo Doubles Power ofSmallest Servo Drive

Nashua, NH — Elmo Motion Controlhas doubled the power of its ultra-small, powerful servo drive, the GoldTwitter, to suit the most demandingIndustry 4.0 applications. With aweight of 1.16 oz (33g) and continuouscurrents of 160° (80V) and 140°(100V), the new Double Gold Twitterdelivers over 10,000W of qualitativepower. The new drive is a good fit forapplications that require a reducedfootprint and high power, such aslarge robotic vehicles, antennas, track-ing systems, high-power machine tool-ing, and large printer rolls.

According to the company, the

Double Gold Twitter is among thesmallest STO-certified (IEC 61800-5-2, SIL-3) servo drives on the market.It contains Elmo’s proprietary Fastand Soft Power Switching Tech -nology (FASST).

Its miniature size means thatthe servo drive can be placed on amoving load, on the motor or insidethe motor.

Contact: Elmo Motion Control,Inc., 42 Technology Way, Nashua,NH 03060 % 603-821-9979 fax: 603-821-9943 E-mail: [email protected] Web: www.elmomc.com

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Bartlett, IL — Cycle time, change -over and downtime are three factorsthat significantly impact manufac-

turing efficiency and can be reducedwith the HiQ DIALOG, a new ultra-sonic welding machine. SoftTouchmode prevents damage to sensitivejoints by allowing a quick approachwith gentle contact to the applica-tion. With the help of the quick-change system (QCS) and optionalhinged tool change cover, the ultra-sonic stack can be quickly mountedwith minimum effort, in less than aminute.

The requirements for high-qual-ity products in medical engineeringhave become very complex. In addi-

tion to tightness, strength and mini-mum generation of particles, processvalidation and traceability areimportant quality criteria. TheDataRecorder is responsible forrecording and archiving all weldprocess values and process parame-ters. Strict criteria in accordancewith FDA 21 CFR Part 11 are metwith the FSC software package, pro-viding user authentication and a doc-umented trail of all activities.

The company’s patented HighMotion Control (HMC) ensures a cal-ibrated and repeatable process in themanufacturing environment, helpingthe user to speed production andmaximize repeatability. The pro-grammable stroke selection (start

and end position of the sonotrode)optimizes cycle time. The stroke canbe individually adjusted for therequired weld task and the size of theparts being welded.

According to the company, itsultrasonic welding uses 75 percentless energy than other thermal join-ing processes. This is due to the factthat the welding tools remain coldand have a low energy requirement.The ultrasonic vibrations are specifi-cally applied to the joint area for onlya matter of milliseconds during weld-ing. The digital ultrasonic generatorULTRAPLAST guarantees efficien-cies over 80 percent when poweredwith up to 6,200W.

From prototyping and product

development to full-scale production,medical device manufacturing can bea complex process. Successful collab-oration is vital. During the earlystages of a project, HerrmannUltrasonics will be more than just aconsultant, but rather a partner tohelp design the device for successfulultrasonic assembly, minimizinglong-term risk.

Contact: Herrmann Ultrasonics,Inc., 1261 Hardt Circle, Bartlett, IL60103 % 630-626-1639 fax: 630-626-1627 E-mail: [email protected] Web: www.herrmannultrasonics.com



Herrmann ultrasonic welder.

Herrmann Ultrasonics Introduces New Welder

Melville, NY — LSI/CSI has intro-duced its LS7366RSH shield develop-ment kit. The kit showcases theLS7366R, a powerful 32-bit CMOScounter, with direct interface forquadrature clocks from incrementalencoders.

The LS7366RSH has a six-channel, onboard encoder platformfor out-of-the-box use and rapiddevelopment. The board is directlycompatible with Arduino boards. Itunloads all of the computation oftracking the encoders and interfacesdirectly by using the Arduino boardthrough serial peripheral interface(SPI) and I/Os.

The LS7366RSH provides adedicated solution for positioningand displacement tracking at 40 x106/sec line rate (at 5V) from theencoder, and a count limit of 232. ItsSPI greatly reduces the required I/Owire count when compared with aparallel bus structure. It can alsooperate with non-quadrature clocksignals and provides various count-ing modes for signal conditioning.

Contact: LSI ComputerSystems, Inc., 1235 Walt WhitmanRoad, Melville, NY 11747 % 631-271-0400 fax: 631-271-0405 E-mail: [email protected] Web: www.lsicsi.com

QuadratureCounter ShieldDevelopmentKit fromLSI/CSI

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The Feeder Finger™ adapts the original manufacturer’s feeder to handle cut tape as short as three inches, feeder setup and changeover time is reduced by 50%, and feeder performance is elevated by eliminating cover tape feeder jams during production.

The feeder is not limited to tape strips — full reels can also be loaded keeping all feeders available for production.

Booth 3015

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At APEX 2018, Feeder Finger will showcase its latest Cut Tape Solutions for Juki, Panasonic, & ASM feeders. If you

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Memcon Offers Connectorsfor Medical Sensors

Stevensville, MI — Memcon is nowoffering reliable, lightweight connec-tors for medical sensors. Using

proven crimp connectors with print-ed/flex electronics enables the secureelectrical signals that these sensorsdepend on. The company’s connectorsare excellent for biosensors, forcesensors, multi-sensor body arraysand many other products. The cost-effective connectors can be used fordisposable devices, but are alsorugged enough to withstand reuse.

Whether soldertab, male orfemale configurations, Memconmachines can mass terminate theconnectors. White housings can berequested that will not discolor overtime. Latching, locking and polarizedstyles all come standard. The compa-ny offers both standard and customcrimp connector solutions.

With customers all around theworld, Memcon has grown into amultinational business. The compa-

ny has facilities in Hong Kong,Shenzhen, England, and the U.S.The company has also diversified itsproduct range from electromechani-cal products to the latest in opto tech-nology, offering one of the world’sthinnest LEDs in a 1206 (3216m)package.

The company is also working toexpand its range of adhesives.

Contact: Memcon NorthAmerica, 6000 Red Arrow Highway,Unit 1, Stevensville, MI 49127 % 296-281-0478 fax: 269-593-5952 E-mail: [email protected] Web: www.memcon.net


Memcon’s connectors are well-suited for biosensing applications.

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Savage, MN — Beckhoff’s new EL922x EtherCATterminal series directly integrates electronic over-current protection to safeguard 24 VDC compo-nents in the I/O system. In comparison with cur-rently available protection devices, costs and spacerequirements in control cabinets can be reducedwithout having to use conventional, inflexiblestandalone systems. With an extended range of set-tings and process data options, the 0.5 in. (12 mm)wide EL922x EtherCAT terminals meet diverserequirements and enable transparent system mon-itoring.

The terminal series for over-current protec-tion is designed for 24 VDC operation and includes19 different EtherCAT terminals. There are one-and two-channel versions for various currentloads up to a maximum of 10A.

The range of terminals includes EL9221 andEL9222 terminals with standard func-tionality, such as rated current, whichcan be parameterized with TwinCATsystem manager software or an LEDbutton. The series also includesEL9227-xxxx terminals with extendedfunctionality that can be parameter-ized in the TwinCAT system managersoftware. Settings such as the selec-tion of a characteristic curve, prelimi-

nary warning threshold, under-voltage signal,feedback cut-off, event logging, and a passwordprotected software seal can be controlled.

System-integrated over-current protectionoffers numerous practical benefits for users. Wiringis reduced, since the feed into adjacent I/O termi-nals is achieved automatically by simply pluggingin the terminal. In addition, control cabinets bene-fit from space and cost savings, because additionalcoupling hardware and other digital I/O or powerfeeding products are no longer required.

Contact: Beckhoff Automation, LLC, 13130Dakota Avenue, Savage, MN 55378 952-890-0000 fax: 952-890-2888 E-mail: [email protected] Web: www.beckhoff.com

See at ATX/MD&M East, Booth 4538


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Beckhoff EtherCAT I/O Protects DC Components

Mansfield, MA — DATEL’s new SBseries of 16th-brick DC-DC convert-ers have been designed with ultra-wide voltage ranges and offer anoptional high isolation (2,828 VDC)in an industry-standard package.Tightly-regulated outputs of 2.5, 3.3,5, 12, and 15V are available.

Features include: fixed switch-ing frequency; remote on/off — posi-tive or negative and remote sense; –40to +253.4°F (–40 to +123°C) operatingtemperature range; full over-tempera-ture, over-current, over-voltage,under voltage lock out, and autorestart protections; the ability to with-stand 100V transients; and an option-al SMD-mountable construction.

The SB family of converterscomes in an industry-standard size of0.9 x 1.3 0.4 in. (2.3 x 3.3 x 1 cm). The2:1 Vin series of converters operatesover the input range of 9 to 18, 18 to36 or 36 to 75 VDC and provides upto 100W of output power. The 4:1 Vinseries operates over the input voltagerange of 9 to 36 or 18 to 75 VDC andprovides up to 50W of output power.The SB family offers efficiencies upto 93 percent. Standard models comewith isolation of 2,250 VDC (1,590VAC rms). Optional versions with2,828 VDC (2,000 VAC rms) of isola-tion are also available.

Contact: DATEL, Inc., 11 CabotBoulevard, Suite 200, Mansfield,MA 02048 508-964-5397 E-mail: [email protected] Web: www.datel.com

SB series DC-DC converter.

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Cicoil Creates MissionCritical Cables Video

Valencia, CA — Cicoil has released itslatest video, “Mission-Critical FlatCables,” which can be found on thecompany’s YouTube channel atwww.youtube.com/user/cicoilflexca-bles. The video showcases the compa-ny’s durable flat cable technology.Manufactured with high-strength,oxygen-free copper wire, Cicoil’sdesign is more flexible than othertypes of round and flat cables. Itsshock-absorbing jacket is immune toextreme vibration, g-forces, mechani-cal stress, saltwater submersion, cor-rosion, sunlight, acid, rain, sea ice,sand, UV light, humidity, tempera-tures of –85 to +329°F (–65 to +165°C),flames, ozone, and most chemicals.

The proprietary, crystal-clearencapsulation needs no externalarmor or conduit for protection. Thecable is self-healing from small punc-tures and cable jacket damage can berepaired easily in the field.

Cicoil’s flat cables are used in

thousands of demanding applica-tions, including aircraft fuel controlcells, semiconductor automation andspacecraft. The company’s qualityassurance system is certified to meetthe ISO 9001 (AS9100) standard.

Contact: Cicoil, 24960 AvenueTibbitts, Valencia, CA 91355 % 661-295-1295 fax: 661-295-0813 E-mail: [email protected] Web: www.cicoil.com


Hi-flex unshielded cable.

KEYENCE Launches InstantMeasurement System

Itasca, IL — KEYENCE has launchedits IM-7000 instant measurement sys-tem, along with a variety of units inthe IM series. The new automatedoptical comparator can accuratelymeasure all part dimensions in sec-onds, automatically record data andgenerate complete inspection reportsat the touch of a button.

The company also offers digitalmicroscopes, measurement andvision sensors, machine vision sys-tems, laser markers, inkjet coders,barcode readers, and handheldCMMs. KEYENCE is a developer offactory automation equipment for abroad range of applications in manu-facturing, research and development.

Contact: KEYENCE Corporationof America, 500 Park Boulevard,Suite 200, Itasca, IL 60143 % 888-539-3623 Web: www.keyence.com


IM-7000 instant measurement system.

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St. Paul, MN — Microprecision hasintroduced a new product formechanical position detection. Thenew MP600 series of mechanical sen-sors is designed to detect two posi-tions with a single device. The dis-tance between the two positions canbe customized to the user’s applica-tion between 0.01 to 0.06 in. (0.3 and1.5 mm). The fixed NC and NO con-tacts activate with no measurablehysteresis. Repeatability is betterthan 0.2 mil (5 µm), and dependingon cable selection, the operationaltemperature can go from –40 to+266°F (–40 up to +130°C). The cabletermination can be supplied with anM12 connector.

This patented switching mecha-nism is designed for low-voltageapplications up to 30 VDC. It is selfcontained and can be inserted in

multiple forms and shapes of hous-ings. The IP67-rated standard hous-ing sizes are M8 and M12 with a pinor ball plunger.

The sensors are aimed at appli-cations in the automation, processcontrol and OEM industries thatrequire two switches for position con-

trol. The MP600 series eliminatesthe time-consuming adjustmentsfrom hysteresis caused by other sen-sors or snap-action switches. This istypically the case for brake applica-tions with air gap and wear control,or high- and low-limit control inprocess applications. Due to its sizeand precision, the MP600 can also beused for home position detection inany application with x/y/z move-ments.

Contact: Wilbrecht LEDCO,Inc., — a Microprecision Company,1400 Energy Park Drive, St. Paul,MN 55108 % 888-323-8751 E-mail: [email protected] Web: www.wilbrechtledco.com

See at ATX/MD&M West, Booth 4166MP600 series mechanical two-position sensors.

Microprecision Intros Mechanical Two-Position Sensor

Charlotte, NC — LUTZE is expand-ing its industrial Ethernet cableoffering by introducing an unshield-ed Ethernet cable for light industrialduty, the CAT6 UTP 4X2XAWG23with PVC jacket. The cable is intend-ed for use in low-noise industrialenvironments where the effort ofinstalling a shielded cable does notoffer any benefit to the application.

The cable has a teal jacket and isUL-listed type CMR, CMX outdoorand UL-recognized per AWM 21695600V. It presents an economical solu-tion for industrial environmentswhere commercial grade Ethernetcable does not suffice. The PVC jacketis designed to last in industrial envi-ronments as it is oil-, abrasion- andsunlight-resistant, allowing one cablefor applications inside and outside theplant. The cable is suitable for cabletray installation, per NEC 800, and600V rated for installation onmachines and inside control panels.

Due to its center spline design,the Cat6 UTP offers electrical per-formance that exceeds category 6requirements. Solid copper conduc-tors support easy termination withIDC technology.

Contact: LUTZE, Inc., 13330South Ridge Drive, Charlotte, NC28273 % 800-447-2371 fax: 704-504-0223 E-mail: [email protected]: www.lutze.com


PVC-jacketed unshieldedEthernet cable.

LUTZE IntrosUnshieldedCat6 EthernetCable


http://WWW.PATLITE.COM


GlobTek Intros 60WOutput Power Supply

Northvale, NJ — GlobTek has intro-duced its GTM91099 24V, 60W out-put power supply, with a high surgepower feature of 7.5A (180W) outputcapability for 100 ms pulse time. Thepower supply is DoE Efficiency LevelVI-compliant and is safety certifiedfor medical, ITE and general-purposeproducts.

Its power surge feature makesit a good choice for handling motorstarting current surges, electricvalves and other types of equipment.Due to its small size and economic60W design, it can help to keep OEMproduct system costs under control.

Customized enclosure colors,housing designs, output cord typesand lengths, as well as customizedpackaging, open-frame or ruggedizedto various degrees of ingress protec-tion, such as IP52 or potted IP68 ver-sions, are available.

According to BS EN 60529 andIEC 529, IP52 signifies that the med-ical (60601-1) power supply is pro-tected against dust — limited ingress(no harmful deposit), as well as pro-

tected against vertical direct spraysof water up to 59°F (15°C. Testreports and certifications, as well asa variety of other options are avail-able upon request.

Contact: GlobTek, Inc., 186Veterans Drive, Northvale, NJ07647 % 201-784-1000 E-mail: [email protected] Web: www.globtek.com


GTM91099 24V, 60W power supply.

Banner ImplementsOptel Software

Austin, TX — Banner Engineeringhas completed the implementation ofOptimal Electronics’ Optel softwarefor production, scheduling and mate-rials management at facilities inMinneapolis, Minnesota, and Su -zhou, China. The company operates ahigh-mix production environmentand its ASM lines are frequentlychanged over.

Optel allows the company tocreate group order setups and pro-vides inventory accuracy and trace-ability through a comprehensivematerials management system. Themanagement tracks receiving, bar-coding, storing, and verification ofmaterials, as well as integrates withBanner’s ERP system for real-timecomponent consumption and scrapdeduction data.

Banner Engineering is a provi -der of industrial automation prod-ucts. Its sensors and imaging sys-tems, LED lights and indicators, andwireless and safety products are usedby a variety of companies. Banner

has headquarters in Minneapolisand has sites in both North andSouth America, Asia, Africa, Austra -lia, and Europe.

Contact: Optimal ElectronicsCorp., 13915 Burnet Road, Suite 312, Austin, TX 78728 % 512-673-7297 E-mail: [email protected] Web: www.optelco.com

Banner Engineering implemented Optel to run itsASM lines more efficiently.

McHenry, IL — The redesigned TagMaster 3, an automatic name tagfeeder/marker, uses dot peen tech-nology to permanently mark indus-trial components. This automaticfeeder/marker was developed to elim-inate the problematic tag feedingissues of tags escaping from the bot-tom of the magazine.

The tags are transferred fromthe top to eliminate the jamming,scratching and other problems asso-ciated with bottom-feed, “coin chang-er” type escapements. This alsomeans that thickness tolerances,sharp edges, etc., are no longerissues.

The machine is available withthe company’s Print Queue Driver.

Contact: Kwik Mark, Inc., 4071Albany Street, McHenry, IL 60050% 815-363-8268 fax: 815-363-8089E-mail: [email protected] Web: www.kwikmark.com

Kwik Mark RedesignsName Tag Feeder/Marker


Tag Master 3 automaticfeeder/marker.

http://www.nozzles4smt.com

http://www.apolloseiko.com


Meridian, ID — Computrol, Inc., aprovider of mid- to low-volume, high-mix electronic manufacturing servic-es to OEMs, is well-equipped to meetthe needs of the medtech industry.The company holds ISO 9001-2008certification, ISO 13485 specific tomedical device quality systems,AS9100 specific to military and aero-space quality systems, is IPC Class IIand III and J-STD-certified, as wellas being ITAR-registered and lead-free RoHS compliant.

Computrol continues to upgradeits three state-of-the-art facilitieswith advanced test systems to keepup with its customers’ needs. Core toits business, the company continuesto focus on prototyping and low- to-medium volume, high-mix produc-tion of PCBs, box build, cable har-

nesses, and backplane assemblies.The company’s advanced, low-vol-ume electronics manufacturing capa-bilities allow it to produce cost-effec-tive custom assemblies and productswith JIT-dependability, flexibilityand world-class quality.

Contact: Computrol, Inc., 499 E.Corporate Drive, Meridian, ID83642 % 208-887-1000 fax: 208-887-2000 E-mail: [email protected] Web: www.computrol.com


tOPENING OUR SECOND LOCATION IN BILLERICA, MA 1ST QTR 2018.

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Services ProvidedConformal CoatingPotting/EncapsulationPCB CleaningIonic TestingPlasma TreatingCoating RemovalSolderingAOI Blacklight Insp.UV curing

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Computrol Offers Testing for theMedtech Industry

Wide range of test services for the medical device industry.

Sunnyvale, CA — KRYTAR hasexpanded its line of dual directionalcouplers with a model that offers 20dB of coupling over the ultra-broad-band frequency of 0.5 to 20 GHz, in asingle, compact, lightweight package.

The model 500529920 dual direc-tional coupler is designed for systemsapplications where external leveling,precise monitoring, signal mixing, orswept transmission and reflectionmeasurements are required.

Mainly aimed at broadbandelectronic warfare (EW) systems andcommercial wireless system applica-tions, the dual directional couplersare also used in signal monitoringand measurement, antenna beamforming, cable distributed systems,and military and EMC testing envi-ronments.

Performance ratings includenominal coupling (with respect tooutput) of 20 dB, ±1.2 dB and fre-quency sensitivity of ±0.85 dB. Thedual directional coupler exhibitsinsertion loss of 2.0 dB, directivity of12 dB, maximum VSWR (any port) of1.4, and an input power rating of20W average and 3 kW peak.

The coupler comes with indus-try-standard SMA female connectors.The compact package measures 9 x0.5 x 0.7 in. (22.9 x 1.3 x 1.8 cm) andweighs 0.4 lb (0.2 kg). It operates in atemperature range of –65.2 to +185°F(–54 to +85°C). The dual directionalcoupler can also be manufactured tomeet rigid military specifications.

Contact: KRYTAR, Inc., 1288Anvilwood Avenue, Sunnyvale, CA94089 % 408-734-5999 fax: 408-734-3017 E-mail: [email protected] Web: www.krytar.com

New DualDirectionalCoupler fromKRYTAR

500529920 dual directional coupler.

http://www.speccoat.com

Hampstead, NH — Excelsys Technologies is nowoffering a new output module for its CoolX series ofconvection-cooled, modular configurable powersupplies. The CmE bulk power module provides upto 600W of power from one module (occupyingthree slots). The addition of this module greatlyincreases product and system flexibility for design-ers. It also reduces total system cost throughreduced component count while simplifying config-uration and system integration.

Initially available with a 24V output, theCmE module provides up to 25A output. It is use-ful for applications that require one higher poweroutput with additional lower power outputs, whichcan be configured between 2.5 and 58V using theexisting CoolX modules.

The Excelsys CoolX600 power supply seriesoffers system integrators flexibility with its analogand digital management using PMBus monitoringand control capability. Mounting options include

base, side and DIN rail alternatives.The CoolX600 is available with full safety cer-

tifications to UL/EN60950 and UL/EN60601 3rdand 4th Edition (EMC) for both industrial andmedical applications. Medical features include BFrating (body floating), dual fusing, 2X MOPP, andless than 300 µA leakage current, as well asoptional ultra-low leakage current of 150 µA.

Additional features include SEMI F47 com-pliance and operation at 16,404 ft (5,000m) alti-tude. A 24W standby power output, available aseither 12V or optional 5V, which offers anotheroutput for system intelligence, cooling fans, dis-plays, etc., is a standard feature.

The CoolX600 can be populated with up tofour CoolMods, providing up to five isolated DCoutputs ranging from 2.5 to 58V. The CoolX600 iscompletely user- and field-configurable with plug-and-play power. Outputs can be configured to therequired set point voltages and connected in paral-lel or series for higher output current and/or high-er output voltages.

Contact: Excelsys TechnologiesLtd., 80 Bricketts Mill Road,Hampstead, NH 03841 % 972-771-4544 fax: 603-329-4204 E-mail: [email protected] Web: www.excelsys.com


Excelsys Adds 600W Bulk Power to CoolX Supplies

CmE bulk power module for CoolX power supplies.

Syosset, NY — ISL Products Inter -national has launched a new websitewith enhanced content and improvedsearch functionality to assist engi-neers sourcing audio components,motor and mechanical components,ballasts and power supplies, poten-tiometers, and transformers, as wellas cable assemblies and connectors.The website can be found at www.isl-products.com.

ISL products are most often usedin the audio/visual, health care, secu-rity, industrial machinery, robot ics,and food service industries. The intu-itive website’s new user-friendly navi-gation tools help visitors save timeand the associated costs of locatingend-of-life, phased-out and obsolete

components. Available on each page isa link to an inquiry form that allowsusers to submit their project detailsdirectly to an ISL sales engineer, whowill respond within 24 hours.

Together with the company’scomponent modification and assemblyservices, the website offers detailedinformation pertaining to ISL’s supplychain management services, continu-ous-source manufacturing services andlogistics management capabilities.

Compre hensive design notes,case studies, and listings of indus-tries and customers served areincluded.

Contact: ISL ProductsInternational, Ltd., 235-P RobbinsLane, Suite 270, Syosset, NY 11792% 516-937-3475 E-mail: [email protected] Web: www.islproducts.com

ISL’s new product website.

ISL ProductsLaunchesEnhancedWebsite

Vacuum Tweezer Solutions

For nearly thirty years we have been a leading supplier of vacuum

handling solutions to the world’s high technology fi rms. Our

patented ESD safe products are used by CLASS I clean room

personnel, electronic assemblers, semiconductor manufacturers, the

optics industry and universities around the world. Our success

comes from developing innovative manual vacuum handling tools and

pick-up tips based on customer requests and customer feedback.

These tools provide customer specifi c solutions that make assembly and processing

operations more productive and ergonomic. Parts range in size from 0.13mm (0.005”) up to

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These hand tools replace tweezers and other gripping means for many

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Virtual Industries offers a broad line of accessories

including miniature rubber vacuum cups, PEEK wafer

handling tips, and precision machined handling tips for critical

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Visit our website or contact us for additional information.

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Southfield, MI — DENSO has devel-oped a thin-film transistor (TFT), liq-uid-crystal head-up display (HUD) toproject critical driving informationonto the windshield of automobilesfor drivers. According to the compa-ny, this human-machine interface

(HMI) is the world’s largest automo-tive HUD, with a nearly 24 in. (61cm) projection. The display wasrecently included in the new 2018Lexus LS.

The HUD projects a virtualscreen approximately threemeters ahead of the driver,enabling the driver to more intu-itively access key informationabout the vehicle and its sur-roundings without looking awayfrom the road.

The technology displaysbasic information, such as speedlimits and the vehicle’s drivingspeed, and also the locations ofpedestrians through external sen-

sors. It also provides lane guidanceassistance by using an automotivenavigation system. The navigationsystem has an arrow that indicates

the appropriate lane to follow atintersections.

The HUD takes into considera-tion the relative position of informa-

tion displayed, its colors andother visual effects — all withoutobstructing driving. Its display isbrighter than conventional HUDsto ensure screen visibility inbright, daytime conditions.

Contact: DENSOInternational America, Inc.,24777 Denso Drive, Southfield,MI 48086 % 248-350-7500 Web: www.globaldenso.com


Tualatin, OR — CUI’s power grouphas added five new open-framepower supply series, ranging from180 to 550W, to its line of internalAC-DC medical power supplies.Certified to the medical 606011 edi-tion 3.1 safety standards for 2XMOPP applications and 4th editionEMC requirements, the VMS180,VMS225, VMS275, VMS350, andVMS550 series exhibit high efficien-cy up to 94 percent and power densi-ties up to 30 W/in.3.

The new models are housed in 2x 4 in. (5 x 10.1 cm) and 3 x 5 in. (7.6x 12.7 cm) packages with profilesmeasuring as low as 0.75 in. (1.9 cm).The new supplies provide a compact,high-density solution for medicaldiagnostic equipment, medical moni-toring devices and dental applica-tions.

Each of the new power suppliesprovide output voltages of 12 to 58VDC, have wide universal input volt-age ranges from 80 to 264 VAC andoffer no-load power consumption aslow as 0.5W. The 180 to 550W mod-els also carry an input-to-output iso-lation of 4,200 VAC, with leakagecurrent ratings as low as 0.3 mA at230 VAC.

Operating temperatures at fullload range from –40 to +122°F (–40to +50°C) with forced air cooling, der-ating to 50 percent load at +158°F(+70°C). Additional features includeover-voltage, over-current and shortcircuit protections, power factor cor-rection, and a 12 VDC/500 mA fanoutput.

These medical power suppliesmeet EN 55011 Class B limits forconducted and radiated emissionsand achieve a mean time betweenfailure (MTBF) rating of 3.37 millionhours, calculated per Telcordia SR-332 Issue 3.

Contact: CUI, Inc., 20050 SW112th Avenue, Tualatin, OR 97062% 503-612-2300 fax: 503-612-2383E-mail: [email protected] Web: www.cui.com

Information displayed on DENSO’s new HUD.

DENSO Designs Large Automotive Head-Up Display

Open-frame medical power supplies.

CUI’s NewPowerSuppliesCertifiedfor Medical

TECHNICA, U.S.A.Ful�lling Manufacturing Needs Throughout the Electronics Industry

Available exclusively through Technica, U.S.A.1-800-909-8697 • www.technica.com

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Eagan, MN — Ironwood Electronicshas introduced its latest BGA socket.The SG25-BGA-2042, high-perform-ance, elastomer socket is designedfor 0.016 in. (0.4 mm) pitch packages.The socked is designed for a 0.18 x0.17 in. (4.5 x 4.3 mm) package sizeand operates at bandwidths of up to40 GHz with less than 1 dB of inser-tion loss (GSSG configuration).

The contact resistance is typi-cally 20 mW per pin. Network analyz-er reflection measurements for the

GSSG case were taken with allexcept the pins under considerationterminated into 50W.

The socket is mounted usingsupplied hardware on the target PCBwith no soldering, and according tothe company, has the smallest foot-print in the industry. The small foot-print allows inductors, resistors anddecoupling capacitors to be placedvery close to the device for imped-ance tuning.

The socket also incorporates asimple swivel hardware installationmethod so that ICs can be changedout quickly.

The SG25-BGA-2042 sockets areconstructed with high-performanceand low-inductance elastomer contac-tors. Operating temperature range is–31 to +212°F (–35 to +100°C). The pinself inductance is 0.06 nH with amutual inductance of 0.019 nH.Capacitance to ground is 0.129 pF andmutual capacitance is 0.017 pF.Current capacity is 2A per pin.

Contact: Ironwood Electronics,1335 Eagandale Court, Eagan, MN55121 % 952-229-8200 fax: 952-229-8201 E-mail: [email protected] Web: www.ironwoodelectronics.com

New ProductsNew Products www.us- tech.com February, 2018

SG25-BGA-2042 BGA socket.

Norristown, PA — Megger is now offer-ing a handheld, three-phase powerquality analyzer. The MPQ1000 isClass A and is rated CATIV at 600V. Itcan be used for a wide variety of appli-

cations, including substation monitor-ing, equipment and breaker tripping,load studies, and load balancing, aswell as for switchgear and componentfailure.

The intuitive unit is designedwith an ergonomic platform. In bothits scope and DVM modes, theMPQ1000 can record power, energy,rms, sags, swells, transients down to1 µs, harmonics, inter-harmonics,

harmonic direction, THD, TDD, flick-er, unbalance, rapid voltage change(RVC), mains signaling, and phaseangle deviation, as well as performwaveform analysis to the 128th har-

monic in real time.Data gathered during

testing can be recorded simplyby pushing a button. This fea-ture automatically detects thecurrent clamps, recognizes itsrange, identifies the nominalvoltage, and sets the triggers,as well as verifies that theunit is connected properly tothe device under test.

The device also includesonboard data analysis. An SDcard is used to expand memoryand all data recorded can beviewed on its color VGA dis-play, or transferred to the com-pany’s power quality analysissoftware by USB or Ethernet,and directly from the SD card.

The free PC software thatcomes with the analyzer cre-ates custom configurationsbased on the customer applica-tion and performs automatic

data analysis. It also allows the user tocreate his or her own analysis tem-plates that can be loaded into the ana-lyzer. The MPQ1000 unit also includesflexible current clamps that have fourselectable ranges from 0 to 6,000A.

Contact: Megger, 2621 VanBuren Avenue, Norristown, PA19403 % 800-723-2861 E-mail: [email protected] Web: www.us.megger.com

Megger Now OfferingThree-Phase Power

Quality Analyzer

MPQ1000 handheld power quality analyzer.

HARTING IntegratesWireless Sensors into MICAElgin, IL — HARTING has partneredwith Arrow Electronics to develop awireless sensor network that addsnew wireless communications toHARTING’s MICA (Modular Indus -trial Computing Architecture). Withan Arrow-designed module that wire-lessly communicates with sensors,MICA is now able to capture andprocess data through SmartMESH IP(DUST), Bluetooth Low Energy, andan XBee slot, regardless of the existingmachine control.

These transmission protocolshave been selected to provide a varietyof ways for wireless sensors to connectwith MICA, either directly or throughsensor nodes. The combination of wire-less sensors and MICA offers simpleand cost-efficient machine conditionmonitoring. Data, such as operatingtimes, temperatures and numerousambient parameters, can be deter-

mined and monitored.MICA is a modular, open edge

computing system that can be adaptedeasily to individual requirements. Italso supports traditional industrialinterfaces, such as Profinet, EthernetIP, Ethercat, Modbus, energy monitor-ing solutions, analysis, and RFID.

Contact: HARTING NorthAmerica, 1370 Bowes Road, Elgin,IL 60123 % 847-717-9217 E-mail:[email protected]: www.harting.com

MICA now supports wireless.

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Auburn, MA — PI (Physik Instru mente) has intro-duced a compact, closed-loop motion controller thatprovides nanometer resolution for miniature piezomotor actuators. The E-871.1A1N digital servo con-troller is the latest in a series of drivers and con-trollers designed specifically for inertia-motor-based,opto-mechanical actuators (piezo ratchet drives).These drives are widely used in the semiconductor,laser and photonics industries for the fine-tuning ofcomplex systems.

The miniature actuators are often employedas “set-and-forget” mechanisms with an option tomake adjustments remotely, where manualmicrometer screws would necessitate a systemshutdown to allow for corrections. Other applica-tions include the fields of bio-nan-otechnology, microscopy and micro-manipulation.

The E-871.1A1N has an inte-grated power amplifier and voltagegenerator for piezo inertia drives. It isoptimized for PI’s N-472 series ofclosed-loop PiezoMike precision actu-ators, which provide high stability, alifetime of more than one billion stepsand a low cost of ownership.

The E-871.1A1N is equipped witha data recorder for high speed tracing,ID chip compatibility for quick start-up, and exchange of system compo-nents without recalibration. The con-trollers are delivered with extensivesoftware packages, including support

for LabVIEW, MATLAB, C, C++, C#, VB.NET, andPython. In addition, a powerful macro program-ming language is available for automation tasks

and standalone operation. Communication inter-faces with a host PC include TCP/IP and USB. Anoptional joystick is available for manual operation.

Actuators with a screw and ratchet mechanismare designed with a small piezo ceramic block thatperforms the individual “clicks” based on the inputto a controller. The advantage of this design is a veryhigh stiffness and blocking force of up to 100N. Oncethe encoder tells the controller that a position isreached, the actuator is vibration-proof, shock-resistant, and stable, with no position drift or jitter.

Contact: PI (Physik Instrumente) L.P., 16Albert Street, Auburn, MA 01501 % 508-832-3456fax: 508-832-0506 E-mail: [email protected] Web: www.pi-usa.us


E-871.1A1N digital servo controller.

PI’s New Motion Controller OffersNanometer Resolution

San Diego, CA — Endura Tech nol -ogies has introduced its ET7700, athree-phase 6A switching regulator.According to the company, it is theindustry’s first 28 nm embedded volt-age regulator (eVR™).

It is integrated inside the SoCpackage within a 0.008 in.2 (5 mm2)area and is less than 7.9 mil (200 µm)in height, including inductors. TheET7730 is designed to provide excel-lent performance in a small form fac-tor module, with integrated passives.The ET7700 product family willinclude a fully-integrated, stand-alone module in 2018.

The regulator delivers high per-formance while using very smallinductors (less than 6 nH) and capac-itors (less than 0.47 µF) providinghigh efficiency, a small form factor,PCB area, and BOM savings, as wellas support for high-definition DVFS.

Key features include: high-per-formance 70 to 130 MHz programma-ble DC-DC buck converter; ultra-fastdynamic voltage control (DVC) forDVFS — 100X improvement in slewrate (greater than 500 mV/100 ns);small L/C components for land-side/top-side in-package integration;wide output voltage regulation rangeof 0.1 to 1.1V; high efficiency, flatover entire load range; seamless,automatic PFM/PWM operation andphase shedding without hysteresis;and built-in, fast digital currentreporting in less than 1 µs with noexternal components.

Contact: Endura Technologies,LLC, 7310 Miramar Road, SanDiego, CA 92126 % 858-412-2135Web: www.enduratechnologies.com

Endura IntrosTiny EmbeddedVoltageRegulator

Ersa North America, Inc.1779 Pilgrim RoadPlymouth WI 53073 | USAPhone: +1 920 893 1779Fax: +1 920 893 [email protected]

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Ottawa, Ontario, Canada — FRAMOSis now offering Sony Semiconductors’

new STARVIS IMX 327 image sensor,a more sensitive successor to theIMX290. The 2.1 MP sensor, with a1/2.8 in. optical format, has a 1920 x1080 pixel array utilizing a 0.1 mil(2.9 µm) pixel size. The IMX327reaches a frame rate of 60 FPS at 12bits. With its high sensitivity andgood low-light performance, the sen-sor is a great fit for security and sur-veillance applications, as well as forfactory automation and industrialsolutions.

The STARVIS technology bringsa back-illuminated pixel to theIMX327 sensor, providing a sensitivi-ty of 2,376 mV, which is combinedwith an SNR1s1 of 0.18 lux, making

this sensor perfect for tracking andmonitoring under low-light condi-

tions. The sensor delivershigh image quality in thevisible light and near infra -red light spectrums.

High sensitivity, lowdark current noise and nosmear provide excellentimage reproduction and,when combined with im -proved RGB color mosaic fil-ters, the sensor providesexcellent color reproductionwith little to no additionalprocessing. These chips havean electronic rolling shutterwith variable charge-inte-gration time that allowsmore flexibility when cap-turing precisely-illuminatedsnapshots.

To further enhance theimage quality provided by theIMX327, Sony has included a highdynamic range (HDR) feature, withmultiple exposures and digital over-lap. An anti-reflective coating versionis available to enhance light transmis-sion through the sensor cover glass,achieving even higher performancewith a sensitivity of 2,519 mV andSNR1s of 0.17 lux.The sensor has lowpower consumption, supports I/Oswitching and provides LVDS or MIPICSI-2 output interfaces.

Evaluation samples are nowavailable from FRAMOS, with massproduction planned for Q1 2018.Industry and product experts atFRAMOS are available to support

customers with the integration ofthese new sensors in their applica-tions and projects. In addition, thecompany provides support servicesfor development, customization, andlogistics.

Contact: FRAMOS Technology,Inc., 2733 Lancaster Road, Suite210, Ottawa, Ontario, Canada K1B0A9 % 613-208-1082 E-mail: [email protected] Web: www.framos.com


FRAMOS Now Offering Sony’s New

High-Sensitivity 60 FPS Image Sensor

Sony’s STARVIS IMX327 sensor is excellentfor factory automation and surveillance

applications.

Würth: Wireless Power Coilfor Semtech LinkCharge

Waldenburg, Germany — WürthElektronik eiSos has integrated itstransmission coil, WE-WPCC, intoSemtech’s LinkCharge® LP (lowpower) platform, an innovative wire-less charging solution that concur-rently charges multiple, low-power devices using a singletransmitter.

The WE-WPCC seriestrans mission coil uses its NiZnferrite shielding to protect sensi-tive electronics and to concen-trate the magnetic field. The coilis specially designed for reso-nant inductive coupling andallows several receivers to be usedat the same time. Semtech’sLinkCharge LP, with Würth’s trans-mission coil, provides positioning andspatial freedom that allows thecharging of multiple devices.

The windings of the WE-WPCCcoil consist of high-frequency strandedwire with high-permeability shielding.The coil also scores a low resistanceand high Q factor. WE-WPCC 760 308102 308 for resonance solutions is

available from stock, with a design kitand free sample service.

The platform delivers 1W of out-put power to charging devices andspecifically targets low-power applica-tions, including hearing aids, activity

trackers, smart headphones, smartjewelry and clothing, low-power indus-trial devices, portable medical equip-ment, and LED fixtures.

Contact: Würth Elektronik eiSosGmbH & Co. KG, Max-Eyth-Strasse1, 74638 Waldenburg, Germany % +49-7942-945-5186 E-mail: [email protected] Web: www.we-online.de

Semtech LinkCharge platform withWürth transmission coil.

http://www.apec-conf.org

Chester, CT — Inspectis has launched its F30s,a fully-HD digital microscope. The new model isdesigned to be adaptable and versatile, and anall-around good choice for a wide range of visu-al inspection applications.

With excellent image quality, aided by afull range of available stand options and acces-sories, the F30s brings fully-HD, 1080p 60 FPSto SMT electronics assembly inspection.Features include HDMI output, 30:1 zoomoptics with auto-focus and a generous practicalworking distance. The microscope is designed tofunction well even under poor lighting condi-tions. Its 56X screen magnification on a 24 in.(61 cm) monitor can be increased up to 200Xwith auxiliary lenses.

Like the rest of the company’sdigital microscopes, the F30s incor-porates design features that can sig-nificantly reduce the time spent oninspecting parts. Its ergonomicdesign allows the operator to sit com-fortably in a good working position,providing relief to his or her eyes,neck and shoulders.

Inspectis digital microscopesare easy to use, with minimal inter-action needed for controls and set-tings. Basic parameters, including

zoom, brightness and color levels, can be con-trolled by the user through onboard buttons ontop of the device. Additional control functionali-ty can be added using an optional remote con-trol or through dedicated PC software. Anoptional built-in laser pointer aims at the areaof interest and assists in quickly locating it onthe screen. Object handling is aided by a fullrange of accessories, including a selection ofmounting/stand options and ESD protection.

Inspectis instruments are available inNorth America from Ascentech, LLC.

Contact: Ascentech, LLC, 127 Goose HillRoad, Chester, CT 06412 % 860-526-8903 E-mail: [email protected] Web: www.ascentechllc.com


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Blacksburg, VA — VPT, Inc. hasreleased single- and dual-outputSVRSA DC-DC converters, expand-ing its offering of radiation-hard-ened, high-reliability space products.Specifically designed for the harshradiation of space, the SVRSA serieshas been characterized to total ioniz-ing dose (TID) of 100 krad (Si),including enhanced low dose ratesensitivity (ELDRS), and singleevent effects (SEE) performance to85 MeV-cm2/mg.

The SVRSA 6W output seriesoffers a wide input voltage range of18 to 40V, plus 50V transient opera-tion, and is available in single-outputvoltages of 3.3, 5, 12, and 15V, anddual-output voltages of ±5, ±12 and±15V. The series’ topology is an iso-lated, single-output flyback convert-er with the company’s proprietaryradiation-immune magnetic feed-back technology.

Features of the SVRSA seriesinclude input under-voltage lockout,output soft start, current limit andshort circuit protection, and theseries is rated for full power opera-tion up to 257°F (125°C).

Contact: VPT, Inc., 1971 KraftDrive, Blacksburg, VA % 540-552-5000 fax: 540-552-5003 E-mail: [email protected] Web: www.vptpower.com

SVRSA series DC-DC converters.

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Extech Intros Compact EMFMeter for Low Frequencies

Nashua, NH — Extech Instrumentshas launched its EMF510, a single-axis electromagnetic field (EMF)meter optimized for measuringextremely low frequencies (ELF).The compact new meter makes iteasy to measure EMFs in the 30 to300 Hz frequency range, making ituseful for applications that rangefrom utilities to product developmentand engineering.

The EMF510 has an informa-tive, oversized, dual display thatindicates both EMF reading levelsand the selected EMF range. Userscan measure EMF/ELF levels ineither milliGauss (mG) or microTesla(µT) units in two ranges up to 2,000mG (200 µT) with ±5 percent accura-cy. Useful data functions includedata hold, as well as minimum andmaximum readings. A bright back-light adds versatility for testing inthe dark. The auto-power-off func-tion preserves battery life and can bedisabled for extended monitoring.

The pocket-sized EMF510 canbe used by utility companies to meas-ure the EMFs found in the distribu-tion of electricity through power lines

and subsystems. Product develop-ment and electrical engineers canuse the device to quickly assess EMFlevels generated by electrical compo-

nents, such as motors and blowers. Awrist strap is useful for toting, whilean available tripod mount lets theuser set up the meter in the sameway each time, eliminating variabili-ty in routine measurements.

Contact: Extech Instruments, 9Townsend West, Nashua, NH 03063% 603-324-7800 fax: 603-324-7804E-mail: [email protected] Web: www.extech.com

EMF510 handheld EMF meter.

Independence, MO — HEMCO is nowoffering custom fume hoods to collectand exhaust corrosive vapors, heat,steam, and odors. They are availablein 36, 48, 72, and 96 in. (0.9, 1.2, 1.8,and 2.4m) widths. Canopy hoods areavailable in either molded, chemical-resistant, flame-retardant, one-piececomposite resin or welded Type 304stainless steel.

Wall canopy hoods include awall mounting kit. Island canopyhoods have an optional suspendedmounting kit available. Custom sizecanopy hoods can be built to exactsize and design requirements.

HEMCO’s corner canopy hoodsare excellent for maximizing wastedspace in corners and can be eitherwall mounted or suspended from theceiling. Optional corner compositework surface and corner tables arealso available. With any of the compa-ny’s canopy hoods, vapor-proof lights,switches and side and rear enclosurepanels are offered to prevent crossdrafts and to further improve airflow.The hoods can also be fitted withexhaust blowers, ducting and in-lineHEPA or carbon filters.

The company is also offering its

UniLine Casework, which is a line oflaboratory casework that is made ofwelded 18-gauge steel. Base cabinetshave a load capacity of 500 lb (227 kg)per linear foot. The casework’s powdercoating is environmentally friendlyand designed for durability over time.

The equipment is tested independent-ly to be compliant with SEFA 8.

Contact: HEMCO Corp., 711Powell Road, Independence, MO64056 % 800-779-4362 E-mail: [email protected] Web: www.hemcocorp.com

Custom Fume Hoods andLab Casework from HEMCO

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Gardner, MA — Advanced Cable Tieshas introduced Nylon 12 cable ties,molecularly designed to withstandthe harsh rays of the sun and corro-sive outdoor elements, important forsolar and wind power applications,as well as for other extreme-climateenvironments.

Nylon 12 cable ties resist tem-perature fluctuations, are chemicalresistant and insensitive to stresscracking. The smooth edges elimi-nate abrasion damage and do not cut

into panel cables. Low water absorp-tion and high density provide stabili-ty to the cable tie for lasting perform-ance in solar panel systems. The com-pany offers a complete range of sizesfrom 5 to 14 in. (12.7 to 35.6 cm) in con-venient contractor packaging of 100per bag and 1,000 per case.

Contact: Advanced Cable Ties,Inc., 245 Suffolk Lane, Gardner, MA01440 % 800-861-7228 E-mail: [email protected] Web: www.advancedcableties.com

Advanced Cable Ties: LongLife Solar and Wind Power

Wire Management Ties

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Muskegon, MI — Smart VisionLights has introduced its brightestlinear LED light series to date, theLXE300. The new series delivers upto 100,000 lux and incorporates thecompany’s advanced, built-in Multi-Drive™ driver, allowing the light tooperate continuously or in Over -Drive™ strobe mode.

The Multi-Drive also protectsthe LEDs from premature degrada-tion and failure caused by excessiveheat, by regulating the current deliv-

ered to the LEDs and by limitingtheir duty cycle.

Other advanced features includethe ability to connect up to six lightsdirectly (end-to-end with no spacingbetween the lights) to create uniform-output, long linear lights for a fractionof the cost of a monolithic light.

Contact: Smart Vision Lights,2359 Holton Road, Muskegon, MI49445 % 231-722-1199 fax: 231-722-9922 Web: www.smartvisionlights.com


RoHS

B&K Precision LaunchesNew Battery Analyzers

Yorba Linda, CA — B&K Precisionhas introduced two new battery ana-lyzers, models BA6010 and BA6011.Both battery analyzers measure volt-age and resistance of today’s batterytechnologies with high accuracy, res-olution and speed.

These instruments provide aux-iliary measurement parameters,including inductance, capacitance,dissipation factor, impedance, quali-

ty factor, reactance, and phase anglein both degrees and radians.

The BA6010 series is suitablefor characterizing battery chemis -tries that are responsive to 1 kHz ACstimulus signals, such as lead-acid,lithium and alkaline batteries used

in consumer products, electric vehi-cles, power backup, security, and firealarm systems. Model BA6011 sup-ports voltage measurements of bat-tery packs up to 300V, while theBA6010 measures up to 60V and hasa 6V measurement range that is use-ful for battery cell testing.

Features include: 4.3 in. (10.9 cm)LCD screen; trace function for graphi-cal display of voltage and resistancewith onscreen cursor measurements;four-wire Kelvin test leads with faultmonitoring of drive and sense lines;statistical evaluations to compare andsort using nine bins; delta percentagemode for determining the percent dif-ference between batteries; audiblepass/fail indicator tone; up to 50 meas-urements per second; internal, manu-al, bus, and external trigger modes;handler interface; and standard RS-232 and USB interfaces.

Contact: B&K Precision Corp.,22820 Savi Ranch Parkway, YorbaLinda, CA 92887 % 714-921-9095 E-mail: [email protected] Web: www.bkprecision.com

BA6011 battery analyzer.

Smart Vision Lights: Brightest

Linear LED Light Series

Moorpark, CA — TestEquity hasintroduced a compact temperature/humidity chamber, the model 101H.The unit is completely self-containedand does not require an externalwater source or drain.

Available in both bench-top andfloor-standing versions, the model101H is designed for a wide range ofdevice characterization and tests,including mobile phones and tablets,passive and active components, andsmall PCBs.

The model 101H has a 1.1 ft3

(0.03m3) interior workspace and ispowered by a standard 120V, 15Aoutlet. It can simulate humidity from10 to 95 percent, within the range of50 to 185°F (10 to 85°C), limited by a

6 percent dew point. Lower dew pointconditions can be achieved with GN2or dry-air purge options. In tempera-ture-only mode, the chamber has atemperature range of –0.4 to +266°F(–18 to +130°C).

Humidity is generated by Test -Equity’s patent-pending mass-trans-fer vapor generator. This providesbetter humidity stability throughoutthe entire operating range, asopposed to steam generators, and isaccomplished without an exposedwater bath.

With the F4T touchscreen con-troller, the chamber is very easy touse. Ethernet and RS-232 communi-cations are standard. A USB partlets user transfer data log files, pro-file configurations and controller con-figuration files by using a flash drive.GPIB is available as an option.

Additional features include aviewing window with exterior LEDlighting and 3 in. (7.6 cm) access portson the left and right sides. The 101H-B benchtop version can be convertedinto a 101H-F floor-standing versionby the simple addition of a caster base,which bolts to the chamber.

Contact: TestEquity, LLC, 6100Condor Drive, Moorpark, CA 93021% 800-950-3457 fax: 805-498-3733Web: www.testquity.com

101H-B temperature/humiditychamber.

TestEquity Intros CompactTemperature/Humidity

Chamber

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ULT: Extraction Systemfor Flammable Dust

Mequon, WI — ULT has developed aconductive version to add to its LAS260 series of extraction and filtrationsystems.

The new system is suitable forextraction and filtration tasks ofmaterials that may generate flam-mable or explosive dust/air mixtures,e.g. titanium. A specifically designeddevice and filter were created to pre-vent ignition sources within the sys-tem. The modules are electricallygrounded. Electronic components arespecially designed and integrated.

Developed for the removal of air-borne pollutants that are generatedduring laser and welding processes,the mobile system can be moved tovarious workstations or fixed in posi-tion in full production lines. Filterexchanges are simple and quick.

Contact: ULT, LLC, 6000 WExecutive Drive, Suite G, Mequon,WI 53092 414-377-1376 E-mail: [email protected] Web: www.ult-usa.com

LAS 260 extraction and filtration system.

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Minchinbury, Australia — 4D Sys-tems has introduced its smallestLCD module to date, the IoD-09. At0.9 in. (2.3 cm) and powered by a Wi-Fi-enabled Espressif ESP8266 SoC,it is designed for miniature Internetof Things (IoT) projects.

The Internet of Displays is thecompany’s range of miniature, fea-ture-rich products that offer small-color displays with integrated Wi-Fiand a micro-SD/HDC slot. The IoD-09displays full-color images, animationsand icons. The new modules come intwo versions: through-hole (IoD-09TH) and surface mount (IoD-09SM).

The through-hole version isdesigned for hobbyists and pro-sumers, which can be easily integrat-ed into any product. The surfacemount module is aimed at mass pro-duction applications.

The module comes with 802.11b/g/e/I support, as well as WPA/WPA2, WEP/TKIP/AES, and STA/AP/STA+AP/P2P operational modesupport. There are six GPIOs avail-able, allowing digital I/O as well asvarious communication protocols.

Available interfaces include

SPI, I2C, UART and 1-Wire commu-nications. A micro-SD slot allows the

use of off-the-shelf, high-capacitymemory cards from 4 GB to a maxi-mum of 32 GB. FAT16 and FAT32file accesses are supported. The mod-ule also comes with 4 Mb of flashmemory for user application codeand data, as well as 128 kb of SRAM(80 kb available for the user).

Contact: 4D Systems Pty Ltd.,103 Sargents Road, Unit 7,Minchinbury, NSW 2770, Australia +61-2-9625-9714 fax: +61-2-8834-0747 Web: www.4dsystems.com.au

IoD-09SM surface mount miniature LCD module.

4D Systems Launches ItsSmallest Display Module

North Billerica, MA — Aved hasintroduced custom battery packsbuilt to OEM specifications, designedto optimize the performance andpackaging requirements of medicaland mobility applications.

The medical and high-reliabilitybattery packs are built with the celltype and battery chemistry specifical-ly tailored for voltage, cycles, pulserate, capacity, charging, temperature,and packaging as required. The com-pany performs end-of-line verificationand can simulate battery usage,record performance data, characterizethe battery, and provide serializedtest data for each battery pack.

The FDA and IEC 62133-com-pliant battery packs incorporaterobust electronics and have rapidcharge times of one hour to 85 per-cent if necessary. They can provideclean voltage with a typical less than5 percent deviation, 1,000+ cycle

operation, high pulses up to 100A,capacities from 24 to 200V (10 to 100A/hr), and up to 4 kW. The packsoperate in a temperature range of

–22 to +68°F (–30 to +20°C), depend-ing on the application.

Contact: Aved Electronics, Inc.,95 Billerica, MA 01862 800-441-2833 fax: 978-528-5299 E-mail: [email protected] Web: www.aved.com

Medical and high-reliability battery packs.

Aved’s Custom Battery PacksMeet Medical Requirements


http://www.us-tech.com

San Diego, CA — ACCES I/O Products has intro-duced a new dedicated watchdog timer card forPCI Express (PCIe) computer systems, the PCIe-WDG-CSMA. The card can be used to monitor theoperation of application programs, as well as oper-ating systems and can be configured to initiate asystem reset in case of lockup.

In addition, the PCIe-WDG-CSMA can moni-tor a variety of system hardware parameters, suchas voltage, humidity, temperature, and light.Common applications include military and mis-sion-critical devices, industrial automation, assetmanagement and tracking, medical, and embed-ded devices.

The PCIe-WDG-CSMA includes four general-purpose, optically-isolated digital inputs, two isolat-ed FET outputs to control/switch external devices,two non-isolated digital I/Os, six dedicated A/Dinputs, which includes a security light sensor thatcan be used to detect if the darkenedinterior of an enclosure is opened.

Available accessories includecables and screw terminal breakoutadapter boards for quick and easy con-

nectivity. Customization options include conformalcoating, custom software and product labeling.

The PCIe-WDG-CSMA supports most operat-ing systems and includes a free Windows andLinux and macOS compatible software package.This package contains sample programs andsource code in C#, Delphi and Visual C++ for 32-and 64-bit Windows.

Also provided is a graphical setup program inWindows. Linux support includes installation filesand samples for programming from user levelthrough an open-source kernel driver. Third partysupport includes a Windows standard DLL interfaceusable from the most popular application programs,and includes LabVIEW VIs. Embedded OS supportincludes the family of Windows operating systems.

Contact: ACCES I/O Products, Inc., 10623Roselle Street, San Diego, CA 92121 % 858-550-9559 fax: 858-550-7322 E-mail: [email protected] Web: www.accesio.com


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Phoenix, AZ — Avnet has introducedthe next generation of its trustedplatform module (TPM) securityperipheral module (Pmod). The cost-effective and production-ready com-ponent enables advanced hardwareroot-of-trust platform integrity,remote attestation and cryptographicservices for industrial Internet ofThings (IoT) devices. Applicationsinclude factory automation, smartcities, smart grids, and health care.

Based on Infineon’s OPTIGATPM SLP9670 2.0 security solution,Avnet’s TPM V2.0 security Pmod con-tains an enhanced serial peripheralinterface (SPI) to the Zynq® Ultra -Scale+™ MPSoC from Xilinx. This isincluded on Avnet’s Ultra Zed™ sys-tem-on-module (SoM).

Cybersecurity is a make-or-breakissue with today’s IoT solutions. Bycombining the technology fromInfineon and Xilinx, Avnet is offeringdesigners the security needed for edge-to-cloud connections in a cost-effectivepackage that is easy to implement.

Contact: Avnet, Inc., 2211 S.47th Street, Phoenix, AZ 85034 % 480-643-2000 E-mail: [email protected] Web: www.avnet.com

TPM V2.0 security peripheralmodule (Pmod).

AvnetReleasesUpgradedModule forIoT Security

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Gilching, Germany — Electronic Assembly (EA) hasexpanded its DOG family of displays to include multi-colored modules. The signal colors can be mixed andchanged. The DOG family of display modules has anumber of distinctive features, such as versatility, acompact size and low energy consumption.

The DOGM240-6 series displays have a resolutionof 240 x 64 pixels, which can generate eight lines of 40characters each or four lines of 20 large-text characters.The displays’ full-graphic mode allows a mix of text andimages to be shown.

The modules contain a UC1611s controller and haveintegrated graphics RAM. For a high-contrast image, the

company’s LCD-Supertwist or FSTN displays are a goodchoice. There are four different LED backlight optionsavailable: amber, white and two-color green/red, as wellas the new three-color white/red/green option. The newmodules are also extremely energy-efficient.

The modules operate with voltages of 2.7 to 3.3V.Current consumption is typically 500 µA. For optimalLED lighting, a further 10 to 150 mA is enough.Interface options, such as three-wire serial peripheralinterface (SPI), four-wire SPI and I2C, are available.

The displays can be soldered directly onto thePCB without any complicated assembly. The displaysare suitable for harsh environments and operate in a

temperature range of –4 to +158°F(–20 to +70°C). Accessories include aUSB test board 9780-3 and aWindows simulator, as well as anattachable touch panel and ZIF con-nector.

Contact: Electronic AssemblyGmbH, Zeppelinstrasse 19, 82205Gilching, Germany % +49-0-8105-77-8090 fax: +49-0-8105-77-8099 E-mail: [email protected] Web: www.lcd-module.com

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Smyrna, GA — Murata has introducedits OKI-78SR-E series of three-termi-nal, non-isolated DC-DC converters,designed for use in harsh environ-ments. The board-mounted powermodules offer an efficient replacementfor 78xx linear regulators.

When powered from a 24Vsource, the 12V OKI-78SR-12/1.0-W36E-C device is 95 percent efficient.This eliminates the need for a heatsink, reducing cost and complexityduring the manufacturing process.

Incorporating the latest PWMtechnologies for power conversion,the OKI-78SR-E series offers effi-ciency, high reliability and variousoptional packaging configurations.The series can be used in almost any

application that requires a singleoutput of 3.3, 5 or 12V.

Features include: three moduleswith a fixed single output of 3.3 and5V at 1.5A and 12V at 1A; vertical orhorizontal packages with a linearregulator compatible pinout; operat-ing temperature range of –40 to+185°F (–40 to +85°C); short circuitand over-current protection; anddynamic load response. The series isalso compliant with RoHS-6 and isUL-approved.

Contact: Murata ElectronicsNorth America, Inc., 2200 LakePark Drive, Smyrna, GA 30080 % 770-436-1300 fax: 770-436-3030Web: www.murata.com

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www.xjtag.comAdvertorial

Finisarwww.xjtag.com

The boards are built at Finisar’smanufacturing partner Fabrinet, andare tested at various stages usingboundary scan as well as as X-ray,optical inspection and in-circuit tests.“We want to identify any defects asearly as possible to ensure optimumefficiency,” says Finisar Test EngineerGili Goldfarb. “We are using XJTAGboundary scan immediately after thesoldering process to pinpoint defectsquickly and also to program deviceson the board.”

Goldfarb explains that Finisar firstcontacted local XJTAG distributorPolaris Systems Engineering to helptest connections to BGA devices,but is now taking advantage ofXJTAG to test many other devicesincluding an adjustable power supplyand analogue circuitry. “We have fullaccess to the pins of devicesconnected to the boundary scanchain such as the FPGA, configurationFlash and Ethernet PHY, and areable to test other chips connectedto the FPGA by emulating bussignals. In this way, XJTAG gives usflexibility to read and check manyanalogue signals on the board.”

Controlling and monitoring thepins on boundary scan devices iseasy using XJTAG’s circuitvisualisation and debugging tool,XJAnalyser. Test engineers can getlow-level access to setup pinstates and manipulate busses. They can also take advantage of thecolour-coded graphics to assesslogic levels or other properties suchas input/output on the screen in real time.

Finisar’s Gili Goldfarb alsohighlights easy code developmentas a factor that has helped thecompany maximise the return on itsinvestment in boundary scan.Creating a high-level program togenerate test vectors is straightforwardusing XJTAG’s scripting languageXJEase, and permits complex teststhat are not possible with otherboundary scan systems. “XJEasesimplifies test development, and wecan easily adjust the code to suitour purposes,” he adds.

The Finisar test engineering teamuses the XJDeveloper developmentenvironment in-house to create a setof XJTAG tests for each design.These tests are then passed toFabrinet to test production units

using XJRunner, a specialisedruntime environment. XJRunner isoptimised for production, andexecutes pre-compiled XJDeveloperprojects including testing and in-system programming.

Having initially introducedboundary scan to overcome thespecific challenge presented by BGAdevices, Finisar is now maximisingthe return on its investment inXJTAG. “XJTAG delivers an excellentprice/performance ratio and hashelped us realise the potential toachieve very high test coverage. Weare now reaping the rewards ofusing more boundary scancomponents and focusing ontestability at an early stage ofdesign,” concludes Gili Goldfarb.

“We are using XJTAG boundary scan immediately after thesoldering process to pinpoint defects quickly and also to programdevices on the board. XJTAG gives us flexibility to read and checkmany analogue signals on the board.”“XJEase simplifies test development, and we can easily adjust

the code to suit our purposes.”“XJTAG delivers an excellent price/performance ratio and has

helped us realise the potential to achieve very high test coverage.We are now reaping the rewards of using more boundary scancomponents and focusing on testability at an early stage of design.”

Finisar, a global optical communications technology leader, isresponsible for designing equipment such as reconfigurableoptical add-drop multiplexer (ROADM) linecards based onWavelength Selective Switching (WSS) technology. ROADMsboost efficiency and flexibility in metro optical networks byswitching data traffic at the wavelength layer. The boards arehigh-value items built around a microprocessor systemembedded in an FPGA.

XJTAG Boundary Scan Delivers beyond Expectations for Optical Communications Leader

“Finisar, which produces high-performance optical communication linecards, initially invested in XJTAG®

boundary scan to overcome a particular test challenge. In practice, XJTAG’s ease of use and powerfulfeatures provided much greater scope to increase coverage and streamline testing to ensure only perfectboards leave the factory.”

DataBank

Company Finisar Corporation, HQ USANature of Global technology leader business in optical communicationsMain Fiber optic subsystems and products components for high-speed voice,

video & data communications fortelecommunications, networking,storage, wireless, and cable TV

Customers Global datacom & telecom OEMsLocation Azrieli Center Holon, Israel.

Headquarters in the USA; R&D facilities, manufacturing sites, and sales offices worldwide.

Web site www.finisar.com

opinion Gili GoldfarbTest EngineerFinisar Israel

3D SENSING

WIRELESS & CABLE TV

MILITARY & AEROSPACE LABORATORY / R&D

DATA CENTER & HIGH PERFORMANCE COMPUTINGENTERPRISE, ACCESS & TRANSPORT INDUSTRIAL

STORAGE

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Liberty, SC — Cornell Dubilier Electronics (CDE) haslaunched its THA and THAS series Thinpack capac-itors, which contain the company’s highest-density,low-profile aluminum electrolytic technology.

The 185°F (85°C) THA series Thinpack capaci-tors are only 0.3 in. (8.2 mm) thick, while the 221°F(105°C) THAS series capacitors are 0.35 in. (9 mm)thick. This is comparable in height to V-chip elec-trolytics, tantalums and board-mounted axials, yetoffer much higher bulk storage energy density.

A single THA/THAS capacitor can replacemany SMT, axial or radial aluminum electrolytic orsolid tantalum capacitance arrays. By substitutingthese devices, engineers can design smaller products

with simpler assembly and higher reliability.Unlike cylindrical electrolytics, THA/THAS

capacitors have sealed, laser-welded, aluminumcases that eliminate the need for space-wastingend seal gaskets. The design includes a valve tovent hydrogen gas, reducing swelling by relievinginternal pressure.

These capacitors can offer significant cost,weight and space savings over a comparably ratedbank of SMT or axial aluminum electrolytic capac-itors. This includes requiring about 70 percent lessboard space than alternatives, resulting in areduction of overall board size and weight.

The use of a single component, instead of many,and fewer connections improves over-all circuit reliability. The THA is ratedat 3,000 hours of life at 185°F (85°C),while the THAS is rated at 3,000hours of life at 221°F (105°C). Valuesrange from 140 µF at 450 VDC to18,000 µF at 10 VDC, with 72 differentcapacitance/voltage combinationsavailable for each series.

Contact: Cornell DubilierElectronics, Inc., 140 TechnologyPlace, Liberty, SC 29657 % 864-843-2626 Fax: 864-843-2402 Web: www.cde.com


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Cornell Dubilier (CDE) Highest-DensityCapacitors Now Available

Hampton, NH — XMOS is now offer-ing its xCORE VocalFusion speakerlinear evaluation kit as part of itsrange of far-field voice capture solu-tions. Based on the XMOS Vocal -Fusion XVF3100 voice processor, thekit is designed for developers whointegrate voice interfaces into flat orlinear consumer electronics for pro-cessing by a cloud-based speechrecognition system or local applica-tion processor, even in complexacoustic environments.

The XVF3100 voice processordelivers sophisticated voice digitalsignal processing (DSP) including afull duplex acoustic echo canceller(AEC) with barge-in capability thatenables users to interrupt or pause adevice that is playing music, and anadaptive beamformer that followsthe speaker.

With support for Sensory’sTrulyHandsfree™ keyword triggertechnology, the XVF3100 provides aflexible and cost-effective, always-onvoice interface in a single device.

Contact: XMOS, 1 MerrillIndustrial Drive, Suite 6, Hampton,NH 03842 % 617-500-0353 E-mail: [email protected] Web: www.xmos.com

VocalFusion speaker linear evaluation kit, XK-VF3100-L33.

XMOS Adds toIts Far-FieldVoice CaptureSolutions

THA/THAS series Thinpack capacitors.

http://www.yudu.com


http://www.tomkenindustries.com

Bannockburn, IL — Changing tech-nologies that are driving the elec-tronics industry will take centerstage throughout the IPC APEXEXPO 2018 technical conference andprofessional development sessions.The exhibition will take placeFebruary 24 to March 1 at the SanDiego Convention Center in SanDiego, California.

Keeping with the event’s theme,“Succeed at the Velocity ofTechnology,” the technical confer-ence will include approximately 80technical papers detailing originalresearch and innovations from indus-try experts around the world.Subject-matter experts will covertopics in the areas of board fabrica-tion and design, electronics assemblyand test.

“As the importance of automa-tion and data exchange in manufac-

turing grows at an exponential ratewith increasing miniaturization ofassemblies and the assembly of newcomponents, the complexity of designincreases, so designers and engineersneed to keep current. This is why theindustry needs the education thatIPC APEX EXPO 2018 will offer,”said Jasbir Bath, IPC APEX techni-cal conference director. “Our pro-grams are not theoretical — they’regrounded in, and driven by, real-world application. Attendees willaccess new research on materialsand processes, learn more abouttrending materials, applications andprocesses, such as Industry 4.0 andwearables, and address real-worldproblems,” Bath added.

IPC APEX’s full- and half-dayprofessional development courseswill blend traditional electronicsindustry topics with new develop-

ments, delivered by corporate tech-nologists, consultants, training cen-ter staff and university faculty.Attendees can choose an array ofleading topics, such as: PCB fabrica-tion troubleshooting; dispensing andjetting; printing; manufacturingyield, defect analysis, and failureanalysis; reliability; and design for

excellence (DFX).In addition, IPC APEX has

many free activities, including tech-nical BUZZ sessions, poster presen-tations and an opening keynote titled“Game Changers: Technology andthe Next Big Disruptions” by founderand director of Google Ideas at


hi-TeCh evenTShi-TeCh evenTS

MORE SHOWS: www.topline.tv/tradeshows.cfm

2018EDITORIAL AND

TRADESHOW CALENDAR

ISSUE EDITORIAL SHOW DATE LOCATION

Jan/Feb Test & MeasurementElectronics West/MDM PP

DesignConATX/ Electronics West/MDM

Jan. 30-Feb. 1Feb. 6-8

Santa Clara, CAAnaheim, CA

March Assembly & ProductionAPEX PP

APEXAPECAdvanced Design & Mfg Expo

Feb. 27-March 1March 6-8March 7-8

San Diego, CASan Antonio, TXCleveland, OH

April/May SMT & AssemblyNepcon China PPWire Processing Tech PPEDS PP

BIOMEDevice Boston/ESCNepcon China Wire Processing TechEDS

April 18-19April 24-26May 9-10May 15-18

Boston, MAShanghai, ChinaMilwaukee, WILas Vegas, NV

June Test & AutomationSMT/Hybrid/PKG PPATX East /MDM PP

SMT/Hybrid/PKGATX East /MDM

June 5-7June 12-14

Nuremberg, GermanyNew York, NY

July Production & PackagingSemicon West/Intersolar PP

SEMICON West/Intersolar July 10-12 San Francisco, CA

August PCB & Assembly Nepcon South China PP

Nepcon South ChinaPCB WestAutotestcon

Aug. 28-30Sept. 11-13Sept. 18-20

Shenzhen, ChinaSanta Clara, CANational Harbor, MD

September Test & AutomationSMTAI PP

IMAPS SMTAIThe Assembly ShowMDM Minneapolis

Oct. 9-11Oct. 17-18Oct. 23-25Oct. 31-Nov. 1

Pasadena, CARosemont, ILRosemont, IL Minneapolis, MN

October Components & Distributionelectronica PP

FABTECHelectronicaATX Montreal

Nov. 6-8Nov. 13-16Nov. 14-15

Atlanta, GAMunich, GermanyMontreal, Quebec

Nov/Dec Test & MeasurementE

BIOMEDevice, ESC

Dec. 5-6F

San Jose, CAA

PP = Product Preview

Trade Show Calendar

IPC APEX Highlights Accelerating Technological Change

April 18-19, 2018, BIOMEDevice Boston. *Boston Convention & Exhibition Center,

Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405

% 310-445-4200 Web: www.design-manufacturing-new-england.designnews.com

January 31-February 1, 2018, DesignCon. * Santa Clara Convention Center, Santa

Clara, CA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 415-947-

6105 E-mail: [email protected] Web: www.designcon.com

May 15-18, 2018, EDS. *The Mirage Las Vegas, Las Vegas, NV. Contact: EDS, 1111

Alderman Drive, Suite 400, Alpharetta, GA 30005 % 312-648-1140 fax: 312-648-4282

E-mail: [email protected] Web: www.edsconnects.com

June 5-7, 2018, SMT/Hybrid/Packaging. *Nuremberg Exhibition Centre, Nuremberg,

Germany. Contact: Mesago Messe Frankfurt GmbH, Rotebuehlstrasse 83-85, D-70178

Stuttgart, Germany % +49-711-61946-0 fax: +49-711-61946-91 E-mail: [email protected]

Web: www.smthybridpackaging.com

April 18-19, 2018, Design & Manufacturing New England. *Boston Convention &

Exhibition Center, Boston, MA. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica,

CA 90405 % 310-445-4200 Web: www.design-manufacturing-new-england.designnews.com

March 4-8, 2018, APEC. *Henry B. Gonzalez Convention Center, San Antonio, TX.

Contact: Courtesy Associates, 2025 M Street NW, Suite 800, Washington D.C. 20036

% 202-973-8664 E-mail: [email protected] Web: www.apec-conf.org

May 8-10, 2018, SEMICON Southeast Asia. * Malaysia International Trade &

Exhibition Centre (MITEC). Contact: SEMI, 673 S Milpitas Boulevard, Milpitas, CA 95035

% 408-943-6900 fax: 408-428-9600 E-mail: [email protected] Web: www.semiconchina.org

February 13-15, 2018, The LED Show. * Long Beach Convention Center, Long Beach,

CA. Contact: PennWell Corp., 1421 S Sheridan Road, Tulsa, OK 74112 % 918-835-3161

Web: www.strategiesinlight.com

May 9-10, 2018, EWPTE. *Wisconsin Center, Milwaukee, WI. Contact: Expo Productions,

Inc., 510 Hartbrook Drive, Hartland, WI 53029 % 262-367-5500

E-mail: [email protected] Web: www.epishows.com

March 7-8, 2018, ADM Cleveland. * Huntington Convention Center of Cleveland,

Cleveland, OH. Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405

% 310-445-4200 Web: www.admcleveland.com

February 6-8, 2018, MD&M West. * Anaheim Convention Center, Anaheim, CA.

Contact: UBM Canon, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200

Web: www.mdmwest.mddionline.com

March 14-16, 2018, SEMICON China. * Shanghai New International Exposition Centre.

Contact: SEMI, 673 S Milpitas Boulevard, Milpitas, CA 95035 % 408-943-6900

fax: 408-428-9600 E-mail: [email protected] Web: www.semiconchina.org

June 10-15, 2018 IEEE/MTT-S International Microwave Symposium * Pennsylvania

Convention Center, Philadelphia, PA. Contact: IEEE, 3 Park Avenue, 17th Floor, New York,

NY 10016 % 732-562-3878 E-mail: [email protected] Web: www.ims2018.org

February 27-March 1, 2018, Embedded World. *NürnburgMesse, Nuremburg,

Germany. Contact: NürnburgMesse GmbH, Messezentrum, 90471, Nuremburg, Germany,

% +49-9-11-86-06-0 Web: www.embedded-world.de

April 24-26, 2018, NEPCON China. *Shanghai World EXPO Exhibition & Convention

Center, Shanghai, China. Contact: Reed Exhibitions (Shanghai) Co., Ltd., 42F

Intercontinental Center, 100 Yutong Road, Zhabei District, Shanghai, 200070

% +86-21-2231-7000 fax: +86-21-2231-7181 E-mail: [email protected]

Web: www.nepconchina.com

February 27-March 1, 2018, IPC APEX Expo. *San Diego Convention Center,

San Diego, CA. Contact: IPC, 3000 Lakeside Drive, 105 N, Bannockburn, IL 60015

% 847-615-7100 fax: 847-615-7105 Web: www.ipcapexexpo.org

June 12-14, 2018, MD&M East. *Jacob K. Javits Convention Center, New York, NY.

Contact: UBM, 2901 28th Street, Suite 100, Santa Monica, CA 90405 % 310-445-4200

Web: www.mdmeast.mddionline.com

June 19-22, 2018, automatica. * Munich Expo Fairgrounds, Munich, Germany. Contact:

Messe München GmbH, Messegelande, 81823 Munich, Germany % +49-89-949-20720

fax: +49-89-949-20729 E-mail: [email protected] Web: www.automatica-munich.com

automatica ShowcasesRobotic Breakthroughs

Munich, Germany — Robots are nowmoving into service industries, work-ing collaboratively with humans, inlogistics, agriculture, retail, hospitali-ty, and many other sectors. InMunich, from June 19 to 22, automat-ica will exhibit a range of new devel-opments in service robotics and howthese robots are seeing strong growth.

In logistics, rising customerexpectations and lack of labor is lead-ing companies to investigate auto-mated goods-to-person picking tech-nologies. Advances in semantic map-ping are enhancing robot perform-

ance in active object search and evenin the complex task of shelf-filling.

The most valuable servicerobots reside in the medical domainand the market is expected toincrease by 25 percent per year onaverage over the next four years,according to the InternationalFederation of Robotics (IFR). Servicerobots are most commonly used insurgical applications, but in logisticsexperts believe they may have thegreatest potential — reducing run-ning costs in an average hospital by



Shanghai, China — More than70,000 members of the electronicsmanufacturing industry are expect-ed to descend upon Shanghai forSEMICON China 2018. To be heldMarch 14-16 at the Shanghai NewInternational Expo Centre (SNIEC),the exhibition will bring together topexecutives and technologists in sixexhibition halls, the most ever in theevent’s 30-year history. Key focusareas include smart automotive andsmart manufacturing, green tech,advanced technology, and power andcompound semiconductors.

Staged in conjunction withSEMICON China, CSTIC 2018 hasranked among the largest and mostcomprehensive annual semiconduc-tor technology conferences in Chinasince 2000. March 11 and 12, CSTICwill include nine symposiums cover-

ing all aspects of semiconductor tech-nology, with a focus on manufactur-ing and advanced technology.

SEMICON China will alsoinclude the SIIP tech innovation andinvestment forum. SIIP is a keyinternational platform for semicon-ductor industry investment inChina. Informed by China’s IC policyto fund key semiconductor sectors,leaders of China’s national IC fundand municipal IC funds will joinleaders from global investment insti-tutions to discuss opportunities insemiconductor investment and newapplications.

A smart manufacturing forumwill address automation, product

tractability, cost and cycle time reduc-tion, enhancements in productivityand yield, and efficiency improve-ments in front- and back-end factories.

With more than 10 fabs nowunder construction in China, thecountry’s semiconductor industry isentering a stage of rapid growth. In agreen high-tech facility forum, greentech leaders will discuss how Chinacan improve factory design and con-struction, optimize energy efficiencyof semiconductor manufacturingequipment, enhance machine plat-form stability, manage chemicalsand gas, treat wastewater, andimprove risk management.

SEMICON China will also

showcase three themed pavilions. Atthe IC manufacturing pavilion visi-tors will see products, technologiesand manufacturing solutions focusedon serving China’s fabless IC com-munity, from design to final manu-facturing. The LED and sapphirepavilion will show how China hasbecome the world’s largest sapphiremanufacturing center. The ICMTIApavilion will showcase the IC materi-al industry’s capabilities to supportsemiconductor industry growth.

Contact: SEMI, 673 S MilpitasBoulevard, Milpitas, CA 95035 % 408-943-6900 fax: 408-428-9600 E-mail: [email protected] Web: www.semiconchina.org r


Record SEMICON China Targets Industry Growth

MEETINGS & COURSESFEBRUARY 24 – MARCH 1

CONFERENCE & EXHIBITIONFEBRUARY 27 – MARCH 1

SAN DIEGOCONVENTION CENTERCALIFORNIA > USA

TECHNOLOGYOF

SUCCEED AT THE

GET UP TO SPEED WITH INDUSTRY-LEADING EDUCATION Technology shifts fast—go in new directions with the IPC APEX EXPO 2018 education program, featuring timely topics shared by industry peers, experts, and visionaries.

>> Explore the challenges to developing reliable products.>> Leverage new research on materials and processes to develop fresh approaches.

>> Learn more about trending materials, applications and processes such as wearables/printed electronics and jetting/dispensing.

>> Leave with applicable information from industry insiders for success today and tomorrow!

Our Keynote Speaker Will Accelerate InspirationJared Cohen, founder and director of Google Ideas at Google and now CEO of Jigsaw (its successor arm with Alphabet Inc.).Game Changers: Technology and the Next Big Disruptions

IPCAPEXEXPO.ORG#IPCAPEXEXPO

VISIT IPCAPEXEXPO.ORG FOR MORE INFORMATION

Google and now CEO of Jigsaw,Jared Cohen.

Technology is reshaping nearlyevery aspect of our lives, especiallybusiness, communications, enter-tainment, and politics. Named one ofTIME magazine’s “100 MostInfluential People,” Cohen has spenthis career using technology to solveseemingly intractable problems.

After studying at Stanford andOxford as a Rhodes Scholar, Cohenbecame the youngest person to serveon the U.S. State Department’s poli-cy planning staff. In 2010, he wasrecruited by Google’s then-CEO EricSchmidt, whom Cohen currentlyadvises, to create Google Ideas. Theinfluential think tank expanded tobecome the technology incubator nowknown as Jigsaw and is housed inGoogle’s parent company, Alphabet.

Contact: IPC, 3000 LakesideDrive, 105 N, Bannockburn, IL60015 % 847-615-7100 fax: 847-615-7105 Web: www.ipcapexexpo.org r

IPC APEX...Continued from previous page

up to 20 percent.Exoskeletons are also seeing

strong growth. These robot suitsenable industrial workers to stay fitand healthy and provide ergonomicsupport for heavy manual labor.Forerunners in this area includeSwiss startup Noonee, Laevo and theEU-funded SPEXOR and Robo-Mateprojects.

The sales value of professionalservice robots worldwide was $4.67billion in 2016. Strong growth opensthe door to the development of a hostof enabling technologies, includingsoftware solutions, the current goalof the EU-funded RobMoSys project.It also throws into sharp focus theneed for effective human-robot inter-action, particularly as service robotsfor personal and domestic use gainpopularity. More than 42 million con-sumer robots are expected to enterour homes before the end of thedecade, according to IFR estimates.

Contact: Messe MünchenGmbH, Messegelande, 81823Munich, Germany % +49-89-949-20720 fax: +49-89-949-20729 E-mail: [email protected] Web: www.automatica-munich.com r

automatica in MunichContinued from previous page

http://WWW.IPCAPEXEXPO.ORG


Advertiser..................................Page No. Advertiser..................................Page No. Advertiser...................................Page No.

ADVERTISER’S INDEXACCULOGIC . . . . . . . . . . . . . . . . . . . . . . . .33

ACL STATICIDE . . . . . . . . . . . . . . . . . . . . .28

ADI AMERICAN DISTRIBUTORS . . . . . .14

ADM CLEVELAND . . . . . . . . . . . . . . . . . . .103

ADVANCED INTERCONNECTIONS . . . .48

ADVANCED TEST EQPT RENTAL . . . . .60

AMERICAN HAKKO PRODUCTS . . . . . . .23

ANDA TECHNOLOGIES USA . . . . . . . . . .49

APEC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .102

APEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113

APOLLO SEIKO . . . . . . . . . . . . . . . . . . . . .96

ASM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

ATX WEST . . . . . . . . . . . . . . . . . . . . . . . . . .108

AVEN TOOL . . . . . . . . . . . . . . . . . . . . . . . .86

AVEN TOOL . . . . . . . . . . . . . . . . . . . . . . . .87

BETA LAYOUT USA . . . . . . . . . . . . . . . . . .10

BLUE RING STENCILS . . . . . . . . . . . . . . . 3

BOFA AMERICAS . . . . . . . . . . . . . . . . . . . .84

BTU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41

CAMI RESEARCH . . . . . . . . . . . . . . . . . . .17

CAMI RESEARCH . . . . . . . . . . . . . . . . . . .62

CICOIL . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77

COGISCAN . . . . . . . . . . . . . . . . . . . . . . . . .42

COMET LAB ONE . . . . . . . . . . . . . . . . . . . . 5

CONECSUS . . . . . . . . . . . . . . . . . . . . . . . . .22

CORELIS . . . . . . . . . . . . . . . . . . . . . . . . . . .24

CORNELL DUBLIER . . . . . . . . . . . . . . . . .63

COUNT ON TOOLS . . . . . . . . . . . . . . . . . .42

COUNT ON TOOLS . . . . . . . . . . . . . . . . . .96

CREATIVE ELECTRON . . . . . . . . . . . . . . .13

CYBEROPTICS . . . . . . . . . . . . . . . . . . . . . .59

DATA DELAY DEVICES . . . . . . . . . . . . . .114

DEN-ON USA . . . . . . . . . . . . . . . . . . . . . . .53

DESIGN-2-PART SHOWS . . . . . . . . . . . . .104

DIGI-KEY . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

DL TECHNOLOGY . . . . . . . . . . . . . . . . . . .38

DOVE ELECTRONIC COMPONENT . . . .11

ECD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

ELANTAS . . . . . . . . . . . . . . . . . . . . . . . . . . .94

ELECTRONIC ASSEMBLY GmbH . . . . . .70

EMI FILTER . . . . . . . . . . . . . . . . . . . . . . . .105

ERSA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101

ESSEMTEC . . . . . . . . . . . . . . . . . . . . . . . . .83

EUBANKS ENGINEERING . . . . . . . . . . . .55

EXATRON . . . . . . . . . . . . . . . . . . . . . . . . . .94

FANCORT INDUSTRIES . . . . . . . . . . . . . .70

FEEDER FINGER . . . . . . . . . . . . . . . . . . . .92

FLEXLINK SYSTEMS . . . . . . . . . . . . . . . .88

FOSTER AND JAMES . . . . . . . . . . . . . . . .106

FUJI AMERICA . . . . . . . . . . . . . . . . . . . . . .19

GLENBROOK TECHNOLOGIES . . . . . . .68

GOWANDA ELECTRONICS . . . . . . . . . . .56

HAMMOND MFG . . . . . . . . . . . . . . . . . . . .51

HANWHA TECHWIN . . . . . . . . . . . . . . . . .25

HELUKABEL . . . . . . . . . . . . . . . . . . . . . . . .27

HEMCO . . . . . . . . . . . . . . . . . . . . . . . . . . . .100

INGUN USA . . . . . . . . . . . . . . . . . . . . . . . . .64

INOVAXE . . . . . . . . . . . . . . . . . . . . . . . . . . .66

IPTE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

IRONWOOD ELECTRONICS . . . . . . . . . .105

JANOME INDUSTRIAL . . . . . . . . . . . . . . .84

JNJ INDUSTRIES . . . . . . . . . . . . . . . . . . . .34

JTAG TECHNOLOGIES . . . . . . . . . . . . . . .44

JUKI AUTOMATION SYSTEMS . . . . . . . .29

KEYSTONE ELECTRONICS . . . . . . . . . . .73

KIC THERMAL . . . . . . . . . . . . . . . . . . . . . .35

KOH YOUNG . . . . . . . . . . . . . . . . . . . . . . . . 9

KOKI SOLDER AMERICA . . . . . . . . . . . . .40

KYZEN . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43

LENTHOR ENGINEERING . . . . . . . . . . . .85

MACHINE VISION PRODUCTS . . . . . . . .61

MASTER APPLIANCE . . . . . . . . . . . . . . . . 8

MB MANUFACTURING . . . . . . . . . . . . . . .20

MENTOR A SIEMENS BUSINESS . . . . . .74

METCAL . . . . . . . . . . . . . . . . . . . . . . . . . . .89

MICRO CONTROL COMPANY . . . . . . . . .26

MICROCARE . . . . . . . . . . . . . . . . . . . . . . . .30

MID-AMERICA TAPE & REEL . . . . . . . . .33

MILL-MAX MFG . . . . . . . . . . . . . . . . . . . . .36

MILL-MAX MFG . . . . . . . . . . . . . . . . . . . . .37

MIRTEC . . . . . . . . . . . . . . . . . . . . . . . . . . . .57

MOLDED FIBERGLASS TRAY . . . . . . . . .76

MTA AUTOMATION . . . . . . . . . . . . . . . . . .68

MYCRONIC . . . . . . . . . . . . . . . . . . . . . . . . .45

NATHAN TROTTER . . . . . . . . . . . . . . . . . .80

NEU DYNAMICS . . . . . . . . . . . . . . . . . . . . 8

NORCOM SYSTEMS . . . . . . . . . . . . . . . . . .104

NORDSON ASYMTEK . . . . . . . . . . . . . . . .39

NORDSON DAGE . . . . . . . . . . . . . . . . . . . .115

NORDSON MARCH . . . . . . . . . . . . . . . . . .94

NTE ELECTRONICS . . . . . . . . . . . . . . . . .12

OMRON MICROSCAN . . . . . . . . . . . . . . . .32

OPTICAL CONTROL . . . . . . . . . . . . . . . . .75

OPTIMAL ELECTRONICS . . . . . . . . . . . . .79

PACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .90

PANASONIC FACTORY SOLUTIONS . . .81

PATLITE . . . . . . . . . . . . . . . . . . . . . . . . . . .95

PDR XYTRONIC . . . . . . . . . . . . . . . . . . . . .46

PICO ELECTRONICS . . . . . . . . . . . . . . . . .92

PI-PHYSIK . . . . . . . . . . . . . . . . . . . . . . . . . .52

PLASMA ETCH . . . . . . . . . . . . . . . . . . . . . .76

PRO-LINE . . . . . . . . . . . . . . . . . . . . . . . . . .54

PUREX NORTH AMERICA . . . . . . . . . . . .50

PVA TEPLA AMERICA . . . . . . . . . . . . . . .60

RCD COMPONENTS . . . . . . . . . . . . . . . . .116

REHM THERMAL SYSTEMS . . . . . . . . . .93

RICH SALES INT'L . . . . . . . . . . . . . . . . . . .50

SAKI AMERICA . . . . . . . . . . . . . . . . . . . . .31

SCHLEUNIGER . . . . . . . . . . . . . . . . . . . . .18

SCIENSCOPE . . . . . . . . . . . . . . . . . . . . . . .69

SEHO SYSTEMS GmbH . . . . . . . . . . . . . . .48

SEIKA MACHINERY . . . . . . . . . . . . . . . . .78

SHENMAO GROUP . . . . . . . . . . . . . . . . . .82

SIERRA ELECTRONICS . . . . . . . . . . . . . .36

SIKAMA INTERNATIONAL . . . . . . . . . . .46

SMART SONIC . . . . . . . . . . . . . . . . . . . . . .47

SMT NUREMBERG . . . . . . . . . . . . . . . . . .107

SOLDERSTAR . . . . . . . . . . . . . . . . . . . . . . .30

SPEA AMERICA . . . . . . . . . . . . . . . . . . . . .65

SPECIALIZED COATING SERVICES . . .97

SPECIALTY COATING SYSTEMS . . . . . . 6

SUNSTONE CIRCUITS . . . . . . . . . . . . . . .21

TECHNICA . . . . . . . . . . . . . . . . . . . . . . . . .99

TEXMAC . . . . . . . . . . . . . . . . . . . . . . . . . . .90

THE BRANFORD GROUP . . . . . . . . . . . . .72

TOMKEN INDUSTRIES . . . . . . . . . . . . . . .111

TOPLINE . . . . . . . . . . . . . . . . . . . . . . . . . . .114

TOPLINE VIBRATION ENGINEERING .114

TOTAL POWER INT'L . . . . . . . . . . . . . . . .56

TRANSITION AUTOMATION . . . . . . . . . .38

US TECH . . . . . . . . . . . . . . . . . . . . . . . . . . .106

VI TECHNOLOGY . . . . . . . . . . . . . . . . . . .67

VIRTUAL INDUSTRIES . . . . . . . . . . . . . . .98

VISCOM . . . . . . . . . . . . . . . . . . . . . . . . . . . .71

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WEST BOND . . . . . . . . . . . . . . . . . . . . . . . .40

XJTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . .109

YAMAHA . . . . . . . . . . . . . . . . . . . . . . . . . . .15

YUDU MEDIA . . . . . . . . . . . . . . . . . . . . . . .110

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In addition to a full line of standard components, RCD has been a key supplier of commercial & military-grade specialty products for 40 years, including some of the world’s smallest, largest, high/low temp extreme, high vibration/ power/ voltage/ current/ frequency and most stable state-of-the-art components ever made...

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- Choice of RoHS or SnPb plated terminations - SM & leaded inductors/ transformers/ choke coils

SWIFT™ program

ISO9001 registered RoHS standard

[email protected] Web:www.rcdcomponents.com

The Industry’s Widest Range of Passives

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