package modeling bga, flip-chip, pga, qfp, tsop, pop connector/cable modeling
DESCRIPTION
Package Modeling BGA, Flip-Chip, PGA, QFP, TSOP, PoP Connector/Cable modeling SMA, SCSI, USB, Thru-hole, Board-to-board PCB Measurement Impedance, Skew, Delay, switching noise Socket, Contactor Modeling Probe Card, Socket, Calibration Standard Design Consulting - PowerPoint PPT PresentationTRANSCRIPT
• Package Modeling– BGA, Flip-Chip, PGA, QFP, TSOP, PoP
• Connector/Cable modeling– SMA, SCSI, USB, Thru-hole, Board-to-board
• PCB Measurement– Impedance, Skew, Delay, switching noise
• Socket, Contactor Modeling– Probe Card, Socket, Calibration Standard
• Design Consulting– Design reviews, load board design, prototype development, design
recommendations• Validation
– DDR device, DIMM module• Partner Support
– Conference, Design Seminar