WISE 2000

Paradigm Shift in Semiconductor Paradigm Shift in Semiconductor Business and ManufacturingBusiness and Manufacturing

Tohru OgawaSemiconductor Company

Sony Corporation

WISE 2000

ContentsContents

Paradigm Shift in Semiconductor Business

Sony’s Lithography Roadmap

Flexible Manufacturing Line

Conclusion

WISE 2000

Digitalization creates a new market combining Consumer, Network and PC applications.

Paradigm Shift through DigitalizationParadigm Shift through Digitalization

A

O

1980 1990 2000

AnalogAnalogAnalogAudio

Video

Computing

Communication

Entertainment

ConvergenceConvergence

TV 8mmVideoTV

Tape Rec

CDCD MDMD

WM

MP3MP3

PS1PS1

DVCDVC DVDDVD DTVDTV

VAIO VAIOVAIO

PS

VAIOVAIO

PDC

CDMA Cable Modem

Computing

Networking

Consumer

PS2PS2DigitalDigitalDigital

WISE 2000

Paradigm Shift in Semiconductor ProductsParadigm Shift in Semiconductor Products

[Year]1991 1993 1995 1997 1999 2001 2003 2005 2007 2009 2011Ref. Nikkei Microelectronics (1999)

System LSI

Total Market Volume (W/W)

7

6

5

4

3

2

1

01999 2003

Sal

es (

B$)

D-STB

DVD

Video CD

DTV

DSC

Digital Camcorder

Others

Video Game Consoles

(Dataquest, June ’99)

LS

I Mar

ket

Vo

lum

e (B

$)

1400

1200

1000

800

600

400

200

0

WISE 2000

Impact of Digitalization on LSIImpact of Digitalization on LSI

Large scale system LSI (SOC) with embedded DRAM

Flash memory becomes major storage media

Consumer products are merging with network and PC

Software and security play more important role

WISE 2000

Shift in Values in ElectronicsShift in Values in Electronics- Network oriented business lowers the status of hardware. - High specialization and standardization result in “horizontal” business model.

Hardware

Network

Small

Large

Value Added

Consumer Manufacturer

+ LSI Manufacturer

Consumer ManufacturerIP ProviderLSI Design EDA VendorsSi Foundry

Software Vendors(Application, OS, Tools )

Contents/Service Provider(Video, Music, e-commerce)

$$

$

WISE 2000

PlayStation 2

Fusion of Graphics, Audio/Video and PC

128bit CPU: “Emotion Engine”Clock 300MHz Main Memory 32MB(Direct RDRAM)

Graphics : “Graphic Synthesizer”Clock 150MHz Embedded Cache VRAM 4MB

SPUI/O Processor CD-ROM Drive: X24 DVD-ROM Drive: X4

WISE 2000

NewNew Vertical IntegrationVertical IntegrationProducts demand new vertical integration with horizontal business model.

Software Vendors

Process development

Fab

Design Service

IP Vendors

Equipment Supplier

Solutions Spec.

ProductsProductsConsumer Manufacturer

WISE 2000

Module Processes by Equipment Suppliers Module Processes by Equipment Suppliers

Saves cost/time/risk of process development by introduction of module processes optimized by equipment suppliers.

Integration

Cu CMP New Low-k CVD

LSI Manufacturer

Equipment Suppliers

LSI Manufacturer /Foundry

Module ProcessEquipmentRecipe

Equipment Suppliers

Module Process

Integration

Equipment Equipment

Cu CMPNew Low-k CVD

Module Process

WISE 2000

ContentsContents

Paradigm Shift in Semiconductor Business

Sony’s Lithography Roadmap

Flexible Manufacturing Line

Conclusion

WISE 2000

Sony’s Lithography Strategy

EPL(VUV)

KrF+RET

ArF+RET

Lithography

501994 1996 1998 2000 2002 2004 2006 2008 2010

Mass-production timing (Year)

Rule (nm)

70

100

130150

180

250

350

DRAM Half Pitch

Gate line (Logic)

ITRS Roadmap (1999)

WISE 2000

“Graphic Synthesizer”The Most Advanced Embedded DRAM LSI

0.25um CMOS4MB Embedded DRAM42.7M TransistorsClock150MHzBand Width 48GBps75M Polygon/sec384 pin BGA

1Metal

Capacitor

W

Cross sectional View

LOCOS

Bit Line

Logic Tr BMD

P-TEOS

Word Line(Buried Metal Diffusion)

WISE 2000

The Feature and Critical Issues of 130nmThe Feature and Critical Issues of 130nmEmbEmb--DRAM LSI ProcessDRAM LSI Process

DRAM

Logic

<Top view>

<Side view>

Si-substrate

Global Step

DRAM Logic

The most advanced design rule to achieve high performance Tr-> Enhance resolution, and refine OPC system (speed, accuracy)

Large variation in duty cycles-> Reduce iso – dense bias

High global step-> Enlarge D.O.F

High aspect hole process-> Enhance etching durability

WISE 2000

Resolution Enhancement Tech. to SubResolution Enhancement Tech. to Sub--100nm100nmDouble Exposure Levenson-PSM

Cr

T-0deg

T-180deg

Binary (2-nd exp.)

Levenson (1-st exp.) Levenson+Binary

100nm

After Lithography

λ: 248nm

NA: 0.68

Illu: 1/2 Ann.

WISE 2000

Requirements for ArF Litho. to Below 100nmRequirements for ArF Litho. to Below 100nmArF exposure system- High NA (>0.70), - Small Aberration, - Same performance in each machine,- Reduce initial and running cost, - Stability including ArF laser,

ArF resist - Resolution

- Gate: 100nm logic gate (iso, semi-iso), DRAM(gate 130nm)- Contact: 150nm- Edge roughness: <1nm

- Etching durability: aspect ratio>10 in contact process- Defect density: none

Mask- High CD uniformity to get MEF 1.6 – 1.7- Defect density: same as NTRS- Grid size change: 5nm ->2nm- High durability in transmittance and phase for ArF laser light and

chemical damage- High accuracy phase control- Price and T.A.T

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Key Issues for Mask Cost ReductionKey Issues for Mask Cost ReductionCritical issues- Mask writer: throughput / price

- Inspection tool: throughput / price

How to foster suppliers?For 130nm era:

- Cooperative work between

supplier, consortium, and users.

For below 100nm era:

- World wide strong cooperation.

350nm 250nm 180nm

Tech. Node

Mas

k C

ost

Pure Logic

1

2

3

4

5

1.0

1.5

2.7

WISE 2000

ContentsContents

Paradigm Shift in Semiconductor Business

Sony’s Lithography Roadmap

Flexible Manufacturing Line

Conclusion

WISE 2000

Characteristics of System LSI MarketCharacteristics of System LSI Market

Needs new process development and production strategy optimized forsystem LSI market characteristics.

MPU System LSIDRAM

Cost, Low Power, Functionality

Customized (Analog, Emb. DRAM)

Medium

Many Products/Low Volume

Q-TAT, Flexibility, IP

Cost, Speed

DRAM

Large

Few Products/High Volume

Scale Merit

High Speed

Logic

Large

Few Products/High Volume

Early Introduction of Advanced

Process

Requirement

Device

Market Size

Production

KFS

WISE 2000

Products and Production LinesProducts and Production LinesMini Lines (Scalable Lines) enable both flexibility and efficiency of capital investment.

High HighLow

LowLowHigh

Volume/Products Low/Many Medium/Few High/Few

Mini Line

MultipleMini Lines

Large Line(Scale Merit)Memory, MPU

System LSI

ROI Risk

Flexibility

WISE 2000

Mini Line: ConceptMini Line: Concept

Conventional Line

Demand

ProductionVolume

Line #1

Line #2

Mini Line #1

Mini Line #2

Mini Line #3

Mini Line #4

Surplus

DemandOver Supply

Mini Line #5

Under Supply

Prompt line construction to fit the demand

Mini Line

Shortage

TimeTime

Production Volume

Well balanced wafer supply to market with multiple mini lines

WISE 2000

To Realize MiniTo Realize Mini--line Conceptline Concept……

Capacity (wafers/month)

2000 10000 15000 200005000

Cap

ital

Inve

stm

ent

Target Cost

Estimated Cost

Equipment Price/Level

Pro

cess

Tim

e

Diffusion/LP-CVD

P-CVD/WET/CMP

Slow

Fast

ExpensiveAffordable

Improve Capital EfficiencyIm

pro

ve T

.A.T

Target- Wafer Capacity: 1/3 - Capital Investment: 1/3 - TAT: A.S.A.P

Critical issues- Efficiency in Capital Investment - T. A. T

Strategy- Cooperation with Suppliers- Utilization The Small Number of Wafers per Lot

WISE 2000

ConclusionsConclusions

Digital consumer with net working drive New Technology and Business Scheme.

The structure in electronics industry is changing….

New business model for system LSI is needed. - Partnership through target product

Development item in chip company itself should be focused.- Which item is common or specific?- Common module process solution by equipment suppliers and consortium

Flexible mini line is needed.