part 2: using fmea, dfr, test and failure analysis in lean...
TRANSCRIPT
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Part 2:Using FMEA, DFR, Test andFailure Analysis in Lean NPD
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Overview• Introduction and Definitions• Part 1: Lean Product Development
– Lean vs. Traditional Product Development– Key Elements of Lean NPD
• Customer Defines Value• Front Loaded and Knowledge Based• Eliminate Redesign Waste
– Reliability Requirements• Part 2: Reliability Elements of Lean NPD
– Lean FMEA and DRBFM– Critical Characteristics– DFR and Physics of Failure– Accelerated Testing to Failure– Failure Analysis and Knowledge Capture
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Lean FMEA
• Some teams attempt to lean FMEAprocess by creating product family FMEAsbut fail to update FMEA for newapplications or changes
• Instead Lean FMEA Should Focus on NewDesign Features and Changes to BaselineDesign to Assess Associated Risks
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Tools to Focus Lean FMEA• Diagramming Tools
– Functional Block Diagram– Boundary Diagram– Parameter Diagram– Process Flow Diagram
• Highlight Changes to Product or Processon the Diagrams
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Functional Block Diagram
Annotate Retained and Changed Items & Functions
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Boundary Diagram ConstructionSubsystem 1
Subsystem 3
Subsystem 2
FMEA Boundary
Interface-Physical Interface-Info Transfer-Data Transfer-External InputConsider a Functional Block Diagram of the System
With Modules and Interfaces
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Parameter Diagram ofProduct, Process, System
Product, Process,or System
NoiseFactors
Response(Output, Function)
Control Factors
Signal(Inputs)
Elements of the P-Diagram
• Controlled by Input Function• Static or Dynamic• May be Variable
• Performance Mean, Std Dev• Customer Requirement
• Forces Beyond Control• Cause Output Variation• Environment Factors
• Functional Design Parameters• Fixed or Adjustable• Fundamental to Design of Function• Reduce Variation
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Process Flow Diagram
Annotate Retained and Changed Process Steps
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Selecting Process Steps for Analysis
• On Process Flow Map:– Identify Steps Being Modified– Identify New Steps Required for New Product
• Drill Down to Identify Sub-Steps Within theTarget Steps Identified for Analysis
• Complete Lean PFMEA on SelectedProcess Steps
• Integrate with Previous PFMEA onStandard / Unchanged Process Steps
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Key Characteristics• Include:
– Product Features– Manufacturing Processes– Assembly Characteristics
• That Significantly Affect:– Product Performance– Form, Fit, Function
• Lean NPD Focuses on the Critical FewCharacteristics the Customer Values
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Key Characteristics
DetectPrevent
RPN
DET
OCC
SEV
ActionTaken
Action ResultsResponse &
TargetComplete
Date
RecommendedActions
RPN
Detec
Current
Controls
Occur
PotentialCause(s)/
Mechanism(s)Of Failure
Class
Sev
PotentialEffect(s) of
Failure
PotentialFailureMode
Item /ProcessStep
DetectPrevent
RPN
DET
OCC
SEV
ActionTaken
Action ResultsResponse &
TargetComplete
Date
RecommendedActions
RPN
Detec
CurrentDesign
Controls
Occur
PotentialCause(s)/
Mechanism(s)Of Failure
Class
Sev
PotentialEffect(s) of
Failure
PotentialFailureMode
Item /ProcessStep
Function
DFMEA &PFMEA
Technical Requirements,Tools Identify SpecialProduct Characteristics
Seve
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Special CharacteristicsMatrix
Characteristics Matrix
Requirements Documents•Customer Specification•Regulatory•Dimensions•Appearance
Requirements DocumentDrawingsField History Robustness Tools
•Functional Block Diagram•Boundary Diagram•P-Diagram•Interface Matrix
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Identifying Key Characteristics10
987654321
1 2 3 4 5 6 7 8 9 10
Occurrence
Severity
Potential Critical Characteristic
Potential Key Characteristic Possible Annoyance Zone
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Special Characteristics Matrix
Seve
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Special CharacteristicsMatrix
Process Steps from Flow Chart
Characteristics from Requirements and DFMEAEffect of Step onCharacteristics
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Developing the Control Plan• Prioritize Process Risks Identified in the
PFMEA and the Special CharacteristicsMatrix
• Process Flow Diagram• Lessons Learned from Similar Processes• Process Control Data from Related
Processes• Measurements Required for Process Control• SPC Control Limits• Complete the Items in Control Plan Template
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Control Plan ItemsMachine, Device, Jig,
Tools for Mfg.For each operation that is described, identify the processing equipment machine, device,
jig, or other tools for manufacturing, as appropriate.
No. Enter a cross reference number from all applicable documents such as, but not limited to,process flow diagram, numbered blue print, FMEAs, and sketches.
Product Features or properties of a part, component or assembly that are described on drawingsor other primary engineering info. Compilation of important product characteristics.
Process Process variables that have a cause and effect relationship with the identified productcharacteristic. Identify those process characteristics for which variation must becontrolled to minimize product variation. There may be more than one processcharacteristic for each product characteristic.
Product/ProcessSpecifications/Tolerance
Specifications/tolerance may be obtained from various engineering documents, such as, butnot limited to, drawings, design reviews, material standard, computer aided design data,manufacturing, and/or assembly requirements.
Evaluation/Measurement/Technique
Identify the measurement system being used, including, gages, fixtures, tools, and/or testequipment required to measure the part/process/manufacturing equipment.
Sample When sampling is required list the corresponding size and frequency.
Control Method Brief description of how the operation will be controlled, including procedure numberswhere applicable. Operations may be controlled by SPC, inspection, attribute data,mistake proofing, sampling plans, and other. If elaborate control procedures are used,reference document by ID name/number.
Reaction Plan Specify the corrective actions necessary to avoid producing nonconforming productsor operating out of control. May also refer to a specific reaction plan number and identifythe person responsible for the action.
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Using the Control Plan
• For Critical Characteristics, Use ControlPlan to Identify:– Measurements: How, When, How Often– Controls to Keep Characteristic in Tolerance– Actions if Characteristic Out of Tolerance
• Containment• Corrective Actions
• Robust Design + Controlled Processes =Reliable Products
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DRBFM and DRBTRDesign Review Based on Failure Modes & Test Results
Key Elements of Mizenboushi(Reliability Problem Prevention)
GD3 (Good Design, Good Discussion,Good Dissection)
Toyota’s “Creative FMEA” Method
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Problem Prevention – GD3
• Good Design = Robust Design– Design for Reliability (DFR)– Design for Six Sigma (DFSS)
• Good Discussion = Eliminate Risk– Apply Design Review Based on Failure
Modes (DRBFM) to identify problems anddevelop countermeasures or corrections
• Good Dissection = Effective Validation– Apply Design Review Based on Test Results
(DRBTR) to Evaluate Effectiveness. Test toFailure & Analysis of Test Failures is Critical
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GD3 Problem Resolution
Good DiscussionGood Dissection
Good Design
Development(DiscoverUnknownProblems)
Total Problems to be Solved
Pre-Production
Validation
OBJECTIVE:
Discover& ResolveAll ProblemsBefore Launch
(Robust DesignTo PreventProblems) Unknown
Problems
DiscoveredProblems
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DRBFM Approach• Elements from FMEA, FTA, and Design
Review– These tools previously used for management
and control of projects– Toyota developed “creative FMEA” approach– Shift focus to improve perceptiveness and
problem solving• Focus is on finding and preventing
problems – not completing forms andchecklists (which de-motivate participants)
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DRBFM Application
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DRBFM is a Forum for ThinkingTeamwork and Participation
What has changed? * What did you change? Why?* What surrounding conditions have changed
outside your control?
Concerns about the changes? *Your Concerns? What other concerns?* Draw on expertise and knowledge of past problems
When will concerns appear? *Could concerns become causes of failuresor incidents? Visualize concerns & causes
What effects will there be? *How will causes effect the customer?* Consider effects on the OEM and end user
What preventive measures *What has been done to assure concerns willhave been & should be taken? not actually appear?
*Consider other measures that can be implemented
Source: Bill Haughey, DRBFM, Applied Reliability Symposium, June 2007, March 2008
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How is DRBFM Done?
• Preparation for the Design Review• Conducting the DRBFM• Capturing the Inputs• Assigning and Tracking Actions to
Completion
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Pre-Work for the DRBFM• Design Engineer or Core Team:
– Functional Diagram, Operating Environment– Changes from Previous Baseline Design– Drawings and Analysis– Failed and Sectioned Parts– Draft DRBFM with Components / Changes, Concerns
with Causes and Factors, Effect on Customer, Designto Eliminate Concerns
• Participants (Functional Experts):– Perceptive mindset, interest in improving product– Past experience and knowledge on similar items
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Capturing the Data
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Typical DRBFM Session
Source: A Guide to GD3 Activities and DRBFM Technique to Prevent Trouble, Kano & Shimizu, Toyota 2001
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Changes and Results Documented
Source: Carl Hanser Verlag, QZ, Munich, 4-2005
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Linking DRBFM with FMEA
• DRBFM captures the information neededfor FMEA except scoring
• Scoring columns can be added to fill needfor FMEA if required by customer orstandards
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DRBFM to FMEA (1)
FMEA FormAdd Scores
C Potential O D
Item Item Potential Potential S l Cause(s) / c Current eR
.
Function Failure Effect(s) of e a Mechanism(s) c Design tP
.
Mode Failure v s of Failure u Controls eN
.
s r c
DRBFM Form:
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DRBFM to FMEA (2)
D
Current e R. Recommended Responsibility Action Results
Design t P. Actions & Target Actions S O D R.
Controls e N. Date Taken e c e P.
c v c t N.
DRBFM Form:
Add Scores Add Scores
FMEA Form:
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DRBFM System Integration
Source: SAE Paper 2003-01-2877, Shimizu, Imagawa, Noguchi, Reliability Problem Prevention for Automotive Components
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Applying DRBFM in Lean NPD
• Use “Missing Knowledge” Decision Flowfrom Lean QFD as starting point
• These unknowns and known changesfrom current technology or design are thegreatest risks
• Focus DRBFM on these unknown andchanged areas during concept andprototype team reviews & IntegrationPoints
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Integrating Product & ProcessDesign
• DFMA – Design for Manufacturing andAssembly
• Integrated Product and Process FMEA /DRBFM
• Concurrent Engineering Team• Visual Management – Decision Flow and
Value Stream Map to Manage Tasks
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Impact of Lean Focused FMEA• Allocation of Resources Targeted to
Reduce Highest Risks and Unknowns• Impact Product and Process Design• Drive Test Planning and Analysis to
Resolve Issues and UnderstandUnknowns
• Verify Corrective Action Effectiveness• Critical Characteristics and Process
Measurement / Control
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Lean FMEA Summary• Focus FMEA on Changes in Design or
Process• Use Supporting Tools to Narrow Focus:
– Parameter & Boundary Diagrams– Process Flow Charts– DRBFM Techniques– Characteristics Matrix
• Use Lean NPD Tools to IdentifyUnknowns, Apply Resources, AssignTasks
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Design for Reliability andRobustness
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How do we Design-in Reliability?• Stress Analysis and Test
– Find Product Limits & Understand User Needs– Products fail due to variation or in limit environments
where stress exceeds strength– Stress and strength distributions:
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DFR Strategies
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Stress-Strength vs. Age
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Reducing Stress / StrengthInterference
• Increase strength of the part– Understand operating environment stresses– Select more robust parts or materials– Increase design margin– Supplement deterministic design with probabilistic
tools• Reduce part strength variability
– Understand sources of part variation and deterioration– Controlled production process (SPC)– Protect vulnerable components
• ROBUST DESIGN + CONTROLLEDPROCESSES = RELIABLE PRODUCT
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Robust Design Tools
DFSS and DFR Tools: Differences and Commonality
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Probabilistic Design
Applied Reliability Engineering, Rousch and Webb, Center for Reliability Engineering, University of Maryland, College Park, MD. Jan 2006
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Reliability Based DesignOptimization
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Elements of Probabilistic Design
• Understand physics of failure and stressesthat precipitate failure
• Use predictive modeling and acceleratedtest to failure to estimate probability offailure
• Consider variability of applied stressesand variability of product strength
• Eliminate stress-strength interference
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Physics of Failure Approach
• Robust Design Considerations• FMEA or DRBFM Methods
– Design Review Based on Failure ModesIntegrates FMEA and Design Review
• Test to Failure and Understand CauseMechanisms
• Failure Analysis Methods
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Understand Physics of Failure
• What physical phenomenon in the part is causedby the stresses applied?
• If we understand the root cause, we can improvestrength or reduce variability to prevent ormitigate the failure.
• Most hardware failures can be traced to fourphysical categories / mechanisms:– Wear– Corrosion / Contamination– Mechanical Failure (fatigue, vibration resonance, etc.)– Overstress (electrical or mechanical, transients)
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Physics of Failure Tools• Tools Used in Physics of Failure Analysis
– Principal Physics Model– CAD Drawings / Solid Modeling– Finite Element Analysis
• Dynamic Simulation (Transients)• Fatigue Analysis (Cumulative Damage)• Thermal Analysis• Accelerated Testing• Simulation
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Design of Experiments (DOE)
• Tool to Evaluate Design Alternatives• Determine Factors and Response• May need Two Phased DOE Approach
– Fractional Design to Find Main Factors– Full Factorial Design to Evaluate Effects and
Interactions on Reduced Set of Factors– Consider Time and Cost
• Analysis of Results and Optimization ofSolution
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Iterative DOE Process
Larry Gonzales, Raytheon, Experiment Design for Engineers & Scientists, Applied Reliability Symposium, 2009.
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Use Trade-Off Curves to CaptureKnowledge
• Point Data from Analysis and Experiments• Relationship Between Key Parameters• Apply to Support Design Decisions
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Trade-Off Curves
Capture Knowledge from Point Solutions
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Trade Off Curve Example
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Key is Understanding
• Methods Build Knowledge of Alternatives– Physics of Failure– Design of Experiments– Design for Robustness and Reliability
• Enable Better Design Decisions• Eliminate or Reduce Redesign Waste
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Reliability Testing and DataAnalysis
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Phased Robustness Testing
• Prototype Phase– Accelerated Test to Failure (Well beyond Spec –
HALT, Step Stress, Specific Stresses and FailureModes)
• Design Verification Phase– Quantitative Accelerated Life Test– Selected Qualification Tests
• Production Validation– Demonstrate Corrective Action is Effective– Validate Final Product Made on Production Tools
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Robustness Indicator Figure
Factors(Temperature, Vibration,Humidity etc) Analysis & Test Results for
Each Factor on current ornew product
Requirement orSpecification Margin or
Robustness ofDesign Factor
(Can be Created in Excel using Radar Chart)
If RequirementExceeds TestResult or hasSmall Margin,Design is NotRobust
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General Approach to AcceleratedLife Test (ALT)
• Understand Failure mechanisms• Understand Operating and Design Limits• Clarify Use Level Stress Application• Conduct Qualitative tests like HALT or step-
stress tests to define product limits and failuremodes
• Conduct Quantitative ALT to extrapolate life atuse level conditions– Times to Failure at Accelerated Stress Levels– Use life-stress relationships and distributions
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ALT Plan• Stresses to be Considered• Life-Stress Relationship for Each Stress• Application Use Level for Each Stress• Use Level Failure Criteria / Threshold• Test Duration and Resources Available• Consider Use of DOE to help estimate:
– Stress Factors with Most Effect– Probability of Failure at Specified Use Level– Probability of Failure at Maximum Stress– Interactions to Help Define Life-Stress Relationship
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Highly Accelerated Life Test(HALT) – Qualitative ALT
1. Improve Reliability by FindingWeaknesses and CorrectingThem Early.
2. Establish Upper and LowerOperating and Destruct Limits ofEnvironmental Stressors
3. Typically done in Temperature &Vibration Chamber forElectronics & ElectromechanicalProducts
4. Concept can be Applied to OtherStressors (Voltage, Current,Mechanical Loads, etc.)
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Quantitative ALT
• Test to Failure at Multiple AcceleratedStress Levels
• Use Analysis to Extrapolate Reliability orLife at Application Use Level Stress
• Can be Used to Demonstrate Ability toMeet Reliability Requirements
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Cautions on Acceleration• Understanding product limits helps prevent accelerating
to unrepresentative stresses and failure modes• Time
– Consider Heat Buildup– Effects of Cycling
• Temperature– Material Phase transitions– Non-linear response– High temperature or thermal cycling?
• Power– Protective and limit devices– Transients
• Vibration– Mechanical limits or resonances
• What failure mechanism are we accelerating?
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Data Collected• Test Parameters Measured
– Temperature, Power Density, Cycle Rate, Vibration,Humidity, Voltage, etc. applied
– Product Response or Function (monitor during test)• Time to Failure or Run Time (Suspended)
– At least 3 Different Stress Levels– Fit Data Points to Appropriate Distribution
• Product Limits from Step Stress Test• Failure Mode Observations
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Data Analysis• Analyze Data and Extrapolate Life at Use Level
Stress• Life-Stress Relationships (predictive models)
– Arrhenius – Temperature– Eyring – Temperature or humidity– Inverse Power Law – Voltage, Power, Mechanical– Multiple Life-Stress Models
• Temperature / Humidity• Temperature / Non-Thermal: Temp / Voltage or Power• General Log Linear: multiple accelerating stresses• Proportional Hazards: multiple covariates• Cumulative Damage – Time varying stress profiles
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Data Analysis – Use LevelReliaSoft ALTA 7 - www.ReliaSoft.com
Use Level Probability Weibull
Beta=3.7483; Alpha(0)=-6.0220; Alpha(1)=5776.9341; Alpha(2)=-1.4340; Alpha(3)=0.6242
Time
Unrel
iabilit
y
1000.000 100000.00010000.0000.100
0.500
1.000
5.000
10.000
50.000
90.000
99.000
0.100
Use LevelCB@90% 1-Sided TB
Data 1General Log-LinearWeibull328|10|1F=35 | S=51
Data PointsUse Level LineTop CB-IBottom CB-I
John PaschkewitzWatlow Electric Mfg Co2/4/20083:39:07 PM
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Data Analysis - DistributionReliaSoft ALTA 7 - www.ReliaSoft.com
Probability Density Function
Beta=3.7483; Alpha(0)=-6.0220; Alpha(1)=5776.9341; Alpha(2)=-1.4340; Alpha(3)=0.6242
Time
f(t)
0.000 20000.0004000.000 8000.000 12000.000 16000.0000.000
3.000E-4
6.000E-5
1.200E-4
1.800E-4
2.400E-4
Data 1General Log-LinearWeibull328|10|1F=35 | S=51
Pdf Line
John PaschkewitzWatlow Electric Mfg Co2/4/20083:41:01 PM
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Life vs. Stress as Trade-OffRe l ia So ft AL TA 7 - w w w .Re l ia So ft.c om
L if e v s S t re s s
Std= 0 .7937 ; K= 7 .1350E-12 ; n= 3 .6556
W ir e W a t t D e n s it y
Lif
e,
Cy
cle
s
50 .000 1000 .000100 .00010 .000
10000 .000
100 .000
1000 .000
L i feCB@ 90% 1 -S ide d TB
Ax c e l i s AL T N iCr W W D L -SI nv e rs e Pow e r L a wL ogno rm a l132 .4F = 5 | S= 1
M ea n L i fe L ineTop CB M e a nBo ttom CB M ea n
157.8S tre s s L e v e l Po in tsM ed ia n Po in tI m pos ed Pd f
186 .7S tre s s L e v e l Po in tsM ed ia n Po in tI m pos ed Pd f
281 .6S tre s s L e v e l Po in tsM ed ia n Po in tI m pos ed Pd f
J ohn Pa s c hk ew itzW a tlow E le c tric M fg Co10 / 8 / 20093 :06 :05 PM
1 3 2 1 8 7 2 8 2 5 0 0 7 0 0
R e g i o n o fU n a c c e p ta b l eW a tt D e n s i ty
, w s i
R e g i o n o fA c c e p ta b l eW a tt D e n s i ty
A LT C y c les f rom 250 t o 400 C
A LT C y c les f rom 250 t o 430 C
A LT C y c les f rom 250 t o 500 C
0 . 168" d ia s hea t h. 021 " d ia P C N iC rw ire c y c led us ing
c on t ro lled du t y c y c leram p ov e r 78m inu t e c y c le
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Production Validation Test
• Repeat selected Qualification Tests onany Changes in Product or Process
• Test Samples made on ProductionProcesses
• On-Going Reliability Test (ORT)– HASS – Highly Accelerated Stress Screening– HASA – Highly Accelerated Stress Audit– Periodic HALT Re-Test on Production Units
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Failure Analysis / FRACAS
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Failure Analysis Tools• Basic
– Recovery of Failed Samples– Electrical Test, Microscopy, Digital Photography
• Non-Destructive Methods– X-Ray (Real Time Digital is Particularly Helpful)
• Disassembly / De-capsulation– Tools or Chemicals to remove layers
• Scanning Electron Microscopy & EDS– Defects, Corrosion, Material Failure
• Acoustic Microscopy / Imaging (Voids / Defects)• Some Internal, Others at Outside Labs
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NDT – Electrical Characteristics
Curve Tracer – Showing Good and Failed Part Response
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Real Time Digital X-Ray
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Real Time X-Ray Example
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Digital X-Ray Examples
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SEM / EDS
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Example of SEM / EDS Analysis
Pt: Rh: Al87:10 : 3 Pt : Rh : Si
82.7:10.3:6.7
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PCB Failure Analysis Methods
Thomas Paquette, Insight Analytical Labs, Test & Measurement World, August 2006.
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Failure Analysis Summary
• Progressive Use of Tools from NDT toDissection and Cross-Section Exam
• Objective is to Find Physical Evidence ofFailure Mechanism
• Document with Photos and Analysis toCapture Knowledge Gained
• Update FMEA or DRBFM with FA Findings
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FRACASFailure Reporting, Analysis & Corrective Action System
• Build Knowledge Base• Process and Tool
– Reliability & Quality of Product, Service, Process orSoftware is Tracked, Measured, and Improved
– Applies to Entire Product Life Cycle– Consistently Ranked Among the Most Important
Reliability Tasks– Closed Loop: Ability to Feed Root Cause & Corrective
Action Information Back Into Design Process forFurther Improvement
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Hierarchy of Failure Causes
Design Related Failures
Manufacturing & QualityRelated Failures
Repair Induced
CustomerInduced
Capture Failures from Verification Test to Field Operation
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Capturing FA Knowledge• Capture Failure Analysis Results in
Searchable Tool– Commercial Data Base Tool– A3 Format Documents with Keywords– SharePoint (Microsoft)
• Key is Ability to Retrieve Knowledge withMinimal Search Effort
• Lean NPD is Knowledge Based – Key isContinually Adding to AccessibleKnowledge
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Summary• Features of Lean NPD for Reliability
– Front End Focus to Gain Knowledge• Basis for Better Design Decisions
– Design for Robustness, Reliability– Understand Physics of Failure
• Testing to Learn and Verify– Test to Failure and Understand Causes
• Knowledge Capture for Future Re-use• Develop & Control Critical Characteristics
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References• King, John P. and Jewett, William S.;
Robustness Development and ReliabilityGrowth; Prentice-Hall, Boston, 2010.
• SAE International, J1211, April 2009, Handbookfor Robustness Validation of AutomotiveElectrical / Electronic Modules.
• Robustness Validation Manual, ZVEI, January2010; www.zvei.org/RobustnessValidation
• Jusko, Jill; New Models for ProductDevelopment, Industry Week, April 21, 2010.
• Morgan, James and Liker, Jeffrey; The ToyotaProduct Development System, ProductivityPress, New York, 2006.
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References• Sarakakis, Georgios; Fundamentals of Life Data
Analysis: Concepts and Applications, Tutorial, 2010Applied Reliability Symposium Proceedings, June 17,2010.
• Wiggins, Brian, “A Simpler Look at ProductDevelopment”, Product Design & Development, October8, 2010.
• Mascatelli, R., The Lean Product DevelopmentGuidebook, 2007.
• Soderborg, Dr. Nathan, Lean Product Development,WCBF DFSS Conference, Feb. 2008
• Using DOE Results in Design of ALT, Reliability Edge,Vol 10, Issue 2, pp. 1-7.
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References• SAE 2003-01-2877, Reliability Problem Prevention
Method for Automotive Components, H. Shimizu, T.Imagawa, H. Noguchi.
• A Guide to GD3 Activities and DRBFM Technique toPrevent Trouble, S. Kano, H. Shimizu, Toyota, 2001.
• Lean Product Development, Eric Rebentisch, Oct 5,2005, MIT Open Courseware,http://ocw.mit.edu/courses/aeronautics-and-astronautics/16-852j-integrating-the-lean-enterprise-fall-2005/lecture-notes/8_rebentisc_leng.pdf
• Bill Haughey, DRBFM, Applied Reliability Symposium,June 2007, March 2008
• Lean FMEA Training, Quality Associates International, atwww.quality-one.com
• AIAG, FMEA, 4th Edition, June 2008, pp.135-138.
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Feedback / Follow-up
• Please provide your feedback on this webbased short course: e-mail [email protected] or to ASQ RD
• One day seminar on this topic availablethrough:http://www.hobbsengr.com/Accelerated_Reliability_Seminar_Schedule.htm– Apr 13, 2011 in Chicago, IL– May 2, 2011 in Minneapolis, MN