mmwave radio design for mobile handsets - 5g … radio design for mobile handsets alberto...
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mmWave Radio Design for Mobile Handsets
Alberto Valdes-GarciaResearch Staff Member, ManagerMaster Inventor & Member IBM Academy of Technology
IBM ResearchT. J. Watson Research Center
©2015 IBM Corporation2
Toronto 5G Summit – November 2015
Enabling 5G: mmWave Silicon Integration and Packaging
https://ieeetv.ieee.org/ieeetv-specials/toronto-5g-summit-2015-bodhisatwa-sadhu-enabling-5g-mmwave-silicon-integration-and-packaging?
mmWave WLAN – IBM 16-Element 60-GHz phased array
mmWave Backhaul – IBM 64-Element 94-GHz phased array
mmWave handset radio – IBM 60-GHz low-power TRX
Overview of IBM Research’s 10+ years of
work on silicon-based mmWave radios,
phased arrays, and Gb/s link demonstrations
©2015 IBM Corporation3
Toronto 5G Summit – November 2015
Enabling 5G: mmWave Silicon Integration and Packaging
https://ieeetv.ieee.org/ieeetv-specials/toronto-5g-summit-2015-bodhisatwa-sadhu-enabling-5g-mmwave-silicon-integration-and-packaging?
mmWave WLAN – IBM 16-Element 60-GHz phased array
mmWave Backhaul – IBM 64-Element 94-GHz phased array
mmWave handset radio – IBM 60-GHz low-power TRX
Focus of this presentation
©2015 IBM Corporation4
Gb/s mmWave Wireless Links:Applications across the infrastructure stack
mmWave-based 5G network concept:
Ericsson: E. Dahlman, et al., “5G Radio Access,” Ericsson Review, June, 2014
Samsung: W. Roh, et al., "Millimeter-wave beamforming as an enabling technology for 5G cellular communications:
theoretical feasibility and prototype results," in IEEE Communications Magazine, Feb, 2014
©2015 IBM Corporation5
Potential 5G Scenarios Require mmWave Radio Integration into Handset Devices
mmWave Phased Array
Base Station to Handset Link
mmWave D2D Link
©2015 IBM Corporation6
No mmWave Mass Adoption in Phones Yet!
Directivity Cost
Power budget
Portability
Main challenges
©2015 IBM Corporation7
Outline
Four challenges of mmWave mobile
– Our approach to address these challenges
– TRX module: 60-GHz 32nm SOI CMOS IC
+ Antennas in Package
TRX demonstrations
– Communications link
– Pulse based radar
Summary and conclusions
©2015 IBM Corporation8
Challenge 1: DirectivityMaking mmWave Omni-directional
Reasons for challenge
Integrated antennas higher
directivity
Large cable loss makes discrete
antennas unattractive
©2015 IBM Corporation9
Challenge 1: DirectivityMaking mmWave Omni-directional
Phased arrays do not
solve the problem!
Reasons for challenge
Integrated antennas higher
directivity
Large cable loss makes discrete
antennas unattractive
©2015 IBM Corporation10
Challenge 1: DirectivityMaking mmWave Omni-directional
Reasons for challenge
Integrated antennas higher
directivity
Large cable loss makes discrete
antennas unattractivePhased arrays do not
solve the problem!
©2015 IBM Corporation11
Challenge 1: DirectivityApproach: Switched Beam
Our solution
Multiple antennas in package pointing in different directions
A.L. Amadjikpe, et al., TMTT 2013
X. Gu, et al., ECTC 2015
©2015 IBM Corporation12
60GHz Switched Beam Antenna in Package
X. Gu, et al., ECTC 2015
D. Liu, et al., AP-S, 2015
RX2 (Yagi)
TX2 (Yagi)
11
mm
RFIC
(3.2x3.2mm2)
11mm
TX1 (Patch)
RX1 (Patch)
Parasitic patches
Parasitic patches
BGA balls
Patch antenna
Yagi
antenna
4-layer organic packageRF IC C4s
BGA ballsBoard
Power, ground
and signals
©2015 IBM Corporation13
60GHz IC Block Diagram: Switched LNAs and PAs
• Antenna switching performed by switching LNAs & PAs
• Sliding IF architecture with on-chip PLL
B. Sadhu, et al., RFIC 2016
©2015 IBM Corporation14
Measured Antenna Coverage
• Orthogonally pointed low directivity antennas
• Total coverage achieved = 254○
B. Sadhu, et al., RFIC 2016
©2015 IBM Corporation15
Challenge 2: CostIC + Packaging + Test
IC Design34%
Packaging33%
Test33%
Silicon-based (CMOS)
implementationMultilayer Organic
(MLO) Packaging
?
©2015 IBM Corporation16
Challenge 2: CostApproach: On-chip mmWave Test
Reasons
Expensive equipment
Fragile probes & connectors
High signal path losses
Frequent calibration
Solution
On-chip mmWave test
IC Design34%
Packaging33%
Test33%
©2015 IBM Corporation17
Indirect On-chip Test at mmWave
Temperature
sensor
LNA
Digital
controls
Input
@ 60GHz
Output
@ 60GHz
DC voltage
sensor
Noise
figure
(predicted)
Micro-
controller
DUT
Traditional testing Indirect sensing
Indirect sensing: Estimate the performance metric of interest by using other
performance metrics that are straightforward to measure
Monte Carlo sim across P, Vsup,
T
Choose variables (I, T, V)
3 3 3 2 2 2
300 030 003 200 020 002
110 101 011 100 010 001 000
NF a I a T a V a I a T a V
a IT a VI a VT a I a T a V a
Fit NF(I, T, V) using
multivariate polynomial
rms error = 0.36 dB
J.-O. Plouchart, et al.,
RFIC, 2015
In collaboration with CMU
©2015 IBM Corporation18
Self-test Enables Self-optimization
• Critical blocks include self-test and optimization knobs
• 20 on-chip sensors, 300+ optimization knobs
÷2IF
VGA
×2
÷2IF
VGA
22.8–26.4
GH
z
Self-Healing PLL
11.4–13.2GHz
45.6–52.8GHz
I
Q 11.4–13.2GHz
LPF/VGA
LPF/VGA
TX Ant.
Broadside
TX Ant.
Endfire
RX Ant.
Broadside
RX Ant.
EndfireOn-chip
Microcontroller
Sensor
Actuator
Temperature-sensor, ADCs, bandgap
BA BS
BA BS
BA BSLNA
LNA
PA
SW
PA
Pre-driver
SW
BA BS
BA BS
BA PD
BA PD
BA Bias Actuator
(DAC)
BS Bias Sensor
PD Power Detector
I
Q
Healing infrastructure
©2015 IBM Corporation19
Challenge 3: Power ConsumptionApproach: Low Power Design & Optimization
Reasons
Low efficiency closer to
technology fMAX
Biased for worst case PVT
corner –wasteful
Solution
System level power budgeting
Low power designs
Dynamic power optimization
LNA
PLL + doubler
RX mixer and BB
PA PLL + doubler
TX BB TX mixer
RX mode
TX mode
©2015 IBM Corporation20
Block Diagram: State of the art blocks
World class block level performance:
Class-E PA: 25% PAE @60GHz LNA: <3.3dB NF @60GHz
LiT VCO: -131dBc/Hz @10MHz from 22GHz
PA: O. Ogunnika, et al., RFIC, 2012; LNA: J.-O. Plouchart, et al., RFIC, 2015;VCO: B. Sadhu, et al., RFIC 2012, JSSC, 2013
©2015 IBM Corporation21
Dynamic Power Optimization in LNA
J.-O. Plouchart, et al., RFIC, 2015
Self-healing
reduces power
by 25% while
achieving same
NF<5dB
Fix bias
with
NF<5dB
• Optimize power while meeting specification
©2015 IBM Corporation22
Challenge 4: PortabilityApproach: Tight Integration and Co-design
Reasons
High PA power required
Low LNA noise figure required
Solution
Integrated CMOS circuits with
performance comparable to discrete
components
Integrate antennas close to LNA and
PA to minimize losses
©2015 IBM Corporation23
Tightly Integrated IC, Package, Antenna
LNA 1
LNA 2
PA 2
PA 1
RX BB
I&Q
TX RF UP-
MIXER +
LO
BUFFER +
RF PRE-
DRIVER
PLL +
DOUBLER
+ LO
BUFFERTX IF UP-
MIXER +
IF VGA
RX RF DOWN-MIXER
+ LO BUFFER
INST. ADCs
+ BIAS
RX IN 2
RX IN 1
TX OUT 2
TX OUT 1
RX OUT I RX OUT Q
TX
IN
I
TX IN Q
DIG
ITA
L I/O
PLL REF
MIC
RO
-
CO
NT
RO
LL
ER
3.2mm
3.2
mm
IC area3.2mm x
3.2mm
Self-test area
overhead< 5%
Self-test power
overhead~ 0
Switched beam
area overhead< 16%
Tight co-integration with package
IC Implementation in 32nm CMOS SOI
parasitic patches PCB GND
and package
GND stop
here
B. Sadhu, et al., RFIC 2016
©2015 IBM Corporation25
TX-RX Link Measurement Set-up
serial
ethernet
Zynq card
Packaged chip
Arbitrary waveform generator
Spectrum analyzer
TRx serial
TX baseband
60GHz mmWave
measurements
TCL session
Matlab session
• TCL session for manual commands
• Matlab for automated
Oscilloscope
TX RX
©2015 IBM Corporation26
Demonstration of 60GHz TRX at IEEE RFIC Symp. 2016 Industry Showcase Session, San Francisco, CA
RX TX
802.11ad
MCS8
(2.3Gb/s)
Communication link between 2 TRX chips:
1. > 2Gbps QPSK over > 1m
2. Data link maintained over broad angular range
3. Evaluation of higher order modulations on-going
©2015 IBM Corporation27
Radar Demonstration Set-up
Arbitrary waveform generator -- prbs data
TX baseband
60GHz mmWave
OscilloscopeTX
Zynq card
TRx serial
Object 2Object 1
Computer obtains AWG and scope data
Compares data to find real-time distance
RX
Multi-functionality (communications, radar, sensing) has been demonstrated with
current 2 – 5 GHz radios (e.g. WiFi, Bluetooth). mmWave can potentially take
such capabilities to a whole new level
©2015 IBM Corporation28
Radar Demonstration Results
Radar setup using 2 TRX chips:
1. Demonstrated PRBS pulse based radar
2. Resolution of 3cm achieved over 2m range
3. Power < 250mW makes it attractive for proximity detection in UAVs
Object 1
Object 2
Object 1Object 2
©2015 IBM Corporation30
Conclusions
Silicon based mmWave radio integration is ready
for 5G handsets
– Cellular, D2D
Antenna and packaging need special attention
– Co-design is critical
Testing is expensive
– Use on-chip test
©2015 IBM Corporation31
‘Ultimately though, we should expect mmWave systems
to become as inexpensive and ubiquitous as 2.4- and 5-
GHz WLAN systems are today. Some of the early
companies developing products in the mmWave space
will succeed and become profitable, and some will fail.
But the end result will be “millimeter-waves
for the masses.”’ - Advanced Millimeter Wave
Technologies: Antenna, Packaging and Circuits, Wiley
Press, 2009
©2015 IBM Corporation32
Acknowledgment
This work was supported by the DARPA HEALICS (Self-Healing Mixed-Signal Integrated
Circuits) program under Air Force Research Laboratory (AFRL) contract FA8650-09-C-
7924.
The views, opinions, and/or findings contained in this presentation are those of the
author/presenter and should not be interpreted as representing the official views or
policies, either expressed or implied, of the Defense Advanced Research Projects Agency
or the Department of Defense.
J.-O. Plouchart Xiaoxiong Gu Sakshi Dhawan Herschel Ainspan
Bodhisatwa Sadhu Duixian Liu Mark Ferriss Christian Baks
Michael Beakes Mark Yeck Daniel Friedman Roger Moussalli
Yahya Tousi
©2015 IBM Corporation33
To Learn More…
► IBM Presentation at IEEE 5G Summit November 2015.
“Enabling 5G: mmWave Silicon Integration and Packaging”
► Slides: http://www.5gsummit.org/docs/slides/Bodhisatwa-Sadhu-5GSummit-Toronto-11142015.pdf
► Video:
https://ieeetv.ieee.org/ieeetv-specials/toronto-5g-summit-2015-bodhisatwa-sadhu-enabling-5g-mmwave-silicon-integration-and-
packaging?
► IBM Research Blog: The future of mobile experience:
https://www.ibm.com/blogs/research/2016/05/future-mobile-experience-millimeter-wave-5g-wireless
► IBM-Ericsson announcement on 5G collaboration:
https://www.ericsson.com/news/1873727
©2015 IBM Corporation34
References
[1] B. Sadhu, M. Ferriss, A. Natarajan, S. Yaldiz, J.-O. Plouchart, A. Rylyakov, A. Valdes-Garcia, B. Parker, A.
Babakhani, S. Reynolds, X. Li, L. Pileggi, R. Harjani, J. Tierno, and D. Friedman, “A Linearized, Low Phase Noise
VCO Based 25GHz PLL with Autonomic Biasing”, IEEE Journal of Solid-State Circuits, May 2013.
[2] S. Sun, F. Wang, S. Yaldiz, X. Li, L. Pileggi, A. Natarajan, M. Ferriss, J.-O. Plouchart, B. Sadhu, B. Parker, A.
Valdes Garcia, M. A. T. Sanduleanu, J. Tierno, and D. Friedman, “Indirect Performance Sensing for On-Chip Self-
Healing of Analog and RF Circuits,” IEEE Transactions on Circuits and Systems – I, Vol. 61, no. 8, pp. 2243-2252,
August 2014
[3] J.-O. Plouchart, F. Wang, X. Li, B. Parker, M. Sanduleanu, A. Balteanu, B. Sadhu, A. Valdes-Garcia, and D.
Friedman, “Adaptive Circuit Design Methodology and Test Applied to Millimeter-Wave Circuits”, IEEE Design &
Test, December, 2014
[4] X. Gu, D. Liu, C. Baks, B. Sadhu, and A. Valdes-Garcia, “A Multilayer Organic Package with Four Integrated
60GHz Antennas Enabling Broadside and End-Fire Radiation for Portable Communication Devices”, IEEE
Electronic Components and Technology Conference, May 2015
[5] J.O. Plouchart, F. Wang, A. Balteanu, B. Parker, M. Sanduleanu, M. Yeck, V. Chen, W. Woods, B. Sadhu, A.
Valdes-Garcia, X. Li, D. Friedman, “A 18mW, 3.3dB NF, 60GHz LNA in 32nm SOI CMOS Technology with
Autonomic NF Calibration”, IEEE Radio Frequency Integrated Circuits Symposium, May 2015
[6] B. Sadhu, A. Valdes-Garcia, J.-O. Plouchart, H. Ainspan, A. K. Gupta, M. Ferriss, M. Yeck, M. Sanduleanu, X.
Gu, C. Baks, D. Liu, and D. Friedman “A 60GHz Packaged Switched Beam 32nm CMOS TRX with Broad Spatial
Coverage, 17.1dBm Peak EIRP, 6.1dB NF at < 250mW”, IEEE Radio Frequency Integrated Circuits Symposium,
May 2016