pe2017 forum programs - mesago · 18.05.2017 · ausstellerforum, halle 7, stand 507 exhibitor...
TRANSCRIPT
ForenprogrammForum programs
Ausstellerforum, Halle 7, Stand 507 Exhibitor Forum, hall 7, booth 507
Fachforum, Halle 6, Stand 143 Industry Forum, hall 6, booth 143
E-Mobility-Forum, Halle 6, Stand 326 E-Mobility Forum, hall 6, booth 326
Dienstag, 16.05.2017 Seite 12 Tuesday, 16 May 2017 Page 12
Mittwoch, 17.05.2017 Seite 13 Wednesday, 17 May 2017 Page 13
Donnerstag, 18.05.2017 Seite 14 Thursday, 18 May 2017 Page 14
Ausstellerforum, Fachforum und E-Mobility Forum 2017Exhibitor Forum, Industry Forum 2017and E-Mobility Forum
Mittwoch, 17.05.2017 Seite 5 - 6 Wednesday, 17 May 2017 Page 5 - 6
Dienstag, 16.05.2017 Seite 3 - 4 Tuesday, 16 May 2017 Page 3 - 4
Mittwoch, 17.05.2017 Seite 10 Wednesday, 17 May 2017 Page 10
Dienstag, 16.05.2017 Seite 9 Tuesday, 16 May 2017 Page 9
Donnerstag, 18.05.2017 Seite 7 - 8 Thursday, 18 May 2017 Page 7 - 8
Donnerstag, 18.05.2017 Seite 11 Thursday, 18 May 2017 Page 11
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Ausstellerforum Halle 7, Stand 507Exhibitor Forum hall 7, booth 507
Dienstag, 16.05.2017 Tuesday, 16 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
10:00 - 10:20 MES Manz Electronic Systeme OHG
Jun Chao SUN Characterize power material under pulse excitation
10:20 - 10:40 Alpha Assembly Solutions Gustavo Greca Double sided sintering and reliability confirmed by power cycling
10:40 - 11:00 Mentor Graphics David Sulyok Power electronics for automotive / transportation / EHV
11:00 - 11:20 Rohde & Schwarz GmbH & Co KG.
Thomas Rottach Solutions for accurate and safe power measurements
11:20 - 11:40 Sekels GmbH Stefan Becker Hochstromdrossel
11:40 - 12:00 Panasonic Automotive & Industrial Systems Europe GmbH
Tetsuzo Ueda GaN and SiC power device technologies
12:00 - 12:20 Siebel Elektronik GmbH Henrik Siebel High insulating power supplies: Strategic components in power electronics
12:20 - 12:40 RECOM Power GmbH Thomas Rechlin David schützt Goliat – DC/DC-Wandler für IGBT, SiC und andere Gate Treiber
12:40 - 13:00 Monolith Semiconductor, Inc.
Xuning Zhang Unleash SiC MOSFETs - Extract the best performance
13:00 - 13:20 A.L.M.T. Corp. Shinichi Yamagata ALMT's High Performance Heatspreader Materials for Power Devices and our NEW Products, Magnesium Silicon Carbide Composite and Metal Diamond Composite
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Ausstellerforum Halle 7, Stand 507Exhibitor Forum hall 7, booth 507
Dienstag, 16.05.2017 Tuesday, 16 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
13:20 - 13:40 Advanced Cooling Technologies Inc.
Pete Ritt Thermal management solutions for challenging power electronic applications
13:40 - 14:00 ON Semiconductor James Victory Physical SPICE Modeling for Wide Bandgap Devices
14:00 - 14:20 KEMET Electronics Corporation
Axel Schmidt Ceramic DC Link Capacitors in Wide Band Gap Applications
14:20 - 14:40 Littelfuse Corey Deyalsingh Fabricating rugged 1.2 KV SiC MOSFETs in a high-volume 150mm CMOS fab
14:40 - 15:00 AMS Technologies AG Konrad Laufs Reliable and compact water cooling pump stations utilize all integrated manifolds
15:00 - 15:20 ROGERS Corporation Dominik Pawlik Performance optimization of DC link systems
15:20 - 15:40 Indium Corporation of Europe
Andreas Karch Solder InForms for improved bondline control and enhanced reliability for substrate attach in IGBT power modules
15:40 - 16:00 Proton-Electrotex Alexey Cherkasov Proton-Electrotex production overniew and business perspectives
16:00 - 16:20 dSPACE GmbH Frank Puschmann Hardware-in-the-loop simulation of power electronics and electrical drives systems
16:20 - 16:40 EPCOS AG, A TDK Group Company
Natalia Iriondo EPCOS DC link capacitors for upcoming trends
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Ausstellerforum Halle 7, Stand 507Exhibitor Forum hall 7, booth 507
Mittwoch, 17.05.2017 Wednesday, 17 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
13:20 - 13:40 Diotec Semiconductor AG Udo Steinebrunner Next Generation Schottky Rectifiers - Taylor Made Solutions for Special Application Requirements
13:40 - 14:00 Tamura-Europe Ltd. Wolfgang Rath Gate driver module for SiC-MOSFET / IGBT SEMICONDUCTORS
14:00 - 14:20 Yole Developpement SA Pierric Gueguen Status of power packaging
14:20 - 14:40 VACUUMSCHMELZE GmbH & Co. KG
Frank Schnelle Magnetic components for EV charging
14:40 - 15:00 EPCOS AG, A TDK Group Company
Ayse Kartal AC filtering capacitor solutions with film technology from EPCOS
15:00 - 15:20 Jianghai Europe Electronic Components GmbH
Arne Albertsen Jianghai Power Film Capacitors
15:20 - 15:40 Sumitomo Electric Industries, Ltd.
Yasuki Mikamura SiC V-Groove Trench MOSFETs (VMOSFETs) and power modules with low on-state resistance
15:40 - 16:00 Schweizer Electronic AG Christian Rössle Hochtemperatur-Leiterplatten für Leistungselektronische Anwendungen
16:00 - 16:20 Hollmén & Co Ltd Simon Wright Laser welded cooling solutions for next generation heat sinks and liquid coolers
16:20 - 16:40 FuG Elektronik GmbH Sven Seifert Applications of high voltage power supplies for tests of power electronics
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Ausstellerforum Halle 7, Stand 507Exhibitor Forum hall 7, booth 507
Mittwoch, 17.05.2017 Wednesday, 17 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
09:40 - 10:00 Traftor Europe Guillaume Pasquet Toroidal inductors from 20kVA to 500kVA: How to achieve higher performance and cost reduction combining optimized design and manufacturing capability
10:00 - 10:20 Hitachi Metals Europe GmbH
Tohru Umeno Innovative power application – Energy management –
From the battery to the final product by raw materials
and components
10:20 - 10:40 Mitsubishi Electric Europe B.V.
Eugen Wiesner MITSUBISHI ELECTRIC high voltage power semiconductors: What are the upcoming technologies and trends?
10:40 - 11:00 Vincotech GmbH Guillem Gargallo New VINcoNPC X12 - three-level Modules for 1+ MW 1500 V Solar PV InvertersDC
11:00 - 11:20 Kapteos S.A.S. Lionel Duvillaret A breakthrough in electromagnetism diagnostics using innovative optical sensors
11:20 - 11:40 ABB Switzerland Ltd. - Semiconductors
Raffael Schnell Drive the future with LinPak, the new low inductive power IGBT module
11:40 - 12:00 SEMIKRON International GmbH
Bernhard Eichler 1500VDC in Solar? Whatever you need, SEMIKRON is ready!
12:00 - 12:20 Allegro MicroSystems, LLC
Roland Heene Dan Jacques
Automotive and industrial gate driver ICs for battery operated equipment
12:20 - 12:40 POCO Holding Co., Ltd. yunfan zhang New magnetic powder cores for high frequency power conversion with negative temperature characteristics
12:40 - 13:00 HEIDEN power GmbH Ralph WoidichRonald A. Sommerer
Leistungsmessung ein- und mehrphasiger Systeme
13:00 - 13:20 ROHM Semiconductor GmbH
Aly Mashaly Potential of SiC for automotive applications
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Ausstellerforum Halle 7, Stand 507Exhibitor Forum hall 7, booth 507
Donnerstag, 18.05.2017 Thursday, 18 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
09:40 - 10:00 MacMic Science & Technology Co., Ltd.
Kent Feng Cost Effective and High Performance Power Semiconductor for Inverter Welder and Power Source
10:00 - 10:20 POWERSYS Adrien Michel PSIM: Dynamic simulation platform for power electronics and motor drives
10:20 - 10:40 Analog Devices GmbH Tom Weingartner Connected Motion: ADI Deterministic Ethernet Solutions
10:40 - 11:00 Aperam Alloys Amilly Bashar Gony kµ magnetic core : An effective solution for the most demanding applications
11:00 - 11:20 EpiGaN nv Markus Behet From hype to reality: GaN/Si - where are we today?
11:20 - 11:40 Honeywell Europe N.V. Wilhelm Bloedorn High reliability thermal interface materials (TIMs) for advanced power applications
11:40 - 12:00 Exagan S.A. Eric Moreau Driving the GaN power device roadmap for large scale adoption
12:00 - 12:20 MB Electronic AG Helko Meuche New generation of magnetic materials, an optimum selection for power electronics
12:20 - 12:40 Amulaire Thermal Technology
Chihwei Wei Innovative design in IGBT cold plate
12:40 - 13:00 Wolverine Tube Inc. MicroCool Division
Matt Reeves High performance, cost effective, next generation liquid cooling
13:00 - 13:20 AC Power Corp. Daniel Tseng High power programmable AC and DC power source
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Ausstellerforum Halle 7, Stand 507Exhibitor Forum hall 7, booth 507
Donnerstag, 18.05.2017 Thursday, 18 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
13:20 - 13:40 Magnetics Inc. Donna Kepcia Smaller-faster-lower cost: Magnetic materials meet rigorous demands in today’s high power, fast-paced design landscape
13:40 - 14:00 Hangzhou Firstack Technology Co., Ltd.
Jun Li 1500V NPC PV drive solution
14:00 - 14:20 Yole Developpement SA Jonathan Liao Status of the Gate Driver industry
14:20 - 14:40 tesema Leistungselektronik
Mezmur Asressahegn smart and compact high voltage power supply for air cleaning
14:40 - 15:00 GT elektronik GmbH & Co. KG
Matthias Hecht Scalable real power metering for industry 4.0
15:00 - 15:20 DEWETRON GmbH Christoph Wiedner Analysis of Poly-phase Power Systems with DEWETRON’s Mixed Signal Power Analyzer
15:20 - 15:40 Panasonic Automotive & Industrial Systems Europe GmbH
Satoshi Endo Soft-PGS, new TIM for power module
15:40 - 16:00 Vincotech GmbH Michele Portico Embedded designs drive tomorrow’s solutions
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Fachforum Halle 6, Stand 143Industry Forum hall 6, booth 143
Dienstag, 16.05.2017 Tuesday, 16 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
10:30 - 11:00 Universität Rostock Jan Fuhrmann Research activities of the University of Rostock for future off-shore wind grids
11:00 - 11:30 Fuji Electric Europe GmbH Daniel Hofmann 3.3kV SiC hybrid technology combined with HPnC package
11:30 - 12:00 RWTH Aachen University Hannes Nordmann Added Value For Batterymanagementsystems – Same Hardware, More Informationen, More Safety, More Reliablity
12:15 - 13:15 Power Systems Design Kevin Parmenter Developing the next generation of power supplies
13:30 - 14:00 Fraunhofer IAF Richard Reiner Monolithicallyintegrated GaN circuits
14:00 - 14:30 Technische Universität Wien
Manfred Schrödl Der PLANETENMOTOR – Eine neue, unkonventionelle Kombination von Elektromotor und Planetengetriebe für kompakte elektrische Antriebe
14:30 - 15:30 ROHM Co., Ltd. Kazuhide Ino Benefits and reliability of SiC devices for industrial and automotive applications
15:30 - 16:30 Award Gewinner Leo Lorenz Presentations of the Conference Award Winners 2017
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Fachforum Halle 6, Stand 143Industry Forum hall 6, booth 143
Mittwoch, 17.05.2017 Wednesday, 17 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
10:00 - 11:30 Yole Développement Pierric Gueguen and invited speakers
Status and perspectives in power semiconductor (Si, SiC, GaN) business
11:30 - 12:30 Roland Berger Michael AlexanderWolfgang BernhartJonas Zinn
Automotive electronics battleground: Semiconductor vs.Tier-1 business model
12:30 - 13:30 Infineon Technologies AG Peter Friedrichs Next steps in the industrialization of SiC power switches
13:30 - 14:30 A Media, Bodo's Power Systems
Bodo Arlt SIC – Design, EMC and measurement
14:30 - 15:30 A Media, Bodo's Power Systems
Bodo Arlt GaN – Design, EMC and measurement
15:30 - 16:30 Plexim GmbH Felix Prauße Software and hardware solutions for HIL and RCP applications in power electronics
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Fachforum Halle 6, Stand 143Industry Forum hall 6, booth 143
Donnerstag, 18.05.2017 Thursday, 18 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
10:00 - 10:30 On Semiconductor Dominic Li Optimized high current IGBT gate driver improves system efficiency
10:30 - 11:30 Rohde & Schwarz GmbH & Co KG.
Josef Köppl Abwärme - eine Wärme, die keiner haben will. Neue Trends aus der Kühltechnologie
11:30 - 12:30 ECPE Lena Somschor Einführung in den students day
12:30 - 13:00 Monolith Semiconductor, Inc.
Sujit Banerjee SiC MOSFETs – How can we match the success of SiC diodes?
13:30 - 14:00 Brightek (Europe) Limited Joseph Hung NPI--A balancing act for engineers--Global component sourcing--
14:00 - 15:00 Danfoss Silicon Power GmbH
Alexander Streibel Boosting battery energy storage systems: Three-level power modules using SiC MOSFET
15:30- 16:00 ECPE Lena Somschor Verlosung Students Day
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E-Mobility-Forum Halle 6, Stand 326E-Mobility Forum hall 6, booth 326
Dienstag 16.05.2017 Tuesday 16 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
10:00 - 10:30 Fraunhofer IIS-B Bernd Eckardt Power Electronics for next Generation Electric Vehicles
10:30 - 11:00 Littelfuse Carlos Castro Solutions for a safer E-Mobility
11:00 - 11:30 Infineon Technologies Laurent Beaurenaut Silicon Carbide Inverters: The Future of Electromobility
11:30 - 12:00 Rohm Semiconductors Akifumi Enomoto Jochen Hüskens
SiC solutions for eMobility
12:00 - 14:00 Pause/ Break
14:00 - 14:30 Phoenix Contact Jens Eickelmann High Power Charging - Das Laden von Elektrofahrzeugen mit bis zu 350 kW
14:30 - 15:00 Rutronik
TU Chemnitz
Andreas Mangler
Thomas Günther
Erweiterte Analyse-Funktionen im Batterie Management System – Impedanzspektroskopie das Schlüsselelement in der Reichweitenprognose
15:00 - 15:30 Mitsubishi Electric Khalid Hussein High-power Semiconductors for E-Mobility: Rising prospects and performance expectations
15:30 - 16:00 Keysight Thomas Leifert Design challenges developing the Connected and Electrical Car of the future
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E-Mobility-Forum Halle 6, Stand 326E-Mobility Forum hall 6, booth 326
Mittwoch 17.05.2017 Wednesday 17 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
10:00 - 10:30 Fraunhofer IIS-B Bernd Eckardt Power Electronics for next Generation Electric Vehicles
10:30 - 11:00 Littelfuse Carlos Castro Solutions for a safer E-Mobility
11:00 - 11:30 Infineon Technologies Laurent Beaurenaut Silicon Carbide Inverters: The Future of Electromobility
11:30 - 12:00 Rohm Semiconductors Akifumi Enomoto Jochen Hüskens
SiC solutions for eMobility
12:00 - 14:00 Pause/ Break
14:00 - 14:30 Phoenix Contact Jens Eickelmann High Power Charging - Das Laden von Elektrofahrzeugen mit bis zu 350 kW
14:30 - 15:00 Rutronik
TU Chemnitz
Andreas Mangler
Thomas Günther
Erweiterte Analyse-Funktionen im Batterie Management System – Impedanzspektroskopie das Schlüsselelement in der Reichweitenprognose
15:00 - 15:30 Mitsubishi Electric Khalid Hussein High-power Semiconductors for E-Mobility: Rising prospects and performance expectations
15:30 - 16:00 Keysight Thomas Leifert Design challenges developing the Connected and Electrical Car of the future
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E-Mobility-Forum Halle 6, Stand 326E-Mobility Forum hall 6, booth 326
Donnerstag 18.05.2017 Thursday 18 May 2017
Uhrzeit Time Firma Company Referent Speaker Thema Topic
10:00 - 10:20 Dewesoft GmbHTU Leoben
Helmut Weiß Lithium-Ion-Batteries on Fire: Impressive Action + Demanding Measurement Task
10:20 - 10:40 ALPHA-Numerics GmbH Tobias Best 3D-CFD-Temperatursimulation von Automobilelektronik
10:40 - 11:00 WEVO-CHEMIE GmbH Artur Drachenberg Automobile Leistungselektronik – Innovative Verguss- und Klebelösungen
11:00 - 11:20 Schweizer Electronic AG Christian Rössle Sensor and Power PCBs for E-Mobility
11:20 - 11:40 SET Power Systems GmbH
Sebastian Liebig E-motor emulator: Testing power electronics without an E-motor
11:40 - 12:00 Panasonic Automotive & Industrial Systems Europe GmbH
Dieter Volm Ultrafast disconnection of high voltage DC systems with powerfuse
12:00 - 12:20 Facta Sam Mudge How fuse design can support OEMs and T1 OEMs achieve ISO26262
12:40 - 13:00 ON-Semiconductor Fabio Necco Power MOSFETs in Automotive Applications
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