philips bdp7500s2 (1.1) - service manual - eng

8/12/2019 Philips BDP7500S2 (1.1) - Service Manual - EnG

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Published by KC-LQ 1027 AVM Printed in the Netherlands

BDP7500S2

Subject to modi cation EN

Blue-Ray Disc Player

Contents Page Contents Page

Copyright 2010 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.

All rights reserved. No part of this publication may be reproduced, stored in a

retrieval system or transmitted, in any form or by any means, electronic,

mechanical, photocopying, or otherwise without the prior permission of Philips.

Version 1.1

1 Technical Specification and Connection Facilities and

Version variation

2 Laser Beam Safety Precautions..................................2-1

3 Important Safety Precautions ......................... 3-1 to 3-2

4 Safety Check After Servicing .................................... 4-1

6 Standard Notes For Servicing .................................. .6-1

7 Special Information BGA IC & Flat Pack-IC

5 Safety Information General Notes & Lead Free

8 Direction of Use ...............................................8-1 to 8-5

9 Cabinet Disassembly Instructions ................... 9-1 to 9-2

15 Main Unit--MCD Board

10 Troubleshooting ......................................... 10-1 to 10-2

11 Software Upgrading Procedure ............................. 11-1

12 Software Version Check ........................................ 12-1

13 Block Diagram ........................................................13-1

14 Wiring Diagram ...................................................... 14-1

16 Main Unit--VFD Display Board

17 Main Unit-- Touch Board

Layout Diagram ................................ 17-1

18 Main Unit--Decoder Board

19 Main Unit--Power Board

21 Main Unit Exploded View .......................................21-1

22 Packing Exploded View ..........................................22-123 OPU setting alignment procedure ..........................23-1

20 Main Unit--Output Board

................................................... 7-1 to 7-3

Circuit Diagram ..................18-1 to 18-12

Circuit Diagram ...............................19-1

Circuit Diagram ...............................20-1

Layout Diagram .............................18-13

Layout Diagram ..............................19-2

Layout Diagram ..............................20-2

............................................... 1-1 to 1-3

Circuit Diagram ................................. 15-1Layout Diagram ................................ 15-2

Circuit Diagram ................................. 16-1

Circuit Diagram ................................. 17-1

Layout Diagram ................................ 16-2

Requirement ............................ 5-1 to 5-2

314178535001

24 Revision List ...........................................................24-1


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1.1 PCB Locations

Technical Specification and Connection Facilities

1. Technical Specification and Connection Facilities

VFD Display

Board

Decoder Board

MCU BoardTouch Board

Led Board

Digital Signals Board

Power Board

Picture/Display Picture enhancement: High Def (720p, 1080i,

1080p), Progressive scan, Video upscaling Aspect ratio: 21:9, 16:9, 4:3 D/A converter: 12 bit / 150MHz Blu-ray 3D: Full HD 1080p

Video Playback Playback Media: BD Video, BD-R/RE 2.0, DVD,

DVD-Video, DVD+R/+RW, DVD-R/-RW, CD,CD-R/CD-RW, USB flash drive, DivX, BD-ROM,Video CD/SVCD

Compression formats: H.264, VC-1, MPEG2,XviD, DivX Plus HD, MKV, AVCHD, WMV

Disc Playback Modes: Standard Play, Pause, Search

forward/reverse, Slow Forward, Resume Playbackfrom Stop, Skip, Disc Menu, Repeat, A-B Repeat,Zoom, Angle

Video Enhancement: Deep Color, x.v. Color,Video Upscaling, Progressive Scan

BD Region Code: B DVD Region Code: 2

Sound Sound System: DTS-HDMaster Audio,Dolby True

HD, Dolby Digital Plus, DTS, Dolby Digital Signal to noise ratio: 105 dB Dynamic Range (1kHz): 100 dB Frequency response: 100 Hz D/A converter: 24 bit, 192 kHz

Audio Playback Playback Media: CD, CD-R/RW, MP3-CD, MP3-

DVD, USB flash drive Compression format: DTS, Dolby Digital, AAC,

MP3, PCM, WMA

Digital Photo Playback

Playback Media: USB flash drive, DVD+R/+RW,DVD-R/-RW, CD-R/RW

Picture Compression Format: JPEG Picture Enhancement: High Definition Resolution,

Slideshow, Slideshow with MP3 playback, Rotate,Zoom

Power Power supply: 220-240V, 50/60 Hz Power consumption: 22 W Standby power consumption: 0.25W


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Technical Specications and Connection Facilities

1.6 Analog Video Preformance

1.6.1 CVBS Output Component

Amplitude Output : 1000mVpp 10%White Bar : 714mVpp 10%

Sync. Amplitude : 286mVpp 10%

Chroma / Luminunce Delay(2T pulse)

Amplitude Output : 1000mVpp 10%White Bar : 714mVpp 10%Sync. Amplitude : 286mVpp 10%

Chroma / Luminunce Delay(2T pulse)

1.6.2 Video Output Component

COMPONENT VIDEO OUT Cinch (Y/Pb/Pr):According to EIA-770-1-A, EIA-770-2-A

1.7 Digital Inputs

1.7.1 (AUDIO OUT) COAXIAL DIGITAL OUT Cinch

LPCM : according IEC 60958-3MPEG 1, MPEG 2, A C3 : according IEC 61937DTS : according IEC 61937 +

addendum

1.7.2 USB

Compatibility : USB 2.0Type of connector : Series A Connector

1.7.3 HDMI Output

Compatibility : HDMI version 1.3Type of connector : Type A connector

(19 pins)

1.8 Video Performance

1.8.1 SNR

PAL

RGB CVBS Y/C

Y

NTSC

Y Pb Pr CVBS Y/C

Y

1.8.2 Bandwidth

PALRGB CVBS Y/C

0.5 to 4 MHz:+1dB/-2dB

0.5 to 4 MHz:+1dB/-2dB

Y:4.8MHz-3dB

4.8 MHz:-3dB 4.8 MHz:-3dB C:700 kHz

5.8 MHz:-6dB 5.8 MHz:-6dB

NTSC

YPbPr CVBS Y/C

4.2 MHz:-3dB 4.2 MHz:-3dB Y:4.2MHz-3dB

5.8 MHz:-6dB 5.8 MHz:-6dB

With Pscan:

8.4MHz -3dB

1-2


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Technical Speci cations and Connection Facilities

1.9 Dimension and Weight

Set Dimension W x H x D : 790.6 x 145 x 57.4 mm

gk32.2:thgieWteN

Subwoofer Dimension W x H x D : 182 x 365 x 306 mm

gk6:thgieWteN

2.0 Laser Output Power & Wavelength

2.0.1 DVD

Output power during reading : 7mW

Output power during writing : 6mW

)C52ta(mn08:htgnelevaW

2.0.2 CD

Wm6:rewoptuptuO

)C52ta(mn06:htgnelevaW

2.1 Playability

Video Playback1. Playback Media:

CD-R/CD-RW, DVD+R/+RW,

DVD-R/-RW, DVD-Video, Video

CD/SVCD, DVD+R DL, DVD-R

x

2. Compression Formats:

MPEG2, MPEG1, DivX 3.11, DivX

4.x, DivX 5.x, DivX 6.0, MPEG4

x

Audio Playback

1. Playback Media:

Audio CD, CD-R/RW, DVD+R DL,

DVD+R/+RW, DVD-R/-RW, MP3-

WMA-CD

x

2. Compression Format:

Dolby Digital, MP3, MPEG2

Multichannel, PCM, WMA

x

3. MPEG1 bit rates: 64-384 kbps

and VBR

x

Still Picture Playback

1. Playback Media: CD-R/RW,

DVD+R DL, DVD+R/+RW, DVD-

R/-RW, Picture CD, USB Digital

x

2. Picture Compression Format:

JPEG, JPEG digital camera

photos

x

3. Picture enhancement: Slideshow

with MP3 playback, Createalbums, Rotate, Slideshow with

music playback, Zoom

x

1-3

Type /Versions:

Features

Board in used:

BDP7500S2

Service policy

VFD DISPLAY BOARD

* TIPS : C -- Component Lever Repair.

M -- Module Lever Repair

-- Used

Feature diffrence

RDS

VOLTAGE SELECTOR

ECO STANDBY

Type /Versions:

12/

VERSION VARIATION

C

DECODER BOARD

BDP7500S2

C

C

DIGITAL SIGNALS BOARD

C/M

C/M

CC

/93 /98

DTS

POWER BOARD

MCU BOARD

M

M

M

/05 /51 /55

12/ /93 /98/05 /51 /55

TOUCH BOARD

LED BOARD

M

C

C

CC

M

M

M

C

M

M

C/M

C/M

C

M

C

M

M


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Laser Beam Safety Precautions

This Blu-Ray player uses a pickup that emits a laser beam.

The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keepyour eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser

beam.CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result inhazardous radiation exposure.

Location: Inside Top of Blu-Ray mechanism.

Do not look directly at the laser beam comingfrom the pickup or allow it to strike against yourskin.

Drive Mechanism Assembly

Laser Beam Radiation

Laser Pickup

Turntable

2-1


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Electronics N.V. bears no responsibilityfor improper wall mounting that results inaccident, injury or damage.

For speakers with stands, use only thesupplied stands. Secure the stands tothe speakers tightly. Place the assembledstands ont, level surfaces that cansupport the combined weight of thespeaker and stand.Never place the product or any objectson power cords or on other electricalequipment.

If the product is transported intemperatures below 5C, unpack theproduct and wait until its temperaturematches room temperature beforeconnecting it to the power outlet.Visible and invisible laser radiation whenopen. Avoid exposure to beam.Do not touch the disc optical lens insidethe disc compartment.

Risk of overheating!Never install this product in a connedspace. Always leave a space of at leastfour inches around the product forventilation. Ensure curtains or other

objects never cover the ventilation slotson the product.

Risk of contamination!Do not mix batteries (old and new orcarbon and alkaline, etc.).Remove batteries if they are exhaustedor if the remote control is not to be usedfor a long time.Batteries contain chemical substances,they should be disposed of properly.

Product care

Do not insert any objects other than discsinto the disc compartment.Do not insert warped or cracked discsinto the disc compartment.Remove discs from the disc compartmentif you are not using the product for anextended period of time.

Only use microfiber cloth to clean theproduct.

Important

Important Safety Precautions

Read and understand all instructions before you useyour home theater. If damage is caused by failure tofollow instructions, the warranty does not apply.

Safety

Riskof electricshockorre!Never expose the product and

accessories to rain or water. Never placeliquid containers, such as vases, near theproduct. If liquids are spilt on or into theproduct, disconnect it from the poweroutlet immediately. Contact PhilipsConsumer Care to have the productchecked before use.Never place the product and accessoriesnear nakedames or other heat sources,including direct sunlight.Never insert objects into the ventilationslots or other openings on the product.Where the mains plug or an appliance

coupler is used as the disconnect device,the disconnect device shall remain readilyoperable.Disconnect the product from the poweroutlet before lightning storms.When you disconnect the power cord,always pull the plug, never the cable.

Riskof short circuit orre!Before you connect the product to thepower outlet, ensure that the powervoltage matches the value printed on theback or bottom of the product. Neverconnect the product to the power outletif the voltage is different.

Risk of injury or damage to the home theater!For wall-mountable products, use onlythe supplied wall mount bracket. Securethe wall mount to a wall that can supportthe combined weight of the productand the wall mount. Koninklijke Philips

3-1


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User manual CD

To read the complete user manual, whichincludes information on advanced features, usethe CD supplied with your home theater. Fora printed copy of the complete user manual,contact Philips Consumer Care in your country.

To access the user manual

Caution

The user manual CD is for PC or Mac only. Do

not insert the user manual CD into the disccompartment of the home theater.

Requirements:A PC (Microsoft Windowscompatible) or Mac (OS X) withCD-ROM

Adobe Reader

1 Insert the user manual CD into the CD-ROM tray of the PC or Mac.

2 Close the CD-ROM tray.The user manual screen appears. If theuser manual screen does not appear,

skip Step3 and navigate to thepdffolder in the CD-ROM, double-clickingthe PDF of your choice.

3 Click a user manual language.Acrobat Reader launches, displayingthe complete user manual in thelanguage of your choice.

Disposal of your old product andbatteries

Your product is designed and manufacturedwith high quality materials and components,which can be recycled and reused.

When this crossed-out wheeled bin symbol

is attached to a product it means that theproduct is covered by the European Directive2002/96/EC. Please inform yourself about thelocal separate collection system for electricaland electronic products.Please act according to your local rules anddo not dispose of your old products with yournormal household waste.Correct disposal of your old product helps toprevent potential negative consequences forthe environment and human health.

Your product contains batteries covered bythe European Directive 2006/66/EC, whichcannot be disposed with normal householdwaste.Please inform yourself about the local ruleson separate collection of batteries becausecorrect disposal helps to prevent negativeconsequences for the environmental andhuman health.

Important Safety Precautions

3-2


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4-1

Safety Check after Servicing

Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts, andwires have been returned to their original positions. Afterwards, do the following tests and confirm the specifiedvalues to verify compliance with safety standards.

1. Clearance Distance

When replacing primary circuit components, confirmspecified clearance distance (d) and (d) betweensoldered terminals, and between terminals andsurrounding metallic parts. (See Fig. 1)

Table 1: Ratings for selected area

Note: This table is unofficial and for reference only. Besure to confirm the precise values.

2. Leakage Current Test

Confirm the specified (or lower) leakage currentbetween B (earth ground, power cord plug prongs) andexternally exposed accessible parts (RF terminals,antenna terminals, video and audio input and outputterminals, microphone jacks, earphone jacks, etc.) islower than or equal to the specified value in the tablebelow.

Measuring Method (Power ON):

Insert load Z between B (earth ground, power cord plugprongs) and exposed accessible parts. Use an ACvoltmeter to measure across the terminals of load Z.See Fig. 2 and the following table.

Table 2: Leakage current ratings for selected areas

Note: This table is unofficial and for reference only. Be sure to confirm the precise values.

AC Line Voltage Clearance Distance (d), (d)

110V~220V 3.2 mm (0.126 inches)

AC Line Voltage Load Z Leakage Current (i) Earth Ground (B) to:

110V~220V0.15 F CAP. & 1.5 k RES.

Connected in paralleli 0.5 mA Peak Exposed accessible parts

Chassis or Secondary Conductor

Primary Circuit

Fig. 1

d' d

AC Voltmeter(High Impedance)

Exposed Accessible Part

B Earth GroundPower Cord Plug Prongs

Z

Fig. 2


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1 Safety Instructions

1.1 General Safety

Safety regulations require that during a repair: Connect the unit to the mains via an isolation transformer. Replace safety components, indicated by the symbol ,

only by components identical to the original ones. Anyother component substitution (other than original type)

Safety regulations require that after a repair, you must returnthe unit in its original condition. Pay, in particular, attention tothe following points: Route the wires/cables correctly

mounted cable clamps.

damage.

Check the electrical DC resistance between the mainsplug and the secondary side:1. Unplug the mains cord, and connect a wire between

the two pins of the mains plug.2. Set the mains switch to the on position (keep the

mains cord unplugged!).3. Measure the resistance value between the mains

plug and the front panel, controls, and chassisbottom.

4. Repair or correct unit when the resistance

5. Verify this, before you return the unit to the customer/user (ref. UL-standard no. 1492).

6. Switch the unit off, and remove the wire between thetwo pins of the mains plug.

1.2 Laser Safety

This unit employs a laser may remove the cover, or attempt to service this device (dueto possible eye injury).

Laser Device UnitresalrotcudnocimeS:epyT

sAlAaGWavelength : 650 nm (DVD)

)DC/DCV(mn087:Output Power : 20 mW

)gnitirwWR+DVD(Wm8.0:

)gnidaerDVD(

Wm3.0:)gnidaerDC/DCV(

Beam divergence : 60 degree

CLASS 1LASER PRODUCT

1-2erugiF

Note: Use of controls or adjustments or performance ofprocedure other than those specied herein, may result in

A

2 Warnings

2.1 General

All ICs and many other semiconductors are susceptible toelectrostatic discharges (ESD, ). Careless handlingduring repair can reduce li fe drastically. Make sure that,during repair, you are at the same potential as the massof the set by a wristband with resistance. Keepcomponents and tools at this same potential.

Available ESD protection equipment: Complete kit ESD3 (small tablemat, wristband,

4822 310 10671.

Wristband tester 4822 344 13999. Be careful during measurements in the live voltage

section. The primary side of the power supply, includingthe heatsink, carries live mains voltage when you

connect the player to the mains (even when theplayer is off!). It is possible to touch copper tracks and/or components in this unshielded primary area, whenyou service the player. Service personnel must takeprecautions to prevent touching this area or componentsin this area. A lightning stroke and a stripe-markedprinting on the printed wiring board, indicate the primaryside of the power supply.

Never replace modules, or components, while the unit ison.

2.2 Laser

The use of optical instruments with this product, will

Only qualied service personnel may remove the cover orattempt to service this device, due to possible eye injury.

Repair handling should take place as much as possiblewith a disc loaded inside the player.

T shield:

Figure 2-2

Safety Information, General Notes & Lead Free Requirements

CAUTION VISIBLEAND INVISIBLE LASER RADIATION WHEN OPENAVOID EXPOSURETO BEAMADVARSEL SYNLIG OG USYNLIG LASERSTRLING VED BNING UNDG UDSTTELSE FOR STRLINGADVARSEL SYNLIG OG USYNLIG LASERSTRLING NR DEKSEL PNES UNNG EKSPONERING FOR STRLENVARNING SYNLIG OCH OSYNLIG LASERSTRLNING NR DENNA DEL R PPNAD BETRAKTA EJ STRLENVARO! AVATTAESSA OLETALTTIIN A NKYVLLE JA NKYMTTMLLE LASER STEILYLLE. L KATSO STEESEENVORSICHT SICHTBARE UNDUNSICHTBARE LASERSTRAHLUNG WENNABDECKUNG GEFFNETNICHT DEM STRAHLAUSSETSENDANGER VISIBLEAND INVISIBLE LASER RADIATION WHEN OPEN AVOID DIRECT EXPOSURE TO BEAM

ATTENTION RAYONNEMENT LASER VISIBLE ET INVISIBLE EN CAS DOUVERTURE EXPOSITION DANGEREUSEAU FAISCEAU

5-1


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Safety Information, General Notes & Lead Free Requirements

3 Lead Free Requirement

Information about Lead-free produced sets

Philips CE is starting production of lead-free sets from1.1.2005 onwards.

INDENTIFICATION:

Regardless of special logo (not always indicated)

One must treat all sets from 1 Jan 2005 onwards, accordingnext rules.

Example S/N:

Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 ishe week number, so in this case 1991 wk 18

So from 0501 onwards = from 1 Jan 2005 onwards

mportant note: In fact also products of year 2004 must be treated in this way as long as youavoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higheremperatures belong to this.

Due to lead-free technology some rules have to be respected by theworkshop during a repair:

Use only lead-free solder alloy Philips SAC305 withorder code 0622 149 00106. If lead-free solder-pateis required, please contact the manufacturer of yoursolder-equipment. In general use of solder-paste withinworkshops should be avoided because paste is not easyto store and to handle.

Use only adequate solder tools applicable for lead-freesolder alloy. The solder tool must be able

o To reach at least a solder-temperature of 400C, o To stabilize the adjusted temperature at the solder-

tip o To exchange solder-tips for different applications.

Adjust your solder tool so that a temperature around360C 380C is reached and stabilized at the solder

joint. Heating-time of the solder-joint should not exceed

~ 4 sec. Avoid temperatures above 400C otherwisewear-out of tips will rise drastically and destroyed. To avoid wear-out of tips switch off un-usedequipment, or reduce heat.

Mix of lead-free solder alloy / parts with leaded solderalloy / parts is possible but PHILIPS recommends stronglyto avoid mixed solder alloy types (leaded and lead-free).If one cannot avoid or does not know whether product islead-free, clean carefully the solder-joint from old solderalloy and re-solder with new solder alloy (SAC305).

Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities) has

to be purchased at external companies.Special information for BGA-ICs:

- always use the 12nc-recognizable soldering temperature A (for de-soldering always usethe lead-free temperature prole, in case of doubt)- lead free BGA-ICs will be delivered in so-called dry-packaging (sealed pack including a silica gel pack) toprotect the IC against moisture. After opening, dependentof MSL-level seen on indicator-label in the bag, theBGA-IC possibly still has to be baked dry. (MSL=MoistureSensitivity Level). This will be communicated via AYS-website.

Do not re-use BGAs at all.

For sets produced before 1.1.2005 (except products of2004), containing leaded solder-alloy and components,all needed spare-parts will be available till the end of theservice-period. For repair of such sets nothing changes.

On our website www.atyourservice.ce.Philips. com

BGA-de-/soldering (+ baking instructions)

Heating-proles of BGAs and other ICs used in Philips-sets

You will nd this and more technical information withinthe magazine, chapter workshop news.

For additional questions please contact your local repair-helpdesk.

5-2


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6-1

Standard Notes for Servicing

Circuit Board Indications1. The output pin of the 3 pin Regulator ICs is

indicated as shown.

2. For other ICs, pin 1 and every fifth pin areindicated as shown.

3. The 1st pin of every male connector is indicated asshown.

Instructions for Connectors1. When you connect or disconnect the FFC (FlexibleFoil Connector) cable, be sure to first disconnectthe AC cord.

2. FFC (Flexible Foil Connector) cable should beinserted parallel into the connector, not at anangle.

Pb (Lead) Free Solder

When soldering, be sure to use the Pb free solder.

Information about lead-free solderingPhilips CE is producing lead-free sets from 1.1.2005onwards.

IDENTIFICATION

Regardless of special logo (not alwaysindicated)

One must treat all sets fromonwards, according to the next rule:Serial Number gives a 14-digit. Digit 5&6 shows theYEAR, and digit 7&8 shows the WEEK.

So from onwards=from 1 Jan 2005 onwards

Important note : In fact also products of year 2004

must be treated in this way as long as you avoid

mixing solder-alloys (leaded/ lead-free). So best to

always use SAC305 and the higher temperatures

belong to this.

Due to lead-free technology some rules have to berespected by the workshop during a repair:

Use only lead-free solder alloy Philips SAC305 withorder code 0622 149 00106. If lead-free solder-paste is required, please contact the manufacturer

of your solder-equipment. In general use of solder-paste within workshops should be avoided becausepaste is not easy to store and to handle.

Use only adequate solder tools applicable for lead-free solder alloy. The solder tool must be able

To reach at least a solder-temperature of 400C,

To stabilize the adjusted temperature at the solder-tip

To exchange solder-tips for different applications.

Adjust your solder tool so that a temperature around360C - 380C is reached and stabilized at the

solder joint. Heating-time of the solder-joint shouldnot exceed ~ 4 sec. Avoid temperatures above400C otherwise wear-out of tips will rise drasticallyand flux-fluid will be destroyed. To avoid wear-out oftips switch off un-used equipment, or reduce heat.

Mix of lead-free solder alloy / parts with leadedsolder alloy / parts is possible but PHILIPSrecommends strongly to avoid mixed solder alloytypes (leaded and lead-free).If one cannot avoid or does not know whetherproduct is lead-free, clean carefully the solder-jointfrom old solder alloy and re-solder with new solder

alloy (SAC305). Use only original spare-parts listed in the Service-Manuals. Not listed standard-material (commodities)has to be purchased at external companies.

Top View

Out In

Bottom View

Input

5

10

Pin 1

Pin 1

FFC Cable

Connector

CBA

* Be careful to avoid a short circuit.

1 Jan 2005

0501


12/55

7-1

Special information for BGA-ICs:- always use the 12nc-recognizable solderingtemperature profile of the specific BGA (for de-

soldering always use the lead-free temperatureprofile, in case of doubt)- lead free BGA-ICs will be delivered in so-called'dry-packaging' (sealed pack including a silica gelpack) to protect the IC against moisture. Afteropening, dependent of MSL-level seen on indicator-label in the bag, the BGA-IC possibly still has to bebaked dry. (MSL=Moisture Sensitivity Level). Thiswill be communicated via AYS-website.Do not re-use BGAs at all.

For sets produced before 1.1.2005 (except productsof 2004), containing leaded solder-alloy and

components, all needed spare-parts will be availabletill the end of the service-period. For repair of suchsets nothing changes.

On our websitewww.atyourservice.ce.Philips.com you find moreinformation to:

BGA-de-/soldering (+ baking instructions)

Heating-profiles of BGAs and other ICs used inPhilips-sets

You will find this and more technical information withinthe magazine, chapter workshop news.

For additional questions please contact your localrepair-helpdesk.

How to Remove / Install Flat Pack-IC

Special Information of BGA IC & Flat Pack-IC

1. Removal

With Hot-Air Flat Pack-IC Desoldering Machine:

1. Prepare the hot-air flat pack-IC desolderingmachine, then apply hot air to the Flat Pack-IC(about 5 to 6 seconds). (Fig. S-1-1)

2. Remove the flat pack-IC with tweezers whileapplying the hot air.

3. Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heat

up. Then remove (glue will be melted). (Fig. S-1-6)4. Release the flat pack-IC from the CBA using

tweezers. (Fig. S-1-6)

CAUTION:

1. The Flat Pack-IC shape may differ by models. Usean appropriate hot-air flat pack-IC desolderingmachine, whose shape matches that of the FlatPack-IC.

2. Do not supply hot air to the chip parts around theflat pack-IC for over 6 seconds because damageto the chip parts may occur. Put masking tape

around the flat pack-IC to protect other parts fromdamage. (Fig. S-1-2)

Fig. S-1-1


13/55

3. The flat pack-IC on the CBA is affixed with glue, sobe careful not to break or damage the foil of eachpin or the solder lands under the IC whenremoving it.

With Soldering Iron:

1. Using desoldering braid, remove the solder fromall pins of the flat pack-IC. When you use solderflux which is applied to all pins of the flat pack-IC,you can remove it easily. (Fig. S-1-3)

2. Lift each lead of the flat pack-IC upward one byone, using a sharp pin or wire to which solder willnot adhere (iron wire). When heating the pins, usea fine tip soldering iron or a hot air desolderingmachine. (Fig. S-1-4)

3. Bottom of the flat pack-IC is fixed with glue to the

CBA; when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)

4. Release the flat pack-IC from the CBA usingtweezers. (Fig. S-1-6)

With Iron Wire:

1. Using desoldering braid, remove the solder fromall pins of the flat pack-IC. When you use solderflux which is applied to all pins of the flat pack-IC,you can remove it easily. (Fig. S-1-3)

2. Affix the wire to a workbench or solid mountingpoint, as shown in Fig. S-1-5.

3. While heating the pins using a fine tip solderingiron or hot air blower, pull up the wire as the soldermelts so as to lift the IC leads from the CBAcontact pads as shown in Fig. S-1-5.

4. Bottom of the flat pack-IC is fixed with glue to theCBA; when removing entire flat pack-IC, first applysoldering iron to center of the flat pack-IC and heatup. Then remove (glue will be melted). (Fig. S-1-6)

5. Release the flat pack-IC from the CBA usingtweezers. (Fig. S-1-6)

Note: When using a soldering iron, care must be

taken to ensure that the flat pack-IC is notbeing held by glue. When the flat pack-IC isremoved from the CBA, handle it gentlybecause it may be damaged if force is applied.

Hot-air

Flat Pack-ICDesolderingMachine

CBA

Flat Pack-IC

Tweezers

MaskingTape

Fig. S-1-2

Flat Pack-IC Desoldering Braid

Soldering Iron

Fig. S-1-3

Fine TipSoldering Iron

SharpPin

Fig. S-1-4

To SolidMounting Point

Soldering Iron

Iron Wire

or

Hot Air Blower

Fig. S-1-5

Fine TipSoldering IronCBA

Flat Pack-ICTweezers

Fig. S-1-6

7-2


14/55

7-3

2. Installation1. Using desoldering braid, remove the solder from

the foil of each pin of the flat pack-IC on the CBA

so you can install a replacement flat pack-IC moreeasily.

2. The mark on the flat pack-IC indicates pin 1.(See Fig. S-1-7.) Be sure this mark matches the 1on the PCB when positioning for installation. Thenpresolder the four corners of the flat pack-IC. (SeeFig. S-1-8.)

3. Solder all pins of the flat pack-IC. Be sure thatnone of the pins have solder bridges.

Instructions for Handling Semi-

Special Information BGA IC & Flat Pack-IC

conductors

Electrostatic breakdown of the semi-conductors mayoccur due to a potential difference caused byelectrostatic charge during unpacking or repair work.

1. Ground for Human Body

Be sure to wear a grounding band (1 M) that isproperly grounded to remove any static electricity thatmay be charged on the body.

2. Ground for Workbench

Be sure to place a conductive sheet or copper platewith proper grounding (1 M) on the workbench or

other surface, where the semi-conductors are to beplaced. Because the static electricity charge onclothing will not escape through the body groundingband, be careful to avoid contacting semi-conductorswith your clothing.

Example :

Pin 1 of the Flat Pack-ICis indicated by a " " mark. Fig. S-1-7

Presolder

CBA

Flat Pack-IC

Fig. S-1-8

CBA

Grounding Band

Conductive Sheet orCopper Plate

1M

1M

CBA


15/55

Direction of Use

8-3

Option 1: Connect to the HDMI jack

1 Connect an HDMI cable (not supplied) to:the HDMI jack on this product.the HDMI input jack on the TV.

Tip

If the TV has a DVI connector only, connect via an HDMI/DVI adaptor. Connect an audio cable for sound output.You can optimize the video output.Press the HDMIbutton repeatedly to select thebest resolution the TVcansupport.If this productconnects to a TV compatible with1080por 1080p/24Hz, Philips recommends HDMI category 2cable, also known as High Speed HDMI cable, for optimalvideo and audio output.To play thedigital video imagesof a BD-video or DVD-video via an HDMI connection, it is necessary that boththis product andthe display device(or an AV receiver/ampler) support a copyright protection system calledHDCP (high-bandwidth digital content protection system).This typeof connection provides bestpicturequality.

Option 2: Connect to the componentvideo jack

1 Connect the component video cables(not supplied) to:

HDMI IN

PbY Pr

AUDIO IN

the Y Pb/Cb Pr/Crjacks on this product.the COMPONENT VIDEO input jackson the TV.

2 Connect the audio cables to:the LINE OUT/AUDIO -L/R jacks onthis product.the AUDIO input jacks on the TV.

Tip

The component video input jack on the TV might belabeled as Y Pb Pr or YUV.

Option 3: Connect to the compositevideo jack

1 Connect a composite video cable to:the VIDEOjack on this product.

the VIDEO input jack on the TV.2 Connect the audio cables to:

the LINE OUT/AUDIO -L/R jacks on thisproduct.the AUDIO input jacks on the TV.

Tip

The video input jack onthe TV might be labeled as A/VIN, VIDEO IN, COMPOSITE or BASEBAND.

Route audio to other devices

You can route the audio from this product to otherdevices.

AUDIO IN

VIDEO IN


16/55

Direction of Use

8-4

Connect to HDMI-compliant AV receiver/

1 Connect an HDMI cable (not supplied) to:the HDMI jack on this product.the HDMI jack input jack on the device.

Tip

The HDMI connection provides best audio quality.

Connect to multi-channelAV receiver/

1 Connect the 7.1-channel audio cables (notsupplied) to:

the 7.1 CH AUDIO OUTPUTjacks onthis product.the corresponding AUDIO input jacks

on the device.

HDMI IN

7.1CHAUDIO IN

Tip

To connect 5.1-channel AV receiver/amplier, connectthe 7.1-channel audio jacks exceptthe SL/SR jacks.You can optimize the speaker output (see Adjustsettings >[Audio Setup]>[Speaker Setup] ).

Connect to digitalA receiverConnect to coaxial jack

COAXIAL

COAXIAL

1 Connect a coaxial cable (not supplied) to:the COAXIAL jack on this product.the COAXIAL/DIGITAL input jack onthe device.

Connect to optical jack

1 Connect an optical cable (not supplied) to:the OPTICALjack on t his product.the OPTICAL/DIGITAL input jack on thedevice.

OPTICAL

OPTICAL


17/55

Direction of Use

8-5

Connect analogue stereo system

1 Connect the audio cables to:the LINE OUT/AUDIO -L/R jacks onthis product.the AUDIO input jacks on the device.

Connect a USB device1 Connec t a USB device to the (US B) jack

on the front panel of this product.

Note

Press , and select[BrowseUSB]in the menu to accessthe content andplay theles.Connect a USB deviceonly to the jack on the frontpanel of this product.Philips does not guarantee compatibility withall USBdevices.

Connect a networkWith a wired or wireless connection (see Get

started > Set up a network), you can connectthis product to:the Internet (for software update/BDLive/Net TV service).or a home network (to access mediaesfrom a DLNA media server, e.g. PC).

Note

Internet access to Philips websitefor software updatemaynot be allowed, dependingon the router youuseor the Internet Service Providerspolicy. Contact yourInternet Service Provider for moreinformation.

AUDIO IN


18/55

9-1

Cabinet Disassembly Instructions

1. Disassembly Flowchart

This flowchart indicates the disassembly steps to gainaccess to item(s) to be serviced. When reassembling,follow the steps in reverse order. Bend, route, anddress the cables as they were originally.

2. Disassembly Method

Note:

(1) Identification (location) No. of parts in the figures

(2) Name of the part

(3) Figure Number for reference

(4) Identification of parts to be removed, unhooked,

unlocked, released, unplugged, unclamped, ordesoldered.Axx = Screw, CNxx/Jxx/CONxx = ConnectorD3.5X12BA is specification of screw.

* = Unhook, Unlock, Release, Unplug, or Desolder

e.g. 7(A01) = seven Screws

ID/Loc.No.

Part

Removal

Fig.No.

Remove/*Unhook/Unlock/Release/Unplug/Desolder

Note

[3] DVD Loader Driver,Optical Socket Board,Radio Transmit Board

DVD LoaderDriver,Optical SocketBoard,Radio TransmitBoard

[4] L/R Speaker,Door U/D Control Board

L/R Speaker,Door U/D ControlBoard

[5] DVD Door

DVD Door

[6] Display Board,Door L/R Control Board,Touch Buttom Board

Display Board,Door L/R ControlBoard,Touch ButtomBoard

[2] Decoder Board

Decoder Board

[1] TOP Cover

[1]

[2]

[3]

[4]

[5]

[6]

TOP Cover 4(A01) D3x6KMTT,

4(A02) D3x6BM,2(A03) D3x10PA

12(A03) D3x10BA,

1(A08) D2x3FB

1(A06) D2.6x6BB

5(A02) D2x3FB,2(A05) D3x8PA,2(A05) D2.6x6BB

2(A04) D3x10FA,2(A06) D2.6x6BB,4(A10) D2.6x10PWT

D1

D2

D3

D4

D5

D7

D6

Fig. D1

Fig. D2

A01

A02

A02

A03

A01


19/55

9-2

Fig. D3 Fig. D6

Fig. D7

Fig. D4

Fig. D5

Cabinet Disassembly Instructions

A06

A05

A02

A04

A04

A08

A03


20/55

Troubleshooting

FLOW CHART NO.1

The power cannot be turned on.

Check the Power Cable connect is ok or not

Yes

Yes

No

No

No

No

No

No

No

Check the fuse which location are F1& F1A is normal or not.Check CN1 connector Voltage is 5V or notin PSU Power Board

Yes

NO

Check transformer secondary coil if has voltage output Replace the power board

Press power switch, mianframe light is flash but VFD has no signal

Check location Q102 diode on MCU board is normal or not

Check location No CN4 in power board if has normal voltage:12V,5V,A12V,A-12V,and check CN2 in power board if hasnormal voltage:AC3.3V,AC3.3V,-30V.+5V

Yes

Yes

Yes

Yes

No

Check location CE101 on MCU board voltageis 3.3V or not.

Check location L103 on MCU board voltage is 5V or not.

Yes

No

Check locatoin No U201 PT6312 in VFD board if hasnormal voltage:#27 -30V,#14,38 5V

Check location No from PSU to PT6312 if voltage super track isshort circuit or cut circuit

Use Oscillograph to check VFD data cable if has normal nignalor not, the check pin is #5,#6DATA,#8 CLK,#9 STB.

Check data cable which connect the port and VFD board iscut circuit or not, if cut circuit, please repair it . Check Decoder board power supply is correct or not.

Check pins connector which location is PWR1

voltage if is 12V,5V,A12V,A-12V.

Check AP1538 which location is U2 if has 1.1V output and

capacitor which location is CE3 is working normal or not

Check AP1538 which location is U4 if has 1.8V

output and capacitor which location is CE24 is

working normal or not,

Check the pin#1,#2,#3 of IC9435 which location

is U11 if has 5V output

Check IC1117 which location is U3 if has 3.3V output

and capacitor which location is C16 is working normal or not


and capacitor which location is CE2 is working normal or not


and capacitor which location is C18 is working normal or not

Replace this IC.

No Replace this IC.

No Replace this IC.

NoReplace this IC.

No Replace this IC.

Check MOSI is bad or not

Check fuse which lacation is F1,F1A if is bad or not.

Yes or No,Pleae confirm it

Yes or No,Pleae confirm it

Yes

Yes

Yes

Yes

Yes

Yes

Check transformer which location is T3 is bad or not

Check pin #4,#5,#6 STB,CLK,DATA of port J2 in decoder board tosee the signal is normal or not.

Check lacation no is C5 wchich voltage is 250v or not

NoReplace the power board

10-1


21/55

Fourthly Step:

FLOW CHART NO.2

FLOW CHART NO.3

FLOW CHART NO.4

FLOW CHART NO.5

Pass in and out can not read dish sometime.

Can not read dish

Line out no sound

Can not pass in and out

Check dish if put on the right position or not.

Check pin connector location XP4 at decoder board is loose or not

Check flat flexible cable locatio XP6 is loose or not

Check optical ,coaxial if has output

Check dish if cleanlily or not.

Fifthly Step:

If power supply is normal,check IC G690L which location isU5 voltage is 3.3V or not

If IC G690L which location is U5 potentiometer always is 0,check this circuit if short circuit or not.

Use Oscillograph check IC G690L whcih location is U5,when turn on the power, its voltage value if change from 0to 3.3Vat moment

Replace this IC.

If the power still can not be turn on base on above fouth step,

please upgrade the sofeware

Yes

Yes

Yes

Yes

Yes

Yes

No

NoCheck signal wire is short circuit or not

Check audio board power is normal or not

Check IIS signal for location PCM1789 onaudio board is normal or not.

Yes

Check reposition signal for location PCM1789 on audio boardis normal or not,the check pin is #4

Check connect wire between location J1 on audioboard and location xp8 on mpeg board is ok or not

Troubleshooting

10-2


22/55

Software Upgrading Procedure

1, Download the Software from Philips supportWebsite:

2, Copy the Software upgrade file into USB device.

http://www.philips.com/support.

A, Connect to TV and Turn on Main Unit, D, When Software Upgrading finish,TV screendisplay

Software Upgrade finish.

Select Upgrad from USB,TV Screen Display:

TV Screen Display:

Press OK on Remote Control,TV Screen Display:

B, Press OK on Remote Control,

C, Software Upgrading

11-1


23/55

Software Version Check

1, Select the IFO, like below show:

2, TV Screen Display,select Version Info.

3, Select OK to get the Version information :

4, Press BACK on Remote Control:

TV Screen display:

5, Press 8-5-2-0 on Remote Control,can find Software Version:

12-1


24/55

MPEG

MT8530

DDRII

DDRII

KEY

IR

MCU

R5F21266

AC

YUV

HDMI

USB

USB

OPTICAL

COAXIAL

VFDDriver

PT

16312

DDRII

DDRII

NAND-FLASH

1G

1G

512M

512M

8G

Etherne

t

Etherne

t

YUV

CVBS

CEC

Co

llima

tor

II

FLASH

1M

SMSC8700

I2Cbus

Touchkeyx3

DAC

CS4352

DAC

CS4352

DAC

CS4352

DAC

CS4352

7.1

CHAu

dioOUT

DAC

AK4396

S/Pdif

VFDDisplay

40WPSU

Loader

MPEG

Display

MCU5V

Regulator

Transformer2

Transformer1

Touchedkey

WT5700

O

P

NE5532

CVBSLt/Rt

POW318C

Buffer

FMS6363CS

WIFIDONGLE

W

IFIDONGLE

CEC

ESDREJECTOR

Mo

tor

Driver

R2A30209SP

TPC1391G4

TRAYIN/OUT

A+A-B

+B-

UVW

COM

LOAD+-

VFD

_BUS

IR

CEC

Buffer

INOUT

BDROMASA

AABBUVWC

TRV412VH5

Block

Diagram

13-1

13-1

A+A-B+B-

UVWCOM


25/55

Power

Board

MCU5V

GND

ECO-POWER

GND

VF1

MCU5V

VF2

-30V

GND

GND

ECO-POWER

GND

K3

K2

GND

GND

IRKEY

_STBY

LED

_STBY

ECO

_POWER

LEDBoard

MCU5V

DATA

CLK

STB

K1

K0

HPD

STB

CLK

GND

HDMI5V

DATA

MUTE

RST

CEC

GND

VCC

GND

GND

D+

D-

A+

B-

OPU

B+

A-

+12V

+12V

1.0

/5P

GND

-12V

+5V

GND

GND

Blu-RayLoa

der

Driver

+5V

A+

B-

B+

A-

GND

NC

VCC5V

GND

D+12V

D-1

2V

GND

GND

ADSDATA0

ADSDATA1

ADSDATA2

ACBCK

ADSDATA4

I/0

A_

MUTE

ADSDATA3

ADMCLK

GND

ADLRCK

GND

NC

1.0

/24P

2.0

/5P

1.0

/24P S

CLSDA

GND

VCC

GND

GND

2.0

/8P

DecoderBoard

D+

D-

GND

3.3VRXDTXD

U COM

WV

U COM

WV

GND

3.3VRXDTXD

L

OAD+

2.O

/5P

1.O

/8P

2.O

/4P

2.O

/14P

2

.O/4P

2.O

/4P

L

OAD-

T

RAY+

TRAY-

G

ND

IR SCL

SDA

DATA

1.0

/5P

MCUBoard

2

.0/14P

2.0

/13P

2.0

/5P

1.0

/5P

GND

3.3

V

Touc

hBoard

CLK

GND

A5V

GND

VFDDisplayBoard

2.0

/10P

2.0

/14P

2.0

/2P

LED+

LED-

2.0

/5P

2.0

/6P

2.5

/4P

2.5

/7P

12V

G

ND

G

ND

5

V

+5V+5VGND

GND

GND+12V

-12V

ACINPUT90--

250V/50-6

0HZ

Power

Cord

Wiring

Diag

ram

14-1

14-1


26/55

Ma

inUn

it--M

CUBoard

Circu

itDiagram

15-1

15-1

D102

IN60

D103

IN60

IR_

MTK

IR_

MCU

C112

103

R111

10K

MCU+3.3

V

C115

104

R122680

IR_

MCU

R126100

CEC_INCEC_OUT

Q101

BC847B

R116

220

R102

100K

R1

04

47

K

R105

27K

R101

18K

C101

10P

C102

NC/10P

D101

IN5819CECA

CEC3.3

V

CEC

_OUT

CEC

_IN

MCU+3.3

V

L101

10uH

R121

100

R120100

R107

22K

R108

22K

MCU+3.3

V

I2C_SDAI2C_SCL

R123330MUTE

ECO_POWER

L103

10uH

MCU+5

V

MCU+3.3

V

C103

104

Q102

8050

R117

220/1K

DZ101

3.9

V/3K3

CE103

100u/10

CE101

100u/10

C105

104

R1242K2

LED_T1LED_T2LED_T3

LED_T1R113

47

LED102

LEDW

LED_T2R1

14

47

LED103

LEDW

LED_T3R115

47

MCU+3.3

V

LED104

LEDW

1234CN102

2.0

/4P

RST

_MCU1

MTK_RST

H

PD

I2C

_SDA

I2C

_SCL

G

ND

H

DMI+5V

M

UTE

G

ND

V

FD

_CLK

V

FD

_DATA

V

FD

_STB

KEY_STBY

12345678910

11

12

13

14

CN103

2.0

/14PM

CU+5V

KEY

_STBY

GND

IR LED

_STBY

ECO

_POWER

VFD

_CLK

VFD

_DATA

VFD

_STB

C

ECA

M

TK

_RST

IR

_MTK

P3.5

/SCL

1

P3.7

2

RESET

3

XOUT

4

VSS

5

XIN

6

VCC

7

MODE

8

P4.5/INT0 9

P1.7/INT1 10

P3.6 11

P3.1 12

P5.4 13

P5.3 14

P1.6 15

P1.5/RXD0 16P1.4

/TXD0

17

P1.3

18

P1.2

19

VREF

20

P1.1

21

P1.0

22

P3.3

23

P

3.4

/SDA

24

P0.725 P0.6

26 P0.5

27 P0.4

28 P0.3/AN4

29 P0.2/AN5

30 P0.1/AN6

31 P0.0

32

U101

R5F21266NFP

R106

4K7

MCU+

3.3

V

MCU+3.3

V

R131

10KM

CU+3.3

V

1 2 3 4 5 6 7 8 9 10

11

12

13

CN105

2.0

/13P

1 2 3 4 5CN104

1.0

/5P

G

ND

KEY

_DATA

KEY

_CLK

R119100

JP102

0

JP103

0

JP105

0

JP106

0

JP108

0

MCU+3.3

V

MCU+3.3

V

JP109

0

P3.5

/SCL

SDA

_MCU

I2C

_SCL

I2C

_SCL

CEC

_IN

CEC

_OUT

C108

104

C11947P

C12047P

I2C_SDA

I2C_SCL

JP107

0

GND

KEYSW2

KEYSW0KEYSW1

K_

SW2

GND

KEYSW3

C113104

C116104

C104104

C114104

MCU+3.3

V

R1

09

22K

M

CU+3.3

V

T

KEY+3.3

V

G

ND

KEY

_DATA

KEY

_CLK

R1301K HPD

RST

_MCU

GND

MCU+3.3

V

MODE

L10210uH

C107

104

L104

NC/10uH

_5V

JP

110

0

MODE

JP

111

0

GND

C106104

LED_STBYR125100

R110

22K

MCU+3.3

V

R112

22K

KEYSW0

KEYSW1

KEYSW2

KEYSW3

_5V

IR

GND

JP

112

0

LED

_T1

R118

10

0

TODECODERBOARD

SDA

_MCU

JP101

0

JP104

0

C12

1

104

C122

47P

C123

47P

KEY_DATA

KEY_CLK

C12447P

C12547P

C12647P

VFD_CLK

VFD_DATA

VFD_STB

C127104

C128104

MUTE

MTK_RST

MCU+3.3

V

R132

22K

C129

103

L105

FB

L106

FB

T

K_

DATA

T

K_

CLK

JP

113

0

GND

C130

104

C131

104

C132

104

MAX220PF


27/55

Ma

inUn

it--M

CUBoard

Layou

tDiagram

15-2

15-2

TOPLayou

t

Bo

ttom

Layou

t


28/55

SW0

1

SW1

2

SW2

3

SW3

4

DO

5

DI

6

VSS

7

CLK

8

CS

9

K0

10

K1

11

K2 12

K3 13

VDD 14

S0/K0 15

S1/K1 16

S2/K2 17

S3/K3 18

S4/K4 19

S5/K5 20

S6 21

S7 22

S8

23

S9

24

S10

25

S11/G10

26

VEE

27

S12/G9

28

S13/G8

29

S14/G7

30

S15/G6

31

G5

32

G4

33

G334

G235

G136

G037

VDD38

LED339

LED240

LED141

LED042

VSS43

OSC44

U201

PT6312

R212

47K

S1S2S3S4S5S6S7S8

S9

S10

S11

G1

G2

G3

G4

G6

G5

DS-D

AT

DS-C

LK

DS-S

TB

R205

2.2

1/2

SW201

SW

H=5.0

A5V

VFD

_CLK

VFD

_DATA

VFD

_STB

R222

47

123

IR201

+

CE203

100u/10

R204

2.2

1/2

R217

4K7

MCU+5V

VFD1

VFD2

R208

470R

207

470

R206

470

R21110KR21010K

R20910K

CE201

100u/10V

IRVCC

VF1 1

VF1 2

VF2 31

VF2 32

NC 4

S15 5

S14 6

NC 7

S13 8

S12 9

S11 10

S10 11

S9 12

S8 13

S7 14

S6 15

S5 16

S4 17

S3 18

S2 19

S1 20

NC 21

G1 22

G2 23

G3 24

G4 25

G5 26

G6 27

G7 28

G8 29

VFD201

2007

5-2A23

C206

104

S12

S13

S14

G7

G8

12345678910

CN201

2.0

/10P

GND

-30V

GND

MCU+5V

VF

_1

VF

_2

12CN203

2.0

/2P

Q201

8050

R218

150

MCU+5V

LED_MID

LED

_MID

1 2 3 4 5 6 7 8 9 10

11

12

13

14

CN202

2.0

/14P

MCU+5V

KEY

_STBY

GND

GND

IR LED

_STBY

ECO

_POWER

VFD

_CLK

VFD

_DATA

VFD

_STB

C210

104

R220

22K

M

CU+5V

C207104

C216

104

C205

104

R221

4K7

Q202

8050

R219

1K

MCU+5V

LED201

LEDRED

C211

104

LED

_MID+

LED

_MID-

ECO

_POWER

A5V

C202

101

KEY

_STBY

MCU+5V

R223

33

IR

Ma

inUn

it--V

FDDisp

lay

Board

Circu

itDiagram

16-1

16-1

C203

104

-30V

CE202100u/10V

G1G2G3G4G5G6G7G8

S1

S2S3S4S5S6S7S8S9S10S11S12S13S14

VF1

VF2

VFD1

VFD2

-30V

C201

101

GND

GND

ECO_POWER

VF

_2

JP205

0

VF

_1

JP206

0

VF

_2

JP207

0

A5V

JP208

0

JP209

0

JP210

0

JP211

0

JP212

0

JP213

0

-30V

GND

VFD2

VFD2

A5V

MCU+5

V

KEYSW0

KEYSW1

KEYSW2

KEYSW3

KEY

SW0

KEY

SW1

KEY

SW2

KEY

SW3

C213

104

A5V

C208

104

C209

104

MCU+5V

C215

104

JP201

0

MCU+5

V

JP202

0

JP203

0

LED

_MID1

IRIN

IRIN

LED

_STBY

VFD

_CLK

VFD

_DATA

VFD

_STB

R213

1

K

R214

1

K

R215

1

K

R216

1

K

KEY0

KEY1

KEY2

KEY3

MCU+5V

C214

104

C212104

C21747P

C21847P

VFD_CLK

VFD_DATA

GND

JP204

0

LED_MID1

JP214

0

ECO

_POWER

VF

_1


29/55

Ma

inUn

it--VF

DDisp

lay

Board

Layou

tDiagram

16-2

16-2

TOPLayou

tDiagram

Bo

ttom

Layou

tDiagram


30/55

Ma

inUn

it--

To

uc

hBoard

Circu

it&Layou

tDiagram

Circu

itDiagram

Top

Layou

tDiagram

Bo

ttom

Layou

tDia

gram

17-1

17-1

K1

K2 K

3

12345

J801

1.0

/5P

GND

KEY

_DATA

KEY

_CLK

TKEY+3.3

V

GND

VDD

1

SI[0]

2

SI[1]

3

SI[3]

4

SI[8]

5

SI[10]

6

SI[11]

7

VSS

8

OUT11

9

OUT10

10

OUT8

11

SDA

12

SCL

13

OUT3

14

OUT1

15

OUT0

16

U801

IC-WT5700-S160

C803

NC/5P

C802

NC/5P

C801

NC/5P

TKEY+3.3

V

C

805

104

R801

2M

C804

104

C806

NC/10P

C807

NC/10PR

802

1K

R8031K

R804

10K

R805

47K

TKEY+3.3

V

KEY

_DATA

KEY

_CLK

KEY1

KEY2

KEY3

OPEN/CLOSE

PLAY

PAUSE


31/55

servo

SERVO

DRBOM

0.8

x(1+909/2K)=

1.1

6V

Low

ESR

philips bdp7500s2 (1.1) - service manual - eng

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