photolithography overview for microsystems · 2 photolithography and mems v microsystems (mems)...
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PHOTOLITHOGRAPHY OVERVIEW FOR MICROSYSTEMS
Photolithography Overview Learning Module
Patterned Mask forPhotolithography Expose
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Photolithography and MEMS
v Microsystems (MEMS) fabrication uses several layers to build devices.
v Each layer of this linkage system is a different component of the device and requires a different pattern.
v Photolithography defines and transfers a pattern to each respective layer.
MEMS Linkage Assembly[Linkage graphic courtesy of Khalil Najafi, University of
Michigan]
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Photolithography
Each layer within a microsystem has a unique pattern. v Photolithography transfers this pattern from a mask to a
photosensitive layer. v Another process step transfers the pattern from the photosensitive
layer into an underlying layer. v After the pattern transfer, the resist is stripped (removed).
Pattern Transfer to Underlying Layer
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Three Steps of Photolithography
v Coatv Exposev Develop
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Coat Step: Surface Conditioning
In most applications, surface conditioning precedes the photoresist. v Surface conditioning prepares the wafer to accept the
photoresist by providing a clean surface.v It coats the wafer with a chemical that boosts adhesion
of the photoresist to the wafer’s surface. (Usually Hexamethyldisalizane or HMDS)
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Surface Conditioning Steps
1. Wafer is baked to remove the water molecules on the wafer surface
2. HMDS is applied (prime) to create a hydrophobic surface3. Wafer is cooled to room temperature.
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Spin Coating
v Wafer is placed on a vacuum chuck
v A vacuum holds the wafer on the chuck
v Resist is applied v Chuck accelerates for
desired resist thickness v Chuck continues to spin to
dry filmSpin Coating
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Photoresist (Resist)
Photoresist is a mixture of organic compounds in a solvent solution. Two types of resist:v Positive resist - Exposed
regions become more soluble. A positive mask is left after develop.
v Negative resist - Exposed materials harden. A negative mask is left after develop.
Photoresist - Positive vs. Negative
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Softbake
v After the photoresist is applied to the desired thickness, a softbake is used to remove the residual solvents of the photoresist.
v After the softbake, the wafer is cooled to room temperature.
Softbake after Applying Resist
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Alignment
v "Align" is one of the most critical steps in the entire microsystems fabrication process.
v A misalignment of one micron or smaller can destroy the device and all the devices on the wafer.
v Each layer must be aligned properly and within specifications to the previous layers and subsequent layers.
Microscopic Hinge [Photo courtesy of Sandia National
Laboratories]
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Mask vs. Reticle
v The patterned mask (or reticle) is a quartz or glass plate with the desired pattern (usually in chrome).
v Some equipment do not use a whole mask. Instead a smaller quartz plate is used with just a few die (inset). This plate is called a reticle.
Mask and Reticle (inset)
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Expose
v The wafer is exposed by UV (ultraviolet) from a light source traveling through the mask to the resist.
v A chemical reaction occurs between the resist and the light. v Only those areas not protected by the mask undergo a
chemical reaction.
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Develop
v Portions of the photoresistare dissolved by a chemical developer.
v With positive resist, the exposed resist is dissolved while the unexposed resist remains on the wafer.
v With negative resist, the unexposed resist is dissolved while the exposed resist remains.
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Hardbake
v Hardens the photoresist for the next process.
v The temperature of the hardbake is higher than that of the softbake after coat.
v After the hardbake, the wafer is cooled to room temperature.
Hardbake
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Inspect
Three critical parameters
v Alignment – the pattern must be positioned accurately to the previously layer.
v Line width or critical dimension (CD) – the pattern images are in focus and have the correct size.
v Defects – things that could affect subsequent processes and eventually the operation of the devices
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Photolithography uses three basic process steps to transfer a pattern from a mask to a wafer: coat, develop, expose. The pattern is transferred into the wafer’s surface layer during a subsequent process. In some cases, the resist pattern can also be used to define the pattern for a deposited thin film.
Summary
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Copyright © by the Southwest Center for Microsystems Education and The Regents of the University of New Mexico.
Southwest Center for Microsystems Education (SCME)800 Bradbury Drive SE, Suite 235
Albuquerque, NM 87106-4346Phone: 505-272-7150
Website: www.scme-nm.org
The work presented was funded in part by the National Science Foundation Advanced Technology Education program,
Department of Undergraduate Education grants.
Acknowledgements
Revision 07/10/12