photonic curing and the pulseforge toolset stan farnsworth vp marketing may 2014
TRANSCRIPT
Photonic Curing and the PulseForge Toolset
Stan FarnsworthVP Marketing
May 2014
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NovaCentrix®
Printed Electronics Manufacturing
RawMaterials
Mfg Materials
Curing Tools
Device/ Application
Ink components;Raw substrates
Inks;Substrates
Roll-to-roll;Conveyors
Inkjet;Screen;Aerosol;Flexo;Gravure;
Ovens;Air knives;New Tech
Ovens;UV Lamps;Lasers;PulsedThermal Processing;New Tech
Solar;RFID;Batteries;Transistors;Displays;Packaging;Smart cards
Material Handlers
Printers Dryers
Tool Integrators
Nanoparticles Metalon® inksNovele™ substrates
PulseForge® toolsSimPulse™ thermal simulator
Industryproduct types
Quick Profile• Initially established in 1999 in Austin, TX
• Employees: ~40 : Facilities: ~4000m2
• Competencies: Plasma physics, high-power (MW) electronics, nanomaterials, numerical modeling, machine systems design, dispersions and formulations
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Product Snapshot
PulseForge ® Photonic Curing Tools
Metalon ® Conductive Inks
Also: Ag, Ni, Co, others
SimPulse ® Numerical Simulation
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Photonic Curing– Using carefully timed and controlled flashlamps to heat only the surface and not the
entire thickness of the material. Exposure time is usually less than 1 millisecond.– Allows use of high-temp materials on low-temp substrates.– Organic and inorganic inks (including ITO, Si)– Polymer, paper, glass
NovaCentrix is the process originator, and holder of key patents.
Thin Film
Substrate
Pulsed Light
Tem
pera
ture
Distance from Surface
Thin Film/Substrate Interface
What is Photonic Curing?
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“Basic” Photonic Curing Pulse: What is it?
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Basic pulse suitable for depositions <10 um
Inkjet Ag (Metalon JS-B25P) @ <1 umNotice sintering after photonic curing.
Before
After
Basic pulse shape
Simple ON-OFF cycle.Can be repeated.
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Pulse Shaping: Advanced Pulse Structures
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Conventional Pulse Pulse Shaping
Pulse Shaping: Multiple pulses acting within the thermal equilibrium time of the material.• Equivalent energy but composite pulse allows better control of temperature profile.• Preferred pulse structure for many thicker depositions as well as for drying.
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Advanced Pulse Structures Required
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Warped substrate
Without pulse shaping, processing screen-printed inks can fail.
Skinning and pitting
Delamination
With pulse shaping, processing screen-printed inks is optimized.
• Optimal surface and curing
• Optimized electrical performance.
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Innovation: Copper Oxide Reduction Ink
Metalon ICI-021: Water-based• Nano copper oxide particles• Reduction agent• Water and ethylene glycol• Sheet resistance ~15 mOhm/sq• Very economical pricing
• Copper inks are of interest– Cu costs much less than Ag– Cu has 90% of the conductivity of Ag
• Traditional copper nanoinks are problematic– True Cu inks want to oxidize,
especially nanoparticle inks– Stable nanoparticle inks of true Cu
are usually expensive, outweighing cost benefits
• New Approach– Instead of fighting oxidation, begin
with particles in their terminal state: fully oxidized.
– Converts to conductive Cu during processing with PulseForge tool.
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Copper Oxide Reduction Ink and Pulse Shaping
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• To convert the copper oxide to copper, certain elevated temperature must be reached and sustained long enough for the reaction to complete.
• The exact required temperature and time are not known a priori for a given system: too low or too high will yield poor results.
This Basic Pulse creates temperaturetoo hot and too short.
Shaped Pulse creates optimal temperature for optimal time.
Pulse Configurations Resulting Thermal Simulation(Generated using SimPulse)Shaped Pulse (top)
Basic Pulse (bottom)
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R&D to Production
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• Different chassis• Shared components
– Lamps– Reflector housings– Power supplies– User interface
PulseForge 1200/1300 PulseForge 3200/3300
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Separation of Functions
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Lamp housingMaterial conveyance
Power supplies andlamp controllers
CablesWatercooling
Userinterface
Controls,worksurface
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Configurable Process Width
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Designed for Value and Performance
Throughout the design and development process for the PulseForge 3200 tools, careful thought was given to identifying key design topics. Interviews with external industry leaders as well as internal experts in the NovaCentrix inks and applications teams contributed to design attributes that are embodied in the current tool architecture.
Design Priorities• Safety
– Access interlocks– Automatic system operation monitoring
• Performance– State-of-the-art engineering allows optimization of application processing
• Economic operation – Extremely long lamp lifetimes with quick and tool-free lamp changes– No warm-up time required prior to operation– Water-cooled for continuous operation at max rated power
• Ease of operation– Advanced custom operating system and user interface– Process settings can be saved and accessed for future production
• Ease of integration into Customer’s Quality Management System– On-board recording of each pulse profile and lamp output can be linked and traced to specific item– Process conditions can easily be shared between R&FD and production PulseForge tools
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Thank YouContact our partners or us directly
with questions
or for samples processing.
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