2009-2011 Microchip Technology Inc. DS41365E

PIC18(L)F1XK22Data Sheet

20-Pin Flash Microcontrollerswith nanoWatt XLP Technology

Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breacher ou of in

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workInformation contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyers risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,

knowledge, require using the Microchip products in a mannSheets. Most likely, the person doing so is engaged in theft

Microchip is willing to work with the customer who is conce

Neither Microchip nor any other semiconductor manufacturemean that we are guaranteeing the product as unbreakabl

Code protection is constantly evolving. We at Microchip are comproducts. Attempts to break Microchips code protection feature mallow unauthorized access to your software or other copyrightedDS41365E-page 2

suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,

the code protection feature. All of these methods, to our tside the operating specifications contained in Microchips Data tellectual property.

about the integrity of their code.

guarantee the security of their code. Code protection does not

d to continuously improving the code protection features of oure a violation of the Digital Millennium Copyright Act. If such acts, you may have a right to sue for relief under that Act. 2009-2011 Microchip Technology Inc.

FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

2009-2011, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 978-1-61341-715-7

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Companys quality system processes and procedures are for its PIC MCUs and dsPIC DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchips quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

PIC18(L)F1XK22

High-Performance RISC CPU: C Compiler Optimized Architecture:

- Optional extended instruction set designed to optimize re-entrant code

256 bytes Data EEPROM Up to 16 Kbytes Linear Program Memory

Addressing Up to 512 bytes Linear Data Memory Addressing Up to 16 MIPS Operation 16-bit Wide Instructions, 8-bit Wide Data Path Priority Levels for Interrupts 31-Level, Software Accessible Hardware Stack 8 x 8 Single-Cycle Hardware Multiplier

Flexible Oscillator Structure: Precision 16 MHz Internal Oscillator Block:

- Factory calibrated to 1%- Software selectable frequencies range of

31 kHz to 16 MHz- 64 MHz performance available using PLL

no external components required Four Crystal modes up to 64 MHz Two External Clock modes up to 64 MHz 4X Phase Lock Loop (PLL) Secondary Oscillator using Timer1 @ 32 kHz Fail-Safe Clock Monitor

- Allows for safe shutdown if peripheral clock stops

Two-Speed Oscillator Start-up

Special Microcontroller Features: 2.3V - 5.5V Operation PIC18F1XK22 1.8V-3.6V Operation PIC18LF1XK22 Self-reprogrammable under Software Control Power-on Reset (POR), Power-up Timer (PWRT)

and Oscillator Start-up Timer (OST) Programmable Brown-out Reset (BOR) Extended Watchdog Timer (WDT):

- Programmable period from 4ms to 131s Programmable Code Protection In-Circuit Serial Programming (ICSP) via

two pins

Extreme Low-Power Management PIC18LF1XK22 with nanoWatt XLP: Sleep mode: 34 nA Watchdog Timer: 460 nA Timer1 Oscillator: 650 nA @ 32 kHz

Analog Features: Analog-to-Digital Converter (ADC) module

- 10-bit resolution, 12 channels- Auto acquisition capability- Conversion available during Sleep

Analog Comparator module:- Two rail-to-rail analog comparators- Independent input multiplexing- Inputs and outputs externally accessible

Voltage Reference module:- Programmable (% of VDD), 16 steps- Two 16-level voltage ranges using VREF pins- Programmable Fixed Voltage Reference

(FVR), 3 levels

Peripheral Highlights: 17 I/O Pins and 1 Input-only Pin:

- High current sink/source 25 mA/25 mA- Programmable weak pull-ups- Programmable interrupt-on- change- Three external interrupt pins

Four Timer modules:- 3 16-bit timers/counters with prescaler- 1 8-bit timer/counter with 8-bit period register,

prescaler and postscaler- Dedicated, low-power Timer1 oscillator

Enhanced Capture/Compare/PWM (ECCP) module:- One, two or four PWM outputs- Selectable polarity- Programmable dead time- Auto-shutdown and Auto-restart- PWM output steering control

Master Synchronous Serial Port (MSSP) module- 3-wire SPI (supports all 4 SPI modes)- I2C Master and Slave modes (Slave mode

address masking)

20-Pin Flash Microcontrollers with nanoWatt XLP Technology 2009-2011 Microchip Technology Inc. DS41365E-page 3

In-Circuit Debug via Two Pins Enhanced Universal Synchronous Asynchronous

Receiver Transmitter module (EUSART)- Supports RS-232, RS-485 and LIN 2.0- Auto-Baud Detect- Auto Wake-up on Break

SR Latch (555 Timer) module with:- Configurable inputs and outputs- Supports mTouch capacitive sensing

applications

PIC18(L)F1XK22

TABLE 1: DEVICE OVERVIEW

Pin Diagrams

Device

Program Memory Data Memory

Pins I/O(1)

10-b

it A

/DC

hann

els

Com

para

tors

Tim

ers

8-bi

t/16-

bit

ECC

P

MSS

P

EUSA

RT

SR L

atch

Bytes Words SRAM(bytes)

Data EEPROM(bytes)

PIC18F13K22PIC18LF13K22

8K 4K 256 256 20 18 12-ch 2 1 / 3 1 1 1 Yes

PIC18F14K22PIC18LF14K22

16K 8K 512 256 20 18 12-ch 2 1 / 3 1 1 1 Yes

Note 1: One pin is input-only.

20-pin PDIP, SSOP, SOIC (300 MIL)

10

23456

1

87

9111213141516

1920

1817

VDDRA5RA4

RA3/MCLR/VPPRC5RC4

RC3/PGMRC6RC7RB7

VSSRA0/PGDRA1/PGCRA2RC0RC1RC2RB4RB5RB6

PIC

18(L

)F13

K22

PIC

18(L

)F14

K22

-

8 9

23

11415

16

10

11

6

1213

17181920

7

54

PIC

18(L

)F13

K22

PIC

18(L

)F14

K22

RA3/MCLR/VPPRC5RC4

RC3/PGMRC6

RC

7R

B7

RB

4R

B5

RB

6

RC1RC0RA2RA1/PGC

RA

0/P

GD

VS

SV

DD

RA

4R

A5

RC2

20-Pin QFN 4x4DS41365E-page 4 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22TABLE 2: PIC18(L)F1XK22 PIN SUMMARY20

-Pin

DIL

20-P

in Q

FN

I/O

Ana

log

Com

para

tor

Ref

eren

ce

ECC

P

EUSA

RT

MSS

P

SR L

atch

Tim

ers

Inte

rrup

ts

Pull-

up

Bas

ic

19 16 RA0 AN0 C1IN+ VREF-/CVREF IOC/INT0 Y PGD18 15 RA1 AN1 C12IN0- VREF+ IOC/INT1 Y PGC17 14 RA2 AN2 C1OUT SRQ T0CKI IOC/INT2 Y 4 1 RA3 IOC Y MCLR/VPP3 20 RA4 AN3 IOC Y OSC2/CLKOUT2 19 RA5 T13CKI IOC Y OSC1/CLKIN13 10 RB4 AN10 SDI/SDA IOC Y 12 9 RB5 AN11 RX/DT IOC Y 11 8 RB6 SCL/SCK IOC Y 10 7 RB7 TX/CK IOC Y 16 13 RC0 AN4 C2IN+ 15 12 RC1 AN5 C12IN1- 14 11 RC2 AN6 C12IN2- P1D 7 4 RC3 AN7 C12IN3- P1C PGM6 3 RC4 C2OUT P1B SRNQ 5 2 RC5 CCP1/P1A 8 5 RC6 AN8 SS 9 6 RC7 AN9 SDO 1 18 VDD20 17 VSS 2009-2011 Microchip Technology Inc. DS41365E-page 5

PIC18(L)F1XK22

Table of Contents1.0 Device Overview .......................................................................................................................................................................... 72.0 Oscillator Module........................................................................................................................................................................ 133.0 Memory Organization ................................................................................................................................................................. 254.0 Flash Program Memory.............................................................................................................................................................. 475.0 Data EEPROM Memory ............................................................................................................................................................. 576.0 8x8 Hardware Multiplier.............................................................................................................................................................. 617.0 Interrupts .................................................................................................................................................................................... 638.0 I/O Ports ..................................................................................................................................................................................... 779.0 Timer0 Module ........................................................................................................................................................................... 9510.0 Timer1 Module ........................................................................................................................................................................... 9911.0 Timer2 Module ......................................................................................................................................................................... 10512.0 Timer3 Module ......................................................................................................................................................................... 10713.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 11114.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 13315.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 17516.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 20317.0 Comparator Module.................................................................................................................................................................. 21718.0 Power-Managed Modes ........................................................................................................................................................... 22919.0 SR Latch................................................................................................................................................................................... 23520.0 Voltage References.................................................................................................................................................................. 23921.0 Reset ........................................................................................................................................................................................ 24522.0 Special Features of the CPU.................................................................................................................................................... 25723.0 Instruction Set Summary .......................................................................................................................................................... 27324.0 Development Support............................................................................................................................................................... 32325.0 Electrical Specifications............................................................................................................................................................ 32726.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 36327.0 Packaging Information.............................................................................................................................................................. 379Appendix A: Revision History............................................................................................................................................................. 389Appendix B: Device Differences......................................................................................................................................................... 389

TO OUR VALUED CUSTOMERSIt is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchipproducts. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined andenhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department viaE-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. Wewelcome your feedback.

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http://www.microchip.comYou can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).

ErrataAn errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for currentdevices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revisionof silicon and revision of document to which it applies.To determine if an errata sheet exists for a particular device, please check with one of the following: Microchips Worldwide Web site; http://www.microchip.com Your local Microchip sales office (see last page)When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you areusing.

Customer Notification SystemRegister on our web site at www.microchip.com to receive the most current information on all of our products.DS41365E-page 6 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK221.0 DEVICE OVERVIEWThis family offers the advantages of all PIC18microcontrollers namely, high computationalperformance with the addition of high-endurance,Flash program memory. On top of these features, thePIC18(L)F1XK22 family introduces designenhancements that make these microcontrollers alogical choice for many high-performance, powersensitive applications.

1.1 New Core Features

1.1.1 nanoWatt XLP TECHNOLOGYAll of the devices in the PIC18(L)F1XK22 family incor-porate a range of features that can significantly reducepower consumption during operation. Key itemsinclude:

Multiple Idle Modes: The controller can also run with its CPU core disabled but the peripherals still active. In these states, power consumption can be reduced even further, to as little as 4% of normal operation requirements.

On-the-fly Mode Switching: The power-managed modes are invoked by user code during operation, allowing the user to incorporate power-saving ideas into their applications software design.

Low Consumption in Key Modules: The power requirements for both Timer1 and the Watchdog Timer are minimized. See Section 25.0 Electrical Specifications for values.

1.1.2 MULTIPLE OSCILLATOR OPTIONS AND FEATURES

All of the devices in the PIC18(L)F1XK22 family offerten different oscillator options, allowing users a widerange of choices in developing application hardware.These include:

Four Crystal modes, using crystals or ceramic resonators

External Clock modes, offering the option of using two pins (oscillator input and a divide-by-4 clock output) or one pin (oscillator input, with the sec-ond pin reassigned as general I/O)

External RC Oscillator modes with the same pin options as the External Clock modes

An internal oscillator block which contains a 16 MHz HFINTOSC oscillator and a 31 kHz LFINTOSC oscillator which together provide 8 user selectable clock frequencies, from 31 kHz to 16 MHz. This option frees the two oscillator pins for use as additional general purpose I/O.

A Phase Lock Loop (PLL) frequency multiplier, available to both the high-speed crystal and inter-nal oscillator modes, which allows clock speeds of up to 64 MHz. Used with the internal oscillator, the PLL gives users a complete selection of clock speeds, from 31 kHz to 32 MHz all without using an external crystal or clock circuit.

Besides its availability as a clock source, the internaloscillator block provides a stable reference source thatgives the family additional features for robustoperation:

Fail-Safe Clock Monitor: This option constantly monitors the main clock source against a refer-ence signal provided by the LFINTOSC. If a clock failure occurs, the controller is switched to the internal oscillator block, allowing for continued operation or a safe application shutdown.

Two-Speed Start-up: This option allows the internal oscillator to serve as the clock source from Power-on Reset, or wake-up from Sleep mode, until the primary clock source is available. 2009-2011 Microchip Technology Inc. DS41365E-page 7

PIC18(L)F1XK22

1.2 Other Special Features Memory Endurance: The Flash cells for both

program memory and data EEPROM are rated to last for many thousands of erase/write cycles up to 10K for program memory and 100K for EEPROM. Data retention without refresh is conservatively estimated to be greater than 40 years.

Self-programmability: These devices can write to their own program memory spaces under internal software control. Using a bootloader routine located in the code protected Boot Block, it is possible to create an application that can update itself in the field.

Extended Instruction Set: The PIC18(L)F1XK22 family introduces an optional extension to the PIC18 instruction set, which adds 8 new instruc-tions and an Indexed Addressing mode. This extension has been specifically designed to opti-mize re-entrant application code originally devel-oped in high-level languages, such as C.

Enhanced CCP module: In PWM mode, this module provides 1, 2 or 4 modulated outputs for controlling half-bridge and full-bridge drivers. Other features include:- Auto-Shutdown, for disabling PWM outputs

on interrupt or other select conditions - Auto-Restart, to reactivate outputs once the

condition has cleared- Output steering to selectively enable one or

more of 4 outputs to provide the PWM signal. Enhanced Addressable USART: This serial

communication module is capable of standard RS-232 operation and provides support for the LIN bus protocol. Other enhancements include automatic baud rate detection and a 16-bit Baud Rate Generator for improved resolution.

10-bit A/D Converter: This module incorporates programmable acquisition time, allowing for a channel to be selected and a conversion to be initiated without waiting for a sampling period and thus, reduce code overhead.

Extended Watchdog Timer (WDT): This enhanced version incorporates a 16-bit postscaler, allowing an extended time-out range that is stable across operating voltage and temperature. See Section 25.0 Electrical Specifications for time-out periods.

1.3 Details on Individual Family Members

Devices in the PIC18(L)F1XK22 family are available in20-pin packages. Block diagrams for the two groupsare shown in Figure 1-1.

The devices are differentiated from each other in thefollowing ways:

1. Flash program memory: 8 Kbytes for PIC18(L)F13K22 16 Kbytes for PIC18(L)F14K22

All other features for devices in this family are identical.These are summarized in Table 1-1.

The pinouts for all devices are listed in Table 2 and I/Odescription are in Table 1-2.DS41365E-page 8 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

TABLE 1-1: DEVICE FEATURES FOR THE PIC18(L)F1XK22 (20-PIN DEVICES)

Features PIC18F13K22 PIC18LF13K22 PIC18F14K22 PIC18LF14K22

Voltage Range (1.8 - 5.5V) 2.3-5.5V 1.8V-3.6V 2.3-5.5V 1.8V-3.6VProgram Memory (Bytes) 8K 16KProgram Memory (Instructions) 4096 8192Data Memory (Bytes) 256 512Operating Frequency DC 64 MHzInterrupt Sources 30I/O Ports Ports A, B, CTimers 4Enhanced Capture/ Compare/PWM Modules 1Serial Communications MSSP, Enhanced USART10-Bit Analog-to-Digital Module 12 Input Channels

Resets (and Delays) POR, BOR, RESET Instruction, Stack Full, Stack Underflow, MCLR, WDT(PWRT, OST)

Instruction Set 75 Instructions, 83 with Extended Instruction Set EnabledPackages 20-Pin PDIP, SSOP, SOIC (300 mil)

QFN (4x4x0.9mm) 2009-2011 Microchip Technology Inc. DS41365E-page 9

PIC18(L)F1XK22

FIGURE 1-1: PIC18(L)F1XK22 BLOCK DIAGRAM

InstructionDecode and

Control

PORTA

PORTB

PORTC

RA1RA0

Data Latch

Data Memory

Address Latch

Data Address12

AccessBSR FSR0FSR1FSR2

inc/declogic

Address

4 12 4

PCH PCL

PCLATH

8

31-Level Stack

Program Counter

PRODLPRODH

8 x 8 Multiply

8

BITOP88

ALU

20

8

8

Table Pointer

inc/dec logic

21

8

Data Bus

Table Latch8

IR

12

3

ROM Latch

PCLATU

PCU

Note 1: RA3 is only available when MCLR functionality is disabled.2: OSC1/CLKIN and OSC2/CLKOUT are only available in select oscillator modes and when these pins are not being used

as digital I/O. Refer to Section 2.0 Oscillator Module for additional information.

EUSARTComparator MSSP 10-bit ADC

Timer2Timer1 Timer3Timer0

ECCP1

BORData

EEPROM

W

Instruction Bus

STKPTR Bank

8

State machinecontrol signals

Decode

8

8

Power-upTimer

OscillatorStart-up Timer

Power-onReset

WatchdogTimer

OSC1(2)

OSC2(2)

VDD,

InternalOscillator

Fail-SafeClock Monitor

Precision

ReferenceBand GapVSS

MCLR(1)

Block

LFINTOSCOscillator

16 MHzOscillator

Single-SupplyProgramming FVR

FVRFVRCVREF

Address Latch

Program Memory

Data Latch

CVREF

RA3RA4RA5

RB4RB5RB6RB7

RC0RC1RC2RC3RC4RC5RC6RC7

(512/768 bytes) RA1DS41365E-page 10 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22TABLE 1-2: PIC18(L)F1XK22 PIN SUMMARY

Pin Name

PinNumber Pin

TypeBufferType Description

DIL

QFN

RA0/AN0/CVREF/VREF-/C1IN+/INT0/PGDRA0AN0CVREFVREF-C1IN+INT0PGD

19 16I/OIOIII

I/O

TTLAnalogAnalogAnalogAnalog

STST

Digital I/OADC channel 0DAC reference voltage outputADC and DAC reference voltage (low) inputComparator C1 non-inverting inputExternal interrupt 0ICSP programming data pin

RA1/AN1/C12IN0-/VREF+/INT1/PGCRA1AN1C12IN0-VREF+INT1PGC

18 15I/OI1II

I/O

TTLAnalogAnalogAnalog

STST

Digital I/OADC channel 1Comparator C1 and C2 non-inverting inputADC and DAC reference voltage (high) inputExternal interrupt 1ICSP programming clock pin

RA2/AN2/C1OUT/T0CKI/INT2/SRQRA2AN2C1OUTT0CKIINT2SRQ

17 14I/OI

IIO

STAnalogCMOS

STST

CMOS

Digital I/OADC channel 2Comparator C1 outputTimer0 external clock inputExternal interrupt 2SR latch output

RA3/MCLR/VPPRA3MCLRVPP

4 1IIP

STST

Digital inputActive-low Master Clear with internal pull-upHigh voltage programming input

RA4/AN3/OSC2/CLKOUTRA4AN3OSC2

CLKOUT

3 20I/OIO

O

TTLAnalogXTAL

CMOS

Digital I/OADC channel 3Oscillator crystal output. Connect to crystal or resonatorin Crystal Oscillator modeIn RC mode, OSC2 pin outputs CLKOUT whichhas 1/4 the frequency of OSC1 and denotesthe instruction cycle rate

RA5/OSC1/CLKIN/T13CKIRA5OSC1

CLKIN

T13CKI

2 19I/OI

I

I

TTLXTAL

CMOS

ST

Digital I/OOscillator crystal input or external clock inputST buffer when configured in RC mode; analog otherwiseExternal clock source input. Always associated with the pin function OSC1 (See related OSC1/CLKIN, OSC2,CLKOUT pinsTimer0 and Timer3 external clock input

RB4/AN10/SDI/SDARB4AN10SDISDA

13 10I/OII

I/O

TTLAnalog

STST

Digital I/OADC channel 10SPI data inI2C data I/O

RB5/AN11/RX/DTRB5AN11RXDT

12 9I/OII

I/O

TLLAnalog

STST

Digital I/OADC channel 11EUSART asynchronous receiveEUSART synchronous data (see related RX/TX)

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input I = Input O = Output P = Power XTAL= Crystal Oscillator 2009-2011 Microchip Technology Inc. DS41365E-page 11

PIC18(L)F1XK22RB6/SCK/SCLRB6SCKSCL

11 8I/OI/OI/O

TLLSTST

Digital I/OSynchronous serial clock input/output for SPI modeSynchronous serial clock input/output for I2C mode

RB7/TX/CKRB7TXCK

10 7I/OOI/O

TLLCMOS

ST

Digital I/OEUSART asynchronous transmitEUSART synchronous clock (see related RX/DT)

RC0/AN4/C2IN+RC0AN4C2IN+

16 13I/OII

STAnalogAnalog

Digital I/OADC channel 4Comparator C2 non-inverting input

RC1/AN5/C12IN-/INT1RC1AN5C12IN-INT1

15 12I/OIII

STAnalogAnalog

ST

Digital I/OADC channel 5Comparator C1 and C2 non-inverting inputExternal interrupt 0

RC2/AN6/C12IN2-/P1D/INT2RC2AN6C12IN2-P1D

14 11I/OIIO

STAnalogAnalogCMOS

Digital I/OADC channel 6Comparator C1 and C2 inverting inputEnhanced CCP1 PWM output

RC3/AN7/C12IN3-/P1C/PGMRC3AN7C12IN3-P1CPGM

7 4I/OIIOI/O

STAnalogAnalogCMOS

ST

Digital I/OADC channel 7Comparator C1 and C2 inverting inputEnhanced CCP1 PWM outputLow-Voltage ICSP Programming enable pin

RC4/C12OUT/P1B/SRQRC4C12OUTP1BSRNQ

6 3I/OOOO

STCMOSCMOSCMOS

Digital I/OComparator C1 and C2 outputEnhanced CCP1 PWM outputSR latch output

RC5/CCP1/P1ARC5CCP1P1A

5 2I/OI/OO

STST

CMOS

Digital I/OCapture 1 input/Compare 1 output/PWM 1 outputEnhanced CCP1 PWM output

RC6/AN8/SSRC6AN8SS

8 5I/OII

STAnalog

TTL

Digital I/OADC channel 8SPI slave select input

RC7/AN9/SDORC7AN9SDO

9 6I/OIO

STAnalogCMOS

Digital I/OADC channel 9SPI data out

VSS 20 17 P Ground reference for logic and I/O pins

VDD 1 18 P Positive supply for logic and I/O pins

TABLE 1-2: PIC18(L)F1XK22 PIN SUMMARY

Pin Name

PinNumber Pin

TypeBufferType Description

DIL

QFN

Legend: TTL = TTL compatible input CMOS = CMOS compatible input or output ST = Schmitt Trigger input I = Input O = Output P = Power XTAL= Crystal OscillatorDS41365E-page 12 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK222.0 OSCILLATOR MODULE

2.1 OverviewThe oscillator module has a variety of clock sourcesand features that allow it to be used in a wide range ofapplications, maximizing performance and minimizingpower consumption. Figure 2-1 illustrates a blockdiagram of the oscillator module.

Key features of the oscillator module include:

System Clocks System Clock Selection

- Primary External Oscillator- Secondary External Oscillator- Internal Oscillator

Oscillator Start-up Timer System Clock Selection Clock Switching 4x Phase Lock Loop Frequency Multiplier CPU Clock Divider Two-Speed Start-up Mode Fail-Safe Clock Monitoring

2.2 System ClocksThe PIC18(L)F1XK22 can be operated in 13 differentoscillator modes. The user can program these usingthe available Configuration bits. In addition, clock sup-port functions such as Fail-Safe and two Start-up canalso be configured.

The available Primary oscillator options include:

External Clock, low power (ECL) External Clock, medium power (ECM) External Clock, high power (ECH) External Clock, low power, CLKOUT function on

RA4/OSC2 (ECCLKOUTL) External Clock, medium power, CLKOUT function

on RA4/OSC2 (ECCLKOUTM) External Clock, high power, CLKOUT function on

RA4/OSC2 (ECCLKOUTH) External Crystal (XT) High-speed Crystal (HS) Low-power crystal (LP) External Resistor/Capacitor (EXTRC) External RC, CLKOUT function on RA4/OSC2 31.25 kHz 16 MHz internal oscillator (INTOSC) 31.25 kHz 16 MHz internal oscillator, CLKOUT

function on RA4/OSC2

Additionally, the 4xPLL may be enabled in hardware orsoftware (under certain conditions) for increased oscil-lator speed.

2.3 System Clock SelectionThe SCS bits of the OSCCON register select betweenthe following clock sources:

Primary External Oscillator Secondary External Oscillator Internal Oscillator

TABLE 2-1: SYSTEM CLOCK SELECTION

The default state of the SCS bits sets the system clockto be the oscillator defined by the FOSC bits of theCONFIG1H Configuration register. The system clockwill always be defined by the FOSC bits until the SCSbits are modified in software.

When the Internal Oscillator is selected as the systemclock, the IRCF bits of the OSCCON register and theINTSRC bit of the OSCTUNE register will select eitherthe LFINTOSC or the HFINTOSC. The LFINTOSC isselected when the IRCF = 000 and the INTSRCbit is clear. All other combinations of the IRCF bits andthe INTSRC bit will select the HFINTOSC as thesystem clock.

2.4 Primary External OscillatorThe Primary External Oscillators mode of operation isselected by setting the FOSC bits of theCONFIG1H Configuration register. The oscillator canbe set to the following modes:

LP: Low-Power Crystal XT: Crystal/Ceramic Resonator HS: High-Speed Crystal Resonator RC: External RC Oscillator EC: External Clock

Additionally, the Primary External Oscillator may beshut-down under firmware control to save power.

Note: The frequency of the system clock will bereferred to as FOSC throughout thisdocument.

Configuration Selection

SCS System Clock1x Internal Oscillator01 Secondary External Oscillator00(Default after Reset)

Oscillator defined by FOSC 2009-2011 Microchip Technology Inc. DS41365E-page 13

PIC18(L)F1XK22

FIGURE 2-1: PIC MCU CLOCK SOURCE BLOCK DIAGRAM

4 x PLL

FOSC

OSC2

OSC1/T13CKI

Sleep

CPU

Peripherals

IDLEN

Pos

tsca

ler

MU

X

MU

X

16 MHz

8 MHz

4 MHz2 MHz

1 MHz

250 kHz

500 kHz

IRCF

0x

11010110001101000100031 kHz

31 kHzLFINTOSC

InternalOscillator

Block

ClockControl SCS HFINTOSC

16 MHz

01

INTSRC

Primary PIC18(L)F1XK22

Sleep

Sleep

System

PCLKENPRI_SD

01

FOSC

PLL_ENPLLEN

Oscillator,

WatchdogTimer

Fail-SafeClock

Two-SpeedStart-up

Clock

Timer1/Timer3External

Secondary Oscillator

and

LP, XT, HS, RC, EC, Secondary Osc.

T1OSCEN

Internal Osc. 1x

Note: If using a low-frequency external oscillatorand want to multiple it by 4 via PLL, theideal input frequency is from 4 MHz to 16MHz.DS41365E-page 14 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

2.4.1 PRIMARY EXTERNAL OSCILLATOR

SHUT-DOWNThe Primary External Oscillator can be enabled or dis-abled via software. To enable software control of thePrimary External Oscillator, the PCLKEN bit of theCONFIG1H Configuration register must be set. Withthe PCLKEN bit set, the Primary External Oscillator iscontrolled by the PRI_SD bit of the OSCCON2 register.The Primary External Oscillator will be enabled whenthe PRI_SD bit is set, and disabled when the PRI_SDbit is clear.

2.4.2 LP, XT AND HS OSCILLATOR MODES

The LP, XT and HS modes support the use of quartzcrystal resonators or ceramic resonators connected toOSC1 and OSC2 (Figure 2-2). The mode selects a low,medium or high gain setting of the internal inverter-amplifier to support various resonator types and speed.

LP Oscillator mode selects the lowest gain setting of theinternal inverter-amplifier. LP mode current consumptionis the least of the three modes. This mode is best suitedto drive resonators with a low drive level specification, forexample, tuning fork type crystals.

XT Oscillator mode selects the intermediate gainsetting of the internal inverter-amplifier. XT modecurrent consumption is the medium of the three modes.This mode is best suited to drive resonators with amedium drive level specification.

HS Oscillator mode selects the highest gain setting of theinternal inverter-amplifier. HS mode current consumptionis the highest of the three modes. This mode is bestsuited for resonators that require a high drive setting.

Figure 2-2 and Figure 2-3 show typical circuits forquartz crystal and ceramic resonators, respectively.

FIGURE 2-2: QUARTZ CRYSTAL OPERATION (LP, XT OR HS MODE)

Note: The Primary External Oscillator cannot beshut down when it is selected as theSystem Clock. To shut down the oscillator,the system clock source must be eitherthe Secondary Oscillator or the InternalOscillator.

Note 1: Quartz crystal characteristics varyaccording to type, package andmanufacturer. The user should consult themanufacturer data sheets for specificationsand recommended application.

2: Always verify oscillator performance overthe VDD and temperature range that isexpected for the application.

3: For oscillator design assistance, referencethe following Microchip Applications Notes:

AN826, Crystal Oscillator Basics and Crystal Selection for rfPIC and PIC Devices (DS00826)

AN849, Basic PIC Oscillator Design (DS00849)

AN943, Practical PIC Oscillator Analysis and Design (DS00943)

AN949, Making Your Oscillator Work (DS00949)

Note 1: A series resistor (RS) may be required forquartz crystals with low drive level.

2: The value of RF varies with the Oscillator modeselected (typically between 2 M to 10 M.

C1

C2

Quartz

RS(1)

OSC1/CLKIN

RF(2) Sleep

To Internal Logic

PIC MCU

Crystal

OSC2/CLKOUT 2009-2011 Microchip Technology Inc. DS41365E-page 15

PIC18(L)F1XK22

FIGURE 2-3: CERAMIC RESONATOR

OPERATION(XT OR HS MODE)

2.4.3 EXTERNAL RCThe External Resistor-Capacitor (RC) mode supportsthe use of an external RC circuit. This allows thedesigner maximum flexibility in frequency choice whilekeeping costs to a minimum when clock accuracy is notrequired. In RC mode, the RC circuit connects to OSC1,allowing OSC2 to be configured as an I/O or asCLKOUT. The CLKOUT function is selected by theFOSC bits of the CONFIG1H Configuration register.When OSC2 is configured as CLKOUT, the frequencyat the pin is the frequency of the RC oscillator divided by4. Figure 2-4 shows the external RC mode connections.

FIGURE 2-4: EXTERNAL RC MODES

The RC oscillator frequency is a function of the supplyvoltage, the resistor REXT, the capacitor CEXT and theoperating temperature. Other factors affecting theoscillator frequency are:

Input threshold voltage variation Component tolerances Variation in capacitance due to packaging

2.4.4 EXTERNAL CLOCK The External Clock (EC) mode allows an externallygenerated logic level clock to be used as the systemsclock source. When operating in this mode, theexternal clock source is connected to the OSC1allowing OSC2 to be configured as an I/O or asCLKOUT. The CLKOUT function is selected by theFOSC bits of the CONFIG1H Configuration register.When OSC2 is configured as CLKOUT, the frequencyat the pin is the frequency of the EC oscillator dividedby 4.

Three different power settings are available for ECmode. The power settings allow for a reduced IDD of thedevice, if the EC clock is known to be in a specificrange. If there is an expected range of frequencies forthe EC clock, select the power mode for the highestfrequency.

EC Low power 0 250 kHz

EC Medium power 250 kHz 4 MHz

EC High power 4 64 MHz

2.5 Secondary External OscillatorThe Secondary External Oscillator is designed to drivean external 32.768 kHz crystal. This oscillator isenabled or disabled by the T1OSCEN bit of the T1CONregister. See Section 10.0 Timer1 Module for moreinformation.

Note 1: A series resistor (RS) may be required forceramic resonators with low drive level.

2: The value of RF varies with the Oscillator modeselected (typically between 2 M to 10 M.

3: An additional parallel feedback resistor (RP)may be required for proper ceramic resonatoroperation.

C1

C2 Ceramic RS(1)

OSC1/CLKIN

RF(2) Sleep

To Internal Logic

PIC MCU

RP(3)

Resonator

OSC2/CLKOUT

OSC2/CLKOUT(1)

CEXT

REXT

PIC MCU

OSC1/CLKIN

FOSC/4 or

InternalClock

VDD

VSS

Recommended values: 10 k REXT 100 kCEXT > 20 pF

Note 1: Alternate pin functions are listed in Section 1.0 Device Overview.

2: Output depends upon RC or RCIO clock mode.

I/O(2)DS41365E-page 16 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

2.6 Internal OscillatorThe internal oscillator module contains two independentoscillators which are:

LFINTOSC: Low-Frequency Internal Oscillator HFINTOSC: High-Frequency Internal Oscillator

When operating with either oscillator, OSC1 will be anI/O and OSC2 will be either an I/O or CLKOUT. TheCLKOUT function is selected by the FOSC bits of theCONFIG1H Configuration register. When OSC2 isconfigured as CLKOUT, the frequency at the pin is thefrequency of the Internal Oscillator divided by 4.

2.6.1 LFINTOSCThe Low-Frequency Internal Oscillator (LFINTOSC) isa 31 kHz internal clock source. The LFINTOSCoscillator is the clock source for:

Power-up Timer Watchdog Timer Fail-Safe Clock Monitor

The LFINTOSC is enabled when any of the followingconditions are true:

Power-up Timer is enabled (PWRTEN = 0) Watchdog Timer is enabled (WDTEN = 1) Watchdog Timer is enabled by software

(WDTEN = 0 and SWDTEN = 1) Fail-Safe Clock Monitor is enabled (FCMEM = 1) SCS1 = 1 and IRCF = 000 and INTSRC = 0 FOSC selects the internal oscillator as the

primary clock and IRCF = 000 and INTSRC = 0

IESO = 1 (Two-Speed Start-up) and IRCF = 000 and INTSRC = 0

2.6.2 HFINTOSCThe High-Frequency Internal Oscillator (HFINTOSC) isa precision oscillator that is factory-calibrated tooperate at 16 MHz. The output of the HFINTOSCconnects to a postscaler and a multiplexer (seeFigure 2-1). One of eight frequencies can be selectedusing the IRCF bits of the OSCCON register. Thefollowing frequencies are available from theHFINTOSC:

16 MHZ 8 MHZ 4 MHZ 2 MHZ 1 MHZ (Default after Reset) 500 kHz 250 kHz 31 kHz

The HFIOFS bit of the OSCCON register indicateswhether the HFINTOSC is stable.

The HFINTOSC is enabled if any of the followingconditions are true:

SCS1 = 1 and IRCF 000 SCS1 = 1 and IRCF = 000 and INTSRC = 1 FOSC selects the internal oscillator as the

primary clock and- IRCF 000 or- IRCF = 000 and INTSRC = 1

IESO = 1 (Two-Speed Start-up) and- IRCF 000 or- IRCF = 000 and INTSRC = 1

FCMEM = 1 (Fail-Safe Clock Monitoring) and- IRCF 000 or- IRCF = 000 and INTSRC = 1

Note 1: Selecting 31 kHz from the HFINTOSCoscillator requires IRCF = 000 andthe INTSRC bit of the OSCTUNE registerto be set. If the INTSRC bit is clear, thesystem clock will come from theLFINTOSC.

2: Additional adjustments to the frequencyof the HFINTOSC can made via theOSCTUNE registers. See Register 2-3for more details. 2009-2011 Microchip Technology Inc. DS41365E-page 17

PIC18(L)F1XK22

2.7 Oscillator ControlThe Oscillator Control (OSCCON) (Register 2-1) and theOscillator Control 2 (OSCCON2) (Register 2-2) registerscontrol the system clock and frequency selectionoptions.

REGISTER 2-1: OSCCON: OSCILLATOR CONTROL REGISTER

R/W-0 R/W-0 R/W-1 R/W-1 R-q R-0 R/W-0 R/W-0IDLEN IRCF2 IRCF1 IRCF0 OSTS(1) HFIOFS SCS1 SCS0

bit 7 bit 0

Legend:R = Readable bit W = Writable bit U = Unimplemented bit, read as 0 q = depends on condition-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown

bit 7 IDLEN: Idle Enable bit1 = Device enters Idle mode on SLEEP instruction0 = Device enters Sleep mode on SLEEP instruction

bit 6-4 IRCF: Internal Oscillator Frequency Select bits111 = 16 MHz110 = 8 MHz 101 = 4 MHz 100 = 2 MHz011 = 1 MHz(3)010 = 500 kHz001 = 250 kHz000 = 31 kHz(2)

bit 3 OSTS: Oscillator Start-up Time-out Status bit(1)1 = Device is running from the clock defined by FOSC of the CONFIG1 register0 = Device is running from the internal oscillator (HFINTOSC or LFINTOSC)

bit 2 HFIOFS: HFINTOSC Frequency Stable bit 1 = HFINTOSC frequency is stable0 = HFINTOSC frequency is not stable

bit 1-0 SCS: System Clock Select bits1x = Internal oscillator block01 = Secondary (Timer1) oscillator00 = Primary clock (determined by CONFIG1H[FOSC]).

Note 1: Reset state depends on state of the IESO Configuration bit.2: Source selected by the INTSRC bit of the OSCTUNE register, see text.3: Default output frequency of HFINTOSC on Reset.DS41365E-page 18 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

REGISTER 2-2: OSCCON2: OSCILLATOR CONTROL REGISTER 2

U-0 U-0 U-0 U-0 U-0 R/W-1 R/W-0 R-x PRI_SD HFIOFL LFIOFS

bit 7 bit 0

Legend:R = Readable bit W = Writable bit U = Unimplemented bit, read as 0 q = depends on condition-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown

bit 7-3 Unimplemented: Read as 0bit 2 PRI_SD: Primary Oscillator Drive Circuit shutdown bit

1 = Oscillator drive circuit on0 = Oscillator drive circuit off (zero power)

bit 1 HFIOFL: HFINTOSC Frequency Locked bit1 = HFINTOSC is in lock0 = HFINTOSC has not yet locked

bit 0 LFIOFS: LFINTOSC Frequency Stable bit1 = LFINTOSC is stable0 = LFINTOSC is not stable 2009-2011 Microchip Technology Inc. DS41365E-page 19

PIC18(L)F1XK22

2.7.1 OSCTUNE REGISTERThe HFINTOSC is factory calibrated, but can beadjusted in software by writing to the TUN bits ofthe OSCTUNE register (Register 2-3).

The default value of the TUN is 000000. Thevalue is a 6-bit twos complement number.

When the OSCTUNE register is modified, theHFINTOSC frequency will begin shifting to the newfrequency. Code execution continues during this shift,while giving no indication that the shift has occurred.

OSCTUNE does not affect the LFINTOSC frequency.The operation of features that depend on the LFINTOSCclock source frequency, such as the Power-up Timer

(PWRT), Watchdog Timer (WDT), Fail-Safe Clock Mon-itor (FSCM) and peripherals, are not affected by thechange in frequency.

The OSCTUNE register also implements the INTSRCand PLLEN bits, which control certain features of theinternal oscillator block.

The INTSRC bit allows users to select which internaloscillator provides the clock source when the 31 kHzfrequency option is selected. This is covered in greaterdetail in Section 2.6.1 LFINTOSC.The PLLEN bit controls the operation of the frequencymultiplier. For more details about the function of thePLLEN bit see Section 2.10 4x Phase Lock LoopFrequency Multiplier

REGISTER 2-3: OSCTUNE: OSCILLATOR TUNING REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0INTSRC PLLEN TUN5 TUN4 TUN3 TUN2 TUN1 TUN0

bit 7 bit 0

Legend:R = Readable bit W = Writable bit U = Unimplemented bit, read as 0-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown

bit 7 INTSRC: Internal Oscillator Low-Frequency Source Select bit1 = 31.25 kHz device clock derived from 16 MHz HFINTOSC source (divide-by-512 enabled)0 = 31 kHz device clock derived directly from LFINTOSC internal oscillator

bit 6 PLLEN: Frequency Multiplier PLL bit1 = PLL enabled (for HFINTOSC 8 MHz and 16 MHz only)0 = PLL disabled

bit 5-0 TUN: Frequency Tuning bits011111 = Maximum frequency011110 = 000001 = 000000 = Oscillator module is running at the factory calibrated frequency.111111 = 100000 = Minimum frequencyDS41365E-page 20 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

2.8 Oscillator Start-up TimerThe Primary External Oscillator, when configured forLP, XT or HS modes, incorporates an Oscillator Start-upTimer (OST). The OST ensures that the oscillator startsand provides a stable clock to the oscillator module.The OST times out when 1024 oscillations on OSC1have occurred. During the OST period, with the systemclock set to the Primary External Oscillator, the programcounter does not increment suspending programexecution. The OST period will occur following:

Power-on Reset (POR) Brown-out Reset (BOR) Wake-up from Sleep Oscillator being enabled Expiration of Power-up Timer (PWRT)

In order to minimize latency between external oscillatorstart-up and code execution, the Two-Speed Start-upmode can be selected. See Section 2.11 Two-SpeedStart-up Mode for more information.

2.9 Clock SwitchingThe device contains circuitry to prevent clock glitchesdue to a change of the system clock source. Toaccomplish this, a short pause in the system clockoccurs during the clock switch. If the new clock sourceis not stable (e.g., OST is active), the device willcontinue to execute from the old clock source until thenew clock source becomes stable. The timing of aclock switch is as follows:

1. SCS bits of the OSCCON register aremodified.

2. The system clock will continue to operate fromthe old clock until the new clock is ready.

3. Clock switch circuitry waits for two consecutiverising edges of the old clock after the new clockis ready.

4. The system clock is held low, starting at the nextfalling edge of the old clock.

5. Clock switch circuitry waits for an additional tworising edges of the new clock.

6. On the next falling edge of the new clock, thelow hold on the system clock is release and thenew clock is switched in as the system clock.

7. Clock switch is complete.

Refer to Figure 2-5 for more details.

FIGURE 2-5: CLOCK SWITCH TIMING

Old Clock

New Clock

IRCF

System Clock

Start-up Time(1) Clock Sync Running

High Speed Low Speed

Select Old Select New

New Clk Ready

Low Speed High Speed

Old Clock

New Clock

IRCF

System Clock

Start-up Time(1) Clock Sync Running

Select Old Select New

New Clk Ready

Note 1: Start-up time includes TOST (1024 TOSC) for external clocks, plus TPLL (approx. 2 ms) for HSPLL mode. 2009-2011 Microchip Technology Inc. DS41365E-page 21

PIC18(L)F1XK22

TABLE 2-2: EXAMPLES OF DELAYS DUE TO CLOCK SWITCHING

2.10 4x Phase Lock Loop Frequency Multiplier

A Phase Locked Loop (PLL) circuit is provided as anoption for users who wish to use a lower-frequencyexternal oscillator or to operate at 32 MHz or 64 MHzwith the HFINTOSC. The PLL is designed for an inputfrequency from 4 MHz to 16 MHz. The PLL multipliesits input frequency by a factor of four when the PLL isenabled. This may be useful for customers who areconcerned with EMI, due to high-frequency crystals.

Two bits control the PLL: the PLL_EN bit of theCONFIG1H Configuration register and the PLLEN bit ofthe OSCTUNE register. The PLL is enabled when thePLL_EN bit is set and it is under software control whenthe PLL_EN bit is cleared. Refer to Table 2-3 andTable 2-4 for more information.

TABLE 2-3: PLL CONFIGURATION

2.11 Two-Speed Start-up ModeTwo-Speed Start-up mode provides additional powersavings by minimizing the latency between externalOscillator Start-up Timer (OST) and code execution. Inapplications that make heavy use of the Sleep mode,Two-Speed Start-up will remove the OST period, whichcan reduce the overall power consumption of thedevice.

Two-Speed Start-up mode is enabled by setting theIESO bit of the CONFIG1H Configuration register. WithTwo-Speed Start-up enabled, the device will executeinstructions using the internal oscillator during thePrimary External Oscillator OST period.

When the system clock is set to the Primary ExternalOscillator and the oscillator is configured for LP, XT orHS modes, the device will not execute code during theOST period. The OST will suspend program executionuntil 1024 oscillations are counted. Two-Speed Start-upmode minimizes the delay in code execution byoperating from the internal oscillator while the OST isactive. The system clock will switch back to the PrimaryExternal Oscillator after the OST period has expired.

Two-speed Start-up will become active after:

Power-on Reset (POR) Power-up Timer (PWRT), if enabled Wake-up from Sleep

The OSTS bit of the OSCCON register reports whichoscillator the device is currently using for operation.The device is running from the oscillator defined by theFOSC bits of the CONFIG1H Configuration registerwhen the OSTS bit is set. The device is running fromthe internal oscillator when the OSTS bit is clear.

Switch From Switch To Oscillator Delay

Sleep/POR LFINTOSCHFINTOSC

Oscillator Warm-up Delay (TWARM)

Sleep/POR LP, XT, HS 1024 clock cyclesSleep/POR EC, RC 8 Clock Cycles

PLL_EN PLLEN PLL Status

1 x PLL enabled0 1 PLL enabled0 0 PLL disabled

TABLE 2-4: PLL CONFIG1H/SOFTWARE ENABLE CLOCK SOURCE RESTRICTIONS

Mode PLL CONFIG1H Enable (PLL_EN)PLL Software

Enable (PLLEN)

LP Yes NoXT Yes NoHS Yes NoEC Yes No

EXTRC Yes NoLF INTOSC No NoHF INTOSC 8/16 MHz 8/16 MHzDS41365E-page 22 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

2.12 Fail-Safe Clock MonitorThe Fail-Safe Clock Monitor (FSCM) allows the deviceto continue operating should the external oscillator fail.The FSCM can detect oscillator failure any time afterthe Oscillator Start-up Timer (OST) has expired. TheFSCM is enabled by setting the FCMEN bit in theCONFIG1H Configuration register. The FSCM isapplicable to all external oscillator modes (LP, XT, HS,EC and RC).

FIGURE 2-6: FSCM BLOCK DIAGRAM

2.12.1 FAIL-SAFE DETECTIONThe FSCM module detects a failed oscillator bycomparing the external oscillator to the FSCM sampleclock. The sample clock is generated by dividing theLFINTOSC by 64. See Figure 2-6. Inside the faildetector block is a latch. The external clock sets thelatch on each falling edge of the external clock. Thesample clock clears the latch on each rising edge of thesample clock. A failure is detected when an entire half-cycle of the sample clock elapses before the primaryclock goes low.

2.12.2 FAIL-SAFE OPERATIONWhen the external clock fails, the FSCM switches thedevice clock to an internal clock source and sets the bitflag OSCFIF of the PIR2 register. The OSCFIF flag willgenerate an interrupt if the OSCFIE bit of the PIE2register is also set. The device firmware can then takesteps to mitigate the problems that may arise from afailed clock. The system clock will continue to besourced from the internal clock source until the devicefirmware successfully restarts the external oscillatorand switches back to external operation. An automatictransition back to the failed clock source will not occur.

The internal clock source chosen by the FSCM isdetermined by the IRCF bits of the OSCCONregister. This allows the internal oscillator to beconfigured before a failure occurs.

2.12.3 FAIL-SAFE CONDITION CLEARINGThe Fail-Safe condition is cleared by either one of thefollowing:

Any Reset By toggling the SCS1 bit of the OSCCON register

Both of these conditions restart the OST. While theOST is running, the device continues to operate fromthe INTOSC selected in OSCCON. When the OSTtimes out, the Fail-Safe condition is cleared and thedevice automatically switches over to the external clocksource. The Fail-Safe condition need not be clearedbefore the OSCFIF flag is cleared.

2.12.4 RESET OR WAKE-UP FROM SLEEPThe FSCM is designed to detect an oscillator failureafter the Oscillator Start-up Timer (OST) has expired.The OST is used after waking up from Sleep and afterany type of Reset. The OST is not used with the EC orRC Clock modes so that the FSCM will be active assoon as the Reset or wake-up has completed. Whenthe FSCM is enabled, the Two-Speed Start-up is alsoenabled. Therefore, the device will always be executingcode while the OST is operating.

External

LFINTOSC 64

S

R

Q

31 kHz(~32 s)

488 Hz(~2 ms)

Clock MonitorLatch

ClockFailure

Detected

Oscillator

Clock

Q

Sample Clock

Note: Due to the wide range of oscillator start-uptimes, the Fail-Safe circuit is not activeduring oscillator start-up (i.e., after exitingReset or Sleep). After an appropriateamount of time, the user should check theOSTS bit of the OSCCON register to verifythe oscillator start-up and that the systemclock switchover has successfullycompleted. 2009-2011 Microchip Technology Inc. DS41365E-page 23

PIC18(L)F1XK22

FIGURE 2-7: FSCM TIMING DIAGRAM

TABLE 2-5: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES

Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0Reset

Values on page

CONFIG1H IESO FCMEN PCLKEN PLL_EN FOSC3 FOSC2 FOSC1 FOSC0 259

INTCON GIE/GIEH PEIE/GIEL TMR0IE INT0IE RABIE TMR0IF INT0IF RABIF 253

OSCCON IDLEN IRCF2 IRCF1 IRCF0 OSTS HFIOFS SCS1 SCS0 254

OSCCON2 PRI_SD HFIOFL LFIOFS 254

OSCTUNE INTSRC PLLEN TUN5 TUN4 TUN3 TUN2 TUN1 TUN0 256

IPR2 OSCFIP C1IP C2IP EEIP BCLIP TMR3IP 256

PIE2 OSCFIE C1IE C2IE EEIE BCLIE TMR3IE 256

PIR2 OSCFIF C1IF C2IF EEIF BCLIF TMR3IF 256

T1CON RD16 T1RUN T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON 254Legend: x = unknown, u = unchanged, = unimplemented locations read as 0. Shaded cells are not used by oscillators.Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.

OSCFIF

SystemClock

Output

Sample Clock

FailureDetected

OscillatorFailure

Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies inthis example have been chosen for clarity.

(Q)

Test Test Test

Clock Monitor OutputDS41365E-page 24 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK223.0 MEMORY ORGANIZATIONThere are three types of memory in PIC18 Enhancedmicrocontroller devices:

Program Memory Data RAM Data EEPROM

As Harvard architecture devices, the data and programmemories use separate busses; this allows for concur-rent access of the two memory spaces. The dataEEPROM, for practical purposes, can be regarded asa peripheral device, since it is addressed and accessedthrough a set of control registers.

Additional detailed information on the operation of theFlash program memory is provided in Section 4.0Flash Program Memory. Data EEPROM isdiscussed separately in Section 5.0 Data EEPROMMemory.

3.1 Program Memory OrganizationPIC18 microcontrollers implement a 21-bit programcounter, which is capable of addressing a 2-MbyteProgram Memory (PC) space. Accessing a locationbetween the upper boundary of the physicallyimplemented memory and the 2-Mbyte address willreturn all 0s (a NOP instruction).This family of devices contain the following:

PIC18(L)F13K22: 8 Kbytes of Flash Memory, up to 4,096 single-word instructions

PIC18(L)F14K22: 16 Kbytes of Flash Memory, up to 8,192 single-word instructions

PIC18 devices have two interrupt vectors and oneReset vector. The Reset vector address is at 0000hand the interrupt vector addresses are at 0008h and0018h.

The program memory map for PIC18(L)F1XK22devices is shown in Figure 3-1. Memory block detailsare shown in Figure 22-2.

FIGURE 3-1: PROGRAM MEMORY MAP AND STACK FOR PIC18(L)F1XK22 DEVICES

PC

Stack Level 1

Stack Level 31

Reset Vector

Low Priority Interrupt Vector

CALL,RCALL,RETURNRETFIE,RETLW

21

0000h

0018h

High Priority Interrupt Vector 0008h

Use

r Mem

ory

Spac

e

1FFFFFh

4000h3FFFh

200000h

On-ChipProgram Memory

Read 0

1FFFh2000h

On-ChipProgram Memory

Read 0

PIC18(L)F14K22

PIC18(L)F13K22 2009-2011 Microchip Technology Inc. DS41365E-page 25

PIC18(L)F1XK22

3.1.1 PROGRAM COUNTERThe Program Counter (PC) specifies the address of theinstruction to fetch for execution. The PC is 21 bits wideand is contained in three separate 8-bit registers. Thelow byte, known as the PCL register, is both readableand writable. The high byte, or PCH register, containsthe PC bits; it is not directly readable or writable.Updates to the PCH register are performed through thePCLATH register. The upper byte is called PCU. Thisregister contains the PC bits; it is also notdirectly readable or writable. Updates to the PCUregister are performed through the PCLATU register.

The contents of PCLATH and PCLATU are transferredto the program counter by any operation that writesPCL. Similarly, the upper two bytes of the programcounter are transferred to PCLATH and PCLATU by anoperation that reads PCL. This is useful for computedoffsets to the PC (see Section 3.1.4.1 ComputedGOTO).The PC addresses bytes in the program memory. Toprevent the PC from becoming misaligned with wordinstructions, the Least Significant bit (LSb) of PCL isfixed to a value of 0. The PC increments by 2 toaddress sequential instructions in the program mem-ory.

The CALL, RCALL, GOTO and program branchinstructions write to the program counter directly. Forthese instructions, the contents of PCLATH andPCLATU are not transferred to the program counter.

3.1.2 RETURN ADDRESS STACKThe return address stack allows any combination of upto 31 program calls and interrupts to occur. The PC ispushed onto the stack when a CALL or RCALLinstruction is executed or an interrupt is Acknowledged.The PC value is pulled off the stack on a RETURN,RETLW or a RETFIE instruction. PCLATU and PCLATHare not affected by any of the RETURN or CALLinstructions.

The stack operates as a 31-word by 21-bit RAM and a5-bit Stack Pointer, STKPTR. The stack space is notpart of either program or data space. The Stack Pointeris readable and writable and the address on the top ofthe stack is readable and writable through the Top-of-Stack (TOS) Special File Registers. Data can also bepushed to, or popped from the stack, using theseregisters.

A CALL type instruction causes a push onto the stack;the Stack Pointer is first incremented and the locationpointed to by the Stack Pointer is written with thecontents of the PC (already pointing to the instructionfollowing the CALL). A RETURN type instruction causesa pop from the stack; the contents of the locationpointed to by the STKPTR are transferred to the PCand then the Stack Pointer is decremented.

The Stack Pointer is initialized to 00000 after allResets. There is no RAM associated with the locationcorresponding to a Stack Pointer value of 00000; thisis only a Reset value. Status bits indicate if the stack isfull or has overflowed or has underflowed.

3.1.2.1 Top-of-Stack AccessOnly the top of the return address stack (TOS) is readableand writable. A set of three registers, TOSU:TOSH:TOSL,hold the contents of the stack location pointed to by theSTKPTR register (Figure 3-2). This allows users toimplement a software stack if necessary. After a CALL,RCALL or interrupt, the software can read the pushedvalue by reading the TOSU:TOSH:TOSL registers. Thesevalues can be placed on a user defined software stack. Atreturn time, the software can return these values toTOSU:TOSH:TOSL and do a return.

The user must disable the global interrupt enable bitswhile accessing the stack to prevent inadvertent stackcorruption.

FIGURE 3-2: RETURN ADDRESS STACK AND ASSOCIATED REGISTERS

00011001A34h

111111111011101

000100000100000

00010

Return Address Stack

Top-of-Stack000D58h

TOSLTOSHTOSU34h1Ah00h

STKPTR

Top-of-Stack Registers Stack PointerDS41365E-page 26 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

3.1.2.2 Return Stack Pointer (STKPTR)The STKPTR register (Register 3-1) contains the StackPointer value, the STKFUL (Stack Full) bit and theSTKUNF (Stack Underflow) bits. The value of the StackPointer can be 0 through 31. The Stack Pointer incre-ments before values are pushed onto the stack anddecrements after values are popped off the stack. OnReset, the Stack Pointer value will be zero. The usermay read and write the Stack Pointer value. This fea-ture can be used by a Real-Time Operating System(RTOS) for return stack maintenance.

After the PC is pushed onto the stack 31 times (withoutpopping any values off the stack), the STKFUL bit isset. The STKOVF bit is cleared by software or by aPOR.

The action that takes place when the stack becomesfull depends on the state of the STVREN (Stack Over-flow Reset Enable) Configuration bit. (Refer toSection 22.1 Configuration Bits for a description ofthe device Configuration bits.) If STVREN is set(default), the 31st push will push the (PC + 2) valueonto the stack, set the STKOVF bit and reset thedevice. The STKOVF bit will remain set and the StackPointer will be set to zero.

If STVREN is cleared, the STKOVF bit will be set on the31st push and the Stack Pointer will increment to 31.Any additional pushes will not overwrite the 31st pushand STKPTR will remain at 31.

When the stack has been popped enough times tounload the stack, the next pop will return a value of zeroto the PC and sets the STKUNF bit, while the StackPointer remains at zero. The STKUNF bit will remainset until cleared by software or until a POR occurs.

3.1.2.3 PUSH and POP InstructionsSince the Top-of-Stack is readable and writable, theability to push values onto the stack and pull values offthe stack without disturbing normal program executionis a desirable feature. The PIC18 instruction setincludes two instructions, PUSH and POP, that permitthe TOS to be manipulated under software control.TOSU, TOSH and TOSL can be modified to place dataor a return address on the stack.

The PUSH instruction places the current PC value ontothe stack. This increments the Stack Pointer and loadsthe current PC value onto the stack.

The POP instruction discards the current TOS by decre-menting the Stack Pointer. The previous value pushedonto the stack then becomes the TOS value.

Note: Returning a value of zero to the PC on anunderflow has the effect of vectoring theprogram to the Reset vector, where thestack conditions can be verified andappropriate actions can be taken. This isnot the same as a Reset, as the contentsof the SFRs are not affected.

REGISTER 3-1: STKPTR: STACK POINTER REGISTER

R/C-0 R/C-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0STKOVF(1) STKUNF(1) SP4 SP3 SP2 SP1 SP0

bit 7 bit 0

Legend:R = Readable bit W = Writable bit U = Unimplemented C = Clearable only bit-n = Value at POR 1 = Bit is set 0 = Bit is cleared x = Bit is unknown

bit 7 STKOVF: Stack Overflow Flag bit(1)

1 = Stack became full or overflowed0 = Stack has not become full or overflowed

bit 6 STKUNF: Stack Underflow Flag bit(1)

1 = Stack underflow occurred 0 = Stack underflow did not occur

bit 5 Unimplemented: Read as 0bit 4-0 SP: Stack Pointer Location bits

Note 1: Bit 7 and bit 6 are cleared by user software or by a POR. 2009-2011 Microchip Technology Inc. DS41365E-page 27

PIC18(L)F1XK22

3.1.2.4 Stack Overflow and Underflow

ResetsDevice Resets on Stack Overflow and Stack Underflowconditions are enabled by setting the STVREN bit inConfiguration Register 4L. When STVREN is set, a fullor underflow will set the appropriate STKOVF orSTKUNF bit and then cause a device Reset. WhenSTVREN is cleared, a full or underflow condition will setthe appropriate STKOVF or STKUNF bit but not causea device Reset. The STKOVF or STKUNF bits arecleared by the user software or a Power-on Reset.

3.1.3 FAST REGISTER STACKA fast register stack is provided for the STATUS,WREG and BSR registers, to provide a fast returnoption for interrupts. The stack for each register is onlyone level deep and is neither readable nor writable. It isloaded with the current value of the corresponding reg-ister when the processor vectors for an interrupt. Allinterrupt sources will push values into the stack regis-ters. The values in the registers are then loaded backinto their associated registers if the RETFIE, FASTinstruction is used to return from the interrupt.

If both low and high priority interrupts are enabled, thestack registers cannot be used reliably to return fromlow priority interrupts. If a high priority interrupt occurswhile servicing a low priority interrupt, the stack registervalues stored by the low priority interrupt will beoverwritten. In these cases, users must save the keyregisters by software during a low priority interrupt.

If interrupt priority is not used, all interrupts may use thefast register stack for returns from interrupt. If nointerrupts are used, the fast register stack can be usedto restore the STATUS, WREG and BSR registers atthe end of a subroutine call. To use the fast registerstack for a subroutine call, a CALL label, FASTinstruction must be executed to save the STATUS,WREG and BSR registers to the fast register stack. ARETURN, FAST instruction is then executed to restorethese registers from the fast register stack.

Example 3-1 shows a source code example that usesthe fast register stack during a subroutine call andreturn.

EXAMPLE 3-1: FAST REGISTER STACK CODE EXAMPLE

3.1.4 LOOK-UP TABLES IN PROGRAM MEMORY

There may be programming situations that require thecreation of data structures, or look-up tables, inprogram memory. For PIC18 devices, look-up tablescan be implemented in two ways:

Computed GOTO Table Reads

3.1.4.1 Computed GOTOA computed GOTO is accomplished by adding an offsetto the program counter. An example is shown inExample 3-2.

A look-up table can be formed with an ADDWF PCLinstruction and a group of RETLW nn instructions. TheW register is loaded with an offset into the table beforeexecuting a call to that table. The first instruction of thecalled routine is the ADDWF PCL instruction. The nextinstruction executed will be one of the RETLW nninstructions that returns the value nn to the callingfunction.

The offset value (in WREG) specifies the number ofbytes that the program counter should advance andshould be multiples of 2 (LSb = 0).In this method, only one data byte may be stored ineach instruction location and room on the returnaddress stack is required.

EXAMPLE 3-2: COMPUTED GOTO USING AN OFFSET VALUE

3.1.4.2 Table Reads and Table WritesA better method of storing data in program memoryallows two bytes of data to be stored in each instructionlocation.

Look-up table data may be stored two bytes per pro-gram word by using table reads and writes. The TablePointer (TBLPTR) register specifies the byte addressand the Table Latch (TABLAT) register contains thedata that is read from or written to program memory.Data is transferred to or from program memory onebyte at a time.

Table read and table write operations are discussedfurther in Section 4.1 Table Reads and TableWrites.

CALL SUB1, FAST ;STATUS, WREG, BSR;SAVED IN FAST REGISTER;STACK

SUB1

RETURN, FAST ;RESTORE VALUES SAVED;IN FAST REGISTER STACK

MOVF OFFSET, WCALL TABLE

ORG nn00hTABLE ADDWF PCL

RETLW nnhRETLW nnhRETLW nnh...DS41365E-page 28 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

3.2 PIC18 Instruction Cycle

3.2.1 CLOCKING SCHEMEThe microcontroller clock input, whether from aninternal or external source, is internally divided by fourto generate four non-overlapping quadrature clocks(Q1, Q2, Q3 and Q4). Internally, the program counter isincremented on every Q1; the instruction is fetchedfrom the program memory and latched into theinstruction register during Q4. The instruction isdecoded and executed during the following Q1 throughQ4. The clocks and instruction execution flow areshown in Figure 3-3.

3.2.2 INSTRUCTION FLOW/PIPELININGAn Instruction Cycle consists of four Q cycles: Q1through Q4. The instruction fetch and execute arepipelined in such a manner that a fetch takes oneinstruction cycle, while the decode and execute takeanother instruction cycle. However, due to thepipelining, each instruction effectively executes in onecycle. If an instruction causes the program counter tochange (e.g., GOTO), then two cycles are required tocomplete the instruction (Example 3-3).

A fetch cycle begins with the Program Counter (PC)incrementing in Q1.

In the execution cycle, the fetched instruction is latchedinto the Instruction Register (IR) in cycle Q1. Thisinstruction is then decoded and executed during theQ2, Q3 and Q4 cycles. Data memory is read during Q2(operand read) and written during Q4 (destinationwrite).

FIGURE 3-3: CLOCK/INSTRUCTION CYCLE

EXAMPLE 3-3: INSTRUCTION PIPELINE FLOW

Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4OSC1

Q1

Q2Q3

Q4

PC

OSC2/CLKOUT(RC mode)

PC PC + 2 PC + 4

Fetch INST (PC)Execute INST (PC 2)

Fetch INST (PC + 2)Execute INST (PC)

Fetch INST (PC + 4)Execute INST (PC + 2)

InternalPhaseClock

All instructions are single cycle, except for any program branches. These take two cycles since the fetch instructionis flushed from the pipeline while the new instruction is being fetched and then executed.

TCY0 TCY1 TCY2 TCY3 TCY4 TCY51. MOVLW 55h Fetch 1 Execute 12. MOVWF PORTB Fetch 2 Execute 23. BRA SUB_1 Fetch 3 Execute 34. BSF PORTA, BIT3 (Forced NOP) Fetch 4 Flush (NOP)5. Instruction @ address SUB_1 Fetch SUB_1 Execute SUB_1 2009-2011 Microchip Technology Inc. DS41365E-page 29

PIC18(L)F1XK22

3.2.3 INSTRUCTIONS IN PROGRAM

MEMORYThe program memory is addressed in bytes.Instructions are stored as either two bytes or four bytesin program memory. The Least Significant Byte (LSB)of an instruction word is always stored in a programmemory location with an even address (LSb = 0). Tomaintain alignment with instruction boundaries, the PCincrements in steps of 2 and the LSb will always read0 (see Section 3.1.1 Program Counter).Figure 3-4 shows an example of how instruction wordsare stored in the program memory.

The CALL and GOTO instructions have the absoluteprogram memory address embedded into theinstruction. Since instructions are always stored on wordboundaries, the data contained in the instruction is aword address. The word address is written to PC,which accesses the desired byte address in programmemory. Instruction #2 in Figure 3-4 shows how theinstruction GOTO 0006h is encoded in the programmemory. Program branch instructions, which encode arelative address offset, operate in the same manner. Theoffset value stored in a branch instruction represents thenumber of single-word instructions that the PC will beoffset by. Section 23.0 Instruction Set Summaryprovides further details of the instruction set.

FIGURE 3-4: INSTRUCTIONS IN PROGRAM MEMORY

3.2.4 TWO-WORD INSTRUCTIONSThe standard PIC18 instruction set has four two-wordinstructions: CALL, MOVFF, GOTO and LSFR. In allcases, the second word of the instruction always has1111 as its four Most Significant bits (MSb); the other12 bits are literal data, usually a data memory address.

The use of 1111 in the 4 MSbs of an instructionspecifies a special form of NOP. If the instruction isexecuted in proper sequence immediately after thefirst word the data in the second word is accessed

and used by the instruction sequence. If the first wordis skipped for some reason and the second word isexecuted by itself, a NOP is executed instead. This isnecessary for cases when the two-word instruction ispreceded by a conditional instruction that changes thePC. Example 3-4 shows how this works.

EXAMPLE 3-4: TWO-WORD INSTRUCTIONS

Word AddressLSB = 1 LSB = 0

Program MemoryByte Locations 000000h000002h

000004h000006h

Instruction 1: MOVLW 055h 0Fh 55h 000008hInstruction 2: GOTO 0006h EFh 03h 00000Ah

F0h 00h 00000ChInstruction 3: MOVFF 123h, 456h C1h 23h 00000Eh

F4h 56h 000010h000012h000014h

Note: See Section 3.6 PIC18 InstructionExecution and the Extended Instruc-tion Set for information on two-wordinstructions in the extended instruction set.

CASE 1:Object Code Source Code0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?1100 0001 0010 0011 MOVFF REG1, REG2 ; No, skip this word1111 0100 0101 0110 ; Execute this word as a NOP0010 0100 0000 0000 ADDWF REG3 ; continue codeCASE 2:Object Code Source Code0110 0110 0000 0000 TSTFSZ REG1 ; is RAM location 0?1100 0001 0010 0011 MOVFF REG1, REG2 ; Yes, execute this word1111 0100 0101 0110 ; 2nd word of instruction0010 0100 0000 0000 ADDWF REG3 ; continue codeDS41365E-page 30 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

3.3 Data Memory Organization

The data memory in PIC18 devices is implemented asstatic RAM. Each register in the data memory has a12-bit address, allowing up to 4096 bytes of datamemory. The memory space is divided into as many as16 banks that contain 256 bytes each. Figure 3-5 andFigure 3-6 show the data memory organization for thePIC18(L)F1XK22 devices.

The data memory contains Special Function Registers(SFRs) and General Purpose Registers (GPRs). TheSFRs are used for control and status of the controllerand peripheral functions, while GPRs are used for datastorage and scratchpad operations in the usersapplication. Any read of an unimplemented location willread as 0s.The instruction set and architecture allow operationsacross all banks. The entire data memory may beaccessed by Direct, Indirect or Indexed Addressingmodes. Addressing modes are discussed later in thissubsection.

To ensure that commonly used registers (SFRs andselect GPRs) can be accessed in a single cycle, PIC18devices implement an Access Bank. This is a 256-bytememory space that provides fast access to SFRs andthe lower portion of GPR Bank 0 without using the BankSelect Register (BSR). Section 3.3.2 Access Bankprovides a detailed description of the Access RAM.

3.3.1 BANK SELECT REGISTER (BSR)Large areas of data memory require an efficientaddressing scheme to make rapid access to anyaddress possible. Ideally, this means that an entireaddress does not need to be provided for each read orwrite operation. For PIC18 devices, this is accom-plished with a RAM banking scheme. This divides thememory space into 16 contiguous banks of 256 bytes.Depending on the instruction, each location can beaddressed directly by its full 12-bit address, or an 8-bitlow-order address and a 4-bit Bank Pointer.

Most instructions in the PIC18 instruction set make useof the Bank Pointer, known as the Bank Select Register(BSR). This SFR holds the 4 Most Significant bits of alocations address; the instruction itself includes the8 Least Significant bits. Only the four lower bits of theBSR are implemented (BSR). The upper four bitsare unused; they will always read 0 and cannot bewritten to. The BSR can be loaded directly by using theMOVLB instruction.The value of the BSR indicates the bank in datamemory; the 8 bits in the instruction show the locationin the bank and can be thought of as an offset from thebanks lower boundary. The relationship between theBSRs value and the bank division in data memory isshown in Figure 3-5 and Figure 3-6.

Since up to 16 registers may share the same low-orderaddress, the user must always be careful to ensure thatthe proper bank is selected before performing a dataread or write. For example, writing what should beprogram data to an 8-bit address of F9h while the BSRis 0Fh will end up resetting the program counter.

While any bank can be selected, only those banks thatare actually implemented can be read or written to.Writes to unimplemented banks are ignored, whilereads from unimplemented banks will return 0s. Evenso, the STATUS register will still be affected as if theoperation was successful. The data memory maps inFigure 3-5 and Figure 3-6 indicate which banks areimplemented.

In the core PIC18 instruction set, only the MOVFFinstruction fully specifies the 12-bit address of thesource and target registers. This instruction ignores theBSR completely when it executes. All other instructionsinclude only the low-order address as an operand andmust use either the BSR or the Access Bank to locatetheir target registers.

Note: The operation of some aspects of datamemory are changed when the PIC18extended instruction set is enabled. SeeSection 3.5 Data Memory and theExtended Instruction Set for moreinformation. 2009-2011 Microchip Technology Inc. DS41365E-page 31

PIC18(L)F1XK22

FIGURE 3-5: DATA MEMORY MAP FOR PIC18(L)F13K22 DEVICES

Bank 0

Bank 1

Bank 14

Bank 15

Data Memory MapBSR

= 0000

= 0001

= 1111

060h05Fh

F60hFFFh

00h5Fh60h

FFh

Access Bank

When a = 0: The BSR is ignored and theAccess Bank is used.The first 96 bytes are general purpose RAM (from Bank 0). The second 160 bytes areSpecial Function Registers(from Bank 15).

When a = 1: The BSR specifies the Bankused by the instruction.

F5Fh

F00hEFFh

1FFh

100h0FFh

000hAccess RAM

FFh

00h

FFh

00h

FFh

00h

GPR

SFR

Access RAM High

Access RAM Low

Bank 2

= 0110

= 0010

(SFRs)

2FFh

200h

3FFh

300h

4FFh

400h

5FFh

500h

6FFh

600h

7FFh

700h

8FFh

800h

9FFh

900h

AFFh

A00h

BFFh

B00h

CFFh

C00h

DFFh

D00h

E00h

Bank 3

Bank 4

Bank 5

Bank 6

Bank 7

Bank 8

Bank 9

Bank 10

Bank 11

Bank 12

Bank 13

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

= 0011

= 0100

= 0101

= 0111

= 1000

= 1001

= 1010

= 1011

= 1100

= 1101

= 1110

UnusedRead 00h

UnusedF53h

SFR(1)

Note 1: SFRs occupying F53h to F5Fh address space are not in the virtual bank.DS41365E-page 32 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

FIGURE 3-6: DATA MEMORY MAP FOR PIC18(L)F14K22 DEVICES

Bank 0

Bank 1

Bank 14

Bank 15

Data Memory MapBSR

= 0000

= 0001

= 1111

060h05Fh

00h5Fh60h

FFh

Access Bank

When a = 0: The BSR is ignored and theAccess Bank is used.The first 96 bytes are general purpose RAM (from Bank 0). The second 160 bytes areSpecial Function Registers(from Bank 15).

When a = 1: The BSR specifies the Bankused by the instruction.

F00hEFFh

1FFh

100h0FFh

000hAccess RAM

FFh

00h

FFh

00h

GPR

GPR

Access RAM High

Access RAM Low

Bank 2

= 0110

= 0010

(SFRs)

2FFh

200h

3FFh

300h

4FFh

400h

5FFh

500h

6FFh

600h

7FFh

700h

8FFh

800h

9FFh

900h

AFFh

A00h

BFFh

B00h

CFFh

C00h

DFFh

D00h

E00h

Bank 3

Bank 4

Bank 5

Bank 6

Bank 7

Bank 8

Bank 9

Bank 10

Bank 11

Bank 12

Bank 13

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

FFh

00h

= 0011

= 0100

= 0101

= 0111

= 1000

= 1001

= 1010

= 1011

= 1100

= 1101

= 1110

UnusedRead 00h

Note 1: SFRs occupying F53h to F5Fh address space are not in the virtual bank.

F60hFFFh

F5Fh

FFh

00h

SFR

UnusedF53h

SFR(1) 2009-2011 Microchip Technology Inc. DS41365E-page 33

PIC18(L)F1XK22

FIGURE 3-7: USE OF THE BANK SELECT REGISTER (DIRECT ADDRESSING)

Note 1: The Access RAM bit of the instruction can be used to force an override of the selected bank (BSR) to the registers of the Access Bank.

2: The MOVFF instruction embeds the entire 12-bit address in the instruction.

Data Memory

Bank Select(2)

7 0From Opcode(2)

0 0 0 0000h

100h

200h

300h

F00h

E00h

FFFh

Bank 0

Bank 1

Bank 2

Bank 14

Bank 15

00h

FFh00h

FFh00h

FFh

00h

FFh00h

FFh

00h

FFh

Bank 3throughBank 13

0 0 1 1 1 1 1 1 1 1 1 17 0

BSR(1)DS41365E-page 34 2009-2011 Microchip Technology Inc.

PIC18(L)F1XK22

3.3.2 ACCESS BANKWhile the use of the BSR with an embedded 8-bitaddress allows users to address the entire range ofdata memory, it also means that the user must alwaysensure that the correct bank is selected. Otherwise,data may be read from or written to the wrong location.This can be disastrous if a GPR is the intended targetof an operation, but an SFR is written to instead.Verifying and/or changing the BSR for each read orwrite to data memory can become very inefficient.

To streamline access for the most commonly used datamemory locations, the data memory is configured withan Access Bank, which allows users to access amapped block of memory without specifying a BSR.The Access Bank consists of the first 96 bytes of mem-ory (00h-5Fh) in Bank 0 and the last 160 bytes of mem-ory (60h-FFh) in Block 15. The lower half is known asthe Access RAM and is composed of GPRs. Thisupper half is also where the devices SFRs are mapped.These two areas are mapped contiguously in theAccess Bank and can be addressed in a linear fashionby an 8-bit address (Figure 3-5 and Figure 3-6).

The Access Bank is used by core PIC18 instructionsthat include the Access RAM bit (the a parameter inthe instruction). When a is equal to 1, the instructionuses the BSR and the 8-bit address included in theopcode for the data memory address. When a is 0,however, the instruction is forced to use the AccessBank address map; the current value of the BSR isignored entirely.

Using this forced addressing allows the instruction tooperate on a data address in a single cycle, withoutupdating the BSR first. For 8-bit addresses of 60h andabove, this means that users can evaluate and operateon SFRs more efficiently. The Access RAM below 60his a good place for data values that the user might needto access rapidly, such as immediate computationalresults or common program variables. Access RAMalso allows for faster and more code efficient contextsaving and switching of variables.

The mapping of the Access Bank is slightly differentwhen the extended instruction set is enabled (XINSTConfiguration bit = 1). This is discussed in more detailin Section 3.5.3 Mapping the Access Bank inIndexed Literal Offset Mode.

3.3.3 GENERAL PURPOSE REGISTER FILE

PIC18 devices may have banked memory in the GPRarea. This is data RAM, which is available for use by allinstructions. GPRs start at the bottom of Bank 0(address 000h) and grow upwards towards the bottom ofthe SFR area. GPRs are not initialized by a Power-onReset and are unchanged on all other Resets.

3.3.4 SPECIAL FUNCTION REGISTERSThe Special Function Registers (SFRs) are registersused by the CPU and peripheral modules for controllingthe desired operation of the device. These registers areimplemented as static RAM. SFRs start at the top ofdata memory (FFFh) and extend downward to occupythe top portion of Bank 15 (F60h to FFFh). A list ofthese registers is given in Table 3-1 and Table 3-2.The SFRs can be classified into two sets: thoseassociated with the core device functionality (ALU,Resets and interrupts) and those related to theperipheral functions. The Reset and Interrupt registersare described in their respective chapters, while theALUs STATUS register is described later in thissection. Registers related to the operation of aperipheral feature are described in the chapter for thatperipheral.The SFRs are typically distributed among theperipherals whose functions they control. Unused SFRlocations are unimplemented and read as 0s. 2009-2011 Microchip Technology Inc. DS41365E-page 35

PIC18(L)F1XK22

TABLE 3-1: SPECIAL FUNCTION REGISTER MAP FOR PIC18(L)F1XK22 DEVICESAddress Name Address Name Address Name Address Name Address Name

FFFh TOSU FD7h TMR0H FAFh SPBRG F87h (2) F5Fh (2)

FFEh TOSH FD6h TMR0L FAEh RCREG F86h (2) F5Eh (2)

FFDh TOSL FD5h T0CON FADh TXREG F85h (2) F5Dh (2)

FFCh STKPTR FD4h (2) FACh TXSTA F84h (2) F5Ch (2)

FFBh PCLATU FD3h OSCCON FABh RCSTA F83h (2) F5Bh (2)

FFAh PCLATH FD2h OSCCON2 FAAh (2) F82h PORTC F5Ah (2)

FF9h PCL FD1h WDTCON FA9h EEADR F81h PORTB F59h (2)

FF8h TBLPTRU FD0h RCON FA8h EEDATA F80h PORTA F58h (2)

FF7h TBLPTRH FCFh TMR1H FA7h EECON2(1)