Plasma Ruggedized Solutions

Company Descriptive

COMPANY OVERVIEWPlasma Ruggedized Solutions

Plasma Ruggedized Solutions, Inc. (‘Plasma’ or the ‘Company’) is an engineering services partner to OEM’s that designs, tests, and applies chemical and mechanical agents/devices to ruggedize and encrypt (mechanically) odd geometry/asymmetric PCB’s and electronic assemblies.

Summary

Founded in 1990.

California subchapter ‘S’ Corporation.

Shareholders are Institutional Capital and Management.

Headquartered in San Jose California with a 2nd facility in Huntington Beach comprising a total of approximately 55,000 sq. ft. with 105 employees.

Over 2000 customers in current operating base covering 16 industries with 400-600 active during any particular month. The largest representing less than 12% of sales.

Rapid historical growth facilitated by compliance with newly implemented environmental regulations (RoHS) and industry trend toward ruggedization.

Multi-industry orientation with primary applications in A&D, Medical, Automotive, Robotics and Communications sectors.

Plasma Ruggedized Solutions Proprietary and Confidential

Conformal Coating Introduction

Improves and extends the working life and reliability of electronic components.

Conformal Coats are thin layers of synthetic resins or organic polymers applied to electronic assemblies. Coating protects against environmental, mechanical, thermal, electrical, vibration and chemical challenges.

Mitigates manufacturing issues related to RoHS mandated removal of lead from printed circuit board fabrication and printed circuit assembly operations. Coatings are thin and conform to the irregular shape of the boards and their components.

Potting Introduction

The encapsulating and casting of an electronic device is also a method of coating or sealing circuit board assemblies, cables and harnesses. Unlike Conformal Coating potting does not conform to irregular shapes of components.

Potting provides all of the same environmental protection and electrical performance stabilization as coating, but it also provides a security function for protecting a classified device or prevention of reverse engineering attempts.

The Potting method uses a custom formed “Pot” or case/shell to put the entire device into, the compound is then introduced and the device sealed.

Products & ApplicationsConformal Coating and Potting Represent 90% of Plasma Revenues

Plasma Ruggedized Solutions

Plasma Ruggedized Solutions Proprietary and Confidential

Competitive DifferentiationPlasma Ruggedized Solutions

Short Lead-Time Customer Requirements

Customer production schedule demands are typically < 50 hours and usually require intensive engineering and “First Article” testing and or Qualification of engineering production processes.Physical proximity is important

High-Barrier Technical Problem-Solving Orientation

Customer engineering needs usually demand “face to face” conferences and technicalinteractions to assure and address engineering changes and concerns. Plasma is considered a “Last Stop” for resolution of hard to apply/engineered Coatings and Potting materials. Plasma provides repair and overhaul of other supplier and customer rejected hardware featuring IP equipment and Plasma Etch technology of our own design.

Complex Application Capabilities:

Plasma features a broad spectrum of highly engineered chemical and mechanical technologies for asymmetric and complex PCB’s/electronic assemblies for ruggedization, security and performance enhancement. Customer designs may feature somewhat fluid technical baselines or require rapid rework to effect desired performance.

Structural Inhibitors to Offshore Sourcing

Product restrictions on offshore sourcing for military and medical applications ITAR (International Traffic and Arms Regulations) and State Department Regulations on technology control and transfer limit the supply chain to domestic sources and manufacturing agents. Medical assemblies are generally manufactured locally due to their unique technical and performance requirements and small lot sizes. Military and medical sectors

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Fortification of DifferentiatorsPlasma Ruggedized Solutions

Continuing evolution of Plasma’s competitive differentiation is a core-focus of management and a primary component of the investment thesis:

PRS Augments Current Service Offerings with Complementary and High-Value Services

Environmental Stress Screening and TestingAdditional specialty engineering services/capabilities*Clean room capabilities-10K PPM (Both facilities)Specialty cleaning services for PCB’s and sensitive mechanical componentryPCB Cross section evaluation, advanced microscopic review and X-Ray capabilitiesSub-assembly and System-level build and test

Deeper Penetration of Current Customers and Sector Differentiation

Migration toward higher-barrier-to-entry markets and sectorsTargeted market segment penetration by industry and geographyOn-site customer support teams featuring Plasma engineering and senior managementSelected marketing forums where Plasma’s technical capability can be demonstrated

Position Plasma as a World-Class Engineering Services Provider

Mil-Spec certifications/ recently NASA certified (both facilities) Complete ISO certification processAS9100 program‘Scaled’ six sigma programMore effectively manage and monetize accumulated intellectual property

*Including but not limited to providing PRS engineering resources to participate with OEM’s in original design process for complex systems

Plasma Ruggedized Solutions Proprietary and Confidential

INDUSTRIES SERVED

Plasma Ruggedized Solutions

Plasma Ruggedized Solutions offers solutions which have been successfully deployed across many industries . Our extensive knowledge in the protection of circuit board assemblies allows us to protect circuitry to the Federal Information Processing Standards (FIPS). Following are examples of the industries we serve.

• Aerospace & Defense• Alternative Energy• Automotive• Banking• Intelligence & Reconnaissance• Law Enforcement• LED• Medical• Oil and Gas• Robotics & Electromechanical Systems• Smart Grid• Sports & Recreation• Telecommunications

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CORE BUSINESS

Plasma Ruggedized Solutions

• PLASMA ETCHBACK DESMEAR

• CONFORMAL COATING

• PARYLENE COATING

• POTTING AND ENCAPSULATING

• BGA UNDERFILL

• FORM-IN-PLACE (FIP)

• PRIVATE LABEL MATERIALS

• TESTING, LABORATORY and ENGINEERING SERVICES

• FIPS 140-2 & 140-3 Capabilities

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CONFORMAL COATING

Plasma Ruggedized Solutions

Commonly Used Conformal Coatings Include

Acrylic

(AR)Polyurethane

(UR)Epoxy

(ER)

Silicone

(SR)Parylene

(XY)Nano

Coatings

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QUALITY CERTIFICATIONS

Plasma Ruggedized Solutions

Locations

Plasma Ruggedized Solutions - Northern CA Plasma Ruggedized Solutions - Southern CA2284 Ringwood Ave Suite A 5452 Business Drive San Jose, CA 95131 Huntington Beach, CA 92649

AS9100 ITAR IPC RoHS COMSEC NASA ISO 9001:2008 Registered Registered Complaint Registered 8739.1A Certified

Plasma Ruggedized Solutions Proprietary and Confidential

NASA 8739.1A Certified

Plasma Ruggedized Solutions

Plasma Ruggedized Solutions Proprietary and Confidential

Six Sigma AwardPlasma Ruggedized Solutions

Plasma Ruggedized Solutions Proprietary and Confidential

Aviation Week Award

Plasma Ruggedized Solutions

Plasma Ruggedized Solutions Proprietary and Confidential

Northrop Grumman Letter

Plasma Ruggedized Solutions

Plasma Ruggedized Solutions Proprietary and Confidential

Tin Whisker Mitigation and Layered Coating Solutions

Plasma Ruggedized Solutions

Tin whiskers are not a new phenomenon.  Tin whiskers have been noted as early as the 1950s. Tin is only one of several metals that are known to be capable of growing whiskers. Other examples of metals that may form whiskers include Zinc, Cadmium, Indium and Antimony. 

Tin whiskers are believed to grow in order to relieve mechanical stresses acting within the tin layer. Whiskers grow at a rate of 3-7 angstroms per second and can see an annual growth of 9-10 mm per year.

Tin whiskers, as the name implies, are hair-like growths of near perfect single crystalline structures of tin that grow from some electroplated tin surfaces.

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Tin Whisker Mitigation and Layered Coating Solutions

Plasma Ruggedized Solutions

The “Layered Approach” combines multiple, established conformal coating processes, with innovative surface treatments in specific sequences to strengthen the barrier against tin whisker growth.  

An extremely clean surface, properly prepared with multiple layers of Parylene (XY) and urethane (UR) coatings can provide excellent resistance to whisker growth.

Potting &/or Encapsulation methods using a layered approach provide a solid barrier than can retard growth as well as contain a whisker preventing migration.

Plasma Ruggedized Solutions Proprietary and Confidential

AWARDS & PROGRAMSUNDER SEA ROBOTICS

Plasma Ruggedized Solutions

Ruggedized Electronics for submersion in seawater and depths exceeding 6000m.

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AWARDS & PROGRAMSFA-18 SUPER HORNET

Plasma Ruggedized Solutions

Electronics conformally coated for protection against corrosion, dirt & debris. Ruggedized to withstand extreme forces, including frequent high G loads.

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External Lighting /Shipboard / Blimp

Plasma Ruggedized Solutions

PCBA’s ruggedized to perform outside in all weather conditions. Ruggedized for flexibility on non-rigid surfaces.

Plasma Ruggedized Solutions Proprietary and Confidential

Corrosion Resistance- EMI / RFI Protection

Plasma Ruggedized Solutions

Metalized coatings, shielding, coated enclosures

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Potting & Encapsulation

Plasma Ruggedized Solutions

Potting / Encapsulation is the process used to protect “ruggedize” electronics. Potting provides protection from extreme environments, against shock and vibration, ensures security of sensitive designs, as well as creates a barrier against moisture, fungus, dust, and corrosion.

Potting can also enhance circuit reliability by reducing leakage from high voltage circuits, protecting against voltage arcs and short circuits and by preventing the formation of “tin whiskers.”

Potting or Encapsulating a circuit can make it Federal Information Processing Standards (FIPS) compliant. Because Potting and Encapsulating encloses the entire assembly, the assembly is protected from unauthorized entry, modification and reverse engineering.

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Security Programs FIPS Compliant

Plasma Ruggedized Solutions

Plasma Ruggedized Solutions Proprietary and Confidential

Private Label Material Development

Plasma Ruggedized Solutions

The KRYPTOS™ product line is highly adaptable of which KRYPTOS-17 is a filled, RoHS compliant, medium viscosity, self-extinguishing flame retardant, low stress, thermally conductive epoxy casting resin system. As tested by an independent party (UL 94V0), it passes the criteria for a vertical burn rating of 94V-0 at 3mm and 6mm thickness.

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Private Label Material Development Cont.

Plasma Ruggedized Solutions

THIS SYSTEM WAS DESIGNED TO MEET THE PHYSICAL SECURITY REQUIREMENTS OF FIPS 140-2, AND FIPS 140-3 FOR ENCAPSULATING MATERIALS. KRYPTOS INHERENT NATURE OFFERS GOOD TIN-WHISKER MITIGATION PROPERTIES.

It provides superior resistance to water, salt spray, inorganic acids and bases and most organic solvents. The material is intended for use in outdoor environments (pending UL 746). It cures at room temperature to a tough, semi-rigid polymer; it exhibits good wetting and adhesion to most surfaces and is free flowing to penetrate voids and provide good air release.

Plasma Ruggedized Solutions Proprietary and Confidential

R&O (Repair & Overhaul) Capability

Capabilities to repair and overhaul electronics, vacuum

pumps, RF generator equipment.

Plasma Ruggedized Solutions

Plasma Ruggedized Solutions Proprietary and Confidential