plc front-end design review
DESCRIPTION
PLC front-end Design Review. Curtis Mayberry 7-5-11. Revised Project Description. Block Diagram. Stage 2. Stage 1. RTD TC Thermistor +/-10v, +/-5v 4-20mA. Cost-Effective. Signal Conditioning. ADC. Microcontroller. High-Accuracy. Super-Mini Dig Labview. The Plan. - PowerPoint PPT PresentationTRANSCRIPT
PLC front-end Design Review
Curtis Mayberry
7-5-11
Revised Project Description
Block Diagram
RTDTC
Thermistor+/-10v, +/-5v
4-20mA
Signal Conditioning MicrocontrollerADC
Cost-Effective
High-Accuracy
Super-Mini DigLabview
Stage 1 Stage 2
The Plan
• May 16: First Day
• May 21: Project Definition & training (1 week)
• June 5 - June 10: FAE conference in Tucson (1 week)
• July 5: Block Diagrams, calculations (accuracy), simulations, Part selection & ordering, initial schematic (4 weeks)
• July 14: PCB layout (2 weeks)
• July 21: Basic LabView Coding & Testing preparation (1 week)
• July 29: Initial lab results -Oven(~1 weeks)
• August 3: Accuracy tests (Tucson?)
• August 5: Final Report (2 days)
• August 10: Preliminary Presentation (2 days)
• August 12: Final Presentation (2 days)
• August 18: Last Day (1 week)
Universal Inputs
0-10v and +/- 10v, 0-5v and +/- 5v, 4-20mA
Universal Voltage Input
• 0-5v, 0-10v, +/- 5v and +/- 10v universal voltage input
• Change resistance values to change input voltage levels
• Second order RC filter with poles at 39 Hz and 3900Hz
• Opamp to scale down input
• 2.5v reference generated to scale input
• Opa2333: Low offset voltage and drift, rail-to-rail input, dual opamp part
Noise Calculations: Voltage Reference
• 2.5v Reference– REF5025: 625nVRMS
– OPA333: 869 nVRMS
– Filter KTC noise: 202.8nVRMS
– Reference Output 10kΩ: 202.8 nVRMS
– Total Noise: 1.108µVRMS
RMSHznV
BB
n
HznV
nVHzen
HzHzBW
86963.249)55(
63.249)57.1)(159(
noise) 1/f (no 55 :noise BB
RMS
KJ
R
n
nV
Hzkken
HzHzBW
8.202
)9.249)(10)(15.298)(1038.1(4
9.249)57.1)(15.159(
23
RMSKJ
filter nVnF
ken 84.202
100
)15.298)(1038.1( 23
RMSREF VnVnVnVen 108.1)625()8.202(2)869( 222
– Current Noise: 26.34nVRMS (negligible)
RMS
HznV
BB
nV
kHzen
34.26
)67.16(63.249)100(
RMSppREF nVVen 625)5.7(21
5025
Noise Calculations
• Input Filter – 82nF filter KTC noise: 224 nVRMS
– 820pF filter noise: 211.47 nVRMS
– Total Noise: 308.5 nVRMS
• Amplifier Noise:– Feedback Network (16.67kΩ):
828nVRMS
– OPA333 noise: 869.5nVRMS
– Total Noise: 1.2µVRMS
RMSHznV
BB
n
HznV
nVHzen
HzHzBW
5.8699.249)55(
9.249)57.1)(15.159(
noise) 1/f (no 55 :noise BB
RMS
KJ
R
nV
Hzkken
47.211
)4.1)(818.38)(50)(15.298)(1038.1(4 23
Noise Calculations: Total
• ADC V+ input noise total: 1.503µVRMS
• ADC V- input noise total:1.089uVRMS
RMS
kk
kk
V
V
nVVnVVen
503.1
)8.202()2.1)2.1(()5.308))(2.1(()108.1))(2.1(( 2
filteroutput
2
amplifier
2
filterinput
1201002
Ref
12020
RMSV VnVnVnVen 089.1)625()8.202()869( 222
Noise Calculations: Bringing it all together
• ADC noise: 1.35 µVRMS
– Noise at Apga =1 and 5 SPS
FS of %000358.060
771.13295.2
)089.1()503.1()35.1(noiseOuput 2
-V
2
V
2
ADC
bits
VV
VVV
PPRMS
Resistor Mismatch Errors (Worse Case)
• Resistor Options (worse case)– Set 1: 668.7 µV (0.1% resistors)
– Set 2: 3.337 mV (0.1% resistors)
– Set 2: 1.668 mV (0.05% resistors)
– Set 2:666.8 µV (0.02% resistors)
– Total: 1.797mV
mV
vVERROR
337.3
)100
20
%1.0100%1.020120
%1.02020)(67.1(
VvVERROR 67.668)100
20
20*%1.0100
20*%1.020)(67.1(
mV
vVERROR
668.1
)100
20
%05.0100%05.020120
%05.02020)(10(
V
vVERROR
8.666
)100
20
%02.0100%02.020120
%02.02020)(10(
mVmVV 797.1)668.1()7.668(ErrorGain Mismatch Total 22
Set 1
Set 2
Resistor Tolerance Monte Carlo Simulation
• Ran Monte Carlo Simulation using 0.1% resistors
• 2.5 mV max error on output
• Used an ideal op-amp to isolate the error source
• Small variation between resistor tolerances
Error Estimation
• ADC– 15µV offset– INL: 6 ppm– Gain Error: 0.02%– External Reference: 0.05%*2.024V = 1.024 mV– Total: 1.230 mV
• Level shifting OPA2333– Offset: 10 µV– Offset drift: 0.05 µV/oc– CMRR >106 dB– PSRR: 5 µV/V (max)
• 2.5v Reference OPA2333– Offset: 10 µV– Offset drift: 0.05 µV/oc (3µV over 25oC ± 60oC temperature range)– CMRR >106 dB– PSRR: 5 µV/V (max)
Vv 244*10
66
Vv 8004*0002.0
20,,, 10
CMRR
dcmincmincmcmo AVVAV
PSRRAVV dPSnoiseoffset PS o,
Error Estimation
• Resistor Mismatch: 1.797 mV
• REF5025 2.5v reference: 1.25 mV offset is cancelled out
• Total:
with no “interference”: 2.178 mV
2PSnoise
220,
2222 )(2)10(2))25)(05.0((2)797.1()10(2)230.1( PSRRAVAVCTmVVmV d
CMRR
dcmino
C
Vo
mVmVmV 178.2)797.1()23.1( 22
Simulation: +/- 10v
Simulation: +/- 5v
Universal Current input
• 4-20mA
• Second order RC filter
• Internal 2.048v reference
• 221Ω shunt converts 4-20mA to 884mV-4.420V
• OPA2333: Rail-to-Rail common mode input, low offset voltage and drift
Simulation
2.5v reference
Differential output
Noise Analysis
• OPA333 buffer noise: 869.5 nVRMS
• Resistor Noise– 10kΩ: 202.8 nV– 16kΩ: 123 nV– 1.6kΩ: 31.1 nV
• V+ Total Noise: 901.8 nVRMS
• V- Total Noise: 1.089 µVRMS (Same as Vinput V-)
• ADC noise: 1.35 µVRMS – Noise at Apga =1 and 5 SPS
• Total noise: 11.729 µVPP
RMSHznV
BB
n
HznV
nVHzen
HzHzBW
5.8699.249)55(
9.249)57.1)(15.159(
noise) 1/f (no 55 :noise BB
RMSV VnVnVnVen 089.1)625()8.202()869( 222
FS of %1029249
729.11954.1
)089.1()8.901()35.1(noiseOuput
6
2
-V
2
V
2
ADC
bits
VV
VnVV
PPRMS
Error Estimation
• ADC– 15µV offset– INL: 6 ppm– gain error: 0.02%– Noise error: 7.78 µVpp– External Reference: 1.024 mV
• Shunt resistor tolerance: 20mA*221*.1% =4.42 mV
• Level shifting OPA333– Offset: 10 µV– Offset drift: 0.05 µV/oc– CMRR >106 dB– PSRR: 5 µV/V (min)
• 2.5v Reference OPA333– Offset: 10 µV– Offset drift: 0.05 µV/oc (3µV over 25oC ± 60oC temperature range)– CMRR >130 dB– PSRR: 2 µV/V
• REF5025: 1.25mV
• Total
Vv 244*10
66
Vv 8004*0002.0
20,,, 10
CMRR
dcmincmincmcmo AVVAV
PSRRAVV dPSnoiseoffset PS o,
mVmVmVVV 669.4)2.4()25.1()10(2)839( 2222
2PSnoise
220,
22222 )(2)10(2))25)(05.0((2)2.4()25.1()10(2)839( PSRRAVAVCTmVmVVV d
CMRR
dcmino
C
Vo
Temperature Sensors
Thermistor
RTD
Thermocouple
Targeted industrial temperature range: -40oc to 85oc
Thermistor
• Temperature proportional to resistance
• Calibrated: 25oC and 85oC
• NTC thermistor– 30kΩ ±1% @ 25oC
• 2 Designs: – Single-ended – Bridged
)1
15.3981
(3992exp(
30
%1399285/25
Tk
kR
Simulation
Error Estimation
• Resistor Mismatch: 374.81µV
• Current Accuracy:0v– Ratio metric measurement
• Thermistor Errors: 5.027 mV– Thermistor 25oC R-tolerance: 3.731mV (R±1%)
– Beta Error: 3.37 mV (Beta±1%)
• ADC Errors: – 15µV offset
– INL: 6 ppm
– gain error: 0.02%
– External reference R: 2mV
• Minimum 4.4 mV/oC
• Total Error: 5.425mV (~1.23oC)
V
kkk
kkkA
81.374
)15001.*3060
)001.*3030)(30()(50(Error mismatch R
Vv 122*10
66
Vv 4002*0002.0
mV
kkk
kkkA
731.3
)20001.*4080
)001.*4040)(40()(50(Error -R thermistor
Output Voltage Temperature Dependence
0
100
200
300
400
500
600
700
800
0 20 40 60 80 100
temp (degrees C)
Ou
tpu
t V
olt
age
(mV
)
B nominal
B + 1%
B - 1%
Simulation
Error Estimation
• Resistor Mismatch: 1.677mV (0.1% resistors)
• Current Accuracy: 0v– Ratio metric reading (external ref)– Mismatch between current sources:
• ±0.15% of FS (50 µV) = 75nV (negligible)
• Thermistor Errors: 5.027 mV– Thermistor 25oC R-tolerance: 3.731mV (R±1%)– Beta Error: 3.37 mV (Beta±1%)
• ADC Errors: 400.5µV– 15µV offset– INL: 6 ppm– gain error: 0.02%
• Minimum 4.4 mV/oC
• Total Error: 5.311mV
mVVmV
VkAmVkA
677.1)750()5.1(Error
750)001.*15)(50(:Right 5.1)001.*30)(50(
22mismatch R
Vv 122*10
66
Vv 4002*0002.0
RTD
• PT100, PT 1000
• Resistance proportional to temperature
• Callendar-Van Dusen equation
Simulation
Error Estimation
• Class A RTD probe: ±0.15oC @ 0oC
• ADC Errors: 400.5µV– 15µV offset– INL: 6 ppm– gain error: 0.02%– External reference tolerance:
• Total Error: 2.040 mV
Vv 122*10
66
Vv 4002*0002.0
case)(worst 2
)001.*20)(100(
mV
kAErrorREFERENCE
Thermocouple
• Seebeck effect
• Need to measure voltage across the element
• Cold junction compensation: RTD close to the cold junction
• PCB layout designed to keep the cold junction isothermal with the RTD
• Types: K, J, T, E, N, R, S, B
• Different materials, temperature ranges, TC
• Example: K type: ~55µV/oC
Error Estimation
• RTD Error: 2.040 mV
• Thermocouple element error: Varies by type
• Max element error (using K type): 1.1oC or 0.4%
Digital Interface
SM-USB-DIG
Stage 2 Interface
• Add MCU
• Excluded from stage 1 (Rev. A)
• MCU controls data converters
• MCU communicates through SM-USB-DIG to computer
• Adds extra capabilities
Power
• Powered by a lab supply for prototyping
• Banana plug input jack
Floor plan
Front-Ends
Control and Power
The Plan
• May 16: First Day
• May 21: Project Definition & training (1 week)
• June 5 - June 10: FAE conference in Tucson (1 week)
• July 5: Block Diagrams, calculations (accuracy), simulations, Part selection & ordering, initial schematic (4 weeks)
• July 14: PCB layout (2 weeks)
• July 21: Basic LabView Coding & Testing preparation (1 week)
• July 29: Initial lab results -Oven(~1 weeks)
• August 3: Accuracy tests (Tucson?)
• August 5: Final Report (2 days)
• August 10: Preliminary Presentation (2 days)
• August 12: Final Presentation (2 days)
• August 18: Last Day (1 week)